JP2018133621A - Ultrasonic device, ultrasonic probe, and ultrasonic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high performance ultrasonic device, an ultrasonic probe, and an ultrasonic apparatus.SOLUTION: An ultrasonic device includes a substrate 42 having a first surface and having a plurality of groove portions 426A extending in a first direction along the surface direction of the first surface in the first surface and a partition wall 426C separating the adjacent groove portions, a vibration film provided on the first surface and closing the groove portion, a wall portion provided on a side opposite to the substrate of the vibration film and extending in a second direction crossing the first direction, and a piezoelectric element provided in the vibration film and provided at a position surrounded by the partition wall and the wall portion in a plan view seen from the thickness direction of the substrate, and the partition wall is provided with a communicating groove 426B that performs communication between the adjacent groove portions.SELECTED DRAWING: Figure 8

Description

  The present invention relates to an ultrasonic device, an ultrasonic probe, and an ultrasonic apparatus.

Conventionally, an ultrasonic sensor including an ultrasonic device that transmits and receives ultrasonic waves is known (see Patent Document 1).
An ultrasonic sensor described in Patent Document 1 includes a substrate in which an opening is formed, a diaphragm provided on the substrate so as to close the opening, and a piezoelectric element stacked on the opposite side of the opening of the diaphragm. And. In this ultrasonic sensor, a plurality of piezoelectric elements are arranged to face one opening, and vibrations of the diaphragm are suppressed between adjacent piezoelectric elements and on a surface opposite to the substrate of the diaphragm. A columnar part is provided. In such an ultrasonic sensor, a region surrounded by the edge of the opening and the edge of the columnar portion of the vibration plate becomes a vibration portion that is vibrated by the piezoelectric element, and a plurality of vibration portions are provided in the opening. It becomes.

JP 2015-188208 A

  Incidentally, in the ultrasonic device described in Patent Document 1, the columnar portion may resonate due to vibration of the vibration film. The vibration of the columnar part includes vibrations of a plurality of different vibration modes, and the vibration mode may include an unnecessary mode that inhibits the vibration of the vibration part. For example, when a vibration mode having a frequency in the same band as the frequency of the vibration part is included, there is a possibility that unnecessary vibration is excited in the vibration part or the vibration of the vibration part is attenuated due to the vibration of the columnar part. There is a problem that the performance of the ultrasonic device is degraded.

  An object of the present invention is to provide a high-performance ultrasonic device, an ultrasonic probe, and an ultrasonic apparatus, and hereinafter, application examples and embodiments capable of achieving the object will be described.

  An ultrasonic device of an application example according to the present invention has a first surface, and the first surface is adjacent to a plurality of groove portions extending in a first direction along a surface direction of the first surface. A substrate having a partition wall separating the groove, a vibration film provided on the first surface and closing the groove, and provided on the opposite side of the vibration film from the substrate, and intersecting the first direction. A wall portion extending in two directions, and a piezoelectric element provided on the vibration film and provided at a position surrounded by the partition wall and the wall portion in a plan view as viewed from the thickness direction of the substrate. The partition wall is provided with a communication groove that communicates between the adjacent groove portions.

In this application example, a plurality of grooves along the first direction are provided on the first surface of the substrate, and the plurality of grooves are separated by the partition walls. A vibration film is provided on the first surface of the substrate, and a wall portion extending along the second direction is provided on the opposite side of the vibration film from the substrate. Furthermore, a piezoelectric element is provided at a position surrounded by the partition wall and the wall portion of the vibration film. And the communication groove which connects between adjacent groove parts is provided in the partition.
By the way, as described above, in the configuration in which the region surrounded by the partition wall and the wall portion of the vibration portion is a vibration portion and the vibration portion is vibrated by a piezoelectric element, the partition wall resonates in a plurality of types of vibration modes by the vibration of the vibration portion. There is a risk. The number of vibration modes increases as the length dimension in the first direction of the partition wall is long, and there is a high possibility that an unnecessary mode that inhibits vibration of the diaphragm is included.
On the other hand, in this application example, since the communication groove is provided in the partition wall as described above, the partition wall is divided into a plurality of portions (partial partition walls). In this case, although resonance occurs in each partial partition due to vibration of the vibration part, the length dimension in the first direction of each partial partition is not provided with a communication groove (the total length of the partition along the first direction). ). Therefore, the number of vibration modes that can occur in the resonance of each partial partition is reduced. For this reason, possibility that the unnecessary mode which affects the vibration of a vibration part will be included will be reduced, and it will become possible to provide a high performance ultrasonic device.

In the ultrasonic device according to this application example, it is preferable that positions of the communication grooves in the first direction are different in the adjacent partition walls.
A configuration in which a communication groove is provided at a predetermined position in the first direction for each partition wall, that is, when viewed from the second direction, when the communication groove of each partition wall is at the same position, a substantially linear shape along the second direction The strength of the ultrasonic device is reduced by the communication grooves arranged in the, and for example, the ultrasonic device may be easily bent or damaged with the straight line as a boundary (fold).
On the other hand, in this application example, the position of the first communication groove provided in the first partition in the first direction and the second communication groove provided in the second partition adjacent to the first partition. The position in the first direction is different. That is, when viewed from the second direction, the first communication groove and the second communication groove do not overlap. In such a configuration, in the first partition, the strength of the ultrasonic device is weakened at the position where the first communication groove is formed, but the strength is compensated by the second partition. Similarly, the strength is compensated by the first partition for a decrease in strength at the position of the second communication groove of the second partition. Thereby, the strength fall by the communicating groove | channel in an ultrasonic device can be suppressed.

In the ultrasonic device according to this application example, it is preferable that the groove depth of the communication groove is the same as the groove depth of the groove portion.
In this application example, since the groove depth of the communication groove and the groove portion is the same, for example, when the groove portion and the communication groove are formed by etching the substrate, the groove portion and the communication groove are simultaneously formed in the same step. It becomes possible to do.

An ultrasonic probe according to an application example of the present invention includes the above-described ultrasonic device and a housing that houses the ultrasonic device.
In the ultrasonic probe of this application example, the ultrasonic device as described above is housed in the housing, and the ultrasonic measurement is performed on the subject by bringing the ultrasonic probe into contact with the subject. can do. As described above, since the ultrasonic device is provided with the communication groove in the partition wall, even when the partition wall resonates due to vibration of the vibration unit, generation of unnecessary modes that inhibit the vibration of the vibration unit is reduced. ing. Therefore, an ultrasonic probe having such a high-performance ultrasonic device can perform ultrasonic measurement with high accuracy.

An ultrasonic apparatus according to an application example of the invention includes an ultrasonic device as described above, and a control unit that controls the ultrasonic device.
In the ultrasonic apparatus of this application example, various ultrasonic treatments using the ultrasonic device as described above can be performed. For example, an ultrasonic device transmits / receives ultrasonic waves to / from a subject to form an internal tomographic image of the subject, or measures a part of the subject (for example, blood pressure or blood flow of a living body) can do. Further, by transmitting ultrasonic waves to the affected part of the subject, the affected part can be treated (ultrasonic treatment), or the removal target attached to the object can be removed by the ultrasonic wave. In this application example, since the ultrasonic device having high performance is provided as described above, even in the ultrasonic apparatus including the ultrasonic device, the various ultrasonic processes can be performed with high accuracy. .

The figure which shows schematic structure of the ultrasonic device of 1st embodiment. 1 is a cross-sectional view illustrating a schematic configuration of an ultrasonic probe according to a first embodiment. The top view which shows schematic structure of the element board | substrate of the ultrasonic device of 1st embodiment. Sectional drawing which shows typically the ultrasonic device cut | disconnected by the AA line in FIG. Sectional drawing which shows typically the ultrasonic device cut | disconnected by the BB line in FIG. The perspective view which shows schematic structure of the element substrate of 1st embodiment. The perspective view which shows schematic structure of the sealing plate of 1st embodiment. The top view which shows schematic structure of the sealing board of 1st embodiment. Sectional drawing which shows schematic structure of the sealing board cut | disconnected by CC line | wire in FIG. Sectional drawing which shows typically the ultrasonic device cut | disconnected by the DD line | wire of FIG. Sectional drawing which shows typically the ultrasonic device cut | disconnected by the EE line | wire of FIG. The top view which shows schematic structure of the sealing board of 2nd embodiment. The top view which shows schematic structure of the sealing board of the modification 1. FIG. The top view which shows schematic structure of the sealing board of the modification 2. As shown in FIG. The top view which shows schematic structure of the sealing board of the modification 3. FIG.

[First embodiment]
Hereinafter, a first embodiment will be described based on the drawings.
FIG. 1 is a perspective view showing a schematic configuration of the ultrasonic measurement apparatus 1.
The ultrasonic measurement device 1 corresponds to an ultrasonic device, and includes an ultrasonic probe 2 and a control device 10 electrically connected to the ultrasonic probe 2 via a cable 3 as shown in FIG. .
The ultrasonic measurement apparatus 1 sends ultrasonic waves from the ultrasonic probe 2 into the living body in a state where the ultrasonic probe 2 is in contact with the surface of the living body (for example, a human body). In addition, the ultrasonic wave reflected by the organ in the living body is received by the ultrasonic probe 2, and based on the received signal, for example, an internal tomographic image in the living body is obtained, or the state of the organ in the living body (for example, Blood flow etc.).

[1. Configuration of control device]
The control device 10 corresponds to a control unit, and includes, for example, an operation unit 11 including buttons and a touch panel, and a display unit 12 as illustrated in FIG. Although not shown, the control device 10 includes a storage unit configured by a memory or the like, and a calculation unit configured by a CPU (Central Processing Unit) or the like. The control device 10 controls the ultrasonic measurement device 1 by causing the calculation unit to execute various programs stored in the storage unit. For example, the control device 10 outputs a command for controlling the driving of the ultrasonic probe 2 or forms an image of the internal structure of the living body based on the reception signal input from the ultrasonic probe 2 to display the display unit. 12 or the biological information such as blood flow is measured and displayed on the display unit 12. As such a control apparatus 10, terminal devices, such as a tablet terminal, a smart phone, and a personal computer, can be used, for example, You may use the dedicated terminal device for operating the ultrasonic probe 2. FIG.

[2. Configuration of ultrasonic probe]
FIG. 2 is a cross-sectional view showing a schematic configuration of the ultrasonic probe 2.
The ultrasonic probe 2 corresponds to an ultrasonic probe, and as shown in FIG. 2, a housing 21, an ultrasonic device 22 housed in the housing 21, and an ultrasonic device 22 are controlled. And a circuit board 23 provided with a driver circuit and the like. The ultrasonic device 22 and the circuit board 23 constitute an ultrasonic sensor 24.

[2-1. Case configuration]
As shown in FIG. 1, the casing 21 is formed in, for example, a box shape having a rectangular shape in plan view, and a sensor window 21 </ b> B is provided on one surface (sensor surface 21 </ b> A) orthogonal to the thickness direction. A part of 22 is exposed. Further, a cable 3 connected to the circuit board 23 inside the housing 21 is inserted into a part of the housing 21 (side surface in the example shown in FIG. 1), and the ultrasonic probe 2 is connected by the cable 3. Are connected to the control device 10. Note that the connection configuration between the ultrasonic probe 2 and the control device 10 is not limited to this, and for example, the ultrasonic probe 2 and the control device 10 may be connected by wireless communication. Various configurations of the control device 10 may be provided therein.

[2-2. Circuit board configuration]
The circuit board 23 is electrically connected to a signal terminal 414P (see FIG. 3) and a common terminal 416P (see FIG. 3) of the ultrasonic device 22 described later, and controls the ultrasonic device 22 based on the control of the control device 10. To do.
Specifically, the circuit board 23 includes a transmission circuit, a reception circuit, and the like. The transmission circuit outputs a drive signal that causes the ultrasonic device 22 to perform ultrasonic transmission. The reception circuit acquires the reception signal output from the ultrasonic device 22 that has received the ultrasonic wave, performs amplification processing, AD conversion processing, phasing addition processing, and the like on the reception signal and outputs the received signal to the control device 10. To do.

[2-3. Configuration of ultrasonic device]
FIG. 3 is a plan view of the element substrate 41 in the ultrasonic device 22 as viewed from the sealing plate 42 side. 4 is a cross-sectional view of the ultrasonic device 22 cut along line AA in FIG. FIG. 5 is a cross-sectional view of the ultrasonic device 22 cut along line BB in FIG. FIG. 6 is a perspective view showing a schematic configuration when the element substrate 41 is viewed from the acoustic lens 44 side. In FIG. 3, for convenience of explanation, the number of ultrasonic transducers Tr is reduced, but in reality, more ultrasonic transducers Tr are arranged. Similarly, in the opening 411A and the partition 426 shown in FIG. 6 and FIGS. 7 to 15 described later, the number of arrangements is reduced for convenience of explanation.
As shown in FIGS. 2, 4, and 5, the ultrasonic device 22 includes an element substrate 41, a sealing plate 42 (substrate), and an acoustic lens 44.
As shown in FIG. 3, the ultrasonic device 22 extends along the X direction (slice direction; second direction) and the Y direction (scan direction; first direction) that intersect with each other (in this embodiment, orthogonal). A plurality of ultrasonic transducers Tr are arranged in a two-dimensional array. In the present embodiment, a 1CH (channel) transmission / reception sequence Ch is configured by a plurality of ultrasonic transducers Tr arranged in the X direction. In addition, an ultrasonic device 22 having a one-dimensional array structure is configured by arranging a plurality of the 1CH transmission / reception columns Ch along the Y direction. Here, an area where the ultrasonic transducer Tr is arranged is referred to as an array area Ar1.
In FIG. 3, for convenience of explanation, the number of ultrasonic transducers Tr is reduced, but in reality, more ultrasonic transducers Tr are arranged.
In addition, although an example in which the 1CH transmission / reception sequence Ch is configured by one row of ultrasonic transducers Tr arranged in the X direction is shown, the present invention is not limited thereto. For example, one row of ultrasonic transducers Tr arranged in the X direction may be used as one element group, and a predetermined number of element groups arranged in the Y direction (for example, four element groups) may be used as one transmission / reception row Ch.

[2-3-1. Configuration of element substrate]
As shown in FIG. 4, the element substrate 41 includes a substrate body 411, a vibration film 412 provided on the sealing plate 42 side of the substrate body 411, and a piezoelectric element 413 provided on the vibration film 412. .

The substrate body 411 is made of a semiconductor substrate such as Si. The substrate body 411 is provided with openings 411A that overlap with the respective transmission / reception rows Ch in plan view. In other words, in the present embodiment, the opening 411A has an opening width dimension in the X direction that is larger than a width dimension in the Y direction, and is formed longitudinally along the X direction.
In the present embodiment, each opening 411A is a through-hole penetrating in the substrate thickness direction of the substrate body 411, and the vibration film 412 is provided so as to close one end side (sealing plate 42 side) of the through-hole. It has been.
Here, the portion of the substrate body 411 joined to the vibration film 412 is a wall portion 411B, and the opening 411A is formed by surrounding the four sides (± X side, ± Y side) by the wall portion 411B. Yes. That is, a wall portion 411B extending in the X direction is arranged between the adjacent opening portions 411A, and the adjacent opening portions 411A are separated by these wall portions 411B.

The vibration film 412 is made of, for example, SiO ₂ , a laminated body of SiO ₂ and ZrO ₂ , and is provided on the surface of the substrate body 411 on the sealing plate 42 side. As described above, the vibration film 412 is supported by the wall portion 411B of the substrate body 411, thereby closing each opening 411A. The thickness dimension of the vibration film 412 is sufficiently small with respect to the substrate main body 411.

  A sealing plate 42 is bonded to the side of the vibration film 412 opposite to the substrate body 411. As will be described in detail later, as shown in FIGS. 4 and 5, the sealing plate 42 is provided with a plurality of partition walls 426 extending in the Y direction in plan view, and the plurality of partition walls 426 are arranged in the X direction. In contrast, they are arranged at a predetermined interval. That is, the sealing plate 42 includes a plurality of groove portions 426A that are sandwiched between the plurality of partition walls 426 and extend in the Y direction along the surface direction of the bonding surface 421. In the array region Ar <b> 1 of the element substrate 41, a plurality of partition walls 426 of the sealing plate 42 are bonded to the vibration film 412.

That is, in the present embodiment, the vibration film 412 has a plurality of wall portions 411B extending in the X direction on the + Z side surface and a plurality of wall portions 411B extending in the Y direction on the −Z side surface. A partition wall 426 is joined.
Here, in the vibration film 412, in a plan view, a region surrounded by the edge of the wall portion 411B and the edge of the partition wall 426 (region where the opening portion 411A and the groove portion 426A overlap) is the flexible portion 412A. Configure. The dimension in the Y direction of the flexible portion 412A is defined by the width dimension in the Y direction of the opening 411A, and the dimension in the X direction is defined by the width dimension in the X direction of the groove 426A.
In the present embodiment, a plurality of flexible portions 412A are arranged in the X direction with respect to one opening 411A. Each flexible portion 412A is provided with a piezoelectric element 413, and the flexible portion 412A and the piezoelectric element 413 constitute one ultrasonic transducer Tr.

As described above, the piezoelectric element 413 is provided on the surface of each flexible portion 412A on the sealing plate 42 side. For example, the piezoelectric element 413 includes a laminated body in which a lower electrode 414, a piezoelectric film 415, and an upper electrode 416 are laminated from the vibrating film 412 side.
In such an ultrasonic transducer Tr, when a rectangular wave voltage (drive signal) having a predetermined frequency is applied between the lower electrode 414 and the upper electrode 416, the piezoelectric film 415 is bent and the flexible portion 412A vibrates. Ultrasonic waves are sent out. Further, when the flexible portion 412A is vibrated by the ultrasonic waves reflected from the living body, a potential difference is generated above and below the piezoelectric film 415. Accordingly, the received ultrasonic wave can be detected by detecting the potential difference generated between the lower electrode 414 and the upper electrode 416.

  As shown in FIG. 3, the lower electrode 414 is formed linearly along the X direction and constitutes a 1CH transmission / reception string Ch. Both end portions (± X side end portions) of the lower electrode 414 extend to the terminal region Ar2 provided on the ± X side of the array region Ar1, and the signal electrically connected to the circuit board 23 in the terminal region Ar2. A terminal 414P is provided.

  Further, as shown in FIG. 3, the upper electrode 416 is formed linearly along the Y direction, and connects the transmission / reception columns Ch arranged in the Y direction. The ± Y side end of the upper electrode 416 is connected to the common electrode line 416A. The common electrode line 416A connects a plurality of upper electrodes 416 arranged in the X direction. Both end portions (± X side end portions) of the common electrode line 416A are extended to the terminal region Ar2, and a common terminal 416P that is electrically connected to the circuit board 23 is provided in the terminal region Ar2. The common terminal 416P is connected to a reference potential circuit (not shown) of the circuit board 23 and set to a reference potential.

[2-3-2. Configuration of acoustic layer and acoustic lens]
As shown in FIGS. 4 and 5, the acoustic layer 43 is provided on the surface on the + Z side of the element substrate 41 so as to fill the inside of the opening 411 </ b> A.
As shown in FIG. 1, the acoustic lens 44 is exposed to the outside from the sensor window 21 </ b> B of the housing 21 and is in contact with the surface of a living body that is a measurement target. The acoustic lens 44 has a cylindrical shape in cross section on the ZX plane (see FIG. 5), and converges the ultrasonic wave transmitted from the ultrasonic device 22.

  The acoustic layer 43 and the acoustic lens 44 are formed of a viscoelastic material or an elastomer, and can be formed using, for example, silicone rubber or butadiene rubber. In addition, the acoustic layer 43 and the acoustic lens 44 have an acoustic impedance (for example, 1.5 MRayls) that is close to the acoustic impedance of a living body that is a measurement target. Thereby, the acoustic layer 43 and the acoustic lens 44 efficiently propagate the ultrasonic wave transmitted from the ultrasonic transducer Tr to the living body to be measured, and efficiently reflect the ultrasonic wave reflected in the living body. Propagate to the Ducer Tr.

[2-4. Configuration of sealing plate]
FIG. 7 is a perspective view showing a schematic configuration when the sealing plate 42 is viewed from the element substrate 41 side. FIG. 8 is a plan view of the sealing plate 42 as viewed from the element substrate 41 side. FIG. 9 is a cross-sectional view of the sealing plate 42 cut along the line CC in FIGS. 7 and 8. 10 is a cross-sectional view of the ultrasonic device 22 cut along line DD in FIG. 8, and FIG. 11 is a cross-sectional view of the ultrasonic device 22 cut along line EE in FIG. In FIG. 8, the position where the opening 411A of the element substrate 41 overlaps is shown by a broken line in plan view.
The sealing plate 42 corresponds to a substrate, and a planar shape when viewed from the thickness direction is formed in the same shape as the element substrate 41, for example. The + Z side surface (bonding surface 421) of the sealing plate 42 corresponds to the first surface of the substrate, and the −Z side surface of the element substrate 41 (vibrating film 412) is formed by, for example, a resin member (not shown). Be joined. The sealing plate 42 is composed of a semiconductor substrate such as Si or an insulator substrate, and reinforces the element substrate 41. In addition, since the material and thickness of the sealing plate 42 affect the frequency characteristic of the ultrasonic transducer Tr, it is preferable to set based on the center frequency of the ultrasonic wave transmitted and received by the ultrasonic transducer Tr.

As shown in FIGS. 7 and 8, the sealing plate 42 includes a wiring part 422, an array facing groove 423, a connection path 424, and a communication path 425.
The wiring part 422 is a through hole provided in a position facing the terminal region Ar2 of the element substrate 41 and penetrating in the Z direction. Each terminal 414P, 416P is arranged at a position overlapping the wiring part 422 when viewed from the -Z side, and is connected to a circuit board via a wiring member (not shown) such as an FPC (Flexible printed circuits) inserted through the wiring part 422. 23.

As shown in FIG. 8, the array facing groove 423 is a concave groove that is formed in, for example, a substantially rectangular shape in a plan view and is provided in a region facing the array region Ar <b> 1 of the element substrate 41. From the groove bottom surface 423A of the array facing groove 423, as shown in FIGS. 9 to 11, a plurality of partition walls 426 are erected toward the element substrate 41 side.
The groove wall surface on the ± X side of the array facing groove 423 is at the same position as the ± X end face of each opening 411A of the element substrate 41 or outside the ± X end face of each opening 411A of the element substrate 41 (array region Ar1). Located on the side away from the In the present embodiment, the shape of the flexible portion 412A located at both ends in the X direction is defined by the opening 411A (wall portion 411B) on three sides and the partition wall 426 on one side. Therefore, as described above, the groove wall surface on the ± X side of the array facing groove 423 may be disposed at the same position as the ± X end face of each opening 411A of the element substrate 41. On the other hand, in order to make the characteristics of each flexible part 412A the same, in the flexible part 412A at the ± X side end part as well as the other flexible parts 412A, the pair of partition walls 426 and the pair of walls It is good also as a structure enclosed by the part 411B. In this case, the groove wall surface on the ± X side of the array facing groove 423 is preferably disposed outside the ± X end face of each opening 411A of the element substrate 41 (on the side away from the array region Ar1 in plan view).
Further, the + Y side groove side surface of the array facing groove 423 is located on the + Y side by the dimension L1 from the + Y side end edge of the opening 411A arranged at the + Y side end of the array region Ar1. Similarly, the −Y side groove side surface of the array facing groove 423 is located on the −Y side by the dimension L1 from the −Y side end edge of the opening 411A disposed at the −Y side end of the array region Ar1.

  The array facing groove 423 is provided with a plurality of partition walls 426 protruding from the groove bottom surface 423A (see FIGS. 9 to 10) to the element substrate 41 side. The protruding tip of each partition wall 426 is located on the same plane as the bonding surface 421 of the sealing plate 42 and is bonded to the vibration film 412 in the array region Ar1. That is, the vibration film 412 covers and closes the groove portion 426 </ b> A in the sealing plate 42. Accordingly, a gap (internal space 420) corresponding to the groove depth of the groove 426A is formed between the ultrasonic transducer Tr (flexible part 412A) and the sealing plate 42 (groove bottom surface 423A).

Each of the partition walls 426 extends along the Y direction, and a plurality of the partition walls 426 are arranged side by side at a predetermined interval (dimension in the X direction of the flexible portion 412A) with respect to the X direction. The ± Y side end face of the partition wall 426 is disposed at a position having a dimension L1 from the groove side surface on the ± Y side of the array facing groove 423.
As a result, a groove portion 426 </ b> A sandwiched between adjacent partition walls 426 is formed in the sealing plate 42. In other words, the sealing plate 42 has a configuration in which a plurality of concave groove portions 426A that are open in the joint surface 421 and extend in the Y direction are arranged in the X direction, and the adjacent groove portions 426A are separated by the partition wall 426. It has been. Then, the groove 426A is formed at a position that intersects with the transmission / reception array Ch along the X direction and overlaps each ultrasonic transducer Tr constituting the transmission / reception array Ch in plan view (see FIG. 5). That is, the piezoelectric element 413 is provided at a position overlapping the groove 426A.
The dimension in the Z direction of the groove part 426A (the height dimension from the groove bottom surface 423A of the partition wall 426) is set to a dimension that does not hinder at least the vibration of the flexible part 412A and the piezoelectric element 413.

Further, the partition wall 426 is provided with a plurality of communication grooves 426B that communicate between the groove portions 426A adjacent to the ± X side of the partition wall 426. The communication groove 426B is formed at the same or substantially the same groove depth as the groove 426A. That is, the partition wall 426 is divided into a plurality of partial partition walls 426C by the communication groove 426B. The width dimension in the Y direction of the communication groove 426B is not particularly limited as long as the partition wall 426 can be divided into a plurality of partial partition walls 426C. However, when the communication groove 426B is provided in the flexible portion 412A, the ultrasonic transformer The frequency of ultrasonic waves that can be transmitted and received by the reducer Tr varies. Therefore, the width dimension in the Y direction of the communication groove 426B is formed, for example, the same as the width dimension in the Y direction of the wall portion 411B.
Here, the position where the communication groove 426B is provided is the position where the wall portion 411B extending in the X direction of the element substrate 41 is provided in plan view. Therefore, the partial partition wall 426C is disposed at a position overlapping the opening 411A. In the present embodiment, the partial partition wall 426C is disposed across one opening 411A or two adjacent openings 411A.

More specifically, in this embodiment, as shown in FIGS. 8, 10, and 11, the communication grooves 426 </ b> B are arranged at different positions in the partition walls 426 adjacent in the X direction. That is, the communication grooves 426 </ b> B do not overlap each other in a projected view of the two partition walls 426 adjacent in the X direction.
In the example shown in FIG. 8, the odd-numbered partitions 426 arranged in the X direction include the opening 411 </ b> A and the (2n) th opening arranged in the (2n−1) th in the Y direction in plan view. A communication groove 426B is provided at a position overlapping the wall portion 411B (odd-numbered wall portion 411B) between the portions 411A (where n is an integer of 1 or more). Further, the partition walls 426 arranged evenly with respect to the X direction have a wall part 411B (even number) between the opening part 411A and the (2n + 1) th opening part 411A arranged with respect to the Y direction. A communication groove 426B is provided at a position overlapping the second wall portion 411B).

  The connecting path 424 is provided at the ± Y side end of the array facing groove 423. That is, the connecting path 424 is configured by a groove having a dimension L1 between the ± Y side groove wall surface of the array facing groove 423 and the ± Y side end face of each partition wall 426. The connecting path 424 connects the end portions on the ± Y side of the respective groove portions 426A. The depth dimension in the connection path 424 is the same as the groove part 426A and the communication groove 426B. Therefore, for example, when the groove 426A is formed by etching, the communication groove 426B and the connection path 424 can be formed at the same time, and the manufacturing process can be simplified.

The communication path 425 extends in a direction away from the array facing groove 423 in a plan view, for example, from a connection path 424 disposed on the −Y side, and has a hole 425A at an end opposite to the connection path 424. It communicates with the outside via. In this embodiment, as shown in FIGS. 7 and 8, the communication path 425 is formed along the Y direction and communicates with a connection path 424 provided at the −Y side of the groove 426A at the + Y side end. And it communicates with the hole 425A at the end on the -Y side.
As shown in FIG. 8, the depth dimension of the communication path 425 (dimension in the Z direction) is smaller than the groove part 426 </ b> A and the connection path 424. Further, the width dimension (dimension in the X direction) of the communication path 425 is substantially the same as the dimension L1 of the connection path 424. Therefore, the cross-sectional area of the communication path 425 is smaller than the cross-sectional area of the plane (plane parallel to the YZ plane) intersecting the extending direction (X direction) of the connection path 424.
Note that the configuration of the communication path 425 is not limited to the above. For example, the communication path 425 may be provided on both sides of the ± Y side, and the communication path 425 extends in a meandering direction away from the array facing groove 423. Also good. Moreover, although the structure which is connected to the back surface opposite to the bonding surface 421 of the sealing plate 42 by the hole portion 425A is illustrated, for example, the hole portion 425A which communicates with the back surface or the side surface intersecting the bonding surface 421. May be provided.

[3. Effects of First Embodiment]
The ultrasonic measurement apparatus 1 according to this embodiment includes an ultrasonic probe 2 in which an ultrasonic device 22 is housed in a casing 21 and a control apparatus 10 that controls the ultrasonic device 22.
The ultrasonic device 22 includes an element substrate 41 and a sealing plate 42 bonded to the element substrate 41. The element substrate 41 includes a plurality of openings 411A that extend in the X direction on the substrate body 411 and are arranged in the Y direction, and a wall 411B that separates the openings 411A. The element 411B has openings in the wall 411B. A vibrating membrane 412 that closes 411A is joined. On the other hand, the sealing plate 42 includes a groove portion 426A extending in the Y direction on the bonding surface 421 and a partition wall 426 separating the adjacent groove portion 426A, and the bonding surface 421 is bonded to the vibration film 412. In addition, in the vibration film 412, in a plan view, a flexible portion 412A is configured by a region where the opening 411A and the groove 426A overlap each other (a region surrounded by the partition wall 426 and the wall 411B). An ultrasonic transducer Tr is configured by arranging the piezoelectric element 413. Each partition wall 426 of the sealing plate 42 includes a communication groove 426B that communicates adjacent groove portions 426A.

With such a configuration, even when the partition 426 resonates when the ultrasonic transducer Tr is driven and the flexible portion 412A vibrates, the disadvantage that the vibration of the flexible portion 412A is hindered can be suppressed. The performance of the ultrasonic device 22 can be improved.
That is, when the communication groove 426B is not provided in the partition wall 426, when the partition wall 426 resonates due to the vibration of the flexible portion 412A, the partition wall 426 resonates in a plurality of vibration modes. In this case, there is a high possibility that the vibration mode includes an unnecessary vibration mode (unnecessary mode) that hinders normal vibration of the flexible portion 412A, and it is difficult to drive the ultrasonic device 22 with high accuracy. On the other hand, the partition 426 is divided into a plurality of partial partitions 426C by providing the partition 426 with the communication groove 426B as in the present embodiment. The partial partition 426C may also resonate due to the vibration of the flexible portion 412A. However, since the length dimension in the Y direction is smaller than that of the partition 426, the resonance frequency is shifted toward the lower frequency and is generated. The vibration mode to be performed is also reduced. Therefore, the possibility that an unnecessary mode that hinders normal vibration of the flexible portion 412A is generated is reduced.
Thereby, the ultrasonic device 22 can be driven with high performance. Therefore, even when performing ultrasonic measurement on the subject with the ultrasonic probe 2 using the ultrasonic device 22, it is possible to perform high-accuracy ultrasonic measurement. Even when performing various processes based on the measurement result (for example, generation and display of an internal tomographic image of a living body), it is possible to perform a highly accurate process based on a highly accurate measurement result.

In the present embodiment, the adjacent partition walls 426 have different Y-direction positions where the communication grooves 426B are provided. For example, as shown in FIG. 8, the partition walls 426 that are arranged oddly with respect to the X direction are provided with communication grooves 426B at positions that overlap with the odd-numbered wall portions 411B with respect to the Y direction. The even-numbered partition 426 is provided with a communication groove 426B at a position overlapping the even-numbered wall 411B in the Y direction.
In general, when the communication groove 426B is provided in the partition wall 426, the strength of the partition wall 426 is reduced at the position where the communication groove 426B is provided. In contrast, in the present embodiment, the strength of the odd-numbered partition walls 426 at the positions where the communication grooves 426B are provided can be compensated by the even-numbered partition walls 426. Similarly, the even-numbered partition walls 426 communicate with each other. The strength at the position where the groove 426B is provided can be compensated by the odd-numbered partition walls 426.
Thereby, the overall strength reduction of the sealing plate 42 can be suppressed, and the element substrate 41 can be reinforced by the sealing plate 42.

  In the present embodiment, the groove depth of the communication groove 426B is the same as the groove depth of the groove portion 426A and the groove depth of the connecting path 424. Therefore, when the groove 426A, the communication groove 426B, and the connection path 424 are formed by etching the sealing plate 42, the groove part 426A, the communication groove 426B, and the connection path 424 are formed simultaneously. Can do. Thereby, the manufacturing cost can be reduced.

In the present embodiment, each groove 426A is connected by a communication groove 426B and a connection path 424, and a communication path 425 having a hole 425A communicating with the outside is formed in the connection path 424. Thereby, generation | occurrence | production of the pressure difference between the internal space 420 between flexible part 412A and the sealing board 42 and external space can be suppressed, and the ultrasonic device by the failure | damage or deterioration of the vibration film 412 or the piezoelectric element 413 is possible. 22 performance degradation can be suppressed.
In addition, since the groove portion 426A is connected to the communication path 425 via the connection path 424, the inflow of foreign matter into the internal space 420 compared to the case where the groove section 426A is connected to the internal space 420 without passing through the connection path 424. Can be suppressed more reliably.
Further, the communication path 425 extends in a direction away from the array facing groove 423, and the cross-sectional area of the communication path 425 is smaller than the cross-sectional area of the connection path 424. Thereby, the flow path resistance of the communication path 425 can be increased more than the connection path 424, and the inflow of the foreign material from external space can be suppressed more effectively.

[Second Embodiment]
Hereinafter, the second embodiment will be described.
In 1st embodiment, the partition 426 showed the example divided | segmented into the partial partition 426C which has a length dimension ranging over two opening part 411A. On the other hand, the second embodiment is different from the first embodiment in that the length dimension of each partial partition wall 426C divided by the communication groove 426B is different.
In the following description, components similar to those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

FIG. 12 is a plan view of the sealing plate 42 in the second embodiment viewed from the element substrate 41 side.
In the present embodiment, the partition wall 426 has a communication groove 426B formed at each position overlapping the wall portion 411B in plan view. The width dimension in the Y direction of the communication groove 426B is the same as the width dimension in the Y direction of the wall portion 411B.
That is, the partition wall 426 is divided by the communication groove 426B into partial partition walls 426C having substantially the same dimension as the length of the opening 411A in the Y direction, and each partial partition wall 426C overlaps the opening 411A in plan view.

[Operational effects of the second embodiment]
In the present embodiment, the partition wall 426 includes a communication groove 426B provided at each position overlapping the wall portion 411B in plan view.
For this reason, the length dimension of each partial partition 426C in the Y direction is shorter than the partial partition 426C of the first embodiment. Thereby, when each partial partition 426C resonates due to the vibration of the flexible portion 412A, the possibility of including unnecessary mode vibration is further reduced, and the performance of the ultrasonic device 22 can be further enhanced.

[Modification]
Note that the present invention is not limited to the above-described embodiments and modifications, and a configuration obtained by appropriately combining modifications, improvements, and embodiments within a range in which the object of the present invention can be achieved. Is included.

(Modification 1)
FIG. 13 is a plan view showing a schematic configuration of a sealing plate 42 according to a modification as viewed from the element substrate 41 side.
In the second embodiment, the adjacent partition walls 426 have the same position in the Y direction of the communication groove 426B, and the communication grooves 426B are arranged along the X direction. In such a configuration, the strength of the sealing plate 42 is reduced in a line along the X direction in which the communication grooves 426B are arranged.
On the other hand, it is good also as a structure as shown in FIG.
In the example illustrated in FIG. 13, the sealing plate 42 includes the (4n−3) th partition wall 426 (first partition wall 426P1) and the (4n−2) th partition wall with respect to the X direction. 426 (second partition 426P2) is provided with a connecting wall 426D for connecting the partition walls 426 at a position overlapping with the odd-numbered wall portions 411B arranged in the Y direction (where n is an integer of 1 or more). . In addition, a communication groove 426B is provided at a position overlapping the even-numbered wall portion 411B in the Y direction, as in the second embodiment.
On the other hand, in the X direction, the (4n-1) th partition 426 (third partition 426P3) and the (4n) th partition 426 (fourth partition 426P4) are arranged in the Y direction. A connection wall 426D that connects the partition walls 426 is provided at a position overlapping the even-numbered wall portions 411B. In addition, a communication groove 426B is provided at a position that overlaps with the odd-numbered wall portion 411B arranged in the Y direction, as in the second embodiment.

In such a configuration, in the first partition wall 426P1 and the second partition wall 426P2, the communication groove 426B is provided at the same position with respect to the Y direction (position overlapping the wall portion 411B arranged evenly in the Y direction). However, since the connection wall 426D is provided in the third partition wall 426P3 and the fourth partition wall 426P4 with respect to the position in the Y direction, the strength with respect to the position in the Y direction is compensated by the connection wall 426D.
The same applies to the third partition wall 426P3 and the fourth partition wall 426P4. That is, the connection wall 426D is provided in the first partition 426P1 and the second partition 426P2 with respect to the position where the communication groove 426B of the third partition 426P3 and the fourth partition 426P4 is provided. Therefore, the strength is compensated for by the connecting wall 426D between the first partition 426P1 and the second partition 426P2 even at the position where the communication groove 426B of the third partition 426P3 and the fourth partition 426P4 is provided.

In the example shown in FIG. 13, even when the connection wall 426 </ b> D is provided, the internal spaces 420 (not shown in FIG. 13) between the ultrasonic transducers Tr and the sealing plate 42 are connected to the connection paths 424. It becomes the structure connected to. Therefore, damage and performance degradation of the ultrasonic transducer Tr are suppressed.
Furthermore, since the connecting wall 426D that connects the partition walls 426 is provided so as to intersect (orthogonal in this example) with respect to the extending direction (Y direction) of the partition walls 426, the connection wall 426D serves as a suppression unit that suppresses vibration of the partition walls 426. Function. That is, in the example of FIG. 13, the partition wall 426 is configured such that a plurality of partial partition walls 426C are divided by the communication groove 426B and the connection wall 426D. Therefore, the length dimension of the partial partition 426C in the second embodiment and the partial partition 426C in FIG. 13 in the Y direction are substantially the same. Thereby, even when the partial partition 426C resonates due to the vibration of the flexible portion 412A, the generation of the unnecessary mode is suppressed, and each ultrasonic transducer Tr can be driven appropriately.

(Modification 2)
In the first embodiment described above, the example in which the positions of the communication grooves 426B are different in the adjacent partition walls 426 is shown, but a configuration as shown in FIG.
FIG. 14 is a plan view of the sealing plate in Modification 2 as viewed from the element substrate side.
In the example of FIG. 14, the first partition 426P1 and the second partition 426P2 are similar to the odd-numbered partition 426 in the first embodiment and (2n−1) th opening 411A with respect to the Y direction in plan view ( 2n) A communication groove 426B is provided at a position overlapping with the space between the first openings 411A (odd-numbered walls 411B). On the other hand, the third partition wall 426P3 and the fourth partition wall 426P4 are similar to the even-numbered partition wall 426 in the first embodiment, and the (2n-1) th opening 411A and the (2n) th wall in the Y direction in plan view. A communication groove 426B is provided at a position overlapping with the opening 411A (even-numbered wall 411B).

In such a configuration, in the first partition wall 426P1 and the second partition wall 426P2, the communication groove 426B is provided at the same position with respect to the Y direction (position overlapping the wall portion 411B arranged evenly in the Y direction). However, since the third partition wall 426P3 and the fourth partition wall 426P4 are not provided with the communication groove 426B with respect to the position in the Y direction, the position in the Y direction is determined by the third partition wall 426P3 and the fourth partition wall 426P4. The strength against is compensated.
The same applies to the third partition wall 426P3 and the fourth partition wall 426P4. The first partition wall 426P1 and the second partition wall 426P2 have a communication groove 426B with respect to the position where the communication groove 426B of the third partition wall 426P3 and the fourth partition wall 426P4 is provided. Since it is not provided, a decrease in strength is suppressed.
Thus, even if the position in the Y direction where the communication groove 426B is provided in the adjacent partition wall 426 is the same, in the other partition wall 426, the communication groove 426B is not provided at the position. The strength reduction of the sealing plate 42 can be suppressed.

(Modification 3)
FIG. 15 is a plan view of the sealing plate of Modification 3 as viewed from the element substrate side.
A convex portion 426E as shown in FIG. 15 may be provided on the sealing plate 42 shown in the first embodiment.
That is, in the sealing plate 42 shown in FIG. 15, the partial partition wall 426C provided between two openings 411A adjacent in plan view protrudes in the Y direction at a position overlapping the wall 411B between the openings 411A. A convex portion 426E is provided.
The protruding dimension of the convex part 426E may be, for example, the width dimension in the X direction of the flexible part 412A, or may be half the width dimension of the flexible part 412A. Further, when the width dimension in the X direction of the upper electrode 416 is smaller than the width dimension in the X direction of the flexible portion 412A, the convex portion 426E is formed to the edge of the upper electrode 416 (to a position not overlapping with the upper electrode 416). May be.
Further, in the example illustrated in FIG. 15, the convex portion 426E is provided on both the ± X sides of the partial partition wall 426C.

In such a configuration, the strength of the sealing plate 42 can be further increased. That is, in this application example, in the adjacent partition walls 426, the positions where the communication grooves 426B are provided are different from each other, so that the strength reduction due to the communication grooves 426B can be suppressed as in the first embodiment.
In addition, since the protrusion 426E protruding in the X direction is provided in the other partition wall 426 with respect to the position where the communication groove 426B is provided in one partition wall 426, the strength at the position can be further increased. .
Moreover, in this modification, the vibration of each partial partition 426C is suppressed by providing the convex portion 426E. Thereby, even when each partial partition wall 426 </ b> C resonates due to vibration of the vibration film 412, the influence of resonance can be reduced.

(Modification 4)
In each of the above embodiments, the example in which the ± Y side end portion of the partition wall 426 is disposed apart from the ± Y side groove side surface of the array facing groove 423 by the dimension L1 has been described, but the present invention is not limited thereto.
For example, the ± Y side end of the partition wall 426 may be continuous with the ± Y side groove side surface of the array facing groove 423. In this case, the connection path 424 is not necessary, and the communication path 425 only needs to communicate with any of the plurality of grooves 426A. That is, in the present embodiment, the plurality of communication grooves 426B are provided in the partition wall 426, so that adjacent groove portions 426A communicate with each other. Accordingly, each groove portion 426A does not become a closed space but communicates with the hole portion 425A via the communication channel 425 via the communication groove 426B and the adjacent groove portion 426A.
With such a configuration, vibration of the partial partition wall 426 </ b> C at the + Y side end of the partition wall 426 can be suppressed.

(Modification 5)
In each of the above embodiments, the width dimension in the Y direction of the communication groove 426B is the same as the width dimension in the Y direction of the wall portion 411B, but the present invention is not limited to this. That is, the communication groove 426B does not have to overlap with the opening 411A. For example, the width dimension in the Y direction of the communication groove 426B may be smaller than the width dimension in the Y direction of the wall part 411B. In this case, since a margin is provided at the end of the partial partition wall 426C, alignment adjustment when the sealing plate 42 is bonded to the element substrate 41 is facilitated.

(Modification 6)
In the first embodiment, the example in which the groove depth dimensions of the groove portion 426A and the communication groove 426B are the same is shown, but the present invention is not limited to this.
For example, the depth dimension of the communication groove 426B may be larger than that of the groove part 426A. Furthermore, instead of the communication groove 426B, a through-hole penetrating the sealing plate 42 in the thickness dimension may be provided. The communication path of the internal space 420 between the ultrasonic transducer Tr and the sealing plate 42 to the external space is shortened. Therefore, the pressure change in the internal space 420 is further suppressed, and damage to the ultrasonic transducer Tr and performance degradation can be suppressed.
Further, the depth dimension of the communication groove 426B may be smaller than that of the groove part 426A. In this case, the strength of each partition wall 426 can be improved, and consequently the strength of the sealing plate 42 can be improved.

(Modification 7)
In each said embodiment, although the ultrasonic measuring device 1 which makes a measuring object the organ in a living body was illustrated as an ultrasonic device, it is not limited to this. For example, the structure of the said embodiment and each modification is applicable to the measuring machine which performs the detection of the defect of the said structure, and the test | inspection of aging for various structures. Further, for example, the same applies to a measuring machine that uses a semiconductor package, a wafer, or the like as a measurement target and detects a defect of the measurement target.

  In addition, the specific structure for carrying out the present invention may be configured by appropriately combining the above-described embodiments and modifications within the scope that can achieve the object of the present invention, and may be appropriately changed to other structures and the like. May be.

  DESCRIPTION OF SYMBOLS 1 ... Ultrasonic measuring apparatus (ultrasonic apparatus), 2 ... Ultrasonic probe (ultrasonic probe), 10 ... Control apparatus (control part), 21 ... Housing | casing, 22 ... Ultrasonic device, 41 ... Element board | substrate, 42 ... Sealing plate (substrate), 411 ... Substrate body part, 411A ... Opening part, 411B ... Wall part, 412 ... Vibration film, 412A ... Flexible part, 413 ... Piezoelectric element, 414 ... Lower electrode, 415 ... Piezoelectric film 416 ... Upper electrode, 420 ... Internal space, 421 ... Bonding surface, 422 ... Wiring part, 423 ... Array facing groove, 423A ... Groove bottom surface, 424 ... Connection path, 425 ... Communication path, 425A ... Hole, 426 ... Partition wall 426A ... groove, 426B ... communication groove, 426C ... partial partition, 426D ... connection wall, 426E ... convex, 426P1 ... first partition, 426P2 ... second partition, 426P3 ... third partition, 426P4 ... fourth partition, Ar1 ... are Regions, Ar @ 2 ... terminal region, Ch ... transceiver columns, Tr ... ultrasonic transducer.

Claims (5)

A substrate having a first surface and having a plurality of groove portions extending in a first direction along the surface direction of the first surface on the first surface, and a partition wall separating the adjacent groove portions;
A vibration membrane provided on the first surface and closing the groove;
A wall portion provided on the opposite side of the vibrating membrane from the substrate and extending in a second direction intersecting the first direction;
A piezoelectric element provided in the vibration film, and provided in a position surrounded by the partition wall and the wall portion in a plan view as viewed from the thickness direction of the substrate;
The ultrasonic device according to claim 1, wherein the partition wall is provided with a communication groove that communicates between the adjacent groove portions. The ultrasonic device according to claim 1,
In the adjacent partition walls, the positions of the communication grooves in the first direction are different from each other. The ultrasonic device according to claim 1 or 2,
The ultrasonic device according to claim 1, wherein a groove depth of the communication groove is the same as a groove depth of the groove portion. The ultrasonic device according to any one of claims 1 to 3,
A housing for housing the ultrasonic device;
An ultrasonic probe comprising: The ultrasonic device according to any one of claims 1 to 3,
A control unit for controlling the ultrasonic device;
An ultrasonic apparatus comprising: