JP6704993B2 - Nozzle holding mechanism and component mounting device - Google Patents

Description

The present invention relates to a nozzle holding mechanism and a component mounting device.

Conventionally, an electronic component supplied from a component supply device is attracted to the tip of a nozzle with a negative pressure, the nozzle is moved to a predetermined position on the substrate, and the negative pressure is released, thereby causing the electronic component to a predetermined amount on the substrate. A component mounting device for mounting at a position is known. In such a component mounting apparatus, there is also known one in which a held surface of a nozzle is held on a nozzle holding surface of a head by using negative pressure (for example, Patent Document 1).

JP, 2006-261325, A

However, the nozzle held on the nozzle holding surface of the head by utilizing the negative pressure has a problem that the nozzle falls from the head when the negative pressure is cut off for some reason. As a mechanism for preventing such a drop of the nozzle, it is conceivable to provide a resin pin on one of the nozzle holding surface of the head and the held surface of the nozzle and to provide a hole for press-fitting the pin on the other. In this way, even if the negative pressure is cut off, the head and the nozzle are held by the pin, so that the nozzle does not drop from the head. However, if such a mechanism is adopted, the head and the nozzle are held by the pin even if the negative pressure is shut off when the nozzle is automatically replaced, and therefore the work of pulling out the pin is required. For example, it is necessary to close the shutter of the nozzle stocker with the nozzle inserted in the storage hole of the nozzle stocker and pull out the pin by pulling up the head while pressing the nozzle against the shutter. Therefore, there is a problem that the nozzle cannot be quickly removed when the nozzle is replaced.

The present invention has been made to solve the above-mentioned problems, and even if the negative pressure is suddenly shut off, the nozzle does not drop from the head, and the nozzle can be quickly removed when replacing the nozzle. The main purpose is to

The nozzle holding mechanism of the present invention,
A nozzle holding mechanism for holding a held surface of a nozzle on a nozzle holding surface of a head of a component mounting device by using negative pressure,
A recess provided in at least one of the nozzle holding surface and the held surface,
Pressure adjusting means connected to the recess,
It is attached to the head so as to face the concave portion and the positional relationship with the nozzle holding surface can be changed, and when the nozzle is not held on the nozzle holding surface, an elastic member separates the nozzle holding surface from the nozzle holding surface. A magnet that is placed in a distant normal position,
A metal member made of a material attached to the magnet, the metal member being provided at a position facing the magnet on the held surface of the nozzle;
Equipped with
When a negative pressure is supplied to the pressure adjusting chamber via the pressure adjusting means after bringing the nozzle holding surface and the held surface into contact with each other to form the concave portion as a pressure adjusting chamber, the held surface is made negative. The magnet is attracted to the nozzle holding surface by pressure, and the magnet is arranged from the normal position to the attracting position to attract the metal member by magnetic force against the bias of the elastic body by the negative pressure, and then the pressure is applied. When a positive pressure is supplied to the pressure adjusting chamber via the adjusting means, the magnet is arranged at the normal position by the positive pressure and the bias of the elastic body to attract the metal member on the held surface. To release,
It is a thing.

In this nozzle holding mechanism, when the nozzle holding surface of the head and the held surface of the nozzle are brought into contact with each other to make the concave portion a pressure adjusting chamber and then a negative pressure is supplied to the pressure adjusting chamber, the held surface of the nozzle becomes negative. It is sucked by the pressure to the nozzle holding surface. At the same time, the magnet provided in the head is arranged from the normal position to the attraction position (the position where the metal member provided in the nozzle is attracted by magnetic force) against the bias of the elastic body due to the negative pressure. That is, the nozzle is sucked and held by the head by negative pressure, and is attracted and held by the head by magnetic force. Therefore, even if the negative pressure is suddenly shut off, the nozzle is still attracted to and held by the head due to the magnetic force, and therefore the nozzle does not drop from the head. On the other hand, when removing the nozzle, a positive pressure is supplied to the pressure adjusting chamber. Then, the suction of the nozzle to the head due to the negative pressure is released. Further, since the magnet is arranged at the normal position by the positive pressure and the bias of the elastic body, the attraction of the metal member provided in the nozzle is released. That is, the attraction of the nozzle to the head due to the magnetic force is also released. Therefore, when replacing the nozzle, the nozzle can be quickly removed by supplying a positive pressure to the pressure adjusting chamber.

Examples of the "material attached to the magnet" include a material containing an iron-based element (iron, cobalt, nickel) as a main component.

In the nozzle holding mechanism of the present invention, when the magnet is arranged at the attracting position, the magnet may attract the metal member by a magnetic force while facing the metal member with a gap. In this case, the magnet does not come into direct contact with the metal member, so cracks are less likely to occur. Therefore, the magnet can be used for a long period of time. Further, when a positive pressure is supplied to the pressure adjusting chamber, the positive pressure acts to push up the magnet from the gap between the magnet and the metal member, so that the magnet can be easily returned from the attracting position to the normal position.

The nozzle holding mechanism of the present invention includes a cylindrical magnet holder that holds the magnet, and the magnet has the lower end surface of the magnet whose height is higher than the lower end surface of the magnet holder and the pressure adjustment. The magnet holder is held by the magnet holder so that the atmosphere of the chamber reaches the lower end surface of the magnet through the ventilation hole of the magnet holder, and when the magnet holder is placed at the attracting position, the lower end surface of the magnet holder becomes the metal member. The metal member may be attracted by a magnetic force in a state where the lower end surface of the magnet is in contact with and faces the metal member with the gap. With this configuration, when the magnet is arranged at the attracting position, the lower end surface of the magnet holder comes into contact with the metal member to secure a gap between the magnet and the metal member, which facilitates management of the gap size. .. Further, when positive pressure is supplied to the pressure adjusting chamber, the positive pressure in the pressure adjusting chamber reaches the lower end surface of the magnet through the ventilation hole of the magnet holder, so it is easy to push up the magnet arranged at the attracting position. Become.

Examples of the “vent holder vent holes” include notches and slits provided on the lower end surface of the magnet holder, and vent holes provided near the lower end surface of the magnet holder.

The component mounting apparatus of the present invention includes the nozzle holding mechanism described above. Therefore, according to this component mounting apparatus, it is possible to obtain the same effect as that of the nozzle holding mechanism described above.

FIG. 3 is a perspective view of the component mounting apparatus 10. Explanatory drawing which shows the electrical connection of the component mounting apparatus 10. FIG. 6 is a sectional view of a nozzle holding mechanism in which the head 18 holds a nozzle 28. The bottom view of the nozzle holding surface 62. The perspective view which looked at the magnet holder 70 holding the magnet 76 from diagonally downward. Explanatory drawing which shows the procedure at the time of mounting the nozzle 28 to the head 18. Explanatory drawing which shows the procedure at the time of removing the nozzle 28 from the head 18.

Preferred embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view of the component mounting apparatus 10, FIG. 2 is an explanatory view showing electrical connection of the component mounting apparatus 10, FIG. 3 is a sectional view of a nozzle holding mechanism, FIG. 4 is a bottom view of a nozzle holding surface 62, and FIG. FIG. 6 is a perspective view of the magnet holder 70. In this embodiment, the left-right direction (X axis), the front-back direction (Y axis), and the up-down direction (Z axis) are as shown in FIG. In addition, FIG. 3 also shows an enlarged view of a part surrounded by an ellipse of a chain line.

As shown in FIG. 1, the component mounting apparatus 10 includes a board transfer device 12, a head 18, a nozzle 28, a mark camera 34, a parts camera 36, a nozzle stocker 38, and a mounting controller 40 that executes various controls. (See FIG. 2) and a component supply unit 50.

The substrate transfer device 12 transfers the substrate S from left to right by conveyor belts 16 and 16 (only one of which is shown in FIG. 1) attached to the pair of left and right conveyor rails 14 and 14, respectively. Further, the board transfer device 12 fixes the board S by lifting the board S from below by the support pins 17 arranged below the board S and pressing the board S against the guide portions of the conveyor rails 14, 14 to fix the support pins 17 to the support pins 17. By lowering the substrate S, the fixation of the substrate S is released.

The head 18 has a nozzle 28 on the lower surface. Further, the head 18 is detachably attached to the front surface of the X-axis slider 20. The X-axis slider 20 is slidably attached to a pair of upper and lower guide rails 22, 22 provided on the front surface of the Y-axis slider 24 and extending in the left-right direction. The Y-axis slider 24 is integrated with a nut 23 screwed into a Y-axis ball screw 25, and slidably attached to a pair of left and right guide rails 26, 26 extending in the front-rear direction. One end of the Y-axis ball screw 25 is attached to the Y-axis motor 24a, and the other end is a free end. The Y-axis slider 24 slides along the guide rails 26, 26 by such a ball screw mechanism. That is, when the Y-axis motor 24a rotates, the Y-axis ball screw 25 rotates, and the nut 23 slides along with the Y-axis slider 24 along the guide rails 26, 26 accordingly. Although not shown, the X-axis slider 20 slides along the guide rails 22 and 22 by a ball screw mechanism including an X-axis motor 20a (see FIG. 2), like the Y-axis slider 24. The head 18 moves in the left-right direction as the X-axis slider 20 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 24 moves in the front-rear direction.

The nozzle 28 uses pressure to adsorb components to the nozzle tip or separate components adsorbed to the nozzle tip. The height of the nozzle 28 is adjusted by a Z-axis motor 30 built in the head 18 and a ball screw 32 extending along the Z-axis.

Here, a nozzle holding mechanism in which the head 18 holds the nozzle 28 will be described with reference to FIGS. The nozzle 28 is detachably held by a nozzle holding surface 62 which is a lower surface of a nozzle holding body 60 provided below the head 18. As shown in FIG. 4, the nozzle holding surface 62 is circular when viewed from below and has a ring-shaped concave groove 64 (recess). A pressure adjusting port 66 is provided in the groove 64. A pressure adjusting device 68 is connected to the pressure adjusting port 66. The pressure adjusting device 68 is connected to a positive pressure source 68a that supplies a pressure (positive pressure) higher than atmospheric pressure, a negative pressure source 68b that supplies a pressure (negative pressure) lower than atmospheric pressure, and an atmosphere opening port. The built-in switching valve 68c can supply positive pressure, negative pressure, or atmospheric pressure to the groove 64. Magnets 76 held by a cylindrical magnet holder 70 are arranged at two positions of the groove 64 (on the diameter line of the nozzle holding surface 62). The magnet 76 is held by the magnet holder 70 such that the height of the lower end surface of the magnet 76 is higher than that of the magnet holder 70. As shown in FIG. 5, a plurality of slit-shaped notches 74 (vent holes) are provided along the circumferential direction on the lower end surface of the magnet holder 70. The magnet holder 70 holding the magnet 76 is inserted into the stepped hole 63 of the nozzle holder 60. A holder flange 72 is provided on the upper edge of the magnet holder 70. A coil spring 78 is arranged between the step portion of the stepped hole 63 and the holder flange 72. A cylindrical stopper 80 is laminated on the upper end of the magnet holder 70. A stopper flange 82 is provided radially outward on the upper edge of the stopper 80. The diameter of the stopper flange 82 is formed to be larger than the diameter of the upper opening of the stepped hole 63. The magnet holder 70 and the stopper 80 are laminated so that their central axes coincide with each other, and are integrated by a bolt 84. That is, a screw hole that vertically penetrates the center of the magnet holder 70 is provided in the upper portion of the magnet holder 70, and a screw hole that vertically penetrates the center of the stopper 80 is provided in the stopper 80, and the bolt 84. Is screwed into both screw holes. Therefore, the magnet holder 70 holding the magnet 76 and the stopper 80 can move up and down the stepped hole 63 as a unit, but the stopper flange 82 is provided on the periphery of the upper opening of the stepped hole 63. When it hits it, it cannot move below it.

The nozzle 28 includes a nozzle body 282 and a disc-shaped nozzle flange 286. The nozzle body 282 has a ventilation hole 284 that penetrates in the vertical direction along the central axis. A negative pressure, a positive pressure, or an atmospheric pressure is supplied to the ventilation hole 284 from a nozzle pressure adjusting device (not shown). The nozzle flange 286 is integrated with the upper portion of the nozzle body 282. A metal plate 290 (metal member) made of a material attached to the magnet 76 (for example, an iron-based element such as iron, cobalt, nickel) is provided at a position facing the magnet 76 on the held surface 288 that is the upper surface of the nozzle flange 286. Is buried.

A procedure for mounting the nozzle 28 on the nozzle holding surface 62 of the head 18 will be described with reference to FIG. FIG. 6 is an explanatory diagram of this procedure. First, as shown in FIG. 6A, the nozzle holding surface 62 of the head 18 is brought into contact with the held surface 288 of the nozzle 28. At this time, the center of the nozzle holding surface 62 and the center of the held surface 288 of the nozzle 28 are aligned. As a result, the concave groove 64 of the nozzle holding surface 62 is covered with the held surface 288 of the nozzle 28 to form the pressure adjusting chamber C. At this stage, the magnet holder 70 that holds the magnet 76 and the stopper 80 are positioned by the coil spring 78 at a position (normal position) spaced upward from the nozzle holding surface 62. Next, a negative pressure is supplied to the pressure adjusting chamber C via the pressure adjusting device 68. Then, the held surface 288 of the nozzle 28 is attracted to the nozzle holding surface 62 of the head 18 by negative pressure. At the same time, since the magnet 76 is elastically supported by the coil spring 78 while facing the groove 64, the magnet 76 resists the biasing force of the coil spring 78 due to the negative pressure, as shown in FIG. 6B. And moves downward, that is, toward the held surface 288 of the nozzle 28, and stops at the position (attraction position) where the lower end surface of the magnet holder 70 contacts the metal plate 290 of the nozzle 28. Since the height of the lower end surface of the magnet 76 is higher than the lower end surface of the magnet holder 70, a predetermined gap is formed between the magnet 76 and the metal plate 290. The height of this gap is controlled by the difference in height between the lower end surface of the magnet holder 70 and the lower end surface of the magnet 76. Even if the negative pressure is cut off, the height of this gap can keep the nozzle 28 retained on the nozzle holding surface 62 of the head 18 by attracting the metal plate 290 with the magnet 76 facing the metal plate 290. It is set to be possible. The atmosphere in the pressure adjusting chamber C reaches the lower end surface of the magnet 76 through the notch 74 provided in the lower end surface of the magnet holder 70. The stopper 80 integrated with the magnet holder 70 also determines the lower limit position of the magnet 76, and normally when the lower end surface of the magnet holder 70 contacts the metal plate 290, the stopper flange 82 has a stepped hole. It is designed to contact the periphery of the upper opening of 63, but this may not be the case due to tolerances or the like. Therefore, the gap between the magnet 76 and the metal plate 290 is substantially controlled by the height difference between the lower end surface of the magnet holder 70 and the lower end surface of the magnet 76.

Returning to FIG. 1, the mark camera 34 is installed on the lower surface of the head 18 so that the imaging direction faces the substrate S, and is movable in the XY directions together with the head 18. The mark camera 34 is used to capture an image of a board mark (not shown) provided on the board S for board positioning.

The parts camera 36 is installed between the parts supply unit 50 and the board transfer device 12 so that the imaging direction is upward at approximately the center of the length in the left-right direction. The parts camera 36 images the parts sucked by the nozzles 28 passing above the parts camera 36.

The nozzle stocker 38 stocks a plurality of types of nozzles 28 in the storage hole 38a. The nozzle stocker 38 is arranged next to the parts camera 36. The nozzle 28 is replaced with a nozzle suitable for the type of board on which the component is mounted and the type of the component.

As shown in FIG. 2, the mounting controller 40 is configured as a microprocessor centered on a CPU 40a, and includes a ROM 40b for storing a processing program, an HDD 40c for storing various data, a RAM 40d used as a work area, and the like. .. An input device 40e such as a mouse and a keyboard and a display device 40f such as a liquid crystal display are connected to the mounting controller 40. The mounting controller 40 is connected to a feeder controller 57 built in the feeder 56 and a management computer 90 so as to be capable of bidirectional communication. Further, the mounting controller 40 is connected so as to be able to output control signals to the board transfer device 12, the X-axis motor 20a, the Y-axis motor 24a, the Z-axis motor 30, the mark camera 34, the parts camera 36, the pressure adjusting device 68, and the like. Has been done. Further, the mounting controller 40 is connected so as to be able to receive images from the mark camera 34 and the parts camera 36. For example, the mounting controller 40 recognizes the position of the board S by processing the image of the board S captured by the mark camera 34 and recognizing the position of the board mark (not shown). Further, the mounting controller 40 determines whether or not a component is sucked by the nozzle 28, and determines the shape, size, suction position, etc. of the component based on the image captured by the parts camera 36.

As shown in FIG. 1, the component supply unit 50 includes a device pallet 52 and a feeder 56. The device pallet 52 has a large number of slots 54 on its upper surface. The slot 54 is a groove into which the feeder 56 can be inserted. The feeder 56 rotatably holds a reel 58 around which a tape is wound. A plurality of recesses (not shown) are formed on the tape so as to be aligned along the longitudinal direction of the tape. Parts are housed in the respective recesses. These parts are protected by a film (not shown) covering the surface of the tape. A component suction position is defined on the feeder 56. The component suction position is a position determined by design where the nozzle 28 sucks a component. Every time the tape is fed back by a predetermined amount by the feeder 56, the components housed in the tape are sequentially arranged at the component suction position. The film that has come to the component suction position is peeled off, and is sucked by the nozzle 28.

As shown in FIG. 2, the management computer 90 includes a personal computer main body 92, an input device 94, and a display 96, and can input signals from the input device 94 operated by an operator. Images can be output. The production job data is stored in the memory of the personal computer body 92. The production job data defines what components are to be mounted on the board S in the component mounting apparatus 10 in what order, and how many boards S to be mounted in this manner are to be manufactured.

Next, an operation (a component mounting operation) in which the mounting controller 40 of the component mounting apparatus 10 mounts a component on the board S based on a production job will be described. First, the mounting controller 40 causes the nozzle 28 of the head 18 to adsorb the component supplied from the feeder 56 of the component supply unit 50. Specifically, the mounting controller 40 controls the X-axis motor 20a of the X-axis slider 20 and the Y-axis motor 24a of the Y-axis slider 24 so that the nozzle 28 of the head 18 is located directly above the component suction position of the desired component. To move. Next, the mounting controller 40 controls the Z-axis motor 30 to lower the nozzle 28 and supply the negative pressure to the vent hole 284 of the nozzle 28. As a result, the desired component is adsorbed to the tip of the nozzle 28. After that, the mounting controller 40 raises the nozzle 28 and controls the X-axis slider 20 and the Y-axis slider 24 to move the nozzle 28, which has adsorbed the component at its tip, to above a predetermined position on the substrate S. Then, at the predetermined position, the mounting controller 40 lowers the nozzle 28 and controls so that the atmospheric pressure is supplied to the vent hole 284. As a result, the components sucked by the nozzles 28 are separated from each other and mounted on the substrate S at predetermined positions. Other components to be mounted on the substrate S are similarly mounted on the substrate S, and when the mounting of all components is completed, the substrate S is sent to the downstream side.

Next, the operation in which the mounting controller 40 of the component mounting apparatus 10 automatically replaces the nozzle 28 of the head 18 will be described. When it is necessary to replace the nozzle, the mounting controller 40 controls the X-axis motor 20a and the Y-axis motor 24a to move the nozzle 28 held by the head 18 above a predetermined storage hole 38a of the nozzle stocker 38. .. Subsequently, the mounting controller 40 controls the Z-axis motor 30 to store the nozzle 28 held by the head 18 in a predetermined storage hole 38 a of the nozzle stocker 38.

FIG. 7 is an explanatory diagram of a procedure for removing the nozzle 28 from the head 18. At the stage when the nozzle 28 held by the head 18 is inserted into the storage hole 38a, the nozzle 28 is in the state shown in FIG. 7(a). That is, the nozzle 28 is sucked and held by the nozzle holding surface 62 of the head 18 by the negative pressure in the pressure adjusting chamber C, and the magnetic force of the magnet 76 arranged at the attracting position causes the metal plate 290 to move to the head 18. It is attracted and held. Subsequently, the mounting controller 40 supplies a positive pressure from the pressure adjusting port 66 via the pressure adjusting device 68 to the pressure adjusting chamber C to which the negative pressure has been supplied until then. Then, the suction of the nozzle 28 to the head 18 due to the negative pressure is released. Further, as shown in FIG. 7B, the magnet 76 is moved from the attracted position to the position (normal position) away from the nozzle holding surface 62 by the positive pressure in the pressure adjusting chamber C and the bias of the coil spring 78. In order to move, the attraction of the metal plate 290 provided on the nozzle 28 is released. That is, the attraction of the nozzle 28 to the head 18 by the magnetic force is also released. Therefore, when replacing the nozzle, the nozzle 28 can be quickly removed by supplying a positive pressure to the pressure adjusting chamber C.

The mounting controller 40 moves the head 18 with the nozzle 28 removed to a position above the housing hole 38a in which the nozzle 28 to be used next is housed in a state where the atmospheric pressure is supplied to the pressure adjusting chamber C, and the nozzle 28 is covered. The nozzle holding surface 62 of the head 18 is brought into contact with the holding surface 288. In that state, the mounting controller 40 supplies a negative pressure from the pressure adjusting port 66 to the pressure adjusting chamber C via the pressure adjusting device 68. Then, the held surface 288 of the nozzle 28 is attracted to the nozzle holding surface 62 by the negative pressure. At the same time, the magnet 76 provided on the head 18 moves from the normal position to the attracting position against the bias of the coil spring 78 by the negative pressure. As a result, the nozzle 28 is sucked and held by the head 18 by a negative pressure, and is attracted and held by the head 18 by a magnetic force. In this way, the nozzle 28 is automatically replaced.

In the component mounting apparatus 10 described above, the nozzle holding surface 62 of the head 18 and the held surface 288 of the nozzle 28 are brought into contact with each other to form the concave groove 64 as the pressure adjusting chamber C, and then the negative pressure is supplied to the pressure adjusting chamber C. Then, the held surface 288 of the nozzle 28 is attracted to the nozzle holding surface 62 by the negative pressure. At the same time, the magnet 76 provided on the head 18 is arranged from the normal position to the attracting position against the bias of the coil spring 78 by the negative pressure. That is, the nozzle 28 is attracted and held by the head 18 by negative pressure, and is attracted and held by the head 18 by magnetic force. Therefore, even if the negative pressure is suddenly cut off as in the case where the power is turned off, the nozzle 28 is still attracted to and held by the head 18 due to the magnetic force, and therefore does not fall off the head 18. On the other hand, when removing the nozzle 28, a positive pressure is supplied to the pressure adjusting chamber C. Then, the suction of the nozzle 28 to the head 18 due to the negative pressure is released. Further, since the magnet 76 is arranged at the normal position by the positive pressure and the bias of the coil spring 78, the attraction of the metal plate 290 provided on the nozzle 28 is released. That is, the attraction of the nozzle 28 to the head 18 by the magnetic force is also released. Therefore, when replacing the nozzle, the nozzle 28 can be quickly removed by supplying a positive pressure to the pressure adjusting chamber C.

Further, since the magnet 76 attracts the metal plate 290 with magnetic force in a state of facing the metal plate 290 with a gap when it is arranged at the attracting position, it does not come into direct contact with the metal plate 290 and cracks are less likely to occur. .. Therefore, the magnet 76 can be used for a long period of time. Further, when a positive pressure is supplied to the pressure adjusting chamber C, the positive pressure acts to push up the magnet 76 from the gap between the magnet 76 and the metal plate 290, so that the magnet 76 can be easily returned from the attracting position to the normal position.

Further, when the magnet 76 is arranged at the attracting position, the lower end surface of the magnet holder 70 comes into contact with the metal plate 290 to secure a gap between the magnet 76 and the metal plate 290, so that the size of the gap is managed. Easier to do. Further, when a positive pressure is supplied to the pressure adjusting chamber C, the positive pressure of the pressure adjusting chamber C reaches the lower end surface of the magnet 76 through the notch 74 of the magnet holder 70, and thus pushes up the magnet arranged at the attracting position. It will be easier.

Furthermore, since it is not necessary to open and close the shutter of the nozzle stocker 38 at the time of nozzle replacement, automatic nozzle replacement can be performed more quickly. Further, the cost can be reduced by eliminating the shutter mechanism itself.

It is needless to say that the present invention is not limited to the above-described embodiment and can be implemented in various modes within the technical scope of the present invention.

For example, although the magnet holder 70 and the stopper 80 are integrated with the bolt 84 in the above-described embodiment, the stopper 80 and the bolt 84 may be omitted. Even in this case, since the lower end surface of the magnet holder 70 comes into contact with the metal plate 290, a gap is secured between the magnet 76 and the metal plate 290, and therefore the same effect as that of the above-described embodiment can be obtained.

In the above-described embodiment, a gap is formed between the magnet 76 and the metal plate 288 when the magnet 76 is arranged at the attracting position. However, when the magnet 76 having excellent impact resistance is used, The metal plate 76 and the metal plate 288 may be in contact with each other. Specifically, the lower end surface of the magnet 76 and the lower end surface of the magnet holder 70 may have the same height. In this case, if a positive pressure is supplied to the pressure adjusting chamber C in a state where the magnet 76 is arranged at the attracting position, a positive pressure is applied to the notch 74 of the magnet holder 70 so that the magnet 76 returns to the normal position. Good.

In the above-described embodiment, the head 18 is equipped with one nozzle 28, but a plurality of nozzles may be equipped with the nozzle holding mechanism described above.

Although two pairs of the magnet 76 and the metal plate 290 are provided in the above-described embodiment, three or more pairs may be provided.

The present invention can be used for a component mounting device.

10 component mounting device, 12 board transfer device, 14 conveyor rail, 16 conveyor belt, 17 support pin, 18 head, 20 X-axis slider, 20a X-axis motor, 22 guide rail, 23 nut, 24 Y-axis slider, 24a Y-axis Motor, 25 Y-axis ball screw, 26 guide rail, 28 nozzle, 30 Z-axis motor, 32 ball screw, 34 mark camera, 36 parts camera, 38 nozzle stocker, 38a storage hole, 40 mounting controller, 40a CPU, 40b ROM, 40c HDD , 40d RAM, 40e input device, 40f display device, 50 parts supply unit, 52 device pallet, 54 slot, 56 feeder, 57 feeder controller, 58 reel, 60 nozzle holder, 62 nozzle holding surface, 63 stepped hole, 64 Groove, 66 pressure adjusting port, 68 pressure adjusting device, 68a positive pressure source, 68b negative pressure source, 68c switching valve, 70 magnet holder, 72 holder flange, 74 notch, 76 magnet, 78 coil spring, 80 stopper, 82 stopper Flange, 84 bolt, 90 management computer, 92 personal computer body, 94 input device, 96 display, 282 nozzle body, 284 vent hole, 286 nozzle flange, 288 held surface, 290 metal plate.

Claims (4)

A nozzle holding mechanism for holding a held surface of a nozzle on a nozzle holding surface of a head of a component mounting device by using negative pressure,
A recess provided in at least one of the nozzle holding surface and the held surface,
Pressure adjusting means connected to the recess,
It is attached to the head so as to face the concave portion and the positional relationship with the nozzle holding surface can be changed, and when the nozzle is not held on the nozzle holding surface, an elastic member separates the nozzle holding surface from the nozzle holding surface. A magnet that is placed in a distant normal position,
A metal member made of a material attached to the magnet, the metal member being provided at a position facing the magnet on the held surface of the nozzle;
Equipped with
When a negative pressure is supplied to the pressure adjusting chamber via the pressure adjusting means after bringing the nozzle holding surface and the held surface into contact with each other to form the concave portion as a pressure adjusting chamber, the held surface is made negative. The magnet is attracted to the nozzle holding surface by pressure, and the magnet is arranged from the normal position to the attracting position to attract the metal member by magnetic force against the bias of the elastic body by the negative pressure, and then the pressure is applied. When a positive pressure is supplied to the pressure adjusting chamber via the adjusting means, the magnet is arranged at the normal position by the positive pressure and the bias of the elastic body to attract the metal member on the held surface. To release,
Nozzle holding mechanism. When the magnet is arranged at the attraction position, the magnet attracts the metal member with a magnetic force while facing the metal member with a gap,
The nozzle holding mechanism according to claim 1. The nozzle holding mechanism according to claim 2, wherein
A cylindrical magnet holder for holding the magnet,
In the magnet, the height of the lower end surface of the magnet is higher than the lower end surface of the magnet holder, and the atmosphere of the pressure adjusting chamber reaches the lower end surface of the magnet through the ventilation hole of the magnet holder. When the metal holder is held by the magnet holder and is arranged at the attracting position, the lower end surface of the magnet holder comes into contact with the metal member and the lower end surface of the magnet faces the metal member with the gap therebetween. Attracts members with magnetic force,
Nozzle holding mechanism. A component mounting apparatus comprising the nozzle holding mechanism according to claim 1.

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