JP6476756B2 - Heat-resistant IC tag manufacturing method - Google Patents

Description

  The present invention relates to a heat-resistant IC tag in which an IC tag is incorporated in a glass container, and more particularly, to an internal structure of a glass container in which the incorporated IC tag does not easily slide inside the container.

  An RFID tag (hereinafter referred to as an IC tag) for reading out information stored in the IC chip wirelessly without contact is an ID card for entry / exit management, a ticket for transportation such as subway, bus or ferry, Or, it is incorporated in an IC card such as electronic money, or affixed as a label for sealing various products / articles themselves or cases distributed in the market, for shoplifting prevention, authenticity judgment, history management, distribution management, inventory It is also used for management, etc.

  The IC tag 10 itself has a very simple structure in which a coiled loop antenna 12 for transmitting and receiving electromagnetic waves and an IC chip 4 connected to the loop antenna 12 are disposed on a thin substrate 11 as shown in FIG. Practically, it is common to cover the front and back of the base material 11 with a protective sheet for use.

  For example, in a noncontact IC card system, an electromagnetic wave is emitted from a loop antenna of a reader / writer which writes or reads data to the IC card. The radiated electromagnetic waves are received by a loop antenna provided inside the IC card. Thus, communication is performed between the IC card and the reader / writer. However, since the driving energy is excited by the electromagnetic wave, it is not necessary to incorporate a battery as an energy source. Therefore, it can be made smaller and lighter, and can be used semipermanently unless destroyed. As a communication frequency, a 900 MHz band or 2.45 GHz or 5.8 GHz band which can make a loop antenna small is used, and a communicable distance is about several tens cm to several m.

  Specific examples used as labels are attached to inconspicuous areas of commercial materials for inventory and history management of products etc, or to creases such as sealing bags, enclosures of electronic devices, etc., and closed sections. There is a seal that is used to put it on. Another example is when used around lids, stoppers, food bottles such as liquor, wine bottles, jams, dressings, sauces, spices etc. or plastic containers. These containers are often covered with a shrink film with a part or all of the lid or plug and the side of the container as evidence that the container is unopened or unopened.

  In addition, recently, the demand for a chemically resistant IC tag that can be used even in a high temperature environment of 300 ° C. to 400 ° C. for a short time in a short time is also increasing (Patent Document 1) . For example, as shown in FIG. 2, the structure of the heat resistant tag is a structure in which the IC tag 10 is covered with the fireproof layer 3 and the fireproof layer 3 is further covered with the protective layer 2. A heat-resistant synthetic resin may be used for the protective layer 2 in some cases, but if the object to which the IC tag is attached has a chemical treatment process such as washing with an acid-alkali, a sufficient protective effect against chemicals can be obtained. In recent years, a glass container excellent in both heat resistance and chemical resistance is used as the protective layer 2.

  Generally, the space between the IC tag 10 placed at the center of the glass container 2 and the glass container 2 is filled with a heat insulating material having open cells. However, if foam or hollow spheres in which independent cells are dispersed in a highly heat-resistant solid such as cement or heatless glass are used for the fireproof layer 3, the air in the cells will expand and be damaged at high temperature. Things can happen. Therefore, it may have a structure which is filled with the open-celled heat insulating material and simultaneously brings the inside of the glass container into a low pressure vacuum state.

  As the heat insulating material, inorganic fibers such as ceramic wool, glass wool, rock wool, etc., and heat insulating materials such as bricks, ceramic formed bodies, etc., and materials having permeability to liquid or gas are used. However, if there is a process involving dipping in the chemical solution tank, the chemical solution may come in contact with the IC tag, and the durability may be lowered.

JP, 2011-123866, A JP 2002-222400 A

  In the heat-resistant IC tag in which the IC tag is placed at the center of the glass container and the space between the glass container and the IC tag is filled with the glass fiber of the heat insulator, the end of the glass fiber insulation is melted by heat treatment during the manufacturing process. As a result, the length is shortened and the position occupied in the glass container is not stable. Even if the desirable position of the IC tag in the container is such that the lower end of the heat insulating material abuts on the bottom surface of the glass container, the heat insulating material slides away from the bottom and slips up at a certain pace There is. Then, there is a problem that the IC tag is also displaced and the stability of communication is lost.

  On the contrary, only the heat insulating material is displaced, and the IC tag may come out of the heat insulating material and be too close to the glass container. In this case, even if the pressure is reduced, the heat insulating effect of the heat insulating material does not function effectively, and the IC tag may be thermally damaged in a high temperature environment.

  The present invention has been made in view of such a situation, and in a heat-resistant tag in which an IC tag inlet is accommodated in a glass container, a glass fiber thermal insulation layer filled to protect the IC tag from heat causes external impact or An object of the present invention is to provide an internal structure of a glass container which does not slide in the glass container and change its position by its own weight.

The invention according to claim 1 for achieving the above object includes the steps of forming a glass container was one of cutting the other end outright sealed ends open end of the glass tube having a predetermined inner diameter,
Storing an IC tag inside the glass container;
Filling the glass container with a glass heat insulating material so as to surround the IC tag;
During the attachment of the exhaust pipe by heating the open end, flying fine powder of glass fiber with air to fix the fine powder of glass to the upper inner wall of the glass container;
Sealing the open end of the glass container while evacuating the glass container through the exhaust pipe;
A method of manufacturing a heat-resistant IC tag, characterized in that

The invention described in claim 2 for achieving the above object is obtained by the manufacturing method of the heat-resistant IC tag according to claim 1, characterized in that to reduce the internal pressure of the glass container to less than 0.5Pa is there.

  In the present invention, a convex portion made of glass fine powder is formed on the upper inner wall of a cylindrical glass container. By appropriately selecting the thickness of the convex portion, the inner diameter of the glass convex portion can be made narrower than the outer diameter of the cylindrical heat insulating layer made of glass fiber. The inner diameter of the protrusion and the outer diameter of the heat insulating layer are adjusted so that the protrusion is a stopper.

Then, even if the glass fiber thermal insulation layer previously contained so as to contact the bottom of the glass container is moved, for example, by the external force, the upper edge of the thermal insulation layer is blocked by the protrusion of the glass fine powder and moves. Even if you move it, you can move only a small distance.
Therefore, since the heat insulating layer does not shift in the container, the IC tag housed inside the glass heat insulating layer is not exposed or moved from the heat insulating layer.

  For this reason, the communication performance of the IC tag does not decrease, and the heat resistance does not decrease, and the IC tag is not damaged.

It is a figure (photograph) for demonstrating an example of the external shape of a heat-resistant IC tag. (A) When the thermal insulation layer is in a normal position. (B) When the thermal insulation layer moves upward. It is sectional drawing of the side view (a) and upper surface view (b) explaining an example of the internal structure of a heat-resistant IC tag. It is a schematic diagram explaining the shift | offset | difference of the heat insulation layer of a heat-resistant IC tag. (A) Top view, (b) Cross sectional view. It is a figure of the cross sectional view explaining the positional relationship of the adhering layer and heat insulation layer which become this invention. It is a perspective view explaining the structure of IC tag. (A)-(f) It is process drawing of the cross sectional view explaining the manufacturing method of a heat-resistant IC tag.

  The IC tag 10 is like an inlet in which the IC chip 13 is connected to the end of the loop antenna 12 on the film base 11 on which the loop antenna 12 made of copper or aluminum is laid as shown in FIG. The loop antenna 12 is generally wound on a film substrate 11 in the form of a loop as large as possible in two or more turns and laid, and the carrier frequency (carrier frequency) of the electromagnetic wave emitted from the reader / writer is A signal is received by resonating a resonant circuit composed of the loop antenna 12 and a capacitor (not shown).

  A capacitor can be produced, for example, by opposing electrodes on the front and back of the substrate 11. The IC chip 4 is connected or directly soldered to the connection island at the end of the antenna 12 through an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP). . In order to protect the connecting portion, underfill resin is often filled in the gap between the IC chip 4 and the support base 11 or the whole is covered with resin.

  Usually, the above-mentioned IC tag 10 is held between plastic base materials and used in a card form, coin form or the like. In order to improve the heat resistance, a glass substrate can be used as the supporting substrate 11 on which the IC chip 4 is mounted, but generally, the IC tag 10 is accommodated at the center of the glass container 2 as shown in FIG. A type of heat-resistant IC tag 1 is used.

The outermost layer of the heat-resistant tag 1 is a heat-resistant glass material such as quartz glass, borosilicate glass, or aluminoborosilicate glass. The shape of the glass container 2 is not particularly limited, but a shape such as a cylindrical shape or a square shape is desirable from the viewpoint of strength and ease of handling, but a cylindrical shape is particularly preferable. If it is a glass container, it has sufficient chemical resistance, and it becomes an IC tag that has both heat resistance and chemical resistance.

  Although FIG. 2 and FIG. 3 show the example in which the IC tag 10 is placed horizontally to the bottom of the container, it may be vertical or may be inclined. It may be installed so as to improve transmission and reception efficiency of radio waves from the reader / writer.

  The gap between the glass container 2 and the IC tag 10 is filled with glass fibers 3 to hold the IC tag 10 away from the glass wall as shown in FIGS. 1 to 3. The glass fiber 3 is an open-celled material having no pores inside, and has a strength capable of supporting the IC tag 10 inside. Since this glass fiber 3 functions as a heat insulating material, it is hereinafter referred to as the glass fiber based heat insulating layer 3 or simply as the heat insulating layer 3.

  The glass fiber used for the heat insulating layer 3 is a heat-resistant member such as an inorganic fiber body such as ceramic wool, glass wool, rock wool, a brick, a ceramic forming body, etc. The heat insulating material which it has is preferable.

  By the way, the heat insulating layer 3 housed inside the cylindrical glass container 2 whose both ends are closed is, as it is, a glass container as shown in comparison with FIGS. 1 (a), (b) and FIGS. 3 (a), (b). It can not be fixed so as not to move inside 2. The length of the heat insulating layer 2 may be set shorter than the length of the side wall of the glass container, or the glass fiber may be melted and the length may be shortened by heating in the sealing process during glass processing.

  In such a case, the heat insulating layer 3 slides inside the glass container 2 so that the position of the IC tag 10 held in the heat insulating layer may be displaced from the desired position (FIG. 3A). If it is exposed (FIG. 3 (b)), the communication performance of the IC tag may be degraded, or the connection portion with the IC chip may be thermally damaged.

  The present invention functions as a stopper by thickening the inner wall portion under the shoulder R 32 of the glass container 2 so that the heat insulating layer 3 does not slide in the container 2 inside the glass container 2 as schematically shown in FIG. To be placed in contact with the underlying glass thermal insulation layer 3 so as to be immobile. Alternatively, asperities are formed of a glass-based material on the inner surface on the lower side of the shoulder 32 to increase the frictional force between the inner wall of the container 2 and the heat insulating layer 3 to make it difficult to move.

  In order to thicken the convex portion on the inner wall of the glass container, the glass fine powder is made to fly near the shoulder and fixed to the inner wall of the glass container in the high temperature state by utilizing the time when the vicinity of the shoulder R is in a high heat condition. The timing to fly the fine powder uses the time to connect the glass pipe for internal degassing. At this time, the open end of the cylindrical glass is heated.

  It is also conceivable to evacuate without connecting a glass pipe for evacuation, but also in this case, since the sealing is performed, it is possible to fly fine powder at this time. The height of the convex portion is preferably as high as possible, but it is not easy to fix the fine powder flatly, and it adheres in a concavo-convex shape, but is about 1 mm to about 3 mm on average. The diameter of the heat insulating layer is determined in accordance with this height. Alternatively, the height of the unevenness is set in accordance with the diameter of the heat insulating layer.

  Hereinafter, the present invention will be briefly described according to the embodiment, but the construction method of the IC tag will be omitted according to a standard method. The process of containing the glass container is described for each function, and the details of the manufacturing apparatus are also omitted.

  The glass container is manufactured by processing a glass pipe (a softening point of about 850 ° C. or more, for example) having a diameter of about 15 mm and a wall thickness of about 1 mm and having a predetermined length of 30 mm. The inner diameter, length, thickness, etc. of the glass pipe are not particularly limited, but are determined from the size of the IC chip housed inside, the thickness and length of the necessary heat insulating material, the pressure resistance of the glass container, cost, productivity, etc. Be

  First, the vicinity of one open end of the glass pipe 30 is heated to about the melting point according to a standard method of glass processing to form a stretched shoulder R 32 and a scaffold 31 (drawing processing in FIG. 6A). Next, the base of the scaffold 31 is heated to remove excess scaffold, and the tip portion is further heated to remove the thick portion and close the tip to the bottom. Next, while heating the bottom, air is introduced from the other opening to mold the bottom into a predetermined shape (FIG. 6 (b)). To flatten the bottom, place a iron on it and mold it flat. Thereby, the glass container 2 which the other shown in FIG.6 (c) opened is obtained.

  Next, a cylindrical glass heat insulating material 3 (lock wool) having a predetermined diameter and containing an IC chip inside is inserted into the inside of the container so that one end contacts the bottom 33 of the glass container (FIG. 5 (d )). In this state, the heat insulating material 5 has a size that can slide up and down (left and right in the figure) inside the glass container.

Next, an exhaust glass pipe 34 is joined to the other open end.
Specifically, a portion at a predetermined distance from the open end of the glass container is heated, and an exhaust pipe 34 having the same diameter as the scaffold is heat-bonded in accordance with a standard method. From the heated site to the scaffold, there is a shoulder R32 with a narrow diameter. While the vicinity of the shoulder R32 is heated, fine powder of glass fiber is blown with air 35 from the tip of the scaffold 31 to fly the inside of the container and the glass fine powder is fused in the vicinity of the shoulder R32 to a predetermined thickness or unevenness. Do. If the temperature is lowered in this state, the glass fiber fine powder is solidified and fixed to the inner wall to form the glass fixed layer 5 (FIG. 6 (e)).

  The glass fiber fine powder to be blown is preferably made of the same material as the glass container, and can be easily fixed to the inner wall of the container. However, glasses of different materials may be used if they do not stick and fall off. Thereby, as shown in FIG. 4, it is possible to manufacture a glass container in which the diameter of the lower inner wall including the shoulder R is narrowed. In this state, the heat insulating layer 3 is fixed at the top and does not slide inside the container.

  The flying glass fiber powder may be the glass heat insulating material 3 itself which is inserted in advance as a heat insulating material. It is because there is a component which the end melts and floats by temperature rise.

  Finally, the inside of the glass container is suctioned through the exhaust pipe 34, and the area near the base of the scaffold is heated and sealed, and the inside of the glass container as shown in FIG. 6 (f) and FIG. Can produce a heat resistant IC tag.

  The pressure in the container is preferably 0.5 Pa or less. If the temperature is too high, the thermal conductivity by air will remain and the heat insulation will be insufficient, and the internal pressure of the glass will rise in a high temperature environment, making it prone to rupture. It is preferable to control to be an appropriate internal pressure in consideration of the thickness of the glass container.

1, heat-resistant IC tag 2, glass container (protective layer)
3 、 Glass insulation (fireproof layer)
4, IC chip 5, glass fixing layer 6, supporting base 10, IC tag (inlet)
12, antenna circuit 14, adhesive layer 15, release film 20, RFID
30, glass pipe 31, scaffold 32, shoulder R
33, bottom 34, exhaust pipe

Claims (2)

Forming an open end glass container by sealing one end of a glass tube having a predetermined inner diameter and cutting the other end;
Storing an IC tag inside the glass container;
Filling the glass container with a glass heat insulating material so as to surround the IC tag;
During the attachment of the exhaust pipe by heating the open end, flying fine powder of glass fiber with air to fix the fine powder of glass to the upper inner wall of the glass container;
Sealing the open end of the glass container while evacuating the glass container through the exhaust pipe;
A method for producing a heat-resistant IC tag, comprising: The method for manufacturing a heat-resistant IC tag according to claim 1 , wherein the inside of the glass container is depressurized to 0.5 Pa or less.