JP6420996B2 - Imaging device - Google Patents

Description

  The present invention relates to an image pickup apparatus that picks up a subject image formed by an image pickup lens using an image pickup element.

  2. Description of the Related Art Conventionally, an imaging apparatus that captures an image using an image sensor such as a CCD image sensor or a CMOS image sensor is widely known.

  For example, the imaging apparatus described in Patent Literature 1 includes an imaging lens, an imaging element, a lens holder that holds the imaging lens, a front case that fixes the lens holder, and a substrate that mounts and fixes the imaging element. This image pickup apparatus has a structure in which an image pickup element is fixed to an image pickup lens by screwing a substrate to the back surface of the front case.

JP 2012-74934 A

  In such an imaging apparatus, since the substrate is fastened with screws in the assembly process, the position of the image sensor relative to the imaging lens may occur due to the influence of the sinking of the substrate due to overtightening of the screws.

  In order to avoid such a problem, there is a method in which the imaging element is bonded and fixed to a member that holds the imaging lens. However, since the adhesive has a large coefficient of thermal expansion, there has been a problem that the relative distance between the imaging element and the imaging lens changes due to a temperature change.

  In order to solve the above-described problem, an imaging apparatus according to the present invention includes a lens holder that holds an imaging lens and a substrate on which an imaging element is mounted. The screw that is attached to the lens holder and the substrate are brought into contact with the screw. And an elastic body that urges the substrate to receive the substrate at an upper portion of a screw head.

  According to the present invention, it is possible to eliminate the positional deviation of the image sensor in the assembly process, and it is also possible to eliminate the positional deviation of the image sensor due to the temperature change caused by the adhesive.

It is a disassembled perspective view which shows one Embodiment of the imaging device which concerns on this invention. It is an external view of the imaging device in FIG. (A) A rear view is shown. (B) A bottom view is shown. It is sectional drawing of the AA part in FIG. It is a perspective view which shows the shape of a case and an elastic body.

  A preferred embodiment of an imaging apparatus according to the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 4, the imaging device 10 is an imaging device that images a subject image formed on the imaging device 20 via the imaging lenses 12, 13, and 14. , 14, imaging lenses 12, 13, 14, adjustment screws 15, 16, 17, imaging device 20, substrate 18 for mounting and fixing the imaging device 20, and substrate 18 are fixed. A case 19 is provided.

  The imaging lenses 12, 13, and 14 are optical lenses for forming a subject image on the imaging device 20, and are held (fixed) on the lens holder 11. In this embodiment, a case where a plurality of imaging lenses are accommodated and attached to the lens holder 11 is shown, but a single imaging lens may be used, or a zoom lens may be used depending on the application. Alternatively, the imaging lens may be fixed to the inner periphery of a cylindrical lens barrel, and the lens barrel may be fixed to the lens holder.

  The imaging device 20 is an imaging device made of a solid-state imaging device such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The image sensor 20 is mounted and fixed on the substrate 18.

  The lens holder 11 has a main body part 11a and a cylindrical part 11b formed on the main body part 11a. The aforementioned imaging lenses 12, 13, and 14 are fixed to the inner peripheral portion of the cylindrical portion 11b. Further, the body 11 a of the lens holder 11 is formed with screw holes 11 c, 11 d, 11 e for attaching the adjusting screws 15, 16, 17 and protrusions 11 f, 11 g for fixing the case 19.

  Three screw holes 11c, 11d, and 11e are provided around the imaging lenses 11, 12, and 13 with the imaging lenses 11, 12, and 13 as the center. If three screw holes 11c, 11d, and 11e are connected by virtual lines, an isosceles triangle shape is obtained. More preferably, the screw holes 11c, 11d, and 11e are provided at equal intervals. In this case, if three screw holes 11c, 11d, and 11e are connected by virtual lines, a regular triangle shape is obtained. This makes it possible to reliably and easily adjust the inclination of the image sensor 20 to be described later. Two protrusions 11f and 11g are provided facing each other with the imaging lenses 11, 12, and 13 therebetween.

  The adjusting screws 15, 16, and 17 attached to the screw holes 11c, 11d, and 11e of the lens holder 11 are pan head screws. The adjusting screws 15, 16, and 17 are screwed into the screw holes 11c, 11d, and 11e from the back side. The screw heads of the adjustment screws 15, 16, and 17 are pan head screws, but are not limited to pan head screws.

  The substrate 18 on which the image sensor 20 is mounted is provided with three circular substrate holes 18 a, 18 b and 18 c around the image sensor 20. The substrate holes 18 a, 18 b, and 18 c are through holes that are formed at the same positions as the screw holes 11 c, 11 d, and 11 e of the lens holder 11 in plan view in the optical axis L direction and penetrate the substrate 18.

  As shown in FIG. 3, the edges of the substrate holes 18 a, 18 b, 18 c on the imaging lens 11, 12, 13 side are located above the screw heads of the adjustment screws 15, 16, 17 attached to the lens holder 11. Abut. In other words, the upper portions of the screw heads of the adjusting screws 15, 16, 17 are exposed to the outside on the back side through the substrate holes 18a, 18b, 18c. As described above, the diameters of the substrate holes 18a, 18b, and 18c are smaller than the diameters of the screw heads of the adjustment screws 15, 16, and 17, but are adjusted when adjusting the inclination of the image sensor 20 as will be described later. Since a screwdriver is used as a jig for turning the screws 15, 16, and 17, the size is such that the tip of the screwdriver can enter.

  The substrate 18 is fixed by being biased by a case 19 having a leaf spring from the back side of the substrate 18 received at the top of the screw heads of the adjustment screws 15, 16, 17. By using screws with round screw heads for the adjustment screws 15, 16, and 17, the upper portions of the screw heads and the edges of the board holes 18a, 18b, and 18c can be reliably brought into contact with each other. When the substrate 18 is brought into contact with the neck portion of the screw head, a part of the substrate 18 may float with respect to the neck portion of the screw head, and the substrate 18 may become unstable. By bringing the edges of the circular substrate holes 18a, 18b, and 18c into contact with the upper portions of the adjustment screws 15, 16, and 17 having round heads, it is possible to prevent a part of the substrate 18 from floating with respect to the screw heads. Thus, it is more suitable if the screw head is a round screw.

  The case 19 is formed by bending a thin metal plate into a U-shape, and is provided with case holes 19 a and 19 b that engage with the lens holder 11 and leaf springs 19 c and 19 d as elastic bodies that are pressed against the substrate 18. . The case holes 19a and 19b are holes that are formed at the end of the case 19 bent in a U-shape and into which the protrusions 11f and 11g of the lens holder 11 are inserted.

  The leaf springs 19c and 19d of the case 19 are cut and bent at an intermediate portion of the case 19 bent in a U shape. That is, the plate springs 19 c and 19 d are integrally formed with the case 19. The tips of the leaf springs 19c, 19d are in contact with the substrate 18 from the back side, and the base 18 is pressed against the upper part of the screw heads of the adjustment screws 15, 16, 17 by the urging force of the leaf springs 19c, 19d. Further, since the plate springs 19c, 19d are in contact with the substrate 18 within a range surrounded by the three adjustment screws 15, 16, 17 in a plan view as viewed from the back side, the base 18 is attached to the adjustment screws 15, 16 and 17 can be stably pressed against. Instead of forming the leaf springs 19c and 19d, for example, a compression spring provided between the case 19 and the substrate 18 or a tension spring provided between the lens holder 11 and the substrate 18 is used. be able to.

  The assembly procedure will be described with reference to FIG. The adjustment screws 15, 16, and 17 are screwed into the screw holes 11a, 11b, and 11c from the back side with the back side of the main body 11a of the lens holder 11 to which the imaging lenses 12, 13, and 14 are fixed facing upward. Then, the substrate 18 on which the image sensor 20 is mounted is placed on the adjustment screws 15, 16, 17. At this time, the substrate holes 18a, 18b, and 18c are placed so that the edges of the board holes 18a, 18b, and 18c come into contact with the upper portions of the screw heads of the adjustment screws 15, 16, and 17, respectively. Thereafter, the case 19 and the substrate 18 are fixed by engaging the case holes 19 a and 19 b with the protrusions 11 f and 11 g of the lens holder 11 while the leaf springs 19 c and 19 d are brought into contact with the back side of the substrate 18.

  Next, the position of the image sensor 20 is adjusted. Specifically, the position of the substrate 18 is adjusted by turning the adjustment screws 15, 16, and 17. A screwdriver as a jig is inserted from the back side of the board holes 18a, 18b, 18c, and the adjustment screw 15, 16, 17 is rotated by checking the image actually formed on the image pickup device 20, thereby rotating the adjustment screw 15. , 16 and 17 are moved in the direction of the optical axis L to adjust the position of the substrate 18 (imaging device 20) in the direction of the optical axis L and adjust the inclination with respect to the optical axis L.

  Thus, since the imaging device 10 can be assembled simply by placing the members from above, it can be easily assembled.

  As described above, the adjustment screws 15, 16, and 17 are attached to the lens holder 11 to which the imaging lenses 12, 13, and 14 are fixed, and the imaging element 20 is mounted on the top of the screw heads of the adjustment screws 15, 16, and 17. The substrate 18 is received, and the substrate 18 is pressed against the upper portions of the screw heads of the adjustment screws 15, 16, and 17 by the leaf springs 19 c and 19 d (elastic body) of the case 19. Then, the position of the substrate 18 in the optical axis L direction and the inclination of the substrate 18 are adjusted by rotating the adjustment screws 15, 16, and 17. Therefore, it is possible to eliminate the positional deviation of the image sensor 20, and it is also possible to eliminate the positional deviation of the image sensor 20 due to the temperature change caused by the adhesive.

  Although embodiments of the present invention have been described in detail with reference to the drawings, the specific configuration is not limited to these embodiments, and design changes and the like within a scope not departing from the gist of the present invention are possible. Even if it exists, it is included in this invention.

10: Imaging device 11: Lens holder 12, 13, 14: Imaging lens 15, 16, 17: Adjustment screw 18: Substrate 18a, 18b, 18c: Substrate hole 19: Case 19c, 19d: Plate spring (elastic body)
20: Image sensor

Claims (4)

In an imaging apparatus having a lens holder that holds an imaging lens and a substrate on which an imaging element is mounted,
And three screws attached to the periphery of the imaging lens definitive to the lens holder,
An elastic body that urges the substrate to abut against the screw;
Receiving the substrate at the top of the screw head of the screw ;
The upper portions of the screw heads of the three screws are exposed to the back side of the substrate through three substrate holes provided in the substrate, respectively.
The imaging device according to claim 1, wherein the elastic body biases the substrate within a range surrounded by the three screws . The screw head is round,
The substrate hole is circular,
The diameter of the substrate hole is rather smaller than the diameter of the screw head,
The imaging apparatus according to claim 1, wherein an upper portion of the screw head is in contact with an edge of the substrate hole . The elastic body is case and one body formed covering the substrate and the lens holder,
The case has a U-shape with two case holes provided at both ends,
Wherein the lens holder, wherein each engaged with the two cases holes, the imaging apparatus according to claim 1 or claim 2, characterized in that two projections projecting outwardly is provided. It said three screws, the imaging apparatus according to any one of claims 1 to 3, characterized in that it is attach at equal intervals around the imaging lens.

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