JP6581540B2 - FIXING STRUCTURE, SUBSTRATE CONVEYING DEVICE, SUBSTRATE PROCESSING DEVICE, AND FIXING STRUCTURE HEIGHT ADJUSTMENT METHOD - Google Patents

Description

  The present invention relates to a fixing structure, a substrate transfer apparatus, a substrate processing apparatus, and a height adjusting method for the fixing structure.

  Conventionally, a substrate processing apparatus described in Patent Document 1 below is known. The substrate processing apparatus is a chemical mechanical polishing (CMP) apparatus that flatly polishes the surface of a substrate such as a silicon wafer, and includes a polishing unit that polishes the substrate, a cleaning unit that cleans the substrate, and a substrate A substrate transfer unit for transferring the substrate. The substrate transfer unit includes a plurality of transfer robots, and transfers the substrate by moving up and down or horizontally.

JP 2010-50436 A

The substrate transport unit includes a moving unit that moves the base member, and a substrate holding unit that is attached to the base member via an attachment member. The mounting accuracy of the mounting member with respect to the base member affects the substrate transport accuracy. Conventionally, a shim is sandwiched between the base member and the mounting member to adjust the mounting height of the mounting member relative to the base member.
However, if a shim is used, the adjustment allowance is limited by the thickness and number of shims, so that it is impossible to make fine adjustments for height adjustment or adjustments exceeding the prescribed number of shims. In addition, adjustment was impossible when there was a need for quick adjustment but there was no shim.

  The present invention has been made in view of the above problems, and a fixing structure and a substrate transport apparatus that can finely adjust the mounting height of the mounting member with respect to the base member without separately preparing an adjusting member such as a shim. An object of the present invention is to provide a substrate processing apparatus and a fixing structure height adjustment method.

  (1) A fixing structure according to an aspect of the present invention includes a base member, an attachment member attached to the base member, a height adjustment mechanism for adjusting an attachment height of the attachment member with respect to the base member, and the height A fixing mechanism that fixes the mounting member, the height of which is adjusted by a height adjusting mechanism, to the base member, and the height adjusting mechanism is provided with a plurality of screw adjusting portions provided so as to be able to protrude and retract with respect to the mounting member. Is provided.

(2) In the fixing structure described in (1) above, at least three of the screw adjustment portions may be provided.
(3) In the fixing structure described in the above (1) or (2), the fixing mechanism fixes the attachment member to the base member in an area surrounded by the plurality of screw adjusting portions. You may provide the 1st fixing | fixed part to do.
(4) In the fixing structure described in (3) above, the first fixing portion includes a screw member that is screwed into the base member, and the screw member is inserted through the mounting member. An insertion hole may be formed, and the insertion hole may include a counterbore portion for disposing the screw member below the surface of the mounting member.
(5) In the fixing structure described in the above (1) to (4), the fixing mechanism includes a cover member that covers the plurality of screw adjusting portions, and the base member that is attached to the base member via the cover member. And a second fixing portion that is fixed to the member.

  (6) A substrate transfer device according to an aspect of the present invention includes a moving unit that moves a base member, a substrate holding unit that is attached to the base member via an attachment member, and the attachment member that is fixed to the base member. A substrate transport apparatus including a fixing unit, wherein the fixing unit includes the fixing structure according to the above (1) to (5).

  (7) In the substrate transfer apparatus described in (6) above, the moving unit may be a lifting drive unit that moves the base member up and down.

  (8) A substrate processing apparatus according to an aspect of the present invention is a substrate processing apparatus including a substrate transport unit that transports a substrate, a polishing unit that polishes the substrate, and a cleaning unit that cleans the substrate. The substrate transport unit includes the substrate transport apparatus according to (6) or (7).

  (9) A height adjustment method for a fixed structure according to an aspect of the present invention includes a base member, an attachment member attached to the base member, and a plurality of screw adjustment portions provided so as to be movable in and out of the attachment member. And a first height fixing mechanism for fixing the mounting member to the base member in a region surrounded by the height adjusting mechanism for adjusting the mounting height of the mounting member with respect to the base member and the plurality of screw adjusting portions. A fixing mechanism comprising: a fixing part; a cover member that covers the plurality of screw adjustment parts; and a second fixing part that fixes the attachment member to the base member via the cover member. A height fixing method, wherein the first fixing portion temporarily fixes the mounting member to the base member so that the height can be adjusted; and after the temporary fixing step, the plurality of screws Depending on the adjustment section After the height adjusting step for adjusting the mounting height of the mounting member with respect to the base member, and after the height adjusting step, the height of the mounting member relative to the base member cannot be adjusted by the first fixing portion. After the first fixing step of fixing to the cover and the first fixing step, the cover member covers the plurality of screw adjusting portions, and the second fixing portion covers the attachment via the cover member. A second fixing step of fixing the member to the base member.

  According to the above aspect of the present invention, the fixing structure, the substrate transport apparatus, the substrate processing apparatus, and the fixing capable of finely adjusting the mounting height of the mounting member with respect to the base member without separately preparing an adjusting member such as a shim. A method for adjusting the height of the structure is obtained.

It is a top view showing the whole substrate processing device composition concerning one embodiment. It is a perspective view which shows the structure of the lifter which concerns on one Embodiment. It is a disassembled perspective view which shows the structure of the fixing structure with which the lifter which concerns on one Embodiment is provided. It is (a) top view, (b) II sectional view, and (c) II-II sectional view of the fixed structure concerning one embodiment. It is a flowchart of the height adjustment method of the fixed structure concerning one embodiment. It is explanatory drawing of the (a) temporary fix | stop process in the height adjustment method of the fixed structure which concerns on one Embodiment, and the (b) height adjustment process. It is explanatory drawing of the (a) 1st fixing process and (b) 2nd fixing process in the height adjustment method of the fixing structure which concerns on one Embodiment.

  Hereinafter, a fixing structure, a substrate transfer apparatus, a substrate processing apparatus, and a fixing structure height adjusting method according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus 1 according to an embodiment.
A substrate processing apparatus 1 shown in FIG. 1 is a chemical mechanical polishing (CMP) apparatus that flatly polishes the surface of a substrate W such as a silicon wafer. The substrate processing apparatus 1 includes a rectangular box-shaped housing 2. The housing 2 is formed in a substantially rectangular shape in plan view.

  The housing 2 includes a substrate transfer path 3 extending in the longitudinal direction at the center thereof. A load / unload unit 10 is disposed at one end of the substrate transport path 3 in the longitudinal direction. A polishing unit 20 is disposed on one side of the width direction of the substrate transport path 3 (a direction orthogonal to the longitudinal direction in plan view), and a cleaning unit 30 is disposed on the other side. A substrate transport unit 40 that transports the substrate W is provided in the substrate transport path 3. The substrate processing apparatus 1 also includes a control unit 50 (control panel) that controls operations of the load / unload unit 10, the polishing unit 20, the cleaning unit 30, and the substrate transport unit 40.

  The load / unload unit 10 includes a front load unit 11 that accommodates the substrate W. A plurality of front load portions 11 are provided on one side surface in the longitudinal direction of the housing 2. The plurality of front load portions 11 are arranged in the width direction of the housing 2. The front load unit 11 includes, for example, an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). SMIF and FOUP are sealed containers in which a cassette of the substrate W is housed and covered with a partition wall, and can maintain an environment independent of the external space.

  In addition, the load / unload unit 10 includes two transfer robots 12 that take in and out the substrates W from the front load unit 11, and a traveling mechanism 13 that causes each transfer robot 12 to travel along the front load unit 11. . Each transfer robot 12 has two hands on the upper and lower sides, and is used properly before and after the processing of the substrate W. For example, when the substrate W is returned to the front load unit 11, the upper hand is used, and when the unprocessed substrate W is taken out from the front load unit 11, the lower hand is used.

  The polishing unit 20 includes a plurality of polishing units 21 (21A, 21B, 21C, 21D) that polish (planarize) the substrate W. The plurality of polishing units 21 are arranged in the longitudinal direction of the substrate transport path 3. The polishing unit 21 includes a polishing table 23 that rotates a polishing pad 22 having a polishing surface, a top ring 24 that holds the substrate W and polishes the substrate W while pressing the substrate W against the polishing pad 22 on the polishing table 23, A polishing liquid supply nozzle 25 for supplying a polishing liquid or a dressing liquid (for example, pure water) to the polishing pad 22, a dresser 26 for dressing the polishing surface of the polishing pad 22, and a liquid (for example, pure water) And an atomizer 27 that sprays a mixed fluid or liquid (for example, pure water) of gas (for example, nitrogen gas) into a mist and sprays it onto the polishing surface.

  The polishing unit 21 presses the substrate W against the polishing pad 22 by the top ring 24 while supplying the polishing liquid onto the polishing pad 22 from the polishing liquid supply nozzle 25, and further moves the top ring 24 and the polishing table 23 relative to each other. Thus, the substrate W is polished to flatten the surface. In the dresser 26, hard particles such as diamond particles and ceramic particles are fixed to a rotating portion at the tip that comes into contact with the polishing pad 22. The dresser 26 swings while rotating the rotating portion, so that the entire polishing surface of the polishing pad 22 is covered. Dress uniformly and form a flat polished surface. The atomizer 27 cleans the polishing surface and sharpens the polishing surface by the dresser 26 that is mechanical contact, that is, polishing, by washing away polishing debris and abrasive grains remaining on the polishing surface of the polishing pad 22 with a high-pressure fluid. Achieve surface regeneration.

  The cleaning unit 30 includes a plurality of cleaning units 31 (31A, 31B) that clean the substrate W, and a drying unit 32 that dries the cleaned substrate W. The plurality of cleaning units 31 and drying units 32 are arranged in the longitudinal direction of the substrate transport path 3. A first transfer chamber 33 is provided between the cleaning unit 31A and the cleaning unit 31B. In the first transfer chamber 33, a transfer robot 35 that transfers the substrate W between the substrate transfer unit 40, the cleaning unit 31A, and the cleaning unit 31B is provided. A second transfer chamber 34 is provided between the cleaning unit 31 </ b> B and the drying unit 32. In the second transfer chamber 34, a transfer robot 36 that transfers the substrate W between the cleaning unit 31B and the drying unit 32 is provided.

  The cleaning unit 31A includes a roll sponge type cleaning module, and primarily cleans the substrate W. The cleaning unit 31B also includes a roll sponge type cleaning module, and performs secondary cleaning of the substrate W. The cleaning unit 31A and the cleaning unit 31B may be the same type or different types of cleaning modules, for example, a pencil sponge type cleaning module or a two-fluid jet type cleaning module. Good. The drying unit 32 includes, for example, a drying module that performs Rotagoni drying (IPA (Iso-Propyl Alcohol) drying). After drying, the shutter 1 a provided on the partition wall between the drying unit 32 and the load / unload unit 10 is opened, and the substrate W is taken out from the drying unit 32 by the transfer robot 12.

  The substrate transport unit 40 includes a lifter 41, a first linear transporter 42, a second linear transporter 43, and a swing transporter 44. In the substrate transport path 3, the first transport position TP1, the second transport position TP2, the third transport position TP3, the fourth transport position TP4, the fifth transport position TP5, and the sixth transport are sequentially performed from the load / unload unit 10 side. A position TP6 and a seventh transport position TP7 are set.

  The lifter 41 is a mechanism for transporting the substrate W up and down at the first transport position TP1. The lifter 41 receives the substrate W from the transport robot 12 of the load / unload unit 10 at the first transport position TP1. Further, the lifter 41 delivers the substrate W received from the transport robot 12 to the first linear transporter 42. The partition between the first transfer position TP1 and the load / unload unit 10 is provided with a shutter 1b. When the substrate W is transferred, the shutter 1b is opened and the substrate W is received by the lifter 41 from the transfer robot 12. Passed.

  The first linear transporter 42 is a mechanism that transports the substrate W among the first transport position TP1, the second transport position TP2, the third transport position TP3, and the fourth transport position TP4. The first linear transporter 42 includes a plurality of transport hands 45 (45A, 45B, 45C, 45D) and a linear guide mechanism 46 that moves each transport hand 45 in a horizontal direction at a plurality of heights. The transport hand 45A is moved between the first transport position TP1 and the fourth transport position TP4 by the linear guide mechanism 46. The transport hand 45 </ b> A is a pass hand for receiving the substrate W from the lifter 41 and delivering it to the second linear transporter 43. The transport hand 45A is not provided with a lifting drive unit.

  The transport hand 45B is moved between the first transport position TP1 and the second transport position TP2 by the linear guide mechanism 46. The transport hand 45B receives the substrate W from the lifter 41 at the first transport position TP1, and delivers the substrate W to the polishing unit 21A at the second transport position TP2. The transport hand 45B is provided with an elevating drive unit, and is raised when the substrate W is transferred to the top ring 24 of the polishing unit 21A, and is lowered after the substrate W is transferred to the top ring 24. In addition, the same raising / lowering drive part is provided also in 45 C of conveyance hands, and the conveyance hand 45D.

  The transport hand 45C is moved between the first transport position TP1 and the third transport position TP3 by the linear guide mechanism 46. The transport hand 45C receives the substrate W from the lifter 41 at the first transport position TP1, and delivers the substrate W to the polishing unit 21B at the third transport position TP3. The transfer hand 45C also functions as an access hand that receives the substrate W from the top ring 24 of the polishing unit 21A at the second transfer position TP2 and delivers the substrate W to the polishing unit 21B at the third transfer position TP3.

  The transport hand 45D is moved between the second transport position TP2 and the fourth transport position TP4 by the linear guide mechanism 46. The transport hand 45D receives the substrate W from the top ring 24 of the polishing unit 21A or the polishing unit 21B at the second transport position TP2 or the third transport position TP3, and receives the substrate W from the swing transporter 44 at the fourth transport position TP4. It functions as an access hand for passing.

  The swing transporter 44 has a hand that can move between the fourth transport position TP4 and the fifth transport position TP5, and delivers the substrate W from the first linear transporter 42 to the second linear transporter 43. . The swing transporter 44 delivers the substrate W polished by the polishing unit 20 to the cleaning unit 30. A temporary table 47 for the substrate W is provided on the side of the swing transporter 44. The swing transporter 44 places the substrate W received at the fourth transport position TP4 or the fifth transport position TP5 upside down and places it on the temporary placement table 47. The substrate W placed on the temporary placement table 47 is transferred to the first transfer chamber 33 by the transfer robot 35 of the cleaning unit 30.

  The second linear transporter 43 is a mechanism that transports the substrate W among the fifth transport position TP5, the sixth transport position TP6, and the seventh transport position TP7. The second linear transporter 43 includes a plurality of transport hands 48 (48A, 48B, 48C) and a linear guide mechanism 49 that moves each transport hand 45 horizontally at a plurality of heights. The transport hand 48A is moved between the fifth transport position TP5 and the sixth transport position TP6 by the linear guide mechanism 49. The transport hand 45A functions as an access hand that receives the substrate W from the swing transporter 44 and delivers it to the polishing unit 21C.

  The transport hand 48B moves between the sixth transport position TP6 and the seventh transport position TP7. The transport hand 48B functions as an access hand for receiving the substrate W from the polishing unit 21C and delivering it to the polishing unit 21D. The transport hand 48C moves between the seventh transport position TP7 and the fifth transport position TP5. The transport hand 48C receives the substrate W from the top ring 24 of the polishing unit 21C or the polishing unit 21D at the sixth transport position TP6 or the seventh transport position TP7, and receives the substrate W from the swing transporter 44 at the fifth transport position TP5. It functions as an access hand for passing. Although not described, the operation of the transfer hand 48 when the substrate W is transferred is the same as the operation of the first linear transporter 42 described above.

Next, the configuration of the lifter 41 according to the embodiment of the substrate transfer apparatus will be described with reference to FIGS.
FIG. 2 is a perspective view illustrating a configuration of the lifter 41 according to the embodiment. FIG. 3 is an exploded perspective view showing the configuration of the fixing structure 80 provided in the lifter 41 according to the embodiment. 4A is a plan view, FIG. 4B is a cross-sectional view taken along line II, and FIG. 4C is a cross-sectional view taken along line II-II.

  As shown in FIG. 2, the lifter 41 includes an elevating drive unit 60 (moving unit) that moves the base member 61, a mounting stage 70 (substrate holding unit) that is attached to the base member 61 via an attachment member 71, and And a fixing structure 80 (fixing portion) for fixing the attachment member 71 to the base member 61. The raising / lowering drive part 60 is a motor drive mechanism provided with a ball screw, an air cylinder, etc., and moves the base member 61 up and down. The mounting stage 70 is provided with four pins 70a on the upper surface, and the substrate W is placed on these pins 70a.

  The mounting stage 70 is arranged on the same vertical axis as the transport hand 45 of the first linear transporter 42 at the first transport position TP1. The placement stage 70 has a shape that does not overlap the transport hand 45 when viewed from the vertical direction. More specifically, the transfer hand 45 is formed with a notch 45a through which the placement stage 70 of the lifter 41 passes. This notch 45 a is formed to be slightly larger than the mounting stage 70.

  The lifter 41 receives the substrate W from the transport robot 12 at a position where the placement stage 70 is raised, and then lowers the placement stage 70 by the lift drive unit 60. When the mounting stage 70 passes the transport hand 45 of the first linear transporter, only the substrate W is mounted on the transport hand 45, and the mounting stage 70 continues to descend to a predetermined stop position. As a result, the substrate W is transferred from the lifter 41 to the first linear transporter 42.

  As shown in FIG. 3, the fixing structure 80 includes a base member 61, an attachment member 71, a height adjustment mechanism 90, and a fixing mechanism 100. The base member 61 has a substantially I shape, and a lower end thereof is fixed to the elevating drive unit 60 via a bolt 62. The base member 61 is located outside the placement stage 70. That is, the base member 61 is at a position (on the polishing unit 21 side shown in FIG. 1) that does not overlap the mounting stage 70 when viewed from the vertical direction. The attachment member 71 has a substantially inverted L shape, and is fixed to the upper surface 61 a of the base member 61.

  The attachment member 71 includes a horizontal portion 72 that extends in the horizontal direction from the upper surface 61 a of the base member 61 toward the placement stage 70. On the lower surface 72b of the horizontal portion 72, a step 72b1 that faces the front surface 61c of the base member 61 is formed. The step 72 b 1 aligns the horizontal portion 72 (attachment member 71) and the base member 61. When the attachment member 71 is attached to the base member 61, a predetermined clearance is formed between the step 72b1 and the front surface 61c. The clearance is secured in order to adjust the attachment position of the attachment member 71 with respect to the base member 61 around the vertical axis.

  The attachment member 71 includes a vertical portion 73 that is suspended downward from the tip of the horizontal portion 72. A mounting stage 70 is fixed to the lower end of the vertical portion 73. The mounting stage 70 is held by protruding from the lower end of the vertical portion 73 in the horizontal direction (on the side opposite to the base member 61). A cover member 74 is fixed to the back surface 73 d of the vertical portion 73. The cover member 74 is larger than the width of the vertical portion 73 and extends below the lower end (mounting stage 70) of the vertical portion 73. The cover member 74 prevents splashes or the like from the substrate transport path 3 side from adhering to the lifting / lowering drive unit 60.

  The height adjustment mechanism 90 includes a plurality of screw adjustment portions 91 that adjust the attachment height of the attachment member 71 with respect to the base member 61. The plurality of screw adjustment portions 91 are provided so as to be able to appear and retract with respect to the attachment member 71. As shown in FIG. 4B, the screw adjusting portion 91 (see 91 </ b> C) includes a screw hole 92 formed in the attachment member 71 and a set screw 93 that is screwed into the screw hole 92. The screw hole 92 is formed to penetrate from the upper surface 72a to the lower surface 72b of the horizontal portion 72 of the mounting member 71 in the vertical direction.

  The set screw 93 is screwed into the screw hole 92 so as to protrude toward the lower surface 72b. The set screw 93 is a hexagon socket set screw (also referred to as a grub screw). The total length L of the set screw 93 is set to be equal to or less than the thickness T of the mounting member 71 (less than the total length of the screw hole 92). That is, the set screw 93 can be completely immersed in the attachment member 71 (in the screw hole 92). The set screw 93 can project from the lower surface 72b with a stroke equal to or less than the thickness T of the mounting member 71.

  It is preferable that at least three screw adjusting portions 91 having the above-described configuration are provided. In the present embodiment, as shown in FIG. 4A, three screw adjusting portions 91 are provided at positions corresponding to the triangular corners. . The screw adjustment portion 91A is arranged on the placement stage 70 side (the upper side in the drawing in FIG. 4A). Further, the screw adjusting portions 91B and 91C are on the same straight line with an interval in the left-right direction (width direction) of the mounting member 71 on the side opposite to the placement stage 70 side (the lower side in the drawing in FIG. 4A). Is arranged. The plurality of screw adjustment portions 91 are arranged corresponding to the corners of an isosceles triangle or equilateral triangle having the screw adjustment portion 91A as a vertex.

  The plurality of screw adjustment portions 91 can be adjusted in height independently by each of the screw adjustment portions 91A, 91B, and 91C. Accordingly, not only the height of the mounting member 71 with respect to the base member 61 but also the inclination of the mounting member 71 with respect to the base member 61 can be adjusted. For example, if the protruding amount of the set screw 93 in the screw adjusting portion 91B and the screw adjusting portion 91C shown in FIG. 4B is made different, the inclination of the mounting member 71 in the left-right direction can be finely adjusted. Further, if the protruding amount of the set screw 93 in the screw adjusting portion 91A and the screw adjusting portion 91B (and the screw adjusting portion 91C) shown in FIG. 4C is made different, the mounting member 71 is moved in the front-rear direction (toward the mounting stage 70). Direction) can be finely adjusted.

  As shown in FIG. 4A, the fixing mechanism 100 includes a first fixing portion 101 that fixes the attachment member 71 to the base member 61 in the region X surrounded by the plurality of screw adjustment portions 91. The first fixing portion 101 is disposed at the center of the region X (specifically, the center of gravity of a triangle connecting a plurality of screw adjusting portions 91 with straight lines). As shown in FIG. 4B, the first fixing portion 101 includes a bolt 102 (screw member) that is screwed into the base member 61. A screw hole 63 into which the bolt 102 is screwed is formed in the upper surface 61 a of the base member 61. This bolt 102 is a hexagon socket head cap screw.

  The attachment member 71 is formed with an insertion hole 75 through which the bolt 102 is inserted. The insertion hole 75 is sized so as to ensure a clearance with which the inclination of the mounting member 71 can be adjusted by the plurality of screw adjusting portions 91 between the bolts 102 (a size that does not interfere when the mounting member 71 is inclined). It is formed with. The insertion hole 75 includes a counterbore portion 76 for arranging the bolt 102 below the upper surface 72 a (front surface) of the attachment member 71. The counterbore part 76 is formed larger than the diameter of the head part of the bolt 102 and deeper than the height of the head part of the bolt 102.

  As shown in FIG. 3, the fixing mechanism 100 includes a cover member 103 that covers the plurality of screw adjustment portions 91, and a second fixing portion 104 that fixes the attachment member 71 to the base member 61 via the cover member 103. Prepare. The cover member 103 is formed in a substantially rectangular plate shape, and has a size capable of collectively covering the plurality of screw adjusting portions 91 as shown in FIG. The cover member 103 is formed from, for example, a metal plate material. As shown in FIG. 3, the second fixing portion 104 includes a plurality of bolts 105 (second screw members) that fix the four corners of the cover member 103 to the base member 61 via the attachment member 71.

  A plurality of screw holes 64 into which a plurality of bolts 105 are screwed are formed in the upper surface 61 a of the base member 61. The attachment member 71 is formed with a plurality of insertion holes 77 through which the plurality of bolts 105 are inserted. The insertion hole 77 is formed to be slightly larger than the diameter of the threaded portion (shaft) of the bolt 105 (and relatively larger than the insertion hole 75). That is, a large clearance is formed between the insertion hole 77 and the screw portion of the bolt 105. The clearance is secured in order to adjust the attachment position of the attachment member 71 with respect to the base member 61 about the vertical axis with the first fixing portion 101 as the center.

Next, with reference to FIGS. 5 to 7, a method for adjusting the height of the fixed structure 80 having the above-described configuration (hereinafter may be referred to as the present method) will be described.
FIG. 5 is a flowchart of the height adjustment method of the fixing structure 80 according to the embodiment. FIG. 6 is an explanatory diagram of (a) the temporary fixing step S1 and (b) the height adjusting step S2 in the height adjusting method of the fixing structure 80 according to the embodiment. FIG. 7 is an explanatory diagram of (a) the first fixing step S3 and (b) the second fixing step S4 in the method for adjusting the height of the fixing structure 80 according to the embodiment.

As shown in FIG. 5, the present method includes a temporary fixing step S1, a height adjusting step S2, a first fixing step S3, and a second fixing step S4.
As shown in FIG. 6A, the temporary fixing step S <b> 1 is a step of temporarily fixing the mounting member 71 to the base member 61 so that the height can be adjusted by the first fixing portion 101. In the initial state, the set screw 93 of the screw adjusting portion 91 is completely immersed in the mounting member 71. First, the mounting member 71 in this state is placed on the upper surface 61 a of the base member 61. That is, the lower surface 72 b of the attachment member 71 is brought into contact with the upper surface 61 a of the base member 61.

  Positioning of the attachment member 71 with respect to the base member 61 is performed by a step 72b1 shown in FIG. When the screw hole 63 of the base member 61 and the insertion hole 75 of the attachment member 71 are aligned using the step 72b1, the bolt 102 is passed through the insertion hole 75 and the bolt 102 is screwed as shown in FIG. Screwed into the hole 63. At this time, the bolts 102 are loosely screwed together so as to ensure a clearance capable of adjusting the mounting height of the mounting member 71 with respect to the base member 61. That is, the bolt 102 is not brought into contact with the spot facing portion 76. Further, in the temporary fixing step S1, the attachment position of the attachment member 71 with respect to the base member 61 can be finely adjusted around the vertical axis around the temporarily fixed first fixing portion 101.

  Height adjustment process S2 is a process of adjusting the attachment height with respect to the base member 61 of the attachment member 71 by the some screw adjustment part 91, as shown in FIG.6 (b) after the said temporary fix | stop process S1. . The operator accesses the set screw 93 from the upper surface 72 a side of the mounting member 71 and rotates the set screw 93 with a tool such as a hexagon wrench, thereby causing the set screw 93 to protrude from the lower surface 72 b of the mounting member 71. Thereby, the attachment height of the attachment member 71 with respect to the base member 61 can be adjusted. That is, the lower end of the set screw 93 contacts the upper surface 61 a of the base member 61, and the lower surface 72 b of the mounting member 71 is separated from the upper surface 61 a of the base member 61.

  The adjustment by the screw adjusting portion 91 can be continuously adjusted by the protruding amount of the set screw 93, and finer adjustment is possible than the discrete adjustment with the conventional shim interposed therebetween. In addition, since the set screw 93 is provided so as to be able to protrude and retract with respect to the mounting member 71, even if it is necessary to adjust the height suddenly, the height can be adjusted immediately without preparing an adjustment member such as a shim. Is possible. Further, since a plurality of the screw adjusting portions 91 are provided, not only the height of the mounting member 71 with respect to the base member 61 but also the mounting amount of the set screw 93 in each screw adjusting portion 91 is varied. The inclination (levelness) of the member 71 can also be adjusted.

  As shown in FIG. 4A, three screw adjusting portions 91 are provided. Thus, if there are three or more screw adjustment portions 91, the posture of the attachment member 71 after height adjustment is stabilized, and the post-process operation becomes easy. Of the plurality of screw adjustment portions 91, the screw adjustment portion 91A is disposed on the placement stage 70 side, and the screw adjustment portions 91B and 91C are disposed on the opposite side to the placement stage 70 side. As shown in FIG. 1, the placement stage 70 side (substrate transport path 3 side) is the center side of the housing 2, so the worker is on the opposite side of the placement stage 70 side (polishing unit 21 side). Easy to access. For this reason, it is preferable that the arrangement of the screw adjustment unit 91 is set to be larger on the opposite side (polishing unit 21 side) to the placement stage 70 side than on the placement stage 70 side (substrate transport path 3 side). Further, since a moment load is applied to the mounting stage 70, it is preferable that the plurality of screw adjustment portions 91 be arranged so that at least the inclination of the mounting member 71 in the front-rear direction (projection direction) can be adjusted.

  In the first fixing step S3, after the height adjusting step S2, as shown in FIG. 7A, the mounting member 71 is fixed to the base member 61 so that the height cannot be adjusted by the first fixing portion 101. It is a process to do. In the first fixing step S3, the bolt 102 that has been loosely fixed in the temporary fixing step S1 is screwed into the base member 61 completely. That is, the bolt 102 is tightened until it comes into contact with the counterbore 76. This prevents the set screw 93 adjusted in the height adjusting step S2 from being loosened due to vibration or the like. Further, as shown in FIG. 4A, the first fixing portion 101 has a single bolt for fixing the mounting member 71 to the base member 61 in the region X surrounded by the plurality of screw adjusting portions 91. The plurality of screw adjustment portions 91 can be pressed substantially uniformly by 102, and loosening of the set screw 93 can be effectively prevented with a small number of parts.

  In the second fixing step S4, after the first fixing step S3, as shown in FIG. 7B, the cover member 103 covers the plurality of screw adjusting portions 91 and the second fixing portion 104 In this step, the attachment member 71 is fixed to the base member 61 via the cover member 103. In the second fixing step S4, first, the cover member 103 is placed on the upper surface 72a of the attachment member 71. Since the bolt 102 is disposed below the upper surface 72 a of the mounting member 71 by the counterbore portion 76, the bolt 102 does not interfere with the cover member 103. Next, the four corners of the cover member 103 are fixed to the base member 61 by the plurality of bolts 105 of the second fixing portion 104. Since the insertion hole 77 formed in the attachment member 71 is formed to be relatively large, for example, even if the attachment position of the attachment member 71 is adjusted around the vertical axis centering on the first fixing portion 101. The bolt 105 can be easily screwed into the screw hole 64.

  As shown in FIG. 4A, the second fixing portion 104 attaches the mounting member 71 to the base member 61 via an insertion hole 77 disposed outside the region X surrounded by the plurality of screw adjustment portions 91. Fix it. Therefore, the first fixing portion 101 and the second fixing portion 104 press the plurality of screw adjusting portions 91 substantially uniformly on both the inside and outside of the region X, and the set screw 93 is reliably prevented from loosening. The Further, as shown in FIG. 7B, the cover member 103 covers the plurality of screw adjustment portions 91, so that the polishing portion 20 is formed in a groove (a depression in the upper surface 72 a) formed by protruding the set screw 93. It is possible to prevent the liquid used in the process of being in the form of droplets and entering the water pool. Further, the cover member 103 prevents the liquid from entering the counterbore 76 where the bolt 102 is disposed and becoming a puddle. Thereby, the malfunction of the operation | movement of the lifter 41 by the said puddle can be prevented.

  As described above, according to the fixing structure 80 according to the present embodiment, the base member 61, the attachment member 71 attached to the base member 61, and the height for adjusting the attachment height of the attachment member 71 with respect to the base member 61. The adjustment mechanism 90 and the fixing mechanism 100 that fixes the attachment member 71 whose height is adjusted by the height adjustment mechanism 90 to the base member 61 are provided, and the height adjustment mechanism 90 can freely move in and out of the attachment member 71. By adopting the configuration of including a plurality of provided screw adjusting portions 91, the mounting height of the mounting member 71 with respect to the base member 61 can be finely adjusted without separately preparing an adjusting member such as a shim. .

  Although preferred embodiments of the present invention have been described and described above, it should be understood that these are exemplary of the present invention and should not be considered as limiting. Additions, omissions, substitutions, and other changes can be made without departing from the scope of the invention. Accordingly, the invention is not to be seen as limited by the foregoing description, but is limited by the scope of the claims.

  For example, in the above-described embodiment, the configuration in which three screw adjusting portions 91 are provided has been illustrated, but two screw adjusting portions 91 or four or more screw adjusting portions 91 may be provided. In consideration of the mounting stability of the mounting member 71, it is preferable to have a three-point support structure in which three screw adjusting portions 91 are provided.

  For example, in the above-described embodiment, the screw adjustment unit 91 includes the set screw 93. However, the screw adjustment unit 91 may be another screw member (such as a bolt) that is not the set screw 93. Moreover, the screw member used in the fixing mechanism 100 can be appropriately selected from known ones.

  Further, for example, in the above-described embodiment, the lifter 41 is exemplified as the substrate transport apparatus including the fixing structure 80. However, the substrate transport apparatus includes, for example, the transport robots 12, 35, 36, the first linear transporter 42, and the second It may be a linear transporter 43, a swing transporter 44, or the like.

  Further, for example, in the above-described embodiment, the configuration in which the fixing structure 80 is applied to the substrate transfer apparatus is illustrated. However, the fixing structure 80 is not limited to the substrate transfer apparatus, and other apparatuses that require accuracy in mounting height. It can also be applied to.

  DESCRIPTION OF SYMBOLS 1 ... Substrate processing apparatus, 20 ... Polishing part, 30 ... Cleaning part, 40 ... Substrate conveyance part, 41 ... Lifter (substrate conveyance apparatus), 60 ... Lifting drive part (moving part), 61 ... Base member, 70 ... Mounting Stage (substrate holding part), 71 ... Mounting member, 72a ... Upper surface (front surface), 75 ... Insertion hole, 76 ... Counterbore part, 77 ... Insertion hole, 80 ... Fixing structure (fixing part), 90 ... Height adjustment mechanism , 91 ... Screw adjusting part, 100 ... Fixing mechanism, 101 ... First fixing part, 102 ... Bolt (screw member), 103 ... Cover member, 104 ... Second fixing part, S1 ... Temporary fixing step, S2 ... High Adjustment step, S3 ... first fixing step, S4 ... second fixing step, W ... substrate, X ... region

Claims (8)

A base member;
An attachment member attached to the base member;
A height adjusting mechanism for adjusting the mounting height of the mounting member relative to the base member;
A fixing mechanism for fixing the mounting member whose height is adjusted by the height adjusting mechanism to the base member,
The height adjusting mechanism includes a plurality of screw adjusting portions provided so as to be able to protrude and retract with respect to the mounting member ,
The fixing mechanism is
A cover member covering the plurality of screw adjustment portions;
And a second fixing portion for fixing the attachment member to the base member via the cover member .   The fixing structure according to claim 1, wherein at least three screw adjusting portions are provided.   The said fixing mechanism is equipped with the 1st fixing | fixed part which fixes the said attachment member to the said base member in the area | region enclosed by these several screw adjustment parts, The Claim 1 or 2 characterized by the above-mentioned. Fixed structure. The first fixing portion includes a screw member that is screwed into the base member,
The mounting member is formed with an insertion hole through which the screw member is inserted,
The fixing structure according to claim 3, wherein the insertion hole includes a counterbore portion for disposing the screw member below a surface of the mounting member. A moving part for moving the base member;
A substrate holding part attached to the base member via an attachment member;
A substrate transport apparatus comprising: a fixing portion that fixes the mounting member to the base member;
The said fixing | fixed part is equipped with the fixing structure as described in any one of Claims 1-4 , The board | substrate conveyance apparatus characterized by the above-mentioned. The substrate transfer apparatus according to claim 5 , wherein the moving unit is an elevating drive unit that moves the base member up and down. A substrate transport section for transporting the substrate;
A polishing section for polishing the substrate;
A substrate processing apparatus comprising: a cleaning unit that cleans the substrate;
The said substrate conveyance part is equipped with the substrate conveyance apparatus of Claim 5 or 6 , The substrate processing apparatus characterized by the above-mentioned. A base member;
An attachment member attached to the base member;
A height adjusting mechanism having a plurality of screw adjusting portions provided so as to be able to protrude and retract with respect to the mounting member, and adjusting a mounting height of the mounting member with respect to the base member;
In a region surrounded by the plurality of screw adjustment portions, a first fixing portion for fixing the attachment member to the base member, a cover member covering the plurality of screw adjustment portions, and the cover member A fixing mechanism comprising: a second fixing portion that fixes the mounting member to the base member;
A temporary fixing step of temporarily fixing the mounting member to the base member so as to be height-adjustable by the first fixing portion;
After the temporary fixing step, the height adjusting step of adjusting the mounting height of the mounting member with respect to the base member by the plurality of screw adjusting portions;
After the height adjustment step, a first fixing step of fixing the attachment member to the base member so as not to be height adjustable by the first fixing portion;
After the first fixing step, the cover member covers the plurality of screw adjustment portions, and the second fixing portion fixes the attachment member to the base member via the cover member. A fixing structure height adjusting method comprising:

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