JP6646994B2 - Optical unit, optical scanning device including the optical unit, and image forming apparatus including the optical unit - Google Patents

Description

  The present invention relates to an optical scanning device that emits a light beam toward an object to be exposed, and an image forming apparatus including the optical scanning device.

  2. Description of the Related Art Image forming apparatuses such as electrophotographic copying machines and printers form an electrostatic latent image on a photoconductor by scanning a laser beam that blinks on the photoconductor in accordance with image data. Is developed with toner to form an image. An optical scanning device is used as a device that emits laser light.

  The optical scanning device converts a light beam from a semiconductor laser as a light source into a substantially parallel light beam, and then deflects the light with a rotating polygon mirror (hereinafter, referred to as a polygon mirror). The laser light deflected by the polygon mirror scans the photoconductor.

  In recent years, an optical scanning device exposes a photoconductor with a plurality of laser beams emitted from a plurality of light emitting points in order to cope with a higher image forming speed and a higher resolution of an image. As a type of a semiconductor laser, for example, a vertical cavity surface emitting laser (hereinafter, referred to as VCSEL) is easily formed into an array of a large number of light emitting points. Used for light sources.

  The optical path of the laser light emitted from the light source affects the spot shape and the light amount of the laser light on the photoconductor. For this reason, a high accuracy is required for the installation position of the light source, and a position guarantee for the micrometer unit is required for the components.

  Therefore, Patent Document 1 proposes a method of mounting a reference surface of a package portion of a VCSEL chip with high accuracy perpendicular to an optical axis of an optical unit. In Patent Literature 1, a reference plane parallel to a plane on which light emitting points of the VCSEL chip are provided is provided on a package portion of the VCSEL chip. The reference surface of the package portion is brought into contact with three contact portions provided on the laser holder, and the reference surface of the package member is attached with high accuracy perpendicular to the optical axis of the optical unit.

JP 2013-15557 A

  In an optical scanning device using a VCSEL chip as disclosed in Patent Document 1, it is conceivable that the package portion is made of ceramic and the laser holder is made of metal. The contact portion of the laser holder comes into contact with the package portion of the VCSEL chip, but since the ceramic material of the package portion is an insulator, the laser holder and the VCSEL chip are not electrically connected.

  On the other hand, a terminal for inputting an electric signal to a light emitting part of the VCSEL chip is provided in the package part. Since the package portion is as small as about 10 mm square, the distance between the contact portion of the laser holder that contacts the package portion and the terminal is short. The laser holder may be charged during the assembling operation of the image forming apparatus. However, the VCSEL chip is electrostatically damaged due to a discharge phenomenon in which the charge charged in the laser holder rapidly flows from the contact portion of the laser holder to the terminal. There is a risk.

  The present invention has been made in view of the above problems, and has as its object to suppress discharge between a laser holder and terminals of a laser chip in order to prevent electrostatic breakdown of the laser chip.

An optical unit for solving the above-mentioned problem is an optical unit attached to a housing of an optical scanning device, and includes a package portion formed of ceramic, and a plurality of light emitting devices that emit a laser beam surrounded by the package portion. A laser chip, which is a vertical cavity surface emitting laser , comprising: a unit, and a plurality of terminals arranged on an end surface of the package unit for supplying current to the plurality of light emitting units; and , an electric substrate on which the plurality of terminals are electrically connected by soldering, and a metal laser holder with an abutment for defining the contact with the position of the laser chip to the package portion, elastically deformable A connection member made of a resin, wherein the electric board and the resin are connected so that the package portion abuts on the abutment portion by a restoring force due to the elastic deformation. A connecting member connecting the Zahoruda, a screw that is fastened to the connecting member for connecting the electrical substrate to the connecting member, and a screw to elastically deform the connecting member by the fastening,
Anda conductive member connected the to the laser holder and the electrical substrate for electrically connecting the electrical substrate and the laser holder, the said electrical substrate and said laser holder through said conductive member An electrode for electrical conduction is formed, and the conduction member is connected to the electrode and the laser holder.

By providing a conducting member for electrically conducting between the electric board and the electric board on which the laser chip is mounted, separately from a screw for fastening the electric board to the connecting member, a ceramic package type vertical resonator type is provided. Discharge between the laser chip of the laser and the metal laser holder can be suppressed.

Schematic sectional view of a color printer Diagram showing optical scanning device Diagram showing optical unit The figure which shows the arrangement | sequence of the light emitting element of VCSEL Control block diagram of image forming apparatus Diagram illustrating how to attach the ground plate

(Example 1)
FIG. 1 is a schematic cross-sectional view of a color image forming apparatus that is an image forming apparatus according to the present embodiment. Although the embodiments will be described by taking a color image forming apparatus and an optical scanning device provided therein as an example, the embodiment is not limited to the color image forming apparatus, and the image forming apparatus is configured to perform image formation using only a single color toner (for example, black). Image forming apparatus.

  First, an image forming apparatus 100 according to the present embodiment will be described with reference to FIG. The image forming apparatus 100 includes four image forming units 101Y, 101M, 101C, and 101Bk that form images for each color. Here, Y, M, C, and Bk represent yellow, magenta, cyan, and black, respectively. The image forming units 101Y, 101M, 101C, and 101Bk form images using yellow, magenta, cyan, and black toners, respectively. Since the image forming units for the respective colors have the same configuration, the image forming unit 101Y will be described below.

  The image forming unit 101Y includes a photosensitive drum 102Y as a photosensitive member. Around the photosensitive drum 102Y, a charging device 103Y, an optical scanning device 104Y, a developing device 105Y, and a drum cleaning device 106Y are arranged.

  An endless belt-shaped intermediate transfer belt 107 is arranged below the photosensitive drum 102Y. The intermediate transfer belt 107 is stretched around a driving roller 108 and driven rollers 109 and 110, and rotates in the direction of arrow B in the drawing during image formation. A primary transfer device 111Y is provided at a position facing the photosensitive drum 102Y via the intermediate transfer belt 107.

  Next, the image forming process will be described. First, the charging device 103Y charges the photosensitive drum 102Y. The charged photosensitive drum 102Y is exposed to laser light emitted from the optical scanning device 104Y. As a result, an electrostatic latent image is formed on the photoconductor. Thereafter, the electrostatic latent image is developed by the developing device 105Y, and a toner image appears on the photosensitive drum 102Y. The toner image developed on the photosensitive drum 102Y is transferred to the intermediate transfer belt 107 by the primary transfer unit 112 applying a transfer bias to the transfer belt.

  The toner image transferred to the intermediate transfer belt 107 is transferred by the secondary transfer device 112 onto the recording medium S conveyed from the paper supply cassette 115 to the secondary transfer unit 112. The toner image on the recording medium S is heated and fixed by the fixing device 113. The recording medium S on which the toner image has been fixed is discharged to a paper discharge unit 116.

  Next, the configuration of the optical scanning devices 104Y, 104M, 104C, and 104Bk will be described. Since the configuration of each optical scanning device is the same, the suffixes Y, M, C, and Bk indicating colors are omitted in the following description.

  2, the optical scanning device 104 includes a housing 401 and an optical unit 200. Further, various optical members described below, such as a polygon mirror 402 and an fθ lens 404, are accommodated in the housing 401.

  FIG. 3 is an exploded perspective view of the optical unit 200 attached to the housing of the optical scanning device 104. FIG. 3A is a perspective view seen from a lens barrel 204 described later, and FIG. 3B is a perspective view seen from a VCSEL substrate 203 described later. FIGS. 3C and 3D are horizontal cross-sectional views at the optical axis position of the optical unit 200 before the lens barrel 204 is assembled. FIG. 3E is a perspective view showing a connecting member 207 described later. is there.

  In FIG. 3A, the optical unit 200 includes a VCSEL chip 202 that is a laser chip that emits a laser beam (light beam). VCSEL stands for Vertical Cavity Surface Emitting LASER (Vertical Cavity Surface Emitting LASER). Further, the optical unit 200 includes a VCSEL substrate 203 which is an electric substrate for driving the VCSEL chip 202.

The VCSEL chip 202 includes a package unit 202b so as to surround the light emitting unit 202a as shown in FIG. A terminal 202c for inputting a current to the light emitting unit 202a is arranged around the package unit. The package part 202b is formed of a ceramic material which is an insulator such as Al ₂ O _3, SiO ₂ , TiO 2, or the like. By using ceramics, good characteristics in hardness and rigidity can be obtained. In general, ceramics are suitable as a material for the package part because they can easily obtain accuracy on the order of submicron due to their material characteristics. The enlarged view of FIG. 4 shows the arrangement of the light emitting elements of the light emitting section 202a. In the light emitting section 202a of this embodiment, a plurality of light emitting elements are arranged in one row (array). The laser light emitted from each light emitting element is installed in the optical scanning device so as to form an image at a different position on the photosensitive member in the rotation direction of the photosensitive drum. Note that the arrangement of the light emitting elements is not limited to one row, and may be two-dimensionally arranged. In this embodiment, a VCSEL chip has been described as a type of laser chip. However, another semiconductor laser having the same shape (for example, an edge emitting light emitting diode) may be used.

  The VCSEL chip 202 is disposed on a VCSEL substrate 203 shown in FIG. 3A, and terminals 202c are electrically connected to electrodes on the VCSEL substrate 203 via solder, cables, and the like.

  On the VCSEL substrate 203, an insertion hole 203a for fixing the VCSEL substrate 203 is arranged. Further, as shown in FIG. 3B, electrodes around the insertion holes 203a on the surface of the VCSEL substrate 203 for allowing electric charges to move between the laser holder 201 and the VCSEL substrate 203 as described later. Is arranged. The ground pattern 203b is formed of a highly conductive material such as copper, and is electrically connected to a part of the terminal 202c of the VCSEL chip by a printed wiring or the like.

  The laser holder 201 has a lens barrel 204, and a collimator lens 205 is attached to the tip of the lens barrel 204. The laser holder 201 has three contact portions 201a as shown in FIG. Since the laser holder 201 and the contact portion 201a are required to have excellent strength and rigidity, they are formed of a metal material such as aluminum die-cast or magnesium die-cast.

  The collimator lens 205 converts laser light (divergent light) emitted from the VCSEL 202 into parallel light. The position of the collimator lens 205 with respect to the laser holder 201 is adjusted while detecting the irradiation position and the focus of the laser light emitted from the light emitting unit 202a using an adjustment jig when assembling the optical scanning device 104. When the installation position of the collimator lens 205 is determined, the collimator lens 205 is bonded and fixed to the laser holder 201 by irradiating the ultraviolet curable adhesive applied between the collimator lens 205 and the lens barrel 204 with ultraviolet rays. Is done.

  The plurality of light emitting elements provided in the light emitting unit 202a emit laser light when current is supplied from the VCSEL substrate 203. The VCSEL substrate 203 is connected to a connector 213 arranged on the VCSEL substrate 203 shown in FIG. 3B and a CPU 501 described in detail with reference to FIG. 5 via an electric cable (not shown). The protective cover 210 is fastened to the laser holder 201 by screws 211 to protect the VCSEL substrate 203. An earth plate 601 serving as a conductive member electrically connects the laser holder 201 and the VCSEL substrate 203. One end of the ground plate 601 is fixed to the laser holder 201 by a screw 602 shown in FIG. The other end of the ground plate 601 is fastened to the connecting member 207 with the screw 209a shown in FIG. The ground plate 601 is formed of a metal material such as SUS. Details regarding the ground plate 601 will be described later.

  Next, a configuration for fixing the VCSEL substrate 203 to the laser holder 201 will be described. 3B, the connecting member 207 has a function of fixing the VCSEL substrate 203 to the laser holder 201. The material of the connecting member 207 is an elastic resin such as PC + ABS or PA. As shown in FIG. 3E, the connecting member 207 has three fixing portions 207b for fixing the connecting member 207 to the laser holder 201. Each of the fixing portions 207b has an insertion hole. The connecting member 207 has three substrate supporting portions 207a and fixing portions 207b for attaching the VCSEL substrate 203, and a connecting portion 207c is provided between the substrate supporting portions 207a and the fixing portions 207b.

  The method of fixing the VCSEL substrate 203 to the laser holder 201 is as follows.

  As shown in FIG. 3B, the connecting member 207 is fixed to the laser holder 201 by three screws 208. Next, the package portion 202b of the VCSEL chip mounted on the VCSEL substrate 203 is pressed against three contact portions 201a provided on the laser holder 201. The contact portion 201a is formed with high precision because it serves as a reference for the position and posture of the VSCEL chip. When the package portion 202b is pressed against the contact portion 201a, the VCSEL chip 202 has a desired position and posture.

  In a state where the package portion 202b is pressed against the contact portion 201a, as shown in FIG. 3C, there is a gap t between the substrate support portion 207a of the connecting member 207 and the VCSEL substrate 203. Next, as shown in FIG. 3B, the screws 209a, 209b, and 209c are inserted into the screw holes 207d of the connecting member. Then, the connecting portion 207c shown in FIG. 3E is elastically deformed so as to fill the gap t, and the substrate supporting portion 207a comes into close contact with the VCSEL substrate 203 (see FIG. 3D). The restoring force generated by the elastic deformation of the connection portion 207c is a force for pressing the VCSEL chip 202 against the contact portion 201a of the laser holder 201. The VCSEL chip 202 is fixed to the contact part 201a by this restoring force. Here, the package portion 202b of the VCSEL chip is as small as about 10 mm square. For this reason, the distance between the contact part 201a and the terminal 202c of the VCSEL chip becomes short, and there is a possibility that electrostatic breakdown may occur. Details will be described later.

  The optical unit 200 is assembled by the above method. Next, a configuration for scanning the photosensitive drum with the laser light emitted from the optical unit 200 will be described.

  2A is a perspective view of the optical scanning device 104, FIG. 2B is a top view of the optical scanning device 104, and FIG. 2C is a cross-sectional view taken along the line AA 'in FIG. FIG. 2D is a perspective view showing a configuration of main optical components. As shown in FIG. 2A, the optical unit 200 is attached to the housing 401. The housing 401 has a shape that is open up and down, and the inside is sealed by attaching an upper lid 417 and a lower lid 418 as shown in FIG. Inside the housing 401, a rotary polygon mirror 402, which is a deflecting member that deflects the laser light emitted from the optical unit, is housed. The rotary polygon mirror 402 is driven to rotate by a motor 403 shown in FIG. 2C so that the laser beam scans the photosensitive drum in a predetermined direction. The laser light deflected by the rotary polygon mirror 402 enters the first fθ lens 404 shown in FIG. The laser light that has passed through the first fθ lens 404 is reflected by the reflection mirror 405 and the reflection mirror 406 and enters the second fθ lens 407. The laser light passing through the second fθ lens 407 is reflected by the reflection mirror 408, passes through the dustproof glass 409, and is guided onto the photosensitive drum. A laser beam scanned at a constant angular speed by the rotating polygon mirror 402 forms an image on the photoconductor by the first fθ lens 404 and the second fθ lens 407, and scans the photoconductor at a constant speed.

  As shown in FIG. 2D, the optical scanning device 104 of the present embodiment has a beam splitter 410. The beam splitter 410 is disposed on an optical path of laser light emitted from the VCSEL chip 202 and directed to the rotary polygon mirror 402. The laser light incident on the beam splitter 410 is separated into a first laser light that is transmitted light and a second laser light that is reflected light. The first laser light is deflected by the rotary polygon mirror 402 and guided to the photosensitive drum as described above. After passing through the condenser lens 415, the second laser light is incident on a photodiode 411 (hereinafter, PD 411) that is a photoelectric conversion element (light receiving unit). The PD 411 outputs a detection signal according to the amount of received light, and performs automatic power control (Automatic Power Control: APC) based on the output detection signal.

  Further, the optical scanning device 104 of the present embodiment includes a beam detector 412 (hereinafter, referred to as a BD 412) that generates a synchronization signal for determining a laser beam emission timing based on image data on the photosensitive drum. The laser light (first laser light) deflected by the rotating polygon mirror 402 passes through the first fθ lens 404, is reflected by the reflection mirror 405 and the BD mirror 414, passes through the optical system 413, and then enters the BD 412. I do.

  Next, a control for forming a desired electrostatic latent image by a laser beam that scans the photosensitive drum will be described. FIG. 5 is a control block diagram of the image forming apparatus of the present embodiment. Note that, since the components in the image forming units of the respective colors in the present embodiment are the same, a control block diagram of the image forming unit 101Y will be described below as an example.

  The CPU 501 is a control unit that causes each element to execute predetermined control based on a control program stored in the memory 502. The process unit shown in FIG. 5 is a general term for a driving unit for driving the photosensitive drum, a charging device 103Y, a developing device 105Y, a drum cleaning device 106Y, a driving roller 108, and a primary transfer device 111Y. Description is omitted.

  The memory 502 stores, in addition to the control program, reference value data used when executing the APC, and timing data defining the emission timing of each light emitting element. The CPU 501 includes a clock signal generation unit such as a crystal oscillator that generates a clock signal having a higher frequency than the synchronization signal, and a counter that counts the clock signal.

  The synchronization signal output from the BD 412 is input to the CPU 501. Further, a detection signal output from the PD 411 is input to the CPU 501. The CPU 501 transmits a control signal to the laser driver 503 based on the synchronization signal, and the laser driver 503 transmits a drive signal to the VCSEL chip 202 based on the control signal.

  Next, the configuration of the ground plate 601 which is a characteristic part of the present embodiment will be described with reference to FIG. FIG. 6 shows a state in which the ground plate 601 and the VCSEL substrate 203 are incorporated in the laser holder 201.

  FIG. 6A is an exploded perspective view before the ground plate 601 is incorporated into the laser holder 201. FIG.

  FIG. 6B is a diagram illustrating a state where the ground plate 601 is incorporated in the laser holder 201.

  FIG. 6C shows a state where the VCSEL substrate 203 is set at a predetermined position.

  FIG. 6D is a diagram illustrating a relationship between the ground plate 601 and the VCSEL substrate 203 when the VCSEL substrate 203 is fixed by screws.

  It should be noted that parts irrelevant to the purpose of the present embodiment are omitted.

  As shown in FIG. 6A, the ground plate 601 has a substantially U-shape, and has a contact portion 601a, insertion holes 601b and 601d, and a positioning hole 601c. The position of the ground plate 601 with respect to the laser holder 201 is determined by fitting the positioning hole 601c into the boss 201c of the laser holder 201. Next, the earth plate 601 is fixed to the laser holder 201 by inserting the screw 602 into the screw hole 201b through the insertion hole 601b (FIG. 6B). Since the ground plate 601 and the laser holder 201 are both formed of a metal material, the ground plate 601 and the laser holder 201 are electrically connected by screwing.

  Next, the VCSEL substrate 203 is set on the laser holder 201 as shown in FIG. At this time, the VCSEL substrate 203 is disposed inside the U-shape of the ground plate 601.

  6C, the screw 209a is inserted through the insertion hole 601a of the ground plate 601 and the insertion hole 203a of the VCSEL substrate, and tightened into the fastening portion 207a of the connecting member 207 (see FIG. 2B). Then, the ground plate 601, the VCSEL substrate 203, and the connecting member 207 are screwed together. Since the ground pattern 203b is formed around the insertion hole 203a of the VCSEL substrate, the contact part 601a of the ground plate and the ground pattern 203b are pressed against each other. With this configuration, the ground plate 601 and the VCSEL substrate 203 are electrically connected (FIG. 6D).

  With the above configuration, the VCSEL substrate 203 and the laser holder 201 are electrically connected via the ground plate 601. In other words, the electric charge can be moved from the laser holder 201 to the VCSEL substrate 203 via the ground plate 601. Next, advantages of such a configuration will be described.

  After being assembled by the above-described method, the optical scanning device 104 is attached to the main body frame of the image forming apparatus. On the other hand, many units such as a paper feeding unit and a secondary transfer unit are attached to the main body frame of the image forming apparatus in addition to the optical scanning device. During the mounting operation, the main body frame may be charged. When the optical scanning device 104 is attached to the main frame while the main frame is charged, the electric charges move to the housing 401 of the optical scanning device. Since the laser holder 201 is attached to the housing 401, if the housing 401 is made of metal, electric charges move instantaneously to the laser holder and the laser holder is charged.

  Further, the laser holder may be charged during the assembly operation of the optical scanning device 104. Optical components are housed inside the housing 401 of the optical scanning device, and if dust adheres to the optical components, the laser light emitted from the light emitting unit 202a of the VCSEL chip is not transmitted or reflected normally, and causes image defects. Becomes In order to prevent dust from adhering to the optical components, a dustproof sheet may be attached to the housing 401 to ensure airtightness. The dustproof sheet is generally attached to the housing 401 using a double-sided tape, but when the release paper of the double-sided tape is peeled off, a peeling charging phenomenon occurs and the dustproof sheet is charged. When the charged dustproof sheet is attached to the housing 401, the housing 401 is charged. When the housing 401 is charged, the charges move to the laser holder and the laser holder is charged. Even when the housing 401 is made of resin, electric charges may move from the housing 401 to the laser holder 201 depending on the material and environment.

  For the above reasons, the laser holder 201 may be charged.

  As described above, the contact portion 201a of the laser holder is close to the terminal 202c of the VCSEL chip, but is not in contact therewith. For this reason, when the laser holder is charged, there is a possibility that a discharge phenomenon occurs in which the charge rapidly moves from the contact portion 201a to the terminal 202c. When the discharge phenomenon occurs, the VCSEL chip 202 may be electrostatically damaged. However, when configured as in the present embodiment, charges move from the laser holder 201 to the ground plate 601. Since the ground plate 601 is electrically connected to the VCSEL substrate, the charge moves to the VCSEL substrate 203. Since the VCSEL substrate 203 and the terminal 202c of the VCSEL chip are also electrically connected, the electric charge moves via the ground plate 601 until the laser holder 201 and the terminal 202c of the VCSEL chip eventually have the same potential.

  As described above, by electrically connecting the VCSEL substrate 203 and the laser holder 201 with the ground plate 601, a discharge phenomenon occurs between the laser holder 201 and the terminal 202 c of the VCSEL chip, and the electrostatic breakdown of the VCSEL chip 202 occurs. Can be suppressed.

  In the present embodiment, the description has been made using the ground plate 601; however, the VCSEL substrate and the laser holder may be electrically connected using, for example, a cable without being limited to the sheet metal member. The material of the housing 401 may be entirely metal or resin, or may be partially metal or resin.

REFERENCE SIGNS LIST 100 Image forming apparatus 104Y, 104M, 104C, 104Bk Optical scanning apparatus 201 Laser holder 201a Contact section 201b Screw hole 201c Boss 202 VCSEL chip 202a Light emitting section 202b Package section 202c Terminal 203 VCSEL board 203a Insertion hole 203b Ground pattern 207 Connecting member 208 , 209 screw 401 housing 402 rotating polygon mirror 601 ground plate 601a contact part 601b, 601d insertion hole 601c positioning hole 602 screw

Claims (10)

An optical unit attached to a housing of the optical scanning device,
A package portion formed of ceramic, a plurality of light-emitting portions for emitting a laser beam surrounded by the package portion, and a plurality of light-emitting portions disposed on an end surface of the package portion for supplying a current to the plurality of light-emitting portions. A laser chip which is a vertical cavity surface emitting laser comprising a terminal ,
An electric board to which the laser chip is attached and the plurality of terminals are electrically connected by solder ,
A metal laser holder comprising a contact portion for determining the position of the laser chip in contact with the package portion,
A connecting member made of an elastically deformable resin, the connecting member connecting the electric board and the laser holder so that the package portion abuts on the abutting portion by a restoring force due to the elastic deformation;
A screw fastened to the connection member to connect the electric board to the connection member, wherein the screw elastically deforms the connection member by the fastening,
Having a conducting member connected to the laser holder and the electric board to electrically conduct the laser holder and the electric board,
An electrode is formed on the electric substrate to electrically conduct with the laser holder via the conduction member,
The optical unit, wherein the conductive member is connected to the electrode and the laser holder. 2. The optical unit according to claim 1, wherein the conductive member is co-fastened to the connecting member together with the electric board by the screw so that the conductive member contacts the electrode. 3. The optical unit according to claim 1 or 2, wherein the conductive member is characterized by a metallic sheet metal. 4. The optical unit according to claim 1, wherein the laser holder holds a lens that optically acts on the laser beam. 5. The electric board according to any one of claims 1 to 4, wherein the electric board has an insertion hole through which the screw is inserted, and the electrode is formed on the electric board so as to surround the insertion hole. An optical unit as described. The said connection member is further fixed to the said laser holder with the screw different from the said screw for fastening the said electric board and the said connection member to the said laser holder together, The said 1 to 5 characterized by the above-mentioned. The optical unit according to claim 1. A deflecting member that deflects the light beam emitted from the laser chip so as to scan on the photoconductor, and a housing that houses the deflecting member,
An optical scanning device to which the optical unit according to any one of claims 1 to 6 is attached in a state where the electric board and the conductive member are assembled to the laser holder. A deflecting member that deflects a light beam emitted from the laser chip to scan on a photoconductor,
A housing housing the deflection member therein, and the optical scanning device,
The image forming apparatus according to claim 1, further comprising: a photoconductor exposed by a laser beam emitted from the optical scanning device. The image forming apparatus according to claim 8, wherein the housing is made of resin. The image forming apparatus according to claim 8, wherein the housing is made of metal.

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