JP6428384B2 - Power converter and board mounting structure - Google Patents

Description

  The present invention relates to a power conversion device. In particular, the present invention relates to a board mounting structure of a power converter.

  In a power conversion device such as an inverter, a semiconductor power module in which a plurality of switching elements such as IGBTs and MOSFETs and elements such as FWD are combined and housed in one package is used. The semiconductor power module is provided with a main circuit board that drives a switching element in the semiconductor power module and a control board that transmits a control signal to the main circuit board.

  For example, in Patent Documents 1 and 2, a control board for controlling the main circuit board is arranged perpendicular to the main circuit board (corresponding to the power board described in Patent Documents 1 and 2).

  In Patent Document 1, the control board is disposed in a space sandwiched between the bottom of the metal U-shaped guide and the upper and side surfaces of the metal lower case, and unnecessary noise is radiated from the main circuit board to the control board. Is preventing.

  In Patent Document 2, the current sensor and the control circuit are connected to each other at the shortest distance by connecting the control board vertically to the main circuit board and connecting the control board and the main circuit board without using a wire harness. The effect of inductive noise has been reduced.

JP 2001-260466 A JP 2009-33882 A

  However, in Patent Document 1, the control board and the main circuit board are arranged vertically to reduce noise from the main circuit board, and a metal member is provided between the main circuit board and the control board to prevent noise radiation. doing.

  That is, there is a possibility that noise countermeasures are not always sufficient simply by arranging the control board and the main circuit board vertically. Moreover, when a metal member is provided for noise countermeasures, a cost for providing the metal member and a space for providing the metal member are required.

  In view of the above circumstances, an object of the present invention is to provide a technique that contributes to downsizing of a power converter and reduction of induction noise with respect to a control board.

  The power conversion device of the present invention that achieves the above object includes a semiconductor module having a switching element, a main circuit board that drives the semiconductor module, a control board that controls the main circuit board, and a smoothing provided in the semiconductor module. A capacitor, and a terminal of the semiconductor module is provided on one end of the semiconductor module, the main circuit board is provided in parallel with a surface on which the terminal of the semiconductor module is provided, and the smoothing capacitor is Provided facing the main circuit board, the terminal of the smoothing capacitor is provided at the end of the smoothing capacitor on the same side as the one end of the semiconductor module, and the control board is provided at the other end of the semiconductor module. The main circuit board and the control board are provided so as to be vertical.

  The board mounting structure of the present invention that achieves the above object includes a semiconductor module having a switching element, a main circuit board that drives the semiconductor module, a control board that controls the main circuit board, and the main circuit board. And a smoothing capacitor provided opposite to the substrate, wherein the main circuit board is provided between the smoothing capacitor and the semiconductor module, and the smoothing capacitor and the DC voltage source are provided. A terminal for connecting the semiconductor module, an external load, and a terminal for connecting the semiconductor module, the main circuit board, and the smoothing capacitor are provided on one end side of the laminate, and the control board is provided with the control board, The control board is provided on the other end side of the laminated body so as to be perpendicular to the main circuit board.

  According to the above invention, a power converter device can be reduced in size and induction noise with respect to a control board can be reduced.

It is the schematic which shows the principal part of the power converter device which concerns on embodiment of this invention. It is a circuit diagram of the power converter device shown in FIG.

  A power converter and a substrate mounting structure according to an embodiment of the present invention will be described in detail with reference to the drawings. In the description of the embodiment, for convenience, the surface on which the main circuit board of the semiconductor power module is provided will be described as the top surface, but the vertical direction does not limit the present invention.

  As shown in FIG. 1, a power conversion device 1 according to an embodiment of the present invention includes a semiconductor power module 2, a main circuit board 3, a control board 4, and a smoothing capacitor 5.

  The semiconductor power module 2 is an element in which a single or a plurality of semiconductor switching elements (for example, IGBT, MOSFET, etc.) and a plurality of elements such as FWD are combined in one package. For example, the semiconductor power module 2 is a 6-in-1 module having a 6-arm inverter bridge configuration in which a semiconductor switching element and FWD are mounted as shown in FIG. As shown in FIG. 1, AC output terminals 2 u, 2 v, 2 w are provided at one end of the upper surface of the semiconductor power module 2. The AC output terminals 2u, 2v, 2w output three-phase (U-phase, V-phase, W-phase) AC voltages converted by the semiconductor power module 2.

  The main circuit board 3 generates a gate signal or the like for ON / OFF control of the semiconductor switching element. The main circuit board 3 is provided on the upper surface of the semiconductor power module 2. That is, the main circuit board 3 is provided in parallel to the upper surface of the semiconductor power module 2 (that is, the surface on which the AC output terminals 2u, 2v, 2w are provided).

  The control board 4 is a board that controls the main circuit board 3. A control CPU and the like are disposed on the control board 4. The control board 4 is disposed on the side opposite to the side where the AC output terminals 2u, 2v, 2w of the semiconductor power module 2 are provided, and the control board 4 and the main circuit board 3 are arranged vertically. That is, the control board 4 is arranged with respect to the main circuit board 3 so that the side end face of the main circuit board 3 faces the component mounting surface of the control board 4 (or the back surface of the component mounting surface). For example, the control board 4 faces the side surface of the semiconductor power module 2 on the opposite side to the side where the AC output terminals 2u, 2v, 2w of the semiconductor power module 2 are provided, and the bottom surface of the casing of the power converter 1 (not shown). To be fixed in the vertical direction by a fixture or the like. That is, the AC output terminals 2u, 2v, 2w are provided on one end side of the main circuit board 3, and the control board 4 is arranged on the opposite side. The circuit on the control board 4 and the circuit on the main circuit board 3 are connected by a flexible printed wiring board 6 (FPC) or the like.

  The flexible printed wiring board 6 has a structure in which a conductive foil is formed on a base film, and is covered with an insulator other than the terminal portion and the soldered portion. That is, the flexible printed wiring board 6 is a bendable printed wiring board using a thin insulating plastic film.

  The smoothing capacitor 5 is disposed on the upper surface of the main circuit board 3. The smoothing capacitor 5 is, for example, a rectangular parallelepiped film capacitor or a cylindrical electrolytic capacitor, and smoothes the DC voltage input to the semiconductor power module 2. The smoothing capacitor 5 is provided with DC input terminals 5p and 5n to which a DC voltage source (not shown) is connected. The DC input terminals 5p and 5n are provided at the end of the smoothing capacitor 5 on the same side as the end where the AC output terminals 2u, 2v and 2w of the semiconductor power module 2 are provided. Although not shown, the smoothing capacitor 5 and the semiconductor power module 2 are connected to the lower surface of the smoothing capacitor 5 and the upper surface of the semiconductor power module 2.

  When the power converter 1 operates as an inverter, DC power is input from a DC voltage source (not shown). Then, a predetermined control signal is input from the control board 4 to the main circuit board 3, and a drive signal is generated in the main circuit board 3 based on the input control signal. The semiconductor power module 2 converts DC power into AC power according to the drive signal, and the converted AC power is output to the motor 7 from the AC output terminals 2u, 2v, 2w, and the motor 7 is driven. When the power conversion device 1 operates as a converter, AC power is input from an AC input terminal (corresponding to the AC output terminals 2u, 2v, and 2w in FIG. 1), and the AC power is converted into DC power by the semiconductor power module 2. It is converted and DC power is output from the DC output terminal (corresponding to the DC input terminals 5p and 5n in FIG. 1).

  According to the power conversion device 1 and the substrate arrangement method of the present invention as described above, the AC output terminals 2u, 2v, 2w (or AC input terminals) and the DC input terminals 5p, 5n that are sources of inductive noise are generated. (Or DC output terminal) is provided on one end side of the laminated body in which the semiconductor power module 2, the main circuit board 3 and the smoothing capacitor 5 are laminated, and the control board 4 is arranged on the other end side of the laminated body. Control signals and noise induced on the control board 4 from the AC output terminals 2u, 2v, 2w and the DC input terminals 5p, 5n can be reduced.

  Further, by arranging the control board 4 perpendicularly to the main circuit board 3, the side of the control board 4 opposite to the side where the AC output terminals 2u, 2v, 2w of the semiconductor power module 2 are provided, the main circuit The end face of the substrate 3 and the side face opposite to the side where the DC input terminals 5p, 5n of the smoothing capacitor 5 are provided are disposed. As a result, noise radiation from the main circuit board 3 to the control board 4 can be suppressed without adding a shielding member such as a metal member between the main circuit board 3 and the control board 4. That is, since the induction noise to the control board 4 can be reduced without adding a metal member or the like, the induction noise to the control board 4 can be reduced without increasing the cost of the power conversion device 1.

  Furthermore, by arranging the control board 4 perpendicularly to the main circuit board 3, the power conversion apparatus 1 can be configured using the space without waste, so that the power conversion apparatus 1 can be downsized. .

  That is, in the conventional power conversion device, the arrangement of the main circuit terminal serving as a noise generation source and the control board is not taken into consideration, and noise countermeasures are not always sufficient. In the case of an inverter incorporated in an electronic device, since the capacity of a motor (load) to be driven is small, various main circuit components are not large, and the arrangement of main circuit components and main circuit terminals is not considered. On the other hand, in the case of industrial motors, the main circuit parts such as smoothing capacitors are enlarged from the viewpoint of driving motors rated at several kW or more, control accuracy and pulsation suppression, and the arrangement of the main circuit boards and control boards In addition, it is necessary to consider the arrangement of main circuit components and main circuit terminals.

  Therefore, the power conversion device 1 according to the embodiment of the present invention includes the arrangement of the AC output terminals 2u, 2v, 2w (or AC input terminals) and the DC input terminals 5p, 5n (or DC output terminals) and the control board 4. In consideration of the arrangement, the induction noise to the control board 4 was suppressed while realizing the miniaturization of the power conversion device 1.

  As mentioned above, although the specific embodiment was shown and demonstrated in detail about the power converter device and board | substrate attachment structure of this invention, the power converter device and board | substrate attachment structure of this invention are not limited to embodiment. However, the design can be changed as appropriate without departing from the characteristics of the invention, and the changed design is also included in the technical scope of the present invention.

  For example, the configuration of the semiconductor power module is not limited to the embodiment, and the number, configuration, and the like of the switching elements are appropriately changed according to the purpose of use of the power conversion device.

  Further, the control board 4 is not limited to a form that is fixed from the bottom surface of the casing of the power conversion device 1 by a fixture or the like. That is, with the main circuit board 3 as a reference, the control board 4 is perpendicular to the main circuit board 3 on the side opposite to the side where the DC input terminals 5p and 5n and the AC output terminals 2u, 2v and 2w are provided. As long as the control board 4 is provided as described above, the place where the control board 4 is fixed can be arbitrarily set. For example, an aspect in which the control board 4 is fixed to the side portion of the semiconductor power module 2 or the smoothing capacitor 5 and an aspect in which the control board 4 is fixed on the main circuit board 3 also belong to the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Power converter 2 ... Semiconductor power module (semiconductor module)
2u, 2v, 2w ... AC output terminal 3 ... Main circuit board 4 ... Control board 5 ... Smoothing capacitor 5p, 5n ... DC input terminal 6 ... Flexible printed wiring board 7 ... Motor (load)

Claims (2)

A semiconductor module having a switching element;
A main circuit board for driving the semiconductor module;
A control board for controlling the main circuit board;
A smoothing capacitor provided in the semiconductor module,
A terminal of the semiconductor module is provided on one end side of the semiconductor module,
The main circuit board is provided in parallel with the surface on which the terminals of the semiconductor module are provided,
The smoothing capacitor is provided facing the main circuit board, and the terminal of the smoothing capacitor is provided at the end of the smoothing capacitor on the same side as the one end of the semiconductor module,
The power conversion device, wherein the control board is provided on the other end side of the semiconductor module so that the main circuit board and the control board are perpendicular to each other. In a power converter comprising: a semiconductor module having a switching element; a main circuit board that drives the semiconductor module; a control board that controls the main circuit board; and a smoothing capacitor that is provided to face the main circuit board. A board mounting structure,
Providing the main circuit board between the smoothing capacitor and the semiconductor module;
A terminal for connecting the smoothing capacitor and the DC voltage source, and a terminal for connecting the semiconductor module and an external load are provided on one end side of the laminate in which the semiconductor module, the main circuit board, and the smoothing capacitor are stacked. Provided,
The board mounting structure, wherein the control board is provided on the other end side of the laminate so that the control board is perpendicular to the main circuit board.

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