JP6424537B2 - Electric heating device for plated metal plate for hot stamping - Google Patents

Electric heating device for plated metal plate for hot stamping Download PDF

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JP6424537B2
JP6424537B2 JP2014191283A JP2014191283A JP6424537B2 JP 6424537 B2 JP6424537 B2 JP 6424537B2 JP 2014191283 A JP2014191283 A JP 2014191283A JP 2014191283 A JP2014191283 A JP 2014191283A JP 6424537 B2 JP6424537 B2 JP 6424537B2
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学 福本
学 福本
晃大 仙石
晃大 仙石
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Description

本発明は、ホットスタンプ用めっき金属板、たとえば、自動車用部品のめっき鋼板を通電加熱する装置に関する。   The present invention relates to an apparatus for current heating a plated metal plate for hot stamping, for example, a plated steel plate of an automobile part.

高強度の金属板（たとえば、鋼板）を所望の形状に成形する方法の一つとして、ホットスタンプ法がある。ホットスタンプ法では、たとえば、金属板が鋼板である場合、鋼板をオーステナイト化温度（またはＡ３変態点）以上に加熱した状態でプレス成形する。金属板の加熱は、現在、炉を用いて行われることが多いが、より短時間で金属板を所望の温度に加熱し得る方法として、通電加熱が注目されている。   One method of forming a high strength metal plate (for example, a steel plate) into a desired shape is the hot stamping method. In the hot stamping method, for example, when the metal plate is a steel plate, the steel plate is press-formed in a heated state at austenitizing temperature (or A3 transformation point) or more. At present, heating of metal plates is often carried out using a furnace, but as a method capable of heating metal plates to a desired temperature in a shorter time, electric heating is noted.

表面に低融点金属がめっきされた金属板、たとえば、Ａｌがめっきされた鋼板を、通電加熱すると、めっき金属が、特定の方向に移動することが知られている。具体的には、めっき金属の一部が、金属板の面内方向、かつ、金属板を流れる電流の方向に直交する方向に移動し、その結果、めっき層に薄い部分と厚い部分とが生じる。このようにめっき金属が移動する現象を、以下、「めっき層の寄り」ともいう。   It is known that, when a metal plate having a low melting point metal plated on its surface, for example, a steel plate plated with Al, is heated electrically, the plated metal moves in a specific direction. Specifically, a part of the plated metal moves in the in-plane direction of the metal plate and in the direction orthogonal to the direction of the current flowing through the metal plate, resulting in a thin portion and a thick portion in the plated layer . The phenomenon in which the plating metal moves in this manner is hereinafter also referred to as "the side of the plating layer".

めっき層の寄りが生じると、成形品の外観が損なわれ、また、めっき層厚が薄い部分では耐食性が低下する。めっき層の寄りは、加熱によりめっき層の融液が生じ、この融液に流れる電流によるローレンツ力が作用することにより生ずるものと考えられている。   When the plating layer is shifted, the appearance of the molded product is impaired, and the corrosion resistance is lowered in the portion where the plating layer thickness is thin. The plating layer is considered to be generated by the generation of a melt of the plating layer by heating and the action of Lorentz force by the current flowing through the melt.

このようなめっき層の寄りを防止するため、種々の方法が提案されている。特許文献１では、めっき鋼鈑の電流が流れる方向に延びる側縁に対して絶縁間隙を挟んで延びる側縁を有する補助通電板を、めっき鋼鈑と同一平面内に並べ、めっき鋼鈑および補助通電板に同位相の電流を通電する装置が提案されている。この装置では、補助通電板に流れる電流によるローレンツ力で、金属板に流れる電流によるローレンツ力の少なくとも一部が打ち消される。   Various methods have been proposed to prevent such displacement of the plating layer. In Patent Document 1, an auxiliary current-carrying plate having side edges extending across the insulating gap with respect to side edges extending in the direction of current flow of the plated steel plate is arranged in the same plane as the plated steel plate. An apparatus has been proposed which applies current of the same phase to the current-carrying plate. In this device, at least a part of the Lorentz force due to the current flowing through the metal plate is canceled by the Lorentz force due to the current flowing through the auxiliary conducting plate.

また、特許文献２では、めっき鋼板の表面に直交する壁面を有する強磁性の磁束誘導体を、めっき鋼板の電流が流れる方向に延びる側面に沿って配置する装置が提案されている。めっき鋼板の側面と磁束誘導体の壁面との間には、絶縁間隙が設けられる。この装置では、磁束誘導体で金属板に流れる直流電流による磁界を制御することにより、ローレンツ力の少なくとも一部が打ち消される。   Moreover, in patent document 2, the apparatus which arrange | positions the ferromagnetic magnetic flux derivative which has a wall surface orthogonal to the surface of a plated steel plate along the side surface extended in the direction through which the electric current of a plated steel plate flows is proposed. An insulating gap is provided between the side surface of the plated steel plate and the wall surface of the magnetic flux conductor. In this device, at least a part of the Lorentz force is canceled by controlling the magnetic field by the direct current flowing to the metal plate with the magnetic flux derivative.

特許文献３には、ホットスタンプ用めっき金属板と同一形状の金属導体と、ホットスタンプ用めっき金属板とを、位置を揃えて平行に配置し、ホットスタンプ用めっき金属板と金属導体とを電気的に接続して通電することが提案されている。   In Patent Document 3, a metal conductor having the same shape as a plated metal plate for hot stamping and a plated metal plate for hot stamp are arranged in parallel with each other at the same position, and the plated metal plate for hot stamp and the metal conductor are electrically It is proposed to connect in order to apply current.

図１Ａに、特許文献３に開示された通電加熱装置での、めっき金属板と金属導体との電気的接続態様の一例を示し、図１Ｂに、その通電回路を示す。図１Ａおよび図１Ｂに示す態様は、特許文献３に開示された各種の態様の中では、めっき層の寄りを抑制する効果を最も大きくすることができると考えられる。   FIG. 1A shows an example of an electrical connection mode between a plated metal plate and a metal conductor in the electric heating device disclosed in Patent Document 3, and FIG. 1B shows its electric conduction circuit. Among the various embodiments disclosed in Patent Document 3, it is considered that the embodiment shown in FIG. 1A and FIG. 1B can maximize the effect of suppressing the shift of the plating layer.

この通電加熱装置は、金属導体４Ａ、４Ｂを備えている。金属導体４Ａと金属導体４Ｂとは、互いに同じ形状（平面形状は、ホットスタンプ用素材１と同じ）を有し、互いに同じ材料からなる。したがって、金属導体４Ａと金属導体４Ｂとは、同じ電気抵抗を有する。   This energization heating device includes metal conductors 4A and 4B. The metal conductor 4A and the metal conductor 4B have the same shape (the planar shape is the same as the hot stamping material 1), and are made of the same material. Therefore, metal conductor 4A and metal conductor 4B have the same electrical resistance.

ホットスタンプ用素材（めっき金属板）１と金属導体４Ａ、４Ｂとは、位置を揃えて配置されている。金属導体４Ａ、４Ｂは、それぞれ、ホットスタンプ用素材１の表面と裏面とに、間隙をおいて対向されている。ホットスタンプ用素材１と金属導体４Ａとの間隔Ｌ１は、ホットスタンプ用素材１と金属導体４Ｂとの間隔Ｌ２に等しい。ホットスタンプ用素材１の両端と金属導体４Ａ、４Ｂの両端とには、給電部材２が電気的に接続されている。   The material for hot stamping (plated metal plate) 1 and the metal conductors 4A and 4B are arranged at the same position. The metal conductors 4A and 4B are respectively opposed to the front surface and the back surface of the hot stamp material 1 with a gap. The distance L1 between the hot stamping material 1 and the metal conductor 4A is equal to the distance L2 between the hot stamping material 1 and the metal conductor 4B. A feed member 2 is electrically connected to both ends of the material for hot stamping 1 and to both ends of the metal conductors 4A and 4B.

ホットスタンプ用素材１の端部、および金属導体４Ａ、４Ｂの端部には、給電部材２を介して、電源３が接続されている。電源３に対して、ホットスタンプ用素材１と金属導体４Ａ、４Ｂとは直列に接続されており、金属導体４Ａと金属導体４Ｂとは並列に接続されている。各金属導体４Ａ、４Ｂに流れる電流の向きは、ホットスタンプ用素材１に流れる電流の向きと逆であり、各金属導体４Ａ、４Ｂには、ホットスタンプ用素材１に流れる電流の１／２の電流が流れる。   A power supply 3 is connected to an end of the material for hot stamping 1 and an end of the metal conductors 4A and 4B via a power supply member 2. The material 1 for hot stamping and the metal conductors 4A and 4B are connected in series to the power supply 3, and the metal conductor 4A and the metal conductor 4B are connected in parallel. The direction of the current flowing through each metal conductor 4A, 4B is opposite to the direction of the current flowing through the material 1 for hot stamping, and each metal conductor 4A, 4B is half of the current flowing through the material 1 for hot stamping A current flows.

特開２０１２−１１５８６４号公報JP, 2012-115864, A 特開２０１２−１６６２４２号公報JP, 2012-166242, A 特開２０１２−２２１７８４号公報JP, 2012-221784, A

しかし、特許文献１および２の方法では、めっき層の寄りを抑制する効果は十分ではなく、特に、めっき鋼板の幅が広い場合は、補助通電板、または磁束誘導体を配置することによる効果は限定的なものとなる。   However, in the methods of Patent Documents 1 and 2, the effect of suppressing the displacement of the plating layer is not sufficient, and in particular, when the width of the plated steel plate is wide, the effect by arranging the auxiliary conducting plate or the magnetic flux derivative is limited. It will be

特許文献３の装置を用いた場合は、金属板の幅が狭くなるほど、また、ホットスタンプ用素材と金属導体との間隔が大きくなるほど、ローレンツ力を抑制してめっき層の寄りを抑制する効果は低減する。   When the apparatus of Patent Document 3 is used, the effect of suppressing the Lorentz force and suppressing the shift of the plating layer as the width of the metal plate decreases and as the distance between the material for hot stamping and the metal conductor increases. Reduce.

そこで、本発明の目的は、ホットスタンプ用めっき金属板、特に、ホットスタンプ用めっき鋼板の通電加熱装置であって、従来の通電加熱装置よりも、溶融しためっき層に作用するローレンツ力を小さくして、めっき層の寄りを低減することができる通電加熱装置を提供することである。   Therefore, an object of the present invention is an electric heating apparatus for a plated metal plate for hot stamping, in particular, a plated steel sheet for hot stamp, which reduces Lorentz force acting on a molten plated layer compared to a conventional electric heating apparatus. It is an object of the present invention to provide an electric heating apparatus capable of reducing the deviation of the plating layer.

本発明は、下記通電加熱装置を要旨とする。
第１および第２端部を有するホットスタンプ用めっき金属板に通電して加熱する通電加熱装置であって、
前記めっき金属板と同じ平面形状を有し、前記めっき金属板の第１表面に対向されて前記めっき金属板に平行に配置される第１補助通電板であって、前記めっき金属板の前記第１および第２端部とそれぞれ位置を揃えて配置される第１および第２端部を有する第１補助通電板と、
前記めっき金属板と同じ平面形状を有し、前記めっき金属板の第２表面に対向されて前記めっき金属板に平行に配置される第２補助通電板であって、前記めっき金属板の前記第１および第２端部とそれぞれ位置を揃えて配置される第１および第２端部を有する第２補助通電板と、
前記めっき金属板の第１および第２端部、ならびに前記第１および第２補助通電板の各々の第１および第２端部に接続され、前記めっき金属板に電流を流すとともに、前記第１および第２補助通電板の各々に、前記めっき金属板に流れる電流の大きさの１／２より大きく前記めっき金属板に流れる電流と逆向きの電流を流すための電源装置とを備えた、ホットスタンプ用めっき金属板の通電加熱装置。 The present invention provides the following electric heating device as a gist.
An electroheating apparatus for heating a plated metal plate for a hot stamp having first and second ends by energization.
A first auxiliary current-carrying plate having the same planar shape as the plated metal plate and facing a first surface of the plated metal plate and disposed in parallel to the plated metal plate, A first auxiliary current-carrying plate having first and second ends disposed in alignment with the first and second ends, respectively;
A second auxiliary current-carrying plate having the same planar shape as the plated metal plate and facing the second surface of the plated metal plate and disposed in parallel to the plated metal plate, wherein A second auxiliary current-carrying plate having first and second ends disposed in alignment with the first and second ends, respectively;
The first and second ends of the plated metal plate, and the first and second ends of each of the first and second auxiliary current-carrying plates are connected to pass a current to the plated metal plate, and And a power supply device for supplying a current in the opposite direction to the current flowing through the plated metal plate to each of the second auxiliary current conducting plates by more than 1/2 of the magnitude of the current flowing through the plated metal plate Electric heating device for plated metal plate for stamps.

本発明の通電加熱装置によれば、ホットスタンプ用めっき金属板に通電して加熱する際、従来の通電加熱装置を用いた場合に比して、溶融しためっき層が一方向に移動する現象（めっき層の寄り）を抑制することができる。その結果、ホットスタンプにより得られる成型品の表面性状を良好なものとすることができる。   According to the heating apparatus of the present invention, when heating and heating the plated metal plate for hot stamping, a phenomenon in which the molten plating layer moves in one direction as compared with the case where the conventional heating apparatus is used ( The plating layer can be suppressed). As a result, the surface properties of the molded article obtained by the hot stamping can be made favorable.

図１Ａは、従来の通電加熱装置を用いた場合のホットスタンプ用素材および金属導体の電気的接続態様を示す図である。FIG. 1A is a view showing an electrical connection mode of a material for a hot stamp and a metal conductor when using a conventional electric heating device. 図１Ｂは、図１Ａに示すホットスタンプ用素材および金属導体の通電回路を示す図である。FIG. 1B is a diagram showing the hot stamp material shown in FIG. 1A and a conductive circuit of a metal conductor. 図２Ａは、本発明の第１の実施形態に係る通電加熱装置の構成を示す図である。FIG. 2A is a view showing the configuration of a current-carrying heating device according to the first embodiment of the present invention. 図２Ｂは、本発明の第１の実施形態の変形例に係る通電加熱装置の構成を示す図である。FIG. 2B is a view showing the configuration of a current-carrying heating device according to a modification of the first embodiment of the present invention. 図３Ａは、本発明の第２の実施形態に係る通電加熱装置の構成を示す図である。FIG. 3A is a view showing the configuration of a current-carrying heating device according to a second embodiment of the present invention. 図３Ｂは、本発明の第２の実施形態に係る通電加熱装置の変形例の構成を示す図である。FIG. 3B is a view showing the configuration of a modification of the current-carrying heating device according to the second embodiment of the present invention. 図４は、めっき金属板の幅方向に関して、めっき金属板の中央からの距離と、その位置で生じるローレンツ力の大きさとの関係を示す図である。FIG. 4 is a view showing the relationship between the distance from the center of the plated metal plate and the magnitude of the Lorentz force generated at that position in the width direction of the plated metal plate.

図１Ａおよび図１Ｂを参照して、特許文献３の通電加熱装置を用いた場合は、金属導体４Ａ、４Ｂの各々に流れる電流の大きさは、ホットスタンプ用素材１に流れる電流の大きさの１／２に固定される。本発明者らは、このような制約を取り除き、金属導体４Ａ、４Ｂの各々に流れる電流の大きさを、ホットスタンプ用素材１に流れる電流の大きさの１／２より大きくすることを可能とすれば、ローレンツ力を抑制する効果が、より大きくなることを知見した。本発明は、このような知見に基づいて完成したものである。   With reference to FIGS. 1A and 1B, in the case of using the electric heating device of Patent Document 3, the magnitude of the current flowing in each of the metal conductors 4A and 4B is the magnitude of the current flowing in the material 1 for hot stamping. It is fixed to 1/2. The present inventors have been able to remove such restrictions and make the magnitude of the current flowing in each of the metal conductors 4A and 4B larger than half of the magnitude of the current flowing in the hot stamping material 1. It has been found that the effect of suppressing the Lorentz force is further enhanced. The present invention has been completed based on such findings.

本発明の通電加熱装置は、上述のように、第１および第２端部を有するホットスタンプ用めっき金属板に通電して加熱するためのものである。この通電加熱装置は、第１補助通電板と、第２補助通電板と、電源装置とを備えている。第１補助通電板は、めっき金属板と同じ平面形状を有し、めっき金属板の第１表面に対向されてめっき金属板に平行に配置される。第１補助通電板は、めっき金属板の第１および第２端部とそれぞれ位置を揃えて配置される第１および第２端部を有する。第２補助通電板は、めっき金属板と同じ平面形状を有し、めっき金属板の第２表面に対向されてめっき金属板に平行に配置される。第２補助通電板は、めっき金属板の第１および第２端部とそれぞれ位置を揃えて配置される第１および第２端部を有する。電源装置は、めっき金属板の第１および第２端部、ならびに第１および第２補助通電板の各々の第１および第２端部に接続され、めっき金属板に電流を流すとともに、第１および第２補助通電板の各々に、めっき金属板に流れる電流の大きさの１／２より大きくめっき金属板に流れる電流と逆向きの電流を流すための電源装置とを備えている。   The electric heating apparatus of the present invention, as described above, is for supplying current to and heating the plated metal plate for a hot stamp having the first and second ends. The energization heating device includes a first auxiliary energization plate, a second auxiliary energization plate, and a power supply. The first auxiliary conduction plate has the same planar shape as the plated metal plate, is opposed to the first surface of the plated metal plate, and is disposed parallel to the plated metal plate. The first auxiliary conduction plate has first and second ends disposed in alignment with the first and second ends of the plated metal plate, respectively. The second auxiliary current-carrying plate has the same planar shape as the plated metal plate, is opposed to the second surface of the plated metal plate, and is disposed parallel to the plated metal plate. The second auxiliary conduction plate has first and second ends which are disposed in alignment with the first and second ends of the plated metal plate, respectively. The power supply device is connected to the first and second ends of the plated metal plate, and the first and second ends of each of the first and second auxiliary current carrying plates, and supplies a current to the plated metal plate, and And each of the second auxiliary current-carrying plates is provided with a power supply device for flowing a current in the opposite direction to the current flowing in the plated metal plate by more than half of the magnitude of the current flowing in the plated metal plate.

めっき金属板において、０．１ＭＮ／ｍ3以下のローレンツ力が作用する部分では、通常、溶融しためっき層の移動は生じない。本発明の通電加熱装置によれば、めっき金属板に流れる電流の大きさに対する、第１および第２補助通電板に流れる電流の大きさの比を適切なものとすることにより、めっき金属板の側部領域を除く広い領域について、その領域内の各部に作用するローレンツ力を０．１ＭＮ／ｍ3以下にすることができる。この領域は、めっき金属板の幅方向に関して、たとえば、当該幅の９０％の領域である。 In the portion where the Lorentz force of 0.1 MN / m 3 or less acts in the plated metal sheet, the movement of the molten plated layer does not generally occur. According to the electric heating apparatus of the present invention, the ratio of the magnitude of the current flowing through the first and second auxiliary conducting plates to the magnitude of the current flowing through the plated metal plate is made appropriate, For a wide area excluding the side area, the Lorentz force acting on each part in the area can be 0.1 MN / m 3 or less. This area is, for example, an area of 90% of the width in the width direction of the plated metal plate.

めっき金属板の側部（電流が流れる方向に直交する方向の縁部）は、めっき層の寄り等により品質が良好ではない場合は、トリミングにより除去することができる。本発明の通電加熱装置により、そのような除去する領域を少なくすることができる。   The side portions of the plated metal plate (the edge portions in the direction orthogonal to the direction in which the current flows) can be removed by trimming if the quality is not good due to displacement of the plating layer or the like. The electric heating device of the present invention can reduce the area to be removed.

以下、図面を参照して、本発明の通電加熱装置の実施形態について具体的に説明する。
図２Ａは、本発明の第１の実施形態に係る通電加熱装置の構成を示す図である。 Hereinafter, with reference to drawings, an embodiment of an electric heating device of the present invention is concretely described.
FIG. 2A is a view showing the configuration of a current-carrying heating device according to the first embodiment of the present invention.

この通電加熱装置１０は、めっき金属板１１をホットスタンプ加工するに際して、めっき金属板１１に通電して加熱するためのものである。通電加熱装置１０は、第１および第２補助通電板１２、１３を備えている。第１補助通電板１２は、めっき金属板１１の第１表面（図２Ａにおいて上面）に対向されてめっき金属板１１に平行に配置される。第２補助通電板１３は、めっき金属板１１の第２表面（図２Ａにおいて下面）に対向されてめっき金属板１１に平行に配置される。   The electric heating device 10 is for heating the plated metal plate 11 by heating when the plated metal plate 11 is hot stamped. The electric heating device 10 includes first and second auxiliary electric conduction plates 12 and 13. The first auxiliary conduction plate 12 is disposed in parallel to the plated metal plate 11 so as to face the first surface (upper surface in FIG. 2A) of the plated metal plate 11. The second auxiliary conduction plate 13 is disposed in parallel to the plated metal plate 11 so as to face the second surface (the lower surface in FIG. 2A) of the plated metal plate 11.

めっき金属板１１は、たとえば、表面に低融点金属（Ａｌ、Ｚｎ、Ｓｎ等）がめっきされた鋼板であってもよい。これらの低融点金属は、ホットスタンプを行うに際しての加熱により、液相を生ずる。第１および第２補助通電板１２、１３は、熱伝導が大きい材料からなることが好ましく、たとえば、銅または銅合金からなる。   The plated metal plate 11 may be, for example, a steel plate having a low melting point metal (Al, Zn, Sn, etc.) plated on the surface. These low melting metals form a liquid phase upon heating when hot stamping is performed. The first and second auxiliary current-carrying plates 12 and 13 are preferably made of a material having high thermal conductivity, for example, copper or a copper alloy.

めっき金属板１１ならびに第１および第２補助通電板１２、１３は、いずれも板状であり、これらを垂直に見て、第１および第２補助通電板１２、１３の各々は、めっき金属板１１と、実質的に同じ平面形状（この実施形態では、矩形）および大きさを有する。   The plated metal plate 11 and the first and second auxiliary conducting plates 12 and 13 are both plate-shaped, and when viewed vertically, each of the first and second auxiliary conducting plates 12 and 13 is a plated metal plate And 11 have substantially the same planar shape (rectangular in this embodiment) and size.

通電加熱装置１０は、めっき金属板１１ならびに第１および第２補助通電板１２、１３の各々の長手方向両端部にそれぞれ取り付けられる給電部材１４を備えている。給電部材１４は、導電性を有する。以下、めっき金属板１１ならびに第１および第２補助通電板１２、１３のそれぞれについて、長手方向の同じ一方側（図２Ａで右側）の端部を「第１端部」といい、他方側（図２Ａで左側）の端部を「第２端部」という。   The electric heating device 10 is provided with a feeding member 14 attached to each of longitudinal ends of each of the plated metal plate 11 and the first and second auxiliary conduction plates 12 and 13. The power supply member 14 has conductivity. Hereinafter, for each of the plated metal plate 11 and the first and second auxiliary current-carrying plates 12 and 13, the end on the same side in the longitudinal direction (right side in FIG. 2A) is referred to as the "first end", and the other side The end of FIG. 2A) is referred to as the “second end”.

めっき金属板１１の第１端部に取り付けられた給電部材１４には、非磁性絶縁体を介して、第１補助通電板１２の第１端部に取り付けられた給電部材１４と、第２補助通電板１３の第１端部に取り付けられた給電部材１４とが重ねられる。また、めっき金属板１１の第２端部に取り付けられた給電部材１４には、非磁性絶縁体を介して、第１補助通電板１２の第２端部に取り付けられた給電部材１４と、第２補助通電板１３の第２端部に取り付けられた給電部材１４とが重ねられる。   The feeding member 14 attached to the first end of the plated metal plate 11 includes the feeding member 14 attached to the first end of the first auxiliary conduction plate 12 via a nonmagnetic insulator, and the second assistance The feed member 14 attached to the first end of the current-carrying plate 13 is superimposed. The feed member 14 attached to the second end of the plated metal plate 11 includes the feed member 14 attached to the second end of the first auxiliary conduction plate 12 via a nonmagnetic insulator, and The feed member 14 attached to the second end of the auxiliary current-carrying plate 13 is overlapped.

これにより、めっき金属板１１の第１および第２端部に対して、それぞれ、第１補助通電板１２の第１および第２端部が位置を揃えて配置されるとともに、第２補助通電板１３の第１および第２端部が位置を揃えて配置される。また、めっき金属板１１と第１補助通電板１２との間隔は、めっき金属板１１と第２補助通電板１３との間隔に等しくなる。   As a result, the first and second ends of the first auxiliary conduction plate 12 are arranged at the same position with respect to the first and second ends of the plated metal plate 11, respectively, and the second auxiliary conduction plate The first and second ends of the thirteen are aligned. Further, the distance between the plated metal plate 11 and the first auxiliary conduction plate 12 is equal to the distance between the plated metal plate 11 and the second auxiliary conduction plate 13.

通電加熱装置１０は、給電部材１４を介してめっき金属板１１に直流電流を流すための第１電源１５と、給電部材１４を介して第１および第２補助通電板１２、１３の各々に直流電流を流すための第２電源１６とを含む。   The electric heating device 10 applies a DC current to each of the first and second auxiliary electric conduction plates 12 and 13 through the power supply member 14 and the first power supply 15 for supplying a DC current to the plated metal plate 11 through the power supply member 14. And a second power supply 16 for passing a current.

第２電源１６は、第１および第２出力端子１６ａ、１６ｂを含む。第１出力端子１６ａは、第１補助通電板１２の第１端部と、第２補助通電板１３の第１端部とに接続されており、第２出力端子１６ｂは、第１補助通電板１２の第２端部と、第２補助通電板１３の第２端部とに接続されている。すなわち、第１補助通電板１２と第２補助通電板１３とは、第２電源１６に対して並列に接続されている。また、第１補助通電板１２と第２補助通電板１３とは、互いに実質的に同じ大きさの電気抵抗を有する。このため、第２電源１６により第１および第２補助通電板１２、１３に電圧を印加すると、第１補助通電板１２に流れる電流の大きさと第２補助通電板１３に流れる電流の大きさとは、実質的に同じになる。第２電源１６は、第１電源１５によりめっき金属板１１に流される電流と逆向きの電流を、第１および第２補助通電板１２、１３の各々に流す。   The second power supply 16 includes first and second output terminals 16a and 16b. The first output terminal 16a is connected to the first end of the first auxiliary conduction plate 12 and the first end of the second auxiliary conduction plate 13. The second output terminal 16b is a first auxiliary conduction plate. The second end of the second auxiliary conduction plate 13 is connected to the second end of the second auxiliary conduction plate 13. That is, the first auxiliary conduction plate 12 and the second auxiliary conduction plate 13 are connected in parallel to the second power supply 16. In addition, the first auxiliary conduction plate 12 and the second auxiliary conduction plate 13 have electrical resistance substantially the same magnitude as each other. Therefore, when a voltage is applied to the first and second auxiliary conduction plates 12 and 13 by the second power supply 16, the magnitude of the current flowing through the first auxiliary conduction plate 12 and the magnitude of the current flowing through the second auxiliary conduction plate 13 are , Will be substantially the same. The second power supply 16 supplies a current reverse to the current supplied to the plated metal plate 11 by the first power supply 15 to each of the first and second auxiliary current-carrying plates 12 and 13.

第１電源１５の出力電圧は可変であり、これにより、めっき金属板１１に流れる直流電流の大きさを調整することができる。同様に、第２電源１６の出力電圧は可変であり、これにより、第１および第２補助通電板１２、１３に流れる直流電流の大きさを調整することができる。第１電源１５により、めっき金属板１１に第１および第２端部を介して流される電流の大きさをＩ1とすると、第２電源１６は、大きさＩ2が１／２×Ｉ1より大きな電流を、第１および第２補助通電板１２、１３の各々に第１および第２端部を介して流すことができる。 The output voltage of the first power supply 15 is variable, whereby the magnitude of the direct current flowing to the plated metal plate 11 can be adjusted. Similarly, the output voltage of the second power supply 16 is variable, which makes it possible to adjust the magnitude of the direct current flowing through the first and second auxiliary conduction plates 12 and 13. The first power source 15, the magnitude of the current flowing through the first and second ends to the plated metal plates 11 and I 1, second power supply 16, the size I 2 is 1/2 × I 1 Larger currents can be passed through the first and second ends of the first and second auxiliary plates 12, 13, respectively.

めっき金属板１１を通電加熱する際は、まず、めっき金属板１１ならびに第１および第２補助通電板１２、１３が上述のように配置され、これらに対して、第１および第２電源１５、１６が上述のように接続された状態とする。第１および第２補助通電板１２、１３ならびにめっき金属板１１の変形（たとえば、撓み）により、これらのうち隣接するものが接触しないように、第１および第２補助通電板１２、１３の各々は、めっき金属板１１と、１ｍｍ以上の間隔をあけて配置されることが好ましい。   When the plated metal plate 11 is heated by electric current, first, the plated metal plate 11 and the first and second auxiliary conducting plates 12 and 13 are arranged as described above, with respect to the first and second power supplies 15, 16 is connected as described above. Each of the first and second auxiliary current-carrying plates 12 and 13 so that adjacent ones of the first and second auxiliary current-carrying plates 12 and 13 and the plated metal plate 11 do not contact due to deformation (for example, deflection) It is preferable that the plating metal plate 11 be disposed at an interval of 1 mm or more.

そして、第１電源１５により、めっき金属板１１に直流電流Ｉ1を流すとともに、第２電源１６により、第１および第２補助通電板１２、１３の各々に、直流電流Ｉ2を流す。第１および第２補助通電板１２、１３を流れる電流の向きは、めっき金属板１１を流れる電流の向きと逆になるようにする。図２Ａに、電流の向きの例を、矢印で示す。また、第１および第２補助通電板１２、１３の各々を流れる電流の大きさＩ2は、めっき金属板１１を流れる電流の大きさＩ1の１／２より大きくなるようにする。 Then, while the direct current I 1 is caused to flow to the plated metal plate 11 by the first power supply 15, the direct current I 2 is caused to flow to each of the first and second auxiliary conducting plates 12 and 13 by the second power supply 16. The direction of the current flowing through the first and second auxiliary conducting plates 12 and 13 is made opposite to the direction of the current flowing through the plated metal plate 11. An example of the direction of the current is shown by arrows in FIG. 2A. The size I 2 of the current flowing through each of the first and second switch assisting plate 12, 13 to be larger than half the size of I 1 of the current flowing through the plated metal plate 11.

第１および第２補助通電板１２、１３の各々を流れる電流の大きさＩ2を適切に選択することにより、Ｉ2＝１／２×Ｉ1とした場合に比して、めっき金属板１１に流れる電流によって生じる磁場によりめっき金属板１１に生じるローレンツ力を、第１および第２補助通電板１２、１３に流れる電流によって生じる磁場により、低減することができる。これにより、めっき金属板１１に通電加熱することにより、めっき層が溶融しても、その融液に作用するローレンツ力を抑制し、その融液の移動を抑制することができる。したがって、この通電加熱装置１０を用いた通電加熱により、従来の通電加熱装置を用いた場合に比して、めっき層の寄りを抑制することができる。 By appropriately selecting the magnitude I 2 of the current flowing through each of the first and second auxiliary current-carrying plates 12 and 13, the plated metal plate 11 can be made as compared to the case where I 2 = 1/2 × I 1. The Lorentz force generated in the plated metal plate 11 by the magnetic field generated by the current flowing through can be reduced by the magnetic field generated by the current flowing in the first and second auxiliary conductive plates 12 and 13. Thereby, even if a plating layer fuse | melts by electrically heating to the metal-plating metal plate 11, Lorentz force which acts on the melt can be suppressed, and the movement of the melt can be suppressed. Therefore, the displacement of the plating layer can be suppressed by the conduction heating using the conduction heating device 10 as compared to the case where the conventional electric conduction heating device is used.

第１および第２補助通電板１２、１３は、めっき金属板１１と同じ平面形状および大きさを有するので、めっき金属板１１と第１および第２補助通電板１２、１３との間隔、および、この間隔に応じた第１および第２補助通電板１２、１３への通電量を、それぞれ適切に設定した場合、めっき層の寄りを抑制する効果は、めっき金属板１１の幅が広い場合でも、めっき金属板１１の大部分の領域に及ぶ。   Since the first and second auxiliary current-carrying plates 12 and 13 have the same planar shape and size as the plated metal plate 11, the distance between the plated metal plate 11 and the first and second auxiliary current-carrying plates 12 and 13; When the amounts of current supplied to the first and second auxiliary current-carrying plates 12 and 13 according to the distance are appropriately set, the effect of suppressing the displacement of the plating layer is that even when the width of the plated metal plate 11 is wide, It covers most of the area of the plated metal plate 11.

図２Ｂは、本発明の第１の実施形態の変形例に係る通電加熱装置の構成を示す図である。図２Ｂにおいて、図２Ａに示す構成要素に対応する構成要素には、図２Ａと同じ参照符号を付して説明を省略する。   FIG. 2B is a view showing the configuration of a current-carrying heating device according to a modification of the first embodiment of the present invention. In FIG. 2B, the components corresponding to the components shown in FIG. 2A are assigned the same reference numerals as in FIG. 2A and the description thereof is omitted.

この通電加熱装置２０は、図２Ａに示す通電加熱装置１０の第１および第２電源１５、１６の代わりに、それぞれ、第１および第２電源２５、２６を備えている。第２電源２６は、第１および第２出力端子２６ａ、２６ｂを含む。第１出力端子２６ａは、第１補助通電板１２の第１端部と、第２補助通電板１３の第１端部とに接続されており、第２出力端子２６ｂは、第１補助通電板１２の第２端部と、第２補助通電板１３の第２端部とに接続されている。   The electric heating device 20 includes first and second power supplies 25 and 26 instead of the first and second power supplies 15 and 16 of the electric heating device 10 shown in FIG. 2A. The second power supply 26 includes first and second output terminals 26a and 26b. The first output terminal 26a is connected to the first end of the first auxiliary conduction plate 12 and the first end of the second auxiliary conduction plate 13. The second output terminal 26b is a first auxiliary conduction plate. The second end of the second auxiliary conduction plate 13 is connected to the second end of the second auxiliary conduction plate 13.

第１および第２電源２５、２６は、いずれも、互いに同じ周波数の交流電圧を発生する。第１電源２５により、めっき金属板１１に交流電流を流すことができる。第２電源２６は、第１電源２５によってめっき金属板１１に流される電流（大きさがＩ1）と同じ周波数を有し、大きさＩ2が１／２×Ｉ1より大きい交流電流を、第１および第２補助通電板１２、１３の各々に流すことが可能である。図２Ｂには、ある瞬間における電流の向きを矢印で示す。 The first and second power supplies 25 and 26 both generate alternating voltages having the same frequency as each other. An alternating current can be supplied to the plated metal plate 11 by the first power supply 25. The second power supply 26 has the same frequency as the current (magnitude is I 1 ) supplied to the plated metal plate 11 by the first power supply 25 and has an alternating current having a magnitude I 2 larger than 1/2 × I 1 , It is possible to flow in each of the first and second auxiliary current-carrying plates 12 and 13. In FIG. 2B, the direction of the current at a certain moment is indicated by an arrow.

通電加熱装置２０は、同期装置２７を備えている。同期装置２７は、めっき金属板１１に流れる交流電流と第１および第２補助通電板１２、１３を流れる交流電流とを逆位相になるように同期させる。   The electric heating device 20 is provided with a synchronization device 27. The synchronization device 27 synchronizes the alternating current flowing through the plated metal plate 11 and the alternating current flowing through the first and second auxiliary conducting plates 12 and 13 so as to be in reverse phase.

同期装置２７によって、このように同期を行うと、めっき金属板１１を流れる電流の向きと、第１および第２補助通電板１２、１３の各々を流れる電流の向きとは、常に逆になるので、図２Ａに示す実施形態の場合と同様に、めっき金属板１１の通電加熱により生じる融液に作用するローレンツ力を抑制し、その融液の移動を抑制することができる。   Since the direction of the current flowing through the plated metal plate 11 and the direction of the current flowing through each of the first and second auxiliary conducting plates 12 and 13 are always reversed when synchronization is performed in this manner by the synchronization device 27. Similarly to the embodiment shown in FIG. 2A, it is possible to suppress the Lorentz force acting on the melt generated by the electric heating of the plated metal plate 11, and to suppress the movement of the melt.

図３Ａは、本発明の第２の実施形態に係る通電加熱装置の構成を示す図である。図３Ａにおいて、図２Ａに示す構成要素に対応する構成要素には、図２Ａと同じ参照符号を付して説明を省略する。   FIG. 3A is a view showing the configuration of a current-carrying heating device according to a second embodiment of the present invention. In FIG. 3A, components corresponding to the components shown in FIG. 2A are assigned the same reference numerals as in FIG.

この通電加熱装置３０は、１対の出力端子である第１および第２端子３５ａ、３５ｂを有する電源３５と、第１および第２回路３７、３８とを備えている。電源３５は、直流電圧を発生するものであってもよく、交流電圧を発生するものであってもよい。第１および第２回路３７、３８は、電源３５に対して、めっき金属板１１と、第１補助通電板１２と、第２補助通電板１３とを並列に接続する回路を形成する。   The electric heating device 30 includes a power supply 35 having first and second terminals 35a and 35b, which are a pair of output terminals, and first and second circuits 37 and 38. The power source 35 may generate a DC voltage or may generate an AC voltage. The first and second circuits 37 and 38 form a circuit connecting the plated metal plate 11, the first auxiliary conduction plate 12, and the second auxiliary conduction plate 13 in parallel to the power supply 35.

第１回路３７は、電源３５の第１出力端子３５ａと、めっき金属板１１の第１端部、第１補助通電板１２の第２端部、および第２補助通電板１３の第２端部とを電気的に接続する。第１回路３７は、電源３５の第１出力端子３５ａとめっき金属板１１の第１端部とを接続し第１分岐点Ｐ１が設けられた導電経路と、第１補助通電板１２の第２端部と第２補助通電板１３の第２端部とを接続し第２分岐点Ｐ２が設けられた導電経路と、第１分岐点Ｐ１と第２分岐点Ｐ２とを接続する導電経路とを含む。   The first circuit 37 includes a first output terminal 35 a of the power source 35, a first end of the plated metal plate 11, a second end of the first auxiliary conduction plate 12, and a second end of the second auxiliary conduction plate 13. And electrically connected. The first circuit 37 connects the first output terminal 35 a of the power source 35 to the first end of the plated metal plate 11 and provides the first branch point P 1, and the second auxiliary conductive plate 12. A conductive path connecting the end and the second end of the second auxiliary current-carrying plate 13 and provided with the second branch point P2, and a conductive path connecting the first branch point P1 and the second branch point P2 Including.

第２回路３８は、電源３５の第２出力端子３５ｂと、めっき金属板１１の第２端部、第１補助通電板１２の第１端部、および第２補助通電板１３の第１端部とを電気的に接続する。第２回路３８は、電源３５の第２出力端子３５ｂとめっき金属板１１の第２端部とを接続し第３分岐点Ｐ３が設けられた導電経路と、第１補助通電板１２の第１端部と第２補助通電板１３の第１端部とを接続し第４分岐点Ｐ４が設けられた導電経路と、第３分岐点Ｐ３と第４分岐点Ｐ４とを接続する導電経路とを含む。   The second circuit 38 includes a second output terminal 35 b of the power source 35, a second end of the plated metal plate 11, a first end of the first auxiliary conduction plate 12, and a first end of the second auxiliary conduction plate 13. And electrically connected. The second circuit 38 connects the second output terminal 35 b of the power source 35 to the second end of the plated metal plate 11 and provides the third branch point P 3, and the first auxiliary conductive plate 12 A conductive path connecting the end and the first end of the second auxiliary current-carrying plate 13 and provided with a fourth branch point P4, and a conductive path connecting the third branch point P3 and the fourth branch point P4 Including.

第１分岐点Ｐ１と第２分岐点Ｐ２との間の導電経路、および第３分岐点Ｐ３と第４分岐点Ｐ４との間の導電経路には、第１可変抵抗器Ｒ１１、Ｒ１２が、それぞれ介装されている。第１分岐点Ｐ１とめっき金属板１１の第１端部との間の導電経路、および第３分岐点Ｐ３とめっき金属板１１の第２端部との間の導電経路には、第２可変抵抗器Ｒ２１、Ｒ２２が、それぞれ介装されている。   In the conductive path between the first branch point P1 and the second branch point P2 and in the conductive path between the third branch point P3 and the fourth branch point P4, first variable resistors R11 and R12 are respectively provided. It is interspersed. A second variable path is provided for the conductive path between the first branch point P1 and the first end of the plated metal plate 11, and the conductive path between the third branch point P3 and the second end of the plated metal plate 11. Resistors R21 and R22 are respectively interposed.

第１可変抵抗器Ｒ１１および第１可変抵抗器Ｒ１２の少なくとも一方の抵抗値を大きくすると、第１および第２補助通電板１２、１３の各々に流れる電流の大きさＩ2が小さくなる。第２可変抵抗器Ｒ２１および第２可変抵抗器Ｒ２２の少なくとも一方の抵抗値を大きくすると、めっき金属板１１に流れる電流の大きさＩ1が小さくなる。すなわち、第１可変抵抗器Ｒ１１、Ｒ１２および第２可変抵抗器Ｒ２１、Ｒ２２の抵抗値を調整（いずれかの可変抵抗器の抵抗値をゼロにする場合を含む。）することにより、これらの電流の大きさＩ1、Ｉ2を調整することができる。 Increasing the first variable resistor R11 and at least one of the resistance value of the first variable resistor R12, the magnitude I 2 of the current flowing in each of the first and second switch assisting plates 12 and 13 is reduced. Increasing at least one of the resistance value of the second variable resistor R21 and the second variable resistor R22, the magnitude I 1 of the current flowing through the plated metal plate 11 is reduced. That is, these currents are adjusted by adjusting the resistance values of the first variable resistors R11 and R12 and the second variable resistors R21 and R22 (including the case where the resistance value of any variable resistor is made zero). The sizes I 1 and I 2 can be adjusted.

この実施形態では、電源３５が、直流電圧を発生するものである場合および交流電圧を発生するものである場合のいずれであっても、第１および第２補助通電板１２、１３の各々を流れる電流の向きは、常に、めっき金属板１１を流れる電流の向きと逆になる。また、第１可変抵抗器Ｒ１１、Ｒ１２および第２可変抵抗器Ｒ２１、Ｒ２２それぞれの抵抗値を適切に調整することにより、第１および第２補助通電板１２、１３の各々を流れる電流の大きさＩ2が、めっき金属板１１を流れる電流の大きさＩ1の１／２より大きくなるようにすることができる。 In this embodiment, the power supply 35 flows through each of the first and second auxiliary conducting plates 12 and 13 regardless of whether it generates a DC voltage or an AC voltage. The direction of the current is always opposite to the direction of the current flowing through the plated metal plate 11. Also, by appropriately adjusting the resistance values of the first variable resistor R11, R12 and the second variable resistor R21, R22, the magnitude of the current flowing through each of the first and second auxiliary conducting plates 12, 13 I 2 is able to be larger than half the size of I 1 of the current flowing through the plated metal plate 11.

したがって、この状態で、図２Ａに示す実施形態の場合と同様に、めっき金属板１１の通電加熱により生じる融液に作用するローレンツ力を抑制し、その融液の移動を抑制することができる。   Therefore, in this state, similarly to the embodiment shown in FIG. 2A, it is possible to suppress the Lorentz force acting on the melt generated by the electric heating of the plated metal plate 11, and to suppress the movement of the melt.

めっき金属板１１の通電加熱により生じる融液に作用するローレンツ力は、たとえば、下記パラメータにより変化する。
(i) めっき金属板１１と第１補助通電板１２との間隔、およびめっき金属板１１と第２補助通電板１３との間隔
(ii) めっき金属板１１、ならびに第１および第２補助通電板１２、１３それぞれの板厚
(iii) 第１および第２補助通電板１２、１３の材質 The Lorentz force which acts on the melt which arises by energization heating of plating metal plate 11 changes, for example with the following parameters.
(i) The distance between the plated metal plate 11 and the first auxiliary conduction plate 12 and the distance between the plated metal plate 11 and the second auxiliary conduction plate 13
(ii) Plate thicknesses of the plated metal plate 11 and the first and second auxiliary conducting plates 12 and 13
(iii) Materials of the first and second auxiliary conducting plates 12 and 13

このようなパラメータに応じて、融液全体についてローレンツ力が最小になるように、めっき金属板１１に流れる電流の大きさＩ1、ならびに第１および第２補助通電板１２、１３に流れる電流の大きさＩ2を最適化することが好ましい。第１可変抵抗器Ｒ１１、Ｒ１２および第２可変抵抗器Ｒ２１、Ｒ２２それぞれの抵抗値を調整することにより、このような最適な電流の大きさＩ1、Ｉ2を実現することができる。 According to such parameters, the magnitude I 1 of the current flowing to the plated metal plate 11 and the current flowing to the first and second auxiliary conducting plates 12 and 13 so that the Lorentz force is minimized in the entire melt. it is preferable to optimize the size of I 2. Such optimal current magnitudes I 1 and I 2 can be realized by adjusting the resistance values of the first variable resistor R11 and R12 and the second variable resistor R21 and R22.

第１回路３７の第１可変抵抗器Ｒ１１、および第２回路３８の第１可変抵抗器Ｒ１２の一方は、設けられていなくてもよい。この場合でも、第１回路３７の第１可変抵抗器Ｒ１１、または第２回路３８の第１可変抵抗器Ｒ１２により、第１および第２補助通電板１２、１３に流れる電流の大きさＩ2を調整することができる。同様に、第１回路３７の第２可変抵抗器Ｒ２１、および第２回路３８の第２可変抵抗器Ｒ２２の一方は、設けられていなくてもよい。この場合でも、第１回路３７の第２可変抵抗器Ｒ２１、または第２回路３８の第２可変抵抗器Ｒ２２により、めっき金属板１１に流れる電流の大きさＩ1を調整することができる。 One of the first variable resistor R11 of the first circuit 37 and the first variable resistor R12 of the second circuit 38 may not be provided. In this case, the first variable resistor R12 of the first variable resistor R11 or the second circuit 38, the first circuit 37, the current flowing through the first and second switch assisting plates 12 and 13 the size of I 2 It can be adjusted. Similarly, one of the second variable resistor R21 of the first circuit 37 and the second variable resistor R22 of the second circuit 38 may not be provided. Even in this case, it is possible by the second variable resistor R22 of the second variable resistor R21 or the second circuit 38, the first circuit 37 adjusts the magnitude I 1 of the current flowing through the plated metal plate 11.

さらに、第１および第２補助通電板１２、１３に適切な大きさＩ2の電流が流れる場合は、第１可変抵抗器Ｒ１１、Ｒ１２は設けられていなくてもよい。同様に、めっき金属板１１に適切な大きさＩ1の電流が流れる場合は、第２可変抵抗器Ｒ２１、Ｒ２２は設けられていなくてもよい。さらに、第１および第２補助通電板１２、１３に適切な大きさＩ2の電流が流れ、かつめっき金属板１１に適切な大きさＩ1の電流が流れる場合は、第１可変抵抗器Ｒ１１、Ｒ１２、および第２可変抵抗器Ｒ２１、Ｒ２２のいずれも設けられていなくてもよい。たとえば、第１および第２補助通電板１２、１３の抵抗値、ならびに、電源３５の出力電圧が適切に選択されている場合、第１および第２補助通電板１２、１３に適切な大きさＩ2の電流が流れ、かつめっき金属板１１に適切な大きさＩ1の電流が流れる状態を実現し得る。 Furthermore, if the current of the proper magnitude I 2 flows through the first and second switch assisting plates 12 and 13, the first variable resistor R11, R12 may not be provided. Similarly, if the current of the proper magnitude I 1 flows through the plated metal plate 11, a second variable resistor R21, R22 may not be provided. Furthermore, if the first and second current switch assisting plates 12 and 13 to size I 2 flows, and the current of the plated metal plate 11 to size I 1 flows through the first variable resistor R11 , R12 and the second variable resistors R21 and R22 may not be provided. For example, when the resistance values of the first and second auxiliary current plates 12 and 13 and the output voltage of the power source 35 are properly selected, the appropriate size I for the first and second auxiliary current plates 12 and 13 can be obtained. 2 of current flows, and the current of the proper magnitude I 1 can realize a state flowing in the plated metal plate 11.

この実施形態において、めっき金属板１１に流れる電流の大きさＩ1に対する、第１および第２補助通電板１２、１３の各々に流れる電流の大きさＩ2の比を変更する必要がない場合は、第１可変抵抗器Ｒ１１、Ｒ１２および第２可変抵抗器Ｒ２１、Ｒ２２の代わりに、いずれも、固定抵抗器を用いてもよい。 In this embodiment, when it is not necessary to change the ratio of the magnitude I 2 of the current flowing in each of the first and second auxiliary current carrying plates 12 and 13 to the magnitude I 1 of the current flowing in the plated metal plate 11. In place of the first variable resistor R11, R12 and the second variable resistor R21, R22, any fixed resistor may be used.

図３Ｂは、本発明の第２の実施形態の変形例の構成を示す図である。図３Ｂにおいて、図３Ａに示す構成要素に対応する構成要素には、図３Ａと同じ参照符号を付して説明を省略する。   FIG. 3B is a diagram showing the configuration of a modification of the second embodiment of the present invention. In FIG. 3B, the components corresponding to the components shown in FIG. 3A are assigned the same reference numerals as in FIG. 3A and the description thereof is omitted.

この通電加熱装置３０Ａと図３Ａに示す通電加熱装置３０との差異として、通電加熱装置３０Ａには、可変抵抗器Ｒ１２、Ｒ２２は設けられておらず、第２回路３８の導電経路には、第３分岐点Ｐ３と第４分岐点Ｐ４とが一致した分岐点である分岐点Ｐが設けられている。通電加熱装置３０Ａは、めっき金属板１１に流れる電流の大きさＩ2を調整する手段として、１つの第１可変抵抗Ｒ１（図３Ａの第１可変抵抗器Ｒ１１に対応）を含み、第１および第２補助通電板１２、１３に流れる電流の大きさＩ1を調整する手段として、１つの第２可変抵抗Ｒ２（図３Ａの第２可変抵抗器Ｒ２１に対応）を含む。 As a difference between the heating device 30A and the heating device 30 shown in FIG. 3A, the variable heating devices 30A do not have the variable resistors R12 and R22, and the conductive path of the second circuit 38 A branch point P which is a branch point at which the 3-branch point P3 and the fourth branch point P4 coincide with each other is provided. Resistance heating apparatus 30A, as a means for adjusting the magnitude of I 2 of the current flowing through the plated metal plate 11 includes a first single variable resistor R1 (corresponding to the first variable resistor R11 of FIG. 3A), the first and as means for adjusting the magnitude of I 1 of the current flowing through the second switch assisting plates 12 and 13, including one of the second variable resistor R2 (corresponding to the second variable resistor R21 of FIG. 3A).

第１および第２可変抵抗器Ｒ１、Ｒ２それぞれの抵抗値を適切に調整することにより、第１および第２補助通電板１２、１３の各々を流れる電流の大きさＩ2が、めっき金属板１１を流れる電流の大きさＩ1の１／２より大きくなるようにすることができる。したがって、この状態で、めっき金属板１１の通電加熱により生じる融液に作用するローレンツ力を抑制し、その融液の移動を抑制することができる。 First and by the second variable resistor R1, R2 to appropriately adjust the resistance values, the magnitude I 2 of the current flowing through each of the first and second switch assisting plate 12 and 13, the plated metal plate 11 it can be made to be larger than half the size of I 1 of the current flowing through. Therefore, in this state, it is possible to suppress the Lorentz force acting on the melt generated by the electric current heating of the plated metal plate 11, and to suppress the movement of the melt.

本発明の通電加熱装置を用いた場合、および図１に示す特許文献３の通電加熱装置を用いた場合のそれぞれについて、通電加熱対象のめっき金属板の各部に生じるローレンツ力を、磁場解析（シミュレーション）により求めた。解析は、下記の条件に基づいて行った。   For each of the case of using the electric heating device of the present invention and the case of using the electric heating device of Patent Document 3 shown in FIG. It asked by). The analysis was performed based on the following conditions.

めっき金属板のサイズは、以下の通りとした。
幅：２００ｍｍ
厚さ：１．６ｍｍ
長さ：１０００ｍｍ The size of the plated metal plate was as follows.
Width: 200 mm
Thickness: 1.6 mm
Length: 1000 mm

第１および第２補助通電板は、互いに同じサイズのものとし、そのサイズは、下記の通りとした。
幅：２００ｍｍ
厚さ：２０ｍｍ
長さ：１０００ｍｍ The first and second auxiliary conducting plates had the same size as each other, and the sizes were as follows.
Width: 200 mm
Thickness: 20 mm
Length: 1000 mm

めっき金属板と第１補助通電板との間隔、およびめっき金属板と第２補助通電板との間隔は、いずれも、２０ｍｍとした。   The distance between the plated metal plate and the first auxiliary conduction plate, and the distance between the plated metal plate and the second auxiliary conduction plate were both 20 mm.

めっき金属板と、第１および第２補助通電板の各々とには、互いに逆向きの直流電流を流すものとした。めっき金属板に流す直流電流の大きさは、１４３００Ａとした。したがって、図１に示す特許文献３の通電加熱装置を用いる場合は、第１および第２補助通電板に流す直流電流の大きさは、７１５０Ａ（１４３００Ａの１／２）とした。本発明の通電加熱装置を用いる場合は、第１および第２補助通電板に流す直流電流の大きさを、７１５０Ａより大きい範囲で変更しながら、めっき金属板に生じるローレンツ力が最小になるときの直流電流の大きさを求めた。   In the plated metal plate and each of the first and second auxiliary current-carrying plates, direct currents in opposite directions are allowed to flow. The magnitude of the direct current applied to the plated metal plate was 14300A. Therefore, in the case of using the electric heating apparatus of Patent Document 3 shown in FIG. 1, the magnitude of the direct current flowing through the first and second auxiliary electric conduction plates is 7150 A (1/2 of 14300 A). When the electric heating apparatus of the present invention is used, the Lorentz force generated on the plated metal plate is minimized while changing the magnitude of the direct current supplied to the first and second auxiliary current conduction plates in a range larger than 7150A. The magnitude of the direct current was determined.

図４に、めっき金属板の幅方向に関して、めっき金属板の板幅中央から距離と、その位置で生じるローレンツ力の大きさとの関係を示す。めっき部に作用するローレンツ力はめっき金属板の板幅中央に関して板幅方向に対称であるため、図４では、板幅中央から板幅の半分の領域のみを図示している。図４において、ローレンツ力の値が負の数であることは、ローレンツ力がめっき金属板の幅方向中央側に向いていることを意味する。   FIG. 4 shows the relationship between the distance from the center of the plated metal plate width and the magnitude of the Lorentz force generated at that position in the width direction of the plated metal plate. Since the Lorentz force acting on the plating portion is symmetrical in the plate width direction with respect to the center of the plate width of the plated metal plate, FIG. 4 illustrates only a half area of the plate width from the center of the plate width. In FIG. 4, when the value of the Lorentz force is a negative number, it means that the Lorentz force is directed to the center side in the width direction of the plated metal plate.

特許文献３の通電加熱装置を用いた場合は、めっき金属板の中央から約４０ｍｍまでの位置では、ローレンツ力はほぼ０であったが、中央から４０ｍｍを超えて遠くなると、ローレンツ力の絶対値は次第に大きくなった。これに対して、本発明の通電加熱装置を用いた場合は、めっき金属板の中央から約９０ｍｍまでの位置で、ローレンツ力はほぼ０であり、中央から９０ｍｍを超えて遠くなると、ローレンツ力の絶対値は次第に大きくなった。   When the electric heating device of Patent Document 3 is used, the Lorentz force is almost zero at a position about 40 mm from the center of the plated metal plate, but when it is further than 40 mm from the center, the absolute value of the Lorentz force Gradually grew. On the other hand, in the case of using the electric heating device of the present invention, the Lorentz force is almost zero at a position about 90 mm from the center of the plated metal plate, and far from 90 mm from the center. The absolute value gradually increased.

めっき金属板の中央から、９０ｍｍの位置で比較するとローレンツ力は、本発明の通電加熱装置を用いた場合が約−０．１ＭＮ／ｍ3であったのに対し、特許文献３の通電加熱装置を用いた場合は約−１ＭＮ／ｍ3であった。 When compared at a position of 90 mm from the center of the plated metal plate, the Lorentz force was about -0.1 MN / m 3 when using the electric heating device of the present invention, whereas the electric heating device of Patent Document 3 When it was used, it was about -1 MN / m 3 .

ローレンツ力の絶対値が０．１ＭＮ／ｍ3以下であると、めっき層の寄りは実質的に生じない。このため、めっき層の寄りが生じた部分を、トリミングにより除去するとすれば、めっき金属板の幅方向片側につき、特許文献３の通電加熱装置を用いた場合は、めっき金属板の幅の約５０％の領域を除去しなければならないのに対して、本発明の通電加熱装置を用いた場合は、めっき金属板の幅の１０％の領域を除去すれば足りる。 When the absolute value of the Lorentz force is 0.1 MN / m 3 or less, displacement of the plating layer does not substantially occur. For this reason, if the portion where the deviation of the plating layer is generated is removed by trimming, about 50% of the width of the plated metal plate when using the electric heating device of Patent Document 3 on one side in the width direction of the plated metal plate. While it is necessary to remove the% area, it is sufficient to remove the area of 10% of the width of the plated metal plate when using the electric heating apparatus of the present invention.

以上の結果は、上述のように、めっき金属板と第１および第２補助通電板との間隔が２０ｍｍの場合であるが、この間隔を、１ｍｍ、および４０ｍｍに変更して、同様の解析を行った。その結果、それぞれの間隔に対して適切な電流Ｉ1およびＩ2を設定すれば、めっき金属板と第１および第２補助通電板との間隔が２０ｍｍの場合と同様に、特許文献３の通電加熱装置を用いた場合に比して、本願発明の通電加熱装置を用いた場合で、ローレンツ力の大きさ（絶対値）は小さくなった。 The above results are for the case where the distance between the plated metal plate and the first and second auxiliary conducting plates is 20 mm as described above, but this distance is changed to 1 mm and 40 mm, and the same analysis is performed went. As a result, by setting the appropriate current I 1 and I 2 for each interval, similarly to the case where the interval between the plated metal plate and the first and second switch assisting plate is 20 mm, the energization of the patent document 3 The magnitude (absolute value) of the Lorentz force was smaller in the case of using the electric heating device of the present invention than in the case of using the heating device.

１０、２０、３０、４０：通電加熱装置、
１１：ホットスタンプ用めっき金属板、 １２：第１補助通電板、
１３：第２補助通電板、 １４：給電部材、 １５、２５：第１電源、
１６、２６：第２電源、 １６ａ、２６ａ：第１出力端子、
１６ｂ、２６ｂ：第２出力端子、 ２７：同期装置、 ３５：電源、
３５ａ：第１出力端子、 ３５ｂ：第２出力端子、
３７、４７：第１回路、 ３８、４８：第２回路、 Ｐ：分岐点、
Ｐ１：第１分岐点、 Ｐ２：第２分岐点、 Ｐ３：第３分岐点、
Ｐ４：第４分岐点、 Ｒ１、Ｒ１１、Ｒ１２：第１可変抵抗器、
Ｒ２、Ｒ２１、Ｒ２２：第２可変抵抗器 10, 20, 30, 40: Electric heating device,
11: Plated metal plate for hot stamping, 12: 1st auxiliary conducting plate,
13: 2nd auxiliary electric conduction board, 14: Power supply member, 15, 25: 1st power supply,
16, 26: second power supply, 16a, 26a: first output terminal,
16b, 26b: second output terminal, 27: synchronizer, 35: power supply,
35a: first output terminal 35b: second output terminal
37, 47: first circuit, 38, 48: second circuit, P: branch point,
P1: first branch point, P2: second branch point, P3: third branch point,
P4: fourth branch point, R1, R11, R12: first variable resistor,
R2, R21, R22: second variable resistor

Claims (9)

第１および第２端部を有するホットスタンプ用めっき金属板に通電して加熱する通電加熱装置であって、
前記めっき金属板と同じ平面形状を有し、前記めっき金属板の第１表面に対向されて前記めっき金属板に平行に配置される第１補助通電板であって、前記めっき金属板の前記第１および第２端部とそれぞれ位置を揃えて配置される第１および第２端部を有する第１補助通電板と、
前記めっき金属板と同じ平面形状を有し、前記めっき金属板の第２表面に対向されて前記めっき金属板に平行に配置される第２補助通電板であって、前記めっき金属板の前記第１および第２端部とそれぞれ位置を揃えて配置される第１および第２端部を有する第２補助通電板と、
前記めっき金属板の第１および第２端部、ならびに前記第１および第２補助通電板の各々の第１および第２端部に接続され、前記めっき金属板に電流を流すとともに、前記めっき金属板の幅方向に関して当該幅の少なくとも６０％の領域において通電加熱により溶融しためっき層に作用するローレンツ力の絶対値が０．１ＭＮ／ｍ ３ 以下となるように、前記第１および第２補助通電板の各々に、前記めっき金属板に流れる電流の大きさの１／２より大きく前記めっき金属板に流れる電流と逆向きの電流を流すための電源装置とを備えた、ホットスタンプ用めっき金属板の通電加熱装置。 An electroheating apparatus for heating a plated metal plate for a hot stamp having first and second ends by energization.
A first auxiliary current-carrying plate having the same planar shape as the plated metal plate and facing a first surface of the plated metal plate and disposed in parallel to the plated metal plate, A first auxiliary current-carrying plate having first and second ends disposed in alignment with the first and second ends, respectively;
A second auxiliary current-carrying plate having the same planar shape as the plated metal plate and facing the second surface of the plated metal plate and disposed in parallel to the plated metal plate, wherein A second auxiliary current-carrying plate having first and second ends disposed in alignment with the first and second ends, respectively;
First and second end portions of the plated metal plate, and is connected to the first and second ends of each of said first and second switch assisting plate, with electric current to the plating metal plate, the plating metal The first and second auxiliary electrifications are performed such that the absolute value of the Lorentz force acting on the plating layer melted by electric heating in the area of at least 60% of the width in the width direction of the plate is 0.1 MN / m 3 or less. A plated metal plate for hot stamping, comprising: a power supply device for causing current to flow in the opposite direction to the current flowing to the plated metal plate by more than 1/2 of the magnitude of the current flowing to the plated metal plate on each of the plates Electric heating device. 請求項１に記載の通電加熱装置であって、
前記電源装置は、
前記めっき金属板の第１および第２端部に接続され前記めっき金属板に直流電流を流す第１電源装置と、
前記第１および第２補助通電板の各々の第１および第２端部に接続され、前記第１電源装置によって前記めっき金属板に流される電流の大きさの１／２より大きい直流電流を、前記第１および第２補助通電板の各々に流す第２電源装置とを備え、
前記第２電源装置は、
第１および第２出力端子を備えた電源と、
前記電源の第１出力端子と、前記第１補助通電板の第１端部、および前記第２補助通電板の第１端部とを電気的に接続するとともに、前記電源の第２出力端子と、前記第１補助通電板の第２端部、および前記第２補助通電板の第２端部とを電気的に接続して、前記電源に対して、前記第１補助通電板と、前記第２補助通電板とを並列に接続する回路とを備えた、通電加熱装置。 The electric heating apparatus according to claim 1, wherein
The power supply device
A first power supply device connected to the first and second ends of the plated metal plate and flowing a direct current to the plated metal plate;
The direct current, which is connected to the first and second ends of each of the first and second auxiliary current carrying plates, and which is flowed to the plated metal plate by the first power supply device, is greater than half of the magnitude of the current, A second power supply to be flowed through each of the first and second auxiliary conduction plates;
The second power supply device is
A power supply comprising first and second output terminals;
A first output terminal of the power supply, a first end of the first auxiliary conduction plate, and a first end of the second auxiliary conduction plate are electrically connected, and a second output terminal of the power supply And electrically connecting a second end of the first auxiliary conduction plate and a second end of the second auxiliary conduction plate to the power supply, the first auxiliary conduction plate, and (2) A current-carrying heating device provided with a circuit for connecting in parallel the auxiliary current-carrying plate. 請求項１に記載の通電加熱装置であって、
前記電源装置は、
前記めっき金属板の第１および第２端部に接続され前記めっき金属板に交流電流を流す第１電源装置と、
前記第１および第２補助通電板の各々の第１および第２端部に接続され、前記第１電源装置によって前記めっき金属板に流される電流の大きさの１／２より大きい交流電流を、前記第１および第２補助通電板の各々に流す第２電源装置と、
前記めっき金属板に流れる交流電流と前記第１および第２補助通電板を流れる交流電流とを逆位相になるように調整する同期装置とを備え、
前記第２電源装置は、
第１および第２出力端子を備えた電源と、
前記電源の第１出力端子と、前記第１補助通電板の第１端部、および前記第２補助通電板の第１端部とを電気的に接続するとともに、前記電源の第２出力端子と、前記第１補助通電板の第２端部、および前記第２補助通電板の第２端部とを電気的に接続して、前記電源に対して、前記第１補助通電板と、前記第２補助通電板とを並列に接続する回路とを備えた、通電加熱装置。 The electric heating apparatus according to claim 1, wherein
The power supply device
A first power supply device connected to the first and second ends of the plated metal plate to cause an alternating current to flow through the plated metal plate;
An alternating current, connected to the first and second ends of each of the first and second auxiliary current carrying plates, being greater than one half of the magnitude of the current flowed to the plated metal plate by the first power supply, A second power supply to be flowed to each of the first and second auxiliary conduction plates;
And a synchronizer for adjusting the alternating current flowing through the plated metal plate and the alternating current flowing through the first and second auxiliary conducting plates to be in reverse phase.
The second power supply device is
A power supply comprising first and second output terminals;
A first output terminal of the power supply, a first end of the first auxiliary conduction plate, and a first end of the second auxiliary conduction plate are electrically connected, and a second output terminal of the power supply And electrically connecting a second end of the first auxiliary conduction plate and a second end of the second auxiliary conduction plate to the power supply, the first auxiliary conduction plate, and (2) A current-carrying heating device provided with a circuit for connecting in parallel the auxiliary current-carrying plate. 請求項１に記載の通電加熱装置であって、
前記電源装置が、
第１および第２出力端子を備えた電源と、
前記電源に対して、前記めっき金属板と、前記第１補助通電板と、前記第２補助通電板とを並列に接続する回路とを備え、
前記回路は、
前記電源の前記第１出力端子と、前記めっき金属板の第１端部とを接続し、第１分岐点が設けられた導電経路と、
前記第１補助通電板の第２端部と、前記第２補助通電板の第２端部とを接続し、第２分岐点が設けられた導電経路と、
前記第１分岐点と、前記第２分岐点とを接続する導電経路と、
前記電源の前記第２出力端子と、前記めっき金属板の第２端部とを接続し、第３分岐点が設けられた導電経路と、
前記第１補助通電板の第１端部と、前記第２補助通電板の第１端部とを接続し、第４分岐点が設けられた導電経路と、
前記第３分岐点と、前記第４分岐点とを接続する導電経路と、
を含む、通電加熱装置。 The electric heating apparatus according to claim 1, wherein
The power supply device
A power supply comprising first and second output terminals;
The power supply includes a circuit connecting the plated metal plate, the first auxiliary conduction plate, and the second auxiliary conduction plate in parallel.
The circuit is
A conductive path connecting the first output terminal of the power supply and the first end of the plated metal plate and provided with a first branch point;
A conductive path connecting a second end of the first auxiliary conduction plate and a second end of the second auxiliary conduction plate and provided with a second branch point;
A conductive path connecting the first branch point and the second branch point;
A conductive path connecting the second output terminal of the power supply and the second end of the plated metal plate and provided with a third branch point;
A conductive path connecting a first end of the first auxiliary conduction plate and a first end of the second auxiliary conduction plate and provided with a fourth branch point;
A conductive path connecting the third branch point and the fourth branch point;
Electrical heating device including. 請求項４に記載の通電加熱装置であって、
前記回路が、前記第１分岐点と前記第２分岐点との間の導電経路、および前記第３分岐点と前記第４分岐点との間の導電経路の少なくとも一方に介装された第１抵抗器をさらに含む、通電加熱装置。 The electric heating apparatus according to claim 4, wherein
The circuit is interposed between at least one of a conductive path between the first branch point and the second branch point and a conductive path between the third branch point and the fourth branch point. A conductive heating device further comprising a resistor. 請求項４または５に記載の通電加熱装置であって、
前記第１分岐点と前記めっき金属板の第１端部との間の導電経路、および前記第３分岐点と前記めっき金属板の第２端部との間の導電経路の少なくとも一方に介装された第２抵抗器をさらに含む、通電加熱装置。 The electric heating apparatus according to claim 4 or 5, wherein
Interposed in at least one of a conductive path between the first branch point and the first end of the plated metal plate, and a conductive path between the third branch point and the second end of the plated metal plate A conductive heating device, further comprising a second resistor. 請求項１〜６のいずれかに記載の通電加熱装置であって、
前記めっき金属板が、ホットスタンプ用めっき鋼板である、通電加熱装置。 The electric heating apparatus according to any one of claims 1 to 6, wherein
A conductive heating device, wherein the plated metal plate is a plated steel plate for hot stamping. 請求項１〜７のいずれかに記載の通電加熱装置であって、
前記第１および第２補助通電板が、銅または銅合金からなる、通電加熱装置。 The electric heating apparatus according to any one of claims 1 to 7, wherein
The current-carrying heating device, wherein the first and second auxiliary current-carrying plates are made of copper or copper alloy. 請求項１〜８のいずれかに記載の通電加熱装置であって、
前記第１および第２補助通電板の各々と前記めっき金属板とが、１ｍｍ以上の間隔をあけて配置されるように構成された、通電加熱装置。 The electric heating apparatus according to any one of claims 1 to 8, wherein
An electric heating apparatus, wherein each of the first and second auxiliary current-carrying plates and the plated metal plate are disposed at an interval of 1 mm or more.
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