JP6664301B2 - Apparatus and method for processing waste electronic substrate - Google Patents

Description

  The present invention relates to a processing apparatus and a processing method for a waste electronic substrate, which is a waste of an electronic substrate mounted on an electronic device, an automobile, or the like.

  2. Description of the Related Art Electronic devices such as mobile phones and PCs are equipped with electronic substrates on which a large number of electronic components such as resistors and semiconductor chips are mounted. Also, various printed circuit boards are used in various places such as automobiles for control and power supply. These electronic substrates include noble metals such as gold and copper used for surface treatment and the like, and rare metals such as nickel derived from electronic components. Therefore, collecting these valuable resources from discarded electronic substrates is extremely useful for Japan, which has scarce resources.

  In order to recover the valuable resources from the waste electronic substrate, separation and recovery by roasting, crushing or pulverizing, sorting, leaching and the like are performed. The roasting treatment aims at separating plastics and the like contained in the waste electronic substrate from metals containing useful metals as a carbonized mixture.

  By the way, regarding the roasting treatment of a waste lithium ion battery, as described in Patent Document 1, the present applicant stores a battery pack in a heat-resistant container provided with an exhaust port, and then determines the melting point of aluminum in a heat treatment furnace. Has also been proposed in which the useful metal is recovered by heating at a low temperature, carbonizing the battery pack in the heat-resistant container, separating the carbonized mixture.

JP 2016-22395 A

  The technique described in Patent Document 1 is effective when roasting a waste lithium ion battery. However, when this technique is diverted to roasting a waste electronic substrate, oxygen spreads to the inside of the waste electronic substrate. Therefore, there is a problem that the state becomes close to a reducing atmosphere and the roasting takes a long time, and a sufficient amount of treatment cannot be obtained.

  Therefore, the present invention has been made in view of the above-mentioned problems in the related art, and has as its object to provide an apparatus and a method for processing a large amount of waste electronic substrates in a short time.

  In order to achieve the above object, a waste electronic substrate processing apparatus according to the present invention is a bottomed cylindrical heat-resistant container for housing a waste electronic substrate, wherein a slit formed on a side surface and a vertical portion from a central portion of an inner bottom surface are provided. A heat-resistant container having a cylindrical member having a plurality of openings formed in a side surface thereof, and a cylindrical furnace wall, and supplying fuel in a horizontal direction along an inner surface of the furnace wall. It is characterized by comprising a heat treatment furnace having a burner to squirt, an exhaust pipe at the center of a circular ceiling in a top view, and a container transfer device capable of charging and discharging the heat-resistant container to and from the heat treatment furnace.

  According to the present invention, when separating the plastics and the like of the waste electronic substrate from the metal containing the useful metal as the carbonized mixture, the ventilation spreads to the inside of the waste electronic substrate in the heat-resistant container via the slit and the tubular member. Therefore, the temperature rise time of 200 ° C. to 400 ° C., which is the decomposition temperature of plastics, can be accelerated, and the processing amount per batch can be increased. Can be greatly increased.

  In the waste electronic substrate processing apparatus, the slit is provided to extend in a horizontal direction, and may be provided in a plurality of steps in a vertical direction, or a total area of an opening formed in a side surface of the cylindrical member may be reduced by the cylinder. It can be 20% or more of the area of the entire side surface of the shaped member.

  Outflow prevention means for preventing the waste electronic substrate from flowing out of the heat-resistant container through the slit can be provided, and loss of useful metals can be prevented.

  Further, the method for treating a waste electronic substrate according to the present invention is a bottomed cylindrical heat-resistant container for housing the waste electronic substrate, wherein the slit is formed on a side surface and extends vertically from a central portion of an inner bottom surface. And a heat-resistant container having a cylindrical member having a plurality of openings formed in a side surface thereof, a burner having a cylindrical furnace wall, and injecting fuel in a horizontal direction along an inner surface of the furnace wall, The heat treatment furnace was equipped with a heat treatment furnace having an exhaust pipe at the center of a circular ceiling viewed from above, and a container transfer device capable of loading and unloading the heat-resistant container into and out of the heat treatment furnace. The heat-resistant container is heated from outside by the burner, and the waste electronic substrate inside the heat-resistant container is roasted to separate a carbonized mixture.

  According to the present invention, similarly to the above-described invention, when separating plastics and the like of a waste electronic substrate from a metal containing a useful metal as a carbonized mixture, the waste electronic substrate in the heat-resistant container is passed through the slit and the tubular member. Since the ventilation can be spread to the inside of the substrate, the temperature rise time of 200 ° C. to 400 ° C., which is the decomposition temperature of plastics, can be accelerated, and the throughput of waste electronic substrates can be greatly increased. Become.

  The waste electronic substrate housed in the heat-resistant container is crushed in advance to a maximum size of 150 mm or less, or the internal temperature of the heat treatment furnace is adjusted to 600 ° C or more and 700 ° C or less, so that the waste electronic substrate can be efficiently roasted. it can.

  In the above processing method, the gas discharged through the exhaust pipe of the heat treatment furnace can be introduced into a region of 350 ° C. or higher of the preheater of the cement burning device. As a result, it is not necessary to provide a new facility as a secondary combustion chamber, and fluoride in the combustion gas can be captured by the cement mixture raw material, and VOCs (volatile organic compounds) can also be burned. It can be detoxified.

  As described above, according to the present invention, a large amount of electronic substrates discarded can be processed in a short time.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall cross-sectional view showing an embodiment of a waste electronic substrate processing apparatus according to the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall vertical sectional view showing an embodiment of a waste electronic substrate processing apparatus according to the present invention. 3A and 3B are diagrams showing a heat-resistant container used in the processing apparatus of FIGS. 1 and 2, wherein FIG. 3A is a front view, FIG. 3B is a top view, and FIG. FIG. 4 is a longitudinal sectional view showing the heat-resistant container of FIG. 3. It is sectional drawing which shows the modification of the slit formed in the inner cylinder of the heat resistant container of FIG. FIG. 3 is a cross-sectional view showing a heat-resistant container immediately before being charged into a heat treatment furnace in the processing apparatus of FIGS. 1 and 2. FIG. 3 is a longitudinal sectional view showing a heat-resistant container immediately before being put into a heat treatment furnace in the processing apparatus of FIGS. 1 and 2. It is a figure which shows the container main body of the heat resistant container used by the comparative example, (a) is a front view, (b) is a top view, (c) is a bottom view. It is a figure which shows the lid | cover of the heat resistant container used by the comparative example, (a) is a front view, (b) is a top view. FIG. 10 is a longitudinal sectional view showing a state where a heat-resistant container is configured by combining the container body of FIG. 8 and the lid of FIG. 9. In the temperature rise graph in the test example, the vertical axis indicates the raw material temperature (° C.), and the horizontal axis indicates the time during operation.

  Next, an embodiment of the present invention will be described in detail with reference to the drawings.

  As shown in FIGS. 1 and 2, in the waste electronic substrate processing apparatus 1 according to the present invention, what was mounted on an electronic device or an automobile was collected as waste and crushed in advance by a substrate shredder or the like. The waste electronic substrate (hereinafter abbreviated as “substrate”) 40 is subjected to a heat treatment to recover useful metals. The plurality of heat-resistant containers 2 accommodating the substrate 40, the heat treatment furnace 3, and the heat treatment furnace 3 It is provided with a container transport device 4 for charging and discharging the heat-resistant container 2 and the like.

  The heat-resistant container 2 is made of steel or the like and has a heat-resistant temperature of at least 650 ° C. As shown in FIG. 3, the heat-resistant container 2 has an inner cylinder 2a opened upward and formed in a cylindrical shape, and an outer cylinder arranged so as to surround the inner cylinder 2a with a larger diameter than the inner cylinder 2a. 2b, a plurality of wheels 2c arranged on the bottom surface 2j of the inner cylinder 2a and the outer cylinder 2b, two handles 2e fixed to the peripheral surface 2d of the outer cylinder 2b, and protruding from the peripheral surface 2d of the outer cylinder 2b. Hanger 2f.

  On the side surface of the inner cylinder 2a, slits 2g extending horizontally in an arc shape having a center angle of substantially 180 ° are formed in three steps in the vertical direction in order to promote ventilation to the inside of the heat-resistant container 2. Is done. As shown in FIG. 4, a cylindrical member 2 h made of punched metal extends vertically upward from the center of the bottom surface 2 j in the heat-resistant container 2 in order to promote ventilation to the inside of the heat-resistant container 2. Is established.

  The slits 2g are not limited to those described above, and may be formed over substantially the entire periphery of the side surface. The number of slits is not limited to three in the vertical direction, and may be two or less or four or more. The cylindrical member 2h need not be made of punching metal, but may be formed in a cylindrical shape and provided with a plurality of openings for ventilation on the side surface. It is preferable that the area is 20% or more of the area of the entire side surface of the cylindrical member 2h. The diameter of the cylindrical member 2h is preferably 5 cm or more in order to secure ventilation. The diameter or width of the opening formed in the side surface of the cylindrical member 2h is preferably 5 to 30 mm so that the waste electronic substrate 40 does not pass through the opening. The width of the slit 2g is preferably 5 to 30 mm so that the waste electronic substrate 40 does not pass through and flow out.

  When the waste electronic substrate 40 is accommodated in the inner cylinder 2a of the heat-resistant container 2 in order to prevent the waste electronic substrate 40 from flowing out through the slit 2g, as shown in FIG. A bent portion 2k may be provided in 2a to form a slit 2m. Further, a concave portion (not shown) is formed in the heat-resistant container 2 for receiving and storing the waste electronic board 40 flowing out to the outside during the heat treatment, thereby preventing a melt such as plastic from spilling out of the heat-resistant container 2. Is also good.

  As shown in FIGS. 1 and 2, the heat treatment furnace 3 is a cylindrical vertical furnace having a furnace wall 7 formed of a steel plate covered with a refractory material, and includes four gas burners 8 (8A to 8D). Heated by A nozzle 11 (11A to 11D) is provided near the gas burner 8, and combustion and cooling air A sent through a fan (not shown) is supplied into the furnace. A thermometer 13 and a pressure gauge 14 are provided for measuring the temperature and pressure in the furnace. The number of gas burners 8 and nozzles 11 is not limited to four, but may be three or less or five or more.

  The hearth 17 of the heat treatment furnace 3 is made of a steel plate covered with a refractory material similarly to the furnace wall 7, and is rotated around a vertical axis by a hearth rotating device 19 equipped with an electric motor (not shown), so that a positioning sensor ( (Not shown).

  An opening 7a is formed in a part of the furnace wall 7 of the heat treatment furnace 3 and is vertically separated from the outside by a furnace door 7b that can be opened and closed. At a position opposed to the opening 7a, the container transfer device 4 for charging the heat-resistant container 2 into the heat treatment furnace 3 from the opening 7a and discharging the heat-resistant container 2 after making a round in the heat treatment furnace 3 from the heat treatment furnace 3 is provided. Provided.

  As shown in FIGS. 1, 2, 6, and 7, the container transfer device 4 extends in a direction (a left-right direction in FIG. 1) on a line connecting the opening 7 a of the heat treatment furnace 3 and the center of the heat treatment furnace 3. A pusher portion 4a which contacts the heat-resistant container 2 by the forward rotation of the motor 18 to push the heat-resistant container 2 into the heat treatment furnace 3 and a claw 4c for locking a hanger 2f provided on the outer periphery of the heat-resistant container 2 are provided at the tip. A pull-out portion 4b is provided to pull out the heat-resistant container 2 from the inside of the heat treatment furnace 3 by the negative rotation of the motor 18. The pusher part 4a is arranged right above the pull-out part 4b.

  Immediately before the heat-resistant container 2 is put into the heat treatment furnace 3, that is, when the heat-resistant container 2 is located outside the openable furnace body door 7b, the tangential direction of the heat treatment furnace 3 (the vertical direction in FIG. 1). The slide base 21 is mounted on a slide base 21 that is movable in the furnace, and the slide base 21 is moved by a base moving device 22 connected to the end of the slide base 21 to a furnace front chamber 23 (FIG. 1) and a stand 25 located outside with the open / close type furnace front door 24 interposed therebetween. The furnace front chamber 23 is separated from the outside by a furnace front door 24, and is separated from the heat treatment furnace 3 by a furnace door 7b so as to suppress a temperature change when the furnace door 7b is opened. I have to. Further, by providing the furnace front chamber 23, the atmosphere in the heat treatment furnace 3 can be maintained, and dangerous gas leakage and hot air blowing can be prevented.

  When the slide base 21 moves onto the stand 25, the heat-resistant container 2 before being heated by the crane (not shown) is placed on the slide base 21, and then is carried to the furnace front chamber 23 by the base moving device 22. After being heated, the heat-resistant container 2 is similarly transported from the furnace front chamber 23 to the stand 25 by the base moving device 22 and then automatically moved to a cooling chamber (not shown). The base moving device 22 moves the slide base 21 connected to the tip of the shaft 22b by extending and contracting the shaft 22b by driving the motor 22a.

  As shown in FIGS. 1 and 2, a secondary combustion chamber 27 is provided at a position away from the heat treatment furnace 3, and the secondary combustion chamber 27 and the heat treatment furnace 3 are connected by an exhaust pipe 28. The exhaust pipe 28 is provided with a fan 29 for sending unburned gas in the heat treatment furnace 3 to the secondary combustion chamber 27 via the exhaust pipe 28.

  The secondary combustion chamber 27 is also heated by the gas burner 34, and the combustion air of the unburned gas is supplied into the secondary combustion chamber 27 via the fan 30 in the secondary combustion chamber 27. The temperature inside the secondary combustion chamber 27 is measured by a thermometer 32. The secondary combustion chamber 27 is provided with a chimney 31 for exhaust.

  As shown in FIG. 2, the heat treatment furnace 3 side of the exhaust pipe 28 is guided into the heat treatment furnace 3 from the center of the ceiling of the heat treatment furnace 3, and the position of the tip 28 a is accommodated inside the heat-resistant container 2. It is set to be lower than the upper end position of the substrate 40. Here, the position of the tip (lower end) 28a of the exhaust pipe 28 is set lower than the upper end of the substrate 40 accommodated in the heat-resistant container 2, so that the hot air flows from above to below and from below in the heat treatment furnace 3. The convection largely flows upward, and the substrate 40 inside the heat-resistant container 2 is efficiently roasted in combination with the promotion of the ventilation into the heat-resistant container 2 by the slit 2g. Thus, a large number of substrates 40 can be processed in a short time.

  Immediately above the heat treatment furnace 3 in the exhaust pipe 28, a damper 33 for adjusting the pressure inside the heat treatment furnace 3 is provided. For example, when the pressure in the heat treatment furnace 3 increases, the damper 33 is opened, and the heat treatment furnace 3 is opened. The negative pressure inside is maintained. The illustrated butterfly valve or the like can be used for the damper 33.

  Next, a method of processing a waste electronic substrate using the waste electronic substrate processing apparatus 1 having the above configuration will be described.

  (1) After performing pre-purge for discharging the residual gas inside the heat treatment furnace 3 to the outside of the furnace, the gas burner 8 is ignited to raise the furnace temperature from 600 ° C. to 700 ° C. to keep the temperature constant.

  (2) Open the furnace front chamber door 24 and advance the slide base 21 to the position of the stand 25 provided outside the furnace front chamber 23 via the base moving device 22. Then, using a crane (not shown), the heat-resistant container 2 containing the substrate 40 is placed on the slide base 21 moved to the position of the stand 25 as shown in FIGS.

  (3) The slide base 21 is retracted from the position of the stand 25 to the inside of the furnace front chamber 23 via the base moving device 22, and the furnace front chamber door 24 is closed.

  (4) After opening the furnace door 7b, the pusher portion 4a of the container transfer device 4 is advanced to put the heat-resistant container 2 into the heat treatment furnace 3. Thus, the heat-resistant container 2 is placed on the hearth 17 of the heat treatment furnace 3 at the position of 9 o'clock in FIG.

  (5) After the pusher portion 4a of the container transfer device 4 is retracted, the furnace body door 7b is closed, and the hearth 17 is rotated 45 ° counterclockwise through the hearth rotating device 19. The rotation at 45 ° is not particularly limited. For example, by setting the hearth 17 to rotate 45 ° every 37.5 minutes, the hearth 17 is set to rotate once in 5 hours. ing.

  (6) By repeating the above processes (1) to (5) seven more times, adjacent heat-resistant containers 2 are spaced at a fixed interval on the hearth 17 of the heat treatment furnace 3 as shown in FIG. Eight heat-resistant containers 2 are placed in a ring shape in an opened state.

  During the above operation, the heat-resistant container 2 is heated from the outside while making one round in the heat treatment furnace 3, so that the plastics contained in the substrate 40 accommodated in the heat-resistant container 2 are roasted to form a carbonized mixture of gold, It is in a state separated from useful metals such as copper and nickel.

  Gas generated by the thermal decomposition of a flammable substance such as plastic is discharged from the upper part of the heat-resistant container 2 into the heat treatment furnace 3 and reused as a heat source in the heat treatment furnace 3. During the heat treatment, the temperature in the heat treatment furnace 3 is controlled by adjusting the amount of oxygen in the air supplied through the nozzle 11 so that the flammable gas released from the heat-resistant container 2 into the heat treatment furnace 3 is heated. The amount of combustion is controlled so that the value measured by the thermometer 13 becomes a desired value or range.

  On the other hand, when the pressure inside the heat treatment furnace 3 becomes a positive pressure, a hot gas is blown out of the furnace from the opening 7a of the heat treatment furnace 3 and it becomes difficult to put and discharge the heat-resistant container 2 into and out of the heat treatment furnace 3. It is necessary to maintain the inside of 3 at a negative pressure. Therefore, the damper 33 is opened and closed according to the measurement value of the pressure gauge 14 to maintain the inside of the heat treatment furnace 3 at a desired value or range. For example, even when the organic compound burns violently during the roasting of the substrate 40 and the pressure inside the heat treatment furnace suddenly rises, the pressure is quickly released by opening the damper 33 and the negative pressure inside the heat treatment furnace 3 is reduced. To maintain. Since the damper 33 is disposed inside the exhaust pipe 28 near the ceiling of the heat treatment furnace 3, it is possible to quickly respond to a pressure change inside the heat treatment furnace 3.

  The unburned gas in the heat treatment furnace 3 is guided to the secondary combustion chamber 27 and burns at a temperature (800 ° C.) higher than the temperature of the heat treatment furnace 3 (600 to 700 ° C.).

  (7) When the heat-resistant container 2 makes one round in the heat treatment furnace 3, the furnace door 7b is opened and the pull-out portion 4b of the container transfer device 4 is advanced to the position of the heat-resistant container 2, and as shown in FIG. The claw 4c provided at the tip of the portion 4b is engaged with a hanger 2f provided in the heat-resistant container 2. Then, the pull-out portion 4b is retracted, the heat-resistant container 2 is pulled out of the heat treatment furnace 3, placed on the slide base 21, and the furnace door 7b is closed.

  (8) Next, after opening the furnace front chamber door 24, the slide base 21 on which the heat-resistant container 2 having been subjected to the heat treatment is placed is advanced through the base moving device 22 to the position of the stand 25. When the front door 24 of the furnace front chamber is half closed in this state and the slide base 21 is returned to the original position, the heat-resistant container 2 comes into contact with the door 24 of the furnace front chamber in the half closed state and is placed on the stand 25. Then, the furnace front chamber door 24 is completely closed.

  (9) After that, the heat-resistant container 2 on the slide base 21 that has been moved to the position of the stand 25 is placed on a transfer conveyor (not shown) and carried to a cooling chamber (not shown). The heat-resistant container 2 may be placed on the transfer conveyor and automatically conveyed by abutting the half-closed furnace front chamber door 24 in (8). Then, instead of the heat-resistant container 2 that has been subjected to the heat treatment, a new heat-resistant container in which the substrate 40 is accommodated by using a crane (not shown) on the slide base 21 in the same manner as shown in (2). 2 is installed, and the following processing (3) is repeatedly performed.

  The heat-resistant container 2 that has been heated and transported to the cooling chamber is subjected to a process of further separating useful metals such as gold, copper, and nickel after crushing and classifying the internal substrate 40 to remove the carbonized mixture.

  According to the processing apparatus and the processing method of the waste electronic substrate configured as described above, when separating the plastics and the like of the substrate 40 from the metal containing the useful metal as the carbonized mixture, the slit 2g and the cylinder of the heat-resistant container 2 are used. Since the ventilation can be spread to all corners inside the substrate 40 accommodated in the heat-resistant container 2 through the shaped member 2h, the heating time of 200 ° C. to 400 ° C., which is the decomposition temperature of plastics, is reduced. Since it is possible to accelerate the processing and to increase the processing amount per batch, the processing amount of the substrate 40 can be greatly increased.

  In addition, the unburned gas is led from the heat treatment furnace 3 to the secondary combustion chamber 27 and burned at a temperature (800 ° C.) higher than the temperature of the heat treatment furnace 3 (600 to 700 ° C.). Can be suppressed.

  In the present embodiment, the uniform heat treatment is performed by using the heat treatment furnace 3 in which the hearth 17 rotates, but the hearth 17 does not necessarily need to rotate. Further, a plurality of heat-resistant containers 2 are continuously charged and discharged into the heat treatment furnace 3, but a batch type can be applied.

  In this embodiment, the case where the furnace temperature in the heat treatment furnace 3 is maintained at about 600 ° C. to 700 ° C. has been described. However, if the temperature of the heat treatment is not lower than the decomposition temperature of plastic (300 ° C.), The material is not particularly limited because it is decomposed and separated from the metal.

  In the present embodiment, the heat treatment furnace 3 using gas is used as the heat source for the heat treatment. However, various furnaces using electricity or heavy oil can be used as the heat source. In addition, effective use of thermal energy can be achieved by using, as a heat source, exhaust gas from an existing manufacturing facility, for example, a cement firing apparatus.

  Further, the gas discharged through the exhaust pipe 28 of the heat treatment furnace 3 can be introduced into the region of 350 ° C. or higher of the preheater of the cement firing apparatus without being introduced into the secondary combustion chamber 27. As a result, the secondary combustion chamber 27 becomes unnecessary, and the fluoride in the combustion gas can be captured by the raw material for cement mixing, and VOC (volatile organic compound) can also be burned, thereby rendering the unburned gas harmless. You can also. According to an experiment in an electric furnace, it was possible to reduce the fluoride concentration in the combustion gas to about 0.4% and the hydrogen fluoride concentration to about 0.45% by using the cement mixture raw material, and dry-process calcium carbide. There is about a 20-fold reduction effect when used as an agent.

  Further, in the present embodiment, a case has been described in which a waste electronic substrate that has been crushed in advance is processed. However, when the waste electronic substrate is originally small, it is not always necessary to crush the waste electronic substrate in advance. In addition, in order to crush the waste electronic substrate, a four-axis crusher or the like can be used in addition to the shredder for the substrate.

  Next, a test example of the waste electronic substrate processing apparatus according to the present invention will be described. In this test, waste electronic substrates crushed by a substrate shredder were processed.

  As an example, the waste electronic substrate processing apparatus 1 shown in FIGS. 1 to 7 was used, and as a comparative example, the heat resistant container shown in FIGS. 8 to 10 was used instead of the heat resistant container 2 shown in FIGS. A container 52 was used, and the other configuration was the same as that of the waste electronic substrate processing apparatus 1.

  As shown in FIG. 10, the heat-resistant container 52 used in the comparative example includes a container body 52A and a lid 52B, both of which have a heat-resistant temperature of at least 650 ° C.

  As shown in FIG. 8, the container main body 52A (SS400) has an inner cylinder 52a (diameter 642 mm, height 800 mm) which is opened upward and is formed in a cylindrical shape, and an inner cylinder 52a having a larger diameter than the inner cylinder 52a. (A diameter of 700 mm, a height of 460 mm), a plurality of wheels 52c disposed on the bottom surfaces of the inner cylinder 52a and the outer cylinder 52b, and a peripheral surface 52d of the outer cylinder 52b. It comprises two handles 52e and a hanger 52f protruding from the peripheral surface 52d of the outer cylinder 52b. As shown in FIG. 7, slits 2g (width 10 mm) extending horizontally in an arc shape having a center angle of approximately 140 ° are formed in three steps near a height of 300 mm in the vertical direction. A cylindrical member 2h (100 mm in diameter) made of punched metal extends vertically upward from the center of the bottom surface 2j. An opening (diameter 20 mm) is formed in the side surface of the cylindrical member 2h.

  On the other hand, as shown in FIG. 9, the lid 52B includes a cylindrical main body 52n that opens downward, an exhaust pipe 52g that opens on the peripheral surface of the main body 52n and projects obliquely upward, and a ceiling of the main body 52n. And a handle 52m provided on the surface 52h. The angle between the exhaust pipe 52g and the horizontal plane is about 45 degrees. The direction of the exhaust pipe 52g is set so that the horizontal component of the velocity vector of the combustion gas ejected from the exhaust pipe 52g is the same as the direction of the vortex combustion of the heat treatment furnace 3.

  In order to form the heat-resistant container 52 by the container main body 52A and the lid 52B, as shown in FIG. 10, the lower end 52k of the main body 52n of the lid 52B is formed in a groove 52j between the inner cylinder 52a and the outer cylinder 52b of the container main body 52A. Is fitted, sand is filled in the groove 52j to form a sand seal, and the lid 52B is attached to the container main body 52A so as to be able to lift up by a predetermined distance L. In Comparative Example 1, the lid 52B was used. In Comparative Example 2, the lid 52B was not used.

  Table 1 shows test conditions and test results. FIG. 12 shows a graph of the temperature rise in the furnace. In the temperature rise graph, the temperature of the raw material was measured by attaching a thermocouple at the center in the height direction near the slit 2g in the heat-resistant container 2 in the embodiment and near the wall surface of the container body 52A in the heat-resistant container 52 in the comparative example. (Material temperature) was measured.

  As Comparative Example 1, the temperature in the heat treatment furnace 3 was set to 600 ° C., and 64 kg of the substrate 40 was charged per one of the heat-resistant containers (with lids) 52 and roasted. As a result, as shown in FIG. 11 (c), the furnace temperature reached 200 ° C. about 1 hour after charging, and reached 400 ° C. about 1 hour 30 minutes after charging. The weight loss rate of the substrate 40 was 16.7%.

As Comparative Example 2, the temperature in the heat treatment furnace 3 was set to 600 ° C., and 64 kg of the substrate 40 was charged per one of the heat-resistant containers (with no lid) 52 and roasted. As a result, as shown in FIG. 11D, the furnace temperature reached 200 ° C. in about 40 minutes after charging, and reached 400 ° C. in about 1 hour after charging. The weight loss rate of the substrate 40 was 19.7%.

  In Example 1, the temperature in the heat treatment furnace 3 was set to 600 ° C., and 92 kg of the substrate 40 was charged per one of the heat-resistant containers 2 and roasted. As a result, as shown in FIG. 11A, the furnace temperature reached 200 ° C. in about 40 minutes after charging, and reached 400 ° C. in about 1 hour after charging. The weight loss rate of the substrate 40 was 24.0%.

  In Example 2, the temperature in the heat treatment furnace 3 was set to 700 ° C., and 92 kg of the substrate 40 was charged per one of the heat-resistant containers 2 and roasted. As a result, as shown in FIG. 11 (b), the furnace temperature reached 200 ° C. 30 minutes after charging, and reached 400 ° C. about 40 minutes after charging. The weight loss rate of the substrate 40 was 21.9%.

  According to the above experiment, even though the input amount of the substrate 40 is more than 40% or more in Examples 1 and 2 than in Comparative Examples 1 and 2, until the decomposition temperature of plastics reaches 200 ° C. to 400 ° C. It can be seen that the time is the same or shorter, that is, the temperature rise rate is high, the weight loss rate of the substrate 40 is high, and unnecessary carbon has burned. Therefore, according to the present invention, a large amount of waste electronic substrates can be processed in a shorter time than in the past, and the recovery efficiency of useful metals can be increased.

DESCRIPTION OF SYMBOLS 1 Waste electronic board processing apparatus 2 Heat-resistant container 2a Inner cylinder 2b Outer cylinder 2c Wheel 2d Peripheral surface 2e Handle 2f Hanger 2g Slit 2h Cylindrical member 2j Bottom surface 2k Bent portion 2m Slit 3 Heat treatment furnace 4 Container transport device 4a Pusher portion 4b Pull-out Part 4c Claw 7 Furnace wall 7a Opening 7b Furnace body door 8 (8A-8D) Gas burner 11 (11A-11D) Nozzle 13 Thermometer 14 Pressure gauge 17 Hearth 18 Motor 19 Hearth rotating device 21 Slide base 22 Base movement Device 22a Motor 22b Shaft 23 Furnace chamber 24 Furnace chamber door 25 Stand 27 Secondary combustion chamber 28 Exhaust pipe 28a Tip 29 Fan 30 Fan 31 Chimney 32 Thermometer 33 Damper 34 Gas burner 40 Waste electronic board

Claims (8)

A bottomed cylindrical heat-resistant container for housing a waste electronic substrate, wherein the slit is formed on a side surface, and extends vertically from a central portion of an inner bottom surface, and a plurality of openings are formed on the side surface. A heat-resistant container having a tubular member,
A heat treatment furnace having a cylindrical furnace wall, a burner that ejects fuel in a horizontal direction along the inner surface of the furnace wall, and an exhaust pipe in the center of a circular ceiling viewed from above,
A waste electronic substrate processing apparatus, comprising: a container transfer device capable of loading and unloading the heat-resistant container into and from the heat treatment furnace.   2. The apparatus according to claim 1, wherein the slit extends in a horizontal direction and is provided in a plurality of stages in a vertical direction. 3.   The processing of a waste electronic substrate according to claim 1, wherein a total area of an opening formed in a side surface of the cylindrical member is 20% or more of an area of the entire side surface of the cylindrical member. apparatus.   The waste electronic substrate processing apparatus according to claim 1, further comprising an outflow prevention unit configured to prevent the waste electronic substrate from flowing out of the heat-resistant container through the slit. A bottomed cylindrical heat-resistant container for housing a waste electronic substrate, wherein the slit is formed on a side surface, and extends vertically from a central portion of an inner bottom surface, and a plurality of openings are formed on the side surface. A heat-resistant container having a tubular member,
A heat treatment furnace having a cylindrical furnace wall, a burner that ejects fuel in a horizontal direction along the inner surface of the furnace wall, and an exhaust pipe in the center of a circular ceiling viewed from above,
Using a processing apparatus having a container transfer device capable of charging and discharging the heat-resistant container to the heat treatment furnace,
A method for treating a waste electronic substrate, comprising: heating the heat-resistant container placed in the heat treatment furnace from the outside with the burner to roast the waste electronic substrate inside the heat-resistant container to separate a carbonized mixture. .   The method for treating a waste electronic substrate according to claim 5, wherein the waste electronic substrate housed in the heat-resistant container is crushed in advance to a maximum size of 150 mm or less.   The method according to claim 5, wherein the internal temperature of the heat treatment furnace is adjusted to 600 ° C. or more and 700 ° C. or less.   8. The method for treating a waste electronic substrate according to claim 5, wherein the gas discharged through an exhaust pipe of the heat treatment furnace is introduced into a region of 350 ° C. or higher of a preheater of a cement firing apparatus.

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