JP6683096B2 - Ultrasonic device, ultrasonic probe, and ultrasonic device - Google Patents

Description

  The present invention relates to an ultrasonic device, an ultrasonic probe, and an ultrasonic device.

  BACKGROUND ART Conventionally, an ultrasonic transducer device (ultrasonic device) including a substrate having a plurality of openings arranged in an array and an ultrasonic transducer arranged at each opening for transmitting and receiving ultrasonic waves is known. (For example, patent document 1).

In Patent Document 1, the ultrasonic transducer includes a vibrating film that closes the opening, and a piezoelectric element portion (piezoelectric element) provided in the vibrating film.
In the above ultrasonic device, the vibrating film is vibrated in response to the driving of the piezoelectric element arranged in the opening, so that the ultrasonic wave is transmitted from the inside of the opening. Further, when receiving the ultrasonic wave, the vibrating film is vibrated by the ultrasonic wave that has entered the opening, and a signal corresponding to the vibration of the vibrating film is output from the piezoelectric element.

JP, 2014-78906, A

  However, in the conventional ultrasonic device as described in Patent Document 1, there is a possibility that a part of the ultrasonic waves reflected by the measurement target may enter other than the opening, that is, the wall portion forming the opening. Therefore, a part of the reflected wave may not be received, and the receiving sensitivity of the ultrasonic device may be reduced.

  An object of the present invention is to provide an ultrasonic device, an ultrasonic probe, and an ultrasonic device as the following modes or application examples capable of improving ultrasonic wave reception sensitivity.

  An ultrasonic device according to an application example of the present invention covers a substrate having a transducer array including a plurality of ultrasonic transducers arranged in an array, the transducer array, and ultrasonic waves to the ultrasonic transducer. And an acoustic member that propagates the acoustic member, the substrate has an element outside region between the adjacent ultrasonic transducers, and the acoustic member is arranged in a first direction from the transducer array toward the acoustic member. In a planar view seen, it has a void forming surface that forms a void that overlaps at least a part of the element outside region, and the void forming surface is inclined toward the ultrasonic transducer adjacent to the void. It is characterized by including an inclined portion.

  In this application example, the acoustic member is arranged so as to cover the transducer array. In addition, the acoustic member has a void forming surface that forms a void portion that overlaps with the element outside region in a plan view seen from the first direction. The void forming surface has an inclined portion that is inclined toward the ultrasonic transducer adjacent to the void. In such a configuration, the difference in acoustic impedance between the void and the acoustic member is large. Therefore, the acoustic member can guide at least a part of the ultrasonic waves incident on the area outside the element to the ultrasonic transducer by the inclined portion. Therefore, at least a part of the ultrasonic waves propagating toward the region outside the element can be received by the ultrasonic transducer, and the receiving sensitivity of the ultrasonic device can be improved.

In the ultrasonic device according to this application example, the inclined portion has one of the two ultrasonic transducers arranged adjacent to each other at a position sandwiching the void along a second direction intersecting the first direction, and It has a 1st inclination part which inclines toward said one of the other, and a 2nd inclination part which inclines toward the other, and the 1st inclination part and the 2nd inclination part are in the 1st direction. It is preferable that they are connected to each other on the side opposite to the substrate.
In this application example, the first inclined portion is inclined toward one of the two ultrasonic transducers arranged so as to sandwich the void along the second direction, and the second inclined portion is toward the other. Incline. The first sloped portion and the second sloped portion are connected on the side opposite to the substrate. With such a configuration, it is possible to guide the ultrasonic wave toward the area outside the element to the ultrasonic transducer by either the first inclined portion or the second inclined portion. That is, a part of the ultrasonic waves directed to the region outside the element is transferred to the one ultrasonic transducer by the first inclined portion, and another part of the ultrasonic wave is transferred to the other ultrasonic transducer by the second inclined portion. Can lead to a producer. Therefore, it is possible to more reliably guide the ultrasonic waves toward the area outside the element toward the ultrasonic transducer, and it is possible to more reliably improve the transmission / reception sensitivity.

In the ultrasonic device according to this application example, the inclined portion has one of the two ultrasonic transducers arranged adjacent to each other at a position sandwiching the void along a second direction intersecting the first direction, and The other has a first inclined portion inclined toward the one side and a second inclined portion inclined toward the other side, and the first inclined portion and the second inclined portion are flat surfaces, and In a plane parallel to the first direction and the second direction, a first virtual line that overlaps the first inclined portion intersects the one side of the ultrasonic transducer and a second virtual line that overlaps the second inclined portion. A line preferably intersects the other of the ultrasonic transducers.
In this application example, the first virtual line that overlaps the first inclined portion intersects one of the ultrasonic transducers in the plane (virtual plane) parallel to the first direction and the second direction. That is, the first inclined portion has a planar shape and is inclined toward one of the ultrasonic transducers in the virtual plane. With such a configuration, the first inclined portion can more reliably guide a part of the ultrasonic wave propagating toward the outer region of the element along the first direction to the one ultrasonic transducer. Further, the second inclined portion, like the first inclined portion, more reliably transmits the other part of the ultrasonic wave propagating toward the element outside region along the first direction to the other ultrasonic transducer. I can guide you.

In the ultrasonic device according to this application example, the void portion includes two ultrasonic transformers arranged adjacent to each other along a second direction intersecting the first direction in a plan view seen from the first direction. It is preferable that it is formed at a position sandwiched by theducer and that the dimension in the second direction is the same as the dimension of the element outside region.
Here, in the second direction (width direction), when the dimension of the void (width dimension) is larger than the element outside region, a part of the ultrasonic wave transmitted from the ultrasonic transducer along the first direction However, there is a possibility that the output is reduced due to being blocked by the voids. Further, when the width dimension of the void is smaller than the element outside area, a part of the ultrasonic wave propagating toward the element outside area along the first direction is directly incident on the element outside area of the substrate. As described above, the reception sensitivity may decrease. On the other hand, in this application example, the width dimension of the void portion is the same as the outside area of the element, so that the above-described decrease in output and decrease in reception sensitivity can be suppressed.

In the ultrasonic device of this application example, it is preferable that the void be separated from the substrate.
In this application example, the void portion is provided separately from the substrate. That is, a part of the acoustic member is arranged between the gap and the substrate. In such a configuration, the acoustic member is supported by the substrate in both the region outside the element and the region where the ultrasonic transducer is provided (element region) in the substrate. Therefore, the stress acting on the element region of the substrate can be relaxed by supporting the acoustic member, and it is possible to prevent the ultrasonic transducer from having a defect such as a characteristic change.

In the ultrasonic device according to this application example, the substrate includes a vibrating film, and a substrate body portion provided on one surface of the vibrating membrane, and the substrate body portion includes a wall portion that supports the vibrating membrane, An opening provided with the ultrasonic transducer, the opening being closed by the vibrating membrane, the acoustic member being provided on one side of the vibrating membrane, and the void being viewed from the first direction. It preferably overlaps with the wall portion in a plan view.
In this application example, the substrate body provided on one surface side of the vibrating membrane has a wall portion that supports the vibrating membrane and an opening that is closed by the vibrating membrane. An ultrasonic transducer is provided in the opening. That is, the flexible portion is vibrated by the ultrasonic wave that propagates along the first direction and is incident on the vibrating film (hereinafter also referred to as the flexible portion) in the opening, and a signal corresponding to the vibration is transmitted to the ultrasonic transformer. Output from the producer.
In such a configuration, since the wall portion of the substrate main body portion is arranged on the one surface side of the flexible portion, that is, the incident side of the ultrasonic wave, the ultrasonic wave is easily incident on the wall portion and the ultrasonic wave is easily attenuated.
On the other hand, the acoustic member is provided on the one surface side of the vibrating film, that is, in the opening or on the wall so that the void overlaps the wall in the first direction. Thereby, the ultrasonic waves toward the wall portion can be guided toward the ultrasonic transducer, and a decrease in the reception sensitivity of the ultrasonic waves can be suppressed.

In the ultrasonic device of this application example, the acoustic member is an acoustic layer that covers the transducer array, and an acoustic lens that is located on the opposite side of the acoustic layer from the transducer array and that has the void portion. It is preferable to have
In this application example, the acoustic member has an acoustic layer and an acoustic lens in which a void portion is formed. Here, the acoustic lens is brought into contact with the measurement target when transmitting and receiving ultrasonic waves. For this reason, it is preferable that the acoustic lens have a hardness capable of suppressing deformation at the time of contact. In this application example, by forming the void portion in the acoustic lens, the deformation of the void portion can be suppressed, and the reception sensitivity can be more reliably improved.

  An ultrasonic probe according to one application example of the present invention covers a substrate having a transducer array including a plurality of ultrasonic transducers arranged in an array and the transducer array, and An acoustic member that propagates an ultrasonic wave, and a housing that houses the substrate and the acoustic member are provided, the substrate has an element outside region between the adjacent ultrasonic transducers, and the acoustic member is In a plan view seen from a first direction from the transducer array toward the acoustic member, the device has a void forming surface that forms a void portion that overlaps at least a part of the element outer region, and the void forming surface is It is characterized by including an inclined portion which is inclined toward the ultrasonic transducer adjacent to the void portion.

In the ultrasonic probe according to the application example of the present invention, the acoustic member is arranged so as to cover the transducer array. In addition, the acoustic member has a void forming surface that forms a void portion that overlaps with the element outside region in a plan view seen from the first direction. The void forming surface has an inclined portion that is inclined toward the ultrasonic transducer adjacent to the void.
In the ultrasonic probe of the present application example configured in this manner, as in the above-described application example, at least a part of the ultrasonic waves incident on the area outside the element can be guided to the ultrasonic transducer by the inclined portion. it can. Therefore, at least a part of the ultrasonic waves propagating toward the region outside the element can be received by the ultrasonic transducer, and the receiving sensitivity of the ultrasonic device can be improved.

  An ultrasonic device according to an application example of the present invention covers a substrate having a transducer array including a plurality of ultrasonic transducers arranged in an array, the transducer array, and ultrasonic waves to the ultrasonic transducer. An acoustic member that propagates the ultrasonic transducer, and a control unit that controls the ultrasonic transducer, the substrate has an element outer region between the adjacent ultrasonic transducers, and the acoustic member is the transformer. In a plan view seen from the first direction toward the acoustic member from theducer array, it has a void forming surface that forms a void portion that overlaps at least a part of the element outer region, and the void forming surface is in the void portion. An ultrasonic device comprising an inclined portion inclined to the adjacent ultrasonic transducers.

In the ultrasonic device according to one application example of the present invention, the acoustic member is arranged so as to cover the transducer array. In addition, the acoustic member has a void forming surface that forms a void portion that overlaps with the element outside region in a plan view seen from the first direction. The void forming surface has an inclined portion that is inclined toward the ultrasonic transducer adjacent to the void.
In the ultrasonic device of the present application example configured in this manner, at least a part of the ultrasonic waves incident on the region outside the element can be guided to the ultrasonic transducer by the inclined portion, as in the above-described application example. Therefore, at least a part of the ultrasonic waves propagating toward the region outside the element can be received by the ultrasonic transducer, and the receiving sensitivity of the ultrasonic device can be improved.

The figure which shows schematic structure of the ultrasonic apparatus of 1st Embodiment. Sectional drawing which shows schematic structure of the ultrasonic probe of 1st Embodiment. The top view which looked at the element substrate of the ultrasonic device of a 1st embodiment from the sealing board side. Sectional drawing which shows typically the cross section of the ultrasonic device in the AA line of FIG. Sectional drawing which shows typically the cross section of the acoustic layer in the BB line of FIG. Sectional drawing which shows schematic structure of the ultrasonic device of 2nd Embodiment. Sectional drawing which shows schematic structure of the ultrasonic device of 3rd Embodiment. Sectional drawing which shows schematic structure of the ultrasonic device of 4th Embodiment. Sectional drawing which shows schematic structure of the ultrasonic device which concerns on a modification. Sectional drawing which shows schematic structure of the ultrasonic device which concerns on a modification. Sectional drawing which shows schematic structure of the ultrasonic device which concerns on a modification. The figure which shows the ultrasonic device which concerns on a modification typically.

[First Embodiment]
Hereinafter, the ultrasonic measurement device according to the first embodiment will be described with reference to the drawings.
FIG. 1 is a perspective view showing a schematic configuration of an ultrasonic measurement device 1.
The ultrasonic measurement device 1 corresponds to an ultrasonic device and includes an ultrasonic probe 2 and a control device 10 connected to the ultrasonic probe 2 via a cable 3 as shown in FIG. 1.
The ultrasonic measurement device 1 brings the ultrasonic probe 2 into contact with the surface of a living body (for example, a human body) to be measured, and transmits ultrasonic waves from the ultrasonic probe 2 into the living body. Further, the ultrasonic measurement device 1 receives the ultrasonic waves reflected by the organs in the living body by the ultrasonic probe 2, and acquires, for example, an internal tomographic image in the living body, or in the living body based on the received signal. The state of organs (eg blood flow) is measured.

[Configuration of control device]
The control device 10 corresponds to a control unit, and includes an operation unit 11 including buttons, a touch panel, and the like, and a display unit 12, as illustrated in FIG. 1. Further, although not shown, the control device 10 includes a storage unit configured by a memory and the like, and a calculation unit configured by a CPU (Central Processing Unit) and the like. The control device 10 controls the ultrasonic measurement device 1 by causing the calculation unit to execute various programs stored in the storage unit. For example, the control device 10 outputs a command for controlling the driving of the ultrasonic probe 2, or forms an image of the internal structure of the living body based on the received signal input from the ultrasonic probe 2 to display the display unit. 12 or the biological information such as blood flow is measured and displayed on the display unit 12. As such a control device 10, for example, a terminal device such as a tablet terminal, a smartphone or a personal computer can be used, and a dedicated terminal device for operating the ultrasonic probe 2 may be used.

[Structure of ultrasonic probe]
FIG. 2 is a cross-sectional view showing a schematic configuration of the ultrasonic probe 2.
The ultrasonic probe 2 corresponds to an ultrasonic probe, and as shown in FIG. 2, a housing 21, an ultrasonic device 22 housed inside the housing 21, and an ultrasonic device 22 for controlling the ultrasonic device 22. And a circuit board 23 provided with a driver circuit and the like. The ultrasonic device 22 and the circuit board 23 constitute an ultrasonic sensor 24 corresponding to an ultrasonic module.

[Case configuration]
As shown in FIG. 1, the housing 21 is formed, for example, in a box shape having a rectangular shape in plan view, and a sensor window 21B is provided on one surface (sensor surface 21A) orthogonal to the thickness direction. Part of 22 is exposed. Further, a passage hole 21C for the cable 3 is provided in a part of the housing 21 (a side surface in the example shown in FIG. 1), and the cable 3 is connected to the circuit board 23 inside the housing 21 through the passage hole 21C. ing. The gap between the cable 3 and the passage hole 21C is filled with, for example, a resin material to ensure waterproofness.
In the present embodiment, the configuration in which the ultrasonic probe 2 and the control device 10 are connected by using the cable 3 is illustrated, but the configuration is not limited to this, and the ultrasonic probe 2 and the control device 10 are wireless, for example. They may be connected by communication, or various configurations of the control device 10 may be provided in the ultrasonic probe 2.

[Circuit board configuration]
The circuit board 23 is electrically connected to the signal terminal 414P and the common terminal 416P (see FIG. 3) of the ultrasonic device 22, and controls the ultrasonic device 22 based on the control of the control device 10.
Specifically, the circuit board 23 includes a transmission circuit, a reception circuit, and the like. The transmission circuit outputs a drive signal that causes the ultrasonic device 22 to transmit ultrasonic waves. The reception circuit acquires the reception signal output from the ultrasonic device 22 that has received the ultrasonic wave, performs amplification processing, AD conversion processing, phasing addition processing, etc. of the reception signal and outputs the reception signal to the control device 10. To do.

[Structure of ultrasonic device]
FIG. 3 is a plan view of the element substrate 41 of the ultrasonic device 22 as viewed from the sealing plate 42 side. FIG. 4 is a cross-sectional view of the ultrasonic device 22 taken along the line AA in FIG.
As illustrated in FIG. 4, the ultrasonic device 22 includes an element substrate 41, a sealing plate 42, and an acoustic member 5 including an acoustic layer 43 and an acoustic lens 44.

(Structure of element substrate)
The element substrate 41 corresponds to a substrate, and as shown in FIG. 4, a substrate body 411, a vibrating film 412 provided on the sealing plate 42 side of the substrate body 411, and a piezoelectric element provided on the vibrating film 412. 413 and. Here, in the following description, the surface of the substrate body 411 on the acoustic lens 44 side is referred to as the front surface 411A, and the surface facing the sealing plate 42 is referred to as the back surface 411B. Further, a surface (corresponding to one surface) of the vibrating film 412 opposite to the sealing plate 42 is referred to as an opening surface 412A, and a surface on the sealing plate 42 side is referred to as an operating surface 412B.

  As shown in FIG. 3, the element substrate 41 is provided with an ultrasonic transducer array (transducer array) 46 as a one-dimensional array including a plurality of ultrasonic transducers 45 arranged in an array. That is, in a plan view of the element substrate 41 viewed from the substrate thickness direction (Z direction) (hereinafter, also simply referred to as a plan view), a plurality of ultrasonic transducers 45 are arranged in a matrix in the array region Ar1 at the center of the element substrate 41. And an ultrasonic transducer array 46 is configured. The ultrasonic transducer array 46 is composed of a plurality of ultrasonic transducers 45 arranged along the X direction (slice direction), and has a plurality of transmission / reception columns 45A that function as transmission / reception channels of 1CH. The plurality of transmission / reception columns 45A are arranged in the Y direction (scan direction). In FIG. 3, the number of ultrasonic transducers 45 arranged is reduced for convenience of explanation, but in reality, more ultrasonic transducers 45 are arranged.

  As shown in FIG. 4, the substrate body 411 is a substrate that supports the vibrating film 412, and is made of a semiconductor substrate such as Si. The substrate body 411 is provided with openings 411C corresponding to the respective ultrasonic transducers 45.

The vibrating film 412 is made of, for example, SiO ₂ , a laminated body of SiO ₂ and ZrO ₂ , or the like, and is provided on the back surface 411B of the substrate body 411. That is, the vibrating film 412 has a flexible portion 412C that is supported by the wall portion 411D that forms the opening 411C and closes the rear surface 411B side of the opening 411C. That is, the opening 411C defines the outer edge of the flexible portion 412C, which is the vibrating region of the vibrating film 412. The thickness of the vibrating film 412 is sufficiently smaller than that of the substrate body 411.

In addition, a piezoelectric element 413, which is a laminated body of a lower electrode 414, a piezoelectric film 415, and an upper electrode 416, is provided on the operation surface 412B of the flexible portion 412C that closes each opening 411C. The flexible portion 412C and the piezoelectric element 413 form one ultrasonic transducer 45.
A region in the array region Ar1 where the ultrasonic transducer 45 is provided, that is, a region overlapping with the opening 411C (flexible portion 412C) in a plan view is also referred to as an element region Ar11. A region in the array region Ar1 other than the element region Ar11, that is, a region overlapping the wall portion 411D in plan view is also referred to as an element outside region Ar12.

  In such an ultrasonic transducer 45, a pulse wave voltage having a predetermined frequency is applied between the lower electrode 414 and the upper electrode 416 to vibrate the flexible portion 412C in the opening region of the opening 411C, Ultrasonic waves are transmitted from the opening surface 412A side. Further, when the flexible portion 412C is vibrated by the ultrasonic waves reflected from the object and incident on the opening surface 412A, a potential difference is generated above and below the piezoelectric film 415. Therefore, the ultrasonic wave is detected, that is, received by detecting the potential difference generated between the lower electrode 414 and the upper electrode 416.

  Here, the lower electrode 414 is linearly formed along the X direction, and constitutes the 1CH transmission / reception column 45A. Signal terminals 414P electrically connected to the circuit board 23 in the terminal region Ar2 are provided at both ends (± X side ends) of the lower electrode 414.

  The upper electrode 416 is linearly formed along the Y direction and connects the transmission / reception columns 45A arranged in the Y direction. Then, the ± Y side ends of the upper electrode 416 are connected to the common electrode line 416A. The common electrode line 416A connects the plurality of upper electrodes 416 arranged along the X direction. At both ends (± X side ends) of the common electrode line 416A, common terminals 416P electrically connected to the circuit board 23 are provided. The common terminal 416P is connected to a reference potential circuit (not shown) of the circuit board 23 and set to the reference potential.

(Structure of sealing plate)
The sealing plate 42 is formed, for example, in the same shape as the element substrate 41 when viewed in the thickness direction, and is made of a semiconductor substrate such as Si or an insulating substrate. Since the material and thickness of the sealing plate 42 affect the frequency characteristics of the ultrasonic transducer 45, it is preferably set based on the center frequency of ultrasonic waves transmitted and received by the ultrasonic transducer 45.

  The sealing plate 42 has a groove 421 formed in a region of the array region Ar1 of the element substrate 41 facing the element region Ar11. That is, the sealing plate 42 has a plurality of concave grooves 421 corresponding to the openings 411C. As a result, in the element region Ar11 corresponding to the flexible portion 412C vibrated by the ultrasonic transducer 45, the gap 421A having a predetermined size is provided between the element substrate 41 and the sealing plate 42, and the vibrating film is formed. The vibration of 412 is not disturbed. Further, it is possible to suppress the inconvenience (crosstalk) that the back wave from one ultrasonic transducer 45 is incident on another adjacent ultrasonic transducer 45.

  When the vibrating film 412 vibrates, ultrasonic waves are emitted as back waves not only to the opening 411C side (opening surface 412A side) but also to the sealing plate 42 side (back surface 411B side). This back wave is reflected by the sealing plate 42 and is again emitted to the vibrating film 412 side through the gap 421A. At this time, if the phase of the reflected back wave and the ultrasonic wave emitted from the vibrating film 412 to the opening surface 412A side shifts, the ultrasonic wave is attenuated. Therefore, in the present embodiment, the groove depth of each concave groove 421 is set so that the acoustic distance in the gap 421A is an odd multiple of λ / 4 where the wavelength of the ultrasonic wave is λ. In other words, the thickness dimension of each part of the element substrate 41 and the sealing plate 42 is set in consideration of the wavelength λ of the ultrasonic wave emitted from the ultrasonic transducer 45.

  Further, the sealing plate 42 is provided with a connecting portion that connects the terminals 414P and 416P to the circuit board 23 at a position facing the terminal region Ar2 of the element substrate 41. As the connection portion, for example, an opening provided in the element substrate 41 and a wiring member such as an FPC (Flexible printed circuits), a cable wire, or a wire that connects the terminals 414P and 416P to the circuit board 23 through the opening. A configuration including and is illustrated.

(Structure of acoustic member)
The acoustic member 5 includes an acoustic layer 43 arranged so as to cover the + Z side of the element substrate 41, and an acoustic lens 44 arranged on the + Z side of the acoustic layer 43.
The acoustic member 5 is preferably a viscoelastic body or an elastomer, for example, and silicone rubber or butadiene rubber is preferable. The acoustic impedance is preferably an acoustic impedance (for example, 1.5M Rayls) close to the acoustic impedance of the living body to be measured. As a result, the acoustic member 5 efficiently propagates the ultrasonic wave transmitted from the ultrasonic transducer 45 to the living body as a measurement target, and also efficiently propagates the ultrasonic wave reflected in the living body to the ultrasonic transducer 45. Let

(Structure of acoustic lens)
As shown in FIG. 1, the acoustic lens 44 is exposed to the outside through the sensor window 21B of the housing 21, and is brought into contact with the surface of the living body that is the measurement target. The acoustic lens 44 has a cylindrical cross section in the ZX plane and converges the ultrasonic waves transmitted from the ultrasonic device 22.

(Structure of acoustic layer)
FIG. 5: is a figure which shows typically the cross section of the acoustic layer 43 cut | disconnected by the BB line of FIG.
The acoustic layer 43 has a void forming surface 431 that forms a void portion 430 at a position overlapping at least a part of the element outside region Ar12 (see FIG. 3) in a plan view.
The void portion 430 is formed at a position overlapping the wall portion 411D of the acoustic layer 43 in a plan view. The void portion 430 is formed in a lattice shape along each of the X direction and the Y direction so as to surround each ultrasonic transducer 45 in a plan view. The void portion 430 guides at least a part of ultrasonic waves toward the wall portion 411D to the ultrasonic transducer 45 as described later. In other words, in the plan view, the void portion 430 is sandwiched between the two ultrasonic transducers 45 arranged adjacent to each other along the X direction and the two superposed portions arranged adjacent to each other along the Y direction. It is formed at a position sandwiched between the sound wave transducers 45.

  As shown in FIG. 4, in the region formed along the Y direction in the void 430, the cross-sectional shape in the ZX plane is a substantially triangular shape. Further, in the region formed along the Y direction in the void portion 430, the maximum dimension in the X direction (maximum width dimension), that is, the width dimension at the −Z side end portion is the same as that of the wall portion 411D. Although not shown, in the region along the X direction of the void 430 as well, the cross-sectional shape in the YZ plane is substantially triangular and the maximum width dimension is the same as that of the wall 411D.

As shown in FIG. 4, the void forming surface 431 forming the void 430 is inclined toward the ultrasonic transducer 45 disposed adjacent to the void 430, and has a planar first inclined portion 432 and It has a second inclined portion 433. The space forming surface 431 is located on the + Z side of the space 430. That is, the void forming surface 431 is the bottom surface of the groove portion formed along the X direction and the Y direction, and the groove portion is open on the −Z side.
Hereinafter, with reference to FIG. 4, the first inclined portion 432 and the second inclined portion 433 forming the void portion 430 extending in the Y direction will be mainly described.

The first inclined portion 432 is the -X side ultrasonic transducer 45 (one of the two ultrasonic transducers 45) of the two ultrasonic transducers 45 arranged so as to sandwich the void portion 430 in the X direction. Lean toward.
As shown in FIG. 4, in the ZX plane, the first imaginary line L1 overlapping the first inclined portion 432 is the flexible portion 412C of the -X side ultrasonic transducer 45, that is, the element region Ar11 (see FIG. 3). ) Cross.

The second inclined portion 433 is provided on the + X side ultrasonic transducer 45 (the other of the two ultrasonic transducers 45) of the two ultrasonic transducers 45 arranged so as to sandwich the void 430 in the X direction. Incline toward.
As shown in FIG. 4, in the ZX plane, the second virtual line L2 that overlaps the second inclined portion 433 is the flexible portion 412C of the + X side ultrasonic transducer 45, that is, the element region Ar11 (see FIG. 3). Cross.

  The first inclined portion 432 and the second inclined portion 433 are connected to each other on the + Z side. In addition, the distance between the first sloped portion 432 and the second sloped portion 433 in the X direction increases toward the −Z side. The first inclined portion 432 and the second inclined portion 433 as described above form the void portion 430 having a substantially triangular cross section as described above.

  The void portion 430 configured in this manner is filled with gas, and may be filled with air, a rare gas (helium gas, neon gas, argon gas, krypton gas, xenon gas), nitrogen gas, or the like. The acoustic impedance of the void 430 is 0.00043MRayls when filled with air, and is much smaller than the acoustic impedance of a region other than the void 430 in the acoustic layer 43 (for example, 1.5MRayls). That is, in the first sloped portion 432 and the second sloped portion 433 which are the interfaces of the void 430, the acoustic impedance difference between the inside and outside of the void 430 is large. Therefore, the ultrasonic waves propagating from the measurement target toward the wall portion 411D (outer element region Ar12) along the Z direction are guided toward the ultrasonic transducer 45 by the void portion 430. The acoustic impedance of the void 430 is preferably 1/1000 or less of the acoustic impedance of the acoustic member 5.

  More specifically, the first inclined portion 432 is a direction in which at least a part of the incident ultrasonic waves is directed toward the ultrasonic transducer 45 located on the −X side of the void 430 along the first virtual line L1. Propagate to. Moreover, the 2nd inclination part 433 propagates at least one part of the incident ultrasonic wave toward the ultrasonic transducer 45 located in the + X side of the void part 430 along the 2nd virtual line L2. Thereby, at least a part of the ultrasonic waves propagating toward the wall portion 411D is received by the ultrasonic transducer 45.

  Although the first sloped portion 432 and the second sloped portion 433 forming the void portion 430 arranged along the Y direction have been described, the same applies to the void portion 430 arranged along the X direction. That is, the void portion 430 arranged along the X direction is formed at a position sandwiched by two ultrasonic transducers adjacent in the Y direction. The void forming surface 431 forming the void 430 includes a first inclined portion 432 that is inclined toward the -Y side ultrasonic transducer 45 among the two ultrasonic transducers and a + Y side ultrasonic transformer. A second inclined portion 433 that inclines toward theducer 45.

[Operation and effect of the first embodiment]
In the first embodiment configured as described above, the following operational effects can be obtained.
The acoustic member 5 is arranged so as to cover the ultrasonic transducer array 46, and has a void portion 430 that overlaps with the element outside region Ar12 in the Z direction (first direction). The space forming surface 431 forming the space 430 has a first slope 432 and a second slope 433 as slopes that slope toward the ultrasonic transducer 45 adjacent to the space 430. As described above, the first sloped portion 432 and the second sloped portion 433 can propagate at least a part of the ultrasonic wave incident on the element outside region Ar12 toward the ultrasonic transducer 45. Therefore, at least a part of the ultrasonic waves propagating toward the out-of-element region Ar12 can be received by the ultrasonic transducer 45, and the receiving sensitivity of the ultrasonic device 22 can be improved.

  The first inclined portion 432 and the second inclined portion 433 are planar and are connected to each other on the + Z side to form the void portion 430 having a substantially triangular cross section. Of these, the first inclined portion 432 is inclined toward one of the two ultrasonic transducers 45 arranged so as to sandwich the space 430, and the second inclined portion 433 is formed between the two ultrasonic transducers 45. Incline towards the other. With such a configuration, a part of the ultrasonic wave traveling toward the element outside region Ar12 can be guided to the one ultrasonic transducer 45 by the first inclined portion 432. In addition, the other part of the ultrasonic waves traveling toward the element outside region Ar12 can be guided to the other ultrasonic transducer 45 by the second inclined portion 433. That is, the ultrasonic waves propagating toward the outside-element region Ar12 along the Z direction can be guided more reliably to the ultrasonic transducer 45, and the transmission / reception sensitivity can be more reliably improved.

  In the present embodiment, as shown in FIG. 4, in the first inclined portion 432 formed along the Y direction, the first virtual line L1 that overlaps the first inclined portion 432 in the ZX plane is one of the above It intersects with the acoustic wave transducer 45 (the ultrasonic transducer 45 located on the −X side). The first inclined portion 432 can propagate at least a part of the incident ultrasonic waves toward the one ultrasonic transducer 45 in the direction along the first virtual line L1. Similarly, in the second inclined portion 433, at least a part of the incident ultrasonic wave is directed toward the other ultrasonic transducer 45 (the ultrasonic transducer 45 located on the + X side) along the second virtual line L2. Can be propagated in any direction. The same applies to the first inclined portion 432 and the second inclined portion 433 formed along the X direction. With such a configuration, a part of the ultrasonic waves propagating toward the element outside region Ar12 can be more reliably guided to the ultrasonic transducer 45 by the first inclined portion 432 and the second inclined portion 433.

The dimension (width dimension) of the void 430 in the width direction (the second direction, which is the X direction in FIG. 4) is the same as the width dimension of the element outer region Ar12, that is, the wall portion 411D.
Here, when the width dimension of the void portion 430 is larger than the element outside region Ar12, a part of the ultrasonic waves transmitted from the ultrasonic transducer 45 may be blocked by the void portion 430, and the output may be reduced. . Further, when the width dimension of the void portion 430 is smaller than the element outside region Ar12, a part of the ultrasonic wave propagating toward the element outside region Ar12 directly enters the element outside region Ar12, and the reception sensitivity as described above. May decrease. On the other hand, in the present embodiment, since the width dimension of the void portion 430 is the same as that of the element outer region Ar12, it is possible to suppress the above-described output reduction and reception sensitivity reduction.

The substrate body 411 has an opening 411C and a wall 411D, and the opening 411C is closed by the vibrating film 412 arranged on the −Z side. An ultrasonic transducer 45 is configured by the flexible portion 412C of the vibrating film 412 that closes the opening 411C and the piezoelectric element 413 provided in the flexible portion 412C. That is, the ultrasonic wave that propagates along the Z direction and enters the flexible portion 412C in the opening 411C is detected by the ultrasonic transducer 45.
In such a configuration, since the wall portion 411D is arranged on the + Z side of the flexible portion 412C, ultrasonic waves are likely to enter the wall portion 411D. On the other hand, as described above, the void portion 430 is provided so as to overlap the wall portion 411D. Therefore, the ultrasonic waves toward the wall portion 411D can be guided toward the ultrasonic transducer 45, and the decrease in the reception sensitivity of the ultrasonic waves can be suppressed.

[Second Embodiment]
The second embodiment will be described below.
In the first embodiment, the void portion 430 is formed so as to be surrounded by the first inclined portion 432 and the second inclined portion 433 and the + Z side surface of the wall portion 411D. On the other hand, the second embodiment differs from the first embodiment in that the void portion 430 is formed inside the acoustic layer 43 and is separated from the wall portion 411D in the Z direction.
In the following description, the same components as those in the first embodiment will be designated by the same reference numerals and the description thereof will be omitted or simplified.

FIG. 6 is a cross-sectional view schematically showing the ultrasonic device 22A of the second embodiment.
As shown in FIG. 6, the ultrasonic device 22A has an acoustic member 5A including an acoustic layer 43A and an acoustic lens 44.
In the acoustic layer 43A, a void portion 430A is provided at a position overlapping with the outer region Ar12 (see FIG. 3), that is, at least a portion of the wall portion 411D in plan view, separated from the wall portion 411D in the Z direction. That is, a part of the acoustic layer 43A is provided on the + Z side of the wall portion 411D.

  The acoustic layer 43A has a void forming surface 431A that forms a void 430A. The void forming surface 431A has a first inclined portion 432, a second inclined portion 433, and a bottom surface portion 434. Of these, the bottom surface portion 434 is formed in a plane shape parallel to the XY plane and is continuous with the −Z side end portions of the first inclined portion 432 and the second inclined portion 433, respectively.

[Operation and effect of the second embodiment]
The void portion 430A is provided separately from the element substrate 41. That is, a part of the acoustic layer 43A is arranged between the void portion 430A and the element substrate 41. With such a configuration, the acoustic layer 43A can be supported by the wall portion 411D of the element outside region Ar12. Therefore, compared with the case where the acoustic layer 43A is mainly supported by the element region Ar11, the stress acting on the element region Ar11 can be relaxed by the support of the acoustic layer 43A, and the stress changes the characteristics of the ultrasonic transducer 45. It is possible to suppress the occurrence of the problem.

[Third Embodiment]
The third embodiment will be described below.
In the first embodiment, the void 430 is formed in the acoustic layer 43. On the other hand, the third embodiment differs from the first embodiment in that the void is formed in the acoustic lens.
In the following description, the same components as those in the first embodiment will be designated by the same reference numerals and the description thereof will be omitted or simplified.

FIG. 7: is sectional drawing which shows the ultrasonic device 22B of 3rd Embodiment typically.
As shown in FIG. 7, the ultrasonic device 22B has an acoustic member 5B including an acoustic layer 43B and an acoustic lens 44B.
The acoustic layer 43B covers the + Z side surface of the element substrate 41 in the array region Ar1 (see FIG. 3). That is, the acoustic layer 43B is arranged on the opening surface 412A of the flexible portion 412C and the + Z side surface (front surface 411A) of the wall portion 411D.

  The acoustic lens 44B has a void forming surface 441 that forms a void 440 at a position overlapping the wall 411D of the acoustic layer 43B in a plan view. The void portion 440 and the void forming surface 441 are configured in substantially the same manner as the void portion 430 and the void forming surface 431 of the first embodiment except that they are formed on the acoustic lens 44B.

  That is, the void portions 440 are formed in a lattice shape along the X direction and the Y direction. As shown in FIG. 7, in the region formed along the Y direction in the void portion 440, the cross-sectional shape in the ZX plane is a substantially triangular shape, and the maximum width dimension in the X direction is the same as that of the wall portion 411D. . Similarly, in the region of the void 440 along the X direction, the cross-sectional shape in the YZ plane is substantially triangular and the maximum width dimension is the same as that of the wall 411D.

  As shown in FIG. 7, the void forming surface 441 has a planar first inclined portion 442 and a second inclined portion 443 which are inclined toward the ultrasonic transducer 45 arranged adjacent to the void portion 440. . The first sloped portion 442 and the second sloped portion 443 are continuous with each other on the + Z side, like the first sloped portion 432 and the second sloped portion 433 of the first embodiment. Further, the first inclined portion 442 and the second inclined portion 443 are arranged in one of the two ultrasonic transducers 45 arranged so as to sandwich the void portion 440 (one of the X direction and the Y direction, and FIG. Then, the distance in the X direction) increases toward the −Z side.

  As shown in FIG. 7, the first imaginary line L1 overlaps the first inclined portion 442 in the ZX plane and intersects with the flexible portion 412C of the -X side ultrasonic transducer 45. The second virtual line L2 overlaps with the second inclined portion 443 in the ZX plane and intersects with the flexible portion 412C of the ultrasonic transducer 45 on the + X side.

[Operation and effect of the third embodiment]
In the third embodiment, the following effects can be obtained in addition to the same effects as the first embodiment.
The acoustic member 5B has an acoustic lens 44B in which the void portion 440 is formed, and the acoustic lens 44B is arranged on the + Z side of the acoustic layer 43B. Here, the acoustic lens 44B is brought into contact with the measurement target when transmitting and receiving ultrasonic waves. For this reason, it is preferable that the acoustic lens 44B has a hardness that can suppress deformation at the time of contact. By forming the void portion 440 in such an acoustic lens 44B, the deformation of the void portion 440 can be suppressed, and the reception sensitivity can be more reliably improved.

  Further, it is preferable that the acoustic layer 43B have a hardness that does not hinder the driving of the ultrasonic transducer 45. In this embodiment, since no void is formed in the acoustic layer 43B, the hardness of the acoustic layer 43B can be reduced. As a result, it is possible to further suppress the drive of the ultrasonic transducer 45 from being hindered by the acoustic layer 43B, and it is possible to improve the transmission / reception sensitivity.

[Fourth Embodiment]
The fourth embodiment will be described below.
In the first embodiment, the acoustic member 5 is arranged so as to cover the opening surface 412A side of the vibrating film 412, that is, the substrate body 411. On the other hand, in the fourth embodiment, the acoustic member 5 is different from the first embodiment in that the acoustic member 5 is provided on the side opposite to the substrate body 411 so as to cover the operating surface 412B of the vibrating film 412. To do.
In the following description, the same components as those in the first embodiment will be designated by the same reference numerals and the description thereof will be omitted or simplified.

FIG. 8: is sectional drawing which shows typically the ultrasonic device 22C of 4th Embodiment.
As shown in FIG. 8, the ultrasonic device 22C includes an element substrate 41C, a sealing plate 42C arranged on the −Z side of the element substrate 41C, and an acoustic member 5 arranged on the + Z side of the element substrate 41C. Equipped with. The ultrasonic device 22C is configured to be capable of transmitting ultrasonic waves to the + Z side.

The element substrate 41C has a plane symmetry (mirror image symmetry) relationship with the element substrate 41 of the first embodiment with respect to the XY plane. That is, the vibrating film 412 is provided on the + Z side of the substrate body 411. That is, the −Z side surface of the vibrating film 412 is the opening surface 412A, and the + Z side surface is the operating surface 412B. The piezoelectric element 413 is provided on the operating surface 412B.
The sealing plate 42C is formed in a flat plate shape, and is provided on the −Z side of the element substrate 41C so as to face the substrate body 411.

The acoustic member 5 includes an acoustic layer 43 and an acoustic lens 44.
The acoustic layer 43 has substantially the same configuration as that of the first embodiment, except that the acoustic layer 43 is arranged on the actuation surface 412B side of the vibrating membrane 412. That is, the acoustic layer 43 is arranged on the element substrate 41C such that the void portion 430 overlaps the wall portion 411D in a plan view. The void portion 430 is formed so as to contact the element substrate 41C. That is, the void portion 430 is formed by the first inclined portion 432, the second inclined portion 433, and the operating surface 412B of the vibrating membrane 412.

[Operation and Effect of Fourth Embodiment]
In the fourth embodiment, the following effects can be obtained in addition to the same effects as the first embodiment.
The void portion 430 is formed so as to be in contact with the element substrate 41C and surrounds the ultrasonic transducer 45 (element region Ar11) in a plan view. That is, the void 430 is formed between the adjacent ultrasonic transducers 45 in a plan view. As a result, it is possible to suppress the occurrence of so-called crosstalk in which the ultrasonic waves transmitted from the ultrasonic transducers 45 propagate to the adjacent ultrasonic transducers 45.

[Modification]
Note that the present invention is not limited to the above-described embodiments, and modifications and improvements within a range in which the object of the present invention can be achieved, and configurations obtained by appropriately combining the embodiments are included in the present invention. It is a thing.

(Modification 1)
FIG. 9: is sectional drawing which shows the ultrasonic device 22D of one modification typically.
As shown in FIG. 9, the ultrasonic device 22D is different from the ultrasonic device 22 of the first embodiment in that a slit 6 is provided in the wall portion 411D, that is, the element outside region Ar12.
As shown in FIG. 9, the slit 6 is provided in the wall portion 411D located between the plurality of ultrasonic transducers 45 arranged in the X direction, that is, in the element outside region Ar12 (see FIG. 3). The slit 6 penetrates the wall portion 411D in the Z direction and is provided along the Y direction. Although not shown, the slit 6 is also provided in the wall portion 411D located between the plurality of ultrasonic transducers 45 arranged in the Y direction. That is, the slits 6 are provided in a lattice shape so as to surround each ultrasonic transducer 45 along the X direction and the Y direction.

In such a configuration, the slits 6 are formed between the adjacent ultrasonic transducers 45. As a result, it is possible to prevent the ultrasonic waves transmitted from the ultrasonic transducers 45 from causing crosstalk between the adjacent ultrasonic transducers 45.
Note that the same modification can be applied to the ultrasonic device 22A of the second embodiment.

(Modification 2)
FIG. 10: is sectional drawing which shows the ultrasonic device 22E of one modification typically.
As shown in FIG. 10, the ultrasonic device 22E differs from the fourth embodiment in that the width dimension of the void portion 430 is larger than the width dimension of the wall portion 411D (outer element region Ar12).
In such a configuration, the acoustic layer 43 is provided on a part of the flexible portion 412C. Here, the larger the area of the flexible portion 412C covered by the acoustic layer 43, the larger the value of the added mass to the flexible portion 412C. Here, when designing the ultrasonic transducer 45 having a predetermined resonance frequency, the larger the above-mentioned additional mass, the smaller the size of the ultrasonic transducer 45 (the area of the flexible portion 412C) needs to be reduced. The receiving sensitivity is reduced. On the other hand, as shown in FIG. 10, the width dimension of the void portion 430 is made larger than that of the wall portion 411D (that is, the area of the flexible portion 412C covered by the acoustic layer 43 is reduced), and the added mass is increased. It is possible to increase the size of the ultrasonic transducer 45 with respect to the designed value of the resonance frequency, and thus to increase the reception sensitivity.

(Modification 3)
FIG. 11: is sectional drawing which shows the ultrasonic device 22F of a modification typically.
As shown in FIG. 11, the ultrasonic device 22F is different from the first embodiment in that an acoustic layer 43F is provided with a void portion 430F having a V-shaped cross section in the ZX cross section.
The space forming surface 431F forming the space 430F has a third slope 435 and a fourth slope 436 in addition to the first slope 432 and the second slope 433. The third inclined portion 435 has a planar shape and faces the first inclined portion 432 in the Z direction. The fourth sloped portion 436 is planar and faces the second sloped portion 433 in the Z direction.
In other words, the void portion 430F has a first slit portion sandwiched between the first sloped portion 432 and the third sloped portion 435 and a second slit portion sandwiched between the second sloped portion 433 and the fourth sloped portion 436. . The first slit portion and the second slit portion are continuous on the + Z side and are inclined so as to separate from each other toward the −Z side.

Although not shown, the void portion 430F is provided along the opening 411C, for example, and has the same dimension in the Y direction as the opening 411C.
Although the void portion 430F provided along the Y direction has been described, the void portion 430F is similarly formed along the X direction. That is, the void 430F is formed at a position surrounding each opening 411C in a plan view.

  With such a configuration, the volume of the void portion 430F can be made smaller than in the case where the first inclined portion 432 and the second inclined portion 433 form the void portion having a substantially triangular cross section. Therefore, it is possible to suppress the decrease in the strength of the acoustic layer 43F due to the formation of the void portion 430F, and it is possible to suppress the deformation of the acoustic layer 43F, and thus the deformation of the void portion 430F.

(Other modifications)
In each of the above-described embodiments, the first inclined portion 432 is inclined so that the first virtual line L1 intersects with the ultrasonic transducer 45 located on the −X side, and similarly, the second inclined portion 433 is the second inclined portion 433. The configuration in which the virtual line L2 is inclined so as to intersect the ultrasonic transducer 45 located on the + X side is illustrated. On the other hand, the first inclined portion 432 and the second inclined portion 433 may be formed so as to incline so as to satisfy the conditions shown in the following formulas (1) to (3).
Hereinafter, the following formulas (1) to (3) will be described with reference to FIG.

FIG. 12 is a sectional view schematically showing the ultrasonic device 22.
As shown in FIG. 12, among the ultrasonic waves that propagate along the Z direction and enter the first inclined portion 432, the ultrasonic waves that enter the −Z side end portion (point A) of the first inclined portion 432 are: It is assumed that the light enters the point B of the flexible portion 412C. In addition, it is assumed that the ultrasonic wave incident on the + Z side end portion (point C) of the first inclined portion 432 is incident on the point D of the flexible portion 412C.
The inclination angle of the first inclined portion 432 with respect to the XY plane (front surface 411A) is the first angle θ ₁ . Further, the angle formed by the ultrasonic wave propagating along the Z direction and the first inclined portion 432 is referred to as a second angle θ ₂ . The first angle θ ₁ and the second angle θ ₂ satisfy the relationship of the following expression (1). The incident angle of the ultrasonic wave on the first inclined portion 432 is the first angle θ ₁ .
Further, the dimension of the wall portion 411D in the Z direction, that is, the distance dimension between the vibrating membrane 412 and the void portion 430 is defined as the first dimension h ₁ . The dimension of the void 430 in the Z direction is the second dimension h ₂ . Further, the dimension of the flexible portion 412C in the X direction (second direction) is Mx.
Here, the void portion 430 is preferably formed so as to satisfy the relationship of the following formula (2), and more preferably formed so as to satisfy the relationship of the following formula (3).

[Equation 1]
θ ₁ = 90 ° −θ ₂ (1)
h ₁ tan2θ ₂ <Mx (2)
_{(H 1 + h 2) tan2θ} 2 -h 2 tanθ 2 <Mx ··· (3)

As shown in the above formula (2), by making the length of the line segment BE smaller than the dimension Mx of the flexible portion 412C, at least a part of the ultrasonic waves incident on the first inclined portion 432 is converted into ultrasonic waves. It can be made incident on the transducer 45. That is, the receiving sensitivity can be increased by setting the first angle θ ₁ so as to satisfy the above formulas (1) and (2).

If the point on the vibrating membrane 412 that overlaps with the point C in the Z direction is F, the length of the line segment EF is h ₂ tan θ ₂ and the length of the line segment DE is the left side of the above equation (3). It is represented by. As shown in the above formula (3), by making the length of the line segment DE smaller than the dimension Mx of the flexible portion 412C, the ultrasonic waves incident on the first inclined portion 432 can be more reliably transmitted by the ultrasonic transformer. It can be made incident on theducer 45. That is, the reception sensitivity can be more surely increased by satisfying the above formula (2) and the following formula (3).
Although the first inclined portion 432 formed along the Y direction has been described in detail, the first inclined portion 432 formed along the X direction and the second inclined portion 432 formed along the X direction and the Y direction. The same applies to the inclined portion 433.

  Further, in each of the above-described embodiments, the configuration in which the width dimension of the void portion is the same as the outside area of the element is illustrated. Further, in the second modification, the configuration in which the width of the void is larger than that of the area outside the element is illustrated. However, the width dimension of the void portion is not limited to this, and may be smaller than the area outside the element. By reducing the width of the void, the volume of the void can be reduced and the strength of the acoustic member can be improved.

  In the fourth embodiment, the void portion 430 is formed so as to be in contact with the element substrate 41C. That is, the void portion 430 was formed by the groove portion provided in the acoustic layer 43 so as to open to the −Z side. However, the configuration is not limited to this, and the void portion 430 may be separated from the element substrate 41C as in the second embodiment. That is, similarly to the second embodiment, a part of the acoustic layer may be disposed on the −Z side of the void 430, and the acoustic layer 43 and the element substrate 41C may be in direct contact with each other in the element outside region Ar12. With such a configuration, by supporting the acoustic layer 43A by the element outside area Ar12, the stress acting on the element area Ar11 can be relaxed, and the ultrasonic transducer 45 changes its characteristics due to the stress, as in the second embodiment. It is possible to suppress the occurrence of such problems.

In each of the above-described embodiments, the void forming surface has a planar first inclined portion and a second inclined portion as inclined portions, and an imaginary line that overlaps each inclined portion intersects with an element region of an adjacent ultrasonic transducer. However, it is not limited to this. For example, the imaginary line may cross the element region of the ultrasonic transducer and intersect the region outside the element.
Further, the first sloped portion and the second sloped portion may be curved. For example, the first sloped portion and the second sloped portion may have a convex surface shape that is convex toward the center of the void portion, or may be a concave surface shape that is recessed in a direction away from the center.
Even with such a configuration, at least a part of the ultrasonic waves can be guided to the ultrasonic transducers (element areas) arranged adjacent to each other by the inclined portion formed in the area outside the element.

In each of the above-described embodiments, the cavity has a configuration in which the cross-sectional shape (cross-sectional shape in the ZX plane in FIG. 4) is a substantially isosceles triangle, but the configuration is not limited to this.
For example, the void may have a trapezoidal shape or a semicircular cross section. In the case of a trapezoidal shape, the + Z side end portions of the first inclined portion and the second inclined portion are connected by a flat surface portion parallel to the XY plane. Therefore, there is a possibility that the ultrasonic wave that has entered the plane portion along the Z direction is reflected and not received by the ultrasonic transducer. On the other hand, it is preferable to make the cross-sectional shape of the voids triangular so that the ultrasonic waves can be guided to the ultrasonic transducer more reliably.
Further, in each of the above-described embodiments, the configuration having the first sloped portion and the second sloped portion as the sloped portion is illustrated, but the configuration having only one of the first sloped portion and the second sloped portion as the sloped portion is also possible. Good.

  In each of the above-described embodiments, the void portion is provided in a region overlapping with the wall portion 411D in plan view, that is, substantially the entire region surrounding the ultrasonic transducer 45, but is not limited to this. That is, the void may be provided in at least a part of the region overlapping with the wall 411D. For example, the void portion may be formed so as to overlap only the outside-element region Ar12 between the respective transmission / reception columns 45A (see FIG. 3) arranged along the Y direction. That is, only the void along the X direction may be formed. With such a configuration, as described above, a part of the ultrasonic waves incident on the element outside region Ar12 can be guided to the ultrasonic transducer 45, and the receiving sensitivity can be improved. Further, it is possible to suppress crosstalk of ultrasonic waves between the transmission / reception columns 45A.

  In each of the above-described embodiments, the configuration including the vibrating film 412 and the piezoelectric element 413 formed on the vibrating film 412 is illustrated as the ultrasonic transducer 45, but the configuration is not limited thereto. For example, as the ultrasonic transducer 45, a configuration including a flexible film, a first electrode provided on the flexible film, and a second electrode provided at a position facing the first electrode on the sealing plate is adopted. May be adopted. The first electrode and the second electrode form an electrostatic actuator as a vibrator. In such a configuration, ultrasonic waves can be detected by driving the electrostatic actuator to transmit ultrasonic waves and detecting electrostatic capacitance between the electrodes.

  In each of the above-described embodiments, the ultrasonic device that measures the organ in the living body as the measurement target is exemplified as the electronic device, but the invention is not limited to this. For example, the structures of the above-described embodiment and each modified example can be applied to a measuring machine that detects defects of the structure and inspects for deterioration of the structure by measuring various structures. Further, for example, a semiconductor package, a wafer, or the like is used as a measurement target, and the same applies to a measuring machine that detects a defect in the measurement target.

  In addition, a specific structure for carrying out the present invention may be configured by appropriately combining the above-described embodiments and modifications within a range in which the object of the present invention can be achieved, and is appropriately changed to another structure or the like. You may.

  DESCRIPTION OF SYMBOLS 1 ... Ultrasonic measuring device (ultrasonic device), 10 ... Control device, 21 ... Housing, 22, 22A, 22B, 22C, 22D, 22E, 22F ... Ultrasonic device, 41 ... Element substrate, 42 ... Sealing plate , 43, 43A, 43B ... Acoustic layer, 44, 44B ... Acoustic lens, 45 ... Ultrasonic transducer, 46 ... Ultrasonic transducer array, 411 ... Substrate main body section, 411A ... Front surface, 411B ... Back surface, 411C ... Opening section Reference numeral 411D ... Wall portion, 412 ... Vibration film, 412A ... Opening surface, 412B ... Operating surface, 413 ... Piezoelectric element, 414 ... Lower electrode, 415 ... Piezoelectric film, 416 ... Upper electrode, 421 ... Recessed groove, 421A ... Gap, 430, 430A, 430F ... void portion, 431, 431A, 431F ... void forming surface, 432 ... first inclined portion, 433 ... second inclined portion, 434 ... bottom portion, 44 ... void portion, 441 ... void formation surface, 442 ... first inclined portion, 443 ... second inclined portion, Ar12 ... outside the element region, L1 ... first virtual line, L2: second virtual line.

Claims (9)

A substrate having a transducer array including a plurality of ultrasonic transducers arranged in an array;
An acoustic member that covers the transducer array and propagates ultrasonic waves to the ultrasonic transducers;
The substrate has a region outside the element between the ultrasonic transducers adjacent to each other,
The acoustic member has a void forming surface that forms a void portion that overlaps at least a part of the element outside region in a plan view seen from a first direction from the transducer array toward the acoustic member,
The ultrasonic device, wherein the space forming surface includes an inclined part that is inclined toward the ultrasonic transducer adjacent to the space. The ultrasonic device according to claim 1,
The inclined portion is inclined toward one of the two ultrasonic transducers and the other one of the two ultrasonic transducers arranged adjacent to each other at a position sandwiching the void along a second direction intersecting the first direction. A first inclined portion and a second inclined portion inclined toward the other,
The ultrasonic device, wherein the first sloped portion and the second sloped portion are connected to each other on the side opposite to the substrate in the first direction. The ultrasonic device according to claim 1 or 2,
The inclined portion is inclined toward one of the two ultrasonic transducers and the other one of the two ultrasonic transducers arranged adjacent to each other at a position sandwiching the void along a second direction intersecting the first direction. A first inclined portion and a second inclined portion inclined toward the other,
The first inclined portion and the second inclined portion are flat surfaces,
In a plane parallel to the first direction and the second direction, a first virtual line that overlaps the first inclined portion intersects the one side of the ultrasonic transducer, and a second virtual line that overlaps the second inclined portion. An ultrasonic device, wherein a virtual line intersects the other of the ultrasonic transducers. The ultrasonic device according to any one of claims 1 to 3,
The void portion is formed at a position sandwiched by the two ultrasonic transducers arranged adjacent to each other along a second direction intersecting the first direction in a plan view seen from the first direction, The dimension in the second direction is the same as the dimension of the element outside region. The ultrasonic device according to any one of claims 1 to 4,
The ultrasonic device is characterized in that the void portion is separated from the substrate. The ultrasonic device according to any one of claims 1 to 5,
The substrate includes a vibrating film, and a substrate body portion provided on one surface of the vibrating film,
The substrate body has a wall portion that supports the vibrating film, and an opening that is closed by the vibrating film and in which the ultrasonic transducer is provided,
The acoustic member is provided on one surface side of the vibrating film,
The ultrasonic device, wherein the void portion overlaps with the wall portion in a plan view seen from the first direction. The ultrasonic device according to any one of claims 1 to 6,
The acoustic member has an acoustic layer that covers the transducer array, and an acoustic lens that is located on the opposite side of the acoustic layer from the transducer array and has the void portion formed therein. Sound wave device. A substrate having a transducer array including a plurality of ultrasonic transducers arranged in an array;
An acoustic member that covers the transducer array and propagates ultrasonic waves to the ultrasonic transducers,
A housing that houses the substrate and the acoustic member,
The substrate has a region outside the element between the ultrasonic transducers adjacent to each other,
The acoustic member has a void forming surface that forms a void portion that overlaps at least a part of the element outside region in a plan view seen from a first direction from the transducer array toward the acoustic member,
The ultrasonic probe, wherein the space forming surface includes an inclined part that is inclined toward the ultrasonic transducer adjacent to the space. A substrate having a transducer array including a plurality of ultrasonic transducers arranged in an array;
An acoustic member that covers the transducer array and propagates ultrasonic waves to the ultrasonic transducers,
A control unit for controlling the ultrasonic transducer,
The substrate has a region outside the element between the ultrasonic transducers adjacent to each other,
The acoustic member has a void forming surface that forms a void portion that overlaps at least a part of the element outside region in a plan view seen from a first direction from the transducer array toward the acoustic member,
The ultrasonic device, wherein the space forming surface includes an inclined part that is inclined toward the ultrasonic transducer adjacent to the space.

Images