JP6426388B2 - Resist stripping solution cleaning apparatus and substrate processing apparatus - Google Patents

Description

  Embodiments of the present invention relate to a resist stripping solution cleaning apparatus and a substrate processing apparatus.

  In the manufacturing process of semiconductors, liquid crystal panels and the like, a substrate processing apparatus is used which supplies a resist stripping solution to the surface of a substrate such as a wafer or a liquid crystal substrate and removes the resist film from the surface of the substrate. In this substrate processing apparatus, a spin processing apparatus has been developed which rotates the substrate in a horizontal state to supply a resist stripping solution substantially to the center of the substrate surface and spreads the resist stripping solution on the substrate surface by centrifugal force. . Furthermore, a spin processing apparatus has also been developed that recovers and reuses the resist stripping solution that has been used once.

  Usually, since a resist strip peeled off from the substrate surface is mixed in the resist stripping solution used once, it is necessary to remove the resist strip from the used resist stripping solution in order to reuse this resist stripping solution. . For this reason, in the recovery flow path for recovering the resist stripping solution, a filter for removing resist pieces in the resist stripping solution is provided.

JP 2002-96012 A

  However, in the above-mentioned filter, since clogging occurs due to the resist pieces in the resist stripping solution, maintenance such as filter replacement and cleaning is essential, and the burden on the operator is increased. For this reason, it is desirable to reduce the burden on workers.

  The problem to be solved by the present invention is to provide a resist stripping solution cleaning apparatus and a substrate processing apparatus capable of reducing the burden on the operator.

The resist stripping solution purification apparatus according to the embodiment is
A liquid storage unit for storing a resist stripping solution containing a resist piece;
A catch portion for catching the resist piece in the resist stripping solution in the liquid storage portion;
A heating unit for heating the resist piece captured by the capturing unit;
And a stirring unit configured to turn the resist stripping solution in the liquid storage unit in one direction,
A plurality of the capturing portions are provided on the inner circumferential surface of the liquid storage portion so that the resist stripping solution is aligned by the stirring portion.

The substrate processing apparatus according to the embodiment
A liquid supply unit for supplying a resist stripping solution to a substrate having a resist;
A liquid storage unit that stores a resist stripping solution that is supplied from the liquid supply unit and that includes a resist piece that is stripped from the substrate;
A catch portion for catching the resist piece in the resist stripping solution in the liquid storage portion;
A heating unit for heating the resist piece captured by the capturing unit;
And a stirring unit configured to turn the resist stripping solution in the liquid storage unit in one direction,
A plurality of the capturing portions are provided on the inner circumferential surface of the liquid storage portion so that the resist stripping solution is aligned by the stirring portion.

  According to the embodiment of the present invention, the burden on the worker can be reduced.

It is a figure which shows schematic structure of the substrate processing apparatus which concerns on 1st Embodiment. It is sectional drawing which shows the liquid storage part with which the liquid purification part which concerns on 1st Embodiment is equipped. It is a top view which shows the liquid storage part with which the liquid purification part which concerns on 1st Embodiment is equipped. It is sectional drawing which shows the modification 1 of the liquid storage part with which the liquid purification part which concerns on 1st Embodiment is equipped. It is sectional drawing which shows the modification 2 of the liquid storage part with which the liquid purification part which concerns on 1st Embodiment is equipped. It is sectional drawing which shows the liquid storage part with which the liquid purification part which concerns on 2nd Embodiment is equipped. It is a figure which shows a part of schematic structure of the substrate processing apparatus which concerns on 3rd Embodiment.

First Embodiment
The first embodiment will be described with reference to FIGS. 1 to 5.

  As shown in FIG. 1, the substrate processing apparatus 1 according to the first embodiment includes a substrate processing tank 2 that processes a substrate W with a resist stripping solution, and a liquid supply unit that supplies the resist stripping solution to the substrate processing tank 2. A liquid cleaning unit 4 that functions as a resist removing solution cleaning device that cleans the resist removing solution discharged from the substrate processing tank 2 and a control unit 5 that controls each unit are provided.

  The substrate processing tank 2 includes a cup 2a provided inside the tank, a table 2b supporting the substrate W horizontally in the cup 2a, and a nozzle for supplying a resist stripping solution to the surface of the substrate W on the table 2b. 2c and a rotation mechanism 2d for rotating the table 2b in a horizontal plane.

  The cup 2a is formed in a cylindrical shape, and encloses the table 2b from the periphery and is accommodated inside. The upper portion of the peripheral wall of the cup 2a is inclined inward in the radial direction, and is opened so that the substrate W on the table 2b is exposed. The cup 2a receives the resist stripping solution that has fallen from the surface of the rotating substrate W and the scattered resist stripping solution.

  The table 2 b is positioned near the center in the cup 2 a and rotatably provided in the horizontal plane. The table 2 b has a plurality of support members 2 b 1 such as pins, and supports the substrate W such as a wafer or a liquid crystal substrate so as to be sandwiched by the support members 2 b 1. The substrate W has a resist film (resist layer) for a mask or the like on the surface.

Furthermore, the table 2 b functions as a hot plate for heating the substrate W, and the resist stripping solution (for example, SPM (mixed liquid of sulfuric acid and hydrogen peroxide solution) etc.) supplied to the surface of the substrate W on the table 2 b is used. warm. As the heating means, in addition to the hot plate, it is possible to use a lamp for emitting light, a heater for generating heat, an electromagnetic heater using an electromagnetic wave, or the like. When the resist stripping solution is SPM, the heating temperature is, for example, 180.degree. This is to set the temperature of the SPM on the substrate W of the table 2 b to, for example, 150 ° C. or more and 320 ° C. or less in order to promote dissolution of the resist.

  The nozzle 2c supplies the processing liquid to the surface of the substrate W on the table 2b. The nozzle 2c is provided movably along the surface of the substrate W on the table 2b, and is retracted from the liquid supply position facing the approximate center of the surface of the substrate W on the table 2b and the liquid supply position. The substrate W is moved to a standby position that does not hinder the loading and unloading of the substrate W.

  The rotation mechanism 2d rotates the table 2b with the center of the table 2b as the rotation axis. The rotation mechanism 2d includes a rotation shaft connected to the table 2b and a motor for rotating the rotation shaft. The motor is electrically connected to the control unit 5, and the drive thereof is controlled by the control unit 5.

The liquid supply unit 3 includes a liquid storage portion 3a at the upper end opening for storing a resist stripping solution at normal temperature (for example, 20 to 30 ° C.), a supply pipe 3b connecting the liquid reservoir 3a and the nozzle 2c, and a resist stripping solution A return pipe 3c for returning the fluid, a pump 3d serving as a flow source of the resist stripping solution, a filter 3e for removing particles, and a control valve (for example, a solenoid valve) 3f for adjusting the opening degree of the supply pipe 3b There is. The pump 3 d and the adjustment valve 3 f are electrically connected to the control unit 5, and the drive of the pump 3 d and the adjustment valve 3 f is controlled by the control unit 5. When the resist stripping solution is SPM, the liquid storage portion 3a may be supplemented with sulfuric acid or hydrogen peroxide solution as necessary.

  The liquid purification unit 4 includes a recovery pipe 4a for discharging the resist stripping solution from the substrate processing tank 2, a liquid storage unit 4b at the upper end opening for storing the discharged resist stripping solution, a liquid storage unit 4b and a liquid supply unit 3, a connection pipe 4c for connecting the liquid storage portion 3a, a pump 4d serving as a flow source of the resist stripping solution, a control valve (e.g., a solenoid valve) 4e for adjusting the opening of the connection pipe 4c, and a resist stripping solution And a replenishing unit 4g for replenishing the liquid storage unit 4b with a hydrogen peroxide solution. The replenishment unit 4g includes a liquid storage unit 4g1 for storing hydrogen peroxide water, a replenishment pipe 4g2 for connecting the liquid storage unit 4g1 and the liquid storage unit 4b, and an adjustment valve for adjusting the opening degree of the replenishment pipe 4g2 For example, a solenoid valve etc.) 4g3 is provided. The pump 4 d, the adjusting valve 4 e, the cooling unit 4 f, and the adjusting valve 4 g 3 are electrically connected to the control unit 5, and the drive of these is controlled by the control unit 5.

  The control unit 5 includes a microcomputer that centrally controls each unit, a storage unit that stores substrate processing information related to substrate processing, various programs, and the like (all are not shown). The control unit 5 controls the substrate processing tank 2, the liquid supply unit 3, and the liquid purification unit 4 based on the substrate processing information and various programs. Specifically, the table 2b supporting the substrate W is rotated by the rotation mechanism 2d, and the resist supply liquid is supplied from the nozzle 2c to the surface of the substrate W on the rotating table 2b by the liquid supply unit 3 Processing) Furthermore, the resist stripping solution used in the stripping process is recovered and cleaned by the liquid purifying unit 4, and control of liquid circulation is performed such that the cleaned resist stripping solution is used again for the stripping process.

  Next, the above-mentioned liquid storage part 4b will be described with reference to FIG. 2 and FIG.

  As shown in FIGS. 2 and 3, in the liquid storage portion 4b, a stirring portion 11 for stirring the resist peeling liquid in the liquid storage portion 4b and a resist piece in the resist peeling liquid in the liquid storage portion 4b are captured. A plurality of capture heating parts 12 which are heating elements are provided. In addition, the liquid storage part 4b is formed, for example in cylindrical shape.

  One end of the recovery pipe 4a on the liquid storage portion 4b side extends to near the bottom surface of the liquid storage portion 4b so as to supply the resist stripping liquid to the bottom surface side (lower end side) of the liquid storage portion 4b. Further, one end of the connection pipe 4c on the liquid storage portion 4b side is connected to the side wall on the opening side (upper end side) of the liquid storage portion 4b. In order to supply the resist stripping liquid to the bottom surface side of the liquid storage portion 4b, one end of the recovery pipe 4a on the liquid storage portion 4b side may be connected to the bottom surface of the liquid storage portion 4b.

  The stirring unit 11 includes a stirring element 11 a such as a propeller, a rotating shaft 11 b, and a motor 11 c. The stirrer 11a is fixed to the tip of the rotary shaft 11b, and rotates, for example, in one direction. The rotation shaft 11 b is connected to a motor 11 c serving as a rotation source, and the motor 11 c is electrically connected to the control unit 5, and the drive thereof is controlled by the control unit 5.

  Each capture heating unit 12 is formed in, for example, a rectangular plate shape, and does not prevent the rotation of the stirring bar 11a, and further, the rotation direction of the stirring bar 11a, that is, the resist stripping solution is aligned in a turning direction by the stirring bar 11a. As such, it is provided on the inner peripheral surface of the liquid storage portion 4b. In FIG. 3, as an example, the capture heating unit 12 is provided every 45 degrees, and a predetermined angle (for example, from the vertical state with respect to the inner circumferential surface of the liquid storage portion 4 b) in the direction opposite to the rotation direction 30 degrees) being beaten. In the first embodiment, the plurality of capture heating units 12 are provided. However, the present invention is not limited to this, and may be one, for example, and the number thereof is not particularly limited.

  The capture heating units 12 capture the resist pieces in the resist stripping solution that is swirled by the rotation of the stirrer 11a. Furthermore, each capture heating unit 12 is formed of a heating wire that generates heat, and is used to heat and capture both (or one of) the resist stripping solution in the liquid storage unit 4b and the captured resist fragments. Dissolve. The resist pieces are decomposed into carbon dioxide and water by the oxidizing power of the resist stripping solution (for example, SPM). That is, carbon dioxide evaporates, but the remaining water is mixed with the resist stripping solution. Thus, the resist pieces are dissolved and not in a solid state. Each capture heating unit 12 is electrically connected to the control unit 5, and the drive (heat generation amount etc.) thereof is controlled by the control unit 5. When the resist stripping solution is SPM, the heating temperature is, for example, 180 ° C., as described above.

  Here, as each capture heating part 12, it is possible to use various capture members which capture a resist piece. At this time, it is not necessary to use capture members of the same type all, and capture members of different types may be used. As the capture member, for example, a filtration membrane such as a mesh or pore mesh can be used. Furthermore, it is possible to use a strip-shaped member, and as an example, one end of the strip-shaped member drifting in the resist stripping solution of the liquid reservoir 4b is fixed to the inner surface of the liquid reservoir 4b. In this case, the resist piece is blocked by the strip-like member expanded by the swirling flow in the liquid storage portion 4 b and stays there. Moreover, it is also possible to use a cloth-like member, and as an example, a bag is formed of cloth, and the end is fixed to the inner surface of the liquid storage portion 4b. In this case, the resist pieces will enter and stay in the expanded bag. In addition, as a capture member, it is also possible to use an adsorption member that adsorbs a resist piece by applying adhesiveness or potential.

  Next, the above-mentioned purification operation of the liquid purification unit 4 will be described.

  First, in the substrate processing tank 2, the resist stripping solution supplied by the liquid supply unit 3 is applied from the nozzle 2c to the surface of the substrate W on the rotating table 2b and spreads on the surface of the substrate W by the centrifugal force of rotation. Thus, a liquid film is generated by the resist stripping solution, and the resist is removed from the surface of the substrate W. At this time, the resist stripping solution flows down or scatters from the surface of the rotating substrate W and is received by the cup 2a. The resist stripping solution contains a resist piece stripped from the surface of the substrate W.

  The resist stripping solution containing a resist piece is discharged from the inside of the cup 2a, passes through the recovery pipe 4a, and flows near the bottom surface of the liquid reservoir 4b. At this time, since the stirrer 11a in the liquid storage portion 4b is rotating, the resist stripping liquid in the liquid storage portion 4b swirls in one direction, and a swirling flow (vortex) is generated in the liquid storage portion 4b. The resist pieces in the resist stripping solution move near the bottom surface by their own weight, but move toward the outer peripheral surface of the liquid storage portion 4b by the centrifugal force of the swirling flow. Further, even if resist pieces are floating, the resist pieces move toward the outer peripheral surface of the liquid storage portion 4b by the centrifugal force of the swirling flow.

  Such resist pieces are caught and caught by the respective capture heating portions 12 present on the outer peripheral surface of the liquid storage portion 4b, and are thereafter captured by the respective capture heating portions 12 by the flow of the swirling flow (flow force). It becomes. The floating resist pieces are also reliably captured by the respective capture heating portions 12 before reaching the liquid surface in the swirling flow. The resist stripping solution thus captured is gradually dissolved in the resist stripping solution because the resist stripping solution in the liquid storage section 4b is heated by the respective capture heating sections 12 to the melting temperature or more.

  The purified resist stripping solution in which the resist pieces are dissolved is discharged from the connection pipe 4c located on the opening side (upper end side) of the liquid storage portion 4b. Thereafter, the resist stripping solution flowing through the connection pipe 4c is cooled to about normal temperature (for example, about 20 to 30 ° C.) by the cooling unit 4f, flows into the liquid storage 3a, and is supplied to the nozzle 2c again for use.

During this cleaning operation, hydrogen peroxide solution is replenished into the liquid storage portion 4b by the replenishing portion 4g, and the reduction of the hydrogen peroxide concentration of the resist stripping liquid is suppressed. The hydrogen peroxide solution may be heated after being heated to the extent that it does not boil. In addition, the resist pieces mixed in the resist stripping solution are captured by the respective capture heating units 12, and the resist stripping solution is discharged to the pipe 4c. The resist pieces remain captured by the respective capture heaters 12 and the captured time is utilized and dissolved. The time for which the resist piece is captured and remaining, that is, the time for which the resist piece is retained is the melting time, and is, for example, about several tens minutes or several tens of minutes. Since it takes time to dissolve the resist pieces in this manner, it is desirable to replenish the hydrogen peroxide solution in the liquid storage portion 4b as described above to suppress the reduction of the hydrogen peroxide concentration in the resist stripping solution.

  According to such a cleaning operation, it is possible to capture and dissolve the resist pieces in the resist remover solution by each capture heating unit 12 and to remove the resist pieces from the resist remover solution in the liquid storage unit 4b. Further, the oxidizing power of the resist stripping solution can be compensated by replenishing the liquid storage portion 4b with the hydrogen peroxide solution, and the oxidizing power can promote the dissolution of the resist piece. As described above, clogging of the filter does not occur as compared to the case where the resist piece in the resist stripping solution is removed by the filter. This makes it possible to eliminate the need for maintenance such as filter replacement and cleaning, thereby reducing the burden on the operator.

  Further, the resist stripping solution in the fluid storage section 4b is swung in one direction by the stirring unit 11 to generate a swirling flow in the fluid storage section 4b, whereby the resist pieces in the resist stripping solution are subjected to the centrifugal force of the swirling flow. It can be moved toward the outer peripheral surface of the liquid storage portion 4 b and captured by the respective capture heating portions 12 present on the outer peripheral surface of the liquid storage portion 4 b. Therefore, it is possible to reliably capture the resist piece in the liquid storage portion 4b, and the resist piece in the resist stripping solution can be reliably dissolved.

  In addition, the resist pieces captured by the respective capture heating units 12 will remain at the capture position and melt due to the flow (force of the flow) of the swirling flow thereafter. Furthermore, since each capture heating unit 12 is inclined by a predetermined angle in the direction opposite to the flow direction of the swirling flow, the resist pieces captured once are swirled compared to the case where the capture heating portion 12 falls by the predetermined angle in the same direction as the flow direction of the swirling flow. It is possible to prevent something from being escaped by the flow. Therefore, the resist piece can be continuously captured in the liquid storage portion 4b, and the resist piece in the resist stripping solution can be reliably dissolved.

  Further, since the resist stripping solution containing the resist pieces is supplied near the bottom of the liquid storage portion 4b, even if there are floating resist pieces, even if the resist pieces move up by the swirling flow, Before the resist piece gets on the swirling flow and reaches the liquid surface, each capture heating portion 12 can capture the resist piece, and from the connection pipe 4c located on the opening side (upper end side) of the liquid storage portion 4b It can suppress flowing out. As described above, since it is possible to reliably capture resist pieces in the liquid storage portion 4b, it is possible to reliably dissolve the resist pieces in the resist stripping solution.

  As described above, according to the first embodiment, in the liquid purification part 4, the resist pieces in the resist stripping solution in the liquid storage part 4 b are caught by the respective capture heating parts 12, and further, those capture heating parts 12 By heating the resist stripping solution in the fluid storage portion 4b and dissolving the captured resist pieces, it becomes possible to remove the resist strips from the resist stripping solution in the fluid storage portion 4b. Therefore, clogging of the filter does not occur as compared with the case where the resist piece in the resist stripping solution is removed by the filter. This makes it possible to eliminate the need for maintenance such as filter replacement and cleaning, thereby reducing the burden on the operator.

(Modification 1 and Modification 2)
Modifications 1 and 2 of the liquid storage portion 4b described above will be described with reference to FIGS. 4 and 5. FIG. Although each capture heating unit 12 functions as a heater in the above description, in the first and second modifications, instead of each capture heating unit 12, a plurality of captures for capturing resist pieces in the liquid storage portion 4 b The part 12a is provided, and one heater (heating part) 12b or 12c is provided.

  More specifically, in the first modification, as shown in FIG. 4, the plurality of capturing portions 12a capturing resist pieces in the liquid storage portion 4b are the same as the above-described capture heating portion 12 (see FIG. 3), It is provided along the inner peripheral surface of the liquid storage part 4b. In addition, a heater 12b for heating the resist stripping solution in the fluid storage portion 4b is provided outside the fluid storage portion 4b. The heater 12b is formed in an annular shape, accommodates the liquid storage portion 4b in its ring, and heats the resist stripping liquid inside the liquid storage portion 4b. The heater 12 b is electrically connected to the control unit 5, and the drive thereof is controlled by the control unit 5.

  In the second modification, as shown in FIG. 5, the capture portion 12a for capturing resist pieces in the liquid storage portion 4b is provided along the inner circumferential surface of the liquid storage portion 4b as in the first modification described above. It is done. In addition, a heater 12c that heats the resist stripping solution in the liquid storage portion 4b is provided in the liquid storage portion 4b. The heater 12c is formed of, for example, a heating wire, and the heating wire is provided in a coil shape so as to wind the recovery pipe 4a. The heater 12 c is electrically connected to the control unit 5, and the drive thereof is controlled by the control unit 5.

  In addition, although the some capture part 12a is provided in the modified example 1 and the modified example 2, it does not restrict to this, for example, may be one and the number is not specifically limited. In addition to the heater that generates heat, a lamp that emits light, an electromagnetic heater that uses electromagnetic waves, or the like can be used as the heating unit that melts the resist pieces in the resist stripping solution in the liquid storage unit 4b. is there.

  Further, in the first embodiment, the first modification and the second modification, a circulation pipe may be provided in the middle of the connection pipe 4c to return the resist stripping liquid to the liquid reservoir 4b. In this case, when the substrate W is not processed (during standby), the resist strip may be melted while circulating the resist stripping solution. That is, the resist piece may be dissolved by taking time more slowly than the peeling action (including the dissolution) at the time of processing the substrate W.

Second Embodiment
The second embodiment will be described with reference to FIG. In the second embodiment, only differences from the first embodiment (the internal structure of the liquid storage unit included in the liquid purification unit) will be described, and the other descriptions will be omitted.

  As shown in FIG. 6, in the second embodiment, the capture portion 12d for capturing resist pieces in the liquid storage portion 4b is formed, for example, in a disk shape, and is horizontal in the liquid storage portion 4b. It is provided to laminate at a predetermined interval. Further, a heater 12e for heating the resist stripping solution in the liquid storage portion 4b is provided in the vicinity of the bottom surface of the liquid storage portion 4b. The heater 12e is formed in a coil shape by, for example, a heating wire. The heater 12 e is electrically connected to the control unit 5, and the drive thereof is controlled by the control unit 5.

  Further, one end on the liquid storage portion 4b side of the recovery pipe 4a is connected to the side wall on the bottom surface side of the liquid storage portion 4b so as to supply the resist stripping liquid to the bottom surface side (lower end side) of the liquid storage portion 4b. Further, one end of the connection pipe 4c on the liquid storage portion 4b side is inserted into the liquid storage portion 4b from the opening at the upper end of the liquid storage portion 4b.

  In the cleaning operation of the liquid purification unit 4, the peeling process in the substrate processing tank 2 is the same as that of the first embodiment, and after the peeling process, the resist peeling solution including the resist piece is discharged from the inside of the cup 2a and collected. It flows into the vicinity of the bottom of the liquid reservoir 4b through the pipe 4a. At this time, while the resist pieces in the resist stripping solution stay near the bottom by their own weight, they move upward from near the bottom by the flow of the resist stripping solution. Further, even if there is a floating resist piece, the resist piece moves upward by the flow of the resist stripping solution.

Such resist pieces are caught and captured by the capturing portions 12d stacked at predetermined intervals in the liquid storage portion 4b before reaching the liquid surface. The resist stripping solution thus captured is gradually dissolved in the resist stripping solution having the melting temperature or more, because the resist stripping solution is heated to the melting temperature or more by the heater 12e. Thereafter, the purified resist stripping solution in which the resist pieces are dissolved is discharged from the connection pipe 4c connected to the opening at the upper end of the liquid storage portion 4b. The subsequent cooling and circulation of the resist stripping solution and the replenishment of the hydrogen peroxide solution are the same as in the first embodiment.

  According to such a cleaning operation, each capture portion 12d captures a resist strip in the resist stripper, the heater 12e heats the resist stripper, and the captured resist strip is melted to form the inside of the liquid storage portion 4b. It becomes possible to eliminate from the resist stripping solution. Therefore, clogging of the filter does not occur as compared with the case where the resist piece in the resist stripping solution is removed by the filter. This makes it possible to eliminate the need for maintenance such as filter replacement and cleaning, thereby reducing the burden on the operator.

  As described above, according to the second embodiment, the same effect as that of the first embodiment can be obtained. That is, since maintenance such as filter replacement and cleaning can be made unnecessary, the burden on the operator can be reduced.

  In addition, in the above-mentioned 2nd Embodiment, although the some capture part 12d is provided, it does not restrict to this, for example, may be one and the number is not specifically limited. In addition, the size (filtration size) of the mesh and holes of each capture portion 12d may be the same, or the sizes thereof may be different, for example, to be gradually reduced from the bottom to the top in FIG. You may

Third Embodiment
The third embodiment will be described with reference to FIG. In the third embodiment, only differences from the first embodiment (arrangement of liquid reservoirs included in the liquid purification unit) will be described, and the other descriptions will be omitted.

  As shown in FIG. 7, in the third embodiment, the liquid storage portion 4 b is fixed to the bottom surface of the cup 2 a. The liquid storage portion 4b is an annular tank having an upper end opening, and the rotation shaft 2d1 of the rotation mechanism 2d passes through the inside of the ring of the liquid storage portion 4b. Further, the rotary shaft 11b of the stirring unit 11 is formed by a hollow tube, and this hollow tube is provided such that a cylindrical inner peripheral wall located at the center of the storage portion 4b is positioned inside the hollow tube. It is done. Although the motor 11c is not shown in FIG. 7, the motor 11c is provided at a position which does not disturb the rotation of the table 2b and the stirrer 11a.

  Here, the rotational speed of the stirrer 11a is set to be slower than the rotational speed of the table 2b. For this reason, although each rotational speed of the table 2b and the stirrer 11a is different, it is not limited to this, and may be the same. For example, the rotational speed of the table 2b is adjusted to the rotational speed of the stirrer 11a. It is good. In addition, the rotational directions of the table 2b and the stirrer 11a may be the same or different. In addition to the motor 11c, for example, it is also possible to transmit the rotational force of the rotation mechanism 2d to the rotation shaft 11b by a transmission member such as a gear to rotate the stirrer 11a.

  The above-mentioned liquid storage part 4b directly stores the resist stripping liquid which flows down from the surface of the substrate W on the table 2b from the annular opening. As a result, since the recovery pipe 4a according to the first or second embodiment is not necessary, it is possible to suppress the circulation failure due to the clogging of the recovery pipe 4a as compared with the case where the recovery pipe 4a is present.

  In addition, since the recovery pipe 4a is a pipe through which the resist stripping solution including the resist piece flows, the recovery pipe 4a is a portion where clogging easily occurs as compared with the other portion of the circulation path. Naturally, it is possible to suppress the occurrence of clogging if the bore diameter of the recovery pipe 4a is increased, but it may be difficult to enlarge the bore diameter of the recovery pipe 4a due to the installation space and other mechanisms.

  As described above, according to the third embodiment, the same effect as that of the first embodiment can be obtained. That is, since maintenance such as filter replacement and cleaning can be made unnecessary, the burden on the operator can be reduced. Furthermore, compared with the first or second embodiment, it is possible to suppress the circulation failure due to the clogging of the recovery pipe 4a.

(Other embodiments)
In the first to third embodiments described above, the liquid purification unit 4 is applied to the single wafer type substrate processing apparatus 1 by spin processing, but the present invention is not limited to this. For example, a batch type substrate processing apparatus The present invention is applicable to various substrate processing apparatuses.

  While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and the gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.

Reference Signs List 1 substrate processing apparatus 2c nozzle 4 liquid purification unit 4b liquid storage unit 4g replenishment unit 12 capture heating unit 12a capture unit 12b heater 12c heater 12c capture unit 12e heater W substrate

Claims (5)

A liquid storage unit for storing a resist stripping solution containing a resist piece;
A catch portion for catching the resist piece in the resist stripping solution in the liquid storage portion;
A heating unit for heating the resist piece captured by the capturing unit;
And a stirring unit configured to turn the resist stripping solution in the liquid storage unit in one direction,
A plurality of said capture parts are provided in the inner peripheral surface of the said liquid storage part so that the said resist stripping solution may be located in a line with the said stirring part in a turning direction, The resist stripping solution purification apparatus characterized by the above-mentioned .   The resist stripping solution purification apparatus according to claim 1, wherein the capture unit is a mesh-like capture member provided in the liquid storage unit. The heating unit, the resist stripping solution purification device according to claim 1 or claim 2, characterized in that provided in the capture unit. The resist stripping solution contains a hydrogen peroxide solution,
The resist stripping solution purification apparatus according to any one of claims 1 to 3 , further comprising a replenishment unit that replenishes the resist stripping solution in the liquid storage unit with a hydrogen peroxide solution. A liquid supply unit for supplying a resist stripping solution to a substrate having a resist;
A liquid storage unit that stores a resist stripping solution that is supplied from the liquid supply unit and that includes a resist piece that is stripped from the substrate;
A catch portion for catching the resist piece in the resist stripping solution in the liquid storage portion;
A heating unit for heating the resist piece captured by the capturing unit;
And a stirring unit configured to turn the resist stripping solution in the liquid storage unit in one direction,
The substrate processing apparatus is characterized in that a plurality of capture portions are provided on the inner peripheral surface of the liquid storage portion so as to be aligned in the direction in which the resist stripping solution is swirled by the stirring portion .

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