JP6556173B2 - Piezoelectric thin film resonator, filter and multiplexer - Google Patents

Description

  The present invention relates to a piezoelectric thin film resonator, a filter, and a multiplexer, and relates to a piezoelectric thin film resonator, a filter, and a multiplexer having an insertion film inserted between a lower electrode and an upper electrode.

  Elastic wave devices using piezoelectric thin film resonators are used as filters and multiplexers in wireless devices such as mobile phones. The piezoelectric thin film resonator has a laminated film in which the lower electrode and the upper electrode face each other with the piezoelectric film interposed therebetween. A region where the lower electrode and the upper electrode face each other with the piezoelectric film interposed therebetween is a resonance region.

  With the rapid spread of wireless systems, many frequency bands are being used. As a result, there is an increasing demand for sharpening the skirt characteristics of filters and duplexers. One measure to sharpen the skirt characteristics is to increase the Q value of the piezoelectric thin film resonator.

  It is known to provide a ring band on one surface of the upper electrode and the lower electrode (for example, Patent Document 1). It is known to provide an insertion film inserted into a piezoelectric film in the outer peripheral region of the resonance region (for example, Patent Document 2). It is known to provide an annular band called a bridge in a piezoelectric film (for example, Patent Document 3).

JP 2006-109472 A JP 2014-161001 A U.S. Pat. No. 9,048,812

  According to Patent Documents 1 to 3, leakage of elastic wave energy from the resonance region can be suppressed, and the Q value can be improved. However, leakage of elastic wave energy from the resonance region cannot be sufficiently suppressed.

  The present invention has been made in view of the above problems, and an object thereof is to improve the performance of a piezoelectric thin film resonator.

The present invention comprises a substrate;
A piezoelectric film provided on the substrate, a lower electrode and an upper electrode facing each other with at least a part of the piezoelectric film interposed therebetween, and at least two types of layers provided in or on the substrate and having different air gaps or different acoustic characteristics An acoustic reflection layer including an acoustic reflection film laminated, and inserted between the lower electrode and the upper electrode, the lower electrode and the upper electrode face each other with the piezoelectric film interposed therebetween, and the piezoelectric film and the Provided in an outer peripheral region defined in a region defined by a region where the lower electrode, the upper electrode and the acoustic reflection layer overlap, and at least a part of the resonance region surrounding the resonance region, and the resonance region The first film thickness in the resonance region is smaller than the second film thickness outside the resonance region, and the insertion film is the first film thickness. The first region is In the resonance region, at least a portion surrounding the central region includes the outer periphery of the resonance region and is provided along the outer periphery, and the second region in which the insertion film is the second film thickness is outside the resonance region. An outer periphery of the first region and provided along the outer periphery including the outer periphery of the resonance region; the piezoelectric film and the acoustic reflection layer overlap in the second region; and the insertion film of the first film thickness and the first film The insertion film of two thicknesses is made of the same material, and the acoustic impedance of the insertion film is a piezoelectric thin film resonator smaller than the acoustic impedance of the piezoelectric film.

In the above configuration, the wave number of the transverse mode in the central region at the anti-resonance frequency of the resonance region is smaller than the wave number of the transverse mode in the first region , and the second region outside the resonance region at the anti-resonance frequency of the resonance region. The transverse mode wave number of the first region may be smaller than the transverse mode wave number of the first region .

In the above configuration, the piezoelectric film includes a lower piezoelectric film and an upper piezoelectric film provided on the lower piezoelectric film, and the insertion film is inserted between the lower piezoelectric film and the upper piezoelectric film . It can be.

  In the above configuration, the insertion film having the first film thickness and the insertion film having the second film thickness may be in contact with each other.

In the above-described configuration, the insertion film having the first film thickness and the insertion film having the second film thickness can be separated from each other in the thickness direction.

  The present invention is a filter including the piezoelectric thin film resonator.

  The present invention is a multiplexer including the filter.

  According to the present invention, the performance of the piezoelectric thin film resonator can be improved.

FIG. 1A is a plan view of the piezoelectric thin film resonator according to the first embodiment, and FIGS. 1B and 1C are cross-sectional views taken along line AA of FIG. FIG. 2 is a plan view illustrating the positional relationship between the resonance region, the insertion film, and the gap in the vicinity of the resonance region of the piezoelectric thin film resonator according to the first embodiment. FIGS. 3A to 3D are cross-sectional views (part 1) illustrating the method for manufacturing the series resonator according to the first embodiment. 4A to 4C are cross-sectional views (part 2) illustrating the method for manufacturing the series resonator according to the first embodiment. FIG. 5A to FIG. 5C are diagrams showing cross-sectional structures of Comparative Examples 1 and 2 and Example 1 in which simulation was performed. FIG. 6 is a diagram illustrating a Q value with respect to frequency in Comparative Examples 1 and 2 and Example 1. FIG. 7A is a diagram showing the dispersion characteristics of the transverse mode in Example 1, and FIG. 7B is an enlarged view of a range A in FIG. 7A. FIGS. 8A to 8C are cross-sectional views of the piezoelectric thin film resonators according to the first embodiment and the first and second modifications of the first embodiment, respectively. FIGS. 9A to 9D are cross-sectional views of piezoelectric thin film resonators according to modifications 3 to 6 of the first embodiment, respectively. FIG. 10A to FIG. 10D are cross-sectional views of a seventh modification of the first embodiment. FIG. 11A to FIG. 11C are cross-sectional views of Modification 8 of Embodiment 1. FIG. 12A to 12C are cross-sectional views according to modified examples 9 to 11 of the first embodiment, respectively. FIG. 13A is a cross-sectional view of the piezoelectric thin film resonator of the second embodiment, and FIG. 13B is a cross-sectional view of the piezoelectric thin film resonator of the first modification of the second embodiment. FIG. 14A is a circuit diagram of a filter according to the third embodiment, and FIG. 14B is a circuit diagram of a duplexer according to a modification of the third embodiment.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1A is a plan view of the piezoelectric thin film resonator according to the first embodiment, and FIGS. 1B and 1C are cross-sectional views taken along line AA of FIG. FIG. 1B shows a series resonator of a ladder filter, for example, and FIG. 1C shows a parallel resonator of a ladder filter, for example.

  The structure of the series resonator S will be described with reference to FIGS. 1 (a) and 1 (b). A lower electrode 12 is provided on a substrate 10 which is a silicon (Si) substrate. A gap 30 having a dome-like bulge is formed between the flat main surface of the substrate 10 and the lower electrode 12. The dome-shaped bulge is a bulge having a shape such that, for example, the height of the gap 30 is small around the gap 30 and the height of the gap 30 increases toward the inside of the gap 30. The lower electrode 12 includes a lower layer 12a and an upper layer 12b. The lower layer 12a is, for example, a Cr (chromium) film, and the upper layer 12b is, for example, a Ru (ruthenium) film.

  On the lower electrode 12, a piezoelectric film 14 mainly composed of aluminum nitride (AlN) whose main axis is the (002) direction is provided. The piezoelectric film 14 includes a lower piezoelectric film 14a and an upper piezoelectric film 14b. An insertion film 28 is provided between the lower piezoelectric film 14a and the upper piezoelectric film 14b.

  The upper electrode 16 is provided on the piezoelectric film 14 so as to have a region (resonance region 50) facing the lower electrode 12 with the piezoelectric film 14 interposed therebetween. The resonance region 50 has an elliptical shape and is a region in which elastic waves in the thickness longitudinal vibration mode resonate. The upper electrode 16 includes a lower layer 16a and an upper layer 16b. The lower layer 16a is, for example, a Ru film, and the upper layer 16b is, for example, a Cr film.

  The insertion film 28 is provided in the regions 52 and 54 and is not provided in the central region of the resonance region 50. The region 52 corresponds to at least a part of the outer peripheral region of the resonance region 50. The region 54 is provided outside the resonance region 50. The region 52 is a region where the thin insertion film 28a is inserted into the piezoelectric film 14 and overlaps the gap 30 in plan view. The region 54 is a region where the thick insertion film 28b is inserted into the piezoelectric film 14 and overlaps the gap 30 in plan view.

  A frequency adjusting film such as a silicon oxide film and / or a passivation film may be formed on the upper electrode 16. The laminated film in the resonance region 50 includes the lower electrode 12, the piezoelectric film 14, and the upper electrode 16.

  As shown in FIG. 1A, the lower electrode 12 is formed with an introduction path 33 for etching the sacrificial layer. The sacrificial layer is a layer for forming the gap 30. The vicinity of the distal end of the introduction path 33 is not covered with the piezoelectric film 14, and the lower electrode 12 has a hole 35 at the distal end of the introduction path 33.

    The structure of the parallel resonator P will be described with reference to FIG. Compared with the series resonator S, the parallel resonator P is provided with a mass load film 20 made of a Ti (titanium) layer between the lower layer 16a and the upper layer 16b of the upper electrode 16. Thus, the laminated film includes the mass load film 20 formed on the entire surface in the resonance region 50 in addition to the laminated film of the series resonator S. The difference in resonance frequency between the series resonator S and the parallel resonator P is adjusted using the film thickness of the mass load film 20. Other configurations are the same as those of the series resonator S shown in FIG.

In the case of a piezoelectric thin film resonator having a resonance frequency of 2 GHz, the lower layer 12a of the lower electrode 12 is a Cr film having a thickness of 100 nm, and the upper layer 12b is a Ru film having a thickness of 200 nm. The piezoelectric film 14 is an AlN film having a thickness of 1200 nm. The insertion films 28a and 28b are SiO ₂ (silicon oxide) films having a thickness of 150 nm and 300 nm, respectively. The insertion film 28 is provided at the center of the piezoelectric film 14 in the film thickness direction. The lower layer 16a of the upper electrode 16 is a Ru film having a thickness of 230 nm, and the upper layer 16b is a Cr film having a thickness of 50 nm. The frequency adjustment film is a silicon oxide film having a thickness of 50 nm. The mass load film 20 is a Ti film having a thickness of 120 nm. The film thickness of each layer can be set as appropriate in order to obtain desired resonance characteristics.

  As described in Patent Document 2, the Young's modulus of the insertion film 28 is preferably smaller than that of the piezoelectric film 14. If the densities are substantially the same, the Young's modulus correlates with the acoustic impedance, so that the acoustic impedance of the insertion film 28 is preferably smaller than that of the piezoelectric film 14. Thereby, the Q value can be improved. Further, in order to make the acoustic impedance of the insertion film 28 smaller than that of the piezoelectric film 14, when the piezoelectric film 14 is mainly composed of aluminum nitride, the insertion film 28 includes an Al (aluminum) film, an Au (gold) film, and a Cu (copper). ) Film, Ti film, Pt (platinum) film, Ta (tantalum) film, Cr film or silicon oxide film. In particular, from the viewpoint of Young's modulus, the insertion film 28 is preferably an Al film or a silicon oxide film.

  As the substrate 10, in addition to the Si substrate, a sapphire substrate, an alumina substrate, a spinel substrate, a quartz substrate, a glass substrate, a ceramic substrate, a GaAs substrate, or the like can be used. As the lower electrode 12 and the upper electrode 16, in addition to Ru and Cr, a single layer film such as Al, Ti, Cu, Mo (molybdenum), W (tungsten), Ta, Pt, Rh (rhodium) or Ir (iridium) Alternatively, a stacked film of these can be used. For example, the lower layer 16a of the upper electrode 16 may be Ru and the upper layer 16b may be Mo.

In addition to aluminum nitride, the piezoelectric film 14 may be made of ZnO (zinc oxide), PZT (lead zirconate titanate), PbTiO ₃ (lead titanate), or the like. In addition, for example, the piezoelectric film 14 may contain aluminum nitride as a main component and may contain other elements for improving resonance characteristics or piezoelectricity. For example, the piezoelectricity of the piezoelectric film 14 is improved by using two elements of Sc (scandium), a divalent element and a tetravalent element, or two elements of a divalent element and a pentavalent element as additive elements. To do. For this reason, the effective electromechanical coupling coefficient of the piezoelectric thin film resonator can be improved. The divalent element is, for example, Ca (calcium), Mg (magnesium), Sr (strontium), or Zn (zinc). The tetravalent element is, for example, Ti, Zr (zirconium) or Hf (hafnium). The pentavalent element is, for example, Ta, Nb (niobium) or V (vanadium). Further, the piezoelectric film 14 may contain aluminum nitride as a main component and B (boron).

  As the frequency adjustment film, a silicon nitride film, aluminum nitride, or the like can be used in addition to the silicon oxide film. As the mass load film 20, in addition to Ti, a single layer film such as Ru, Cr, Al, Cu, Mo, W, Ta, Pt, Rh or Ir can be used. For example, an insulating film made of metal nitride or metal oxide such as silicon nitride or silicon oxide can be used. In addition to the layer between the upper electrodes 16 (between the lower layer 16 a and the upper layer 16 b), the mass load film 20 is disposed below the lower electrode 12, between the lower electrodes 12, above the upper electrode 16, and between the lower electrode 12 and the piezoelectric film 14. Or between the piezoelectric film 14 and the upper electrode 16. The mass load film 20 may be larger than the resonance region 50 as long as it is formed so as to include the resonance region 50.

  FIG. 2 is a plan view illustrating the positional relationship between the resonance region, the insertion film, and the gap in the vicinity of the resonance region of the piezoelectric thin film resonator according to the first embodiment. In FIG. 2, the length ratio is not necessarily the same as in FIGS. 1A to 1C for easy understanding.

  In FIG. 1B to FIG. 2, an outer contour 60 that is an outer contour of the resonance region 50, an outer peripheral region of the resonance region 50, and an inner contour 62 of a region 52 in which the thin insertion film 28 a is inserted into the piezoelectric film 14. The outer outline 64 of the region 54 where the thick insertion film 28 b is inserted into the piezoelectric film 14 and overlaps the gap 30 and the outer outline 66 of the gap 30 are illustrated. Of the region surrounding the resonance region 50, a lead region 70 for drawing the upper electrode 16 from the resonance region 50 and a region 72 other than the lead region 70 among the regions surrounding the resonance region 50 are shown.

  In each film, when the end surface is inclined or curved in the film thickness direction, the outer contour is the outermost of the inclined or curved end surfaces, and the inner contour is the innermost of the inclined or curved end surfaces. The term “substantially coincides with” means that, for example, it coincides with the variation in the manufacturing process and the matching accuracy in the manufacturing process.

  In the extraction region 70, the outer contour of the lower electrode 12 becomes the outer contour 60 of the resonance region 50. In the region 72, the outer contour of the upper electrode 16 becomes the outer contour 60 of the resonance region 50.

  In the extraction region 70, a thick insertion film 28 b is provided under the upper electrode 16. Since the region 54 overlaps the gap 30, the outer contour 64 of the region 54 and the outer contour 66 of the void 30 substantially coincide with each other. In the region 72, the outer contour 66 of the gap 30 is located outside the outer contour 64 of the region 54. In the extraction region 70 and the region 72, the outer contour of the region 52 substantially matches the outer contour 60 of the resonance region 50. The region 54 is provided outside and in contact with the region 52. The regions 52 and 54 are provided in an annular shape. The width of the region 52 is substantially the same, and the width of the region 54 is substantially the same.

FIGS. 3A to 4C are cross-sectional views illustrating a method for manufacturing the series resonator according to the first embodiment. As shown in FIG. 3A, a sacrificial layer 38 for forming a void is formed on the substrate 10 having a flat main surface. The thickness of the sacrificial layer 38 is, for example, 10 to 100 nm, and is selected from materials that can be easily dissolved in an etching solution or etching gas such as MgO (magnesium oxide), ZnO, Ge (germanium), or SiO ₂ (silicon oxide). The Thereafter, the sacrificial layer 38 is patterned into a desired shape using a photolithography technique and an etching technique. The shape of the sacrificial layer 38 is a shape corresponding to the planar shape of the air gap 30, and includes a region that becomes the resonance region 50, for example. Next, the lower layer 12 a and the upper layer 12 b are formed as the lower electrode 12 on the sacrificial layer 38 and the substrate 10. The sacrificial layer 38 and the lower electrode 12 are formed by using, for example, a sputtering method, a vacuum evaporation method, or a CVD (Chemical Vapor Deposition) method. Thereafter, the lower electrode 12 is patterned into a desired shape using a photolithography technique and an etching technique. The lower electrode 12 may be formed by a lift-off method.

  As shown in FIG. 3B, the lower piezoelectric film 14a is formed on the lower electrode 12 and the substrate 10 by using, for example, a sputtering method, a vacuum evaporation method, or a CVD method. As shown in FIG. 3C, an insertion film 28c is formed on the lower piezoelectric film 14a by using, for example, a sputtering method, a vacuum evaporation method, or a CVD method. As shown in FIG. 3D, the insertion film 28c is patterned into a desired shape using a photolithography technique and an etching technique. The insertion film 28c may be formed by a lift-off method.

  As shown in FIG. 4A, an insertion film 28d is formed on the lower piezoelectric film 14a and the insertion film 28c by using, for example, a sputtering method, a vacuum evaporation method, or a CVD method. The insertion film 28d is patterned into a desired shape using a photolithography technique and an etching technique. The insertion film 28d may be formed by a lift-off method. Thus, a thin insertion film 28a is formed by the insertion film 28d, and a thick insertion film 28b is formed by the insertion films 28c and 28d. The insertion film 28 is formed by the insertion films 28a and 28b.

  As shown in FIG. 4B, the upper piezoelectric film 14b and the lower layer 16a and the upper layer 16b of the upper electrode 16 are formed on the lower piezoelectric film 14a and the insertion film 28 by using, for example, sputtering, vacuum deposition, or CVD. Film. A piezoelectric film 14 is formed from the lower piezoelectric film 14a and the upper piezoelectric film 14b. The upper electrode 16 is patterned into a desired shape using a photolithography technique and an etching technique. The upper electrode 16 may be formed by a lift-off method.

  In the parallel resonator shown in FIG. 1C, after the lower layer 16a of the upper electrode 16 is formed, the mass load film 20 is formed using, for example, a sputtering method, a vacuum evaporation method, or a CVD method. The mass load film 20 is patterned into a desired shape using a photolithography technique and an etching technique. Thereafter, the upper layer 16b of the upper electrode 16 is formed.

  As shown in FIG. 4C, the piezoelectric film 14 is patterned into a desired shape using a photolithography technique and an etching technique. As an etching technique, a wet etching method or a dry etching method may be used.

  The etching solution for the sacrificial layer 38 is introduced into the sacrificial layer 38 below the lower electrode 12 through the hole 35 and the introduction path 33 (see FIG. 1A). Thereby, the sacrificial layer 38 is removed. The medium for etching the sacrificial layer 38 is preferably a medium that does not etch the material constituting the resonator other than the sacrificial layer 38. In particular, the etching medium is preferably a medium in which the lower electrode 12 with which the etching medium contacts is not etched. The stress of the laminated film from the lower electrode 12 to the frequency adjustment film is set to be a compressive stress. Thus, when the sacrificial layer 38 is removed, the laminated film swells away from the substrate 10 on the opposite side of the substrate 10. A gap 30 having a dome-like bulge is formed between the lower electrode 12 and the substrate 10. As a result, the series resonator S shown in FIGS. 1A and 1B and the parallel resonator P shown in FIGS. 1A and 1C are manufactured.

  Next, the Q value of the piezoelectric thin film resonator according to Example 1 was simulated using a two-dimensional finite element method. FIG. 5A to FIG. 5C are diagrams showing cross-sectional structures of Comparative Examples 1 and 2 and Example 1 in which simulation was performed. As shown in FIGS. 5A to 5C, the center of the resonance region 50 is a mirror interface 59. The half width of the resonance region 50 is W5, the width of the gap 30 outside the resonance region 50 is W6, and the width of the lower piezoelectric film 14a outside the resonance region 50 is W7.

  As shown in FIG. 5A, in Comparative Example 1, the insertion film 28 is inserted into the piezoelectric film 14 in the region 52 within the resonance region 50. The insertion film 28 is not inserted into the piezoelectric film 14 in the region 51 within the resonance region 50. The insertion width and film thickness of the insertion film 28 in the region 52 were set to W3 and d0, respectively. The width of the upper piezoelectric film 14b outside the resonance region 50 is W4. The insertion film 28 is inserted into the piezoelectric film 14 in a region 55 outside the resonance region 50.

  As shown in FIG. 5B, in Comparative Example 2, the insertion film 28 is inserted into the piezoelectric film 14 in the region 54 outside the resonance region 50. The insertion film 28 is not inserted into the piezoelectric film 14 in the resonance region 50. The width in which the insertion film 28 was inserted into the piezoelectric film 14 was W4, and the thickness of the insertion film 28 was d0.

  As shown in FIG. 5C, in Example 1, the width of the region 52 is W1, and the thickness of the insertion film 28a is d1. The width of the region 54 is W2, and the thickness of the insertion film 28b is d2.

Each material and film thickness used for the simulation are as follows.
Lower layer 12a of the lower electrode 12: Cr film having a thickness of 100 nm Upper layer 12b of the lower electrode 12: Ru film piezoelectric film having a thickness of 200 nm: AlN film having a thickness of 1260 nm Lower piezoelectric film 14a: AlN having a thickness of 630 nm Upper film piezoelectric film 14b: AlN film insertion film 28 having a film thickness of 630 nm: Silicon oxide film upper electrode 16: Width of Ru film resonance region 50 having a film thickness of 230 nm W5: 42 μm
The width W6 of the air gap 30 outside the resonance region 50: 13 μm
Width W7 of the lower piezoelectric film 14a outside the resonance region 50: 8 μm

Comparative Example 1
Film thickness d0 of the insertion film 28: 150 nm
Insertion width W3 of the insertion film 28: 2200 nm
Comparative Example 2
Film thickness d0 of insertion film 28: 300 nm
Insertion width W4 of the insertion film 28: 2800 nm

Example 1
Insertion film 28a thickness d1: 150 nm
Insertion width W1 of the insertion film 28a: 1800 nm
Film thickness d2 of insertion film 28b: 300 nm
Insertion width W2 of the insertion film 28b: 3600 nm

  FIG. 6 is a diagram illustrating a Q value with respect to frequency in Comparative Examples 1 and 2 and Example 1. As shown in FIG. 6, in Comparative Examples 1 and 2, the Q value becomes maximum between the resonance frequency fr and the antiresonance frequency fa. In the first embodiment, the Q value is high in a wide band having a resonance frequency fr or higher. The Q value becomes maximum in the vicinity of 2.05 GHz, which is higher than the antiresonance frequency fa. Thus, Example 1 has a larger Q value range than Comparative Examples 1 and 2.

  The reason why the Q value can be improved in a wide band in the first embodiment will be described. The dispersion characteristics of the transverse mode elastic waves (elastic waves propagating in the transverse direction) in Example 1 were simulated. The simulation conditions are the same as the above conditions. The simulated acoustic wave mode is the main mode used in the piezoelectric thin film resonator.

  FIG. 7A is a diagram showing the dispersion characteristics of the transverse mode in Example 1, and FIG. 7B is an enlarged view of a range A in FIG. 7A. In FIG. 7A, the horizontal axis represents the wave number in the horizontal direction, and the vertical axis represents the frequency. When the wave number is 0, the elastic wave does not propagate in the lateral direction and a response in the thickness longitudinal mode occurs. When the wave number is greater than 0, the elastic wave propagates in the transverse direction and becomes a transverse mode elastic wave. The frequency at which the wave number of the dispersion characteristic in the region 51 in the resonance region 50 is 0 becomes the resonance frequency fr of the piezoelectric thin film resonator. In the region 51, the frequency decreases as the wave number increases from zero. When the frequency exceeds f0, the frequency increases with the wave number. The cutoff frequency where the wave number of the region 52 is 0 is lower than the resonance frequency fr. The cutoff frequency where the wave number of the region 54 is 0 is higher than the cutoff frequency of the region 52 and lower than the resonance frequency fr. The cut-off frequency where the wave number of the region 55 in Comparative Example 1 is 0 is higher than the resonance frequency fr.

  As shown in FIG. 7B, the wave numbers of the regions 51, 52, and 54 at the antiresonance frequency fa are β51, β52, and β54, respectively. The relationship is β51 <β54 <β52. In the region 55, there is no anti-resonance frequency fa mode in the region where the wave number is positive. Therefore, the elastic wave of this mode does not propagate through the region 55 at the antiresonance frequency fa.

  In Comparative Example 1, the wave number β52 in the region 52 is larger than the wave number β51 in the region 51 near the antiresonance frequency fa. That is, the velocity of the elastic wave near the antiresonance frequency fa in the region 52 is smaller than the velocity of the elastic wave in the region 51. For this reason, the elastic wave propagating laterally from the region 51 is reflected by the region 52 and returns to the region 51. Thereby, the Q value is improved. In the region 55, the transverse mode elastic wave does not propagate.

  In Comparative Example 2, the wave number β54 in the region 54 is larger than the wave number β51 in the resonance region 50 (region 51) near the antiresonance frequency fa. That is, the velocity of the elastic wave near the antiresonant frequency fa in the region 54 is smaller than the velocity of the elastic wave in the resonant region 50. Therefore, the elastic wave propagating from the resonance region 50 in the lateral direction is reflected by the region 54 and returns to the resonance region 50. Thereby, the Q value is improved.

  In the first embodiment, the relationship is β51 <β54 <β52. That is, the velocity of the elastic wave near the antiresonance frequency fa is high in the region 51, slow in the region 52, and fast in the region 52. For this reason, when the Bragg condition is approached, the elastic wave reflected by the region 52 and the elastic wave reflected by the region 54 strengthen each other. Thereby, the transverse mode elastic wave reflected in the region 51 becomes larger than those in the first and second comparative examples. Thereby, the leakage of the elastic wave from the resonance region 50 can be suppressed and the Q value can be improved. Thus, in Example 1, the Q value can be improved as compared with Comparative Examples 1 and 2.

  According to the first embodiment, the insertion film 28 is provided in the outer peripheral region 52 in the resonance region 50 and the outside of at least a part of the resonance region 50 surrounding the resonance region 50. Is not provided. The film thickness d1 (first film thickness) of the insertion film 28a in the resonance region 50 is smaller than the film thickness d2 (second film thickness) of the insertion film 28b outside the resonance area 50. Thereby, the Q value can be improved.

  In plan view, the resonance region 50 and at least a part of the insertion film 28 b having a film thickness d 2 outside the resonance region 50 overlap the gap 30. As a result, a transverse mode elastic wave propagates through the piezoelectric films 14 in the regions 51, 52 and 54. For this reason, the transverse mode elastic wave is reflected under the Bragg condition. Therefore, the Q value can be improved.

  As shown in FIG. 7B, the wave number β51 of the transverse mode in the region 51 at the antiresonance frequency fa of the resonance region 50 is smaller than the wave number β52 of the transverse mode in the region 52 provided with the insertion film 28a. The transverse mode wavenumber β54 of the region 54 provided with the insertion film 28b is smaller than the transverse mode wavenumber β52 of the region 52 provided with the insertion film 28a. Thereby, a transverse mode elastic wave is reflected on the Bragg condition. Therefore, the Q value can be improved.

  The insertion film 28 may be provided above and below the piezoelectric film 14, but is preferably inserted into the piezoelectric film 14. Thereby, the Q value can be further improved.

  The insertion film 28a and the insertion film 28b are preferably in contact with each other. Thereby, the Q value can be further improved.

  FIGS. 8A to 8C are cross-sectional views of the piezoelectric thin film resonators according to the first embodiment and the first and second modifications of the first embodiment, respectively. As shown in FIG. 8A, in the piezoelectric thin film resonator according to the first embodiment, the air gap 30 is illustrated in the substrate 10 for simplification. Other configurations are the same as those in FIGS. 1A to 1C.

[Modification 1 of Example 1]
As shown in FIG. 8B, the insertion film 28 is provided on the piezoelectric film 14 and is provided below the upper electrode 16. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

[Modification 2 of Embodiment 1]
As shown in FIG. 8C, the insertion film 28 is provided below the piezoelectric film 14 and provided on the lower electrode 12. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

  As in the first and second modifications of the first embodiment, the insertion film 28 may be provided on or below the piezoelectric film 14.

[Modification 3 of Embodiment 1]
FIGS. 9A to 9D are cross-sectional views of piezoelectric thin film resonators according to modifications 3 to 6 of the first embodiment, respectively. As shown in FIG. 9A, the outer contours of the lower piezoelectric film 14 a, the upper piezoelectric film 14 b and the insertion film 28 substantially coincide with the outer contour 66 of the gap 30 in the region other than the lead region of the upper electrode 16. . For this reason, the outer contour 64 of the region 54 substantially matches the outer contour 66 of the gap 30. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

[Modification 4 of Example 1]
As shown in FIG. 9B, the outer contours of the lower piezoelectric film 14 a, the upper piezoelectric film 14 b, and the insertion film 28 are located between the outer contour 66 of the gap 30 and the outer contour 60 of the resonance region 50. The outer contour 64 of the region 54 is located inside the outer contour 66 of the gap 30. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

[Modification 5 of Embodiment 1]
As shown in FIG. 9C, the lower piezoelectric film 14 a and the insertion film 28 extend outside the outer contour 66 of the gap 30. The outer contour of the upper piezoelectric film 14 b substantially matches the outer contour 66 of the gap 30. For this reason, the outer contour 64 of the region 54 substantially coincides with the outer contour 66 of the gap 30. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

[Modification 6 of Example 1]
As shown in FIG. 9D, the lower piezoelectric film 14 a, the upper piezoelectric film 14 b, and the insertion film 28 extend outside the outer contour 66 of the gap 30. For this reason, the outer contour 64 of the region 54 substantially coincides with the outer contour 66 of the gap 30. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

  As in the third to sixth modifications of the first embodiment, the outer contours of the lower piezoelectric film 14a, the insertion film 28b, and the upper piezoelectric film 14b are located inside, outside, or substantially outside the outer contour 66 of the gap 30. May match.

[Modification 7 of Example 1]
FIG. 10A to FIG. 10D are cross-sectional views of a seventh modification of the first embodiment. As shown in FIG. 10A, the insertion film 28 a is inserted into the piezoelectric film 14. The insertion film 28 b is provided at a position different from the insertion film 28 a in the thickness direction of the piezoelectric film 14. Other configurations are the same as those of the third modification of the first embodiment, and a description thereof is omitted.

  As shown in FIG. 10B, the insertion film 28 a is inserted into the piezoelectric film 14. The insertion film 28 b is provided on the piezoelectric film 14. In the lead region of the upper electrode 16, the insertion film 28 b is provided between the piezoelectric film 14 and the upper electrode 16. Other configurations are the same as those of the third modification of the first embodiment, and a description thereof is omitted.

  As shown in FIG. 10C, the insertion film 28 a is inserted into the piezoelectric film 14. The insertion film 28 b is provided under the piezoelectric film 14. In the extraction region of the lower electrode 12, the insertion film 28 b is provided between the piezoelectric film 14 and the lower electrode 12. Other configurations are the same as those of the third modification of the first embodiment, and a description thereof is omitted.

  As shown in FIG. 10 (d), the insertion film 28 a is inserted into the piezoelectric film 14. In the lead region of the upper electrode 16, the insertion film 28 b is provided between the piezoelectric film 14 and the upper electrode 16. In the lead region of the lower electrode 12, the insertion film 28 b is provided between the piezoelectric film 14 and the lower electrode 12. Other configurations are the same as those of the third modification of the first embodiment, and a description thereof is omitted.

  As in the first embodiment and the first to sixth modifications, the insertion films 28a and 28b may be in contact with each other. As in the seventh modification of the first embodiment, the insertion films 28a and 28b may be provided at different positions in the thickness direction.

[Modification 8 of Example 1]
FIG. 11A to FIG. 11C are cross-sectional views of Modification 8 of Embodiment 1. FIG. As shown in FIG. 11A, a gap 32 is provided between the piezoelectric film 14 and the upper electrode 16 in the region 54. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

  As shown in FIG. 11B, a gap 32 is provided between the lower electrode 12 and the piezoelectric film 14 in the region 54. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

  As shown in FIG. 11C, gaps 32 are provided in the region 54 between the piezoelectric film 14 and the upper electrode 16 and between the lower electrode 12 and the piezoelectric film 14. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

  As in the modification 8 of the first embodiment, in the regions 52 and 54, the gap 32 is provided in at least one of the space between the piezoelectric film 14 and the lower electrode 12 and the space between the piezoelectric film 14 and the upper electrode 16. It may be. In this case, the resonance region 50 is a region where the air gap 32 is not provided, for example.

[Variation 9 of Embodiment 1]
12A to 12C are cross-sectional views according to modified examples 9 to 11 of the first embodiment, respectively. As shown in FIG. 12A, the outer contour of the insertion film 28 b is located outside the outer contour 66 of the gap 30. For this reason, the outer contour 64 of the region 54 substantially coincides with the outer contour 66 of the gap 30. Other configurations are the same as those of the sixth modification of the first embodiment, and a description thereof will be omitted.

[Modification 10 of Example 1]
As shown in FIG. 12B, the outer contour of the region 52 may substantially match the outer contour 66 of the gap 30 in the lead region of the upper electrode 16. The thick insertion film 28 b does not overlap the gap 30 in the extraction region of the upper electrode 16. In the lead region of the lower electrode 12, the region 54 is provided as in the first embodiment. Other configurations are the same as those of the sixth modification of the first embodiment, and a description thereof will be omitted.

[Modification 11 of Example 1]
As shown in FIG. 12C, the outer contour 61 of the region 52 is located inside the outer contour 60 of the resonance region 50 in the lead region of the upper electrode 16. The thick insertion film 28 b does not overlap the gap 30 outside the resonance region 50 in the extraction region of the upper electrode 16. In the lead region of the lower electrode 12, the region 54 is provided as in the first embodiment. Other configurations are the same as those of the sixth modification of the first embodiment, and a description thereof will be omitted.

  As in the modified examples 10 and 11 of the first embodiment, the region 54 where the insertion film 28 b overlaps the air gap 30 outside the resonance region 50 only needs to be provided in a part of the resonance region 50. It suffices that the regions 52 and 54 are provided in at least a part surrounding the resonance region 50.

  Example 2 and its modification 1 are examples in which the structure of the gap is changed. FIG. 13A is a cross-sectional view of the piezoelectric thin film resonator of the second embodiment, and FIG. 13B is a cross-sectional view of the piezoelectric thin film resonator of the first modification of the second embodiment. As shown in FIG. 13A, a depression is formed on the upper surface of the substrate 10. The lower electrode 12 is formed flat on the substrate 10. Thereby, the air gap 30 is formed in the recess of the substrate 10. The air gap 30 is formed so as to include the resonance region 50. Other configurations are the same as those in the first embodiment, and a description thereof will be omitted. The gap 30 may be formed so as to penetrate the substrate 10. An insulating film may be formed in contact with the lower surface of the lower electrode 12. That is, the air gap 30 may be formed between the substrate 10 and the insulating film in contact with the lower electrode 12. As the insulating film, for example, an aluminum nitride film can be used.

  As shown in FIG. 13B, the acoustic reflection film 31 is formed below the lower electrode 12 in the resonance region 50. The acoustic reflection film 31 is alternately provided with films 30a having a low acoustic impedance and films 30b having a high acoustic impedance. The film thicknesses of the films 30a and 30b are each λ / 4 (λ is the wavelength of the elastic wave), for example. The number of layers of the film 30a and the film 30b can be set arbitrarily. The acoustic reflection film 31 may be formed by laminating at least two types of layers having different acoustic characteristics with a gap therebetween. Further, the substrate 10 may be one of at least two types of layers having different acoustic characteristics of the acoustic reflection film 31. For example, the acoustic reflection film 31 may have a configuration in which a film having different acoustic impedances is provided in the substrate 10. Other configurations are the same as those in the first embodiment, and a description thereof will be omitted.

  In the first embodiment and its modification, the gap 30 may be formed in the same manner as in the second embodiment, and the acoustic reflection film 31 may be formed in place of the gap 30 as in the first modification of the second embodiment.

  The piezoelectric thin film resonator is an FBAR (Film Bulk Acoustic Resonator) in which the air gap 30 is formed between the substrate 10 and the lower electrode 12 in the resonance region 50 as in the first embodiment and the modified example and the second embodiment. Good. Further, as in the first modification of the second embodiment, the piezoelectric thin film resonator includes an SMR (Solidly Mounted Resonator) including an acoustic reflection film 31 that reflects an elastic wave propagating through the piezoelectric film 14 below the lower electrode 12 in the resonance region 50. )

  In the first to second embodiments and the modifications thereof, the insertion film 28 is provided so as to surround the resonance region 50, but the insertion film 28 is provided outside the resonance region 50 in at least a part of the resonance region 50. It only has to be done. For example, the regions 52 and 54 may be annular with a part cut. Although an example in which the resonance region 50 has an elliptical shape has been described, other shapes may be used. For example, the resonance region 50 may be a polygon such as a quadrangle or a pentagon.

  Example 3 is an example of a filter and a duplexer using the piezoelectric thin film resonators of Examples 1 and 2 and modifications thereof. FIG. 14A is a circuit diagram of a filter according to the third embodiment. As shown in FIG. 14A, one or a plurality of series resonators S1 to S4 are connected in series between the input terminal T1 and the output terminal T2. One or a plurality of parallel resonators P1 to P4 are connected in parallel between the input terminal T1 and the output terminal T2. The elastic wave resonators according to the first and second embodiments and modifications thereof can be used for at least one of the one or more series resonators S1 to S4 and the one or more parallel resonators P1 to P4. The number of resonators of the ladder type filter can be set as appropriate.

  FIG. 14B is a circuit diagram of a duplexer according to a modification of the third embodiment. As shown in FIG. 14B, the transmission filter 40 is connected between the common terminal Ant and the transmission terminal Tx. A reception filter 42 is connected between the common terminal Ant and the reception terminal Rx. The transmission filter 40 passes a signal in the transmission band among signals input from the transmission terminal Tx as a transmission signal to the common terminal Ant, and suppresses signals of other frequencies. The reception filter 42 passes signals in the reception band among the signals input from the common terminal Ant to the reception terminal Rx as reception signals, and suppresses signals of other frequencies. At least one of the transmission filter 40 and the reception filter 42 can be the filter of the third embodiment.

  The filter includes the piezoelectric thin film resonators of the first and second embodiments and modifications thereof. Thereby, the Q value of the resonator is improved, and the skirt characteristic of the filter can be improved.

  In addition, at least one of the transmission filter 40 and the reception filter 42 may be a filter including the piezoelectric thin film resonators of the first and second embodiments and the modifications thereof.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.

DESCRIPTION OF SYMBOLS 10 Substrate 12 Lower electrode 14 Piezoelectric film 14a Lower piezoelectric film 14b Upper piezoelectric film 16 Upper electrode 28, 28a, 28b Insertion film 30 Gap 31 Acoustic reflection film 40 Transmission filter 42 Reception filter 50 Resonance region 51, 52, 54 region

Claims (7)

A substrate,
A piezoelectric film provided on the substrate;
A lower electrode and an upper electrode facing each other across at least a part of the piezoelectric film;
An acoustic reflection layer including an acoustic reflection film provided in or on the substrate and having an air gap or at least two kinds of layers having different acoustic characteristics laminated thereon;
A region that is inserted between the lower electrode and the upper electrode, sandwiches the piezoelectric film, the lower electrode and the upper electrode face each other, and the piezoelectric film, the lower electrode, the upper electrode, and the acoustic reflection layer overlap each other Provided in the outer peripheral region defined by the resonance region and at least a part of the resonance region surrounding the resonance region, and not provided in the central region of the resonance region. The first film thickness is less than the second film thickness outside the resonance region;
Equipped with,
The first region in which the insertion film has the first film thickness is provided along the outer periphery including the outer periphery of the resonance region in at least a part surrounding the central region in the resonance region,
A second region in which the insertion film has the second film thickness is provided outside the resonance region, outside the first region, and including the outer periphery of the resonance region along the outer periphery;
In the second region, the piezoelectric film and the acoustic reflection layer overlap,
The insertion film of the first film thickness and the insertion film of the second film thickness are made of the same material,
A piezoelectric thin film resonator in which the acoustic impedance of the insertion film is smaller than the acoustic impedance of the piezoelectric film. The wave number of the transverse mode in the central region at the anti-resonance frequency of the resonance region is smaller than the wave number of the transverse mode in the first region ,
The piezoelectric thin-film resonator wave number smaller claim 1, wherein the wave number of transverse modes of the resonance region outside the second region transverse mode of the first region in the anti-resonance frequency of the resonance region. The piezoelectric film includes a lower piezoelectric film and an upper piezoelectric film provided on the lower piezoelectric film,
3. The piezoelectric thin film resonator according to claim 1, wherein the insertion film is inserted between the lower piezoelectric film and the upper piezoelectric film . The piezoelectric thin-film resonator according to one of claims 1-3 which is in contact and the first thickness of the intervening layer and the second thickness of the intervening layer. The piezoelectric thin-film resonator according to any one claim of claims 1-3 provided in different positions in the thickness direction away from the insert film and the second film thickness of the intervening layer of the first film thickness. A filter comprising the piezoelectric thin film resonator according to any one of claims 1 to 5 . A multiplexer including the filter according to claim 6 .

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