JP6623304B2 - Nozzle position measurement method and collection system - Google Patents

Description

The present invention relates to a nozzle position measuring method and a collection system.
This application claims priority on September 29, 2016 based on Japanese Patent Application No. 2006-191974 for which it applied to Japan, and uses the content here.

  Conventionally, a screening apparatus for fine particles is known (see, for example, Patent Document 1). The screening apparatus includes a measuring chip in which a well in which fine particles are stored is formed, and a collecting unit that has a capillary and sucks and discharges fine particles in the well to a predetermined position. I have.

JP 2008-249679 A

  However, when the height of the tip of the capillary is adjusted, the reference surface for height adjustment is set on the inner surface of the fixture. Then, the collection portion is moved while focusing on the reference surface for height adjustment, and the tip of the capillary is brought close to the upper surface of the measurement chip from this position. For this reason, there is a possibility that the measuring chip and the capillary cannot be positioned with high accuracy.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a nozzle position measuring method and a collection system that can accurately position a substrate and a nozzle.

  A nozzle position measuring method according to a first aspect of the present invention is a nozzle position measuring method for measuring the position of a nozzle with respect to a substrate, wherein the nozzle is moved up and down along the first direction with respect to the substrate. A substrate moving step for moving the substrate in a second direction intersecting the first direction after the nozzle raising and lowering step, and a determining step for determining whether or not the nozzle moves together with the substrate in the substrate moving step. And including.

  According to this method, by including a determination step of determining whether or not the nozzle moves together with the substrate in the substrate movement step, when it is determined in the determination step that the nozzle moves together with the substrate, the nozzle contacts the substrate. Can be estimated. On the other hand, when it is determined in the determination step that the nozzle does not move together with the substrate, it can be estimated that the nozzle is separated from the substrate. Therefore, the nozzle can be brought as close to the substrate as possible while confirming whether the nozzle is actually in contact with the substrate. Therefore, the substrate and the nozzle can be accurately positioned. By the way, a method using an optical sensor is also conceivable for positioning the substrate and the nozzle. However, when the surface of the substrate is a liquid surface, there is a possibility that the position of the substrate cannot be accurately measured due to refraction or reflection of light on the liquid surface. On the other hand, according to this method, since light is not used, the substrate and the nozzle can be accurately positioned even when the surface of the substrate is a liquid surface.

In the nozzle position measuring method, the nozzles may be imaged with a camera in focus on the surface of the substrate in the nozzle raising / lowering step.
According to this method, in the nozzle ascending / descending step, since the focus is achieved when the nozzle approaches the surface of the substrate, the nozzle can be clearly recognized from the captured image of the camera. Therefore, it is possible to easily bring the nozzle close to the surface of the substrate while viewing the captured image of the camera. Therefore, the surface of the substrate and the nozzle can be easily and accurately positioned.

In the nozzle position measurement method, when it is determined that the nozzle has moved based on the determination result in the determination step, the nozzle is moved away from the substrate, and when it is determined that the nozzle does not move, You may further include the position adjustment process which makes a nozzle stand still and adjusts the relative position of the said nozzle and the said board | substrate.
According to this method, in the position adjustment step, when it is determined that the nozzle has moved based on the determination result in the determination step, the state where the nozzle is in contact with the substrate is released by moving the nozzle away from the substrate. Can do. On the other hand, in the position adjustment step, when it is determined that the nozzle does not move based on the determination result in the determination step, the nozzle can be kept stationary so that the nozzle is kept away from the substrate. Then, by adjusting the relative position between the nozzle and the substrate based on the determination result in the determination step, the nozzle can be brought close to the substrate as much as possible. Therefore, the substrate and the nozzle can be positioned with higher accuracy. In addition, when it is determined that the nozzle has moved based on the determination result in the determination process, the nozzle is excessively loaded on the substrate because the nozzle abuts against the substrate excessively by moving the nozzle away from the substrate. It is possible to avoid getting stuck.

In the nozzle position measuring method, in the position adjusting step, the interval between the nozzle and the substrate may be made smaller than the size of the fine particles accommodated in the concave portion of the substrate.
By the way, when the fine particles accommodated in the concave portion of the substrate are sucked by the nozzle, if the nozzle and the substrate are brought into contact (contact), there is a possibility that the flow of the intake air including the fine particles themselves cannot be created. That is, since the flow of the intake air is blocked at the contact portion between the nozzle and the substrate, there is a possibility that the fine particles cannot be sucked. On the other hand, according to this method, in the position adjusting step, since the gap between the nozzle and the substrate is opened, it is possible to create a flow of intake air that includes the fine particles themselves without being blocked by the flow of intake air. Suction can be reliably performed. In addition, by reducing the distance between the nozzle and the substrate to be smaller than the size of the fine particles, the suction of external foreign matter is suppressed compared to the case where the distance between the nozzle and the substrate is larger than the size of the fine particles. be able to. Therefore, mixing of fine particles and foreign matters (contamination) can be suppressed, and desired fine particles can be reliably sucked. By the way, when a plurality of concave portions capable of accommodating fine particles are formed on the substrate, when the interval between the nozzle and the substrate is equal to or larger than the size of the fine particles, the fine particles accommodated in the target concave portions are sucked. Furthermore, there is a possibility that the fine particles accommodated in the adjacent recesses are accidentally sucked. On the other hand, according to this method, the distance between the nozzle and the substrate is made smaller than the size of the fine particles, so that it is possible to avoid accidentally sucking the fine particles accommodated in the adjacent recess.

  The recovery system according to the second aspect of the present invention is a recovery system including a structure that can store fine particles and a nozzle that sucks and recovers the fine particles stored in the structure. Is disposed between the first substrate and the second substrate, the first substrate formed with a through hole penetrating the fine particles, the second substrate facing the first substrate, and the first substrate. And a support layer in which a communication hole communicating with the through hole is formed and capable of supporting the fine particles.

  By the way, when trying to collect fine particles in the structure, if the structure is a substrate having a recess that can be accommodated with fine particles, it may be difficult to create a flow of intake air including the fine particles themselves. is there. On the other hand, according to this configuration, the structure has a first substrate in which a through-hole penetrating the fine particles can be accommodated, a second substrate facing the first substrate, and the first substrate and the second substrate. Between the through hole of the first substrate and the communication hole of the support layer, and the fine particle itself is provided between the through hole of the first substrate and the communication hole of the support layer. Since the flow of the intake air can be created, fine particles can be reliably collected.

The collection system further includes a nozzle position measuring device that measures the position of the nozzle with respect to the first substrate, the nozzle position measuring device being moved up and down with respect to the first substrate along the first direction. A nozzle lifting / lowering mechanism, a structure moving mechanism for moving the structure in a second direction intersecting the first direction, and the nozzle together with the structure when the structure is moved in the second direction A determination unit that determines whether or not the object moves.
According to this configuration, by including the determination unit that determines whether or not the nozzle moves together with the structure when the structure is moved in the second direction, the determination unit determines that the nozzle has moved together with the structure. Sometimes, it can be estimated that the nozzle is in contact with the first substrate. On the other hand, when the determination unit determines that the nozzle does not move together with the structure, it can be estimated that the nozzle is separated from the first substrate. Therefore, the nozzle can be brought as close as possible to the first substrate while confirming whether the nozzle is actually in contact with the first substrate. Therefore, the first substrate and the nozzle can be positioned with high accuracy.

In the above collection system, the nozzle position measurement device may further include a camera that focuses on the surface of the first substrate and images the nozzle.
According to this configuration, since the focus is achieved when the nozzle approaches the surface of the first substrate, the nozzle can be clearly recognized from the captured image of the camera. Therefore, it is possible to easily bring the nozzle close to the surface of the first substrate while viewing the captured image of the camera. Therefore, the surface of the first substrate and the nozzle can be easily and accurately positioned.

In the collection system, the nozzle may be in contact with a surface of the first substrate opposite to the support layer.
According to this configuration, it is possible to avoid sucking external foreign matters as compared with the case where the nozzle and the first substrate are separated from each other. Therefore, it is possible to avoid the mixing (contamination) of the fine particles and the foreign matters and to reliably suck the desired fine particles. In addition, since it is possible to create a flow of intake air that entrains the fine particles themselves only between the through hole of the first substrate and the communication hole of the support layer, compared with the case where the nozzle and the first substrate are separated, The suction force of the nozzle can be kept low.

  ADVANTAGE OF THE INVENTION According to this invention, the nozzle position measuring method and collection | recovery system which can position a board | substrate and a nozzle accurately can be provided.

It is a top view showing a schematic structure of a recovery system concerning a first embodiment. It is a perspective view which shows schematic structure of a board | substrate. It is a figure which shows the principal part of the collection | recovery system which concerns on 1st embodiment. It is a top view which shows schematic structure of a dip part. It is a figure for demonstrating XY alignment. It is a figure which shows the state which the front-end | tip part of a nozzle is contact | abutting on the surface of a board | substrate. It is a figure which shows the state which the front-end | tip part of the nozzle has separated from the surface of the board | substrate. It is a top view which shows schematic structure of the collection | recovery system which concerns on 2nd embodiment. It is a perspective view which shows schematic structure of a structure. It is sectional drawing which shows schematic structure of a structure. It is a figure which shows the principal part of the collection | recovery system which concerns on 2nd embodiment. It is a figure which shows the state which the front-end | tip part of a nozzle is contact | abutting on the surface of the 1st board | substrate. It is a perspective view which shows the modification of a structure. It is a perspective view which shows the modification of a structure. It is a perspective view which shows the modification of a structure. It is a perspective view which shows the modification of a structure. It is a top view which shows schematic structure of the collection | recovery system which concerns on 3rd embodiment. It is a figure which shows schematic structure of a 1st detection apparatus. It is a figure which shows schematic structure of a 2nd detection apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation directions around the X axis, the Y axis, and the Z axis are the θX, θY, and θZ directions, respectively.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. In the present embodiment, a collection system used for a nozzle position measurement method for measuring the position of a nozzle with respect to a substrate will be described as an example. The recovery system of this embodiment includes a substrate that can store fine particles, and a nozzle that sucks and collects the fine particles stored in the substrate.

  For example, the fine particles are cells having a diameter of about 10 μm to 200 μm. The cells include antibody secreting cells, rare cells and the like. The term “fine particles” is not limited to a single cell, but is a concept that includes colonies and spheroids (cell mass).

  For example, the collection system sorts and collects target cells. Note that “recovery” is not limited to selecting and recovering target cells, but is a concept that includes a wide range of cases where cells are transferred to another container for recovery.

<Recovery system>
FIG. 1 is a plan view showing a schematic configuration of a recovery system 1 according to the first embodiment.
As shown in FIG. 1, the collection system 1 includes a base 2, a control device 3, a display device 4, an input device 5, a substrate 10, a nozzle 20, and a nozzle position measuring device 30. Yes. The collection system 1 is covered with a case (not shown). This prevents foreign matter (dust) from entering the collection system 1 from the outside.

<Base>
The base 2 holds each element (substrate 10, nozzle 20, and nozzle position measuring device 30) of the collection system 1. The base 2 has a rectangular shape in plan view.

<Control device>
The control device 3 controls driving of each element (nozzle 20 and nozzle position measuring device 30) of the collection system 1.

<Display device>
The display device 4 displays characters and images. The display device 4 displays various information regarding the collection system 1. For example, the display device 4 is a liquid crystal display.

<Input device>
The input device 5 includes an input device that accepts an operator's operation. For example, the input device is a keyboard and a mouse. The input device 5 outputs the input predetermined information to the control device 3.

<Board>
FIG. 2 is a perspective view showing a schematic configuration of the substrate 10.
As shown in FIG. 2, the substrate 10 has a rectangular plate shape. For example, the substrate 10 has a length of about 50 mm in the X-axis direction and the Y-axis direction. The substrate 10 has translucency. For example, the substrate 10 is a glass substrate or a plastic substrate.

The substrate 10 is formed with a plurality of recesses 11 that are recessed to accommodate the fine particles M. The plurality of recesses 11 are arranged in a matrix at regular intervals along the X-axis direction and the Y-axis direction. For example, the cross-sectional shape of the concave portion 11 is a U-shaped concave shape or a cup-shaped concave shape.
The size of the recess 11 is such that only one fine particle M can be accommodated. Thereby, the target single kind of cell etc. can be collect | recovered rapidly. In addition, the magnitude | size of the recessed part 11 may be a magnitude | size which can accommodate the some fine particle M, and is not specifically limited.

  Each recess 11 may contain a culture solution together with the fine particles M. Examples of the culture solution include DMEM medium, MEM medium, RPMI 1640 medium, Fischer's medium, and the like. In addition, the kind of culture solution is not specifically limited.

  A marking 12 is formed at a corner of the surface 10 a (upper surface) of the substrate 10. The marking 12 serves as a reference when setting coordinates regarding the X-axis direction and the Y-axis direction of each recess 11 on the surface 10 a of the substrate 10. For example, the marking 12 is formed by cutting a corner portion of the surface 10 a of the substrate 10. In addition, the marking 12 may be formed by printing the corner | angular part of the surface 10a of the board | substrate 10. FIG.

<Nozzle>
FIG. 3 is a diagram illustrating a main part of the collection system 1 according to the first embodiment.
As shown in FIG. 3, the nozzle 20 has a cylindrical shape having a tapered shape toward the lower side in the Z-axis direction. For example, the nozzle 20 is made of resin or metal. For example, the nozzle 20 is a microcapillary. As the nozzle 20, one corresponding to the size of the concave portion 11 of the substrate 10 is used. For example, the inner diameter of the tip 21 of the nozzle 20 is set to about twice the diameter of the recess 11. For example, the inner diameter of the tip portion 21 of the nozzle 20 is about 10 μm to 100 μm.

  A suction pump (not shown) is connected to the nozzle 20. For example, the suction pump is a tube pump driven by a stepping motor. The nozzle 20 sucks the microparticles M from the tip 21 when the suction pump rotates forward. On the other hand, the nozzle 20 discharges the fine particles M from the tip 21 when the suction pump rotates in the reverse direction.

<Nozzle position measuring device>
The nozzle position measuring device 30 measures the position of the nozzle 20 with respect to the substrate 10. The nozzle position measuring device 30 includes a nozzle lifting / lowering mechanism 31, a substrate moving mechanism 35, a determination unit 39, and a camera 40.

<Nozzle lifting mechanism>
The nozzle raising / lowering mechanism 31 raises / lowers the nozzle 20 with respect to the substrate 10 along the first direction V1. Here, the “first direction” corresponds to the normal direction of the surface 10 a of the substrate 10 (for example, the Z-axis direction). The nozzle lifting mechanism 31 includes an arm 32, a Z drive mechanism 33, and a nozzle position adjustment mechanism 34.

  The arm 32 holds the nozzle 20. The arm 32 is a rod-like member extending in a direction parallel to the XY plane. The nozzle 20 is detachably attached to one end of the arm 32. A Z drive mechanism 33 is connected to the other end of the arm 32.

  The Z drive mechanism 33 can move the arm 32 up and down in the Z-axis direction and can rotate around the Z-axis (θZ direction). For example, the Z drive mechanism 33 is driven by a stepping motor. With such a configuration, the nozzle 20 can perform operations such as turning, raising and lowering, suction and discharge.

  For example, the Z drive mechanism 33 is set such that the stroke in the Z-axis direction is 20 mm, the moving speed is 5 to 5000 μm / sec, and the position control in the Z-axis direction is ± 1 μm. In the Z drive mechanism 33, the drive angle in the turning operation in the θZ direction is set to ± 100 degrees (stroke 200 degrees), and the rotational position control is set to ± 0.002 degrees.

  The nozzle position adjusting mechanism 34 is a mechanism for aligning the nozzles 20. For example, the nozzle position adjustment mechanism 34 includes an adjustment knob such as a micrometer. Thereby, the attachment position of the nozzle 20 with respect to the arm 32 can be finely adjusted in the XY plane.

<Substrate moving mechanism>
The substrate moving mechanism 35 moves the substrate 10 in the second direction V2 that intersects the first direction V1.
Here, the “second direction” corresponds to a direction perpendicular to the normal direction of the surface 10 a of the substrate 10 (for example, the X-axis direction or the Y-axis direction). The substrate moving mechanism 35 includes a stage 36 and an XY drive mechanism 37.

  The stage 36 is a mounting table on which the substrate 10 is mounted. On the upper surface of the stage 36, a suction collection area 36a and a discharge collection area 36b are provided. The suction / recovery area 36a is an area for performing a recovery operation for sucking and collecting the fine particles M from the recess 11 of the substrate 10. The discharge / recovery area 36b is an area for discharging and collecting the fine particles M sucked and collected from the recess 11 of the substrate 10. That is, the nozzle 20 sucks the fine particles M from the substrate 10 (concave portion 11) in the suction collection area 36a, and discharges the sucked fine particles M in the discharge collection area 36b.

  A collection tray 15 for collecting the fine particles M discharged from the nozzle 20 is installed in the discharge collection area 36b. The collection tray 15 has a rectangular plate shape. The recovery tray 15 is formed with a plurality of wells 16 that are recessed to accommodate the fine particles M. The plurality of wells 16 are arranged in a matrix at regular intervals along the X-axis direction and the Y-axis direction. The well 16 separately collects and accommodates the fine particles M sequentially discharged from the nozzle 20. For example, the cross-sectional shape of the well 16 is a U-shaped concave shape or a cup-shaped concave shape. The size of the well 16 is approximately the same as the size of the recess 11 of the substrate 10. The size of the well 16 may be a size that can accommodate a plurality of fine particles M, and is not particularly limited.

An opening 36 h that faces the lower surface of the substrate 10 is formed in the suction collection area 36 a of the stage 36. A guide (not shown) for holding the substrate 10 is provided in the suction collection area 36 a of the stage 36. Thereby, the substrate 10 is held in a state of being positioned at a predetermined position of the suction collection area 36a.
The method for holding the substrate 10 in the suction collection area 36a may be suction holding by a suction mechanism, and is not particularly limited.

  The XY drive mechanism 37 can move the stage 36 along the X-axis direction and the Y-axis direction. For example, the XY drive mechanism 37 includes a motor and a feed screw. The XY drive mechanism 37 may include a linear motor or the like, and is not particularly limited.

  The substrate moving mechanism 35 may be capable of tilting the upper surface of the stage 36 in the XY plane independently of the XY driving mechanism 37. Thereby, the stage 36 can correct even when there is a slight inclination in the parallelism of the surface 10 a of the substrate 10.

<Determining unit>
The determination unit 39 is connected to the control device 3. The determination unit 39 determines whether the nozzle 20 moves together with the substrate 10 when the substrate 10 is moved in the second direction V1.

<Camera>
The camera 40 focuses on the surface 10 a of the substrate 10 and images the nozzle 20. The camera 40 includes a zoom lens 41, an eyepiece lens 42, a half mirror 43, and a light receiving unit 44.

  The zoom lens 41 is disposed in a state of facing the lower surface of the substrate 10 through an opening 36h formed in the suction collection region 36a. The zoom lens 41 adjusts the focus with respect to the surface 10 a of the substrate 10. Thereby, the camera 40 is focused on the surface 10a of the substrate 10.

  The eyepiece lens 42 makes the observation image through the zoom lens 41 visible with the naked eye of the operator.

  The half mirror 43 is disposed on the optical path between the zoom lens 41 and the light receiving unit 44. The half mirror 43 transmits part of the light that has passed through the zoom lens 41 and reflects the remaining part. The light reflected by the half mirror 43 is guided to the eyepiece lens 42.

  For example, the light receiving unit 44 is an image sensor such as a CCD image sensor. The light receiving unit 44 outputs the captured image to the control device 3 via the determination unit 39. Thereby, the captured image of the camera 40 is displayed on the display device 4.

FIG. 4 is a plan view showing a schematic configuration of the dip unit 50.
As illustrated in FIG. 4, the collection system 1 of the embodiment further includes a dip portion 50 that immerses (dips) the nozzle 20. The dip unit 50 includes a reagent dip unit 51 and a cleaning liquid dip unit 52.

  Hereinafter, the position where the nozzle 20 sucks the fine particles M is “suction position”, the standby position of the nozzle 20 is “standby position (home position)”, the position where the nozzle 20 is cleaned is “cleaning position”, and the nozzle 20 The discharge position is called “discharge position”. The nozzle 20 moves between the suction position P1, the standby position P2, the cleaning position P3, and the discharge position P4 by the rotation operation of the arm 32.

The reagent dip unit 51 is disposed at the standby position P2. The reagent dip part 51 makes the tip part 21 of the nozzle 20 wet with a liquid. Thereby, it can suppress that the front-end | tip part 21 of the nozzle 20 dries in the stand-by position P2.
In the reagent dip unit 51, as a liquid to dip the tip 21 of the nozzle 20, a culture solution or PBS (Phosphate buffered saline) disposed in the recess 11 together with the fine particles M is used.

The cleaning liquid dip unit 52 is disposed at the cleaning position P3. The cleaning liquid dip unit 52 cleans the inside of the tip part 21 of the nozzle 20 by filling the tip part 21 of the immersed nozzle 20 with the cleaning liquid. Thereby, even if it is a case where one nozzle 20 is shared in the fine particle collection | recovery operation | movement in each recessed part 11, generation | occurrence | production of contamination can be suppressed.
In the cleaning liquid dip section 52, as the cleaning liquid for cleaning the tip portion 21 of the nozzle 20, a culture liquid or PBS arranged in the recess 11 together with the fine particles M is used.

<Nozzle position measurement method>
Hereinafter, an example of a nozzle position measurement method for measuring the position of the nozzle 20 with respect to the substrate 10 using the collection system 1 of the present embodiment will be described.

  In the nozzle position measuring method of the present embodiment, a nozzle moving step for moving the nozzle 20 up and down with respect to the substrate 10 along the first direction V1, and a substrate movement for moving the substrate 10 in the second direction V2 after the nozzle lifting step. And a determination step of determining whether or not the nozzle 20 moves together with the substrate 10 in the substrate movement step.

First, the collection system 1 is turned on.
The collection system 1 performs an initialization operation when the power is turned on. For example, in the initialization operation, the stage 36 is moved to the standby position (initial position). And after performing the turning operation | movement of the nozzle 20, raising / lowering operation, and suction discharge operation | movement, the nozzle 20 is moved to a standby position (standby position P2). Thereby, it can be confirmed that the stage 36 and the nozzle 20 operate normally without interfering with other mechanisms. In addition, the stage 36 and the nozzle 20 are in a standby state at the reference position (home position).

  Next, the substrate 10 in which the fine particles M are accommodated in the respective recesses 11 is set in the suction collection area 36 a of the stage 36. Further, the collection tray 15 is set in the discharge collection area 36 b of the stage 36. For example, the setting operation of the substrate 10 and the collection tray 15 is manually performed by an operator. The set operation may be automated by a robot.

  Next, the substrate 10 and the nozzle 20 are positioned (hereinafter referred to as “XY alignment”) in the X-axis direction and the Y-axis direction. For example, XY alignment is performed visually. Specifically, in the XY alignment, the stage 36 is moved along the X-axis direction and the Y-axis direction by the XY drive mechanism 37 while visually confirming that the tip portion 21 and the concave portion 11 of the nozzle 20 overlap in the Z-axis direction. To do. In addition, the adjustment knob (micrometer) of the nozzle position adjusting mechanism 34 is operated.

  For example, in XY alignment, lower illumination (not shown) is turned on, and the nozzle 20 is positioned in the XY plane at the suction position P1. At this time, the illumination light passes through the recess 11 and is applied to the nozzle 20. The light reflected by the nozzle 20 is guided to the eyepiece lens 42 and the light receiving unit 44 through the zoom lens 41 and the half mirror 43. Then, the display device 4 displays an image guided to the light receiving unit 44 (a captured image of the camera 40).

FIG. 5 is a diagram for explaining XY alignment.
As shown in FIG. 5, in the XY alignment, for example, the center axis C <b> 1 (axis passing through the radial center) of the nozzle 20 and the reference point G <b> 1 of the observation area of the recess 11 are matched. Here, the “reference point G1 of the observation region of the concave portion 11” corresponds to the center point of the display image G (image guided to the light receiving unit 44) displayed on the display device 4.

  The alignment between the center axis C1 of the nozzle 20 and the center G1 of the display image G is performed by operating an adjustment knob (micrometer) of the nozzle position adjusting mechanism 34. For example, a target mark TM such as a cross mark is displayed at a position corresponding to the center G1 of the display image G. Thereby, alignment with the center axis | shaft C1 of the nozzle 20 and the center G1 of the display image G can be performed easily.

  Next, focus adjustment with respect to the surface 10a of the substrate 10 is performed. Specifically, in the nozzle ascending / descending process, the tip portion 21 of the nozzle 20 is imaged by the camera 40 that is focused on the surface 10a of the substrate 10.

  For example, in focus adjustment, upper illumination (not shown) is turned on. At this time, the illumination light passes through the concave portion 11 and is guided to the eyepiece lens 42 and the light receiving unit 44 through the zoom lens 41 and the half mirror 43. Then, the display device 4 displays an image guided to the light receiving unit 44 (a captured image of the camera 40).

  For example, the focus adjustment with respect to the surface 10 a of the substrate 10 is performed while visually confirming the captured image of the camera 40 displayed on the display device 4. In addition, you may perform focus adjustment with respect to the surface 10a of the board | substrate 10, visually recognizing the observation image of the recessed part 11 via the eyepiece lens 42. FIG.

  Next, in the nozzle raising / lowering step, the nozzle 20 is lowered along the first direction V1. Next, in the substrate moving step, the substrate 10 is moved in the second direction V2. In the determination step, it is determined whether the nozzle 20 moves together with the substrate 10.

  Here, the tip 21 of the nozzle 20 has a tapered shape. Therefore, as shown in FIG. 6, when the tip portion 21 of the nozzle 20 is in contact with the surface 10 a of the substrate 10, the nozzle 20 is also likely to move following the movement of the substrate 10. Therefore, in the determination step, when it is determined that the nozzle 20 has moved together with the substrate 10, it can be estimated that the tip portion 21 of the nozzle 20 is in contact with the surface 10 a of the substrate 10.

  On the other hand, as shown in FIG. 7, when the tip 21 of the nozzle 20 is separated from the surface 10 a of the substrate 10, the possibility that the nozzle 20 moves following the movement of the substrate 10 is low. Therefore, in the determination step, when it is determined that the nozzle 20 does not move together with the substrate 10, it can be estimated that the tip portion 21 of the nozzle 20 is separated from the surface 10 a of the substrate 10.

  In the nozzle position measurement method of the present embodiment, when it is determined that the nozzle 20 has moved based on the determination result in the determination step, the nozzle 20 is separated from the substrate 10 and when it is determined that the nozzle 20 does not move. It further includes a position adjustment step of adjusting the relative position between the nozzle 20 and the substrate 10 by making the nozzle 20 stationary.

  For example, in the position adjustment step, when it is determined that the nozzle 20 has moved based on the determination result in the determination step, the nozzle 20 is moved away from the substrate 10 (hereinafter referred to as “first adjustment”). Thereby, the state where the tip 21 of the nozzle 20 is in contact with the surface 10a of the substrate 10 is released. On the other hand, in the position adjustment step, when it is determined that the nozzle 20 does not move based on the determination result in the determination step, the nozzle 20 is stopped (hereinafter referred to as “second adjustment”). Thereby, the state where the tip 21 of the nozzle 20 is separated from the surface 10a of the substrate 10 is maintained.

  And the relative position of the nozzle 20 and the board | substrate 10 is adjusted based on the determination result in a determination process. Specifically, after the first adjustment or the second adjustment, the nozzle 20 is slightly lowered along the first direction V1 (for example, smaller than the movement amount in the nozzle raising / lowering process) (hereinafter referred to as “third”). Adjustment "). Next, after the third adjustment, the substrate 10 is moved in the second direction V2 to determine whether or not the nozzle 20 moves together with the substrate 10 (hereinafter referred to as “fourth adjustment”).

  In the fourth adjustment, when it is determined that the nozzle 20 has moved, the nozzle 20 is moved away from the substrate 10 (first adjustment). On the other hand, in the fourth adjustment, when it is determined that the nozzle 20 does not move, the nozzle 20 is stopped (second adjustment). That is, in the position adjustment step, the first adjustment to the fourth adjustment are repeated.

  Thereby, in the position adjustment process, the tip portion 21 of the nozzle 20 is brought as close as possible to the surface 10 a of the substrate 10. As shown in FIG. 7, in the position adjustment step, the distance H2 between the tip 21 of the nozzle 20 and the surface 10a of the substrate 10 is set to be larger than the size H1 (diameter) of the fine particles M accommodated in the recess 11 of the substrate 10. Decrease (H2 <H1). For example, in the position adjusting step, when the size H1 of the fine particles M is about 10 μm, the interval H2 between the tip portion 21 of the nozzle 20 and the surface 10a of the substrate 10 is set to about 1 μm.

As described above, the nozzle position measuring method according to the present embodiment is a nozzle position measuring method for measuring the position of the nozzle 20 with respect to the substrate 10, and the nozzle 20 is moved up and down with respect to the substrate 10 along the first direction V1. A nozzle raising / lowering step, a substrate moving step of moving the substrate 10 in the second direction V2 after the nozzle raising / lowering step, and a determination step of determining whether the nozzle 20 moves together with the substrate 10 in the substrate moving step. Including.
According to this method, by including a determination step of determining whether or not the nozzle 20 moves together with the substrate 10 in the substrate movement step, when it is determined in the determination step that the nozzle 20 moves together with the substrate 10, the nozzle 20 Can be estimated to be in contact with the substrate 10.
On the other hand, when it is determined in the determination step that the nozzle 20 does not move together with the substrate 10, it can be estimated that the nozzle 20 is separated from the substrate 10. Therefore, the nozzle 20 can be brought as close to the substrate 10 as possible while confirming whether or not the nozzle 20 is actually in contact with the substrate 10. Therefore, the substrate 10 and the nozzle 20 can be accurately positioned.
By the way, in the positioning of the substrate 10 and the nozzle 20, a method using an optical sensor can be considered. However, when the surface 10a of the substrate 10 is a liquid surface, there is a possibility that the position of the substrate 10 cannot be accurately measured due to refraction, reflection, etc. of the light on the liquid surface. On the other hand, according to this method, since no light is used, the substrate 10 and the nozzle 20 can be accurately positioned even when the surface 10a of the substrate 10 is a liquid surface.

  Further, in the nozzle raising / lowering step, the nozzle 20 is imaged by the camera 40 that is focused on the surface 10a of the substrate 10, so that the nozzle 20 is focused when the nozzle 20 approaches the surface 10a of the substrate 10 in the nozzle raising / lowering step. The nozzle 20 can be clearly recognized from the captured image of the camera 40. Therefore, the nozzle 20 can be easily brought close to the surface 10a of the substrate 10 while viewing the image captured by the camera 40. Therefore, the surface 10a of the substrate 10 and the nozzle 20 can be easily and accurately positioned.

Further, in the nozzle position measurement method according to the present embodiment, when it is determined that the nozzle 20 has moved based on the determination result in the determination step, it is determined that the nozzle 20 is moved away from the substrate 10 and the nozzle 20 does not move. In this case, the method further includes a position adjusting step in which the nozzle 20 is stopped and the relative position between the nozzle 20 and the substrate 10 is adjusted.
According to this method, in the position adjustment step, when it is determined that the nozzle 20 has moved based on the determination result in the determination step, the nozzle 20 contacts the substrate 10 by moving the nozzle 20 away from the substrate 10. The state can be released. On the other hand, in the position adjustment step, when it is determined that the nozzle 20 does not move based on the determination result in the determination step, the nozzle 20 can be kept stationary so that the nozzle 20 can be kept away from the substrate 10. . And the nozzle 20 can be made to approach the board | substrate 10 to the maximum by adjusting the relative position of the nozzle 20 and the board | substrate 10 based on the determination result in a determination process. Therefore, the substrate 10 and the nozzle 20 can be positioned with higher accuracy. In addition, when it is determined that the nozzle 20 has moved based on the determination result in the determination step, the nozzle 20 is excessively contacted with the substrate 10 by causing the nozzle 20 to move away from the substrate 10 and an excessive load is applied to the nozzle 20. It is possible to prevent the nozzle 20 from being sunk into the substrate 10.

In the position adjusting step, the distance H2 between the nozzle 20 and the substrate 10 is made smaller than the size H1 of the fine particles M accommodated in the concave portion 11 of the substrate 10.
By the way, when the fine particles M accommodated in the recesses 11 of the substrate 10 are sucked by the nozzles 20, if the nozzles 20 and the substrate 10 are brought into contact (adhering), it is not possible to create a flow of intake air including the fine particles M themselves. there is a possibility. That is, since the flow of the intake air is blocked at the contact portion between the nozzle 20 and the substrate 10, there is a possibility that the fine particles M cannot be sucked. On the other hand, according to this method, in the position adjustment step, the gap H2 between the nozzle 20 and the substrate 10 is opened, so that the flow of intake air including the fine particles M itself can be created without obstructing the flow of intake air. Therefore, the fine particles M can be reliably sucked. In addition, the distance H2 between the nozzle 20 and the substrate 10 is smaller than the size H1 of the fine particles M, so that the distance H2 between the nozzle 20 and the substrate 10 is greater than or equal to the size H1 of the fine particles M. It is possible to suppress the suction of external foreign matters. Therefore, mixing of the fine particles M and foreign matters (contamination) can be suppressed, and the desired fine particles M can be reliably sucked. By the way, when the substrate 10 on which the plurality of concave portions 11 capable of accommodating the fine particles M is used is used, when the interval H2 between the nozzle 20 and the substrate 10 is equal to or larger than the size H1 of the fine particles M, the substrate is accommodated in the concave portion 11 as a target. When sucking the fine particles M, the fine particles M accommodated in the adjacent recesses 11 may be sucked by mistake. On the other hand, according to this method, the distance H2 between the nozzle 20 and the substrate 10 is made smaller than the size H1 of the fine particles M, so that the fine particles M accommodated in the adjacent recesses 11 are sucked by mistake. You can avoid that.

In the present embodiment, the nozzle 20 is formed of resin or metal.
By the way, when the nozzle 20 is formed of glass, the nozzle 20 may break when the nozzle 20 abuts against the substrate 10 and an excessive load is applied to the nozzle 20. On the other hand, in this embodiment, since the nozzle 20 is formed of resin or metal, even if the nozzle 20 is excessively abutted against the substrate 10 and an excessive load is applied to the nozzle 20, the nozzle 20 bends to some extent. Can be avoided.

(Second embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to FIGS.
FIG. 8 is a plan view showing a schematic configuration of the collection system 201 according to the second embodiment.
As shown in FIG. 8, this embodiment is different from the first embodiment in that a structure 210 is provided instead of the substrate 10. That is, the collection system 201 of the present embodiment includes the structure 210 that can store the fine particles M and the nozzle 20 that sucks and collects the fine particles M stored in the structure 210. 8-12, the same code | symbol is attached | subjected to the structure similar to 1st embodiment, and the detailed description is abbreviate | omitted.

<Structure>
In the plan view of FIG. 8, the structure 210 has a rectangular shape. For example, the structure 210 has a length of about 50 mm in the X-axis direction and the Y-axis direction. The structure 210 has translucency.

FIG. 9 is a perspective view showing a schematic configuration of the structure 210. FIG. 10 is a cross-sectional view illustrating a schematic configuration of the structure 210.
As shown in FIG. 9, the structure 210 includes a first substrate 211, a second substrate 212, a support layer 213, and support pillars 214.

<First substrate>
The first substrate 211 has a rectangular plate shape. For example, the first substrate 211 is a glass substrate or a plastic substrate. For example, the thickness of the first substrate 211 is about 5 μm to 100 μm. A marking 12 is formed at a corner of the surface 211 a (upper surface) of the first substrate 211.

  The first substrate 211 is formed with a plurality of through holes 211h that penetrate the fine particles M so as to be accommodated. The plurality of through holes 211h are arranged in a matrix at regular intervals along the X-axis direction and the Y-axis direction. The through hole 211h has a circular shape in plan view. The size of the through hole 211h is such that only one fine particle M can be accommodated. Thereby, the target single kind of cell etc. can be collect | recovered rapidly. The size of the through hole 211h is not particularly limited, and may be a size that can accommodate a plurality of fine particles M.

  Each through-hole 211h may contain a culture solution together with the fine particles M. Examples of the culture solution include DMEM medium, MEM medium, RPMI 1640 medium, Fischer's medium, and the like. In addition, the kind of culture solution is not specifically limited.

<Second board>
The second substrate 212 faces the first substrate 211 through the support layer 213 and the support pillars 214.
The second substrate 212 has a rectangular plate shape. For example, the second substrate 212 is a glass substrate or a plastic substrate.

<Support layer>
The support layer 213 is disposed between the first substrate 211 and the second substrate 212. Specifically, the support layer 213 is coupled to the back surface 211b (lower surface) of the first substrate 211. For example, the support layer 213 is a resin layer. The thickness of the support layer 213 is thinner than the thickness of the first substrate 211.

The support layer 213 has a plurality of communication holes 213h that communicate with the through holes 211h. The plurality of communication holes 213h are arranged in a matrix at regular intervals along the X-axis direction and the Y-axis direction. The support layer 213 has a mesh shape. In plan view, the communication hole 213h has a circular shape. The diameter of the communication hole 213h is smaller than that of the through hole 211h.
The diameter of the communication hole 213h is smaller than the size of the fine particles M. Thereby, the support layer 213 can support the fine particles M.

<Support pillar>
The support pillar 214 is disposed between the first substrate 211 and the second substrate 212. The support pillar 214 has a cylindrical shape extending in the Z-axis direction. For example, the support pillar 214 is made of resin. The support column 214 connects the first substrate 211 and the second substrate 212 at a position avoiding the through hole 211h.

<Nozzle position measuring device>
FIG. 11 is a diagram illustrating a main part of the collection system 201 according to the second embodiment.
As shown in FIG. 11, the collection system 201 further includes a nozzle position measuring device 230 that measures the position of the nozzle 20 with respect to the first substrate 211.
The nozzle position measuring device 230 includes a nozzle lifting mechanism 31, a structure moving mechanism 235, a determination unit 39, and a camera 40.
The structure moving mechanism 235 corresponds to the substrate moving mechanism 35 according to the first embodiment.

FIG. 12 is a diagram illustrating a state in which the tip portion 21 of the nozzle 20 is in contact with the surface 211 a of the first substrate 211.
As shown in FIG. 12, in the present embodiment, at the suction position P1, the tip portion 21 of the nozzle 20 is in contact with the surface of the first substrate 211 opposite to the support layer 213 (that is, the surface 211a). Yes. That is, in the nozzle position measurement method according to this embodiment, in the position adjustment step, the tip 21 of the nozzle 20 is brought into contact (contacted) with the surface 211a of the first substrate 211.

  As described above, the recovery system 201 according to the present embodiment includes the structure 210 that can store the fine particles M and the nozzle 20 that sucks and recovers the fine particles M stored in the structure 210. The structure 210 includes a first substrate 211 in which a through-hole 211h penetrating the fine particles M is formed, a second substrate 212 facing the first substrate 211, a first substrate 211, and a second substrate And a support layer 213 that is disposed between the substrate 212 and that has a communication hole 213 h that communicates with the through hole 211 h and that can support the fine particles M.

  By the way, when trying to collect the fine particles M in the structure, if the structure is the substrate 10 (see FIG. 2) in which the concave portion 11 is formed so as to be able to accommodate the fine particles M, the flow of the intake air entraining the fine particles M themselves. It can be difficult to make. On the other hand, according to this configuration, the structure 210 includes the first substrate 211 in which the through-hole 211h penetrating through the fine particles M is formed, the second substrate 212 facing the first substrate 211, By providing a support layer 213 that is disposed between the one substrate 211 and the second substrate 212 and that is formed with a communication hole 213 h that communicates with the through hole 211 h and can support the fine particles M, the first substrate 211 can be penetrated. Since a flow of intake air in which the fine particles M themselves are involved can be created between the holes 211h and the communication holes 213h of the support layer 213, the fine particles M can be reliably recovered.

The collection system 201 further includes a nozzle position measuring device 230 that measures the position of the nozzle 20 with respect to the first substrate 211. The nozzle position measuring device 230 moves the nozzle 20 along the first direction V1 to the first substrate 211. The nozzle 20 is moved up and down, the structure moving mechanism 235 that moves the structure 210 in the second direction V2, and the nozzle 20 together with the structure 210 when the structure 210 is moved in the second direction V1. And a determination unit 39 for determining whether or not to move.
According to this configuration, by including the determination unit 39 that determines whether the nozzle 20 moves together with the structure 210 when the structure 210 is moved in the second direction V1, the determination unit 39 and the structure 210 together. When it is determined that the nozzle 20 has moved, it can be estimated that the nozzle 20 is in contact with the first substrate 211. On the other hand, when the determination unit 39 determines that the nozzle 20 does not move together with the structure 210, it can be estimated that the nozzle 20 is separated from the first substrate 211. Therefore, the nozzle 20 can be brought as close as possible to the first substrate 211 while confirming whether the nozzle 20 is actually in contact with the first substrate 211. Therefore, the first substrate 211 and the nozzle 20 can be positioned with high accuracy.

In the collection system 201, the nozzle position measurement device 230 further includes a camera 40 that images the nozzle 20 by focusing on the surface 211 a of the first substrate 211.
According to this configuration, since the focus is achieved when the nozzle 20 approaches the surface 211 a of the first substrate 211, the nozzle 20 can be clearly recognized from the captured image of the camera 40. Therefore, it is possible to easily bring the nozzle 20 close to the surface 211 a of the first substrate 211 while viewing the image captured by the camera 40. Therefore, the surface 211a of the first substrate 211 and the nozzle 20 can be easily positioned with high accuracy.

In the recovery system 201, the nozzle 20 is in contact with the surface 211 a of the first substrate 211.
According to this configuration, it is possible to avoid sucking external foreign matters as compared with the case where the nozzle 20 and the first substrate 211 are separated from each other. Therefore, mixing of the fine particles M and foreign matters (contamination) can be avoided, and the desired fine particles M can be reliably sucked. In addition, since it is possible to create an intake air flow that encloses the fine particles M only between the through hole 211h of the first substrate 211 and the communication hole 213h of the support layer 213, the nozzle 20 and the first substrate 211 are separated from each other. Compared to the case, the suction force of the nozzle 20 can be kept low.

(Modification of structure according to second embodiment)
Next, a modified example of the structure 210 according to the second embodiment will be described with reference to FIGS.
13 to 16 are perspective views showing modifications of the structure 210. FIG.
As shown in FIGS. 13-16, in this modification, the aspect of the support layer 213 differs especially with respect to the structure 210 which concerns on 2nd embodiment. 13 to 16, the same reference numerals are given to the same components as those in the second embodiment, and detailed description thereof will be omitted.

  As shown in FIG. 13, in the structure 210A of the present modification, the support layer 213 has a plurality of communication holes 213i that communicate with the through holes 211h. The plurality of communication holes 213i are arranged only in a portion overlapping with the through hole 211h in the Z-axis direction. In plan view, the communication hole 213i has a slit shape (specifically, a shape in which one rectangular shape and one semicircular shape are arranged).

  As shown in FIG. 14, in the structure 210B of this modification, the support layer 213 is formed with a plurality of communication holes 213j that communicate with the through holes 211h. The plurality of communication holes 213j are arranged only in a portion overlapping with the through hole 211h in the Z-axis direction. In plan view, the communication hole 213j has a shape in which three sectors having a central angle of about 120 degrees are arranged in the circumferential direction.

  As shown in FIG. 15, in the structure 210C of this modification, the support layer 213 is formed with a plurality of communication holes 213k communicating with the through holes 211h. The plurality of communication holes 213k are disposed only in a portion overlapping with the through hole 211h in the Z-axis direction. In the plan view, the communication hole 213k has a shape in which four sectors having a central angle of about 90 degrees are arranged in the circumferential direction.

  As shown in FIG. 16, in the structure 210D of the present modification, the support layer 213 is formed with a plurality of communication holes 213m communicating with the through holes 211h. The plurality of communication holes 213m are arranged only in a portion overlapping with the through hole 211h in the Z-axis direction. In plan view, the communication hole 213m has a shape in which four squares are arranged in the circumferential direction.

  Note that the mode of the support layer 213 (the mode of the communication hole) is not limited to those illustrated in FIGS. 13 to 16, and various modes can be adopted.

(Third embodiment)
Hereinafter, a third embodiment of the present invention will be described with reference to FIGS.
FIG. 17 is a plan view showing a schematic configuration of a recovery system 301 according to the third embodiment.
As shown in FIG. 17, this embodiment is different from the second embodiment in that a detection device 360 is further provided. 17 to 19, the same components as those in the second embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

<Detection device>
As shown in FIG. 17, the detection device 360 is arranged at a position overlapping the suction collection region 36 a in plan view. The detection device 360 includes a first detection device 361 and a second detection device 362.

FIG. 18 is a diagram illustrating a schematic configuration of the first detection device 361.
As shown in FIG. 18, the first detection device 361 can measure the height and parallelism of the surface 211a of the first substrate 211 in a non-contact manner by using laser light as detection light. The first detection device 361 is fixed to the base 2 (see FIG. 17) by a fixing member (not shown).
Therefore, the relative position of the first detection device 361 with respect to the structure 210 placed on the stage 36 is fixed. Thereby, the first detection device 361 can perform measurement with high accuracy.

  The first detection device 361 includes a light emitting unit 361a that emits the detection light L1 and a light receiving unit 361b that receives the detection light L1. For example, the light emitting unit 361a emits laser light having a light diameter of 1 μm as the detection light L1. The light receiving unit 361b receives the detection light L1 emitted from the light emitting unit 361a and reflected by the surface 211a of the first substrate 211.

  For example, the light emitting unit 361a is a YAG laser. The light receiving unit 361b is reflected on the surface 211a of the first substrate 211 and based on the time until the detection light L1 reaches the light receiving unit 361b, the reflection angle of the detection light L1 on the surface 211a of the first substrate 211, and the like. Information on the height (coordinate position in the Z-axis direction) and parallelism of the first substrate 211 is acquired. The first detection device 361 outputs the detection result to the control device 3.

FIG. 19 is a diagram illustrating a schematic configuration of the second detection device 362.
As shown in FIG. 19, the second detection device 362 can measure the height of the tip portion 21 of the nozzle 20 in a non-contact manner by using laser light as detection light. The second detection device 362 is fixed to the base 2 (see FIG. 17) by a fixing member (not shown). Therefore, the relative position of the second detection device 362 with respect to the nozzle 20 is fixed. Thereby, the second detection device 362 can perform measurement with high accuracy.

  In addition, the second detection device 362 is movable between the measurement position and the standby position. For example, when the second detection device 362 does not detect the nozzle 20, the operation of the nozzle 20 is not hindered by retracting the second detection device 362 to a standby position above the arm 32.

  The second detection device 362 includes a light emitting unit 362a that emits the detection light L2, and a light receiving unit 362b that receives the detection light L2. For example, the light emitting unit 362a emits laser light having a light diameter of 1 μm as the detection light L2. The light receiving unit 362b receives the detection light L2 emitted from the light emitting unit 362a.

  For example, the light emitting unit 362a is a YAG laser. The light receiving unit 362b is configured to detect the detection light L2 emitted from the light emitting unit 362a at the front end 21 of the nozzle 20 based on the received light amount (luminance) of the detection light L2 and the like. Information on the height (the coordinate position in the Z-axis direction) is detected. The second detection device 362 outputs the detection result to the control device 3.

As described above, the collection system 301 according to the present embodiment includes the first detection device 361 and the second detection device 362, so that information on the height of the first substrate 211 and the tip portion 21 of the nozzle 20 can be obtained. It can be detected in a non-contact manner. Therefore, it is possible to detect the positional information of the first substrate 211 and the nozzle 20 with high accuracy without causing damage due to the contact to the first substrate 211 and the nozzle 20 and without causing a positional shift associated with the contact. It is.
By the way, the detection of the surface 211a of the first substrate 211 by the first detection device 361 is not performed on the entire surface 211a. For this reason, it is assumed that a slight unevenness is generated for some reason in a part of the surface 211a (a region outside the detection area). Therefore, it may be possible for an operator to add a margin of several μm to the data using the input device 5 (for example, a keyboard). In this case, a value obtained by adding a predetermined margin to the height data of the surface 211a of the first substrate 211 detected by the first detection device 361 can be set as the height of the first surface 211a.

  The present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit or concept of the invention that can be read from the claims and the entire specification. For example, in the above-described embodiment, an example in which the plurality of through holes 211h are formed in the first substrate 211 has been described, but the present invention is not limited thereto. For example, only one through hole 211h may be formed in the first substrate 211. That is, the structure 210 may be capable of accommodating only one fine particle M.

  Moreover, although the example which performs XY alignment by visual observation was given in the said embodiment, it is not restricted to this. For example, the XY alignment may be automatically performed based on the marking 12. For example, the control device 3 may control the XY drive mechanism 37 to perform XY alignment so that the substrate 10 and the nozzle 20 coincide in the X-axis direction and the Y-axis direction.

  In addition, each component described as embodiment or its modification in the above can be combined suitably, in the range which does not deviate from the meaning of this invention, and some components are combined among several combined components. It is also possible not to use as appropriate.

DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 10a ... Surface, 11 ... Recessed part, 20 ... Nozzle, 31 ... Nozzle raising / lowering mechanism, 39 ... Determination part, 40 ... Camera, H1 ... Size of fine particle, H2 ... Space | interval of a nozzle and a board | substrate, 201,301 ... Recovery system, 210, 210A, 210B, 210C, 210D ... Structure, 211 ... First substrate, 211a ... Surface (surface opposite to the support layer of the first substrate), 211h ... Through hole, 212 ... Second Substrate, 213 ... support layer, 213h, 213i, 213j, 213k, 213m ... communication hole, 230 ... nozzle position measuring device, 235 ... structure moving mechanism, M ... fine particles, V1 ... first direction, V2 ... second direction

Claims (7)

A nozzle position measurement method for measuring the position of a nozzle with respect to a substrate,
The nozzle is movable in a first direction and is movable asynchronously or independently of movement of the substrate in a second direction intersecting the first direction.
A nozzle elevating step of elevating relative to the substrate and along the nozzle in the first direction,
After the nozzle lift step, a substrate moving step of moving the substrate in the second direction,
A determination step of determining whether or not the nozzle moves together with the substrate in the substrate movement step. The nozzle position measuring method according to claim 1, wherein in the nozzle raising / lowering step, the nozzle is imaged with a camera in focus on the surface of the substrate. Based on the determination result in the determination step, further includes a position adjustment step of adjusting the relative position of the nozzle and the substrate,
3. The position adjusting step causes the nozzle to move away from the substrate when it is determined that the nozzle has moved, and keeps the nozzle stationary when it is determined that the nozzle does not move. Nozzle position measurement method described in 1. The nozzle position measuring method according to claim 3, wherein, in the position adjusting step, the interval between the nozzle and the substrate is made smaller than the size of the fine particles accommodated in the concave portion of the substrate. A recovery system comprising a structure that can store fine particles, and a nozzle that sucks and recovers the fine particles stored in the structure,
The nozzle is movable in a first direction and is movable asynchronously or independently of movement of the structure in a second direction intersecting the first direction,
The structure is
A first substrate formed with a through-hole penetrating the fine particles;
A second substrate facing the first substrate;
A support layer that is disposed between the first substrate and the second substrate, has a communication hole that communicates with the through-hole, and can support the fine particles, and
A nozzle position measuring device for measuring the position of the nozzle with respect to the first substrate;
The nozzle position measuring device is
A nozzle elevating mechanism for elevating to said first substrate and along said nozzle to said first direction,
After allowed along the nozzle in the first direction to lift relative to the first substrate, the structure moving mechanism for moving the structure in the second direction,
A determination unit that determines whether the nozzle moves together with the structure when the structure is moved in the second direction. The nozzle position measuring device is
The collection system according to claim 5 , further comprising a camera that focuses the surface of the first substrate and images the nozzle. The nozzle, the recovery system according to claim 5 or 6 is in contact with the surface opposite to the supporting layer of the first substrate.

Images