JP6671891B2 - Electronic component test equipment, electronic component test method - Google Patents

Description

  The present invention relates to an electronic component test apparatus and an electronic component test method for quickly determining whether a defective product is mixed in an electronic component.

  With the information society in recent years, electric devices such as personal computers, smartphones, and wearable terminals have become widespread. Various electronic components such as capacitors, inductors, and resistors are used in electrical devices, and the performance of the same type of electronic components varies depending on the application. For example, capacitors are widely used for smoothing power supply circuits for smartphones and various electrical devices, or for noise reduction circuits, etc. Products having various withstand voltages and large and small withstand voltages have been commercialized.

  Electronic components are being mass-produced due to the spread of electrical equipment, but on the other hand, testing methods of electronic components to guarantee the quality of electronic components are still fumbled, and electronic components are currently in excess. It is commercialized in a state of quality. That is, a quality test of a mass-produced product is usually performed by extracting a predetermined number of products from all products and only for the extracted products. However, in the case of electronic components, a test method has not been established, and at present, individual inspection is performed for all products in order to reduce the defective product rate.

In view of the above, Japanese Patent Application Laid-Open No. H11-163873 discloses a technique in which a plurality of capacitors are connected in parallel to perform an inspection at the same time in order to shorten the inspection time of the insulation resistance of the capacitor. That is, a test resistor was connected in series to each of a plurality of capacitors connected in parallel, a voltage was simultaneously applied to the plurality of capacitors and the test resistor, and the voltage across each test resistor was measured. The insulation resistance of each of a plurality of capacitors is obtained from the voltage between both ends, and the inspection is performed.
However, in the technique described in Patent Document 1, in order to obtain the insulation resistance of each of the plurality of capacitors, it is necessary to measure the voltage across the test resistors connected in series with the plurality of capacitors. Then, even though a plurality of capacitors are inspected at the same time, there is no difference from the case where the inspection is performed individually.

Further, Patent Literature 2 discloses a technique for inspecting a plurality of electronic components mounted on a printed circuit board or the like at a time. That is, for a circuit on a printed circuit board to which a plurality of electronic components are electrically connected, a signal output from the circuit in response to the input of the inspection signal is received, and the received signal is compared with a reference signal to generate a plurality of signals. The quality of the electronic component is determined.
However, the technique described in Patent Document 2 includes not only inspection of a plurality of electronic components on a printed board but also inspection of a circuit on the printed board. For example, even when electronic components are not properly mounted on a printed circuit board, a signal output from a circuit is considered to be different from a reference signal, and the technique described in Patent Document 2 does not necessarily require a plurality of electronic components. It was not intended for testing.

JP 2011-112852 A JP 2001-264398 A

  An object of the present invention is to provide an electronic component test apparatus and an electronic component test method for quickly determining whether a defective product is mixed in an electronic component. The electronic component test apparatus and the electronic component test method of the present invention supply a current or a voltage having a predetermined impulse waveform to a first circuit including a plurality of electronic components, and generate a current or a voltage waveform that flows through the first circuit. In addition, the presence or absence of a defective product in an electronic component is determined at a high speed.

  An electronic component test apparatus according to the present invention is configured by electrically connecting an arrayed test target electronic component, which is a plurality of test target electronic components, and an arrayed test target electronic component. A first power supply unit that supplies a first impulse waveform that is a current or voltage having a predetermined impulse waveform to one circuit, and detects a first detection waveform that is a current or voltage waveform flowing to the first circuit by supplying the first impulse waveform A first detection unit, and a first circuit, which is the same circuit as a first circuit configured by electrically connecting normal electronic components of the same type as a plurality of electronic components that supply the first impulse waveform at the first power supply unit. A first reference waveform holding unit that holds a first reference waveform that is a current or voltage waveform to be detected by the first detection unit when the first impulse waveform is supplied to one reference circuit; A first detected waveform and the first reference waveform and compared to the test target electronic component first determination unit determines faulty or products are mixed in the issued, characterized in that it has a.

  Further, the electronic component test method of the present invention is configured by arranging and arranging a plurality of electronic components to be tested, which are the electronic components to be tested, and electrically connecting the arranged electronic components to be tested. A first circuit configuration step of configuring a first circuit, a first impulse waveform supply step of supplying a first impulse waveform that is a current or voltage of a predetermined impulse waveform to the first circuit, and a supply of the first impulse waveform. A first detection step of detecting a first detection waveform that is a current or voltage waveform flowing in the first circuit, and supplying a first detection waveform detected by the first detection unit and a first impulse waveform by the first power supply unit When a first impulse waveform is supplied to a first reference circuit, which is the same circuit as a first circuit configured by electrically connecting a plurality of electronic components to the same type of normal electronic components, the first detection is performed. A first reference waveform, which is a current or voltage waveform to be detected by the unit, to determine whether a defective product is mixed in the electronic component to be tested. .

  By using the electronic component test apparatus and the electronic component test method of the present invention, it is possible to quickly determine whether a defective product is mixed in the electronic component.

Functional block diagram showing an example of an electronic component test apparatus according to the first embodiment. FIG. 2 is a circuit diagram illustrating an example of a configuration of a first circuit of the electronic component test apparatus according to the first embodiment. The figure which shows an example of the circuit structure for supplying a 1st impulse waveform FIG. 3 is a diagram illustrating an outline of a first detection waveform detected by a first detection unit of the electronic component test apparatus according to the first embodiment. FIG. 4 is a diagram illustrating a determination example in a first determination unit of the electronic component test device of the first embodiment. The figure which shows the detail of the example of a determination in the 1st determination part of the electronic component test apparatus of Embodiment 1. FIG. 4 is a diagram showing an example of a processing flow of an electronic component test method using the electronic component test apparatus of the first embodiment. Functional block diagram illustrating an example of an electronic component test apparatus according to a second embodiment. FIG. 4 is a circuit diagram showing a configuration example of a second circuit of the electronic component test device of the second embodiment. The figure which shows the example of a process in the defective product mixing area calculation part of the electronic component test apparatus of Embodiment 2. The figure which shows another example of a process in the defective product mixing area calculation part of the electronic component test apparatus of Embodiment 2. The figure which shows another example of a process in the defective product mixing area calculation part of the electronic component test apparatus of Embodiment 2. The figure which shows an example of the flow of a process of the test method of the electronic component in the electronic component test apparatus of Embodiment 2. Functional block diagram illustrating an example of an electronic component test apparatus according to a third embodiment. The figure which shows an example of a structure of the 1st bridge circuit of the electronic component test apparatus of Embodiment 3. The figure which shows an example of the electronic component test method using the electronic component test apparatus of Embodiment 3. Functional block diagram illustrating an example of an electronic component test apparatus according to a fourth embodiment. 14 shows an example of a first bridge circuit of the electronic component test apparatus of Embodiment 4. The figure which shows an example of the flow of the process of the test method of the electronic component using the electronic component test apparatus of Embodiment 4.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The mutual relationship between the embodiment and the claims is as follows. The first embodiment mainly relates to claims 1, 6, 7, 9, 14, 15, and the like. The second embodiment mainly relates to claims 2-7, 10-15, and the like. Embodiments 3 and 4 mainly relate to claims 8 and 16. It should be noted that the present invention is not limited to these embodiments and the description of the drawings at all, and can be carried out in various modes without departing from the gist thereof.
<< First Embodiment >>
<Overview>

The present embodiment relates to an electronic component test apparatus and an electronic component test method for quickly determining whether a defective product is mixed in an electronic component.
<Structure>

  FIG. 1 is a functional block diagram illustrating an example of the electronic component test apparatus according to the present embodiment. For example, the electronic component test apparatus (0100) of the present embodiment includes an array unit (0101), a first power supply unit (0102), a first detection unit (0103), a first reference waveform holding unit (0104), and a first determination unit. (0105). Hereinafter, each configuration will be described.

  Note that, in this specification, electronic components include electronic components such as capacitors, inductors, and resistors, chip components such as chip capacitors, chip inductors, and chip resistors, electronic components that combine chip components (for example, integrated circuits and IC chips), It also includes light emitting diodes (LEDs).

(First circuit)
The first circuit (0106) is a circuit configured by electrically connecting the arranged electronic components to be tested. The electronic component test apparatus of the present embodiment supplies a current or voltage having a predetermined impulse waveform to the first circuit, and performs a test for configuring the first circuit based on the detected current or voltage waveform flowing through the first circuit. This is to determine whether a defective product is mixed in the target electronic component.

  The number of electronic components constituting the first circuit is not particularly limited. However, even if one defective product is mixed in the electronic components constituting the first circuit, the electronic component test apparatus does not It is preferable that the number is such that mixing can be determined. Further, all the electronic components constituting the first circuit may be the same type of electronic components, or a plurality of types of electronic components may be mixed. For example, all of the electronic components constituting the first circuit may be capacitors, but capacitors, inductors, and resistors may be mixed.

  FIG. 2 is a circuit diagram illustrating an example of the configuration of the first circuit. In the first circuit, for example, all the capacitors (0201) may be connected in series as shown in (a), or may be connected in parallel as shown in (b). Further, as shown in FIG. 3 (c), capacitors may be connected in series and in parallel. Further, as shown in (d), a capacitor (0201), a resistor (0202), and a coil (0203) may be connected in series and in parallel.

  The electronic component test apparatus of the present invention is particularly suitable for testing capacitors among electronic components. As a method of testing the insulation resistance of a capacitor, a method of measuring a leak current flowing after charging the capacitor is known.However, such a method requires a long time to charge the capacitor if the capacitor has a large capacity, and thus requires a long time for the test. Will take. Furthermore, if a test is performed for all large-capacity large-capacity capacitors by charging the capacitors, the amount of power consumed by the test also becomes enormous.

  However, the electronic component test apparatus of the present invention supplies a current or voltage having a predetermined impulse waveform to the first circuit as described above, and performs a test based on the detected current or voltage waveform flowing through the first circuit. It is not necessary to charge the capacitor each time when testing the capacitor. Therefore, not only can the capacitor test be performed at high speed, but also the amount of power consumed by the test can be suppressed.

(Array part)
The array unit (0101) is configured to array and mount a plurality of electronic components to be tested, which are electronic components to be tested. The “placement of electronic components to be tested” is not limited to the case where the electronic components to be tested are arranged in the array section. This includes the case where the target electronic component is placed. A known technique can be used for the method of arranging the test target electronic components.

  Note that the first circuit is configured by electrically connecting the arranged electronic components to be tested. Therefore, the arrangement unit may have a function of electrically connecting the test target electronic components to form the first circuit by arranging the test target electronic components.

(First power supply)
The first power supply unit (0102) is configured to supply a first impulse waveform that is a current or voltage having a predetermined impulse waveform to the first circuit. The “impulse waveform” is a pulse waveform having an infinitely short half-width and an infinite amplitude in theory, but in the present embodiment, a predetermined half-width (for example, about 1 μs to 100 μs) and a predetermined amplitude (for example, 1 to 100 kV).

  The first impulse waveform supplied from the first power supply unit to the first circuit is preferably a single pulse because the test of the electronic component can be performed at higher speed, but may be a plurality of pulses. For example, a configuration may be employed in which a first impulse waveform having the same waveform is supplied three times from the first power supply unit to the first circuit to test the electronic component.

  Since the half width of the impulse waveform is very short, the half width of the detected current or voltage waveform is also very short. Since the electronic component test apparatus of the present invention performs a test based on a detected current or voltage waveform, by performing a test using an impulse waveform, the time required for the test can be reduced.

  When an impulse waveform is used as a current or voltage waveform supplied to an electronic component, the effect on the electronic component can be reduced. That is, even if a voltage higher than the withstand voltage of the electronic component is applied, if the voltage waveform is an impulse waveform, the amount of energy given to the electronic component is small, so that the electronic component does not fail. Then, the amount of current or voltage supplied to the electronic component can be increased, and the amount of current or voltage detected can be increased, and it can be more accurately determined whether a defective product is mixed in the electronic component. Can be determined.

  The first power supply unit may hold a plurality of first impulse waveforms. The first power supply unit holds a plurality of first impulse waveforms, so that when testing a plurality of types of electronic components with the electronic component test apparatus, a plurality of held multiple types of electronic components are held in accordance with the type of each electronic component. An optimal waveform can be selected from the first impulse waveform, and the voltage of the first impulse waveform can be supplied to the first circuit.

  FIG. 3 shows an example of a circuit configuration for supplying the first impulse waveform. First, when supplying the first impulse waveform, electric charges are stored between both electrodes of the high-voltage capacitor (0302) by the high-voltage power supply (0301). Then, when the switch (0303) is turned on for a moment, the electric charge stored in the high-voltage capacitor is supplied to the first circuit (0305). At this time, by providing a diode (0304) between the switch and the electronic component to be tested, it is possible to prevent a voltage (current) from flowing back from the capacitor in the electronic component to be tested to the high-voltage capacitor. The voltage can be accurately supplied to the first circuit. Note that a resistor (0306) is connected between the power supply and the high-voltage capacitor to prevent the power supply from being short-circuited when the switch is turned on. Further, an inductance may be connected instead of the resistance.

  The capacitance of the high-voltage capacitor provided as the first power supply unit of the electronic component test apparatus of the present embodiment is, when the capacitor is included in the electronic component to be tested, the capacitance of the capacitor in the electronic component to be tested. It is preferably at least 10 times as large as Here, the “capacitance of the capacitor in the electronic component under test” is not the capacitance of the capacitor included in each test target but the capacitance of the first circuit configured by the electronic component under test. It is. If the capacitance of the high-voltage capacitor on the power supply side is 10 times or more the capacitance of the capacitor in the electronic component under test, a large amount of charge is supplied to the capacitor in the electronic component under test when the switch is turned on. Thus, a stable impulse waveform can be provided to the electronic component under test when the impulse voltage is applied. In addition, in order to further reduce the test time (tact time), it is possible to make a circuit in which the pulse generation time interval is shortened by connecting the charging circuit units in parallel and sequentially switching the charging circuit units with an electronic rotary switch. .

(First detector)
The first detector (0103) is configured to detect a first detection waveform that is a current or voltage waveform flowing in the first circuit by supplying the first impulse waveform. The detection of the first detection waveform can be performed using, for example, an ammeter or a voltmeter. The first detection unit may hold the detected first detected waveform as it is, but the waveform in which the characteristics of the detected waveform, such as rise time, wave tail length, amplitude, waveform area, and waveform variation, are detected. May be calculated and stored.

  FIG. 4 shows an outline of the rise time and the wave tail length of the first detection waveform. The rise time T1 and the wave tail length T2 of the first detection waveform (0401) are calculated as follows. First, regarding the rising edge of the first detected waveform, the intersection of the time axis with the straight line connecting the two points of 30% (or 10%) and 90% of the peak value of the waveform is defined as the waveform origin (0402). I do. The time between the point corresponding to 100% of the waveform on the straight line and the reference origin is defined as the rise time T1. Further, regarding the wave tail of the first detection waveform, the time between the point at which the wave tail becomes 50% of the wave tail and the reference origin is defined as the wave tail length T2.

  The first detection waveform may be a voltage waveform flowing through the first circuit, but is preferably a current waveform. In general, since a minute change in current is easier to detect, therefore, detecting a current waveform can more accurately determine the mixing of defective products in electronic components.

(First reference waveform holding unit)
The first reference waveform holding unit (0104) stores the first impulse waveform in the first reference circuit, which is the same circuit as the first circuit configured by electrically connecting a plurality of electronic components and normal electronic components of the same type. It is configured to hold a first reference waveform that is a current or voltage waveform to be detected by the first detection unit when supplied. Here, the first reference waveform held by the first reference waveform holding unit may be set as a theoretically predicted waveform, or may be configured by electrically connecting normally normal electronic components. May be set as the waveform detected by the first detection unit when the voltage of the first impulse waveform is supplied to the first reference circuit.

(First judgment unit)
The first determination unit (0105) is configured to compare the first detection waveform detected by the first detection unit with the first reference waveform to determine whether a defective product is mixed in the electronic component to be tested. You. “Comparing the first detection waveform with the first reference waveform” means that the first detection waveform and the first reference waveform are determined, for example, using the rise time, the wave tail length, the amplitude, the waveform area, and the variation of the waveform as determination item values. Are compared with each other.

  The electronic component test apparatus of the present invention performs a test on an electronic component to be tested by comparing a first detection waveform with a first reference waveform, and performs physical property values (for example, capacitance) of each electronic component to be tested. , Insulation resistance, etc.). Therefore, the electronic component test can be performed at higher speed as compared with the case where the electronic component test is performed by measuring the individual physical property values.

  For example, “determining whether a defective product is mixed in the electronic component to be tested” means that each determination item value of the first detection waveform is within an allowable range (for example, ± (Within 1%), a configuration may be adopted in which it is determined that a defective product is not mixed in the test target electronic component for the determination item. Even if the electronic parts have a common production line, their physical property values may vary to some extent. Therefore, by using this determination method, the error can be tolerated to some extent.

  Further, as a method of “determining whether a defective product is mixed in the electronic component to be tested”, a method is used in accordance with the degree of divergence of each determination item value of the first detection waveform with respect to each determination item value of the first reference waveform. Alternatively, the electronic components in the first circuit for which the first detection waveform has been detected may be ranked. Specifically, for example, when the wave tail length of the first detection waveform is within ± 1% of the wave tail length of the first reference current waveform, the electronic component to be tested forming the first circuit is set to “excellent”. If it is within ± 3%, it is ranked as “good”, if it is less than ± 5%, it is ranked as “good”, and if it is more than ± 5%, it is ranked as “bad”.

  FIG. 5 shows a determination example in the first determination unit. The waveform shown in (a) is a first reference waveform (0501) and has a wave tail length t1 and an amplitude i1. First, the first detection waveform (0502) shown in (b) has the same wave tail length t2 and amplitude i2 as the first reference waveform. On the other hand, in the first detection waveform (0513) shown in (c), the amplitude i3 is almost the same as the amplitude of the first reference waveform (0511), but the wave tail length t3 is longer than the wave tail length of the first reference waveform. . Also, the first detection waveform (0514) shown in (d) has the same wave tail length t4 as the wave tail length of the first reference waveform (0511), but the amplitude i4 is smaller than the amplitude of the first reference waveform. .

  FIG. 6 is a diagram illustrating details of a determination example in the first determination unit in FIG. That is, two values of “wave tail length” and “amplitude” of each waveform are used as the judgment item values in the first judgment unit, and each judgment item value of (a) to (d) and the value shown in (a) It shows the degree of deviation from. For example, each judgment item value of the first detection waveform shown in (b) is within ± 1% which is within an allowable range when compared with each judgment item value of the first reference waveform. Therefore, when the first detection waveform shown in (b) is detected, the first determination unit determines that a defective product is not mixed in the test target electronic component constituting the first circuit.

  On the other hand, the first detection waveform shown in (c) is + 10%, which is much larger than the allowable range, when the first reference waveform is compared with its wave tail length. Therefore, when the first detection waveform shown in (c) is detected by the first determination unit, it is determined that a defective product is mixed in the test target electronic component constituting the first circuit.

  Further, the first detection waveform shown in (d) is -20%, which is much lower than the allowable range, when comparing the amplitude with the first reference waveform. Therefore, when the first detection waveform shown in (d) is detected by the first determination unit, it is determined that a defective product is mixed in the test target electronic component constituting the first circuit.

  The first determination unit may be configured to determine not only the presence or absence of a defective product in the test target electronic component but also the type of the defect. For example, the first detection waveform shown in (c) has a longer tail length than the first reference waveform. A long wave tail length indicates that a defective product having a large capacitance is mixed in the electronic component to be tested. It can also be determined that a product is mixed. The first detection waveform shown in (d) has a smaller amplitude than the first reference waveform. A small amplitude indicates that a defective product with a low insulation resistance is mixed in the electronic component under test, and the first determination unit determines that a defective product with a small insulation resistance is mixed in the electronic component under test. You can also decide that you are.

  If the result of the determination by the first determination unit is that the defective product has not been mixed in the electronic component, the test of the electronic component can be terminated as it is, and the second electronic component can be used as the new electronic component. One circuit can be configured and tested. On the other hand, when the determination result in the first determination unit is a determination result indicating that a defective product is mixed in the electronic component, the electronic component in which the defective product is mixed is determined by another testing device. The retest may be performed.

  If the determination result in the first determination unit is a determination result that a defective product is mixed in the electronic component, another circuit is configured using the electronic component in which the defective product is mixed. Alternatively, the test may be performed again using another circuit. (Details will be described in Embodiment 2.)

(AC waveform)
The current or voltage supplied to the first circuit by the first power supply unit may be an AC waveform instead of an impulse waveform. That is, the first power supply unit may be configured to supply the first circuit with a first AC waveform that is a current or voltage having a predetermined AC waveform. The frequency of the AC waveform is not particularly limited, but is preferably a high frequency (for example, several kHz to several MHz).
<Process flow>

FIG. 7 shows an example of a processing flow of an electronic component test method using the electronic component test apparatus of the present embodiment. First, in the arranging step, the electronic components to be tested, which are a plurality of electronic components to be tested, are arranged and placed (S0701). Next, in a first circuit configuration step, a first circuit configured by electrically connecting the arranged test target electronic components is configured (S0702). Then, in the first impulse waveform supply step, a first impulse waveform which is a current or voltage of a predetermined impulse waveform is supplied to the first circuit (S0703). Then, in the first detection step, a first detection waveform, which is a current or voltage waveform flowing through the first circuit due to the supply of the first impulse waveform, is detected (S0704). Then, in the first circuit determination step, normal electronic components of the same kind as the plurality of electronic components that supply the first impulse waveform detected by the first power supply unit and the first detected waveform detected by the first detection unit are electrically connected. A first reference waveform that is a current or voltage waveform to be detected by the first detection unit when the first impulse waveform is supplied to the first reference circuit that is the same circuit as the first circuit configured to be connected to It is determined whether a defective product is mixed in the electronic component to be tested (S0705).
<Effect>

By using the electronic component test apparatus and the electronic component test method described above, it is possible to quickly determine whether a defective product is mixed in the electronic component.
<< Embodiment 2 >>
<Overview>

The electronic component test apparatus according to the present embodiment includes, in addition to the components described in the first embodiment, a second circuit including at least a part of the test target electronic component included in the first circuit. A current or a voltage is supplied to determine whether a defective product is mixed, and the first circuit or / and / or the first circuit or / Then, an area where a defective product of the second circuit is mixed is calculated.
<Structure>

  FIG. 8 is a functional block diagram illustrating an example of the electronic component test apparatus according to the present embodiment. For example, the electronic component test apparatus (0800) of the present embodiment includes an array unit (0801), a first power supply unit (0802), a first detection unit (0803), a first reference waveform holding unit (0804), and a first determination unit. (0805), a second power supply unit (0807), a second detection unit (0808), a second reference waveform holding unit (0809), a second determination unit (0810), and a defective product mixing area calculation unit (0811). You. The first power supply unit and the second power supply unit, the first detection unit and the second detection unit, the first reference waveform holding unit and the second reference waveform holding unit, the first determination unit and the second determination unit are configured by the same hardware. May be. In the following, a description will be given of a second power supply unit, a second detection unit, a second reference waveform holding unit, a second determination unit, and a defective product mixing area calculation unit, which are mainly different from the first embodiment.

(Second circuit)
The second circuit (0812) is electrically configured by another connection by a test electronic component including at least a part of the test target electronic component included in the first circuit (0806). That is, the second circuit may be configured by a part of the electronic components to be tested forming the first circuit, or may be configured by all of the electronic components to be tested forming the first circuit. Further, the second circuit may be constituted by at least a part of the electronic component to be tested, which supplies the first impulse waveform by the first power supply unit, and an electronic component of the same kind as the electronic component to be tested. Here, the “electronic component of the same type as the electronic component to be tested” indicates an electronic component having the same type and the same physical property value as the electronic component to be tested. For example, the electronic component to be tested has a capacitance of 10 μF. In the case of a capacitor having the following, the same type of electronic component as the electronic component to be tested also indicates a capacitor having a capacitance of 10 μF.

  FIG. 9 is a circuit diagram illustrating a configuration example of the second circuit. (A) shows the first circuit, and (b) to (d) show the second circuit. The first circuit is configured by connecting four test target electronic components (9a) to (9d) in series. In the second circuit, for example, as shown in (b), the electronic components to be tested constituting the second circuit are the same as the electronic components to be tested constituting the first circuit, and the electrical connection of the electronic components to be tested is performed. , The second circuit may be configured. Specifically, four capacitors ((9a) to (9d)) are connected in series in the first circuit, whereas four capacitors ((9a) to (9d)) are connected in the second circuit. Are connected in parallel.

  Further, the second circuit shown in (c) is configured by electrically connecting a part of the test target electronic components constituting the first circuit. Specifically, while the four capacitors ((9a) to (9d)) are connected in the first circuit, the second circuit electrically connects two of them ((9a) and (9b)). It is constituted by connecting to.

  Further, the second circuit shown in (d) is configured by a part of the electronic component to be tested constituting the first circuit and an electronic component of the same kind as the electronic component to be tested. Specifically, the electronic components to be tested ((9a) and (9b)) constituting the first circuit are electrically connected to electronic components ((9c) and (9d)) of the same type as the electronic components to be tested. It is constituted by doing.

  The electronic component test apparatus of the present embodiment switches the electrical connection without changing the relative positions of the electronic components to be tested arranged in the array portion from the first circuit to the second circuit. Or / and / or a circuit configuration change unit that configures the first circuit from the second circuit. For example, the circuit configuration changing unit controls the switch to switch only the electrical connection without changing the position of the electronic components to configure the second circuit from the first circuit or / and the first circuit from the second circuit. It is configured so that a circuit can be configured. Since it takes time to change the positions of the electronic components, the electronic component test apparatus has a circuit configuration change unit, which eliminates the need to change the positions of the electronic components, and enables high-speed testing of the electronic components. It can be performed.

  When the electronic circuit under test includes a capacitor and the electrical connection is switched to form the second circuit from the first circuit, short the capacitor once before supplying the second impulse waveform to the second circuit. It is preferable to remove the charge accumulated in the capacitor. This is because if electric charges are accumulated in the capacitor, a current or voltage waveform obtained when the second impulse waveform is supplied cannot be obtained accurately.

(Second power supply section)
The second power supply unit (0807) is configured to supply a second impulse waveform that is a current or voltage having a predetermined impulse waveform to the second circuit. Although the first power supply unit and the second power supply unit have the same basic configuration, the second impulse waveform supplied to the second circuit by the second power supply unit may be the same as the first impulse waveform. Good or another waveform may be used.

  When the first impulse waveform and the second impulse waveform are different, the first impulse waveform is a waveform for measuring the impedance of the electronic component under test, and the second impulse waveform is the waveform of the electronic component under test. The waveform for measuring capacitance may be a waveform for measuring capacitance, or the first impulse waveform may be a waveform for measuring capacitance and the second impulse waveform may be a waveform for measuring impedance. “Impedance measurement waveform” is a waveform for measuring the so-called insulation resistance of the electronic device under test, and “capacitance measurement waveform” is a waveform for measuring the capacitance of the electronic device under test. It is. By adopting such a configuration, it is possible to perform a test on two physical properties (for example, impedance and capacitance) with the same electronic component test apparatus, and therefore, it is possible to more accurately detect mixing of defective products in the electronic component to be tested. Can be.

  For example, the first circuit shown in FIG. 9A has four capacitors connected in series, and the second circuit shown in FIG. 9B has four capacitors connected in parallel. Therefore, first, a capacitance measurement waveform is supplied to the first circuit shown in FIG. 9A, and it is determined whether or not a defective product regarding the capacitance is mixed in the test target electronic component constituting the first circuit. Next, a second circuit shown in FIG. 9B is formed, a waveform for impedance measurement is supplied to the second circuit, and a defective product with respect to the insulation resistance is mixed in the test target electronic component forming the second circuit. And so on.

(Second detector)
The second detection unit (0808) is configured to detect a second detection waveform that is a current or voltage waveform flowing in the second circuit by supplying the second impulse waveform. The configuration of the second detection unit is the same as the configuration of the first detection unit except that a current or voltage waveform flowing in the second circuit is detected.

(Second reference waveform holding unit)
The second reference waveform holding unit (0809) is the same as a second circuit configured by electrically connecting normal electronic components of the same type as a plurality of electronic components that supply the second impulse waveform by the second power supply unit. When a second impulse waveform is supplied to a second circuit reference which is a circuit, a second reference waveform which is a current or voltage waveform to be detected by the second detection unit is held. The second reference waveform held by the second reference waveform holding unit may be set as a theoretically predicted waveform, or may be a second reference waveform configured by electrically connecting normally normal electronic components. When the voltage of the second impulse waveform is supplied to the reference circuit, the voltage may be set as the waveform detected by the second detection unit.

(Second determination unit)
The second determination unit (0810) is configured to compare the second detection waveform detected by the second detection unit with the second reference waveform to determine whether a defective product is mixed in the electronic component to be tested. You. The determination by the second determination unit can be performed in the same manner as the determination by the first determination unit described in the first embodiment.

(Defective product mixing area calculation unit)
The defective product mixing area calculation unit (0811) mixes defective products of the first circuit and / or the second circuit from one or more determination results in the first determination unit and one or more determination results in the second determination unit. It is configured to calculate the area that is present. "Calculating the area where defective products are mixed" is intended to extract defective products from the electronic components to be tested.

  FIG. 10 shows a processing example in the defective product mixing area calculation unit. FIG. 10 shows an example in which the second circuit shown in FIG. 9C is used, and when a defective product (10f) is extracted from eight test target electronic components (10a to 10h). An outline of the processing will be described. In this example, first, as shown in FIG. 10A, a circuit (10-1) is formed by electrically connecting eight test target electronic components (10a to 10h). It is determined whether or not a defective product is mixed in the product. Since the defective product (10f) is mixed in the eight electronic components to be tested, the determination result that the defective product is mixed in the electronic component to be tested is output as the determination result.

  Therefore, the electrical connection of the electronic components to be tested constituting the first circuit is reconstructed, and the electronic components to be tested (10a to 10d) and the electronic components to be tested (10e to 10h) are electrically connected respectively. Then, two circuits (10-2, 10-3) are configured, and it is determined whether or not a defective product is mixed in the test target electronic component configuring the circuit for each circuit. Then, a determination result is output that no defective product is mixed in the electronic components to be tested (10a to 10d) and a defective product is mixed in the electronic components to be tested (10e to 10h). .

  Therefore, the electrical connection of the test target electronic components (10e to 10h) containing the defective product is reconstructed, and the test target electronic components (10e, 10f) and the test target electronic components (10g, 10h) are connected. Each circuit is electrically connected to form two circuits (10-4, 10-5), and it is determined whether or not a defective product is mixed in a test target electronic component forming the circuit for each circuit. judge. Then, a determination result is output that a defective product is not mixed in the test target electronic components (10g, 10h) and a defective product is mixed in the test target electronic components (10e, 10f).

  Therefore, it is possible to determine that the test target electronic component (10f) is a defective product by determining whether or not each of the test target electronic components (10e, 10f) containing the defective product is a defective product.

  In the example shown in FIG. 10, for example, when a test is first performed using the electronic components to be tested (10a to 10h), it is a determination result that no defective product is mixed in the electronic components to be tested. In this case, the test of the eight electronic components to be tested can be completed only once. Further, even if the determination result indicates that a defective product is mixed in the electronic component to be tested, the number of electronic components to be tested is eight, and one of the eight electronic components is defective. In this case, a defective product in the electronic component to be tested can be specified by a test at a minimum of 4 times and a maximum of 7 times. When performing an individual inspection of all the electronic components to be tested, if the number of electronic components to be tested is eight, the number of tests is also eight degrees. Therefore, the mixed area of defective products is calculated using the example shown in FIG. By doing so, it is possible to quickly determine whether a defective product is mixed in the electronic component.

  FIG. 11 shows another processing example in the defective product mixing area calculation unit. FIG. 11 shows an example in which the second circuit shown in FIG. 9D is used, and when a defective product (11) is extracted from the 16 electronic components to be tested (1 to 16). An outline of the processing will be described. In this example, first, as shown in FIG. 11A, the 16 electronic devices to be tested (1 to 16) are divided into four electronic devices to be tested, and each of them is electrically connected to the four electronic devices. One circuit (ad) is configured. Then, for each of the four first circuits thus configured, it is determined whether or not a defective product is mixed in the test target electronic component constituting each of the first circuits. Since defective products (11) are mixed in the 16 electronic components to be tested, no defective products are mixed in the electronic components to be tested forming the first circuit (a, b, d). And a determination result that a defective product is mixed in the test target electronic component constituting the first circuit (c) is output.

  Next, four second circuits (e to h) are configured by switching the electrical connection of the 16 electronic components to be tested. Then, for each of the four configured second circuits, it is determined whether or not a defective product is mixed in the test target electronic component configuring each of the second circuits. Then, no defective product is mixed in the electronic components to be tested constituting the second circuit (a, b, d), and a defective product is contained in the electronic components to be tested constituting the second circuit (c). The result of the determination that it is mixed is output.

  Therefore, based on the determination result of the test performed using the first circuit (a to d) and the second circuit (e to h) in the defective product mixing area calculation unit, the area where the defective product is mixed is determined. Is calculated. Specifically, the defective product mixing area calculation unit obtains, from the first determination unit, a determination result indicating that the defective product is mixed in the test target electronic component configuring (c) in the first circuit, From the second determination unit, a determination result that a defective product is mixed in the test target electronic component constituting (g) in the second circuit is acquired. Then, since the test target electronic component commonly used in the first circuit (c) and the second circuit (g) is (11), the defective product mixing area calculation unit calculates the 16 test target electronic components. Among them, (11) can be specified as a defective product.

  FIG. 11B shows another processing example in the defective product mixing area calculation unit. FIG. 11B shows an example in which the second circuit shown in FIG. 9D is used, and a defective product (10f) is extracted from eight test target electronic components (10a to 10h). An outline of the processing when performing the processing will be described. In this example, first, as shown in FIG. 10A, a circuit (10-1) is formed by electrically connecting eight test target electronic components (10a to 10h). It is determined whether or not a defective product is mixed in the product. Since the defective product (10f) is mixed in the eight electronic components to be tested, the determination result that the defective product is mixed in the electronic component to be tested is output as the determination result.

Therefore, the test target electronic component (10a to 10h) in which the defective product is mixed is divided into two (10a to 10d, 10e to 10h), and each of the divided electric components is of the same type as the test target electronic component. The normal electronic components (10i to 10l) are electrically connected to form new circuits (10-2, 10-3), and defective products are mixed in the test target electronic components constituting the circuits for each circuit. It is determined whether or not. In the example shown in FIG. 11B, it is determined that the defective product is not mixed in the circuit shown in (10-2), and the test target electronic components (10a to 10d) constituting (10-2) are determined. The test can be terminated. On the other hand, the defective product is mixed in the circuit shown in (10-3) and the defective product is not mixed in (10i to 10l). Can be determined. The test target electronic component in which the defective product is mixed can be retested by another test device.
<Process flow>

  FIG. 12 is a diagram illustrating an example of a processing flow of an electronic component test method in the electronic component test apparatus of the present embodiment. First, in the arranging step, the electronic components to be tested, which are a plurality of electronic components to be tested, are arranged and placed (S1201). Next, in a first circuit configuration step, a first circuit configured by electrically connecting the arranged test target electronic components is configured (S1202). Then, in the first impulse waveform supply step, a first impulse waveform which is a current or voltage of a predetermined impulse waveform is supplied to the first circuit (S1203). Then, in the first detection step, a normal electronic component of the same kind as a plurality of electronic components that supply the first impulse waveform by the first power supply unit and the first detection waveform detected by the first detection unit is electrically connected. When a first impulse waveform is supplied to a first reference circuit, which is the same circuit as the first circuit configured by connection, a first reference waveform that is a current or voltage waveform to be detected by the first detection unit. It is determined whether a defective product is mixed in the electronic component to be tested (S1205).

  Thereafter, in a second circuit configuration step, a second circuit electrically configured by another connection is configured by the test target electronic components including at least a part of the test target electronic components configuring the first circuit (S1206). . Then, in the second impulse waveform supply step, a second impulse waveform that is a current or voltage of a predetermined impulse waveform is supplied to the second circuit (S1207). Then, in the second detection step, a second detection waveform, which is a current or voltage waveform flowing through the second circuit due to the supply of the second impulse waveform, is detected (S1208). Then, in the second circuit determination step, a normal electronic component of the same kind as a plurality of electronic components supplying the second impulse waveform by the second power supply unit and the second detected waveform detected by the second detection unit is electrically connected. A second reference waveform that is a current or voltage waveform to be detected by the second detection unit when a second impulse waveform is supplied to a second circuit reference that is the same circuit as the second circuit configured to be connected to It is determined whether a defective product is mixed in the test target electronic component (S1209).

Then, in the defective product mixing area calculation step, defective products of the first circuit and / or the second circuit are mixed based on at least one determination result of the first determination unit and at least one determination result of the second determination unit. The area in which it is located is calculated (S1210).
<Effect>

By employing the above-described configuration, it is possible to judge the acceptability of a plurality of electronic components at a time, and thus it is possible to reduce the time required for testing the electronic components. Further, by performing the test of the electronic component using the first circuit and the second circuit, it is possible to calculate the area where the defective product is mixed.
<< Embodiment 3 >>
<Overview>

This embodiment incorporates a plurality of electronic components to be tested into a part of a bridge circuit, detects a current or a voltage flowing in the bridge circuit when a current or a voltage is supplied to the bridge circuit, and includes the components in the electronic component. The present invention relates to an electronic component test apparatus for determining whether a defective product is mixed.
<Structure>

  FIG. 13 is a functional block diagram illustrating an example of the electronic component test apparatus according to the present embodiment. For example, the electronic component test apparatus (1300) of the present embodiment includes an arrangement section (1301), a first power supply section (1302), a first detection section (1303), and a first determination section (1304). Hereinafter, each configuration will be described.

(First bridge circuit)
The first bridge circuit (1305) is a circuit in which an electronic component to be tested, which is an electronic component to be tested, is incorporated in a part of the bridge circuit. Here, the number of electronic components to be tested incorporated in the first bridge circuit is not particularly limited, but two or more electronic components are electrically connected in that a plurality of electronic components are tested at one time. Is preferred.

  FIG. 14 shows an example of the configuration of the first bridge circuit. The example shown in FIG. 14 is an example in which a Wheatstone bridge circuit is employed as the bridge circuit. In the example shown in (a), a test target electronic component (1401) is connected in series, a test reference electronic component (1402) as a test reference is connected in series, and each is connected in parallel with each other to form a Wheatstone bridge circuit. Is composed. At this time, the connection point (1403) of the test target electronic component and the connection point (1404) of the test reference electronic component are electrically connected, and the current or voltage flowing between the two connection points is measured, for example, by using a galvanometer. The differential detection is performed using (1405). Here, the "test reference electronic component" is an electronic component whose physical property value has already been determined, and may be, for example, a test target electronic component which has already been determined not to be a defective product.

  Also, the first bridge circuit shown in (b) differs from (a) in that the electronic device under test (1401) and the test reference electronic component (1402) are connected in series, and each is connected in parallel with each other. . At that time, a connection point (1406) between the electronic component to be tested and the test reference electronic component is electrically connected, and a current or a voltage flowing between the connection points is differentially detected by, for example, a galvanometer (1405).

  Further, in the example shown in FIG. 14, a Wheatstone bridge circuit is configured using two test target electronic components by connecting test target electronic components one by one in series or in parallel. A plurality of (two or more) circuits connected in series or in parallel are prepared, and the two circuits are connected in series or in parallel instead of the electronic components to be tested shown in FIG. 14, and the two circuits are converted into a Wheatstone bridge circuit. It may be configured to be incorporated.

  The electronic component test apparatus according to the present embodiment supplies a current or a voltage to the first bridge circuit and detects a current or a voltage flowing in the first bridge circuit, thereby performing a pass / fail determination on the electronic component to be tested. . The use of a bridge circuit can increase the accuracy of detecting a defective product in an electronic component.

(Array part)
The array unit (1301) is configured to array and mount a plurality of electronic components to be tested, which are electronic components to be tested. The test target electronic components arranged in the arrangement unit are electrically connected and incorporated into a part of the bridge circuit to form a first bridge circuit.

(First power supply)
The first power supply (1302) is configured to supply a current or a voltage to the first bridge circuit. The current or voltage waveform supplied to the first bridge circuit is preferably a predetermined impulse waveform or AC waveform.

(First detector)
The first detection unit (1303) is configured to detect a first detection waveform that is a current or voltage waveform flowing in the first bridge circuit by supplying a current or voltage from the first power supply unit. The detection of the current or voltage waveform can be performed using, for example, a galvanometer as described above.

(First judgment unit)
The first determination unit (1304) is configured to determine whether a defective product is mixed in the electronic component to be tested. As a method of determining whether or not a defective product is mixed, for example, the electronic component test apparatus previously holds a current or voltage waveform that is considered to be detected when the defective product is mixed in the electronic component to be tested. When such a current or voltage waveform is detected, a configuration may be adopted in which it is determined that a defective product is mixed in the electronic component to be tested.

However, in the case of the present embodiment, the current or voltage waveform detected by the first detection unit varies depending on the degree of failure of the test target electronic component, and cannot be specified unambiguously. That is, when a current or voltage is supplied to the first bridge circuit shown in FIG. 14, the current or voltage flowing through the galvanometer is mainly due to the difference in impedance between the electronic device under test and the test reference electronic component. However, the current or voltage waveform flowing through the galvanometer is expected to undergo various changes due to variations in the electrical characteristics of the electronic component under test. Therefore, the first determination unit holds the threshold value of the current or voltage flowing through the galvanometer, and when the current or voltage flowing through the galvanometer exceeds the threshold value, a defective product is mixed in the electronic component under test. May be determined.
<Process flow>

FIG. 15 shows an example of an electronic component test method using the electronic component test apparatus of the present embodiment. First, in the arrangement step, the electronic components to be tested are arranged (S1501). Next, in a first bridge circuit configuration step, the electronic components to be tested are electrically connected and incorporated into a part of the bridge circuit to configure a first bridge circuit (S1502). Then, in the first power supply step, power is supplied to the first bridge circuit (S1503). Then, in the first detection step, a first detection waveform which is a current or voltage waveform flowing through the first bridge circuit due to the supply of the current or voltage from the first power supply unit is detected (S1504). Then, in the first determination step, it is determined whether a defective product is mixed in the test target electronic component (S1505).
<Effect>

By performing an electronic component test using the electronic component test apparatus of the present embodiment, it is possible to not only shorten the time required for testing the electronic component by performing a test on a plurality of electronic components at once, but also The accuracy of the determination can be improved.
<< Embodiment 4 >>
<Overview>

The electronic component test device of the present embodiment uses the quadrature phase bridge circuit as the first bridge circuit in the electronic component test device of the third embodiment.
<Structure>

  FIG. 16 is a functional block diagram illustrating an example of the electronic component test apparatus according to the present embodiment. For example, the electronic component test apparatus (1600) of the present embodiment includes an arrangement section (1601), a first power supply section (1602), a second power supply section (1603), a first detection section (1604), A determination unit (1605). Hereinafter, each configuration will be described.

(First bridge circuit)
The first bridge circuit (1606) is a circuit in which an electronic component to be tested, which is an electronic component to be tested, is incorporated in a part of the bridge circuit. In the third embodiment, a Wheatstone bridge circuit is used as the first bridge circuit. However, in the present embodiment, a quadrature bridge circuit is used as the first bridge circuit. Although the number of electronic components to be tested incorporated in the first bridge circuit is not particularly limited, two or more electronic components are electrically connected in that a plurality of electronic components are tested at one time. Thus, the first bridge circuit may be configured.

  FIG. 17 shows an example of the first bridge circuit of the present embodiment. The example shown in FIG. 17 is an example in which a quadrature bridge circuit is employed as the bridge circuit. That is, in the first bridge circuit, an electronic component to be tested (1703) and a test reference electronic component (1704), which is an electronic component to be a test reference, are connected in series, and a first power supply unit (1701) and a second power supply unit (1701) are provided at both ends. Two power supplies of the dual power supply section (1702) are connected. In this example, a capacitor is used as the electronic component to be tested, and a resistor is used as the test reference electronic component, but there is no particular limitation. The connection point between the test target electronic component and the test reference electronic component is grounded, and the current or voltage flowing through the connection point is differentially detected by, for example, a galvanometer (1705).

  The electronic component to be tested may be a single electronic component, but a plurality of electronic components may be electrically connected. For example, a plurality of capacitors may be connected in series and assembled at the position of the electronic component to be tested shown in FIG.

(Array part)
The array unit (1601) is configured to array and mount a plurality of electronic components to be tested, which are electronic components to be tested. The test target electronic components arranged in the arrangement unit are electrically connected and incorporated into a part of the bridge circuit to form a first bridge circuit.

(First power supply, second power supply)
In the first power supply section (1602), an alternating current or voltage is applied to the first bridge circuit. On the other hand, in the second power supply unit (1603), the same alternating current or voltage as that of the first power supply unit is applied to the first bridge circuit, but the phase is changed according to the component of the electronic component to be tested. Is shifted by a predetermined phase with respect to the sine wave generated from. For example, when the electronic component to be tested is a capacitor and the test reference electronic component is a resistor, the phase of the capacitor advances by π / 2 compared to the resistance, so the second power supply unit is connected to the first power supply unit. An AC current or voltage delayed by π / 2 from the applied AC phase is applied.

(First detector)
A first detector (1604) detects a current or a voltage flowing through a connection point between the test electronic component and the reference electronic component. The detection of the current or voltage waveform can be performed using, for example, a galvanometer.

(First judgment unit)
The first determination unit (1605) determines the acceptability of the electronic component to be tested. In addition, the quality determination of the test target electronic component may be performed based on the current or voltage detected by the first detection unit, for example, or may be performed after processing the detected current or voltage. .

(Partial discharge test)
The first detector may constitute a partial discharge test circuit. "Partial discharge" is a phenomenon in which, for example, when the space between the plates of a capacitor is made of an insulating material, discharge occurs in a part of the capacitor due to non-uniformity or failure of the insulating material. The "circuit" is a circuit for detecting a defect of an electronic component by detecting the partial discharge. For example, if there is a void in the insulating material of the capacitor, a failure of the electronic component occurs from that portion, and it is desired to detect the failure.

  Since partial discharge occurs randomly, it is difficult to judge the quality of electronic components based on the amount of current at the time of discharge.In general, a partial discharge test circuit uses not the amount of current but the amount of charge obtained by integrating the amount of current. measure. Therefore, the first detection unit “configures a partial discharge test circuit” means, for example, a circuit that allows the first detection unit to measure the amount of charge flowing through the connection point between the electronic component under test and the reference electronic component. To indicate that

(Signal processing)
The first detector may constitute a signal processing circuit. For example, as described above, if the first detection unit configures a partial discharge test circuit, the first detection unit will detect a partial discharge of the electronic component under test, but since the partial discharge occurs randomly, However, the detected partial discharge signal cannot be used as it is. Therefore, it is preferable to process the partial discharge signal using a signal processing circuit to determine the quality of the electronic component to be tested.

(Analog signal processing)
Note that the signal processing by the signal processing circuit may be analog signal processing. Generally, digital signal processing has a merit that a large-capacity signal can be processed, but has a demerit that it is slower than analog signal processing. In the case of the present invention, since the signal processing is used for testing an electronic component, it is desirable to be able to perform the signal processing faster than to process a large-capacity signal.

(Fourier transform)
As a specific example of the analog signal processing, for example, a configuration in which a signal processing circuit performs Fourier transform may be employed. For example, as an advantage of performing the Fourier transform, a large number of noise components are often superimposed on the current detected by the first detection unit. Then, it is difficult to simply determine the defect of the electronic component from the detected current. However, since the frequency of each component detected as noise is often constant, it is possible to extract only the current resulting from the failure of the electronic component by detecting the frequency component using Fourier transform.

(Wavelet conversion)
Further, as another example of the analog signal processing, for example, a configuration may be adopted in which a signal processing circuit performs Wavelet conversion. Wavelet transform is one of the frequency analysis methods, and uses a function called Wavelet function as a basis function. As a difference from the Fourier transform, the Fourier transform loses the time component of the data due to the transform, but the Wavelet transform can leave the time component.
<Process flow>

FIG. 18 shows an example of a processing flow of an electronic component test method using the bridge electronic component test apparatus of the present embodiment. First, in the arrangement step, the test target electronic components are arranged (S1801). Next, in a first bridge circuit configuration step, the electronic components to be tested are electrically connected and incorporated into a part of the bridge circuit to configure a first bridge circuit (S1802). Then, in the first power supply operation step, the first power supply is operated to supply a sine wave voltage to the first bridge circuit (S1803). Next, in the second power supply operation step, the second power supply is operated to supply a sine wave voltage to the first bridge circuit (S1804). Note that the order of the first power supply operation step and the second power supply operation step may be reversed or may be simultaneous. Next, in a first detection step, a first detection waveform is detected (S1805). Thereafter, in a determination step, it is determined whether the electronic component to be tested is a defective product (S1806).
<Effect>

  By using the bridge electronic component test apparatus of the present embodiment, it is possible not only to shorten the time required for testing the electronic components by testing a plurality of electronic components at once, but also to improve the accuracy of the quality judgment. Can be done. Furthermore, the provision of the partial discharge test circuit and the signal processing circuit can further improve the accuracy of the quality judgment.

0100: electronic component test apparatus, 0101: array unit, 0102: first power supply unit, 0103: first detection unit, 0104: first reference waveform holding unit, 0105: first determination unit, 0106: first circuit

Claims (12)

An array unit for arranging and mounting test target electronic components as a plurality of electronic components to be tested;
A first power supply unit that supplies a first impulse waveform that is a current or voltage of a predetermined impulse waveform to a first circuit configured by electrically connecting the test target electronic components arranged,
A first detection unit that detects a first detection waveform that is a current or voltage waveform flowing through the first circuit by supplying the first impulse waveform,
A first impulse is applied to a first reference circuit, which is the same circuit as a first circuit configured by electrically connecting a plurality of electronic components that supply a first impulse waveform and a normal electronic component of the same type in the first power supply unit. A first reference waveform holding unit that holds a first reference waveform that is a current or voltage waveform to be detected by the first detection unit when a waveform is supplied,
A first determination unit that determines whether a defective product is mixed in the electronic component under test by comparing the first detection waveform and the first reference waveform detected by the first detection unit,
A second impulse waveform that is a current or voltage of a predetermined impulse waveform in a second circuit that is electrically connected to another circuit by the test target electronic component including at least a part of the test target electronic component included in the first circuit. A second power supply unit for supplying
A second detection unit that detects a second detection waveform that is a current or voltage waveform flowing through the second circuit by supplying the second impulse waveform,
A second impulse is applied to a second circuit reference, which is the same circuit as a second circuit configured by electrically connecting a plurality of electronic components that supply a second impulse waveform at the second power supply unit and normal electronic components of the same type. A second reference waveform holding unit that holds a second reference waveform that is a current or voltage waveform to be detected by the second detection unit when the waveform is supplied,
A second determination unit that compares the second detection waveform and the second reference waveform detected by the second detection unit to determine whether a defective product is mixed in the test target electronic component,
Defective product mixing area calculation for calculating an area where defective products of the first circuit and / or second circuit are mixed from one or more determination results in the first determination unit and one or more determination results in the second determination unit Department and
An electronic component testing device having The electronic component according to claim 1 , wherein the second circuit includes at least a part of the electronic component to be tested that supplies the first impulse waveform from the first power supply unit, and an electronic component of the same type as the electronic component to be tested. Testing equipment. A second circuit is formed from the first circuit by switching electrical connection without changing the relative positions of the electronic components to be tested arranged in the array portion, and / or the second circuit electronic device testing apparatus according to claim 1 or 2 having a circuit configuration changing unit that constitutes the first circuit from. The first impulse waveform is a waveform for measuring the impedance of the electronic component under test, and the second impulse waveform is a waveform for measuring the capacitance of the electronic component under test. is there,
Or electronic device testing apparatus as claimed in any one of the 3 second impulse waveform is a first impulse waveform capacitance measurement waveform is the impedance measurement waveform. The electronic component test apparatus according to any one of claims 1 to 4 , wherein an AC waveform is used instead of the impulse waveform. Tested electronic component electronic device testing apparatus according to any one of claims 1-5 is a capacitor. An arrangement step of arranging and placing test target electronic components, which are a plurality of electronic components to be tested,
A first circuit configuration step to configure a first circuit configured by electrically connecting the test target electronic components arranged,
A first impulse waveform supply step of supplying a first impulse waveform that is a current or voltage of a predetermined impulse waveform to the first circuit,
A first detection step of detecting a first detection waveform that is a current or voltage waveform flowing to the first circuit by supplying the first impulse waveform,
A first configuration configured by electrically connecting normal electronic components of the same type as a plurality of electronic components that supply a first impulse waveform at the first power supply unit with the first detection waveform detected by the first detection unit. When the first impulse waveform is supplied to the first reference circuit, which is the same circuit as the circuit, the first impulse waveform is compared with the first reference waveform which is the current or voltage waveform to be detected by the first detection unit. A first determination step of determining whether a defective product is mixed in the
A second circuit configuration step of configuring a second circuit electrically configured by another connection by a test target electronic component including at least a part of the test target electronic component forming the first circuit,
A second impulse waveform supplying step of supplying a second impulse waveform that is a current or voltage of a predetermined impulse waveform to the second circuit,
A second detection step of detecting a second detection waveform that is a current or voltage waveform flowing through the second circuit by supplying the second impulse waveform,
A second configured by electrically connecting normal electronic components of the same kind as the plurality of electronic components that supply the second impulse waveform at the second detection waveform detected by the second detection unit and the second power supply unit. When a second impulse waveform is supplied to a second circuit reference that is the same circuit as the circuit, the second impulse waveform is compared with a second reference waveform that is a current or voltage waveform to be detected by the second detection unit. A second determination step of determining whether a defective product is mixed in the
Defective product mixing area calculation for calculating an area where defective products of the first circuit and / or second circuit are mixed from one or more determination results in the first determination unit and one or more determination results in the second determination unit Steps and
An electronic component test method having: The electronic component according to claim 7 , wherein the second circuit includes at least a part of the electronic component to be tested that supplies the first impulse waveform in the first power supply unit, and an electronic component of the same type as the electronic component to be tested. Test method. The electrical connection is switched without changing the relative positions of the electronic components to be tested arranged in the array to form the second circuit from the first circuit, and / or the first circuit from the second circuit. electronic device testing method according to claim 7 or 8 in a circuit. The first impulse waveform is a waveform for measuring the impedance of the electronic component under test, and the second impulse waveform is a waveform for measuring the capacitance of the electronic component under test. is there,
Or electronic device testing method according to any one of claims 7 9 first impulse waveform is the second impulse waveform is the capacitance measurement waveform is the impedance measurement waveform. The electronic component test method according to any one of claims 7 to 10 , wherein an AC waveform is used instead of the impulse waveform. It tested electronic component electronic device testing method according to any one of claims 7 11 which is a capacitor.

Images