JP2016148226A - Floor material construction method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a floor material construction method in which workability is favorable when constructing another floor material after adhering a newly installed floor material 4 to a floor surface 1a.SOLUTION: A floor material construction method includes: an adhesive tape sticking step of sticking an adhesive tape 2 which is formed by a hot-melt adhesive agent 22 being coated on both surfaces of a conductive heat generation material 21 on a floor surface 1a along one direction; a floor material arrangement step of arranging a newly installed floor material 4 (floor material) on the floor surface 1a on which the adhesive tape 2 is stuck; and a floor material adhesive step of adhering the newly installed floor material 4 to the floor surface 1a by melting the conductive heat generation material 21 by performing electromagnetic induction heating on the adhesive tape 2 at a predetermined interval in the one direction.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a floor material construction method for bonding a floor material to a floor surface.

  Conventionally, the technique of the flooring construction method which adhere | attaches a flooring on a floor surface is well-known. For example, as described in Patent Document 1.

  In Patent Document 1, an adhesive tape in which a conductor piece is disposed between two sheet-like heat welding materials is attached to a floor slab, and the floor material is disposed on the adhesive tape. The floor material construction method is to adhere the floor material to the floor slab by running the electromagnetic induction device along the surface of the floor material, heating the conductor piece by electromagnetic induction (melting the electromagnetic induction) and melting the heat welding material Is described. In such a flooring construction method, even after the thermal welding material is solidified and the flooring is bonded to the floor slab, the thermal welding material can be melted again by running the electromagnetic induction device on the adhesive tape. The flooring can be easily peeled off.

  However, in the technique described in Patent Document 1, the workability when another flooring is constructed again after the flooring is bonded to the floor slab is not good. Specifically, it is as follows.

  In order to construct another flooring, it is necessary to peel off the bonded flooring and bond the other flooring to the floor slab. However, the adhesive tape once heated by electromagnetic induction and bonded to the floor slab and the flooring material does not exhibit an adhesive action even when heated again by electromagnetic induction heating to peel off the flooring material. Therefore, it is necessary to attach a new adhesive tape to the floor slab separately. At this time, if the adhesive tape that could not be peeled off or the heat welding material of this adhesive tape remains on the floor slab, there is a problem that a new adhesive tape is difficult to adhere to the floor slab. There is also a problem that the original adhesive tape peeled off becomes dust.

JP-A-4-368563

  The present invention has been made in view of the situation as described above, and the problem to be solved is a floor material construction with good workability when constructing another floor material after the floor material is bonded to the floor surface. A method is provided.

  The problem to be solved by the present invention is as described above. Next, means for solving the problem will be described.

  That is, according to claim 1, an adhesive tape attaching step of attaching an adhesive tape formed by applying a heat-meltable adhesive on both surfaces of a conductive heating material along one direction to a floor surface, and the adhesive tape A floor material placement step of placing a floor material on the floor surface to which is attached, and electromagnetic induction heating the adhesive tape at a predetermined interval in the one direction to melt the conductive heating material. And a floor material bonding step of bonding the floor material to the floor surface.

  In claim 2, in the adhesive tape applying step, the adhesive tape is applied in a plurality of rows, and in the flooring adhesive step, the outermost adhesive tape of the plurality of rows of adhesive tapes is more than the other adhesive tape. The adhesive tape is heated by electromagnetic induction so that the predetermined interval is reduced.

  According to a third aspect of the present invention, the predetermined interval between the other adhesive tapes is 250 to 350 mm, and the predetermined interval between the outermost adhesive tapes is 100 to 200 mm.

  According to a fourth aspect of the present invention, the method further includes a double-sided tape affixing step of adhering a double-sided tape to an end of the floor surface before the flooring arrangement step.

  In Claim 5, the sealing process which seals between the edge part of the said flooring and the said floor surface is further comprised.

  As effects of the present invention, the following effects can be obtained.

  In Claim 1, workability | operativity at the time of constructing another flooring material after adhere | attaching a flooring material on a floor surface can be made favorable.

  According to the second aspect of the present invention, it is possible to shorten the time for floor material bonding work.

  According to the third aspect of the present invention, it is possible to suppress the floating of the floor material with respect to the floor surface while shortening the time for bonding the floor material.

  In claim 4, before the floor material is bonded to the floor surface with the adhesive tape, the floor material can be temporarily fixed to the floor surface. Moreover, the float of the edge part of a flooring can be suppressed.

  According to the fifth aspect of the present invention, it is possible to prevent water from entering between the floor surface and the floor material and peeling off the floor material.

The top view which showed the state which affixed the double-sided tape and the adhesive tape on the existing flooring. The top view which showed a mode that the newly installed flooring was arrange | positioned on the existing flooring, and an adhesive tape heated electromagnetically. The top view which showed the location which performs electromagnetic induction heating. AA sectional drawing of FIG. The flowchart of the flooring construction method which concerns on one Embodiment of this invention. (A) Top view and (b) BB sectional drawing which showed the state which peeled off the newly installed flooring and showed another flooring on the floor of the existing flooring. (A) Top view and (b) CC sectional drawing which showed the state which constructed another flooring on the new flooring material, adhering the new flooring material to the floor surface of the existing flooring material. The top view which showed the sticking position of the adhesive tape in the adhesive tape sticking process of the flooring construction method which concerns on other embodiment of this invention.

  In the following description, the up-down direction, the left-right direction, and the front-rear direction are defined according to the arrows shown in the figure.

  Below, with reference to FIGS. 1-5, the flooring construction method which concerns on one Embodiment of this invention is demonstrated.

  A flooring construction method according to an embodiment of the present invention is a method of constructing a new flooring material on a floor surface of an existing flooring material. A flooring construction method according to an embodiment of the present invention includes a double-sided tape affixing step, an adhesive tape affixing step, a flooring arrangement step, a flooring adhering step, and a sealing step.

  First, a double-sided tape affixing process is performed (step S101). In the double-sided tape affixing step, the double-sided tape 3 is affixed to the end of the floor surface 1 a of the existing flooring 1. Specifically, the double-faced tape 3 is attached to the left and right ends of the floor surface 1a along the front-rear direction from the vicinity of the front end to the vicinity of the rear end of the existing flooring 1, and the vicinity of the left end of the existing flooring 1 Is pasted to both front and rear ends of the floor surface 1a along the right and left direction from the right end to the vicinity (see FIG. 1). The existing flooring 1 is a flooring that has already been constructed on a floor slab such as a concrete slab.

  Next, an adhesive tape application process is performed (step S102). In the adhesive tape attaching step, the adhesive tape 2 is attached to the floor surface 1a of the existing flooring 1 (see FIGS. 1 and 4). The adhesive tape 2 includes a conductive heating material 21 and a hot-melt adhesive 22.

  The conductive heating material 21 shown in FIG. 4 generates heat by electromagnetic induction. The conductive heating material 21 is formed in a rectangular sheet shape in plan view. The conductive heating material 21 is formed from a metal material such as aluminum foil.

  The hot-melt adhesive 22 shown in FIG. 4 is a hot-melt adhesive that bonds by being melted by heat. The hot-melt adhesive 22 is applied to both surfaces of the conductive heating material 21 to form a layer. The hot-melt adhesive 22 is formed from a thermoplastic resin such as polyamide.

  In the region surrounded by the double-sided tape 3, the adhesive tape 2 configured in this way is located in the vicinity of the front and rear ends of the floor surface 1a along the left-right direction from the vicinity of the left end of the existing flooring 1 to the vicinity of the right end. It is pasted. Furthermore, the adhesive tape 2 is applied along the front-rear direction from the vicinity of the front end of the existing flooring 1 to the vicinity of the rear end (between the adhesive tapes 2 attached along the left-right direction). The adhesive tape 2 is attached in four rows in the left-right direction (see FIG. 1).

  Next, a flooring arrangement process is performed (step S103). In the floor material arrangement step, the new floor material 4 is arranged on the floor surface 1a to which the adhesive tape 2 is attached. That is, the new flooring 4 is arranged so that the adhesive tape 2 and the double-sided tape 3 are interposed between the existing flooring 1 and the new flooring 4 (see FIGS. 2 and 4). The new flooring 4 is formed in a plate shape that is substantially the same shape as the existing flooring 1 in plan view. The new flooring 4 is formed from, for example, a vinyl chloride sheet.

  Next, a floor material bonding process is performed (step S104). In the floor material bonding step, the adhesive tape 2 is electromagnetically heated from above the newly installed floor material 4 by the electromagnetic induction heating device 5 (see FIGS. 2 and 4).

  The electromagnetic induction heating device 5 includes a coil (not shown) wound around an axis extending in the vertical direction. A high frequency power source is connected to the coil. When a current flows from the high-frequency power source to the coil, a magnetic field line (alternating magnetic field) is generated around the coil. When the magnetic field lines reach the conductive heating material 21, an eddy current is generated inside the conductive heating material 21. Thereby, the conductive heating material 21 generates heat, and the temperature of the conductive heating material 21 can reach the melting temperature of the hot-melt adhesive 22.

  The electroconductive heating material 21 is electromagnetically heated by the electromagnetic induction heating device 5 configured as described above, thereby melting the hot-melt adhesive 22. After the hot-melt adhesive 22 is melted, the existing floor material 1 and the new floor material are applied by applying pressure from above to the new floor material 4 until the hot-melt adhesive 22 cools and solidifies. 4 is bonded.

  The electromagnetic induction heating is not performed on the entire surface of the adhesive tape 2 but on a part of the adhesive tape 2. Specifically, the electromagnetic induction heating is performed at a predetermined interval in the longitudinal direction of the adhesive tape 2. For the adhesive tape 2 attached along the front-rear direction, electromagnetic induction heating is performed at a predetermined interval in the front-rear direction. For the adhesive tape 2 attached along the left-right direction, electromagnetic induction heating is performed at a predetermined interval in the left-right direction.

  Specifically, the electromagnetic induction heating is performed on a region a indicated by hatching in FIG. The region a has a minimum area required for bonding the existing flooring 1 and the new flooring 4 or more. Of the adhesive tapes 2 attached along the front-rear direction, the outermost adhesive tape 2 in the left-right direction is heated by electromagnetic induction with a pitch L1 in the front-rear direction. Of the adhesive tapes 2 attached along the front-rear direction, the other (left-right center side) adhesive tape 2 is electromagnetically heated by a pitch L2 in the front-rear direction. The pitch L1 has a value larger than the length in the front-rear direction of the region a when the area of the region a is the minimum area necessary for the bonding. The pitch L1 is smaller than the pitch L2. Specifically, the pitch L1 is 100 to 200 mm, and the pitch L2 is 250 to 350 mm. At this time, the pitch in the left-right direction between the adhesive tapes 2 is not limited, but is 1000 mm or less, preferably 300 to 600 mm. In addition, the pitch of the left-right direction of the electromagnetic induction heating of the adhesive tape 2 affixed along the left-right direction shall be comparable as the pitch L1.

  Next, a sealing process is performed (step S105). In the sealing step, the gap between the end of the new flooring 4 and the existing flooring 1 is sealed. Specifically, the gap between the end of the newly installed flooring 4 and the end of the floor surface 1a is sealed with a seal adhesive 6 (see FIG. 4). This sealing can be performed over the entire circumference of the end portion of the new flooring 4. Thereby, it can prevent that water permeates between the floor surface 1a and the lower surface of the new flooring 4 and the new flooring 4 peels off. As the seal adhesive 6, for example, a known seal adhesive such as a silicon-based adhesive can be used.

  The new flooring 4 can be bonded to the existing flooring 1 through the above steps. When the new flooring 4 is peeled off, the conductive heating material 21 is again heated by electromagnetic induction. Specifically, the electromagnetic induction heating device 5 is used to place a portion (region a) where the existing flooring 1 and the new flooring 4 are bonded by electromagnetic induction heating in the flooring bonding process from above the new flooring 4. Heat again by electromagnetic induction. Thereby, since the hot-melt adhesive 22 is melted, the new flooring 4 can be easily peeled off.

  Thus, since the flooring construction method of the present embodiment does not use a fixing tool such as a nail or a solvent-based adhesive, adhesion and peeling are easy.

  Further, by performing the electromagnetic induction heating at a predetermined interval (pitch L1 and pitch L2) in the longitudinal direction of the adhesive tape 2, the work time required for the electromagnetic induction heating can be shortened. Furthermore, the pitch L1 is set to 200 mm or less (100 to 200 mm) and the pitch L2 is set to 350 mm or less (250 to 350 mm), thereby suppressing the occurrence of floating of the newly installed flooring 4 with respect to the existing flooring 1 while performing electromagnetic induction heating. The required work time can be shortened.

In addition, by attaching the double-sided tape 3 to the floor surface 1 a of the existing flooring 1, the new flooring 4 can be temporarily fixed to the existing flooring 1. Thereby, it can prevent that the position of the newly installed flooring 4 will shift | deviate in the case of electromagnetic induction heating.
Moreover, when the edge part of the new flooring 4 is located near the wall, it is difficult to electromagnetically heat the part near the wall by the electromagnetic induction heating device 5. Therefore, it is difficult to bond the portion near the wall with the adhesive tape 2. However, by using the double-sided tape 3, it is possible to bond the end of the new flooring 4 without using the adhesive tape 2 at the edge of the wall, and to prevent the end of the new flooring 4 from floating. it can.

  The floor material construction method of this embodiment has good workability when constructing another floor material even after the newly installed floor material 4 is bonded to the floor surface 1a of the existing floor material 1. As a method of constructing another floor material after constructing the new floor material 4, (1) a method of peeling the new floor material 4 and constructing another floor material on the floor surface 1a of the existing floor material 1, and (2 ) A method of constructing another floor material on the new floor material 4 while the new floor material 4 is bonded to the floor surface 1a of the existing floor material 1 is used.

  First, with reference to FIG.3 and FIG.6, (1) The method of peeling off the newly installed flooring 4 and constructing another flooring on the floor surface 1a of the existing flooring 1 is demonstrated.

  When the new flooring 4 is peeled off after the new flooring 4 is bonded to the floor 1a of the existing flooring 1, the bonding area (the area a shown by hatching in FIG. 3) between the floor 1a and the new flooring 4 is newly installed. Electromagnetic induction heating is performed from above the material 4 by the electromagnetic induction heating device 5 to melt the hot-melt adhesive 22 in the region a. In the state where the hot-melt adhesive 22 is melted, the new flooring 4 is peeled off. Next, the double-sided tape 3 is peeled off from the floor surface 1 a of the existing flooring 1.

  In the double-sided tape affixing step, a new double-sided tape 3 a is affixed to the floor surface 1 a of the existing flooring 1. The new double-sided tape 3 a is attached at the same position as the original double-sided tape 3.

  In the floor material arranging step, the second new floor material 7 is arranged on the floor surface 1a of the existing floor material 1 (on the adhesive tape 2) with the adhesive tape 2 left on the floor surface 1a of the existing floor material 1. . The second new flooring 7 is a flooring to be newly constructed.

  In the floor material bonding step, the conductive heating material 21 is electromagnetically heated by the electromagnetic induction heating device 5 from above the second newly installed floor material 7. At this time, the region a where the existing flooring 1 and the new flooring 4 are bonded is dissolved twice for bonding and peeling, and does not exhibit the bonding action even when electromagnetic induction heating is performed again. Therefore, an area different from the area a in the adhesive tape 2 is heated by electromagnetic induction from above the second new flooring 7. Specifically, a region (region b indicated by hatching (solid line) in FIG. 6) formed between the regions a within the range of the adhesive tape 2 is heated by electromagnetic induction. The length in the longitudinal direction of the region b is smaller than the pitch L1. The region b has a minimum area required for bonding the existing flooring 1 and the second newly-installed flooring 7 or an area larger than that. Since area | region b is not used for adhesion | attachment with the existing flooring 1 and the new flooring 4, the existing flooring 1 and the 2nd new flooring 7 can be adhere | attached.

  According to the floor material construction method according to the present embodiment, the existing floor material 1 and the second new floor material 7 are bonded using the region b that is not used for bonding the existing floor material 1 and the new floor material 4. Therefore, it is not necessary to newly affix the adhesive tape 2 to the floor surface 1a of the existing flooring 1. Moreover, the operation | work which peels off the adhesive tape 2 and the operation | work which removes the hot-melt adhesive 22 from the floor surface 1a become unnecessary. Therefore, work time can be shortened. Moreover, since the pitch L1 has a value larger than the length of the area | region a in the longitudinal direction, the adhesion margin of the existing flooring 1 and the 2nd newly established flooring 7 can be ensured between the areas a.

  Next, referring to FIG. 3 and FIG. 7, (2) a method of constructing another floor material on the new floor material 4 while the new floor material 4 is bonded to the floor surface 1a of the existing floor material 1 will be described. To do.

  When the second floor material 7 is bonded onto the new floor material 4 while the new floor material 4 is bonded to the floor surface 1a of the existing floor material 1, first, the double-faced tape 3b is attached to the new floor material in the double-sided tape affixing step. Paste to 4. The double-sided tape 3b is attached to the same position as the double-sided tape 3 in plan view.

  In the adhesive tape attaching step, the adhesive tape 2a is attached on the newly installed flooring 4. The adhesive tape 2a is affixed to the same position as the adhesive tape 2 between the existing flooring 1 and the new flooring 4 in plan view.

  In the floor material arrangement step, the second new floor material 7 is arranged on the new floor material 4 (on the adhesive tape 2a).

  In the floor material bonding step, the adhesive tape 2a is electromagnetically heated by the electromagnetic induction heating device 5 from above the second newly installed floor material 7. At this time, a region different from the region a in the adhesive tape 2 is heated by electromagnetic induction. Specifically, a region (region c indicated by hatching (solid line) in FIG. 7) formed between the regions a in the front-rear direction is heated by electromagnetic induction. The region c is the same region as the region b (see FIG. 6) in plan view.

  The reason why the region c, which is a region different from the region a, is electromagnetically heated is that when the region a is electromagnetically heated from above the second newly-installed flooring 7, the hot-melt adhesive 22 of the adhesive tape 2 in the region a is This is because the existing flooring 1 and the new flooring 4 are separated by melting. Adhering the new floor material 4 and the second new floor material 7 while maintaining the adhesion between the existing floor material 1 and the new floor material 4 by electromagnetic induction heating of the area c from above the second new floor material 7 can do. Furthermore, since the hot-melt adhesive 22 in the region c of the adhesive tape 2 melts and exhibits an adhesive action, the existing flooring 1 and the new flooring 4 can be bonded more firmly.

  Further, since the new floor material 4 and the second new floor material 7 can be bonded in the region c, the adhesive tape 2a does not need to be attached to the adhesive tape 2 at a different position in plan view. Therefore, the space for adhering the adhesive tape 2a (the margin for adhering the second newly installed flooring 7) can be easily secured.

As described above, in the flooring construction method according to the present embodiment, the adhesive tape 2 formed by applying the hot-melt adhesive 22 on both surfaces of the conductive heating material 21 is formed along the floor surface 1a in one direction. An adhesive tape applying step for attaching, a floor material arranging step for arranging a new floor material 4 (floor material) on the floor surface 1a to which the adhesive tape 2 is attached, and the adhesive tape 2 in a predetermined direction in the one direction. A floor material bonding step of melting the conductive heat generating material 21 and bonding the new floor material 4 to the floor surface 1a by electromagnetic induction heating at intervals.
By comprising in this way, workability | operativity at the time of constructing the 2nd new flooring material 7 (another flooring material) after adhering the new flooring material 4 to the floor surface 1a can be made favorable.

In the floor material construction method according to the present embodiment, the adhesive tape 2 is attached in a plurality of rows in the adhesive tape attaching step, and the outermost adhesive among the adhesive tapes 2 in the plurality of rows in the floor material attaching step. The adhesive tape 2 is heated by electromagnetic induction so that the predetermined interval of the tape 2 is smaller than that of the other adhesive tape 2.
By comprising in this way, the time of the adhesion | attachment operation | work of the newly installed flooring 4 can be shortened.

Further, in the flooring construction method according to the present embodiment, the predetermined interval of the other adhesive tape 2 is 250 to 350 mm, and the predetermined interval of the outermost adhesive tape 2 is 100 to 200 mm. There is something.
By comprising in this way, the float of the new flooring 4 with respect to the floor surface 1a can be suppressed, shortening the time of the adhesion | attachment operation | work of the new flooring 4.

Moreover, the flooring construction method according to the present embodiment further includes a double-sided tape affixing step for affixing the double-sided tape 3 to the end of the floor surface 1a before the flooring arrangement step.
By comprising in this way, before adhering the new flooring 4 to the floor surface 1a with the adhesive tape 2, the new flooring 4 can be temporarily fixed to the floor 1a. Moreover, the float of the edge part of the new flooring 4 can be suppressed.

Moreover, the flooring construction method according to the present embodiment further includes a sealing step for sealing between the end of the flooring and the floor surface.
By comprising in this way, it can prevent that the water infiltrates between the floor surface 1a and the newly installed flooring 4, and the newly installed flooring 4 peels off.

  The embodiment of the present invention has been described above, but the present invention is not limited to the above-described configuration, and various modifications can be made within the scope of the invention described in the claims.

  For example, in the present embodiment, the new flooring 4 is attached to the floor surface 1a of the existing flooring 1, but the present invention is not limited to this. For example, the new flooring 4 may be directly pasted on the floor surface of a floor slab such as a concrete slab.

  Further, in the present embodiment, in the adhesive tape applying step, one adhesive tape 2 is applied from the vicinity of the front end of the existing flooring 1 to the vicinity of the rear end and from the vicinity of the left end to the vicinity of the right end. However, the present invention is not limited to this. For example, as shown in FIG. 8, a plurality of adhesive tapes 2 are pasted in the front-rear direction from the vicinity of the front end to the vicinity of the rear end of the existing flooring 1, and from the vicinity of the left end of the existing flooring 1 to the vicinity of the right end. A plurality of adhesive tapes 2 may be pasted at intervals in the left-right direction.

  In the present embodiment, four rows of adhesive tapes 2 are attached in the left-right direction, but the number of rows of adhesive tapes 2 is not limited to this. The number of rows of the adhesive tape 2 may be one row, two rows, three rows, or five rows or more.

  Further, in the present embodiment, the pitch L1 in the front-rear direction of electromagnetic induction heating of the outermost adhesive tape 2 in the left-right direction among the adhesive tapes 2 attached along the front-rear direction is 100 to 200 mm, and the center side in the left-right direction. Although the pitch L2 in the front-rear direction of electromagnetic induction heating of the adhesive tape 2 is 250 to 350 mm, it is not limited to this. The pitch L1 may be less than 100 mm or more than 200 mm. The pitch L2 may be less than 250 mm or greater than 350 mm.

  Moreover, in this embodiment, although the double-sided tape sticking process shall be performed before an adhesive tape sticking process, it is not limited to this. For example, the double-sided tape sticking step can be performed after the adhesive tape sticking step.

  Moreover, in this embodiment, although the double-sided tape 3 shall be affixed on the right-and-left both ends and front-and-rear both-ends of the floor surface 1a, it is not limited to this. For example, the double-sided tape 3 may be attached only to the left and right ends of the floor surface 1a.

  In the present embodiment, in the sealing step, the gap between the end of the new flooring 4 and the end of the floor surface 1a is sealed over the entire circumference of the new flooring 4, but this is not limitative. Is not to be done. In the sealing step, it is only necessary to seal between a part of the end of the new flooring 4 and the floor 1a. For example, the left and right ends of the new flooring 4 and the left and right ends of the floor 1a You may make it seal only between each. Further, it is not always necessary to seal the outermost end of the new flooring 4, and it may be sealed with a slight distance from the outermost end.

DESCRIPTION OF SYMBOLS 1 Existing floor material 2 Adhesive tape 3 Double-sided tape 4 New floor material 5 Electromagnetic induction heating device 21 Conductive heating material 22 Hot melt adhesive

Claims (5)

An adhesive tape affixing step in which an adhesive tape formed by applying a hot-melt adhesive on both sides of the conductive heating material is adhered to the floor surface along one direction; and
A flooring arrangement step of arranging a flooring on the floor surface to which the adhesive tape is attached;
A floor material bonding step of melting the conductive heating material and bonding the floor material to the floor surface by electromagnetic induction heating the adhesive tape at a predetermined interval in the one direction;
A flooring construction method comprising: In the adhesive tape application step, a plurality of rows of the adhesive tape are applied,
In the floor material bonding step, the outermost adhesive tape of the plurality of rows of adhesive tapes is heated by electromagnetic induction so that the predetermined interval is smaller than other adhesive tapes.
The flooring construction method according to claim 1. The predetermined interval of the other adhesive tape is 250 to 350 mm;
The predetermined interval of the outermost adhesive tape is 100 to 200 mm;
The flooring construction method according to claim 2. Before the flooring arrangement step, further comprising a double-sided tape affixing step of adhering a double-sided tape to the end of the floor surface,
The flooring construction method according to any one of claims 1 to 3. Further comprising a sealing step of sealing between the end of the flooring and the floor surface;
The flooring construction method according to any one of claims 1 to 4.

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