JP6500551B2 - 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器 - Google Patents

電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器 Download PDF

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Publication number
JP6500551B2
JP6500551B2 JP2015065934A JP2015065934A JP6500551B2 JP 6500551 B2 JP6500551 B2 JP 6500551B2 JP 2015065934 A JP2015065934 A JP 2015065934A JP 2015065934 A JP2015065934 A JP 2015065934A JP 6500551 B2 JP6500551 B2 JP 6500551B2
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Prior art keywords
light transmitting
electro
wafer
optical device
mirror
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JP2015065934A
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English (en)
Japanese (ja)
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JP2016186527A (ja
JP2016186527A5 (OSRAM
Inventor
康男 山▲崎▼
康男 山▲崎▼
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Seiko Epson Corp
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Seiko Epson Corp
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Publication date
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Priority to JP2015065934A priority Critical patent/JP6500551B2/ja
Priority to US15/017,960 priority patent/US9547169B2/en
Priority to CN201610162063.6A priority patent/CN106019577B/zh
Publication of JP2016186527A publication Critical patent/JP2016186527A/ja
Priority to US15/348,172 priority patent/US10156717B2/en
Publication of JP2016186527A5 publication Critical patent/JP2016186527A5/ja
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/085—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by electromagnetic means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/005—Projectors using an electronic spatial light modulator but not peculiar thereto
    • G03B21/008—Projectors using an electronic spatial light modulator but not peculiar thereto using micromirror devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Projection Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Transforming Electric Information Into Light Information (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2015065934A 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器 Active JP6500551B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015065934A JP6500551B2 (ja) 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器
US15/017,960 US9547169B2 (en) 2015-03-27 2016-02-08 Electro-optical device, method of manufacturing electro-optical device, electro-optical unit, and electronic apparatus
CN201610162063.6A CN106019577B (zh) 2015-03-27 2016-03-21 电光装置、电光装置的制造方法、电光单元及电子设备
US15/348,172 US10156717B2 (en) 2015-03-27 2016-11-10 Electro-optical device, method of manufacturing electro-optical device, electro-optical unit, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015065934A JP6500551B2 (ja) 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器

Publications (3)

Publication Number Publication Date
JP2016186527A JP2016186527A (ja) 2016-10-27
JP2016186527A5 JP2016186527A5 (OSRAM) 2018-04-12
JP6500551B2 true JP6500551B2 (ja) 2019-04-17

Family

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Family Applications (1)

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JP2015065934A Active JP6500551B2 (ja) 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器

Country Status (3)

Country Link
US (2) US9547169B2 (OSRAM)
JP (1) JP6500551B2 (OSRAM)
CN (1) CN106019577B (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016184068A (ja) * 2015-03-26 2016-10-20 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
JP6500551B2 (ja) * 2015-03-27 2019-04-17 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4481531A (en) * 1977-11-03 1984-11-06 Massachusetts Institute Of Technology Microchannel spatial light modulator
US5042923A (en) * 1988-06-27 1991-08-27 Allied-Signal, Inc. Adjustable tint window with electrochromic conductive polymer
KR100584538B1 (ko) * 1999-11-04 2006-05-30 삼성전자주식회사 마이크로미러 가동장치를 채용한 반사형 프로젝터
US6700557B1 (en) * 2000-03-07 2004-03-02 Three-Five Systems, Inc. Electrode border for spatial light modulating displays
JP3605752B2 (ja) * 2000-03-10 2004-12-22 ノーリツ鋼機株式会社 画像形成装置
US6555904B1 (en) * 2001-03-05 2003-04-29 Analog Devices, Inc. Electrically shielded glass lid for a packaged device
JP2004354853A (ja) * 2003-05-30 2004-12-16 Seiko Epson Corp 冷却装置、この冷却装置を備えた光学装置およびプロジェクタ
TW593126B (en) * 2003-09-30 2004-06-21 Prime View Int Co Ltd A structure of a micro electro mechanical system and manufacturing the same
US7760415B2 (en) * 2003-11-01 2010-07-20 Silicon Quest Kabushiki-Kaisha Micro mirror device
US20050184304A1 (en) * 2004-02-25 2005-08-25 Gupta Pavan O. Large cavity wafer-level package for MEMS
US7184202B2 (en) * 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
US7417783B2 (en) * 2004-09-27 2008-08-26 Idc, Llc Mirror and mirror layer for optical modulator and method
KR100667291B1 (ko) * 2005-07-27 2007-01-12 삼성전자주식회사 마이크로 미러 소자 패키지 및 그 제조방법
JP4142064B2 (ja) * 2005-08-05 2008-08-27 セイコーエプソン株式会社 液晶装置、電気光学装置、プロジェクタ、及びマイクロデバイス
US7763962B2 (en) * 2006-11-10 2010-07-27 Spatial Photonics, Inc. Wafer-level packaging of micro devices
JP5098681B2 (ja) * 2008-02-15 2012-12-12 セイコーエプソン株式会社 液晶装置、投射装置、及び電子機器
DE102008012384A1 (de) * 2008-03-04 2009-09-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Deckel für Mikro-Systeme und Verfahren zur Herstellung eines Deckels
JP2010014798A (ja) * 2008-07-01 2010-01-21 Nsk Ltd マイクロミラーデバイス及び光照射装置
US7898724B2 (en) 2008-11-05 2011-03-01 Texas Instruments Incorporated Thermal conduction by encapsulation
US8864316B2 (en) * 2010-04-28 2014-10-21 Lemoptix Sa Optical MEMS scanning micro-mirror with speckle reduction
WO2012029370A1 (ja) * 2010-08-31 2012-03-08 京セラ株式会社 光伝送構造体およびその製造方法、ならびに光伝送モジュール
JP2012198401A (ja) 2011-03-22 2012-10-18 Seiko Epson Corp プロジェクター
KR101849974B1 (ko) * 2011-09-16 2018-04-19 삼성전자주식회사 개구수 제어 유닛, 이를 채용한 가변형 광 프로브 및 깊이 스캐닝 방법
US20140002964A1 (en) * 2012-06-28 2014-01-02 Qualcomm Mems Technologies, Inc. Mems device encapsulation with corner or edge seals
EP2769956B1 (en) * 2013-02-20 2016-08-24 Harman Becker Automotive Systems GmbH Circuit board comprising spatial light modulator
JP6500551B2 (ja) * 2015-03-27 2019-04-17 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器

Also Published As

Publication number Publication date
JP2016186527A (ja) 2016-10-27
CN106019577A (zh) 2016-10-12
US20160282607A1 (en) 2016-09-29
CN106019577B (zh) 2020-07-21
US10156717B2 (en) 2018-12-18
US20170059853A1 (en) 2017-03-02
US9547169B2 (en) 2017-01-17

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