JP6617391B2 - Film substrate and suture connection structure of film substrate - Google Patents

Description

  The present invention relates to a stitch connection structure between a film substrate having a conductive yarn that is connected in a conductive manner across a conductive portion at a distant position of a base film, and the film substrate.

  Conventional film substrates (flexible printed circuit boards, FPCs) are based on a base film and have a conductive circuit formed on the surface with conductive metal foil or coating film. For this reason, it is widely used in electronic devices.

However, the base film has a characteristic that even if it is bent, the base film is easily returned to the original state due to the repulsive force of the base film and spreads into a flat surface. Moreover, it is difficult to bend in the transverse direction with respect to the plane of the base film, and when the bending is repeated, the base film and the conductive circuit may be deteriorated and broken. Furthermore, it was difficult to stretch or shrink the base film in the plane direction of the film.
On the other hand, these problems are derived from the base film, and a technique using a rubber material that can be expanded and contracted instead of the film is also known. For example, Japanese Patent Application Laid-Open No. 2007-173226 (Patent Document 1) discloses a configuration in which conductive parts in which conductive particles are in contact with each other are provided on a stretchable base material mainly composed of rubber so that the whole can be stretched. It is said.

JP 2007-173226 A

However, with the technique described in the above-mentioned Japanese Patent Application Laid-Open No. 2007-173226 (Patent Document 1), it is difficult to form fine conductive wires with conductive particles, and the advantages of the film substrate cannot be used as they are. .
Therefore, the present invention has been made in view of the above problems, and enables conductive connection between conductive portions that cannot be achieved with a general film substrate, while taking advantage of the conventional film substrate as it is, and the base film itself. The present invention provides a technique that enables even complicated arrangements.

The film substrate of the present invention that achieves the above object is configured as follows.
That is, for a film substrate having a conductive property circuit substrate film, the conductive circuit, have a conductive yarn conductively connected spanned a conductive portion which is in a remote location of the base film, passed over the conductive portion An insulating film is provided on the surface of the conductive yarn after being processed .
For a film substrate having a conductive circuit on a base film, the conductive circuit has conductive yarns that are connected and connected across a conductive portion at a position away from the base film. Three-dimensional conductive connection can be made, the base film itself can be fixed in a bent or twisted state, and conductive connection in various directions is possible. Further, a plurality of film substrates can be connected to form a large area film substrate.

The conductive yarn may have a fibrous material as a core material and a conductive coating layer that covers the fibrous material.
Since the conductive yarn has a fibrous material as a core and a conductive coating layer that covers the fibrous material, it is flexible, can be transformed into a desired shape, and has conductivity. can do.

The conducting portion can be a printed layer made of a conductive paint.
Since the conductive part is a printed layer made of a conductive paint, a complicated conductive part can be easily formed on the base film.

The conductive yarn may have a stitched portion that connects the conductive portions of the conductive circuit.
Since the conductive yarn has a stitched portion for connecting the conductive portions of the conductive circuit, the conductive portions can be connected to each other and the base film can be connected to each other at the same time. In addition, since the conductive yarn is flexible, the conductive portions can be appropriately deformed.

Moreover, the 1st film substrate which has a conductive circuit in a base film, the 2nd film substrate which has a conductive circuit in a base film, the conductive circuit of a 1st film substrate, and the conductivity of a 2nd film substrate A conductive yarn that is connected to and electrically connected to the conductive circuit, and the conductive material after the conductive circuit of the first film substrate and the conductive circuit of the second film substrate are extended. Provided is a suture connection structure for a film substrate in which an insulating film is provided on the surface of a yarn .
First film substrate having conductive circuit on base film, second film substrate having conductive circuit on base film, conductive circuit of first film substrate, and conductive circuit of second film substrate Since the conductive yarns are connected to each other and electrically connected to each other, a raw material film substrate having a size that cannot be realized with one raw material film substrate can be obtained. That is, it can be set as the film substrate of the magnitude | size which combined the 1st film substrate and the 2nd film substrate.

It can be set as the film board | substrate which the site | part over which it cross | intersects with the conductive thread of a base film cross | intersects three-dimensionally.
Since the part which cross | intersects with the electroconductive thread | yarn of a base film shall cross | intersect three-dimensionally, a planar film substrate can be used three-dimensionally.
Moreover, it can be set as the suture connection structure of the film board | substrate which a 1st film board | substrate and a 2nd film board | substrate cross | intersect in three dimensions.
Since the first film substrate and the second film substrate have a stitched connection structure for a film substrate that three-dimensionally intersects, a planar film substrate can be used three-dimensionally.

It can be assumed that the conductive portions at remote positions on the base film are spanned by a conductive thread through a spacer.
If it is assumed that the conductive thread is stretched between the conductive parts at a distance on the base film through a spacer, the conductive thread between the conductive parts can be fixed by the spacer. The position of the other conduction part with respect to the conduction part can be fixed.

It can be assumed that the conductive portions at remote locations on the base film are spanned by conductive yarns through a space.
If it is assumed that a conductive thread is passed through a space between conductive parts at remote positions on the base film, the conductive parts at remote positions on the base film are short-circuited away from the base film. be able to. Thereby, a three-dimensional conductive circuit separated from the base film can be formed.

It can be set as the stitching connection structure of the film board | substrate spanned with the electrically conductive thread through the spacer between the 1st film board | substrate and the 2nd film board | substrate. Since the conductive film is spanned between the first film substrate and the second film substrate via a spacer, one base film (first base film) and the other base film (first 2 base film) can be fixed, and the position of the other conductive portion relative to one conductive portion can be fixed.
Moreover, it can be set as the suture connection structure of the film board | substrate spanned with the electrically conductive thread through the space between the 1st film board | substrate and the 2nd film board | substrate. Since the conductive thread is spanned between the conductive parts at a distant position on the base film through a space, the conductive base can be flexibly moved so that the other base film can be freely moved with respect to one base film. Can move. Therefore, the distance of the other film substrate (second film substrate) to one film substrate (first film substrate) can be changed. In addition, the positional relationship between the two can be freely changed according to the space in the electronic device.

According to the film substrate or the stitched connection structure of the film substrate of the present invention, the conductive connection between the conductive portions can be three-dimensionally performed by the flexibility of the conductive yarn. Moreover, since the distance to the other conductive portion can be easily changed with respect to the one conductive portion, and the direction thereof can be easily changed, the degree of freedom in arranging the film substrate can be increased.
Furthermore, according to the film substrate or the stitched connection structure of the film substrate of the present invention, it is possible to obtain a large-area film substrate that is difficult to manufacture.

The film substrate of 1st Embodiment is represented, A part (A) is a top view, A part (B) is SA-SA sectional view taken on the line (A), A part (C) is a bottom view. It is a schematic cross section explaining a film substrate of a modification of the first embodiment. The film substrate of 2nd Embodiment is represented, A part (A) is a front view, A part (B) is a SB-SB sectional view taken on the line (A). It is a model perspective view explaining the film substrate of the modification of 2nd Embodiment. The film substrate of 3rd Embodiment is represented, A part (A) is a top view, A part (B) is SC-SC sectional view taken on the line (A). It is a model perspective view of the film substrate of the modification of 3rd Embodiment. The film substrate of 4th Embodiment is represented, A part (A) is a top view, A part (B) is SD-SD sectional view taken on the line (A). The film substrate of the modification 1 of 4th Embodiment is represented, A part (A) is a top view, A part (B) is the sectional view on the SE-SE line of part (A). The film substrate of the modification 2 of 4th Embodiment is represented, A part (A) is a top view, A part (B) is the SF-SF sectional view taken on the line (A). The film substrate of the modification 3 of 4th Embodiment is represented, A part (A) is a top view, A part (B) is SG-SG sectional drawing of a part (A), A part (C) is a part. It is SH-SH sectional view taken on the line of (A). The film substrate of the modification 4 of 4th Embodiment is represented, A part (A) is a top view, A part (B) is a SI-SI sectional view taken on a part (A), A part (C) is a part. It is SJ-SJ sectional view taken on the line of (A). The film substrate of the modification 5 of 4th Embodiment is represented, A part (A) is a top view, A part (B) is a SK-SK sectional view taken on a part (A), A part (C) is a bottom view. It is.

  The base film of the present invention will be described in more detail according to the embodiment. In each embodiment, the duplicate description of the same members, materials, manufacturing methods, effects, etc. is omitted.

First Embodiment [FIG. 1] :
A film substrate 10 described as the first embodiment is shown in FIG. 1A is a plan view of the film substrate 10, FIG. 1B is a sectional view thereof, and FIG. 1C is a bottom view thereof.
The film substrate 10 includes a first film substrate A having a conductive wire 13a (13) as a conductive portion on a base film 12a (12), and a conductive wire 13b (as a conductive portion on the base film 12b (12) separately. 13) having the second film substrate B having the first film substrate A and the second film substrate A, the conductive film 15 is passed over the conductive wire 13a of the first film substrate A and the conductive film 13b of the second film substrate B. The film substrate B is connected and a conductive circuit is formed over both film substrates A and B.

That is, as shown in FIG. 1, the conductive yarn 15 of the film substrate 10 covers a partial surface of one of the conductive wires 13a formed on the surface of the first film substrate A, and the inside of the base film 12a. To the back surface, and from the back surface of the other second film substrate B to the surface through the inside of the base film 12b, covering a partial surface of one of the conductive wires 13b. In this way, one conductive wire 13b of the second film substrate B to be connected to one conductive wire 13a of the first film substrate A is conductively connected by the conductive yarn 15, and similarly the first film substrate. Another conductive wire 13 a provided on A is also conductively connected by another conductive wire 15 to another conductive wire 13 b of the second film substrate B to be connected.
In FIG. 1, the conductive yarn 15 is expressed in black. However, a number of thin conductive yarns 15 are included in the conductive yarn 15 and are represented as a bundle of conductive yarns 15. The same applies to other drawings.

  The base film 12 can be a resin film used as a base for a known flexible printed circuit board. Examples thereof include resin films such as polyamide, polyethylene terephthalate, polycarbonate, and polyethylene. Furthermore, synthetic rubber and thermoplastic elastomer can be thinly molded and used as a base film. Examples of the synthetic rubber include known rubbers such as urethane rubber, silicone rubber, and fluorine rubber. Examples of the thermoplastic elastomer include urethane-based, olefin-based, styrene-based, polyester-based, silicone-based, and fluorine-based thermoplastic elastomers.

As will be described later, when a sewing hole is previously formed in the base film 12, a rigid material can be used, and for example, glass epoxy is used.
Although the thickness of the base film 12 can be set to an appropriate thickness depending on the application, in order to sew the base films 12 and 12 together with the conductive yarn 15, it is a preferable aspect that the thickness is 2 mm or less.

  Conductive portions such as the conductive wires 13 provided on the surface of the base film 12 can be formed of a metal foil, a conductive coating film, a conductive polymer, or the like. In the example shown in the present embodiment, a conductive circuit is formed by patterning the linear conductive wire 13, but the conductive portion is not limited to such a conductive wire 13 but is a planar shape that is used in a touch sensor or the like. It may be a conductive film or the like spread.

  The first film substrate A and the second film substrate B are film substrates having a conductive circuit composed of the conductive wires 13 on the surface of the base film 12 as described above, and are known film substrates or commercially available film substrates. May be. That is, the first film substrate A and the second film substrate B may be those that can already be used as film substrates.

  The conductive yarn 15 is a fibrous material having flexibility and conductivity on the surface. Examples of the fibrous material include those obtained by conductively coating the surfaces of resin fibers and glass fibers that are non-conductive fibers, or those made of conductive materials such as carbon fibers and metal fibers. A fibrous material having a surface coated with a conductive material such as a metal based on resin fibers having high durability against repeated bending is preferable.

As the resin fiber, a monofilament or multifilament polymer fiber can be used. As the polymer fiber, synthetic fibers such as polyamide, polyester, acrylic, polyolefin, polyurethane and the like, and natural fibers such as silk, wool, cotton and hemp can be used.
The conductive coating on the surface of the non-conductive fiber is preferably one in which a conductive coating layer is formed from a metal or a carbon coating film. In particular, it is preferable to coat with a highly conductive metal such as silver or copper.

  The thickness of the conductive yarn 15 can be about 10 to 5000 μm, but can be appropriately selected and used. Moreover, even if it is the electroconductive yarn of the same thickness, it can also be made into the twist thread | yarn of several finer electroconductive yarn besides using the electroconductive thread of a single thickness.

The connection between the first film substrate A and the second film substrate B using the conductive yarn 15 is preferably performed by stitching (sewing) with the conductive yarn 15. This is because the film substrates A and B can be connected to each other at a desired angle and strength by sewing with the conductive thread 15. Moreover, it is because the conductive yarn 15 itself can be used for stitching purposes.
Sewing can be performed by machine work using a sewing machine or by hand-sewing. In addition, a sewing hole may be prepared in advance on the film substrates A and B to be sewn, or may be sewn while making a hole with a needle. Various sewing methods such as side-by-side stitching, reverse stitching, overlock stitching, festival stitching, and zigzag stitching can be used as the stitching method.
In addition to the stitching, a method of connecting and fixing the conductive wire 13 and the conductive yarn 15 on the film substrate 12 with a conductive adhesive or an adhesive tape may be employed.

  As described above, it is preferable to provide a sewing hole in advance in the base film 12 or the conductive wire 13. This is because by making a sewing hole in advance, it is easy to pass the base film 12 and the conductive wire 13 even if the strength of the conductive thread 15 is weak. Further, it is preferable in that the number of conductive threads 15 can be easily sewn. By providing through-hole plating that is electrically connected to the conductive wire 13 in such a sewing hole, the conductive connection between the conductive yarn 15 and the conductive wire 13 can be made more reliable.

The ends of the conductive threads 15 after sewing are processed so as not to fray. It is also preferable to form a knot or to heat and melt it and roll it thicker than the sewing hole to fix it to the base film 12.
In addition, after conducting wires 13 a and 13 b are conductively connected with the conductive yarn 15, it is preferable to form an insulating film on the surface of the conductive yarn 15. This is to prevent the conductive yarns 15 from coming into contact with each other and short-circuiting, and to increase the durability of the conductive yarns 15. The insulating film can be formed by coating with an insulating tape or by applying and curing an insulating coating film.
Moreover, an insulating coating film can be formed so as to cover the conductive wires 13a and 13b and the conductive yarn 15 to form a protective layer.

  According to the film substrate 10, the first film substrate A and the second film substrate B are electrically connected to the first film substrate A by the conductive yarn 15. It is possible to twist, tilt, or shorten the distance of the second film substrate B. Therefore, the first film substrate A and the second film substrate B can be three-dimensionally arranged in the electronic device.

  In order to maintain the distance between the first film substrate A and the second film substrate B, it is also preferable to interpose a spacer between the first film substrate A and the second film substrate B. It is. As the spacer, a resin such as a film or a block, rubber, foam, cloth or the like can be used.

Modified example of the first embodiment [FIG. 2] :
A film substrate 10a described as a modification of the first embodiment is shown in FIG.
The film substrate 10a differs from the film substrate 10 in that each end face is abutted and connected to each other without providing a space between the first film substrate A and the second film substrate B. Yes.
The 1st film board | substrate A which has the conducting wire 13a (13) which is a conduction | electrical_connection part on the base film 12a (12), and the conducting wire 13b (13) which is a conduction | electrical_connection part on the base film 12b (12) separately from it. The first film substrates A and B are connected to each other by the conductive yarn 15 that spans the conductive wires 13a and 13b of the respective film substrates A and B, thereby forming a conductive circuit. Is the same as the film substrate 10.

  As shown in FIG. 2, the conductive yarn 15 of the film substrate 10a covers the conductive wire 13a formed on the surface of the first film substrate A, goes out to the back surface through the inside of the base film 12a, and the other second The film substrate B enters from the back surface and exits to the surface through the inside of the base film 12b, covers the surface of the conductive wire 13b, and communicates with the conductive wire 13a. In this way, one conductive wire 13b of the second film substrate B to be connected to one conductive wire 13a of the first film substrate A is conductively connected by the conductive yarn 15, and similarly the first film substrate. Another conductive wire 13 a provided on A is also conductively connected by another conductive wire 15 to another conductive wire 13 b of the second film substrate B to be connected.

  According to the film substrate 10a, the conducting wires 13a and 13b of the first film substrate A and the second film substrate B are electrically connected by the conductive yarn 15, and the first film substrate A and the second film substrate B are connected. The end faces of each other are connected by stitching. Accordingly, the first film substrate A and the second film substrate B can be connected so as to form a ring. In addition, the conductive portion of the first film substrate A and the conductive portion of the second film substrate B can be conductively connected, and the base film 12a and the base film 12b can be simultaneously connected.

Second Embodiment [FIG. 3] :
A film substrate 20 described as the second embodiment is shown in FIG. 3A is a front view of the film substrate 20 and FIG. 3B is a cross-sectional view thereof.
The film substrate 20 is different from the film substrate 10 shown in the previous embodiment in that the first film substrate A and the second film substrate B are vertically crossed and connected.
The 1st film board | substrate A which has the conducting wire 13a (13) which is a conduction | electrical_connection part on the base film 12a (12), and the conducting wire 13b (13) which is a conduction | electrical_connection part on the base film 12b (12) separately from it. The first film substrates A and B are connected to each other by the conductive yarn 15 that spans the conductive wires 13a and 13b of the respective film substrates A and B, thereby forming a conductive circuit. Is the same as the film substrate 10 of the previous embodiment.

  That is, as shown in FIG. 3, the conductive yarn 15 of the film substrate 20 covers one end surface of the conductive wire 13a formed on the surface of the first film substrate A, and the inside of the base film 12a. To the back surface, and from the surface of the other second film substrate B (the surface on which the conducting wire 13b is not formed) to the back surface through the inside of the base film 12b, and a part of one of the conducting wires 13b It covers the surface, and further passes through the inside of the base film 12b to the surface and communicates with the end surface of the conductive wire 13a. In this way, one conductive wire 13b of the second film substrate B to be connected to one conductive wire 13a of the first film substrate A is conductively connected by the conductive yarn 15, and similarly the first film substrate. Another conductive wire 13 a provided on A is also conductively connected by another conductive wire 15 to another conductive wire 13 b of the second film substrate B to be connected.

  According to the film substrate 20, the conducting wires 13 a and 13 b of the first film substrate A and the second film substrate B are electrically connected by the conductive yarn 15, and the first film substrate A and the second film substrate B are connected. And are connected vertically by stitching. Thereby, the 1st film board | substrate A and the 2nd film board | substrate B can be arrange | positioned crossing in three dimensions in an electronic device.

Modified example of the second embodiment [FIG. 4] :
A film substrate 20a as a modification of the second embodiment is shown in FIG.
The film substrate 20a is the same as the film substrate 20 in that the first film substrate A and the second film substrate B, which are two film substrates, are connected so as to cross three-dimensionally. Another end portion of the film substrate A is different in that it is conductively connected to the second film substrate B.

  In FIG. 4, the conductive portion provided on the first film substrate A and the conductive portion provided on the second film substrate B are not clearly shown, but both the film substrates A and B are electrically connected to both the front and back surfaces. The conductive film 15 may be connected to the base film 12a and the base film 12b at the same time as the conductive film 15 is connected to the conductive part provided on the first film substrate A and the second film substrate B. Conductive connection is established with the conduction part.

  According to the film substrate 20a, since the first film substrate A is connected to the second film substrate B in an arch shape, the arch state of the first film substrate A is stabilized in that state. I can leave.

Third Embodiment [FIG. 5] :
A film substrate 30 described as the third embodiment is shown in FIG. 5A is a plan view of the film substrate 30 and FIG. 5B is a sectional view thereof.
Compared to the film substrate 10 shown in the previous embodiment, the film substrate 30 is bent at about 90 ° at the ends of the first film substrate A and the second film substrate B, and the ends are connected to each other. Is different in that

  The 1st film board | substrate A which has the conducting wire 13a (13) which is a conduction | electrical_connection part on the base film 12a (12), and the conducting wire 13b (13) which is a conduction | electrical_connection part on the base film 12b (12) separately from it. The first film substrates A and B are connected to each other by the conductive yarn 15 that spans the conductive wires 13a and 13b of the respective film substrates A and B, thereby forming a conductive circuit. Is the same as the film substrate 10 of the previous embodiment.

  In the film substrate 10 shown in the previous embodiment, the conducting wire 13a on the base film 12a and the conducting wire 13b on the base film 12b are in positions separated from each other. In the film substrate 30 of the embodiment, since the base films 12a and 12b serve as spacers even when the conductive wire 13a on the base film 12a and the conductive wire 13b on the base film 12b are located at a distance, The first film substrate A and the second film substrate B are fixed without any gap, and both can be fixed.

  As shown in FIG. 5, the conductive yarn 15 of the film substrate 30 covers the surface of one end of the conductive wire 13a formed on the surface of the first film substrate A, and the back surface through the inside of the base film 12a. , Enters from the back surface of the other second film substrate B, exits to the surface through the inside of the base film 12b, covers one end surface of the conductive wire 13b, and further covers the base film 12b. It reaches the back surface through the inside, goes out to the surface through the inside of the first film substrate A, and communicates with the end surface of the conductive wire 13a. In this way, one conductive wire 13b of the second film substrate B to be connected to one conductive wire 13a of the first film substrate A is conductively connected by the conductive yarn 15, and similarly the first film substrate. Another conductive wire 13 a provided on A is also conductively connected by another conductive wire 15 to another conductive wire 13 b of the second film substrate B to be connected.

According to the film substrate 30, the first film substrate A and the second film substrate B are folded at the ends of the base films 12 a and 12 b and stitched together with the conductive yarn 15 in a state where the back surfaces thereof are butted together. A long film substrate in which the first film substrate A and the second film substrate B are connected to each other can be obtained.
In addition, in the film board | substrate 30 shown in FIG. 5, it is bent and connected in the edge part of each film board | substrate A and B, but only in the horizontal direction of FIG.5 (B) by bending and connecting in the center part. It can be set as a three-dimensional film substrate which continues for a long time in the vertical direction.

Modified example of the third embodiment [FIG. 6] :
A film substrate 30a described as a modification of the third embodiment is shown in FIG.
Compared with the film substrate 30 shown in the previous embodiment, the film substrate 30 a is different from connecting two raw film substrates, and the ends of one film substrate A are stitched together with the conductive thread 15. Is different. Therefore, in the film board | substrate 30a, the edge part and edge part of the conduction | electrical_connection part formed on the base film 12a (12) are conduct-connected.

Further, the film substrate 30a is different from the film substrate 30 in that the conductive yarn 15 is stitched by stitch stitching which is exposed and stitched to the edge of the base film 12a.
In the film substrate 30a, one base material 12a can be fixed in an annular shape.

Fourth Embodiment [FIG. 7] :
A film substrate 40 described as the fourth embodiment is shown in FIG. 7 is a front view of the film substrate 40, and FIG. 7B is a cross-sectional view thereof.
The film substrate 40 is formed by stacking and connecting a first film substrate A and a second film substrate B, which are two film substrates, in the thickness direction. More specifically, the surface opposite to the surface on which the conducting wire 13b of the second film substrate B is provided is connected to the surface on the opposite side to the surface on which the conducting wire 13a of the first film substrate A is provided. Yes. The structure of the 1st film board | substrate A and the 2nd film board | substrate B is the same as that of other embodiment.

  As shown in FIG. 7, the conductive yarn 15 of the film substrate 40 covers a partial surface of one of the conductive wires 13a formed on the surface of the first film substrate A, and the back surface through the inside of the base film 12a. And enters the back surface of the other second film substrate B and connects to the conductive wire 13b through the inside thereof. From there, it reaches the back surface through the inside of the base film 12b, and is stitched so as to come out from the back surface of the first film substrate A that comes into contact through the inside of the base film 12a to the surface of the conductor 13a. ing.

  In this way, one conductive wire 13b of the second film substrate B to be connected to one conductive wire 13a of the first film substrate A is conductively connected by the conductive yarn 15, and similarly the first film substrate. Another conductive wire 13 a provided on A is also conductively connected by another conductive wire 15 to another conductive wire 13 b of the second film substrate B to be connected.

According to the film substrate 40, since a part of the first film substrate A and the second film substrate B is laminated, the long film substrate in which the first film substrate A and the second film substrate B are connected. It can be.
Further, the conductive wires 13a and 13b on both the front and back surfaces of the film substrate 40 can be conductively connected.

Modification 1 of the fourth embodiment [FIG. 8] :
A film substrate 40a as a modification of the fourth embodiment is shown in FIG. 8 is a plan view of the film substrate 40a, and FIG. 8B is a sectional view thereof.
The film substrate 40a is the same as the film substrate 40 in that the first film substrate A and the second film substrate B, which are two film substrates, are stacked and connected in the thickness direction. The difference is that the surface having the conducting wire 13b of the second film substrate B is connected to the surface having the conducting wire 13a of one film substrate A.

  As shown in FIG. 8, the conductive yarn 15 of the film substrate 40a reaches the opposite surface through the inside from the surface of the first film substrate A where the conductive wire 13a is not provided, and one of the conductive wires 13a. It touches a part and also touches a part of one of the conductive wires 13b to enter the base film 12a and reach the back surface. From there, it also reaches the surface where the conducting wire 13b is provided through the inside of the base film 12b, contacts the conducting wire 13b, contacts the conducting wire 13a, enters the inside of the base film 12a, and is not provided with the conducting wire 13a. The base film 12a and the base film 12b are stitched so as to communicate with the surface.

  In this way, one conductive wire 13b of the second film substrate B to be connected to one conductive wire 13a of the first film substrate A is conductively connected by the conductive yarn 15, and similarly the first film substrate. Another conductive wire 13 a provided on A is also conductively connected by another conductive wire 15 to another conductive wire 13 b of the second film substrate B to be connected.

According to the film substrate 40a, since a part of the first film substrate A and the second film substrate B is laminated, the long film substrate in which the first film substrate A and the second film substrate B are connected. It can be.
Further, since the conductive wires 13a and 13b are directly brought into contact with each other, it is difficult to bring complicated circuits into contact with each other. However, since the conductive wires are directly brought into contact with each other, a film substrate with reliable conduction can be obtained.

Modification 2 of the fourth embodiment [FIG. 9] :
FIG. 9 shows a film substrate 40b as another modification of the fourth embodiment. 9A is a plan view of the film substrate 40b, and FIG. 9B is a cross-sectional view thereof.
The film substrate 40b is also the same as the film substrate 40 in that the first film substrate A and the second film substrate B, which are two film substrates, are stacked and connected in the thickness direction. The difference is that the surface of the second film substrate B provided with the conductive wire 13b is connected to the surface of the first film substrate A where the conductive wire 13a is not provided.

  As shown in FIG. 9, the conductive yarn 15 of the film substrate 40b covers a partial surface of one of the conductive wires 13a formed on the surface of the first film substrate A, and the back surface through the inside of the base film 12a. , Contacts one of the conductive wires 13b formed on the surface of the other second film substrate B, and further enters the inside of the second film substrate B before reaching the back surface thereof. From there, it also reaches the surface on which the conductive wire 13b is provided through the inside of the base film 12b, comes into contact with the conductive wire 13b, and further passes through the inside of the base film 12a to the surface and leads to the partial surface of the conductive wire 13a. The base film 12a and the base film 12b are stitched together.

  In this way, one conductive wire 13b of the second film substrate B to be connected to one conductive wire 13a of the first film substrate A is conductively connected by the conductive yarn 15, and similarly the first film substrate. Another conductive wire 13 a provided on A is also conductively connected by another conductive wire 15 to another conductive wire 13 b of the second film substrate B to be connected.

  According to the film substrate 40b, since a part of the first film substrate A and the second film substrate B is laminated, the long film substrate in which the first film substrate A and the second film substrate B are connected. It can be. At this time, since both of the conducting wires 13a and 13b are located on the upper side surfaces of the base films 12a and 12b in FIG. 9B, the circuit can be connected without causing the conducting wires to wrap around the rear side surface. .

Modification 3 of the fourth embodiment [FIG. 10] :
FIG. 10 shows a film substrate 40c as another modification of the fourth embodiment. 10A is a plan view of the film substrate 40c, FIG. 10B is a sectional view thereof, and FIG. 10C is another sectional view.
The film substrate 40c is also formed by laminating the first film substrate A and the second film substrate B, which are two film substrates, in the thickness direction, and on the surface where the conducting wire 13a of the first film substrate A is not provided. The film substrate 40c is the same as the film substrate 40c in that the surface on which the conducting wire 13b of the second film substrate B is provided is connected, but the stitching positions of the conducting wires 13a and 13b are not all the same position. Is different.

  That is, in the conducting wire 13a shown second from the top than the conducting wire 13a shown at the top in FIG. 10A, the stitching position has moved to the right side. The third conductive wire 13a is stitched at the same position as the uppermost conductive wire 13a. Thus, the stitching position can be appropriately changed according to the arrangement of the conducting wires 13a and 13b.

Modification 4 of the fourth embodiment [FIG. 11] :
FIG. 11 shows a film substrate 40d as still another modified example of the fourth embodiment. 11A is a plan view of the film substrate 40d, FIG. 11B is a sectional view thereof, and FIG. 11C is another sectional view.
The film substrate 40d is also the same as the film substrate 40d in that the first film substrate A and the second film substrate B, which are two film substrates, are laminated in the thickness direction. It differs from the film substrate 40d in that conductive wires 13b1 and 13b2 are provided on both front and back surfaces.

  In the film substrate 40d, the conductive wire 13a provided on the base film 12a and the conductive wire 13b1 provided on the base film 12b are stitched with the conductive yarn 15, and the conductive wire 13b1 and the conductive wire 13b2 provided on the base film 12b are connected to the conductive yarn 15. Conductive connection is established. Since the base film provided with the conductive portion is laminated and the conductive portions and the base film are appropriately stitched, a complicated three-dimensional conductive circuit can be realized.

Modification 5 of the fourth embodiment [FIG. 12] :
A film substrate 40e as still another modification of the fourth embodiment is shown in FIG. 12A is a plan view of the film substrate 40d, FIG. 12B is a sectional view thereof, and FIG. 12C is a bottom view thereof.
The film substrate 40e is a modified example of the film substrate 40d shown in FIG. 11, and is formed by electrically connecting conductive wires 13a1 and 13a2 provided on the front and back surfaces of one base film 12a with conductive yarns 15.
Without connecting the base film as in this embodiment, a plurality of conductive portions on one base film can be conductively connected by stitching with a conductive thread.

  The form shown in the above embodiment is an exemplification of the present invention, and the embodiment can be changed, partly deleted, addition of a known technique, combination, etc. can be made without departing from the gist of the present invention. These techniques are also included in the scope of the present invention.

10, 10a, 20, 20a, 30, 30a, 40, 40a, 40b, 40c, 40d, 40e Film substrate 12, 12a, 12b Base film 13, 13a, 13b, 13b1, 13b2 Conductor (conductive circuit)
15 Conductive yarn A 1st film substrate B 2nd film substrate

Claims (15)

In the film substrate having a conductive circuit in the base film,
Conductive circuit, have a conductive yarn conductively connected spanned a conductive portion located away of the substrate film, the insulating film is provided on a surface of the conductive yarn after passing over the conductive portion film substrate, characterized in that is.   The film substrate according to claim 1, wherein the conductive yarn has a nonconductive fiber serving as a core material and a conductive coating layer covering the nonconductive fiber.   The film substrate according to claim 1, wherein the conductive portion is a printed layer made of a conductive paint.   The film substrate according to any one of claims 1 to 3, wherein the conductive yarn has a stitched portion that connects the conductive portions of the conductive circuit.   The film substrate according to any one of claims 1 to 3, wherein a portion of the base film that is spanned by the conductive yarn intersects three-dimensionally.   The film substrate according to any one of claims 1 to 5, wherein the conductive portions at remote positions on the base film are spanned by conductive yarns via a spacer.   The film substrate according to any one of claims 1 to 5, wherein the conductive portions located at a distance on the base film are spanned by conductive yarns through a space. The film substrate according to any one of claims 1 to 7, wherein the insulating film is provided by covering the surface of the conductive yarn with the insulating tape after the conductive portion is spanned. The insulating film according to any one of claims 1 to 7, wherein the insulating film is provided by applying and curing an insulating coating film on the surface of the conductive yarn after the conductive portion is spanned. Film substrate. The film substrate according to claim 1, wherein the conductive yarn is provided as a bundle of a plurality of conductive yarns. The through-hole plating provided in the sewing hole provided in the base film is electrically connected to the conductive portion, and is electrically connected to the conductive thread that is spanned to the sewing hole. The film substrate according to claim 1. A first film substrate having a conductive circuit in the base film; a second film substrate having a conductive circuit in the base film;
A conductive yarn that spans the conductive circuit of the first film substrate and the conductive circuit of the second film substrate and is electrically connected to each other ;
A stitch connection structure of a film substrate in which an insulating film is provided on the surface of the conductive yarn after the conductive circuit of the first film substrate and the conductive circuit of the second film substrate are spanned . The stitch connection structure of a film substrate according to claim 12, wherein the first film substrate and the second film substrate cross three-dimensionally. Suture connection structure of the film substrate of claim 12 or claim 13, wherein in which looped over a conductive thread through the spacer between the first film substrate and the second film substrate. The stitch connection structure for a film substrate according to claim 12 or 13, wherein the first film substrate and the second film substrate are spanned by a conductive thread through a space.

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