JP6538432B2 - Carrier film for transparent conductive film and laminate - Google Patents

Description

  The present invention relates to a carrier film for a transparent conductive film having a support and an adhesive layer. Moreover, this invention relates to the laminated body which has the said carrier film for transparent conductive films, and a transparent conductive film.

  In recent years, in touch panels, liquid crystal display panels, organic EL panels, electrochromic panels, electronic paper elements and the like, the demand for elements using a film substrate provided with a transparent electrode on a plastic film is increasing.

  At present, ITO thin films (In · Sn complex oxides), metal thin films such as silver and copper, and silver nanowire thin films are used as materials for transparent electrodes, including the ITO thin films / metal thin films / silver nanowire thin films The thickness of the thin film substrate tends to decrease year by year.

  In addition, an antireflection (AR) layer is provided as a functional layer on a thin film substrate including the ITO thin film to improve visibility or a hard coat (HC) layer to prevent generation of a scratch. In many cases, an anti-blocking (AB) layer is provided to prevent blocking or an oligomer-preventing (OB) layer is provided to prevent white turbidity upon heating.

  Under such circumstances, a surface protection film or the like is used by being bonded to an optical member such as an ITO thin film for the purpose of preventing scratches, dirt, and the like in a processing step, a conveying step, and the like. For example, Patent Document 1 discloses that a thin surface protective film is attached to an optical member and used.

  However, in order to improve the productivity, for example, with the functional layer provided, a manufacturing process such as formation or patterning of the ITO thin film is performed, and the transparent conductive film having the functional layer is subjected to a heating environment. It may be exposed to very large temperature changes, such as being washed or washed with water. With such temperature change, there is a problem that the transparent conductive film (the functional layer itself when having the functional layer) is largely deformed (e.g., generation of waviness). To address this problem, for example, as a carrier film for a transparent conductive film having a support and a pressure-sensitive adhesive layer, Patent Document 2 controls the unevenness of the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer to be bonded to the transparent conductive film small. Things have been proposed.

JP 2007-304317 International Publication 2013-094542 brochure

  The above-described carrier film for transparent conductive film is used as a laminate bonded to the transparent conductive film. In the laminate, the pressure-sensitive adhesive layer of the carrier film for transparent conductive film is a transparent conductive film even when it is placed under a heating environment in a manufacturing process such as patterning of a transparent conductive layer (ITO thin film etc.) Sufficient fixing is required, while an adequate adhesive strength is required so that it can be easily peeled off after the manufacturing process. In addition, the pressure-sensitive adhesive layer of the carrier film for transparent conductive film is required to maintain the same appropriate adhesive strength even when the environment in aging after forming the pressure-sensitive adhesive layer changes, for example. Be

  Further, in the carrier film for transparent conductive film of Patent Document 2, butyl acrylate is used as a main monomer as a pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer in order to control the unevenness of the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer small. The acrylic polymer is used as a base polymer, and the glass transition temperature of the pressure-sensitive adhesive layer is designed to be relatively high. The glass transition temperature of the pressure-sensitive adhesive layer of Patent Document 2 is usually about -40 ° C. According to the carrier film for transparent conductive film of patent document 2, while solving the said problem, when peeling a transparent conductive film from the said carrier film, the unevenness | corrugation (glue surface unevenness) which arises on the transparent conductive film surface Can also be suppressed.

  Thus, although the thing of patent document 2 can suppress generation | occurrence | production of adhesive surface unevenness and it is fully useful as an actual product, it turned out newly that the phenomenon of "zipping" may occur. . “Zipping” means a phenomenon in which a transparent conductive film is not peeled off smoothly when peeled from a carrier film, but is repeatedly peeled or stopped while making a noise. The occurrence of zipping when the adhesion of the transparent conductive film to the adherend is high is not preferable in that the ITO film may be cracked or a peeling mark may remain. On the other hand, it is considered that the occurrence of zipping can be improved by designing the glass transition temperature of the pressure-sensitive adhesive layer low or lowering the degree of crosslinking using a crosslinking agent, but when adopting such means And the occurrence of adhesive surface irregularities could not be sufficiently suppressed.

  An object of this invention is to provide the carrier film for transparent conductive films which has an adhesive layer which can maintain moderate adhesive force, even when the environment in aging changes.

  The present invention also provides a carrier film for a transparent conductive film having a pressure-sensitive adhesive layer capable of suppressing the occurrence of zipping and capable of maintaining appropriate adhesion even when the environment at aging changes. The purpose is to

  Furthermore, this invention aims at providing the laminated body containing the said carrier film for transparent conductive films, and a transparent conductive film.

  MEANS TO SOLVE THE PROBLEM When the present inventors earnestly examined in order to achieve the said objective, they find out that the said objective can be achieved by using the carrier film for transparent conductive films of the following, and came to complete this invention.

That is, the present invention is a carrier film for transparent conductive film having a pressure-sensitive adhesive layer on at least one side of a support,
The pressure-sensitive adhesive layer is
The glass transition temperature is −50 ° C. or less, and 59.5 to 91% by weight of an alkyl (meth) acrylate having 1 to 14 carbon atoms and 8.5 to 40 of a hydroxyl group-containing monomer with respect to the total monomer components. (Meth) acrylic polymer (A) obtained by polymerizing monomer components containing, by weight, 0.001 to 0.5% by weight of a carboxyl group-containing monomer, and 0 to 10% by weight of other copolymerizable monomers ), And
The present invention relates to a carrier film for a transparent conductive film, which is formed from a pressure-sensitive adhesive composition containing an aliphatic polyisocyanate based crosslinking agent (B).

  In the carrier film for a transparent conductive film, the aliphatic polyisocyanate crosslinking agent (B) preferably contains a hexamethylene diisocyanate crosslinking agent.

  In the carrier film for transparent conductive film, the compounding amount of the aliphatic polyisocyanate crosslinking agent (B) is 1 to 30 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer (A). Is preferred.

  In the carrier film for transparent conductive film, the pressure-sensitive adhesive composition preferably contains a catalyst (C) having iron or tin as an active center. The amount of the catalyst (C) containing iron or tin as an active center is preferably 0.002 to 0.5 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer (A).

  In the carrier film for transparent conductive film, the pressure-sensitive adhesive composition preferably contains a compound (D) which causes keto-enol tautomerism. The compound (D) causing the keto-enol tautomerism is preferably a β-diketone.

The present invention is also a laminate having the above-described carrier film for a transparent conductive film, and a transparent conductive film laminated on the carrier film for a transparent conductive film,
The present invention relates to a laminate in which an adhesive surface of an adhesive layer of the carrier film for transparent conductive film is attached to at least one surface of the transparent conductive film.

As the laminate, the transparent conductive film has a transparent conductive layer and a support,
The thing by which the adhesive surface of the adhesive layer of the said carrier film for transparent conductive films is bonded together on the surface on the opposite side to the surface which contacts the said transparent conductive layer of the said support body is mentioned.

As the laminate, the transparent conductive film has a transparent conductive layer and a support, and further has a functional layer on the surface of the support opposite to the surface in contact with the transparent conductive layer.
The thing by which the adhesive surface of the adhesive layer of the said carrier film for transparent conductive films is bonded together on the surface on the opposite side to the surface which contacts the said support of the said functional layer is mentioned.

  The carrier film for transparent conductive film of the present invention is obtained by polymerizing a monomer component having a glass transition temperature of -50 ° C. or less and having a predetermined composition as an adhesive layer (meth) acrylic polymer (A) And a pressure-sensitive adhesive composition containing an aliphatic polyisocyanate crosslinking agent (B) as a crosslinking agent. The pressure-sensitive adhesive layer of the carrier film for transparent conductive film of the present invention is formed from a pressure-sensitive adhesive composition in which the (meth) acrylic polymer (A) and the aliphatic polyisocyanate crosslinking agent (B) are combined. Even when the environment (for example, the temperature and humidity environment) in aging changes, appropriate adhesiveness can be maintained. Therefore, the pressure-sensitive adhesive layer is appropriate even in the case where the laminate is attached to a transparent conductive film and the laminate is subjected to a heating environment in a manufacturing process such as patterning of the transparent conductive layer. Adhesiveness can be maintained.

  In the carrier film for a transparent conductive film of the present invention, the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer can contain a catalyst (C) having iron or tin as an active center. According to a carrier film for a transparent conductive film having a pressure-sensitive adhesive layer containing a catalyst (C) containing iron or tin as an active center, heating or washing with water is performed in a state where the carrier film is attached to the transparent conductive film It is possible to suppress the occurrence of zipping in the case where the carrier film for a transparent conductive film is peeled from the transparent conductive film after being used in a processing step, a conveying step, and the like that involve temperature changes.

  Further, the pressure-sensitive adhesive layer according to the present invention is formed from a pressure-sensitive adhesive composition having a low glass transition temperature (meth) acrylic polymer (A) having a glass point transition temperature of −50 ° C. or less as a base polymer. The pressure-sensitive adhesive layer is soft and can suppress the occurrence of zipping. Further, among the crosslinking agents, by using an isocyanate-based crosslinking agent (aliphatic polyisocyanate-based crosslinking agent (B)), the occurrence of zipping is suppressed by lowering the crosslinking density of the pressure-sensitive adhesive layer.

  On the other hand, when using a (meth) acrylic polymer (A) having a low glass point transition temperature and an isocyanate crosslinking agent (aliphatic polyisocyanate crosslinking agent (B)), the crosslinking speed of the pressure-sensitive adhesive composition is low, The pressure-sensitive adhesive layer to be formed becomes soft and the adhesive surface is easily deformed, and the adhesive surface unevenness is easily generated. In the present invention, the use of a catalyst (C) having iron or tin as an active center as a catalyst for an isocyanate-based crosslinking agent (aliphatic polyisocyanate-based crosslinking agent (B)) allows the above crosslinking even with a small addition amount. The speed can be increased, the pressure-sensitive adhesive layer can be hardened, and the occurrence of unevenness in the adhesive surface can be suppressed.

  Further, by using the carrier film for transparent conductive film of the present invention, the transparent conductive film as an adherend does not generate wrinkles and scratches, and the shape of the transparent conductive film is maintained. Can.

(A) It is a schematic diagram of the laminated body which stuck the transparent conductive film with a functional layer on the adhesive layer surface of the carrier film for transparent conductive films. (B) It is a schematic diagram of the laminated body which stuck the transparent conductive film to the adhesive layer surface of the carrier film for transparent conductive films.

1. Carrier Film for Transparent Conductive Film Hereinafter, an embodiment of the present invention will be described in detail with reference to FIG. However, the present invention is not limited to the embodiment of FIG.

  The carrier film 20 for transparent conductive film of the present invention has the pressure-sensitive adhesive layer 3 on at least one surface of the support 4 and has the pressure-sensitive adhesive surface A on the side opposite to the surface of the pressure-sensitive adhesive layer 3 in contact with the support. . In addition, as shown to Fig.1 (a), when the transparent conductive film is the transparent conductive film 10 with a functional layer, the said adhesive surface A is a surface which contacts the said functional layer 2, and is a figure. As shown in 1 (b), when the transparent conductive film 1 does not have a functional layer, the surface of the support (base material) 1b (the transparent conductive layer 1a of the support 1b) constituting the transparent conductive film is It is a surface in contact with the non-existent side).

(1) Pressure-Sensitive Adhesive Layer The pressure-sensitive adhesive layer in the present invention has a glass transition temperature of −50 ° C. or less and a (meth) acrylic polymer (A) obtained by polymerizing a monomer component having a predetermined composition, and a fat Group polyisocyanate-based crosslinking agent (B), which is formed from a pressure-sensitive adhesive composition.

<(Meth) acrylic polymer (A)>
The (meth) acrylic polymer (A) comprises 59.5 to 91% by weight of an alkyl (meth) acrylate having 2 to 14 carbon atoms and 8.5 to 40% by weight of a hydroxyl group-containing monomer based on the total amount of monomer components. (Meth) acrylic polymer (A) obtained by polymerizing monomer components containing 0.001 to 0.5% by weight of a carboxyl group-containing monomer and 0 to 10% by weight of other copolymerizable monomers The glass transition temperature (Tg) of (a) is adjusted to -50.degree. C. or less. The glass transition temperature of the (meth) acrylic polymer (A) can be adjusted within the above range by appropriately changing the composition ratio of the monomer components. The glass transition temperature of the (meth) acrylic polymer (A) is preferably −55 ° C. or less, more preferably −60 ° C. or less, and further preferably −65 ° C. or less, from the viewpoint of suppressing the occurrence of zipping. Is preferred. On the other hand, if the glass transition temperature is too low, cohesion may not be obtained and the adhesive strength may be too high, or adhesive residue may occur, so the glass transition temperature is preferably -100 ° C or higher.

  The said C2-C14 alkyl (meth) acrylate is a main monomer component of (meth) acrylic-type polymer (A). The carbon number of the alkyl group is preferably 4 to 14, more preferably 6 to 14, and even more preferably 6 to 9. The glass transition temperature of the (meth) acrylic polymer (A) is -50 ° C or less It is preferable to adjust to Examples of the alkyl (meth) acrylate having an alkyl group having 2 to 14 carbon atoms include ethyl (meth) acrylate, n-butyl (meth) acrylate (BA), t-butyl (meth) acrylate and isobutyl (meth) ) Acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate (2EHA), n-octyl (meth) acrylate, isooctyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate And n-decyl (meth) acrylate, isodecyl (meth) acrylate, n-dodecyl (meth) acrylate, n-tridecyl (meth) acrylate, n-tetradecyl (meth) acrylate and the like. Or two or more It can be mixed with use. Among these, n-butyl (meth) acrylate (BA) and 2-ethylhexyl (meth) acrylate (2EHA) are preferable, and 2-ethylhexyl (meth) acrylate (2EHA) is particularly preferable.

  The content of the alkyl (meth) acrylate having 2 to 14 carbon atoms in the monomer component is 59.5 to 91% by weight, further 65 to 91% by weight, further 70 to 90% by weight, and further It is preferable that it is 70-85 weight%. When the content of the alkyl (meth) acrylate having 2 to 14 carbon atoms is less than 59.5% by weight, the content of the hydroxyl group-containing monomer and other copolymerizable monomers described later is increased, and (meth) There is a tendency that the glass transition temperature of the acrylic polymer (A) becomes high and it becomes easy to dip. On the other hand, when the content ratio of the alkyl (meth) acrylate having 2 to 14 carbon atoms exceeds 91% by weight, the crosslinking point in the polymer is relatively small and the heat resistance is inferior, which is not preferable.

  In addition, when the light-sensitive adhesive layer is required to be lightly peeled off, the alkyl (meth) acrylate having 2 to 14 carbon atoms, in particular, uses the alkyl (meth) acrylate having the alkyl group having 6 to 14 carbon atoms The content of the alkyl (meth) acrylate having an alkyl group having 6 to 14 carbon atoms is preferably 50% by weight or more based on the total amount of the alkyl (meth) acrylates having 2 to 14 carbon atoms. Is more preferably 60% by weight or more, still more preferably 80% by weight or more, and still more preferably 90% by weight or more.

  The hydroxyl group-containing monomer has a polymerizable functional group having an unsaturated double bond such as a (meth) acryloyl group or a vinyl group, and is a hydroxyl group capable of reacting with the aliphatic polyisocyanate crosslinking agent (B) Contains Specific examples of the hydroxyl group-containing monomer include, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxy Butyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxy lauryl (meth) acrylate, [4- (hydroxymethyl) cyclohexyl And hydroxyalkyl (meth) acrylates such as methyl acrylate.

  Further, as a hydroxyl group-containing monomer, N-methylol acrylamide, N-methylol methacrylamide, N- (2-hydroxyethyl) acrylamide, N- (2-hydroxyethyl) methacrylamide, N- (2-hydroxypropyl) acrylamide, N -(2-hydroxypropyl) methacrylamide, N- (1-hydroxypropyl) acrylamide, N- (1-hydroxypropyl) methacrylamide, N- (3-hydroxypropyl) acrylamide, N- (3-hydroxypropyl) methacryl Amide, N- (2-hydroxybutyl) acrylamide, N- (2-hydroxybutyl) methacrylamide, N- (3-hydroxybutyl) acrylamide, N- (3-hydroxybutyl) methacrylamide, N- (4-hydroxy) Chill) acrylamide, N- (4-hydroxybutyl) such as methacrylamide N- hydroxyalkyl (meth) acrylamide; and the like.

  Among these hydroxyl group-containing monomers, 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate and the like from the viewpoint of the polymerizability and reactivity with the aliphatic polyisocyanate crosslinking agent (B) Hydroxyalkyl (meth) acrylates are preferred, in particular 4-hydroxybutyl acrylate. These hydroxyl group-containing monomers may be used alone or in combination.

  The content of the hydroxyl group-containing monomer in the monomer component is 8.5 to 40% by weight, preferably 8.5 to 35% by weight, and more preferably 10 to 30% by weight. More preferably, it is 25 to 25% by weight, and most preferably 16 to 25% by weight. Setting the content ratio of the hydroxyl group-containing monomer to 8.5% by weight or more secures the content ratio of the hydroxyl group-containing monomer and causes generation of zipping by crosslinking with the aliphatic polyisocyanate crosslinking agent (B). It is preferable from the point of suppressing. In particular, when light release is required for the pressure-sensitive adhesive layer, the content is preferably 11% by weight or more. When the content of the hydroxyl group-containing monomer is less than 8.5% by weight, the crosslinking point in the polymer is small and the heat resistance is poor.

  The carboxyl group-containing monomer has a polymerizable functional group having an unsaturated double bond such as a (meth) acryloyl group or a vinyl group, and contains a carboxyl group. The carboxyl group-containing monomer can be used from the point of being able to carry out the crosslinking reaction more efficiently, and of improving the adhesion by interacting with the adherend surface. Specific examples of the carboxyl group-containing monomer include (meth) acrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid and the like. Among these carboxyl group-containing monomers, acrylic acid is preferable from the viewpoint of its polymerizability, aggregation property, cost and versatility.

  The content of the carboxyl group-containing monomer in the monomer component is 0.001 to 0.5% by weight, preferably 0.005 to 0.4% by weight, and 0.0075 to 0.3% by weight. Is more preferably, it is more preferably 0.01 to 0.2% by weight, and most preferably 0.01 to 0.1% by weight. It is preferable to set the content ratio of the carboxyl group-containing monomer to 0.001% by weight or more from the viewpoint of achieving a certain level of adhesion after bonding and heating to prevent the problem of peeling. When the content of the carboxyl group-containing monomer exceeds 0.5% by weight, the pot life becomes short, which is not preferable.

  The said monomer component can contain the monomer which can be copolymerized other than the C2-C14 alkyl (meth) acrylate, a hydroxyl-containing monomer, and a carboxyl group-containing monomer. The copolymerizable monomer is a polymerizable monomer having a polymerizable functional group having an unsaturated double bond such as a (meth) acryloyl group or a vinyl group, and can include one or more polymerizable monomers. . As said other copolymerizable monomer, what makes the glass transition point of a (meth) acrylic-type polymer (A) below -50 degrees C is selected suitably, and is used. The other copolymerizable monomers may be used alone or in combination, but the blending amount of the other polymerizable monomers is 0 to 10% by weight in the monomer component, and 0 to 9 wt%. %, More preferably 0 to 8% by weight, even more preferably 0 to 7% by weight, even more preferably 0 to 6% by weight, even more preferably 0 to 5% by weight.

  Examples of the other polymerizable monomer include methyl (meth) acrylate which is an alkyl (meth) acrylate having 1 carbon atom, a sulfonic acid group-containing monomer, a phosphoric acid group-containing monomer, a cyano group-containing monomer, and a vinyl ester monomer , Cohesive force and heat resistance improving component such as aromatic vinyl monomer, acid anhydride group containing monomer, amide group containing monomer, amino group containing monomer, epoxy group containing monomer, N-acryloyl morpholine, vinyl ether monomer, etc. Crosslinking base point The monomer component which has a functional group which works as can be used suitably. These monomer components may be used alone or in combination of two or more.

  Examples of the acid anhydride group-containing monomer include maleic anhydride and itaconic anhydride.

  Examples of the sulfonic acid group-containing monomer include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamido-2-methylpropane sulfonic acid, (meth) acrylamidopropane sulfonic acid, sulfopropyl (meth) acrylate, (meth And the like) and the like.

  Examples of the phosphoric acid group-containing monomer include 2-hydroxyethyl acryloyl phosphate, 2- (phosphonooxy) ethyl methacrylate, 3-chloro-2- (phosphonooxy) propyl methacrylate and the like.

  Examples of the cyano group-containing monomer include acrylonitrile and the like.

  Examples of the vinyl ester monomer include vinyl acetate, vinyl propionate and vinyl laurate.

  Examples of the aromatic vinyl monomer include styrene, chlorostyrene, chloromethylstyrene, α-methylstyrene and the like.

  Examples of the amide group-containing monomer include acrylamide and diethyl acrylamide.

  Examples of the amino group-containing monomer include N, N-dimethylaminoethyl (meth) acrylate and N, N-dimethylaminopropyl (meth) acrylate.

  Examples of the epoxy group-containing monomer include glycidyl (meth) acrylate and allyl glycidyl ether.

  Examples of the vinyl ether monomer include methyl vinyl ether, ethyl vinyl ether and isobutyl vinyl ether.

  The (meth) acrylic polymer (A) used in the present invention is obtained by polymerizing the monomer component, and the polymerization method is not particularly limited, and solution polymerization, emulsion polymerization, bulk It can be polymerized by known methods such as polymerization and suspension polymerization, and solution polymerization is more preferable from the viewpoint of workability and the like. The polymer to be obtained may be any of homopolymers, random copolymers, block copolymers and the like.

  The weight average molecular weight of the (meth) acrylic polymer (A) used in the present invention is preferably 300,000 to 5,000,000, more preferably 400,000 to 2,000,000, and particularly preferably 500,000 to 1,000,000. When the weight-average molecular weight is smaller than 300,000, the adhesion to the adherend (with a functional layer) to the transparent conductive film is improved, and the adhesion at the time of peeling is increased. It may cause damage to the adherend, and the adhesive layer tends to cause adhesive residue due to the reduced cohesion of the adhesive layer. On the other hand, when the weight average molecular weight exceeds 5,000,000, the flowability of the polymer is lowered, and the wettability to the adherend (with functional layer) transparent conductive film becomes insufficient, and the adherend and the transparent conductivity It tends to be a cause of the swelling generated between the film carrier film and the pressure-sensitive adhesive layer. In addition, a weight average molecular weight says what was obtained by measuring by GPC (gel permeation chromatography).

<Aliphatic polyisocyanate based crosslinking agent (B)>
In the present invention, among the isocyanate-based crosslinking agents, aliphatic polyisocyanate-based crosslinking agents (B) are used. The aliphatic polyisocyanate-based crosslinking agent (B) is used in combination with the (meth) acrylic polymer (A). By the pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive composition including the above, appropriate adhesiveness can be maintained even when the environment (for example, the temperature and humidity environment) in aging changes. The pressure-sensitive adhesive layer can maintain an adequate adhesive strength even when it is put under a heating environment in a state of being bonded and made into a laminate after aging.

  As aliphatic polyisocyanate, for example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene diisocyanate, 2,4,4-trimethyl Hexamethylene diisocyanate etc. are mentioned. Among these, hexamethylene diisocyanate is preferred.

  In addition, the aliphatic polyisocyanate crosslinking agent (B) is a multimer (dimer, trimer, pentamer, etc.) of the above diisocyanate, a urethane modified product, a urea modified product, a biuret modified product, an alphanate modified product And isocyanurate modified products, carbodiimide modified products and the like.

  As a commercial item of aliphatic polyisocyanate type crosslinking agent (B), "Coronato HL" "Coronato HX" "Coronato HK" [above, Nippon Polyurethane Industry Co., Ltd. make] etc. are mentioned, for example. These compounds may be used alone or in combination of two or more.

  In addition, another isocyanate type crosslinking agent can be used as a crosslinking agent with an aliphatic polyisocyanate type crosslinking agent (B). The isocyanate-based crosslinking agent is a compound having at least two isocyanate groups, and as other isocyanate-based crosslinking agents, for example, known alicyclic polyisocyanates and aromatic polyisocyanates which are generally used for urethanization reaction may be used. . The same multimers and modified products as described above can be used for the alicyclic polyisocyanate and the aromatic polyisocyanate. However, when only the alicyclic polyisocyanate and the aromatic polyisocyanate are used, it is difficult to maintain appropriate adhesiveness when the environment (for example, temperature and humidity environment) in aging changes.

  Examples of alicyclic isocyanates include 1,3-cyclopentene diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, isophorone diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated tolylene diisocyanate hydrogen Examples include added tetramethyl xylylene diisocyanate.

  As aromatic diisocyanate, for example, phenylene diisocyanate, 2,4-tolylene diisosoanate, 2,6-tolylene diisosoanate, 2,2′-diphenylmethane diisocyanate, 4,4′-diphenylmethane diisocyanate, 4,4 '-Toluidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4'-diphenyl diisocyanate, 1,5-naphthalene diisocyanate, xylylene diisocyanate and the like.

  Commercially available products of alicyclic isocyanate and aromatic diisocyanate include, for example, trade names "Millionate MT", "Millionate MTL", "Millionate MR-200", "Millionate MR-400" and "Corronate L" [manufactured by Nippon Polyurethane Industry Co., Ltd.] "Takenate D-110 N" "Takenate D-120 N" "Takenate D-140 N" "Takenate D-160 N" "Takenate D-165 N" "Takenate D-170 HN" "Takenate D-178 N" "Takenate 500" "Takenate 600" [above, Mitsui Chemicals, Inc.]; and the like. These compounds may be used alone or in combination of two or more.

  In the present invention, the content of the aliphatic polyisocyanate crosslinking agent (B) is preferably 1 to 30 parts by weight, more preferably 3 to 25 parts by weight per 100 parts by weight of the (meth) acrylic polymer (A). It is preferable to be 6 parts by weight, more preferably 6 to 20 parts by weight, preferably 11 to 20 parts by weight, and most preferably 16 to 20 parts by weight. When the content of the aliphatic polyisocyanate crosslinking agent (B) is 1 part by weight or more, the crosslinking of the pressure-sensitive adhesive layer is sufficiently performed by the reaction with the hydroxyl group of the (meth) acrylic polymer (A). It is preferable in terms of improving the cohesion and suppressing the occurrence of zipping. Moreover, heat resistance is obtained by cohesive force, and it is preferable also from the point which can reduce adhesive residue. On the other hand, by setting the content of the aliphatic polyisocyanate crosslinking agent (B) to 30 parts by weight or less, the occurrence of adhesive surface unevenness is suppressed by preventing the crosslinking from advancing excessively and the cohesive force becoming too large. Preferred. In addition, when the content of the aliphatic polyisocyanate crosslinking agent (B) is 1 part by weight or more, the carrier film of the present invention is peeled off from the transparent conductive film (with a functional layer) which is an adherend. Even when the peeling rate is slow or fast, an appropriate adhesive force can be expressed, and the peelability is excellent, which is preferable.

In the pressure-sensitive adhesive composition of the present invention, in addition to the above-mentioned aliphatic polyisocyanate-based crosslinking agent (B), other crosslinking agents (including other isocyanate-based crosslinking agents other than aliphatic polyisocyanate-based crosslinking agents) as needed You may include it. As other crosslinking agents, for example, epoxy-based crosslinking agents, melamine-based resins, aziridine derivatives, metal chelate compounds and the like are used. These compounds may be used alone or in combination. However, even if an epoxy-based crosslinking agent other than the aliphatic isocyanate-based crosslinking agent (B) is used alone, the occurrence of the zipping can not be sufficiently suppressed.

  Examples of the epoxy compound include N, N, N ′, N′-tetraglycidyl-m-xylenediamine (trade name: TETRAD-X, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and 1,3-bis (N, N, N-diglycidylaminomethyl) cyclohexane (trade name: TETRAD-C, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and the like. These compounds may be used alone or in combination of two or more.

  Examples of the melamine resins include hexamethylolmelamine and the like. As an aziridine derivative, for example, the trade name HDU (manufactured by Mutual Pharmaceutical Co., Ltd.) as a commercial product, the trade name TAZM (manufactured by Mutual Pharmaceutical Co., Ltd.), the trade name TAZO (manufactured by Mutual Pharmaceutical Co., Ltd.), etc. Can be mentioned. These compounds may be used alone or in combination of two or more.

  Examples of the metal chelate compound include aluminum, titanium, nickel and zirconium as a metal component, acetylene, methyl acetoacetate, ethyl acetoacetate, ethyl lactate, acetylacetone and the like as a chelate component. These compounds may be used alone or in combination.

  When a crosslinking agent other than these aliphatic polyisocyanate crosslinking agents (B) is used in combination, the amount thereof used is not particularly limited as long as the effects of the present invention are not impaired, but the total amount with the aliphatic polyisocyanate crosslinking agent (B) Is 1 to 30 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer (A), and the proportion of the aliphatic polyisocyanate crosslinking agent (B) in the total amount of the crosslinking agent is 50% by weight or more Furthermore, it is preferable to use in 70 weight% or more, further 90 weight% or more range.

(Catalyst with iron or tin as active center (C))
The pressure-sensitive adhesive composition of the present invention can contain a catalyst (C) having iron or tin as an active center (hereinafter, may be simply referred to as catalyst (C)). The catalyst (C) is effective in suppressing zipping as a catalyst for an isocyanate crosslinking agent (aliphatic polyisocyanate crosslinking agent (B)). In particular, the iron catalyst can accelerate the crosslinking speed even with a small addition amount, can harden the pressure-sensitive adhesive layer, and can also suppress the occurrence of unevenness in the adhesive surface. The catalyst (C) has a slow crosslinking speed at a small addition amount and can not sufficiently suppress the occurrence of the surface unevenness. On the other hand, when the addition amount of the tin-based catalyst is increased, the pot life of the pressure-sensitive adhesive composition becomes short and the productivity is poor. As the catalyst (C), a catalyst having iron as an active center (hereinafter sometimes referred to as catalyst (C1)) is preferable.

As the iron catalyst (C1), an iron chelate compound can be suitably used, and can be represented, for example, as a general formula Fe (X) (Y) (Z). Iron chelate compounds can be obtained by combining (X) (Y) (Z) with Fe (X) ₃ , Fe (X) ₂ (Y), Fe (X) (Y) ₂ , Fe (X) (Y) (Z) It is represented by any of. In the iron chelate compound Fe (X) (Y) (Z), (X) (Y) (Z) is a ligand for Fe, and for example, when X, Y or Z is a β-diketone, β- As diketones, acetylacetone, hexane-2,4-dione, heptane-2,4-dione, heptane-3,5-dione, 5-methyl-hexane-2,4-dione, octane-2,4-dione, 6 -Methylheptane-2,4-dione, 2,6-dimethylheptane-3,5-dione, nonane-2,4-dione, nonane-4,6-dione, 2,2,6,6-tetramethylheptane 3,5-dione, tridecane-6,8-dione, 1-phenyl-butane-1,3-dione, hexafluoroacetylacetone, ascorbic acid and the like.

  When X, Y or Z is a β-ketoester, as a β-ketoester, methyl acetoacetate, ethyl acetoacetate, n-propyl acetoacetate, isopropyl acetoacetate, n-butyl acetoacetate, sec-butyl acetoacetate, Acetoacetic acid tert-butyl, propionyl acetate methyl, propionyl acetate ethyl, propionyl acetate-n-propyl, propionyl acetate isopropyl, propionyl acetate-n-butyl, propionyl acetate-sec-butyl, propionyl acetate-tert-butyl, acetoacetate benzyl And dimethyl malonate, diethyl malonate and the like.

In the present invention, iron catalysts other than iron chelate compounds can also be used, and for example, compounds of iron and an alkoxy group, a halogen atom, and an acyloxy group can also be used. In the case of a compound of iron and an alkoxy group, as an alkoxy group, a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, a sec-butoxy group, a tert-butoxy group, a pentyloxy group, a hexyloxy group group, heptyloxy group, octyloxy group, 2-ethylhexyl group, a phenoxy group, a cyclohexyl group, a benzyl group, 1-benzyl-naphthyl group and the like.

  In the case of a compound of iron and a halogen atom, examples of the halogen atom include fluorine, chlorine, bromine and iodine.

  In the case of a compound of iron and an acyloxy group, 2-ethylhexyl acid, octylic acid, naphthenic acid, resin acid (abietic acid, neoabietic acid, d-pimaric acid, iso-d-pimaric acid, podocarpic acid) as an acyloxy group Aliphatic organic acids, benzoic acids, cinnamic acids, p- that are mainly composed of gluconic acid, fumaric acid, citric acid, aspartic acid, α-ketoglutamic acid, malic acid, succinic acid, amino acids such as glycine and histidine And aromatic fatty acids containing as a main component oxycinnamic acid etc.

  In the present invention, among these iron catalysts (C1), iron chelate compounds having a β-diketone as a ligand are preferable in terms of reactivity and curability, and it is particularly preferable to use tris (acetylacetonato) iron . These iron catalysts (C1) may be used alone or in combination of two or more.

  In addition, as a catalyst (C) which makes tin an active center, for example, bivalent organic tin compounds such as tin octoate, tin octylate, tin butanoate, tin naphthenate, tin caprylate, tin oleate; dibutyl Tin dioctoate, dibutyl tin dilaurate, dibutyl tin diacetate, dibutyl tin dimaleate, dibutyl tin distearate, dibutyl tin dioleate, dioctyl tin dilaurate, dioctyl tin diversatate, diphenyl tin diacetate, dibutyl tin dimethoxide, dibutyl tin oxide, dibutyl tin bis (tri And tetravalent organic tin compounds such as a reaction product of dibutyltin oxide and phthalic acid ester; dibutyltin bis (acetylacetonate), tin-based chelate compounds, and the like.

In the present invention, the content of the catalyst (C) is preferably 0.002 to 0.5 parts by weight, and 0.003 to 0.3 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer (A). Is preferably, and more preferably 0.004 to 0.2 parts by weight. Setting the content of the catalyst (C) to 0.002 parts by weight or more with respect to 100 parts by weight of the (meth) acrylic polymer (A) accelerates the crosslinking speed of the pressure-sensitive adhesive layer, thereby increasing the pressure-sensitive adhesive It is preferable from the point of hardening quickly and suppressing the occurrence of surface unevenness. When the amount of the catalyst (C) is small, the curing property is insufficient and the adhesive strength of the pressure-sensitive adhesive layer immediately after the preparation is increased, which may cause adhesive residue when the pressure-sensitive adhesive layer is peeled off. The change in adhesion over time may be significant. On the other hand, when the content of the catalyst (C) exceeds 0.5 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer (A), in order to prevent the deactivation of the catalyst (C) described later When the compound (D) causing the required keto-enol tautomerism is used, the required content is increased, and the compound (D) remains as a residue in the adhesive layer, and the change in adhesion with time is It can be large.

In the present invention, in order to effectively exhibit the above function of the catalyst (C) in the present invention, it is preferable to adjust the compounding amount thereof according to the content of the aliphatic isocyanate crosslinking agent (B) . That is, it is preferable to blend 0.05 to 12.5 parts by weight of the catalyst (C) with respect to the blending amount (100 parts by weight) of the aliphatic polyisocyanate crosslinking agent (B), and 0.075 to 7.5 It is more preferable to mix | blend in the quantity used as a weight part.

(Compounds which cause keto-enol tautomerism (D))
The pressure-sensitive adhesive composition of the present invention can contain a compound (D) which causes keto-enol tautomerism (hereinafter, may be referred to as keto-enol tautomeric compound (D)). When a (meth) acrylic polymer having a carboxyl group is used, the function of the catalyst (C) may be reduced and the crosslinking reaction may not be completed promptly. In the keto-enol tautomeric compound (D), the monomer component forming the (meth) acrylic polymer (A) preferably functions with respect to the carboxyl group-containing monomer.

（Ｒ^１，Ｒ^２，Ｒ^３は水素、アルキル基、アルケニル基、アリール基等の置換基であって、分子内にヘテロ原子やハロゲン原子を含んでいてもよい） The keto-enol tautomeric compound (D) is a compound that causes tautomerism (see Formula 1) between keto (ketone, aldehyde) and enol, and a chelating agent for the catalyst (C). These compounds are compounds that act as and prevent deactivation of the catalytic function by the carboxyl group. That is, in the catalyst (C), when a carboxyl group is present, the carboxyl function reduces the catalyst function by causing a change in the chemical structure of the catalyst (C), but the compound (D) causes keto-enol tautomerism In the presence of the compound (D) causing keto-enol tautomerism over the carboxyl group preferentially coordinates in the vicinity of the catalyst (C), thereby blocking changes in the chemical structure of the catalyst (C) It is thought that the inactivation is prevented by doing.

(R ¹ , R ² and R ³ are substituents such as hydrogen, an alkyl group, an alkenyl group, an aryl group and the like, and may contain a hetero atom or a halogen atom in the molecule)

As the compound (D) which causes keto-enol tautomerism, for example, methyl acetoacetate, ethyl acetoacetate, n-propyl acetoacetate, isopropyl acetoacetate, n-butyl acetoacetate, sec-butyl acetoacetate, acetoacetate -T-butyl acetate, methyl propionyl acetate, ethyl propionyl acetate, n-propyl propionyl acetate, isopropyl propionyl acetate, n-butyl propionyl acetate, sec-butyl propionyl acetate, tert-butyl propionyl acetate, benzyl acetoacetate, Β-ketoesters such as dimethyl malonate and diethyl malonate;
Acetylacetone, hexane-2,4-dione, heptane-2,4-dione, heptane-3,5-dione, 5-methyl-hexane-2,4-dione, octane-2,4-dione, 6-methylheptane -2,4-dione, 2,6-dimethylheptane-3,5-dione, nonane-2,4-dione, nonane-4,6-dione, 2,2,6,6-tetramethylheptane-3, Β-diketones such as 5-dione, tridecane-6,8-dione, 1-phenyl-butane-1,3-dione, hexafluoroacetylacetone, ascorbic acid;
Acid anhydrides such as acetic anhydride;
Ketones such as acetone, methyl ethyl ketone, methyl n-butyl ketone, methyl isobutyl ketone, methyl tert-butyl ketone, methyl phenyl ketone, cyclohexanone and the like can be mentioned. Among these compounds, β-diketones having a high effect of preventing the deactivation of the catalytic function by a carboxyl group are preferably used, and among them, acetylacetone is more preferable.

  The content of the compound (D) causing keto-enol tautomerism is such that the weight ratio (D / C) of keto-enol tautomer (D) to the catalyst (C) is 3 to 70. The content is preferably 10 to 70, more preferably 20 to 60, and still more preferably 40 to 55. When the content ratio of the keto-enol tautomer (D) and the catalyst (C) exceeds 70, the keto-enol tautomer (D) is contained in excess relative to the catalyst (C). In this state, the keto-enol tautomeric compound (D) causes a side reaction with the aliphatic polyisocyanate crosslinker (B) in the compounding solution, so the number of isocyanate groups capable of reacting with hydroxyl groups during curing decreases, and sufficient curing occurs. You can not get sex. On the other hand, when the content ratio of the keto-enol tautomer (D) and the iron catalyst (C) is less than 3, the keto-enol tautomer (D) is too small relative to the catalyst (C). In this state, the catalyst function can not be prevented from being inactivated by the carboxyl group, resulting in insufficient curing.

  The compound (D) causing the keto-enol tautomerism may be contained so that the weight ratio (D / C) of the keto-enol tautomer (D) to the catalyst (C) is 3 to 70. In that case, it is preferable to be mix | blended 0.15-35 weight part with respect to 100 weight part of said (meth) acrylic-type polymers (A), and it is more preferable to contain 0.2-20 weight part. When the content of the keto-enol tautomeric compound (D) exceeds 35 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer (A), the compound (D) remains as a residue in the pressure-sensitive adhesive layer In some cases, the change in adhesive strength over time may increase. On the other hand, when the content of the keto-enol tautomeric compound (D) is less than 0.15 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer (A), the deactivation of the catalytic function by the carboxyl group It can not be prevented and curing may be insufficient.

In addition to the (meth) acrylic polymer (A), a polyfunctional monomer having two or more radiation-reactive unsaturated bonds can be blended in the pressure-sensitive adhesive composition of the present invention. The polyfunctional monomer can be used as a monomer component when preparing the (meth) acrylic polymer (A). In such a case, the (meth) acrylic polymer (A) is crosslinked by irradiation with radiation or the like. As a polyfunctional monomer having two or more radiation reactive unsaturated bonds in one molecule, for example, it can be cross-linked (cured) by irradiation with radiation such as vinyl, acryloyl, methacryloyl or vinylbenzyl. Examples thereof include polyfunctional monomers having one or more types of radiation-reactive unsaturated bonds . In addition, as the polyfunctional monomer, generally, one having 10 or less radiation-reactive unsaturated bonds is suitably used. These compounds may be used alone or in combination of two or more.

  Specific examples of the polyfunctional monomer include, for example, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6 hexane Diol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, divinylbenzene, N, N'-methylenebisacrylamide and the like.

  The compounding amount of the polyfunctional monomer is preferably 30 parts by weight or less, more preferably 1 to 30 parts by weight, with respect to 100 parts by weight (solid content) of the (meth) acrylic polymer (A). More preferably, it is 25 parts by weight.

  Examples of radiation include ultraviolet rays, laser rays, alpha rays, beta rays, gamma rays, X rays, electron rays and the like, but ultraviolet rays are preferably used in terms of controllability, handleability and cost. More preferably, ultraviolet light having a wavelength of 200 to 400 nm is used. The ultraviolet light can be irradiated using an appropriate light source such as a high pressure mercury lamp, a microwave excitation lamp, or a chemical lamp. In addition, when using an ultraviolet-ray as radiation, a photoinitiator is mix | blended with an adhesive composition.

  The photopolymerization initiator may be any substance that generates radicals or cations by irradiation with ultraviolet light of an appropriate wavelength that can be a trigger for the polymerization reaction, depending on the type of radiation-reactive component.

  Photoradical polymerization initiators include, for example, benzoin, benzoin methyl ether, benzoin ethyl ether, methyl o-benzoylbenzoate-p-benzoin ethyl ether, benzoin isopropyl ether, benzoins such as α-methylbenzoin, benzyl dimethyl ketal, trichlorene Acetophenones such as acetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methylpropiophenone, 2-hydroxy-4'-isopropyl-2-methylpropiophenone, etc. Benzophenones such as propiophenones, benzophenone, methylbenzophenone, p-chlorobenzophenone, p-dimethylaminobenzophenone, 2-chlorothioxanthone, 2-ethyl Thioxanthones such as oxantone, 2-isopropylthioxanthone, bis (2,4,6-trimethyl benzoyl) -phenyl phosphine oxide, 2,4,6-trimethyl benzoyl diphenyl phosphine oxide, (2,4,6-trimethyl benzoyl)- Acyl phosphine oxides such as (ethoxy) -phenyl phosphine oxide, benzyl, dibenzosuberone, α-acyl oxime ester and the like. These compounds may be used alone or in combination of two or more.

  As photocationic polymerization initiators, for example, onium salts such as aromatic diazonium salts, aromatic iodonium salts, aromatic sulfonium salts, organometallic complexes such as iron-allene complex, titanocene complex, arylsilanol-aluminum complex, nitro Examples thereof include benzyl ester, sulfonic acid derivative, phosphoric acid ester, phosphoric acid ester, phenol sulfonic acid ester, diazonaphthoquinone, N-hydroxyimidosulfonate and the like. These compounds may be used alone or in combination of two or more. It is preferable to mix | blend 0.1 to 10 weight part normally with respect to 100 weight part of (meth) acrylic-type polymers (A), and mix | blend a photopolymerization initiator in 0.2 to 7 weight part.

Furthermore, it is also possible to use a photopolymerization start auxiliary such as amines in combination. Examples of the photopolymerization initiation aid include 2-dimethylaminoethyl benzoate, dimethylaminoacetophenone, p-dimethylaminobenzoic acid ethyl ester, p-dimethylaminobenzoic acid isoamyl ester and the like. These compounds may be used alone or in combination of two or more. It is preferable to mix | blend 0.05-10 weight part with respect to 100 weight part of (meth) acrylic-type polymers (A), and it is more preferable to mix | blend a photopolymerization start adjuvant with 0.1-7 weight part. preferable.

  Furthermore, the pressure-sensitive adhesive composition used in the present invention may contain other known additives. For example, colorants, powders such as pigments, surfactants, plasticizers, tackifiers Low molecular weight polymer, surface lubricant, leveling agent, antistatic agent, antioxidant, corrosion inhibitor, light stabilizer, UV absorber, polymerization inhibitor, silane coupling agent, inorganic or organic filler, metal powder According to the use which uses particle shape, a foil-like thing, etc., it can mix | blend suitably.

  The pressure-sensitive adhesive layer used in the present invention is formed from the pressure-sensitive adhesive composition as described above. In addition, the carrier film for transparent conductive film (with functional layer) of the present invention is formed by forming the pressure-sensitive adhesive layer on a support (a base material, a base material layer). At that time, the crosslinking of the (meth) acrylic polymer is generally performed after the application of the pressure-sensitive adhesive composition, but it is also possible to transfer the pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition after crosslinking to a support or the like. It is possible.

  The method for forming the pressure-sensitive adhesive layer on a support (also referred to as a base or base layer) is not particularly limited. For example, the pressure-sensitive adhesive composition is applied to a support (for example, as solid content) 20% by weight or more is preferable, and 30% by weight or more is more preferable), and a polymerization solvent or the like is removed by drying to form a pressure-sensitive adhesive layer on a support. Thereafter, curing may be performed for the purpose of adjusting the component transfer of the pressure-sensitive adhesive layer, adjusting the crosslinking reaction, and the like. Moreover, when apply | coating an adhesive composition on a support body and producing the carrier film for transparent conductive films, it is 1 type other than a polymerization solvent in an adhesive composition so that it can apply | coat uniformly on a support body. The above solvents may be newly added.

  Moreover, as a coating method of the said adhesive composition, the well-known method used for manufacture of an adhesive tape etc. is used. Specific examples thereof include roll coating, gravure coating, reverse coating, roll brushing, spray coating, air knife coating, and the like.

  The drying conditions for drying the pressure-sensitive adhesive composition applied to the support can be appropriately determined according to the composition, concentration, type of solvent in the composition, etc., and are not particularly limited. However, for example, it can be dried at 80 to 200 ° C. for about 10 seconds to 30 minutes.

In addition, when the photopolymerization initiator as an optional component is blended as described above, the pressure-sensitive adhesive layer is coated by applying light to one side or both sides of the support (base, base layer) and then applying light. You can get it. Usually, a pressure-sensitive adhesive layer is obtained by photopolymerization by irradiating an ultraviolet ray having an illuminance of 1 to 200 mW / cm ² at a wavelength of 300 to 400 nm at a light amount of about 400 to 4000 mJ / cm ² .

  The thickness of the pressure-sensitive adhesive layer of the carrier film for a transparent conductive film of the present invention is preferably 5 to 50 μm, more preferably 10 to 30 μm. It is excellent in the balance of adhesiveness and removability as it is in the said range, and it becomes a preferable aspect. The above-mentioned pressure-sensitive adhesive layer is formed by coating or the like on at least one surface of a support (base material layer) used in the present invention, and a form such as a film, sheet or tape is formed.

(2) Support The support (substrate) (4 in FIG. 1) constituting the carrier film for a transparent conductive film of the present invention is not particularly limited, but, for example, a paper-based support such as paper; Non-woven fabric, net-like fiber-based support (The raw material thereof is not particularly limited and, for example, manila hemp, rayon, polyester, pulp fiber and the like can be appropriately selected); Metal-based support such as metal foil and metal plate Body; Plastic supports such as plastic films and sheets; Rubber supports such as rubber sheets; Foams such as foam sheets and laminates of these (for example, laminates of plastic supports and other supports) An appropriate thin leaf such as a body or a laminate of plastic films (or sheets) can be used.

  As a raw material in the film or sheet of the plastic, for example, α-olefin such as polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) is used as a monomer component Olefin resin; cyclic olefin resin; polyester resin such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT); polycarbonate resin; polyvinyl chloride (PVC); vinyl acetate resin; Amide-based resins such as polyphenylene sulfide (PPS); polyamide (nylon), wholly aromatic polyamide (aramid); polyimide-based resin; polyetheretherketone (PEEK); aromatic polyether-based resin and the like. These materials can be used alone or in combination of two or more. Among them, particularly, the polyester resin has toughness, processability, transparency and the like, and by using this for a carrier film for a transparent conductive film, the workability and the testability will be improved, and the resin is further improved. It becomes a preferable aspect.

The polyester resins are not particularly limited as long as it can be formed into a sheet or film shape or the like, for example, polyethylene terephthalate (PET), polyethylene naphthalate, polybutylene terephthalate. These polyester resins may be used alone (homopolymers), or two or more may be mixed and polymerized (copolymer etc.). In particular, in the present invention, polyethylene terephthalate is preferably used as a support since it is used as a carrier film for a transparent conductive film. By using polyethylene terephthalate, it becomes a carrier film for a transparent conductive film excellent in toughness, processability and transparency, and the workability is improved, which is a preferable embodiment.

  The thickness of the support is generally 25 to 300 μm, preferably 75 to 200 μm, more preferably 80 to 140 μm, and particularly preferably 90 to 130 μm. By adhering the carrier film for transparent conductive film to the transparent conductive film (with a functional layer) within the above range and using it, the shape of the transparent conductive film free of stiffness and flexible is held. It is possible to prevent the occurrence of defects such as wrinkles and scratches in the processing step, the transfer step and the like, which is useful.

  Further, the support may be, if necessary, a release agent of silicone type, fluorine type, long chain alkyl type or fatty acid amide type, release with silica powder, antifouling treatment, acid treatment, alkali treatment, primer It is also possible to carry out antistatic treatment such as treatment, corona treatment, plasma treatment, easy adhesion treatment such as ultraviolet light treatment, coating type, kneading type, vapor deposition type and the like. In particular, when performing the antistatic treatment, it is preferable to provide an antistatic layer between the support and the pressure-sensitive adhesive layer.

  In order to improve the adhesion between the pressure-sensitive adhesive layer and the support, the surface of the support may be subjected to corona treatment or the like. In addition, the support may be subjected to backside treatment.

  The carrier film for a transparent conductive film (with a functional layer) of the present invention is a silicone, fluorine, long chain alkyl or fatty acid amide type release on the surface of the adhesive for the purpose of protecting the adhesive surface, if necessary. It is possible to bond the agent-treated separators together. As a base material which comprises a separator, although there exist paper and a plastic film, a plastic film is used suitably from the point which is excellent in surface smoothness. The film is not particularly limited as long as it can protect the pressure-sensitive adhesive layer, and, for example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer A united film, a polyethylene terephthalate film, a polybutylene terephthalate film, a polyurethane film, an ethylene-vinyl acetate copolymer film and the like can be mentioned.

  In addition, the support for the separator may be, if necessary, an alkaline treatment, a primer treatment, a corona treatment, a plasma treatment, an adhesion promoting treatment such as an ultraviolet ray treatment, or the like, a coating type, a kneading type, an evaporation type etc It can also be processed. In particular, when performing an antistatic treatment, it is preferable to provide an antistatic treatment layer between the support and the releasing agent.

2. Transparent Conductive Film (With Functional Layer) As shown in FIG. 1, the transparent conductive film (thin layer base material) 1 can be a film having a transparent conductive layer 1 a and a support 1 b.

  Examples of the support 1b include a resin film and a substrate made of glass or the like (for example, a sheet-like, film-like, plate-like substrate (member) or the like), and a resin film can be particularly mentioned. The thickness of the support 1 b is not particularly limited, but is preferably about 10 to 200 μm, and more preferably about 15 to 150 μm.

  The material of the resin film is not particularly limited, and various plastic materials having transparency may be mentioned. For example, as the material, polyester resin such as polyethylene terephthalate and polyethylene naphthalate, acetate resin, polyether sulfone resin, polycarbonate resin, polyamide resin, polyimide resin, polyolefin resin, (meth) acrylic resin Polyvinyl chloride resin, polyvinylidene chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate resin, polyphenylene sulfide resin and the like can be mentioned. Among these, polyester resins, polyimide resins, cyclic olefin resins and polyethersulfone resins are particularly preferable.

  In addition, the support 1b is previously subjected to an etching treatment such as sputtering, corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical formation, oxidation or undercoating on the surface, and a transparent conductive layer 1a etc. provided thereon The adhesion to the support 1 b may be improved. In addition, before providing the transparent conductive layer 1a, if necessary, dust may be removed or cleaned by solvent cleaning or ultrasonic cleaning.

  The constituent material of the transparent conductive layer 1a is not particularly limited, and is selected from the group consisting of indium, tin, zinc, gallium, antimony, titanium, silicon, zirconium, magnesium, aluminum, gold, silver, copper, palladium, and tungsten. Metal oxides of at least one metal, metal nanowires (eg, silver nanowires), metal mesh, and the like are used. The said metal oxide may contain the metal atom further shown by the said group as needed. For example, indium oxide (ITO) containing tin oxide, tin oxide containing antimony, etc. are preferably used, and ITO is particularly preferably used. The ITO preferably contains 80 to 99% by weight of indium oxide and 1 to 20% by weight of tin oxide.

  Although the thickness in particular of the said transparent conductive layer 1a is not restrict | limited, It is more preferable that it is 10-300 nm, and it is further more preferable that it is 15-100 nm.

  It does not specifically limit as a formation method of the said transparent conductive layer 1a, A conventionally well-known method is employable. Specifically, for example, a vacuum evaporation method, a sputtering method, and an ion plating method can be exemplified. In addition, an appropriate method can be adopted according to the required film thickness.

  Moreover, an undercoat layer, an oligomer prevention layer, etc. can be provided as needed between the transparent conductive layer 1a and the support body 1b.

  Moreover, the transparent conductive film 1 which has the said transparent conductive layer 1a can be used as a base material (optical member) for optical devices. The substrate for optical devices is not particularly limited as long as it is a substrate having optical properties, and, for example, a display device (liquid crystal display device, organic EL (electroluminescence) display device, PDP (plasma display panel), electron Examples of the base material (members) constituting a device such as paper), an input device (a touch panel or the like), or a base material (member) used for these devices. These substrates for optical devices have been reduced in hardness with the recent tendency of thinning, and are easily deformed or deformed in processing steps, transport steps, and the like. By sticking and using the carrier film for transparent conductive films of this invention, a shape can be hold | maintained, generation | occurrence | production of a malfunction can be suppressed and it becomes a preferable aspect.

  The functional layer 2 can be provided on the side of the transparent conductive film on which the transparent conductive layer 1 a is not provided.

  As the functional layer, for example, an antiglare treatment (AG) layer or an antireflective (AR) layer may be provided for the purpose of improving visibility. It does not specifically limit as a constituent material of a glare-proof processing layer, For example, ionizing-radiation-hardening-type resin, thermosetting resin, a thermoplastic resin etc. can be used. The thickness of the antiglare treatment layer is preferably 0.1 to 30 μm. As the antireflective layer, titanium oxide, zirconium oxide, silicon oxide, magnesium fluoride or the like is used. The antireflective layer can be provided with a plurality of layers.

  In addition, as the functional layer, a hard coat (HC) layer can be provided. As a material for forming the hard coat layer, for example, a cured film made of a curable resin such as melamine resin, urethane resin, alkyd resin, acrylic resin, or silicone resin is preferably used. The thickness of the hard coat layer is preferably 0.1 to 30 μm. It is preferable to provide the hardness of 0.1 μm or more in thickness. In addition, the antiglare layer, the antireflective layer, and the antiblocking layer can be provided on the hard coat layer. In addition, a hard coat layer having an antiglare function, an antireflective function, an antiblocking function, and an oligomer preventing function can be used.

  As a thickness of the said transparent conductive film with a functional layer (a functional layer is included), 210 micrometers or less are preferable, and 150 micrometers or less are more preferable. By using the carrier film for transparent conductive film of the present invention (with a functional layer) with respect to the transparent conductive film (adherend) within the above range, even if the transparent conductive film is very thin, its shape Can be held, and the occurrence of defects such as wrinkles and flaws can be suppressed, which is a preferable embodiment.

  As the adhesive strength (normal temperature: 25 ° C., adhesive strength to surface A in FIG. 1) to the functional layer of the pressure-sensitive adhesive layer used in the present invention, when the environment in aging (for example, temperature or humidity environment) changes And preferably 0.3 to 3.5 N / 50 mm, more preferably 0.3 to 2.5 N / 50 mm, 0.3 to 1.0 N, after bonding to a transparent conductive film and heating. More preferably, it is / 50 mm. When peeling the carrier film for transparent conductive films from the transparent conductive film as it is in the said range, the shape of the said transparent conductive film does not produce a deformation | transformation etc., but becomes a preferable aspect. Moreover, when the adhesive force exceeds 3.0 N / 50 mm, in particular, when peeling the carrier film for transparent conductive film from the transparent conductive film, the shape of the transparent conductive film tends to be deformed or the like. Yes, not preferable.

  Moreover, as an adhesive force with respect to the functional layer of the said adhesive layer used in this invention, it is heat resistance that the difference in adhesive force is 0.5 N / 50 mm or less before and after bonding and heating to a transparent conductive film. It is preferable from the viewpoint of sex. When the difference in adhesive strength is 0.5 N / 50 mm or more, the degree of adhesion to the transparent conductive film before and after heating largely changes, which affects the surface state of the transparent conductive film, which is not preferable.

  Moreover, as an adhesive force with respect to the functional layer of the said adhesive layer used in this invention, it does not change a lot, when aging the carrier film for transparent conductive films under heating, and when aging it under humidification. preferable. In particular, when the adhesive strength decreases under humidification, the cross-linking agent causes self-polymerization with moisture to be cured, which is not preferable for the reaction with the (meth) acrylic polymer, which is not preferable. It is preferable that the difference of the adhesive force in the aging under heating and the aging under humidification is within 0.2 N / 50 mm after bonding to a transparent conductive film and heating.

3. Laminate The present invention is a laminate having a carrier film for a transparent conductive film and a transparent conductive film laminated on the carrier film for a transparent conductive film,
The carrier film for transparent conductive film is the carrier film for transparent conductive film described in the present specification,
The transparent conductive film has a transparent conductive layer and a support,
The present invention relates to a laminate in which the adhesive surface of the pressure-sensitive adhesive layer of the carrier film for a transparent conductive film is bonded to the surface of the support opposite to the surface in contact with the transparent conductive layer.

Furthermore, the present invention is a laminate having a carrier film for transparent conductive film and a transparent conductive film laminated on the carrier film for transparent conductive film,
The carrier film for transparent conductive film is the carrier film for transparent conductive film described in the present specification,
The transparent conductive film has a transparent conductive layer and a support, and further has a functional layer on the surface of the support opposite to the surface in contact with the transparent conductive layer.
The present invention relates to a laminate in which the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer of the carrier film for a transparent conductive film is bonded to the surface of the functional layer opposite to the surface in contact with the support.

  Examples of the carrier film for transparent conductive film and the transparent conductive film used in the laminate of the present invention can include those described above.

  Hereinafter, although the example etc. which show the composition and effect of the present invention concretely are described, the present invention is not limited to these. In addition, the evaluation item in an Example etc. measured as follows. The contents of the formulation are shown in Tables 1 and 2 and the evaluation results are shown in Table 2.

Example 1
<Preparation of acrylic polymer (A)>
90.98% by weight of 2-ethylhexyl acrylate (2EHA), 9.00% by weight of 4-hydroxybutyl acrylate (HBA), and acrylic resin in a square flask equipped with a stirring blade, a thermometer, a nitrogen gas inlet tube, and a cooler 100 parts by weight of a monomer component of 0.02% by weight of acid (AA), 0.2 parts by weight of 2,2'-azobisisobutyronitrile as a polymerization initiator, and 205 parts by weight of ethyl acetate are charged and gently stirred. Nitrogen gas was introduced, and the liquid temperature in the flask was maintained at around 63 ° C., and a polymerization reaction was carried out for about 4 hours to prepare a (meth) acrylic polymer (A1) solution (about 35% by weight). The weight average molecular weight of the (meth) acrylic polymer (A1) was 650,000, and the Tg was -67.6 ° C.

<Adjustment of adhesive solution>
The above (meth) acrylic polymer (A1) solution (about 35% by weight) is diluted to 29% by weight with ethyl acetate, and hexamethylene is used per 100 parts by weight (solid content) of (meth) acrylic polymer of this solution. 12 parts by weight of an isocyanurate of diisocyanate (Nippon Polyurethane Industry Co., Ltd., trade name "Coronato HX"), iron as a catalyst tris (acetylacetonato) iron (trade name "Narsem ferric iron", trade name "Narsem ferric iron") 0 .015 parts by weight and 0.69 parts by weight of acetylacetone as a compound causing keto-enol tautomerism are added, and kept at about 25 ° C. for about 1 minute while stirring for mixing, (meth) acrylic pressure-sensitive adhesive composition (1 Were prepared.

<Preparation of Carrier Film for Transparent Conductive Film>
The above (meth) acrylic pressure-sensitive adhesive composition (1) is applied to one side of a polyethylene terephthalate (PET) substrate (thickness 125 μm, support), heated at 150 ° C. for 90 seconds, 20 μm thick The agent layer was formed. Then, a silicone-treated surface of a PET release liner (25 μm in thickness), one side of which was silicone-treated, was attached to the surface of the pressure-sensitive adhesive layer to prepare a carrier film for transparent conductive film. In addition, the said peeling liner was removed and used at the time of use.

[Examples 2 to 10, Comparative Examples 1 to 4]
As shown in Tables 1 and 2, the type or blending amount of the monomer component constituting the (meth) acrylic polymer, the crosslinking agent constituting the pressure-sensitive adhesive composition, the catalyst, and the keto-enol tautomeric compound was changed A carrier film for a transparent conductive film was produced in the same manner as in Example 1 except for the above.

<Measurement of weight average molecular weight (Mw) of (meth) acrylic polymer>
The weight average molecular weight of the produced polymer was measured by GPC (gel permeation chromatography).

Device: Tosoh Corporation HLC-8220 GPC
column:
Sample column; Tosoh Corporation TSKguardcolumn Super HZ-H
(1) + TSKgel Super HZM-H (2)
Reference column; Tosoh TSKgel Super H-RC (1)
Flow rate: 0.6 ml / min
Injection volume: 10 μl
Column temperature: 40 ° C
Eluent: THF
Injection sample concentration: 0.2% by weight
Detector: Differential Refractometer In addition, the weight average molecular weight was calculated by polystyrene conversion.

<Measurement of glass transition temperature (Tg) of (meth) acrylic polymer>
The glass transition temperature (Tg) (° C.) was determined by the following equation using the following literature values as the glass transition temperature Tgn (° C.) of the homopolymer of each monomer.

Formula: 1 / (Tg + 273) =. SIGMA. [Wn (-) / (Tgn + 273)]
(Wherein, Tg (° C) is the glass transition temperature of the copolymer, Wn (-) is the weight fraction of each monomer, Tgn (° C) is the glass transition temperature of the homopolymer of each monomer, n is the type of each monomer Represents
2-ethylhexyl acrylate (2EHA): -70 ° C
Butyl acrylate (BA): -55 ° C
4-hydroxybutyl acrylate (HBA): -32 ° C
Acrylic acid: 106 ° C
Methyl methacrylate (MMA): 105 ° C
In addition, "the synthesis and design of acrylic resin and new application development" (published by Central Management Development Center Publishing Department) was referred to as the literature value.

  The following evaluation was performed about the carrier film for transparent conductive films obtained by the Example and the comparative example.

<Measurement of adhesive force>
The obtained carrier film for transparent conductive film (with PET release liner),
(1) 24 hours at 50 ° C .: heat aging,
(2) 40 ℃, 92% R. H. What was aged (stored) on each condition of 24 hours: humidification aging was prepared respectively.
As the adherend, a transparent conductive film of 50 mm in width and 100 mm in length fixed to a SUS plate (SUS430BA) (manufactured by Nitto Denko Corporation, Elecristor V150M-OFAD2, has a transparent conductive layer on one side of the PET film, The “adhesive surface” of the pressure-sensitive adhesive layer of the carrier film for transparent conductive film was attached to the “functional layer surface” of the film having a functional layer on the other side to prepare a laminate (crimping with a bonding machine: 0.25 MPa, crimping speed 2.0 m / min).
With respect to the laminate, using a universal tensile tester, the carrier film for transparent conductive film is peeled from the transparent conductive film under the conditions of peeling speed 0.3 m / min (low speed peeling) and peeling angle 180 °, Peeling force (N / 50 mm) was measured (initial adhesion).
Further, the laminate prepared in the same manner as described above is then heated at 140 ° C. for 90 minutes, left at normal temperature (25 ° C.) for 30 minutes or more, and peeled off in the same environment under the same method. The force (N / 50 mm) was measured (adhesive force after heating).

<Zipping>
As the adherend, “HC side of HC film (Waif 50 mm in width, 100 mm in length, made by Kimoto Co., KB film G01, a film having a hard coat layer on a PET film) fixed to a SUS plate (SUS430BA): The "adhesive surface" of the adhesive layer of the carrier film for transparent conductive films was bonded to the hard coat surface "(crimping with a laminating machine: 0.25 MPa, crimping speed 2.0 m / min). Then, after heating at 140 ° C. for 90 minutes and then standing at normal temperature (25 ° C.) for 30 minutes or more, using a universal tensile tester under the same environment, peeling speed 0.3 m / min, peeling angle 180 ° The carrier film for transparent conductive film was peeled 80 mm from the HC film under the conditions, and the peeling force (N / 50 mm) at this time was measured.
Using the measurement data for the latter 60 mm of the peeling force, the presence or absence of zipping was determined by the following equation.
ΔF / F (Ave) <15%: Zipping does not occur (○)
ΔF / F (Ave)> 15%: Zipping occurs (×)
F (Ave): Average peel force F (Max): Maximum peel force F (Min): Minimum peel force ΔF: F (Max)-F (Min)

注）２ＥＨＡ：２−エチルヘキシルアクリレート、ＢＡ：ブチルアクリレート、ＨＢＡ：４−ヒドロキシブチルアクリレート、ＡＡ：アクリル酸、ＭＭＡ：メチルメタリレート。

Note) 2EHA: 2-ethylhexyl acrylate, BA: butyl acrylate, HBA: 4-hydroxybutyl acrylate, AA: acrylic acid, MMA: methyl methacrylate.

注）架橋剤は、
Ｃ／ＨＸ：イソシアネート系架橋剤（ヘキサメチレンジイソシアネートのイソシアヌレート体，日本ポリウレタン工業社製，商品名「コロネートＨＸ」）；
Ｃ／ＨＫ：イソシアネート系架橋剤（ヘキサメチレンジイソシアネートのイソシアヌレート体，日本ポリウレタン工業社製，商品名「コロネートＨＫ」）；
Ｃ／Ｌ：イソシアネート系架橋剤（トリメチロールプロパン／トリレンジイソシアネート３量体付加物，日本ポリウレタン工業社製，商品名「コロネートＬ」）；
Ｔ／Ｃ：エポキシ系架橋剤（三菱ガス化学社製，ＴＥＴＲＡＤ−Ｃ）；を示す。
触媒は、
鉄触媒：トリス（アセチルアセトナート）鉄（日本化学産業社製，商品名「ナーセム第二鉄」）；
錫触媒：ジオクチル錫ジラウレート（東京ファインケミカル社製、商品名「エンビライザー ＯＬ−１」）、を示す。
ケト−エノール互変異性を起こす化合物は、アセチルアセトンを示す。

Note) The crosslinking agent is
C / HX: isocyanate type crosslinking agent (isocyanurate of hexamethylene diisocyanate, manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Corronate HX");
C / HK: isocyanate type crosslinking agent (isocyanurate of hexamethylene diisocyanate, manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronato HK");
C / L: Isocyanate based crosslinking agent (trimethylolpropane / tolylene diisocyanate trimer adduct, manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Corronate L");
T / C: Epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., TETRAD-C);
The catalyst is
Iron catalyst: Tris (acetylacetonato) iron (manufactured by Nippon Chemical Industrial Co., Ltd., trade name "Narsem ferric iron");
Tin catalyst: Dioctyl tin dilaurate (manufactured by Tokyo Fine Chemical Co., Ltd., trade name "Embylizer OL-1") is shown.
Compounds that cause keto-enol tautomerism represent acetylacetone.

1a Transparent Conductive Layer 1b Support (Base Material)
1 Transparent Conductive Film 2 Functional Layer 3 Adhesive Layer 4 Support (Base Material)
10 Transparent conductive film with functional layer 20 Carrier film for transparent conductive film with functional layer A Adhesive surface on the side opposite to the side in contact with the support

Claims (10)

A carrier film for a transparent conductive film having a pressure-sensitive adhesive layer on at least one side of a support, comprising:
The pressure-sensitive adhesive layer is
The glass transition temperature is −50 ° C. or less, and 59.5 to 91% by weight of an alkyl (meth) acrylate having 2 to 14 carbon atoms and 8.5 to 40 of a hydroxyl group-containing monomer with respect to the total amount of monomer components. (Meth) acrylic polymer (A) obtained by polymerizing monomer components containing, by weight, 0.001 to 0.5% by weight of a carboxyl group-containing monomer, and 0 to 10% by weight of other copolymerizable monomers ), And
A carrier film for a transparent conductive film, which is formed from a pressure-sensitive adhesive composition containing an aliphatic polyisocyanate based crosslinking agent (B).   The carrier film for a transparent conductive film according to claim 1, wherein the aliphatic polyisocyanate crosslinking agent (B) contains a hexamethylene diisocyanate crosslinking agent.   The compounding quantity of the said aliphatic polyisocyanate type crosslinking agent (B) is 1-30 weight parts with respect to 100 weight parts of said (meth) acrylic-type polymers (A), The said claim | item 1 or 2 characterized by the above-mentioned. Carrier film for transparent conductive film. The said adhesive composition contains the catalyst (C) which has iron or tin as an active center, The carrier film for transparent conductive films in any one of the Claims 1-3 characterized by the above-mentioned.   The compounding amount of the catalyst (C) having iron or tin as an active center is 0.002 to 0.5 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer (A). The carrier film for transparent conductive films according to claim 4.   The carrier film for a transparent conductive film according to any one of claims 1 to 5, wherein the pressure-sensitive adhesive composition contains a compound (D) causing keto-enol tautomerism.   The transparent conductive film carrier film according to claim 6, wherein the compound (D) causing the keto-enol tautomerism is a β-diketone. It is a laminated body which has a transparent conductive film laminated on the carrier film for transparent conductive films according to any one of claims 1 to 7 and the carrier film for transparent conductive films,
A laminate comprising an adhesive surface of an adhesive layer of the carrier film for a transparent conductive film is bonded to at least one surface of the transparent conductive film. The transparent conductive film has a transparent conductive layer and a support,
The pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer of the carrier film for a transparent conductive film is bonded to the surface of the support opposite to the surface in contact with the transparent conductive layer. Stack. The transparent conductive film has a transparent conductive layer and a support, and further has a functional layer on the surface of the support opposite to the surface in contact with the transparent conductive layer.
The pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer of the carrier film for a transparent conductive film is bonded to the surface of the functional layer opposite to the surface in contact with the support. body.

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