JP6554913B2 - lamp - Google Patents

lamp Download PDF

Info

Publication number
JP6554913B2
JP6554913B2 JP2015110090A JP2015110090A JP6554913B2 JP 6554913 B2 JP6554913 B2 JP 6554913B2 JP 2015110090 A JP2015110090 A JP 2015110090A JP 2015110090 A JP2015110090 A JP 2015110090A JP 6554913 B2 JP6554913 B2 JP 6554913B2
Authority
JP
Japan
Prior art keywords
body portion
led
electric circuit
circuit board
lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015110090A
Other languages
Japanese (ja)
Other versions
JP2016225130A (en
Inventor
兼史 川尻
兼史 川尻
広之 番場
広之 番場
考司 石合
考司 石合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwasaki Denki KK
Original Assignee
Iwasaki Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwasaki Denki KK filed Critical Iwasaki Denki KK
Priority to JP2015110090A priority Critical patent/JP6554913B2/en
Publication of JP2016225130A publication Critical patent/JP2016225130A/en
Application granted granted Critical
Publication of JP6554913B2 publication Critical patent/JP6554913B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

本発明は、例えばLEDや有機EL等の発光素子を光源に備え、既設のソケットに装着可能なランプに関する。   The present invention relates to a lamp that includes a light emitting element such as an LED or an organic EL in a light source and can be mounted on an existing socket.

近年、LEDの高出力化、及び低コスト化に伴い、電球の代替として使用可能な電球型のLEDランプが普及している。この種のLEDランプは、一般に、LEDを実装したLED基板を平円板に載置し、この平円板の裏面に、電源回路等の電気回路基板を収めた筒状の胴体部を接続し、この胴体部の終端に絶縁部を挟んで口金を設けて構成されている(例えば、特許文献1、特許文献2参照)。
また、従来、熱伝導性と電気絶縁性に優れる熱伝導性樹脂成形体を提供するために、電気絶縁層と熱伝導層とを二色成形法により一体成形する方法が提案されている(例えば、特許文献3参照)。
2. Description of the Related Art In recent years, light bulb-type LED lamps that can be used as a substitute for light bulbs have become widespread with the increase in output and cost of LEDs. In general, this type of LED lamp has an LED board on which an LED is mounted mounted on a flat disk, and a cylindrical body containing an electric circuit board such as a power circuit is connected to the back of the flat disk. In addition, a base is provided at the end of the body portion with an insulating portion interposed therebetween (see, for example, Patent Document 1 and Patent Document 2).
Conventionally, in order to provide a thermally conductive resin molded article having excellent thermal conductivity and electrical insulation, a method of integrally molding an electrical insulating layer and a thermally conductive layer by a two-color molding method has been proposed (for example, And Patent Document 3).

特開2010−010134号公報JP 2010-010134 A 特開2009−206104号公報JP 2009-206104 A 特開2010−264740号公報JP 2010-264740 A

ところで、LEDランプの胴体部を放熱性に優れた非結晶性樹脂で成形し、この胴体部の終端に結晶性樹脂から成る絶縁部を一体成形することで、放熱性と絶縁性とをあわせ持つ胴体部を提供することが考えられる。しかしながら、二色成形やインサート成形により、結晶性樹脂と非結晶性樹脂とのような異種の樹脂を一体成形した場合、それらの溶融温度の違いや、熱膨張係数の違いから、接合部の接合性が良くないという問題があった。
本発明は、上述した事情に鑑みてなされたものであり、異種の樹脂材料を一体成形した接合部の接合性を向上することができるLEDランプを提供する。
By the way, the body part of the LED lamp is formed of an amorphous resin having excellent heat dissipation, and the insulating part made of crystalline resin is integrally formed at the end of the body part, thereby having both heat dissipation and insulation. It is conceivable to provide a body part. However, when dissimilar resins such as crystalline resin and non-crystalline resin are integrally molded by two-color molding or insert molding, due to the difference in their melting temperature and the difference in thermal expansion coefficient, There was a problem that the nature was not good.
This invention is made | formed in view of the situation mentioned above, and provides the LED lamp which can improve the joining property of the junction part which integrally molded the different resin material.

上記目的を達成するために、本発明は、発光素子を実装した基板と、当該基板が表面に載置された平板部と、前記平板部の裏面から延びる胴体部と、前記胴体部の終端に設けられた絶縁性の筒部を介して接続される口金と、を有するランプであって、前記胴体部と、前記筒部とは、互いに異なる樹脂から一体に成形され、前記胴体部は、前記筒部よりも放熱性に優れた非結晶性の樹脂から形成され、かつ前記筒部を形成する樹脂は、前記胴体部を形成する樹脂よりも成形収縮率が大きく、前記胴体部は、前記筒部と接合する終端に、少なくとも径方向に曲げられた曲部を備え、前記曲部を前記筒部により上下及び内外方向から包囲するようにインサート成形により一体に形成したことを特徴とする。 In order to achieve the above object, the present invention provides a substrate on which a light emitting element is mounted, a flat plate portion on which the substrate is placed, a trunk portion extending from the back surface of the flat plate portion, and a terminal end of the trunk portion. A base connected via an insulating tube portion provided, wherein the body portion and the tube portion are integrally formed from different resins, and the body portion is The resin forming the cylindrical portion is made of an amorphous resin having better heat dissipation than the cylindrical portion, and the molding shrinkage rate is larger than that of the resin forming the trunk portion. The terminal part joined to the part is provided with a curved part bent at least in the radial direction, and the curved part is integrally formed by insert molding so as to be surrounded by the cylindrical part from the top and bottom and inside and outside directions.

また本発明は、上記ランプにおいて前記胴体部は、前記筒部よりも放熱性に優れた非結晶性の樹脂から形成され、前記筒部は、前記胴体部よりも耐薬品性に優れた結晶性の樹脂から形成されたことを特徴とする。   According to the present invention, in the lamp, the body portion is formed of an amorphous resin having better heat dissipation than the tube portion, and the tube portion has crystallinity superior in chemical resistance than the body portion. It was formed from the resin of this.

また本発明は、上記ランプにおいて、前記胴体部をポリカーボネイトで形成し、前記筒部をポリブチレンテレフタレートで形成したことを特徴とする。   According to the present invention, in the lamp described above, the body portion is formed of polycarbonate, and the cylindrical portion is formed of polybutylene terephthalate.

本発明によれば、発光素子を実装した基板と、当該基板が表面に載置された平板部と、前記平板部の裏面から延びる胴体部と、前記胴体部の終端に設けられた絶縁性の筒部を介して接続される口金と、を有するランプであって、前記胴体部と、前記筒部とは、互いに異なる樹脂から一体に成形され、前記胴体部は、前記筒部と接合する終端に、少なくとも径方向に曲げられた曲部を備え、前記曲部を前記筒部により上下及び内外方向から包囲するように形成した。この構成によれば、胴体部の終端の曲部を上下及び内外方向から包囲するように筒部を形成したため、成形収縮率の違による接合面の間隙が生じることがなく、接合面を密着させることができる。よって、異種の樹脂材料を一体成形した場合の接合部の接合性を向上することができる。   According to the present invention, the substrate on which the light emitting element is mounted, the flat plate portion on which the substrate is placed, the body portion extending from the back surface of the flat plate portion, and the insulating material provided at the end of the body portion. A lamp having a base connected via a tube portion, wherein the body portion and the tube portion are integrally formed from different resins, and the body portion is joined to the tube portion. In addition, a curved portion bent at least in the radial direction is provided, and the curved portion is formed so as to be surrounded by the cylindrical portion from above and below and from inside and outside. According to this configuration, since the cylindrical portion is formed so as to surround the curved portion at the end of the body portion from above and below and from inside and outside, the gap between the joining surfaces due to the difference in molding shrinkage does not occur, and the joining surfaces are brought into close contact with each other. be able to. Therefore, it is possible to improve the bondability of the joint portion when different types of resin materials are integrally formed.

本発明の実施形態に係るLEDランプの外観構成を示す図であり、(A)は平面図、(B)は側面図、(C)は底面図である。It is a figure which shows the external appearance structure of the LED lamp which concerns on embodiment of this invention, (A) is a top view, (B) is a side view, (C) is a bottom view. LEDランプを分解して示す斜視図である。It is a perspective view which decomposes | disassembles and shows an LED lamp. LEDランプの内部構成を示す断面図である。It is sectional drawing which shows the internal structure of a LED lamp. ベース板の平面図である。It is a top view of a base board. 胴体部と筒部との接合構造を示す図であり、(A)は曲部の形状の一例を示す図、(B)曲部の形状の別の一例を示す図である。It is a figure which shows the joining structure of a trunk | drum part and a cylinder part, (A) is a figure which shows an example of the shape of a curved part, (B) is a figure which shows another example of the shape of a curved part. 筒部の断面図である。It is sectional drawing of a cylinder part.

以下、図面を参照して本発明の実施形態について説明する。
なお、以下の実施形態では、発光素子を光源に備えるランプとして、LEDを光源に備えたLEDランプを例示するが、本発明はこれに限定されるものではなく、例えば有機EL等の他の発光素子を光源に備えるランプにも適用可能である。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the following embodiments, an LED lamp having an LED as a light source is exemplified as a lamp having a light emitting element as a light source. However, the present invention is not limited to this, and other light emission such as an organic EL, for example. The present invention can also be applied to a lamp having an element as a light source.

図1は本実施形態に係るLEDランプ1の外観構成を示す図であり、図1(A)は平面図、図1(B)は側面図、図1(C)は底面図である。図2はLEDランプ1を分解して示す斜視図である。図3はLEDランプ1の内部構成を示す断面図である。
これらの図に示すように、LEDランプ1は、既存の電球と形状及び光学特性が略同じになるように構成されており、既存の電球の代替として使用可能となっている。
FIG. 1 is a diagram showing an external configuration of an LED lamp 1 according to the present embodiment, in which FIG. 1 (A) is a plan view, FIG. 1 (B) is a side view, and FIG. 1 (C) is a bottom view. FIG. 2 is an exploded perspective view showing the LED lamp 1. FIG. 3 is a cross-sectional view showing the internal configuration of the LED lamp 1.
As shown in these drawings, the LED lamp 1 is configured to have substantially the same shape and optical characteristics as an existing light bulb, and can be used as an alternative to the existing light bulb.

すなわち、LEDランプ1は、図1に示すように、高熱伝導性を有する材料から形成された略円筒状の胴体部2を有する。この胴体部2の先端2C(図3参照)には、発光部12が設けられ、終端2Aには、絶縁性を有する材料から形成された筒状の絶縁筒部10が設けられる。絶縁筒部10の終端10A(図2)には、口金3が冠着されている。口金3は、既存のソケット(不図示、例えばE26型ソケット)に螺合するネジ山が切られた筒状のシェル5と、このシェル5の端部の頂部に絶縁部6を介して設けられたアイレット7とを備え、シェル5及びアイレット7がソケットに装着可能な形状寸法に構成されている。これにより、当該LEDランプ1は、天井や壁面に既設のソケットや、既存の電球を装着して使用するランプホルダーのソケットに装着でき、既存の電球の代替として使用できる。   That is, as shown in FIG. 1, the LED lamp 1 has a substantially cylindrical body portion 2 formed of a material having high thermal conductivity. A light emitting portion 12 is provided at the front end 2C (see FIG. 3) of the body portion 2, and a cylindrical insulating cylinder portion 10 formed of an insulating material is provided at the terminal end 2A. A base 3 is attached to the terminal end 10 </ b> A (FIG. 2) of the insulating cylinder portion 10. The base 3 is provided with a cylindrical shell 5 threaded into an existing socket (not shown, for example, E26 type socket) and an insulating portion 6 on the top of the end of the shell 5. The shell 5 and the eyelet 7 are configured to have a shape and size that can be attached to the socket. Thereby, the said LED lamp 1 can be mounted | worn with the socket of the lamp holder which mounts and uses the existing socket and the existing light bulb, and can use it as an alternative of the existing light bulb.

発光部12は、複数のLED15を光源に備え、図2及び図3に示すように、LED15の点灯に要するドライバ回路や電源回路等の電気回路を搭載した電気回路基板8が胴体部2及び絶縁筒部10に配設されている。電気回路基板8の電源回路と、口金3のシェル5、及びアイレット7とは、それぞれリード線9A、9Bにより電気的に接続されており、これらシェル5、及びアイレット7を通じてソケットからの電力が電気回路基板8の電源回路に供給される。   The light emitting unit 12 includes a plurality of LEDs 15 as a light source. As shown in FIGS. 2 and 3, the electric circuit board 8 on which an electric circuit such as a driver circuit and a power circuit required for lighting the LEDs 15 is mounted It is disposed in the tube portion 10. The power circuit of the electric circuit board 8 and the shell 5 and the eyelet 7 of the base 3 are electrically connected by lead wires 9A and 9B, respectively, and the power from the socket is electrically connected through the shell 5 and the eyelet 7. The power is supplied to the power circuit of the circuit board 8.

シェル5と胴体部2とは絶縁筒部10によって電気的に絶縁されており、胴体部2の放熱性を高めるべく導電性を有する材料で構成しても、口金3のシェル5と胴体部2との間の絶縁が良好に維持されるように構成される。本実施形態では、詳細については後述するが、胴体部2を熱伝導性樹脂から形成するとともに、絶縁筒部10を絶縁性樹脂から形成し、胴体部2及び絶縁筒部10をインサート成形している。なお、胴体部2及び絶縁筒部10を二色成形により形成してもよい。   The shell 5 and the body portion 2 are electrically insulated by the insulating cylinder portion 10, and the shell 5 and the body portion 2 of the base 3 are formed even if the shell 5 and the body portion 2 are made of a conductive material to improve the heat dissipation of the body portion 2. It is comprised so that the insulation between can be maintained favorably. In this embodiment, although details will be described later, the body 2 is formed from a heat conductive resin, the insulating cylinder 10 is formed from an insulating resin, and the body 2 and the insulating cylinder 10 are insert-molded. Yes. The body part 2 and the insulating cylinder part 10 may be formed by two-color molding.

胴体部2を熱伝導性樹脂から形成することで、アルミニウム等の金属材料でベース板13及び胴体部2を形成したときよりもLEDランプ1の軽量化が図られ、電球の代替としてLEDランプ1を既存のソケットや既存のランプホルダーに装着する場合でも、当該LEDランプ1の重量を支えるために既存のソケットや既存のランプホルダーを補強する作業や部材が必要なく、そのまま代替使用することができる。また軽量化により、後述の放熱フィン25の枚数を増やすことができるので、表面積が増え、より効率的に放熱性を高めることができる。このような熱伝導性樹脂としては、例えば高熱伝導性のカーボン繊維(本実施形態では帝人(株)製ラヒーマ(登録商標))を混入したポリカーボネイト樹脂を好適に用いることができる。また胴体部2と絶縁筒部10とを樹脂材のインサート成形により一体に形成することで接合が強固なものとなる。   By forming the body part 2 from a heat conductive resin, the LED lamp 1 can be lighter than when the base plate 13 and the body part 2 are formed of a metal material such as aluminum, and the LED lamp 1 can be used as an alternative to a light bulb. Even when the lamp is mounted on an existing socket or an existing lamp holder, there is no need to reinforce the existing socket or the existing lamp holder in order to support the weight of the LED lamp 1, and it can be used instead. . Moreover, since the number of later-described radiating fins 25 can be increased by reducing the weight, the surface area can be increased and the heat dissipation can be improved more efficiently. As such a heat conductive resin, for example, a polycarbonate resin mixed with a high heat conductive carbon fiber (Lajema (registered trademark) manufactured by Teijin Limited in this embodiment) can be suitably used. Further, the body part 2 and the insulating cylinder part 10 are integrally formed by insert molding of a resin material, so that the joining becomes strong.

図3、図4に示すように、絶縁筒部10の終端10Aには、胴体部2側ほど拡径する導入穴部32が形成されている。導入穴部32には、終端10Aを貫通する配線孔31A、31Bが形成されている。
リード線9A、9Bは、電気回路基板8における口金3側の端に接続され、配線孔31A、31Bを通ってシェル5、及びアイレット7にそれぞれ接続される。配線孔31Aから引き出されたリード線9Aは、絶縁筒部10の終端10Aで外側に屈曲して絶縁筒部10の外側面に沿って延びシェル5に接続される。一方、配線孔31Bから引き出されたリード線9Bは、そのまま直線的に延びてアイレット7に接続される。絶縁筒部10に口金3を取り付ける際には、シェル5を絶縁筒部10の終端10Aに係合させた状態で、このシェル5を外周側から絶縁筒部10にかしめて固定する。
As shown in FIG. 3 and FIG. 4, an introduction hole portion 32 whose diameter increases toward the body portion 2 side is formed at the terminal end 10 </ b> A of the insulating cylinder portion 10. In the introduction hole portion 32, wiring holes 31A and 31B penetrating the terminal end 10A are formed.
The lead wires 9A and 9B are connected to the end of the electric circuit board 8 on the base 3 side, and are connected to the shell 5 and the eyelet 7 through the wiring holes 31A and 31B, respectively. The lead wire 9 </ b> A drawn out from the wiring hole 31 </ b> A is bent outward at the terminal end 10 </ b> A of the insulating tube portion 10, extends along the outer surface of the insulating tube portion 10, and is connected to the shell 5. On the other hand, the lead wire 9B drawn out from the wiring hole 31B extends straight as it is and is connected to the eyelet 7. When attaching the base 3 to the insulating cylinder portion 10, the shell 5 is caulked and fixed to the insulating cylinder portion 10 from the outer peripheral side with the shell 5 engaged with the terminal end 10 </ b> A of the insulating cylinder portion 10.

次いでLEDランプ1の発光部12について詳述する。
発光部12は、上述の通り、胴体部2における口金3と逆側の先端2Cに設けられている。発光部12は、板状のベース板13を有し、このベース板13の上面に、複数のLED15が実装されたLED基板16が設けられている。ベース板13は、胴体部2よりも大きな径の上面視略円板状の部材であり、裏面Aには胴体部2の先端2Cが連接されている。ベース板13、及び胴体部2は同一の材料、すなわち熱伝導性樹脂材から一体に成形されており、これらベース板13、胴体部2、及び絶縁筒部10により、LEDランプ1の筐体35が構成されている。
Next, the light emitting unit 12 of the LED lamp 1 will be described in detail.
As described above, the light emitting unit 12 is provided at the tip 2C on the opposite side of the base 3 in the body 2. The light emitting unit 12 has a plate-like base plate 13, and an LED substrate 16 on which a plurality of LEDs 15 are mounted is provided on the upper surface of the base plate 13. The base plate 13 is a substantially disk-shaped member having a larger diameter than that of the body portion 2 when viewed from above, and the front end 2C of the body portion 2 is connected to the back surface A. The base plate 13 and the body portion 2 are integrally formed from the same material, that is, a heat conductive resin material, and the base plate 13, the body portion 2, and the insulating cylinder portion 10 form the housing 35 of the LED lamp 1. Is configured.

図4はベース板13の平面図である。
同図に示すように、ベース板13の面内には、当該胴体部2の連接箇所に対応して、電気回路基板8を胴体部2に挿入するための上面視略円形(胴体部2と略同径)の挿入開口14が形成されている。電気回路基板8は、図3に示すように、胴体部2の先端2Cから絶縁筒部10にかけて延びる長さで、この胴体部2の中空形状に係合する正面視形状を有して形成されている。
FIG. 4 is a plan view of the base plate 13.
As shown in the figure, in the surface of the base plate 13, corresponding to the connecting part of the body part 2, a substantially circular shape (together with the body part 2 and the body part 2) for inserting the electric circuit board 8 into the body part 2. An insertion opening 14 having substantially the same diameter) is formed. As shown in FIG. 3, the electric circuit board 8 has a length extending from the distal end 2 </ b> C of the body portion 2 to the insulating cylinder portion 10 and has a front view shape that engages with the hollow shape of the body portion 2. ing.

図3に示すように、胴体部2の直径Rは、電気回路基板8の横幅と略同程度に形成されており、胴体部2の内側には、図4に示すように、胴体部2の終端2A側に電気回路基板8の幅方向の縁を挟み込む固定用溝部51Aが設けられる。また、この固定用溝部51Aに対向する位置には、胴体部2の先端2C側から終端2A側に延びる突き当て片51Bが設けられている。
電気回路基板8を挿入開口14から挿入すると、電気回路基板8の幅方向の一方の縁8Dが固定用溝部51Aに挟み込まれるとともに、この一方の縁8Dと対向する他方の縁8Eの1辺が突き当て片51Bの側面に突き当てられることで、この電気回路基板8が胴体部2内に固定される。
As shown in FIG. 3, the diameter R of the body portion 2 is formed to be approximately the same as the lateral width of the electric circuit board 8, and inside the body portion 2, as shown in FIG. A fixing groove 51A that sandwiches the edge in the width direction of the electric circuit board 8 is provided on the end 2A side. Further, an abutting piece 51B extending from the distal end 2C side to the terminal end 2A side of the body portion 2 is provided at a position facing the fixing groove portion 51A.
When the electric circuit board 8 is inserted from the insertion opening 14, one edge 8D in the width direction of the electric circuit board 8 is sandwiched by the fixing groove 51A, and one side of the other edge 8E facing the one edge 8D is The electric circuit board 8 is fixed in the body portion 2 by being abutted against the side surface of the abutting piece 51B.

また、この電気回路基板8は、図2に示すように、上端部8Cが固定ブッシュ27を介して後述するLED基板16によって押圧されて強固に固定される。なお、図3では固定ブッシュ27の図示を省略している。また、胴体部2の中には電気回路基板8を取り囲むように巻かれた絶縁シート28が設けられており、当該絶縁シート28により、胴体部2と電気回路基板8との間が電気的に絶縁されている。
特に、電気回路基板8の幅方向の一方の縁8Dを固定用溝部51Aで挟み込みつつ、一方の縁8Dと対向する他方の縁8Eの1辺を突き当て片51Bの側面に突き当てて固定することで、この電気回路基板8が胴体部2内にしっかりと固定されることから、胴体部2と電気回路基板8との間の絶縁距離を確実に確保することができる。
Further, as shown in FIG. 2, the upper end portion 8 </ b> C of the electric circuit board 8 is firmly fixed by being pressed by the LED board 16 described later via the fixing bush 27. In FIG. 3, the illustration of the fixed bush 27 is omitted. In addition, an insulating sheet 28 wound around the electric circuit board 8 is provided in the body part 2, and the insulating sheet 28 electrically connects the body part 2 and the electric circuit board 8. Insulated.
In particular, one edge 8D in the width direction of the electric circuit board 8 is sandwiched by the fixing groove 51A, and one side of the other edge 8E facing the one edge 8D is abutted against and fixed to the side surface of the abutting piece 51B. Thus, since the electric circuit board 8 is firmly fixed in the body part 2, an insulation distance between the body part 2 and the electric circuit board 8 can be reliably ensured.

LED15は、例えばSMDやCOBのようなLED素子をパッケージ化してなるLEDを好適に用いることができる。本実施形態では、LED15に白色LEDが用いられている。なお、LED15に白色以外の他の発光色のLEDを用いても良いことは勿論である。LED15は、図2に示すように、円板状の回路基板である上記LED基板16の上に複数配置されている。   As the LED 15, for example, an LED formed by packaging an LED element such as SMD or COB can be suitably used. In the present embodiment, a white LED is used as the LED 15. Needless to say, an LED having a light emitting color other than white may be used for the LED 15. As shown in FIG. 2, a plurality of LEDs 15 are arranged on the LED substrate 16 which is a disc-shaped circuit substrate.

LED基板16は、図2に示すように、上記ベース板13にネジ止め固定され、その略中央には、リード線引出開口17が形成されている。胴体部2に挿着された電気回路基板8から電力供給用の陽極及び陰極のリード線(図示せず)がリード線引出開口17を通じて引出されて、このLED基板16の上面に形成されている回路パターン80に電気的に接続され、当該回路パターンを通じて各LED15に電力が供給される。   As shown in FIG. 2, the LED substrate 16 is fixed to the base plate 13 with screws, and a lead wire lead-out opening 17 is formed at the approximate center thereof. A power supply anode and cathode lead wires (not shown) are drawn from the electric circuit board 8 inserted into the body 2 through a lead wire lead-out opening 17 and formed on the upper surface of the LED board 16. It is electrically connected to the circuit pattern 80, and power is supplied to each LED 15 through the circuit pattern.

ベース板13は、図2及び図3に示すように、周縁に沿って側壁19を有したトレー状を成し、この側壁19の内周面にLED基板16を覆うグローブ22が取り付けられている。このグローブ22と側壁19の間には、シール部材26が設けられており、グローブ22を側壁19に挿入するのに伴い、シール部材26がグローブ22と側壁19の間に挟み込まれる。このように、グローブ22と側壁19との間にシール部材26を挟み込むことで発光部12の防水性が保持される。
グローブ22には、図示を省略するが、LEDランプ1の銘番を内面に印刷や刻印等で設けている。これにより、LEDランプ1が風雨に晒されても銘番が消えることがなく、また擦れによって消えたりすることもない。
As shown in FIGS. 2 and 3, the base plate 13 has a tray shape having a side wall 19 along the periphery, and a globe 22 that covers the LED substrate 16 is attached to the inner peripheral surface of the side wall 19. . A seal member 26 is provided between the globe 22 and the side wall 19, and the seal member 26 is sandwiched between the globe 22 and the side wall 19 as the globe 22 is inserted into the side wall 19. Thus, the waterproofness of the light emitting unit 12 is maintained by sandwiching the sealing member 26 between the globe 22 and the side wall 19.
Although not illustrated, the globe 22 is provided with the name of the LED lamp 1 on the inner surface by printing, engraving, or the like. Thereby, even if the LED lamp 1 is exposed to wind and rain, the name number does not disappear, and it does not disappear due to rubbing.

図2及び図3に示すように、発光部12には、各LED15から側壁19に向かい遮光される光線成分Saを反射させ、グローブ22から取り出して照明に利用可能にすべく、環状の反射体21が設けられている。環状の反射体21には、各LED15を取り囲むようにベース板13の円周に沿って配置され、LED15から入射する光線成分Saをグローブ22に向けて反射する反射面21Aが形成されている。かかる反射体21を備えることで、LEDランプ1の光利用効率が向上し、また、水平方向(LED基板16の面に平行な方向)への光の拡がりが抑えられる。
なお、各LED15から側壁19に向かって遮光される光線成分Saをグローブ22から取り出して照明に利用可能にすべく、反射体21の反射面21Aは、高い反射率が得られるように高反射グレード素材を使用しているが、アルミニウム蒸着等でも良い。また、カバーには、拡散材を添加したり、シボ加工を施したり、ショットブラスト等による表面処理により、拡散性を持たせてもよい。
As shown in FIGS. 2 and 3, the light-emitting unit 12 reflects the light component Sa that is shielded from each LED 15 toward the side wall 19, and is extracted from the globe 22 so that it can be used for illumination. 21 is provided. The annular reflector 21 is formed with a reflecting surface 21 </ b> A that is disposed along the circumference of the base plate 13 so as to surround each LED 15 and reflects the light ray component Sa incident from the LED 15 toward the globe 22. By providing such a reflector 21, the light use efficiency of the LED lamp 1 is improved, and the spread of light in the horizontal direction (direction parallel to the surface of the LED substrate 16) is suppressed.
Note that the reflecting surface 21A of the reflector 21 has a high reflection grade so that a high reflectance can be obtained so that the light ray component Sa shielded from each LED 15 toward the side wall 19 can be extracted from the globe 22 and used for illumination. Although the material is used, aluminum vapor deposition or the like may be used. Further, the cover may be provided with diffusibility by adding a diffusing material, applying a texture, or performing a surface treatment such as shot blasting.

LED基板16とベース板13の間には、図2及び図3に示すように、LED基板16と同等の面積かそれ以下の大きさのLED基板用放熱シート20が挟まれており、LED15の発熱がLED基板16からLED基板用放熱シート20を通じてベース板13に効率良く導かれ、このベース板13を含む筐体35の全体から外気に放熱される。なお、LED基板用放熱シート20を用いることなく、LED基板16の裏面に放熱性能を有する弾性材質からなる樹脂を所要の厚さコートし一体化する構成としても良い。LED基板用放熱シート20またはLED基板16の裏面のコートに絶縁性能を持たせても良い。
すなわち、ベース板13及び上記胴体部2は共に高熱伝導性を有する材料から一体に形成されていることから、ベース板13と胴体部2の間の熱抵抗は小さく、ベース板13に導かれた熱が胴体部2にロスを少なくして伝えられる。
As shown in FIGS. 2 and 3, an LED board heat dissipation sheet 20 having an area equivalent to or smaller than the LED board 16 is sandwiched between the LED board 16 and the base plate 13. Heat generation is efficiently guided from the LED substrate 16 to the base plate 13 through the LED substrate heat-dissipating sheet 20, and is radiated from the entire casing 35 including the base plate 13 to the outside air. In addition, it is good also as a structure which coat | covers resin which consists of an elastic material which has heat dissipation performance for required thickness on the back surface of LED board 16, and is integrated, without using LED board heat dissipation sheet 20. The insulation performance may be imparted to the coating on the back surface of the LED board heat radiation sheet 20 or the LED board 16.
That is, since both the base plate 13 and the body portion 2 are integrally formed from a material having high thermal conductivity, the thermal resistance between the base plate 13 and the body portion 2 is small and led to the base plate 13. Heat is transmitted to the body part 2 with less loss.

また、LED基板用放熱シートの代わりに銅やアルミ等熱伝導率の高い金属板をLED基板16とベース板13の間に設置してもよい。LED基板16からの熱をベース板13に効率よく伝えるとともに、金属板がヒートスプレッダとして働き複数のLED15からの熱をベース板13の全体に伝え、放熱フィン25の全体から放熱することで放熱効率を上げることができる。
尚、金属板をLED基板16よりも大きく形成し、金属板をヒートシンクとして利用することもできる。このとき金属板の周縁部を折り曲げ放熱面積を増やしてもよい。
Further, a metal plate having high thermal conductivity such as copper or aluminum may be installed between the LED substrate 16 and the base plate 13 instead of the LED substrate heat dissipation sheet. The heat from the LED board 16 is efficiently transmitted to the base plate 13, and the metal plate functions as a heat spreader to transmit the heat from the plurality of LEDs 15 to the entire base plate 13 and dissipate heat from the entire radiation fins 25 to increase the heat radiation efficiency. Can be raised.
In addition, a metal plate can be formed larger than the LED board 16, and a metal plate can also be utilized as a heat sink. At this time, the peripheral portion of the metal plate may be bent to increase the heat radiation area.

胴体部2の外周面には、先端2Cから終端2Aに延びる板状の放熱フィン25が胴体部2の軸線を中心にして放射状に多数立設されており、胴体部2に導かれた熱が各放熱フィン25から放熱される。各放熱フィン25は、フィン端部25Aがベース板13の裏面13Aに連接されるとともに、これら放熱フィン25、胴体部2及びベース板13が一体に形成されている。これにより、胴体部2に伝わった熱がロスなく放熱フィン25から放熱されるとともに、ベース板13からも直接放熱フィン25に熱が伝えられることから、放熱フィン25への伝熱量が増加して高い放熱性能が得られる。   A large number of plate-like heat radiation fins 25 extending radially from the front end 2 </ b> C to the end end 2 </ b> A are erected on the outer peripheral surface of the body portion 2 centering on the axis of the body portion 2. The heat is radiated from each heat radiating fin 25. Each radiating fin 25 has a fin end 25 </ b> A connected to the back surface 13 </ b> A of the base plate 13, and the radiating fin 25, the body portion 2, and the base plate 13 are integrally formed. As a result, heat transmitted to the body portion 2 is radiated from the radiation fins 25 without loss, and heat is also transmitted directly from the base plate 13 to the radiation fins 25, so that the amount of heat transferred to the radiation fins 25 increases. High heat dissipation performance can be obtained.

また胴体部2の直径Rは、上述の通り、内蔵の電気回路基板8が収まる程度(電気回路基板8の幅程度)に小さく形成されているため、LED基板16とベース板13の接触面積を確保できLED基板16とベース板13間での伝熱量を多くできる。これに加え、ベース板13と胴体部2の径の差も大きくなるため、放熱フィン25のフィン端部25Aを胴体部2からベース板13の縁部(側壁19)まで延びる長さとすることで、このフィン端部25Aと裏面13Aの接触面積も大きくなり、より多くの発熱を放熱フィン25に導き放熱できる。このようにして放熱フィン25への伝熱量が確保されるため、放熱フィン25の厚みを例えば2.5mm以下まで薄くしても十分は放熱性能が維持でき、これにより、放熱フィン25の薄型化の分だけ軽量化が図られる。   Further, as described above, the diameter R of the body portion 2 is formed to be small enough to accommodate the built-in electric circuit board 8 (about the width of the electric circuit board 8), so that the contact area between the LED board 16 and the base plate 13 is reduced. The amount of heat transfer between the LED substrate 16 and the base plate 13 can be increased. In addition to this, since the difference in diameter between the base plate 13 and the body portion 2 also increases, the fin end portion 25A of the radiating fin 25 has a length extending from the body portion 2 to the edge portion (side wall 19) of the base plate 13. The contact area between the fin end 25A and the back surface 13A is also increased, and more heat can be guided to the radiation fins 25 and dissipated. Since the amount of heat transfer to the radiation fins 25 is ensured in this way, the radiation performance can be sufficiently maintained even if the thickness of the radiation fins 25 is reduced to, for example, 2.5 mm or less. The weight can be reduced by that amount.

また電気回路基板8にあっては、絶縁筒部10から胴体部2の先端2Cにかけて延びる長さに形成されているため、胴体部2に装着した状態では、図3に示すように、電気回路基板8の下端部8Aが口金3の近傍に位置する。
したがって、例えば、この状態において、胴体部2及び絶縁筒部10のフィン無し区間45に対応する箇所に電気回路基板8の電気回路のうち、熱的な影響を受け易い(熱から保護すべき)電気回路部品を配置する構成として、電気回路部品を放熱フィン25の熱から保護するという使い方もできる。
Further, since the electric circuit board 8 is formed to have a length extending from the insulating cylinder portion 10 to the distal end 2C of the body portion 2, when the electric circuit board 8 is mounted on the body portion 2, as shown in FIG. A lower end 8 </ b> A of the substrate 8 is located in the vicinity of the base 3.
Therefore, for example, in this state, the portion corresponding to the finless section 45 of the body portion 2 and the insulating cylinder portion 10 is susceptible to thermal influence among the electric circuits of the electric circuit board 8 (should be protected from heat). As a configuration in which the electric circuit component is disposed, the electric circuit component can be protected from the heat of the heat radiation fin 25.

なお、胴体部2及びベース板13を絶縁性塗料を用いて表面塗装することで、筐体35への漏電をより確実に防止できる。ただし、ベース板13表面には塗装を施さずに表面の粗さがこまかい方が胴体部2の熱伝導が良いことから、十分な絶縁性が確保されている場合には、ベース板13表面への塗装による絶縁は必ずしも必要ではない。   In addition, the surface leakage of the body part 2 and the base plate 13 using an insulating paint can prevent the leakage to the casing 35 more reliably. However, if the surface of the base plate 13 is not coated and the surface roughness is high, the heat conduction of the body portion 2 is good. If sufficient insulation is ensured, the surface of the base plate 13 is moved to the surface. Insulation by painting is not always necessary.

ところで、胴体部2にあっては直径Rを電気回路基板8の幅程度まで小さくすると、胴体部2に電気回路基板8が近接し、胴体部2と電気回路基板8との間の電気的な絶縁性能が劣化する。そこで、上述の通り、胴体部2の中には、電気回路基板8を囲むように巻いた絶縁シート28を設けることにより、胴体部2の内側面の全体を絶縁シート28で覆い、電気回路基板8と胴体部2の間の絶縁性能を高めることとしている。絶縁シート28は可撓性及び絶縁性を有する1枚のシートを帯状に形成したものであって、胴体部2への装着時には、シートの両端同士が重なるように筒状に巻いた状態でベース板13の挿入開口14から挿入される。胴体部2の中では絶縁シート28が巻き戻りによって拡がり、このときの巻き戻る力によって胴体部2の内側面を覆うように装着される。このように、絶縁シート28を帯状に形成し、巻いた状態でベース板13の挿入開口14に挿入し、絶縁シート28の巻き戻りによって胴体部2の中に装着する構成としたため、胴体部2の内側面の全面を覆うように絶縁シート28を簡単に装着することができる。   By the way, when the diameter R of the body part 2 is reduced to about the width of the electric circuit board 8, the electric circuit board 8 comes close to the body part 2, and an electrical connection between the body part 2 and the electric circuit board 8 occurs. Insulation performance deteriorates. Therefore, as described above, the body part 2 is provided with the insulating sheet 28 wound so as to surround the electric circuit board 8, thereby covering the entire inner surface of the body part 2 with the insulating sheet 28. It is supposed that the insulation performance between 8 and the trunk | drum 2 is improved. The insulating sheet 28 is formed by forming a single sheet having flexibility and insulation into a strip shape. When the insulating sheet 28 is attached to the body portion 2, the base sheet is wound in a cylindrical shape so that both ends of the sheet overlap each other. It is inserted from the insertion opening 14 of the plate 13. In the body part 2, the insulating sheet 28 expands by rewinding, and is mounted so as to cover the inner surface of the body part 2 by the rewinding force at this time. In this way, the insulating sheet 28 is formed in a band shape, inserted into the insertion opening 14 of the base plate 13 in a wound state, and mounted in the body part 2 by rewinding the insulating sheet 28, so that the body part 2 The insulating sheet 28 can be easily attached so as to cover the entire inner surface of the cover.

次いで、胴体部2と絶縁筒部10との接合構造について説明する。
胴体部2は、放熱性に優れた材料から形成され、上述したように、熱伝導性樹脂から形成される。胴体部2は、非結晶性樹脂から形成され、本実施形態では上述したように、高熱伝導性のカーボン繊維を混入したポリカーボネイトから形成される。絶縁筒部10は、結晶性樹脂から形成される。絶縁筒部10は、特に、絶縁性が高く、耐薬品性に優れた材料から形成されるのが望ましい。絶縁筒部10は、本実施形態では、PBT(ポリブチレンテレフタレート)から形成される。このように、胴体部2は、非結晶性樹脂から、絶縁筒部10は、結晶性樹脂から形成されるが、非結晶性樹脂としては、ポリカーボネイトの他に例えば、メタクリル樹脂、ポリスチレン、ポリエーテルスルホン等を用いることができ、結晶性樹脂としては、ポリブチレンテレフタレートの他に例えば、ポリアセタール、ポリエチレンテレフタレート、ポリフェニレンスルフィド等を用いることができる。
Next, a joint structure between the body part 2 and the insulating cylinder part 10 will be described.
The trunk | drum 2 is formed from the material excellent in heat dissipation, and as above-mentioned, it is formed from heat conductive resin. The body portion 2 is formed from an amorphous resin, and in the present embodiment, as described above, is formed from a polycarbonate mixed with carbon fiber having high thermal conductivity. The insulating cylinder part 10 is formed from crystalline resin. The insulating cylinder portion 10 is particularly preferably formed from a material having high insulating properties and excellent chemical resistance. Insulating cylinder part 10 is formed from PBT (polybutylene terephthalate) in this embodiment. As described above, the body portion 2 is formed from an amorphous resin, and the insulating cylinder portion 10 is formed from a crystalline resin. Examples of the amorphous resin include, in addition to polycarbonate, methacrylic resin, polystyrene, polyether, and the like. For example, polyacetal, polyethylene terephthalate, polyphenylene sulfide, and the like can be used as the crystalline resin in addition to polybutylene terephthalate.

絶縁筒部10は、予め成形された胴体部2の終端2Aに、インサート成形によって形成される。つまり、1次成形品としてのポリカーボネイトから成る胴体部2に、PBTの絶縁筒部10が2次成形される。PBTとポリカーボネイトとは、各々の成形収縮率が違ため、インサート成形による接合面が密着されにくい。また、PBTとポリカーボネイトとは、各々の熱膨張率が違うため、LED15の点灯/消灯による熱膨張/収縮で接合面に間隙が生じる場合がある。   The insulating cylinder portion 10 is formed by insert molding at a terminal end 2A of the body portion 2 molded in advance. That is, the PBT insulating tube portion 10 is secondarily formed on the body portion 2 made of polycarbonate as a primary molded product. PBT and polycarbonate are different from each other in molding shrinkage ratio, so that the joint surface by insert molding is hardly adhered. In addition, since PBT and polycarbonate have different thermal expansion coefficients, there may be a gap in the joint surface due to thermal expansion / contraction caused by turning on / off the LED 15.

胴体部2と絶縁筒部10との接合面に間隙が生じると、LEDランプ1の防水性が損なわれることとなる。そこで、本実施形態では、図5(A)に示すように、胴体部2の、絶縁筒部10と接合する終端2Aに、当該終端2Aを内径方向に曲げた曲部200が形成される。曲部200は、図5(C)に示すように、終端2Aを、少なくとも胴体部2の内径方向に曲げて形成される。また、曲部200は、図5(B)に示すように、終端2Aを内径方向に曲げた第一曲部200Aと、第一曲部200Aの終端部をさらに口金3が取り付けられる側に曲げた第二曲部200Bを備えていても良い。
絶縁筒部10は、図5(B)及び図5(C)に示すように、胴体部2の終端2Aの曲部200を上下及び内外方向から包囲するように形成される。絶縁筒部10を形成するPBTは、胴体部2を形成するポリカーボネイトと比較して成形収縮率が大きい。このため絶縁筒部10を、曲部200を上下及び内外方向から包囲するようにインサート成形することで、絶縁筒部10が曲部200を包み込んで収縮する。この構成によれば、胴体部2と絶縁筒部10との接合面に成形収縮によって間隙が生じることがない。
If a gap is generated in the joint surface between the body portion 2 and the insulating cylinder portion 10, the waterproofness of the LED lamp 1 is impaired. Therefore, in the present embodiment, as shown in FIG. 5A, a curved portion 200 is formed by bending the terminal end 2A in the inner diameter direction at the terminal end 2A of the body portion 2 joined to the insulating cylinder portion 10. As shown in FIG. 5C, the curved portion 200 is formed by bending the terminal end 2 </ b> A at least in the inner diameter direction of the body portion 2. Further, as shown in FIG. 5B, the curved portion 200 is bent to a side where the base 3 is further attached, and a first curved portion 200A obtained by bending the terminal end 2A in the inner diameter direction, and a terminal portion of the first curved portion 200A. The 2nd music part 200B may be provided.
As shown in FIGS. 5 (B) and 5 (C), the insulating cylinder portion 10 is formed so as to surround the curved portion 200 of the terminal end 2A of the body portion 2 from above and below and from inside and outside. The PBT forming the insulating cylinder portion 10 has a larger molding shrinkage rate than the polycarbonate forming the body portion 2. For this reason, the insulating cylinder part 10 wraps around the bending part 200 and shrinks by insert-molding the insulating cylinder part 10 so as to surround the bending part 200 from above and below and from inside and outside. According to this configuration, a gap does not occur on the joint surface between the body portion 2 and the insulating cylinder portion 10 due to molding shrinkage.

また、LED15の点灯/消灯によって、胴体部2及び絶縁筒部10が各々膨張/収縮しても、曲部200が絶縁筒部10に包み込まれている、つまり、絶縁筒部10が曲部200の上下及び内外から挟み込むため、胴体部2及び絶縁筒部10の各々が単独で動くことがなく、胴体部2と絶縁筒部10との接合面に間隙が生じることがない。
これにより、異種材料間のインサート成形においても、胴体部2と絶縁筒部10との接合面を密着させることができ、接合面に間隙が生じるのを防ぐことができるため、LEDランプ1の防水性能を向上させることができる。なお、本実施形態では、胴体部2の終端2Aを内径方向に曲げて曲部200を形成する構成としたが、これに限らず、胴体部2の終端2Aを、絶縁筒部10により上下及び内外方向から包囲することができ、射出成形により形成できる任意の形状とすることができる。
Further, even if the body portion 2 and the insulating cylinder portion 10 are expanded / contracted by turning on / off the LED 15, the curved portion 200 is encased in the insulating cylindrical portion 10, that is, the insulating cylindrical portion 10 is bent. Since the body part 2 and the insulating cylinder part 10 do not move independently, there is no gap in the joint surface between the body part 2 and the insulating cylinder part 10.
As a result, even in insert molding between different materials, the joint surface between the body portion 2 and the insulating tube portion 10 can be brought into close contact with each other, and a gap can be prevented from being formed on the joint surface. Performance can be improved. In the present embodiment, the end portion 2A of the body portion 2 is bent in the inner diameter direction to form the curved portion 200. However, the present invention is not limited thereto, and the end portion 2A of the body portion 2 is It can be enclosed from the inside and outside directions, and can have any shape that can be formed by injection molding.

ところで、電気回路基板8を筐体35内部に挿入して格納する際に、電気回路基板8の下端部8Aに接続されたリード線9A、9Bを導入穴部32を介して配線孔31A、31Bに通す必要がある。配線孔31A、31Bの孔径が小さいと、そこにリード線9A、9Bを通す工程の作業性が悪い。一方、配線孔31A、31Bの孔径が大きい方がリード線9A、9Bを通し易いが、孔径が大きいと配線孔31A、31Bから筐体35内部に粉塵が入り易くなるという問題がある。
そこで、配線孔31A、31Bの孔径を大きくすることなく、配線孔31A、31Bにリード線9A、9Bを通し易くするために、本実施形態では、図6に示すように、導入穴部32を胴体部2側ほど拡径するロート状に形成している。
By the way, when the electric circuit board 8 is inserted into the housing 35 and stored, the lead wires 9A and 9B connected to the lower end portion 8A of the electric circuit board 8 are connected to the wiring holes 31A and 31B via the introduction holes 32. It is necessary to pass through. If the hole diameters of the wiring holes 31A, 31B are small, the workability of the process of passing the lead wires 9A, 9B there is poor. On the other hand, if the hole diameters of the wiring holes 31A and 31B are larger, the lead wires 9A and 9B are easier to pass. However, if the hole diameter is larger, there is a problem that dust easily enters the housing 35 from the wiring holes 31A and 31B.
Therefore, in order to make it easier to pass the lead wires 9A and 9B through the wiring holes 31A and 31B without increasing the hole diameters of the wiring holes 31A and 31B, in this embodiment, as shown in FIG. It is formed in a funnel shape whose diameter increases toward the body part 2 side.

電気回路基板8は表裏の面が実装面として用いることができる基板であり、表裏の面に電子部品が実装され、リード線9A、9Bは、電気回路基板8の一方の実装面108Aに接続されている。電気回路基板8には、上述したように、下端部8A側に熱的な影響を受け易い電子部品が載置される。これらの熱的な影響を受け易い電子部品のうち、他の部品に比べて背の高い部品、つまり、他の部品に比べて電気回路基板8の実装面から著しく突出する電子部品Eは、電気回路基板8のリード線9A、9Bが延出された一方の実装面108Aに載置される。   The electric circuit board 8 is a board whose front and back surfaces can be used as mounting surfaces, electronic components are mounted on the front and back surfaces, and the lead wires 9A and 9B are connected to one mounting surface 108A of the electric circuit board 8. ing. As described above, electronic components that are susceptible to thermal influence are placed on the electric circuit board 8 on the lower end portion 8A side. Among these electronic components that are easily affected by heat, a component that is taller than other components, that is, an electronic component E that significantly protrudes from the mounting surface of the electric circuit board 8 as compared with other components, The lead wires 9 </ b> A and 9 </ b> B of the circuit board 8 are placed on the one mounting surface 108 </ b> A that is extended.

配線孔31A、31Bは、図4に示すように、胴体部2の軸中心を通る線Xa上に並べて配設される。電気回路基板8は、幅方向がこの線Xaと平行に並び、且つ胴体部2の軸中心からはずらして、筐体35内に格納される。導入穴部32は、胴体部2側ほど拡径するロート状に形成されるが、筐体35内に格納された電気回路基板8の一方の実装面108Aに対向する側の傾斜面32Aのランプ軸線Xからの傾き角度は、図6に示すように、他方の実装面108Bに対向する側の傾斜面32Bのランプ軸線Xからの傾き角度より小さく形成されている。電気回路基板8が筐体35内部に挿入された際には、リード線9A、9Bが傾斜面32Aにぶつかり、傾斜面32Aに案内されて、配線孔31A、31Bに挿入される。傾斜面32Aのランプ軸線Xからの傾き角度は45度以下に設定されるのが望ましく、この構成によれば、リード線9A、9Bが傾斜面32Aの斜面にぶつかった際に掛かる力が傾斜面32Aに沿う方向に向かうように分解され、この力により、リード線9A、9Bを容易に配線孔31A、31Bに挿入することができる。   As shown in FIG. 4, the wiring holes 31 </ b> A and 31 </ b> B are arranged side by side on a line Xa passing through the axial center of the body portion 2. The electric circuit board 8 is stored in the housing 35 with the width direction aligned in parallel with the line Xa and shifted from the axial center of the body 2. The introduction hole portion 32 is formed in a funnel shape whose diameter increases toward the body portion 2 side, but the ramp on the inclined surface 32 </ b> A on the side facing the one mounting surface 108 </ b> A of the electric circuit board 8 stored in the housing 35. As shown in FIG. 6, the inclination angle from the axis X is formed smaller than the inclination angle from the lamp axis X of the inclined surface 32B on the side facing the other mounting surface 108B. When the electric circuit board 8 is inserted into the housing 35, the lead wires 9A and 9B collide with the inclined surface 32A, are guided by the inclined surface 32A, and are inserted into the wiring holes 31A and 31B. The inclination angle of the inclined surface 32A from the ramp axis X is preferably set to 45 degrees or less. According to this configuration, the force applied when the lead wires 9A and 9B hit the inclined surface of the inclined surface 32A is inclined. The lead wires 9A and 9B can be easily inserted into the wiring holes 31A and 31B by this force.

電気回路基板8を筐体35内部に挿入する際には、幅方向を配線孔31A、31Bの並び方向と略平行にすると共に、リード線9A、9Bが延出された一方の実装面108Aを、電気回路基板8が筐体35内部に格納された際に広くスペースが空く方に向けて挿入する。本実施形態によれば、導入穴部32を配線孔31A、31Bに向かって一方の傾斜面32Aのランプ軸線Xからの傾き角度を、他方の傾斜面32Bのランプ軸線Xからの傾き角度より小さく形成し、ランプ軸線Xからの傾き角度の小さい傾斜面32Aに沿わせてリード線9A、9Bを挿入することで、リード線9A、9Bを配線孔31A、31Bに挿入しやすくすることができる。また、ランプ軸線Xからの傾き角度の大きい傾斜面32B側にランプ軸線Xからずらして電気回路基板8を挿入し、広くスペースが取れる方を向く実装面108Aに他の部品に比べて背の高い電子部品Eを配置したため、絶縁筒部10の全長を延ばすことなく、電子部品を収容するスペースを確保することができる。   When the electric circuit board 8 is inserted into the housing 35, the width direction is made substantially parallel to the arrangement direction of the wiring holes 31A and 31B, and one mounting surface 108A from which the lead wires 9A and 9B are extended is formed. When the electric circuit board 8 is stored in the housing 35, the electric circuit board 8 is inserted toward a direction where a large space is available. According to this embodiment, the inclination angle from the ramp axis X of one inclined surface 32A toward the wiring holes 31A and 31B through the introduction hole 32 is smaller than the inclination angle from the ramp axis X of the other inclined surface 32B. By forming and inserting the lead wires 9A and 9B along the inclined surface 32A having a small inclination angle from the lamp axis X, the lead wires 9A and 9B can be easily inserted into the wiring holes 31A and 31B. Further, the electric circuit board 8 is inserted on the inclined surface 32B side having a large inclination angle from the lamp axis X so as to be shifted from the lamp axis X, and the mounting surface 108A facing the direction where a large space can be taken is taller than other components. Since the electronic component E is disposed, a space for accommodating the electronic component can be secured without extending the entire length of the insulating cylinder portion 10.

以上説明したように、本実施形態のLEDランプ1によれば、LED15(発光素子)を実装したLED基板16と、当該LED基板16が表面に載置されたベース板13(平板部)と、ベース板13の裏面13Aから延びる胴体部2と、胴体部2の終端に設けられた絶縁性の絶縁筒部10を介して接続される口金3と、を有するLEDランプ1であって、胴体部2と、絶縁筒部10とは、互いに異なる樹脂から一体に成形され、胴体部2は、絶縁筒部10と接合する終端2Aに、少なくとも径方向に曲げられた曲部200を備え、胴体部2の終端2Aに設けられた曲部200を絶縁筒部10により上下及び内外方向から包囲するように形成した。
この構成によれば、胴体部2の終端2Aの曲部200を上下及び内外方向から包囲するように絶縁筒部10を形成したため、接合性を向上することができる。また、LED15の点灯/消灯により部材が各々膨張/縮小しても、胴体部2の終端2Aの曲部200が絶縁筒部10の内側に挟み込まれた状態となるため、胴体部2の終端2Aと絶縁筒部10とがそれぞれ単独では動くことがない。
As described above, according to the LED lamp 1 of the present embodiment, the LED substrate 16 on which the LED 15 (light emitting element) is mounted, the base plate 13 (flat plate portion) on which the LED substrate 16 is mounted, An LED lamp 1 having a body part 2 extending from a back surface 13A of a base plate 13 and a base 3 connected via an insulating insulating cylinder part 10 provided at the end of the body part 2, 2 and the insulating cylinder part 10 are integrally formed from different resins, and the body part 2 is provided with a bent part 200 bent at least in the radial direction at the terminal end 2A joined to the insulating cylinder part 10. The bent portion 200 provided at the second end 2A is formed so as to be surrounded by the insulating cylinder portion 10 from above and below and from inside and outside.
According to this configuration, since the insulating cylinder portion 10 is formed so as to surround the curved portion 200 of the terminal end 2A of the body portion 2 from above and below and from inside and outside, the joining property can be improved. Further, even if the members are expanded / reduced by turning on / off the LED 15, the bent portion 200 of the terminal end 2 </ b> A of the body portion 2 is sandwiched inside the insulating cylinder portion 10, and therefore the terminal end 2 </ b> A of the body portion 2. And the insulating cylinder 10 do not move independently.

また、本実施形態のLEDランプ1によれば、胴体部2は、絶縁筒部10よりも放熱性に優れた非結晶性の樹脂から形成され、絶縁筒部10は、胴体部2よりも耐薬品性に優れた結晶性の樹脂から形成されている。この構成によれば、胴体部2の放熱性を向上するとともに、胴体部2から放熱フィン25に熱を効率よく導いて放熱させることができる。また、絶縁筒部10を結晶性の耐薬品性に優れた樹脂から形成したため、絶縁筒部10が溶剤等により劣化することがなく、胴体部2と口金3との絶縁性を保つことができる。   Further, according to the LED lamp 1 of the present embodiment, the body portion 2 is formed of an amorphous resin that has better heat dissipation than the insulating tube portion 10, and the insulating tube portion 10 is more resistant than the body portion 2. It is formed from a crystalline resin with excellent chemical properties. According to this configuration, the heat dissipation of the body portion 2 can be improved, and heat can be efficiently guided from the body portion 2 to the radiation fins 25 to be radiated. Further, since the insulating cylinder portion 10 is formed of a resin having excellent crystalline chemical resistance, the insulating cylinder portion 10 is not deteriorated by a solvent or the like, and the insulation between the body portion 2 and the base 3 can be maintained. .

また、本実施形態のLEDランプ1によれば、胴体部2と絶縁筒部10とをインサート成形により一体成形した。この構成によれば、ベース板13及び放熱フィン25と一体成形された胴体部2に絶縁筒部10をインサート成形により一体成形したため、部品点数を少なくし、組み立て性を向上することができる。   Moreover, according to the LED lamp 1 of this embodiment, the trunk | drum 2 and the insulation cylinder part 10 were integrally molded by insert molding. According to this structure, since the insulating cylinder part 10 was integrally molded by insert molding in the trunk | drum 2 integrally molded with the base plate 13 and the radiation fin 25, the number of parts can be reduced and assembly property can be improved.

また、本実施形態のLEDランプ1によれば、胴体部2をポリカーボネイトで形成し、絶縁筒部10をポリブチレンテレフタレートで形成した。この構成によれば、胴体部2を耐熱耐衝撃性に優れた構造とすることができると共に、絶縁筒部10を耐薬品性に優れた構造とすることができる。   Further, according to the LED lamp 1 of the present embodiment, the body portion 2 is formed of polycarbonate, and the insulating cylinder portion 10 is formed of polybutylene terephthalate. According to this configuration, the body portion 2 can have a structure excellent in thermal shock resistance, and the insulating cylinder portion 10 can have a structure excellent in chemical resistance.

なお、上述した実施形態は、あくまでも本発明の一態様を示すものであり、本発明の趣旨を逸脱しない範囲で任意に変形及び応用が可能である。   The above-described embodiment is merely an aspect of the present invention, and can be arbitrarily modified and applied without departing from the spirit of the present invention.

1 LEDランプ
2 胴体部
2A 終端
2C 先端
3 口金
8 電気回路基板
8A 下端部
9A リード線
9B リード線
10 絶縁筒部
10A 終端
13 ベース板
13A 裏面
15 LED
16 LED基板
22 グローブ
25 放熱フィン
31A 配線孔
31B 配線孔
32A 傾斜面
32B 傾斜面
35 筐体
108A 実装面
108B 実装面
200 曲部
200A 第一曲部
200B 第二曲部
DESCRIPTION OF SYMBOLS 1 LED lamp 2 Body part 2A Termination 2C Tip 3 Base 8 Electric circuit board 8A Lower end part 9A Lead wire 9B Lead wire 10 Insulating cylinder part 10A Termination 13 Base board 13A Back surface 15 LED
16 LED board 22 Globe 25 Radiation fin 31A Wiring hole 31B Wiring hole 32A Inclined surface 32B Inclined surface 35 Housing 108A Mounting surface 108B Mounting surface 200 Curved portion 200A First curved portion 200B Second curved portion

Claims (3)

発光素子を実装した基板と、当該基板が表面に載置された平板部と、前記平板部の裏面から延びる胴体部と、前記胴体部の終端に設けられた絶縁性の筒部を介して接続される口金と、を有するランプであって、
前記胴体部と、前記筒部とは、互いに異なる樹脂から一体に成形され、
前記胴体部は、前記筒部よりも放熱性に優れた非結晶性の樹脂から形成され、かつ前記筒部を形成する樹脂は、前記胴体部を形成する樹脂よりも成形収縮率が大きく、
前記胴体部は、前記筒部と接合する終端に、少なくとも径方向に曲げられた曲部を備え、
前記曲部を前記筒部により上下及び内外方向から包囲するようにインサート成形により一体に形成した
ことを特徴とするランプ。
Connected via a substrate on which a light emitting element is mounted, a flat plate portion on which the substrate is mounted, a trunk portion extending from the back surface of the flat plate portion, and an insulating cylinder provided at the end of the trunk portion A lamp having a base,
The trunk portion and the cylindrical portion are integrally molded from different resins,
The body part is formed from an amorphous resin having better heat dissipation than the cylinder part, and the resin forming the cylinder part has a larger molding shrinkage than the resin forming the body part,
The trunk portion includes a bent portion bent at least in a radial direction at a terminal end joined to the cylindrical portion,
The lamp is characterized in that the curved portion is integrally formed by insert molding so as to surround the tubular portion from above and below and from inside and outside.
記筒部は、前記胴体部よりも耐薬品性に優れた結晶性の樹脂から形成されたことを特徴とする請求項1に記載のランプ。 Prior Symbol cylindrical portion, the lamp according to claim 1, characterized in that it is formed from a high crystalline resin chemical resistance than the body portion. 前記胴体部をポリカーボネイトで形成し、前記筒部をポリブチレンテレフタレートで形成したことを特徴とする請求項1または2に記載のランプ。 The lamp according to claim 1 or 2 , wherein the body portion is made of polycarbonate and the cylindrical portion is made of polybutylene terephthalate.
JP2015110090A 2015-05-29 2015-05-29 lamp Active JP6554913B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015110090A JP6554913B2 (en) 2015-05-29 2015-05-29 lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015110090A JP6554913B2 (en) 2015-05-29 2015-05-29 lamp

Publications (2)

Publication Number Publication Date
JP2016225130A JP2016225130A (en) 2016-12-28
JP6554913B2 true JP6554913B2 (en) 2019-08-07

Family

ID=57746812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015110090A Active JP6554913B2 (en) 2015-05-29 2015-05-29 lamp

Country Status (1)

Country Link
JP (1) JP6554913B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3544291B1 (en) 2016-11-18 2021-09-08 JVCKENWOOD Corporation Recording device, recording method and program

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003220887A (en) * 2002-01-30 2003-08-05 Togo Seisakusho Corp Illuminator
JP4854798B2 (en) * 2010-05-31 2012-01-18 シャープ株式会社 Lighting device
JP2012119281A (en) * 2010-12-03 2012-06-21 Iwasaki Electric Co Ltd Lamp
KR20130025718A (en) * 2011-09-02 2013-03-12 삼성전자주식회사 Light emitting device lamp
US9528693B2 (en) * 2013-02-28 2016-12-27 Lg Innotek Co., Ltd. Lighting device

Also Published As

Publication number Publication date
JP2016225130A (en) 2016-12-28

Similar Documents

Publication Publication Date Title
JP5353216B2 (en) LED bulb and lighting fixture
US8500301B2 (en) Illuminant device and manufacturing method of lamp holder
WO2012020830A1 (en) Lamp and optical component
JP5280496B2 (en) Lighting device
JP5636923B2 (en) lamp
JP5190105B2 (en) LED lamp
JP5575715B2 (en) Light bulb type lighting device
JP2012038691A (en) Led lamp
JP5569372B2 (en) Lamp and lamp device
JP6554913B2 (en) lamp
WO2013042238A1 (en) Light-bulb shape led lamp
WO2013046294A1 (en) Bulb-type lamp
JP2010073627A (en) Illumination device and luminaire
JP2012119281A (en) Lamp
JP6589382B2 (en) lamp
JP6028784B2 (en) lamp
KR101548722B1 (en) Led lamp
WO2016004723A1 (en) Omni-directional led lamp
JP2013025924A (en) Lamp
JP5935854B2 (en) LED lamp
JP2014120412A (en) LED lamp
JP6600992B2 (en) lamp
JP6171215B2 (en) LED lamp
JP2017135126A (en) lamp
US20130051036A1 (en) Led lamp

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180420

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190208

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190219

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190411

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190611

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190624

R150 Certificate of patent or registration of utility model

Ref document number: 6554913

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350