JP6682025B2 - Wireless module, LED lighting device, solar power generation system, automatic operation system, and detection device - Google Patents

Description

  The present invention relates to a wireless communication module, an LED lighting device, a solar power generation system, an automatic operation system, and a detection device.

  In recent years, modularization of the wireless communication unit is progressing. For example, Patent Literature 1 discloses a Bluetooth module device that enables compatible use regardless of the internal antenna specifications and external antenna specifications of system components and has good production efficiency.

JP-A-2002-353841

  According to the conventional technique disclosed in Patent Document 1, it is necessary to connect the microcomputer that processes the output from the wireless communication module and the wireless communication module on the set maker side. However, since it is necessary to connect the wireless communication module and the microcomputer with a large number of signal lines, the load of circuit design on the set maker side increases.

  Therefore, it may be considered that a wireless communication circuit (RF (Radio Frequency) circuit) and a microcomputer are integrally mounted on a single substrate. However, according to such a wireless communication module, since the RF circuit and the microcomputer are arranged side by side, the area of the substrate becomes large and the size of the module becomes large. In addition, as the substrate on which the RF circuit is mounted, it is necessary to use a multilayer substrate having a high dielectric constant in relation to the high frequency of the RF circuit. Therefore, if the RF circuit and the microcomputer are mounted on a single substrate, the substrate of a multi-layer substrate having a high dielectric constant is used even in the microcomputer portion which is originally unnecessary, which causes a problem of cost increase.

  An object of the present invention is to provide a wireless communication module, an LED lighting device, a solar power generation system, an automatic operation system, which can realize a reduction in size and cost while integrating an RF circuit and a microcomputer, and It is to provide a detection device.

  According to one aspect of the present invention, a first substrate having a front surface and a back surface, a first circuit disposed on the front surface of the first substrate for processing a radio signal, and the first circuit. An antenna capable of transmitting and receiving radio waves, which is arranged on the front surface of the substrate and electrically connected to the first circuit, and a front surface and a back surface, at least a part of the back surface of which is the first A second substrate which faces the surface of the substrate and is arranged so as to cover the first circuit and expose the antenna in a first direction view which is a vertical direction view of the surface of the first substrate; There is provided a wireless module having a first conductive portion arranged between the front surface of a first substrate and the back surface of the second substrate so as to be electrically connected to the first circuit.

  According to another aspect of the present invention, there is provided an LED lighting device including the wireless module.

  According to another aspect of the present invention, there is provided a photovoltaic power generation system including the wireless module.

  According to another aspect of the present invention, the wireless module provided for receiving a signal transmitted from the outside, and an operation unit for switching on / off of a specific function based on a received signal of the wireless module. An automatic actuation system comprising:

  According to another aspect of the present invention, there is provided a detection device including a sensor that detects a predetermined state and the wireless module that is provided to wirelessly transmit a detection signal of the sensor.

  According to the present invention, a wireless communication module, an LED lighting device, a solar power generation system, an automatic operation system, which can reduce the size and realize the cost reduction while integrating the RF circuit and the microcomputer, and A detection device can be provided.

It is a typical block diagram which shows the structural example of the wireless-communications module which concerns on 1st Embodiment, Comprising: (a) A typical side view, (b) A typical top view, (c) Another typical top view. FIG. 3 is a schematic block diagram showing a configuration example of the RF circuit according to the first embodiment. It is explanatory drawing of the RF board | substrate which concerns on 1st Embodiment, Comprising: (a) typical sectional view, (b) typical top view. The typical external view when the wireless-communications module which concerns on 1st Embodiment is applied to an LED illuminating device. The schematic block diagram at the time of applying the wireless-communications module which concerns on 1st Embodiment to a solar power generation system. It is a typical block diagram which shows the structural example of the radio | wireless communication module which concerns on 2nd Embodiment, Comprising: (a) A typical side view, (b) A typical top view. It is a typical block diagram which shows the structural example of the wireless-communications module which concerns on 3rd Embodiment, Comprising: (a) typical side view, (b) typical top view. It is a typical block diagram which shows the structural example of another wireless communication module which concerns on 3rd Embodiment, Comprising: (a) A typical side view, (b) A typical top view. The schematic block diagram which shows the structural example of the radio | wireless communication module which concerns on 4th Embodiment. The schematic block diagram which shows the structural example of the wireless-communications module which concerns on 5th Embodiment. The schematic block diagram which shows the structural example of the radio | wireless communication module which concerns on 6th Embodiment. The schematic block diagram which shows the structural example of the wireless-communications module which concerns on 7th Embodiment. It is a typical block diagram which shows the structural example of the radio | wireless communication module which concerns on 1st Embodiment, Comprising: (a) A typical side view, (b) A typical top view which shows the inner side board surface of a control board. It is a typical block diagram which shows the structural example of the wireless-communications module which concerns on 8th Embodiment, Comprising: (a) A typical side view, (b) A typical top view which shows the inner board | substrate surface of a control board, (c) ) A schematic enlarged sectional view, (d) Another schematic enlarged sectional view. The schematic block diagram which shows the structural example of the wireless-communications module which concerns on 9th Embodiment. It is a typical block diagram of the wireless-communications module which concerns on 10th Embodiment, Comprising: (a) A typical top view, (b) A typical side view. It is a typical block diagram of the RF board | substrate shown by FIG. 16, Comprising: (a) A typical top view, (b) A typical side view. It is a typical block diagram of the control board shown by FIG. 16, Comprising: (a) typical top view, (b) typical front view, (c) typical side view.

  Next, an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness of each component and the plane dimension, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, the specific thickness and dimensions should be determined in consideration of the following description. Further, it is needless to say that the drawings include portions having different dimensional relationships and ratios.

  Further, the following embodiments exemplify devices and methods for embodying the technical idea of the present invention, and the embodiments of the present invention show the material, shape, and structure of each component. , The arrangement, etc. are not specified as below. The embodiment of the present invention can be modified in various ways within the scope of the claims.

[First Embodiment]
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 5.

  The wireless communication module 1 according to the present embodiment includes an RF circuit 12 that transmits and receives wireless signals, a connector 11 that is an inter-board connector, an RF board 10 on which the RF circuit 12 is mounted and the connector 11 is provided, A microcomputer 22 for processing radio signals transmitted and received by the RF circuit 12, a connector 21 which is an inter-board connector connectable to the connector 11, and a control board 20 on which the microcomputer 22 is mounted and which is provided with the connector 21 are provided. The RF board 10 and the control board 20 are configured to at least partially overlap with each other while the connector 11 and the connector 21 are connected.

  The RF board 10 and the control board 20 are arranged such that the board surface of the RF board 10 on which the RF circuit 12 is mounted and the board surface of the control board 20 on which the microcomputer 22 is not mounted face each other. May be.

  Further, the antenna 13 may be arranged in a region on the RF substrate 10 where the RF substrate 10 and the control substrate 20 do not overlap each other.

  Further, the RF board 10 may be a multi-layer board having a higher dielectric constant than the control board 20.

(Wireless communication module)
1A and 1B are schematic configuration diagrams showing a configuration example of a wireless communication module 1 according to the first embodiment, where FIG. 1A is a schematic side view and FIG. 1B is a schematic plan view. Is. As shown in this figure, the wireless communication module 1 is divided into separate boards of the RF board 10 and the control board 20 and three-dimensionally connected by the connectors 11 and 21. In the following description, the substrate surface on the side where the two substrates 10 and 20 face each other is called an “inner substrate surface”, and the substrate surface on the opposite side is called an “outer substrate surface”.

  An RF circuit 12 is mounted on the inner substrate surface of the RF substrate 10 and a connector 11 is provided. The RF circuit 12 is a radio circuit that transmits and receives radio signals and operates at high frequency. The connector 11 is a thin board-to-board connector generally called a board-to-board connector.

  A connector 21 is provided on the inner board surface of the control board 20. The connector 21 is a thin inter-board connector that can be connected to the connector 11. Further, a microcomputer 22 and other electronic components 23 are mounted on the outer substrate surface of the control substrate 20, and a connector 24 is provided. The microcomputer 22 is a signal processing circuit that processes radio signals transmitted and received by the RF circuit 12. The connector 24 is for connecting to the outside.

  When the connector 11 and the connector 21 are connected, the RF board 10 and the control board 20 face each other. The RF circuit 12 is arranged between the two substrates 10 and 20, and the microcomputer 22 and other components 23 are arranged on the outer substrate surface of the control substrate 20. As shown in this figure, the RF board 10 has a larger board size than the control board 20, and the right end portion of the RF board 10 is protruded in the drawing. By disposing the antenna 13 on the RF substrate 10 that has popped out, radio waves are not blocked by metal parts or the like, so that deterioration of the sensitivity of the antenna 13 can be avoided.

  FIG. 1C is a schematic plan view showing an example of a connection form between the antenna 13 and the RF circuit 12. As shown in this figure, the antenna 13 or the external antenna 13a is connected to the RF circuit 12 via the switch 13d. The external antenna 13a will be described in detail later. The switch 13d has a first connecting portion connected to the external antenna 13a and a second connecting portion connected to the antenna 13. When transmitting and receiving a radio signal using the antenna 13, the switch 13d is fixed with the antenna 13 connected to the second connecting portion. On the other hand, when transmitting / receiving a radio signal using the external antenna 13a, the switch 13d is fixed with the cable 13b of the external antenna 13a being connected to the first connecting portion. Other configurations are the same as those in FIG.

(RF circuit)
FIG. 2 is a schematic block diagram showing a configuration example of the RF circuit 12 according to the first embodiment. The RF circuit 12 includes a power supply unit 121, a filter 122, an RF switch 123, a transmission unit 124, a reception unit 125, a modulation / demodulation unit 126, a control unit 127, and a transmitter 128. Each of these parts 121 to 128 is covered with a shield plate 120 made of metal. The shield plate 120 has a flat upper surface portion and four side surface portions. The inside of the shield plate 120 is hollow, and it is possible to fix the RF circuit 12 at the side surface while covering the RF circuit 12. The side surface portion is soldered to a pad connected to the ground of the RF substrate 10. That is, the shield plate 120 is electrically connected to the ground of the RF substrate 10 and fixed to the RF substrate 10. Further, the shield plate 120 does not have to be made of metal, and may be made of resin, for example. In this case, the shield plate 120 is fixed to the RF substrate 10 with, for example, an adhesive material. The transmission section 124 to the control section 127 in the RF circuit 12 configure one RFIC section 129. The power supply unit 121 converts a DC current of a certain voltage into a DC current of another voltage and supplies the DC current to the modulation / demodulation unit 126, the control unit 127 and the like. The oscillator 128 generates a clock signal and supplies it to the modulation / demodulation unit 126, the control unit 127, and the like. The control unit 127 performs various controls for wireless communication. The modulator / demodulator 126 performs frequency modulation based on a modulation method such as GFSK (Gaussian Frequency-Shift Keying). The RF switch 123 is a switch for switching transmission / reception of wireless signals. The filter 122 for reducing noise is connected to the antenna 13 via the antenna connector 13c.

(RF board, control board)
3A and 3B are explanatory views of the RF substrate 10 according to the first embodiment, FIG. 3A is a schematic sectional view, and FIG. 3B is a schematic plan view. As the RF substrate 10, it is necessary to use a multi-layer substrate having a high dielectric constant in relation to the high frequency of the RF circuit 12. As shown in this figure, the strip line 31 is formed by using the RF substrate 10 as a multi-layer substrate having, for example, about 4 to 6 layers. The strip line 31 corresponds to a line connecting the antenna connector 13c to the RF switch 123, the RF switch 123 to the transmitting unit 124, and the RF switch 123 to the receiving unit 125, which are shown by thick lines in FIG. Reference numeral 32 shown in FIG. 3 is a ground pattern, and reference numeral 33 is a via hole. The material of the RF substrate 10 is a material having a high dielectric constant such as glass epoxy, alumina, SiN, or SiC. The control board 20 does not have to be a multi-layer board made of a material having a high dielectric constant, but may be a single-layer board made of, for example, glass epoxy.

(Application example)
FIG. 4 is a schematic external view when the wireless communication module 1 according to the first embodiment is applied to an LED lighting device. The connector 24 of the wireless communication module 1 is connected to the connector 24b of the LED power supply module 2 via the harness 24a. According to such an LED lighting device, it is possible to perform an operation such as turning on / off the lighting from another room by transmitting / receiving a radio signal to / from the remote controller. Further, as shown in FIG. 4, a detection device 300 including a sensor 100 that detects the presence of a person (a predetermined state) and a wireless transmission unit 200 that wirelessly transmits the detection signal is combined with the above LED lighting device. In this case, a system for automatically switching the lighting on / off by the detection / non-detection of the presence of a person by the sensor 100 is configured. In this case, the wireless transmission unit 200 that wirelessly transmits the detection signal of the sensor 100 can be configured by the wireless communication module 1 according to the present embodiment.

  FIG. 5 is a schematic block diagram when the wireless communication module 1 according to the first embodiment is applied to a solar power generation system. The power conditioner 4 converts the electricity generated by the solar cell 3 into an AC power source that can be used in each home 7. Further, the surplus power can be sold to the power company 6. The wireless communication module 1 is mounted on such a power conditioner 4 and its remote controller 5. As a result, wireless signals can be transmitted and received between the power conditioner 4 and the remote controller 5, so that various data such as the amount of power generation and power consumption can be displayed on the monitor 5a of the remote controller 5.

  Not limited to the above example, the wireless communication module 1 can be applied to an automatic operation system having a function of switching on / off by receiving a signal from a sensor or a signal by a human operation (for example, remote control operation). In other words, this automatic operation system includes a wireless communication module 1 provided for receiving a signal transmitted from the outside, and an operation unit for switching on / off a specific function based on a received signal of the wireless communication module 1. It is a system equipped with. For example, it is preferably applicable to automatic door opening / closing by detecting the presence of a person, driving / stopping of an escalator, lighting on / off, alarm on / off, automatic faucet, automatic cleaning, and the like. Further, as described above, the wireless communication module 1 can be used as a transmitter. Further, the detection target of the sensor 100 is not limited to the presence or absence of living things such as humans, and may be a physical quantity such as temperature or pressure.

  As described above, in the wireless communication module 1 according to the first embodiment, the RF board 10 and the control board 20 are configured to overlap with each other while the connector 11 and the connector 21 are connected. As a result, the components can be mounted three-dimensionally, and the size can be reduced while the RF circuit 12 and the microcomputer 22 are integrated. Further, since the control board 20 can be made of an inexpensive material, it is possible to reduce the cost. Furthermore, since the RF board 10 and the control board 20 are separate boards, only the microcomputer 22 can be customized for each user, and the functions of the wireless communication module 1 can be easily increased or changed. .

  Further, in the present embodiment, the RF board 10 and the control board 20 are arranged so that the board surface on which the RF circuit 12 is mounted and the board surface on which the microcomputer 22 is not mounted face each other. . That is, since only the components on the RF substrate 10 side are arranged between the RF substrate 10 and the control substrate 20, it is possible to provide the thin wireless communication module 1.

[Second Embodiment]
The configuration of the wireless communication module 1 according to the second embodiment will be described below with reference to FIG. 6 only regarding the differences from the first embodiment.

(Wireless communication module)
6A and 6B are schematic configuration diagrams showing a configuration example of the wireless communication module 1 according to the second embodiment, where FIG. 6A is a schematic side view and FIG. 6B is a schematic plan view. Is. The difference from the first embodiment is that the antenna 13 is externally attached. That is, the antenna connector 13c is provided on the inner substrate surface of the RF substrate 10, and the antenna 13 is connected to the antenna connector 13c via the cable 13b. In this case, the substrate size of the RF substrate 10 may be about the same as the substrate size of the control substrate 20, as shown in FIG.

  As described above, according to the wireless communication module 1 according to the second embodiment, the antenna 13 can be externally attached. Therefore, it is possible to reduce the substrate size of the RF substrate 10 as compared with the first embodiment.

[Third Embodiment]
The configuration of the wireless communication module 1 according to the third embodiment will be described below with reference to FIGS. 7 to 8 only as to the differences from the first and second embodiments.

(Wireless communication module)
7A and 7B are schematic configuration diagrams illustrating a configuration example of the wireless communication module 1 according to the third embodiment, where FIG. 7A is a schematic side view and FIG. 7B is a schematic plan view. Is. The difference from the first embodiment is that the antenna 13 is sandwiched between the RF board 10 and the control board 20. That is, the antenna 13 can be arranged between the RF circuit 12 and the control board 20 unless a metal part or the like is arranged near the antenna 13.

  Specifically, the antenna 13 is arranged in a region on the RF substrate 10 where the RF substrate 10 and the control substrate 20 overlap each other, and the microcomputer 22 is arranged so as to avoid a region E2 near the antenna 13. There is. In other words, the area E2 near the antenna 13 is an area that may affect the radio wave state of the antenna 13. More specifically, the antenna 13 and the microcomputer 22 are arranged so as not to overlap with each other when viewed from the direction in which the RF board 10 and the control board 20 overlap (for example, the viewpoint of FIG. 1B). Of course, the position of the microcomputer 22 may be within the area E1 not near the antenna 13, and is not limited to the position shown in FIG. Further, not only the microcomputer 22 but also the connector 24 for connecting to the outside, other components 23, and the wiring pattern on the control board 20 should be avoided in the area E2.

  8A and 8B are schematic configuration diagrams showing a configuration example of another wireless communication module 1 according to the third embodiment, where FIG. 8A is a schematic side view and FIG. 8B is a schematic view. It is a top view. The point that the antenna 13 is sandwiched between the RF board 10 and the control board 20 is the same as in FIG. 7. In FIG. 7, the antenna 13 is arranged at the right end of the RF board 10, but in FIG. 8, the antenna 13 is arranged at the center of the RF board 10. Also in this case, the connector 24, the microcomputer 22, the other components 23, and the like are arranged while avoiding the area E2 near the antenna 13.

  As described above, in the wireless communication module 1 according to the third embodiment, the antenna 13 is sandwiched between the RF board 10 and the control board 20. Even in this case, since various components and wiring patterns are arranged on the control board 20 while avoiding the area E2 near the antenna 13, it is possible to avoid the sensitivity deterioration of the antenna 13.

[Fourth Embodiment]
The configuration of the wireless communication module 1 according to the fourth embodiment will be described below with reference to FIG. 9 only as to differences from the first to third embodiments.

(Wireless communication module)
FIG. 9 is a schematic configuration diagram showing a configuration example of the wireless communication module 1 according to the fourth embodiment. The difference from the first embodiment is that the inner substrate surface of the control substrate 20 (the substrate surface of the control substrate 20 on the side facing the RF substrate 10) and the upper surface portion of the shield plate 120 of the RF circuit 12 are bonded by the adhesive 31. It is a fixed point. The material of the adhesive 31 and the method of applying the adhesive 31 are not particularly limited. For example, a double-sided tape can be used as the adhesive 31. Further, the adhesive 31 is preferably an insulating material.

  As described above, in the wireless communication module 1 according to the fourth embodiment, the inner board surface of the control board 20 and the RF circuit 12 are fixed by the adhesive 31. Thereby, the connection strength can be increased as compared with the case where the RF board 10 and the control board 20 are connected only by the connectors 11 and 21.

[Fifth Embodiment]
The configuration of the wireless communication module 1 according to the fifth embodiment will be described below with reference to FIG. 10 only as to differences from the first to fourth embodiments.

(Wireless communication module)
FIG. 10 is a schematic configuration diagram showing a configuration example of the wireless communication module 1 according to the fifth embodiment. The difference from the first embodiment is that the RF board 10 and the control board 20 are fixed by screws 32a and 32b. The positions where the screws 32a and 32b are provided may be the four corners of the control board 20 or the like, and are not particularly limited.

  As described above, in the wireless communication module 1 according to the fifth embodiment, the RF board 10 and the control board 20 are fixed by the screws 32a and 32b. Thereby, the connection strength can be increased as compared with the case where the RF board 10 and the control board 20 are connected only by the connectors 11 and 21.

[Sixth Embodiment]
The configuration of the wireless communication module 1 according to the sixth embodiment will be described below with reference to FIG. 11 only as to the differences from the first to fifth embodiments.

(Wireless communication module)
FIG. 11 is a schematic configuration diagram showing a configuration example of the wireless communication module 1 according to the sixth embodiment. The difference from the first embodiment is that the RF board 10 and the control board 20 are fixed by the locking supports 33a and 33b. The positions where the locking supports 33a and 33b are provided may be the four corners of the control board 20 or the like, and are not particularly limited.

  As described above, in the wireless communication module 1 according to the sixth embodiment, the RF board 10 and the control board 20 are fixed by the locking supports 33a and 33b. Thereby, the connection strength can be increased as compared with the case where the RF board 10 and the control board 20 are connected only by the connectors 11 and 21.

[Seventh Embodiment]
The configuration of the wireless communication module 1 according to the seventh embodiment will be described below with reference to FIG. 12 only as to differences from the first to sixth embodiments.

(Wireless communication module)
FIG. 12 is a schematic configuration diagram showing a configuration example of the wireless communication module 1 according to the seventh embodiment. The difference from the first embodiment is that inter-board connectors are provided at two locations. Specifically, the connector 11 is provided at the left end of the RF board 10, and the connector 15 is provided at the right end of the RF board 10. A connector 21 is provided at the left end of the control board 20, and a connector 25 is provided at the right end of the control board 20.

  As described above, in the wireless communication module 1 according to the seventh embodiment, the board-to-board connectors are provided at two locations. Thereby, the connection strength can be increased as compared with the case where the RF board 10 and the control board 20 are connected only by the connectors 11 and 21.

[Eighth Embodiment]
The configuration of the wireless communication module 1 according to the eighth embodiment will be described below with reference to FIGS. 13 to 14 only with respect to differences from the first to seventh embodiments.

(Wireless communication module)
According to the first embodiment, the inner substrate surface of the control substrate 20 may come into contact with the upper surface portion of the shield plate 120 of the RF circuit 12. That is, as shown in FIG. 13, since there is a small gap between the control board 20 and the RF circuit 12, when a load is applied to the wireless communication module 1, the RF circuit 12 and the RF circuit 12 on the inner board surface of the control board 20 are connected. The facing area E3 may come into contact with the RF circuit 12. Therefore, the wiring pattern is formed on the inner substrate surface of the control substrate 20 while avoiding the region E3.

  14A and 14B are schematic configuration diagrams showing a configuration example of the wireless communication module 1 according to the eighth embodiment. FIG. 14A is a schematic side view and FIG. 14B is a control board 20. It is a schematic plan view showing an inner substrate surface. In addition, FIGS. 14C and 14D are schematic enlarged cross-sectional views of a range indicated by a circle in FIG. As shown in this figure, convex portions 14 projecting toward the control board 20 are provided at four corners of the surface (upper surface portion) of the shield plate 120 that covers the RF circuit 12 and faces the control board 20. As a result, the parts other than the convex portion 14 do not come into contact with the control board 20. Therefore, as shown in FIG. 14C, the signal wiring pattern L1 can be formed in a region (a region other than the region E4) on the inner substrate surface of the control substrate 20 avoiding the convex portion 14. However, it is desirable that the ground wiring pattern L2 is formed in the region E4 that abuts the convex portion 14. By doing so, the shield plate 120 can be used as a ground.

  The protrusion 14 may be an elastically deformable spring, as shown in FIG. Such a spring may be formed integrally with the shield plate 120. The RF board 10 and the control board 20 are connected and fixed in a state where the convex portion 14 is bent. That is, when the RF board 10 and the control board 20 are connected, the convex portion 14 is in contact with the control board 20 in a bent state. As a result, even if the protrusion height of the protrusion 14 varies, the ground wiring pattern L2 of the control board 20 and the shield plate 120 can be reliably brought into contact with each other. In this case, since the control board 20 is pushed upward by the convex portion 14, a load may be applied to the connectors 11 and 21. Therefore, it is preferable to connect and fix the RF substrate 10 and the control substrate 20 at a plurality of locations, for example.

  As described above, in the wireless communication module 1 according to the eighth embodiment, the convex portions 14 are provided at the four corners of the surface of the shield plate 120 facing the control board 20. As a result, the parts other than the protrusions 14 do not come into contact with the control board 20, so that it is possible to expand the area where the signal wiring pattern L1 can be formed on the inner board surface of the control board 20.

  In addition, a ground wiring pattern L2 is formed in a region contacting the convex portion 14. As a result, the shield plate 120 is used as a ground, so that the area of the ground is increased and the circuit is stabilized. The convex portion 14 and the ground wiring pattern L2 (pad) of the control board 20 may be fixed with a conductive adhesive.

[Ninth Embodiment]
The configuration of the wireless communication module 1 according to the ninth embodiment will be described below with reference to FIG. 15 only as to differences from the first to eighth embodiments.

(Wireless communication module)
FIG. 15 is a schematic configuration diagram showing a configuration example of the wireless communication module 1 according to the ninth embodiment. The difference from the first embodiment is that the RF circuit 12 and the control board 20 are arranged upside down. That is, the RF board 10 and the control board 20 are arranged such that the board surface of the RF board 10 on which the RF circuit 12 is not mounted and the board surface of the control board 20 on which the microcomputer 22 is mounted face each other. ing. In this case, a spacer S is provided between the RF substrate 10 and the control substrate 20 in order to avoid contact between the microcomputer 22 and the inner substrate surface of the RF substrate 10. Of course, the height and shape of the spacer S can be changed as appropriate.

  As described above, in the wireless communication module 1 according to the ninth embodiment, the RF board is arranged so that the board surface on which the RF circuit 12 is not mounted and the board surface on which the microcomputer 22 is mounted face each other. 10 and a control board 20 are arranged. With such a configuration, as in the first embodiment, it is possible to reduce the size and realize the cost reduction while integrating the RF circuit 12 and the microcomputer 22. Of course, the same effects as those of the second to eighth embodiments can be obtained.

[Tenth Embodiment]
Hereinafter, the configuration of the wireless communication module 1 according to the tenth embodiment will be described with reference to FIGS. 16 to 18 only as to differences from the first to ninth embodiments.

(Wireless communication module)
A schematic plan configuration of the wireless communication module 1 according to the tenth embodiment is represented as shown in FIG. 16 (a), and a schematic side configuration thereof is represented as shown in FIG. 16 (b). . As shown in FIGS. 16A and 16B, the distance L10 between the RF substrate 10 and the control substrate 20 is in the region on the control substrate 20 where the RF substrate 10 and the control substrate 20 do not overlap each other. A connector 26 which is taller than the above is arranged. The connector 26 is for connecting to the outside. With such a configuration, the distance L10 between the RF substrate 10 and the control substrate 20 can be narrowed, so that the wireless communication module 1 can be downsized.

  When the connector 11 on the RF board 10 side and the connector 21 on the control board 20 side are connected, the RF board 10 and the control board 20 face each other. The RF circuit 12 is arranged between the RF board 10 and the control board 20, and the microcomputer 22 is arranged on the outer board surface of the control board 20. Further, the antenna 13, the connector 16 and the like are arranged on the inner substrate surface of the RF substrate 10 that protrudes to the right of the control substrate 20 in the drawing.

(RF board)
A schematic planar configuration of the RF substrate 10 shown in FIG. 16 is represented as shown in FIG. 17A, and a schematic side configuration thereof is represented as shown in FIG. 17B. As shown in FIGS. 17A and 17B, the RF circuit 12 is covered with a metal shield plate 120. Further, the convex portions 14a to 14e are provided at the four corners of the surface of the shield plate 120 facing the control board 20 and the substantially central portion of one side of the quadrangle formed by the four corners. Although the convex portions 14a to 14d may be provided only at the four corners, if the convex portion 14e is further provided at the substantially central portion of one side, it is possible to avoid the problem that the shield plate 120 is mounted in the wrong orientation.

  Further, as shown in FIGS. 17A and 17B, the antenna 13 is arranged in a region on the RF substrate 10 where the RF substrate 10 and the control substrate 20 do not overlap each other. Since the shield plate 120 is electrically connected to the ground of the RF substrate 10, if the antenna 13 and the shield plate 12 are brought too close to each other, the radio waves transmitted and received by the antenna 13 will be interfered and absorbed by the shield plate 120. .

  Therefore, the shield plates 120 are arranged with a distance L11 larger than a quarter of the wavelength λ of the radio wave transmitted and received by the antenna 13. For example, when the frequency band is the 920 MHz band, λ / 4 is about 0.75 cm, so the distance L11 between the antenna 13 and the shield plate 120 is slightly larger than 0.75 cm (for example, about 1 cm). It is desirable to do. In this way, the radio waves transmitted and received by the antenna 13 are less likely to interfere and be absorbed by the shield plate 120, so that the sensitivity of the antenna 13 can be prevented from deteriorating.

  Of course, as shown in FIG. 17A, electronic parts such as the connector 16 can be mounted in the upper region of the antenna 13. Further, it is possible to reduce the space for disposing the antenna 13 by bending the antenna 13 or attaching the coils C1 to C3 to the outside.

(Control board)
A schematic plan configuration of the control board 20 shown in FIG. 16 is represented as shown in FIG. 18A, and a schematic front configuration thereof is represented as shown in FIG. 18B, and its schematic side surface is shown. The configuration is represented as shown in FIG. As shown in FIGS. 18A, 18B, and 18C, the connector 26 includes a VDD pin P1, a TXD pin P2, an RXD pin P3, an RTS pin P4, a CTS pin P5, a GPIO pin P6, a GPIO pin P7, and a GND pin. Eight pins P1 to P8 are arranged in the order of P8. VDD pin P1 is a power supply voltage input pin, TXD pin P2 is an asynchronous data output pin, RXD pin P3 is an asynchronous data input pin, RTS pin P4 is an RTS (Ready to Send) control output pin, and CTS pin P5 is CTS (Clear). to Send) control input pins, GPIO pins P6 and P7 are user-settable input or output pins, and GND pin P8 is a ground pin. As shown in FIG. 18B, these eight pins P1 to P8 are arranged on the same plane parallel to the substrate surface 20a of the control substrate 20. Therefore, the height L12 of the connector 26 is suppressed, and the wireless communication module 1 can be downsized. In addition, since the input and the output are alternately arranged, for example, even when short-circuited with the adjacent pin, an unexpected current does not flow and it is safe.

  As described above, in the wireless communication module 1 according to the tenth embodiment, the RF board 10 and the control board 20 are provided in the area on the control board 20 where the RF board 10 and the control board 20 do not overlap. A connector 26 that is taller than the distance L10 between With such a configuration, the distance L10 between the RF substrate 10 and the control substrate 20 can be narrowed, so that the wireless communication module 1 can be downsized.

  Further, the connector 26 includes eight pins P1 to P8 arranged in order of VDD pin P1, TXD pin P2, RXD pin P3, RTS pin P4, CTS pin P5, GPIO pin P6, GPIO pin P7, and GND pin P8. Prepare These eight pins P1 to P8 are arranged on the same plane parallel to the substrate surface 20a of the control substrate 20. Therefore, the height L12 of the connector 14 is suppressed, and the wireless communication module 1 can be downsized.

  Further, the convex portions 14a to 14e are provided at the four corners of the surface of the shield plate 120 facing the control board 20 and the substantially central portion of one side of the quadrangle formed by the four corners. Therefore, it is possible to avoid the problem that the shield plate 120 is mounted in the wrong direction.

  Further, the shield plates 120 are arranged with a distance L11 larger than a quarter of the wavelength λ of the radio wave transmitted and received by the antenna 13. In this way, the radio waves transmitted and received by the antenna 13 are less likely to interfere and be absorbed by the shield plate 120, so that the sensitivity of the antenna 13 can be prevented from deteriorating.

  As described above, according to the present invention, the RF circuit 12 and the microcomputer 22 can be integrated, but the size can be reduced and the cost can be reduced. A photovoltaic system, an automatic actuation system, and a sensing device can be provided.

[Other Embodiments]
As described above, the present invention has been described by the first to tenth embodiments, but it is understood that the discussion and drawings forming a part of this disclosure are exemplifications and limit the present invention. should not do. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  As described above, the present invention includes various embodiments and the like not described here. For example, in FIG. 1 and the like, the entire RF board 10 is configured to overlap the control board 20, but the RF board 10 and the control board 20 may be configured to at least partially overlap.

  The wireless communication module according to the present invention can be applied to an LED lighting device, a solar power generation system, an automatic operation system, a detection device, and the like.

1 ... Wireless communication module 10 ... First substrate (RF substrate)
12 ... Wireless circuit (RF circuit)
11, 15 ... First connector (connector)
13 ... Antenna 14, 14a-14e ... Convex part 20 ... 2nd board | substrate (control board)
21, 25 ... Second connector (connector)
22 ... Signal processing circuit (microcomputer)
24 ... Third connector (connector)
26 ... Fourth connector (connector)
31 ... Adhesives 32a, 32b ... Screws 33a, 33b ... Locking support 120 ... Shield plate E2 ... Area near antenna E4 ... Area P1 abutting on convex part ... VDD pin P2 ... TXD pin P3 ... RXD pin P4 ... RTS pin P5 ... CTS pins P6, P7 ... GPIO pins P8 ... GND pins

Claims (18)

A first substrate having a front surface and a back surface;
A first circuit disposed on the surface of the first substrate for processing a radio signal;
An antenna arranged on the surface of the first substrate and electrically connected to the first circuit for transmitting and receiving radio waves;
A front surface and a back surface, at least a part of the back surface is opposed to the front surface of the first substrate, and the first circuit is viewed in a first directional view that is a vertical direction view of the front surface of the first substrate. A second substrate disposed to cover and expose the antenna;
A first conductive portion disposed between the front surface of the first substrate and the back surface of the second substrate so as to be electrically connected to the first circuit;
An electronic component disposed on the second substrate,
Equipped with
In the first direction view, the electronic component overlaps the first circuit,
Wireless module. A first substrate having a front surface and a back surface;
A first circuit disposed on the surface of the first substrate for processing a radio signal;
An antenna arranged on the surface of the first substrate and electrically connected to the first circuit for transmitting and receiving radio waves;
A front surface and a back surface, at least a part of the back surface is opposed to the front surface of the first substrate, and the first circuit is viewed in a first directional view that is a vertical direction view of the front surface of the first substrate. A second substrate disposed to cover and expose the antenna;
A first conductive portion disposed between the front surface of the first substrate and the back surface of the second substrate so as to be electrically connected to the first circuit;
Equipped with
The first substrate is a substrate made of a material having a higher dielectric constant than the second substrate,
Wireless module. The wireless module according to claim 1 , wherein the first circuit is disposed between the antenna and the first conductive portion when viewed in the first direction.   The wireless module according to any one of claims 1 to 3, wherein a center of the first circuit is separated from a center of the first substrate when viewed in the first direction.   The wireless module according to claim 1, wherein the antenna is separated from the second substrate when viewed in the first direction.   The wireless module according to claim 1, wherein the first circuit and the back surface of the second substrate are separated from each other. The first circuit includes a transmitter that performs a predetermined process for transmitting a signal from the antenna,
The wireless module according to claim 1, further comprising: a receiving unit that performs a predetermined process on a signal received by the antenna.   The wireless module according to claim 1, wherein the first circuit is covered with a metal shield plate. Further comprising an electronic component arranged on the second substrate,
  The wireless module according to claim 2, wherein the electronic component overlaps the first circuit when viewed in the first direction. The wireless module according to claim 3 , wherein the first substrate is a substrate made of a material having a higher dielectric constant than the second substrate. The wireless module according to claim 1 , further comprising a second circuit electrically connected to the first conductive portion and disposed on the second substrate, the second circuit processing the wireless signal. The wireless module according to claim 11 , wherein at least a part of the second circuit overlaps with the first circuit when viewed in the first direction. 13. The wireless module according to claim 12 , wherein the second circuit is arranged in a formation region of the first circuit in the first direction view. The wireless module according to claim 11 , wherein the second circuit is arranged so as to avoid an area near the antenna. An LED lighting device comprising the wireless module according to claim 1 . A photovoltaic power generation system comprising the wireless module according to claim 1 . The wireless module according to claim 1 , which is provided to receive a signal transmitted from the outside,
An automatic operation system, comprising: an operation unit that switches on / off a specific function based on a reception signal of the wireless module. A sensor that detects a predetermined state,
A detection device, comprising: the wireless module according to claim 1 , which is provided to wirelessly transmit a detection signal of the sensor.