JP6444952B2 - Molded article monitoring device - Google Patents

Molded article monitoring device Download PDF

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JP6444952B2
JP6444952B2 JP2016166635A JP2016166635A JP6444952B2 JP 6444952 B2 JP6444952 B2 JP 6444952B2 JP 2016166635 A JP2016166635 A JP 2016166635A JP 2016166635 A JP2016166635 A JP 2016166635A JP 6444952 B2 JP6444952 B2 JP 6444952B2
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abnormality
molded product
abnormality occurrence
occurrence position
monitoring apparatus
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JP2017114109A (en
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内山 辰宏
辰宏 内山
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FANUC Corp
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本発明は、射出成形機によって成形された成形品の監視装置に関し、特に複数の成形品の画像を取得することによって、成形不良の発生傾向を把握可能とした成形品監視装置に関する。   The present invention relates to a monitoring device for a molded product molded by an injection molding machine, and more particularly to a molded product monitoring device that can grasp a tendency of occurrence of molding defects by acquiring images of a plurality of molded products.

射出成形機によって成形された成形品に不良が発生した場合に、その不良の発生位置を特定することは、不良対策を行う上で極めて重要である。例えば、成形品の末端にバリやショートが発生した場合には、保圧工程における圧力が適切でない可能性がある。成形品のゲート周囲にシルバーが発生する場合には、射出速度が適切でない可能性がある。また、成形品表面にランダムに炭化物が見られる場合には、樹脂温度が適切でない可能性がある。   When a defect occurs in a molded product molded by an injection molding machine, specifying the position where the defect occurs is extremely important in taking measures against the defect. For example, when burrs or shorts occur at the end of the molded product, the pressure in the pressure holding process may not be appropriate. If silver is generated around the gate of the molded product, the injection speed may not be appropriate. Moreover, when a carbide | carbonized_material is seen at random on the molded article surface, resin temperature may not be appropriate.

近年では、成形品の画像を取得し、その画像に基づいて、上述したバリ、ショート、シルバー、炭化物等の不良を発見する手段が種々提案されている。例えば、特許文献1には、成形品の画像を取得して、異常が発生した位置によって成形機や付属装置を動作させる金型監視装置が開示されている。特許文献2には、成形品の画像をビデオカメラで取得して、網目状検出単位領域の明るさで異常の有無を判定する射出成形機監視装置が開示されている。特許文献3には、良品の成形品画像と不良品の成形品画像とを比較し、その差分データを記憶する成形機管理システムが開示されている。特許文献4には、撮影した成形品画像に基づいて不良の種類や程度を特定して、成形条件を補正する不適合品発生防止成形システムが開示されている。特許文献5には、不良発生箇所毎に不良発生件数を集計してグラフ表示すること、及び不良が発生したショットを含む複数のショット間で射出成形機のプロセス値を比較することができる不良要因判定システムが開示されている。   In recent years, various means for acquiring an image of a molded product and finding defects such as the above-described burrs, shorts, silver, and carbides based on the image have been proposed. For example, Patent Literature 1 discloses a mold monitoring apparatus that acquires an image of a molded product and operates a molding machine or an accessory device at a position where an abnormality has occurred. Patent Document 2 discloses an injection molding machine monitoring apparatus that acquires an image of a molded product with a video camera and determines the presence or absence of an abnormality based on the brightness of a mesh detection unit region. Patent Document 3 discloses a molding machine management system that compares a non-defective product image with a defective product image and stores the difference data. Patent Document 4 discloses a nonconforming product generation preventing molding system that corrects molding conditions by specifying the type and degree of failure based on a photographed molded product image. Patent Document 5 discloses a failure factor that allows the number of failures to be tabulated for each failure occurrence location and displayed as a graph, and the process value of an injection molding machine to be compared between a plurality of shots including shots where failures have occurred. A determination system is disclosed.

特開2009−061786号公報JP 2009-061786 A 特開平3−231824号公報JP-A-3-231824 特開2007−160642号公報JP 2007-160642 A 特開2006−297759号公報JP 2006-297759 A 特開2014−69382号公報JP 2014-69382 A

上述したバリ、ショート、シルバー、炭化物等の不良が突発的なものなのか、又は上述した圧力、射出速度、樹脂温度等の成形条件に起因しているのかを判定するためには、複数の成形品における不良の発生状況に基づいて、不良の発生傾向を把握することが有効である。   In order to determine whether the defects such as burrs, shorts, silvers, carbides, etc. mentioned above are sudden or due to the molding conditions such as pressure, injection speed, resin temperature, etc. It is effective to grasp the tendency of occurrence of defects based on the state of occurrence of defects in the product.

しかしながら、特許文献1乃至4記載の技術は、いずれも成形品毎の良否を判別するのみであって、不良の発生傾向を把握するものではない。また、特許文献5記載の技術は成形条件の異なる複数のショット間で不良発生箇所を比較することができないため、成形不良の原因となる成形条件を特定することが困難であった。このため、特許文献1乃至5記載の技術では、突発的な成形不良の対策には役立っても、最適な成形条件を確定し、長期的な安定成形を実現することは困難であった。   However, all of the techniques described in Patent Documents 1 to 4 only determine the quality of each molded product, and do not grasp the tendency of occurrence of defects. Moreover, since the technique described in Patent Document 5 cannot compare the occurrence of defects between a plurality of shots having different molding conditions, it is difficult to specify the molding conditions that cause molding defects. For this reason, with the techniques described in Patent Documents 1 to 5, it is difficult to determine optimum molding conditions and realize long-term stable molding even if it is useful for countermeasures for sudden molding defects.

本発明は、このような問題点を解決するためになされたものであり、異なる期間における複数の成形品の画像を取得することによって、異なる期間間の成形不良の発生傾向の相違を把握可能とした成形品監視装置を提供することを目的とする。   The present invention has been made to solve such problems, and by acquiring images of a plurality of molded products in different periods, it is possible to grasp the difference in occurrence tendency of molding defects between different periods. An object of the present invention is to provide a molded product monitoring apparatus.

本発明の一実施の形態にかかる成形品監視装置は、射出成形機で成形された成形品の画像を取得する成形品画像取得手段と、前記画像に基づいて前記成形品に異常があるか否かを判別し、異常がある場合には異常発生位置を特定する異常発生位置特定手段と、を備える成形品監視装置において、前記成形品画像取得手段は、少なくとも2個以上の前記成形品の前記画像を取得し、前記異常発生位置特定手段は、前記異常発生位置毎に異常発生回数又は異常発生頻度のうち少なくともいずれか一方を算出し、数の異なる期間の、前記異常発生位置毎の前記異常発生回数又は前記異常発生頻度を示すグラフを並べて生成する比較手段を有することを特徴とするものである。 A molded product monitoring apparatus according to an embodiment of the present invention includes a molded product image acquisition unit that acquires an image of a molded product molded by an injection molding machine, and whether or not there is an abnormality in the molded product based on the image. And an abnormality occurrence position specifying means for specifying an abnormality occurrence position when there is an abnormality, wherein the molded product image acquisition means includes at least two of the molded articles. acquiring an image, the abnormality occurrence position specifying means, said abnormality calculating at least any one of the abnormality occurrence count or abnormal occurrence frequency for each location, the different periods of several, said each of the abnormality occurrence position Comparing means for generating a graph indicating the number of times of occurrence of abnormality or the frequency of occurrence of abnormality is provided.

他の実施の形態にかかる前記成形品監視装置では、前記異常発生位置特定手段は、前記グラフに代えて、前記異なる期間毎に、前記異常発生位置を示す平面上に、前記異常発生位置毎の前記異常発生回数又は前記異常発生頻度を示す数値を表示手段に表示させることを特徴とする。 In the molded product monitoring apparatus according to another embodiment, the abnormality occurrence position specifying unit is provided for each abnormality occurrence position on a plane indicating the abnormality occurrence position for each different period instead of the graph . A numerical value indicating the number of occurrences of the abnormality or the frequency of occurrence of the abnormality is displayed on a display unit.

他の実施の形態にかかる前記成形品監視装置では、前記異常発生位置特定手段は、前記異なる期間毎に、前記異常発生位置を示す平面と、前記異常発生位置毎の前記異常発生回数又は前記異常発生頻度を示す軸とを含む空間内に3次元グラフを表示手段に表示させることを特徴とする。   In the molded article monitoring apparatus according to another embodiment, the abnormality occurrence position specifying means includes a plane indicating the abnormality occurrence position and the number of occurrences of abnormality or the abnormality for each abnormality occurrence position for each different period. A three-dimensional graph is displayed on the display means in a space including an axis indicating the occurrence frequency.

他の実施の形態にかかる前記成形品監視装置では、前記比較手段は、前記グラフに代えて、前記異なる期間間における前記異常発生回数又は異常発生頻度の差分を異常発生位置毎に求め、前記異常発生位置を示す平面上に、前記差分を示す数値を表示手段に表示させることを特徴とする。 In the molded article monitoring apparatus according to another embodiment, the comparison unit obtains , for each abnormality occurrence position, the difference between the number of occurrences of abnormality or the frequency of occurrence of abnormality between the different periods instead of the graph, and the abnormality A numerical value indicating the difference is displayed on a display unit on a plane indicating the generation position.

他の実施の形態にかかる前記成形品監視装置では、前記比較手段は、前記異なる期間間における前記異常発生回数又は異常発生頻度の差分を異常発生位置毎に求め、前記異常発生位置を示す平面と、前記差分を示す軸とを含む空間内に3次元グラフを表示手段に表示させることを特徴とする。   In the molded product monitoring apparatus according to another embodiment, the comparison unit obtains a difference between the number of occurrences of abnormality or the frequency of occurrence of abnormality between the different periods for each abnormality occurrence position, and a plane indicating the abnormality occurrence position; A three-dimensional graph is displayed on the display means in a space including the axis indicating the difference.

他の実施の形態にかかる前記成形品監視装置では、前記異なる期間は、所定の成形サイクル数を成形した期間、又は所定の時間であることを特徴とする。   In the molded product monitoring apparatus according to another embodiment, the different period is a period in which a predetermined number of molding cycles is molded, or a predetermined time.

他の実施の形態にかかる前記成形品監視装置では、前記射出成形機の物理量を前記成形サイクル毎に取得する物理量取得手段を備え、前記異常発生位置特定手段は、前記物理量と前記異常発生位置を対応付けて記憶手段に記憶させることを特徴とする。   In the molded product monitoring apparatus according to another embodiment, the apparatus includes a physical quantity acquisition unit that acquires the physical quantity of the injection molding machine for each molding cycle, and the abnormality occurrence position specifying unit is configured to determine the physical quantity and the abnormality occurrence position. The information is stored in the storage means in association with each other.

他の実施の形態にかかる前記成形品監視装置では、前記成形品の物理量を前記成形サイクル毎に取得する物理量取得手段を備え、前記異常発生位置特定手段は、前記物理量と前記異常発生位置を対応付けて記憶手段に記憶させることを特徴とする。   In the molded product monitoring apparatus according to another embodiment, the molded product monitoring apparatus includes a physical quantity acquisition unit that acquires a physical quantity of the molded product for each molding cycle, and the abnormality occurrence position specifying unit associates the physical quantity with the abnormality occurrence position. In addition, it is stored in the storage means.

他の実施の形態にかかる前記成形品監視装置では、前記異常発生位置特定手段は、前記物理量が所定範囲内の場合と所定範囲の場合において算出された前記異常発生位置毎の前記異常発生回数又は前記異常発生頻度のうち少なくともいずれか一方を、前記所定範囲内の場合と前記所定範囲外の場合とで前記表示手段に表示させることを特徴とする。 In the molded article monitoring apparatus according to another embodiment, the abnormality occurrence position specifying unit is configured to calculate the abnormality occurrence number for each abnormality occurrence position calculated when the physical quantity is within a predetermined range and outside the predetermined range. Alternatively, at least one of the abnormality occurrence frequencies is displayed on the display unit when the frequency is within the predetermined range and when the frequency is out of the predetermined range.

他の実施の形態にかかる成形品監視装置は、前記異常発生位置特定手段は、成形品の異常の判別の基準となる基準成形品画像を予め記憶しておき、前記基準成形品画像と前記画像とを比較することにより前記成形品に異常があるか否かを判定することを特徴とする。   In the molded product monitoring apparatus according to another embodiment, the abnormality occurrence position specifying unit stores in advance a reference molded product image serving as a reference for determining abnormality of the molded product, and the reference molded product image and the image are stored in advance. To determine whether or not there is an abnormality in the molded product.

他の実施の形態にかかる成形品監視装置は、前記基準成形品画像は、前記成形品画像取得手段によって予め取得されることを特徴とする。   The molded product monitoring apparatus according to another embodiment is characterized in that the reference molded product image is acquired in advance by the molded product image acquisition means.

本発明により、異なる期間における複数の成形品の画像を取得することによって、異なる期間間の成形不良の発生傾向の相違を把握可能とした成形品監視装置を提供することができる。   According to the present invention, it is possible to provide a molded product monitoring apparatus capable of grasping a difference in occurrence tendency of molding defects between different periods by acquiring images of a plurality of molded products in different periods.

成形品監視装置100の構成を示すブロック図である。2 is a block diagram illustrating a configuration of a molded product monitoring apparatus 100. FIG. 成形品の異常発生位置の特定手法の例を示す図である。It is a figure which shows the example of the identification method of the abnormality occurrence position of a molded article. 異常発生回数又は異常発生頻度の表示例を示す図である。It is a figure which shows the example of a display of abnormality occurrence frequency or abnormality occurrence frequency. 異常発生回数又は異常発生頻度の表示例を示す図である。It is a figure which shows the example of a display of abnormality occurrence frequency or abnormality occurrence frequency. 異常発生回数又は異常発生頻度の表示例を示す図である。It is a figure which shows the example of a display of abnormality occurrence frequency or abnormality occurrence frequency. 異なる成形条件下における異常発生回数又は異常発生頻度の比較表示例を示す図である。It is a figure which shows the comparative display example of the frequency | count of abnormality occurrence or the frequency of abnormality occurrence under different molding conditions. 物理量と異常発生位置との対応付けの例を示す図である。It is a figure which shows the example of matching with a physical quantity and abnormality occurrence position.

<実施の形態1>
以下、本発明の実施の形態を図面と共に説明する。
図1は、本発明の実施の形態にかかる成形品監視装置100の構成を示すブロック図である。成形品監視装置100は、図1に示すように射出成形機に内蔵されていてもよく、射出成形機とは別個の装置であっても良い。典型的な成形品監視装置100は、中央情報処理装置(CPU)が記憶装置に格納されたプログラムに従って所定の処理を実行し、必要に応じ各種ハードウェアの制御等を行うことにより、様々な処理手段を論理的に実現する。
<Embodiment 1>
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a block diagram showing a configuration of a molded product monitoring apparatus 100 according to an embodiment of the present invention. The molded product monitoring apparatus 100 may be built in the injection molding machine as shown in FIG. 1 or may be a separate device from the injection molding machine. A typical molded article monitoring apparatus 100 performs various processing by a central information processing device (CPU) executing predetermined processing according to a program stored in a storage device and controlling various hardware as necessary. Implement the means logically.

成形品監視装置100は、成形品画像取得手段101、異常発生位置特定手段102、記憶手段104、表示手段106、比較手段107を有する。   The molded product monitoring apparatus 100 includes a molded product image acquisition unit 101, an abnormality occurrence position specifying unit 102, a storage unit 104, a display unit 106, and a comparison unit 107.

成形品画像取得手段101は、射出成形機で成形された成形品の画像を取得する手段である。典型的にはカメラユニットを利用できる。   The molded product image acquisition unit 101 is a unit that acquires an image of a molded product molded by an injection molding machine. Typically, a camera unit can be used.

異常発生位置特定手段102は、成形品画像取得手段101が取得した成形品画像に異常があるか否かを判別する処理を行う。また、成形品画像に異常があると判別された場合には、異常が発生した位置を特定する処理を行う。具体的には、異常発生位置特定手段102は、基準となる良品の成形品画像(基準成形品画像)を予め取得しておき、基準成形品画像と成形品画像取得手段101が取得した成形品画像とを比較することにより、異常があるか否かを判別できる。又は、基準成形品画像の代わりに、成形品のCAD図を基準画像として利用しても良い。   The abnormality occurrence position specifying unit 102 performs processing for determining whether or not there is an abnormality in the molded product image acquired by the molded product image acquiring unit 101. Further, when it is determined that there is an abnormality in the molded product image, a process for specifying the position where the abnormality has occurred is performed. More specifically, the abnormality occurrence position specifying unit 102 acquires in advance a reference non-defective molded product image (reference molded product image), and the molded product acquired by the reference molded product image and the molded product image acquisition unit 101. By comparing with the image, it can be determined whether or not there is an abnormality. Alternatively, instead of the reference molded product image, a CAD drawing of the molded product may be used as the reference image.

図2に、異常が発生した位置の特定手法の一例を示す。異常発生位置特定手段102は、成形品の所定の面を撮影した画像をXY座標平面上に配置する。そして、この座標平面を任意の大きさの格子状領域に分割し、格子毎に上述の判別処理を行う。その結果、異常があると判別された格子を、異常が発生した位置として特定する。   FIG. 2 shows an example of a method for identifying a position where an abnormality has occurred. The abnormality occurrence position specifying unit 102 arranges an image obtained by photographing a predetermined surface of the molded product on the XY coordinate plane. Then, this coordinate plane is divided into lattice regions of an arbitrary size, and the above-described determination process is performed for each lattice. As a result, the grid determined to be abnormal is specified as the position where the abnormality has occurred.

また、異常発生位置特定手段102は、少なくとも2個以上の同種の成形品の成形品画像を、成形品画像取得手段101により取得する。そして、異常が発生した位置毎に、異常発生回数又は異常発生頻度の少なくともいずれか一方を算出し、算出結果を表示手段106に表示する。表示手段106は、典型的にはディスプレイユニットである。   Further, the abnormality occurrence position specifying unit 102 acquires a molded product image of at least two or more of the same type of molded product by the molded product image acquiring unit 101. Then, at least one of the number of occurrences of abnormality and the frequency of occurrence of abnormality is calculated for each position where an abnormality has occurred, and the calculation result is displayed on the display means 106. The display means 106 is typically a display unit.

図3乃至図5に、異常発生回数又は異常発生頻度の表示例を示す。図3のチャートは、異常発生位置を示す格子状領域上に、異常発生回数を示す数値を表示した例である。例えば、数値「4」が表示されている場合、その位置においては4回の異常が発生したことを示している。図4のチャートは、同様の格子状領域上に異常発生頻度を示す数値を表示した例である。例えば、格子に数値「40%」が表示されている場合、異常発生位置特定手段102が取得した成形品画像のうち40%において、その位置で異常が発生していたことを示している。図5のグラフは、格子状領域を含む平面を構成するXY軸に加え、異常発生回数や異常発生頻度を示す第3軸を備えた座標空間内に、3次元グラフを生成、表示した例である。図5の例によれば、異常発生回数又は異常発生頻度の多い位置をより直感的に把握できる。   3 to 5 show display examples of the number of occurrences of abnormality or the frequency of occurrence of abnormality. The chart of FIG. 3 is an example in which a numerical value indicating the number of occurrences of an abnormality is displayed on a grid area indicating the occurrence position of the abnormality. For example, when the numerical value “4” is displayed, it indicates that the abnormality has occurred four times at that position. The chart of FIG. 4 is an example in which a numerical value indicating an abnormality occurrence frequency is displayed on a similar grid area. For example, when the numerical value “40%” is displayed on the grid, it indicates that an abnormality has occurred at that position in 40% of the molded product image acquired by the abnormality occurrence position specifying unit 102. The graph of FIG. 5 is an example in which a three-dimensional graph is generated and displayed in a coordinate space having a third axis indicating the number of occurrences of abnormality and the frequency of occurrence of abnormalities in addition to the XY axes constituting a plane including a grid area. is there. According to the example of FIG. 5, it is possible to more intuitively understand the number of occurrences of abnormality or the position where the abnormality occurrence frequency is high.

なお、異常発生位置特定手段102は、成形品画像を取得する毎に、異常発生位置を特定し、その異常発生位置における異常発生回数と異常発生頻度とを都度更新しても良い。又は、異常発生位置特定手段102は、成形品画像を取得する毎に異常発生位置を記憶しておき、後で異常発生位置毎の異常発生回数と異常発生頻度とをまとめて算出しても良い。異常発生位置特定手段102は、異常発生位置毎に算出した異常発生回数や異常発生頻度を、記憶手段104に格納する。   The abnormality occurrence position specifying unit 102 may specify the abnormality occurrence position every time the molded product image is acquired, and update the abnormality occurrence frequency and the abnormality occurrence frequency at the abnormality occurrence position each time. Alternatively, the abnormality occurrence position specifying unit 102 may store the abnormality occurrence position every time the molded product image is acquired, and calculate the abnormality occurrence frequency and the abnormality occurrence frequency for each abnormality occurrence position later. . The abnormality occurrence position specifying unit 102 stores the abnormality occurrence frequency and abnormality occurrence frequency calculated for each abnormality occurrence position in the storage unit 104.

比較手段107は、異なる成形条件下等で算出された異常発生回数や異常発生頻度にかかる情報を比較する処理を行う。換言すれば、異なる期間において算出された異常発生位置毎の異常発生回数又は異常発生頻度を相互に比較する処理を行う。これにより、成形条件の変更による影響等を検証しやすくなる。   The comparison unit 107 performs processing for comparing information regarding the number of occurrences of abnormality and the frequency of occurrence of abnormality calculated under different molding conditions. In other words, processing for comparing the number of occurrences of abnormality or the frequency of occurrence of abnormality for each abnormality occurrence position calculated in different periods is performed. Thereby, it becomes easy to verify the influence etc. by the change of molding conditions.

以下、本実施の形態における成形品監視装置100の動作例について説明する。まず、射出成形機が最初の100ショット分の成形を行う。異常発生位置特定手段102は、この100ショット分の成形品について、異常発生位置毎に異常発生回数や異常発生頻度を算出し、記憶手段104がこれらを記憶する。   Hereinafter, an operation example of the molded product monitoring apparatus 100 in the present embodiment will be described. First, the injection molding machine performs molding for the first 100 shots. The abnormality occurrence position specifying means 102 calculates the number of occurrences of abnormality and the frequency of occurrence of abnormality for each abnormality occurrence position for the 100 shots of the molded product, and the storage means 104 stores them.

次に、射出成形機が保圧条件を変更して次の100ショット分の成形を行う。異常発生位置特定手段102は、この100ショット分の成形品についても、異常発生位置毎に異常発生回数や異常発生頻度を算出し、記憶手段104がこれらを記憶する。   Next, the injection molding machine changes the pressure holding condition and performs molding for the next 100 shots. The abnormality occurrence position specifying means 102 also calculates the number of occurrences of abnormality and the frequency of occurrence of abnormality for each abnormality occurrence position for the 100 shots of the molded product, and the storage means 104 stores them.

比較手段107は、記憶手段104から複数の異なる期間における異常発生回数又は異常発生頻度に関する情報を読み出す。この例では、比較手段107は、最初の100ショット分の異常発生回数又は異常発生頻度、及び次の100ショット分の異常発生回数又は異常発生頻度をそれぞれ読み出す。そして比較手段107は、最初の100ショット分の異常発生回数又は異常発生頻度を示すチャート又はグラフと、次の100ショット分の異常発生回数又は異常発生頻度を示すチャート又はグラフとを並べて表示部106に表示させることができる(図6)。これにより、ユーザは、成形条件の変更等による不良発生状況の変化を把握することができる。例えば、最初の100ショット分に比べ、次の100ショット分において異常発生回数や異常発生頻度が低下していれば、保圧条件変更が適切であったと評価できる。さらに、比較手段107は、2つのチャート又はグラフを並べて表示する代わりに、最初の100ショット分の異常発生回数又は異常発生頻度と次の100ショット分の異常発生回数又は異常発生頻度との差分を異常発生位置毎に求め、この差分を図3又は図4のチャート、もしくは図5のグラフのような態様で表示しても良い。   The comparison unit 107 reads information related to the number of occurrences of abnormality or the frequency of occurrence of abnormality in a plurality of different periods from the storage unit 104. In this example, the comparison unit 107 reads out the number of occurrences or frequency of abnormality for the first 100 shots and the number of occurrences or frequency of abnormality for the next 100 shots. The comparison unit 107 displays a chart or graph indicating the number of occurrences or frequency of abnormality for the first 100 shots, and a chart or graph indicating the number of occurrences or frequency of abnormality for the next 100 shots. Can be displayed (FIG. 6). Thereby, the user can grasp | ascertain the change of the defect occurrence condition by the change of molding conditions, etc. For example, if the number of occurrences of abnormality and the frequency of occurrence of abnormality are reduced in the next 100 shots compared to the first 100 shots, it can be evaluated that the pressure holding condition change is appropriate. Furthermore, instead of displaying the two charts or graphs side by side, the comparison means 107 calculates the difference between the number of occurrences of abnormality or the frequency of occurrence of abnormality for the first 100 shots and the number of occurrences of abnormality or the occurrence of abnormality for the next 100 shots. The difference may be obtained for each abnormality occurrence position, and the difference may be displayed in the form shown in the chart of FIG. 3 or FIG. 4 or the graph of FIG.

なお、本実施の形態は上述の例に限定されるものでなく、比較手段107は、例えば最初に1時間成形を行って得られた異常発生回数又は異常発生頻度と、次の1時間の成形で得られた異常発生回数又は異常発生頻度とを並べて表示するなどしても良い。すなわち、比較手段107は任意に定義された複数の異なる期間における異常発生回数又は異常発生頻度を比較する。   Note that the present embodiment is not limited to the above-described example, and the comparison means 107, for example, the abnormality occurrence frequency or abnormality occurrence frequency obtained by first performing the molding for one hour and the molding for the next hour. The number of occurrences of abnormality or the frequency of occurrence of abnormality obtained in (1) may be displayed side by side. That is, the comparison unit 107 compares the number of occurrences of abnormality or the frequency of occurrence of abnormality in a plurality of arbitrarily defined different periods.

本実施の形態によれば、成形品監視装置100は、複数の成形品の異常発生位置を統計的に処理することにより、成形不良の発生傾向を把握することができる。具体的には、異常発生位置毎に異常発生回数や異常発生頻度を算出することができる。これにより、例えば、成形品の末端位置の異常発生回数や異常発生頻度が高ければ、ユーザは、この不良現象が突発的なものではなく潜在的に保圧条件に問題があると推測することができるようになる。さらに、成形品監視装置100は、異なる成形条件下等で算出された異常発生回数や異常発生頻度にかかる情報を並べて表示する。これにより、ユーザは、成形条件の変更による影響等を容易に検証することができる。   According to the present embodiment, the molded product monitoring apparatus 100 can grasp the occurrence tendency of molding defects by statistically processing the abnormality occurrence positions of a plurality of molded products. Specifically, the number of occurrences of abnormality and the frequency of occurrence of abnormality can be calculated for each abnormality occurrence position. Thereby, for example, if the number of occurrences of abnormalities and the frequency of occurrences of abnormalities at the end position of the molded product is high, the user may speculate that this defect phenomenon is not sudden and there is a potential problem with the pressure holding conditions. become able to. Further, the molded product monitoring apparatus 100 displays information related to the number of occurrences of abnormality and the frequency of occurrence of abnormality calculated side by side under different molding conditions. Thereby, the user can verify easily the influence etc. by the change of molding conditions.

<実施の形態2>
実施の形態2にかかる成形品監視装置100は、射出成形機で検出された物理量(例えば、ピーク射出圧、最小クッション量、計量時間、成形品重量、成形品寸法等)を、成形品の異常発生位置とともに記憶する点に特徴を有する。以下、本実施の形態における成形品監視装置100の動作例について説明する。
<Embodiment 2>
The molded product monitoring apparatus 100 according to the second embodiment uses a physical quantity (for example, peak injection pressure, minimum cushion amount, measurement time, molded product weight, molded product size, etc.) detected by an injection molding machine to detect abnormalities in the molded product. It has a feature in that it is stored together with the generation position. Hereinafter, an operation example of the molded product monitoring apparatus 100 in the present embodiment will be described.

実施の形態2にかかる成形品監視装置100は、物理量取得手段105を有する。その他の構成要素については、実施の形態1及び2と同様である。   The molded product monitoring apparatus 100 according to the second embodiment includes a physical quantity acquisition unit 105. Other components are the same as those in the first and second embodiments.

物理量取得手段105は、射出成形機から、成形品を成形した際の物理量(例えば、ピーク射出圧、最小クッション量、計量時間、射出速度、樹脂温度等)を取得する。又は、所定の成形サイクル数毎に上記物理量を取得することとしても良い。また、図示しない検査機から、成形品にかかる物理量(例えば、成形品重量、成形品寸法等)を取得しても良い。   The physical quantity acquisition unit 105 acquires physical quantities (for example, peak injection pressure, minimum cushion amount, measurement time, injection speed, resin temperature, etc.) when the molded product is molded from the injection molding machine. Alternatively, the physical quantity may be acquired for each predetermined number of molding cycles. Moreover, you may acquire the physical quantity concerning a molded product (for example, molded product weight, molded product dimension, etc.) from the inspection machine which is not illustrated.

異常発生位置特定手段102は、成形品の異常発生位置と、物理量取得手段105が取得した物理量とを組にして記憶手段104に格納する。図7に、本実施の形態の成形品監視装置100が記憶手段に格納するデータの一例を示す。ここでは、物理量である「ピーク圧力」「最小クッション量」「計量時間」と、格子状領域毎の異常発生の有無(OK=異常なし、NG=異常あり)を示す「画像(1,1)」乃至「画像(10,10)」とが対応付けて格納されている。   The abnormality occurrence position specifying unit 102 stores the abnormality occurrence position of the molded product and the physical quantity acquired by the physical quantity acquisition unit 105 in the storage unit 104 as a set. FIG. 7 shows an example of data stored in the storage means by the molded product monitoring apparatus 100 of the present embodiment. Here, “Peak Pressure”, “Minimum Cushion Amount”, “Measuring Time” which are physical quantities, and the presence / absence of occurrence of abnormality for each grid area (OK = no abnormality, NG = abnormal) “Image (1, 1)” ”To“ image (10, 10) ”are stored in association with each other.

本実施の形態によれば、射出成形機の物理量と異常発生位置との関係が明確になるので、成形不良対策をさらに容易ならしめることができる。具体的には、前記の記憶手段104に格納された成形品の異常位置と物理量の組の中から、所定の物理量が所定範囲を超えた成形サイクルと所定範囲内の成形サイクルとを抽出し、それぞれ異常発生位置毎に異常発生回数や異常発生頻度を算出、記憶する。そして、成形品監視装置100は、所定の物理量が所定範囲を超えた成形サイクルの異常発生回数又は異常発生頻度を示すチャート又はグラフと、所定範囲内の成形サイクルの異常発生回数又は異常発生頻度を示すチャート又はグラフとを並べて表示すれば、物理量が所定範囲か否かで、異常発生位置がどのように変化するかを容易に把握することができる。   According to the present embodiment, since the relationship between the physical quantity of the injection molding machine and the abnormality occurrence position is clarified, it is possible to further facilitate the countermeasure against molding defects. Specifically, a molding cycle in which a predetermined physical quantity exceeds a predetermined range and a molding cycle within a predetermined range are extracted from a set of abnormal positions and physical quantities of the molded product stored in the storage unit 104. The number of occurrences of abnormality and the frequency of occurrence of abnormality are calculated and stored for each abnormality occurrence position. Then, the molded product monitoring apparatus 100 displays the chart or graph indicating the number of occurrences of abnormality or the frequency of occurrence of abnormality in the molding cycle in which the predetermined physical quantity exceeds the predetermined range, and the number of occurrences of abnormality or the frequency of occurrence of abnormality in the molding cycle within the predetermined range. If the chart or graph shown is displayed side by side, it is possible to easily grasp how the abnormality occurrence position changes depending on whether or not the physical quantity is within a predetermined range.

なお、本発明は上記実施の形態に限られたものではなく、趣旨を逸脱しない範囲で、構成要素の置換、省略、付加、順序の入れ替え等の変更を施すことが可能である。   Note that the present invention is not limited to the above-described embodiment, and changes such as replacement, omission, addition, and rearrangement of constituent elements can be made without departing from the spirit of the present invention.

100 成形品監視装置
101 成形品画像取得手段
102 異常発生位置特定手段
104 記憶手段
105 物理量取得手段
106 表示手段
107 比較手段
DESCRIPTION OF SYMBOLS 100 Molded article monitoring apparatus 101 Molded product image acquisition means 102 Abnormality generation position specification means 104 Storage means 105 Physical quantity acquisition means 106 Display means 107 Comparison means

Claims (11)

射出成形機で成形された成形品の画像を取得する成形品画像取得手段と、
前記画像に基づいて前記成形品に異常があるか否かを判別し、異常がある場合には異常発生位置を特定する異常発生位置特定手段と、を備える成形品監視装置において、
前記成形品画像取得手段は、少なくとも2個以上の前記成形品の前記画像を取得し、
前記異常発生位置特定手段は、前記異常発生位置毎に異常発生回数又は異常発生頻度のうち少なくともいずれか一方を算出し、
複数の異なる期間の、前記異常発生位置毎の前記異常発生回数又は前記異常発生頻度を示すグラフを並べて生成する比較手段を有することを特徴とする
成形品監視装置。
Molded product image acquisition means for acquiring an image of a molded product molded by an injection molding machine;
In the molded product monitoring device comprising: an abnormality occurrence position specifying means for determining whether or not there is an abnormality in the molded product based on the image, and specifying the abnormality occurrence position when there is an abnormality.
The molded product image acquisition means acquires the images of at least two or more molded products,
The abnormality occurrence position specifying means calculates at least one of the number of occurrences of abnormality and the frequency of occurrence of abnormality for each abnormality occurrence position,
A molded product monitoring apparatus, comprising: a comparison unit configured to generate a graph indicating the number of occurrences of abnormality or the frequency of occurrence of abnormality for each abnormality occurrence position in a plurality of different periods.
前記異常発生位置特定手段は、前記グラフに代えて、前記異なる期間毎に、前記異常発生位置を示す平面上に、前記異常発生位置毎の前記異常発生回数又は前記異常発生頻度を示す数値を表示手段に表示させることを特徴とする
請求項1記載の成形品監視装置。
The abnormality occurrence position specifying means displays , instead of the graph, a numerical value indicating the abnormality occurrence frequency or the abnormality occurrence frequency for each abnormality occurrence position on a plane indicating the abnormality occurrence position for each different period. The molded product monitoring apparatus according to claim 1, wherein the molded product monitoring device is displayed on a means.
前記異常発生位置特定手段は、前記異なる期間毎に、前記異常発生位置を示す平面と、前記異常発生位置毎の前記異常発生回数又は前記異常発生頻度を示す軸とを含む空間内に3次元グラフを表示手段に表示させることを特徴とする
請求項1記載の成形品監視装置。
The abnormality occurrence position specifying means is a three-dimensional graph in a space including a plane indicating the abnormality occurrence position and an axis indicating the number of occurrences of abnormality or the frequency of occurrence of abnormality for each abnormality occurrence position for each different period. Is displayed on the display means. The molded article monitoring apparatus according to claim 1, wherein:
前記比較手段は、前記グラフに代えて、前記異なる期間間における前記異常発生回数又は異常発生頻度の差分を異常発生位置毎に求め、前記異常発生位置を示す平面上に、前記差分を示す数値を表示手段に表示させることを特徴とする
請求項1記載の成形品監視装置。
The comparison means obtains a difference between the number of occurrences of abnormality or the frequency of occurrence of abnormality between the different periods instead of the graph for each abnormality occurrence position , and sets a numerical value indicating the difference on a plane indicating the abnormality occurrence position. The molded article monitoring apparatus according to claim 1, wherein the molded article monitoring apparatus displays the information on display means.
前記比較手段は、前記異なる期間間における前記異常発生回数又は異常発生頻度の差分を異常発生位置毎に求め、前記異常発生位置を示す平面と、前記差分を示す軸とを含む空間内に3次元グラフを表示手段に表示させることを特徴とする
請求項1記載の成形品監視装置。
The comparison means obtains a difference between the number of occurrences of abnormality or the frequency of occurrence of abnormality between the different periods for each abnormality occurrence position, and three-dimensionally in a space including a plane indicating the abnormality occurrence position and an axis indicating the difference The molded article monitoring apparatus according to claim 1, wherein a graph is displayed on the display means.
前記異なる期間は、所定の成形サイクル数を成形した期間、又は所定の時間であることを特徴とする
請求項1記載の成形品監視装置。
The molded product monitoring apparatus according to claim 1, wherein the different period is a period in which a predetermined number of molding cycles is molded or a predetermined time.
前記射出成形機の物理量を前記成形サイクル毎に取得する物理量取得手段を備え、
前記異常発生位置特定手段は、前記物理量と前記異常発生位置を対応付けて記憶手段に記憶させることを特徴とする
請求項1記載の成形品監視装置。
A physical quantity acquisition means for acquiring a physical quantity of the injection molding machine for each molding cycle;
The molded article monitoring apparatus according to claim 1, wherein the abnormality occurrence position specifying unit stores the physical quantity and the abnormality occurrence position in association with each other in a storage unit.
前記成形品の物理量を前記成形サイクル毎に取得する物理量取得手段を備え、
前記異常発生位置特定手段は、前記物理量と前記異常発生位置を対応付けて記憶手段に記憶させることを特徴とする
請求項1記載の成形品監視装置。
Physical quantity acquisition means for acquiring the physical quantity of the molded product for each molding cycle;
The molded article monitoring apparatus according to claim 1, wherein the abnormality occurrence position specifying unit stores the physical quantity and the abnormality occurrence position in association with each other in a storage unit.
前記異常発生位置特定手段は、前記物理量が所定範囲内の場合と所定範囲外の場合において算出された前記異常発生位置毎の前記異常発生回数又は前記異常発生頻度のうち少なくともいずれか一方を、前記所定範囲内の場合と前記所定範囲外の場合とで前記表示手段に表示させることを特徴とする
請求項又は記載の成形品監視装置。
The abnormality occurrence position specifying means is configured to calculate at least one of the abnormality occurrence frequency and the abnormality occurrence frequency for each abnormality occurrence position calculated when the physical quantity is within a predetermined range and outside the predetermined range, The molded article monitoring apparatus according to claim 7 or 8 , wherein the display means displays the case within a predetermined range and the case outside the predetermined range.
前記異常発生位置特定手段は、成形品の異常の判別の基準となる基準成形品画像を予め記憶しておき、前記基準成形品画像と前記画像とを比較することにより前記成形品に異常があるか否かを判定することを特徴とする
請求項1記載の成形品監視装置。
The abnormality occurrence position specifying means stores in advance a reference molded product image that is a reference for determining abnormality of the molded product, and the molded product has an abnormality by comparing the reference molded product image with the image. The molded article monitoring apparatus according to claim 1, wherein it is determined whether or not.
前記基準成形品画像は、前記成形品画像取得手段によって予め取得されることを特徴とする
請求項10記載の成形品監視装置。
The molded product monitoring apparatus according to claim 10, wherein the reference molded product image is acquired in advance by the molded product image acquisition unit.
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