JP6675272B2 - Cooling unit and method of manufacturing cooling unit - Google Patents

Description

  The present invention relates to a cooling unit and a method for manufacturing the cooling unit. In particular, the present invention relates to a cooling unit used in a semiconductor manufacturing apparatus and a method of manufacturing the cooling unit.

  In a manufacturing process of a semiconductor device such as an LSI or a memory, a thin film is formed and processed on a semiconductor substrate to form a functional element such as a transistor element, a wiring, a resistor, and a capacitor. As a method of forming a thin film on a semiconductor substrate, a chemical vapor deposition (CVD) method, a physical vapor deposition (PVD) method, an atomic layer deposition method (ALD; Atomic Layer Deposition) and the like are available. Is used. Further, as a method of processing the thin film, a method such as an ion reactive etching (RIE), a mechanical polishing (MP), and a chemical mechanical polishing (CMP) are used. In the process of manufacturing a semiconductor device, a surface treatment step such as a plasma treatment is performed in addition to the film formation and processing of a thin film.

  A semiconductor manufacturing apparatus used in the above-described film forming, processing, and surface treatment steps is provided with a stage for supporting a semiconductor substrate. The stage not only supports the semiconductor substrate but also has a function of adjusting the temperature of the semiconductor substrate according to each processing step. For example, the stage is provided with a cooling mechanism to adjust the temperature as described above. In particular, in the semiconductor manufacturing apparatus described above, a cooling mechanism (cooling unit) that cools the stage by circulating a liquid refrigerant is widely used.

  In the cooling unit described above, for example, as in Patent Document 1, the first platen member (lid member) and the second platen member (plate member) are joined in a region other than the groove serving as the flow path of the cooling water. Thus, a structure is disclosed in which the cooling water is prevented from leaking out of the cooling unit.

JP 2007-222965 A

  However, in the cooling unit disclosed in Patent Document 1, the first platen member (lid member) and the second platen member (plate member) are arranged along the region other than the groove from above the first platen member (lid member). However, since the position of the groove is not known from above the first platen member (lid member), it has been difficult to accurately perform the bonding process in a region other than the groove. Alternatively, in Patent Literature 1, in order to accurately perform a joining process on a region other than the groove, it is troublesome to add a marker or the like to a portion where the joining process is to be performed in advance.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a cooling unit having good workability in a joining process between a plate member and a lid member.

  A cooling unit according to an embodiment of the present invention is a cooling unit in which a lid member is joined to a plate member, and the plate member has a flat portion facing the lid member, and a flat portion extending from the flat portion to the inside of the plate member. A groove protruding outward from the plate member from the flat portion, and an opening is provided in the lid member at a position corresponding to the protrusion, and a side wall of the protrusion is provided. A mixed layer of the plate member and the lid member exists between the inner wall of the opening and the inner wall of the opening.

  In addition, the lid member may further include a first water-resistant coating disposed on the flat portion and the groove portion, and a second water-resistant coating disposed on a surface of the lid member facing the flat portion and the groove portion.

  Further, the plate member and the lid member may be made of the same material.

  Further, the plate member and the lid member may be a metal containing aluminum.

  Further, the side wall of the protrusion and the inner wall of the opening may be in contact with each other.

  Further, the plate member is provided with a through hole penetrating from the first surface of the projection exposed from the lid member to the second surface of the plate member opposite to the projection at the position where the projection is arranged. May be.

  Further, three or more protrusions provided with the through holes may be provided, and the protrusions may be arranged such that the center of the plate member is included inside a polygon formed by the plurality of protrusions.

  A method of manufacturing a cooling unit according to an embodiment of the present invention is a method of manufacturing a cooling unit in which a lid member is joined to a plate member, wherein the flat portion facing the lid member, the flat portion is placed inside the plate member. A plate member having a groove recessed toward the outside and a protrusion protruding from the flat portion toward the outside of the plate member is prepared, a lid member provided with an opening is prepared, and the protrusion is fitted inside the opening. The plate member and the lid member are arranged so as to be joined, and the side wall of the protrusion and the inner wall of the opening are joined by friction stir welding.

  ADVANTAGE OF THE INVENTION According to the cooling unit which concerns on this invention, the workability | operativity in the joining process of a plate member and a lid member can be provided with favorable operability.

FIG. 2 is a top view illustrating the entire configuration of the cooling unit according to the embodiment of the present invention. FIG. 2 is a sectional view taken along line A-A ′ of FIG. 1. It is a top view showing the composition of the plate member concerning one embodiment of the present invention. FIG. 4 is a sectional view taken along line B-B ′ of FIG. 3. It is a top view showing the composition of the lid member concerning one embodiment of the present invention. FIG. 6 is a sectional view taken along line C-C ′ of FIG. 5. It is the elements on larger scale of the sectional view of the cooling unit concerning one embodiment of the present invention. It is a sectional view of a cooling unit concerning one embodiment of the present invention. It is a sectional view showing an example of application of a penetration hole in a cooling unit concerning one embodiment of the present invention. FIG. 2 is a top view illustrating the entire configuration of the cooling unit according to the embodiment of the present invention. It is a top view which shows the whole structure of the cooling unit which concerns on the modification of one Embodiment of this invention.

  Hereinafter, a cooling unit according to the present invention will be described with reference to the drawings. However, the cooling unit of the present invention can be implemented in many different modes, and should not be construed as being limited to the description of the embodiments below. Note that in the drawings referred to in this embodiment, the same portions or portions having similar functions are denoted by the same reference numerals, and description thereof will not be repeated. In addition, for convenience of description, the description will be made using the terms “upper” or “lower”, but the upper or lower indicates the direction when the cooling unit is used (when the apparatus is mounted), respectively. In addition, in order to make the description clearer, the width, thickness, shape, and the like of each part may be schematically illustrated as compared with actual embodiments, but this is merely an example, and the interpretation of the present invention is not limited thereto. It is not limited.

<First embodiment>
The overall configuration of the cooling unit according to the first embodiment of the present invention will be described with reference to FIGS. The cooling unit according to the first embodiment of the present invention can be used for a CVD device, a sputtering device, a vapor deposition device, an etching device, a plasma processing device, a polishing device, a measuring device, an inspection device, a microscope, and the like. However, the cooling unit according to the first embodiment is not limited to the one used for the above-described device, and can be used for a device that needs to cool the substrate.

[Configuration of cooling unit 10]
FIG. 1 is a top view showing the overall configuration of the cooling unit according to one embodiment of the present invention. FIG. 2 is a sectional view taken along line AA ′ of FIG. Further, as shown in FIGS. 1 and 2, the cooling unit 10 according to the first embodiment has a plate member 100 and a lid member 200. The plate member 100 has a flat portion 105 facing the lid member 200, a groove 110 recessed from the flat portion 105 toward the inside of the plate member 100, and a protrusion 140 projecting from the flat portion 105 toward the outside of the plate member 100. , 150. An opening 210 is provided in the lid member 200 at a position corresponding to the protrusion 140. The plate member 100 and the lid member 200 are joined to each other at a contact portion between the side wall 142 of the protrusion 140 and the inner wall 212 of the opening 210 and a contact portion between the side wall 152 of the protrusion 150 and the outer peripheral wall 214 of the cover member 200. Have been. The lid member 200 is surrounded by a protrusion 150 provided on the outer periphery of the plate member 100. Here, the protrusions 140-1 to 140-5 are simply referred to as the protrusions 140 unless otherwise distinguished. Similarly, when the openings 210-1 to 210-5 are not particularly distinguished, they are simply referred to as openings 210.

  In FIG. 2, the side wall 142 of the protrusion 140 is joined to the inner wall 212 of the opening 210, and the side wall 152 of the protrusion 150 is joined to the outer side wall 214 of the lid member 200. On the other hand, the flat portion 105 and the lower surface of the lid member 200 are in mechanical contact with each other, but are not joined.

  In addition, the upper surface of the protruding portion 140 and the upper surface of the lid member 200 are aligned, that is, the structure in which both surfaces are positioned is exemplified, but the present invention is not limited to this structure. For example, the upper surface of the protruding portion 140 may protrude above the upper surface of the lid member 200, and conversely, the upper surface of the lid member 200 may protrude above the upper surface of the protruding portion 140. Water can be used as the coolant flowing through the flow path formed by the groove 110 and the lid member 200, but other cooling liquids such as liquid nitrogen and liquid helium can also be used.

  FIG. 2 illustrates a configuration in which the flat portion 105 and the lower surface of the lid member 200 are not joined, but the configuration is not limited to this. For example, the flat portion 105 and the lower surface of the lid member 200 may be joined or bonded in an auxiliary manner. Further, the flat portion 105 and the lower surface of the lid member 200 need not be in contact with each other. That is, the flat portion 105 and the lower surface of the lid member 200 may be separated from each other. FIG. 2 illustrates a structure in which the side wall 142 and the inner wall 212 are in direct contact with each other, but the present invention is not limited to this structure.

  Here, the structure of each of the plate member 100 and the lid member 200 will be described in detail with reference to FIGS. FIG. 3 is a top view showing the configuration of the plate member according to one embodiment of the present invention. FIG. 4 is a sectional view taken along the line B-B 'of FIG. FIG. 5 is a top view showing the configuration of the lid member according to one embodiment of the present invention. FIG. 6 is a sectional view taken along line C-C ′ of FIG.

  As shown in FIG. 3, the groove 110 is connected to the external connection parts 120 and 130 at both ends. The cooling liquid introduced from one of the external connection parts 120 and 130 passes through the groove 110 and is discharged to the outside from the other of the external connection parts 120 and 130. The external connection portion 120 is provided near the outer periphery of the plate member 100, and the external connection portion 130 is provided near the center of the plate member 100. The groove 110 is spirally arranged from the external connection 120 to the external connection 130. The positions of the external connection portions 120 and 130 and the shape of the groove 110 may take various forms as described later.

  As shown in FIG. 4, the groove 110 has a rectangular cross-sectional shape, and is recessed from the flat portion 105 in the inside of the plate member 100. The width of the groove 110 may be 1 mm or more and 20 mm or less, and the depth of the groove 110 may be 1 mm or more and 30 mm or less. FIG. 4 shows an example in which the cross-sectional shape of the groove 110 is rectangular, but the present invention is not limited to this cross-sectional shape. For example, the bottom of the groove 110 may have a curved shape, or may have a tapered shape in which the diameter of the groove 110 gradually widens or narrows from the inside of the plate member 100 toward the lid member 200.

  As shown in FIG. 3, the protruding portion 140 is disposed at a central portion (protruding portion 140-1) of the plate member 100 and at a position separated from the central portion in four directions (protruding portions 140-2 to 140-5). . The protrusions 140-2 to 140-5 are arranged between adjacent arcs of the spiral groove 110. The protrusion 150 is provided on the outer periphery of the plate member 100. That is, on the upper surface side of the plate member 100, the area excluding the groove 110 and the protrusions 140 and 150 is the plane part 105. Although FIG. 3 illustrates a configuration in which five protruding portions 140 are arranged, the configuration is not limited to this configuration and may be less than five or more than five. Further, as described later, the protrusion 140 may not be arranged at the center of the plate member 100.

  As shown in FIG. 4, the protruding portions 140 and 150 have a rectangular cross-sectional shape, and protrude from the flat portion 105 to the outside of the plate member 100. The width of the protrusion 140 can be 1 mm or more and 30 mm or less, and the height of the protrusion 140 can be 0.5 mm or more and 20 mm or less. Similarly, the width of the protrusion 150 may be 1 mm or more and 30 mm or less, and the height of the protrusion 150 may be 0.5 mm or more and 30 mm or less. The protrusions 140 and 150 are part of the plate member 100. That is, the plate member 100 and the protrusions 140 and 150 are integrally formed. However, the protrusions 140 and 150 of a member different from the plate member 100 may be connected to the upper surface of the flat portion 105 of the plate member 100. FIG. 4 shows an example in which the cross-sectional shape of the protrusions 140 and 150 is rectangular, but the present invention is not limited to this cross-sectional shape. For example, a tapered shape in which the diameters of the protrusions 140 and 150 gradually decrease from the inside to the outside of the plate member 100 may be used. When the cross-sectional shapes of the protrusions 140 and 150 are tapered, the cross-sectional shapes of the opening 210 and the outer peripheral side wall 214 of the lid member 200 may be tapered corresponding to the cross-sectional shapes of the protrusions 140 and 150.

  As shown in FIG. 5, the lid member 200 has a disk shape, and openings 210-1 to 210-5 are provided inside the lid member 200 at positions corresponding to the protrusions 140-1 to 140-5. The outer diameter (outer peripheral side wall 214) of the lid member 200 substantially matches the inner diameter of the protrusion 150. That is, the lid member 200 overlaps the plane portion 105 and the groove portion 110 of the plate member 100 in a plan view. The lid member 200 is installed on the plate member 100 by fitting the protrusions 140 and 150 with the opening 210 and the outer peripheral side wall 214. Here, in order to prevent the lid member 200 from floating from the plate member 100, for example, three or more protrusions 140 are provided, and the plate member 100 is provided inside a polygon formed by the plurality of protrusions 140. The plurality of protrusions 140 can be arranged so as to include the center.

  Although FIG. 4 illustrates a structure in which the side wall of the opening 210 is perpendicular to the main surface of the lid member 200, the present invention is not limited to this structure, and the shape is appropriately changed according to the shapes of the protrusions 140 and 150. be able to.

[Method of joining plate member 100 and lid member 200]
The joint between the side wall 142 of the protrusion 140 and the inner wall 212 of the opening 210 and the joint between the side wall 152 of the protrusion 150 and the outer peripheral side wall 214 of the lid member 200 are methods such as friction stir welding (FSW). Can be used. FSW is a method in which a tool having a protrusion (probe) at the tip is pressed into a joint while rotating, and the material softened by frictional heat is stirred (plasticized fluidization) and joined. Here, the layer joined by the FSW is referred to as a mixed layer.

  As described above, first, the plate member 100 and the lid member 200 are prepared. Here, the plate member 100 has a flat portion 105 facing the lid member 200, a groove 110 recessed from the flat portion 105 toward the inside of the plate member 100, and protruding from the flat portion 105 toward the outside of the plate member 100. A protrusion 140 is provided. Further, an opening 210 is provided in the lid member 200. Next, the plate member 100 and the lid member 200 are arranged so that the protrusion 140 is fitted into the opening 210. In other words, the plate member 100 and the lid member 200 are arranged such that the protrusion 140 enters the inside of the opening 210. Then, the cooling unit is completed by joining the side wall of the protrusion 140 and the inner wall of the opening 210 by FSW.

  By joining using FSW, joining is performed in a solid phase near the boundary between the side wall of the projection 140 and the inner wall of the opening 210, and a mixed layer of the material of the plate member 100 and the material of the lid member 200 is formed. You. That is, a mixed layer of the plate member 100 and the lid member 200 exists between the side wall of the protrusion 140 and the inner wall of the opening 210. Here, since the FSW is processed from the direction in which the protrusion 140 and the lid member 200 are exposed upward, the region to be joined can be visually recognized.

[Material of each component of cooling unit 10]
Hereinafter, the material of each component of the cooling unit 10 will be described. As the plate member 100, a material such as aluminum (Al), titanium (Ti), a metal mainly containing Al, a metal mainly containing Ti, and stainless steel (SUS) can be used. Similarly, as the lid member 200, similarly to the plate member 100, a material such as Al, Ti, a metal mainly containing Al, a metal mainly containing Ti, and SUS can be used. The same material can be used for the plate member 100 and the lid member 200. However, the plate member 100 and the lid member 200 may use different materials.

  As described above, according to the cooling unit 10 of the first embodiment, the side wall 142 of the protrusion 140 and the inner wall 212 of the opening 210 are joined, and the side wall 152 of the protrusion 150 and the outer side wall 214 of the lid member 200 are connected. By joining, the joining region between the protruding portion 140 and the lid member 200 can be visually recognized, so that the workability in the joining process between the plate member 100 and the lid member 200 can be improved. In addition, since the joint is provided at a position away from the flow path formed by the groove 110 and the lid member 200, it is possible to make it difficult for the cooling water to reach the joint when, for example, flowing the cooling water. As a result, it is possible to suppress problems such as corrosion of the joint due to cooling water. Alternatively, even when the cooling water reaches the joining portion, the cooling water stays in the vicinity of the joining portion, so that the progress of corrosion or the like of the joining portion due to the cooling water can be suppressed.

  Further, by using the same material for the plate member 100 and the lid member 200, a joint having higher strength can be obtained, and the occurrence of electrolytic corrosion (corrosion of the metal material) due to the difference in hydrogen ion concentration can be suppressed. be able to. Further, by using a metal containing Al as the plate member 100 and the lid member 200, the thermal conductivity of the entire cooling unit 10 can be increased, and the cooling efficiency can be improved. Further, by disposing the plurality of protrusions 140 such that the center of the plate member 100 is included inside the polygon formed by the plurality of protrusions 140, the lid member 200 floats from the plate member 100. This can suppress the cooling liquid from leaking out of the cooling unit 10.

<Second embodiment>
A cooling unit according to a second embodiment of the present invention will be described with reference to FIG. The cooling unit according to the second embodiment of the present invention can be used for a CVD device, a sputtering device, a vapor deposition device, an etching device, a plasma processing device, a polishing device, a measuring device, an inspection device, a microscope, and the like. However, the cooling unit according to the second embodiment is not limited to the one used for the above-described device, and can be used for a device that needs to cool the substrate.

First, the process leading to the invention of the cooling unit according to the second embodiment will be described. In recent years, in order to realize an inexpensive cooling unit in a cooling unit, it has been required to use a metal mainly composed of Al as a material of the cooling unit and use inexpensive water as a refrigerant. Since Al is a chemically active metal, corrosion (rust) proceeds when exposed to water. Therefore, when Al is used as the material of the cooling unit, a structure is adopted in which the surface of Al is subjected to alumite treatment to form an aluminum oxide (Al ₂ O ₃ ) film so that Al is not exposed to the area in contact with the cooling water. Have been.

For example, when the joining process between the first base plate member (lid member) and the second base plate member (plate member) is performed in a structure as shown in Patent Literature 1, heat generated by the joining process is generated in the cooling water flow path. The Al ₂ O ₃ film formed on the inner surface of the flow path is peeled off to the area corresponding to the inner surface (the groove portion and the lower surface of the first platen member (lid member) corresponding to the groove portion). If the Al ₂ O ₃ coating on the inner surface of the flow path is peeled off, the corrosion resistance of the area is reduced, and the inner surface of the flow path is corroded (rusted).

  The cooling unit according to the second embodiment has been made in view of the above problems, and has an object to provide a cooling unit having high corrosion resistance to cooling water in a cooling unit using Al as a member. .

  FIG. 7 is a partially enlarged view of a cross-sectional view of the cooling unit according to the embodiment of the present invention. As shown in FIG. 7, the cooling unit 10A according to the second embodiment has a plate member 100A, a lid member 200A, a first water-resistant coating 310A, and a second water-resistant coating 320A. The plate member 100A has a flat portion 105A facing the lid member 200A, a groove 110A recessed from the flat portion 105A toward the inside of the plate member 100A, and a protrusion 140A protruding from the flat portion 105A toward the outside of the plate member 100A. , 150A. An opening 210A is provided in the lid member 200A at a position corresponding to the protrusion 140A.

  The first water-resistant coating 310A is disposed on the plane portion 105A and the groove 110A. Specifically, the first water-resistant coating 310A is disposed over the entire area of the plane portion 105A. In other words, the first water-resistant coating 310A covers the plane portion 105A. The second water-resistant coating 320A is disposed on the surface of the lid member 200A facing the flat portion 105A and the groove 110A. The second water-resistant coating 320A is disposed on the entire lower surface of the lid member 200A. In other words, the second water-resistant coating 320A covers the lower surface of the lid member 200A. Here, a water-resistant coating is not formed on the side wall 142A of the protrusion 140A, the inner wall 212A of the opening 210A, the side wall 152A of the protrusion 150A, and the outer peripheral side wall 214A of the lid member 200A. That is, the side wall 142A is in contact with the inner wall 212A, and the side wall 152A is in contact with the outer peripheral side wall 214A.

As the first water-resistant coating 310A and the second water-resistant coating 320A, for example, an Al ₂ O ₃ film can be used. The Al ₂ O ₃ film can be formed by, for example, alumite treatment or thermal spraying treatment. Here, in addition to the Al ₂ O ₃ film, a film such as an yttria (Y ₂ O ₃ ) film, a zirconia (ZrO ₂ ) film, and a nickel (Ni) film can be used as the water-resistant film.

  In FIG. 7, the plate member 100A and the lid member 200A are joined to each other at a contact portion between the side wall 142A and the inner wall 212A and a contact portion between the side wall 152A and the outer peripheral side wall 214A. On the other hand, the first waterproof coating 310A disposed on the upper surface of the flat portion 105A and the second waterproof coating 320A disposed on the lower surface of the lid member 200A are in mechanical contact with each other, but are not joined. . However, the flat portion 105A and the lower surface of the lid member 200A may be additionally joined or bonded. Also, the flat portion 105A and the lower surface of the lid member 200A need not be in contact with each other. That is, the flat portion 105A and the lower surface of the lid member 200A may be separated from each other. FIG. 7 illustrates the structure in which the side wall 142A and the inner wall 212A are in direct contact with each other, but the present invention is not limited to this structure.

  As described above, according to the cooling unit 10A of the second embodiment, between the lower surface of the groove portion 110A and the lower surface of the lid member 200A in the region where the cooling water flows, and the upper surface of the unbonded flat portion 105A and the lower surface of the lid member 200A. Since the first water-resistant coating 310A and the second water-resistant coating 320A are disposed on the first and second substrates, respectively, it is possible to suppress the cooling water from directly contacting the plate member 100A and the lid member 200A. As a result, corrosion of the plate member 100A and the lid member 200A can be suppressed. The plate member 100A and the lid member 200A are joined at a contact portion between the side wall 142A and the inner wall 212A and a contact portion between the side wall 152A and the outer peripheral side wall 214A. That is, since the plate member 100A and the lid member 200A are joined at a position distant from the cooling water flow path, the heat generated by the joining process causes the first water-resistant coating 310A and the (2) Since the water-resistant coating is less likely to be transmitted to the area where the water-resistant coating 320A is arranged, it is possible to suppress the water-resistant coating formed in the area where the cooling water flows from coming off.

<Third embodiment>
A cooling unit according to a third embodiment of the present invention will be described with reference to FIGS. The cooling unit according to the third embodiment of the present invention can be used for a CVD device, a sputtering device, a vapor deposition device, an etching device, a plasma processing device, a polishing device, a measuring device, an inspection device, a microscope, and the like. However, the cooling unit according to the third embodiment is not limited to the one used for the above device, and can be used for a device that needs to cool the substrate.

  FIG. 8 is a sectional view of a cooling unit according to an embodiment of the present invention. As shown in FIG. 8, the cooling unit 10B according to the third embodiment has a plate member 100B and a lid member 200B, similarly to the cooling unit 10 shown in FIG. The plate member 100B includes a flat portion 105B facing the lid member 200B, a groove 110B recessed from the flat portion 105B toward the inside of the plate member 100B, and a protruding portion 140B protruding from the flat portion 105B toward the outside of the plate member 100B. , 150B. The plate member 100B is provided with a through hole 400B at a position where the protrusion 140B is arranged. The through hole 400B penetrates from the first surface 146B (upper surface) of the protrusion 140B exposed from the lid member 200B to the second surface 106B (lower surface) of the plate member 100B opposite to the protrusion 140B.

  FIG. 9 is a cross-sectional view illustrating an application example of a through hole in a cooling unit according to an embodiment of the present invention. For example, when a transistor or the like is formed on the silicon wafer 500B, lift pins 510B are used to lift up / lift off the silicon wafer 500B in moving the silicon wafer 500B between the robot arm that transports the silicon wafer 500B and the cooling unit 10B. is necessary. The example shown in FIG. 9 is a mechanism for lifting and lowering the lift pins 510B via the through holes 400B. The diameter of the through hole 400B is larger than the diameter of the lift pin 510B.

  8 and 9, the first water-resistant coating 310A and the second water-resistant coating 320A shown in FIG. 7 may be applied.

  As described above, according to the cooling unit 10B of the third embodiment, the plate member 100B and the protrusion 140B are continuous, and the through hole 400B penetrates the plate member 100B and the protrusion 140B. It can be separated from the water flow path. Therefore, it is possible to suppress the cooling water from leaking out of the cooling unit 10B through the through hole 400B.

<Fourth embodiment>
A cooling unit according to a fourth embodiment of the present invention and modifications thereof will be described with reference to FIGS. 10 and 11. The cooling unit according to the fourth embodiment of the present invention can be used for a CVD device, a sputtering device, a vapor deposition device, an etching device, a plasma processing device, a polishing device, a measuring device, an inspection device, a microscope, and the like. However, the cooling unit according to the fourth embodiment is not limited to the one used for the above-described device, and can be used for a device that needs to cool the substrate. The structure of the cooling unit according to the first to third embodiments can be used for the cooling unit according to the fourth embodiment. In the cooling unit according to the fourth embodiment, the planar shapes of the plate member and the lid member are different from those of the cooling units according to the first to third embodiments. Therefore, in the fourth embodiment, only the planar shape will be described. .

  FIG. 10 is a top view showing the overall configuration of the cooling unit according to one embodiment of the present invention. Comparing the cooling unit 10C shown in FIG. 10 with the cooling unit 10 shown in FIG. 1, the cooling unit 10C has a projection 140C and an opening 210C (hereinafter referred to as a joint) arranged at a center position 230C of the plate member 100C. This is different from the cooling unit 10 in that it is not provided. As shown in FIG. 10, the joining part does not necessarily have to be arranged at the center position 230C of the plate member 100C. However, when the joint is not disposed at the center position 230C, it is preferable to provide three or more joints, and each joint is formed so that the center 230C is included inside the polygon formed by the plurality of joints. Can be arranged. By doing so, it is possible to prevent the lid member 200C from floating from the plate member 100C.

  FIG. 11 is a top view illustrating the overall configuration of a cooling unit according to a modification of the embodiment of the present invention. Comparing the cooling unit 10D shown in FIG. 11 with the cooling unit 10 shown in FIG. 1, it differs from the cooling unit 10 in that the planar shape of the groove 110D is different. As shown in FIG. 11, both external connection parts 120D and 130D are provided near the outer periphery of plate member 100D. The groove 110D is spirally arranged from the external connection part 120D to the folded part 160D near the center of the plate member 100D, is folded at the folded part 160D, and is spirally formed from the folded part 160D to the external connection part 130D. Are located in

  Cooling water is introduced into the flow path from the inlet, flows on the plane of the plate member, and is discharged at the outlet.However, due to heat exchange with the surroundings, the temperature of the cooling water near the outlet is lower than the temperature of the cooling water near the inlet. Will be expensive. However, according to the shape of the groove 110D shown in FIG. 11, the inlet and the outlet of the cooling water are both arranged near the outer periphery of the plate member 100D, and the groove 110D is folded near the center of the plate member 100D, so that the inlet Variations in cooling efficiency due to the temperature difference between the vicinity of the cooling water and the vicinity of the outlet can be suppressed.

  The present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the gist.

10: Cooling unit 100: Plate member 105: Flat portion 106: Second surface 110: Groove portions 120, 130: External connection portions 140, 150: Projection portions 142, 152: Side wall 146: First surface 160: Folded portion 200: Lid Member 210: Opening 212: Inner wall 214: Outer side wall 230: Center position 310: First water resistant coating 320: Second water resistant coating 400: Through hole 500: Silicon wafer 510: Lift pin

Claims (8)

A cooling unit in which a lid member is joined to a plate member,
The plate member,
A flat portion facing the lid member,
From the plane portion, a groove recessed toward the inside of the plate member,
A projecting portion projecting from the flat portion toward the outside of the plate member;
Has,
An opening is provided in the lid member at a position corresponding to the protrusion,
There is a mixed layer of the plate member and the lid member between the side wall of the protrusion and the inner wall of the opening ,
Three or more protrusions are provided,
The cooling unit , wherein the center of the plate is included inside a polygon formed by the plurality of protrusions . A first water-resistant coating disposed on the plane portion and the groove;
In the lid member, a second water-resistant coating disposed on a surface facing the flat portion and the groove portion,
The cooling unit according to claim 1, further comprising:   The cooling unit according to claim 2, wherein the plate member and the lid member are made of the same material.   The cooling unit according to claim 3, wherein the plate member and the lid member are made of a metal including aluminum.   The cooling unit according to claim 2, wherein a side wall of the protrusion and an inner wall of the opening are in contact with each other.   The plate member has a penetrating portion penetrating from a first surface of the projecting portion exposed from the lid member to a second surface of the plate member opposite to the projecting portion at a position where the projecting portion is arranged. The cooling unit according to claim 1, wherein a hole is provided. A method for manufacturing a cooling unit in which a lid member is joined to a plate member,
Prepare the plate member having a flat portion facing the lid member, a groove recessed from the flat portion toward the inside of the plate member, and a protrusion protruding from the flat portion toward the outside of the plate member. ,
Prepare the lid member provided with an opening,
Arranging the plate member and the lid member such that the protrusion is fitted inside the opening,
Joining the side wall of the protrusion and the inner wall of the opening by friction stir welding ,
Three or more protrusions are provided,
A method of manufacturing a cooling unit , wherein a center of the plate is included inside a polygon formed by the plurality of protrusions . The plate member has a penetrating portion penetrating from a first surface of the projecting portion exposed from the lid member to a second surface of the plate member opposite to the projecting portion at a position where the projecting portion is arranged. The method according to claim 7, wherein holes are provided.

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