JP6416526B2 - Flame detector - Google Patents

Flame detector Download PDF

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JP6416526B2
JP6416526B2 JP2014145444A JP2014145444A JP6416526B2 JP 6416526 B2 JP6416526 B2 JP 6416526B2 JP 2014145444 A JP2014145444 A JP 2014145444A JP 2014145444 A JP2014145444 A JP 2014145444A JP 6416526 B2 JP6416526 B2 JP 6416526B2
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lamp
light receiving
contamination
light
light emitting
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JP2016021199A (en
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加藤 健一
健一 加藤
孝治 遠藤
孝治 遠藤
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Nohmi Bosai Ltd
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Description

本発明は、火災の検出を行う炎感知器に関するものであり、更に述べると、受光窓の
汚損度測定試験機能を有する炎感知器に関するものである。
The present invention relates to a flame detector for detecting a fire, and more particularly to a flame detector having a function of measuring the degree of contamination of a light receiving window.

炎感知器には、受光窓が設けられており、炎から放射される赤外線は、この受光窓を透過した後に受光素子で受光される。そのため、前記受光窓が粉塵等によって汚れていると、前記赤外線が透過しにくくなるので、精度の高い炎検出を行うことが困難となる。   The flame detector is provided with a light receiving window, and infrared rays emitted from the flame are received by the light receiving element after passing through the light receiving window. For this reason, if the light receiving window is contaminated with dust or the like, the infrared rays are hardly transmitted, and it is difficult to perform highly accurate flame detection.

そこで、上記問題に対して、本体カバーの略中央に設けられた受光窓の汚損度を測定するために、本体カバー内部に設けられた試験光を照射する試験光源と、受光窓の裏面近傍に設けられ、試験光源から光を受光する受光素子とを備えた汚損度測定試験機能付き火災検知器が開発されている(例えば、特許文献1参照)。   Therefore, in order to measure the degree of contamination of the light receiving window provided in the approximate center of the main body cover, the test light source for irradiating the test light provided in the main body cover and the back surface of the light receiving window are disposed in the vicinity of the above problem. There has been developed a fire detector with a contamination degree measurement test function that includes a light receiving element that receives light from a test light source (see, for example, Patent Document 1).

特開2005−122437号公報JP 2005-122437 A

図7は特許文献1に記載された従来の炎感知器である。実施例1の炎感知器と同じ構成については、一部について符号を省略している。図2は炎感知器を天井設置時に下方から見た図であり、図7はそのI−I線概略縦断面図である。1000は炎感知器、7は受光窓、8は受光素子、3は本体カバー、22は汚損度測定用受光素子、100は汚損度測定用発光素子を示す。
汚損度測定用発光素子100は、近赤外線波長帯域の試験光を発光する発光ダイオードであり、そのリード線部100bはソケット100cを介して回路基板5に取り付けられている。この汚損度測定用発光素子100の灯部100aは第2の収容室21内において本体カバー3の最下面裏側に近接して位置しており、そのリード線部100bが折り曲げられることで、その灯部100aが、所定の曲げ角度、例えば18度で曲げられて受光窓7に向けられるともに、後述する汚損度測定用受光素子22と互いの光軸が対向する向きに向けられている。
FIG. 7 shows a conventional flame detector described in Patent Document 1. About the same structure as the flame detector of Example 1, the code | symbol is abbreviate | omitted about one part. FIG. 2 is a view of the flame detector as viewed from below when the ceiling is installed, and FIG. 7 is a schematic vertical sectional view taken along the line I-I. 1000 is a flame detector, 7 is a light receiving window, 8 is a light receiving element, 3 is a body cover, 22 is a light receiving element for measuring the degree of contamination, and 100 is a light emitting element for measuring the degree of contamination.
The contamination degree measuring light emitting element 100 is a light emitting diode that emits test light in the near-infrared wavelength band, and its lead wire portion 100b is attached to the circuit board 5 via a socket 100c. The lamp portion 100a of the contamination degree measuring light emitting element 100 is located in the second storage chamber 21 in the vicinity of the bottom side of the lowermost surface of the main body cover 3, and the lead wire portion 100b is bent, so that the lamp The portion 100a is bent at a predetermined bending angle, for example, 18 degrees and directed toward the light receiving window 7, and is directed in a direction in which the optical axis of the contamination degree measuring light receiving element 22 described later faces each other.

汚損度測定用発光素子100からの試験光を受光する汚損度測定用受光素子22は、開口部6の開口内を避けた位置で、回路基板5に直付けされて搭載されている。
ここで、前記開口を避けた位置とは、該開口と相対位置でない位置であり、前記開口から外光が入り込みにくい領域をいい、例えば、受光素子収容部13の外側である。汚損度測定用受光素子22は、可視光から近赤外線までの波長帯域に感度を有するSiフォトダイオードであり、その受光面は可視光カット部材により構成されている。汚損度測定用受光素子22は、回路基板5において受光素子収容部13を介して汚損度測定用発光素子100の反対側に位置し、更にそのリード線部22bが折り曲げられて、その受光部22aは、汚損度測定用発光素子100と互いの光軸が対向する向きに向けられている。
そして、試験光は受光窓7の汚損度により減衰するため、汚損度測定用受光素子22の出力から、その汚損度を測定することができる。
The contamination degree measuring light receiving element 22 for receiving the test light from the contamination degree measuring light emitting element 100 is mounted directly attached to the circuit board 5 at a position avoiding the inside of the opening 6.
Here, the position avoiding the opening refers to a position that is not relative to the opening and refers to a region in which external light is difficult to enter from the opening, for example, outside the light receiving element housing portion 13. The contamination degree measuring light receiving element 22 is a Si photodiode having sensitivity in a wavelength band from visible light to near infrared light, and its light receiving surface is formed of a visible light cut member. The contamination degree measuring light receiving element 22 is located on the opposite side of the contamination degree measuring light emitting element 100 via the light receiving element accommodating portion 13 in the circuit board 5, and the lead wire portion 22b is further bent, and the light receiving portion 22a. Is directed to the direction in which the optical axis of the contamination degree measuring light emitting element 100 and the mutual optical axis face each other.
Since the test light is attenuated by the degree of contamination of the light receiving window 7, the degree of contamination can be measured from the output of the contamination degree measuring light receiving element 22.

しかしながら、上記した従来の炎感知器1000では、汚損度測定用発光素子100における灯部100aの位置が回路基板5から遠い位置にあるために、製造時に発光方向を調整する必要があった。更に、調整を行っても発光方向が安定せず、汚損度測定用受光素子22の受光量にばらつきが生じるおそれがあった。
本発明は、上記事情に鑑み、炎感知器において汚損度測定用発光素子の発光方向及び汚損度測定用受光素子の受光量にばらつきがないようにすることを目的とする。
However, in the conventional flame detector 1000 described above, since the position of the lamp portion 100a in the contamination degree measuring light emitting element 100 is far from the circuit board 5, it is necessary to adjust the light emitting direction during manufacturing. Further, even if the adjustment is made, the light emission direction is not stable, and there is a possibility that the amount of light received by the contamination measuring light-receiving element 22 varies.
SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to prevent variations in the light emission direction of a contamination degree measuring light emitting element and the amount of light received by the contamination degree measuring light receiving element in a flame detector.

本発明は前記課題を解決するものであり、次のとおりのものである。
本体と、前記本体に連結され開口部を有する本体カバーとからなるケースと、前記ケース内に収容される回路基板と、赤外線を透過させる素材からなる受光窓を介して、前記開口部から入射される炎から放射された赤外線を受光する受光素子と、前記受光窓の汚損度測定試験を行うための試験光を発光する汚損度測定用発光素子と、前記受光窓を介して前記試験光を受光する汚損度測定用受光素子と、を備えてなる炎感知器であって、前記汚損度測定用発光素子を前記回路基板に取り付けるための固定スペーサを設け、前記固定スペーサに前記汚損度測定用発光素子の灯部を位置決め固定することで、前記汚損度測定用発光素子の発光方向が所定の方向に固定されることを特徴とする炎感知器。
The present invention solves the above problems and is as follows.
A case made of a main body and a main body cover connected to the main body and having an opening, a circuit board housed in the case, and a light receiving window made of a material that transmits infrared rays, is incident from the opening. A light receiving element that receives infrared rays emitted from a flame, a light emitting element for measuring the degree of contamination for emitting a test light for performing a degree of contamination measurement test of the light receiving window, and the test light received through the light receiving window. A flame detector comprising: a light receiving element for measuring the degree of contamination, wherein a fixing spacer for attaching the light emitting element for measuring the degree of contamination to the circuit board is provided, and the light emission for measuring the degree of contamination is provided on the fixed spacer. A flame detector characterized in that the light emitting direction of the pollution degree measuring light emitting element is fixed in a predetermined direction by positioning and fixing the lamp portion of the element.

本願の発明は、次の効果を奏する。
(1)製造時に汚損度測定用発光素子の発光方向を調整する必要がなく、製造工程数が低減されて生産性が向上する。
(2)汚損度測定用発光素子の発光方向が安定するため、歩留まりを高めることができる。
(3)発光素子を生産時に正確な位置に固定することができ、また、現場での振動等による外的要因を受けにくくなることから、現場での異常誤作動を低減することができる。
The invention of the present application has the following effects.
(1) It is not necessary to adjust the light emission direction of the light emitting element for measuring the degree of contamination at the time of production, and the number of production steps is reduced and productivity is improved.
(2) Since the light emitting direction of the pollution degree measuring light emitting element is stabilized, the yield can be increased.
(3) The light emitting element can be fixed at an accurate position during production, and is less susceptible to external factors such as vibration at the site, so that abnormal malfunctions at the site can be reduced.

実施例1における炎感知器。図2のI−I線概略縦断面図である。The flame detector in Example 1. FIG. 3 is a schematic longitudinal sectional view taken along line II in FIG. 2. 従来および実施例1の炎感知器を天井設置時に下方から見た図。The figure which looked at the flame detector of the prior art and Example 1 from the bottom at the time of ceiling installation. 実施例1における汚損度測定用発光素子10の斜視図。1 is a perspective view of a pollution degree measuring light-emitting element 10 in Example 1. FIG. 実施例1における固定スペーサ50。The fixed spacer 50 in Example 1. FIG. 実施例1において、回路基板5に固定スペーサ50等を取り付けた状態を示す図。In Example 1, the figure which shows the state which attached the fixed spacer 50 grade | etc., To the circuit board 5. FIG. 汚損度測定用発光素子10の発光特性。The light emission characteristic of the light emitting element 10 for measuring the contamination degree 従来の炎感知器。図2のI−I線概略縦断面図である。Conventional flame detector. FIG. 3 is a schematic longitudinal sectional view taken along line II in FIG. 2.

以下、この発明の実施形態について説明する。従来例の図7と同じ部分には共通の符号を付す。   Embodiments of the present invention will be described below. The same parts as those of the conventional example shown in FIG.

図1は、本発明の実施例1を示す炎感知器1の図で、図2のI−I線概略縦断面図である。
炎感知器1は、本体2と、本体2に連結される本体カバー3とからなるケース4を備えており、図示しない刃金具により取り付けベースに結合されて天井面等に取り付けられるものである。図2は、炎感知器1を天井に取り付けた状態で、下方から見た図である
FIG. 1 is a diagram of a flame detector 1 showing Embodiment 1 of the present invention, and is a schematic longitudinal sectional view taken along line II of FIG.
The flame detector 1 includes a case 4 including a main body 2 and a main body cover 3 connected to the main body 2, and is attached to a ceiling surface or the like by being connected to an attachment base by a blade fitting (not shown). FIG. 2 is a view as seen from below with the flame detector 1 attached to the ceiling.

本体カバー3は、截頭円錐状に形成されるとともに、底面中央の凹状部には、開口を有する底壁6bと側壁6aとから形成される開口部6が形成されている。更に、本体カバー3には、キャップ嵌合部11が形成されており、このキャップ嵌合部11に嵌合されて、動作確認灯9と汚損度測定用発光素子10を収容するメタクリル樹脂材質からなる透明な透光キャップ11aが設けられている。   The body cover 3 is formed in a frustoconical shape, and an opening 6 formed by a bottom wall 6b having an opening and a side wall 6a is formed in a concave portion at the center of the bottom surface. Further, the body cover 3 is formed with a cap fitting portion 11, which is fitted with the cap fitting portion 11 and made of a methacrylic resin material that accommodates the operation check lamp 9 and the lightness measuring element 10 for measuring the degree of contamination. A transparent translucent cap 11a is provided.

受光素子8は、受光素子収容部13に収容され、その受光部8aが本体カバー3の開口部6との相対位置に位置する如く回路基板5に搭載されている。受光素子収容部13は、受光素子8の周囲を囲み、かつ、受光素子8の受光部8aとの相対位置にバンドパスフィルタ14を固定する円筒状の受光素子ホルダ15と、この受光素子ホルダ15の前面に配置された受光窓7と、受光素子ホルダ15が収容され、受光素子8の受光部8aとの相対位置に受光窓7を固定する、メタクリル樹脂材質からなる透明な円筒状の受光素子カバー16とからなる。受光素子カバー16は、汚損度測定用発光素子10が発する試験光を後述する汚損度測定用受光素子22に向けて透過する第3の透光窓16aを備えている。   The light receiving element 8 is housed in the light receiving element housing portion 13, and is mounted on the circuit board 5 so that the light receiving portion 8 a is positioned relative to the opening 6 of the main body cover 3. The light receiving element accommodating portion 13 surrounds the light receiving element 8 and has a cylindrical light receiving element holder 15 that fixes the band pass filter 14 at a relative position with respect to the light receiving portion 8a of the light receiving element 8, and the light receiving element holder 15 A transparent cylindrical light receiving element made of a methacrylic resin material, in which a light receiving window 7 disposed in front of the light receiving element 7 and a light receiving element holder 15 are housed and which fixes the light receiving window 7 at a relative position with respect to the light receiving portion 8a of the light receiving element 8. And a cover 16. The light receiving element cover 16 includes a third light transmission window 16a that transmits the test light emitted from the contamination degree measuring light emitting element 10 toward the contamination degree measuring light receiving element 22 described later.

この受光素子カバー16は、凹状部の開口部6の底壁6b内面に当接しているので、前記開口部6の開口は、前記受光素子収容部13につながっているような状態となっている。この受光素子収容部13では、受光素子カバー16と受光素子ホルダ15とが対応する複数個の係止孔16bと突起15c(図1において1組のみ示す)により係合17が形成され、受光素子ホルダ15が回路基板5に係合(図示省略)されることで、回路基板5に取り付けられている。なお、バンドパスフィルタ14は、特定の波長帯の範囲内にある光線のみを透過させる性質を有するもので、本実施の形態においては、炎から放射されるCO共鳴放射の波長帯域の赤外線のみを透過させるために用いられている。又、受光窓7は、赤外線を透過させる素材、例えば、サファイアガラスからなる。 Since the light receiving element cover 16 is in contact with the inner surface of the bottom wall 6b of the concave opening 6, the opening of the opening 6 is connected to the light receiving element housing 13. . In the light receiving element accommodating portion 13, an engagement 17 is formed by a plurality of locking holes 16b and protrusions 15c (only one set shown in FIG. 1) corresponding to the light receiving element cover 16 and the light receiving element holder 15. The holder 15 is attached to the circuit board 5 by being engaged with the circuit board 5 (not shown). The band-pass filter 14 has a property of transmitting only light rays within a specific wavelength band, and in the present embodiment, only infrared rays in the wavelength band of CO 2 resonance radiation emitted from the flame are used. It is used to transmit. The light receiving window 7 is made of a material that transmits infrared rays, for example, sapphire glass.

これにより、炎感知器1において、炎から放射された赤外線は、本体カバー3の開口部6から入射されて受光窓7及びバンドパスフィルタ14を透過し、受光素子8の受光部8aに受光されることとなり、受光素子8がその赤外線を検出して炎の発生を感知することができるようになっている。   Thereby, in the flame detector 1, infrared rays emitted from the flame are incident from the opening 6 of the main body cover 3, pass through the light receiving window 7 and the band pass filter 14, and are received by the light receiving portion 8 a of the light receiving element 8. Accordingly, the light receiving element 8 can detect the occurrence of the flame by detecting the infrared ray.

透光キャップ11aは、動作確認灯9を収容し、動作確認灯9用の第1の透光窓18を有する第1の収容室19と、汚損度測定用発光素子10を収容し、汚損度測定用発光素子10用の第2の透光窓20を有する第2の収容室21とを備えている。なお、第1の収容室19は、回路基板5側の面を有しない略箱状であり、第2の収容室21は、回路基板5側及び本体カバー3表面側の面を有しない略箱状である。第2の収容室21の本体カバー3表面側の面は、本体カバー3で塞がれている。   The translucent cap 11 a accommodates the operation check lamp 9, the first storage chamber 19 having the first light transmission window 18 for the operation check lamp 9, and the pollution measuring light emitting element 10. And a second storage chamber 21 having a second light transmission window 20 for the measurement light emitting element 10. The first storage chamber 19 has a substantially box shape having no surface on the circuit board 5 side, and the second storage chamber 21 has a substantially box shape having no surface on the circuit board 5 side and the surface side of the main body cover 3. Is. A surface of the second housing chamber 21 on the surface side of the main body cover 3 is closed by the main body cover 3.

透光キャップ11aにおいて、第1の透光窓18は、四角錘状に形成されるとともに表面が梨地状に形成され、本体カバー3の表面より外方に突出して設けられており、第2の透光窓20は、第2の収容室21の側壁21aに形成され、本体カバー3の開口部6に臨んで設けられている。   In the translucent cap 11a, the first translucent window 18 is formed in a quadrangular pyramid shape and the surface is formed in a satin shape, and is provided to project outward from the surface of the main body cover 3. The translucent window 20 is formed on the side wall 21 a of the second storage chamber 21 and is provided facing the opening 6 of the main body cover 3.

ケース4内に収容される回路基板5には、炎を感知する受光素子8と共に動作確認灯9、汚損度測定用発光素子10と汚損度測定用受光素子22が接続される。本発明の実施例1では、動作確認灯9と汚損度測定用発光素子10は固定スペーサ50に搭載された状態で回路基板5に固定されている。固定スペーサ50は回路基板5から下方に延びて汚損度測定用発光素子10の灯部10aを位置決め固定することで、灯部10aの発光方向が所定の方向に固定される。   The circuit board 5 accommodated in the case 4 is connected with an operation check lamp 9, a contamination degree measuring light emitting element 10, and a contamination degree measuring light receiving element 22 together with a light receiving element 8 for detecting flame. In the first embodiment of the present invention, the operation check lamp 9 and the pollution degree measuring light emitting element 10 are fixed to the circuit board 5 while being mounted on the fixed spacer 50. The fixing spacer 50 extends downward from the circuit board 5 and positions and fixes the lamp portion 10a of the pollution degree measuring light emitting element 10, whereby the light emitting direction of the lamp portion 10a is fixed in a predetermined direction.

図3は、汚損度測定用発光素子10の斜視図であり、灯部10aとリード線部10bを有する。   FIG. 3 is a perspective view of the contamination degree measuring light emitting element 10, which includes a lamp portion 10 a and a lead wire portion 10 b.

図4は、固定スペーサ50である。炎感知器1を天井に設置した際には上下が逆になる。図4(a)は側面図、図4(b)は斜め上方(天井設置状態では斜め下方)から見た図である。図4については炎感知器1の天井設置状態ではなく図4の上下関係で説明する。固定スペーサ50は側面から見て、図4(a)に示したように高台部50aと低台部50bが接続された構造となっており、下部には3つの固定脚50cがある。固定スペーサ50はこの固定脚50cにより回路基板5に固定される。   FIG. 4 shows the fixed spacer 50. When the flame detector 1 is installed on the ceiling, it is upside down. 4 (a) is a side view, and FIG. 4 (b) is a view seen obliquely from above (or obliquely below in the ceiling installation state). 4 will be described based on the vertical relationship of FIG. 4, not the ceiling installation state of the flame detector 1. As shown in FIG. 4A, the fixed spacer 50 has a structure in which a high platform portion 50a and a low platform portion 50b are connected, and has three fixed legs 50c in the lower portion. The fixed spacer 50 is fixed to the circuit board 5 by the fixed legs 50c.

高台部50aにはその上部に灯部搭載部50dがあり、その低台部50b側に灯背固定部50eが、逆側の両側に灯前側固定部50fがある。図4(b)に示したように、灯前側固定部50fは二つに分かれており、その間に灯前溝50gがある。これらの構造により汚損度測定用発光素子10の灯部10aを固定する。
また、高台部50aにはリード線収納溝50hがその両側面に設けられ、下部にはリード線挿入孔50iが設けられている。これらを介して汚損度測定用発光素子10のリード線部10bが回路基板5に直付けされる。
低台部50bの上部には確認灯搭載部50jがあり、その面から下部に向けて確認灯リード線挿入部50kが設けられている。そして、動作確認灯9が搭載され、リード線部9bが確認灯リード線挿入部50kを介して回路基板5に直付けされる。
The hill part 50a has a lamp part mounting part 50d at the upper part thereof, a lamp back fixing part 50e on the lower part part 50b side, and a lamp front side fixing part 50f on opposite sides. As shown in FIG. 4 (b), the front lamp side fixing portion 50f is divided into two, and there is a front lamp groove 50g therebetween. With these structures, the lamp portion 10a of the pollution degree measuring light emitting element 10 is fixed.
The hill portion 50a is provided with lead wire receiving grooves 50h on both side surfaces thereof, and a lead wire insertion hole 50i is provided at the lower portion. Through these, the lead wire portion 10b of the pollution degree measuring light emitting element 10 is directly attached to the circuit board 5.
There is a confirmation lamp mounting part 50j on the upper part of the low platform part 50b, and a confirmation lamp lead wire insertion part 50k is provided from the surface to the lower part. Then, the operation check lamp 9 is mounted, and the lead wire portion 9b is directly attached to the circuit board 5 via the check lamp lead wire insertion portion 50k.

図5は、汚損度測定用発光素子10等を回路基板5に取り付けた状態を表す図である。汚損度測定用発光素子10は、動作確認灯9と共に固定スペーサ50に取り付けたうえで、回路基板5に取り付けられている。汚損度測定用発光素子10は固定スペーサ50の灯部搭載部50dに跨るようにして設置され、その灯部10aは灯背固定部50eと灯前側固定部50fにより固定され、そのリード線部10bはリード線収納溝50hに収納されてリード線挿入孔50iを通り回路基板5に接続されている。また、動作確認灯9は確認灯搭載部50jに搭載され、確認灯リード線挿入部50kを通り回路基板5に接続されている。さらに汚損度測定用受光素子22も回路基板5に取り付けられている。灯部10aは回路基板5から離れた位置にあり、回路基板5近傍に取り付けた汚損度測定用受光素子22に向かって近赤外線の試験光を発光する。図5の矢印で示したように、近赤外線は受光窓7から入り、第3の透光窓16aを透過して汚損度測定用受光素子22で受光される。灯部10aは固定スペーサ50の先端に固定されているので位置や方向がずれることはない。   FIG. 5 is a diagram illustrating a state in which the contamination degree measuring light emitting element 10 and the like are attached to the circuit board 5. The light-emitting element 10 for measuring the degree of contamination is attached to the circuit board 5 after being attached to the fixed spacer 50 together with the operation check lamp 9. The contamination measuring light emitting element 10 is installed so as to straddle the lamp mounting part 50d of the fixed spacer 50. The lamp part 10a is fixed by the lamp back fixing part 50e and the lamp front side fixing part 50f, and the lead wire part 10b. Is housed in the lead wire housing groove 50h and connected to the circuit board 5 through the lead wire insertion hole 50i. The operation check lamp 9 is mounted on the check lamp mounting portion 50j, and is connected to the circuit board 5 through the check lamp lead wire insertion portion 50k. Further, the light receiving element 22 for measuring the degree of contamination is also attached to the circuit board 5. The lamp unit 10 a is located away from the circuit board 5 and emits near-infrared test light toward the contamination measuring light-receiving element 22 attached in the vicinity of the circuit board 5. As indicated by the arrows in FIG. 5, near-infrared light enters from the light receiving window 7, passes through the third light transmitting window 16 a, and is received by the contamination degree measuring light receiving element 22. Since the lamp portion 10a is fixed to the tip of the fixed spacer 50, the position and direction do not shift.

汚損度測定用発光素子10と動作確認灯9は固定スペーサ50に搭載された状態で透光キャップ11aに挿入される。汚損度測定用発光素子10は第2の収容室21内に位置し、灯部10aからの光は第2の透光窓20を介して汚損度測定用受光素子22へ向けて放出される。また、動作確認灯9は、その発光部9aが透光キャップ11aの第1の収容室19内に位置する。   The pollution degree measuring light emitting element 10 and the operation check lamp 9 are inserted into the translucent cap 11 a while being mounted on the fixed spacer 50. The contamination degree measuring light emitting element 10 is located in the second storage chamber 21, and light from the lamp portion 10 a is emitted toward the contamination degree measuring light receiving element 22 through the second light transmission window 20. Further, the light emitting portion 9a of the operation check lamp 9 is located in the first storage chamber 19 of the translucent cap 11a.

図6は、実施例1における汚損度測定用発光素子10の発光特性である。この素子では、10度近傍の発光量が最も高いが、本実施例では−20〜−30度の方向の発光を用いる。すなわち、汚損度測定用受光素子22の方向が−20〜−30度になるように設置される。この方向では灯部10aの方向を変える必要がないだけでなく、角度が少し変わったとしても発光量はほとんど変わらないので、発光強度に角度安定性がある。この点でも汚損度測定用受光素子22のばらつきは生じにくい。   FIG. 6 shows the light emission characteristics of the contamination degree measuring light emitting device 10 in Example 1. In this element, the amount of light emitted in the vicinity of 10 degrees is the highest, but in this embodiment, light emitted in the direction of -20 to -30 degrees is used. That is, it is installed so that the direction of the contamination degree measuring light receiving element 22 is -20 to -30 degrees. In this direction, it is not only necessary to change the direction of the lamp unit 10a, but even if the angle is changed a little, the amount of emitted light is hardly changed, so that the emitted light intensity has angular stability. In this respect as well, variations in the contamination degree measuring light receiving element 22 hardly occur.

汚損度測定用発光素子10からの光を受光する汚損度測定用受光素子22は、開口部6の開口内を避けた位置で、回路基板5に直付けされて搭載されている。
ここで、前記開口を避けた位置とは、該開口と相対位置でない位置であり、前記開口から外光が入り込みにくい領域をいい、例えば、受光素子収容部13の外側である。汚損度測定用受光素子22は、可視光から近赤外線までの波長帯域に感度を有するSiフォトダイオードであり、その受光面は可視光カット部材により構成されている。汚損度測定用受光素子22は、回路基板5において受光素子収容部13を介して汚損度測定用発光素子10の反対側に位置し、更にそのリード線部22bが折り曲げられて、その受光部22aが、所定の曲げ角度で曲げられて、汚損度測定用発光素子10と互いの光軸が対向する向きに向けられている。
The contamination degree measuring light receiving element 22 that receives light from the contamination degree measuring light emitting element 10 is mounted directly attached to the circuit board 5 at a position avoiding the inside of the opening 6.
Here, the position avoiding the opening refers to a position that is not relative to the opening and refers to a region in which external light is difficult to enter from the opening, for example, outside the light receiving element housing portion 13. The contamination degree measuring light receiving element 22 is a Si photodiode having sensitivity in a wavelength band from visible light to near infrared light, and its light receiving surface is formed of a visible light cut member. The contamination degree measuring light receiving element 22 is located on the opposite side of the contamination degree measuring light emitting element 10 through the light receiving element accommodating portion 13 in the circuit board 5, and the lead wire portion 22b is further bent, and the light receiving portion 22a. However, it is bent at a predetermined bending angle so that the pollution degree measuring light emitting element 10 and the optical axis of each other face each other.

次に、実施例1の炎感知器における動作について説明する。
火災監視時:
図1において、受光素子8は、受光窓7を介して炎を監視している。火災が発生すると、火災により発生した赤外線は、開口部6の開口、受光窓7及びバンドパスフィルタ14を透過して受光素子8に受光されるので、火災が検出できる。
Next, the operation of the flame detector according to the first embodiment will be described.
During fire monitoring:
In FIG. 1, the light receiving element 8 monitors the flame through the light receiving window 7. When a fire occurs, the infrared rays generated by the fire pass through the opening 6, the light receiving window 7, and the band pass filter 14 and are received by the light receiving element 8, so that the fire can be detected.

受光窓の汚損度測定試験時:
汚損度測定用発光素子10に給電すると近赤外線の試験光が発生する。そして、灯部10aは固定スペーサ50によって位置固定されており、その試験光は図1,5に示すように、透光キャップ11aの第2の透光窓20、受光窓7、受光素子ホルダ15の切欠部15a、受光素子カバー16の第3の透光窓16a、を透過して汚損度測定用受光素子22に正確に受光される。
試験光は受光窓7の汚損度により減衰するため、汚損度測定用受光素子22の出力から、その汚損度を測定する。
測定した汚損度により受光素子8から得られる信号の補正や、炎感知器1の異常報知が行われる。
During a light-receiving window contamination degree measurement test:
When power is supplied to the light emitting element 10 for measuring the degree of contamination, near-infrared test light is generated. The lamp portion 10a is fixed in position by a fixing spacer 50, and the test light is, as shown in FIGS. 1 and 5, the second light transmitting window 20, the light receiving window 7, and the light receiving element holder 15 of the light transmitting cap 11a. Are transmitted through the notch 15a and the third light transmission window 16a of the light receiving element cover 16 and are accurately received by the contamination measuring light receiving element 22.
Since the test light is attenuated by the degree of contamination of the light receiving window 7, the degree of contamination is measured from the output of the contamination degree measuring light receiving element 22.
Correction of the signal obtained from the light receiving element 8 and abnormality notification of the flame detector 1 are performed based on the measured degree of contamination.

なお、受光素子収容部13は、防風機能をもち、受光素子8が外気の影響を受けることを防止することができる。   The light receiving element accommodating portion 13 has a windproof function and can prevent the light receiving element 8 from being influenced by outside air.

この発明の他の複数の実施例を、実施例1との相違点を示して説明する。
(1)汚損度測定用発光素子10と汚損度測定用受光素子22の位置を逆にして、汚損度測定用受光素子22を固定スペーサ50に搭載する。これにより受光方向が固定されるので受光感度が安定する。また、汚損度測定用発光素子10と汚損度測定用受光素子22との両方を固定部品等により固定するようにしてもよい。
A plurality of other embodiments of the present invention will be described by showing differences from the first embodiment.
(1) The contamination measuring light-receiving element 22 is mounted on the fixed spacer 50 with the positions of the contamination measuring light-emitting element 10 and the contamination measuring light-receiving element 22 reversed. As a result, the light receiving direction is fixed, so that the light receiving sensitivity is stabilized. Further, both the contamination degree measuring light emitting element 10 and the contamination degree measuring light receiving element 22 may be fixed by fixing parts or the like.

(2)固定スペーサ50を回路基板5から斜め方向に傾いて突出した形状とする。そうすると、実施例1のように汚損度測定用発光素子10の斜め方向の発光を用いなくても、固定スペーサ50の傾きを変えれば任意の方向の発光を用いることができ、発光特性が異なる種々の発光素子を用いることができる。また、当該方向が汚損度測定用受光素子22に向くように、固定スペーサ50は灯部10aが当接する灯部搭載部50dの近傍のみ傾けても良く、汚損度測定用発光素子10のリード線部10bを通過させるための固定スペーサ50の灯部搭載部50d、リード線収納溝50h、リード線挿入孔50i等に任意の角度を設けてもよい。これらの場合には、第2の収容室21が固定スペーサ50等を収容できる形状と大きさになるように透光キャップ11a等を設計する。 (2) The fixed spacer 50 has a shape protruding from the circuit board 5 in an oblique direction. Then, even if it does not use the light emission in the oblique direction of the light emitting element 10 for contamination degree measurement as in the first embodiment, light emission in an arbitrary direction can be used if the inclination of the fixed spacer 50 is changed, and various light emission characteristics are different. The light emitting element can be used. Further, the fixed spacer 50 may be inclined only in the vicinity of the lamp portion mounting portion 50d with which the lamp portion 10a abuts so that the direction is directed to the contamination degree measuring light receiving element 22, and the lead wire of the contamination degree measuring light emitting element 10 An arbitrary angle may be provided in the lamp mounting portion 50d of the fixed spacer 50 for passing the portion 10b, the lead wire receiving groove 50h, the lead wire insertion hole 50i, and the like. In these cases, the translucent cap 11a and the like are designed so that the second accommodation chamber 21 has a shape and size that can accommodate the fixed spacer 50 and the like.

(3)実施例1では、固定スペーサ50は回路基板5に固定されて灯部10aの方向を規定するが、本体カバー3に固定してもよい。この場合には、汚損度測定用発光素子10等を搭載した固定スペーサ50を本体カバー3に固定した後で、はんだ付けやコネクタによってリード線部10b等を回路基板5に接続する。
また、図6における−20〜−30度の方向の角度安定性を有した発光特性のみを利用して、灯部10aを固定スペーサ50に固定せずに、従来のように設置しても良い。
(3) In the first embodiment, the fixing spacer 50 is fixed to the circuit board 5 and defines the direction of the lamp unit 10 a, but may be fixed to the main body cover 3. In this case, after fixing the fixing spacer 50 mounting the light emitting element 10 for measuring the degree of contamination to the main body cover 3, the lead wire portion 10b and the like are connected to the circuit board 5 by soldering or a connector.
In addition, the lamp unit 10a may be installed in the conventional manner without being fixed to the fixed spacer 50 by using only the light emission characteristic having the angle stability in the direction of -20 to -30 degrees in FIG. .

1 炎感知器、2 本体、3 本体カバー、4 ケース、5 回路基板、6 開口部、7 受光窓、8 受光素子、9 動作確認灯、10 汚損度測定用発光素子、10a 灯部、10b リード線部、11 キャップ嵌合部、11a 透光キャップ、13 受光素子収容部、14 バンドパスフィルタ、15 受光素子ホルダ、16 受光素子カバー、16a 第3の透光窓、18 第1の透光窓、19 第1の収容室、20 第2の透光窓、21 第2の収容室、21a 側壁、22 汚損度測定用受光素子、50 固定スペーサ、50a 高台部、50b 低台部、50c 固定脚、50d 灯部搭載部、50e 灯背固定部、50f 灯前側固定部、50g 灯前溝、50h リード線収納溝、50i リード線挿入孔、50j 確認灯搭載部、50k 確認灯リード線挿入部、100 汚損度測定用発光素子、100a 灯部、100b リード線部、100c スペーサ、1000 炎感知器 DESCRIPTION OF SYMBOLS 1 Flame detector, 2 main body, 3 main body cover, 4 case, 5 circuit board, 6 opening part, 7 light receiving window, 8 light receiving element, 9 operation check lamp, 10 light emitting element for contamination degree measurement, 10a light part, 10b lead Line part, 11 Cap fitting part, 11a Light transmission cap, 13 Light receiving element accommodating part, 14 Band pass filter, 15 Light receiving element holder, 16 Light receiving element cover, 16a 3rd light transmission window, 18 1st light transmission window , 19 1st accommodating chamber, 20 2nd light transmission window, 21 2nd accommodating chamber, 21a side wall, 22 Light receiving element for contamination degree measurement, 50 fixed spacer, 50a high base part, 50b low base part, 50c fixed leg 50d Lamp part mounting part, 50e Lamp back fixing part, 50f Lamp front side fixing part, 50g Lamp front groove, 50h Lead wire storage groove, 50i Lead wire insertion hole, 50j Confirmation lamp mounting part, 50k confirmation Lead wire insertion section, 100 defacement degree-measuring light-emitting devices, 100a lamp unit, 100b lead portion 100c spacer 1000 flame detector

Claims (2)

本体と、前記本体に連結され、開口部を有する本体カバーとからなるケースと、
前記ケース内に収容される回路基板と、
赤外線を透過させる素材からなる受光窓を介して、前記開口部から入射される炎から放射された赤外線を受光する受光素子と、
リード線部と、前記受光窓の汚損度測定試験を行うための試験光を発光する灯部とを有した汚損度測定用発光素子と、
前記受光窓を介して前記試験光を受光する汚損度測定用受光素子と、を備えてなる炎感知器であって、
前記汚損度測定用発光素子を前記回路基板に取り付けるための固定スペーサを設け、
前記汚損度測定用発光素子が前記固定スペーサの灯部搭載部に跨るようにして前記灯部を位置決め固定することで、前記汚損度測定用発光素子の発光方向が所定の方向に固定されることを特徴とする炎感知器。
A case comprising a main body and a main body cover coupled to the main body and having an opening;
A circuit board housed in the case;
A light receiving element that receives infrared rays emitted from a flame incident from the opening through a light receiving window made of a material that transmits infrared rays;
A light emitting element for measuring the degree of contamination having a lead wire part and a lamp part for emitting test light for performing a degree of contamination measurement test of the light receiving window;
A flame detector comprising: a contamination degree measuring light receiving element that receives the test light through the light receiving window,
A fixing spacer for attaching the light emitting element for measuring the degree of contamination to the circuit board is provided,
The light emitting direction of the contamination degree measuring light emitting element is fixed in a predetermined direction by positioning and fixing the lamp portion so that the contamination degree measuring light emitting element straddles the lamp portion mounting portion of the fixed spacer. A flame detector characterized by
前記固定スペーサは高台部と低台部を有し、  The fixed spacer has a high base part and a low base part,
前記高台部は、両側部にリード線収納溝を、頂部に灯背固定部と灯前側固定部を、底部にリード線挿入孔を備え、  The hill part includes a lead wire storage groove on both sides, a lamp back fixing part and a lamp front side fixing part on the top part, and a lead wire insertion hole on the bottom part,
前記低台部は、動作確認灯が搭載される確認灯搭載部と、確認灯リード線挿入部を有し、  The low base part has a confirmation lamp mounting part on which an operation confirmation lamp is mounted, and a confirmation lamp lead wire insertion part,
前記汚損度測定用発光素子の前記リード線部は、前記リード線収納溝に収納されて前記リード線挿入孔に挿入され、  The lead wire portion of the contamination degree measuring light emitting element is housed in the lead wire housing groove and inserted into the lead wire insertion hole,
前記灯部は前記灯背固定部と灯前側固定部により固定されていることを特徴とする請求項1に記載の炎感知器。  The flame detector according to claim 1, wherein the lamp part is fixed by the lamp back fixing part and the lamp front side fixing part.
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