JP6602213B2 - Board working apparatus and component mounting apparatus - Google Patents

Description

  The present invention relates to a board working apparatus and a component mounting apparatus, and more particularly to a board working apparatus and a component mounting apparatus provided with an imaging unit.

  Conventionally, a component mounting apparatus including an imaging unit is known (for example, see Patent Document 1).

  In Patent Document 1, a component holding head for mounting a component on a substrate, a component camera (imaging unit) for imaging a component held by the component holding head, and an enlargement / reduction process for an image of the component captured by the component camera An electronic circuit component mounting machine (component mounting apparatus) including an image processing computer is disclosed. The electronic circuit component mounting machine of Patent Document 1 is configured such that an image of a component is enlarged or reduced at a specified magnification according to the size of the component.

JP 2003-273589 A

  However, the electronic circuit component mounting machine (component mounting apparatus) disclosed in Patent Document 1 is configured such that an image of a component is enlarged or reduced at a specified magnification in accordance with the size of the component. It is considered that there is a case where the minimal parts are not clearly displayed when the image is simply enlarged at a specified magnification. In this case, there is a problem that it is difficult to accurately recognize the minimal component.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a substrate working apparatus and a component mounting apparatus capable of accurately recognizing a minimal component. It is.

According to a first aspect of the present invention, there is provided a substrate working apparatus that performs a work on a substrate on which a component is mounted, an imaging unit capable of imaging the component, and an enlargement process of an image of the component captured by the imaging unit. and an image processing unit, an image processing unit, based on the component size of the previously obtained, and the resolution of the imaging unit, and the number of sampling pixels necessary for detecting the position of the outer edge of the component from the image, parts Before performing the process of detecting the position of the outer edge of the image, the process of determining the enlargement ratio of the image, and the position accuracy standard deviation that is the standard deviation of the position detection error that changes depending on the enlargement ratio of the image, are set in advance. It is configured to perform at least one of processing for determining an image enlargement ratio based on the standard value.

  In the substrate working apparatus according to the first aspect of the present invention, as described above, based on the size of the component, the resolution of the imaging unit, and the number of sampling pixels necessary to detect the position of the outer edge of the component from the image. The image enlargement ratio is determined based on the process for determining the image enlargement ratio, the position accuracy standard deviation that is the standard deviation of the position detection error that varies depending on the image enlargement ratio, and a preset standard value. An image processing unit that performs at least one of the determination process is provided. As a result, when the enlargement ratio of the image is determined based on the size of the component, the resolution of the imaging unit, and the number of sampling pixels necessary to detect the position of the outer edge of the component from the image, Even if the size or resolution of the imaging unit changes, the image can be enlarged so that the number of sampling pixels that can detect the position of the outer edge of the component is ensured. It can be recognized accurately. In addition, when the image enlargement ratio is determined based on the position accuracy standard deviation, which is the standard deviation of the position detection error that changes depending on the image enlargement ratio, and a preset standard value, the position detection of the component is performed. Since the image can be enlarged so that the accuracy of the error is within the standard value, the position and orientation of the component can be accurately recognized from the enlarged image. As a result, it is possible to accurately recognize the minimal component.

  The substrate working apparatus according to the first aspect is preferably configured to detect a component posture including a component position based on an image of the component enlarged by the image processing unit. If comprised in this way, the components attitude | position including the position of a minimal component can be recognized with high precision by the enlarged image.

  In the substrate working apparatus according to the first aspect, preferably, when the image processing unit enlarges the image, the image processing unit sets a luminance value of a pixel to be interpolated based on luminance values of a plurality of surrounding pixels to a third or higher order. It is comprised so that it may obtain | require using a high-order type | formula. With this configuration, the image can be enlarged by smoothly interpolating the pixels using a higher-order expression of the third or higher order, so that the minimal component can be recognized more accurately from the enlarged image.

  In the substrate working apparatus according to the first aspect, preferably, in the image processing unit, the number of pixels in the sampling area width of the component image is equal to or more than the number of sampling pixels necessary for detecting the position of the outer edge portion of the component. As described above, the image enlargement ratio is determined. With this configuration, the image can be enlarged so as to ensure the number of sampling pixels that can detect the position of the outer edge of the component, so that the minimal component can be recognized more accurately from the enlarged image. Can do.

  In this case, the image processing unit is preferably configured such that the number of pixels of the sampling area width of the image of the component is greater than the number of sampling pixels necessary for detecting the position of the outer edge of the component with an accuracy equal to or higher than the resolution of the imaging unit. Thus, the image enlargement ratio is determined. By configuring in this way, even when accuracy higher than the resolution of the imaging unit is required, the image can be enlarged so as to ensure the number of sampling pixels that can detect the position of the outer edge of the component, The extremely small parts can be recognized with higher accuracy by the enlarged image.

  In the substrate working apparatus according to the first aspect, preferably, when the position accuracy standard deviation is used when the image processing unit determines the enlargement ratio of the image, the plurality of positions and postures in which the component is moved with respect to the image are used. Based on the image of the part, the position accuracy standard deviation is obtained. According to this configuration, the position accuracy standard deviation used when determining the image enlargement ratio can be easily obtained according to the part, so that the optimum image enlargement ratio can be easily determined.

A component mounting apparatus according to a second aspect of the present invention includes a mounting head that performs an operation of mounting a component on a substrate, an imaging unit that can image the component held by the mounting head, and an image of the component captured by the imaging unit. An image processing unit that performs an enlargement process, and the image processing unit is based on the size of the component acquired in advance , the resolution of the imaging unit, and the number of sampling pixels necessary to detect the position of the outer edge of the component from the image. Before performing the process of detecting the position of the outer edge of the component, the process of determining the enlargement ratio of the image, the position accuracy standard deviation that is the standard deviation of the position detection error that changes according to the enlargement ratio of the image, Based on the set standard value, at least one of processing for determining the enlargement ratio of the image is performed.

  In the component mounting apparatus according to the second aspect of the present invention, as described above, based on the size of the component, the resolution of the imaging unit, and the number of sampling pixels necessary to detect the position of the outer edge of the component from the image. The image enlargement ratio is determined based on the process for determining the image enlargement ratio, the position accuracy standard deviation that is the standard deviation of the position detection error that varies depending on the image enlargement ratio, and a preset standard value. An image processing unit that performs at least one of the determination process is provided. As a result, when the enlargement ratio of the image is determined based on the size of the component, the resolution of the imaging unit, and the number of sampling pixels necessary to detect the position of the outer edge of the component from the image, Even if the size or resolution of the imaging unit changes, the image can be enlarged so that the number of sampling pixels that can detect the position of the outer edge of the component is ensured. It can be recognized accurately. In addition, when the image enlargement ratio is determined based on the position accuracy standard deviation, which is the standard deviation of the position detection error that changes depending on the image enlargement ratio, and a preset standard value, the position detection of the component is performed. Since the image can be enlarged so that the accuracy of the error is within the standard value, the position and orientation of the component can be accurately recognized from the enlarged image. As a result, it is possible to provide a component mounting apparatus capable of accurately recognizing extremely small components.

  According to the present invention, as described above, it is possible to provide a substrate working apparatus and a component mounting apparatus that can recognize a minimal component with high accuracy.

It is the top view which showed the outline of the component mounting apparatus by 1st Embodiment of this invention. It is the block diagram which showed the control structure of the component mounting apparatus by 1st Embodiment of this invention. It is a figure for demonstrating the component recognition process of the component mounting apparatus by 1st Embodiment of this invention. It is a figure for demonstrating the sampling pixel number in the case of the component recognition process of the component mounting apparatus by 1st Embodiment of this invention. It is a table | surface for demonstrating the determination processing of the magnification of the component mounting apparatus by 1st Embodiment of this invention. It is a flowchart for demonstrating the magnification determination process by CPU of the component mounting apparatus by 1st Embodiment of this invention. It is a table | surface for demonstrating the standard value of the image processing precision of the component mounting apparatus by 2nd Embodiment of this invention. It is a table | surface for demonstrating the determination processing of the magnification of the component mounting apparatus by 2nd Embodiment of this invention. It is a flowchart for demonstrating the magnification determination process by CPU of the component mounting apparatus by 2nd Embodiment of this invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings.

[First Embodiment]
(Configuration of component mounting device)
First, with reference to FIG. 1, the structure of the component mounting apparatus 100 by 1st Embodiment of this invention is demonstrated.

  As shown in FIG. 1, the component mounting apparatus 100 is a component mounting apparatus that transports a substrate P in the X direction by a pair of conveyors 2 and mounts a component 31 on the substrate P at a mounting work position M. The component mounting apparatus 100 is an example of the “board working apparatus” in the claims.

  As shown in FIG. 1, a component mounting apparatus 100 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a support unit 5, a pair of rail units 6, and a component recognition camera. 7. As shown in FIG. 2, the component mounting apparatus 100 includes a CPU (Central Processing Unit) 81, a storage device 82, a memory 83, a display unit 84, an input device 85, and a control configuration. A motor controller 86, a camera I / F 87, a lighting controller 88, various I / O 89, a motor amplifier 90, and a motor 91 are provided. The head unit 4 is an example of the “working unit” in the claims, and the component recognition camera 7 is an example of the “imaging unit” in the claims. The CPU 81 is an example of the “image processing unit” in the claims.

  The pair of conveyors 2 is installed on the base 1 and configured to transport the substrate P in the X direction. Further, the pair of conveyors 2 are configured to hold the substrate P being conveyed in a state where it is stopped at the mounting work position M. Further, the pair of conveyors 2 is configured to be able to adjust the interval in the Y direction according to the dimensions of the substrate P.

  The component supply unit 3 is disposed outside the pair of conveyors 2 (Y1 side and Y2 side). The component supply unit 3 is provided with a plurality of tape feeders 3a.

  The tape feeder 3a holds a reel (not shown) around which a tape holding a plurality of components 31 at a predetermined interval is wound. The tape feeder 3a is configured to supply the component 31 from the tip of the tape feeder 3a by sending a tape that holds the component 31 by rotating the reel. Here, the component 31 includes electronic components such as an IC, a transistor, a capacitor, and a resistor. The component 31 includes a minimal component having a side size of 1 mm or less.

  The head unit 4 is configured to perform work on the substrate P on which the component 31 is mounted. Specifically, the head unit 4 is disposed above the pair of conveyors 2 and the component supply unit 3, and a plurality (five) of mounting heads 42 having nozzles 41 (see FIG. 2) attached to the lower end. And a substrate recognition camera 43.

  The mounting head 42 is configured to be movable up and down (movable in the Z direction), and the component 31 supplied from the tape feeder 3a by the negative pressure generated at the tip of the nozzle 41 by a negative pressure generator (not shown). The component 31 is mounted and mounted at a mounting position (see FIG. 2) on the board P.

  The substrate recognition camera 43 is configured to image the fiducial mark F of the substrate P in order to recognize the position of the substrate P. Then, by capturing and recognizing the position of the fiducial mark F, it is possible to accurately acquire the mounting position of the component 31 on the board P. An illumination 44 (see FIG. 2) is provided in the vicinity of the board recognition camera 43. The illumination 44 is configured to irradiate the substrate P with visible light when the substrate recognition camera 43 captures an image. Thereby, the board | substrate recognition camera 43 can image the board | substrate P clearly.

  The support unit 5 includes a motor 51. The support unit 5 is configured to move the head unit 4 in the X direction along the support unit 5 by driving the motor 51. Both ends of the support part 5 are supported by a pair of rail parts 6.

  The pair of rail portions 6 are fixed on the base 1. The rail portion 6 on the X1 side includes a motor 61. The rail portion 6 is configured to move the support portion 5 along the pair of rail portions 6 in the Y direction orthogonal to the X direction by driving the motor 61. The head unit 4 can move in the X direction along the support portion 5, and the support portion 5 can move in the Y direction along the rail portion 6, whereby the head unit 4 can move in the XY direction. .

  The component recognition camera 7 is fixed on the upper surface of the base 1. The component recognition camera 7 is configured to be able to image components. Specifically, the component recognition camera 7 is disposed outside the pair of conveyors 2 (Y1 side and Y2 side). The component recognition camera 7 images the component 31 sucked by the nozzle 41 of the mounting head 42 from the lower side (Z2 side) in order to recognize the suction state (suction posture) of the component 31 prior to mounting the component 31. It is configured as follows. Thereby, the CPU 81 can acquire the suction state of the component 31 sucked by the nozzle 41 of the mounting head 42. An illumination 71 (see FIG. 2) is provided in the vicinity of the component recognition camera 7. The illumination 71 is configured to irradiate the component 31 adsorbed by the nozzle 41 with visible light when the component recognition camera 7 captures an image. As a result, it is possible to clearly image the component 31 adsorbed to the nozzle 41 by the component recognition camera 7.

  The CPU 81 is configured to control the overall operation of the component mounting apparatus 100 such as the conveyance operation of the substrate P by the pair of conveyors 2, the mounting operation by the head unit 4, and the imaging operation by the substrate recognition camera 43 and the component recognition camera 7. ing.

  The storage device 82 stores information on the substrate P, information on the component 31, a program for performing a mounting operation, and the like. The storage device 82 includes, for example, an HDD (hard disk drive), an SSD (solid state drive), and the like.

  The memory 83 is configured to store information when the CPU 81 operates. The display unit 84 is configured to display the state of the component mounting apparatus 100, information on the board P being produced, and the like. The input device 85 is configured such that a user's operation on the component mounting apparatus 100 is input. The input device 85 includes, for example, a mouse, a keyboard, a switch, a touch panel, and the like.

  The motor controller 86 controls various motors 91 (motor 51, motor 61, lifting motor (Z-axis motor) of the mounting head 42, rotating motor (R-axis motor) of the mounting head 42) through the motor amplifier 90 under the control of the CPU 81. It is comprised so that it may drive. The component recognition camera 7 and the board recognition camera 43 are connected to the camera I / F (interface). The camera I / F is connected to the CPU 81. Thereby, it is comprised so that CPU81, the component recognition camera 7, and the board | substrate recognition camera 43 may be connected, respectively.

  The illumination controller 88 is configured to drive the illuminations 71 and 44 under the control of the CPU 81. Various I / Os (input / output) 89 are configured to control signals input to and output from the CPU 81.

  Here, in the first embodiment, the CPU 81 is configured to enlarge the image of the component 31 captured by the component recognition camera 7. Specifically, the CPU 81 enlarges the image based on the size of the component 31, the resolution of the component recognition camera 7, and the number of sampling pixels necessary to detect the position of the outer edge of the component 31 from the image. It is comprised so that the process which determines may be performed. The CPU 81 is configured to perform processing for enlarging the image of the component 31 with the determined enlargement rate. Note that the size of the component 31 is stored in the storage device 82 as a component library. The resolution of the component recognition camera 7 is stored in the storage device 82 as a machine parameter.

  The CPU 81 is configured to detect a component posture including the position of the component 31 based on the enlarged image of the component 31. Specifically, as shown in FIG. 3, the component posture including the position of the component 31 is detected (recognized). First, in (1) of FIG. 3, the circumscribed line of the component 31 is recognized. Then, the temporary center position C1 is determined based on the circumscribed line. In (2) of FIG. 3, six sampling areas Sa1 for detecting the edge (outer edge portion) of the component 31 are set based on the temporary center position C1. One sampling region Sa1 is set for each of the short sides of the component 31 and two for the long sides.

  In (3) of FIG. 3, the edge of the component 31 is detected in each sampling area Sa1. Then, the temporary center position C2 and the temporary rotation angle θ1 are determined based on the detected edge of the component 31. In (4) of FIG. 3, six sampling regions Sa2 are newly set based on the temporary center position C2 and the temporary rotation angle θ1. In (5) of FIG. 3, the edge of the component 31 is detected in each sampling area Sa2. Based on the detected edge of the component 31, the center position C3 and the rotation angle θ2 are determined.

  The CPU 81 is configured to obtain the luminance value of the pixel to be interpolated using a cubic equation based on the luminance values of a plurality of surrounding pixels when the image is enlarged. Specifically, when enlarging an image, the CPU 81 performs enlargement processing by newly interpolating pixels between pixels of the original image. In this case, the CPU 81 is configured to perform bicubic interpolation that obtains the luminance value of the pixel to be interpolated by a cubic equation using the luminance values of the surrounding 4 × 4 total 16 pixels. Thereby, it is possible to enlarge the image of the component 31 to an image having a smooth gradation with higher accuracy in which the shaggy of the edge (outer edge portion) of the component 31 is not conspicuous.

  Further, the CPU 81 determines the image enlargement ratio so that the number of pixels of the sampling area width of the image of the component 31 is equal to or larger than the number of sampling pixels necessary for detecting the position of the outer edge portion of the component 31. It is configured. Specifically, the CPU 81 determines that the number of pixels in the sampling area width of the image of the component 31 is equal to or greater than the number of sampling pixels necessary for detecting the position of the outer edge of the component 31 with an accuracy equal to or higher than the resolution of the component recognition camera 7. So that the enlargement ratio of the image is determined. For example, when the position of the outer edge portion of the component 31 is detected using a pixel having a size of 1 / N or less of the pixel of the captured image, the number of sampling pixels is preferably N or more. As in the example shown in FIG. 4, in the case where a pixel having a size of 1/10 is used, the number of sampling pixels is desirably 10 pixels or more.

(Magnification magnification determination process)
With reference to FIG. 5 and FIG. 6, an example of the enlargement magnification determination process will be described.

  In the example illustrated in FIG. 5, an enlargement magnification determination process is illustrated for four components 31 (component A, component B, component C, and component D) of different types (sizes). Note that the component A is the largest component, and the size decreases in the order of the component B, the component C, and the component D. That is, the relationship among the long side size La1 of the part A, the long side size Lb1 of the part B, the long side size Lc1 of the part C, and the long side size Ld1 of the part D is La1> Lb1> Lc1> Ld1. Further, the relationship among the short side size La2 of the part A, the short side size Lb2 of the part B, the short side size Lc2 of the part C, and the short side size Ld2 of the part D is La2> Lb2> Lc2> Ld2. The parts A, B, C, and D are extremely small parts having a side size of 1 mm or less.

  The long side size (number of pixels) Pa1 of the component A is expressed as Pa1 = La1 / R using the resolution R of the component recognition camera 7. Further, the long side size (number of pixels) Pb1 of the component B is expressed as Pb1 = Lb1 / R using the resolution R of the component recognition camera 7. Further, the long side size (number of pixels) Pc1 of the component C is expressed as Pc1 = Lc1 / R by using the resolution R of the component recognition camera 7. The long side size (number of pixels) Pd1 of the component D is expressed as Pd1 = Ld1 / R using the resolution R of the component recognition camera 7. The short side size (number of pixels) Pa2 of the component A is expressed as Pa2 = La2 / R. Further, the short side size (number of pixels) Pb2 of the component B is expressed as Pb2 = Lb2 / R. The short side size (number of pixels) Pc2 of the component C is expressed as Pc2 = Lc2 / R. The short side size (number of pixels) Pd2 of the component D is expressed as Pd2 = Ld2 / R.

  The long side sampling area width is set based on the length of the long side. For example, the long side sampling area width is set to ½ of the length of the long side. That is, the long-side sampling area width (number of pixels) Wa1 of the component A is expressed as Wa1 = Pa1 / 2. The long side sampling area width (number of pixels) Wb1 of the component B is expressed as Wb1 = Pb1 / 2. Further, the long-side sampling area width (number of pixels) Wc1 of the component C is expressed as Wc1 = Pc1 / 2. Further, the long-side sampling area width (number of pixels) Wd1 of the component D is expressed as Wd1 = Pd1 / 2. The short-side sampling area width (number of pixels) Wa2 of the component A is expressed as Wa2 = Pa2 / 2. Further, the short-side sampling area width (number of pixels) Wb2 of the component B is expressed as Wb2 = Pb2 / 2. Further, the short side sampling area width (number of pixels) Wc2 of the component C is expressed as Wc2 = Pc2 / 2. Further, the short-side sampling area width (number of pixels) Wd2 of the component D is expressed as Wd2 = Pd2 / 2.

  Here, since the short side is shorter than the long side, the sampling area width (number of pixels) is also shorter on the short side. That is, if the short side sampling width can be enlarged so as to be a width (number of pixels) necessary for detecting the edge (outer edge portion) of the component 31, the long side sampling width can also be increased to the edge (outer edge portion) of the component 31. ) Is a width (number of pixels) necessary to detect.

  The magnification of component A is equal to or larger than Wa2 / n using the width (number of pixels) n necessary to detect the edge (outer edge) of component 31, and is the smallest natural value. . Similarly, magnifications of parts B, C, and D are obtained. In the case of the example shown in FIG. 5, the magnification of component A is 1 times, the magnification of component B is 2 times, the magnification of component C is 3 times, and the magnification of component D is 3 times. .

  Next, with reference to FIG. 6, an enlargement magnification determination process by the CPU 81 of the component mounting apparatus 100 will be described based on a flowchart.

  In step S1 of FIG. 6, the component size stored in the storage device 82 as a component library is read out. In step S2, the resolution of the component recognition camera 7 stored in the storage device 82 as a machine parameter is read out.

  In step S3, the enlargement ratio of the image is the component size, the resolution of the component recognition camera 7, and the sampling area width (number of pixels) for detecting the position of the outer edge of the component 31 in the horizontal direction (X direction and Y direction). ) Is determined from the number of pixels n required for (). Thereafter, the enlargement magnification determination process is terminated.

(Effect of 1st Embodiment)
In the first embodiment, the following effects can be obtained.

  In the first embodiment, as described above, based on the size of the component 31, the resolution of the component recognition camera 7, and the number of sampling pixels necessary to detect the position of the outer edge portion of the component 31 from the image, A CPU 81 that performs processing for determining the enlargement ratio is provided. As a result, even if the size of the component 31 or the resolution of the component recognition camera 7 changes, the image can be enlarged so that the number of sampling pixels that can detect the position of the outer edge of the component 31 can be secured. The position and orientation of the component 31 can be accurately recognized from the obtained image. As a result, the extremely small component 31 can be accurately recognized.

  In the first embodiment, the component posture including the position of the component 31 is detected based on the image of the component 31 enlarged by the CPU 81. Thereby, the component posture including the position of the minimal component 31 can be accurately recognized from the enlarged image.

  In the first embodiment, the CPU 81 is configured to obtain the luminance value of the pixel to be interpolated using a cubic equation based on the luminance values of a plurality of surrounding pixels when the image is enlarged. As a result, the image can be enlarged by smoothly interpolating the pixels using a cubic equation, so that the minimal component 31 can be recognized more accurately from the enlarged image.

  In the first embodiment, the CPU 81 enlarges the image so that the number of pixels of the sampling area width of the image of the component 31 is equal to or larger than the number of sampling pixels necessary for detecting the position of the outer edge portion of the component 31. Configure to determine rate. Thereby, the image can be enlarged so that the number of sampling pixels capable of detecting the position of the outer edge portion of the component 31 is ensured, and therefore, the extremely small component 31 can be recognized more accurately by the enlarged image. it can.

  In the first embodiment, the CPU 81 performs sampling necessary for detecting the position of the outer edge portion of the component 31 with the accuracy of the number of pixels of the sampling area width of the image of the component 31 equal to or higher than the resolution of the component recognition camera 7. The image enlargement ratio is determined so as to be equal to or greater than the number of pixels. As a result, even when accuracy higher than the resolution of the component recognition camera 7 is required, the image can be enlarged so that the number of sampling pixels that can detect the position of the outer edge portion of the component 31 can be ensured. The extremely small component 31 can be recognized with higher accuracy from the obtained image.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the image enlargement ratio is determined based on the size of the component 31, the resolution of the component recognition camera 7, and the number of sampling pixels necessary to detect the position of the outer edge of the component 31 from the image. Unlike the first embodiment in which the determining process is performed, the image is enlarged based on the position accuracy standard deviation, which is a standard deviation of the position detection error that changes depending on the image enlargement ratio, and a preset standard value. An example of a configuration for performing processing for determining the rate will be described. In addition, the same code | symbol is attached | subjected to the location similar to 1st Embodiment.

  Here, in the second embodiment, the CPU 81 is configured to enlarge the image of the component 31 captured by the component recognition camera 7. Specifically, the CPU 81 determines the image enlargement rate based on the position accuracy standard deviation, which is the standard deviation of the position detection error that changes depending on the image enlargement rate, and a preset standard value (3σ). It is comprised so that the process to perform may be performed. The CPU 81 is configured to perform processing for enlarging the image of the component 31 with the determined enlargement rate.

  Further, the CPU 81 is configured to obtain the position accuracy standard deviation based on the images of the parts 31 having a plurality of positions and postures where the part 31 is moved with respect to the image.

  Specifically, as shown in the example of FIG. 7, the standard value (3σ) of the image processing accuracy in the X direction, the Y direction, and the A (rotation direction) is set for each type (size) of the component 31. Note that σ is a standard deviation.

  In the case of component A, the standard value in the X direction is less than 0.005 mm, the standard value in the Y direction is less than 0.005 mm, and the standard value in the A direction (rotation direction) is less than 0.750 degrees. is there. In the case of component B, the standard value in the X direction is less than 0.005 mm, the standard value in the Y direction is less than 0.005 mm, and the standard value in the A direction (rotation direction) is 1.000 degrees. Is less than. In the case of component C, the standard value in the X direction is less than 0.005 mm, the standard value in the Y direction is less than 0.005 mm, and the standard value in the A direction (rotation direction) is 1.250 degrees. Is less than. In the case of component D, the standard value in the X direction is less than 0.005 mm, the standard value in the Y direction is less than 0.005 mm, and the standard value in the A direction (rotation direction) is 1.500 degrees. Is less than.

(Magnification magnification determination process)
With reference to FIG. 8 and FIG. 9, an example of the magnification determination process will be described.

  The second embodiment is configured to determine the enlargement magnification from the position accuracy result obtained by performing image processing by changing the enlargement magnification by the actual component mounting apparatus 100 and a preset standard value. That is, the component 31 is moved with respect to the image, the image is enlarged, and the position of the component 31 is detected. Then, the amount of displacement is measured by comparing the amount of movement of the component 31 with the position of the component 31 in the enlarged image. This measured deviation amount statistic is within the standard value range, and the smallest magnification is selected. In the process of moving the component 31 with respect to the image, a plurality of images may be captured while the position of the component 31 is actually moved, and the position of the captured component 31 in the image is processed by image processing. It may be moved.

  In the example shown in FIG. 8, when the magnification is 1, the component A has 3σ in the X direction of 0.004, 3σ in the Y direction is 0.003, and 3σ in the A direction (rotation direction) is 0.00. 739. When the enlargement magnification was 2, the 3σ in the X direction was 0.003, the 3σ in the Y direction was 0.002, and the 3σ in the A direction (rotation direction) was 0.230. When the magnification was 3, the 3σ in the X direction was 0.002, the 3σ in the Y direction was 0.002, and the 3σ in the A direction (rotation direction) was 0.185. When the magnification was 4, the 3σ in the X direction was 0.002, the 3σ in the Y direction was 0.001, and the 3σ in the A direction (rotation direction) was 0.184. In this case, since the position accuracy result after image processing is within the range of the standard value of the image processing accuracy when the enlargement magnification is 1 or more, the enlargement magnification is determined to be 1.

  In the example shown in FIG. 8, when the magnification of the component B is 1, the 3σ in the X direction is 0.005, the 3σ in the Y direction is 0.003, and the 3σ in the A direction (rotation direction) is 1. 437. When the enlargement magnification was 2, the 3σ in the X direction was 0.003, the 3σ in the Y direction was 0.002, and the 3σ in the A direction (rotation direction) was 0.408. When the magnification was 3, the 3σ in the X direction was 0.002, the 3σ in the Y direction was 0.002, and the 3σ in the A direction (rotation direction) was 0.285. When the magnification was 4, the 3σ in the X direction was 0.001, the 3σ in the Y direction was 0.001, and the 3σ in the A direction (rotation direction) was 0.187. In this case, when the enlargement magnification is 1, the position accuracy result in the X direction and the position accuracy result in the A direction (rotation direction) are out of the standard value range of the image processing accuracy. In addition, when the enlargement magnification is 2 times or more, the position accuracy result obtained by performing the image processing is within the range of the standard value of the image processing accuracy, so the enlargement magnification is determined to be 2 times.

  In the example shown in FIG. 8, when the magnification of the component C is 1, the 3σ in the X direction is 0.006, the 3σ in the Y direction is 0.004, and the 3σ in the A direction (rotation direction) is 1. 482. When the enlargement magnification was 2, the 3σ in the X direction was 0.003, the 3σ in the Y direction was 0.002, and the 3σ in the A direction (rotation direction) was 0.740. When the magnification was 3, the 3σ in the X direction was 0.003, the 3σ in the Y direction was 0.001, and the 3σ in the A direction (rotation direction) was 0.853. When the magnification was 4, the 3σ in the X direction was 0.002, the 3σ in the Y direction was 0.001, and the 3σ in the A direction (rotation direction) was 0.833. In this case, when the enlargement magnification is 1, the position accuracy result in the X direction and the position accuracy result in the A direction (rotation direction) are out of the standard value range of the image processing accuracy. In addition, when the enlargement magnification is 2 times or more, the position accuracy result obtained by performing the image processing is within the range of the standard value of the image processing accuracy. Therefore, the enlargement magnification is determined to be 2 times.

  In the example shown in FIG. 8, when the magnification of the component D is 1, the 3σ in the X direction is 0.009, the 3σ in the Y direction is 0.005, and the 3σ in the A direction (rotation direction) is 3. 420. When the enlargement magnification was 2, the 3σ in the X direction was 0.005, the 3σ in the Y direction was 0.003, and the 3σ in the A direction (rotation direction) was 1.287. When the magnification was 3, the 3σ in the X direction was 0.003, the 3σ in the Y direction was 0.002, and the 3σ in the A direction (rotation direction) was 1.201. When the magnification was 4, the 3σ in the X direction was 0.002, the 3σ in the Y direction was 0.002, and the 3σ in the A direction (rotation direction) was 1.031. In this case, when the enlargement magnification is 1, the position accuracy result in the X direction, the position accuracy result in the Y direction, and the position accuracy result in the A direction (rotation direction) are out of the standard value range of the image processing accuracy. Further, when the enlargement magnification is 2, the position accuracy result in the X direction is out of the range of the standard value of the image processing accuracy. In addition, when the enlargement magnification is 3 times or more, the position accuracy result obtained by performing the image processing is within the range of the standard value of the image processing accuracy, so the enlargement magnification is determined to be 3 times.

  Next, with reference to FIG. 9, an enlargement magnification determination process by the CPU 81 of the component mounting apparatus 100 will be described based on a flowchart.

  In step S11 in FIG. 9, the component recognition camera 7 captures the image of the component 31, and the captured image of the component 31 is stored. In step S12, in order to measure the position accuracy, a plurality of images obtained by moving the component 31 in the X direction, the Y direction, and the A direction (rotation direction) are created and stored.

  In step S13, each image is subjected to image processing, and the position and orientation of the component 31 are measured (detected). In step S14, the position accuracy standard deviation is obtained from the amount of movement of the component 31 and the result of image processing to measure the position and orientation of the component 31.

  In step S15, it is determined whether or not the position accuracy standard deviation is within the range of the standard value. If it is not within the range of the standard value, the process proceeds to step S16, and if it is within the range of the standard value, the process proceeds to step S18. In step S16, the image enlargement magnification is set to +1. For example, when the enlargement magnification is 1, it is doubled. Further, in the case of double, it is tripled.

  In step S17, each image is enlarged according to the magnification. Thereafter, the process returns to step S13.

  When it is determined in step S15 that the position accuracy standard deviation is within the range of the standard value, in step S18, a magnification having no standard value range is determined as the enlargement magnification. Thereafter, the enlargement magnification determination process is terminated.

  In addition, the other structure of 2nd Embodiment is the same as that of the said 1st Embodiment.

(Effect of 2nd Embodiment)
In the second embodiment, the following effects can be obtained.

  As described above, in the second embodiment, the image is enlarged based on the position accuracy standard deviation which is the standard deviation of the position detection error that changes depending on the image enlargement ratio and the preset standard value (3σ). A CPU 81 that performs processing for determining the rate is provided. As a result, the image can be enlarged so that the position detection error of the component 31 is within the standard value (3σ), so that the position and orientation of the component 31 can be accurately recognized from the enlarged image. . As a result, the extremely small component 31 can be accurately recognized.

  Further, in the second embodiment, as described above, the position accuracy standard deviation is obtained based on the images of the parts 31 at a plurality of positions and postures where the part 31 is moved with respect to the image. . Thereby, since the position accuracy standard deviation used when determining the enlargement ratio of the image can be easily obtained according to the component 31, the optimum enlargement ratio of the image can be easily determined.

  The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

(Modification)
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first and second embodiments, the example in which the present invention is applied to a component mounting apparatus as a board working apparatus has been described, but the present invention is not limited to this. The present invention may be applied to devices other than component mounting apparatuses. For example, the present invention may be applied to an inspection apparatus that inspects a board on which components are mounted. In this case, the imaging unit may image a component mounted on the board. Further, the imaging unit does not have to image the component based on visible light. For example, the imaging unit may image a component based on infrared light, X-rays, or the like.

  In the first embodiment, the sampling pixel necessary for the CPU (image processing unit) to detect the size of the component, the resolution of the component recognition camera (imaging unit), and the position of the outer edge of the component from the image. In the second embodiment, the CPU (image processing unit) uses a standard deviation of a position detection error that varies depending on the image enlargement rate. Although the example which performs the process which determines the magnification rate of an image based on a certain positional accuracy standard deviation and the preset standard value was shown, this invention is not limited to this. In the present invention, the image processing unit determines an image enlargement ratio based on the size of the component, the resolution of the imaging unit, and the number of sampling pixels necessary to detect the position of the outer edge of the component from the image. Both processing and processing for determining the image enlargement ratio based on the standard deviation of position accuracy, which is a standard deviation of the position detection error that changes depending on the image enlargement ratio, and a preset standard value are performed. Also good.

  Further, in the first and second embodiments, the example of the configuration in which the component posture including the position of the component in the image is detected by the CPU (image processing unit) that determines the enlargement ratio of the image has been described. The invention is not limited to this. In the present invention, the component posture including the position of the component in the image may be detected by a processing unit that is separate from the image processing unit that has determined the image enlargement ratio.

  Moreover, in the said 1st and 2nd embodiment, although the example of the structure whose component recognition camera (imaging part) is an area camera was shown, this invention is not limited to this. In the present invention, the imaging unit may be a line camera.

  In the first and second embodiments, the example using ± 3σ as the position accuracy standard deviation is shown, but the present invention is not limited to this. In the present invention, ± σ or ± 2σ may be used as the position accuracy standard deviation. In addition, an average value ± σ, an average value ± 2σ, an average value ± 3σ, or the like may be used as the position accuracy standard deviation.

  In the first and second embodiments, when the image is enlarged, an example of a configuration in which the luminance value of the pixel to be interpolated is obtained using a cubic equation based on the luminance values of a plurality of surrounding pixels. Although shown, the present invention is not limited to this. In the present invention, when the image is enlarged, the luminance value of the pixel to be interpolated may be obtained using a higher-order expression of the fourth or higher order based on the luminance values of a plurality of surrounding pixels. Further, when the image is enlarged, the luminance value of the pixel to be interpolated may be obtained using a quadratic or lower formula based on the luminance values of a plurality of surrounding pixels.

  In the first and second embodiments, for the sake of convenience of explanation, the processing of the CPU (image processing unit) has been described using a flow-driven flow in which processing is performed in order along the processing flow. It is not limited to this. In the present invention, the processing of the CPU may be performed by event driven type (event driven type) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

4 Head unit (working section)
7 Component recognition camera (imaging part)
31 parts 42 mounting head 81 CPU (image processing unit)
100 Component mounting equipment (board work equipment)
P substrate

Claims (7)

A working unit that performs work on a board on which components are mounted;
An imaging unit capable of imaging the component;
An image processing unit for enlarging the image of the component imaged by the imaging unit,
Wherein the image processing unit, based on the size of the previously acquired the component has, and resolution of the imaging unit, and the number of sampling pixels necessary for detecting the position of the outer edge of the from the image part, the outer edge of the component Before performing the process of detecting the position of the part, the process of determining the enlargement ratio of the image, the position accuracy standard deviation that is the standard deviation of the position detection error that changes according to the enlargement ratio of the image, and a preset standard value A substrate working apparatus configured to perform at least one of processing for determining an image enlargement ratio based on the above.   The board | substrate working apparatus of Claim 1 comprised so that the component attitude | position including the position of the said component may be detected based on the image of the said component expanded by the said image process part.   The image processing unit is configured to obtain a luminance value of a pixel to be interpolated using a higher-order expression of the third or higher order based on luminance values of a plurality of surrounding pixels when the image is enlarged. The substrate working apparatus according to claim 1 or 2.   The image processing unit determines an image enlargement ratio so that the number of pixels of the sampling area width of the image of the component is equal to or larger than the number of sampling pixels necessary for detecting the position of the outer edge portion of the component. The board | substrate working apparatus of any one of Claims 1-3 comprised by these.   The image processing unit is configured such that the number of pixels in the sampling area width of the image of the component is equal to or greater than the number of sampling pixels necessary for detecting the position of the outer edge of the component with an accuracy equal to or higher than the resolution of the imaging unit. 5. The substrate working apparatus according to claim 4, wherein the substrate working apparatus is configured to determine an enlargement ratio of the image.   In the case where the position accuracy standard deviation is used when the image processing unit determines the magnification of the image, the position accuracy is based on images of the component at a plurality of positions and postures where the component is moved with respect to the image. The board | substrate working apparatus of any one of Claims 1-5 comprised so that a standard deviation may be calculated | required. A mounting head that performs the work of mounting components on the board;
An imaging unit capable of imaging the component held by the mounting head;
An image processing unit for enlarging the image of the component imaged by the imaging unit,
Wherein the image processing unit, based on the size of the previously acquired the component has, and resolution of the imaging unit, and the number of sampling pixels necessary for detecting the position of the outer edge of the from the image part, the outer edge of the component Before performing the process of detecting the position of the part, the process of determining the enlargement ratio of the image, the position accuracy standard deviation that is the standard deviation of the position detection error that changes according to the enlargement ratio of the image, and a preset standard value And a component mounting apparatus configured to perform at least one of processing for determining an image enlargement ratio based on the above.

Images