JP6619451B2 - Electronic equipment rack and apparatus comprising electronic equipment rack - Google Patents

Description

  The present invention relates to an electronic equipment rack and an apparatus including the electronic equipment rack, and is particularly suitable for application to an electronic equipment rack that requires efficient exhaust and an apparatus including the electronic equipment rack.

  The evolution of semiconductor integrated circuits used in electronic devices, especially semiconductor integrated circuits such as those represented by CPUs (Central Processing Units) of information processing devices, has been rapidly progressing, and the density and heat generation have been increasing. Is a well-known fact. Along with this, the number of mounted fans or the number of rotations is increased for cooling electronic components such as semiconductor integrated circuits, and the noise value and power consumption of the apparatus are also increasing.

  In particular, with regard to power consumption, there is a strong demand for power saving from the viewpoint of reducing the environmental load. In addition, with respect to electronic equipment racks such as server equipment and other rack equipment, it is also an issue to improve arrangement efficiency and maintainability while maintaining cooling performance. In order to meet the demands of these users, high efficiency cooling technology and rack solutions have been developed.

  A conventional electronic equipment rack is configured as a rack that can be stacked in multiple stages on one surface, and further includes a power supply for power supply and a cooling fan, and accommodates a plurality of electronic equipment that operate independently. It has a configuration (see Patent Document 1).

JP 2013-74219 A

  However, in such a configuration, the cooling air direction of the electronic device has a uniform inlet / exhaust direction from the viewpoint of cooling performance, and the rear surface of the rack becomes an exhaust area, and the temperature in the vicinity of the exhaust area increases. Therefore, in an environment where it is necessary to install a plurality of racks containing similar electronic devices, such as a data center, bringing an inlet area of another rack close to the exhaust area causes a cooling problem. There is a fear. As a result, conventional rack installation restrictions have occurred, and this is a factor that impairs the placement efficiency of electronic devices and the like in such an environment.

  The present invention has been made in consideration of the above points, and an object of the present invention is to propose an electronic equipment rack and an apparatus including the electronic equipment rack capable of suppressing the arrangement space while maintaining the cooling efficiency.

  In order to solve such a problem, in the present invention, the housing, the plurality of support columns supporting the side surface portion of the housing, and the side surface portion are provided so as to be arranged along the plurality of support columns. A pair of support portions each holding both side end portions of the plurality of electronic devices inserted from the side, and tip portions of the plurality of electronic devices inserted from the side portions face each other along the plurality of columns. An exhaust recovery duct that is a cavity formed inside the casing and through which heat generated by the plurality of electronic devices passes, and an upper exhaust port that is provided on the upper surface of the casing and communicates with the exhaust recovery duct And a blower that exhausts heat generated by the plurality of electronic devices from the upper surface exhaust port via the exhaust recovery duct.

  Further, in the present invention, in an apparatus including an electronic device rack capable of mounting a plurality of electronic devices, the electronic device rack includes a housing, a plurality of support columns that support side surfaces of the housing, and the plurality A pair of support portions each holding both side end portions of the plurality of electronic devices inserted from the side surface portion, and the plurality of inserted portions inserted from the side surface portion. An exhaust recovery duct that is a cavity formed inside the housing along the plurality of support columns by the front end portions of the electronic devices facing each other and through which heat generated by the plurality of electronic devices passes, and the housing An upper surface exhaust port provided on the upper surface of the body and communicating with the exhaust recovery duct; and a blower for exhausting heat generated by the plurality of electronic devices from the upper surface exhaust port via the exhaust recovery duct. Characterized in that it has a.

  According to the present invention, it is possible to suppress the arrangement space while maintaining the cooling efficiency.

It is a perspective view which shows an example of the external appearance of the electronic device rack by 1st Embodiment. It is a side view of the electronic device rack shown in FIG. It is sectional drawing which shows an example of the cross section in the horizontal direction of the electronic device rack shown to FIG.1 and FIG.2. It is sectional drawing which shows an example of the cross section in the orthogonal | vertical direction of the electronic device rack shown to FIG.1 and FIG.2. It is the fragmentary sectional view which expanded the upper part of the electronic device rack shown in FIG. It is a perspective view which shows an example of the aspect by which exhaust_gas | exhaustion is performed from the upper part of a some electronic device rack. It is sectional drawing which shows an example of a mode that the some electronic device rack was arrange | positioned at equal intervals in the horizontal direction. It is a perspective view which shows the structural example of the electronic device rack by 2nd Embodiment. It is a side view which shows the structural example of the electronic device rack by 2nd Embodiment. It is sectional drawing which shows the structural example of the electronic device rack by 2nd Embodiment. It is a perspective view which shows the structural example of the electronic device rack by 3rd Embodiment. It is a side view which shows the structural example of the electronic device rack by 3rd Embodiment. It is sectional drawing which shows the structural example of the electronic device rack by 3rd Embodiment. It is sectional drawing which shows the structural example of the electronic device rack by 4th Embodiment. It is sectional drawing which shows the structural example of the electronic device rack by 4th Embodiment. It is sectional drawing which shows the structural example of the electronic device rack by 5th Embodiment.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

(1) Configuration of Electronic Equipment Rack According to First Embodiment FIG. 1 is a perspective view showing an example of an appearance of an electronic equipment rack 100 that constitutes a part of an electronic device according to the first embodiment. 2 is a side view showing an example of an appearance when the electronic equipment rack 100 shown in FIG. 1 is viewed from the side.

  As shown in FIG. 1, in the electronic equipment rack 100, for example, a plurality of electronic boards as an example of the electronic equipment 2 can be inserted into and removed from the side face of the housing 19 having four side faces (hereinafter also referred to as “side faces”). It has a configuration. Needless to say, the electronic device 2 may be not only an electronic substrate but also other electronic devices. The housing 19 can insert a large number of electronic devices 2 from the side surface so as to overlap each other at regular intervals, and can accommodate the large number of electronic devices 2.

  In the housing 19, the common function unit 5 as four support columns extends in the vertical direction from the corner of the power supply unit 4 constituting the bottom of the rectangle. A plurality of common function portions 5 extending from a plurality of adjacent corner portions support the side portions described above. Further, the common function unit 5 supplies electric power to each electronic device 2 accommodated while supplying electric power to the cooling unit 3 constituting the upper portion of the housing 19. The cooling unit 3 cools these electronic devices 2 by circulating cooling air with a fan (not shown) inside a housing 19 that houses a large number of electronic devices 2. At the same time, the cooling unit 3 discharges the heat generated by the electronic device 2 from the upper exhaust port 3A of the electronic device rack 100 as the exhaust cooling air 7 or recovers the heat from the exhaust cooling air 7 and reuses it. It also has a function to regenerate.

  FIGS. 3A and 3B are cross-sectional views showing an example of a cross section in the horizontal direction of the electronic equipment rack 100 shown in FIGS. 1 and 2, respectively. The cross-sectional configuration example shown in FIG. 3 is a top view when the electronic equipment rack 100 shown in FIGS. 1 and 2 is cut along a plane perpendicular to the ground plane. FIG. 3A shows a state in which the electronic device 2 has been attached to the housing 19, and FIG. 3B shows a state in which the electronic device 2 has been removed from the housing 19.

  As described above, the common function units 5 are provided at the four corners of the housing 19 and have a rectangular cylindrical shape. However, in FIGS. 3A and 3B, the common functional units 5 have a cross-sectional configuration. It is almost rectangular. Each common function unit 5 is provided with a large number of connectors 5A in the vertical direction along two side surfaces facing the inside of the housing 19 of the outer peripheral surface.

  As shown in FIG. 3B, a plurality of connectors 5 </ b> A are provided at the four corners of the housing 19 so as to support both side ends of the electronic device 2. When the electronic device 2 is inserted into the casing 19 as shown in FIG. 3A, the electronic device 2 is electrically connected between the electrodes formed on both side ends thereof and the electrodes of the connector 5A. It has a configuration.

  As described above, an exhaust recovery duct 8 through which cooling air, which will be described later, passes, is configured at the center of the casing 19 by the tips of the plurality of electronic devices 2 each mounted on the casing 19. With such a configuration, at the tip of the plurality of electronic devices 2, one connector on the electronic device 2 side and the other connector on the housing 19 side to which the one connector is attached do not have to exist. Therefore, the ventilation resistance of the cooling air, which will be described later, becomes smaller, and more cooling air can easily pass.

  Next, the ventilation resistance and the securing of the cooling air volume of each electronic device 2 by the structure of the electronic device rack 100 according to the present embodiment will be described. 4 is a cross-sectional view showing an example of a vertical cross section of the electronic equipment rack shown in FIGS. 1 and 2, and FIG. 5 is an enlarged partial cross-sectional view of the upper part of the electronic equipment rack shown in FIG.

  As shown in FIG. 4, the cooling air 6 flows in from the side surface portion of the housing 19 in which a large number of electronic devices 2 are mounted, passes through the vicinity of the electronic component 9 mounted on the electronic device 2, and then the exhaust collection duct 8. To leak. The exhaust gas flowing into the exhaust recovery duct 8 in this way passes through the exhaust recovery duct 8 by the fan 3C of the cooling unit 3 and is carried to the upper portion of the housing 19 to be exhausted cooling air 7 from the upper surface exhaust port 3A. It is discharged outside.

  In such a structure, depending on the mounting position of the electronic device 2 mounted on the electronic device rack 100, the route from the inlet cooling air 6 to the exhaust cooling air 7 excluding the ventilation resistance of the electronic device 2 itself is used. Since the ventilation resistances are different, when all the electronic devices 2 mounted on the housing 19 are the same and have the same ventilation resistance, at first glance, all the electronic devices 2 mounted on the housing 19 It may also seem that it is difficult to supply a uniform amount of cooling air. However, even in the case where there may be a problem related to the supply of the cooling air amount, for example, if the ventilation resistance adjusting plate 62 as shown in FIG. 2 can be configured to obtain the required cooling air volume.

  FIG. 6 shows an example of a configuration in which a plurality of electronic device racks 100 according to the present embodiment are installed and the exhaust from each electronic device rack 100 is collected via the exhaust transport pipe 37. As shown in the figure, an exhaust transport pipe 37 is coupled to the upper part of each electronic equipment rack 100. When such an exhaust transport pipe 37 is connected to each electronic equipment rack 100, the exhaust in the casing 19 of each electronic equipment rack 100 can be efficiently collected and utilized.

  By the way, in the electronic equipment rack 100 according to the present embodiment, the exhaust of all the electronic equipment 2 inserted and mounted in the housing 19 is collected in the exhaust collection duct 8 inside the electronic equipment rack 100. Since it is the structure discharged | emitted upwards, it becomes possible to provide the exhaust port 3A in the exhaust port 3A, and to transport the exhaust gas without being scattered in the atmosphere. Thereby, the effect of suppressing the use of the heat energy in the exhaust and the air conditioning energy in the installation environment of the electronic equipment rack 100 can be exhibited.

  FIG. 7 is a cross-sectional view showing an arrangement example when a plurality of electronic equipment racks 100 according to the present embodiment are installed. According to the structure of the electronic device rack 100 according to the present embodiment, all of the side surfaces (corresponding to the side surface portion) become the air inlet surface of the electronic device 2 to be mounted. In consideration of the influence of the included heat, there is no need to secure an extra large space 60, 61 between adjacent electronic equipment racks 100.

  Accordingly, the spaces 60 and 61 between the electronic device racks 100 only need to have a necessary space for maintenance or the like. According to the above configuration, the installation environment of the apparatus including the electronic device rack 100 It is possible to optimize the placement efficiency in the.

(2) Second Embodiment FIG. 8 is a perspective view showing a configuration example of an electronic device rack according to the second embodiment, and FIG. 9 is a configuration example of an electronic device rack according to the second embodiment. FIG. 10 is a cross-sectional view showing a configuration example of an electronic equipment rack according to the second embodiment. 8 to 10 correspond to FIGS. 1 to 3 in the first embodiment, respectively.

  In the electronic device rack 100 according to the first embodiment described above, the casing 19 has a quadrangular prism shape and has four side surfaces (side portions), whereas the electronic device rack 100A according to the second embodiment. As shown in FIGS. 8 and 10, the housing 19A has a triangular prism shape and has three side surfaces (side surfaces).

  In the second embodiment, descriptions of configurations and functions substantially the same as those of the first embodiment are omitted. Note that in the second embodiment, members having substantially the same functions as those in the first embodiment are mainly illustrated using the reference numerals with “A” after each reference numeral. The common function unit 15 corresponds to the common function unit 5 according to the first embodiment, but its cross section is different from that of the first embodiment described above.

  According to such a configuration, an effect similar to that of the above-described first embodiment can be exhibited.

(3) Third Embodiment FIG. 11 is a perspective view showing a configuration example of an electronic device rack according to the third embodiment, and FIG. 12 is a configuration example of an electronic device rack according to the third embodiment. FIG. 13 is a cross-sectional view showing a configuration example of an electronic equipment rack according to the third embodiment. 11 to 13 correspond to FIGS. 1 to 3 in the first embodiment, respectively.

  In the electronic equipment rack 100 according to the first embodiment described above, the casing 19 has a quadrangular prism shape, has four side surfaces (side portions), and the electronic equipment rack according to the first embodiment described above. 100, the housing 19 has a triangular prism shape and has three side surfaces (side portions), whereas the electronic equipment rack 100B according to the third embodiment has a housing 19A as shown in FIGS. Has a triangular prism shape and has three side surfaces (side portions).

  In the third embodiment, descriptions of configurations and functions substantially similar to those of the first or second embodiment are omitted. Note that in the third embodiment, members having substantially the same functions as those in the first embodiment are mainly illustrated using the reference numerals with “B” after each reference numeral. The common function unit 105 corresponds to the common function unit 5 according to the first embodiment, but its cross-section is different from the above-described embodiments.

  According to such a configuration, an effect similar to that of the above-described first embodiment can be exhibited.

(4) Fourth Embodiment FIGS. 14 and 15 are cross-sectional views showing a configuration example of an electronic equipment rack 100C according to a fourth embodiment. FIG. 14 shows a state where the electronic device 2 </ b> C is attached to the housing 19, while FIG. 15 shows a state where the electronic device 2 </ b> C is removed from the housing 19. 14 and 15 correspond to FIGS. 3A and 3B in the first embodiment, respectively, although each electronic component on the electronic board is omitted.

(4-1) Basic Structure In the configuration examples shown in FIGS. 14 and 15, a specific configuration is shown for one electronic device 2C, while a specific configuration is omitted for the remaining three electronic devices 2C. ing. The fourth embodiment is characterized by the use of the common function unit 5. The common function unit 5 shares, for example, the functions of any one of power feeding, cooling, and signal transmission, or any combination thereof in order to share the electronic devices 2C accommodated in the electronic device rack 100C. It is used as a storage area for parts that have functions and perform each function.

  Specifically, the common function unit 5 exhibits a function of any one of the following three functions or a combination thereof.

(4-1-1) First function (power feeding member accommodation function)
As a first function, a plurality of electronic devices 2C mounted on the electronic device rack 100C are metal rods (hereinafter referred to as “power lines”) as buses that receive electrical supply from power supplies installed inside and outside the casing 19. ) Can be exemplified.

  Specifically, the power supply line is provided, for example, along the longitudinal direction of the common function unit 5 and is electrically connected to the power line at the position of the power line on which each electronic device 2C is mounted. Each common power feeding section 41 is provided. The electronic device 2 </ b> C is provided with a common power supply connector 42 that is a connector that can be inserted into and removed from the common power supply 41.

  According to such a configuration, power can be collectively supplied to the plurality of electronic devices 2C mounted on the electronic device rack 100C, so that maintenance work can be facilitated.

(4-1-2) Second function (heat transport member accommodation function)
As a second function, when a plurality of electronic devices 2C mounted on the electronic device rack 100C have a large amount of generated heat, heat for directly transporting the generated heat to the cooling unit 3 or the like above the rack by heat conduction. The function of accommodating the transport pipe can be exemplified.

  Specifically, as such a heat transport pipe, for example, the common function heat transport section 33 can be exemplified. On the other hand, the electronic device 2C is provided with an electronic device heat receiving portion 31 and a common heat transport portion connecting portion 32. The electronic device heat receiving portion 31 is connected to each electronic component 9 mounted on the electronic device 2 </ b> C, receives the heat generated by each electronic component 9 and transmits it to the common heat transport portion connecting portion 32.

  The common heat transport part connection part 32 is, for example, a heat pipe, and is connected to the common function heat transport part 33 so that it can be inserted and removed when the electronic device 2C is removed (see FIG. 15) and attached (see FIG. 14). Is done. As described above, the common heat transport part connection part 32 transfers the heat of each electronic component 9 transmitted to itself (the common heat transport part connection part 32) to the common function heat transport part 33 inside the common function part 5. The heat is transmitted and the heat is discharged to the outside of the housing 19.

  If it does in this way, the heat of each electronic component 9 on electronic equipment 2C can be stopped inside common function part 5, and the cooling efficiency of electronic equipment 2C can be improved.

(4-1-3) Third function (transmission path accommodation function)
As the third function, a function of accommodating a transmission path such as light and electricity that enables control of a plurality of electronic devices 2C mounted on the electronic device rack 100C and exchange of signals between the electronic devices 2C is exemplified. be able to.

  Specifically, as such a transmission path, the common transmission unit 51 illustrated inside the common function unit 5 on the left side in FIGS. 14 and 15 can be exemplified. On the other hand, the electronic device 2 </ b> C is provided with a common transmission unit connection unit 52 connected to each electronic component 9, and the common transmission unit connection unit 52 is a common transmission unit 51 inside the common function unit 5. Can be connected to.

  As described above, when the electronic device 2C is mounted on the housing 19 and the common transmission unit connection unit 52 on the electronic device 2C side is connected to the common transmission unit 51 on the housing 19 side, the electronic device 2C is connected to the common transmission unit. Signals can be exchanged with the other electronic device 2C and the like of the electronic device rack 100 via 51.

  In this way, it is not necessary to route wiring necessary for signal exchange between the plurality of electronic devices 2C mounted on the electronic device rack 100C, and the common transmission unit 51 can be accommodated inside the common function unit 5. become. For this reason, since the common function part 5 is exposed to the side surface in the housing | casing 19, not only the maintenance operation | work with respect to the accommodation of the common function part 5 becomes easy but a maintenance cost can be suppressed. Moreover, since the number of parts used can be reduced by using the common function part 5, energy consumption can be suppressed.

  According to such a configuration, the same effects as those of the first embodiment described above can be exhibited, and the effects of the above functions can be exhibited.

(5) Fifth Embodiment FIG. 16 is a cross-sectional view showing a configuration example of an electronic equipment rack 100D according to a fifth embodiment. The illustrated example shows a state in which the electronic device 2 </ b> C is attached to the housing 19. FIG. 16 corresponds to FIG. 3A in the first embodiment although each electronic component on the electronic substrate is omitted. In the configuration example shown in FIG. 16, a specific configuration is shown for one electronic device 2C, while a specific configuration is omitted for the remaining three electronic devices 2C.

  In the fifth embodiment, in the second function in the fourth embodiment, the common function heat transport section 33 as an example of the heat transport pipe described above is exhausted instead of the inside of the common function section 5. It is provided in the recovery duct 8. Accordingly, in the electronic device 2 </ b> C, for example, the common heat transport part connection part 32, which is a heat pipe, extends toward the inside of the housing 19 and is connected to the common function heat transport part 33.

  With such a configuration, the common function heat transport section 33 is provided in the exhaust recovery duct 8 originally provided for waste heat of the heat generated by the electronic device 2C, and thus transmitted from the electronic device 2C. While the heat is transmitted through the common function heat transport section 33, the heat is cooled, and the cooling efficiency can be further improved.

(6) Other Embodiments The above embodiment is an example for explaining the present invention, and is not intended to limit the present invention only to these embodiments. The present invention can be implemented in various forms without departing from the spirit of the present invention. For example, in the above-described embodiment, the electronic substrate has been illustrated and described as an example of the electronic device mounted on the electronic device rack, but the present invention is not particularly limited to this.

  The present invention can be widely applied to an electronic equipment rack on which a plurality of electronic devices are mounted and an apparatus including the electronic equipment rack.

  2, 2B, 2C ... Electronic board (an example of electronic equipment), 8, 8A, 8B ... Exhaust recovery duct, 19 ... Housing, 31 ... Electronic equipment heat receiving part, 32 ... Common heat transport part connection Part, 33 ... common function heat transport part, 100, 100A, 100B, 100C, 100D ... electronic equipment rack.

Claims (4)

A housing,
A plurality of support columns for supporting side surfaces of the housing;
A pair of support portions that are provided so as to be arranged along the plurality of support columns, and that respectively hold both side end portions of the plurality of electronic devices inserted from the side surface portions,
Heat generated by the plurality of electronic devices, which are cavities formed in the housing along the plurality of support columns, by tip ends of the plurality of electronic devices inserted from the side surfaces facing each other. An exhaust recovery duct passing through,
An upper surface exhaust port provided on the upper surface of the housing and leading to the exhaust recovery duct;
A blower that exhausts heat generated by the plurality of electronic devices from the upper surface exhaust port via the exhaust recovery duct;
Have
The electronic device includes an electronic board on which an electronic component that generates heat is mounted,
The pair of support portions, Ri connector der electrically connected to electrical contacts formed on a side end portion of the electronic board,
The housing includes a heat transport part having thermal conductivity,
The electronic device includes a connection part connectable to the heat transport part,
The plurality of struts are cylindrical members,
An electronic equipment rack , wherein a housing space in which the plurality of electronic equipments can be shared is formed inside the cylindrical member . The heat transport part is
The electronic equipment rack according to claim 1 , wherein the electronic equipment rack is provided in the accommodation space. In an apparatus having an electronic equipment rack capable of mounting a plurality of electronic equipment,
The electronic equipment rack is
A housing,
A plurality of support columns for supporting side surfaces of the housing;
A pair of support portions that are provided so as to be arranged along the plurality of support columns, and that respectively hold both side end portions of the plurality of electronic devices inserted from the side surface portions,
Heat generated by the plurality of electronic devices, which are cavities formed inside the housing along the plurality of support columns by the front end portions of the plurality of electronic devices inserted from the side portions facing each other. An exhaust recovery duct passing through,
An upper surface exhaust port provided on the upper surface of the housing and leading to the exhaust recovery duct;
A blower that discharges heat generated by the plurality of electronic devices from the upper surface exhaust port via the exhaust recovery duct;
Have
The electronic device includes an electronic board on which an electronic component that generates heat is mounted,
The pair of support portions, Ri connector der electrically connected to electrical contacts formed on a side end portion of the electronic board,
The housing includes a heat transport part having thermal conductivity,
The electronic device includes a connection part connectable to the heat transport part,
The plurality of support columns are cylindrical members,
An apparatus comprising an electronic equipment rack , wherein an accommodation space in which the plurality of electronic equipments can be shared is formed inside the cylindrical member . The heat transport part is
The apparatus which comprises the electronic equipment rack of Claim 3 provided in the said storage space.

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