JP6486917B2 - スキャトロメトリ測定のための照明配置 - Google Patents

スキャトロメトリ測定のための照明配置 Download PDF

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Publication number
JP6486917B2
JP6486917B2 JP2016527043A JP2016527043A JP6486917B2 JP 6486917 B2 JP6486917 B2 JP 6486917B2 JP 2016527043 A JP2016527043 A JP 2016527043A JP 2016527043 A JP2016527043 A JP 2016527043A JP 6486917 B2 JP6486917 B2 JP 6486917B2
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Japan
Prior art keywords
illumination
target
scatterometry
illumination beam
pupil plane
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JP2016527043A
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English (en)
Japanese (ja)
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JP2016527501A5 (OSRAM
JP2016527501A (ja
Inventor
ツァヒ グリュンツヴァイク
ツァヒ グリュンツヴァイク
アンディ（アンドリュー） ヒル
アンディ（アンドリュー） ヒル
バリー ロエフスキー
バリー ロエフスキー
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KLA Corp
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KLA Corp
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Publication of JP2016527501A5 publication Critical patent/JP2016527501A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
    • F21V14/02—Controlling the distribution of the light emitted by adjustment of elements by movement of light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • G03F7/706849—Irradiation branch, e.g. optical system details, illumination mode or polarisation control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/40—Lighting for industrial, commercial, recreational or military use
    • F21W2131/403—Lighting for industrial, commercial, recreational or military use for machines
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2016527043A 2013-07-18 2014-07-15 スキャトロメトリ測定のための照明配置 Active JP6486917B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361847883P 2013-07-18 2013-07-18
US61/847,883 2013-07-18
PCT/US2014/046724 WO2015009739A1 (en) 2013-07-18 2014-07-15 Illumination configurations for scatterometry measurements

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019028295A Division JP6745367B2 (ja) 2013-07-18 2019-02-20 スキャトロメトリ測定システム及び方法

Publications (3)

Publication Number Publication Date
JP2016527501A JP2016527501A (ja) 2016-09-08
JP2016527501A5 JP2016527501A5 (OSRAM) 2017-08-24
JP6486917B2 true JP6486917B2 (ja) 2019-03-20

Family

ID=52346681

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016527043A Active JP6486917B2 (ja) 2013-07-18 2014-07-15 スキャトロメトリ測定のための照明配置
JP2019028295A Active JP6745367B2 (ja) 2013-07-18 2019-02-20 スキャトロメトリ測定システム及び方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019028295A Active JP6745367B2 (ja) 2013-07-18 2019-02-20 スキャトロメトリ測定システム及び方法

Country Status (4)

Country Link
JP (2) JP6486917B2 (OSRAM)
KR (2) KR102069253B1 (OSRAM)
TW (1) TWI640761B (OSRAM)
WO (1) WO2015009739A1 (OSRAM)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105807573B (zh) * 2014-12-31 2017-12-29 上海微电子装备（集团）股份有限公司 用于套刻误差检测的装置和方法
US10732516B2 (en) * 2017-03-01 2020-08-04 Kla Tencor Corporation Process robust overlay metrology based on optical scatterometry
US11112369B2 (en) * 2017-06-19 2021-09-07 Kla-Tencor Corporation Hybrid overlay target design for imaging-based overlay and scatterometry-based overlay
US11112691B2 (en) * 2019-01-16 2021-09-07 Kla Corporation Inspection system with non-circular pupil
KR102876372B1 (ko) * 2020-01-29 2025-10-24 에이에스엠엘 네델란즈 비.브이. 기판 상의 주기적 구조체를 측정하는 메트롤로지 방법 및 디바이스
EP3876037A1 (en) * 2020-03-06 2021-09-08 ASML Netherlands B.V. Metrology method and device for measuring a periodic structure on a substrate
US11346657B2 (en) * 2020-05-22 2022-05-31 Kla Corporation Measurement modes for overlay
CN114253065B (zh) * 2021-12-20 2025-08-01 武汉天马微电子有限公司 掩膜版及其制备方法、显示面板、显示装置和光刻设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859424A (en) * 1997-04-08 1999-01-12 Kla-Tencor Corporation Apodizing filter system useful for reducing spot size in optical measurements and other applications
US6538730B2 (en) * 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system
US7528953B2 (en) * 2005-03-01 2009-05-05 Kla-Tencor Technologies Corp. Target acquisition and overlay metrology based on two diffracted orders imaging
US7589832B2 (en) * 2006-08-10 2009-09-15 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device method
US7573584B2 (en) * 2006-09-25 2009-08-11 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
KR101523993B1 (ko) * 2006-11-27 2015-05-29 필립스 솔리드-스테이트 라이팅 솔루션스, 인크. 조명 장치, 균일한 투사 조명을 제공하기 위한 방법, 및 투사 조명 장치
US7618163B2 (en) * 2007-04-02 2009-11-17 Ruud Lighting, Inc. Light-directing LED apparatus
DE102008046362A1 (de) * 2008-09-09 2010-03-18 Diehl Bgt Defence Gmbh & Co. Kg Gegenstandserfassungssystem mit einem Bilderfassungssystem
NL2004542A (en) * 2009-05-11 2010-11-15 Asml Netherlands Bv Method of determining overlay error and a device manufacturing method.
US20120081684A1 (en) * 2009-06-22 2012-04-05 Asml Netherlands B.V. Object Inspection Systems and Methods
NL2008197A (en) * 2011-02-11 2012-08-14 Asml Netherlands Bv Inspection apparatus and method, lithographic apparatus, lithographic processing cell and device manufacturing method.
DE102011006468B4 (de) * 2011-03-31 2014-08-28 Carl Zeiss Smt Gmbh Vermessung eines abbildenden optischen Systems durch Überlagerung von Mustern
NL2008936A (en) 2011-07-28 2013-01-29 Asml Netherlands Bv Illumination source for use in inspection methods and/or lithography inspection and lithographic apparatus and inspection method.
US20130077086A1 (en) * 2011-09-23 2013-03-28 Kla-Tencor Corporation Solid-State Laser And Inspection System Using 193nm Laser

Also Published As

Publication number Publication date
KR102202523B1 (ko) 2021-01-13
JP2019078773A (ja) 2019-05-23
WO2015009739A1 (en) 2015-01-22
TWI640761B (zh) 2018-11-11
KR20160034343A (ko) 2016-03-29
KR20200008043A (ko) 2020-01-22
TW201522942A (zh) 2015-06-16
JP2016527501A (ja) 2016-09-08
JP6745367B2 (ja) 2020-08-26
KR102069253B1 (ko) 2020-01-22

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