JP6687346B2 - アクティブダンピング機構を備えた振動式流体ムーバアセンブリ - Google Patents
アクティブダンピング機構を備えた振動式流体ムーバアセンブリ Download PDFInfo
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- 239000012530 fluid Substances 0.000 title claims description 129
- 238000013016 damping Methods 0.000 title claims description 27
- 230000007246 mechanism Effects 0.000 title description 10
- 239000000725 suspension Substances 0.000 claims description 68
- 125000006850 spacer group Chemical group 0.000 claims description 20
- 239000013464 silicone adhesive Substances 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000013536 elastomeric material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
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- 229920001971 elastomer Polymers 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
- F04B43/046—Micropumps with piezoelectric drive
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B17/00—Pumps characterised by combination with, or adaptation to, specific driving engines or motors
- F04B17/03—Pumps characterised by combination with, or adaptation to, specific driving engines or motors driven by electric motors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
- F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
- F04B45/047—Pumps having electric drive
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
- F04F7/00—Pumps displacing fluids by using inertia thereof, e.g. by generating vibrations therein
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
- F15D1/00—Influencing flow of fluids
- F15D1/0095—Influencing flow of fluids by means of injecting jet pulses of fluid wherein the injected fluid is taken from the fluid and re-injected again, e.g. synthetic jet actuators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Vibration Prevention Devices (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Reciprocating Pumps (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combined Devices Of Dampers And Springs (AREA)
Description
12 シンセティックジェット
16 ハウジング、本体
18 回路駆動装置
20 内部チャンバ、キャビティ
22 流体
24 第1プレート
26 第2のプレート
28 スペーサ要素
30 オリフィス、開口部
32 外部環境
34 圧電駆動アクチュエータ
36 圧電駆動アクチュエータ
38 可撓性ダイアフラム
40 可撓性ダイアフラム
44 矢印
46 周囲流体、周囲ガス
48 矢印
50 矢印
52 矢印
54 装置
56 シンセティックジェットアセンブリ
58 動吸振系
60 システム/コンポーネント、表面
62 懸垂用突起
64 ばね式支持具
66 中央点
68 穴
70 シンセティックジェットアセンブリ
72 動吸振系
74 コイルばね
76 シンセティックジェットアセンブリ
78 動吸振系
80 実装用支持具アセンブリ
82 実装用支持具
84 コイルばね
86 支持部
88 上面
90 シンセティックジェットアセンブリ
92 動吸振系
94 実装用支持具
96 溝
98 コイルばね
Claims (17)
- 第1のプレート(24)と、
前記第1のプレート(24)から離間する第2のプレート(26)と、
前記第1および第2のプレート(24、26)の間にあって前記第1および第2のプレート(24、26)を離間した状態に維持するスペーサ要素(28)であって、内部にオリフィス(30)が形成されたスペーサ要素(28)と、
前記第1および第2のプレート(24、26)のうちの少なくとも1つに結合され、かつ流体流を生成してそれを前記オリフィス(30)から噴出するようにそのたわみを選択的に生じさせるアクチュエータ素子(34、36)と、
を有する振動式流体ムーバと、
前記振動式流体ムーバに接続され、かつ前記振動式流体ムーバに対してアクティブダンピングを行う吸振系(58)であって、前記吸振系(58)は、
前記振動式流体ムーバに結合された複数個の懸垂用突起(62)と、
前記振動式流体ムーバを懸架状態で実装するように構成された複数個のばね要素であって、前記複数個のばね要素はコイルばね(74)を備え、各コイルばね(74)は懸垂用突起(62)にそれぞれ取り付けられて、前記振動式流体ムーバに対して振動減衰を行う、ばね要素と、
を有する、吸振系(58)と、
を備えた振動式流体ムーバアセンブリ(10)。 - 前記複数個の懸垂用突起(62)のそれぞれは、前記振動式流体ムーバに対して振動減衰を行うエラストマー材料で形成される、請求項1に記載の振動式流体ムーバアセンブリ(10)。
- 前記複数個の懸垂用突起(62)のそれぞれはシリコン接着剤で形成され、かつ前記複数個のばね要素のそれぞれに直接結合されている、請求項1に記載の振動式流体ムーバアセンブリ(10)。
- 前記複数個のばね要素はばね式支持具(64)を備え、各ばね式支持具(64)は懸垂用突起(62)にそれぞれ取り付けられて、前記振動式流体ムーバに対して振動減衰を行う、請求項1に記載の振動式流体ムーバアセンブリ(10)。
- 各ばね式支持具(64)はそのばね式支持具(64)の中央点(66)で懸垂用突起(62)にそれぞれ取り付けられる、請求項4に記載の振動式流体ムーバアセンブリ(10)。
- 各ばね式支持具(64)はそのばね式支持具(64)の向かい合う両端に一対の開口(68)を備え、前記ばね式支持具(64)を外部のコンポーネントまたはシステムに固定するために、前記一対の開口(68)はその内部に固定具を受け入れるように構成される、請求項5に記載の振動式流体ムーバアセンブリ(10)。
- 前記複数個の懸垂用突起(62)は、前記第1および第2のプレート(24、26)のモード形状が前記振動式流体ムーバの動作時に影響を受けるように、前記第1および第2のプレート(24、26)を前記振動式流体ムーバの周りの少なくとも一部分に配置された実装用支持具(82)に固定する、請求項1に記載の振動式流体ムーバアセンブリ(10)。
- 前記吸収系(58)は前記振動式流体ムーバの周りの少なくとも一部分に配置された実装用支持具(82)をさらに備え、前記複数個の懸垂用突起(62)は前記実装用支持具(82)に結合されて、前記振動式流体ムーバと前記実装用支持具(82)の間にある程度柔軟な接続を実現する、請求項1に記載の振動式流体ムーバアセンブリ(10)。
- 前記実装用支持具(82)は、一対の側方支持部を接続する後部支持部を有するU字型の実装用支持具(82)を備え、前記U字型の実装用支持具(82)の各辺に少なくとも1つの懸垂用突起(62)が備わるように前記複数個の懸垂用突起(62)が配置される、請求項8に記載の振動式流体ムーバアセンブリ(10)。
- 前記実装用支持具(82)は前記実装用支持具(82)の内縁に沿って溝(96)が形成され、前記複数個の懸垂用突起(62)が前記溝(96)とかみ合うことで前記振動式流体ムーバを前記実装用支持具(82)に固定する、請求項8に記載の振動式流体ムーバアセンブリ(10)。
- 前記複数個のばね要素はコイルばね(74)を備え、それぞれのコイルばね(74)は前記実装用支持具(82)の底面に取り付けられる、請求項8に記載の振動式流体ムーバアセンブリ(10)。
- 前記振動式流体ムーバはシンセティックジェット(12)を備える、請求項1に記載の振動式流体ムーバアセンブリ(10)。
- キャビティ(20)およびオリフィス(30)が内部に形成された本体(16)と、
前記本体(16)に結合され、かつ前記本体(16)のたわみを選択的に生じさせてそれによって流体流を生成してそれを前記オリフィス(30)から噴出させる少なくとも1つのアクチュエータ素子(34、36)と、
を有する振動式流体ムーバと、
前記振動式流体ムーバに接続された動吸振系(58)であって、前記動吸振系(58)は、
前記振動式流体ムーバを外部の系に対して懸架状態で実装するように構成された複数個のばね要素であって、前記複数個のばね要素はコイルばね(74)を備える、ばね要素と、
前記振動式流体ムーバを前記複数個のばね要素に結合する複数個の懸垂用突起(62)と、
を有する動吸振系(58)と、
を備え、
前記複数個のばね要素と前記複数個の懸垂用突起(62)とは前記振動式流体ムーバに対してアクティブダンピングを行う、
振動式流体ムーバアセンブリ(10)。 - 前記複数個の懸垂用突起(62)のそれぞれはシリコン接着剤で形成され、前記シリコン接着剤は各ばね要素への接着を行うことによって前記懸垂用突起(62)を前記ばね要素に結合する、請求項13に記載の振動式流体ムーバアセンブリ(10)。
- 前記複数個のばね要素はばね式支持具(64)を備え、各ばね式支持具(64)はそのばね式支持具(64)の中央点(66)で懸垂用突起(62)にそれぞれ取り付けられる、請求項13に記載の振動式流体ムーバアセンブリ(10)。
- 第1のプレート(24)と、
前記第1のプレート(24)から離間する第2のプレート(26)と、
前記第1および第2のプレート(24、26)の間にあって前記第1および第2のプレート(24、26)を離間した状態に維持するスペーサ要素(28)であって、内部にオリフィス(30)が形成されたスペーサ要素(28)と、
前記第1および第2のプレート(24、26)のうちの少なくとも1つに結合され、かつ流体流を生成してそれを前記オリフィス(30)から噴出するようにそのたわみを選択的に生じさせるアクチュエータ素子(34、36)と、
を有する振動式流体ムーバと、
前記振動式流体ムーバの周りの少なくとも一部分に配置されて前記振動式流体ムーバを支持する実装用支持具(82)であって、前記実装用支持具(82)の内縁に沿って溝(96)が形成されている、実装用支持具(82)と、
前記振動式流体ムーバを前記実装用支持具(82)に結合する複数個の懸垂用突起(62)であって、前記溝(96)と嵌合することによって前記振動式流体ムーバと前記実装用支持具(82)との間にある程度柔軟な接続を実現する、複数個の懸垂用突起(62)と、
前記振動式流体ムーバに対してアクティブダンピングを行うために前記実装用支持具(82)の底面に取り付けられる複数個のコイルばね(74)と、
を備える振動式流体ムーバアセンブリ(10)。 - 前記実装用支持具(82)は、一対の側方支持部を接続する後部支持部を有するU字型の実装用支持具(82)を備え、前記U字型の実装用支持具(82)の各辺の前記内縁に形成された前記溝(96)に少なくとも1つの懸垂用突起(62)が嵌合するように前記複数個の懸垂用突起(62)が配置される、請求項16に記載の振動式流体ムーバアセンブリ(10)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/473,152 US9879661B2 (en) | 2014-08-29 | 2014-08-29 | Vibrational fluid mover jet with active damping mechanism |
US14/473,152 | 2014-08-29 |
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JP2016050581A JP2016050581A (ja) | 2016-04-11 |
JP6687346B2 true JP6687346B2 (ja) | 2020-04-22 |
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US (1) | US9879661B2 (ja) |
EP (1) | EP2995815A1 (ja) |
JP (1) | JP6687346B2 (ja) |
KR (1) | KR20160026787A (ja) |
CN (1) | CN105387762B (ja) |
TW (1) | TWI670416B (ja) |
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- 2015-08-26 EP EP15182565.0A patent/EP2995815A1/en not_active Withdrawn
- 2015-08-28 CN CN201510859312.2A patent/CN105387762B/zh not_active Expired - Fee Related
- 2015-08-28 KR KR1020150121774A patent/KR20160026787A/ko not_active Application Discontinuation
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CN105387762A (zh) | 2016-03-09 |
EP2995815A1 (en) | 2016-03-16 |
KR20160026787A (ko) | 2016-03-09 |
CN105387762B (zh) | 2019-10-01 |
JP2016050581A (ja) | 2016-04-11 |
TWI670416B (zh) | 2019-09-01 |
US20160061194A1 (en) | 2016-03-03 |
TW201629344A (zh) | 2016-08-16 |
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