JP6439532B2 - Inspection control device, inspection device, and inspection method - Google Patents

Description

  The present invention relates to an inspection technique for a wiring board and the like, and more particularly to a technique for improving an inspection speed.

  In the production process of printed circuit boards and the like, SMT (Surface Mounting Technology) is often used as a technology for mounting electronic components such as semiconductor devices on a substrate. In SMT, an electronic component such as a semiconductor device is placed on a substrate, and the electronic component and a terminal on the surface of the substrate are connected by solder, whereby the electronic component such as a semiconductor device is connected and fixed to the substrate.

  When a semiconductor device or the like is mounted on an electronic board such as a printed board, the shape of the solder in the connecting portion, the presence or absence of voids in the solder, the state of the land on the board, and the like greatly affect the reliability of the printed board. For this reason, in order to maintain the reliability of a printed circuit board or the like, it is necessary to suppress as much as possible the abnormality of the connection portion and the generation of voids inside the solder. However, since it is impossible to avoid the occurrence of defects in production processes, etc., after soldering electronic components to the printed circuit board by the reflow process, it is checked whether there are any abnormalities in the vicinity of the connection part or whether voids have occurred by inspection. Often.

  In order to perform such an inspection in the production process, it is desirable that the inspection accuracy be as high as possible in order not to cause an abnormal product to flow out. On the other hand, it is also required that the inspection be completed in as short a time as possible so that the inspection for the presence or absence of abnormality is not rate-limiting in the production process.

  When an electronic component is mounted on a printed circuit board by SMT, the solder connection portion exists between the electronic component and the substrate and cannot be directly inspected from the surface by visual observation or image analysis. Therefore, in an inspection of a printed circuit board manufactured by SMT, an X-ray inspection apparatus that performs inspection by irradiating the printed circuit board with X-rays and capturing an X-ray image transmitted through the inspection target part is often used. In the X-ray inspection apparatus, the X-ray image transmitted through the solder portion can be analyzed to confirm the presence or absence of a void in the solder, such as an abnormality in the connecting portion such as a solder shape abnormality.

  On the other hand, electronic components are often mounted on both sides of a printed circuit board in order to cope with high performance and downsizing of information processing apparatuses and communication apparatuses. When electronic components are mounted on both sides of the substrate, the electronic components may be mounted at substantially the same position on both sides of the substrate. When an X-ray inspection is performed when electronic components are mounted at the same position on both sides of the substrate, an X-ray transmission image is acquired as data in which the X-rays pass through both the connection portions of the two electronic components to the substrate. The For this reason, when there is an abnormality in the vicinity of the connection part with one electronic component, the transmission image overlaps with the other electronic component, and the abnormality may not be detected. Therefore, in order to improve the inspection accuracy, it is necessary to be able to inspect without overlooking an abnormality even if the substrate has electronic components mounted on substantially the same positions on both sides of the substrate. As such a technique that can be inspected even on a board on which electronic components are mounted at substantially the same position on both sides of the board, for example, a technique as disclosed in Patent Document 1 is disclosed.

  Patent Document 1 relates to an X-ray inspection apparatus including an X generator, an X-ray detector, and an X-ray generator positioning device. The X-ray inspection apparatus of Patent Document 1 irradiates a substrate to be inspected from an X-ray generator with X-rays, and detects X-rays transmitted through the substrate with an X-ray detector. In the X-ray generator of Patent Document 1, the tilt angle θ with respect to the X-ray detector is variable. The positioning device controls the X generator so that the inclination angle θ is determined and the determined θ is obtained. The positioning device determines the inclination angle θ so that the connection portion to be inspected on the substrate does not overlap with an object that interferes with the X-ray inspection. In Patent Document 1, it is said that the X-ray inspection of the joint portion can be reliably performed even when an object that hinders the inspection exists on the substrate by adopting such a configuration.

  Patent Document 2 also discloses an X-ray inspection apparatus that inspects a solder connection portion between a substrate and a component mounted on the substrate. The X-ray inspection apparatus of Patent Document 2 includes an X-ray source, an X-ray detector, and a substrate support unit that horizontally holds a substrate to be inspected between the X-ray source and the X-ray detector. In the X-ray inspection apparatus of Patent Document 2, the positions of the X-ray source and the X-ray detector are set so that X-rays are irradiated to the inspection target substrate from an oblique direction with respect to the vertical direction. In Patent Document 2, even when components are mounted at substantially the same position on both sides of the substrate by irradiating the substrate to be inspected with X-rays from an oblique direction, the projected image of the component with the X-ray detector is obtained. It is said that inspection is possible because it is in a different position. According to Patent Document 2, it is possible to ensure the inspection accuracy of the solder connection portion by adopting such a configuration.

JP 2002-189002 A JP 2009-115462 A

  However, the technique of Patent Document 1 is not sufficient in the following points. In patent document 1, the angle with respect to the X-ray detector of an X-ray generator is determined so that the influence of an obstruction may be suppressed with respect to a test object. However, in an actual printed circuit board or the like, a large number of components are mounted on both sides of the substrate, and there are a large number of connection portions between the substrate to be inspected and the components. Further, the size of each component and the overlapping width between components on both sides of the substrate are different. Therefore, in order to accurately inspect the vicinity of the connection portion between each component and the board, it is necessary to inspect while changing the setting in order by setting the optimum angle for each component or the vicinity of the connection portion. Therefore, it takes a long time to inspect one substrate, and the inspection process may become a rate-limiting step in the production process.

  Similarly, in Patent Document 2, since an inspection with high accuracy cannot be performed unless an optimum angle is set according to the size and overlap width of components, the time required for the inspection becomes longer with a substrate on which a large number of components are mounted on both sides. . Therefore, the techniques of Patent Document 1 and Patent Document 2 are techniques for inspecting a substrate by reducing the time required for inspection while maintaining inspection accuracy in a printed circuit board or the like in which components are mounted on both sides of the substrate. Not enough.

  An object of the present invention is to obtain an inspection control apparatus capable of inspecting a substrate while reducing inspection time while maintaining inspection accuracy.

  In order to solve the above-described problem, the inspection control apparatus of the present invention includes a part information storage unit, a setting calculation unit, a group generation unit, an order determination unit, and an imaging control unit. The component information storage means stores component information including information on the sizes of components mounted on both sides of the substrate to be inspected and information on the position of the connection portion between the substrate and the component. The setting calculation means images the X-ray irradiation angle when irradiating the substrate with the X-ray from the X-ray generator for each predetermined area in the vicinity of the connection portion between the component mounted on both sides of the substrate and the substrate. It is calculated based on component information as a condition. The group generation unit forms a group for each predetermined region in which the imaging conditions calculated by the setting calculation unit can be regarded as substantially the same. The order determining means determines the order of groups to be imaged according to a predetermined standard so that the time required for imaging a plurality of groups is shortened. The imaging control means sets the X-ray generator and the X-ray detector so as to satisfy the imaging conditions for each group based on the order of the groups determined by the order determination means when imaging the X-ray image transmitted through the substrate. Control.

  The inspection method of the present invention extracts component information including information on the sizes of components mounted on both surfaces of a substrate to be inspected and information on the position of a connection portion between the substrate and the component. According to the inspection method of the present invention, the X-ray irradiation angle at the time of irradiating the substrate with the X-ray is determined for each predetermined area near the connection portion between the component mounted on both sides of the substrate and the substrate. The calculation is performed based on the component information as the imaging condition. In the inspection method of the present invention, a group is formed for each predetermined region in which the imaging conditions can be regarded as substantially the same. In the inspection method of the present invention, the order of groups to be imaged is determined based on a predetermined reference so that the time required for imaging a plurality of groups is shortened. The inspection method of the present invention controls the X-ray generator and the X-ray detector so as to satisfy the imaging conditions for each group based on the determined order of groups when capturing an X-ray image transmitted through the substrate. .

  According to the present invention, it is possible to perform inspection of a substrate while maintaining inspection accuracy and shortening the time required for inspection.

It is a figure which shows the outline | summary of a structure of the 1st Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 2nd Embodiment of this invention. It is the figure which showed typically the motion of the X-ray source at the time of the test | inspection in the 2nd Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the test | inspection control apparatus of the 2nd Embodiment of this invention. It is a figure which shows the outline | summary of the operation | movement flow in the 2nd Embodiment of this invention. It is the figure which showed typically the relationship between the test | inspection apparatus and test object in the 2nd Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 3rd Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the test | inspection control apparatus of the 3rd Embodiment of this invention. It is a figure which shows the outline | summary of the operation | movement flow in the 3rd Embodiment of this invention.

(First embodiment)
A first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows an outline of the configuration of the inspection control apparatus of this embodiment. The inspection control apparatus according to the present embodiment includes a part information storage unit 1, a setting calculation unit 2, a group generation unit 3, an order determination unit 4, and an imaging control unit 5.

  The component information storage unit 1 stores component information including information on the sizes of components mounted on both sides of the substrate to be inspected and information on the position of the connection portion between the substrate and the component. The setting calculation means 2 determines the X-ray irradiation angle when irradiating the substrate with the X-ray from the X-ray generator for each predetermined region near the connection portion between the component mounted on both sides of the substrate and the substrate. Calculation is performed based on component information as an imaging condition. The group generation unit 3 forms a group for each predetermined region in which the imaging conditions calculated by the setting calculation unit 2 can be regarded as substantially the same. The order determining means 4 determines the order of groups to be imaged according to a predetermined standard so that the time required for imaging a plurality of groups is shortened. The imaging control means 5 detects the X-ray generator and the X-ray detection so that the imaging conditions for each group are satisfied based on the order of the groups determined by the order determination means 4 when imaging the X-ray image transmitted through the substrate. Control the instrument.

  In the inspection control apparatus of the present embodiment, the X-ray irradiation angle when the X-ray detector emits X-rays is used to connect the component and the substrate mounted on both sides of the substrate by the setting calculation means 2 based on the component information. It is calculated as an imaging condition for each predetermined area near the part. In this way, by controlling the X-ray generator or the like to the imaging conditions calculated based on the component information including the position information of the connection portion between the board and the component, the vicinity of the connection portion between the substrate and the components on both sides of the substrate It is possible to avoid a state in which the images of the images completely overlap. Therefore, in the inspection control apparatus according to the present embodiment, it is possible to easily check whether there is an abnormality for each predetermined region near the connection portion between the board and the component based on the X-ray image.

  Further, in the inspection control apparatus of the present embodiment, the group generation unit 3 forms a group for each component having substantially the same imaging conditions, and the order determination unit 4 shortens the time required for imaging the imaging order for each group. It has been decided to become. The imaging control unit 5 controls the imaging for each group having the same imaging condition according to the order determined by the order determination unit 4, so that the imaging of all the predetermined areas is performed rather than the imaging for each predetermined area. The time required can be suppressed. As described above, in the inspection control apparatus of the present embodiment, an X-ray image is obtained by suppressing the time required for imaging while maintaining the detection accuracy of the presence / absence of abnormality even on a board in which components are overlapped on both sides of the board. Can be obtained. As a result, the inspection control apparatus of the present embodiment can inspect the substrate while reducing the time required for the inspection while maintaining the inspection accuracy.

(Second Embodiment)
A second embodiment of the present invention will be described in detail with reference to the drawings. FIG. 2 shows an outline of the configuration of the X-ray inspection apparatus of the present embodiment. The X-ray inspection apparatus according to this embodiment includes an X-ray source 11, an X-ray detector 12, a substrate holding unit 13, and an inspection control unit 14.

  The X-ray inspection apparatus according to the present embodiment is an apparatus that captures and inspects a transmission X-ray image of a substrate 15 such as a printed circuit board on which components such as a semiconductor device are mounted on both sides. The X-ray inspection apparatus of the present embodiment captures an X-ray image of the substrate 15 based on the laminography method. The imaging method may be performed by a method other than the laminography method. As another imaging method, for example, a CT (Computed Tomography) method can be used.

  FIG. 3 is a diagram schematically showing the operation of the apparatus when the substrate is inspected by the X-ray inspection apparatus of the present embodiment. In FIG. 3, the component A and the component B are connected and fixed to the substrate 15 by solder and mounted at substantially the same positions on both sides of the substrate 15. X-rays emitted from the X-ray source 11 toward the substrate 15 to be inspected are detected by an X-ray detector 12 that is a detector.

  In the leftmost drawing of FIG. 3, X-rays are irradiated from almost directly above the parts A and B, so the transmission image of the part A and the transmission image of the part B at the position of the X-ray detector 12 overlap. Yes. Therefore, the X-ray image generated based on the X-rays detected by the X-ray detector 12 is an image in which the transmission images of the parts A and B overlap. Therefore, in the state of the leftmost diagram of FIG. 3, even if there is an abnormality near the connection portion between the component A or the component B and the substrate, the connection portion between the component A or the component B and the substrate from the X-ray transmission image. It is difficult to determine the presence of nearby abnormalities.

  On the other hand, when the X-ray source 11 is rotated and X-rays are irradiated as shown in the center or right side of FIG. 3, the transmitted images of the parts A and B in the X-ray detector 12 are formed at different positions. The Therefore, when X-rays are irradiated as shown in the center or right side of FIG. 3, the parts A and B are located at different positions in the X-ray image based on the X-ray intensity detected by the X-ray detector 12. Goodbye Therefore, it is possible to determine whether there is an abnormality near the connection portion between the component A or the component B and the board based on the X-ray image.

  The configuration of the X-ray inspection apparatus of this embodiment will be described in detail. The X-ray source 11 has a function of irradiating X-rays necessary for substrate inspection. The X-ray source 11 includes an X-ray tube that generates and outputs X-rays irradiated to a substrate to be inspected as an X-ray generator. The X-ray tube of the X-ray source 11 that is an X-ray generator irradiates a substrate or the like to be inspected with X-rays based on a control signal sent from the inspection control unit 14 as an X-ray source control signal S1. . Further, the X-ray tube of the X-ray source 11 of the present embodiment is rotated and changed in position based on the X-ray source control signal S1 sent from the inspection control unit 14 to irradiate the inspection target with X-rays. Change the angle. Even if the X-ray irradiation angle or irradiation position is changed, the inspection control unit 14 can be moved in the X-axis or Y-axis direction, that is, in the horizontal direction with respect to the inspection target surface, in addition to the rotation. Good. Alternatively, the X-ray source 11 may be fixed, and the substrate holding unit 13 and the X-ray detector 12 may be moved to change the X-ray irradiation angle with respect to the inspection target substrate 15.

  The X-ray detector 12 has a function of detecting X-rays emitted from the X-ray source 11 and transmitted through the substrate. The X-ray detector 12 detects the intensity of X-rays irradiated from the X-ray source 11 and transmitted through the substrate. The X-ray detector 12 detects an X-ray by, for example, an FPD (Flat Panel Detector) and converts it into an electric signal. The X-ray detector 12 operates based on a control signal sent from the inspection control unit 14 as a detector control signal S2. The X-ray detector 12 sends the detected X-ray intensity data to the inspection control unit 14 as a detection data signal S3. The X-ray detector 12 of this embodiment includes a movable mechanism in the substrate horizontal direction, and the relative positional relationship between the X-ray source 11 and the substrate 15 to be inspected is controlled by the inspection control unit 14. The X-ray detector 12 may be movable in the vertical direction or may be fixed.

  The substrate holding unit 13 has a function of holding a substrate to be inspected. The substrate holding unit 13 holds a substrate to be inspected between the X-ray source 11 and the X-ray detector 12. For example, when the FPD is used as the X-ray detector 12, the substrate holding unit 13 holds the substrate so that the substrate is horizontal with respect to the detection surface of the X-ray detector 12. The substrate holder 13 is designed so as not to absorb X-rays transmitted through the substrate in the region to be inspected. Further, the inspection holding unit 13 may be configured such that the substrate to be inspected can be automatically set or replaced by a transport device or the like. Further, the inspection holding unit 13 may be configured to move based on a control signal from the inspection control device 14. 2 and 3, the horizontal plane of the substrate 15 is held in the horizontal direction in the figure, but the apparatus configuration may be such that the horizontal plane of the substrate 15 is set in another direction such as the vertical direction. .

  The configuration of the inspection control unit 14 will be described. FIG. 4 is a diagram showing an outline of the configuration of the inspection control unit 14 of the present embodiment. As shown in FIG. 4, the inspection control unit 14 includes a mounting interference check unit 21, a mounting information storage unit 22, a component information storage unit 23, an imaging condition determination unit 24, an imaging group generation unit 25, and an imaging control unit. 26, an image acquisition unit 27, and an image storage unit 28.

  The mounting interference check unit 21 has a function of determining the presence or absence of interference such as overlapping of components on the board to be inspected. When the mounting interference check unit 21 receives a signal requesting component information from the imaging control unit 26 as the information request signal S21, the mounting interference check unit 21 refers to the mounting information storage unit 22 and the components mounted on the board to be inspected and the positions of the components. Get information about. The information on the position of the component includes position information on a predetermined area near the connection portion between the board and the component. In the present embodiment, the predetermined area near the connection portion between the substrate and the component refers to a portion where a land is formed as a connection portion between the component. The predetermined region in the vicinity of the connection portion may be a location other than the land on the substrate. Further, the mounting interference check unit 21 refers to the component information storage unit 23 and acquires information on the size of each component.

  The mounting interference check unit 21 confirms whether or not there is interference due to the overlap with the component on the opposite side of the board for each component based on the information on the component, the position of the component, and the size of the component, and generates a list of overlapping components. To do. When the mounting interference check unit 21 generates a list of overlapping components, the mounting interference check unit 21 sends information on the confirmation result to the imaging condition determination unit 24 as a component information signal S22. The information of the confirmation result is configured by the position of the component and the presence / absence of overlap. The function of the mounting interference check unit 21 of the present embodiment corresponds to the component information acquisition unit 1 of the first embodiment.

  The mounting information storage unit 22 has a function of storing information on the components mounted on the substrate to be inspected and the positions of the components. The mounting information storage unit 22 stores information on the parts used on the board to be inspected and the positions of the parts. The mounting information storage unit 22 stores, for example, information on components mounted on the substrate and information on the positions of the components as CAD (Computer Aided Design) data used for designing the substrate. Further, the mounting information storage unit 22 may be configured to receive information on the parts of the board to be inspected and the position of the parts from a data server or the like via a network.

  The component information storage unit 23 has a function of storing information on components mounted on the board. The component information storage unit 23 stores information such as a component used on each board to be inspected and the size of the component. The component information storage unit 23 stores, for example, information on a component and its size as a BOM (Bill of materials). The component information storage unit 23 may store not only the components actually mounted on the board to be inspected but also information on the components that may be used on the board. In addition, the component information storage unit 23 may be configured to receive information on components and component sizes from a data server or the like via a network.

  The imaging condition determination unit 24 has a function of calculating an X-ray irradiation angle for inspecting the substrate 15 and calculating an arrangement position of the X-ray source 11 and the X-ray detector 12. The imaging condition determination unit 24 obtains an X-ray image of a predetermined area near the connection portion between the board and the component based on the position and size information of the component sent from the mounting interference check unit 21 as the component information signal S22. An X-ray irradiation angle at the time of imaging is calculated. The imaging condition determination unit 24 calculates information on the arrangement positions of the X-ray source 11 and the X-ray detector 12 based on the calculated X-ray irradiation angle. The imaging condition determination unit 24 calculates the arrangement positions of the X-ray source 11 and the X-ray detector 12 for each predetermined region to be inspected, that is, for each land. The X-ray irradiation angle at the time of imaging a predetermined area and the arrangement positions of the X-ray source 11 and the X-ray detector 12 are referred to as imaging conditions in the following description. When the imaging condition determination unit 24 calculates the imaging condition, the imaging condition determination unit 24 sends information on the imaging condition for each land to the imaging group generation unit 25 as the imaging condition signal S23. The function of the imaging condition determination unit 24 of the present embodiment corresponds to the setting calculation unit 2 of the first embodiment.

  The imaging group generation unit 25 has a function of classifying a predetermined area in the vicinity of the connection portion between the board and the component for each group having the same imaging condition. The imaging group generation unit 25 generates a group for each land that can be measured under the same imaging condition based on the imaging condition information of each land received from the imaging condition determination unit 24. When the imaging group generation unit 25 generates a group, the imaging group generation unit 25 sends the generated group and its imaging conditions to the imaging control unit 26 as an imaging group signal S24. Further, the function of the imaging group generation unit 25 of the present embodiment corresponds to the group generation unit 3 of the first embodiment.

  The imaging control unit 26 has a function of determining the order of imaging based on the imaging conditions for each group received from the imaging group generation unit 25. The imaging control unit 26 has a function of controlling the X-ray source 11 and the X-ray detector 12 to take an X-ray image for each predetermined area. The imaging control unit 26 determines the order of groups for capturing X-ray images based on the imaging conditions for each group received as the imaging group signal S24 from the imaging group generation unit 25. For example, the imaging control unit 26 determines the order of groups in which imaging is performed so that the operations of the X-ray source 11 and the X-ray detector 12 during the imaging of all groups are minimized. The imaging control unit 26 may determine the order of groups in which imaging is performed so that the operation of either the X-ray source 11 or the X-ray detector 12 is minimized. Further, the imaging control unit 26 may perform imaging from a group having a large number of lands included in the group. When the number of lands to be inspected is large, it is highly likely that it takes time to process the inspection results, so that the entire inspection time can be shortened by acquiring an image first.

  When the imaging control unit 26 determines the order of groups to be imaged, the X-ray source 11 uses a control signal that requests imaging under each imaging condition based on the determined order as an X-ray source control signal S1 and a detector control signal S2. And X-ray detector 12 respectively. The imaging control unit 26 sends a signal requesting collection of imaging data to the image acquisition unit 27 as an image acquisition signal S25. In addition, when receiving information from the image acquisition unit 27 as the image acquisition completion signal S26 when the image pickup control unit 26 receives information indicating that an image has been collected under one image pickup condition, the image pickup control unit 26 performs image pickup under the next image pickup condition. Control each site. The functions of the imaging control unit 26 of the present embodiment correspond to the order determining unit 4 and the imaging control unit 5 of the first embodiment.

  The image acquisition unit 27 has a function of processing the inspection result based on the intensity data sent from the X-ray detector 12. The image acquisition unit 25 generates X-ray image data based on the intensity data transmitted from the X-ray detector 12 as the detection data signal S3. When the X-ray image data is generated, the image acquisition unit 27 stores the generated X-ray image data in the image storage unit 28. The image acquisition unit 27 starts collection and storage of X-ray image data based on a control signal transmitted from the imaging control unit 26 as the image acquisition request signal S25. Further, when the acquisition and storage of the X-ray image data under one imaging condition is completed, the image acquisition unit 27 outputs an image acquisition completion signal S26 indicating that the acquisition of the X-ray image data is completed. Send to.

  The image acquisition unit 27 may have a function of determining whether there is an abnormality based on X-ray image data. For example, when there is a sharp intensity change compared to a normal state, the image acquisition unit 27 determines that a defect such as a void has occurred in the solder formed on the land.

  The image storage unit 28 has a function of storing X-ray image data of a substrate imaged with X-rays. The image storage unit 28 stores the X-ray image data sent from the image acquisition unit 27. The image storage unit 28 may output X-ray image data and inspection result information based on a request from another information device or a production management system.

  The operation of the X-ray inspection apparatus of this embodiment will be described. FIG. 5 shows an outline of a flow when performing substrate inspection in the X-ray inspection apparatus of the present embodiment.

  In response to an inspection request from an operator or a production management system, inspection of the substrate is started. The board inspection request is input to the imaging control unit 26 of the inspection control unit 14. When the inspection of the substrate is started, the imaging control unit 26 of the inspection control unit 14 sends a signal requesting component information together with information on the substrate to be inspected to the mounting interference check unit 21 as an information request signal S21.

  When receiving the information request signal S21 for requesting component information, the mounting interference check unit 21 refers to the mounting information storage unit 22 and acquires information on the components mounted on the board to be inspected and the positions of the components. When the component and component position information is acquired, the mounting interference check unit 21 refers to the component information storage unit 23 and acquires information on the size of the component used in the board to be inspected (step 101).

  When the mounting interference check unit 21 acquires the information on the position and size of the component mounted on the board to be inspected, the mounting interference check unit 21 determines the components mounted on both sides of the board based on the information on the position and size of the component. The presence or absence of interference due to overlap is confirmed (step 102).

  When there is an overlap between components on both sides of the board (Yes in step 103), the mounting interference check unit 21 generates a list of overlapping components (step 104). When the list of overlapping parts is generated, the mounting interference check unit 21 sends information on the overlapping parts, the position and size of the parts to the imaging condition determination unit 24 as a part information signal S22.

  When the imaging condition determination unit 24 receives information such as the position of the component as the component information signal S22, the optimum X-ray source 11 and X-ray detector are detected for each predetermined region near the overlapping component and the board connection portion. 12 are determined (step 105).

  A method for calculating the inclination θ, which is an X-ray irradiation angle, used when determining the arrangement of the X-ray source 11 and the X-ray detector 12 calculated by the imaging condition determination unit 24 will be described with reference to FIG. Assume that the component A is mounted on the X-ray source 11 side of the substrate 15 and the component B is mounted on the X-ray detector 12 side of the substrate 15. At this time, the size of the component A is assumed to be a width W1, a height H1, and a depth D1. The size of the part B is assumed to be a width W2, a height H2, and a depth D2. The sizes of the component A and the component B are values obtained from the BOM and CAD stored in the mounting information storage unit 22 and the component information storage 23. The thickness of the substrate is assumed to be d.

At this time, when the width W1 of the component A is equal to or larger than the width W2 of the component B, that is, when W1 ≧ W2, the inclination θ is θ = tan ⁻¹ ((W1 / 2) / (H1 + d + H2)). When the width W1 of the component A is smaller than the width W2 of the component B, that is, when W1 <W2, the inclination θ is θ = tan ⁻¹ ((W2 / 2) / (H1 + d + H2)).

  When the imaging condition determination unit 24 calculates the imaging condition for a predetermined region, that is, for each land, for the overlapping parts, the imaging condition determination unit 24 sends the calculated imaging condition information to the imaging group generation unit 25 as the imaging condition signal S23. When the imaging group generation unit 25 receives the imaging condition information of the overlapping parts as the imaging condition signal S23, the imaging group generation unit 25 performs grouping for each land having the same imaging condition (step 106). The same imaging conditions in the present embodiment may be substantially the same conditions that can be regarded as the same imaging conditions, and a predetermined range that can be regarded as the same imaging conditions is set in advance.

  When the imaging group generation unit 25 performs grouping for each land having the same imaging condition, the imaging group generation unit 25 sends information on the imaging condition for each group to the imaging control unit 26 as an imaging group signal S24.

  When the imaging control unit 26 receives the imaging condition information for each group as the imaging group signal S24, the imaging control unit 26 determines the order of the groups to be imaged. The imaging control unit 26 determines the imaging order so that the movements of the X-ray source 11 and the X-ray detector 12 are minimized until imaging of all groups is completed. The imaging control unit 26 may determine the imaging order so that the movements of the X-ray source 11 and the X-ray detector 12 for each imaging are reduced. In addition, when determining the order, the imaging control unit 26 also determines the order by adding parts that do not overlap, that is, groups that capture images under normal conditions.

  When the imaging control unit 26 determines the order of imaging, the imaging control unit 26 performs imaging of X-ray images under the imaging conditions of each group according to the determined order (step 107). The imaging control unit 26 uses the control signals indicating the setting conditions for the X-ray source 11 and the X-ray detector 12 as the X-ray source control signal S1 and the detector control signal S2 so that the imaging conditions of the group in which the turn has come. Send each one. In addition, the imaging control unit 26 sends a signal requesting the start of image data collection to the image acquisition unit 27 as an image acquisition request signal S25. Upon receiving the image acquisition request signal S25, the image acquisition unit 27 stands by in a state where it can receive the X-ray detection intensity data transmitted from the X-ray detector 12 as the detection data signal S3.

  The X-ray source 11 and the X-ray detector 12 move to positions according to the X-ray source control signal S1 and the detector control signal S2, respectively. The X-rays emitted from the X-ray source 11 and transmitted through the substrate are converted into X-rays. The detector 12 detects. When detecting the X-ray, the X-ray detector 12 sends X-ray intensity information to the image acquisition unit 27 as a detection data signal S3. When receiving the X-ray intensity information as the detection data signal S3, the image acquisition unit 27 stores the captured X-ray image data in the image storage unit 28.

  The image acquisition unit 27 determines whether there is an abnormality based on the output of the captured X-ray image data or the inspection result, and processes the inspection result (step 108). When the captured X-ray image data is processed, the image acquisition unit 27 sends a signal indicating that the acquisition of the X-ray image data for one condition is completed to the imaging control unit 26 as an image acquisition completion signal S26. Send as.

  Upon receiving the image acquisition completion signal S26, the imaging control unit 26 captures an X-ray image of the next group of imaging conditions. The imaging control unit 26 continues the imaging by repeating the control of the X-ray source 11 and the X-ray detector 12 according to the imaging conditions of the group until the imaging of all groups is completed.

  If there is no overlapping part in step 102 (No in step 103), imaging is performed only under normal conditions (step 109). At that time, the imaging condition determination unit 24 and the imaging group generation unit 25 send information having no overlapping parts to the next unit, and the imaging control unit 26 controls imaging under normal conditions. When imaging is performed under normal conditions, the image acquisition unit 27 processes the inspection result (step 108). The normal condition is a condition in which X-rays are irradiated almost directly above the inspection target.

  In the X-ray inspection apparatus of the present embodiment, the imaging condition determination unit 24 of the inspection control apparatus 14 calculates an imaging condition that does not affect each other when components mounted on the substrate 15 are inspected by X-rays. When the X-ray source 11 irradiates the X-ray from the X-ray source 11, a transmission image of a predetermined region near the connection portion between the component mounted on the substrate and the substrate is displayed in the X-ray detector 12. Imaging conditions are set so as to avoid a state where the transmitted image of the part overlaps. That is, the imaging condition determination unit 24 controls the X-ray source 11 and changes the X-ray irradiation angle when the positions of the components on both sides of the board overlap, An X-ray irradiation angle is calculated so that the transmission images in the detector 12 do not overlap each other. By calculating such conditions and taking a transmission image by X-rays, in the X-ray inspection apparatus of this embodiment, even if there are parts whose positions overlap on the substrate, the presence or absence of voids in the vicinity of the connection portion, etc. Can be confirmed. Therefore, in the X-ray inspection apparatus according to the present embodiment, in inspection of a board on which components are mounted on both sides, a plurality of components do not completely overlap in the X-ray image, and an abnormality occurs in each predetermined area near the connection portion. The presence or absence of can be detected more accurately.

  In the X-ray inspection apparatus according to the present embodiment, the imaging group generation unit 25 of the inspection control apparatus 14 forms a group for each predetermined area having the same imaging condition. In the X-ray inspection apparatus according to the present embodiment, a plurality of components on the board are obtained by performing imaging for each group of the same imaging conditions formed by the imaging group generation unit 25, rather than performing imaging for each predetermined region. The time required for the inspection can be suppressed. In addition, the imaging control unit 26 determines the order of groups in which imaging is performed so that the movement of the X-ray source 11 and the like is minimized. Therefore, the X-ray inspection apparatus according to the present embodiment is highly effective in reducing the time required for inspecting the vicinity of the connection portion between the substrate and the component. In particular, when a large number of lands are to be inspected as a predetermined area near the connecting portion, the effect of shortening the time by performing grouping becomes high. As described above, in the X-ray inspection apparatus of this embodiment, it is possible to inspect the substrate while reducing the time required for inspection while maintaining inspection accuracy.

(Third embodiment)
A third embodiment of the present invention will be described in detail with reference to the drawings. FIG. 7 shows an outline of the configuration of the X-ray inspection apparatus of the present embodiment. When the imaging condition calculated by the imaging condition determination unit is a condition that cannot be set, the X-ray inspection apparatus according to the present embodiment corrects the imaging condition to a settable imaging condition and captures an X-ray image of a component on the board. It is characterized by doing.

  The X-ray inspection apparatus according to this embodiment includes an X-ray source 11, an X-ray detector 12, a substrate holding unit 13, and an inspection control unit 30. The X-ray inspection apparatus of the present embodiment also detects X-rays that are irradiated with X-rays from the X-ray source 11 and transmitted through the substrate 15 by the X-ray detector 12 based on the control of the inspection control unit 30. Take a line image. The configurations and functions of the X-ray source 11, the X-ray detector 12, and the substrate holder 13 are the same as those in the second embodiment. Further, the X-ray source control signal S1, the detector control signal S2, and the detection data signal S3 have the same functions as the signals of the same name in the second embodiment.

  The configuration of the inspection control unit 30 will be described. FIG. 8 is a diagram showing an outline of the configuration of the inspection control unit 30 of the present embodiment. The inspection control unit 30 includes a mounting interference check unit 31, a mounting information storage unit 32, a component information storage unit 33, an imaging condition determination unit 34, an imaging group generation unit 35, an imaging control unit 36, and an image acquisition unit. 37, an image storage unit 38, and an image acquisition determination unit 39. The inspection control unit 30 further includes an alarm generation unit 40.

  The configurations and functions of the mounting interference check unit 31, the mounting information storage unit 32, the component information storage unit 33, the imaging control unit 36, the image acquisition unit 37, and the image storage unit 38 are the same as the parts having the same names in the second embodiment. is there. Further, the information request signal S31, the component information signal S32, the imaging group signal S35, the image acquisition request signal S36, and the image acquisition completion signal S37 have the same functions as the signals having the same names in the second embodiment.

  The imaging condition determination unit 34 has the same function as the imaging condition determination unit 24 of the second embodiment. The imaging condition determination unit 34 sends the calculated imaging condition to the image acquisition determination unit 39 as an imaging condition signal S33.

  The imaging group generation unit 35 has the same function as the imaging group generation unit 25 of the second embodiment. The imaging group generation unit 35 according to the present embodiment receives information on imaging conditions for each predetermined region near the connection part between the board and the component from the image acquisition determination unit 39 as a corrected imaging condition signal S34.

  The image acquisition determination unit 39 has a function of correcting the arrangement positions of the X-ray source 11 and the X-ray detector 12 calculated by the imaging condition determination unit 34, that is, the imaging conditions. The image acquisition determination unit 39 determines whether the X-ray source 11 and the X-ray detector 12 can actually be set at an arrangement position corresponding to the imaging condition received from the imaging condition determination unit 34 as the imaging condition signal S33. to decide. The range of arrangement positions of the X-ray source 11 and the X-ray detector 12 that can be set is stored in advance in the image acquisition determination unit 39 based on the specifications of the X-ray inspection apparatus.

  When the image acquisition determination unit 39 determines that the X-ray source 11 and the X-ray detector 12 cannot actually be set at the arrangement position according to the imaging condition, the imaging acquisition condition is corrected to an imaging condition that can be set. The image acquisition determination unit 39 sets the imaging condition closest to the imaging condition received as the imaging condition signal S33 among the settable imaging conditions as the corrected imaging condition. When the image acquisition condition is corrected, the image acquisition determination unit 39 sends information on the corrected image pickup condition to the image pickup group generation unit 35 as a corrected image pickup condition signal S34.

  In addition, when the X-ray source 11 and the X-ray detector 12 can be set at the arrangement positions according to the imaging conditions, the image acquisition determination unit 39 outputs the information on the imaging conditions without correcting the imaging conditions. The corrected image capturing condition signal S34 is sent to the image capturing group generation unit 35.

  The operation of the X-ray inspection apparatus of this embodiment will be described. FIG. 9 shows an outline of a flow when performing substrate inspection in the X-ray inspection apparatus of the present embodiment.

  In response to an inspection request from an operator or a production management system, inspection of the substrate is started. The substrate inspection request is input to the imaging control unit 36 of the inspection control unit 30. When the inspection is started, the imaging control unit 36 of the inspection control unit 30 sends a signal requesting component information to the mounting interference check unit 31 as information request signal S31 together with information on the board to be inspected.

  When receiving the information request signal S31 for requesting component information, the mounting interference check unit 31 refers to the mounting information storage unit 32 and acquires information on the components mounted on the board to be inspected and the positions of the components. When the component and component position information is acquired, the mounting interference check unit 21 refers to the component information storage unit 33 and acquires information on the size of the component used in the board to be inspected (step 111).

  When the mounting interference check unit 31 acquires the information on the position and size of the component mounted on the board to be inspected, the mounting interference check unit 31 detects the component mounted on both sides of the board based on the information on the position and size of the component. The presence or absence of interference due to the overlap is confirmed (step 112).

  When there is an overlap between the components on both sides of the board (Yes in step 113), the mounting interference check unit 31 generates a list of components with an overlap (step 114). When the overlapping component list is generated, the mounting interference check unit 31 sends the overlapping component, information on the position and size of the component to the imaging condition determination unit 34 as a component information signal S32.

  When the imaging condition determination unit 34 receives information on the position and size of the component as the component information signal S32, the optimal X-ray source 11 and X for each predetermined region, that is, for each land, near the connection portion between the board and the component. The arrangement of the line detector 12 is determined (step 115). The imaging condition determination unit 34 calculates the arrangement of the X-ray source 11 and the X-ray detector 12 as in the second embodiment.

  When the imaging condition determination unit 34 calculates the imaging condition for each predetermined area, that is, for each land, the imaging condition determination unit 34 sends information about the calculated imaging condition to the image acquisition determination unit 39 as an imaging condition signal S33. When receiving the imaging condition signal S33 for each part, the image acquisition determination unit 39 determines whether the imaging condition can be set.

  When the imaging condition includes a condition that cannot be arranged (Yes in step 116), the image acquisition determination unit 39 corrects the imaging condition. The image determination unit 39 corrects the imaging condition to an arrangement position closest to the imaging condition received from the imaging condition determination unit 34 among the settable arrangement positions (step 120). When the image acquisition determination unit 39 corrects the imaging condition, the image acquisition determination unit 39 sends the corrected imaging condition to the imaging group generation unit 35 as a corrected imaging condition signal S34. In addition, when the imaging condition includes a condition that cannot be arranged, the image acquisition determination unit 39 sends information indicating that the condition that cannot be arranged is included to the alarm generation unit 40. When receiving information indicating that the conditions that cannot be arranged are included, the alarm generation unit 40 displays an alarm indicating that the conditions that cannot be arranged are included and outputs the information to the production management system.

  When the imaging group generation unit 35 receives the imaging condition information of the overlapping parts as the corrected imaging condition signal S34, the imaging group generation unit 35 performs grouping for each land having the same imaging condition (step 117). When the imaging group generation unit 35 performs grouping for each land having the same imaging condition, the imaging group generation unit 35 sends information on the imaging condition for each group to the imaging control unit 36 as an imaging group signal S35.

  When the imaging control unit 36 receives information on imaging conditions for each group as the imaging group signal S35, the imaging control unit 36 determines the order of groups to be imaged. The imaging control unit 36 determines the imaging order so that the movements of the X-ray source 11 and the X-ray detector 12 are minimized while imaging all groups of X-ray images. In addition, when determining the order, the imaging control unit 36 also determines the order by adding lands that do not overlap, that is, groups that capture images under normal conditions.

  When the imaging control unit 36 determines the order in which imaging is performed, the imaging control unit 36 performs imaging of X-ray images under the imaging conditions of each group in accordance with the determined order (step 118). The imaging control unit 36 outputs a control signal indicating a setting condition to the X-ray source 11 and the X-ray detector 12 so as to satisfy the imaging condition of the group in which the imaging order has been turned, and the X-ray source control signal S1 and the detector control signal. Each is sent as S2. Further, the imaging control unit 36 sends a signal requesting the start of image data collection to the image acquisition unit 37 as an image acquisition request signal S36. Upon receiving the image acquisition request signal S36, the image acquisition unit 37 stands by in a state where it can receive the X-ray detection intensity data transmitted from the X-ray detector 12 as the detection data signal S3.

  The X-ray source 11 and the X-ray detector 12 move to a position according to the control signal, and the X-ray detector 12 detects X-rays irradiated from the X-ray source 11 and transmitted through the substrate. When detecting the X-ray, the X-ray detector 12 sends information on the intensity of the X-ray to the image acquisition unit 37 as a detection data signal S3. When receiving the X-ray intensity information as the detection data signal S3, the image acquisition unit 37 stores the captured X-ray image data in the image storage unit 38.

  The image acquisition unit 37 determines the presence / absence of an abnormality based on the output of the captured X-ray image data or the inspection result, and processes the inspection result (step 119). When the captured X-ray image data is processed, the image acquisition unit 37 sends a signal indicating that the acquisition of the X-ray image data for one condition is completed to the imaging control unit 36 as an image acquisition completion signal S37. Send as.

  Upon receiving the image acquisition completion signal S37, the imaging control unit 36 performs imaging of the next group of imaging conditions. The imaging control unit 36 continues imaging by repeating control of the X-ray source 11 and the X-ray detector 12 according to the imaging conditions of the group until imaging of all groups is completed.

  If there is no overlapping part in step 112 (No in step 113), imaging is performed only under normal conditions (step 121). At that time, the imaging condition determination unit 34, the imaging group generation unit 35, and the image acquisition determination unit 39 send information that there is no overlapping component to the next unit, and the imaging control unit 36 controls imaging under normal conditions. . When imaging is performed under normal conditions, the image acquisition unit 37 processes the inspection result (step 119).

  Further, when the imaging condition does not include a condition that cannot be arranged (No in step 116), the image acquisition determination unit 39 corrects the imaging condition received without correcting the imaging condition or the like to the imaging group generation unit 35. This is sent as a condition signal S34. After the image acquisition determination unit 39 sends the imaging conditions to the imaging group generation unit 35 as the corrected imaging condition signal S34, the operation from step 117 is performed in the same manner as when the imaging conditions are corrected.

  The X-ray inspection apparatus of this embodiment can obtain the same effects as the X-ray inspection apparatus of the second embodiment. In the X-ray inspection apparatus of the present embodiment, the image acquisition determination unit 39 determines whether the X-ray source 11 and the like can be set at the arrangement position corresponding to the imaging condition calculated by the imaging condition determination unit 34. doing. The image acquisition determination unit 39 corrects the imaging condition when it is determined that it cannot be set in the arrangement position of the imaging condition calculated by the imaging condition determination unit 34. In the X-ray inspection apparatus of the present embodiment, it is possible to suppress a state in which a portion where inspection cannot be performed is generated by correcting the imaging conditions. Therefore, in the X-ray inspection apparatus according to the present embodiment, it is possible to accurately inspect whether there is an abnormality even if there are overlapping parts. As a result, the X-ray inspection apparatus according to the present embodiment can inspect the substrate while reducing the time required for the inspection while maintaining the inspection accuracy.

  In the second and third embodiments, the imaging condition is set and grouped in units of lands as a predetermined area near the connection portion between the board and the component. Units such as setting of imaging conditions and grouping may be performed in units other than lands. For example, when a plurality of components are mounted on the substrate, the imaging conditions may be calculated and grouped in units of components. Alternatively, several lands having a uniform design and arrangement may be set as one small group, and imaging conditions may be calculated and grouped in units of small groups.

  When the substrate is inspected in the X-ray inspection apparatuses of the second and third embodiments, the imaging conditions need not be set for each substrate. For example, when repeatedly inspecting a substrate with the same design in the production process, the imaging condition may be set and stored in advance, and the substrate inspection may be performed by reading the stored imaging condition data. Further, when inspecting a plurality of the same substrates, the imaging conditions may be set on the first substrate, and the subsequent substrates may be inspected on the imaging conditions of the first substrate. .

  In the second and third embodiments, X-ray images of all the predetermined areas near the connection portion between the board and the component are captured. Instead of such a configuration, only a predetermined location may be inspected. In the case of such a configuration, for example, information on the importance of the component to be inspected is stored in the component information storage unit, and the connection portion between the highly important component and the board is inspected. In addition, when determining the imaging order for each group, the inspection may be started from a group where defects are likely to occur, and the inspection may be stopped when an abnormality is detected.

  Further, when inspecting the same type of substrate, a predetermined region to be inspected may be changed for each substrate. For example, inspect all parts for parts with high importance or parts with a high frequency of abnormalities, and pick up images of parts with low importance or parts with a very low frequency of abnormality with only a part of the board. You may make it make it the object of. By inspecting the substrate by such an inspection method, the inspection time can be shortened.

  Processing corresponding to each function of the inspection control apparatus according to the first to third embodiments may be executed by a computer as a computer program. A program that can cause a computer to execute the processes shown in the first to third embodiments can be stored in a storage medium and distributed. As the storage medium, for example, a magnetic tape for data recording or a magnetic disk such as a hard disk can be used. As the storage medium, an optical disc such as a CD-ROM (Compact Disc Read Only Memory) or a DVD (Digital Versatile Disc), or a magneto-optical disc (MO) can be used. A semiconductor memory may be used as a storage medium.

DESCRIPTION OF SYMBOLS 1 Component information storage means 2 Setting calculation means 3 Group generation means 4 Order determination means 5 Imaging control means 11 X-ray source 12 X-ray detector 13 Substrate holding part 14 Inspection control part 15 Substrate 21 Mounting interference check part 22 Mounting information storage part DESCRIPTION OF SYMBOLS 23 Component information storage part 24 Imaging condition judgment part 25 Imaging group production | generation part 26 Imaging control part 27 Image acquisition part 28 Image storage part 30 Inspection control part 31 Mounting interference check part 32 Mounting information storage part 33 Component information storage part 34 Imaging condition judgment 34 Unit 35 Imaging group generation unit 36 Imaging control unit 37 Image acquisition unit 38 Image storage unit 39 Image acquisition determination unit 40 Alarm generation unit S1 X-ray source control signal S2 Detector control signal S3 Detection data signal S21 Information request signal S22 Component information signal S23 Imaging condition signal S24 Imaging group signal S25 Image acquisition request signal No. S26 Image acquisition completion signal S31 Information request signal S32 Component information signal S33 Imaging condition signal S34 Correction imaging condition signal S35 Imaging group signal S36 Image acquisition request signal S37 Image acquisition completion signal

Claims (10)

Component information storage means for storing component information including information on the sizes of components mounted on both sides of the substrate to be inspected and information on the position of the connection portion between the substrate and the component;
Imaging the X-ray irradiation angle when irradiating the substrate with the X-ray from the X-ray generator for each predetermined region near the connection portion between the component mounted on both sides of the substrate and the substrate Setting calculation means for calculating based on the component information as a condition;
A group generation unit that forms a group for each of the predetermined areas in which the imaging conditions calculated by the setting calculation unit can be regarded as substantially the same;
Order determining means for determining the order of the groups to be imaged according to a predetermined reference so that the time required for imaging the plurality of groups is shortened;
When capturing an X-ray image transmitted through the substrate, the X-ray generator and the X-ray detection are performed so as to satisfy the imaging conditions for each group based on the order of the groups determined by the order determination unit. An inspection control apparatus comprising: an imaging control means for controlling the instrument.   The predetermined criterion is set so that the movement of at least one of the X-ray generator and the X-ray detector until the imaging of all the groups is completed is minimized. The inspection control device described.   The inspection control apparatus according to claim 1, wherein the group generation unit sets the predetermined area in which the imaging condition is within the predetermined range as the same group. Setting availability determination means for determining whether the X-ray generator and the X-ray detector can be set at a setting position based on the imaging condition;
The inspection control apparatus according to any one of claims 1 to 3, further comprising: a condition correction unit that corrects the imaging condition to a settable condition when the setting availability determination unit determines that the setting is not possible. . An X-ray generator having means for irradiating a substrate to be inspected with X-rays;
An X-ray detector having means for detecting the X-rays transmitted through the substrate;
An inspection control device according to any one of claims 1 to 4,
2. The inspection apparatus according to claim 1, wherein the X-ray generator irradiates the substrate with X-rays based on control of the inspection control apparatus, and the X-ray detector detects the X-rays transmitted through the substrate.   6. The X-ray generator according to claim 5, wherein the X-ray generator includes a rotation mechanism, and imaging is performed based on the imaging condition by changing a place by rotation of an X-ray irradiation unit of the X-ray generator. Inspection device. Component information extraction processing for extracting component information including information on the sizes of components mounted on both sides of the substrate to be inspected and information on the position of the connection portion between the substrate and the component;
Imaging the X-ray irradiation angle when irradiating the substrate with the X-ray from the X-ray generator for each predetermined region near the connection portion between the component mounted on both sides of the substrate and the substrate A setting calculation process for calculating based on the component information as a condition;
A group generation process for forming a group for each of the predetermined areas in which the imaging conditions calculated in the setting calculation process can be regarded as substantially the same;
An order determination process for determining the order of the groups to be imaged according to a predetermined reference so that the time required for imaging the plurality of groups is shortened;
When capturing an X-ray image transmitted through the substrate, the X-ray generator and the X-ray detection are performed so as to satisfy the imaging conditions for each group based on the order of the groups determined in the order determination process. A program that causes a computer to execute an imaging control process for controlling a device. Extracting component information including information on the size of each component mounted on both sides of the substrate to be inspected and information on the position of the connection portion between the substrate and the component,
Imaging the X-ray irradiation angle when irradiating the substrate with the X-ray from the X-ray generator for each predetermined region near the connection portion between the component mounted on both sides of the substrate and the substrate Calculate based on the part information as a condition,
A group is formed for each of the predetermined areas where the imaging conditions can be regarded as substantially the same,
The order of the groups to be imaged is determined according to a predetermined criterion so that the time required for imaging the plurality of groups is shortened,
Inspection for controlling the X-ray generator and the X-ray detector so as to satisfy the imaging conditions for each group based on the determined order of the groups when capturing an X-ray image transmitted through the substrate Method.   9. The predetermined criterion is set so that the movement of at least one of the X-ray generator and the X-ray detector until the imaging of all the groups is completed is minimized. Inspection method described. Determining whether the X-ray generator and the X-ray detector can be set at a set position based on the imaging condition;
10. The inspection method according to claim 8, wherein when the setting is determined to be impossible, the imaging condition is corrected to a settable condition.

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