JP6594095B2 - Light source unit - Google Patents

Description

  The present invention relates to a light source unit using a light emitting element as a light source.

  A conventional light source unit with a built-in power source uses an LED element, which is a light emitting element, as a light source, and a lighting circuit and a light emitting element substrate are housed in a cylindrical light transmitting cover made of resin for cost reduction. Resin bases with terminals protruding from both ends of the cover are attached.

JP2014-103000A

In Patent Document 1, since the lighting circuit is not metal-closed, there is a risk of smoke or fire if a problem occurs in the power supply.
If a two-layer structure having a light emitting surface covered with a resin cover and a non-light emitting surface provided with a metal casing is used, the lighting circuit can be housed in the metal casing, and the metal can be closed. There is a problem that the manufacturing cost becomes high.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a light source unit that can separate a substrate and a lighting circuit while using a translucent cover formed of a resin all-around structure, and can easily mount the substrate. And

The light source unit according to the present invention is formed using a translucent cylindrical outer shell and a resin material, and along the cylindrical axis in a cross-sectional view intersecting the cylindrical axis direction of the outer shell. A partition that separates the space inside the outer shell, a light source module that is disposed on one side of the partition that is on one side of the partition, and on one side of the partition And a lighting device that is disposed on the other separated side of the space and supplies power to the light source module.

  According to the light source unit of the present invention, the substrate mounting portion includes a resin-made substrate mounting portion that partitions the space inside the translucent cover, and the substrate mounting portion has the substrate mounted on one surface and the other surface. Since the lighting circuit for lighting the light emitting element is attached to the substrate, the substrate and the lighting circuit can be partitioned by the resin substrate mounting portion, and a safe light source unit can be provided at a low manufacturing cost.

1 is a schematic diagram of a light source unit 100 according to Embodiment 1. FIG. The schematic diagram of the AA cross section of FIG. FIG. 3 is a schematic diagram showing an arrangement of lighting circuits 150 in the light source unit 100 according to Embodiment 1. The schematic diagram of the BB cross section of FIG. The schematic diagram which looked at the light source unit 100a which concerns on Embodiment 2 from the heat radiation part 132 side of the light source attachment body 130b. The schematic diagram of the CC cross section of FIG. 5, and the enlarged schematic diagram of the groove part 134 part. The schematic diagram which looked at the light source unit 100b which concerns on Embodiment 3 from the light emission direction side, and the enlarged schematic diagram of the 1st nozzle | cap | die 120a. FIG. 6 is a schematic diagram of a partial perspective view of a light source unit 100c according to a fourth embodiment. The schematic diagram of the end surface which looked at the light source unit 100c which concerns on embodiment from the P1 direction.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments described below. Moreover, in the following drawings, the relationship of the size of each component may be different from the actual one. In the description of the embodiment, when directions or positions such as top, bottom, left, right, front, back, front, back are indicated, these notations are described as such for convenience of explanation. However, it does not limit the arrangement or orientation of devices, instruments, parts, and the like.

Embodiment 1 FIG.
*** Explanation of the outline of the configuration of the light source unit 100 ***
FIG. 1 is a schematic diagram of a light source unit 100 according to the present embodiment.
FIG. 2 is a schematic diagram of the AA cross-sectional view of FIG.
The outline of the configuration of the light source unit 100 according to the present embodiment will be described with reference to FIGS. 1 and 2.
The light source unit includes a translucent cover 110, a pair of caps 120, a light source attachment body 130, and a light source module 140.
The light source unit 100 includes a lighting circuit 150 that turns on the light source module 140. In FIG. 1, the lighting circuit 150 is omitted. The arrangement position of the lighting circuit 150 will be described later. The lighting circuit 150 is also referred to as a lighting device or a power supply unit.
The light source unit 100 is also referred to as a straight tube LED lamp.

<Translucent cover 110>
The translucent cover 110 is a cylindrical outer shell extending in the longitudinal direction. The longitudinal direction is also referred to as the axial direction of the cylinder. The translucent cover 110 has translucency and light diffusibility. The translucent cover 110 houses the light source module 140 therein. Specifically, the translucent cover 110 is a resin material such as polycarbonate (PC) or acrylic, and other resin materials may be used as long as the resin material has translucency and light diffusibility. The translucent cover 110 may be a white one containing a diffusing material as described above, or a transparent one. The translucent cover 110 may be made of glass.
Note that the cross-sectional shape of the translucent cover 110 may be other than a cylindrical shape as long as it is a cylindrical shape, and may be a cylindrical shape having an elliptical cross-sectional shape, a rectangular cylindrical shape, a polygonal cylindrical shape, or the like.

<Base 120>
The pair of caps 120 are attached to both ends of the translucent cover 110. Each base 120 includes a pair of pins 121. The pin 121 may be fixed by being press-fitted into a fixing hole (not shown) provided in the base casing 124 in advance, or the base 121 is formed by insert molding the pin 121 so that the pin 121 is fixed to the base casing. It may be fixed to the body 124.
The base 120 in FIG. 1 is an example of a G13 type base. Note that the number or shape of the pins 121 is not limited to that shown in FIG. 1 and may be other numbers or other shapes.
In addition, about a pair of bases 120, one base may be described as the 1st base 120a, and the other base may be described as the 2nd base 120b.
The lighting circuit 150 to be described later receives power from the pin 121 of the base 120.

  The translucent cover 110 and the base 120 are bonded with an adhesive or the like. Alternatively, the base 120 may be screwed to the end portion of the light source mounting body 130 described later with a screw for fastening the base.

<Light source module 140>
The light source module 140 includes a substrate 141 and a light emitting element 142 arranged on the substrate 141 in the longitudinal direction.
Specifically, the substrate 141 is preferably made of a metal plate such as an aluminum plate, a copper plate, or an alloy plate, or a ceramic substrate, a metal core substrate, a metal core ceramic substrate, or the like in order to improve heat dissipation. Note that a glass epoxy substrate (FR4 (Frame Regentant Type 4) or CEM1 to 3 (Composite epoxy material-1 to 3)) or a paper phenol substrate may be used as long as the temperature of the light emitting element 142 is equal to or lower than a specified value. The substrate 141 is formed to have a thickness that can ensure electrical insulation between the light emitting element 142 and the lighting circuit 150 that is a power supply unit. In the case of a metal core substrate, insulation can be ensured by increasing the resist thickness.

  As the light emitting element 142, an LED is used. For example, a pseudo white LED packaged by arranging a phosphor that converts blue light into yellow light on an LED chip that emits blue light of about 440 to 480 nm is used. Can do. Note that an LED chip directly mounted on the substrate 52 such as a chip on board (COB) may be used. In addition to the LED, the light emitting element 142 may be an organic EL (electroluminescence) or a laser diode (LD).

  The substrate 141 is a rectangle extending long in the longitudinal direction. Note that the substrate 141 may not be rectangular as long as it is long, and may be elliptical, polygonal, or the like. Further, the substrate 141 does not necessarily have a long shape, and the present embodiment can be applied to a non-long square, polygon, circle, ellipse, or the like.

The substrate 141 is a long flat plate that extends to both ends in the length direction of the translucent cover 110, that is, to both the caps 120. A circuit for supplying power to the light emitting element 142 is printed or wired on the substrate 141. A plurality of light emitting elements 142 are arranged at equal intervals on the upper surface of the substrate 141, and electrodes of the plurality of light emitting elements 142 are physically and electrically joined to a circuit for supplying power to form a light source circuit. The
A lower surface of the substrate 141 is bonded to a planar substrate mounting portion 131 of the light source mounting body 130 described later with an adhesive or a double-sided tape having high thermal conductivity.

  The surface of the substrate 141 is covered with a silicone-based highly reflective resist layer using a silicone-based resin material as a base material. The silicone-based highly reflective resist layer is exposed in the light emitting direction of the light emitting element 142 so as to overlap the circuit for supplying power of the substrate 141 in a layered manner. The silicone-based highly reflective resist layer is laid on the entire mounting surface of the substrate 141 excluding the portion to which the light emitting element 142 is bonded.

<Light source attachment body 130>
The light source attachment 130 attaches the light source module 140 and also has a role of a heat sink that radiates heat generated from the light emitting element 142. The light source attachment 130 is made of a metal such as aluminum, for example.
Note that the light source attachment 130 may not have the role of a heat sink as long as the light source module 140 can be attached thereto.

  The light source attachment body 130 in FIG. 2 has a D-shaped AA cross section and is hollow inside. The light source mounting body 130 is a long aluminum heat sink that extends to both ends, that is, both caps in the longitudinal direction of the translucent cover 110. The hollow portion penetrates in the longitudinal direction. The light source mounting body 130 includes a circular arc-shaped heat radiating portion 132 along the inner surface 1101 of the translucent cover 110 and a substrate mounting portion 131 that forms a linear portion to which the substrate is mounted. The lower part of the heat radiating part 132 of the light source attachment body 130 and the translucent cover 110 may be bonded with an adhesive. At this time, adhesive silicone is used as the adhesive.

  In FIG. 2, the light source attachment body 130 that also serves as a long heat sink has been described. However, as long as the light source module 140 can be attached as described above, the configuration is not limited to that of FIG. 2. The heat dissipating part 132 may not be a continuous arc shape and may be partially missing. Further, the heat dissipating part 132 may not be provided. Further, the board attachment portion 131 may not be plate-shaped as long as the board 141 can be attached. Further, the substrate attachment portion 131 may be a pair of grooves in which the light source module 140 is attached by accommodating both side portions of the substrate 141 in the longitudinal direction.

*** Explanation of the configuration of the light source unit 100 according to the present embodiment ***
FIG. 3 is a schematic diagram showing the arrangement of the lighting circuit 150 in the light source unit 100 according to the present embodiment.
FIG. 4 is a schematic diagram of a BB cross section of FIG.
The arrangement of the lighting circuit 150 in the light source unit 100 according to the present embodiment will be described with reference to FIGS. 3 and 4.
In FIG. 3, the light source attachment 130 is not shown.

  The light source unit 100 includes a cylindrical translucent cover 110 having translucency and a substrate 141 housed in the translucent cover 110. On the substrate 141, the light emitting element 142 is mounted, and a lighting circuit 150 for lighting the light emitting element 142 is mounted in an empty area 1413 other than the area where the light emitting element 142 is mounted.

The substrate 141 includes a light emitting surface 1411 on which the light emitting element 142 is mounted, and a back surface 1412 of the light emitting surface 1411. The lighting circuit 150 is mounted in the empty area 1413 of the light emitting surface 1411 or the empty area 1413 of the back surface 1412.
In FIG. 3, the lighting circuit 150 is mounted in the empty area 1413 on the back surface 1412. Alternatively, the lighting circuit 150 may be mounted in the empty area 1413 of the light emitting surface 1411.

  A silicone-based highly reflective resist layer using a silicone-based resin material has the function of a conventional solder resist (function of protecting the surface of the substrate 141). The silicone-based highly reflective resist layer is preferably white for improving the reflectance. The silicone-based highly reflective resist layer may be a wet resist or a dry resist. In the case of a wet resist, it may be dried by thermal curing (low accuracy) or dried by ultraviolet curing (high accuracy).

  The silicone resin material has a reflectance of 90% or more. The theoretical value with a layer thickness dimension of 70 μm is 98%. The measured value with a layer thickness dimension of 50 μm is 92-96%. Therefore, a resist using a silicone-based resin material can satisfy the demand for high luminance (high output). Silicone resin materials have an advantageous characteristic that they do not change color even when exposed to high heat of about 120 ° C. or strong light for a long time. For example, in the process of soldering the light emitting element 142 to the substrate 141, the substrate 141 (resist laid on the substrate 141) is exposed to an environment exceeding 250 ° C. When a silicone-based resin material is used for the resist base material, changes in optical characteristics due to discoloration (decrease in reflectance and hue change in reflected light) do not occur. Furthermore, the silicone-based resin material has excellent weather resistance enough to be used for paints for outdoor buildings.

The lighting circuit 150 is disposed inside the translucent cover 110 pin 121.
Further, in the lighting circuit 150, the component 151 constituting the lighting circuit 150 is directly mounted in the empty area 1413 of the substrate 141 on which the light emitting element 142 is mounted. That is, in the light source unit 100, the number of the substrates 141 is one.
The empty area 1413 is an empty space on the substrate 141 on which the light emitting element 142 is mounted. Specifically, the back surface 1412 on the side where the light emitting element 142 is not mounted or the light emission on the side where the light emitting element 142 is mounted. An empty space at the end in the longitudinal direction of the surface 1411 or the like.

  In the case where the lighting circuit 150 is mounted on the light emitting surface 1411, the lighting circuit 150 is disposed on the light emitting surface 1411 so as not to disturb the light distribution of the light emitted from the light emitting element 142. That is, in the lighting circuit 150, the arrangement method of the components 151 is determined according to the light distribution characteristics of the light emitted from the light emitting element 142.

  Although not illustrated, the substrate 141 illustrated in FIG. 3 is provided with a through hole, and the light emitting element 142 and the lighting circuit 150 which is a power supply unit are electrically connected to each other through the through hole. Therefore, the substrate 141 illustrated in FIG. 3 can conduct the light-emitting element 142 and the lighting circuit 150 without using a wire or the like.

As shown in FIG. 3, all the components 151 may be arranged on the back surface 1412.
Further, when the components 151 are arranged on both surfaces of the substrate 141, it is preferable to arrange the high-profile components on the back surface 1412 and the low-profile components on the light emitting surface 1411 so as not to disturb the light distribution.
Further, when the high-profile component is disposed on the light emitting surface 1411 and the low-profile component is disposed on the back surface 1412, the high-profile component is preferably disposed at an end portion in the longitudinal direction of the light emitting surface 1411. In the case where the component 151 is disposed on the light emitting surface 1411 other than the end portion in the longitudinal direction, it is better not to arrange the tall component as much as possible so as not to disturb the light distribution.

  The circuit configuration of the lighting circuit 150 which is a power supply unit is an insulation type, non-insulation type, series method, switching method (single forward method, flyback method, push-pull method, half bridge method, full bridge method, step-down chopper method, booster) Chopper method).

  In the manufacturing process of the light source module 140 in which the light emitting element 142 and the lighting circuit 150 are mounted, both the light emitting surface 1411 and the back surface 1412 can be mounted in a reflow process, or only one surface can be mounted by a flow method. It is also possible to reflow the light emitting element 142 that is easily affected by temperature, and reflow the lighting circuit 150 having heat resistance first.

FIG. 4 is a schematic view of the BB cross-sectional view of FIG. 3 and shows a light source attachment body 130a.
The light source attachment body 130a shown in FIG. 4 is different from the light source attachment body 130 described in FIG. 2 in that an opening 1313 for inserting the lighting circuit 150 into the board attachment portion 131 is formed.

The substrate attachment part 131 is a plate shape to which the substrate 141 is attached in contact with the back surface 1412 of the substrate 141, and is inserted into the translucent cover 110.
The substrate attachment portion 131 is formed with an opening 1313 into which the lighting circuit 150 mounted on the back surface 1412 of the substrate 141 is inserted when the substrate 141 is attached.

The light source attachment body 130a shown in FIG. 4 has an opening 1313 in a portion corresponding to the lighting circuit 150 in the plate-like substrate attachment portion 131.
When the substrate 141 with the lighting circuit 150 mounted on the back surface 1412 is attached to the substrate attachment portion 131, the lighting circuit 150 is inserted into the opening 1313.
The substrate 141 is attached to the light source attachment 130 a by bonding the back surface 1412 to a portion other than the opening 1313 of the substrate attachment portion 131.

*** Explanation of effects according to this embodiment ***
According to the light source unit according to the present embodiment, the lighting circuit can be effectively mounted in a vacant space such as the back surface or the end of the front surface of the LED mounting substrate. The power supply function can be enhanced.

  Specifically, according to the light source unit according to the present embodiment, the mounting substrates can be integrated into one, saving space. Furthermore, since the mounting space for the power supply section is increased, the circuit configuration can be increased, for example, by arranging a circuit for providing an additional function, and the functions can be enhanced. In addition, the time for assembly can be reduced. Furthermore, the number of connectors for connecting the power supply unit and the light emitting element mounting unit and the components of the casing of the power supply unit can be reduced, resulting in cost reduction.

  In the present embodiment, the silicone-based highly reflective resist layer laid on the entire mounting surface of the substrate 141 not only protects the mounting surface of the substrate 141, but also irradiates light directly or indirectly from the light emitting element 142. Reflected at a high ratio of 90% or more can be used for illumination. Therefore, it is possible to achieve high luminance (high output). In addition, since the silicone-based high-reflection resist layer does not deteriorate due to the influence of high-temperature heat and strong light generated with the increase in luminance (high output), the high luminance (high output) can be stably maintained. It becomes possible.

*** Other configurations ***
The light source unit according to the present embodiment can be applied to a bulb-type LED lamp, an appliance-integrated LED illumination, or the like in addition to a straight tube LED lamp.

Embodiment 2. FIG.
In the present embodiment, differences from the first embodiment will be mainly described.
The light source unit 100a according to the present embodiment has a structure in which the lighting circuit 150 is housed in the first base 120a. The light source unit 100a is a double-sided power feeding method, and commercial power is applied to the caps 120a and 120b on both sides of the light source unit 100a.

*** Explanation of configuration ***
FIG. 5 is a schematic view of the light source unit 100a according to the present embodiment as viewed from the heat radiation part 132 side of the light source attachment body 130b.
FIG. 6 is a schematic diagram of the CC cross section of FIG. 5 and an enlarged schematic diagram of the groove part 134.
The light source unit 100a according to the present embodiment differs from the light source unit 100 according to the first embodiment mainly in the arrangement position of the lighting circuit 150, the point of the both-side power feeding method, and the shape of the light source attachment body 130b.
In this embodiment, components having the same functions as those described in Embodiment 1 are denoted by the same reference numerals, and the description thereof may be omitted.

As shown in FIG. 5, the lighting circuit 150 is housed inside the first base 120a.
In the present embodiment, the lighting circuit 150 is housed in only one of the first base 120a. However, a separate type lighting circuit is used as the lighting circuit 150, and the lighting circuit 150 is provided on both sides of the first base 120a and the second base 120b. The lighting circuit 150 may be accommodated.

The first base 120 a is attached to one end of the translucent cover 110.
The first base 120a houses therein a lighting circuit 150 for lighting the light emitting element 142, and is connected to the lighting circuit 150 by an electric wire 160a.
The second base 120 b is attached to the other end of the translucent cover 110.
The second base 120b is connected to the lighting circuit 150 via the electric wire 160b.
That is, the lighting circuit 150 is connected to the pin 121a of the first base 120a and the electric wire 160a, and is connected to the pin 121b of the second base 120b and the electric wire 160b. The lighting circuit 150 is supplied with power from both the pin 121a and the pin 121b.

  As shown in FIG. 5, the electric wire 160b is wired over the connecting direction from the second base 120b toward the first base 120a, that is, in the longitudinal direction.

The light source mounting body 130b differs from the light source mounting body 130 described in FIG. 2 of the first embodiment in that a pair of wall portions projecting toward the light emitting direction at both ends in the short direction of the planar substrate mounting portion 131. The point provided with 133 and the point provided with the groove part 134 in the heat radiating part 132.
The pair of wall portions 133 serve as guides when attaching the substrate 141 to the substrate attachment portion 131.

The light source attachment body 130 b attaches a substrate 141 on which the light emitting element 142 is mounted, and is housed inside the light transmitting cover 110. Further, the light source attachment body 130 b has a heat radiating portion 132 that faces the inner surface 1101 of the translucent cover 110. The heat radiating portion surface 1321 of the heat radiating portion 132 faces the inner surface 1101 of the translucent cover 110.
The light source attachment body 130b is also referred to as a heat sink.

The material of the light source mounting body 130b is a metal material such as aluminum, copper, ceramic, or magnesium, or a composite material including at least one of these metal materials, or a resin material.
The light source attachment body 130b may have a bowl shape, a triangle shape, or a polygonal cross section. Further, the light source attachment body 130b may be an H steel shape, a flat plate shape, or the like.

  In the light source mounting body 130b, a groove portion 134 is formed on the heat radiating portion surface 1321 facing the inner surface 1101 of the translucent cover 110, extending in the connecting direction from the second base 120b to the first base 120a.

The groove part 134 accommodates the electric wire 160b.
The groove section 134 has a circular cross section that cuts in the connecting direction, with a part of the circumference being a groove opening section 1341.
The width L2 of the groove opening 1341 is smaller than the circular diameter L1. That is, since the groove part 134 is formed so that the diameter of the groove opening part 1341 is smaller than the diameter inside the groove, the electric wire 160b housed inside has a structure that is difficult to come off.
The cross section of the groove 134 may be a square, a triangle, a trapezoid, a gourd or the like in addition to a circle.

  As shown in FIG. 6, the groove part 134 is formed in the vicinity of the center part of the bottom part 1322 and the side part 1323 in the heat radiation part 132. In addition, the groove part 134 may be formed in the vicinity of the bottom part 1322, the vicinity of the side part 1323, or the like.

Further, the light source attachment body 130 b includes a protruding portion 1342 that protrudes from the inner wall of the groove portion 134. The protruding portion 1342 presses the electric wire 160 b stored in the groove portion 134. However, the protruding portion 1342 may be omitted.
By the protrusion 1342 holding the electric wire 160b, the electric wire 160b stored in the groove 134 can be made more difficult to come off.

*** Explanation of effects according to this embodiment ***
According to the light source unit according to the present embodiment, a groove portion is formed in the heat radiating portion, and the electric wire is accommodated in the groove portion, so that the wiring is prevented from being messy, and the wiring looks beautiful and protects the electric wire. can do.
Further, according to the light source unit according to the present embodiment, the wiring is prevented from being hindered in the assembly work, and the manufacturing process is simplified.

Embodiment 3 FIG.
In the present embodiment, differences from Embodiments 1 and 2 will be mainly described.
In the present embodiment, the same components as those described in the first and second embodiments are denoted by the same reference numerals, and the description thereof is omitted.

*** Explanation of configuration ***
FIG. 7 is a schematic view of the light source unit 100b according to the present embodiment as viewed from the light emitting direction side, and an enlarged schematic view of the first base 120a.
The light source unit 100b according to the present embodiment has a structure in which the lighting circuit 150 is housed in the second base 120b.
The light source unit 100b is a one-sided power feeding method, and power is fed only to the pins 121b of the second base 120b in which the lighting circuit 150 is housed. The second base 120b is also referred to as a power supply base, and the pin 121b is also referred to as a power supply pin.

  In the present embodiment, the G13 type cap is exemplified and described as the first cap 120a and the second cap 120b, but the present embodiment can be applied to other caps.

No power is supplied to the pin 121a of the first base 120a, and the first base 120a has a role of a mechanical structure when the light source unit 100b is attached to the socket of the lighting fixture. Therefore, the first base 120a is also referred to as a non-power supply base, and the pin 121a is also referred to as a non-power supply pin. The first base 120a is an example of a base, and the pair of pins 121a is an example of a pair of pins.
The pair of pins 121a are electrically connected by a conductor 122a.

The first base 120 a has a pair of pins 121 a that are electrically connected via the protection element 200. The protection element 200 is a circuit protection element for protecting at least one of the light source circuit including the lighting circuit 150 and the light emitting element 142.
The protection element 200 is disposed inside one pin 121a1 of the pair of pins 121a. That is, one pin 121a1 incorporates the protection element 200.
One pin 121a1 of the pair of pins 121a has an element housing portion 1211 formed therein. The protection element 200 is disposed in the element housing portion 1211.

  The light source unit 100b includes a first base 120a, a translucent cover 110 that attaches the first base 120a to one end, a light source attachment body 130 that has the substrate 141 attached and is housed in the translucent cover 110, and a translucent cover. And a second base 120b attached to the other end of 110. The second base 120 b houses a lighting circuit 150 that lights the light emitting element 142 and supplies power to the lighting circuit 150.

Specifically, the protection element 200 is a fuse, a varistor, a PTC thermistor, an NTC thermistor, a Zener diode, or the like.
Further, as a method for housing and protecting the protection element 200 in the pin 121a1, there are a method of fixing by caulking, a method of filling the element housing portion 1211 with a fluid resin material or an adhesive, and drying and solidifying the element housing portion 1211. .

  In the present embodiment, the case where the protection element 200 is built in the pin 121a of the first base 120a has been described, but the protection element 200 may be built in the pin 121b of the second base 120b. In this case, when the lighting circuit 150 is housed in the second base 120b or the translucent cover, and the power is supplied from the second base 120b to the lighting circuit, the lighting circuit 150 is connected to the lighting circuit 150 via the protection element 200 built in the pin 121b. Power is supplied. Therefore, the lighting circuit 150 can be protected from a high voltage, a large current, or the like caused by external noise or the like.

*** Explanation of effects according to this embodiment ***
According to the base according to the present embodiment, since the protective element is already housed in the pin, the lamp assembling work is simplified and the working efficiency is improved. In addition, since the protective element is built in and fixed to the pin, the impact and vibration applied to the protective element from the outside are alleviated, and the protective element can be protected. Furthermore, since the heat generated when the protective element operates (for example, fusing) inside the element housing portion is dissipated to the outside through the pins, the first base cap housing formed of a resin material is used. There is little risk of deformation.

Embodiment 4 FIG.
In the present embodiment, differences from Embodiments 1 to 3 will be mainly described.
In the present embodiment, the same reference numerals are given to the same components as those described in the first to third embodiments, and the description thereof is omitted.

*** Explanation of configuration ***
FIG. 8 is a schematic diagram of a partial perspective view of the light source unit 100c according to the present embodiment.
FIG. 9 is a schematic diagram of an end surface of the light source unit 100c according to the present embodiment as viewed from the P1 direction.
The configuration of the light source unit 100c according to the present embodiment will be described with reference to FIGS.

  In the light source unit 100c according to the present embodiment, the differences from the first to third embodiments are that the light source mounting body 130 is composed of only the substrate mounting portion 131a and the mounting for mounting the substrate 141 to the substrate mounting portion 131a. And a metal housing 152 that houses the lighting circuit 150.

First, the configuration of the board mounting portion 131a will be described.
The light source unit 100c is a translucent cylindrical translucent cover 110 made of a resin material, and includes a translucent cover 110 that houses a substrate 141 on which the light emitting element 142 is mounted.
The board attachment portion 131 a is made of resin, and is a partition wall that is provided in the translucent cover 110 in the axial direction of the translucent cover 110 and partitions the internal space of the translucent cover 110.

In the substrate attachment portion 131a, the substrate 141 is attached to one surface 1314, and the lighting circuit 150 for lighting the light emitting element 142 is attached to the other surface 1315. The side portions 1316 on both sides of the board attachment portion 131a are fixed to the inner surface 1101 of the translucent cover 110. In other words, the board attachment portion 131a separates the internal space of the translucent cover 110 into the board 141 side and the lighting circuit 150 side. The board attaching part 131 a serves as a partition wall that separates the board 141 and the lighting circuit 150.
8 and 9, the lighting circuit 150 is housed in the metal casing 152, but the metal casing 152 may not be provided. That is, the lighting circuit 150 may be directly attached to the other surface 1315 of the board attachment portion 131a.

When the translucent cover 110 is formed using a resin material such as polycarbonate, the translucent cover 110 and the substrate attachment portion 131a may be integrally formed by a method such as an extrusion method.
Further, the board attachment portion 131a may be formed of a different type of resin material from the resin material on which the translucent cover 110 is formed. That is, the substrate mounting portion 131a that is a partition wall may be another material having performances such as flame retardancy, electrical insulation, heat shrinkability, and heat dissipation. Specifically, the translucent cover 110 is made of polycarbonate, and the board mounting portion 131a is made of polyethylene, glass, or fiber reinforced resin having a flame retardancy of 94-V0 or higher in the UL94 standard defined by United States Writers Laboratories (UL). Fiber Reinforced Plastics (FRP), glass-fiber reinforced resin (GRP), or the like may be used.
The substrate attachment portion 131 may be formed of a resin material including a thermally conductive filler. With such a configuration, the operation heat generated by the light emitting element 142 can be efficiently transmitted to the outside of the translucent cover 110. it can.

Next, an attachment method for attaching the substrate 141 to the substrate attachment portion 131a will be described.
The light source unit 100 c includes a protrusion 1102 that protrudes from the inner surface 1101 of the translucent cover 110 and presses the substrate 141 attached to one surface 1314 against the one surface 1314.
As shown in FIG. 9, a slit-like storage groove 135 that stores the substrate side portions 1414 on both sides of the substrate 141 is formed by one surface 1314 of the substrate attachment portion 131 a and the protruding portion 1102. By sliding the substrate 141 and storing the substrate side portions 1414 on both sides of the substrate 141 in the slit-shaped storage grooves 135, the substrate 141 can be attached to the substrate attachment portion 131a. The housing groove 135 allows the substrate 141 to be attached to the substrate attachment portion 131a without using an adhesive or the like.

  When the translucent cover 110 is formed using a resin material such as polycarbonate, the translucent cover 110 and the protruding portion 1102 may be integrally formed by a method such as an extrusion method.

  Further, the protruding portion 1102 may be formed of a different type of resin material from the resin material on which the translucent cover 110 is formed. The protruding portion 1102 may be formed using a highly reflective resin material (light-shielding material). With such a configuration, the light emitted from the light emitting element 142 can be efficiently taken out of the translucent cover 110. Can do.

  Further, the protruding portion 1102 may be formed of a material different from that of the translucent cover 110 and the substrate mounting portion 131a. In this case, the translucent cover 110, the substrate mounting portion 131a, and the protruding portion 1102 are multicolor extruded. It may be integrally formed by a method such as a molding method.

  As shown in FIG. 9, in the storage groove 135, the substrate mounting portion 131a and the protruding portion 1102 are not parallel, and the protruding portion 1102 is formed obliquely inward so as to face the substrate mounting portion 131a. By forming the protruding portion 1102 in this way, when the substrate 141 is stored in the storage groove 135, the substrate 141 is pressed against the substrate mounting portion 131a, and the substrate 141 and the substrate mounting portion 131a are brought into close contact with each other without any gap. be able to.

Next, the metal casing 152 will be described.
The light source unit 100 c includes a metal housing 152 that houses the lighting circuit 150, and is attached to the other surface 1315 of the board attachment portion 131 a to attach the lighting circuit 150 to the other surface 1315.
The metal casing 152 has a semi-cylindrical cross section, and the bottom surface portion 1521 is fixed to the other surface 1315 of the board attachment portion 131a. Specifically, the metal casing 152 is fixed to the other surface 1315 of the board attachment portion 131a with an adhesive or the like.
Note that the shape of the cross section of the metal casing 152 is not limited as long as the lighting circuit 150 can be covered with metal, and may be a triangle, a quadrangle, a polygon, or the like in addition to the kamaboko shape.

*** Explanation of effects according to this embodiment ***
According to the light source unit according to the present embodiment, the cost can be reduced because the translucent cover is a resin structure such as an all-around polycarbonate. In addition, since the lighting circuit can be metal-closed, there is no danger of smoke or ignition.

Further, according to the light source unit according to the present embodiment, a housing groove having a slit structure is provided inside the translucent cover, and the substrate on which the light emitting element is mounted can be easily mounted without using an adhesive or the like. This shortens the manufacturing process and reduces costs.
Since the slit structure of the storage groove is slanted, the substrate can be brought into close contact with the substrate mounting portion, and heat dissipation is improved.

  In addition, according to the light source unit according to the present embodiment, it is possible to suppress thermal expansion during lighting by adopting a resin material having excellent heat shrinkage for the partition wall that separates the lighting circuit portion and the light emitting element portion. The overall length can be kept within the standard. Further, by adopting a resin material having excellent electrical insulation and heat dissipation as the resin material for the partition wall, it is possible to improve insulation from the lighting circuit and efficiently dissipate heat generated from the light emitting element.

As mentioned above, although Embodiment 1-4 of this invention was demonstrated, you may implement combining 2 or more among these Embodiment. Alternatively, one of these embodiments may be partially implemented. Alternatively, two or more of these embodiments may be partially combined. In addition, these two embodiments may be implemented in any combination as a whole or in part.
In addition, said embodiment is an essentially preferable illustration, Comprising: It does not intend restrict | limiting the range of this invention, its application thing, and a use, A various change is possible as needed. .

  100, 100a, 100b, 100c Light source unit, 110 translucent cover, 1101 inner surface, 1102 protrusion, 120 base, 120a first base, 120b second base, 121 pin, 121a, 121a1, 121b pin, 1211 element housing portion, 122a Conductor, 124 Base housing, 130, 130a, 130b Light source mounting body, 131, 131a Substrate mounting portion, 1313 opening portion, 1314 One surface, 1315 The other surface, 1316 Side portion, 132 Heat radiation portion, 1321 Heat radiation portion Surface, 1322 Bottom, 1323 Side, 133 Wall, 134 Groove, 1341 Groove Opening, 1342 Projection, 135 Storage Groove, 140 Light Source Module, 141 Substrate, 142 Light Emitting Element, 1411 Light Emitting Surface, 1412 Back Surface, 1413 Free Space , 1414 groups Side, 150 lighting circuit, 151 parts, 152 a metal housing, 1521 bottom portion, 160,160B, 160a wire, 200 protection device.

Claims (6)

A cylindrical outer shell having translucency;
A partition wall formed using a resin material, and separating a space inside the outer shell along the cylinder axis in a cross-sectional view intersecting the cylinder axis direction of the outer shell;
A light source module disposed on one side of the partition and on one side separated in the space;
A lighting device that is disposed on one side of the partition wall and on the other separated side of the space, and that supplies power to the light source module ;
The outer shell is
A groove formed by the partition wall, an inner surface of the outer shell facing the inner space, and a protruding portion protruding from the inner surface;
The light source module is a light source unit attached to the groove . A cylindrical outer shell having translucency;
A plate-shaped partition wall that is formed inside the outer shell and is provided so as to partition the internal space across the cylinder axis direction of the outer shell;
A light source module disposed in the inner space of the outer shell in a state attached to one surface of the partition;
A lighting device that is attached to the other surface of the partition wall and lights the light source module ;
The outer shell is
A groove formed by the partition wall, an inner surface of the outer shell facing the inner space, and a protruding portion protruding from the inner surface;
The light source module is a light source unit attached to the groove . The light source module is
A light emitting element, and a substrate on which the other surface is attached to the partition wall with one face to the light emitting element is disposed possess,
The protrusion is
Formed obliquely from the inner surface toward the partition,
The substrate is
The light source unit according to claim 1, wherein the light source unit is housed in the groove and the one surface of the substrate is pressed against the partition wall by the protrusion . Said shell, said partition wall, and the projection, the light source unit according to any one of claims 1 to 3 which is integrally formed. The light source unit according to any one of claims 1 to 4 , wherein the partition wall is formed of a resin material different from a resin material forming the outer shell. The lighting device is
The light source unit according to any one of claims 1 to 5 , wherein the light source unit is disposed on the other surface of the partition wall in a state of being housed in a metal housing attached to the other surface of the partition wall.

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