JP6474709B2 - Thermal flow meter - Google Patents

Description

  The present invention relates to a thermal flow meter.

  There is a thermal flow meter as a device for measuring the mass flow rate of the gas to be measured flowing through the main passage. The thermal flow meter has a structure in which a part of a measurement target gas flowing in a pipe that is a main passage is taken into a sub-passage and led to a flow rate detection unit. In the flow rate detection unit, a hot wire, a silicon element, and the like are arranged, and the mass flow rate in the pipe is measured by utilizing the fact that the hot wire, the silicon element, etc. are cooled by the air flow and the electric resistance value changes.

  Patent Document 1 proposes a thermal flow meter technology that provides a static electricity dissipation region in the bypass passage to remove the charge of the pollutant from the viewpoint of preventing fouling from adhering to the flow rate detector. (Patent Document 1). The thermal type flow meter shown in Patent Document 1 has a conductive part provided inside the cover, and by attaching the cover to the housing, the circuit wiring of the housing is pressed by the conductive part and electrically connected to each other. It has a structure.

US2013 / 0061684

  A general thermal flow meter is configured using a plurality of components having different linear expansion coefficients. Therefore, in the case of the technique shown in Patent Document 1, it is necessary to press the conductive component against the circuit wiring of the electronic circuit with a certain amount of pressing force in order to maintain the connection state even during thermal expansion and contraction.

  However, when the circuit wiring is pressed by the conductive member, the stress due to the pressing of the circuit wiring acts on the circuit components connected to the circuit wiring, which may affect the characteristics of the circuit components.

  The present invention has been made in view of the above points, and an object of the present invention is to obtain a thermal flow meter capable of preventing the pressing force of the conductive member from affecting the characteristics of the circuit components. That is.

  The thermal flow meter of the present invention that solves the above problems has a lead frame on which circuit components are mounted, and the lead frame is disposed adjacent to the mounting portion on which the circuit components are mounted and the mounting portion. And a pressing portion that is pressed through a conductive member electrically connected to a member constituting the sub-passage, and at least a part between the mounting portion and the pressing portion is separated It is characterized by that.

  According to the present invention, it is possible to prevent the pressing force of the conductive member from affecting the characteristics of the circuit component. Problems, configurations, and effects other than those described above will be clarified by the following description of the embodiments.

1 is a system diagram showing an embodiment in which a thermal flow meter according to the present invention is used in an internal combustion engine control system. The front view which shows the external appearance of the thermal type flow meter which concerns on this invention. The left view which shows the external appearance of the thermal type flow meter which concerns on this invention. The rear view which shows the external appearance of the thermal type flow meter which concerns on this invention. The right view which shows the external appearance of the thermal type flow meter which concerns on this invention. The front view which shows the state of the housing which removed the front cover and the back cover from the thermal type flow meter which concerns on this invention. The rear view which shows the state of the housing which removed the front cover and the back cover from the thermal type flow meter which concerns on this invention. The rear view of a table cover. 4B is a cross-sectional view taken along the line IVB-IVB in FIG. 4A. The rear view of a back cover. The VB-VB sectional view taken on the line of FIG. 5A. FIG. 2B is a cross-sectional view taken along the line VIA-VIA in FIG. 2A. The figure which expands and shows VIB of FIG. 6A. FIG. 2C is a cross-sectional view taken along the line VIC-VIC in FIG. 2A. FIG. 2B is a sectional view taken along line VID-VID in FIG. 2A. The figure explaining the connection method of a lead frame and a conductor. The figure which shows the surface of a circuit package. The figure which shows the specific structural example of a lead frame. The figure which shows notionally the structure of a lead frame. The figure which shows a modification conceptually. The figure which shows a modification conceptually.

  Next, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a system diagram showing an embodiment in which a thermal flow meter according to the present invention is used in an electronic fuel injection type internal combustion engine control system. Based on the operation of the internal combustion engine 110 including the engine cylinder 112 and the engine piston 114, intake air is sucked from the air cleaner 122 as the gas to be measured 30 and passes through the main passage 124 such as the intake pipe, the throttle body 126, and the intake manifold 128. Guided to the combustion chamber of the engine cylinder 112. The flow rate of the gas 30 to be measured, which is the intake air led to the combustion chamber, is measured by the thermal flow meter 300 according to the present invention, and fuel is supplied from the fuel injection valve 152 based on the measured flow rate. The gas to be measured is introduced into the combustion chamber together with a certain gas 30 to be measured. In the present embodiment, the fuel injection valve 152 is provided in the intake port of the internal combustion engine 110, and the fuel injected into the intake port forms an air-fuel mixture together with the measured gas 30 that is intake air, and passes through the intake valve 116. Then, it is guided to the combustion chamber and burns to generate mechanical energy.

  The fuel and air guided to the combustion chamber are in a mixed state of fuel and air, and are burned explosively by spark ignition of the spark plug 154 to generate mechanical energy. The combusted gas is guided from the exhaust valve 118 to the exhaust pipe, and exhausted as exhaust 24 from the exhaust pipe to the outside of the vehicle. The flow rate of the gas 30 to be measured, which is the intake air led to the combustion chamber, is controlled by the throttle valve 132 whose opening degree changes based on the operation of the accelerator pedal. The fuel supply amount is controlled based on the flow rate of the intake air guided to the combustion chamber, and the driver controls the flow rate of the intake air guided to the combustion chamber by controlling the opening degree of the throttle valve 132, thereby The mechanical energy generated by the engine 110 can be controlled.

  The flow rate and temperature of the gas 30 to be measured, which is intake air that is taken in from the air cleaner 122 and flows through the main passage 124, are measured by the thermal flow meter 300, and electrical signals representing the flow rate and temperature of the intake air are output from the thermal flow meter 300. Input to the control device 200. Further, the output of the throttle angle sensor 144 that measures the opening of the throttle valve 132 is input to the control device 200, and the positions and states of the engine piston 114, the intake valve 116, and the exhaust valve 118 of the internal combustion engine 110, and further the internal combustion engine 110. Output from the rotation angle sensor 146 is input to the control device 200. The output of the oxygen sensor 148 is input to the control device 200 in order to measure the state of the mixture ratio between the fuel amount and the air amount from the state of the exhaust 24.

  The control device 200 calculates the fuel injection amount and the ignition timing based on the flow rate of the intake air that is the output of the thermal flow meter 300 and the rotational speed of the internal combustion engine 110 that is measured based on the output of the rotation angle sensor 146. . Based on these calculation results, the amount of fuel supplied from the fuel injection valve 152 and the ignition timing ignited by the spark plug 154 are controlled. The fuel supply amount and ignition timing are actually based on the intake air temperature and throttle angle change state measured by the thermal flow meter 300, the engine rotational speed change state, and the air-fuel ratio state measured by the oxygen sensor 148. It is finely controlled. The control device 200 further controls the amount of air that bypasses the throttle valve 132 by the idle air control valve 156 when the internal combustion engine 110 is in the idling operation state, thereby controlling the rotational speed of the internal combustion engine 110 in the idling operation state.

  FIG. 2 shows the appearance of the thermal flow meter 300. 2A is a front view of the thermal flow meter 300, FIG. 2B is a left side view, FIG. 2C is a rear view, and FIG. 2D is a right side view. The thermal flow meter 300 includes a housing 302. The housing 302 is inserted into the intake pipe and disposed in the main passage 124 (see FIG. 1). At the base end portion of the housing 302, a flange 305 for fixing to the intake pipe and an external connection portion 306 exposed outside the intake pipe are provided.

  The housing 302 is supported in a cantilever manner by fixing the flange 305 to the intake pipe, and is disposed so as to extend along a direction perpendicular to the main flow direction of the measurement target gas 30 flowing through the main passage 124. The housing 302 is provided with a sub-passage for taking in the gas to be measured 30 flowing through the main passage 124, and a flow rate detector 451 for detecting the flow rate of the gas under measurement 30 in the sub-passage (FIG. 3A). Is arranged.

  An inlet 311 for taking a part of the measurement target gas 30 such as intake air into the sub-passage is provided at a position on the front end side of the housing 302 and upstream in the main flow direction. A first outlet 312 and a second outlet 313 for returning the gas 30 to be measured from the auxiliary passage to the main passage 124 are provided at a position on the distal end side and the downstream side in the main flow direction. The first outlet 312 and the second outlet 313 are arranged side by side in the thickness direction of the housing 302 as shown in FIG. 2D.

  By providing the inlet 311 on the distal end side of the housing 302, a gas in a portion near the center portion away from the inner wall surface of the main passage 124 can be taken into the sub-passage. Therefore, it becomes difficult to be influenced by the temperature of the inner wall surface of the main passage 124, and a decrease in the measurement accuracy of the gas flow rate and temperature can be suppressed.

  In the vicinity of the inner wall surface of the main passage 124, the fluid resistance is large, and the flow velocity is lower than the average flow velocity of the main passage 124. However, in the thermal type flow meter 300 of this embodiment, the flange 305 is located in the center of the main passage 124. Since the inlet 311 is provided on the distal end side of the thin and long housing 302 extending toward the upper side, the gas having a high flow velocity at the center of the main passage can be taken into the sub-passage. Further, since the first outlet 312 and the second outlet 313 of the auxiliary passage are also provided on the distal end side of the housing 302, the gas flowing in the auxiliary passage can be returned to the central portion of the main passage where the flow velocity is high.

  The housing 302 has a substantially rectangular wide surface on the front side, but has a narrow side surface (thin thickness). The front surface and the rear surface of the housing 302 are disposed along the main flow direction of the gas to be measured flowing through the main passage 124, and the side surfaces are disposed so as to face the main flow direction. As a result, the thermal flow meter 300 can be provided with a sufficiently long sub-passage with a reduced fluid resistance with respect to the gas to be measured 30.

  That is, in the thermal flow meter 300 of the present embodiment, the shape of the housing 302 projected on the orthogonal plane orthogonal to the flow direction of the measurement target gas 30 flowing through the main passage 124 is the first direction on the orthogonal plane. 50 and a thickness dimension defined in a second direction 51 perpendicular to the first direction 50 (see FIG. 2B) on the orthogonal plane, and the thickness dimension is The shape is smaller than the length dimension.

  The housing 302 is provided with a temperature detector 452 for measuring the temperature of the measurement target gas 30. The housing 302 has a shape recessed toward the downstream side at a position in the center in the longitudinal direction and upstream in the main flow direction of the measurement target gas 30, and the temperature detection unit 452 is provided in the recessed position. It has been. The temperature detector 452 has a shape protruding from the housing 302 toward the upstream side in the main flow direction.

  FIG. 3 shows a state of the housing 302 with the front cover 303 and the back cover 304 removed from the thermal flow meter 300. 3A is a front view of the housing 302, and FIG. 3B is a rear view.

  Inside the housing 302, a flow rate detector 451 for measuring the flow rate of the measurement target gas 30 flowing through the main passage 124, a temperature detection unit 452 for measuring the temperature of the measurement target gas 30 flowing through the main passage 124, and the like. The circuit package 400 provided is integrally molded (see FIG. 3A).

  The housing 302 is formed with a sub-passage groove for forming a sub-passage. In the present embodiment, the sub-passage grooves are recessed on both the front and back surfaces of the housing 302, and the front and rear covers 303 and 304 are placed on the front and back surfaces of the housing 302 to complete the sub-passage. . With such a structure, when the housing 302 is molded (resin molding process), molds provided on both surfaces of the housing 302 are used, so that both the front side sub-passage groove 321 and the back side sub-passage groove 331 are part of the housing 302. All can be molded as a part.

  The sub passage groove includes a back side sub passage groove 331 formed on the back surface of the housing 302 and a front side sub passage groove 321 formed on the surface of the housing 302. The back side auxiliary passage groove 331 has a first groove part 332 and a second groove part 333 that branches in the middle of the first groove part 332.

  The first groove portion 332 extends straight along the main flow direction of the measurement target gas 30 at the distal end portion of the housing 302, one end communicates with the inlet 311 of the housing 302, and the first outlet 312 of the housing 302. The other end is in communication. The first groove portion 332 includes a straight portion 332A extending from the inlet 311 with a substantially constant cross-sectional shape, and a throttle portion 332B in which the groove width gradually decreases as it moves from the straight portion 332A toward the first outlet 312. ing.

  A plurality of ridges 335 are provided on the straight part 332 </ b> A of the first groove part 332. The ridge portions 335 are provided on the bottom wall surface 332b of the straight portion 332A so that a plurality of the ridge portions 335 are arranged at a predetermined interval in the groove width direction of the first groove portion 332, and from the inlet 311 along the straight portion 332A. It extends over to 332B. The protruding portion 335 has a trapezoidal cross section, and the side surfaces on both sides are inclined obliquely. Therefore, when a water droplet adheres, the contact angle of the water droplet can be increased to reduce the height of the water droplet, the wettability can be increased, and the water can flow quickly from the upstream side toward the downstream side. Therefore, when water droplets adhere to the first groove portion 332, it is possible to effectively prevent the water droplet from flowing from the first groove portion 332 into the second groove portion 333, and it can be quickly discharged to the outside.

  The second groove portion 333 branches from the straight portion 332A of the first groove portion 332 and proceeds toward the proximal end side of the housing 302 while curving, and enters the measurement flow path 341 provided in the longitudinal center portion of the housing 302. Communicate. Of the pair of side wall surfaces constituting the first groove portion 332, the second groove portion 333 has an upstream end communicating with the side wall surface 332 a located on the proximal end side of the housing 302, and the bottom wall surface 333 a is the first groove portion 332. It is continuous with the bottom wall surface 332b of the straight portion 332A.

  A step 334 is provided along the boundary between the bottom wall surface 332 b of the first groove 332 and the bottom wall surface 333 a of the second groove 333 of the housing 302. The step 334 is formed from the intersection of the side wall surface 332a of the first groove portion 332 and the side wall surface 333b on the inner peripheral side of the second groove portion 333, and the side wall surface 333c of the first groove portion 332 and the outer side wall surface 333c of the second groove portion 333. It is formed on a line that connects up to the point of intersection with a straight line.

  The step 334 dams the water droplets by the step 334 when the water droplets adhering to the bottom wall surface 332b of the linear portion 332A of the first groove portion 332 are swept away by the measurement target gas 30 and move toward the second groove portion 333. It can stop, and it can prevent flowing into bottom wall surface 333a of the 2nd groove part 333 from bottom wall surface 332b of the 1st groove part 332. Therefore, it is possible to prevent water droplets from entering the second groove portion 333 from the first groove portion 332 along the passage wall surface, and to protect the flow rate detection portion 451 from water.

  The step 334 has a trapezoidal cross section like the ridge 335, and the side surfaces on both sides are inclined obliquely. Therefore, when a water droplet adheres, the contact angle of the water droplet can be increased to reduce the height of the water droplet, the wettability can be increased, and the water can flow quickly from the upstream side toward the downstream side. Therefore, when water droplets adhere to the step 334, it is possible to effectively prevent the first groove portion 332 from flowing into the second groove portion 333, and the water can be quickly discharged from the first groove portion 332 to the outside.

  A concave portion 333e is formed in the side wall surface 333b inside the curve of the second groove portion 333, and water that has entered the second groove portion 333 is taken in and formed in a position facing the concave portion 333e in the back cover 304. It can be discharged to the outside through the drain hole 376 (see FIG. 2C).

  The measurement flow path 341 is formed through the housing 302 in the thickness direction from the front side to the back side, and the flow path exposed portion 430 of the circuit package 400 is disposed so as to protrude. The second groove 333 communicates with the measurement channel 341 on the upstream side of the sub-passage with respect to the channel exposure part 430 of the circuit package 400.

  The second groove 333 has a shape in which the groove depth becomes deeper as it proceeds toward the measurement channel 341, and in particular, has a steeply inclined portion 333 d that becomes deeper in front of the measurement channel 341. Yes. The steeply inclined portion 333d is configured such that, in the measurement flow channel 341, the measurement target gas 30 is disposed on the surface 431 side where the flow rate detection unit 451 is provided, of the front surface 431 and the back surface 432 of the circuit package 400. Gas is allowed to pass, and foreign matter such as dust contained in the measurement target gas 30 is allowed to pass through the back surface 432 side.

  The gas 30 to be measured gradually moves in the direction of the front side of the housing 302 (the back side in the drawing in FIG. 3B) as it flows through the back side sub-passage groove 331. Then, a part of the air having a small mass moves along the steeply inclined portion 333d, and flows on the surface 431 (see FIG. 3A) of the flow channel exposed portion 430 in the measurement flow channel 341. On the other hand, a foreign substance having a large mass cannot easily flow along the steeply inclined portion 333d because it is difficult to change the course due to centrifugal force, and the back surface 432 of the flow channel exposed portion 430 in the measurement flow channel 341 (see FIG. 3B). )

  The flow rate detection unit 451 is provided on the surface 431 of the flow path exposure part 430 of the circuit package 400. In the flow rate detection unit 451, heat transfer is performed with the measurement target gas 30 that has flowed toward the surface 431 of the flow path exposure unit 430, and the flow rate is measured.

  When the measurement target gas 30 passes through the front surface 431 side and the back surface 432 side of the flow path exposed portion 430 of the circuit package 400, the measurement target gas 30 flows into the front side sub passage groove 321 from the downstream side of the sub passage of the measurement flow path 341. It flows through the interior 321 and is discharged from the second outlet 313 to the main passage 124.

  As shown in FIG. 3A, one end of the front side sub passage groove 321 communicates with the downstream side of the sub passage of the measurement channel 341 and the other end communicates with the second outlet 313 formed on the front end side of the housing 302. The front side sub-passage groove 321 curves so as to gradually progress toward the downstream side in the main flow direction as it moves toward the distal end side of the housing 302, and toward the downstream side in the main flow direction of the measurement target gas 30 at the distal end portion of the housing 302. It extends on a straight line and has a shape in which the groove width gradually decreases toward the second outlet 313.

  In this embodiment, the flow path formed by the back side sub-passage groove 331 draws a curve from the front end side of the housing 302 toward the base end side which is the flange 305 side, and at the position closest to the flange 305, the sub-passage is formed. The flow of the gas 30 to be measured is in a direction opposite to the main flow direction of the main passage 124, and a back side sub-passage provided on the back side of the housing 302 in the reverse flow portion is provided on the front side. It leads to the front side auxiliary passage.

  The measurement channel 341 is divided into a space on the front surface 431 side and a space on the back surface 432 side by the channel exposure part 430 of the circuit package 400, and is not divided by the housing 302. That is, the measurement flow path 341 is formed so as to penetrate the front surface and the back surface of the housing 302, and the circuit package 400 projects in a cantilever manner in this one space. With such a configuration, the sub-passage grooves can be formed on both the front and back surfaces of the housing 302 in a single resin molding step, and the structure connecting the sub-passage grooves on both sides can be formed together. The circuit package 400 is fixed by being embedded in a fixing portion 351, 352, 353 of the housing 302 by a resin mold.

  Further, according to the configuration described above, the circuit package 400 can be inserted into the housing 302 and mounted at the same time as the resin molding of the housing 302. The back side sub-passage groove 331 and the front side sub-passage groove 321 are configured such that either the upstream side of the passage upstream of the circuit package 400 or the downstream side of the downstream side of the circuit package 400 is penetrated in the width direction of the housing 302. It is also possible to form the sub-passage shape connecting the two in a single resin molding step.

  The front side sub-passage of the housing 302 is formed by closing the front side sub-passage groove 321 with the front cover 303, and a pair of side wall surfaces constituting the front side sub-passage groove 321 and the upper end of the side wall in the groove height direction and the front cover The back surface of 303 is in close contact. The back side sub-passage of the housing 302 is formed by closing the back side sub-passage groove 331 with the back cover 304, and a pair of side wall surfaces constituting the back-side sub-passage groove 331 and a side wall upper end on the upper side in the groove height direction. The back surface of the back cover 304 is in close contact.

  As shown in FIGS. 3A and 3B, the housing 302 has a cavity 342 formed between the flange 305 and the portion where the sub-passage groove is formed. The hollow portion 342 is formed by penetrating the housing 302 in the thickness direction. In this embodiment, the hollow portion 342A on the flange side and the hollow portion 342B on the auxiliary passage side are separated by the fixing portion 352 of the housing 302. It is divided into.

  In the hollow portion 342A, the outer lead (connection terminal) 412 of the circuit package 400 and the inner end 306a of the external terminal of the external connection portion 306 are electrically connected to each other by spot welding or laser welding. An intermediate member 551 is provided in the hollow portion 342B. The intermediate member 551 is interposed between the metal member (conductive member) 501 of the front cover 303 and the lead frame 401 of the circuit package 400 and is electrically connected to each other by attaching the front cover 303 to the housing 302. The cavity 342 is closed by attaching the front cover 303 and the back cover 304 to the housing 302, and the periphery of the cavity 342 is sealed by laser welding with the front cover 303 and the back cover 304.

  FIG. 4 is a diagram illustrating the configuration of the front cover, and FIG. 5 is a diagram illustrating the configuration of the back cover. 4A is a view showing the back surface of the front cover, and FIG. 4B is a cross-sectional view taken along the line IVB-IVB of FIG. 4A. 5A is a view showing the back surface of the back cover, and FIG. 5B is a cross-sectional view taken along the line VB-VB in FIG. 5A.

  The front cover 303 and the back cover 304 are thin plates and have a shape with a wide cooling surface. For this reason, the thermal flow meter 300 has an effect that air resistance is reduced, and further, the thermal flow meter 300 is easily cooled by the gas to be measured flowing through the main passage 124.

  The front cover 303 has a size that covers the surface of the housing 302. On the back surface of the front cover 303, a fifth region 361 that closes the front side sub-passage groove 321 of the housing 302, a sixth region 362 that closes the front side of the measurement flow path 341 of the housing 302, and the front side of the cavity 342 A seventh region 363 that closes is formed. The seventh region 363 has a region 363A that closes the cavity 342A on the flange 305 side of the housing 302 and a region 363B that closes the cavity 342B on the sub-passage side in the cavity 342.

  A recess 361 a into which the upper end of the side wall of the front side sub-passage groove 321 of the housing 302 enters is provided along the periphery of the fifth region 361 and the sixth region 362. A recess 363 a into which the outer peripheral end of the cavity 342 enters is formed along the periphery of the seventh region 363. On the back surface of the front cover 303, a convex portion 362 a is provided that is inserted into a gap between the tip of the flow channel exposed portion 430 of the circuit package 400 and the measurement flow channel 341 of the housing 302.

  The front cover 303 is laser-welded between the front side of the front cover 303 facing the front surface of the housing 302 and the upper end of the side wall of the front side secondary passage groove 321 of the housing 302 that has entered the concave portion 361a. Laser welding is performed between the hollow portion 342 of the housing 302 that has entered and the housing 302 is tightly fixed.

  The front cover 303 is provided with a metal member 501. The metal member 501 is for removing static electricity so that foreign matters such as dust contained in the measurement target gas 30 are not charged and adhere to the flow rate detection unit 451 and its surroundings. It is comprised with the metal material which has. In this embodiment, the metal member 501 is insert-molded on the front cover 303.

  The metal member 501 has a flat plate portion 502 disposed in the sixth region 362 of the front cover 303 and an arm portion 503 that protrudes from the flat plate portion 502 and has a tip disposed in the seventh region 363. The flat plate portion 502 is disposed at a position where at least a part of the flat plate portion 502 is exposed on the back surface of the front cover 303 and opposed to the surface 431 of the flow path exposing portion 430 of the circuit package 400 in the measurement flow path 341 of the housing 302. The flat plate portion 502 has a convex shape in which the center in the flow direction of the measurement target gas 30 protrudes in a mountain shape in order to increase the flow velocity of the measurement target gas 30 passing between the flow rate detection unit 451 of the circuit package 400. . The arm portion 503 has a claw portion 504 that is bent at the tip and protrudes. The claw portion 504 contacts the tip of the intermediate member 551 in a state where the front cover 303 is attached to the housing 302.

  The back cover 304 has a size that covers the back surface of the housing 302. On the back surface of the back cover 304, a first region 371 A that closes the first groove 332 of the back side sub-passage groove 331 of the housing 302, a second region 371 B that closes the second groove 333, and a measurement flow path of the housing 302 A third region 372 that closes the back side of 341 and a fourth region 373 that closes the back side of the cavity 342 are formed. The fourth region 373 has a region 373A that closes the cavity 342A on the flange 305 side of the housing 302 and a region 373B that closes the cavity 342B on the sub-passage side in the cavity 342. A recess 371 a into which the upper end of the side wall of the back side sub-passage groove 331 of the housing 302 enters is provided along the periphery of the first region 371 A, the second region 371 B, and the third region 372. Further, around the fourth region 373, a recess 373a into which the rear outer peripheral end of the cavity 342 enters is provided.

  A plurality of ridges 377 are provided in the first region 371A of the back cover 304. The ridges 377 are provided so as to extend along the longitudinal direction of the first region 371A and to be arranged at a predetermined interval in the lateral direction. The protruding portion 377 has a trapezoidal cross section similar to the step 375, and the side surfaces on both sides are inclined obliquely. Therefore, when water droplets adhere, the contact angle of the water droplets can be increased to reduce the height of the water droplets, the wettability can be increased, and the adhered water droplets can flow quickly from the upstream side toward the downstream side. Can do. Therefore, it is possible to effectively prevent water droplets from flowing from the first region 371A to the second region 371B, and to quickly discharge the water to the outside.

  The back cover 304 has a drain hole 376 communicating with the sub passage. The drainage hole 376 is formed so as to penetrate a position where the recess 333e of the housing 302 is closed with the back cover 304 attached to the housing 302, and the water taken into the recess 333e of the second groove 333 is formed in the housing 302. It can be discharged to the outside.

  On the back surface of the back cover 304, a convex portion 372 a is provided that is inserted into a gap between the tip of the channel exposure portion 430 of the circuit package 400 and the measurement channel 341 of the housing 302. The convex portion 372 a cooperates with the convex portion 362 a of the front cover 303 to fill a gap between the tip of the flow channel exposed portion 430 of the circuit package 400 and the measurement flow channel 341 of the housing 302.

  The front cover 303 and the back cover 304 are attached to the front surface and the back surface of the housing 302, respectively, and form a sub passage by cooperation with the front side sub passage groove 321 and the back side sub passage groove 331. The sub-passage has a first passage that extends in a straight line from the inlet 311 to the first outlet 312, and a second passage that branches in the middle of the first passage and curves toward the flow rate detection unit 451. The metal member 501 provided on the front cover 303 is conductively connected to the lead frame of the circuit package 400 via the intermediate member 551 by attaching the front cover 303 to the housing 302.

  6A is a cross-sectional view taken along the line VIA-VIA of FIG. 2A, FIG. 6B is an enlarged view of the VIB of FIG. 6A, FIG. 6C is a cross-sectional view taken along the line VIC-VIC of FIG. It is a VID-VID sectional view.

  The circuit package 400 is configured by integrally molding a lead frame 401 and circuit components mounted on the lead frame 401 with a thermosetting resin material 403. In this embodiment, LSI 453, capacitor chip 454, flow rate detection unit 451 and temperature detection unit 452 sensor elements are mounted on lead frame 401 as circuit components.

  As shown in FIG. 8, the circuit package 400 has a vertically long flat plate shape. When the circuit package 400 is molded on the housing 302, the flow path exposed portion 430 protrudes into the sub-passage, and the surface of the flow path exposed portion 430. 431 and the back surface 432 are arranged in parallel along the flow direction of the measurement target gas 30 in the sub passage. A projection 433 is provided on one long side of the circuit package 400, and a temperature detection unit 452 is provided at the tip of the projection 433. The protruding portion 433 protrudes along the plane of the circuit package 400, and is disposed at a position that penetrates the upstream outer wall 317 of the housing 302 and exposes the temperature detecting portion 452 to the outside of the housing 302.

  On the long side of the other side of the circuit package 400, a pressing portion 405 where a part of the lead frame 401 is exposed from the resin material 403 is provided. The pressing portion 405 is configured by cutting out the resin material 403 of the circuit package 400, and is provided in an exposed portion where both the front and back surfaces of the lead frame 401 are exposed at the end of the circuit package 400. . In the present embodiment, when the circuit package 400 is molded with the resin material 403, the pressing portion 405 is sandwiched by placing a mold on both the front and back surfaces of the lead frame 401 to prevent the resin from flowing into the pressing portion 405. It is formed by doing.

  The pressing portion 405 of the lead frame 401 is pressed by the metal member 501 through the intermediate member 551. The intermediate member 551 is made of a conductive elastic material and is in contact with the pressing portion 405 of the lead frame 401. The intermediate member 551 is disposed in the hollow portion 342 </ b> B of the housing 302 and electrically connects the pressing portion 405 of the lead frame 401 and the metal member 501 of the front cover 303.

  As shown in FIG. 6D, the intermediate member 551 is supported at the base end by the support portion 343 of the housing 302, and the front end is interposed between the pressing portion 405 of the lead frame 401 and the claw portion 504 of the metal member 501. . By attaching the front cover 303 to the housing 302, the intermediate member 551 is elastically deformed by the tip of the intermediate member 551 being sandwiched between the pressing portion 405 of the lead frame 401 and the claw portion 504 of the metal member 501, and a predetermined amount. The pressing portion 405 of the lead frame 401 is pressed with a pressing force.

  FIG. 7 is a diagram for explaining a method of connecting the lead frame and the conductor. The support portion 343 of the housing 302 that supports the intermediate member 551 is provided in the hollow portion 342B of the housing 302 (see FIG. 7A). A plurality of rod-like members are erected on the support portion 343 toward the surface side of the housing 302. The intermediate member 551 is pushed from the surface side of the housing 302 toward the support portion 343 along the axial direction of the rod-shaped member, and a base end is inserted between the plurality of rod-shaped members, and the central rod-shaped member is inserted into the intermediate member 551. It is supported by the support portion 343 by being fitted into a round hole at the base end of the base (see FIG. 7 (2)).

  Then, the front cover 303 is attached to the housing 302 (see FIG. 7 (3)). In FIG. 7 (3), the illustration of the front cover 303 is omitted, and only the metal member 501 is illustrated. The intermediate member 551 is brought into contact with the arm portion 503 of the metal member 501 by the attachment of the front cover 303 and is pressed in the thickness direction of the housing 302 so that the arm portion 503 of the metal member 501 and the pressing portion 405 of the circuit package 400 are pressed. It is sandwiched between and held in an elastically deformed state in the pressing direction. Since the intermediate member 551 has conductivity, the metal member 501 and the pressing portion 405 of the circuit package 400 can be electrically connected.

  The intermediate member 551 can electrically connect the metal member 501 of the front cover 303 and the pressing portion 405 of the lead frame 401 only by attaching the front cover 303 to the housing 302. Therefore, the metal member 501 of the front cover 303 can be easily conducted to the pressing portion 405 of the circuit package 400, and the flow rate detecting portion 451 in the auxiliary passage and the nearby components are neutralized and included in the measured gas 30. It is possible to prevent foreign matter from adhering to the flow rate detection unit 451 and the like due to charging.

  FIG. 9 is a diagram illustrating a specific configuration example of the lead frame, and FIG. 10A is a diagram conceptually illustrating the configuration of the lead frame.

  The lead frame 401 includes a mounting portion 404 on which circuit components such as an LSI 453 are mounted, and a pressing portion 405 that is pressed through a metal member 501 (conductive member) electrically connected to a member that constitutes a sub-passage. have. The pressing part 405 is disposed adjacent to the mounting part 404. The mounting portion 404 and the pressing portion 405 are connected to the GND of the lead frame 401, and are connected from the inner lead 411 to the inner end 306 a of the external terminal of the external connection portion 306 through the outer lead 412.

  The lead frame 401 has a configuration in which at least a part between the mounting portion 404 and the pressing portion 405 is separated. In this embodiment, as shown in FIGS. 9 and 10A, a slit 406 is provided between the mounting portion 404 and the pressing region 405a of the pressing portion 405 pressed via the intermediate member 551.

  According to the present embodiment, the lead frame 401 is provided with the slit 406 so that the mounting portion 404 and the pressing portion 405 of the lead frame 401 are separated from each other, so that the pressing area of the pressing portion 405 is interposed via the intermediate member 551. It is possible to prevent the stress when the 405 a is pressed from acting on the mounting area of the mounting portion 404.

  In the circuit package 400, circuit wiring is packaged, and in order to establish conduction with the metal member 501, it is necessary to provide the circuit package 400 with a pressing portion 405 in which a part of the lead frame 401 is partially exposed. The pressing portion 405 of the lead frame 401 is formed by sandwiching a part of the lead frame 401 from the upper and lower sides with a mold when the circuit package 400 is molded. There is no 403 and the rigidity is particularly low compared to the surroundings.

  Therefore, if there is no slit 406, when the pressing region 405 a of the pressing portion 405 of the lead frame 401 is pressed by the metal member 501 through the intermediate member 551, the stress acting on the pressing portion 405 is transmitted to the mounting portion 404. The characteristics of the elements of the LSI 453 and the flow rate detection unit 451 mounted on the mounting unit 404 may change.

  On the other hand, in the present invention, the lead frame 401 is provided with slits 406 to separate the mounting portion 404 and the pressing portion 405 of the lead frame 401 from each other. Therefore, when the pressing area 405 a of the pressing portion 405 of the lead frame 401 is pressed via the intermediate member 551, the stress acting on the pressing portion 405 is blocked by the slit 406 and transmitted from the pressing portion 405 to the mounting portion 404. Can be prevented, and the characteristics of circuit components such as the LSI 453 mounted on the mounting unit 404 can be prevented from being affected.

  FIG. 10B is a diagram conceptually illustrating a modification of the lead frame. In this modification, the mounting portion 404 and the pressing portion 405 are provided separately, and the inner leads 411 of the mounting portion 404 and the pressing portion 405 are connected by a gold wire 408. ing. Although not particularly illustrated, a configuration in which the inner lead 411 is connected instead of the gold wire 408 may be employed. The mounting portion 404 and the pressing portion 405 are electrically connected by the gold wire 408 or the inner lead 411, but are physically separated. Therefore, when the pressing area 405 a of the pressing portion 405 is pressed via the intermediate member 551, stress applied to the pressing portion 405 is prevented from being transmitted from the pressing portion 405 to the mounting portion 404, and the mounting portion 404 is mounted. It is possible to prevent the characteristics of circuit components such as the LSI 453 from being affected.

  FIG. 10C is a diagram conceptually illustrating another modification of the lead frame. In this modification, a low-rigidity portion 409 having lower rigidity than the mounting portion 404 and the pressing portion 405 is provided between the mounting portion 404 and the pressing portion 405. The low-rigidity portion 409 is formed by, for example, half press processing in which the lead frame 401 is thinner than the mounting portion 404 and the pressing portion 405. The low-rigidity portion 409 may be formed by providing a plurality of through holes so as to be aligned on a straight line between the mounting portion 404 and the pressing portion 405.

  Since the low-rigidity part 409 has lower rigidity than the mounting part 404 and the pressing part 405, when the pressing region 405a of the pressing part 405 is pressed via the intermediate member 551, the stress acting on the pressing part 405 is reduced. It is possible to prevent absorption by 409 and transmission from the pressing portion 405 to the mounting portion 404, and to prevent the influence of the characteristics of circuit components such as the LSI 453 mounted on the mounting portion 404.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various designs can be made without departing from the spirit of the present invention described in the claims. It can be changed. For example, the above-described embodiment has been described in detail for easy understanding of the present invention, and is not necessarily limited to one having all the configurations described. Further, a part of the configuration of an embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of an embodiment. Furthermore, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

300 Thermal Flowmeter 302 Housing 303 Front Cover (Cover)
400 Circuit package 401 Lead frame 403 Resin material 404 Mounting portion 405 Pressing portion 406 Slit 408 Gold wire 451 Flow rate detecting portion (sensor element)
452 Temperature detector (sensor element)
453 LSI (circuit parts)
501 Metal member (conductive member)
551 Intermediate member (elastic member)

Claims (8)

A lead frame on which circuit components are mounted;
The lead frame is
A mounting portion on which the circuit component is mounted;
A pressing portion that is disposed adjacent to the mounting portion and pressed through a conductive member that is electrically connected to a member that constitutes the sub-passage, and
At least a part of the mounting portion and the pressing portion is separated from each other.   The thermal flow meter according to claim 1, wherein a slit is provided between the mounting portion and the pressing portion.   The thermal flow meter according to claim 1, wherein the mounting portion and the pressing portion are separated, and the mounting portion and the pressing portion are connected by a gold wire or an inner lead. . A circuit package configured by integrally molding the lead frame and the circuit component mounted on the lead frame with a resin material;
The pressing portion, the thermal type flow meter according to claim 1, characterized in that both the front and back of the lead frame at the end of the circuit package is provided in the exposed portion which is exposed. The sub passage is formed by cooperation of a housing on which the circuit package is mounted and a cover attached to the housing,
The conductive member is formed of a metal member that is disposed along the back surface of the cover and at least a part of which is exposed to the sub-passage, and a conductive elastic member is interposed between the pressing portion and the pressing portion. The thermal flow meter according to claim 4, wherein the thermal flow meter is pressed.   6. The thermal flow meter according to claim 5, wherein the elastic member has a proximal end supported by the housing and a distal end interposed between the pressing portion and the metal member. The circuit package has a flow rate detection unit exposed to the sub-passage,
The thermal flow meter according to claim 6, wherein the metal member is disposed to face the flow rate detection unit in the sub-passage. A lead frame on which circuit components are mounted;
The lead frame is
A mounting portion on which the circuit component is mounted;
A pressing portion that is disposed adjacent to the mounting portion and pressed through a conductive member that is electrically connected to a member that constitutes the sub-passage, and
A low-rigidity portion having lower rigidity than the mounting portion and the pressing portion is provided between the mounting portion and the pressing portion.

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