JP6483679B2 - 集積回路および集積回路アレイを製造する方法 - Google Patents
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Description
−それぞれがサブストレート部分において形成されている複数の集積回路エレメントであり、サブストレート部分は相互に分離されている複数の集積回路エレメントと、
−集積回路エレメントを相互に柔軟に接続するために集積回路エレメントに対して結合されている柔軟及び/又は伸縮可能な接続レイヤと、
−集積回路エレメントを相互に電気的に接続するための複数の電気的インターコネクトであり、集積回路エレメントの統合されたインターコネクトと一体に金属ラインとして形成される電気的インターコネクトと、を含む。
−統合された金属ラインとして形成された電気的インターコネクトを用いて相互に電気的に接続された複数の集積回路エレメントを含んでいるサブストレートを提供するステップと、
−電気的インターコネクトを露出させるステップと、
−集積回路エレメント間において柔軟な接続を提供するために集積回路エレメントに対して柔軟及び/又は伸縮可能な接続レイヤを結合するステップと、
−集積回路エレメントを含んでいるサブストレート部分を相互に機械的に分離するステップであり、柔軟及び/又は伸縮可能な接続レイヤを用いて集積回路エレメントが柔軟に接続されているステップと、を含む。
Claims (15)
- 超音波画像化システムといった2次元センサアレイのための集積回路アレイであって、
複数の集積回路エレメントおよび複数の統合された金属ラインのそれぞれがサブストレート部分において形成されており、前記サブストレート部分は相互に分離されている、複数の集積回路エレメントおよび複数の統合された金属ラインと、
前記集積回路エレメント間を相互に柔軟に接続するために前記集積回路エレメントに対して結合されている柔軟及び/又は伸縮可能な接続レイヤと、
前記集積回路エレメントを相互に電気的に接続するための複数の電気的インターコネクトであり、それぞれの集積回路エレメントは分離されたサブストレート部分において形成されており、前記電気的インターコネクトは前記集積回路エレメントの統合されたインターコネクトと共に一体でモノリシックに形成され、前記金属ラインを構成する、複数の電気的インターコネクトと、
を含む、集積回路アレイ。 - 前記電気的インターコネクトは、前記接続レイヤから絶縁されている、
請求項1に記載の集積回路アレイ。 - 前記電気的インターコネクトは、絶縁層を用いて相互に電気的に絶縁されている、
請求項2に記載の集積回路アレイ。 - 前記絶縁層は、パリレン層、または、原子層堆積技術(ALD)によってデポジットされたレイヤ、を含む、
請求項3に記載の集積回路アレイ。 - 前記集積回路エレメントは、測定値を検出するために、センサエレメントに対してそれぞれ接続されている、
請求項1に記載の集積回路アレイ。 - 前記センサエレメントは、超音波を放射および受信するための超音波トランスデューサエレメントである、
請求項5に記載の集積回路アレイ。 - 前記電気的インターコネクトは、サブミクロン単位の金属ラインとして形成されている、
請求項1に記載の集積回路アレイ。 - 前記電気的インターコネクトは、前記集積回路エレメントを相互に柔軟に接続するために、立面図において少なくとも区分ごとに曲線形状である、
請求項1に記載の集積回路アレイ。 - 超音波画像化システムといった2次元センサアレイのための集積回路エレメントのアレイを製造する方法であって、
統合された金属ラインとして形成された電気的インターコネクトを用いて相互に電気的に接続された複数の集積回路エレメントを含んでいるサブストレートを提供するステップと、
前記電気的インターコネクトを露出させるステップと、
前記集積回路エレメント間において柔軟な接続を提供するために前記集積回路エレメントに対して柔軟及び/又は伸縮可能な接続レイヤを結合するステップと、
前記柔軟及び/又は伸縮可能な接続レイヤを用いて前記集積回路エレメントが柔軟に接続されるように、前記集積回路エレメントを含んでいるサブストレート部分を相互に機械的に分離するステップと、
を含む、方法。 - 前記インターコネクトは、フレキシブル接続レイヤを結合する以前に、除去可能な保護モールドを用いてエンベッドされている、
請求項9に記載の方法。 - 前記保護モールドは、前記電気的インターコネクトを露出するために除去される、
請求項10に記載の方法。 - 前記方法は、さらに、
測定値を検出するために、前記集積回路エレメントそれぞれに対してセンサエレメントを接続するステップ、
を含む、請求項9に記載の方法。 - 前記センサエレメントは、超音波を放射及び/又は受信するための超音波トランスデューサエレメントである、
請求項12に記載の方法。 - 前記集積回路は、前記露出されたインターコネクトの位置に対応する位置において前記サブストレート部分を切断することによって、相互に機械的に分離される、
請求項9に記載の方法。 - 血管内超音波システムのための超音波トランスデューサであって、
超音波を放射及び/又は受信するために、複数の超音波トランスデューサエレメントを含んでいるトランスデューサアレイと、
前記トランスデューサエレメントを駆動するために、請求項1乃至8いずれか一項に記載の前記集積回路アレイと、
を含む、超音波トランスデューサ。
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PCT/EP2014/072260 WO2015071051A1 (en) | 2013-11-15 | 2014-10-16 | Integrated circuit array and method for manufacturing an array of integrated circuits |
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JP5529577B2 (ja) * | 2010-02-14 | 2014-06-25 | キヤノン株式会社 | 電気機械変換装置及びその作製方法 |
EP2455133A1 (en) | 2010-11-18 | 2012-05-23 | Koninklijke Philips Electronics N.V. | Catheter comprising capacitive micromachined ultrasonic transducers with an adjustable focus |
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- 2014-10-16 JP JP2016530897A patent/JP6483679B2/ja active Active
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CN105849890A (zh) | 2016-08-10 |
US10736607B2 (en) | 2020-08-11 |
US20160256133A1 (en) | 2016-09-08 |
WO2015071051A1 (en) | 2015-05-21 |
CN105849890B (zh) | 2019-04-02 |
EP3069382B1 (en) | 2021-09-29 |
EP3069382A1 (en) | 2016-09-21 |
JP2017503534A (ja) | 2017-02-02 |
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