JP6417832B2 - Quality judgment method for laminated metal sheets - Google Patents
Quality judgment method for laminated metal sheets Download PDFInfo
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- JP6417832B2 JP6417832B2 JP2014203091A JP2014203091A JP6417832B2 JP 6417832 B2 JP6417832 B2 JP 6417832B2 JP 2014203091 A JP2014203091 A JP 2014203091A JP 2014203091 A JP2014203091 A JP 2014203091A JP 6417832 B2 JP6417832 B2 JP 6417832B2
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本発明は、積層金属薄板の品質判定方法に係り、特に、導電用部材として用いる積層金属薄板の品質判定方法に関する。 The present invention relates to a method for judging the quality of a laminated metal sheet, and more particularly to a method for judging the quality of a laminated metal sheet used as a conductive member.
近年、二次電池の利用が拡大され、使用する機器の高性能化が進んでいる。それに伴い使用される部材にも高導電性、耐食性、溶接性、放熱性などのさまざまな性能が要求されている。これらの性能を満たす材料として異なる特性を持った金属板を一体積層した積層金属薄板が注目されている。 In recent years, the use of secondary batteries has been expanded, and the performance of equipment used has been improved. Along with that, various performances such as high conductivity, corrosion resistance, weldability, and heat dissipation are also required for the members used. As a material satisfying these performances, a laminated metal thin plate obtained by integrally laminating metal plates having different characteristics has attracted attention.
導電性および溶接性に優れた積層金属薄板としては、Ｎｉ／Ｃｕ、Ｎｉ／Ａｌが知られており、また、導電性および放熱性に優れた積層金属薄板としては、Ａｌ／Ｃｕが知られている。さらに、優れた導電性および溶接性に加え、優れた耐食性を有する積層金属薄板として、Ｎｉ／Ｃｕ／Ｎｉが開発されている。 Ni / Cu and Ni / Al are known as laminated metal sheets with excellent conductivity and weldability, and Al / Cu is known as a laminated metal sheet with excellent conductivity and heat dissipation. Yes. Furthermore, Ni / Cu / Ni has been developed as a laminated metal sheet having excellent corrosion resistance in addition to excellent conductivity and weldability.
たとえば、Ｎｉ／Ｃｕ／Ｎｉを製造する方法として、特許文献１にはＮｉをＣｕへ被覆する電気めっき法が開示されており、特許文献２にはＮｉとＣｕとを接合する接合圧延法が開示されている。しかし、めっき中または接合圧延中にトラブルが発生して、ガス、水分、表面酸化物などの異物を巻き込み、まれに未接合部が発生することがある。未接合部は電気抵抗を増大させ、ジュール発熱を増大させるので、有機系部材および電解質の変質を招くことがある。そして、これらが変質した場合、製品の安全性および性能を低下させるおそれがある。 For example, as a method for producing Ni / Cu / Ni, Patent Literature 1 discloses an electroplating method for coating Ni on Cu, and Patent Literature 2 discloses a joining rolling method for joining Ni and Cu. Has been. However, troubles may occur during plating or joining rolling, and foreign matters such as gas, moisture, and surface oxide may be involved, and in rare cases, unjoined portions may be generated. The unbonded portion increases electrical resistance and increases Joule heat generation, which may cause deterioration of the organic member and the electrolyte. And when these change in quality, there exists a possibility of reducing the safety | security and performance of a product.
未接合部については、剥離試験またはＪＩＳ Ｇ ０６０１におけるせん断試験法によってその存在を推定できる。しかし、これらの評価方法は、局所的な品質評価方法であるため、広い面積を評価しようとすると、多くの試験サンプルと手間が必要となってしまい、工業的には実施不可能となる。また、剥離試験に供する積層金属薄板の層（剥離層）が薄く、試験中に剥離層が破壊されると、評価ができなくなる。 About an unjoined part, the presence can be estimated by the peeling test or the shear test method in JIS G 0601. However, since these evaluation methods are local quality evaluation methods, if a large area is to be evaluated, many test samples and labor are required, making it impossible to implement industrially. Moreover, if the layer (peeling layer) of the laminated metal sheet used for the peeling test is thin and the peeling layer is destroyed during the test, the evaluation cannot be performed.
特許文献３では、繰り返し曲げ試験により未接合部の有無および品質を判定する方法を開示している。 Patent Document 3 discloses a method for determining the presence and quality of an unjoined portion by a repeated bending test.
上述のように、未接合部が発生すると、製品の安全性および性能を低下させるおそれがあるが、未接合部の有無は、接合ままの外観からは判断できない。 As described above, the occurrence of an unjoined portion may reduce the safety and performance of the product, but the presence or absence of the unjoined portion cannot be determined from the appearance as it is joined.
特許文献３に記載の方法では、積層金属薄板の層厚が薄くても評価可能であるが、局所的な評価方法であるため、前記の方法と同様、広い面積の評価を行おうとすると、多くの試験サンプルと手間が必要となってしまう。 In the method described in Patent Document 3, evaluation is possible even when the thickness of the laminated metal thin plate is thin. However, since this is a local evaluation method, as in the above-described method, a large area is often evaluated. This requires a lot of labor and test samples.
このように、従来知られているいずれの試験方法においても、局所的に未接合部の有無を判定できるに過ぎず、積層金属薄板の面内をくまなく検査することができない。 As described above, in any of the conventionally known test methods, it is only possible to locally determine the presence or absence of an unjoined portion, and it is not possible to inspect the entire surface of the laminated metal thin plate.
本発明は、積層金属薄板の未接合部の存在を全域的に検査することができる品質判定方法を提供することを目的とする。 An object of this invention is to provide the quality determination method which can test | inspect the presence of the unjoined part of a laminated metal thin plate throughout.
本発明者らは、上記の課題を解決するため、鋭意検討を行い、下記の知見を得た。 In order to solve the above-mentioned problems, the present inventors have intensively studied and obtained the following knowledge.
積層金属薄板を所定の温度に加熱すると、表層の金属板に膨れ状の欠陥（以下、「フクレ欠陥」と呼ぶ。）が発生することがある。フクレ欠陥の発生原因としては、様々なものが考えられるが、本発明者らが調査したところ、金属板同士の界面に異物が混入し、未接合部が存在している場合に、積層金属薄板が所定の温度域に加熱されると、異物からガスが発生・膨張し、表層の金属板を変形させ、フクレ欠陥に至ることが判明した。なお、異物が混入していても、そのサイズが小さく、必要な接合強度を有している部位にはフクレ欠陥が生じない。 When the laminated metal thin plate is heated to a predetermined temperature, a bulge-like defect (hereinafter referred to as “fluff defect”) may occur in the surface metal plate. There are various causes for the occurrence of blister defects, but when the present inventors investigated, when a foreign object is mixed in the interface between metal plates and an unjoined portion exists, a laminated metal thin plate When heated to a predetermined temperature range, it was found that gas was generated and expanded from the foreign material, deforming the surface metal plate, leading to blister defects. Even if foreign matter is mixed in, the size is small, and no blister defect occurs in a portion having a necessary bonding strength.
そして、未接合部に起因したフクレ欠陥を表層の金属板に意図的に発生させることができれば、接合ままの外観からは判断できない未接合部の存在を確認することができる。本発明者らは、表層の金属板にフクレ欠陥を意図的に発生させる加熱条件について調査し、下記の知見を得た。 And if the blister defect resulting from an unjoined part can be generated intentionally in the metal plate of a surface layer, existence of an unjoined part which cannot be judged from the appearance as joined can be checked. The inventors of the present invention investigated the heating conditions for intentionally generating blister defects on the surface metal plate, and obtained the following knowledge.
前述のように、フクレ欠陥は、異物から発生したガスが膨張することによって発生するため、未接合部に確実にフクレ欠陥を発生させるためには一定温度以上に加熱する必要がある。また、ガスの内圧が表層の金属板を変形させるまでに高まらない限り、フクレ欠陥が生じない。 As described above, the blister defect is generated by the expansion of the gas generated from the foreign matter. Therefore, in order to surely generate the blister defect in the unjoined portion, it is necessary to heat to a certain temperature or higher. Further, unless the internal pressure of the gas increases until the surface metal plate is deformed, the blister defect does not occur.
そこで、本発明者らは、Ｎｉ／Ｃｕ、Ｎｉ／Ｃｕ／ＮｉおよびＡｌ／Ｎｉ／Ａｌの３種類の積層金属薄板のサンプルを用意し、加熱試験と積層金属薄板に９０度曲げを１７回繰り返す、繰り返し曲げ試験とを実施し、それぞれの表層の金属板の未接合部にフクレ欠陥を確実に生じるための加熱条件を調査した。それぞれの製造条件、試験条件は、後段の実施例に記載したとおりである。 Therefore, the present inventors prepare samples of three types of laminated metal thin plates of Ni / Cu, Ni / Cu / Ni, and Al / Ni / Al, and repeat a heating test and 90 degree bending of the laminated metal thin plate 17 times. Then, repeated bending tests were carried out, and the heating conditions for reliably generating blister defects at the unjoined portions of the respective surface metal plates were investigated. The respective production conditions and test conditions are as described in the examples in the subsequent stage.
加熱試験でフクレ欠陥が発生し、かつ繰り返し曲げ試験で剥離が発生したものを「○」とし、加熱試験でフクレ欠陥が発生しなかったが、繰り返し曲げ試験で剥離が発生したものを「×」として、高温変形応力（０．２％耐力）と板厚との関係を整理した結果を図１に示す。すなわち、「○」は、加熱試験によって未接合部を発見できたケースであり、「×」は発見できなかった例である。なお、当該温度条件下の高温変形応力は、Ｎｉ、ＣｕおよびＡｌの板材を５０％圧延した圧延材をＪＩＳ Ｇ ０５６７に従って高温引張試験を実施し、求めた。 “○” indicates that a blister defect occurred in the heating test, and peeling occurred in the repeated bending test, and “×” indicates that no blister defect occurred in the heating test, but peeling occurred in the repeated bending test. FIG. 1 shows the result of arranging the relationship between the high temperature deformation stress (0.2% proof stress) and the plate thickness. That is, “◯” is a case where an unjoined portion was found by a heating test, and “x” is an example where no unjoined portion was found. The high temperature deformation stress under the temperature conditions was determined by performing a high temperature tensile test on a rolled material obtained by rolling 50% of a Ni, Cu and Al plate material according to JIS G 0567.
図１に示すように、フクレ欠陥の発生によって未接合部を発見するためには、任意の加熱条件における金属板の変形抵抗（０．２％耐力）Ｐとフクレ欠陥を観察する表層の金属薄板の厚さｔとの間に一定の関係がある。ここで、フクレ欠陥が座屈変形の１種と考えると、金属板にかかる最大応力σｍａｘは板厚の２乗に反比例する。そして、最大応力σｍａｘが変形抵抗Ｐを上回った場合にフクレ欠陥が発生すると考えることができる。図１に示すように、フクレ欠陥の発生によって未接合部を発見するためには、０．２％耐力Ｐ（ＭＰａ）がフクレ欠陥を観察する表層金属薄板の厚さｔとの関係で、下記の（１）式を満足する温度で加熱することが重要となる。
Ｐ＜８．６／ｔ２ （１）
As shown in FIG. 1, in order to find an unjoined part due to the occurrence of a blister defect, the deformation resistance (0.2% proof stress) P of the metal plate under arbitrary heating conditions and the surface thin metal plate for observing the blister defect There is a certain relationship with the thickness t. Here, assuming that the blister defect is a kind of buckling deformation, the maximum stress σmax applied to the metal plate is inversely proportional to the square of the plate thickness. Then, it can be considered that a blister defect occurs when the maximum stress σmax exceeds the deformation resistance P. As shown in FIG. 1, in order to find an unjoined portion due to occurrence of blister defects, 0.2% proof stress P (MPa) is related to the thickness t of the surface metal thin plate for observing blister defects. It is important to heat at a temperature that satisfies the formula (1).
P <8.6 / t 2 (1)
本発明者らは、上記の（１）式の関係が、任意の加熱条件に対応する変形応力と板厚との関係で整理でき、上記の素材の組み合わせに限らず、他の様々な積層金属薄板に適用可能であることを確認し、本発明を完成させた。 The present inventors can arrange the relationship of the above formula (1) by the relationship between the deformation stress and the plate thickness corresponding to an arbitrary heating condition, and are not limited to the combination of the above materials, but various other laminated metals. The present invention was completed by confirming that it can be applied to a thin plate.
本発明は、下記の積層金属薄板の品質判定方法を要旨とする。 The gist of the present invention is the following quality judgment method for laminated metal sheets.
〔１〕積層金属薄板の品質を判定する方法であって、２５０℃以上で、かつ０．２％耐力Ｐ（ＭＰａ）が下記の（１）式を満足する温度を決定し、その温度で前記積層金属薄板を加熱した後、フクレ欠陥を観察する、積層金属薄板の品質判定方法。
Ｐ＜８．６／ｔ２ （１）
ただし、ｔは、フクレ欠陥を観察する表層金属薄板の厚さ（ｍｍ）である。
[1] A method for judging the quality of a laminated metal sheet, wherein a temperature at 250 ° C. or higher and 0.2% proof stress P (MPa) satisfies the following formula (1) is determined, and the temperature is A method for judging the quality of a laminated metal sheet, in which a bulge defect is observed after the laminated sheet metal is heated.
P <8.6 / t 2 (1)
However, t is the thickness (mm) of the surface metal thin plate which observes a blister defect.
〔２〕積層金属薄板が酸化する場合は非酸化性雰囲気または真空中で加熱する、上記〔１〕の積層金属薄板の品質判定方法。 [2] The method for judging quality of a laminated metal sheet according to the above [1], wherein the laminated metal sheet is heated in a non-oxidizing atmosphere or in a vacuum.
〔３〕フクレ欠陥を観察する表層の金属薄板の厚さｔが０．００５〜０．７５ｍｍである、上記〔１〕または〔２〕の積層金属薄板の品質判定方法。 [3] The method for judging the quality of a laminated metal thin plate according to [1] or [2] above, wherein the thickness t of the surface thin metal plate for observing blister defects is 0.005 to 0.75 mm.
〔４〕層数が３以下である、上記〔１〕〜〔３〕のいずれかの積層金属薄板の品質判定方法。 [4] The method for judging the quality of the laminated metal sheet according to any one of [1] to [3], wherein the number of layers is 3 or less.
〔５〕表層の金属薄板のうち、変形抵抗が小さい方の金属薄板のフクレ欠陥を観察する、上記〔１〕〜〔４〕のいずれかの積層金属薄板の品質判定方法。 [5] The method for judging the quality of the laminated metal thin plate according to any one of [1] to [4], wherein a bulge defect is observed in the metal thin plate having the smaller deformation resistance among the thin metal plates in the surface layer.
本発明によれば、複雑な加工を行うことなく、非破壊で、積層金属薄板の未接合部の存在を広範囲に検査することができるので、安全性が低下した製品の出荷を未然に防止することが可能となる。 According to the present invention, it is possible to inspect extensively the presence of the unjoined portion of the laminated metal thin plate without performing complicated processing, thereby preventing the shipment of products with reduced safety. It becomes possible.
本発明においては、積層金属薄板を２５０℃以上で、かつ０．２％耐力Ｐ（ＭＰａ）が下記の（１）式を満足する温度で加熱した後、フクレ欠陥を観察する必要がある。
Ｐ＜８．６／ｔ２ （１）
ただし、ｔは、フクレ欠陥を観察する表層金属薄板の厚さ（ｍｍ）である。
In the present invention, it is necessary to observe the blister defect after heating the laminated metal sheet at a temperature of 250 ° C. or higher and 0.2% proof stress P (MPa) satisfying the following formula (1).
P <8.6 / t 2 (1)
However, t is the thickness (mm) of the surface metal thin plate which observes a blister defect.
ここで、積層金属薄板の加熱温度が２５０℃未満の場合には、金属薄板間に存在する異物からの発生ガスの膨張が不十分であり、フクレ欠陥を生じさせることができない。また、発生したガスの内圧が表層の金属板を変形させるまでに高まらなければ、未接合部にフクレ欠陥を生じさせることができない。よって、上記の（１）式を満足する温度で加熱する必要がある。なお、加熱温度の上限は特に定めない。溶融温度未満であればよい。ただし、酸化雰囲気で加熱する場合には、スケールまたは酸化被膜によりフクレ欠陥が判定しづらくなる場合があるので、積層金属薄板の酸化温度未満とするのがよい。 Here, when the heating temperature of the laminated metal thin plate is less than 250 ° C., the expansion of the generated gas from the foreign matter existing between the metal thin plates is insufficient, and the blister defect cannot be generated. Further, if the generated gas does not increase in pressure before the surface metal plate is deformed, a blister defect cannot be generated in the unjoined portion. Therefore, it is necessary to heat at a temperature that satisfies the above equation (1). There is no particular upper limit on the heating temperature. What is necessary is just to be below the melting temperature. However, when heating in an oxidizing atmosphere, it may be difficult to determine blister defects due to the scale or oxide film, so it is preferable that the temperature be lower than the oxidation temperature of the laminated metal sheet.
この加熱後に積層金属薄板のフクレ欠陥が発生した未接合部を排除することによって、品質を格段に改善した積層金属薄板を製造することが可能となる。 By eliminating the unjoined portion where the blister defect of the laminated metal thin plate has occurred after this heating, it is possible to produce a laminated metal thin plate with significantly improved quality.
なお、０．２％耐力Ｐ（ＭＰａ）については、Ｎｉ、Ｃｕ、Ａｌなど積層金属薄板を構成する金属板を５０％圧延して得た金属薄板にＪＩＳ Ｇ ０５６７に従って高温引張試験を実施し、各温度に対応した０．２％耐力（ＭＰａ）を求めればよい。 For 0.2% proof stress P (MPa), a high temperature tensile test was performed according to JIS G 0567 on a metal sheet obtained by rolling 50% of a metal sheet constituting a laminated metal sheet such as Ni, Cu, Al, What is necessary is just to obtain 0.2% yield strength (MPa) corresponding to each temperature.
なお、Ｃｕなどの酸化しやすい金属板を加熱する場合には、非酸化性雰囲気または真空中で加熱することが好ましい。本発明は、フクレ欠陥を観察する表層の金属薄板の厚さｔが０．００５〜０．７５ｍｍである積層金属薄板に特に有用である。厚さｔが０．００５ｍｍ未満の場合、加熱によって表層の金属薄板が破断するおそれがあり、厚さｔが０．７５ｍｍを超えると、適切な加熱を行っても未接合部にフクレ欠陥を発生させることができないおそれがある。 In addition, when heating the metal plate which is easy to oxidize, such as Cu, it is preferable to heat in a non-oxidizing atmosphere or a vacuum. The present invention is particularly useful for a laminated metal sheet in which the thickness t of the surface sheet metal sheet for observing blister defects is 0.005 to 0.75 mm. If the thickness t is less than 0.005 mm, the metal sheet on the surface layer may be broken by heating. If the thickness t exceeds 0.75 mm, a blister defect is generated in the unjoined part even if appropriate heating is performed. There is a possibility that it cannot be made.
本発明は、層数が３以下である積層金属薄板に特に有用である。層数を３より増やしても、導電用部材としての特性の向上は望めないからである。 The present invention is particularly useful for a laminated metal sheet having 3 or less layers. This is because even if the number of layers is increased from 3, improvement in characteristics as a conductive member cannot be expected.
表層の金属薄板のうち、変形抵抗が小さい方の金属薄板は、フクレ欠陥が生じやすいため、変形抵抗が小さい方の金属薄板のフクレ欠陥を観察することが好ましい。三層構造の積層金属薄板の場合には、両表層の金属薄板のフクレ欠陥を観察することが好ましい。積層金属薄板の総厚さは、電池用部材として用いる場合には３ｍｍ以下が好ましい。また、加熱時間は、目標温度に達するのに十分な時間であればよいが、実質的には６０秒以上保持するのがよい。 Of the metal thin plates on the surface layer, the metal thin plate having the smaller deformation resistance is likely to cause a blister defect, and therefore it is preferable to observe the blister defect of the metal thin plate having the smaller deformation resistance. In the case of a laminated metal sheet having a three-layer structure, it is preferable to observe a bulge defect in both surface metal sheets. The total thickness of the laminated metal sheet is preferably 3 mm or less when used as a battery member. Further, the heating time may be a time sufficient to reach the target temperature, but it is preferable that the heating time is substantially maintained for 60 seconds or more.
Ｎｉ／Ｃｕ、Ｎｉ／Ｃｕ／ＮｉおよびＡｌ／Ｎｉ／Ａｌの３種類の積層金属薄板のサンプルを用意し、加熱試験と積層金属薄板に９０度曲げを１０回繰り返す、繰り返し曲げ試験とを実施した。 Samples of three types of laminated metal thin plates of Ni / Cu, Ni / Cu / Ni, and Al / Ni / Al were prepared, and a heating test and a repeated bending test were performed by repeating 90 ° bending on the laminated metal thin plate 10 times. .
なお、上記のＮｉ／ＣｕおよびＮｉ／Ｃｕ／Ｎｉは、実験用圧延機によって、真空パック組み立てした素材を６５０℃で均熱後に圧延率５０％以上で圧延し、総厚み０．２〜１．５ｍｍとしたクラッド薄板である。最表層金属の板厚はＮｉ／ＣｕにおいてはＣｕを板厚０．０５〜０．７５ｍｍ厚とし、Ｎｉ／Ｃｕ／ＮｉにおいてはＮｉを板厚０．０５〜０．５０ｍｍ厚とした。また、上記のＡｌ／Ｎｉ／Ａｌは、実験用圧延機によって、冷間で、圧延率５０〜６０％以上で圧延した。更に、圧延率６０％以上のサンプルを再圧延し、最も薄いものは総厚み０．０５５ｍｍまで圧延した。最表層Ａｌの板厚は０．０１〜０．１０とした。接合の際、一部の素材組み立ての接合界面には酸化鉄の微粉末を少量散布し、意図的に未接合部を形成した。 In addition, said Ni / Cu and Ni / Cu / Ni were rolled with the rolling rate of 50% or more after soaking | cleaning the material which carried out the vacuum pack assembly at 650 degreeC with the experimental rolling mill, and the total thickness 0.2-1. The clad thin plate is 5 mm. The plate thickness of the outermost layer metal was 0.05 to 0.75 mm for Cu in Ni / Cu, and 0.05 to 0.50 mm for Ni in Ni / Cu / Ni. Moreover, said Al / Ni / Al was rolled by the experimental rolling mill with the rolling rate of 50-60% or more by cold. Further, a sample having a rolling rate of 60% or more was re-rolled, and the thinnest one was rolled to a total thickness of 0.055 mm. The plate thickness of the outermost layer Al was 0.01 to 0.10. At the time of joining, a small amount of fine powder of iron oxide was sprayed on the joining interface of some material assembly, and an unjoined part was intentionally formed.
上記のサンプルを１００〜７００℃で均熱し、放冷する熱処理した後、表面を目視観察して、フクレ欠陥の発生状況を確認した。加熱試験の熱処理は、Ｎｉ／Ｃｕ／ＮｉおよびＡｌ／Ｎｉ／Ａｌについては大気中で行い、Ｎｉ／ＣｕについてはＣｕの酸化防止のため不活性ガス（Ａｒ）中で行った。 The sample was soaked at 100 to 700 ° C. and subjected to a heat treatment for cooling, and then the surface was visually observed to confirm the occurrence of blister defects. The heat treatment of the heating test was performed in the atmosphere for Ni / Cu / Ni and Al / Ni / Al, and in the inert gas (Ar) for Ni / Cu to prevent Cu oxidation.
サンプルの積層金属薄板の構成、加熱試験条件、フクレ欠陥の有無、繰り返し曲げ試験における剥離の有無を表１に示す。なお、表１において、加熱試験でフクレ欠陥が発生したものを「有」、発生しなかったものを「無」、繰り返し曲げ試験で「９０度繰り返し曲げ試験を１０回施した後の断面観察で、クラッド界面の剥離が認められず、かつ破断に至るまでの繰り返し曲げ回数が１７回以上」であったもの「良」、それ以外のものを「不良」とした。 Table 1 shows the configuration of the laminated metal thin plate of the sample, the heating test conditions, the presence or absence of blister defects, and the presence or absence of peeling in the repeated bending test. In Table 1, “Yes” indicates that the blister defect occurred in the heating test, “No” indicates that the defect did not occur, and “No” in the repeated bending test. The case where the peeling of the clad interface was not recognized and the number of repeated bending until the fracture was 17 times or more was determined as “good”, and the other cases were determined as “bad”.
表１に示すように、本発明例１〜２５では、フクレ欠陥が発生した例では繰り返し曲げ試験でも剥離が発生しており、また、フクレ欠陥が発生しなかった例では繰り返し曲げ試験でも剥離が発生していなかった。これに対して、加熱試験温度が低すぎる比較例１では、フクレ欠陥が発生しないが、繰り返し曲げ試験では剥離が発生していた。加熱試験温度が２５０℃以上ではあるものの、（１）式を満足しない比較例２〜１２においても、フクレ欠陥が発生しないが、繰り返し曲げ試験では剥離が発生していた。 As shown in Table 1, in Examples 1 to 25 of the present invention, peeling occurred in the repeated bending test in the example in which the bulge defect occurred, and peeling also occurred in the repeated bending test in the example in which no bulge defect occurred. It did not occur. On the other hand, in Comparative Example 1 where the heating test temperature is too low, no blister defect occurs, but peeling occurred in the repeated bending test. Although the heating test temperature is 250 ° C. or higher, in Comparative Examples 2 to 12 that do not satisfy the formula (1), no blister defect occurs, but peeling occurred in the repeated bending test.
本発明によれば、複雑な加工を行うことなく、非破壊で、積層金属薄板の未接合部の存在を広範囲で検査することができるので、安全性が低下した製品の出荷を未然に防止することが可能となる。 According to the present invention, it is possible to inspect a wide range of unbonded portions of a laminated metal sheet without performing complicated processing, thereby preventing shipment of products with reduced safety. It becomes possible.
Claims (5)
２５０℃以上で、かつ０．２％耐力Ｐ（ＭＰａ）が下記の（１）式を満足する温度を決定し、その温度で前記積層金属薄板を加熱した後、フクレ欠陥を観察する、
積層金属薄板の品質判定方法。
Ｐ＜８．６／ｔ２ （１）
ただし、ｔは、フクレ欠陥を観察する表層金属薄板の厚さ（ｍｍ）である。 A method of judging the quality of a laminated metal sheet ,
Determine the temperature at 250 ° C. or higher and 0.2% proof stress P (MPa) satisfying the following formula (1), and after heating the laminated metal sheet at that temperature, observe the bulge defect,
Quality judgment method for laminated metal sheets.
P <8.6 / t 2 (1)
However, t is the thickness (mm) of the surface metal thin plate which observes a blister defect.
請求項１に記載の積層金属薄板の品質判定方法。 If the laminated metal sheet oxidizes, heat it in a non-oxidizing atmosphere or vacuum.
The quality judgment method of the laminated metal sheet according to claim 1.
請求項１または２に記載の積層金属薄板の品質判定方法。 The thickness t of the surface metal thin plate for observing blister defects is 0.005 to 0.75 mm.
The quality judgment method of the laminated metal thin plate of Claim 1 or 2.
請求項１から３までのいずれかに記載の積層金属薄板の品質判定方法。 The number of layers is 3 or less,
The quality judgment method of the laminated metal thin plate in any one of Claim 1 to 3.
請求項１から４までのいずれかに記載の積層金属薄板の品質判定方法。 Observe the bulge defect of the metal sheet with the smaller deformation resistance among the surface sheet metal sheets.
The quality judgment method of the laminated metal thin plate according to any one of claims 1 to 4.
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