JP6565211B2 - White reflective film for mounting substrate of light emitting diode element, mounting substrate of light emitting diode element using white reflective film for mounting substrate of light emitting diode element, and lighting fixture using mounting substrate of the light emitting diode element - Google Patents

Description

The present invention relates to a white reflective film for a mounting substrate of a light emitting diode element, a mounting substrate of the light emitting diode element, and a lighting fixture using the mounting substrate of the light emitting diode element. More specifically, the light emitting diode element of the mounting substrate of the light emitting diode element White reflective film for mounting substrate of light emitting diode element, light emitting body of lighting fixture, which can improve the efficiency of extracting light from lighting fixture of light emitted by light emission of light emitting diode element by being incorporated on the side substrate surface When mounted in a lighting fixture as a light emitting diode device, the light emitting diode device mounting substrate and the light emitting diode device mounting substrate can be used to increase the efficiency of extracting light emitted from the light emitting device from the lighting device. The light illuminator emitted by the light emission of the light emitting diode element A lighting fixture that can increase the efficiency of light extraction from.

  In recent years, a light emitting diode element has been widely used as a light source for illumination, for example, because it has higher luminous efficiency than other light emitting methods and is excellent in energy saving.

  One of the light emitting diode elements is an LED. There is a method in which the LED emits light by mounting an LED chip on a wiring of a mounting substrate provided with a wiring for lighting. There is a so-called mounting substrate method.

  Conventionally, a printed wiring board used for LED mounting has not been required to have a light reflection function, but with the spread of lighting fixtures incorporating LED light sources, higher energy savings have been required. Yes.

  For example, in Patent Document 1, a laminate for a light-emitting diode-mounted flexible printed wiring board made of a white reflective film having a high light reflectance in the visible light region made of a biaxially oriented polyethylene naphthalate film including a layer containing a white pigment Body technology is disclosed. The laminate for a light-emitting diode-mounted flexible printed wiring board has various characteristics that cannot be achieved by the prior art, but the reflection characteristic of the white reflective film is that the average value of the total light relative reflectance in the wavelength region of 400 to 700 nm is 90. % Or less, and the reflection characteristic does not necessarily reach a satisfactory level.

  On the other hand, as a method for improving the reflection characteristics of a white reflective polyester film, there is known a method for improving reflection characteristics by containing fine bubbles inside the polyester film and reflecting light at the bubble interface. For example, Patent Document 2 and Patent Document 3 disclose a white reflective polyester film having excellent reflection characteristics in which the total light relative reflectance exceeds 100%. However, the white reflective polyester film disclosed in the patent document has an increased total light relative reflectance by increasing the number of interfaces of fine bubbles contained in the polyester film, so that the cavity ratio is It is high. Therefore, the apparent density of the white reflective polyester film is lowered, and as a result, the rigidity of the white reflective polyester film is reduced. Therefore, there exists a subject that the handleability at the time of processing a white reflective polyester film deteriorates.

  Therefore, the apparent density is high, the handling property when processing a film is excellent, the workability of incorporating the light emitting diode element on the light emitting diode element side substrate surface is excellent, and the light emitting diode element emits light. The present situation is that development of a white reflective film for a mounting substrate of a light emitting diode element capable of enhancing the efficiency of extracting light from a lighting fixture of light emitted from the light source is demanded.

JP 2010-212278 A JP 2014-2390 A JP 2014-159599 A

  The object of the present invention is to solve the above-mentioned problems in the prior art, has a high apparent density, excellent handleability when processing a film, and is provided on the light emitting diode element side of the mounting substrate of the light emitting diode element. It is an object of the present invention to provide a white reflective film for a mounting substrate of a light emitting diode element that can enhance the efficiency of extracting light from a lighting fixture of light emitted by light emission of the light emitting diode element by being incorporated on the substrate surface.

  Furthermore, another object of the present invention is to provide a light emitting diode element that can improve the efficiency of extracting light from the lighting fixture of light emitted by light emission of the light emitting diode device when incorporated in the lighting fixture as a light emitter of the lighting fixture. An object is to provide a mounting substrate.

  Still another object of the present invention is to provide a lighting fixture that can improve the efficiency of extracting light from the lighting fixture for light emitted by light emission of the light-emitting diode element by using the mounting substrate for the light-emitting diode element. For the purpose.

  As a result of intensive studies to solve the above problems, the present inventors have a high apparent density, excellent handling properties when processing a film, and a substrate surface on the light emitting diode element side of the mounting substrate of the light emitting diode element. The present invention has found that a white reflective film for a mounting substrate of a light-emitting diode element can be provided by incorporating the light-emitting diode element into the light-emitting diode element, which can improve the efficiency of extracting light emitted from the light fixture by the light-emitting diode element. It came to complete.

  In order to solve the above problems, the present invention has been completed by adopting a new concept that is not found in the prior art. In other words, in the prior art, it is important to increase the total light reflectance, which is the reflectance of the total reflected light reflected in all directions as measured by a spectrophotometer equipped with an integrating sphere, as the reflection characteristic of the white reflective film. Development has been underway with the concept of being. For this reason, as described above, the reflection characteristics and the handleability of the film are contradictory events.

  Therefore, the inventors of the present invention increase the light extraction efficiency of the light emitted by the light emitting diode element from the lighting fixture by incorporating a white reflective film for the mounting board on the board surface of the mounting board of the light emitting diode element. The mechanism which can do it was examined earnestly. In order to increase the light extraction efficiency of the lighting fixture of this type, it is preferable to install a light diffusion member that diffuses light from the mounting substrate of the light emitting diode element of the lighting fixture to the light output side. If the light diffusing member is not installed, most of the light emitted and emitted from the light emitting diode element is emitted to the light emitting side, so that the mounting substrate is mounted on the light emitting diode element side substrate surface of the light emitting diode element mounting substrate. Even if a white reflective film is installed, it is difficult to increase the light extraction efficiency from the lighting fixture, which is not preferable. Moreover, when a light-diffusion member is not incorporated, there also exists a subject that the so-called glare property is bad, when the luminaire is directly viewed, and it is not preferable. In order to improve the glare, a method of installing a light diffusing member for diffusing light from the mounting substrate of the light emitting diode element of the lighting fixture to the light output side is widely used. However, when the light diffusing member is installed, a part of the light emitted from the light emitting diode element is reflected by the light diffusing member and the amount of light emitted from the lighting fixture is reduced. The light extraction efficiency from so-called luminaires decreases. The reduction of the light extraction efficiency is caused by a part of the light entering the light diffusing member being reflected by the diffusing member. The reflected light travels toward the mounting substrate. The reflected light is reflected by the white reflective film for the mounting substrate installed on the surface of the mounting substrate, and is emitted again in the direction of the light diffusing member, and part of the reflected light is emitted from the lighting fixture through the light diffusing member. The Further, a part thereof is directed again toward the mounting substrate, is again reflected by the white reflective film for mounting substrate, and is emitted again toward the light diffusing member. By reducing the amount of light emitted from the luminaire caused by the light diffusing member due to the repeated reflection effect between the light diffusing member and the white reflective film for mounting substrate, so-called multiple reflection effect, It came to the idea that the light output efficiency of the light emitted from the instrument could be improved.

  If the above hypothesis is correct, the light reflected by the white reflective film for the mounting substrate will be incident on the light diffusing member when the specular reflection (regular reflection) reflected in the direction opposite to the incident angle of the incident light is high. The ratio of light to be reduced. For this reason, it is considered that the higher the diffuse reflectance reflected at various angles, the greater the multiple reflection effect, and the higher the light output efficiency of the light emitted from the luminaire. Therefore, it was considered that not only the total light reflectance that has been attracting attention in the prior art but also the contribution of diffuse reflectance was large. This is because when the diffuse reflectance is low and the specular reflectance is high, the light reflected by the white reflective film for a mounting substrate has a higher reflected light intensity in a specific direction and lowers the multiple reflection effect.

  Therefore, the present inventors have increased the diffuse reflectance, so that even if the total light reflectance is set lower than the range disclosed in the prior art, the light emitted from the luminaire is improved by improving the multiple reflection effect. There is a possibility that the light emission efficiency can be improved, and even if the cavity ratio is set lower than the level of the prior art, the light emission efficiency can be improved. It came to have a new concept of breaking through the phenomenon.

Therefore, intensive studies were conducted to verify the correctness of the new concept.
The diffuse reflectance of the reflecting member is a method of measuring the total light reflectivity using a widely used integrating sphere by measuring the remaining components obtained by removing regular reflection light by an optical trap. ing. First, the diffuse reflectance was measured by the measurement method. However, in the measurement method, in the comparison between the metallic glossy reflecting member having a high specular reflection and the white reflecting member having a high diffuse reflection, the diffuse reflectance is different from the total light reflectance, and there is a difference. It was found that the diffuse reflectance between the white reflective members having a high diffuse reflectance is almost the same as the total light reflectance and cannot be differentiated.

Therefore, the present inventors diligently studied a measurement method that can accurately evaluate the diffuse reflectance. As a method for measuring the reflection characteristics of the reflecting member, total light reflectance and specular reflectance are widely used. The present inventors considered that the diffuse reflectance can be obtained from the total light reflectance and the specular reflectance. That is, the total since light reflectance shows the reflectance combined diffusion reflectivity specular reflectance, a measure of diffuse reflective do it by dividing total light reflectance (%) in specular reflectivity (%) I thought. The present inventors have-out group Dzu above concept, to establish a method of measuring the diffuse reflectance as detailed in the Examples, the present invention has been completed.

That is, the present invention comprises the following configurations (1) to (6).
(1) A void-containing polyester-based film obtained by mixing an incompatible resin in a polyester-based resin, the content a (% by weight) of a polystyrene-based resin being an incompatible resin in the film, The polymethylpentene resin content b (% by weight) and the polypropylene resin content c (% by weight) satisfy the following formula, the total light reflectance is 80% or more, and the total light reflectance (%) is implementation of the light emitting diode device characterized by diffuse reflectance, which is calculated by dividing the specular reflectivity (%) of the 2 nonzero, and an apparent density of 0.9 to 1.4 g / cm ³ White reflective film for substrates.
0.01 ≦ a / (b + c) ≦ 1
c / b ≦ 1
3 ≦ a + b + c ≦ 20
(2) emission according to the above (1), wherein the total light reflectance (%) and diffuse reflectance complex reflectance which can be determined by adding the value of 1/3 of a the 10 0 or more White reflective film for mounting substrate of diode element.
(3) A mounting board for a light emitting diode element, wherein the white reflective film for a mounting board according to (1) or (2) is incorporated on the surface of the peripheral board of the light emitting diode element of the mounting board for the light emitting diode element. .
(4) Mounting of a light-emitting diode element, characterized in that a circuit is formed on the surface of the white reflective film for a mounting substrate according to (1) or (2), and the light-emitting diode element is fixed on the circuit. substrate.
(5) A lighting fixture in which a light diffusing member is installed on a light output surface side of a light source module including a light guide wall installed on a light output side of a mounting substrate of the light emitting diode element according to (3) or (4). The light diffusing member satisfies the following characteristics at the same time.
(I) The light distribution angle of light emitted from the light source module is 70 degrees or more. (II) The total light transmittance / parallel light transmittance ratio of the light diffusing member is 13 to 200. (6) Light emitting diode element Is lit with a non-direct current, The luminaire according to (5) above.

  The white reflective film for a mounting substrate of a light emitting diode element according to the present invention has a high apparent density, excellent handleability when processing the film, and on the light emitting diode element side substrate surface of the light emitting diode element mounting substrate. By incorporating the light, it is possible to increase the light extraction efficiency from the lighting fixture of the light emitted by the light emission of the light emitting diode element.

  In addition, when the light emitting diode element mounting substrate of the present invention is incorporated in a lighting fixture as a light emitter of the lighting fixture, the light extraction efficiency of light emitted by the light emission of the light emitting diode element can be increased. .

  Furthermore, by using the mounting substrate for the light emitting diode element, it is possible to provide a lighting fixture capable of enhancing the light extraction efficiency.

It is an example of the structure schematic diagram of the light source module in this invention. It is an example of the schematic diagram which shows how to obtain | require the opening angle of the light source module in this invention. It is a correlation diagram of the composite reflectance calculated | required from the result of Examples 1-3 and the comparative examples 1 and 2, and direct illumination intensity. The correlation figure of the diffuse reflectance calculated | required from the results of Examples 1-3 and the comparative examples 1 and 2, and direct illumination intensity. The correlation figure of the total light reflectivity calculated | required from the results of Examples 1-3 and Comparative Examples 1 and 2 and the illuminance directly below. The relationship figure of the total light transmittance / parallel light transmittance ratio calculated | required from the result of Example 2 and Experimental Examples 1-5, direct illuminance, and the maximum luminance rate. The incident light distribution angle with respect to the total luminous flux of the light emitted from the lighting fixture in the lighting fixture using various light source modules and various light diffusing members shown in Experimental Example 6, and the total light transmittance / parallel light transmittance of the light diffusing member. Diagram of the synergistic effect with the ratio.

(White reflective film for mounting substrate of light emitting diode element)
(Total light reflectance and diffuse reflectance)
The white reflective film for a mounting substrate of a light emitting diode element according to the present invention (hereinafter sometimes simply referred to as a white reflective film) has a total light reflectance of 80% or more, and diffuse reflection required by the method described in the examples. it is important to satisfy simultaneously that rate is on 2 nonzero.
In total light reflectance of 80% or more, and diffuse reflectance which can be determined by the method described in embodiment 2 nonzero on it is more preferable. The total light reflectance is more preferably 88% or more, and still more preferably 92% or more. The diffuse reflectance which can be determined by the method described in Example is, more preferably over 2 5 or more, and further preferably from the 2 8 or more. The upper limit is not limited, from the technical difficulty and the like, the total light reflectance is 10 5 hereinafter, diffuse reflectance is preferably 5 0 hereinafter. By satisfying the above range, a lighting device for light emitted by light emission of the light emitting diode element is obtained by incorporating the white reflective film for the mounting substrate of the light emitting diode element on the light emitting diode element side substrate surface of the mounting substrate of the light emitting diode element. It is preferable because the light extraction efficiency can be increased.

(Diffuse reflectance)
As described above, the diffuse reflectance of the reflecting member is measured by receiving the remaining components obtained by removing specularly reflected light with an optical trap in a widely used measuring method of total light reflectance using an integrating sphere. The method is known. However, in this measurement method, the diffuse reflectance of a metallic glossy reflective member with high specular reflectivity and a white reflective member with high diffuse reflectivity becomes a value different from the total light reflectivity. Diffuse reflectance between white reflective members having a high height is almost the same as the total light reflectance and cannot be differentiated.

Therefore, the present inventors diligently studied a measurement method that can accurately evaluate the diffuse reflectance, and established a new method for measuring the diffuse reflectance. As a method for measuring the reflection characteristics of the reflecting member, total light reflectance and specular reflectance are widely used. The present inventors considered that the diffuse reflectance can be obtained from the total light reflectance and the specular reflectance. That is, the total since light reflectance shows the reflectance of the total diffuse reflectance and specular reflectance, a measure of diffuse reflective do it by dividing total light reflectance (%) in specular reflectivity (%) Therefore, a new evaluation method described in detail in Examples was established.

(Composite reflectivity)
Mounting board white reflective film of the light emitting diode device of the present invention, total light reflectance (%) and the complex reflectance which can be determined by adding the value of 1/3 of the diffuse reflectance is the 10 0 or more Is preferred. 10 5 or more on the more preferable. The upper limit is not limited, from the technical difficulty and the like, 13 0 hereinafter is preferred.
By satisfying the above range, a white reflective film for a light emitting diode element mounting substrate is incorporated on the light emitting diode element side substrate surface of the light emitting diode element mounting substrate, thereby illuminating light emitted by light emission of the light emitting diode element. This is preferable because the light extraction efficiency from the instrument can be increased.

(Apparent density)
The white reflective film for a mounting substrate of the light emitting diode element of the present invention is preferably a white film having an apparent density of 0.9 to 1.4 g / cm ³ . The apparent density is more preferably 1.0 to 1.3 g / cm ³ . When the apparent density is less than 0.9 g / cm ³ , for example, even if it is a biaxially oriented angle polyester film, the rigidity of the film is lowered, and therefore, the handleability at the time of processing the film is deteriorated. Conversely, if it exceeds 1.3 g / cm ³ , the total light reflectance is lowered, which is not preferable.

(White film)
The white reflective film for a mounting substrate of the light emitting diode element of the present invention is not limited as long as the above characteristics are satisfied, but a biaxially oriented polyester white film is preferable from the viewpoint of economy, rigidity and heat resistance. For example, the configuration and manufacturing method of the biaxially oriented polyester white film are not limited as long as the above characteristics are satisfied. A foam-type biaxially oriented polyester white film containing fine bubbles contained in the film is preferred. For example, a white biaxially oriented angle polyester film manufactured by the following configuration and manufacturing method is preferable.

  Examples of the method of containing cavities inside the film include a method of containing a foaming agent, foaming by heat during extrusion and film formation, or foaming by chemical decomposition, a method of adding a gas such as carbon dioxide to the extruder, etc. However, as a preferred method, a method of generating a cavity by mixing an incompatible thermoplastic resin (hereinafter referred to as an incompatible resin) in a polyester resin and stretching in at least one axial direction. Can be mentioned. A method for producing a void-containing polyester film obtained by mixing an incompatible resin in a polyester resin will be described below.

  In the present invention, the polyester resin is a polymer synthesized from a dicarboxylic acid or an ester-forming derivative thereof and a diol or an ester-forming derivative thereof. Examples of the dicarboxylic acid include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalenedicarboxylic acid, or esters thereof (alkyl esters such as methyl ester) derivatives, and other known aliphatic dicarboxylic acids. . Examples of the glycol include ethylene glycol, diethylene glycol, 1,3-propanediol, 1,4-butanediol, and neopentyl glycol. Typical examples of such polyester resins include polyethylene terephthalate, polytrimethylene terephthalate, polyethylene butylene terephthalate, polyethylene-2,6-naphthalate, and the like. This polyester may be a homopolymer or a copolymer of the third component.

  In addition, other components may be copolymerized with these polyester resins as long as the object of the present invention is not impaired. Specifically, examples of the copolymer component include isophthalic acid, naphthalenedicarboxylic acid, 4,4-diphenyldicarboxylic acid, adipic acid, sebacic acid, and ester-forming derivatives thereof as dicarboxylic acid components. Examples of the diol component include diethylene glycol, hexamethylene glycol, neopentyl glycol, and cyclohexane dimethanol. Further, polyoxyalkylene glycols such as polyethylene glycol and polypropylene glycol are also included. The amount of copolymerization is preferably within 10 mol%, more preferably within 5 mol%, per repeating unit.

  In the present invention, the incompatible resin is not particularly limited, and examples thereof include polyolefin resins typified by polypropylene and polymethylpentene, various modified polyolefin resins, polystyrene resins, polyacrylic resins, and polycarbonate resins. , Polysulfone resin, cellulose resin, polyphenylene ether resin, phenoxy resin and the like. Of these, polymethylpentene resin is preferred because it is difficult to soften even at high temperatures and exhibits excellent cavity development. Moreover, in selection of an incompatible resin, it is not necessarily used alone, and two or more kinds may be used in combination. For example, in order to more uniformly and finely disperse polymethylpentene, a system in which a polypropylene resin or a polystyrene resin that is more compatible with polyester than polymethylpentene resin is used as a preferable example.

  As a particularly preferred embodiment, a case where a polystyrene resin and a polyolefin resin are used in a specific ratio, that is, a polystyrene resin / polyolefin resin is used in a mixture of 0.01 to 1, further, a polyolefin resin is used. It is preferable to use a polymethylpentene resin and a polypropylene resin, that is, a mixture of a polystyrene resin, a polymethylpentene resin and a polypropylene resin.

  In the present invention, the polystyrene-based resin refers to a thermoplastic resin containing a polystyrene structure as a basic component, and grafts or other components other than homopolymers such as atactic polystyrene, syndiotactic polystyrene, and isotactic polystyrene. Block copolymerized modified resins (for example, impact-resistant polystyrene, graft copolymers of polystyrene and polyphenylene ether, etc.), and thermoplastic resins having compatibility with these polystyrene resins, for example, mixtures with polyphenylene ether including.

  In the present invention, the polymethylpentene resin is a polymer containing units derived from 4-methylpentene-1 by 80 mol% or more, preferably 90 mol% or more, and other units include ethylene, propylene, Examples include units derived from butene-1, 3-methylbutene-1, and the like.

  In the present invention, the polypropylene resin includes homopolymers such as isotactic polypropylene and syndiotactic polypropylene, as well as modified resins obtained by grafting or block copolymerizing other components. You may use the said polypropylene resin in the state copolymerized in the said polymethylpentene, ie, the state which introduce | transduced the propylene unit as a copolymerization unit.

These resins are preferably mixed and used at a specific ratio. The content a (wt%) of the polystyrene resin in the film, the content b (wt%) of the polymethylpentene resin, and the content c of the polypropylene resin The case where (% by weight) satisfies the following formula is particularly preferable.
0.01 ≦ a / (b + c) ≦ 1
c / b ≦ 1
3 ≦ a + b + c ≦ 20

  Here, when a / (b + c) is less than 0.01, the dispersion effect of the polystyrene resin on the polyolefin resin (polymethylpentene resin and / or polypropylene resin) becomes unstable, and the unevenness and flexibility of the film are deteriorated. It may be defective and handling properties may be inferior. Conversely, when a / (b + c) is larger than 1, there is a limit to increasing the amount of generated cavities, which is not preferable.

  Similarly, when c / b exceeds 1, it is not preferable because there is a limit to increasing the amount of generated cavities. The lower limit of c / b is not particularly limited, but if it is less than 0.01, film unevenness and flexibility may be poor and handling properties may be inferior.

  Further, when a + b + c is less than 3% by weight, there is a limit to increasing the amount of cavities generated. Conversely, when a + b + c is more than 20% by weight, the inherent property of the polyester resin, that is, stretching of the film , Heat resistance, strength, rigidity and the like may be impaired, and handling properties may be deteriorated. The upper limit of a + b + c is particularly preferably 18% by weight, and the lower limit is particularly preferably 5% by weight.

  In the present invention, the void-containing polyester-based film may contain inorganic or organic particles as necessary in order to improve the concealability and the like. Examples of the particles include silica, kaolinite, talc, calcium carbonate, zeolite, alumina, barium sulfate, titanium oxide, and zinc sulfide. Although not particularly limited, titanium oxide is particularly preferably used. These particles can be contained in the film by adding them in the polyester resin and / or incompatible resin in advance.

  The amount of the particles added is not particularly limited, but is preferably 1 to 35% by weight, more preferably 2 to 30% by weight, and most preferably 3 to 25% by weight. When the amount added is less than 1% by weight, it is difficult to improve the properties such as whiteness and concealment of the film. Conversely, when the amount added is more than 35% by weight, the film breaks during stretching or powder during post-processing. Inconvenience such as occurrence may occur, which is not preferable.

  The method of mixing the polyester resin and incompatible resin, inorganic particles, etc. in the present invention is not particularly limited, and after the polyester resin and the incompatible resin are dry blended, they are put into a film forming machine as they are. Examples thereof include a method, a method in which a polyester-based resin and an incompatible resin are dry-blended and then melt-kneaded using various general kneaders to form a master batch.

  Next, although the method for forming a void-containing polyester film in the present invention will be described, it is not particularly limited thereto. In the present invention, the mixture obtained as described above is dried by a normal method, melt-extruded into a sheet form from a T-shaped die, closely adhered to a casting drum by an electrostatic application method, etc., solidified by cooling, and unstretched. A film is obtained. Next, the unstretched film is stretched and oriented. Hereinafter, the most commonly used sequential biaxial stretching method, particularly a method of stretching the unstretched film in the longitudinal direction and then in the width direction will be described as an example. In the longitudinal stretching step, stretching is performed between two or many rolls having different peripheral speeds. As a heating means at this time, a method using a heating roll or a method using a non-contact heating method may be used, and they may be used in combination, but the temperature of the film is (Tg-10 ° C) to (Tg + 100 ° C). It is preferable to be in the range. Next, the uniaxially stretched film is introduced into a tenter, and a biaxially stretched film is obtained by stretching 2.5 to 5 times at a temperature of Tg or more and Tm-10 ° C or less in the width direction (where Tg is a polyester resin). Glass transition temperature, Tm is the melting point of polyester). In addition, the biaxially stretched film is subjected to heat treatment as necessary. The heat treatment is preferably performed in a tenter, and is preferably performed in the range of Tm-60 ° C. to Tm.

  In the present invention, for improving the slipperiness of the film and other purposes, a layer made of a polyester resin or a resin layer having adhesiveness to the polyester resin is laminated on one or both sides by coextrusion. It may be. The form of the laminated film is not particularly limited. For example, the laminated form of A / B type 2 layer, B / A / B type 2 type 3 layer, A / B / C type 3 type 3 layer, etc. Can be mentioned.

(How to achieve diffuse reflectance of white film)
A method for achieving the above-described preferable range of the diffuse reflectance of the white film is not limited, but a method of laminating a mat layer on the surface of the white film is preferable. Hereinafter, a preferable structure and manufacturing method will be mentioned by taking a biaxially oriented angle polyester film-based white reflective film as an example.
The method of laminating the mat layer on the surface may be carried out by a so-called in-line method, which is carried out in the production process of the film, sheet and plate, or a process different from the production process of the film, sheet and plate, so-called You may carry out by the off-line method. Since the manufacturing cost can be reduced, the former in-line method is preferable. For example, it is a preferred embodiment that is carried out by the method described in JP-A-2000-289171.

  Examples of the inert particles contained in the mat layer of the polyester film in the present invention include titanium oxide, barium sulfate, calcium carbonate, calcium sulfate, silica, alumina, talc, kaolin, clay, and the like, or a mixture thereof. In addition, other general inorganic particles such as calcium phosphate, mica, hectorite, zirconia, tungsten oxide, lithium fluoride, calcium fluoride and other inorganic particles, styrene, acrylic, melamine, benzoguanamine And organic polymer particles such as silicone.

  The average particle diameter of the inert particles in the mat layer is preferably 0.04 to 10.0 μm, more preferably 0.1 to 8.0 μm, and particularly preferably 1.0 to 6.0 μm. If the average particle size of the inert particles is less than 0.04 μm, the formation of irregularities on the film surface becomes insufficient and the matting property tends to be insufficient, which is not preferable. Conversely, if it exceeds 10.0 μm, the particles tend to fall off the film and cause powder falling, which is not preferable.

(Light-emitting diode element mounting board)
The mounting substrate of the light-emitting diode element according to the present invention is one of the preferred implementation measures that the above-described white reflective film for mounting substrate is incorporated on the peripheral substrate surface of the light-emitting diode element of the mounting substrate of the light-emitting diode element. For example, the periphery of a light-emitting diode element on a mounting board of a rigid light-emitting diode element made of a rigid metal-clad laminate obtained by heat-press molding a prepreg impregnated with a thermosetting resin into a sheet glass substrate and a metal foil For example, there is a method of punching out the portion of the mounting board white reflective film protruding from the substrate such as the light emitting diode element portion and attaching the white reflective film on the mounting substrate with an adhesive or an adhesive.

  As a mounting substrate for the above rigid light emitting diode element, a white pigment is blended with a thermosetting resin as a sheet, or a thermoplastic resin is coated on the surface of the sheet with, for example, a reflective paint blended with a white pigment. A mounting board with improved characteristics may be used.

  The mounting substrate of the light emitting diode element according to the present invention is one of the preferred implementation measures, in which a circuit is formed on the surface of the white reflective film for the mounting substrate, and the light emitting diode element is fixed on the circuit. is there. In this method, a circuit formation method and a light emitting diode element fixing method are not limited. For example, as a circuit forming method, a method of forming by a printing method using a conductive paint can be cited. Moreover, as a fixing method of a light emitting diode element, the method of adhering with a conductive adhesive etc., the film mounting technique fixed by the solder reflow method by the local heating by a laser method, etc. are mentioned.

(Shape of mounting board of light emitting diode element)
The shape of the mounting substrate of the light emitting diode element is not limited. Any shape such as a triangle such as a regular triangle, an isosceles triangle, a right triangle, a square such as a square, a rectangle, a rhombus and a trapezoid, a polygon, a circle, an ellipse and an indefinite shape may be used. What is necessary is just to select suitably according to the design and function calculated | required as a lighting fixture.

(Light-emitting diode element on mounting board)
In this invention, the point light source which consists of point-like light emitting elements, such as a LED light source and a laser light source, is mentioned. The type of the point light source is not limited, but an LED light source that is widely spread is preferable. The kind of LED light source is not limited. For example, the bullet type LED, the surface mount type (SMD), the chip on board (COB), etc. which are widely used are mentioned. In particular, the use of surface mount type (SMD) and chip on board (COB) is preferable. A surface mount type (SMD) light source chip part may be a type with a lens in which an optical lens is incorporated. The optical lens is divided into a primary optical lens and a secondary optical lens, but either type may be used.

  The primary optical lens refers to a lens directly mounted on the light source chip, and the secondary optical lens refers to a lens mounted on the LED light source chip afterward. You may use combining both. It is preferable that a lens having a concave structure is attached as the lens because the light distribution angle of light emitted from the light source module can be increased. In particular, when the primary optical lens and the secondary optical lens are used in combination, the influence of the secondary optical lens, which is an optical lens mounted on the light output side, is large, and the secondary optical lens is preferably a concave structure lens. In this case, the primary optical lens is also preferably a concave lens, but is not limited thereto. The number of the light emitting diode elements is not limited. There may be one or more.

(lighting equipment)
The illuminating device of the present invention has a light output from a light source module in which a light guide wall is provided on the light output side of the mounting substrate of the light emitting diode element so that the light emitted and emitted from the diode element can be output to the front surface of the diode element. In the lighting fixture in which the light diffusing member is installed on the surface side, the light diffusing member preferably satisfies the following characteristics at the same time.
(1) The light distribution angle of light emitted from the light source module measured by the method described in the embodiment is 70 degrees or more. (2) Total light transmission measured by the method described in the embodiment of the light diffusing member. Ratio / parallel light transmittance ratio is 13 to 200

(Light source module)
In the light source module according to the present invention, a light guide wall is preferably provided on the light output side of the mounting substrate of the light emitting diode element so that the light emitted by the light emission of the diode element can be output to the front surface of the diode element.

  The shape of the light guide wall in the light source module is not limited, but a structure that matches the shape of the mounting substrate of the light emitting diode element is preferable. The height of the light guide wall is not limited, but is preferably 5 mm to 50 mm. In the case of 5 mm or less, even if a light diffusing member (to be described later) is installed on the light exit surface of the light guide wall, the effect of improving luminance characteristics such as a glare that is glare caused by the light emitting diode element by the light diffusing member is reduced Therefore, it is not preferable. On the other hand, if it exceeds 50 mm, the thickness of the lighting fixture will be increased, which is not preferable.

  The angle between the light guide wall and the surface of the light emitting diode element on which the light emitting diode element is mounted is not limited, but the inner angle between the surface of the light emitting diode element and the light guide wall is preferably 85 degrees or more. If it is less than 85 degrees, it may be difficult to satisfy that the light distribution angle of the light emitted from the light source module is 70 degrees or more, which is not preferable.

  An example of the structure of the light source module is shown in FIG. The light source module is not limited to this structure. It is preferable to incorporate a reflective member such as a white reflective film for a mounting substrate of the light emitting diode element of the present invention on the inner surface of the light guide wall. With this correspondence, it is possible to increase the light extraction efficiency of the light emitted from the light fixture by the light emitting diode element.

  The light guide wall may use a housing of a lighting fixture or may be incorporated in the inner surface of the housing. The material and thickness of the light guide wall are not limited. Examples thereof include metals, alloys, ceramics, and resins. Further, it is not excluded to take measures against heat dissipation by stacking a heat dissipation member on the surface opposite to the light emitting diode element installation surface of the light emitting diode element mounting board or by incorporating a heat dissipation fin. In addition, an aspect of incorporating a lighting fixture into a housing is not excluded.

(Light distribution angle of light emitted from the light source module)
In the present invention, it is preferable that the light distribution angle of light emitted from the light source module measured by the method described in the embodiment (hereinafter also simply referred to as the light output light distribution angle) is 70 degrees or more. 75 degrees or more is more preferable, and 80 degrees or more is more preferable.

  When the light distribution angle is less than 70 degrees, it is not preferable to install a light diffusing member, which will be described later, because a decrease in the amount of light emitted from the lighting fixture increases. Although an upper limit is not limited, it is about 160 degree | times from technical difficulty.

(Achieving the light distribution angle of the light emitted from the light source module)
In the present invention, the method for controlling the light distribution angle of the light emitted from the light source module to the above preferable range is not limited, but it is a preferable embodiment that the opening angle described later is at least 85 degrees in one direction. is there.

  Further, for example, a method using a light source in which an optical lens is incorporated in a light source chip portion and a light source in which a concave optical lens is incorporated is also a preferred embodiment. Furthermore, the above three methods may be combined.

(Opening angle of light source module)
In this invention, it is preferable that the opening angle calculated | required by the method described below is 100 to 170 degree | times. 105 degrees to 170 degrees is more preferable.
If it is less than 100 degrees, the incident light distribution angle is less than the above range, and the illuminance characteristics deteriorate, which is not preferable. On the other hand, if the angle exceeds 170 degrees, the light source module becomes too thin and the luminance characteristics may be deteriorated.

(How to find the opening angle of the light source module)
The opening angle is the intersection of the light emitting diode element mounting board and the light source module when the perpendicular line is drawn to the light emitting diode element mounting board on the bottom surface of the light source module. This is the minimum angle among the angles with the inner surface in all directions of the opening of the light guide wall, and is determined by the inner surface angle with the bottom surface of the light source module as shown in FIG. When the opening is a non-target shape, the minimum value of the inner surface angle in all directions is used. That is, the angle obtained by the above method at the position where the width between the center point of all directions passing through the center point of the opening of the light source module and the inner surface of the opening becomes the minimum value.

(Characteristics of light diffusion member)
The light diffusing member of the present invention preferably has a total light transmittance / parallel light transmittance ratio of 13 to 200 measured by the method described in Examples. 15-150 are more preferable and 15-100 are still more preferable. 15-80 are especially preferable and 15-60 are the most preferable.

  The total light transmittance / parallel light transmittance ratio is an evaluation scale for the degree of diffusion of transmitted light newly established by the present inventors based on the same idea as the aforementioned diffuse reflectance. That is, since the total light transmittance is a value obtained by combining the parallel light transmittance and the diffuse transmittance, the value obtained by dividing the total light transmittance by the parallel light transmittance is considered to be a measure of the diffuse transmittance. The higher the total light transmittance / parallel light transmittance ratio, the higher the diffusivity.

  When the total light transmittance / parallel light transmittance ratio is less than 13, it is not preferable because the extraction efficiency of light emitted from the lighting fixture by the above-described white reflective film for mounting substrate cannot be increased. Further, the maximum luminance is high, the improvement effect of glare is small, and the luminance unevenness is large, which is not preferable. On the other hand, when it exceeds 200, since the fall of the light quantity of the light emitted from a lighting fixture becomes large, it is not preferable.

(Type of light diffusing member)
The kind of the light diffusing member in the present invention is not limited as long as the above characteristics are satisfied. For example, a light diffusion film, a light diffusion sheet, a light diffusion plate, etc. are mentioned. Moreover, the thing of the structure which shape | molded the lens structure on the surface of the diffusion member is also accept | permitted.
A single light diffusing member may be used, or a plurality of light diffusing members may be used in combination. When a plurality of sheets are used in combination, a lens member such as a lens film may be used in combination.

(Installation location of light diffusion member)
In the present invention, the position of the light diffusing member is not limited as long as the light diffusing member is not installed on the light exit surface of the light source module. For example, it may be installed on the light exit surface of the light source module, or may be used between the light exit surface and the mounting substrate of the light emitting diode element. Further, a fixing pin for fixing the light diffusing member may be provided on the light exit surface of the light source module, and the light source module may be fixed and installed at a position floating from the light exit surface.

(Shape and thickness of light diffusion member)
In the present invention, the shape and thickness of the light diffusing member are not limited. The shape may be a flat shape, or may be a curved shape, a cubic shape, a pyramid shape, or the like. The thickness is preferably about 0.5 to 5 mm.

(Lighting method of light-emitting diode elements of lighting fixtures)
The light-emitting diode element has a problem in that the light-emitting diode element generates heat by lighting and the temperature of the element increases, and the heat is transmitted to the mounting substrate to raise the temperature of the mounting substrate. In the case of the present invention, since a polyester-based white reflective film is incorporated on the surface of the mounting substrate, compared with a prepreg or a reflective paint in which a sheet-shaped glass substrate is impregnated with a thermosetting resin used in the prior art. Since the heat resistance is inferior, in the case of a high-output light source module, there is a risk that thermal deformation or peeling of the white reflective film may occur.

  Therefore, in the present invention, it is preferable that the light emitting diode element of the lighting fixture is lit with a non-direct current. For example, an AC method or a method of lighting with a controlled pulse signal can be used. For example, a pulse current generating means for generating a pulse current having a constant frequency disclosed in Japanese Patent No. 4937973 and a pulse current for controlling the switching using the pulse current generated by the pulse current generating means as a signal current is operated. Signal current switching means for switching the signal current in the unit of period, a first circuit that constantly supplies the LED element with a rated forward current that does not damage the LED element, and a signal current distributed by the signal current distribution means It is turned on only for a certain period of time, and is equipped with a second circuit with a means for switching as described above that allows an allowable forward current corresponding to the duty ratio according to the number of distributions. By flowing the permissible forward current corresponding to the duty ratio periodically for permissible time, Preferably carried out in a manner that lights the LED element driving power supply device for driving an LED element by a current amount of the sum of I over ratio corresponding allowable forward current amount.

  This method is preferable because heat generation due to lighting of the light-emitting diode element is suppressed and the temperature rise of the mounting substrate is suppressed, so that thermal stress on the white reflective film for mounting substrate is reduced. Moreover, since the service life of a lighting fixture can be extended, it is preferable.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited by the following examples, and is implemented with appropriate modifications within a range that can be adapted to the gist of the present invention. These are all included in the technical scope of the present invention. The measurement / evaluation methods employed in the examples are as follows. In the examples, “parts” in terms of formulation and composition means “parts by mass” unless otherwise noted, and “%” means “% by mass” unless otherwise noted.

1. Total light transmittance / parallel light transmittance ratio (total light transmittance)
An integrating sphere attachment device (ISR-3100: manufactured by Shimadzu Corp.) is set in a self-recording spectrophotometer (UV-3150: manufactured by Shimadzu Corp.), and the spectrum is scanned at a high speed from 300 to 800 nm with a slit width of 12 nm. The spectrum was measured and displayed as a transmittance at 550 nm.
(Parallel light transmittance)
Using a self-recording spectrophotometer (UV-3150; manufactured by Shimadzu Corporation), the range of wavelength 300 to 800 nm was scanned at a high speed with a slit width of 12 nm, the transmission spectrum was measured, and the measurement was displayed as the transmittance at 550 nm. In, the value when measured by fixing to the sample fixing device so that the main diffusion direction of the sample is horizontal was used.
The main diffusion direction was detected by the following method.
Light was applied to the sample with a laser marker, and the diffusion direction of the emitted light was detected and determined.
The measurement is preferably performed by fixing the sample in a direction in which the light transmission directions in actual use match. In the present invention, in the case of the surface-molding or surface diffusion layer type, measurement was performed by entering light from the surface opposite to the surface molding or surface diffusion layer.
The total light transmittance measured by the above method was calculated by dividing by the parallel light transmittance. The higher the value of the total light transmittance / parallel light transmittance ratio, the higher the diffusivity.

2. Total light reflectance: An integrating sphere attachment device (ISR-3100: manufactured by Shimadzu Corporation) is set in a self-recording spectrophotometer (UV-3150: manufactured by Shimadzu Corporation), and a slit width of 12 nm and a wavelength range of 300 to 800 nm. Was scanned at a high speed to measure a reflection spectrum, and the reflectance was displayed at 550 nm.

3. Specular reflectance Reflector spectrophotometer (UV-3150: manufactured by Shimadzu Corporation) with a metal surface reflection measurement accessory (incident angle: 5 degrees, P / N 206-4046: manufactured by Shimadzu Corporation), slit The reflection spectrum was measured by scanning the range of 300 nm to 800 nm at a high speed with a width of 12 nm, and the reflectance was displayed at 550 nm.

4. Diffuse reflectance Calculated by dividing the total light reflectance (%) obtained by the above method by the specular reflectance (%) . The greater the value of the diffuse reflectance, the higher the diffuseness.

5. Composite reflectance It calculated | required by following (1) using the value of the total light reflectance (%) and diffuse reflectance which were calculated | required by the said method.
Composite reflectance = total light reflectance (%) + diffuse reflectance / 3 (1)

6. Apparent density Film was cut into 4 squares of 5.0cm square, 4 pieces were overlapped, 4 points were measured with 4 significant figures, and the total thickness was changed, 10 points were measured and 4 pieces were overlaid. The average value of thickness was calculated | required. The average value was divided by 4 and rounded to 3 significant figures to obtain an average thickness per sheet (t: μm). The weight (w: g) of the four samples was measured using an automatic upper pan balance with four significant digits, and the apparent density was determined from the following equation. The apparent density was rounded to 3 significant figures.
Apparent density (g / cm 3) = w / (5.0 × 5.0 × t × 10 ⁻⁴ × 4)

7. Bending rigidity A “KES-FB2-L large pure bending tester” (manufactured by Kato Tech Co., Ltd.) was applied to measure and evaluate the bending properties of the film (in both MD and TD directions). Five specimens of 100 mm × 100 mm are prepared for measurement, and the measurement sensitivity is SENS5 (standard). When the predetermined curvature (maximum bending curvature K = ± 0.5 cm ⁻¹ ) is given, bending stiffness B (bending curvature) The slope was ± 0.1-0.3 cm ⁻¹ ). The measurement was performed in an environment of 20 ° C. and 65% RH, and an average value of 5 sheets measured once per sheet was adopted.
It converted into the value of 188 micrometers of film thickness using the value of MD direction, and displayed.

8. Light distribution angle of light emitted from the light source module Using a variable angle illuminometer (“ZERO-ONE” manufactured by Highland), the lighting fixture is placed on the sample table of the drive system, the center point of the light source module and the sample table The center point of the light source module and the illuminometer light receiving surface are set to coincide with each other. The illuminance was measured in the above two directions. Switching between the equator line and the meridian was performed by rotating the sample stage by 90 ° about a straight line passing through the center point of the sample stage and perpendicular to the sample stage. In addition, the illuminance was measured in a dark room, and the measurement was started 30 minutes after the lighting device was turned on. A relationship diagram between the obtained measurement angle and illuminance in both directions was created, the width occupied by the illuminance position of 50% of the maximum illuminance was obtained, and the smaller angle in both directions was taken as the light distribution angle. The light distribution angle was obtained as a total angle of absolute values on the minus side and the plus side.

9. Illuminance of the luminaire Using the variable angle illuminometer (“ZERO-ONE” manufactured by Highland), the center point of the luminaire and the center point of the sample table coincide with each other on the sample table of the driving method. The distance between the luminaire light-emitting surface and the illuminometer light-receiving surface: 1000 mm, variable angle range: -90 ° to 90 ° with 5 ° pitch, the illuminance in two directions on the equator line and meridian Measurements were made. Switching between the equator line and the meridian was performed by rotating the sample stage by 90 ° about a straight line passing through the center point of the sample stage and perpendicular to the sample stage. In addition, the illuminance was measured in a dark room, and the measurement was started 30 minutes after the lighting device was turned on. The illuminance at an angle of 0 ° was taken as the direct illuminance. When the illuminance differs in the axial direction, the average value is displayed.

10. Total luminous flux of lighting fixture The total luminous flux was calculated from the illuminance data measured by the above method using calculation software attached to a variable angle illuminometer ("ZERO-ONE" manufactured by Highland).

11. Maximum luminance rate of lighting fixture The luminance was measured by the following method. The center point of the lighting device and the center point of the sample table are aligned on the sample table of the driving method of the two-dimensional 3CCD color luminance measuring device ("RISA-COLOR / ONE-II" manufactured by Highland). installed. Then, the lighting fixture was turned on and observed from directly above, and five point light sources in the light source portion were arbitrarily selected, and the luminance at the position directly above the light point source was measured. When the number of point light sources was less than 5, the luminance was measured for all light sources. The luminance was measured using a two-dimensional 3CCD color luminance measuring device (“RISA-COLOR / ONE-II” manufactured by Highland Corporation), and L1 was the one with the highest luminance. Moreover, the brightness | luminance when not installing a light-diffusion member was measured using the said two-dimensional 3CCD color brightness | luminance measuring apparatus, and the brightness | luminance was set to L2. The maximum luminance ratio was obtained by dividing the maximum luminance L1 when the light diffusing member was installed by the luminance L2 when the light diffusing member was not installed and expressed as a percentage.

  When the spot of the light point source was visible, the brightness of the spot portion was measured. However, when the diffusivity of the light diffusing member is high, the spread of the light source spot becomes large, and the spot overlapped with the spot of the adjacent light point source may become invisible. In that case, the position of the light point source spot before the light diffusing member was set in advance, and the brightness at the position directly above the light point source was measured by measuring the brightness at that position. The luminance was measured in a dark room, and the measurement was started 30 minutes after the lighting device was turned on. The maximum luminance rate is a measure of the glare when the lighting apparatus is directly viewed, and the dazzle becomes stronger as the maximum luminance rate is larger. 10% or less is preferable.

(Method for producing white reflective film)
1. White reflective film A
[Manufacture of cavity former master pellets (M1)]
A mixture of 60% by mass of a polymethylpentene resin having a melt viscosity of 1,300 poise, 20% by mass of a polypropylene resin having a melt viscosity of 2,000 poise, and 20% by mass of a polystyrene resin having a melt viscosity of 3,900 poise was mixed at 285 ° C. The mixture was supplied to a temperature-controlled vented twin screw extruder and kneaded to produce a cavity forming agent master pellet (M1).
(The melt viscosity was determined as follows. The melt viscosity at a resin temperature of 285 ° C. and a shear rate of 100 / sec was measured using a flow tester (manufactured by Shimadzu Corporation, CFT-500). Measurement of melt viscosity at 100 / sec is difficult to do at a fixed shear rate of 100 / sec, so with an appropriate load, any shear rate less than 100 / sec and above that rate The melt viscosity was measured at an arbitrary large shear rate, the melt viscosity was plotted on the vertical axis, the shear rate was plotted on the horizontal axis, and plotted on a log-log graph, the above two points were connected by a straight line, and the shear rate was 100 / sec by interpolation. The melt viscosity (unit: poise) was obtained at

[Production of titanium oxide master pellets (M2)]
Vented biaxial mixture of 50% by weight of polyethylene terephthalate resin with intrinsic viscosity of 0.62 and 50% by weight of anatase type titanium dioxide (manufactured by Fuji Titanium Co., Ltd .: TA-300) having an average particle size of 0.3 μm (electron microscope) The mixture was supplied to an extruder and kneaded to produce titanium oxide-containing master pellets (M2).
(The intrinsic viscosity was measured as follows. 0.2 g of a sample was dissolved in 50 ml of a mixed solvent of phenol / 1,1,2,2-tetrachloroethane (60/40 (weight ratio)), (Measured using an Ostwald viscometer at 30 ° C. The unit is dl / g.)

[Production of unstretched film]
The cavity forming agent master pellet (M1) 9% by weight, the titanium oxide-containing master pellet (M2) 5% by weight, and the polyethylene terephthalate resin 86% by weight with an intrinsic viscosity of 0.62 are mixed with pellets and vacuum-dried. The raw material for the containing polyester A layer was used. On the other hand, 30% by weight of the titanium oxide-containing master pellet (M2) and 70% by weight of polyethylene terephthalate resin having an intrinsic viscosity of 0.62 were mixed in a pellet and vacuum-dried to obtain a raw material for the white polyester B layer. Supply these raw materials to separate extruders, laminate the void-containing polyester A layer and white polyester B layer in the order of B / A / B, and feed block so that the thickness ratio is 10/80/10 And extruded from a T-die onto a cooling drum adjusted to 30 ° C. to produce an unstretched film having a two-layer / three-layer structure. At this time, cold air adjusted to 20 ° C. was blown onto the opposite surface of the cooling drum for cooling.

[Production of biaxially stretched film]
The obtained unstretched film is uniformly heated to 65 ° C. using a heating roll, and 3 between two pairs of nip rolls (low speed roll speed = 1 m / min, high speed roll speed = 3.4 m / min) having different peripheral speeds. Stretched 4 times. At this time, as an auxiliary heating device for the film, an infrared heater (rated 20 W / cm) provided with a gold reflective film in the middle part of the nip roll was placed facing both surfaces of the film (distance of 1 cm from the film surface) and heated. The uniaxially stretched film thus obtained was guided to a tenter, heated to 150 ° C., transversely stretched 3.7 times, fixed in width, subjected to heat treatment at 220 ° C. for 5 seconds, and further at 210 ° C. By relaxing 4% in the width direction, a void-containing polyester film having a thickness of 188 μm was obtained.

2. White reflective film B
[Production of coating liquid (C1)]
"Elastoron" (registered trademark) as a water-soluble urethane resin in which "Vylonal" (registered trademark) (manufactured by Toyobo Co., Ltd.) as a copolyester resin is 4% by weight in solid content and the terminal isocyanate group is blocked with a hydrophilic group 4% by weight (made by Daiichi Kogyo Seiyaku Co., Ltd.), “Ethosulphate salt of quaternary ammonium cation” as an antistatic agent, 7% by weight with respect to the resin component, benzoguanamine system having a particle size of 2 μm The coating solution (C1) was prepared using 4% by weight of the particles.

[Production of biaxially stretched film]
An unstretched film produced to have the same configuration as in Example 1 was uniaxially stretched by roll stretching in the same manner as in Example 1, and then the above coating solution (C1) was used, and a wire bar was used to uniaxially stretch the film. It applied so that it might become 12 g / m < ² > in a wet state on both surfaces of a stretched film, respectively, and it was made to dry for 30 second at 70 degreeC. Further, in the same manner as in Example 1 using a tenter, a void-containing polyester film having a coating layer with a thickness of 188 μm was obtained through transverse stretching, heat setting, and relaxation steps.

3. White reflective film C
[Manufacture of coating liquid (C2)]
"Elastolon" (registered trademark) as a water-soluble urethane resin in which "Vylonal" (registered trademark) (manufactured by Toyobo Co., Ltd.) as a copolymerized polyester resin is solid 2% by weight and the terminal isocyanate group is blocked with a hydrophilic group (Daiichi Kogyo Seiyaku Co., Ltd.) is 2% by weight in solids, Sumimar (registered trademark) M-50W (manufactured by Sumitomo Chemical) is 2% by weight in solids, Polystyrene sulfonate "was added to the resin component in an amount of 1.2% by weight, 8% by weight of calcium carbonate having an average particle diameter of 0.20 μm, and 4% by weight of silica having an average particle diameter of 3.5 μm. C2) was adjusted.

[Manufacture of laminated film]
The coating solution (C2) was applied to one side of a 125 μm thick white reflective film produced according to the method of the white reflective film (A) so that the thickness after drying was 6 μm using a die coating apparatus. And dried at 150 ° C. and wound up to obtain a white reflective film (C).

4). White reflective film D
Instead of the cavity forming agent master pellets (M1) used in the white reflective film A, pellets made of 100% by mass of a polymethylpentene resin having a melt viscosity of 1,300 poise are used, the discharge amount is adjusted, and the vertical and horizontal directions In the stretching step, a white reflective film D was produced in the same manner as the white reflective film A production step, except that the stretching temperature was lowered and the stretch ratio was changed to be high.

5. White reflective film E
Instead of the titanium oxide master pellet (M2) used in the white reflective film A, 50% by weight of polyethylene terephthalate resin having an intrinsic viscosity of 0.62 and 50% by weight of barium sulfate having an average particle diameter of 1.2 μm are mixed with a vent type. Supplyed to the twin screw extruder and kneaded barium sulfate-containing master pellets, adjusted the discharge rate, and in the longitudinal and transverse stretching processes, the stretching temperature was lowered and the stretching ratio was changed to a higher value. A white reflective film E was produced in the same manner as the production process of the reflective film A.

(Examples 1-3, Comparative Examples 1 and 2)
LED of mounting board painted with white reflective paint with LED chip mounted, removing Fresnel lens fitted in light emitting part of E-CORE (registered trademark) LED unit LDF5N-WGX53 / 2 manufactured by Toshiba Lighting & Technology White reflective films A to E obtained by punching the protruding portions such as the chip portion and the wiring were incorporated on the surface of the mounting substrate around the protruding portions such as the LED chip portion and the wiring, respectively (white reflective films A to C are examples 1 to 3). The white reflective films D and E correspond to Comparative Examples 1 and 2, respectively). Furthermore, on the surface of the light source module from which the Fresnel lens is removed, a polycarbonate-based resin-based light diffusion plate (Panlite (TM) 65HLW 1.5 mm) manufactured by Teijin Chemicals Limited with a total light transmittance / parallel light transmittance ratio of 178 is provided. It was installed and the illuminance and total luminous flux were measured. The measurement results are shown in Table 1. The light source module had an opening angle of 140 degrees and an incident light distribution angle of 116 degrees.
By satisfying the scope of the present invention, for the first time, the rigidity of the white reflective film is high, the handleability when processing the film is excellent, and the light emitted from the luminaire is emitted by the light emission of the light emitting diode element. It can be seen that the extraction efficiency can be increased.
Moreover, the correlation of the relationship of the composite reflectance calculated | required from the evaluation results of Examples 1-3 and Comparative Examples 1 and 2, the diffuse reflectance, the total light reflectance, and the illuminance directly below is shown in FIGS.
Composite reflectance and diffuse reflectance are less than the total light reflectance that has been widely used in the prior art, and the light extraction efficiency of light emitted from the illuminating device of light emitted by the light emission of the light-emitting diode element, that is, the illuminance directly below. It can be seen that the correlation of can be significantly increased.

(Experimental Examples 1-5)
Table 2 shows the evaluation results of the illuminance immediately below the lighting fixture and the maximum luminance rate when the diffusion member installed on the light exit surface of the lighting fixture is changed to the member shown in Table 2 in the method of Example 2.
Further, FIG. 6 shows a relational diagram 6 of the total light transmittance / parallel light transmittance ratio obtained from the evaluation results of Table 2, the illuminance directly below, and the maximum luminance rate. The illuminance just below has a maximum value. On the other hand, the maximum luminance rate becomes extremely high as the total light transmittance / parallel light transmittance ratio decreases. Therefore, it can be seen that there is an optimum range of the total light transmittance / parallel light transmittance ratio in order to achieve both the light extraction efficiency from the light luminaire and the glare.

(Experimental example 6)
The incident light distribution angle with respect to the total luminous flux of the light emitted from the lighting fixture in the lighting fixture using various light source modules and various light diffusing members incorporating the white reflective film (B) used in Example 2 The result of the synergistic effect with the total light transmittance / parallel light transmittance ratio of the light diffusing member is shown in FIG. The vertical axis in FIG. 7 indicates the rate of change of the total luminous flux. In other words, the values are shown as relative values when the total luminous flux value when the light diffusing member is not incorporated is 100%. Therefore, it is a measure of the change in the light extraction efficiency from the luminaire by incorporating the light diffusing member. Therefore, it can be said that the higher the value, the higher the light extraction efficiency. In the case of exceeding 100%, it is indicated that the light extraction efficiency increases rather by the incorporation of the diffusing member. In the case of the lighting fixture used in Examples 1 to 3 having an incident light distribution angle of 116 degrees, it may exceed 100%. In general, when a light diffusing member is installed, a part of the light emitted from the light emitting diode element is reflected by the light diffusing member and the amount of light emitted from the lighting fixture is reduced. The light extraction efficiency from so-called luminaires decreases. The reduction of the light extraction efficiency is caused by a part of the light entering the light diffusing member being reflected by the light diffusing member. The reflected light travels toward the mounting substrate. In the method of the present invention, a white reflective film for a mounting substrate is provided on the surface of the mounting substrate. Therefore, the light reflected by the light diffusing member is reflected by the white reflective film for the mounting substrate and is emitted again in the direction of the light diffusing member, and a part of the light is emitted from the lighting fixture through the light diffusing member. The Further, a part thereof is directed again toward the mounting substrate, is again reflected by the white reflective film for mounting substrate, and is emitted again toward the light diffusing member. It is thought that this is caused by the action of repeating the reflection action between the light diffusing member and the white reflective film for mounting substrate, that is, the so-called multiple reflection effect. This is the effect that forms the basis of the present invention.

  It can be seen that as the incident light distribution angle becomes narrower, the degree of decrease in light extraction efficiency increases even when a diffusing member having a preferable total light transmittance / parallel light transmittance ratio is used. In particular, when the ratio of the total light transmittance / parallel light transmittance of the light diffusing member is increased in order to express the improvement effect of the glare property greatly, the degree of decrease becomes large. Therefore, it can be said that satisfying both that the light distribution angle is 70 degrees or more and that the total light transmittance / parallel light transmittance ratio is 13 to 200 is a more preferable embodiment.

Example 4
A lighting circuit is formed by printing on the surface of the white reflective film B with conductive ink, and 10 LED elements are fixed in 5 rows on the circuit with a conductive adhesive, and the LED element and the opposite end face are formed on the surface of an aluminum plate having a thickness of 1 mm. The film was laminated with an adhesive and lighted by a method according to Example 1 of Japanese Patent No. 4937973. The surface temperature of the white reflective film after 1 hour was 51 degrees.

(Experimental example 7)
In the method of Example 4, it was lit so as to have the same illuminance as Example 4 by the direct current method. The surface temperature of the white reflective film after 1 hour was 85 degrees.

The white reflective film for a mounting substrate of a light emitting diode element according to the present invention has a high apparent density, excellent handleability when processing the film, and on the light emitting diode element side substrate surface of the light emitting diode element mounting substrate. By incorporating the light, it is possible to increase the light extraction efficiency from the lighting fixture of the light emitted by the light emission of the light emitting diode element.
In addition, when the light emitting diode element mounting substrate of the present invention is incorporated in a lighting fixture as a light emitter of the lighting fixture, the light extraction efficiency of light emitted by the light emission of the light emitting diode element can be increased. .
Furthermore, the light extraction efficiency of the lighting fixture can be increased by using the mounting substrate of the light emitting diode element.
Therefore, the contribution to the industry is great.

Claims (6)

A void-containing polyester-based film obtained by mixing an incompatible resin in a polyester-based resin, the content a (% by weight) of a polystyrene-based resin being an incompatible resin in the film, polymethylpentene The resin content b (% by weight) and the polypropylene resin content c (% by weight) satisfy the following formula, the total light reflectance is 80% or more, and the total light reflectance (%) is the specular reflectance. (%) by dividing the diffuse reflectance obtained is 2 nonzero on, and the light emitting diode mounting substrate for white element apparent density, characterized in that a 0.9 to 1.4 g / cm ³ Reflective film.
0.01 ≦ a / (b + c) ≦ 1
c / b ≦ 1
3 ≦ a + b + c ≦ 20 Implementation of the light emitting diode device of claim 1, the total light reflectance (%) and is obtained by adding the value of 1/3 of the diffuse reflectance complex reflectivity is equal to or is on the 10 0 or more White reflective film for substrates.   A mounting substrate for a light-emitting diode element, wherein the white reflective film for a mounting board according to claim 1 or 2 is incorporated on the surface of the peripheral substrate of the light-emitting diode element of the mounting substrate for the light-emitting diode element.   A circuit board is formed on the surface of the white reflective film for a mounting board according to claim 1 or 2, and the light emitting diode element is fixed on the circuit. 5. A lighting device comprising a light diffusing member disposed on a light exit surface side of a light source module comprising a light guide wall disposed on a light exit side of a light emitting diode element mounting substrate according to claim 3, wherein the light diffusing member is provided. The lighting apparatus characterized by the member satisfy | filling the following characteristics simultaneously.
(1) The light distribution angle of the light emitted from the light source module is 70 degrees or more. (2) The total light transmittance / parallel light transmittance ratio of the light diffusing member is 13 to 200.   The lighting device according to claim 5, wherein the light emitting diode element is turned on with a non-direct current.