JP6508106B2 - Packing material - Google Patents

Description

  The present invention relates to a packaging material.

  Generally, a packing material provided with a substrate part, a peripheral wall part, and a buffer block is known as a packing material containing corrugated cardboard. The substrate portion is a corrugated board material, and the buffer block is a block-shaped buffer member such as a foam member or a laminated cardboard. The peripheral wall portion is a corrugated board member or another member. The packaging material is disposed around the packaged goods.

  For example, the substrate portion faces the bottom surface or the top surface of the packaged product, the peripheral wall portion surrounds the outer edge of the substrate portion and faces the four sides of the packaged product, and the buffer block is the substrate It arrange | positions between a part and the said surrounding wall part, and the said packaged goods (for example, refer patent document 1).

JP 2007-246116 A

  By the way, although the buffer performance of the packaging material is mainly determined by the material and structure of the buffer block, the buffer block such as the foam member and the laminated cardboard requires relatively large man-hours and cost for its production.

  Therefore, if the buffer performance of the packaging material can be easily finely adjusted without changing the material and structure of the buffer block, the number of design steps and the cost of the packaging material can be reduced.

  SUMMARY OF THE INVENTION It is an object of the present invention to finely adjust shock absorbing performance without changing the material and structure of the shock absorbing block when the packaging material comprises a corrugated board and a peripheral wall and a shock absorbing block disposed therebetween. It is about providing possible packaging materials.

  A packaging material according to one aspect of the present invention is disposed around a packaged product, and includes a substrate portion, a peripheral wall portion, and a buffer block. The substrate portion is a corrugated board member facing the first outer surface of the packaged product and having a first cut-and-raised portion formed in part. The peripheral wall portion is opposed to a second outer surface formed along a direction which is adjacent to the first outer surface of the packaged product and intersects the first outer surface, and surrounds the outer edge of the substrate portion. is there. The buffer block is a member disposed between the packaged product and the base plate portion and the peripheral wall portion. The buffer block has a substrate facing surface, a peripheral wall facing surface, and a packaged product facing surface. The substrate facing surface is a surface formed along the surface of the substrate portion facing the packaged product. The peripheral wall facing surface is a surface formed along a surface of the peripheral wall portion facing the packaged product. The package facing surface is a surface formed along the first outer surface and the second outer surface of the package. The first cut-and-raised portion is obliquely erected toward the peripheral wall portion from a root portion located inside of a portion facing the buffer block. Furthermore, the end edge of the first cut-and-raised part is in contact with the surface between the substrate facing surface of the buffer block and the package facing surface.

  According to the present invention, in the case where the packaging material is provided with the substrate portion of the corrugated board, the peripheral wall portion and the buffer block disposed therebetween, fine adjustment of the buffer performance can be performed without changing the material and structure of the buffer block. It is possible to provide possible packaging materials.

FIG. 1: is a perspective view of the packing material and the to-be-packaged goods which concern on 1st Embodiment. FIG. 2 is a perspective view of the packaged product in the case of the packaging material according to the first embodiment. FIG. 3: is a plane sectional view of the principal part of the board | substrate part in the packing material which concerns on 1st Embodiment, and a surrounding wall part. FIG. 4 is a cutaway perspective view of the main part of the packaging material according to the first embodiment. FIG. 5: is a plane sectional view of the principal part of the packing material which concerns on 1st Embodiment. FIG. 6 is a perspective view of a buffer block provided in the packing material according to the first embodiment. FIG. 7 is a perspective view of the substrate portion and the buffer block in the packaging material according to the first embodiment. FIG. 8 is a plan cross-sectional view of the main part of the base plate portion and the peripheral wall portion in the packaging material according to the second embodiment. FIG. 9 is a plan cross-sectional view of the main part of the base plate portion and the peripheral wall portion in the packing material according to the third embodiment. FIG. 10 is a perspective view of the packing material according to the fourth embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiment is an example embodying the present invention, and does not have the property of limiting the technical scope of the present invention.

First Embodiment
As shown in FIGS. 1 and 2, the packaging material 8 according to the first embodiment is disposed around a package 9 such as an image forming apparatus. The packing material 8 includes a rectangular parallelepiped outer case 1 and a buffer unit 2 housed in the outer case 1 together with the package 9.

  In FIG. 2, the outer case 1 is shown by a phantom line (two-dot chain line). It is also conceivable that the package 9 is a box in which a product such as the image forming apparatus is accommodated.

  The outer case 1 shown in FIGS. 1 and 2 is a cardboard box that accommodates the package 9. It is also conceivable that the outer case 1 is a synthetic resin or wooden case.

  The buffer unit 2 includes a substrate unit 3 and a buffer block 4. The substrate unit 3 is a corrugated board material, and is disposed to face the bottom surface 90 of the packaged product 9. In the present embodiment, the substrate portion 3 is a rectangular corrugated board disposed along the inner surface of the bottom plate portion 10 of the outer case 1. For example, it is conceivable that the substrate portion 3 is a rectangular corrugated board disposed along the inner surface of the top plate portion 12 of the outer case 1.

  With the buffer unit 2 and the package 9 housed in the outer case 1, the four side walls 11 of the outer case 1 face the side surfaces 91 of the package 9 and surround the outer edge of the substrate 3. The side wall 11 of the outer case 1 is an example of a peripheral wall surrounding the outer edge of the substrate 3.

  In the package 9, the bottom surface 90 is an example of the first outer surface, and the side surfaces 91 of the four sides are an example of the second outer surface formed along the direction adjacent to the bottom surface 90 and intersecting the bottom surface 90. is there. In the packaged product 9, the side surface 91 is formed along the direction orthogonal to the bottom surface 90. It is also conceivable that the substrate unit 3 is disposed in the outer case 1 at a position facing the upper surface of the packaged product 9. In this case, the upper surface of the package 9 is an example of the first outer surface.

  The buffer block 4 is a buffer member attached to the surface of the substrate unit 3. In the present embodiment, the buffer block 4 is a foam member such as foam polystyrene. It is also conceivable that the buffer block 4 is a laminated cardboard or the like in which a plurality of corrugated cardboard pieces are adhered in a laminated state.

  As shown in FIGS. 1 and 2, in the state where the buffer unit 2 and the package 9 are accommodated in the outer case 1, the buffer block 4 is disposed between the package 9 and the substrate 3 and the peripheral wall. Be done.

  The buffer block 4 has a substrate facing surface 4a, a peripheral wall facing surface 4b, and a packaged product facing surface 4c. The substrate facing surface 4 a is a surface formed along the surface of the substrate unit 3 facing the package 9. The buffer block 4 is attached to the substrate unit 3 such that the substrate facing surface 4 a is in contact with the upper surface of the substrate unit 3.

  When the buffer unit 2 is accommodated in the outer case 1, the peripheral wall facing surface 4 b is a surface formed along the inner side surface of the side wall portion 11 of the outer case 1. In addition, the inner side surface of the side wall part 11 is an example of the surface which opposes the packing goods 9 in the said surrounding wall part surrounding the periphery of the board | substrate part 3. As shown in FIG.

  For example, it may be considered that the peripheral wall opposing surface 4b is in contact with the inner side surface of the side wall portion 11 or that the peripheral wall opposing surface 4b is opposed to the inner side surface of the side wall portion 11 with a very small gap. Be

  The package facing surface 4 c is a surface formed along the bottom surface 90 and the side surface 91 of the package 9. In the present embodiment, the buffer block 4 is disposed between the corner portion 92 of the package 9 and the outer case 1. Therefore, the package facing surface 4c includes three surfaces formed along the bottom surface 90 and the two adjacent side surfaces 91 of the package 9, respectively.

  In the present embodiment, the package facing surface 4 c is in contact with the bottom surface 90 and the two side surfaces 91 of the package 9. It is also conceivable that the packaged product opposing surface 4c is opposed to the side surface 91 of the packaged product 9 with a very small gap.

  By the way, although the buffer performance of the packing material 8 is mainly determined by the material and structure of the buffer block 4, the foam member and the buffer block 4 such as the laminated cardboard require relatively large man-hours and cost for manufacturing.

  Therefore, if the buffer performance of the packaging material 8 can be easily finely adjusted without changing the material and structure of the buffer block 4, the number of design steps and cost of the packaging material 8 can be reduced.

  The packaging material 8 has a structure that allows fine adjustment of the buffer performance without changing the material and structure of the buffer block 4. The structure will be described below.

  As shown in FIGS. 3 to 5, the first cut and raised portion 31 is formed in the vicinity of the portion of the substrate portion 3 to which the buffer block 4 is attached. Furthermore, as shown in FIGS. 3 and 7, the second cut and raised portion 32 is formed in the portion of the substrate portion 3 to which the buffer block 4 is attached.

  In the present embodiment, the two second cut-and-raised portions 32 are formed at positions where the first cut-and-raised portions 31 form a corner of a triangle when viewed from the direction orthogonal to the substrate portion 3.

  In addition, FIG. 3 has shown the state before the root part 31a of the 1st cut and raised part 31 and the root part 32a of the 2nd cut and raised part 32 are bend | folded. In FIG. 3, the alternate long and short dash lines indicate the fold lines of the root portion 31 a of the first cut and raised portion 31 and the root portion 32 a of the second cut and raised portion 32.

  As shown in FIGS. 4 and 5, the first cut-and-raised portion 31 is obliquely erected from the root portion 31 a located inside the portion facing the buffer block 4 toward the side wall portion 11 of the outer case 1. ing. The substrate portion 3 is formed with an opening 310 which is a mark formed by cutting and raising the first cut and raised portion 31.

  Furthermore, the end edge portion 31 b of the first cut and raised portion 31 is in contact with the intermediate surface 4 d between the substrate facing surface 4 a and the packaged product facing surface 4 c in the buffer block 4. The intermediate surface 4 d is a surface on the opposite side of the peripheral wall facing surface 4 b in the buffer block 4.

  For example, it is conceivable that the end edge 31 b of the first cut and raised portion 31 is in contact with the intermediate surface 4 d of the buffer block 4 in a slightly biting state.

  In the present embodiment, the intermediate surface 4 d is two planes formed along the orthogonal direction, and the distal end 31 b of the first cut and raised portion 31 is concave along the two surfaces forming the intermediate surface 4 d. It is.

  When the buffer block 4 receives an external force along the direction crossing the substrate facing surface 4a, the peripheral wall facing surface 4b and the intermediate surface 4d face outward such that the thickness in the direction orthogonal to the substrate facing surface 4a shrinks. It deforms to expand and tries to flatten. By the deformation of the buffer block 4, the impact applied to the package 9 is alleviated.

  In the packing material 8, the side wall portion 11 and the first cut and raised portion 31 of the outer case 1 respectively support the flattening buffer block 4 from opposite directions, and suppress the flattening of the cushion block 4. Further, the effect of suppressing the flattening of the buffer block 4 changes due to the difference in the shape of the first cut and raised portion 31 such as the width and the length. For example, the effect of suppressing the flattening of the buffer block 4 is greater in the case where the width of the first cut and raised portion 31 is wider than in the case where the width is the same.

  Therefore, it is easy to deform the buffer block 4 by changing the width and length of the first cut and raised portion 31 or selecting whether or not to provide the first cut and raised portion 31, ie, the buffer performance of the packing material 8. Can be fine-tuned easily.

  Further, as shown in FIG. 6, in the substrate facing surface 4 a of the buffer block 4, a recess 4 e corresponding to the second cut and raised portion 32 is formed. In the present embodiment, two recesses 4 e are formed in the substrate facing surface 4 a.

  As shown in FIG. 7, the second cut-and-raised portion 32 of the substrate portion 3 is a portion fitted into the recess 4 e of the buffer block 4. In the example shown in FIGS. 3 and 7, the end edge 32 b of the second cut and raised portion 32 is a portion cut and raised from the position of the outer edge of the substrate portion 3.

  The width of the end edge 32b of the second cut and raised portion 32 is formed larger than the width of the recess 4e. The end edge 32b of the second cut and raised portion 32 remains in the recess 4e in a contracted state in the width direction, and does not easily come out of the recess 4e.

  The buffer block 4 is temporarily fixed relatively firmly to the substrate portion 3 by the first cut and raised portion 31 and the second cut and raised portion 32. Therefore, even if the buffer block 4 is not bonded to the substrate portion 3, it is easy to transport and store the buffer unit 2 before being combined with the package 9.

Second Embodiment
Next, a packing material 8x according to the second embodiment will be described with reference to FIG. In FIG. 8, the same components as those shown in FIGS. 1 to 7 are denoted by the same reference numerals.

  The packaging material 8x has a structure in which the second cut-and-raised part 32 of the substrate 3 is replaced by a second cut-and-raised part 32x having a different direction of cut-and-raised as compared with the packing material 8 shown in FIGS. Have.

  In the packaging material 8x, two second cut and raised portions 32x are formed at positions where the first cut and raised portion 31 and a corner of a triangle are formed as viewed from the direction orthogonal to the substrate portion 3. In FIG. 8, the triangle is indicated by an alternate long and short dash line, and the buffer block 4 is indicated by an alternate long and two short dash line.

  Further, in the packaging material 8x, the first cut and raised portion 31 and the two second cut and raised portions 32x are root portions of the respective root portions 31a and 32a when viewed from the direction orthogonal to the substrate portion 3. It is formed standing up toward the inside of the said triangle which 31a and 32a form. The substrate portion 3 is formed with openings 310 and 320, which are marks formed by cutting and raising the first cut and raised portion 31 and the second cut and raised portion 32x.

  Similarly to the second cut and raised portion 32, the width of the end edge 32b of the second cut and raised portion 32x is also formed larger than the width of the recess 4e. Then, the end edges 32 b of the two second cut and raised portions 32 x are in contact with the inner surface of the recess 4 e of the buffer block 4.

  That is, in the packaging material 8x, the first cut and raised portion 31 and the two second cut and raised portions 32x sandwich the buffer block 4 from three sides. In this case, the buffer block 4 is temporarily fixed more firmly to the substrate portion 3 by the first cut-and-raised portion 31 and the two second cut-and-raised portions 32 x.

Third Embodiment
Next, a packing material 8y according to the third embodiment will be described with reference to FIG. In FIG. 9, the same components as the components shown in FIGS. 1 to 7 are denoted by the same reference numerals.

  As compared with the packaging material 8 shown in FIGS. 1 to 7, in the packaging material 8 y, the two second cutout parts 32 of the substrate unit 3 are replaced with one second cutout part 32 y having a different direction of cutting and raising. It has the following structure.

  In the packaging material 8y, the first cut-and-raised part 31 and the second cut-and-raised part 32y are formed standing up in the mutually opposing direction from the respective root parts 31a and 32a when viewed from the direction orthogonal to the substrate part 3. ing. The substrate portion 3 is formed with openings 310 and 320, which are marks formed by cutting and raising the first cut and raised portion 31 and the second cut and raised portion 32y. In FIG. 9, the buffer block 4 is shown by a two-dot chain line.

  Similarly to the second cut and raised portion 32, the width of the end edge 32b of the second cut and raised portion 32y is larger than the width of the recess 4e. The end edge 32 b of the second cut and raised portion 32 y is in contact with the inner surface of the recess 4 e of the buffer block 4.

  That is, in the packing material 8y, the first cut and raised portion 31 and the second cut and raised portion 32y sandwich the buffer block 4. In this case, the buffer block 4 is temporarily fixed relatively firmly to the substrate portion 3 by the first cut-and-raised portion 31 and the second cut-and-raised portion 32 y only by cutting and raising two portions of the substrate portion 3. .

Fourth Embodiment
Next, a packing material 8z according to a fourth embodiment will be described with reference to FIG. In FIG. 10, the same components as those shown in FIGS. 1 to 7 are denoted by the same reference numerals.

  The packing material 8z is a kind of so-called cardboard pallet. As compared with the packing material 8 shown in FIGS. 1 to 7, the packing material 8 z is packaged in that the substrate portion 3 and the frame plate portion 11 x surrounding the outer edge of the substrate portion 3 form an integral tray member 1 z. Different from material 8.

  The base plate portion 3 which is the bottom plate of the tray member 1 z faces the bottom surface 90 of the package 9, and the frame plate portion 11 x standing from the outer edge portion of the substrate portion 3 faces the side 91 of the lower portion of the package 9. Four legs 5 are fixed to the lower surface of the substrate 3.

  A frame plate portion 11x forming a frame of four sides of the rectangular substrate portion 3 corresponds to the side wall portion 11 of the outer case 1 in the packing material 8, and is an example of the peripheral wall portion. The buffer block 4 is disposed such that the peripheral wall facing surface 4b is along the inner side surface of the frame plate portion 11x. In addition, the packing material 8z is not equipped with the outer case 1 which directly supports the peripheral wall opposing surface 4b of the buffer block 4.

  Also in the case where the packaging material 8z is employed, the same effect as in the case where the packaging material 8 is employed can be obtained. In the packaging material 8z, it is also conceivable that the substrate portion 3 is a member stacked on the bottom plate portion of the shallow box-like tray member 1z.

  In the packaging material according to the present invention, within the scope of the invention described in each claim, the embodiment and application shown above are combined freely, or the embodiment and application are modified as appropriate, or It is also possible to configure by omitting a part.

1: Outer case 1 z: Tray member 2: Buffer unit 3: Board part 4: Buffer block 4 a: Board opposing surface 4 b: Peripheral wall opposing surface 4 c: Packaged item opposing surface 4 d: Intermediate surface 4 e: Recess 5: Legs 8 and 8 x , 8y, 8z: Packing material 9: Package 10: Bottom plate 11 of outer case 11: Side wall 11x of outer case 11: Frame plate 12 of tray member 12: Top plate 31 of outer case 31: first cut and raised portion 31a: Root portion 31b of the first cut-and-raised portion: end edge portion 32 of the first cut-and-raised portion: second cut-and-raised portion 32a: root portion 32b of the second cut-and-raised portion 32b, 32x, 32y: end edge of the second cut-and-raised portion Part 90: Bottom of package (first outer surface)
91: Side of package (second outer surface)
92: Corner portion 310: Opening

Claims (5)

A packing material placed around the packaged goods,
A corrugated board substrate portion facing the first outer surface, which is the bottom surface or the upper surface of the packaged product, and having a first cut-and-raised portion formed in part;
A peripheral wall portion facing a second outer surface which is a side surface formed in a direction adjacent to the first outer surface of the packaged product and crossing the first outer surface and surrounding four sides of the outer edge of the substrate portion When,
A buffer block disposed between the package and the base plate portion and the peripheral wall portion;
The buffer block is
A substrate facing surface formed along a surface of the substrate portion facing the package;
Two peripheral wall opposing surfaces formed along the two inner side surfaces facing the package in the peripheral wall portion;
A package counter surface comprising three surfaces formed along said first outer surface and two said second outer surfaces of said package;
An intermediate surface which is two flat surfaces forming a convex corner between the substrate facing surface and the packaged product facing surface, and the first cutout portion is a portion facing the buffer block The end of the first cut-and-raised portion is inclined to the intermediate surface of the buffer block, and is obliquely erected toward the two inner side surfaces of the peripheral wall portion from the root portion located on the inner side wherein in said concave portion with two formed in-away-away concave along a plane are engaged with the projecting angular portion of the buffering block, packing material forming. A recess is formed in the substrate facing surface of the buffer block,
The packaging material according to claim 1, wherein a second cut-and-raised portion to be inserted into the recess of the buffer block is formed in the substrate portion. Two recesses are formed in the substrate facing surface of the buffer block,
In the substrate portion, two second cut and raised portions to be fitted into the two recesses of the buffer block are formed,
The first cut-and-raised portion and the two second cut-and-raised portions are directed from the respective root portions toward the inside of the triangle formed by the respective root portions when viewed from the direction orthogonal to the substrate portion It is formed by standing up,
The packaging material according to claim 1 , wherein the end edge of the two second notches contacts the inner surface of the recess of the buffer block. The first cut-and-raised portion and the second cut-and-raised portion are formed to stand in mutually opposing directions from respective root portions when viewed from the direction orthogonal to the substrate portion,
The packaging material according to claim 1 or 2, wherein an end edge of the second cut and raised part is in contact with an inner surface of the recess of the buffer block. The packaging material according to any one of claims 1 to 4, wherein the buffer block is a foam member.

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