JP6447546B2 - Manufacturing method of modeling object manufacturing medium and manufacturing method of modeling object - Google Patents

Description

The present invention relates to a method for manufacturing a medium for manufacturing a modeled object and a method for manufacturing a modeled object .

  Conventionally, on a thermal expansion layer of a medium (for example, a thermal expansion sheet) having a thermal expansion layer that expands and expands according to the amount of absorbed heat, a portion selected from a color image to be printed later is selected. A structure manufacturing apparatus is known that prints a heat absorbing portion in an area where a heat absorbing portion (for example, black ink) is to be formed, and expands and prints the printed portion of the heat absorbing portion by radiant heat radiation. (For example, refer to Patent Document 1). This structure manufacturing apparatus foams and expands the printing portion of the heat absorption unit, prints a solid white image on the entire surface of the medium, and then prints a color image.

  Further, as another structure manufacturing apparatus, a peelable adhesive seal is pasted on the back surface of the medium opposite to the foam expansion surface on which the thermal expansion layer and the color image are formed. A structure manufacturing apparatus that prints a heat absorbing portion on the surface (the surface opposite to the sticking surface) and bulges and expands a portion corresponding to the printing portion of the heat absorbing portion of the thermal expansion layer by radiation of radiant heat. It is known (see, for example, Patent Document 2). In this structure manufacturing apparatus, after the expansion of the thermal expansion layer, the adhesive seal on which the heat absorbing portion is printed is peeled off.

Japanese Patent No. 5212504 JP 2013-220647 A

  However, in the above structure manufacturing apparatus in which the heat absorption part is printed on the surface of the medium, if a color image is formed on the heat absorption part on the upper surface of the medium without printing a solid white image, the color image becomes dull. As a result, there was a problem that the intended color was not achieved. Here, in the structure manufacturing apparatus described above, the heat absorption part is directly formed on the upper surface of the medium. However, the heat absorption part cannot be peeled off from the upper surface of the medium without breaking the thermal expansion layer. Therefore, in order to solve the dullness of the color image, before forming the color image, there is a problem that the heat absorbing portion must first be covered with a solid white image or the like. In order to suppress the dullness of the color image, for example, it is conceivable to suppress the black density of the heat absorption part to a density that can be covered with a solid white image, but in that case, by suppressing the black density Further, the amount of swelling due to foam expansion is also suppressed. In addition, in order to suppress the dullness of the color image, it is necessary to print a solid white image so as to cover at least the heat absorption part. Therefore, a material such as white ink is required, or the color caused by the heat absorption part In order to suppress the dullness of the image, there has been a problem that the consumption of color ink has to be increased. Furthermore, if the heat absorption part cannot be completely covered with a solid white image or the like, the color image printed on the heat absorption part will be dull, which hinders the production of a high-quality structure. It was.

  Furthermore, in the structure manufacturing apparatus described above, a solid white image or a color image is printed on the entire surface of the medium after the printing portion of the heat absorbing portion is expanded and expanded. Therefore, it becomes necessary to print with a flatbed inkjet that can adjust the height of printing, for example, high-speed printing such as screen printing and mass production are difficult, and general-purpose products that are marketed for consumers There has also been a problem that it is difficult to print using an inexpensive and inexpensive inkjet printer.

  On the other hand, in the structure manufacturing apparatus that attaches a tight seal to the back surface of the medium, the distance between the heat absorbing portion and the thermal expansion layer is longer than when the heat absorption portion is formed directly on the surface of the thermal expansion layer. Become. Due to this, when the heat absorbed by the heat absorbing portion is conducted to the thermal expansion layer, the amount of heat diffuses in a direction parallel to the surface of the thermal expansion layer, and a desired region in the thermal expansion layer is desired. There was a problem that it was difficult to expand and expand by the amount. Further, since the substrate of the medium is much thicker than a thermal expansion layer or a release layer described later in the embodiment of the present invention, the amount of heat is more easily diffused, and a desired region in the thermal expansion layer is a desired amount. It was difficult to expand and expand only. Furthermore, when the substrate of the medium is a material having a low thermal conductivity such as paper, the heat conduction itself is difficult to be performed. For this reason, even if a large amount of heat is absorbed by the thermal expansion layer, it is not possible to ensure a sufficient amount of foaming of the thermal expansion layer, and it is difficult to expand the thermal expansion layer by a desired amount. Therefore, it is difficult to manufacture a high-quality structure even in the above-described structure manufacturing apparatus that attaches a tight seal to the back surface of the medium.

An object of the present invention is to avoid leaving a light-to-heat conversion layer, which needs to be formed in order to expand a medium, in the structure when the medium including the expansion layer that expands by heating is expanded. It is providing the manufacturing method of the medium for modeling objects manufacture which can manufacture a high quality structure , and the manufacturing method of modeling objects .

In one aspect of the method for manufacturing a modeled article manufacturing medium, a first step of forming an image on the medium and a coating layer for protecting the image on the first image formed in the first step are formed. And a third step of forming a release layer in which a heat absorption layer for expanding the medium is formed on the coating layer formed in the second step, and the heat absorption layer. Is formed on the surface facing the coating layer .

In one aspect of the manufacturing method of a modeled article manufacturing medium, a first step of forming an image on the medium and a coating layer for protecting the image on the image formed in the first step are formed. A second step and a third step of forming a release layer on the coating layer formed in the second step, and a heat absorption layer for expanding the medium is formed under the release layer It is characterized by being.

  According to the present invention, when a medium including an expansion layer that expands by heating is expanded, a photothermal conversion layer that needs to be formed to expand the medium is prevented from remaining in the structure. High-quality structures can be manufactured.

It is sectional drawing which shows the processing medium for structure manufacture which concerns on 1st Embodiment of this invention. It is a flowchart for demonstrating the structure manufacturing method which concerns on 1st Embodiment of this invention. It is a block diagram which shows the structure manufacturing system which concerns on 1st Embodiment of this invention. 1 is a perspective view illustrating a configuration of an inkjet printer unit according to a first embodiment of the present invention. It is sectional drawing which shows typically the internal structure of the film sticking part in 1st Embodiment of this invention. It is the perspective view (a) and side view (b) which show the heating part in 1st Embodiment of this invention. It is a control block diagram of the structure manufacturing system which concerns on 1st Embodiment of this invention. It is a graph showing the heat absorption relationship of the color ink layer and heat absorption ink layer in 1st Embodiment of this invention. It is sectional drawing which shows the processing medium for structure manufacture which concerns on 2nd Embodiment of this invention. It is a flowchart for demonstrating the image manufacturing method which concerns on 2nd Embodiment of this invention. It is sectional drawing which shows the processing medium for structure manufacture which concerns on the modification of 2nd Embodiment of this invention. It is sectional drawing which shows the processing medium for structure manufacture which concerns on 3rd Embodiment of this invention. It is a flowchart for demonstrating the structure manufacturing method which concerns on 3rd Embodiment of this invention. It is sectional drawing which shows the structure manufacturing medium which concerns on 4th Embodiment of this invention. It is a flowchart for demonstrating the structure manufacturing method which concerns on 4th Embodiment of this invention. It is sectional drawing which shows the processing medium for structure manufacture which concerns on 5th Embodiment of this invention. It is a flowchart for demonstrating the structure manufacturing method which concerns on 5th Embodiment of this invention. It is sectional drawing which shows the processing medium for structure manufacture which concerns on 6th Embodiment of this invention. It is a flowchart for demonstrating the structure manufacturing method which concerns on 6th Embodiment of this invention. It is sectional drawing which shows the processing medium for structure manufacture which concerns on the modification of 6th Embodiment of this invention.

  Hereinafter, a structure manufacturing method, a structure manufacturing system, a structure manufacturing program, and a structure manufacturing medium according to an embodiment of the present invention will be described with reference to the drawings.

<First Embodiment>
First, the structure manufacturing processing medium and the structure manufacturing method before foaming and expansion will be described, and then the structure manufacturing system and the structure manufacturing program will be described.

[Working medium for manufacturing structure and method for manufacturing structure]
FIG. 1 is a cross-sectional view showing a structure manufacturing medium M14 according to the first embodiment of the present invention.

FIG. 2 is a flowchart for explaining the structure manufacturing method according to the first embodiment of the present invention.
A processing medium for manufacturing a structure shown in FIG. 1 (hereinafter simply referred to as “processing medium”) M14 is processed from a medium M11 having a base 101 and a foamed resin layer 102. This is a state before foaming and expansion.

The base material 101 is made of a cloth such as paper or canvas, a panel material such as plastic, and the material is not particularly limited.
In the foamed resin layer 102, a thermal foaming agent (thermally expandable microcapsule) is dispersedly arranged in a binder that is a thermoplastic resin provided on the substrate 101. Thereby, the foam expansion layer 102 expands and expands according to the amount of heat absorbed. The foamed resin layer 102 is an example of an expanded layer that expands when heated.

Such a medium M11 is, for example, a thermally expandable sheet, and a known commercial product can be used.
On the foamed resin layer 102, a color ink layer 103 constituting a color image is formed as an example of an image (step S11 shown in FIG. 2: image forming step). This image forming step S11 is performed, for example, by the ink jet printer unit 2 shown in FIG. The color ink layer 103 is formed, for example, on an ink receiving layer (not shown) provided on the foamed resin layer 102. The medium M11 on which the color ink layer 103 is formed is referred to as a processing medium M12. Note that the image formed in the image forming step S11 may be a black and white image, and is not limited to a color image.

  Since the color ink layer 103 is deformed following the expansion of the foamed resin layer 102, the color can be lightened when the ink expands or the gap between the inks widens. In order to prevent this, it is desirable that the color ink layer 103 be printed darker than the desired density so as to compensate for the color fading associated with the expansion of the foamed resin layer 102. Further, the color ink layer 103 is compared with the density of the desired color image as the part with the larger amount of foam expansion corresponds to the amount of foam expansion for each part of the foamed resin layer 102 positioned so as to overlap the color ink layer 103. Then, the concentration for each region may be determined so as to be darker.

  A release film 105 is attached on the color ink layer 103 via a thermocompression bonding layer 104 (step S12: release layer forming step). This peeling layer formation process S12 is performed by the film sticking part 3 shown in FIG. 5, for example. The release film 105 is an example of a peelable release layer. The processing medium M12 on which the release film 105 is thermocompression bonded by the thermocompression bonding layer 104 is referred to as a processing medium M13. The release film 105 is deformed together with the expanded foam layer 102 when the expanded foam layer 102 is expanded, and then returns to its original shape due to a temperature change (for example, a change to room temperature), or has an elasticity by being elastic. In the case of returning to the shape, after removal in a peeling layer peeling step S15 to be described later, it becomes possible to reattach (repeat the peeling layer) again or repeatedly.

  Examples of the material of the release film 105 include Eval (registered trademark), polyvinyl chloride, polyvinylidene chloride, and polyethylene. The release film 105 is preferably stretchable and thin.

  When the release film 105 has elasticity, the release film 105 is deformed following the expansion of the foamed resin layer 102, so that the release film 105 and the thermocompression bonding layer 104 are A gap is less likely to occur between the foamed resin layer 102. When such a gap occurs, heat conduction from the heat absorbing ink layer 106 described later to the foamed resin layer 102 is hindered. In addition, since the heat absorption ink layer 106 absorbs electromagnetic waves and converts light into heat, it is desirable that the release film 105 be increased in elasticity by conducting the heat.

  Further, the thicker the release film 105 is, and the higher the thermal conductivity of the material of the release film 105 is, not only in the thickness direction of the processing medium M13 but also in the direction crossing the thickness direction in the release film 105. Even heat will be easily conducted. Therefore, when heat is conducted from the heat absorbing ink layer 106 to the expanded foam layer 102, the heat is easily conducted to the region of the release film 105 where the heat absorbing ink layer 106 is formed and deviated in the intersecting direction. Become. As a result, the heat absorbed by the heat-absorbing ink layer 106 diffuses on the foam expansion surface (hereinafter referred to as “surface”) side of the medium M11, so that it is difficult to realize a desired foaming state of the foam expansion layer 102. Therefore, it is desirable that the release film 105 is thinner, and it is desirable that the thermal conductivity of the material of the release film 105 is lower.

  An example of the thickness of the release film 105 is 12 μm, and an example of the thickness of the thermocompression bonding layer 104 is 2 μm. This is because when the adhesive layer is used instead of the thermocompression bonding layer 104, the thickness increases, for example, about 20 μm.

  When the release film 105 is transparent, if black ink that reacts with light (for example, black K ink including carbon black) is used in the color ink layer 103, the black ink is heated in a heating step S4 described later. Absorbs heat. Therefore, when the release film 105 is transparent, it is desirable that the color ink layer 103 is formed with three colors of yellow Y, magenta M, and cyan C. In addition, when black is expressed by a mixed color of black K ink that does not contain carbon black or color inks of cyan C, magenta M, and yellow Y, thermal energy is not generated even if the portion is irradiated with electromagnetic waves. Unintentional expansion of the foamed resin layer 102 can be prevented.

  That is, when the release film 105 has light blocking properties, black ink containing carbon black can be used in the color ink layer 103. Therefore, in order to obtain a more beautiful printing result, even if the color ink layer 103 is formed with four colors of YMCK using black ink containing carbon black in addition to the above three colors of yellow Y, magenta M, and cyan C. Good. The light blocking property of the release film 105 is preferably one that blocks, for example, 10% or more of the electromagnetic waves radiated from above the processing medium M14. That is, it is desirable that the release film 105 does not transmit electromagnetic waves in at least a part of the wavelength region of electromagnetic waves.

  The release film 105 having a light blocking property may have a high thermal conductivity such as vapor deposition of a metal such as aluminum, but the thermal conductivity of the release film 105 such as white (color having a light blocking property) may be high. It is desirable to be low. In addition, although the white release film 105 may print white ink etc. on the transparent release film 105, it is desirable that the release film 105 itself exhibits white or the like.

  Further, instead of the release film 105, a peelable resin or a coating agent may be used as a release layer, and the thermocompression bonding layer 104 may be omitted. Alternatively, the peelable layer may be formed by printing ink such as white ink that can be peeled off by inkjet. Thus, the release layer is not limited to the release film 105, and the method for forming the release layer is not limited to thermocompression bonding using the thermocompression bonding layer 104. In addition, when the heat absorbing ink layer 106 described later is formed on only a part of the surface of the processing medium M13, the release film 105 and the thermocompression bonding layer 104 are included in the surface of the processing medium M12. It may be formed only in a part including a region where 106 is formed.

  Of the region on the release film 105, the region corresponding to the portion where the foamed resin layer 102 is desired to be three-dimensionalized is printed with black ink containing carbon black based on the foaming data, which is an example of the photothermal conversion layer. The heat absorbing ink layer 106 is formed (step S13: photothermal conversion layer forming step). That is, when the processing medium M14 is viewed in plan, the region corresponding to the portion where the foamed resin layer 102 is desired to be three-dimensional and the region where the heat absorbing ink layer 106 is formed on the release film 105 are overlapped. . This photothermal conversion layer forming step S13 is performed by, for example, the ink jet printer unit 2 shown in FIG. 4 as in the image forming step S11. The processing medium M13 on which the heat absorbing ink layer 106 is formed is referred to as a processing medium M14. The photothermal conversion layer may be any layer that converts light such as electromagnetic waves into heat, and may be a layer other than the heat absorbing ink layer 106. The heat absorbing ink layer 106 can be called a heat absorbing portion that absorbs heat for conducting heat to the foamed resin layer 102.

  The heat absorbing ink layer 106 absorbs heat energy more easily than the medium M11 (for example, both the base material 101 and the foamed resin layer 102). Further, since the heat absorbing ink layer 106 is formed on the release film 105, it can be peeled off integrally with the release film 105 and the thermocompression bonding layer 104.

  When the heat absorbing ink layer 106 receives the same amount of heat energy, the foamed resin layer 102 has more heat energy in a region corresponding to a portion where the concentration (for example, area gradation) of the heat absorbing ink layer 106 is darker. Absorbs. Basically, the foaming height of the foamed resin layer 102 has a positive correlation with the amount of heat absorbed by the foamed resin layer 102, so that the portion where the density of the heat absorbing ink layer 106 is formed is higher. The foaming height of the resin layer 102 is increased.

Therefore, the density of the heat absorbing ink layer 106 is determined so as to correspond to the target height of the three-dimensional shape formed when the foamed resin layer 102 expands and expands.
However, when the color ink layer 103 has heat absorption and the heat absorbed by the color ink layer 103 contributes to the expansion of the foamed resin layer 102, the target height of the three-dimensional shape of the foamed resin layer 102 is realized. Therefore, as shown in FIG. 8, the heat absorption ink is obtained by subtracting the heat absorption property of the color ink layer 102 from the desired value of the total heat absorption property of the heat absorption ink layer 106 and the color ink layer 102. The heat absorption (black density) of the layer 106 is preferably used. That is, the heat absorbability for each part was determined based on the desired foamed state of the foamed resin layer 102 and the heat absorbability for each part of the color ink layer 102 positioned so as to overlap the heat absorbing layer 106. A heat absorbing ink layer 106 is preferably formed.

  Note that the heat absorbability shown in FIG. 8 is the heat absorbability of the heat absorbing ink layer 106 and the color ink layer 103 that contribute to the expansion of the foamed resin layer 102. For example, the heat absorption that contributes to the expansion of the foamed resin layer 102 in the heat absorbing ink layer 106 and the color ink layer 103 depends on the positional relationship with the foamed resin layer 102 and the light source unit 54 shown in FIG. Fluctuation occurs when the release film 105 and the thermocompression bonding layer 104 are interposed between the heat absorbing ink layer 106 and the foamed resin layer 102. Moreover, since the desired value of the heat absorbability described above varies depending on the portion of the foamed resin layer 102, the example of FIG. 8 is merely a heat absorbency corresponding to the amount of expansion of foam at a portion of the foamed resin layer 102. .

  In order to complement the expansion of the foamed resin layer 102, the heat-absorbing ink layer 106 is further provided on the back surface of the base material 101, that is, on the surface of the base material 101 opposite to the surface on which the foamed resin layer 102 is formed. It may be formed.

  The processing medium M14 expands by radiating electromagnetic waves (step S14: heating step). This heating step S14 may be any step that expands the foamed resin layer 102 by heating by irradiating electromagnetic waves in the wavelength region absorbed by the heat absorbing ink layer 106. For example, the heating step S14 is performed by the heating unit 4 shown in FIG. Is called. Thereby, especially the heat absorption ink layer 106 absorbs electromagnetic waves, the heat is conducted to the thermal foaming agent contained in the foamed resin layer 102, and the thermal foaming agent causes an expansion reaction. For this reason, the foamed resin layer 102 expands and expands to an extent corresponding to the black density of the heat absorbing ink layer 106 in particular. Even if the portion of the foamed resin layer 102 where the heat-absorbing ink layer 106 is not formed absorbs heat energy, the amount of heat is kept sufficiently small, and the height does not change substantially, or the heat-absorbing ink The change in height is sufficiently small compared to the portion where the layer 106 is formed. Here, the wavelength of the electromagnetic wave irradiated toward the heat absorbing ink layer 106 may be appropriately changed by the heat absorbing ink layer 106. The carbon black used for the heat-absorbing ink layer 106 has a visible light region (380 to 750 nm) and a mid-infrared region (1400 to 4000 nm) centered on the near infrared region (750 to 1400 nm), compared to electromagnetic waves of other wavelengths. ) Is easily absorbed. A material other than carbon black may be used as the heat-absorbing ink layer 106 (photothermal conversion layer), and electromagnetic waves in a desired wavelength region may be irradiated from the entire wavelength region depending on the material used. Therefore, depending on the material, electromagnetic waves of other wavelengths such as the near ultraviolet region (200 to 380 nm), the far ultraviolet region (10 to 200 nm), the near infrared region, and the infrared region excluding the mid infrared region (4000 to 15000 nm) are irradiated. May be. In addition, said numerical value is an example and the boundary of a wavelength range is not restricted to this numerical value.

  After the foamed resin layer 102 expands and expands, the release film 105 is removed from the processing medium M14 (step S15: release layer peeling step). When the release film 105 is peeled, the thermocompression bonding layer 104 and the heat absorbing ink layer 106 are also peeled together. In addition, although peeling layer peeling process S15 can be performed by a human hand, for example, you may perform automatically using the peeling part 5 shown in FIG.3 and FIG.7. Any known device can be used for the peeling portion 5 as long as the peeling film 105 can be peeled off. For example, the peeling part 5 peels off the peeling film 105 from the processing medium M14 by turning up and removing from one or one side of the four corners of the peeling film 105 in a plan view.

[Structure manufacturing system and structure manufacturing program]
FIG. 3 is a block diagram showing the structure manufacturing system 1 according to the first embodiment of the present invention.
As shown in FIG. 3, the structure manufacturing system 1 includes an ink jet printer unit 2 that is an example of an image forming unit and a photothermal conversion layer forming unit, a film attaching unit 3 that is an example of a release layer forming unit, and a heating unit. 4 and a control unit 6. These will be described below with reference to FIGS. The structure manufacturing system 1 includes a peeling unit 5.

FIG. 4 is a perspective view showing the configuration of the inkjet printer unit 2 in the first embodiment of the present invention.
The ink jet printer unit 2 includes a carriage 31 provided so as to be capable of reciprocating in a direction indicated by a double arrow “a” orthogonal to the paper transport direction. A print head 32 that executes printing and an ink cartridge 33 (33w, 33c, 33m, 33y) that stores ink are attached to the carriage 31.

  The cartridges 33w, 33c, 33m, and 33y contain color inks of white W, cyan C, magenta M, and yellow Y, respectively. These cartridges are individually arranged independently, or each ink chamber is integrated in one housing, and the print head 32 having each nozzle for discharging each color ink is arranged in the cartridge. It is connected.

  On the one hand, the carriage 31 is slidably supported by the guide rail 34, and on the other hand, it is fixed to the toothed drive belt 35. As a result, the print head 32 and the ink cartridges 33 (33w, 33c, 33m, 33y) are reciprocally driven together with the carriage 31 in the direction orthogonal to the paper conveyance direction indicated by the double arrow a in FIG. The

  A flexible communication cable 36 is connected via an internal frame 37 between the print head 32 and the control unit 6 shown in FIG. The structure control unit 6b of the control unit 6 sends print data and print control data to the print head 32 through the flexible communication cable 36, and controls the print head 32 based on these data.

  A platen 38 is disposed below the inner frame 37 at a position facing the print head 32 so as to extend in the main scanning direction of the print head 32. The platen 38 constitutes a part of the sheet conveyance path. The medium M11 on which the color ink layer 103 is formed or the processing medium M13 on which the heat absorption ink layer 106 is formed has a lower surface in contact with the platen 38 and a pair of paper feed rollers 39 (the lower roller is the shadow of the medium M11). 4 and cannot be seen in FIG. 4) and a discharge roller pair 41 (the lower roller is not seen in the same manner) and is intermittently conveyed in the printing sub-scanning direction indicated by arrow b in FIG. The paper feed roller 39 and the paper discharge roller pair 41 are controlled by the control unit 6.

  The control unit 6 controls the motor 42, the print head 32, the paper feed roller pair 39, and the paper discharge roller pair 41, so that the print head 32 is mainly used together with the carriage 31 via the drive belt 35 connected to the motor 42. While being transported to an appropriate position in the scanning direction, the ink droplets of cyan C, magenta M, yellow Y and black K are black ink droplets by the print head 32 during the stop of transport of the medium M11. By ejecting the ink toward M11, the color ink layer 103 is printed on the medium M11. Further, during the stop period of the conveyance of the processing medium M13, the print head 32 ejects black K black ink droplets toward the processing medium M13, whereby the heat absorbing ink layer 106 is printed on the processing medium M13. Is called.

  Before printing the color ink layer 103, white ink may be printed on the medium M11 as a base. In this case, first, the medium M11 on which the white ink is printed is reversely conveyed in the direction opposite to the printing sub-scanning direction indicated by the arrow b, and the color ink layer 103 is printed while being conveyed in the arrow b direction again. Moreover, the inkjet printer part 2 may form the color ink layer 103 with four colors of YMCK containing black ink especially when the peeling film 105 has a light blocking property as described above. Further, the image forming method using the color ink layer 103 as an example and the photothermal conversion layer forming method using the heat absorbing ink layer 106 as an example may use a laser printer or the like. Needless to say. Further, the color of the heat-absorbing ink layer 106 is not limited to black as long as it absorbs heat energy more easily than the medium M11 in the heating step (step S14) shown in FIG.

FIG. 5 is a cross-sectional view schematically showing the internal structure of the film attaching portion 3 in the first embodiment of the present invention.
The film attaching unit 3 includes a release layer supply roller 43, an under film supply roller 44, and a roller pair 45.

A release film 105 shown in FIG. 1 is wound around the release layer supply roller 43. The release film 105 is coated with a known thermocompression bonding adhesive that becomes the thermocompression bonding layer 104.
The under film supply roller 44 is disposed on the opposite side of the release layer supply roller 43 across the conveyance path indicated by the arrow c of the processing medium M12 on which the color ink layer 103 is formed. An under film U made of, for example, PET (polyethylene terephthalate) is wound around the under film supply roller 44.

  The under film U faces the entire peeling film 105 and the processing medium M12 on the side opposite to the peeling film 105 side of the processing medium M12 in order to protect the peeling film 105 sticking out of the processing medium M12. In this way, it is affixed larger than the release film 105 and the processing medium M12. The part of the release film 105, the thermocompression bonding adhesive, and the under film U that protrudes from the processing medium M12 is then cut. The under film U may be peeled off before cutting.

  The roller pair 45 includes a pair of rollers 45a and 45b that are disposed across the conveyance path of the processing medium M12. The pair of rollers 45a and 45b rotate so that the peeling film 105 drawn from the peeling layer supply roller 43 and the under film U drawn from the under film supply roller 44 and the medium M12 are brought into close contact with each other with high pressure. The release film 105 and the under film U are pressed toward the processing medium M12 to be conveyed.

  One of the pair of rollers 45a and 45b is a heating roller 45a incorporating a heat source. The heating roller 45a is set to a temperature at which the release film 105 and the processing medium M12 can be thermocompression bonded by a thermocompression bonding adhesive (thermocompression bonding layer 104). In addition, the pair of rollers 45a and 45b is such that the roller 45a is in the direction of the roller 45b and the roller 45b is the roller 45a so that pressure can be applied to the release film 105 and the processing medium M12 by thermocompression bonding adhesive. It is urged in the direction.

  Further, in the thermocompression bonding by the pair of rollers 45a and 45b, the temperature, pressure, and conveyance speed (time) are set so that cohesive failure does not occur when the release film 105 is peeled off and interface peeling occurs.

In the above-described film attaching unit 3, the processing medium M <b> 12 is processed into the processing medium M <b> 13 having the thermocompression bonding layer 104 and the release film 105.
FIG. 6A is a perspective view showing the heating unit 4 in the first embodiment of the present invention, and FIG. 6B is a side view showing the heating unit 4.

  As shown in FIG. 6A, when the work medium M <b> 14 is carried into the heating unit 4, the processing medium M <b> 14 is placed on a medium support frame 49 that is fixedly installed on the placement table 46 of the heating part 4. The heating unit 4 includes a heat source unit 47 provided so as to be movable along two opposing sides of the rectangular mounting table 46. The heat source section 47 is supported on both sides by support columns 48 (48a, 48b), and the control section 6 shown in FIG. 7 moves the support columns 48 along two opposing sides of the mounting table 46, as shown in FIG. The heat source 47 is moved relative to the processing medium M14 placed on the medium support frame 49 by performing control to move in the direction indicated by the white double arrow d. While moving the heat source unit 47 relative to the processing medium M14, the control unit 6 controls the light source 50a of the light source unit 50 included in the heat source unit 47 and causes the light source unit 50 to irradiate the processing medium M14 with electromagnetic waves. . The light source unit 50 includes a reflecting mirror 50b, and the reflecting medium 50b can efficiently irradiate the processing medium M14 with electromagnetic waves emitted from the light source 50a.

  The foamed resin layer 102 expands more as the amount of electromagnetic wave energy irradiated per unit area and unit time toward the heat absorbing ink layer 106 formed on the foamed resin layer 102 increases. For example, the control unit 6 may control the support columns 48a and 48b and the light source 50a so that the relative movement speed of the heat source unit 47 with respect to the processing medium M14 is constant and the output of the light source 50a is constant. However, if the energy amount of electromagnetic waves irradiated per unit area and unit time toward the heat-absorbing ink layer 106 is uniform over the entire processing medium M14, the control method by the control unit 6 is the same. Not exclusively. For example, the heat source unit 47 may be fixed, and the processing medium M14 (medium support frame 49, mounting table 46) may move.

  As the light source 50a, for example, a 900 W halogen lamp is used, which is disposed about 4 cm away from the processing medium M14. The relative moving speed of the light source unit 50 with respect to the processing medium M14 is set to about 20 mm / second. Under this condition, the processing medium M14 is heated to 100 ° C. to 110 ° C., and the foamed resin layer 102 of the processing medium M14 where the heat-absorbing ink layer 106 is formed expands.

FIG. 8 is a control block diagram of the structure manufacturing system 1 according to the first embodiment of the present invention.
The control unit 6 functions as a structure manufacturing control unit 6b that controls the ink jet printer unit 2, the film pasting unit 3, the heating unit 4, and the peeling unit 5 to form a structure in cooperation with them. The control unit 6 acquires the print data and the print control data stored in the memory control circuit 7 by controlling the print data acquisition unit 6a, and controls the three-dimensional object manufacturing based on the acquired data. It functions as the manufacturing control unit 401.

  As the control unit 6 and the memory control circuit 7, a CPU and a storage unit of a computer having a CPU (Central Processing Unit), a storage unit, an input unit, a display unit, an interface unit, and the like can be used. In that case, the CPU reads and executes a structure manufacturing program for performing the above-described processing for manufacturing the structure.

  In the first embodiment described above, the film attaching unit 3 which is an example of the release layer forming unit is peelable on the medium M11 including the foamed resin layer 102 which is an example of the expansion layer that expands by heating. A release film 105, which is an example of a layer, is formed (step S12 shown in FIG. 2: release layer forming step). Next, the ink jet printer unit 2 which is an example of the photothermal conversion layer forming unit forms a heat absorbing ink layer 106 which is an example of the photothermal conversion layer on the medium M11 (processing medium M13) (Step S13: Photothermal conversion layer). Forming step). Next, the heating unit 4 expands the foamed resin layer 102 of the medium M11 (processing medium M14) by heating. Thereafter, the release film 105 is peeled off. In addition, although the heat absorption ink layer 106 is formed on the peeling film 105, since it is formed above the medium M11, it expresses that it is formed on the medium M11. That is, the expression “formed on” a member such as a medium includes a case where it is not formed directly on this member but indirectly formed through another member.

  In the first embodiment, since the heat absorbing ink layer 106 is peeled off integrally with the release film 105, the heat absorbing ink layer 106 is formed directly on the foamed resin layer 102, and the heat absorbing ink layer 106 is broken. Compared to the case where the surface cannot be peeled off from the surface of the foamed resin layer 102 (Comparative Example 1), a solid white image or the like is used to form a color image on the heat absorbing ink layer 106 as in Comparative Example 1. Therefore, it is not necessary to cover the heat-absorbing ink layer 106, and a material such as white ink is not necessary. Further, when the heat absorbing ink layer 106 cannot be completely covered with a solid white image or the like, the color image printed on the heat absorbing ink layer 106 does not become dull. For this reason, the structure manufactured by the structure manufacturing method of the first embodiment was very good in print quality as compared with Comparative Example 1.

  In the first embodiment, the heat-absorbing ink layer 106 is formed on the color ink layer 103 of the medium M11 via the release film 105. The release film 105 is much thicker than the substrate 101. Since the heat absorption ink layer 106 is formed on the back side of the medium M11 (referred to as Comparative Example 2), the heat conduction from the heat absorption ink layer 106 to the foamed resin layer 102 can be reduced. The distance can be shortened. Therefore, as compared with Comparative Example 2, the amount of heat diffuses in a direction parallel to the surface of the foamed resin layer 102 until the heat absorbed by the heat absorbing ink layer 106 is conducted to the surface of the foamed resin layer 102. As a result, it becomes easy to foam and expand a desired region in the foamed resin layer 102 by a desired amount. Furthermore, since it is no longer necessary to cover the heat absorbing ink layer 106 with a solid white image or the like, the black density of the heat absorbing ink layer 106 can be covered with a solid white image or the like in order to suppress dullness of the color image. By suppressing to the concentration of, the amount of swelling due to foam expansion was not suppressed. Therefore, according to the structure manufacturing method of the first embodiment, the structure has a desired height over the entire surface of the structure or a desired height over the entire surface of the structure as compared with Comparative Example 2. A structure having a height closer to that could be produced.

  The print quality is a quality that changes due to the presence of dullness in the color image, the resolution of the print result, and the like, and can be said to be the appearance of the color image. In addition, the region to be expanded is expanded, and the region where the expansion is to be suppressed is suppressed from expanding, so that when the foamed resin layer 102 is expanded by a desired amount, the unevenness quality is judged to be good. It can be said. And it can be said that the higher the print quality and the unevenness quality, the higher the quality of the structure manufactured. In addition, the structure manufactured by the manufacturing method of the present invention includes a portion having a large expansion amount when the surface is expanded and a portion having a smaller expansion amount than a portion having the large expansion amount. Therefore, in the manufactured structure, a portion having a large expansion amount can be regarded as a convex portion, and a portion having a smaller expansion amount than the portion regarded as the convex portion can be regarded as a concave portion. That is, in the present specification, the concave portion in the case of the concave / convex quality and the concave / convex shape is not necessarily formed by further denting the surface of a medium (M11 or the like) that is a source of manufacturing the structure than the original state. Instead, it means a portion that is regarded as a concave portion because the amount of expansion is relatively small compared to the expanded convex portion or is not expanded.

  In the first embodiment, since the color ink layer 103 as an example of the image can be formed before the expansion of the medium M11, the color ink layer 103 is formed after the expansion of the medium M11 (comparative example). 3), for example, the color ink layer 103 is not limited to a flatbed ink jet capable of adjusting the printing height, but is used in various known printing apparatuses such as a general-purpose ink jet printer. Can be formed. Therefore, high-speed printing and mass production can be facilitated. The general-purpose printer includes, for example, a home inkjet printer and an office laser printer. In addition, when the color ink layer 103 is formed after foaming and expansion as in Comparative Example 3 above, if the above-described general-purpose inkjet or laser printer is used, printing is not possible or the surface is flat. Compared with the case of printing on a medium, the print quality is lowered, that is, the original color tone to be created cannot be reproduced with high quality.

As described above, according to the first embodiment, a high-quality structure can be manufactured.
In the present embodiment, the release film 105 is attached to the resin foam layer 102 by thermocompression using the thermocompression bonding layer 104. As a result, the thickness of the release layer can be reduced, and when the heat absorbed by the heat-absorbing ink layer 106 is conducted to the foamed resin layer 102, the amount of heat diffuses in a direction parallel to the surface of the foamed resin layer 102. Can be suppressed. Therefore, a higher quality structure can be manufactured.

  Moreover, in this Embodiment, the peeling film 105 does not permeate | transmit the electromagnetic waves of the wavelength range of at least one part of the wavelength range of electromagnetic waves. Therefore, the color ink layer 103 can be prevented from absorbing heat by electromagnetic waves. Accordingly, it is possible to use a color that easily absorbs heat, such as black ink containing carbon black, in the color ink layer 103. Therefore, a higher quality structure can be manufactured.

  Further, in the present embodiment, the heat absorbing ink layer 106 is based on the desired foamed state of the medium M11 and the heat absorbability for each part of the color ink layer 103 positioned so as to overlap the heat absorbing ink layer 106. Thus, the heat absorbability for each part is determined. Therefore, it is possible to suppress the foaming state of the medium M11 from changing from the desired foaming state due to the heat absorption property of the color ink layer 103.

Second Embodiment
FIG. 9 is a cross-sectional view showing a processing medium M23 according to the second embodiment of the present invention.
FIG. 10 is a flowchart for explaining a structure manufacturing method according to the second embodiment of the present invention.

  In the second embodiment, a release film 205 (referred to as a processed release film 207) on which a heat-absorbing ink layer 206 has been formed in advance is prepared, and the processed release film 207 is formed on the color ink layer 203 as described above. This is different from the first embodiment. Since other matters can be made the same as in the first embodiment, detailed description thereof is omitted.

The processing medium M23 shown in FIG. 9 is processed from the medium M21 having the base material 201 and the foamed resin layer 202, and is in a state before the foamed resin layer 202 is expanded and expanded.
First, a color ink layer 203 constituting a color image is formed on the foamed resin layer 202 (step S21 shown in FIG. 10: image forming step). The medium M21 on which the color ink layer 203 is formed is referred to as a processing medium M22.

  Next, black ink is printed based on the foaming data in a region corresponding to a portion of one surface (one surface) of the release film 205 where the foamed resin layer 202 is to be three-dimensionalized, whereby the heat absorbing ink layer 206 is printed. Is formed (step S22: photothermal conversion layer forming step). Thereby, the peeling film 205 is processed into the processed film 207. Note that when the thermal absorption ink layer 206 is merely formed on one surface of the release film 205 and sufficient thermal energy cannot be obtained to expand the foamed resin layer 202 to a desired foam height, the release film 205 is used. The heat-absorbing ink layer 206 may be formed on both sides. Further, the photothermal conversion layer forming step S22 may be performed before the image forming step S21 or in parallel with the image forming step S21.

  A processed release film 207 is attached on the color ink layer 203 via the thermocompression bonding layer 204 (step S23: release layer forming step). The processed release film 207 is attached so that the heat absorbing ink layer 206 is located on the surface opposite to the foamed resin layer 202. The processing medium M22 on which the processed release film 207 and the thermal adhesive layer 204 are formed is referred to as a processing medium M23. In addition, like the processing medium M23-1 in the modification shown in FIG. 11, the heat absorption ink layer 206 is positioned on the back surface of the processing release film 207-1 on the foamed resin layer 202 side, that is, the heat absorption. The processed release film 207-1 may be attached onto the color ink layer 203 so that the ink layer 206 is interposed between the release film 205 and the medium M21.

  The processing medium M23 is foamed by radiating electromagnetic waves (step S24: heating step). After the foamed resin layer 202 expands and expands, the processed release film 207 and the thermocompression bonding layer 204 are removed from the processing medium M33 (step S25: release layer peeling step).

Also in the second embodiment described above, the same effect as in the first embodiment described above can be obtained. For the sake of simplicity, description here is omitted for details.
In the second embodiment, a processed release film 207 having a heat absorbing ink layer 206 formed on the release film 205 is prepared, and the processed release film 207 is processed so that the heat absorbing ink layer 206 is positioned on the surface. It is formed on the surface of the medium M22. Thus, since the target for forming the heat absorbing ink layer 206 is the release film 205, the heat absorbing ink layer 206 can be formed independently of the medium M21.

  Further, like the processing medium M23-1 in the modification shown in FIG. 11, the processed release film 207 is positioned so that the heat absorbing ink layer 206 is positioned on the back surface of the processed release film 207-1 on the foamed resin layer 302 side. -1 is stuck on the color ink layer 203, as compared with the case where the heat absorbing ink layer 206 is formed on the surface of the processed release film 207 as shown in FIG. The heat conduction distance to the foamed resin layer 202 can be shortened. Therefore, it is possible to suppress the amount of heat from diffusing in a direction parallel to the surface of the foamed resin layer 202 until the heat absorbed by the heat absorbing ink layer 206 is conducted to the surface of the foamed resin layer 202. Thus, the foamed state of the medium M21 can be set to a desired state more reliably. Therefore, a higher quality structure can be manufactured.

<Third Embodiment>
By the way, in the structure manufactured as described in the first and second embodiments and the modification of the second embodiment, the color ink layers 103 and 203 follow the expansion of the foamed resin layers 102 and 202. As a result of the deformation, desired uneven shapes are formed on the surfaces of the color ink layers 103 and 203. The color ink layers 103 and 203 are exposed on the surface of the structure after the release films 105 and 205 are peeled off.

  For this reason, the color ink layers 103 and 203 that have an uneven surface and are exposed on the surface of the structure in this way, for example, when touched by a human hand, the surface peels off or becomes dirty particularly at the tip of the convex portion. It becomes easy to adhere. Moreover, dust tends to accumulate in the concave portion. In addition, since the surfaces of the color ink layers 103 and 203 are uneven, it is difficult to remove dirt and dust. Thus, the print quality tends to deteriorate after the release films 105 and 205 are peeled off.

  Therefore, in the third embodiment, the fourth to sixth embodiments to be described later, and modified examples of the sixth embodiment, coating is performed between the release films 105 and 205 and the media M11 and M21 (processing media M12 and M22). An example of forming a layer will be described. Since other matters can be made the same as those of the first and second embodiments and the modification of the second embodiment, detailed description thereof is omitted.

FIG. 12 is a cross-sectional view showing a processing medium M34 according to the third embodiment of the present invention.
FIG. 13 is a flowchart for explaining a structure manufacturing method according to the third embodiment of the present invention.

The processing medium M34 shown in FIG. 12 is processed from the medium M31 having the base material 301 and the foamed resin layer 302, and is in a state before the foamed resin layer 302 is expanded and expanded.
First, a color ink layer 303 constituting a color image is formed on the foamed resin layer 302 (step S31: image forming step). The medium M31 on which the color ink layer 303 is formed is referred to as a processing medium M32.

  Next, an integrated film 309 formed by bonding the release film 305 and the coating film 308 which is an example of the coating layer by the thermocompression bonding layer 304 is attached to the color ink layer 303 via the thermocompression bonding layer 307. (Step S32: Release layer forming step (coating layer forming step)). The integrated film 309 is placed on the processing medium M32 so that the covering film 308 is interposed between the release film 305 and the processing medium M32, that is, the covering film 308 is located on the back side of the release film 305. It is pasted. The processing medium M32 to which the integrated film 309 is attached in this way is referred to as a processing medium M33.

  The covering film 308 can be formed in the same manner by adopting the same material, properties (for example, light transmittance), thickness, and the like as the peeling film 305, and thus a duplicate description is omitted, but the peeling film 306 is peeled off. In this case, it does not peel off and remains on the color ink layer 303.

  Therefore, the adhesive for the thermocompression bonding layer 307 for attaching the covering film 308 (integrated film 309) is an adhesive that is more difficult to remove than the adhesive for the thermocompression bonding layer 304 for attaching the release film 305. It is desirable to be. In addition, from the viewpoint of not hindering the visibility of the color ink layer 303, the covering film 308 is desirably transparent. However, after the peeling film 305 is peeled off, it may not be transparent particularly when the covering film 308 is peeled off during the distribution process. In addition, as long as the covering film 308 is formed so as to be peelable, it may be formed so that it can be re-applied again or repeatedly after being removed in the same manner as the peeling film 305.

  Note that the cover layer using the cover film 308 as an example may be formed of a resin, a coating agent, or the like, and the thermocompression bonding layer 307 may be omitted as in the case of the release layer using the release film 306 as an example. Or although it does not become a transparent coating layer, it is good also as a peeling layer by printing inks, such as a peelable white ink, with an inkjet. Thus, the coating layer is not limited to the coating film 308, and the method for forming the coating layer is not limited to thermocompression bonding using the thermocompression bonding layer 307. For example, the attachment may be performed by supplying an adhesive between the color ink layer 303 and the covering film 308.

Integral film 309, for example using a film sticking section 3 shown in FIG. 5, to replace the working medium M12 shown in FIG. 5 the coating film 30 8, by bonding the release film 305 in the coating film 308 is formed be able to. In this case, the film sticking part 3 functions as an example of a coating layer forming part. Further, the integral film 309 can be bonded to the processing medium M32 by using the film bonding unit 3 to bond the integrated film 309 to the processing medium M32.

  Next, black ink is printed based on the foam data in a region corresponding to a portion of the integral film 309 on the surface opposite to the foam resin layer 302 where the foam resin layer 302 is desired to be three-dimensional. Thus, the heat absorbing ink layer 306 is formed (step S33: photothermal conversion layer forming step). The processing medium M33 on which the heat absorbing ink layer 306 is formed is referred to as a processing medium M34.

  Next, the processing medium M34 is foamed by radiating electromagnetic waves (step S34: heating step). After the foamed resin layer 302 expands and expands, the release film 305 is removed from the processing medium M34 (step S35: release layer peeling step). When the release film 305 is peeled off, the thermocompression bonding layer 304 and the heat absorbing ink layer 306 are also peeled together, but the covering film 308 is not peeled off and remains on the color ink layer 303.

Also in the third embodiment described above, the same effect as in the first embodiment described above can be obtained. For the sake of simplicity, description here is omitted for details.
In the third embodiment, the covering film 308 as an example of the covering layer is formed on the medium M31 so as to be interposed between the peeling film 305 as an example of the peeling layer and the medium M31 (processing medium M32). Is done. Thus, even after the peeling film 305 is peeled off, the covering film 308 can protect the color ink layer 303 which is an example of an image having an uneven surface, so that the covering film 308 is not formed and the color ink layer 303 is not formed. Compared with the case where the surface of the color ink layer 303 is exposed, the surface of the convex portion of the color ink layer 303 is peeled off or dirt is attached, and dust tends to accumulate in the concave portion of the color ink layer 303. You can avoid that. Furthermore, when the upper surface of the coating film 308 opposite to the color ink layer 303 is a flat surface, it is possible to easily remove dirt and dust by, for example, wiping. As described above, after the peeling film 305 is peeled, the printing quality of the color ink layer 303 can be prevented from being deteriorated.

<Fourth embodiment>
FIG. 14 is a cross-sectional view showing a processing medium M43 according to the fourth embodiment of the present invention.
FIG. 15 is a flowchart for explaining a structure manufacturing method according to the fourth embodiment of the present invention.

  In the fourth embodiment, the integrated film 409 (that is, the processed integrated film 410) on which the heat absorbing ink layer 406 is formed in advance is prepared, and the processed integrated film 410 is formed on the color ink layer 403 as described above. This is different from the third embodiment. Since other matters can be made the same as in the third embodiment, detailed description thereof is omitted.

The processing medium M43 shown in FIG. 14 is processed from the medium M41 having the base material 401 and the foamed resin layer 402, and is in a state before the foamed resin layer 402 is expanded and expanded.
First, a color ink layer 403 constituting a color image is formed on the foamed resin layer 402 (step S41: image forming step). The medium M41 on which the color ink layer 403 is formed is referred to as a processing medium M42.

  Next, on the surface of the release film 405 opposite to the surface to be bonded to the color ink layer 403 in the integrated film 409 formed by bonding the release film 405 and the covering film 408 with the thermocompression bonding layer 407. In the region corresponding to the portion where the foamed resin layer 402 is to be three-dimensionalized, the black ink is printed based on the foam data to form the heat absorbing ink layer 406 (step S42: photothermal conversion). Layer forming step). The integrated film 409 on which the heat-absorbing ink layer 406 is thus formed is referred to as a processed integrated film 410. The photothermal conversion layer forming step S42 may be performed prior to or in parallel with the image forming step S41.

  Next, on the color ink layer 403, the integrated processing film 410 is attached via the thermocompression bonding layer 407 (step S43: peeling layer forming step (covering layer forming step)). The integrated film 410 is placed on the processing medium M42 so that the covering film 408 is interposed between the release film 405 and the processing medium M42, that is, the covering film 408 is located on the back side of the release film 405. Is pasted. The processing medium M42 to which the processing integrated film 410 is thus attached is referred to as a processing medium M43.

  Next, the processing medium M43 is foamed by radiating electromagnetic waves (step S44: heating step). After the foamed resin layer 402 expands and expands, the release film 405 is removed from the processing medium M43 (step S45: release layer peeling step). When the release film 405 is peeled off, the thermocompression bonding layer 404 and the heat absorbing ink layer 406 are also peeled together, but the covering film 408 is not peeled off and remains on the color ink layer 403.

Also in the fourth embodiment described above, the same effect as in the third embodiment described above can be obtained. For the sake of simplicity, description here is omitted for details.
In the fourth embodiment, a processed integrated film 410 in which a heat-absorbing ink layer 406 is formed on the surface of the release film 405 bonded to the coated film 408 is prepared, and the processed integrated film 410 is used as the coated film 408. Is formed on the surface of the processing medium M42 so as to be interposed between the release film 405 and the medium M41 (processing medium M42). Thus, since the object for forming the heat absorbing ink layer 406 is the processed integrated film 410, the heat absorbing ink layer 406 can be formed independently of the medium M41.

<Fifth Embodiment>
FIG. 16 is a cross-sectional view showing a processing medium M55 according to the fifth embodiment of the present invention.
FIG. 17 is a flowchart for explaining a structure manufacturing method according to the fifth embodiment of the present invention.

  The fifth embodiment is different from the third embodiment described above in that the covering film 508 and the release film 505 are individually bonded onto the medium M51. Since other matters can be made the same as in the third embodiment, detailed description thereof is omitted.

The processing medium M55 shown in FIG. 16 is processed from the medium M51 having the base material 501 and the foamed resin layer 502, and is in a state before the foamed resin layer 502 is expanded and expanded.
First, a color ink layer 503 constituting a color image is formed on the foamed resin layer 502 (step S51: image forming step). The medium M51 on which the color ink layer 503 is formed is referred to as a processing medium M52.

  Next, the coating film 508 is attached on the color ink layer 503 via the thermocompression bonding layer 507 (step S52: coating layer forming step). The processing medium M52 to which the covering film 508 is attached in this way is referred to as a processing medium M53.

  Next, on the covering film 508, the peeling film 505 is affixed through the thermocompression bonding layer 504 (step S53: peeling layer formation process). The processing medium M53 to which the release film 505 is thus attached is referred to as a processing medium M54.

  Next, black ink is printed based on the foaming data in the region corresponding to the portion of the release film 505 on the surface opposite to the foamed resin layer 502 where the foamed resin layer 502 is to be three-dimensionalized. Thus, the heat absorbing ink layer 506 is formed (step S54: photothermal conversion layer forming step). The processing medium M54 on which the heat absorbing ink layer 506 is thus formed is referred to as a processing medium M55.

  Next, the processing medium M55 is foamed by radiating electromagnetic waves (step S55: heating step). After the foamed resin layer 502 expands and expands, the release film 505 is removed from the processing medium M55 (step S55: release layer peeling step). When the release film 505 is peeled off, the thermocompression bonding layer 504 and the heat absorbing ink layer 506 are also peeled together, but the covering film 508 is not peeled off and remains on the color ink layer 503.

Also in the fifth embodiment described above, the same effect as in the third embodiment described above can be obtained. For the sake of simplicity, description here is omitted for details.
In the fifth embodiment, the release film 505 and the covering film 508 are individually attached on the medium M51. Therefore, the preparation of the integral film which bonded the peeling film 505 and the coating film 508 can be abbreviate | omitted.

<Sixth Embodiment>
FIG. 18 is a cross-sectional view showing a machining medium M64 according to the sixth embodiment of the present invention.
FIG. 19 is a flowchart for explaining a structure manufacturing method according to the sixth embodiment of the present invention.

  In the sixth embodiment, a release film 605 on which a heat-absorbing ink layer 606 is formed in advance (that is, a processed release film 609) is prepared, and the processed release film 609 is formed on the covering film 608 as described above. This is different from the fifth embodiment. Since other matters can be made the same as in the fifth embodiment, detailed description is omitted.

A processing medium M64 shown in FIG. 18 is processed from a medium M61 having a base 601 and a foamed resin layer 602, and is in a state before the foamed resin layer 602 is expanded and expanded.
First, a color ink layer 603 constituting a color image is formed on the foamed resin layer 602 (step S61: image forming step). The medium M61 on which the color ink layer 603 is formed is referred to as a processing medium M62.

  Next, black ink is printed based on the foaming data in a region corresponding to a portion of the one surface (one surface) of the release film 605 where the foamed resin layer 602 is to be three-dimensionalized, whereby the heat absorbing ink layer 606 is printed. Is formed (step S62: photothermal conversion layer forming step). Thereby, the peeling film 605 is processed into the processed peeling film 609. In addition, when the thermal energy sufficient to foam and expand the foamed resin layer 602 to a desired foaming height cannot be obtained simply by forming the heat absorbing ink layer 606 on one surface of the release film 605, the release film 605 is used. The heat-absorbing ink layer 606 may be formed on both sides. Further, the photothermal conversion layer forming step S62 may be performed prior to or in parallel with the image forming step S61.

  Next, a coating film 608 is affixed on the color ink layer 603 via a thermocompression bonding layer 607 (step S63: coating layer forming step). The processing medium M62 to which the covering film 608 is attached in this way is referred to as a processing medium M63.

  Next, the processed release film 609 is affixed on the covering film 608 via the thermocompression bonding layer 604 (step S64: release layer forming step). The processed release film 609 is attached so that the heat absorbing ink layer 606 is located on the surface opposite to the foamed resin layer 202. The processing medium M63 on which the processed release film 609 is attached in this manner is referred to as a processing medium M64. Note that, like the processing medium M64-1 in the modification shown in FIG. 20, the heat absorption ink layer 606 is positioned on the back surface of the processed release film 609-1 on the foamed resin layer 602 side, that is, the heat absorption. The processed release film 609-1 may be attached on the color ink layer 603 so that the ink layer 606 is interposed between the release film 605 and the medium M61.

Next, the processing medium M64 is foamed by radiating electromagnetic waves (step S65: heating step). After the foamed resin layer 602 expands and expands, the processed release film 609 is removed from the processing medium M65 (step S6 6 : release layer peeling step). When the processed release film 609 is peeled off, the thermocompression bonding layer 604 is also peeled together, but the covering film 608 is not peeled off and remains on the color ink layer 603.

Also in the sixth embodiment described above, the same effect as in the fifth embodiment described above can be obtained. For the sake of simplicity, description here is omitted for details.
In the sixth embodiment, a processed release film 609 having a heat absorbing ink layer 606 formed on the release film 605 is prepared, and the processed release film 609 is processed so that the heat absorbing ink layer 606 is located on the surface. It is formed on the surface of the medium M63. Thus, since the object for forming the heat absorbing ink layer 606 is the release film 605, the heat absorbing ink layer 606 can be formed independently of the medium M61.

  In addition, like the processing medium M64-1 in the modification shown in FIG. 20, the processed release film 609 is positioned so that the heat absorbing ink layer 606 is positioned on the back surface of the processed release film 609-1 on the foamed resin layer 602 side. -1 is pasted on the color ink layer 603, compared with the case where the heat absorbing ink layer 606 is formed on the surface of the processed release film 609 as shown in FIG. The heat conduction distance to the foamed resin layer 602 can be shortened. Therefore, it is possible to suppress the amount of heat from diffusing in a direction parallel to the surface of the foamed resin layer 602 until the heat absorbed by the heat absorbing ink layer 606 is conducted to the surface of the foamed resin layer 602, and thus Thus, the foaming state of the medium M61 can be set to a desired state more reliably. Therefore, a higher quality structure can be manufactured.

  As mentioned above, although embodiment of this invention was described, this invention includes the invention described in the claim, and its equivalent range. The invention described in the scope of claims at the beginning of the filing of the present application will be appended.

[Appendix 1]
Forming a peelable release layer on the medium containing the expanded layer that expands upon heating;
Forming a photothermal conversion layer on the medium;
The expansion layer of the medium is expanded by heating, and then the release layer is released.
The structure manufacturing method characterized by the above-mentioned.

[Appendix 2]
On the medium containing the expansion layer that expands by heating, a release layer on which the photothermal conversion layer is formed and can be peeled is formed,
The expansion layer of the medium is expanded by heating, and then the release layer is released.
The structure manufacturing method characterized by the above-mentioned.

[Appendix 3]
A photothermal conversion layer is formed on the peelable release layer, and then
Forming the release layer on a medium containing an expanded layer that expands by heating;
The expansion layer of the medium is expanded by heating, and then the release layer is released.
The structure manufacturing method characterized by the above-mentioned.

[Appendix 4]
Forming the release layer includes forming the release layer on the medium such that the release layer is interposed between the photothermal conversion layer and the medium.
The structure manufacturing method according to Supplementary Note 2 or 3, wherein

[Appendix 5]
Expanding the expansion layer by heating includes irradiating an electromagnetic wave in a wavelength region absorbed by the light-to-heat conversion layer toward the light-to-heat conversion layer,
The release layer does not transmit electromagnetic waves in at least a part of the wavelength region;
The structure manufacturing method according to any one of appendices 1 to 4, characterized in that:

[Appendix 6]
Forming the release layer includes forming the release layer on the medium such that the photothermal conversion layer is interposed between the release layer and the medium.
The method for manufacturing a structure according to Supplementary Note 2, wherein:

[Appendix 7]
Forming the release layer includes forming the release layer on the medium by thermocompression bonding.
The structure manufacturing method according to any one of appendices 1 to 6, characterized in that:

[Appendix 8]
Forming the release layer includes forming the release layer on which the coating layer covering the medium is formed on the medium such that the coating layer is interposed between the release layer and the medium. Including
The structure manufacturing method according to any one of appendices 1 to 7, wherein:

[Appendix 9]
Before forming the release layer, a coating layer that covers the medium is formed on the medium.
The structure manufacturing method according to any one of appendices 1 to 7, wherein:

[Appendix 10]
Forming an image on the medium before forming the covering layer on the medium;
The structure manufacturing method according to appendix 8 or 9, characterized in that.

[Appendix 11]
A release layer forming unit that forms a peelable release layer on a medium including an expanded layer that expands by heating,
A photothermal conversion layer forming part for forming a photothermal conversion layer on the medium;
A heating unit that expands the expansion layer of the medium by heating;
A structure-type system comprising:

[Appendix 12]
A release layer forming part that forms a release layer on which a photothermal conversion layer is formed and can be peeled on a medium including an expansion layer that expands by heating,
A heating unit that expands the expansion layer of the medium by heating;
A structure manufacturing system comprising:

[Appendix 13]
A photothermal conversion layer forming part for forming a photothermal conversion layer on the peelable release layer;
A release layer forming part for forming the release layer on a medium including an expanded layer that expands by heating,
A heating unit that expands the expansion layer of the medium by heating;
A structure manufacturing system comprising:

[Appendix 14]
The structure manufacturing system according to any one of appendices 11 to 13, further comprising a peeling portion that peels off the peeling layer.

[Appendix 15]
A coating layer forming section for forming a coating layer for coating the medium on the medium;
15. The structure manufacturing system according to any one of appendices 11 to 14, characterized in that:

[Appendix 16]
A program executed by the control unit of the structure manufacturing system including a release layer forming unit, a photothermal conversion layer forming unit, a heating unit, and a control unit,
The control unit
On the medium containing the expansion layer that expands by heating, a release layer that can be peeled is formed using the release layer forming section,
A photothermal conversion layer is formed on the medium using the photothermal conversion layer forming unit,
Expanding the expansion layer of the medium by heating using the heating unit;
A structure manufacturing program characterized in that it functions as described above.

[Appendix 17]
A program executed by the control unit of the structure manufacturing system including a release layer forming unit, a photothermal conversion layer forming unit, a heating unit, and a control unit,
The control unit
A release layer on which a photothermal conversion layer is formed and can be peeled on a medium including an expanded layer that expands by heating is formed using the release layer forming section,
Expanding the expansion layer of the medium by heating using the heating unit;
A structure manufacturing program characterized in that it functions as described above.

[Appendix 18]
A program executed by the control unit of the structure manufacturing system including a release layer forming unit, a photothermal conversion layer forming unit, a heating unit, and a control unit,
The control unit
On the release layer that expands by heating, the photothermal conversion layer is formed using the photothermal conversion layer forming part,
On the medium containing the expansion layer, a peelable release layer is formed using the release layer forming portion,
Expanding the expansion layer of the medium by heating using the heating unit;
A structure manufacturing program characterized in that it functions as described above.

[Appendix 19]
The structure manufacturing system further includes a peeling portion,
The control unit
The peeling layer is peeled off using the peeling part,
The structure manufacturing program according to any one of supplementary notes 16 to 18, wherein the program is further made to function as described above.

[Appendix 20]
The structure manufacturing system further includes a coating layer forming unit,
The control unit
A coating layer that covers the medium is formed on the medium using the coating layer forming unit.
The structure manufacturing program according to any one of supplementary notes 16 to 19, further functioning as described above.

[Appendix 21]
A medium comprising an expanded layer before being expanded and expanded by heating;
A peelable release layer formed on the medium;
A photothermal conversion layer formed on the release layer;
A processing medium for manufacturing a structure, comprising:

[Appendix 22]
A coating layer formed between the release layer and the medium and covering the medium;
Item 22. The processing medium for manufacturing a structure according to appendix 21, wherein

DESCRIPTION OF SYMBOLS 1 ... Structure manufacturing system, 2 ... Inkjet printer part, 3 ... Film sticking part, 4 ... Black ink printing part, 5 ... Heating part, 43 ... Release layer supply roller, 44 ... Under film supply roller, 45 ... Roller pair 45a ... heating roller, 45b ... roller, 101 ... substrate, 102 ... foamed resin layer, 103 ... color ink layer, 104 ... thermocompression bonding layer, 105 ... release film, 106 ... heat absorption ink layer, M1 ... medium, M2 , M3, M4 ... Stereoscopic image forming processing medium

Claims (3)

A first step of forming an image on a medium;
A second step of forming a coating layer for protecting the image on the outs image before formed in the first step,
Forming a release layer in which a heat absorption layer for expanding the medium is formed on the coating layer formed in the second step, and
The said heat absorption layer is formed in the surface on the side facing the said coating layer, The manufacturing method of the modeling object manufacturing medium characterized by the above-mentioned. A first step of forming an image on a medium;
A second step of forming a coating layer for protecting the image on the image formed in the first step;
A third step of forming a release layer on the coating layer formed in the second step,
A method for producing a medium for manufacturing a molded article, wherein a heat absorption layer for expanding the medium is formed below the release layer.   The image is a color image;
  The method for manufacturing a modeled article manufacturing medium according to claim 1, wherein the coating layer is transparent.