JP6653993B2 - Floor material construction method - Google Patents

Description

  The present invention relates to a floor material construction method for bonding a floor material to a floor surface.

  2. Description of the Related Art Conventionally, a technique of a floor material construction method of bonding a floor material to a floor surface has been known. For example, as described in Patent Document 1.

  In Patent Literature 1, an adhesive tape having a conductor piece disposed between two sheet-like heat-sealing materials is attached to a floor slab, and the floor material is disposed on the adhesive tape. A floor material construction method in which an electromagnetic induction device is run along the surface of the floor material, and the conductor pieces are heated by electromagnetic induction (electromagnetic induction heating) to melt the heat welding material, thereby bonding the floor material to the floor slab. Is described. In such a floor material construction method, even after the heat welding material is solidified and the floor material adheres to the floor slab, the heat welding material can be melted by running the electromagnetic induction device on the adhesive tape again, The flooring can be easily peeled off.

  However, in the technique described in Patent Literature 1, workability in attaching another floor material after bonding the floor material to the floor slab was not good. Specifically, it is as follows.

  In order to construct another flooring, it is necessary to peel off the bonded flooring and adhere another flooring to the floor slab. However, the adhesive tape that has been once subjected to electromagnetic induction heating to bond the floor slab and the floor material does not exhibit an adhesive function even after being subjected to electromagnetic induction heating to peel the floor material and then subjected to electromagnetic induction heating again. Therefore, it is necessary to separately attach a new adhesive tape to the floor slab. At this time, if the adhesive tape that has not been peeled off or the heat-sealing material of the adhesive tape remains on the floor slab, there is a problem that a new adhesive tape is difficult to adhere to the floor slab. There is also a problem that the peeled-off adhesive tape becomes dust.

JP-A-4-368563

  The present invention has been made in view of the above circumstances, and a problem to be solved is to provide a floor material construction with good workability when constructing another floor material after bonding the floor material to the floor surface. It provides a method.

  The problem to be solved by the present invention is as described above. Next, means for solving the problem will be described.

That is, according to claim 1, an adhesive tape attaching step of attaching an adhesive tape formed by applying a hot-melt adhesive to both surfaces of a conductive heating material on a floor surface along one direction, and the adhesive tape A floor material arranging step of arranging a floor material on the floor surface to which is adhered, and electromagnetically heating the adhesive tape by a predetermined heating range in the one direction at a predetermined interval in the one direction. A floor material bonding step of melting the hot-melt adhesive and bonding the floor material to the floor surface, and in the adhesive tape applying step, applying a plurality of rows of the adhesive tape, In the floor material bonding step, the outermost adhesive tape of the plurality of rows of adhesive tapes is smaller during the predetermined heating range than other adhesive tapes, and the predetermined heating range is smaller than the predetermined heating range. Heating range To be greater than, the adhesive tape is to electromagnetic induction heating.

In claim 2, the predetermined interval between the other adhesive tapes is 250 to 350 mm, and the predetermined interval between the outermost adhesive tapes is 100 to 200 mm .

Claim 3 further comprises, before the flooring arranging step, a double-sided tape attaching step of attaching a double-sided tape to an end of the floor surface.

In a fourth aspect, the method further comprises a sealing step of sealing between an end of the floor material and the floor surface .

  The present invention has the following effects.

  According to the first aspect, the workability when constructing another floor material after bonding the floor material to the floor surface can be improved.

According to the second aspect, it is possible to suppress the floating of the floor material on the floor surface while shortening the time for bonding the floor material .

According to the third aspect, the floor material can be temporarily fixed to the floor surface before the floor material is bonded to the floor surface with the adhesive tape. In addition, it is possible to suppress the floating of the end of the floor material .

According to the fourth aspect, it is possible to prevent the water from entering between the floor surface and the floor material and peeling the floor material .

The top view showing the state where the double-stick tape and the adhesive tape were stuck on the existing floor material. FIG. 4 is a plan view showing a state in which a new floor material is placed on an existing floor material and an adhesive tape is heated by electromagnetic induction. FIG. 4 is a plan view showing a portion where electromagnetic induction heating is performed. AA sectional drawing of FIG. The flowchart of the flooring construction method which concerns on one Embodiment of this invention. The (a) top view and the (b) BB sectional view showing the state where the new floor material was peeled off and another floor material was constructed on the floor surface of the existing floor material. The (a) top view and the (b) CC sectional view showing the state where another floor material was constructed on the new floor material while the new floor material was adhered to the floor surface of the existing floor material. The top view which showed the sticking position of the adhesive tape in the adhesive tape sticking process of the floor material construction method which concerns on other embodiment of this invention.

  In the following description, an up-down direction, a left-right direction, and a front-back direction are respectively defined according to arrows shown in the drawings.

  Hereinafter, a floor material construction method according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5.

  The flooring construction method according to one embodiment of the present invention is a method for constructing a new flooring on the floor of an existing flooring. A floor material application method according to an embodiment of the present invention includes a double-sided tape attaching step, an adhesive tape attaching step, a floor material arranging step, a floor material attaching step, and a sealing step.

  First, a double-sided tape attaching step is performed (Step S101). In the double-sided tape attaching step, the double-sided tape 3 is attached to the end of the floor surface 1 a of the existing floor material 1. Specifically, the double-sided tape 3 is attached to the left and right ends of the floor 1a along the front-rear direction from near the front end to near the rear end of the existing floor material 1 and near the left end of the existing floor material 1. To the right and left end portions of the floor surface 1a along the left and right direction from the vicinity of the right end (see FIG. 1). Note that the existing flooring 1 is a flooring that has already been constructed on a floor slab such as a concrete slab.

  Next, an adhesive tape attaching step is performed (Step S102). In the adhesive tape attaching step, the adhesive tape 2 is attached to the floor surface 1a of the existing floor material 1 (see FIGS. 1 and 4). The adhesive tape 2 includes a conductive heating material 21 and a hot-melt adhesive 22.

  The conductive heating material 21 shown in FIG. 4 generates heat by electromagnetic induction. The conductive heating material 21 is formed in a rectangular sheet shape in plan view. The conductive heating material 21 is formed from a metal material such as an aluminum foil, for example.

  The hot-melt adhesive 22 shown in FIG. 4 is a hot-melt adhesive that performs bonding by melting with heat. The hot-melt adhesive 22 is applied to both surfaces of the conductive heating material 21 to form a layer. The hot-melt adhesive 22 is formed from, for example, a thermoplastic resin such as polyamide.

  The adhesive tape 2 configured in this manner is provided in the area surrounded by the double-sided tape 3 along the left-right direction from the vicinity of the left end to the vicinity of the right end of the existing floor material 1 in the vicinity of the front and rear ends of the floor surface 1a. Pasted. Further, the adhesive tape 2 is attached along the front-rear direction from the vicinity of the front end to the vicinity of the rear end of the existing floor material 1 (between the adhesive tapes 2 attached along the left-right direction). The adhesive tape 2 is attached in four rows in the left-right direction (see FIG. 1).

  Next, a flooring arrangement step is performed (step S103). In the floor material arranging step, the new floor material 4 is arranged on the floor surface 1a to which the adhesive tape 2 has been attached. That is, the new floor member 4 is arranged so that the adhesive tape 2 and the double-sided tape 3 are interposed between the existing floor member 1 and the new floor member 4 (see FIGS. 2 and 4). The new floor material 4 is formed in a plate shape having substantially the same shape as the existing floor material 1 in plan view. The new flooring 4 is formed from a sheet made of, for example, vinyl chloride.

  Next, a floor material bonding step is performed (Step S104). In the floor material bonding step, the adhesive tape 2 is electromagnetically heated from above the new floor material 4 by the electromagnetic induction heating device 5 (see FIGS. 2 and 4).

  The electromagnetic induction heating device 5 includes a coil (not shown) wound around an axis extending in the vertical direction. A high frequency power supply is connected to the coil. When a current flows from the high-frequency power supply to the coil, a line of magnetic force (alternating magnetic field) is generated around the coil. When the magnetic flux reaches the conductive heating material 21, an eddy current is generated inside the conductive heating material 21. As a result, the conductive heating material 21 generates heat, and the temperature of the conductive heating material 21 can reach the melting temperature of the hot-melt adhesive 22.

  The conductive heating material 21 is electromagnetically heated by the electromagnetic induction heating device 5 configured as described above, so that the hot-melt adhesive 22 is melted. After the hot-melt adhesive 22 is melted, pressure is applied to the newly-installed floor material 4 from above until the hot-melt adhesive 22 cools and solidifies (compressing), whereby the existing floor material 1 and the new floor material are combined. 4 are adhered.

  The electromagnetic induction heating is performed not on the entire surface of the adhesive tape 2 but on a part of the adhesive tape 2. Specifically, the electromagnetic induction heating is performed at predetermined intervals in the longitudinal direction of the adhesive tape 2. With respect to the adhesive tape 2 attached along the front-back direction, the electromagnetic induction heating is performed at predetermined intervals in the front-back direction. With respect to the adhesive tape 2 stuck along the left-right direction, the electromagnetic induction heating is performed at predetermined intervals in the left-right direction.

  Specifically, the electromagnetic induction heating is performed on a region a indicated by hatching in FIG. The area a has a minimum area required for bonding the existing floor material 1 and the new floor material 4 or more. The outermost adhesive tape 2 in the left-right direction among the adhesive tapes 2 applied along the front-rear direction is subjected to electromagnetic induction heating at a pitch L1 in the front-rear direction. Among the adhesive tapes 2 to be applied along the front-rear direction, the other (the center side in the left-right direction) of the adhesive tape 2 is subjected to electromagnetic induction heating with a pitch L2 in the front-rear direction. The pitch L1 has a larger value than the length of the region a in the front-rear direction when the area of the region a is the minimum area necessary for the bonding. The pitch L1 is smaller than the pitch L2. Specifically, the pitch L1 is 100 to 200 mm, and the pitch L2 is 250 to 350 mm. At this time, the pitch in the left-right direction between the adhesive tapes 2 is not limited, but is 1000 mm or less, preferably 300 to 600 mm. The pitch in the left-right direction of the electromagnetic induction heating of the adhesive tape 2 applied along the left-right direction is substantially equal to the pitch L1.

  Next, a sealing step is performed (Step S105). In the sealing step, the space between the end of the new floor material 4 and the existing floor material 1 is sealed. Specifically, the space between the end of the new floor material 4 and the end of the floor surface 1a is sealed with the seal adhesive 6 (see FIG. 4). This sealing can be performed over the entire periphery of the end of the new flooring 4. Accordingly, it is possible to prevent water from entering between the floor surface 1a and the lower surface of the new floor material 4 and peeling of the new floor material 4. As the seal adhesive 6, for example, a known seal adhesive such as a silicon-based adhesive can be used.

  Through the above steps, the new flooring 4 can be bonded to the existing flooring 1. When the new floor material 4 is peeled off, the conductive heating material 21 is again subjected to electromagnetic induction heating. Specifically, in the floor material bonding step, a portion (region a) where the existing floor material 1 and the new floor material 4 are bonded by electromagnetic induction heating is electromagnetically heated from above the new floor material 4 by the electromagnetic induction heating device 5. It is heated again by electromagnetic induction. As a result, the hot-melt adhesive 22 is melted, so that the new flooring 4 can be easily peeled off.

  As described above, since the floor material construction method of the present embodiment does not use a fixing tool such as a nail or a solvent-based adhesive, adhesion and peeling are easy.

  Further, by performing the electromagnetic induction heating at predetermined intervals (pitch L1 and pitch L2) in the longitudinal direction of the adhesive tape 2, the work time required for the electromagnetic induction heating can be reduced. Furthermore, the pitch L1 is set to 200 mm or less (100 to 200 mm) and the pitch L2 is set to 350 mm or less (250 to 350 mm). The required work time can be reduced.

Further, the double-sided tape 3 is attached to the floor surface 1a of the existing floor material 1 so that the new floor material 4 can be temporarily fixed to the existing floor material 1. Thus, it is possible to prevent the position of the new flooring material 4 from shifting during the electromagnetic induction heating.
In addition, when the end of the new floor material 4 is located near the wall, it is difficult for the electromagnetic induction heating device 5 to electromagnetically heat the portion near the wall. Therefore, it is difficult to adhere the portion near the wall with the adhesive tape 2. However, the use of the double-sided tape 3 makes it possible to adhere the end of the new floor material 4 without using the adhesive tape 2 on the side of the wall, and to prevent the end of the new floor material 4 from floating. it can.

  The floor material construction method of the present embodiment has good workability when constructing another floor material even after the new floor material 4 is bonded to the floor surface 1a of the existing floor material 1. As a method of constructing another floor material after constructing the new floor material 4, (1) a method of peeling the new floor material 4 and constructing another floor material on the floor surface 1a of the existing floor material 1; A method of constructing another floor material on the new floor material 4 while the new floor material 4 is adhered to the floor surface 1a of the existing floor material 1 is used.

  First, with reference to FIG. 3 and FIG. 6, a method of (1) peeling the new floor material 4 and constructing another floor material on the floor surface 1 a of the existing floor material 1 will be described.

  When the new floor material 4 is peeled off after the new floor material 4 is bonded to the floor surface 1a of the existing floor material 1, the bonding area between the floor surface 1a and the new floor material 4 (the area a shown by hatching in FIG. 3) is set to the new floor material. The material 4 is subjected to electromagnetic induction heating by the electromagnetic induction heating device 5 to melt the hot-melt adhesive 22 in the region a. With the hot-melt adhesive 22 molten, the new flooring 4 is peeled off. Next, the double-sided tape 3 is peeled off from the floor surface 1 a of the existing floor material 1.

  In the double-sided tape attaching step, a new double-sided tape 3a is attached to the floor 1a of the existing floor material 1. The new double-sided tape 3a is attached to the same position as the original double-sided tape 3.

  In the floor material arranging step, the second new floor material 7 is arranged (on the adhesive tape 2) on the floor surface 1a of the existing floor material 1 with the adhesive tape 2 left on the floor surface 1a of the existing floor material 1. . The second newly provided flooring 7 is a flooring to be newly constructed.

  In the floor material bonding step, the conductive heating material 21 is electromagnetically heated from above the second newly provided floor material 7 by the electromagnetic induction heating device 5. At this time, the area a where the existing floor material 1 and the new floor material 4 are bonded has been melted twice for bonding and peeling, and does not exhibit the bonding function even if electromagnetic induction heating is performed again. Therefore, a region other than the region a in the adhesive tape 2 is heated by electromagnetic induction from above the second newly provided flooring 7. Specifically, a region (region b shown by hatching (solid line) in FIG. 6) formed between regions a in the range of the adhesive tape 2 is subjected to electromagnetic induction heating. The length in the longitudinal direction of the region b is smaller than the pitch L1. The region b has a minimum area required for bonding the existing floor material 1 and the second new floor material 7 or an area larger than the minimum area. Since the area b is not used for bonding the existing floor material 1 and the new floor material 4, the existing floor material 1 and the second new floor material 7 can be bonded.

  According to the floor material construction method according to the present embodiment, the existing floor material 1 and the second new floor material 7 are bonded using the area b not used for bonding the existing floor material 1 and the new floor material 4. Therefore, it is not necessary to newly attach the adhesive tape 2 to the floor surface 1a of the existing floor material 1. In addition, there is no need to remove the adhesive tape 2 and remove the hot-melt adhesive 22 from the floor 1a. Therefore, work time can be reduced. Further, since the pitch L1 has a value larger than the length in the longitudinal direction of the regions a, it is possible to secure a bonding margin between the existing floor material 1 and the second new floor material 7 between the regions a.

  Next, with reference to FIGS. 3 and 7, (2) a method of constructing another floor material on the new floor material 4 while the new floor material 4 is adhered to the floor surface 1 a of the existing floor material 1 will be described. I do.

  When the second new floor material 7 is bonded onto the new floor material 4 while the new floor material 4 is bonded to the floor surface 1a of the existing floor material 1, first, in the double-sided tape attaching step, the double-sided tape 3b is attached to the new floor material. Paste on 4. The double-sided tape 3b is attached to the same position as the double-sided tape 3 in plan view.

  In the adhesive tape attaching step, the adhesive tape 2a is attached on the new floor material 4. The adhesive tape 2a is attached to the same position as the adhesive tape 2 between the existing floor material 1 and the new floor material 4 in plan view.

  In the flooring arranging step, the second new flooring 7 is arranged on the new flooring 4 (on the adhesive tape 2a).

  In the floor material bonding step, the adhesive tape 2a is electromagnetically heated by the electromagnetic induction heating device 5 from above the second new floor material 7. At this time, a region other than the region a in the adhesive tape 2 is heated by electromagnetic induction. Specifically, a region formed between regions a in the front-rear direction (region c shown by hatching (solid line) in FIG. 7) is subjected to electromagnetic induction heating. The area c is the same area as the area b (see FIG. 6) in plan view.

  The reason that the region c, which is a region different from the region a, is subjected to electromagnetic induction heating is that when the region a is heated from above the second newly provided flooring 7 by the electromagnetic induction, the hot-melt adhesive 22 of the adhesive tape 2 in the region a is heated. This is because the existing floor material 1 and the new floor material 4 are peeled off due to melting. The area c is heated by electromagnetic induction from above the second newly provided flooring material 7, thereby bonding the newly provided flooring material 4 and the second newly provided flooring material 7 while maintaining the adhesion between the existing flooring material 1 and the new flooring material 4. can do. Furthermore, since the hot-melt adhesive 22 in the area c of the adhesive tape 2 is melted and exerts an adhesive action, the existing floor material 1 and the new floor material 4 can be more firmly bonded.

  Further, since the new floor member 4 and the second floor member 7 can be bonded in the area c, it is not necessary to bond the adhesive tape 2a to the adhesive tape 2 at a different position in plan view. Therefore, it is possible to easily secure a space for attaching the adhesive tape 2a (a margin for bonding the second new floor member 7).

As described above, the floor material application method according to the present embodiment applies the adhesive tape 2 formed by applying the hot-melt adhesive 22 to both surfaces of the conductive heating material 21 along the floor surface 1a in one direction. An adhesive tape attaching step of attaching, a floor material arranging step of arranging a new floor material 4 (floor material) on the floor surface 1a to which the adhesive tape 2 is affixed, and applying the adhesive tape 2 in a predetermined direction in the one direction. A floor material bonding step of melting the conductive heating material 21 and bonding the new floor material 4 to the floor surface 1a by electromagnetic induction heating at intervals.
With this configuration, it is possible to improve the workability when constructing the second new floor member 7 (another floor member) after the new floor member 4 is bonded to the floor surface 1a.

Further, in the floor material application method according to the present embodiment, in the adhesive tape attaching step, the adhesive tape 2 is attached in a plurality of rows, and in the floor material attaching step, the outermost adhesive of the plurality of rows of the adhesive tapes 2 is attached. The adhesive tape 2 is subjected to electromagnetic induction heating so that the tape 2 has a smaller predetermined interval than other adhesive tapes 2.
With this configuration, it is possible to reduce the time required for the work of bonding the new flooring material 4.

Further, in the floor material construction method according to the present embodiment, the predetermined interval between the other adhesive tapes 2 is 250 to 350 mm, and the predetermined interval between the outermost adhesive tapes 2 is 100 to 200 mm. There is something.
With this configuration, it is possible to suppress the floating of the new floor material 4 with respect to the floor surface 1a while shortening the time for bonding the new floor material 4.

Further, the floor material application method according to the present embodiment further includes a double-sided tape attaching step of attaching a double-sided tape 3 to an end of the floor surface 1a before the floor material arranging step.
With this configuration, it is possible to temporarily fix the new floor material 4 to the floor surface 1a before bonding the new floor material 4 to the floor surface 1a with the adhesive tape 2. In addition, it is possible to suppress the floating of the end of the new flooring 4.

Moreover, the floor material construction method according to the present embodiment further includes a sealing step of sealing between an end portion of the floor material and the floor surface.
With this configuration, it is possible to prevent water from entering between the floor surface 1a and the new floor material 4 and peeling off the new floor material 4.

  As described above, the embodiments of the present invention have been described, but the present invention is not limited to the above configuration, and various changes can be made within the scope of the invention described in the claims.

  For example, in the present embodiment, the new floor material 4 is attached to the floor surface 1a of the existing floor material 1, but the present invention is not limited to this. For example, the new flooring 4 may be directly attached to the floor of a slab such as a concrete slab.

  Further, in the present embodiment, in the adhesive tape attaching step, one adhesive tape 2 is attached from the vicinity of the front end to the vicinity of the rear end of the existing floor material 1 and from the vicinity of the left end to the vicinity of the right end. However, the present invention is not limited to this. For example, as shown in FIG. 8, a plurality of adhesive tapes 2 are attached at intervals in the front-rear direction from the vicinity of the front end to the vicinity of the rear end of the existing flooring 1, and from the vicinity of the left end to the vicinity of the right end of the existing flooring 1. A plurality of adhesive tapes 2 may be attached at intervals in the left-right direction.

  Further, in the present embodiment, the adhesive tape 2 is stuck in four rows in the left-right direction, but the number of rows of the adhesive tape 2 is not limited to this. The number of rows of the adhesive tape 2 may be one, two, three, or five or more.

  Further, in the present embodiment, the pitch L1 in the front-rear direction of the electromagnetic induction heating of the outermost adhesive tape 2 in the left-right direction in the left-right direction among the adhesive tapes 2 pasted in the front-rear direction is 100 to 200 mm, Although the pitch L2 in the front-back direction of the electromagnetic induction heating of the adhesive tape 2 is set to 250 to 350 mm, it is not limited to this. The pitch L1 may be less than 100 mm or more than 200 mm. The pitch L2 may be less than 250 mm or more than 350 mm.

  Further, in the present embodiment, the double-sided tape sticking step is performed before the adhesive tape sticking step. However, the present invention is not limited to this. For example, the double-sided tape attaching step can be performed after the adhesive tape attaching step.

  Further, in the present embodiment, the double-sided tape 3 is attached to the left and right ends and the front and rear ends of the floor surface 1a, but the present invention is not limited to this. For example, the double-sided tape 3 may be stuck to only the left and right ends of the floor 1a.

  Further, in the present embodiment, in the sealing step, the space between the end of the new floor material 4 and the end of the floor surface 1a is sealed over the entire circumference of the new floor material 4, but is not limited to this. It is not something to be done. In the sealing step, it is sufficient that a part of the end of the new floor material 4 and the floor surface 1a are sealed, and for example, the left and right end portions of the new floor material 4 and the left and right end portions of the floor surface 1a are sealed. Only the space may be sealed. Further, it is not always necessary to seal the outermost end of the new flooring material 4, and the seal may be provided at a slight distance from the outermost end.

DESCRIPTION OF SYMBOLS 1 Existing floor material 2 Adhesive tape 3 Double-sided tape 4 New floor material 5 Electromagnetic induction heating device 21 Conductive heating material 22 Hot-melt adhesive

Claims (4)

An adhesive tape formed by applying a hot-melt adhesive to both surfaces of the conductive heating material, and an adhesive tape attaching step of attaching the adhesive tape to the floor surface in one direction,
A floor material arranging step of arranging a floor material on the floor surface to which the adhesive tape is stuck,
The adhesive tape is heated at a predetermined interval in the one direction by electromagnetic induction heating at one place in a predetermined heating range in the one direction, so that the hot-melt adhesive is melted and the floor is placed on the floor surface. A floor material bonding process for bonding materials,
With
In the adhesive tape attaching step, a plurality of rows of the adhesive tape are attached,
In the floor material bonding step, the outermost adhesive tape of the plurality of rows of adhesive tapes is smaller during the predetermined heating range than other adhesive tapes, and the predetermined heating range is smaller than the predetermined heating range. Electromagnetic induction heating the adhesive tape so as to be larger than the heating range,
Floor material construction method. The predetermined interval of the other adhesive tape is 250 to 350 mm,
The predetermined interval of the outermost adhesive tape is 100 to 200 mm,
The floor material construction method according to claim 1 . Prior to the flooring arrangement step, further comprising a double-sided tape sticking step of sticking a double-sided tape to the end of the floor surface,
The floor material construction method according to claim 1 or 2 . Further comprising a sealing step of sealing between the end of the floor material and the floor surface,
The flooring construction method according to any one of claims 1 to 3.

Images