JP6706546B2 - Piezoelectric vibrating piece container and piezoelectric vibrator - Google Patents

Description

The present invention relates to a piezoelectric vibrating piece container and a piezoelectric vibrator, and more particularly, to a mounting portion to which the piezoelectric vibrating piece is attached.

A piezoelectric vibrating reed in which a piezoelectric vibrating reed using crystal or the like is housed in a container of a predetermined size formed of a package and a lid is widely used.
For example, in electronic devices such as mobile phones and personal digital assistants, piezoelectric vibrators are used as time sources, timing sources such as control signals, reference signal sources, and the like.
This type of piezoelectric vibrator includes a base portion formed of a piezoelectric material and a pair of vibrating arm portions extending side by side from the base portion as shown in Patent Document 1, and both vibrating arm portions from both end sides of the base portion. A pair of support arm portions extending in the same direction as the vibrating arm portions are provided on the outer side of the sandwiching arm.
According to this piezoelectric vibrator, by fixing the piezoelectric vibrating reed with the support arm to the mounting part (mount pad) provided in the package, the distance from the vibrating arm to the fixed part via the base becomes longer and fixed. Vibration leakage from the part can be suppressed. In the piezoelectric vibrating reed provided with the supporting arm portion, the supporting arm portion is lengthened and the mounting portion of the container is lengthened to stabilize the posture of the piezoelectric vibrator.

By the way, along with the miniaturization required for various electronic devices, the piezoelectric vibrator is also miniaturized. When miniaturizing the piezoelectric vibrator, it is necessary to reduce the size of the container and also miniaturize the piezoelectric vibrating piece itself to be housed inside. With the miniaturization of the piezoelectric vibrating piece, the vibrating arm portion and the supporting arm portion are The intervals are getting narrower.
Therefore, it is necessary to improve the mounting accuracy when mounting the miniaturized piezoelectric vibrating piece on the mounting portion of the container.
However, due to the miniaturization of the piezoelectric vibrator, the distance between the support arm and the vibrating piece has become narrower. There is a possibility that they will come into contact with each other, or that an adhesive for fixing will stick to the vibrating arm.

FIG. 7 shows the mounting accuracy of the conventional piezoelectric vibrating piece container and the piezoelectric vibrator.
As shown in FIG. 7A, on the base substrate 110 that constitutes the package body of the piezoelectric vibrating reed container, mounting portions 140A and 140B are formed to face each other on the inner long sides that form the housing portion. There is.
The mounting portions 140A and 140B are formed so as to project from the long side of the base substrate 110 to the inside of the container, and a parallel surface a parallel to the base substrate 110 and two side surfaces b connected to the base substrate 110. and b. The intersection of the parallel surface a and both side surfaces b, b is chamfered.

7B to 7D show a state in which the support arm portions 900a and 900b of the piezoelectric vibrating piece 600 are mounted on the mounting portions 140A and 140B.
FIG. 7B shows a state in which the support arm portions 900a and 900b of the piezoelectric vibrating piece 600 are accurately arranged at positions required for design. The piezoelectric vibrating reed 600 arranged has wide portions 710a and 710b in which the width of the tip of the vibrating arm portion is widened, thereby increasing the weight of the vibrating arm portion and the moment of inertia during vibration. It is provided in order to shorten the length of the part and reduce the size.
On the other hand, FIG. 7C shows a state in which the mounted piezoelectric vibrating piece 600 is tilted (rotated on the arrangement surface) and mounted. When the piezoelectric vibrating piece 600 is mounted in an inclined state as described above, the wide portion 710a is in contact with the mounting portion 140A as shown by an arrow P1 in FIG. However, there is a problem of contact during vibration, resulting in mounting failure. In addition to the widened portion 710a, as shown by an arrow P2 in the figure, there is a possibility that the base portion on which the vibrating arm portion is arranged and the mounting portion 140B come close to or contact with each other. If the base portion contacts the mounting portion, it not only affects the vibration of the vibrating arm portion, but also the vibration of the vibrating arm portion leaks to the outside through the contact portion, and the piezoelectric vibrating piece 600 is mounted on the fixed arm portion. By doing so, a mounting defect is also caused in that the effect of suppressing vibration leakage is reduced.

Such contact due to rotation of the piezoelectric vibrating piece 600 is partially avoided by narrowing the width of the mounting portions 140A and 140B (distance from the base substrate 110) and widening the distance between the mounting portions 140A and 140B. be able to.
However, when the widths of both the mounting portions 140A and 140B are narrowed, as shown in FIG. 7D, when the piezoelectric vibrating piece 600 is displaced in the width direction (vertical direction in the drawing), a part of the supporting arm portion 900a is formed. Is more likely to come off the mounting portion 140A, and the possibility that the vibrating arm portion contacts the mounting portion 140B on the opposite side increases.

JP, 2005-97364, A

An object of the present invention is to make it difficult to cause mounting failure of the piezoelectric vibrating piece.

(1) In the invention according to claim 1, there is provided a container for a piezoelectric vibrating piece in which a piezoelectric vibrating piece having a base portion, a vibrating arm portion, and a supporting arm portion for mounting is mounted, and a concave main body and the main body. a lid body forming a housing space of the piezoelectric vibrating piece by being fixed to the example Bei said mounting portion supporting arms are fixed the piezoelectric vibrating piece, the mounting portion, the body longitudinal One parallel surface a parallel to the long side surface formed inside, two side surfaces b having one end side continuous with the long side surface and facing each other, and a flat surface portion in at least a part thereof, A third surface c connecting the surface a and the other end of the side surface b, the long side surface, the parallel surface a, the two side surfaces b, and a mounting surface surrounded by the third surface c. The piezoelectric vibrating piece container is characterized in that an angle β formed by the parallel surface a and the flat surface portion of the third surface c is greater than 135 degrees and less than 180 degrees.
(2) The invention according to claim 2 provides the piezoelectric vibrating reed container according to claim 1, wherein the angle β formed is 150 degrees or more and 170 degrees or less.
(3) claimed in the invention according to claim 3, wherein the third surface c is the parallel surface a and the portion intersecting the side b is R processing, claim 1 or claim, characterized in that 2 to provide a piezoelectric vibrating piece container according to.
(4) In the invention described in claim 4, the piezoelectric vibrating piece container according to any one of claims of claims 1 to 3, a piezoelectric of the support arms is fixed to the mounting portion Provided is a piezoelectric vibrator including: a resonator element.
(5) In the invention according to claim 5, an imaginary line in the longitudinal direction passing through the center of the piezoelectric vibrating reed fixed to the mounting portion in the width direction is a longitudinal direction passing through the center of the piezoelectric vibrating reed container in the width direction. when matching the virtual line, an end portion of the third surface c side of the side b is claim 4, wherein located on the center side than the center side of the side of the support arm portion, characterized in that to provide a piezoelectric vibrator according to.

According to the present invention, the mounting portion includes the parallel surface a, the two side surfaces b, and the third surface c whose angle β formed by the parallel surface a is greater than 135 degrees and less than 180 degrees. It is possible to reduce the number of mounting defects.

It is an external perspective view of a piezoelectric vibrator. It is an exploded perspective view of a piezoelectric vibrator. It is explanatory drawing which represented the shape of the mounting part compared with the prior art and embodiment. It is explanatory drawing showing the positional relationship of a mounting part and a piezoelectric vibrating piece. It is explanatory drawing showing the positional relationship when the mounting position of the piezoelectric vibrating reed with respect to the mounting part shifted. It is a figure showing composition of a piezoelectric vibrating piece and a section of a piezoelectric vibrator. This figure shows the mounting accuracy of a conventional piezoelectric vibrating reed container and a piezoelectric vibrator.

Hereinafter, preferred embodiments of the piezoelectric vibrating reed container and the piezoelectric vibrator of the present invention will be described in detail with reference to FIGS. 1 to 6.
(1) Outline of Embodiment A package 2 of this embodiment functions as a piezoelectric vibrating piece container, and includes a package body 3 that is a concave body and a sealing plate 4. The sealing plate 4 is fixed to the package body 3 to form an accommodation space, and the tuning fork type piezoelectric vibrating piece 6 is mounted therein.
The piezoelectric vibrating reed 6 mounted in the present embodiment has a pair of vibrating arm portions 7 extending from the base portion 8 and supporting arms extending in parallel from the base portion 8 to both outsides of the vibrating arm portions 7. A section 9 is provided. In the longitudinal direction of the pair of vibrating arm portions 7, a groove portion 72 having a constant width is formed on the main surface (back surface) thereof.
Two different systems of excitation electrodes 91 and 92 functioning as a first excitation electrode and a second excitation electrode are formed in the side surface and the main surface forming the outer peripheral surface of the vibrating arm portion 7 and in the groove portion 72.

As shown in FIG. 3A, the package body 3 of the present embodiment has a pair of mounting portions 14 (hereinafter simply referred to as mounting portions 14) formed on the long side surface s on the inner side in the longitudinal direction. There is. The supporting arm portion 9 of the piezoelectric vibrating piece 6 is fixed to the mounting portion 14 via the electrode pad 20 with a bonding material, so that the piezoelectric vibrating piece 6 is mounted.
The mounting portion 14 includes a parallel surface a parallel to the long side surface s in the longitudinal direction, a pair of side surfaces b having one end side continuous with the long side surface s and facing each other, and the other end side of the parallel surface a and the side surface b. And a mounting surface surrounded by these three surfaces.
The angle β formed by the parallel surface a and the third surface c is larger than 135 degrees and smaller than 180 degrees, preferably 150 degrees or more and 170 degrees or less. As a result, the width of the mounting portion 14 is formed by the third surface c in a taper shape in which the width becomes narrower from the end portion on the parallel surface a side toward the end portion (side surface b) in the length direction.
The mounting portion 14 formed in this way can further increase the allowable range of the positional displacement due to the rotation of the piezoelectric vibrating piece 6 and the lateral positional displacement, and as a result, the vibrating arm portion 7 contacts the mounting portion. In addition, the support arm portion 9 does not easily come off the mounting portion 14.
The reason is that the third surface c is provided between the parallel surface a and the side surface b, so that the mounting portion 14 is provided as compared with the conventional mounting portion in which the connecting portion between the parallel surface a and the side surface b is rounded. This is because the corner portion (end side in the longitudinal direction) can be retracted further inward (long side s side). This effect can be further enhanced by making at least a part of the third surface c, preferably the entire surface (excluding the R processed portion of the connection portion), a flat surface.

With respect to the displacement of the piezoelectric vibrating piece 6 in the rotational direction, it is possible to avoid the contact of the vibrating arm portion 7 by increasing the R value of the R processing in the conventional mounting portion in which the parallel surface a and the side surface b are connected. The area of the mounting surface, which is the upper surface of the mounting portion, becomes small.
On the other hand, in the present embodiment, β is set to be larger than 90 degrees in accordance with the inclination of the vibrating arm portion 7 due to the displacement in the rotation direction, so that the mounting portion R is larger than that in the conventional mounting portion. The reduction amount of the area of the mounting surface 14 (the upper surface of the mounting portion 14) can be reduced. As a result, it is possible to secure a wider target area to which the bonding material for fixing the support arm portion 9 can be applied on the mounting portion 14.
The reason why the angle β formed by the parallel surface a and the third surface c is larger than 135 degrees is that the center of the rotational displacement of the piezoelectric vibrating piece 6 exists near the center of the package 2 and the piezoelectric vibrating piece 6 is provided. This is because it is adjusted to the inclination of the vibrating arm portion 7 when is rotated.

(2) Details of Embodiment FIG. 1 is an external perspective view of a piezoelectric vibrator including a piezoelectric vibrating piece according to the embodiment. FIG. 2 is an exploded perspective view of the piezoelectric vibrator according to the embodiment.
As shown in FIGS. 1 and 2, the piezoelectric vibrator 1 according to the present embodiment includes a package 2 having a cavity C hermetically sealed therein, and a piezoelectric vibrating piece 6 housed in the cavity C. It is a ceramic package type surface mount oscillator.
Since the piezoelectric vibrator 1 of the present embodiment has a bilaterally symmetrical structure, both symmetrically arranged parts such as the vibrating arm portion 7a and the vibrating arm portion 7b are represented by the same numeral, and In order to distinguish between the two, the description will be made with one of them being marked with the distinguishing marks a and A and the other being marked with the distinguishing marks b and B. However, although the description will be made by omitting the distinctive reference symbols as appropriate, in this case, it is assumed that each part is indicated.

The piezoelectric vibrating piece 6 is a so-called tuning fork type vibrating piece made of a piezoelectric material such as quartz, lithium tantalate, or lithium niobate, and vibrates when a predetermined voltage is applied. In this embodiment, a piezoelectric vibrating reed formed by using quartz as a piezoelectric material will be described as an example.
The piezoelectric vibrating piece 6 includes vibrating arm portions 7a and 7b extending in parallel from the base portion 8 and support arm portions 9a and 9b extending from the base portion 8 in the same direction outside the vibrating arm portions 7a and 7b. It is held in the cavity C by 9a and 9b.
At the tips of the pair of vibrating arm portions 7a and 7b, widened portions 71a and 71b formed to be wider on both sides than the width of the portion connected to the base portion 8 in order to reduce the size by increasing the inertia moment. Is equipped with. In the present embodiment, the piezoelectric vibrating reed 6 having the widened portions 71a and 71b is described as an example, but a piezoelectric vibrating reed without the widened portion may be used.
Details of the piezoelectric vibrating piece 6 will be described later.

The package 2 is formed in a substantially rectangular parallelepiped shape. The package 2 includes a package body 3 and a sealing plate 4 that is joined to the package body 3 and forms a cavity C between the package body 3 and the package body 3.
The package body 3 includes a first base substrate 10 and a second base substrate 11 that are bonded to each other in a state of being overlapped with each other, and a seal ring 12 bonded to the second base substrate 11.

Notch portions 15 having a quarter arc shape in plan view are formed at the four corners of the first base substrate 10 and the second base substrate 11 over the entire thickness direction of both base substrates 10 and 11. The first base substrate 10 and the second base substrate 11 are formed by, for example, stacking two wafer-shaped ceramic substrates and joining them together, and then forming a plurality of through holes penetrating both the ceramic substrates in a matrix, and then forming each through-hole. It is produced by cutting both ceramic substrates in a grid pattern while using holes as a reference. At that time, the through hole is divided into four to form the cutout portion 15.

Although the first base substrate 10 and the second base substrate 11 are made of ceramics, specific ceramic materials thereof are, for example, HTCC (High Temperature Co-Fired Ceramic) made of alumina and LTCC (made of glass ceramic). Low Temperature Co-Fired Ceramic) and the like.

The upper surface of the first base substrate 10 corresponds to the bottom surface of the cavity C.
The second base substrate 11 is overlaid on the first base substrate 10 and is bonded to the first base substrate 10 by sintering or the like. That is, the second base substrate 11 is integrated with the first base substrate 10.
As will be described later, connection electrodes 24A and 24B (not shown) are formed between the first base substrate 10 and the second base substrate 11 so as to be sandwiched between the two base substrates 10 and 11.

A penetrating portion 11a is formed on the second base substrate 11. The penetrating part 11a is formed in a rectangular shape in plan view with four rounded corners. The inner side surface of the penetrating portion 11a constitutes a part of the side wall of the cavity C. Mounting portions 14A and 14B that project inward are provided on the inner side surfaces (long side surfaces s) on both sides of the penetrating portion 11a that face each other in the lateral direction. The mounting portions 14A and 14B are formed substantially at the center in the longitudinal direction of the penetrating portion 11a. The mounting portions 14A and 14B are formed to have a length that is ⅓ or more of the length of the penetrating portion 11a in the longitudinal direction.
The mounting portions 14A and 14B of the present embodiment include parallel surfaces a, side surfaces b and b, and a third surface c at their outer peripheral edges, and both longitudinal end portions are tapered. Thereby, when the piezoelectric vibrating reed 6 is mounted, it is possible to increase a permissible range of mounting deviation (deviation in the rotational direction or the lateral direction), and as a result, it is possible to reduce the number of mounting defects. Details of the mounting units 14A and 14B in this embodiment will be described later.

The seal ring 12 is a conductive frame member that is slightly smaller than the outer shapes of the first base substrate 10 and the second base substrate 11, and is joined to the upper surface of the second base substrate 11. Specifically, the seal ring 12 is bonded onto the second base substrate 11 by baking with a brazing material such as silver brazing or a solder material, or formed on the second base substrate 11 (for example, electrolytic plating or electroless plating). In addition to plating, they are joined by welding or the like to a metal joining layer formed by vapor deposition or sputtering.

Examples of the material of the seal ring 12 include nickel-based alloys and the like, and specifically, it may be selected from Kovar, Elinvar, Invar, 42-alloy and the like. In particular, as the material of the seal ring 12, it is preferable to select a material having a thermal expansion coefficient close to that of the first base substrate 10 and the second base substrate 11 made of ceramic. For example, when alumina having a thermal expansion coefficient of 6.8×10 −6 /° C. is used as the first base substrate 10 and the second base substrate 11, the seal ring 12 has a thermal expansion coefficient of 5.2×10 −. It is preferable to use 6/° C. Kovar or 42-alloy having a thermal expansion coefficient of 4.5 to 6.5×10 −6 /° C.

The sealing plate 4 is a conductive substrate stacked on the seal ring 12, and is hermetically bonded to the package body 3 by bonding to the seal ring 12. The space defined by the sealing plate 4, the seal ring 12, the penetrating portion 11a of the second base substrate 11, and the upper surface of the first base substrate 10 functions as a cavity C hermetically sealed.

Examples of the welding method of the sealing plate 4 include seam welding by bringing the roller electrodes into contact with each other, laser welding, ultrasonic welding, and the like. Further, in order to make the welding of the sealing plate 4 and the seal ring 12 more reliable, a bonding layer of nickel, gold or the like, which is well compatible with each other, is provided on at least the lower surface of the sealing plate 4 and the upper surface of the seal ring 12, respectively. It is preferably formed.

By the way, a pair of electrode pads 20A and 20B, which are connection electrodes to the piezoelectric vibrating piece 6, are formed on the upper surfaces of the mounting portions 14A and 14B of the second base substrate 11. A pair of external electrodes 21A and 21B are formed on the lower surface of the first base substrate 10 at intervals in the longitudinal direction of the package 2. The electrode pads 20A, 20B and the external electrodes 21A, 21B are, for example, a single-layer film made of a single metal formed by vapor deposition, sputtering, or the like, or a laminated film in which different metals are laminated.
The electrode pads 20A, 20B and the external electrodes 21A, 21B are disposed between the second through electrodes 22A, 22B formed on the mounting portions 14A, 14B of the second base substrate 11 and between the first base substrate 10 and the second base substrate 11. Are electrically connected to each other through the connection electrodes 24A and 24B (not shown) formed on the first base substrate 10 and the first through electrodes 23A and 23B (not shown) formed on the first base substrate 10.
On the other hand, as will be described later in detail, the first bonding materials 51a and 51b and the second bonding materials 52a and 52b are arranged on the electrode pads 20A and 20B so as to be separated from each other in the first direction D1. Each of 9a and 9b is joined at two points separated in the length direction.
In the package body 3 (piezoelectric vibrating piece container) of the present embodiment, the supporting arm portion 9a of the piezoelectric vibrating piece 6 is interposed via the electrode pads 20A and 20B, the first bonding materials 51a and 51b, and the second bonding materials 52a and 52b. , 9b are mounted on the mounting portions 14A and 14B.

FIG. 3 shows the shape of the mounting portion 14.
FIG. 3A shows the shape of the mounting portion 14A in this embodiment, and FIG. 3B shows the shape of the conventional mounting portion 140A.
Since the pair of mounting parts 14A and 14B are formed line-symmetrically, the mounting part 14A will be described. Further, in FIGS. 3A and 3B, in order to clarify the shape, the corner portions formed by the two outer peripheral surfaces of the mounting portion 14A are not processed, but R processing or the like is performed. You may do it.

The mounting portion 14A of the present embodiment includes a mounting surface on which the electrode pad 20A is disposed and a ruled outer edge that defines the mounting surface.
As shown in FIG. 3A, the ruled outer edge is composed of one parallel surface a, two side surfaces b and b facing each other, and a third surface c.
The parallel surface a is formed parallel to the long side surface s extending in the long side direction of the inner side wall forming the cavity of the package body 3.
One end side of the side surface b is continuous with the long side surface s, and the other end side is connected to one end side of the third surface c.
The third surface c is a surface that forms an end in the longitudinal direction of the mounting portion 14 into a tapered shape. One end of the third surface c is connected to the other end of the side surface b, and the other end of the third surface c is connected to the parallel surface a.

The third surface c is a case where the distance from the virtual intersection (the end of the virtual intersection) to the parallel surface a when the parallel surface a and the side surface b are extended is ax, and the distance from the virtual intersection to the side surface b is by. , Ax>by. That is, the third surface c is formed so that the angle β with the parallel surface a is greater than 135 degrees and less than 180 degrees. It is preferable that the range of the formed angle β is 150 degrees or more and 170 degrees or less.
The angle β formed is made larger than 135 degrees when the large C chamfer is applied to the corner portion (the confluence portion of the parallel surface a and the side surface b) of the conventional mounting portion 140A shown in FIG. 3B. This is because the angle is larger than the angle (135 degrees) formed by the plane (C plane) and the parallel plane.

As shown in FIG. 3B, the conventional mounting portion 140A includes parallel surfaces a and side surfaces b that are orthogonal to each other, whereas the mounting portion 14 of the present embodiment has a third surface c. The corners on both end sides in the longitudinal direction are deleted so that ax>by. By this deleted portion, contact due to mounting deviation of the piezoelectric vibrating piece 6 is avoided, and the allowable range of mounting deviation is increased. be able to.

FIG. 3C shows a comparison of the shapes of the mounting portion between the third surface c of this embodiment and the case where the chamfering is performed. As shown in FIG. 3C, when chamfering bx in the conventional mounting portion, the angle F1 on the parallel surface a side is located outside the third surface c of the present embodiment, and thus smaller. The piezoelectric vibrating piece 6 comes into contact with the rotational displacement.
On the other hand, when the C-chamfering of ay is performed on the conventional mounting portion, the angle F2 on the side of the parallel surface a is at the same position as in this embodiment (the confluence point of the parallel surface a and the third surface c), and the corner contact Although the position F2 is the same, the amount of reduction in the area of the mounting surface becomes large as indicated by the hatched lines in the drawing, so that the bonding material for fixing the support arm portion 9 is applied onto the mounting portion 14. The possible target area is narrowed.
The reason why the angle β formed by the parallel surface a and the third surface c is made larger than 135 degrees is that the center of the rotational deviation of the piezoelectric vibrating reed 6 exists near the center of the package 2 and the piezoelectric vibrating reed 6 This is because it is adjusted to the inclination of the vibrating arm portion 7 when is rotated.

Next, the positional relationship between the mounting portion 14 of the package body 3 (piezoelectric vibrating piece container) and the piezoelectric vibrating piece 6 mounted on the mounting portion 14 will be described.
FIG. 4 shows a plan view of the package body 3 and a state where the piezoelectric vibrating piece 6 is mounted on the mounting portion 14.
FIG. 4A shows the package body 3 before the piezoelectric vibrating piece 6 is mounted, and the package body 3 is arranged so that the long side surface s constituting the inner peripheral surface of the second base substrate 11 protrudes into the cavity. Mounting parts 14A and 14B are formed. The mounting portion 14 shown in this figure is chamfered on both sides of the third surface c.
FIG. 4B shows a state in which the piezoelectric vibrating reed 6 is arranged on the mounting portion 14 at a position as designed, and a virtual line in the longitudinal direction passing through the center of the piezoelectric vibrating reed 6 in the width direction. Corresponds to an imaginary line in the longitudinal direction passing through the center of the case in the width direction.
Then, as shown in FIG. 4B, the end portion K of the side surface b on the side of the third surface c is located closer to the center than the side of the supporting arm portion 9 on the vibrating arm portion 7 side (center side). ing. In this case, the end K means a corner (an intersection (line) between the side surface b and the third surface c) when the corner is not chamfered.
In this way, by setting the end portion K closer to the vibrating arm portion 7 than the support arm portion 9, it is possible to secure a large area at both end corner portions of the mounting portion 14 in the longitudinal direction. Further, the support arm portion 9 is fixed to the mounting portion 14 at two points of the first joint material 51 and the second joint material 52 as described later, but the end portion K is vibrating arm portion 7 more than the support arm portion 9. By setting it to the side, it is possible to widen the distance between the two bonding materials and stabilize the mounting of the piezoelectric vibrating piece 6.

FIG. 5 shows a positional relationship when the mounting position of the piezoelectric vibrating reed 6 with respect to the mounting portion 14 is deviated.
FIG. 5A shows a state in which the piezoelectric vibrating reed 6 is mounted with a rotational displacement about the center of gravity. The amount of rotation deviation of the piezoelectric vibrating piece 6 is the same as that of FIG.
In the conventional mounting portion 140A shown in FIG. 7(c), the widened portion 710a is in contact with the mounting portion 140A at P1, whereas in the mounting portion 14A of the present embodiment shown in FIG. 5(a), As indicated by Q1, the presence of the third surface c prevents the widened portion 71a from contacting the mounting portion 14A. That is, the allowable range of mounting deviation due to rotational deviation can be increased.
Further, in FIG. 7C, the distance from the mounting portion 140B on the opposite side of the base portion is extremely short as shown by P2, and when further displaced in the longitudinal direction, the mounting portion 140B comes into contact with the mounting portion 140B. According to this embodiment, there is still a margin between the mounting portion 14B and the mounting portion 14B, as indicated by Q2 in FIG.

On the other hand, FIG. 5B shows a state in which the piezoelectric vibrating reed 6 is mounted with a displacement in the width direction with respect to the center of gravity G, as indicated by a thick arrow. The widthwise shift amount of the piezoelectric vibrating piece 6 is the same as that of FIG.
As described above, in FIG. 7D, the width of the mounting portion 140 is narrowed in order to avoid contact due to rotational displacement, but the spacing between both mounting portions 140A and 140B becomes wider accordingly. In addition, when a mounting deviation occurs in the width direction, a part of the support arm 900a is disengaged from the mounting portion 140A, as shown by P3, and the bonding area of the bonding material is reduced and the fixing strength is reduced.

On the other hand, in the mounting portion 14 of the present embodiment, the contact due to the displacement in the rotational direction is avoided by the third surface c without narrowing the width of the mounting portion 14. For this reason, as indicated by Q3 in FIG. 5B, the support arm portion 9a is not disengaged from the mounting portion 14 even with the same amount of displacement in the width direction. Therefore, the fixing strength of the bonding material can be maintained.

Next, details of the piezoelectric vibrator 1 will be described.
FIG. 6 is a view showing a configuration of the piezoelectric vibrating piece 6 mounted on the mounting portion 14 of the package body 3 and a cross section of the piezoelectric vibrator.
Hereinafter, as shown in FIG. 6, the longitudinal direction of the piezoelectric vibrator 1 is a first direction D1 on a plane parallel to the first base substrate 10, and a direction orthogonal to the first direction D1 on the same plane (piezoelectric vibrator 1 The lateral direction) will be described as the second direction D2, and the direction orthogonal to the first direction D1 and the second direction D2 (the thickness direction of the piezoelectric vibrator 1) will be described as the third direction D3 (see also FIG. 1).
As shown in FIG. 6A, the piezoelectric vibrating piece 6 includes a pair of vibrating arm portions 7a and 7b, a base portion 8, and a pair of supporting arm portions 9a and 9b.
The base portion 8 connects one end portion of the pair of vibrating arm portions 7a and 7b in the first direction D1.
Connection parts 81a and 81b extending outward along the second direction D2 from both end faces facing the second direction D2 are connected to the base part 8, and the connection parts 81a and 81b are respectively arranged along the first direction D1. The extending support arm portions 9a and 9b are connected. The pair of support arm portions 9a and 9b are arranged on both outer sides of the vibrating arm portions 7a and 7b in the second direction D2.
In the support arms 9a and 9b, the length from the end on the base 8 side to the tip is formed to be ⅔ or more of the total length a0 (described later) of the piezoelectric vibrating piece 6. This length is for ensuring a space between the first bonding materials 51a and 51b and the second bonding materials 52a and 52b, as described later.

The pair of vibrating arm portions 7a and 7b are arranged so as to be parallel to each other, and vibrate with the end portion on the base portion 8 side as a fixed end and the tip as a free end.
The pair of vibrating arm portions 7a and 7b are provided with widened portions 71a and 71b formed to be wider on both sides than the reference width when the width of the substantially central portion of the entire length is used as the reference width. The widened portions 71a and 71b have a function of increasing the weight of the vibrating arm portions 7a and 7b and the moment of inertia during vibration. As a result, the vibrating arm portions 7a and 7b easily vibrate, the length of the vibrating arm portions 7a and 7b can be shortened, and downsizing is achieved.
In the piezoelectric vibrating reed 6 of the present embodiment, the widened portions 71a and 71b are formed on the vibrating arms 7a and 7b, but as described above, the piezoelectric vibrating reed without the widened portions may be used.
Further, in the piezoelectric vibrator 1 of the present embodiment, although not shown, the tip end portions (widened portions 71a and 71b) of the vibrating arm portions 7a and 7b are adjusted so that the vibration state vibrates within a predetermined frequency range ( A weight metal film (consisting of a rough adjustment film and a fine adjustment film) for performing frequency adjustment) is formed. By irradiating a suitable amount of this weight metal film with laser light, for example, it becomes possible to adjust the frequency and keep the frequencies of the pair of vibrating arm portions 7a and 7b within the range of the nominal frequency of the device. ing. It is also possible not to form this weight metal film as in the widened portion.

Next, the relationship between the lengths of the base portion 8, the support arm portion 9, the connecting portion 81, and the vibrating arm portion 7 in the piezoelectric vibrating piece 6 will be described.
As shown in FIG. 6A, the total length of the piezoelectric vibrating piece 6 is L1, the length of the base is L2, the width of the connecting portion connecting the base 8 and the supporting arm 9 is L3, and the length of the supporting arm 9 is Is L4, the piezoelectric vibrating piece 6 of the present embodiment is formed so as to satisfy all of the following conditions A to C. In addition, L1, L2, L3, and L4 are all lengths in the longitudinal direction of the piezoelectric vibrating piece 6 (the length direction of the vibrating arm portion 7).
Condition A 0.1≦L2/L1≦0.2
Condition B 0.4≦L3/L2≦0.6
Condition C L4/L1≧0.7

By satisfying the above conditions A to C, the piezoelectric vibrating reed 6 of this embodiment can obtain the following effects.
That is, according to the condition A, the length L2 of the base 8 is set to 10% to 20% of the total length of the piezoelectric vibrating piece 6 and the length L2 is shortened to meet the demand for miniaturization of the piezoelectric vibrator 1. You can
In order to prevent the transmission path of the vibration from being shortened by shortening the length L2 of the base 8, the support arm 9 is not directly connected from the side surface of the base 8, but the length L2 of the base 8 is 40 mm. The base portion 80 and the supporting arm portion 9 are connected by the connecting portion 81 having a width of 60% to 60%. This connecting point is the end of the base 8 on the side where the vibrating arm 7 is not extended. That is, the end surface of the base portion 8 and the one surface of the connecting portion 81 are formed to be the same surface. As a result, an unconnected portion to which the connecting portion 81 is not connected is formed in the base portion 8, and the vibration transmission path can be lengthened by the width (L2-L3) of this non-connecting portion.
As described above, in the present embodiment, by satisfying the conditions A and B, the piezoelectric vibrating reed 6 can be downsized, and a vibration transmission effect can be obtained by ensuring a longer vibration transmission path.

Further, by increasing the length of the support arm portion 9 according to the condition C, it is possible to increase the total mass of the path through which the vibration is transmitted and absorb the vibration, thereby suppressing the vibration leakage.
Although described later in this embodiment, the distance between the first bonding material 51 and the second bonding material 52 is about 1/3 of the total length L1. Thereby, the vibration of the vibrating arm portion 7 can be absorbed and dispersed by a slight bending of the support arm portion 9 between the joint portions, and the vibration leakage to the outside can be suppressed.

FIG. 6C is a cross-sectional view of the cross section taken along the line V1-V1 shown in FIG.
As shown in FIGS. 6A and 6C, groove portions 72a and 72b having a constant width are formed over the entire length of the pair of vibrating arm portions 7a and 7b. The groove portions 72a, 72b are recessed in the third direction D3 on both main surfaces (front and back surfaces) of the pair of vibrating arm portions 7a, 7b, and extend from the base portion 8 side along the first direction D1. The groove portions 72a and 72b are formed from the base ends of the vibrating arm portions 7a and 7b (the end portions 83 on the tip end side of the base portion 8) to the front of the widened portions 71a and 71b.
Due to the groove portions 72a and 72b, the pair of vibrating arm portions 7a and 7b each have an H-shaped cross section as shown in FIG. 6C.

As shown in FIG. 6C, a pair of (two systems) of excitation electrodes 91, 92 (first excitation electrode, second excitation electrode) are provided on the outer surface (outer peripheral surface) of the pair of vibrating arm portions 7a, 7b. Electrodes) are formed. Of these, the excitation electrodes 91 and 92 are electrodes that vibrate the pair of vibrating arm portions 7a and 7b at a predetermined resonance frequency in a direction toward or away from each other when a voltage is applied, and are electrically disconnected. In this state, the vibrating arms 7a and 7b are patterned and formed.
Specifically, one excitation electrode 91 is formed mainly in the groove portion 72a of the one vibrating arm portion 7a and on the side surface of the other vibrating arm portion 7b while being electrically connected to each other. ..
The other excitation electrode 92 is formed mainly in the groove portion 72b of the other vibrating arm portion 7b and on the side surface of the one vibrating arm portion 7a while being electrically connected to each other.

Although not shown, a surface of the piezoelectric vibrating piece 6 facing the first base substrate 10 is mounted on the supporting arms 9a and 9b as two mounting electrodes when mounting the piezoelectric vibrating piece 6 on the package 2. Is formed, and two types of routing electrodes electrically connected to the both mount electrodes are formed in the connecting portions 81a and 81b and the base portion 8.
Then, the mount electrode of the first system formed on the support arm portion 9a is connected to the excitation electrode 92 (see FIG. 6C) through the routing electrode, and the mount electrode of the second system formed on the support arm portion 9b. The mount electrode is connected to the excitation electrode 91 via the lead electrode.
A voltage is applied to the excitation electrodes 91 and 92 of the two systems via a pair of mount electrodes.

The excitation electrodes 91 and 92, the mount electrode, and the lead-out electrode are, for example, a laminated film of chromium (Cr) and gold (Au), and are formed after forming a chromium film having good adhesion to quartz as a base. , With a thin gold film on the surface. However, the present invention is not limited to this case, and for example, a thin film of gold may be further laminated on the surface of the laminated film of chromium and nichrome (NiCr), and a single layer of chromium, nickel, aluminum (Al), titanium (Ti), or the like may be used. A layer film may be used.

The excitation electrodes 91 and 92, the mount electrode, and the lead-out electrode are formed in the same manner as in the conventional case. That is, the electrode material is deposited on the entire surface of the piezoelectric vibrating piece 6 before forming each electrode, including the inside of the groove portions 72a and 72b. This film formation is performed by vapor deposition or sputtering of electrode material.
Then, the excitation electrodes 91, 92, the mount electrodes, and the portions forming the lead-out electrodes are left, and the other portions are removed by photolithography, so that two lines of electrode lines are formed.

6B is a cross-sectional view of the piezoelectric vibrator 1 in which the piezoelectric vibrating piece 6 is mounted on the package 2 shown in FIG. 1, taken along the first direction D1, and taken along line V2-V2 of FIG. 6A. It is sectional drawing which looked at the cross section which was seen in the direction of the arrow. However, in order to represent the first penetrating electrode 23B, the cross-sectional position at that portion is shifted.
Electrode pads 20A and 20B are formed on substantially the entire mounting surfaces (surfaces facing the sealing plate 4) of the mounting portions 14A and 14B of the second base substrate 11.
On the other hand, on the outer bottom surface of the first base substrate 10, external electrodes 21A and 21B extending in the lateral direction (second direction D2) are formed at both ends in the longitudinal direction (first direction D1).
The electrode pads 20A and 20B and the external electrodes 21A and 21B are, for example, a single-layer film made of a single metal formed by vapor deposition or sputtering, or a laminated film in which different metals are laminated. 21A are electrically connected to each other, and the electrode pad 20B and the external electrode 21B are electrically connected to each other.

That is, as shown in FIG. 6B, the first base substrate 10 is formed with the first penetrating electrode 23B which is electrically connected to the external electrode 21B and penetrates the first base substrate 10 in the thickness direction. Further, a second penetrating electrode 22B that is electrically connected to the electrode pad 20B and penetrates the mounting portion 14B in the thickness direction is formed at approximately the center of the mounting portion 14B of the second base substrate 11 (see FIG. 2). A connection electrode 24B that connects the first through electrode 23B and the second through electrode 22B is formed between the first base substrate 10 and the second base substrate 11 (mounting portion 14B).
In this way, the electrode pad 20B and the external electrode 21B are electrically connected to each other via the second through electrode 22B, the connection electrode 24B, and the first through electrode 23B.

On the other hand, as shown by the dotted line in FIG. 6B, the first base substrate 10 is provided with the first through electrode 23A which is electrically connected to the external electrode 21A and penetrates the first base substrate 10 in the thickness direction. A second penetrating electrode 22A that is electrically connected to the electrode pad 20A and penetrates the mounting portion 14A in the thickness direction is formed substantially at the center of the mounting portion 14A of the 2 base substrate 11 (see FIG. 2). A connection electrode 24A that connects the first through electrode 23A and the second through electrode 22A is formed between the first base substrate 10 and the second base substrate 11 (mounting portion 14A).
In this way, the electrode pad 20A and the external electrode 21A are electrically connected to each other via the second through electrode 22A, the connection electrode 24A, and the first through electrode 23A.

The two through electrodes 22B and 22A of the present embodiment are formed substantially at the center of the mounting portions 14B and 14A in the longitudinal direction, but are not limited to the substantially center, and the first bonding materials 51b and 51a and the first bonding material 51b. The two bonding materials 52b and 52a may be formed at any positions of the mounting portions 14B and 14A as long as they do not overlap with each other.
That is, the formation regions of the second through electrodes 22B and 22A and the joint regions of the first bonding materials 51b and 51a and the second bonding materials 52b and 52a do not overlap when viewed from above (sealing plate) side. As long as the through electrode arrangement condition such as is satisfied, it may be formed at any position of the mounting portions 14B and 14A.
For example, the second through electrodes 22B and 22A may be formed not only at the center of the first bonding materials 51b and 51a and the second bonding materials 52b and 52a but also at the base 8 side from the center or on the opposite side. Good.
Further, the second through electrodes 22B and 22A may be formed on a virtual line connecting the centers of the first bonding materials 51b and 51a and the centers of the second bonding materials 52b and 52a, but the piezoelectric vibrating piece may be formed on the virtual line. 6 may be formed on the side of the center of gravity G or on the opposite side.
The electrode pads 20B and 20A in this case may be formed on the entire upper surfaces of the mounting portions 14B and 14A, but include the second through electrode 22B, the first bonding material 51b, and the second bonding material 52b. It may be formed in a continuous region and a continuous region including the second through electrode 22A, the first bonding material 51a, and the second bonding material 52a.

The reason for forming the second through electrodes 22B and 22A at the positions satisfying the above through electrode arrangement conditions is as follows.
That is, the second through electrodes 22B and 22A are made of a conductive material, while the package 2 including the mounting portions 14B and 14A is made of ceramic, and thus has a thermal expansion coefficient different from that of the surrounding ceramic. When the ceramic is sintered (1000 degrees or more), the second through electrodes 22B and 22A may be slightly (about 10 μm) raised.
When the piezoelectric vibrating reed 6 is mounted by applying the first bonding materials 51b and 51a and the second bonding materials 52b and 52a to the portions raised by the second through electrodes 22B and 22A, the piezoelectric bonding pieces 6 are mounted on the protrusions. Therefore, there is a problem that the piezoelectric vibrating reed 6 easily tilts.
In addition, the bonding area and bonding strength of the first bonding materials 51b and 51a and the second bonding materials 52b and 52a may become non-uniform, and the strength for fixing the piezoelectric vibrating piece 6 may be weakened. There is also a possibility of peeling or a defective conductivity.

Further, when the through electrode arrangement condition is not satisfied, the following problem due to stress occurs, and this problem is a problem that occurs even if the second through electrodes 22B and 22A do not rise.
That is, in the piezoelectric vibrating piece 6, the supporting arm portions 9b and 9a are joined to the electrode pads 20B and 20A on the mounting portions 14B and 14A through the first joining materials 51b and 51a and the second joining materials 52b and 52a. There is. Vibrations of the vibrating arm portions 7b and 7a of the piezoelectric vibrating piece 6 and stress due to an external force are applied to the joints formed by the first joint materials 51b and 51a and the second joint materials 52b and 52a. Concentrate on.
On the other hand, when the bonding material is disposed on the entire support arm portions 9b and 9a of the piezoelectric vibrating piece 6, the bonding area becomes large, but as in the present embodiment, the support arm portions 9b and 9a are arranged in the length direction. The bonding area is reduced by disposing the first bonding materials 51b and 51a and the second bonding materials 52b and 52a at two positions apart from each other.
In particular, in the piezoelectric vibrator 1 for which miniaturization is highly demanded, the bonding area between the first bonding materials 51b and 51a and the second bonding materials 52b and 52a is very small under the present circumstances. For example, in the case of the above-described 1.2 mm×1.0 mm size piezoelectric vibrator 1, the piezoelectric vibrator 1 is applied with a radius of about 0.1 mm, and the bonding area is extremely small.
In this way, when the joining area when joining at two places separated from each other becomes small, the stress concentrated at the joining place becomes large. Then, the stress due to the vibration or the external force concentrated on the joint portion between the first joint materials 51b and 51a and the second joint materials 52b and 52a is applied to the joint portion between the second through electrodes 22B and 22A and the electrode pads 20B and 20A. Then, the electrode pads 20B and 20A may be separated from the second through electrodes 22B and 22A.

For the above reason, in order to avoid the influence of the swelling of the second through electrodes 22B and 22A and the stress concentrated on the first joining materials 51b and 51a and the second joining materials 52b and 52a, the second through electrodes of the present embodiment are avoided. 22B and 22A are formed at positions satisfying the through electrode arrangement conditions.

The connection electrodes 24A and 24B are not in a shape that linearly connects the first through electrodes 23A and 23B and the second through electrodes 22A and 22B, and are not exposed in the cavity C. It is formed along the area where 11 and the first base substrate 10 abut.

The piezoelectric vibrating piece 6 is housed in the cavity C of the hermetically sealed package 2 while being mounted on the mounting portions 14A and 14B by the pair of supporting arm portions 9a and 9b.
That is, as shown in FIGS. 6A and 6B, in the piezoelectric vibrating piece 6, each mount electrode provided on the support arm portions 9a and 9b has electrode pads 20A and 20B (on the mounting portions 14A and 14B). When the metallized layer is formed on the upper surface, the metallized layer is electrically and mechanically bonded to the metallized layer via the first bonding materials 51a and 51b and the second bonding materials 52a and 52b, respectively.
As described above, in the piezoelectric vibrating piece 6 of the present embodiment, each of the support arm portions 9a and 9b is joined and held (two points) on the mounting portions 14A and 14B at two locations in the length direction (first direction D1). Supported).

The first bonding materials 51a, 51b and the second bonding materials 52a, 52b have conductivity, have fluidity in the initial stage of bonding, and have the property of solidifying and exhibiting bonding strength in the latter stage of bonding. For example, a conductive adhesive such as a silver paste or a metal bump is preferably used.
When the first bonding materials 51a and 51b and the second bonding materials 52a and 52b are made of a conductive adhesive, they are applied by a dispenser nozzle supported by a moving head of a coating device.
In the present embodiment, the size of each bonding material depends on the size of the piezoelectric vibrator 1. For example, in the case of the piezoelectric vibrator 1 having a size of 1.2 mm×1.0 mm, the radius of about 0.1 mm is applied.

Next, the arrangement relationship between the first bonding material 51 and the second bonding material 52 that fixes and holds the support arm portion 9 on the mounting portion 14 will be described.
In the following description, the centers of the first joining material 51 and the second joining material 52, which join the support arm portion 9, are described as joining points 51 and 52, respectively.
Both support arm portions 9 are formed at ⅔ or more of the entire length of the piezoelectric vibrating piece 6 as described above, and are at two or more locations in the longitudinal direction, preferably at two locations, that is, the joint location 51 on the base 8 side, They are connected at the joint portion 52 on the tip side.
Then, with respect to the support arm portion 9, the second bonding material 52 is disposed at the distal end portion in the longitudinal direction thereof. On the other hand, the first bonding material 51 is arranged such that the bonding portion 51 is closer to the base 8 than the center of gravity G of the piezoelectric vibrating piece 6. As a result, the center of gravity G exists between the joints 51 and 52.
In this way, by making the joint portion 51 on the base portion 8 side closer to the base portion 8 side than the center of gravity G, the total length from the joint portion 51 to the tip of the vibrating arm portion 7 through the base portion 8 can be shortened. As a result, it is possible to reduce the amount of displacement at the tip of the vibrating arm portion 7 against an external impact.
On the other hand, in order to suppress the vibration leakage from the vibrating arm portion 7, the joint portion 51 on the base portion 8 side is located closer to the center of gravity G than the connecting portion 81 between the base portion 8 and the supporting arm portion 9 in the longitudinal direction. ..

In addition, the bonding strength (bonding strength) of the piezoelectric vibrating reed 6 is increased as compared with the case of one bonding by setting the bonding vibrating reeds to two or more, and the piezoelectric vibrating reed 6 is mounted on the conductive adhesive before solidification. The inclination when placed can be greatly reduced. Further, as compared with the case where the conductive adhesive is used for the entire support arm portion 9, the amount of the adhesive used is reduced, and it becomes possible to further suppress the generation of gas in the cavity.
In addition, in order to improve the balance when the piezoelectric vibrating piece 6 is placed and to reduce the generation of gas, it is preferable that there are two bonding points.
Further, the number of joints does not necessarily have to be two, and may be one or three or more. For example, at least one of the support arms 9 may be connected at a joint on a line passing through the center of gravity G in the lateral direction. When the support arm 9 is longer on the tip side than the base side with respect to the center of gravity G, the support arm 9 may be joined to the tip side of the center of gravity G at two or more joining points.

Further, in the present embodiment, the distance between the joint portions 51 and 52 of the support arm portion 9 is widened. For example, with respect to the entire length of the piezoelectric vibrating piece 6, the joining points 51 and 52 are set to 1/3 and 2/3 from the base 8 side, and the interval between the joining points 51 and 52 is set to about 1/3 of the total length. There is. Then, it is preferable that the distance between the joint portions 51 and 52 be within a range of 45% to 35% with respect to the entire length of the piezoelectric vibrating piece 6 and be slightly larger than 1/3 of the entire length.
That is, the distance from the end of the piezoelectric vibrating piece 6 on the base 8 side to the joint location 51 is a1, the distance between the joint location 51 and the joint location 52 is a2, and the distance from the joint location 52 to the tip of the vibrating arm section 7 is. When a3 is set and the total length of the piezoelectric vibrating piece 6 is set to a0 (=a1+a2+a3), it is preferable that a2 be in the range of 45% to 35% of a0. Further, it is preferable that a1<a3<a2.
In this way, by making the distance a2 between the two joints 51, 52 wider than 1/3 of the total length a0 (45% to 35%), it is possible to prevent external impact or vibration of the vibrating arm portion 7. The support arm portion 9 between the two joint portions slightly bends to absorb and disperse, so that the influence from the outside and the influence to the outside can be suppressed. Further, by setting a1<a2, it is possible to further shorten the total length from the joint portion 51 to the tip of the vibrating arm portion 7 through the base portion 8 and reduce the displacement amount of the tip with respect to an external force.
Here, the terms “near” and “about” refer to a range defined by the width z of the support arm 9 that is the joining target of the first joining material 51 and the second joining material 52.
That is, "around 1/3" means a range of (1/3)-(z/2) ≤ around 1/3 ≤ (1/3)-(z/2). In addition, “around 2/3” refers to a range of (2/3)−(z/2)≦about 2/3≦(2/3)−(z/2).
For example, the joining location 51 (center of the first joining material 51) may be in the range of (1/3)-(z/2) to (1/3)-(z/2).
Therefore, about 1/3 of the total length, which is the “interval between the two joints 51 and 52,” is in the range of (1/3)−z≦about 1/3≦(1/3)+z.

When operating the piezoelectric vibrator 1 configured as described above, a predetermined voltage is applied to the external electrodes 21A and 21B. When a predetermined voltage is applied to the external electrodes 21A and 21B, a current flows through the excitation electrodes 91 and 92 of the two systems, and a pair of vibrations are generated by an inverse piezoelectric effect due to an electric field generated between the excitation electrodes 91 and 92 of the two systems. The arms 7a and 7b vibrate at a predetermined resonance frequency, for example, in a direction (second direction D2) toward and away from each other. The vibration of the pair of vibrating arm portions 7a and 7b is used as a time source, a timing source of control signals, a reference signal source, or the like.

The piezoelectric vibrator 1 described above is used as a time source, a timing source such as a control signal, a reference signal source, or the like in a radio-controlled timepiece, a mobile phone or a portable information terminal device, and a measuring device such as a gyro sensor. It

The present invention is not limited to the above-described embodiments described with reference to the drawings, and various modifications can be considered within the technical scope thereof.
For example, in the above-described embodiment, as the piezoelectric vibrator using the piezoelectric vibrating piece, the ceramic package type surface mount type vibrator has been described. However, the piezoelectric vibrating piece has a base substrate and a lid substrate formed of a glass material. It is also possible to apply to a glass package type piezoelectric vibrator joined by anodic bonding.
Further, the electrode pad 20 of the described embodiment is formed on almost the entire surface of the mounting portion 14, but it may be formed on a region corresponding to at least one of the first bonding material 51 and the second bonding material 52. .. In this case, the second through electrode 22 (see FIG. 6C) is formed in the mounting portion 14 at a position corresponding to the electrode pad 20.

DESCRIPTION OF SYMBOLS 1... Piezoelectric vibrator, 2... Package, 3... Package body, 4... Sealing plate, 6... Piezoelectric vibrating piece, 7... Vibrating arm part, 8... Base part, 9... Support arm part, 10... First base substrate, 11 ... 2nd base substrate, 14... Mounting part, 20... Electrode pad, 21... External electrode, 22... 2nd penetration electrode, 23... 1st penetration electrode, 24... Connection electrode, 51... 1st joining material, 52... 2 bonding material, 72... groove part, a... parallel surface, b... side surface, c... third surface c

Claims (5)

A container for a piezoelectric vibrating piece in which a piezoelectric vibrating piece having a base portion, a vibrating arm portion, and a supporting arm portion for mounting is mounted,
With a concave body,
A lid body that is fixed to the main body to form a housing space for the piezoelectric vibrating piece;
E Bei the mounting portion to which the support arm portion of the piezoelectric vibrating piece is fixed,
The mounting unit is
One parallel surface a parallel to the long side surface formed inside the longitudinal direction of the main body;
Two side surfaces b, one end side of which is continuous with the long side surface and face each other,
A third surface c at least partially including a flat surface and connecting the parallel surface a and the other end of the side surface b;
A long side surface, a parallel surface a, two side surfaces b, and a mounting surface surrounded by the third surface c,
An angle β formed by the parallel surface a and the flat surface portion of the third surface c is greater than 135 degrees and less than 180 degrees,
A piezoelectric vibrating reed container characterized by the above. The angle β formed is 150 degrees or more and 170 degrees or less,
The piezoelectric vibrating piece container according to claim 1, wherein. A portion where the third surface c intersects the parallel surface a and the side surface b is R-processed,
The piezoelectric vibrating piece container according to claim 1 or 2, characterized in that. A piezoelectric vibrating reed container according to any one of claims 1 to 3 ,
A piezoelectric vibrating piece in which the support arm portion is fixed to the mounting portion,
A piezoelectric vibrator comprising: When a virtual line in the longitudinal direction passing through the center of the piezoelectric vibrating reed fixed to the mounting portion in the width direction coincides with a virtual line in the longitudinal direction passing through the center of the piezoelectric vibrating reed container in the width direction, the side surface b The end on the side of the third surface c in is located closer to the center than the side on the center side of the support arm,
The piezoelectric vibrator according to claim 4, characterized in that.

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