JP6414007B2 - LED light emitting device - Google Patents

Description

  The present invention relates to a light emitting device using an LED (Light Emitting Diode).

  In recent years, light-emitting devices using LEDs as a backlight source for illumination and liquid crystal display devices have become widespread. The LED light emitting device is highly convenient from the viewpoints of energy saving, space saving, long life, and the like. As the LED, for example, a so-called bullet-type LED in which the outer shape of a mold part in which a light emitting element is sealed is formed into a bullet-type may be used.

  The bullet-type LED is generally fixed to the mounting substrate via a lead extending from the main body (mold part). However, there is a concern that the lead may be bent by the action of an external force such as an unintended impact, and the optical axis of the LED may be displaced. It has been found that when the deviation of the optical axis of the LED occurs, the color changes or a desired luminance cannot be obtained. Therefore, Patent Document 1 discloses an example of a conventional light emitting device using a bullet-type LED proposed to solve such a problem.

  A conventional light-emitting device using a bullet-type LED described in Patent Document 1 includes an LED fixed to an LED substrate through a lead, and a regulating portion that surrounds the LED. Since the restricting portion surrounds the LED, it is possible to prevent the occurrence of deviation of the optical axis of the LED even when a strong external force is applied.

JP 2010-157444 A

  However, since the conventional LED light-emitting device described in Patent Document 1 requires a restricting portion that surrounds the LED, the number of components increases. As a result, there is a problem in that the cost of parts increases and the cost further increases as the number of assembly steps increases. Furthermore, it is not preferable from the viewpoint of reducing the resources to be used.

  Moreover, there is a possibility that dripping of the synthetic resin constituting the mold part of the bullet-type LED occurs during molding. As a result, there is a problem in that the surface close to the mounting board of the bullet-type LED is inclined, and the optical axis of the LED may be displaced.

  The present invention has been made in view of the above points, and provides an LED light-emitting device that can prevent the occurrence of deviation of the optical axis of the LED with a simple configuration in an LED light-emitting device using a bullet-type LED. The purpose is to do.

  In order to solve the above problems, the LED light-emitting device of the present invention includes an LED and a mounting substrate. In the LED, the outer shape of the mold part in which the light emitting element is encapsulated is formed into a bullet shape, and includes a lead protruding outward from the opposite side of the light emitting part of the mold part. The mounting substrate includes a through-hole having an inner diameter that substantially matches the outer diameter of the mold part of the LED, and the LED is mounted thereon. Further, in the LED light emitting device, the mold part of the LED is fitted into the through hole of the mounting substrate, the lead is bent at an angle of 90 degrees or more at a position between the base portion and the tip portion, and the tip portion is mounted on the mounting substrate. To join.

  According to the structure of this invention, since the mold part of LED fits in the through-hole of a mounting board | substrate, even when strong external force is added, the attitude | position of LED can be maintained. Therefore, it is possible to prevent the deviation of the optical axis of the LED with a simple configuration.

It is a fragmentary sectional view of the LED light-emitting device of 1st Embodiment of this invention. It is a fragmentary sectional view of the LED light-emitting device of 2nd Embodiment of this invention. It is a fragmentary sectional view of the LED light-emitting device of 3rd Embodiment of this invention. It is a fragmentary sectional view of the LED light-emitting device of 4th Embodiment of this invention. It is a fragmentary sectional view of the LED light-emitting device of 5th Embodiment of this invention. It is a fragmentary sectional view of the LED light-emitting device of 6th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the following contents.

<First Embodiment>
The structure of the LED light-emitting device according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a partial cross-sectional view of an LED light emitting device.

  The LED light emitting device 1 includes an LED 10 and a mounting substrate 20 as shown in FIG. The LED 10 is mounted on the mounting substrate 20 and fixed.

  The LED 10 includes a mold part 11 and leads 12A and 12B. The LED 10 is a so-called bullet-type LED in which the outer shape of the mold portion 11 is formed into a bullet-type. When the LED 10 is viewed from the upper side to the lower side in FIG. 1, the mold part 11 has a circular shape.

  The mold part 11 is made of, for example, a translucent epoxy resin, and a light emitting element (not shown) is enclosed therein. The light emitting part 11a irradiates light upward in FIG. 1 on the tip side (upper part in FIG. 1) of the mold part 11 having a bullet shape. That is, the axis L (optical axis) of the LED 10 is the vertical direction in FIG. 1 and extends in the normal direction of the surface 20a of the mounting substrate 20.

  The leads 12A and 12B protrude downward from the opposite side of the light emitting part 11a of the mold part 11, that is, from the outer bottom surface of the mold part 11 in FIG. One end of each of the two leads 12A and 12B is disposed inside the mold part 11, and is connected to the anode electrode and the cathode electrode of the light emitting element. The tip portion 12c which is the other end of each of the leads 12A and 12B is joined to the mounting substrate 20 via the solder 30.

  The mounting board 20 has a flat plate shape extending in the direction perpendicular to the paper surface and the horizontal direction in FIG. The mounting substrate 20 includes a through hole 21.

  The through-hole 21 penetrates between the one surface 20a and the other surface 20b of the mounting substrate 20 along the normal direction of those surfaces. The through hole 21 has an inner diameter that substantially matches the outer diameter of the mold part 11 of the LED 10, and its axis and inner peripheral surface 21 a are parallel to the normal lines of the surfaces 20 a and 20 b of the mounting substrate 20.

  Then, the mold portion 11 of the LED 10 is fitted into the through hole 21 of the mounting substrate 20. The LED 10 is inserted into the through hole 21 from the front surface 20b side of the mounting substrate 20, for example. Each of the leads 12A and 12B is bent at an angle of 90 degrees or more at a bent portion 12e which is a portion between the base portion 12d and the tip portion 12c, and the tip portion 12c side is directed outward in the radial direction of the mold portion 11. Extend. The leading end 12c of each of the leads 12A and 12B is joined to the mounting substrate 20 via the solder 30 as described above.

Second Embodiment
Next, the LED light-emitting device of 2nd Embodiment of this invention is demonstrated using FIG. FIG. 2 is a partial cross-sectional view of the LED light emitting device. Since the basic configuration of this embodiment is the same as that of the first embodiment described above, the same components as those of the first embodiment are denoted by the same reference numerals as those of the previous embodiment, and the description thereof is omitted. There is.

  In the LED light emitting device 1 of the second embodiment, the mounting substrate 20 includes a through hole 22 as shown in FIG.

  The diameter of the entire through hole 22 along the axial direction gradually increases as it goes from the light emitting portion 11a side of the LED 10 toward the leads 12A and 12B. That is, the through hole 22 has the smallest diameter on the light emitting part 11a side of the LED 10, the largest diameter on the lead 12A, 12B side, and has a tapered shape in which the inner peripheral surface 22a is inclined with respect to the axis. And LED10 fits in the through-hole 22 in the location by the side of the light emission part 11a of LED10.

<Third Embodiment>
Next, the LED light-emitting device of 3rd Embodiment of this invention is demonstrated using FIG. FIG. 3 is a partial cross-sectional view of the LED light emitting device. Since the basic configuration of this embodiment is the same as that of the first embodiment described above, the same components as those of the first embodiment are denoted by the same reference numerals as those of the previous embodiment, and the description thereof is omitted. There is.

  In the LED light-emitting device 1 of the third embodiment, the mounting substrate 20 includes a through hole 23 as shown in FIG.

  A part of the through hole 23 along the axial direction gradually increases in diameter as it goes from the light emitting portion 11a side of the LED 10 toward the leads 12A and 12B. That is, the through hole 23 has a portion in which the inner peripheral surface 23a forms a cylindrical shape parallel to the axis on the light emitting portion 11a side of the LED 10, and the inner peripheral surface 23b is inclined with respect to the axis on the leads 12A and 12B side. It has a tapered portion. And the through-hole 22 is the light emission part 11a side of LED10, Comprising: LED10 fits in the part in which the internal peripheral surface 23a comprises cylindrical shape.

<Fourth embodiment>
Next, the LED light-emitting device of 4th Embodiment of this invention is demonstrated using FIG. FIG. 4 is a partial cross-sectional view of the LED light emitting device. Since the basic configuration of this embodiment is the same as that of the first embodiment described above, the same components as those of the first embodiment are denoted by the same reference numerals as those of the previous embodiment, and the description thereof is omitted. There is.

  In the LED light-emitting device 1 of the fourth embodiment, the mounting substrate 20 includes a recess 24 as shown in FIG.

  The concave portion 24 is disposed at a joint portion of the mounting substrate 20 with the leading end portion 12c of each of the leads 12A and 12B, and is recessed from the surface 20b of the mounting substrate 20 toward the inside of the mounting substrate 20. When the LED 10 is attached to the through hole 21 of the mounting substrate 20, the leading end portion 12 c of each of the leads 12 </ b> A and 12 </ b> B bent at the bent portion 12 e is inserted into the recess 24.

  In addition, although the recessed part 24 is filled with solder and the mounting substrate 20 and the front-end | tip part 12c of each lead 12A and 12B are joined, drawing of solder is abbreviate | omitted in FIG. The same applies hereinafter.

<Fifth Embodiment>
Next, the LED light-emitting device of 5th Embodiment of this invention is demonstrated using FIG. FIG. 5 is a partial cross-sectional view of the LED light emitting device. Since the basic configuration of this embodiment is the same as that of the first embodiment described above, the same components as those of the first embodiment are denoted by the same reference numerals as those of the previous embodiment, and the description thereof is omitted. There is.

  In the LED light-emitting device 1 of the fifth embodiment, the mounting substrate 20 includes a recess 25 as shown in FIG.

  The concave portion 25 is disposed at a joint portion of the mounting substrate 20 with the tip 12c of each of the leads 12A and 12B, and is recessed from the surface 20b of the mounting substrate 20 toward the inside of the mounting substrate 20. The recess 25 includes a locking portion 25 a at an opening edge corresponding to the surface 20 b of the mounting substrate 20. The locking portion 25 a is disposed in the region of the opening edge of the recess 25 that is farthest from the LED 10. That is, in FIG. 5, the locking portion 25a of the recess 25 corresponding to the lead 12A extending toward the right is disposed in the region on the right side of the opening edge of the recess 25 and corresponds to the lead 12B extending toward the left. The locking portion 25 a of the recess 25 is disposed in the left region of the opening edge of the recess 25.

  The locking portion 25 a has a protruding shape that protrudes inward from the opening edge of the recess 25 along the surface 20 b of the mounting substrate 20. When the LED 10 is attached to the through hole 21 of the mounting substrate 20, the leading end 12c of each of the leads 12A and 12B bent at the bent portion 12e is inserted into the recess 25 and further locked by the locking portion 25a. When the leading end portion 12c of each of the leads 12A and 12B is locked to the locking portion 25a, the leading end portion 12c is moved to the mold portion 11 side against the elastic force of each of the leads 12A and 12B to the back of the recess 25. And insert.

<Sixth Embodiment>
Next, the LED light-emitting device of 6th Embodiment of this invention is demonstrated using FIG. FIG. 6 is a partial cross-sectional view of the LED light emitting device. Since the basic configuration of this embodiment is the same as that of the first embodiment described above, the same components as those of the first embodiment are denoted by the same reference numerals as those of the previous embodiment, and the description thereof is omitted. There is.

  In the LED light emitting device 1 of the sixth embodiment, as shown in FIG. 6, the LED 10 includes leads 13 </ b> A and 13 </ b> B, and the mounting substrate 20 includes a recess 25.

  Each of the leads 13 </ b> A and 13 </ b> B is bent at an angle of about 90 degrees by the bent portion 13 e and extends toward the radially outer side of the mold portion 11. Furthermore, each of the leads 13A and 13B is bent toward the upper side in FIG. 6 and the outer side in the radial direction of the mold part 11 at two points on the tip part 13c side with respect to the bent part 13e. The leading end portion 13c of each of the leads 13A and 13B is inserted into the recess 25 and is further locked by the locking portion 25a. When the leading end portion 13c of each of the leads 13A and 13B is locked to the locking portion 25a, the leading end portion 13c is moved to the mold portion 11 side against the elastic force of each of the leads 13A and 13B, and the back of the concave portion 25 And insert.

  As in the first to sixth embodiments, the LED light-emitting device 1 includes the LED 10 and the mounting substrate 20. The LED 10 includes leads 12A and 12B (13A and 13B) protruding outward from the opposite side of the light emitting part 11a of the mold part 11 to the outer shape of the mold part 11 in which the light emitting element is enclosed. The mounting substrate 20 includes through holes 21 (22, 23) having an inner diameter that substantially matches the outer diameter of the mold part 11 of the LED 10, and the LED 10 is mounted thereon. Further, in the LED light emitting device 1, the mold part 11 of the LED 10 is fitted into the through hole 21 of the mounting substrate 20, and the leads 12A and 12B are 90 at a bent part 12e which is a part between the base part 12d and the tip part 12c. The tip 12c is bent at an angle of at least an angle, and is bonded to the mounting substrate 20.

  According to this structure, since the mold part 11 of the LED 10 is fitted into the through hole 21 of the mounting substrate 20, the posture of the LED 10 can be maintained even when a strong external force is applied. Therefore, it is possible to prevent the occurrence of deviation of the optical axis of the LED 10 with a simple configuration. Thereby, the desired color and brightness of the LED 10 can be obtained.

  Further, in the second embodiment, the through hole 22 as a whole along the axial direction gradually increases in diameter from the light emitting part 11a side of the LED 10 toward the leads 12A and 12B, and on the light emitting part 11a side of the LED 10 The LED 10 is fitted at the place. Further, in the third embodiment, the diameter of the through hole 23 gradually increases as the lead 12A, 12B side portion, which is a part along the axial direction, moves from the light emitting portion 11a side of the LED 10 toward the lead 12A, 12B side. Expanding.

  According to these configurations, for example, as shown in FIG. 2 and FIG. 3, the enlarged diameter portion 11b whose outer diameter swells near the end of the lead portion 12A, 12B side of the mold portion 11 of the LED 10 is intentionally or unintentionally. Even when formed, the LED 10 can be fitted into the through hole 21 of the mounting substrate 20. Furthermore, in 3rd Embodiment, since the through-hole 23 has the part which the inner peripheral surface 23a comprises a cylindrical shape parallel to an axis line in the light emission part 11a side, it is possible to improve the effect | action which maintains the attitude | position of LED10. is there.

  Further, in the fourth to sixth embodiments, the mounting substrate 20 is recessed from the surface 20b toward the inside at the joint portion with the leads 12A and 12B (13A and 13B), and the leads 12A and 12B (13A and 13B). A recess 24 (25) into which the distal end portion 12c (13c) is inserted is provided.

  According to this configuration, the bending direction of the leads 12A and 12B and the positioning of the distal end portion 12c can be easily performed.

  In the fifth and sixth embodiments, the recess 25 is a latch that latches the leading end 12c (13c) of the leads 12A, 12B (13A, 13B) at the opening edge corresponding to the surface 20b of the mounting substrate 20. A portion 25a is provided.

  According to this configuration, since the tip end portion 12c is hooked by the locking portion 25a of the concave portion 25, for example, when there is a gap in the fitting state between the mold portion 11 of the LED 10 and the through hole 21 of the mounting substrate 20, the through hole 21 The displacement of the LED 10 along the axial direction can be suppressed, and the LED 10 can be easily positioned.

  Although the embodiments of the present invention have been described above, the scope of the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  For example, the second and third embodiments can be combined with the fourth, fifth and sixth embodiments.

  The present invention can be used in LED light-emitting devices.

1 LED light emitting device 10 LED
DESCRIPTION OF SYMBOLS 11 Mold part 11a Light emission part 11b Expanded diameter part 12A, 12B, 13A, 13B Lead 12c, 13c Tip part 12d, 13d Base part 12e, 13e Bending part 20 Mounting board 21, 22, 23 Through-hole 24, 25 Recessed part 25a Locking Part 30 Solder

Claims (2)

An LED including a lead in which an outer shape of a mold part in which a light emitting element is enclosed is molded into a bullet shape and protrudes outward from the opposite side of the light emitting part of the mold part;
A mounting substrate that includes a through hole having an inner diameter that substantially matches the outer diameter of the mold part of the LED and on which the LED is mounted;
With
The mold part of the LED is fitted into the through hole of the mounting board, the lead is bent at an angle of 90 degrees or more at a position between the base part and the tip part, and the tip part is the mounting board. Joined to
The mounting substrate includes a recess into which the tip of the lead is inserted by being recessed from the surface to the inside at a joint portion with the lead,
The recess, LED light-emitting device according to claim Rukoto includes a locking portion for locking the front end portion of the lead to the opening edge portion corresponding to the surface of the mounting substrate.   As for the said through-hole, the diameter expands as at least one part along the axial direction goes to the said lead side from the said light emission part side of the said LED, and the said LED fits in the said light emission part side of the said LED The LED light-emitting device according to claim 1.

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