JP6417255B2 - Fixing belt and manufacturing method thereof - Google Patents

Description

  The present invention relates to a fixing belt and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, image forming apparatuses such as electrophotographic copying machines, printers, facsimiles and the like using charged images are known. These image forming apparatuses perform image formation through processes such as formation of a latent image by exposure of image data to a charged photoreceptor, development, transfer to a transfer medium, and fixing. In the fixing step, the toner transferred onto the transfer material (paper) is melted and fixed by heating to form an image. Therefore, a fixing belt that generates heat by electromagnetic induction heating (hereinafter sometimes abbreviated as IH) is used. It has come to be used.

  Examples of the IH fixing belt include a base layer made of polyimide resin, a metal plating layer made of an electroless Ni plating layer / electrolytic Cu plating layer / electrolytic Ni plating layer, and a high-pressure made of silicone rubber. A fixing belt in which a molecular layer and a surface layer made of a fluororesin are laminated in this order is described.

JP 2006-301562 A

  However, the above-described conventional fixing belt has a problem that when the temperature is raised by electromagnetic induction heating, the adhesion between the metal plating layer and the layer above the metal plating layer is poor, and peeling between both layers is likely to occur. is there.

  In addition, when the surface of the metal plating layer is excessively roughened in order to ensure the above-mentioned adhesion, a temperature distribution is generated in the fixing belt when the temperature is raised by electromagnetic induction heating, and the temperature uniformity is lowered. Newly occurs.

  The present invention has been made in view of the above background, and is intended to provide a fixing belt that can ensure adhesion between a metal plating layer and a layer above the metal plating layer and has good temperature uniformity. Is.

One aspect of the present invention is a fixing belt used in an electrophotographic image forming apparatus,
A resin-made base layer formed in a cylindrical shape, a metal plating layer laminated on the outer periphery of the base layer, and a polymer polymer laminated on the outer periphery of the metal plating layer with or without a primer layer And has a layer,
The metal plating layer is disposed on the most polymer layer side, and includes a first plating layer having a surface concavo-convex portion including a large number of concave portions and convex portions on the surface of the polymer layer side, and the base layer. A second plating layer in contact with
The first plating layer is formed of one selected from the group consisting of Cu plating and Cu alloy plating,
The second plating layer is formed of one selected from the group consisting of Ni plating and Ni alloy plating,
The ten-point average roughness Rz of the surface irregularity surface is in the range of 1 to 10 μm,
In the fixing belt, a part of the layer above the first plating layer enters into the recess.

Another aspect of the present invention is a method of manufacturing the above fixing belt,
Forming a plating layer made of the same plating material as the first plating layer, and applying a surface treatment to the surface of the plating layer, thereby forming a first plating layer having the surface irregularities;
And a second step of forming the polymer layer on or without the primer layer on the surface of the first plating layer on which the surface irregularities are to be formed. is there.

  In the fixing belt, the metal plating layer has a first plating layer that is disposed on the most polymer layer side and includes a surface uneven portion including a large number of concave portions and convex portions on the surface of the polymer layer side. doing. Further, the ten-point average roughness Rz of the surface irregularity surface is within the specific range. In addition, a part of a layer above the first plating layer (hereinafter sometimes referred to as “upper layer” as appropriate) enters the recess.

  Therefore, the fixing belt can ensure adhesion between the metal plating layer and the upper layer and has good temperature uniformity. The reason why the adhesion is ensured is that even when a stress is generated when the upper layer is peeled off due to the difference in thermal expansion coefficient between the metal plating layer and the upper layer when the temperature is raised by electromagnetic induction heating of the fixing belt, It is considered that the upper layer is difficult to peel off due to the anchor effect occurring between the first plating layer and the upper layer depending on the configuration. In addition, the reason for having good temperature uniformity is that the ten-point average roughness Rz of the surface irregularity surface of the first plating layer is uniform within the above specific range, so that the change in the thickness of the first plating layer is small. This is considered to be because it is difficult to affect the temperature uniformity.

  According to the method for manufacturing the fixing belt, it is possible to suitably obtain the fixing belt capable of achieving the above-described effects.

1 is an external perspective view of a fixing belt of Example 1. FIG. It is sectional drawing which showed typically a part of II-II cross section of FIG. It is sectional drawing which expanded the vicinity of the interface of a 1st plating layer and the layer above a 1st plating layer, and was shown typically. It is a scanning electron micrograph of the fixing belt section of sample 6, (a) is 10,000 times, (b) is 30,000 times. It is a scanning electron micrograph of the fixing belt section of sample 10, (a) is 10,000 times and (b) is 30,000 times. It is explanatory drawing which showed typically the outline | summary of the evaluation apparatus for evaluating the temperature uniformity and temperature rising property by electromagnetic induction heating.

  The fixing belt is used in an electrophotographic image forming apparatus. Specific examples of the electrophotographic image forming apparatus include image forming apparatuses such as copiers, printers, facsimile machines, multifunction peripherals, and on-demand printers that employ an electrophotographic system using a charged image. .

  Specifically, the resin used for the base layer in the fixing belt includes, for example, polyamideimide resin, modified polyamideimide resin, polyimide resin, modified polyimide resin, polyethersulfone resin, fluororesin, polycarbonate resin, and these resins. The thing etc. which blended the polysiloxane compound can be illustrated. These can be used alone or in combination of two or more. The resin preferably contains one or more selected from a polyamideimide resin, a modified polyamideimide resin, a polyimide resin, a modified polyimide resin, and a blend of these resins with a polysiloxane compound. . In this case, the rigidity of the cylindrical base layer is increased, which is advantageous for improving the durability of the fixing belt.

  The resin base layer may contain one or more additives such as a flame retardant, a filler, a leveling agent, and an antifoaming agent. Further, the thickness of the base layer is preferably about 20 to 200 μm, more preferably about 40 to 150 μm, and still more preferably about 60 to 100 μm, from the viewpoints of improvement in durability, improvement in flexibility, manufacturability, and the like. Can do. The base layer can have a resin layer containing a catalyst such as Pd on the surface of the metal plating layer.

  In the fixing belt, the metal plating layer has a first plating layer that is disposed on the most polymer layer side and includes a surface uneven portion including a large number of concave portions and convex portions on the surface of the polymer layer side. doing. The first plating layer is a layer that can function as a heat generation layer that generates heat by electromagnetic induction heating. Note that the surface of the metal plating layer on the polymer layer side coincides with the surface of the first plating layer. In addition, the shape of the surface uneven portion may be formed in any shape as long as the 10-point average roughness Rz of the surface uneven portion surface is within the specific range. The surface irregularities can be formed by surface treatment such as etching treatment or wet blast treatment, for example.

  The ten-point average roughness Rz of the surface irregularity surface is a value measured according to JIS B0601 1994 (average value of n = 3). As a measuring apparatus, “Surfcom 1400D” manufactured by Tokyo Seimitsu Co., Ltd. is used. When the Rz is less than 1 μm, the roughness of the surface irregularities is insufficient, the adhesiveness between the metal plating layer and the upper layer is deteriorated, and peeling between the two layers is likely to occur when the temperature is raised by electromagnetic induction heating. The Rz is preferably 1.5 μm or more, more preferably 2 μm or more, and even more preferably 3 μm or more from the viewpoint of sufficiently forming the metal plating layer and the upper layer to form a surface uneven portion. . On the other hand, when the Rz exceeds 10 μm, a temperature distribution is likely to occur at the time of temperature increase by electromagnetic induction heating, and the temperature uniformity decreases. This is considered to be because when the roughness of the surface irregularities becomes excessive, the change in the thickness of the first plating layer becomes large, and unevenness in heat generation due to electromagnetic induction heating tends to occur. The Rz is preferably 9.8 μm or less, more preferably 9.5 μm or less, more preferably 9.5 μm or less, from the viewpoints of sufficient adhesion between the metal plating layer and the upper layer, improvement of temperature uniformity, formability of the surface irregularities, and the like. Can be 9 μm or less.

  In the fixing belt, a part of the layer above the first plating layer enters the concave portion of the surface uneven portion having the ten-point average roughness Rz within the specific range. Such a structure can be confirmed by observing the cross section of the fixing belt with a scanning electron microscope.

  In the fixing belt, the surface uneven portion can have an oxide film on the surface. In this case, since the surface of the surface uneven portion has an oxide film in advance, even when the fixing belt is exposed to a heating environment, the surface is exposed to low molecular weight components, moisture, or the like that can be contained in the polymer layer. The surface of the uneven portion is hardly oxidized over time. Therefore, in this case, it is difficult to cause a change with time in which the surface of the surface uneven portion is oxidized and the chemical composition of the surface changes. The oxide film can be formed by, for example, oxidizing the metal forming the first plating layer simultaneously with the etching when the first plating layer is formed by etching. In addition, the oxide film of a surface uneven | corrugated | grooved part can be confirmed by conducting an elemental analysis of the cross section, for example.

The first plating layer, specifically, C u plating, and that is formed from one selected from the Ranaru group hear Cu alloy plating. Cu, Cu alloy is excellent in conductivity, it tends to generate heat by electromagnetic induction heating. Therefore, in this case, it is advantageous to relatively shorten the time required to raise the temperature of the fixing belt to a necessary temperature by electromagnetic induction heating, that is, the temperature raising time. Therefore, in this case, the warm-up time is shortened, and a fixing belt advantageous for energy saving can be obtained by reducing the power consumption of the image forming apparatus.

  Specifically, the thickness of the first plating layer can be, for example, in the range of 10 to 50 μm. In this case, it becomes easy to improve the temperature uniformity and the temperature rise by electromagnetic induction heating while ensuring the adhesion between the metal plating layer and the upper layer.

  The thickness of the first plating layer is preferably 12 μm or more, more preferably 14 μm or more, and even more preferably 16 μm or more, from the viewpoints of temperature uniformity by electromagnetic induction heating, temperature rising property, and the like. On the other hand, the thickness of the first plating layer is preferably 45 μm or less, more preferably 40 μm or less, and even more preferably 35 μm or less, from the viewpoints of productivity improvement by shortening the plating time, cost, and the like. The thickness of the first plating layer can be measured from the cross section of the fixing belt using a scanning electron microscope. Moreover, the thickness of a 1st plating layer is an average value (n = 10) of the distance of the base layer side surface and the bottom part of the recessed part in a surface uneven | corrugated | grooved part.

In the fixing belt, a metal plating layer that consists double several layers. Incidentally, if the metallic plating layer is composed of a plurality of layers, the layer which is disposed closest to the polymer layer side corresponding to the first plating layer. The metal plating layer may be formed by electrolytic plating or may be formed by electroless plating. Or you may form combining both electroplating and electroless-plating.

Metal plating layer, that have a second plating layer in contact with the base layer. According to this structure, a 2nd plating layer can be used as a base layer at the time of 1st plating layer formation. The second plating layer, specifically, N i-plated, or are formed of Ni alloy plating. Specifically, the thickness of the second plating layer can be, for example, about 0.1 to 2 μm.

  More specifically, the metal plating layer may be formed by laminating the second plating layer and the first plating layer in this order. In this case, it becomes easy to ensure the adhesion between the base layer and the metal plating layer and the adhesion between the metal plating layer and the upper layer. Moreover, it becomes easy to ensure the exothermic property by electromagnetic induction heating.

  The fixing belt may have a primer layer between the metal plating layer and the polymer layer or may not have a primer layer. When the primer layer is provided, it is advantageous for improving the adhesion between the metal plating layer and the upper layer. In addition, when it has a primer layer, only a part of primer layer may enter into the recessed part, and a part of primer layer and a part of polymer layer may enter. Moreover, when it does not have a primer layer, a part of polymer layer will enter.

  Examples of the primer for forming the primer layer include “Primer No. 4” and “Primer No. 31” manufactured by Shin-Etsu Chemical Co., Ltd., “DY39-067” and “DY39-051” manufactured by Toray Dow Corning. be able to.

  The thickness of the primer layer can be, for example, about 0.1 μm to 1.0 μm.

  In the fixing belt, when the polymer forming the polymer layer has rubber elasticity, the polymer layer can function as a rubber elastic layer. Therefore, in this case, it is possible to obtain a fixing belt that is excellent in flexibility and easy to apply uniform pressure.

  Specifically, the polymer layer can contain, for example, one kind of polymer selected from the group consisting of silicone rubber, fluororubber, and fluororesin. When the polymer is a silicone rubber, a fixing belt excellent in uniform pressure and heat resistance can be obtained. Further, when the polymer is fluororubber, a fixing belt excellent in uniform pressurization property and easily separated from a transfer material such as paper and toner can be obtained. Further, when the polymer is a fluororesin, a fixing belt in which a transfer material such as paper and toner are easily separated can be obtained.

  More specific examples of the fluororesin include polyfluoroethylene, polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer (PFA), and the like.

  In addition to the above polymers, the polymer layer is a heat conductive material such as heat conductive particles, a conductive agent, a flame retardant, a lubricant, a plasticizer, a softener, a filler, a cross-linking agent, a cross-linking aid, an anti-aging agent, etc. 1 type, or 2 or more types can be included. Examples of the heat conducting material include magnesium oxide, alumina, boron nitride, aluminum nitride, graphite, carbon black, crystalline silica, silicon carbide, and aluminum hydroxide.

  When the polymer layer has rubber elasticity, the thickness of the polymer layer is preferably 100 μm or more, more preferably 150 μm or more, from the viewpoint of imparting flexibility to the surface of the fixing belt and improving the ground contact with the toner or the like. More preferably, it can be 200 micrometers or more. On the other hand, the thickness of the polymer layer is preferably 500 μm or less, more preferably 400 μm or less, and even more preferably 300 μm or less, from the viewpoints of improving the IH temperature rising property and thermal conductivity by thinning. .

  When the polymer layer does not have rubber elasticity, the thickness of the polymer layer is preferably 5 μm or more, more preferably 7 μm or more, and even more preferably 10 μm or more, from the viewpoints of wear resistance, handling properties during production, and the like. can do. On the other hand, the thickness of the polymer layer is preferably 50 μm or less, more preferably 40 μm or less, and even more preferably 30 μm or less, from the viewpoint of ensuring appropriate surface hardness and cost.

  The surface of the polymer layer may be surface-modified. Specifically, F atoms and / or Cl atoms can be introduced into the surface of the polymer layer by modifying the surface of the polymer layer with a surface treatment liquid. Further, the surface of the polymer layer can be made harder than the inside (reducing the friction coefficient) by subjecting the polymer layer surface to light irradiation treatment such as ultraviolet irradiation treatment. In these cases, the toner adhering to the surface of the polymer layer is easily separated.

  Further, the surface of the polymer layer may not be modified, and a surface layer may be further laminated on the outer periphery of the polymer layer.

  The main material used for the surface layer is, for example, polyfluoroethylene, polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer (PFA), etc. from the viewpoint of easily separating transfer materials such as toner and paper. A fluororesin or the like can be suitably used. Further, in the surface layer, for example, one or more additives such as a flame retardant, a filler, a crosslinking agent, a crosslinking aid, a lubricant, a plasticizer, a softener, and an antioxidant may be contained. .

  From the viewpoint of durability and the like, the thickness of the surface layer is preferably 5 μm or more, more preferably 7 μm or more, and further preferably 10 μm or more. On the other hand, the thickness of the surface layer is preferably 80 μm or less, more preferably 70 μm or less, and even more preferably 50 μm or less, from the viewpoint of improving thermal conductivity and cost.

  In the fixing belt manufacturing method, the surface of the plating layer can be suitably surface-treated by, for example, etching treatment or wet blasting treatment. In this case, it is possible to relatively easily form the surface uneven portion having the above-mentioned specific range of Rz. In the etching process, the type of etching chemical, etching time, etching temperature, and the like can be adjusted so that the Rz of the surface uneven portion to be formed is within the above range. In addition, in the wet blast treatment, the type of blasting agent, the projection time, the projection pressure, and the like can be adjusted so that the Rz of the surface uneven portion to be formed is within the above range.

  In the fixing belt manufacturing method, in the second step, a liquid polymer is formed to form a polymer layer after applying a primer layer forming material on the surface of the surface uneven portion as necessary. By coating the material, a polymer layer can be formed. In this case, the material for forming the primer layer and / or the material for forming the polymer layer is likely to enter into the recesses of the surface uneven portion. Therefore, in this case, it is easy to obtain a state in which a part of the layer above the first plating layer has entered the recess of the surface uneven portion. Examples of the coating method include a dip coating method, a dispenser coating method (nozzle coating method), a roll coating method, a ring coating method, and a spray coating method.

  In addition, each structure mentioned above can be arbitrarily combined as needed, in order to acquire each effect etc. which were mentioned above.

  Hereinafter, the fixing belt of the embodiment and the manufacturing method thereof will be specifically described with reference to the drawings.

Example 1
The fixing belt of Example 1 will be described with reference to FIGS. As shown in FIGS. 1 to 3, the fixing belt 1 of this example is used in an electrophotographic image forming apparatus. Specifically, the fixing belt 1 is brought into pressure contact with, for example, a pressure roll disposed so as to face the fixing belt 1 in the fixing unit of the image forming apparatus, and is rotated by being driven by the pressure roll. Can be configured. In this case, the nip portion can be formed by holding the surface of the fixing belt 1 and the surface of the pressure roll in pressure contact with each other. Then, a sheet holding an unfixed toner image can be passed through the nip portion, and the unfixed toner image can be melted and fixed on the sheet by heat and pressure from the fixing belt 1.

  As shown in FIG. 2, the fixing belt 1 includes a resin-made base layer 2 formed in a cylindrical shape, a metal plating layer 3 laminated on the outer periphery of the base layer 2, and a primer layer 41 on the outer periphery of the metal plating layer 3. And a polymer layer 4 made of a polymer laminated with or without interposition. The metal plating layer 3 is disposed on the most polymer layer 4 side, and the first plating layer 31 is provided with a surface uneven portion 311 including a large number of concave portions 311a and convex portions 311b on the surface of the polymer layer 4 side. have.

  Specifically, in this example, the primer layer 41 is formed along the surface of the surface uneven portion 311 of the first plating layer 31, and the polymer layer 4 is laminated on the primer layer 41. In FIG. 1, a detailed stacked configuration is omitted. In FIG. 2, the primer layer 41 is omitted.

  In the fixing belt 1, the ten-point average roughness Rz of the surface irregularity portion 311 surface is in the range of 1 to 10 μm. And as FIG. 3 shows, a part of layer above the 1st plating layer 31 has penetrated into the recessed part 311a. In this example, specifically, a part of the primer layer 41 and a part of the polymer layer 4 enter the recess 311a.

In this example, the base layer 2 is made of polyamideimide resin. Specifically, the metal plating layer 3 includes a second plating layer 32 stacked on the outer periphery of the base layer 2 and a first plating layer 31 stacked on the outer periphery of the second plating layer 32. The first plating layer 31 is specifically, Cu plating, and are formed from one selected from the Ranaru group hear Cu alloy plating. Specifically, the second plating layer 32 is formed by Ni plating or Ni alloy plating. Specifically, the polymer layer 4 includes silicone rubber or fluororubber.

  In this example, the thickness of the base layer 2 is 80 μm. The thickness of the 1st plating layer 31 is thicker than the thickness of the 2nd plating layer 32, and exists in the range of 10-50 micrometers. The thickness of the 2nd plating layer 32 exists in the range of 0.1-2 micrometers. The thickness of the primer layer 41 is about 0.3 μm. The thickness of the polymer layer 4 is 200 μm.

  The fixing belt 1 of this example can generate heat as follows, for example. In the fixing unit of the image forming apparatus, an alternating current having a predetermined frequency is applied to the IH coil of the magnetic field generating unit installed with a gap from the outer peripheral surface of the fixing belt 1. As a result, an alternating magnetic field is generated around the IH coil. When the AC magnetic field crosses the first plating layer 311 in the metal plating layer 3 of the fixing belt 1, an induction current (eddy current) is generated so as to generate a magnetic field that hinders the change of the AC magnetic field due to electromagnetic induction. When the induced current flows through the first plating layer 311 of the fixing belt 1, Joule heat is generated by electric power proportional to the resistance value of the first plating layer 311, and the first plating layer 311 generates heat. As a result, the fixing belt 1 can generate heat.

(Example 2)
A method for manufacturing the fixing belt of Example 2 will be described. The fixing belt manufacturing method of this example is a method by which the fixing belt 1 of Example 1 can be preferably manufactured. The fixing belt manufacturing method of the present example includes a first step and a second step. A 1st process is a process of forming the 1st plating layer provided with a surface uneven | corrugated | grooved part by forming the plating layer which consists of the same plating material as a 1st plating layer, and surface-treating to the surface of this plating layer. . The second step is a step of forming a polymer layer on the surface of the first plating layer where the surface irregularities are formed, with or without a primer layer.

  In this example, specifically, the surface treatment is an etching treatment or a wet blast treatment.

  Hereinafter, a plurality of fixing belt samples were prepared and subjected to various evaluations. An experimental example will be described.

(Experimental example)
<Preparation of fixing belts of Sample 1 to Sample 3>
An aluminum cylindrical mold having a diameter of 40 mm and an axial length of 450 mm was prepared. Next, a polyamide imide varnish (manufactured by Hitachi Chemical Co., Ltd., “HPC-5011-29”) (solid content concentration 16%) as a base layer forming material is applied to the surface of the mold by a dip coating method. Dry at 60 ° C. for 60 minutes. As a result, a polyamideimide base layer (thickness: 80 μm) formed in a cylindrical shape was formed on the outer periphery of the cylindrical mold.

  Next, the outer peripheral surface of the base layer was etched using a 200 g / L NaOH aqueous solution at a temperature of 40 ° C. for 10 minutes. The etched base layer was immersed in a Pd catalyst-imparting agent (Okuno Pharmaceutical Co., Ltd., “OPC-50 inducer”) at 40 ° C. for 5 minutes to give a Pd catalyst to the outer peripheral surface of the base layer. The base layer provided with the Pd catalyst was immersed in an activator (Okuno Pharmaceutical Co., Ltd., “OPC-150 Cryster”) at 25 ° C. for 5 minutes to metallize Pd ions (activation treatment). Thus, the plating pretreatment was performed on the outer peripheral surface of the base layer.

  Subsequently, the base layer on which the plating pretreatment was performed was immersed in an electroless Ni plating solution (Okuno Pharmaceutical Co., Ltd., “TMP Chemical Nickel HRT”) at 40 ° C. for 5 minutes. This formed the 2nd plating layer (thickness 0.3 micrometer) which consists of Ni plating in the outer periphery of the said base layer.

  Next, 70 g / L of copper sulfate, 200 g / L of sulfuric acid, brightener [Okuno Pharmaceutical Co., Ltd., “Top Lucina LS”] 5 ml / L, 35% hydrochloric acid 0.125 ml / L are mixed, and an electrolytic Cu plating solution Was prepared.

Next, electrolytic Cu plating was performed on the surface of the electroless Ni plating layer using the electrolytic Cu plating solution to form an electrolytic Cu plating layer. The plating conditions were a plating bath temperature: 25 ° C., a current density: 2.3 A / dm ² , and a plating time: 40 minutes.

Next, the surface of the electrolytic Cu plating layer was etched using an etching solution (“A10201” manufactured by MEC Co., Ltd.) to form a first plating layer made of Cu plating and having a surface uneven portion. Thereby, the metal plating layer formed by laminating the second plating layer and the first plating layer in this order was formed. The etching conditions were as follows.
・ Sample 1
Etching temperature: 40 ° C., Etching time: 0.5 minutes, Sample 2
Etching temperature: 40 ° C., Etching time: 2.5 minutes, Sample 3
Etching temperature: 40 ° C., Etching time: 5 minutes

  Next, a silicone rubber having thermal conductivity (“X34-2720” manufactured by Shin-Etsu Chemical Co., Ltd.) is kneaded with a planetary mixer, and then dissolved in toluene so that the solid content concentration becomes 60% by mass. As a result, a liquid polymer layer forming material (1) was prepared.

  Next, a primer (“DY39-051” manufactured by Toray Dow Corning Co., Ltd.) was applied to the surface of the first plating layer subjected to the etching treatment with a brush, and baked at 150 ° C. for 30 minutes. Thereafter, the polymer layer-forming material (1) was applied to the surface of the first plating layer on which the primer layer (thickness of about 0.3 μm) was formed by dip coating, and heat-treated at 130 ° C. for 30 minutes. . Thereby, a polymer layer (thickness: 200 μm) made of silicone rubber was formed on the outer periphery of the first plating layer via the primer layer.

  Thus, fixing belts for Sample 1 to Sample 3 were produced.

<Preparation of Fixing Belt of Sample 4>
In the preparation of the fixing belt of Sample 3, the electrolytic Cu plating layer was formed with a plating time of 60 minutes, and instead of the polymer layer forming material (1), a fluororubber polymer layer was formed as follows. A fixing belt of Sample 4 was produced in the same manner except for the formed points.
The surface of the first plating layer was uniformly spray-coated with a fluorine rubber solution (“Daiel Latex GLS-213” manufactured by Daikin Co., Ltd.) using an air spray gun. After spray coating, the mixture was heated at a temperature of 100 ° C. for 15 minutes, further heated from 100 ° C. to 300 ° C. at a rate of 2 ° C./minute, and then heated at a temperature of 300 ° C. for 5 minutes. Then, it cooled to room temperature. Thereby, a polymer layer (thickness: 60 μm) made of fluororubber was formed.

<Preparation of Fixing Belt of Sample 5>
In the preparation of the fixing belt of Sample 1, instead of the electrolytic Cu plating solution, an electrolytic Ag plating solution (manufactured by Daiwa Kasei Kogyo Co., Ltd., “Dyne Silver GPE-PL”) is used. Then, electrolytic Ag plating was performed to form an electrolytic Ag plating layer. The plating conditions were as follows: plating bath temperature: 25 ° C., current density: 1 A / dm ² , plating time: 80 minutes.

  Next, the surface of the electrolytic Ag plating layer is etched using an etching solution (“Esback AG-601”, manufactured by Sasaki Chemical Co., Ltd.), so that the first plating layer is made of Ag plating and has a surface uneven portion. Formed. The etching conditions were an etching temperature: 25 ° C. and an etching time: 5 minutes. Thereafter, the fixing belt of Sample 5 was manufactured in the same manner as the fixing belt of Sample 1.

<Preparation of Fixing Belt of Sample 6>
In the preparation of the fixing belt of Sample 1, the surface of the electrolytic Cu plating layer is etched using an etching solution (Okuno Pharmaceutical Co., Ltd., “OPC Black Bond Cu”) to form Cu plating, and an oxide film is formed on the surface. The 1st plating layer provided with the surface uneven | corrugated | grooved part which has was formed. The etching conditions were an etching temperature: 90 ° C. and an etching time: 3 minutes. Further, after etching, the surface of the surface irregularities was blackened due to the formation of a thin oxide film. Thereafter, the fixing belt of Sample 6 was manufactured in the same manner as the fixing belt of Sample 1.

<Preparation of Fixing Belt of Sample 7>
In the production of the fixing belt of Sample 2, the fixing belt of Sample 7 was produced in the same manner except that the electrolytic Cu plating was performed with a plating time of 16 minutes and an electrolytic Cu plating layer was formed.

<Preparation of Fixing Belt of Sample 8>
Nickel sulfate 250 g / L, nickel chloride 45 g / L, boric acid 40 g / L, brightener (Okuno Pharmaceutical Co., Ltd., “Top Serina 73X”) 5 ml / L, brightener (Okuno Pharmaceutical Co., Ltd., “MU-2”) 5 ml / L was mixed to prepare an electrolytic Ni plating solution.

In the production of the fixing belt of Sample 1, instead of the electrolytic Cu plating solution, the electrolytic Ni plating solution was used, and electrolytic Ni plating was performed on the surface of the electroless Ni plating layer to form an electrolytic Ni plating layer. The plating conditions were a plating bath temperature: 50 ° C., a current density: 3 A / dm ² , and a plating time: 40 minutes. Next, the surface of the electrolytic Ni plating layer is made of Ni plating by etching using an etching solution (manufactured by Nippon Chemical Industry Co., Ltd., “Nickel Etching Solution HA”). A plating layer was formed. The etching conditions were an etching temperature: 30 ° C. and an etching time: 10 minutes. Thereafter, the fixing belt of Sample 8 was manufactured in the same manner as that of the fixing belt of Sample 1.

<Preparation of Fixing Belt of Sample 9>
In the preparation of the fixing belt of Sample 2, the fixing of Sample 9 was performed in the same manner except that a polymer layer was formed directly on the surface of the first plating layer without applying a primer and without a primer layer. A belt was produced.

<Preparation of Fixing Belt of Sample 10>
In the production of the fixing belt of Sample 1, the fixing belt of Sample 10 was produced in the same manner except that the etching treatment was not performed.

<Preparation of Fixing Belt of Sample 11>
In the production of the fixing belt of Sample 1, the fixing belt of Sample 11 was produced in the same manner except that the etching conditions were etching temperature: 40 ° C. and etching time: 6 minutes.

<Measurement of 10-point average roughness Rz of surface irregularities>
At the time of producing the fixing belt of each sample, after etching treatment, in accordance with JIS B0601 1994, using “Surfcom 1400D” manufactured by Tokyo Seimitsu Co., Ltd., the ten-point average roughness Rz (n = 3 average value) ) Was measured. Note that the fixing belt of the sample 10 is not subjected to an etching process. Therefore, for the fixing belt of Sample 10, the ten-point average roughness Rz of the surface of the electrolytic Cu plating that was not etched was measured.

<Belt cross-section observation>
About the fixing belt of each sample, the belt cross section was observed using the scanning electron microscope. As a result, it was confirmed that the fixing belts of Sample 1 to Sample 9 and Sample 11 excluding the fixing belt of Sample 10 had surface irregularities formed by the etching process. In addition, the thickness of the first plating layer in the fixing belt of each sample was also measured. FIG. 4 shows a scanning electron micrograph of the cross section of the fixing belt of Sample 6. FIG. 5 shows a scanning electron micrograph of the cross section of the fixing belt of Sample 10.

<Adhesion>
Each strip-shaped test piece having a length of 10 cm and a width of 1 cm was collected from the fixing belt of each sample. In order not to cut | disconnect each test piece, the notch was put into the interface part by the side of the polymer layer in a 1st plating layer using the cutter knife. Thereafter, by using a tensile tester (manufactured by Shimadzu Corporation, “Precision Universal Testing Machine AGS-1kNX”), the layer above the first plating layer is pulled away from the first plating layer, whereby the adhesion strength (180 ° peel strength). At this time, the tensile speed was 25 mm / min. The adhesion strength was measured in a stable state one minute after the start of tension.

  A case where the adhesion strength was 0.5 N / cm or more or a fracture occurred in the polymer layer was designated as “A” because the adhesion was ensured. The case where the adhesion strength was less than 0.5 N / cm and peeling occurred at the interface with the first plating layer was designated as “C” because the adhesion was poor.

<Soaking>
A fixing unit mounted on a commercially available full-color multifunction peripheral (manufactured by Konica Minolta, “bizhub C652DS”) was used as a rotating unit, and the fixing belt of the sample prepared above was attached to the rotating unit. Next, as shown in FIG. 6, an IH coil 91 was placed close to the outer periphery of the fixing belt 1 of the sample. Next, by rotating the drive motor 92, the pressure roll 94 is rotated through the drive system 93, and the fixing belt 1 of the sample pressed against the pressure roll 94 is rotated in the direction of the arrow Y by the rotation. (Rotation speed 300 rpm). In FIG. 6, N is a nip portion between the fixing belt 1 of the sample and the pressure roll 94. S is printing paper. Further, the IH coil 91 was operated at 1.25 kW, and the temperature of the fixing belt 1 of the rotating sample was raised by electromagnetic induction heating. Then, the fixing belt of the sample was continuously heated for 10 minutes in a state where the temperature of the belt surface in the central portion in the belt axial direction reached 200 ° C. The temperature of the belt surface at the central portion in the belt axial direction after heating for 10 minutes, the temperature of the belt surface at a location 175 mm away from the central portion in one belt axial direction, and from the central portion in the other belt axial direction The temperature of the belt surface at a location separated by 175 mm was measured using a non-contact thermometer 95 (manufactured by Keyence Corporation, “FT-H10”) disposed on the outer periphery of the fixing belt 1 of the sample.

  The case where the temperature difference at three locations was within 5 ° C. was designated as “A” because there was no temperature distribution on the belt and the temperature uniformity was excellent. The case where the temperature difference at three locations was more than 5 ° C. and within 10 ° C. was regarded as “B” because the belt had almost no temperature distribution and good temperature uniformity. When the temperature difference of 3 places exceeded 10 degreeC, temperature distribution had generate | occur | produced in the belt and it was set as "C" because it was inferior in temperature uniformity.

<Temperature rise>
In the same manner as the temperature uniformity evaluation test described above, the fixing belt of the sample was heated by electromagnetic induction heating. And the temperature rising time until the temperature of the belt surface reached 100 ° C. was measured.

  The case where the temperature reached 100 ° C. within 10 seconds was defined as “A”. The case where the temperature reached 100 ° C. within 10 seconds to 20 seconds was defined as “B”. The case where it took more than 20 seconds to reach 100 ° C. was defined as “B-”.

  According to Table 1, the following can be understood.

  In the fixing belt of Sample 10, the ten-point average roughness Rz of the surface uneven portion is lower than the lower limit value defined in the present application. For this reason, the fixing belt of Sample 10 could not secure the adhesion between the metal plating layer and the upper layer.

  In the fixing belt of the sample 11, the ten-point average roughness Rz of the surface uneven portion exceeds the upper limit defined in the present application. For this reason, the fixing belt of the sample 11 was more likely to have a temperature distribution when the temperature was raised by electromagnetic induction heating than the other samples, and the temperature uniformity was poor. This is considered to be due to the influence of the increase in the thickness of the first plating layer because the roughness of the surface irregularities was excessive.

  On the other hand, the fixing belts of Sample 1 to Sample 9 have the above-described configuration defined in the present application. Therefore, it was confirmed that the fixing belts of Sample 1 to Sample 9 can secure the adhesion between the metal plating layer and the upper layer and have good temperature uniformity.

  Next, the fixing belts of Sample 1 to Sample 9 are compared. In the fixing belt of Sample 7, the first plating layer has a thickness of less than 10 μm. For this reason, the fixing belt of Sample 7 has lower temperature rise than the fixing belts of other samples. This is presumably because the thickness of the first plating layer was less than 10 μm, so that there were relatively fewer heat generation sites. From this result, when the thickness of the first plating layer is 10 μm or more, it is possible to improve the temperature rise while ensuring the adhesion and temperature uniformity between the polymer layer and the first plating layer. It can be said that

  In the fixing belt of Sample 8, the first plating layer is formed by Ni plating. Therefore, the fixing belt of the sample 8 has lower temperature rise than the fixing belts of other samples. This is because Ni is inferior in conductivity as compared to Cu, so that it is difficult to generate heat in the first plating layer by electromagnetic induction heating. From this result, in the case where the first plating layer is formed of Cu, Cu alloy, Ag, or Ag alloy, which are highly conductive metals, adhesion between the polymer layer and the first plating layer, soaking It can be said that it is possible to improve the temperature rise while securing the property.

  As mentioned above, although the Example of this invention was described in detail, this invention is not limited to the said Example, A various change is possible within the range which does not impair the meaning of this invention.

DESCRIPTION OF SYMBOLS 1 Fixing belt 2 Base layer 3 Metal plating layer 31 1st plating layer 311 Surface uneven | corrugated | grooved part 311a Concave part 311b Convex part 4 Polymer layer 41 Primer layer

Claims (7)

A fixing belt used in an electrophotographic image forming apparatus,
A resin-made base layer formed in a cylindrical shape, a metal plating layer laminated on the outer periphery of the base layer, and a polymer polymer laminated on the outer periphery of the metal plating layer with or without a primer layer And has a layer,
The metal plating layer is disposed on the most polymer layer side, and includes a first plating layer having a surface concavo-convex portion including a large number of concave portions and convex portions on the surface of the polymer layer side, and the base layer. A second plating layer in contact with
The first plating layer is formed of one selected from the group consisting of Cu plating and Cu alloy plating,
The second plating layer is formed of one selected from the group consisting of Ni plating and Ni alloy plating,
The ten-point average roughness Rz of the surface irregularity surface is in the range of 1 to 10 μm,
A fixing belt, wherein a part of a layer above the first plating layer is inserted into the recess.   The fixing belt according to claim 1, wherein the uneven surface portion has an oxide film on a surface thereof. The polymer layer is a silicone rubber, fluorine rubber, and the fixing belt according to claim 1 or 2, characterized in that it comprises one polymer selected from the group consisting of fluorine resin. The thickness of the first plating layer, the fixing belt according to any one of claims 1 to 3, characterized in that in the range of 10 to 50 [mu] m. A method for manufacturing a fixing belt according to any one of claims 1 to 4 ,
Forming a plating layer made of the same plating material as the first plating layer, and applying a surface treatment to the surface of the plating layer, thereby forming a first plating layer having the surface irregularities;
And a second step of forming the polymer layer on or without the primer layer on the surface of the first plating layer on which the surface irregularities are to be formed. 6. The fixing belt manufacturing method according to claim 5 , wherein the surface treatment is an etching treatment or a wet blast treatment. 6. The fixing belt manufacturing method according to claim 5 , wherein the surface treatment is an etching treatment in which the surface of the plating layer is oxidized simultaneously with etching.