JP6423840B2 - Flux composition and solder paste - Google Patents

Description

  The present invention relates to a flux composition and a solder paste.

  Conventionally, when joining a material to be joined (such as an electronic component) to an electronic circuit formed on a substrate (such as a printed wiring board or a silicon wafer), a solder joining method using a solder alloy has been widely employed. In this solder joining method, a solder ball in which a solder alloy is formed into a ball shape, or a solder paste in which a solder alloy in powder form and a flux composition are mixed is often used. The flux composition has effects such as removal of the solder alloy (powder) and metal oxide on the substrate, and improvement of wettability due to a decrease in the surface tension of the solder alloy (powder).

On the other hand, as a solder alloy, conventionally, lead has been generally used. However, the use of lead is restricted by the RoHS directive or the like from the viewpoint of environmental load, and in recent years, the use of a so-called lead-free solder alloy that does not contain lead is becoming common.
As this lead-free solder alloy, for example, Sn—Cu, Sn—Ag—Cu, Sn—Bi, and Sn—Zn solder alloys are well known. Among them, Sn-3Ag-0.5Cu solder alloy is often used in consumer electronic devices used for televisions, mobile phones, etc. and in-vehicle electronic devices mounted on automobiles.

A substrate having a solder joint portion formed using a Sn-3Ag-0.5Cu solder alloy is exposed to an environment where there is a great difference in temperature between heating and a long time, such as in an engine room of an automobile. When Cu is placed on the Cu land, Cu in the Cu land easily diffuses into the solder joint. For this reason, Cu ₅ Sn _6, which is an intermetallic compound, grows in the vicinity of the interface between the Cu land and the solder joint, and causes cracks in the vicinity of the interface.
As a method for solving this, there is a method of suppressing the growth of Cu ₅ Sn _{6 in} the vicinity of the interface by containing Ni in the solder alloy and suppressing the diffusion of Cu from the Cu land to the solder joint. .

  However, since Ni tends to increase the melting point of the solder alloy and deteriorate wettability, the solder alloy containing Ni is likely to be insufficiently melted at a relatively low temperature. Therefore, during soldering, especially when soldering with solder paste, a lot of voids occur near the interface between the bottom electrode of the electronic component and the solder joint (hereinafter referred to as “under the chip”), and sufficient solder joint There is a risk that it will not be possible.

  In addition, such a solder paste reduces the voids under the chip under high temperature profile conditions, but tends to prevent the voids generated in the solder joints from being discharged outside. That is, the outermost surface of the solder joint portion that has a flared shape (this portion is referred to as a “fillet portion” in this specification) is in contact with air, so that an oxide film is easily generated. Furthermore, since the fillet portion has such a shape as gravity and hem spreading, the flux composition hardly stays on the outermost surface (near the upper part) particularly near the electronic component. For this reason, an oxide film is particularly likely to be generated on the outermost surface in this vicinity, and even if the void under the chip moves to the fillet portion and comes out of the outermost surface, the outermost oxide film prevents this. Furthermore, when a plurality of voids moved near the outermost surface are combined, a huge blow hole is generated, which may cause problems such as appearance of the solder joint, joint strength, and generation of cracks in a thermal cycle.

  Several techniques for incorporating an inorganic filler into a flux composition have been disclosed. For example, in order to prevent solder aggregation inhibition of filler components added in a solder bonding composition containing a thermosetting resin A compound containing a filler (Patent Document 1), and a solder paste using a flux containing a thermosetting resin, which increases its mechanical strength by reducing the internal stress of the resin film formed on the surface of the solder fillet (Patent) Document 2), those containing Aerosil as an additive (Patent Document 3), and those containing Aerosil as a rheology control agent as an additive (Patent Document 4), all of which solve the above problems But there is no suggestion.

Japanese Patent No. 5242521 Japanese Patent No. 4197748 Japanese Patent Laid-Open No. 2014-1000073 Japanese Patent Laying-Open No. 2015-80814

  The present invention solves the above problems, and suppresses the decrease in the viscosity of the flux composition during heating, thereby suppressing the generation of an oxide film on the outermost surface of the fillet, thereby generating voids such as Ni. It is an object of the present invention to provide a flux composition and a solder paste capable of easily discharging voids generated from under the chip from the fillet portion even when a solder alloy containing an easy composition is used.

(1) The flux composition of the present invention includes a base resin, an activator, a solvent, and an inorganic filler, the inorganic filler includes hydrophobic fumed silica, and the blending amount of the inorganic filler is the flux composition. It is characterized by 0.1 to 5% by mass relative to the total amount.

(2) In the configuration described in (1) above, the base resin includes an acrylic resin.

(3) In the constitution described in the above (1) or (2), the hydrophobic fumed silica has at least one of a methylsilyl group, a dimethylsilyl group and a trimethylsilyl group on the surface thereof.

(4) The solder paste of the present invention is characterized by containing the flux composition according to any one of (1) to (3) above and a solder alloy powder.

(5) In the configuration described in (4) above, the solder alloy powder is characterized in that Sn is a main material and Ni is contained in an amount of 0.01% to 0.5% by mass.

(6) In the configuration according to any one of (4) and (5), the solder alloy powder includes Sn as a main material, and includes any two or more of Ag, Cu, Bi, and Sb, The contents of Ag are 0.1 mass% to 5 mass%, Cu is 0.5 mass% to 1 mass%, Bi is 2 mass% to 4 mass%, and Sb is 0.5 mass% to 3 mass%. It is the feature.

  The flux composition and the solder paste of the present invention can easily generate voids such as Ni by suppressing the generation of an oxide film on the outermost surface of the fillet portion by suppressing the decrease in the viscosity of the flux composition during heating. Even when a solder alloy containing the composition is used, voids generated from under the chip can be easily discharged from the fillet, and the appearance of solder joints due to the occurrence of blowholes, joint strength, and cracks in the thermal cycle Generation | occurrence | production etc. can be suppressed.

The profile figure showing the reflow conditions which concern on the Example and comparative example of this invention. The electron micrograph showing a part of surface of the test board after the chip fillet void test concerning a comparative example. The electron micrograph which expanded a part of fillet part which the blowhole generate | occur | produced in the test board after the chip fillet void test which concerns on a comparative example. The electron micrograph which expanded other part of the fillet part which the blowhole generate | occur | produced in the test board after the chip fillet void test which concerns on a comparative example.

1. Flux composition The flux composition concerning this embodiment contains base resin, an activator, a solvent, and an inorganic filler.

(1) Base resin Examples of the base resin include acrylic resin, rosin resin, styrene-maleic acid resin, epoxy resin, urethane resin, polyester resin, phenoxy resin, terpene resin, polyalkylene carbonate, and rosin resin having a carboxyl group. Examples thereof include a derivative compound obtained by dehydration condensation of a resin and a dimer acid derivative flexible alcohol compound. Among these, an acrylic resin is particularly preferably used. In addition, you may use these individually by 1 type or in mixture of multiple types.

  Any acrylic resin can be used as long as it is produced by polymerizing a monomer containing (meth) acrylic acid, for example. Such an acrylic resin can be obtained by homopolymerizing a (meth) acrylate having an alkyl group having 1 to 20 carbon atoms or copolymerizing a monomer containing the acrylate as a main component. In addition, (meth) acrylate refers to a general term for methacrylate and acrylate. Moreover, the acrylic resin may be used alone or in combination of two or more.

  Among the acrylic resins, an acrylic resin obtained by polymerizing methacrylic acid and a monomer containing a monomer having two saturated alkyl groups having 2 to 20 carbon atoms in which the carbon chain is linear is preferably used. More preferably, it is an acrylic resin obtained by polymerizing a monomer containing methacrylic acid and a monomer having two saturated alkyl groups having 2 to 6 carbon atoms in which the carbon chain is linear.

  In addition, the monomer which has two C2-C20 saturated alkyl groups in which the said carbon chain is linear may include multiple types. In this case, for example, a monomer having a saturated alkyl group having 2 carbon atoms in which the carbon chain is linear and a monomer having an alkyl group having 4 carbon atoms in which the carbon chain is linear, such as alkyl having different carbon numbers. It is preferable to include a monomer having a group. Among these, the combined use of a monomer having a C 2 alkyl group having a linear carbon chain and a monomer having a C 6 alkyl group having a linear carbon chain is particularly preferred.

  Furthermore, the monomers used for the production of the acrylic resin are methacrylic acid and a monomer (including a plurality of types) having two saturated alkyl groups having 2 to 20 carbon atoms in which the carbon chain is linear, respectively: Preferably it is included in a ratio of 96 to 20:80.

  The acid value of the acrylic resin is preferably 30 mgKOH / g to 150 mgKOH / g, and the weight average molecular weight is preferably 3,000 Mw to 30,000 Mw.

Due to the nature of the acrylic resin, voids are easily generated particularly in the solder paste when used in the flux composition. Moreover, since the acrylic resin is transparent, the flux residue formed by the flux composition using the acrylic resin also has transparency. For this reason, the voids that are barely discharged from the fillet portion of the solder joint but remain in the flux residue are the appearance of the solder joint (in this specification, the generic name of the solder joint and the flux residue). In addition, it may be difficult to visually inspect the solder joint.
However, since the flux composition according to this embodiment can suppress the generation of an oxide film on the outermost surface of the fillet portion by suppressing the decrease in the viscosity of the flux composition during heating, the void is discharged from the fillet portion. While making it easy, the void residue to a flux residue can also be suppressed.

  Examples of the rosin resin include rosin such as tall oil rosin, gum rosin, and wood rosin; rosin that has been polymerized, hydrogenated, heterogeneous, acrylated, maleated, esterified, or phenol-added. Derivatives: Modified rosin resins obtained by Diels-Alder reaction of these rosins or rosin derivatives with unsaturated carboxylic acids (acrylic acid, methacrylic acid, maleic anhydride, fumaric acid, etc.), and the like. Among these, a modified rosin resin is particularly preferably used, and a hydrogenated acrylic acid-modified rosin resin hydrogenated by reacting acrylic acid is particularly preferably used. In addition, you may use these individually by 1 type or in mixture of multiple types.

  The acid value of the rosin resin is preferably 140 mgKOH / g to 300 mgKOH / g.

  The blending amount of the base resin is preferably 10% by mass or more and 60% by mass or less, and more preferably 30% by mass or more and 55% by mass or less with respect to the total amount of the flux composition. A particularly preferable range is 35% by mass or more and 45% by mass or less.

  The acid value of the base resin is preferably 30 mgKOH / g to 300 mgKOH / g, and more preferably 80 mgKOH / g to 130 mgKOH / g. A particularly preferred range is from 90 mgKOH / g to 120 mgKOH / g.

  When an acrylic resin is used as the base resin, the blending amount is preferably 10% by mass or more and 60% by mass or less, and more preferably 15% by mass or more and 50% by mass or less with respect to the total amount of the flux composition. A particularly preferable range is 20% by mass or more and 30% by mass or less.

  When a rosin resin is used as the base resin, the blending amount is preferably 10% by mass or more and 50% by mass or less, and more preferably 15% by mass or more and 45% by mass or less with respect to the total amount of the flux composition. . A particularly preferable range is 20% by mass or more and 30% by mass or less.

  Moreover, when using together the said acrylic resin and the said rosin-type resin, it is preferable that the mixture ratio is 20:80 to 50:50 in the ratio of a rosin-type resin: acrylic resin, and is 25:75 to 40:60. It is more preferable. A particularly preferred range is 30:70 to 35:65.

(2) Activator Examples of the activator include carboxylic acids and halogen-containing compounds. You may use these individually by 1 type or in mixture of multiple types.

Examples of the carboxylic acids include monocarboxylic acids, dicarboxylic acids, and other organic acids.
Examples of the monocarboxylic acid include propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, capric acid, lauric acid, myristic acid, pentadecylic acid, palmitic acid, margaric acid, stearic acid, tuberculostearic acid, arachidic acid , Behenic acid, lignoceric acid, glycolic acid and the like.
Examples of the dicarboxylic acid include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, fumaric acid, maleic acid, tartaric acid, diglycolic acid and the like.
Examples of the other organic acids include dimer acid, levulinic acid, lactic acid, acrylic acid, benzoic acid, salicylic acid, anisic acid, citric acid, and picolinic acid.
In addition, you may use these individually by 1 type or in mixture of multiple types.

Examples of the halogen-containing compound include a non-dissociable halogenated compound (non-dissociable activator) and a dissociable halogenated compound (dissociable activator).
Examples of the non-dissociative activator include non-salt organic compounds in which halogen atoms are covalently bonded. For example, chlorine, bromine, iodine, fluorine such as chlorinated compounds, brominated compounds, iodinated compounds, and fluorides. A compound having a covalent bond of each single element may be used, or a compound having a covalent bond of any two or all of these four elements may be used. In order to improve the solubility in an aqueous solvent, the compound preferably has a polar group such as a hydroxyl group such as a halogenated alcohol. Examples of the halogenated alcohol include brominated alcohols such as 2,3-dibromopropanol, 2,3-dibromobutanediol, 1,4-dibromo-2-butanol, and tribromoneopentyl alcohol; 1,3-dichloro- Examples include chlorinated alcohols such as 2-propanol and 1,4-dichloro-2-butanol; fluorinated alcohols such as 3-fluorocatechol; and other similar compounds. You may use these individually by 1 type or in mixture of multiple types.

  Examples of the dissociative activator include base hydrochlorides and hydrobromides such as amines and imidazoles. Examples of salts of hydrochloric acid and hydrobromic acid include methylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, n-propylamine, di-n-propylamine, tri-n-propylamine, isopropylamine , Diisopropylamine, butylamine, dibutylamine, tributylamine, cyclohexylamine, monoethanolamine, diethanolamine, triethanolamine and other amines having a relatively small carbon number; imidazole, 2-methylimidazole, 2-ethylimidazole, 2-methyl- Hydrochloric acid salts such as 4-methylimidazole, 2-methyl-4-ethylimidazole, 2-ethyl-4-ethylimidazole, 2-propylimidazole, 2-propyl-4-propylimidazole Fine hydrobromic acid salts, and the like. You may use these individually by 1 type or in mixture of multiple types.

  The blending amount of the activator is preferably 0.1% by mass or more and 30% by mass or more, and more preferably 2% by mass or more and 25% by mass or less with respect to the total amount of the flux composition.

  The blending amount of the carboxylic acids is preferably 1% by mass or more and 25% by mass or less, and more preferably 5% by mass or more and 15% by mass or less with respect to the total amount of the flux composition. By making the compounding quantity of carboxylic acid into this range, generation | occurrence | production suppression of a solder ball and the insulation of a favorable flux composition can be exhibited.

  The blending amount of the non-dissociative activator is preferably 0.1% by mass or more and 5% by mass or less, more preferably 0.5% by mass or more and 3% by mass or less based on the total amount of the flux composition. preferable.

  Next, the blending amount of the dissociative activator is preferably 0.1% by mass or more and 3% by mass or less, and 0.3% by mass or more and 1.5% by mass or less with respect to the total amount of the flux composition. Is more preferable.

  Further, when each of the amine and imidazole is used alone, the blending amount thereof is preferably 0.1% by mass or more and 5% by mass or less, and more preferably 0.5% by mass or more and 3% by mass or less.

(3) Solvent Examples of the solvent include isopropyl alcohol, ethanol, acetone, toluene, xylene, ethyl acetate, ethyl cellosolve, butyl cellosolve, hexyl diglycol, (2-ethylhexyl) diglycol, phenyl glycol, butyl carbitol, and octanediol. , Α-terpineol, β-terpineol, tetraethylene glycol dimethyl ether, trimellitic acid tris (2-ethylhexyl), bisisopropyl sebacate, and the like can be used. You may use these individually by 1 type or in mixture of multiple types.

  The amount of the solvent is preferably 20% by mass or more and 65% by mass or less based on the total amount of the flux composition. The blending amount is more preferably 20% by mass or more and 60% by mass or less, and the particularly preferable blending amount is 25% by mass or more and 50% by mass or less.

(4) Inorganic filler The inorganic filler preferably contains hydrophobic fumed silica. Hydrophobic fumed silica can suppress a decrease in viscosity of the flux composition during heating. Therefore, even if the flux composition contains an acrylic resin that easily generates voids or the solder alloy contains Ni that easily generates voids, the flux composition is formed in the fillet portion by hydrophobic fumed silica. Since it becomes easy to stay, generation | occurrence | production of the oxide film in the outermost surface of a fillet part can be suppressed, and the void which generate | occur | produced from under the chip | tip can be discharged | emitted easily from a fillet part.
Furthermore, the hydrophobic fumed silica preferably has at least one of a methylsilyl group, a dimethylsilyl group and a trimethylsilyl group on the surface thereof. Any one of the methylsilyl group, dimethylsilyl group, and trimethylsilyl group may be bonded to the surface of the hydrophobic fumed silica.
A commercially available product of the hydrophobic fumed silica includes AEROSIL (registered trademark, the same shall apply hereinafter) series (manufactured by Nippon Aerosil Co., Ltd.). Among these, hydrophobic fumed silicas such as AEROSIL RX200 and AEROSIL R974 are preferably used.
In addition, you may use the said hydrophobic fumed silica individually by 1 type or in mixture of multiple types.

  As the inorganic filler, the hydrophobic fumed silica is preferably used alone, but inorganic fillers other than fumed silica such as silica, talc, and alumina, and hydrophilic fumed silica can also be included.

The blending amount of the inorganic filler is preferably 0.1% by mass or more and 5% by mass or less based on the total amount of the flux composition. The blending amount is more preferably 0.5% by mass or more and 2% by mass or less.
In addition, when using together the said hydrophobic fumed silica and another inorganic filler, it is preferable that the compounding quantity of the said hydrophobic fumed silica is 70 mass% or more with respect to the said inorganic filler whole quantity.

(5) Thixotropic agent A thixotropic agent can be mix | blended with the flux composition of this embodiment for the purpose of adjusting the viscosity of a flux composition.
Examples of the thixotropic agent include hydrogenated castor oil, saturated fatty acid amides, saturated fatty acid bisamides, oxy fatty acids, dibenzylidene sorbitols, and the like. You may use these individually by 1 type or in mixture of multiple types.
Further, the blending amount of the thixotropic agent is preferably 1% by mass or more and 15% by mass or less, and more preferably 3% by mass or more and 10% by mass or less with respect to the total amount of the flux.

(6) Antioxidant Antioxidant can be mix | blended with the flux composition of this embodiment in order to suppress the oxidation of a solder alloy. Examples of such antioxidants include, but are not limited to, hindered phenolic antioxidants, phenolic antioxidants, bisphenolic antioxidants, polymer-type antioxidants, and the like. Among these, a hindered phenol antioxidant is particularly preferably used. You may use these individually by 1 type or in mixture of multiple types.
The blending amount of the antioxidant is not particularly limited, but generally it is preferably about 0.5 to 5% by weight with respect to the total amount of the flux composition.

  Moreover, additives, such as a delustering agent and an antifoamer, can be used for the flux composition of this embodiment. The blending amount of the additive is preferably 10% by weight or less, particularly preferably 5% by weight or less, based on the total amount of the flux composition.

2. Solder paste The solder paste of this embodiment is obtained by mixing the flux composition and the solder alloy powder.
The solder alloy powder is mainly composed of Sn, for example, Ag, Bi, In, Ni, Cu, Zn, Ga, Sb, Au, Pa, Ge, Cr, Al, P, Cd, Tl, SeTi, Si. A powdered solder alloy obtained by mixing one or more of Mg, Pb and the like is used. It should be noted that elements other than those listed above can be used in combination. Of course, the solder alloy contains inevitable impurities.

As the solder alloy according to the present embodiment, either a Pb-containing one or a Pb-free one can be used, but a Pb-free one is particularly preferably used. As such a solder alloy, for example, a Sn—Ag—Cu—Ni solder alloy, a Sn—Ag—Cu—Bi—Ni alloy, or the like is preferably used.
Further, a solder alloy containing Sn as a main material and containing 0.01 to 0.5% by mass of Ni, Sn as a main material, containing any two or more of Ag, Cu, Bi, Sb and Ni, Content is 0.1 mass% to 5 mass% for Ag, 0.5 mass% to 1 mass% for Cu, 2 mass% to 4 mass% for Bi, 0.5 mass% to 3 mass% for Sb, Those having Ni of 0.01 mass% to 0.5 mass% are particularly preferably used. In addition, it is preferable that content of Sn is 88 mass% or more.

The amount of the solder alloy powder is preferably 65% by mass to 95% by mass with respect to the total amount of the solder paste. More preferably, the blending amount is 85% by weight to 93% by weight, and a particularly preferable blending amount is 87% by weight to 92% by weight.
When the blending amount of the solder alloy powder is less than 65% by mass, it is difficult to form a sufficient solder joint when the obtained solder paste is used. On the other hand, when the content of the solder alloy powder exceeds 95% by mass, the flux composition as a binder is insufficient, and therefore, it tends to be difficult to mix the flux composition and the solder alloy powder.

  The average particle size of the solder alloy powder is preferably 1 μm or more and 40 μm or less, more preferably 5 μm or more and 35 μm or less, and particularly preferably 10 μm or more and 30 μm or less.

  The solder paste of this embodiment can suppress a decrease in the viscosity of the flux composition during heating by using the flux composition. Therefore, even when using a solder alloy powder containing Ni that easily generates voids or a solder alloy powder containing a composition that easily oxidizes such as In and Bi, the generation of an oxide film on the outermost surface of the fillet portion is suppressed. It is possible to easily discharge the void from the fillet portion and to suppress the void remaining in the flux residue.

3. Electronic circuit board An electronic circuit board having a solder joint formed by using the flux composition of the present embodiment and a solder paste, for example, forms an electrode and a solder resist film at a predetermined position on the substrate, and forms a predetermined pattern. The solder paste of the present embodiment is printed using a mask having the pattern, and an electronic component that conforms to the pattern is mounted at a predetermined position, and is reflowed.

In addition to the reflow method using a solder paste, for example, a flow method using the flux composition of the present embodiment and a mounting method using a solder ball as a method for producing a solder joint and an electronic circuit board having the solder joint Etc. can be used as appropriate.
In the electronic circuit board thus manufactured, a solder joint is formed on the electrode, and the solder joint electrically joins the electrode and the electronic component. Further, a flux residue is formed so as to come into contact with the solder joint or the substrate.

  Since the electronic circuit board manufactured in this way has a solder joint formed using the flux composition and solder paste of the present embodiment, residual voids in the solder joint and flux residue are suppressed. As a highly reliable substrate, it can be suitably used for various applications, for example, a substrate mounted in an engine room of an automobile.

  The type of electronic component mounted on the electronic circuit board is not particularly limited, but the effect can be particularly exhibited when mounting a chip-type component such as a chip capacitor or a chip LED.

  Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples. The present invention is not limited to these examples.

<Synthesis of acrylic resin>
200 g of diethylene glycol monohexyl ether was charged into a 500 ml four-necked flask equipped with a stirrer, a reflux tube, and a nitrogen introduction tube, and this was heated to 110 ° C.
Also, dimethyl 2,2′-azobis (2-methylpropionate) (product name) as an azo radical initiator in 300 g of 10% by weight of methacrylic acid, 51% by weight of 2-ethylhexyl methacrylate and 39% by weight of lauryl acrylate : V-601, manufactured by Wako Pure Chemical Industries, Ltd.) was added in an amount of 0.2% by mass to 5% by mass to dissolve it to prepare a solution.
Next, the solution was dropped into the four-necked flask over 1.5 hours and stirred at 110 ° C. for 1 hour, and then the reaction was terminated to obtain an acrylic resin used in the examples. The acrylic resin had a weight average molecular weight of 7,800 Mw, an acid value of 40 mgKOH / g, and a glass transition temperature of −47 ° C.

  The components described in Table 1 were kneaded to obtain flux compositions according to Examples 1 to 4 and Comparative Examples 1 to 7. Next, 11% by mass of each flux composition and 89% by mass of Sn-3Ag-0.5Cu-3Bi-3Sb-0.15Ni solder alloy powder were kneaded, and according to Examples 1 to 4 and Comparative Examples 1 to 7. Each solder paste was obtained. Unless otherwise specified, the numerical values shown in Table 1 mean mass%. However, the solvent-like acrylic resin produced by the above procedure is used after the solvent is volatilized using an evaporator. Therefore, the numerical value of the acrylic resin described in Table 1 represents only the solid content in which the solvent is volatilized.

* 1 Hydrogenated acid-modified rosin manufactured by Arakawa Chemical Co., Ltd. * 2 Tris (2,3-dibromopropyl) isocyanurate manufactured by Nippon Kasei Co., Ltd. * 3 Hindered phenol antioxidant manufactured by BASF Japan Co., Ltd. * 4 Hydrophobic fumed silica (containing trimethylsilyl group) manufactured by Nippon Aerosil Co., Ltd.
* 5 Hydrophobic fumed silica (containing dimethylsilyl group) manufactured by Nippon Aerosil Co., Ltd.
* 6 Hydrophilic fumed silica manufactured by Nippon Aerosil Co., Ltd. * 7 Zn-Mg-Al inorganic filler manufactured by Toa Gosei Co., Ltd. * 8 Aluminum oxide manufactured by Ishihara Sangyo Co., Ltd.

<Wetting efficacy and dewetting test (copper plate)>
Using each solder paste, the wetting effect and dewetting test on a copper plate were performed and evaluated under the conditions conforming to JIS standard Z 3284-4. The results are shown in Table 2. The evaluation criteria conform to those described in Table 1 (degree of spread) of JIS standard Z 3284-4.

<Wetting efficacy and dewetting test (Ni plate)>
Using each solder paste, a 3 × 3 × 0.5 mm Ni plate was used under the conditions conforming to JIS standard Z 3284-4, and wetting efficacy and dewetting tests were performed and evaluated. The results are shown in Table 2. The evaluation criteria conform to those described in Table 1 (degree of spread) of JIS standard Z 3284-4.

<Chip fillet void>
FR-4 board (thickness: 1.6 mm) provided with a chip component having a size of 3.2 mm × 1.6 mm, a solder resist having a pattern capable of mounting the chip component of the size, and an electrode for connecting the chip component A 150 μm thick metal mask having the same pattern was prepared. Each solder paste was printed on the FR-4 substrate using the metal mask. Next, 20 of the above chip components are placed on each FR-4 substrate, and reflow is performed under the reflow conditions shown in FIG. 1 using a reflow furnace (product name: TNP-538EM, manufactured by Tamura Corporation). Each test substrate was produced. The chip fillets formed on the respective test substrates were observed with an optical microscope, and the number of chips in which cavities (blow holes) were generated in the fillet portion was counted. The results are shown in Table 2. FIG. 2, FIG. 3 and FIG. 4 show a part of the substrate surface of the comparative example in which the blow hole is generated in the fillet portion and the generated blow hole, respectively.

<Flux residue appearance>
A Cu-OSP-treated FR-4 substrate (thickness: 1.6 mm, opening diameter 0.3 mm) having a solder resist and electrodes having a predetermined pattern, and a 150 μm thick metal mask having the same pattern were prepared. . Next, each solder paste is printed on the FR-4 substrate using the metal mask, and reflowed under the reflow conditions shown in FIG. 1 using a reflow furnace (product name: TNP-538EM, manufactured by Tamura Corporation). Then, each test substrate was manufactured. And the external appearance of the flux residue formed on each test board | substrate was observed, and the following evaluation criteria evaluated. The results are shown in Table 2.
○: Transparent and free of crystals of precipitates Δ: Transparent and free of crystals of precipitates, but voids are present in less than 10% in the residue ×: Precipitates are generated and are opaque, and voids are 10% in the residue Exist

<Squeegee adhesion>
A substrate was prepared, 300 g of each solder paste was put into a printing machine, and squeezing was performed four times (two reciprocations) on the substrate using a metal mask and a metal squeegee. When the squeegee is raised by squeezing four times, the solder paste remains on the metal mask (no squeegee attached), or adheres to the squeegee and no paste remains on the metal mask (squeegee attached) It was confirmed and evaluated. The results are shown in Table 2. Note that when the solder paste has squeegee adhesion, there is a possibility that a printing defect may occur after that, but when the solder paste does not have squeegee adhesion, the subsequent printability is good.

As described above, the solder paste according to the example containing hydrophobic fumed silica as the inorganic filler has good solder wettability and dewetting in both the copper plate and the Ni plate. In addition, even when a solder alloy containing a composition that easily generates voids such as Ni is used, the generation of voids in the chip fillet portion and the flux residue can be suppressed, and the printability is also good. I understand.

Claims (6)

Including a base resin, an activator, a solvent, and an inorganic filler,
The inorganic filler comprises hydrophobic fumed silica;
The amount of the inorganic filler is Ri 5% by mass 0.1% by mass of the flux the total amount of the composition,
The flux composition, wherein the blending amount of the base resin is 30% by mass or more and 60% by mass or less .   The flux composition according to claim 1, wherein the base resin includes an acrylic resin.   The flux composition according to claim 1 or 2, wherein the hydrophobic fumed silica has at least one of a methylsilyl group, a dimethylsilyl group, and a trimethylsilyl group on the surface.   A solder paste comprising the flux composition according to any one of claims 1 to 3 and a solder alloy powder.   The solder paste according to claim 4, wherein the solder alloy powder contains Sn as a main material and contains 0.01 mass% to 0.5 mass% of Ni. The solder alloy powder is mainly composed of Sn, and includes any two or more of Ag, Cu, Bi and Sb,
Each content is 0.1 mass% to 5 mass% for Ag, 0.5 mass% to 1 mass% for Cu, 2 mass% to 4 mass% for Bi, and 0.5 mass% to 3 mass% for Sb. The solder paste according to claim 4 or 5, wherein the solder paste is%.