JP6393180B2 - Liquid ejecting head, liquid ejecting apparatus, and method of manufacturing liquid ejecting head - Google Patents

Description

  The present invention relates to a liquid ejecting head for ejecting and recording droplets on a recording medium, a liquid ejecting apparatus, and a method for manufacturing the liquid ejecting head.

  In recent years, an ink jet type liquid ejecting head has been used in which ink droplets are ejected onto recording paper or the like to record characters and figures, or a liquid material is ejected onto the surface of an element substrate to form a functional thin film. In this method, a liquid such as ink or a liquid material is supplied from a liquid tank to a channel of a liquid ejecting head via a supply pipe, and pressure is applied to the liquid in the channel to discharge the liquid from a nozzle communicating with the channel. When ejecting droplets, the liquid ejecting head and the recording medium are moved to record characters and figures, or a functional thin film or a three-dimensional structure having a predetermined shape is formed.

  A shear mode type is known as this type of liquid jet head. In the shear mode type, discharge channels and dummy channels are alternately formed on the surface of the piezoelectric substrate, and a partition between the discharge channels and the dummy channels is instantaneously deformed to discharge droplets from nozzles communicating with the discharge channels. In recent years, high-quality printing is required for liquid jet heads, and the volume of liquid droplets to be ejected is as small as several picoliters. In order to stably discharge such fine droplets, efforts have been made to reduce variations in the amount of droplets between channels and variations in discharge speed.

  For example, Patent Document 1 describes a shear mode type liquid jet head. FIG. 22 is a perspective view of the liquid jet head 100 described in Patent Document 1. FIG. FIG. 23 is a diagram for explaining the characteristics of the liquid jet head 100. FIG. 23A is a diagram showing the depth of the electrode 105 from the left and right upper ends of the channel wall 103, and FIG. 23B is a diagram showing the applied voltage. In the liquid ejecting head 100, the depth of the electrode 105 for driving the channel wall 103 is different for each channel 104, and accordingly, the ejection variation of droplets occurs. Therefore, it is described that the applied voltage applied is changed in accordance with the depth of the electrode 105 of each channel 104 to reduce the discharge variation of the droplets. In addition, 121 is an ink supply port, 102 is a cover member, 122 is a common ink chamber, 109 is a nozzle plate, 110 is a nozzle hole, 106 is a shallow groove portion, 107 is a bonding wire, and 108 is an external electrode.

JP 2001-334657 A

  In Patent Document 1, the applied voltage applied to the electrode 105 of the channel wall 103 is continuously changed according to the position of the channel wall 103. Therefore, a large number of potential levels of the drive voltage are required, and the drive circuit becomes complicated. Further, when the electrode 105 is formed on the channel wall 103 by the oblique deposition method, the depth of the electrode 105 can be increased by using a film forming apparatus that can take a sufficiently large distance from the deposition source with respect to the size of the base member 101. It is made uniform. However, as the number of nozzles increases, the size of the base member 101 increases, and thus the film formation chamber needs to be sufficiently large. Moreover, a complicated configuration is required for the vapor deposition power source. As a result, the film forming apparatus becomes expensive and the manufacturing cost increases.

The liquid jet head according to the present invention includes a discharge channel and a dummy channel that are alternately arranged with a partition wall therebetween to form a channel row, a drive electrode that is a side surface of the partition wall and is located in a depth direction from the upper end of the partition wall, An end side from a substantially central point P of the channel row is defined as an outer side, and the point P side is defined as an inner side from an end portion of the channel row, and the channel row is defined as a central region and both sides of the central region. When dividing into three regions of the end region located at, the drive electrode of the end region satisfies the following formulas (1) and (2).
Tce ≠ (Tdee + Tdie) / 2 (1)
Tci≈ (Tdei + Tdii) / 2 (2)
Tce: Depth of the drive electrode positioned on the outer side surface of the discharge channel Tci: Depth of the drive electrode positioned on the inner side surface of the discharge channel Tdee: The depth adjacent to the outer side of the discharge channel Depth Tdei of the drive electrode positioned on the outer side surface of the dummy channel: Depth Tdie of the drive electrode positioned on the inner side surface of the dummy channel adjacent to the outer side of the discharge channel: Depth Tdi of the driving electrode positioned on the outer side surface of the dummy channel adjacent to the inner side: Depth of the driving electrode positioned on the inner side surface of the dummy channel adjacent to the inner side of the ejection channel

Further, the drive electrode in the end region satisfies the following formula (3).
Tce> (Tdee + Tdie) / 2 (3)

  In the central region, the drive electrode positioned outside the point P satisfies the formula (3).

Further, the drive electrode in the central region satisfies the formula (3) and the following formula (4).
Tci> (Tdei + Tdii) / 2 (4)

Further, the drive electrode in the end region satisfies the following formula (5).
Tce <(Tdee + Tdie) / 2 (5)

  In the central region, the drive electrode positioned outside the point P satisfies the formula (5).

The drive electrode in the central region satisfies the formula (5) and the following formula (6).
Tci <(Tdei + Tdii) / 2 (6)

  In addition, the depth of the drive electrode on the side surface of the dummy channel located on one end side of the channel row changes the position of the dummy channel from one end portion of the channel row to the other end portion. The depth of the drive electrode on the side surface located on the other end side of the channel row in the dummy channel is gradually increased as the dummy channel position is changed from one end portion of the channel row to the other. It became gradually shallower as it changed to the end.

  In addition, the depth of the drive electrode on the side surface of the discharge channel located on the one end side of the channel row is such that the discharge channel extends from the one end side to the other end side of the channel row. The depth of the drive electrode on the side surface located on the other end side of the channel row in the discharge channel is gradually increased from the one end side of the channel row. As it is located on the other end side, it gradually becomes shallower.

  The liquid ejecting apparatus according to the aspect of the invention includes the liquid ejecting head, a moving mechanism that relatively moves the liquid ejecting head and the recording medium, a liquid supply pipe that supplies liquid to the liquid ejecting head, and the liquid supply And a liquid tank for supplying the liquid to the pipe.

  The method of manufacturing a liquid jet head according to the present invention includes a resin film pattern forming step of forming a resin film pattern on the surface of the actuator substrate, and a groove row in which discharge grooves and non-discharge grooves are alternately arranged on the surface of the actuator substrate. A groove forming step to be formed; and an electrode material deposition step of depositing an electrode material by oblique vapor deposition on the surface of the actuator substrate and the side surfaces of the ejection groove and the non-ejection groove. An end side that is located outside the point P, an inner side that is the point P side than the end of the groove row, and the groove row of the end region located on both sides of the central region and the central region in the arrangement direction. When the resin film pattern forming step is divided into three regions and a partition wall region is formed between the ejection groove and the non-ejection groove, the resin film pattern forming step includes the inner region in the partition region in the inner region. Leave the resin film A first resin pattern that removes the resin film from the outer region and a second resin pattern that leaves the resin film in both the inner region and the outer region of the partition wall region are alternately formed. It was decided.

  Further, in the resin film pattern forming step, the second resin pattern is formed on the outer side of the discharge groove in the end region, and the first resin pattern is formed on the inner side of the discharge groove. .

  Further, in the resin film pattern forming step, the second resin pattern is formed on the outer side of the discharge groove and the first resin pattern is formed on the inner side of the discharge groove in the central region.

  In the resin film pattern forming step, in the central region, the resin film is removed from the inner region of the partition region and the resin film is left in the outer region outside the ejection groove. Three resin patterns were formed, and the first resin pattern was formed inside the discharge groove.

  In the resin film pattern forming step, in the end region, the second resin pattern is formed on the outer side of the non-ejection groove, and the first resin pattern is formed on the inner side of the non-ejection groove. It was.

  The resin film pattern forming step includes forming the second resin pattern on the outer side of the non-ejection groove and forming the first resin pattern on the inner side of the non-ejection groove in the central region. did.

  In the resin film pattern forming step, in the central region, the resin film is removed from the inner region of the partition wall, and the resin film is left in the outer region, outside the non-ejection groove. A third resin pattern was formed, and the first resin pattern was formed inside the non-ejection groove.

  Further, the groove forming step is a step of forming the discharge groove from one end of the actuator substrate to the front of the other end, a cover plate bonding step of bonding a cover plate to the surface of the actuator substrate, and the actuator substrate A nozzle plate adhering step of adhering the nozzle plate to the end face.

  Further, the groove forming step is a step of forming the discharge groove from the front of one end of the actuator substrate to the front of the other end, a cover plate joining step of joining a cover plate to the surface of the actuator substrate, And a nozzle plate bonding step of bonding the nozzle plate to the back surface of the actuator substrate.

The method of manufacturing a liquid jet head according to the present invention includes a groove forming step of forming a groove row in which discharge grooves and non-discharge grooves are alternately arranged on the surface of the actuator substrate, the surface of the actuator substrate, the discharge grooves, and the non-discharge grooves. A first electrode material deposition step of depositing an electrode material on a side surface of the discharge groove by an oblique vapor deposition method; and an outer side closer to the end than the central point P of the groove row, and the end of the groove row The non-ejection groove or the ejection contained in the end region when the groove P is divided into three regions of a central region and end regions located on both sides of the central region, with the point P side as the inside. A second electrode material deposition step of installing a mask that shields either one of the grooves and depositing an electrode material on a side surface of the ejection groove or the non-ejection groove by an oblique evaporation method, and the second electrode The actuator in the material deposition process The incident angle of the electrode material with respect to the normal of the surface of the substrate was set to be smaller than the incident angle of the electrode material with respect to the normal of the surface of the actuator substrate in the first electrode material deposition process.
A method for manufacturing a liquid jet head.

A liquid jet head according to the present invention includes ejection channels and dummy channels that are alternately arranged with a partition wall therebetween to form a channel row, and a drive electrode that is a side surface of the partition wall and is positioned in the depth direction from the upper end of the partition wall. , The end side of the channel row from the center P is outside, the point P side from the end of the channel row is inside, the channel row of the end region located on both sides of the central region and the central region When dividing into three regions, the drive electrodes in the end region satisfy the following formulas (1) and (2).
Tce ≠ (Tdee + Tdie) / 2 (1)
Tci≈ (Tdei + Tdii) / 2 (2)
Here, Tce: Depth of the drive electrode located on the outer side surface of the discharge channel, Tci: Depth of the drive electrode located on the inner side surface of the discharge channel, Tdee: Depth of the dummy channel adjacent to the outer side of the discharge channel Depth of the drive electrode located on the outer side surface, Tdei: Depth of the drive electrode located on the inner side surface of the dummy channel adjacent to the outside of the discharge channel, Tdie: Outer side of the dummy channel adjacent to the inside of the discharge channel The depth of the drive electrode located on the side surface of the dummy channel, and Tdi: the depth of the drive electrode located on the side surface inside the dummy channel adjacent to the inside of the ejection channel. This reduces the variation in the amount of displacement of both partition walls of the ejection channel without using a large number of potential level drive voltages, thereby improving the recording quality.

FIG. 3 is an explanatory diagram of a liquid ejecting head according to the first embodiment of the invention. It is a graph showing the relationship between the board | substrate position of a discharge channel, and the largest displacement amount of a partition. It is a graph showing the relationship between the board | substrate position of an ejection channel, and the displacement area of a partition. FIG. 6 is a schematic exploded perspective view of a liquid jet head according to a second embodiment of the present invention. It is explanatory drawing of the liquid jet head which concerns on the 3rd implementation liquid of this invention. 10 is a graph showing a relationship between a substrate position of a channel of a liquid jet head according to a fourth embodiment of the present invention and an electrode depth of a drive electrode. 10 is a graph showing a relationship between a substrate position of a discharge channel and a maximum displacement amount of a partition wall of a liquid jet head according to a fourth embodiment of the present invention. 10 is a graph showing a relationship between a substrate position of a discharge channel and a displacement area of a partition wall of a liquid jet head according to a fourth embodiment of the present invention. 10 is a graph showing a relationship between a substrate position of a channel of a liquid jet head according to a fifth embodiment of the present invention and an electrode depth of a drive electrode. 10 is a graph showing a relationship between a substrate position of a discharge channel and a maximum displacement amount of a partition wall of a liquid jet head according to a fifth embodiment of the present invention. FIG. 10 is a process diagram of a method for manufacturing a liquid jet head according to a fifth embodiment of the present invention. 10 is a graph showing a relationship between a substrate position of a discharge channel and a displacement area of a partition wall of a liquid jet head according to a fifth embodiment of the present invention. FIG. 10 is a process diagram of a method for manufacturing a liquid jet head according to a sixth embodiment of the present invention. It is explanatory drawing of the manufacturing method of the liquid jet head which concerns on 6th embodiment of this invention. It is explanatory drawing of the manufacturing method of the liquid jet head which concerns on 6th embodiment of this invention. It is explanatory drawing of the manufacturing method of the liquid jet head which concerns on 6th embodiment of this invention. It is explanatory drawing of the manufacturing method of the liquid jet head which concerns on 6th embodiment of this invention. It is explanatory drawing of the manufacturing method of the liquid jet head which concerns on 6th embodiment of this invention. FIG. 10 is a process diagram of a method for manufacturing a liquid jet head according to a seventh embodiment of the present invention. It is explanatory drawing of the manufacturing method of the liquid jet head which concerns on 7th embodiment of this invention. It is explanatory drawing of the manufacturing method of the liquid jet head which concerns on 7th embodiment of this invention. FIG. 10 is a schematic perspective view of a liquid ejecting apparatus according to an eighth embodiment of the present invention. It is a perspective view of a conventionally known liquid jet head. It is explanatory drawing of a conventionally well-known liquid ejecting head.

<Liquid jet head>
(First embodiment)
FIG. 1 is an explanatory diagram of a liquid jet head 1 according to the first embodiment of the present invention. FIG. 1A is a schematic cross-sectional view of the liquid jet head 1 in the channel row CR direction, and FIG. 1B is an explanatory diagram of the drive electrode 6 of the dummy channel D sandwiching the ejection channel C in the end region Ae. FIG. 1C is a graph showing the relationship between the substrate position of the channel (discharge channel C and dummy channel D) and the electrode depth of the drive electrode 6.

As shown in FIG. 1A, the liquid jet head 1 includes discharge channels C and dummy channels D that are alternately arranged with the partition walls 3 interposed therebetween to form a channel row CR, and side surfaces of the partition walls 3. And a drive electrode 6 positioned in the depth direction from the upper end. Then, the side closer to the end than the point P approximately in the center of the channel row CR is the outside, and the side of the point P is closer to the inside than the end of the channel row CR. Accordingly, the left end side and the right end side of the point P are both outside, and the point P side from the left and right end sides is inside. Further, the channel row CR is divided into three regions: a central region Ac and end regions Ae located on both sides of the central region Ac. At this time, the drive electrode 6 in the end region Ae satisfies the following formulas (2) and (3). Therefore, naturally, Formula (1) is satisfy | filled.
Tce ≠ (Tdee + Tdie) / 2 (1)
Tci≈ (Tdei + Tdii) / 2 (2)
Tce> (Tdee + Tdie) / 2 (3)
Furthermore, the drive electrode 6 in the central region Ac satisfies the above formula (2) and the following formula (7).
Tce≈ (Tdee + Tdie) / 2 (7)

  Here, Tce is the depth of the drive electrode 6 positioned on the outer side surface of the discharge channel C, and is hereinafter referred to as the depth Tce of the drive electrode 6ce outside the discharge channel. Tci is the depth of the drive electrode 6 located on the inner side surface of the ejection channel C, and is hereinafter referred to as the depth Tci of the in-discharge channel drive electrode 6ci. Tdee is the depth of the driving electrode 6 located on the outer side surface of the dummy channel D adjacent to the outer side of the ejection channel C, and is hereinafter referred to as the depth Tdee of the outer dummy channel outer driving electrode 6dee. Tdei is the depth of the drive electrode 6 located on the inner side surface of the dummy channel D adjacent to the outside of the ejection channel C, and is hereinafter referred to as the depth Tdei of the outer dummy channel drive electrode 6dei. Tdie is the depth of the drive electrode 6 located on the outer side surface of the dummy channel D adjacent to the inside of the ejection channel C, and is hereinafter referred to as the depth Tdie of the inner dummy channel outer drive electrode 6die. Tdii is the depth of the drive electrode 6 located on the inner side surface of the dummy channel D adjacent to the inner side of the ejection channel C, and is hereinafter referred to as the depth Tdii of the inner dummy channel drive electrode 6dii.

  That is, in the left and right end regions Ae, the depth of the drive electrode 6 positioned on the outer side surface of the discharge channel C is the same as that of the drive electrode 6 positioned on the outer side surface of the dummy channel D adjacent to both sides of the discharge channel C. Deeper than average depth. On the other hand, the depth of the drive electrode 6 positioned on the inner side surface of the discharge channel C is substantially equal to the average depth of the drive electrode 6 positioned on the inner side surface of the dummy channel D adjacent to both sides of the discharge channel C. Further, in the central region Ac, the depth of the drive electrode 6 positioned on the outer side surface of the discharge channel C is equal to the average depth of the drive electrode 6 positioned on the outer side surface of the dummy channel D adjacent to both sides of the discharge channel C. Almost equal. Further, the depth of the drive electrode 6 positioned on the inner side surface of the discharge channel C is substantially equal to the average depth of the drive electrode 6 positioned on the inner side surface of the dummy channel D adjacent to both sides of the discharge channel C. Accordingly, it is possible to reduce the variation in the displacement amount of the both partition walls 3 of the ejection channel C and improve the recording quality without using a large number of potential level drive voltages.

This will be specifically described below. The discharge channel C is surrounded by the left and right partition walls 3 and the upper and lower first substrates Pa and the second substrate Pb. Similarly, the dummy channel D is surrounded by the left and right partition walls 3 and the upper and lower first substrates Pa and Pb. The discharge channels C and the dummy channels D are alternately arranged adjacent to each other to form a channel row CR. For the partition 3, a piezoelectric material, for example, a ceramic made of lead zirconate titanate (PZT) or barium titanate (BaTiO ₃ ) can be used. The piezoelectric material is uniformly polarized from below to above or from above to below. In addition, a so-called chevron type piezoelectric material that has a depth of approximately ½ and is polarized in the opposite direction can be used. For the first substrate Pa or the second substrate Pb, the same material as the piezoelectric material constituting the partition wall 3 or a different material can be used. For example, the surface of an actuator substrate made of a single piezoelectric material is ground by a dicing blade, and discharge grooves 4 for the discharge channels C and non-discharge grooves 5 for the dummy channels D are alternately formed across the partition walls 3. Then, the actuator substrate is left at the bottom, and this is used as the second substrate Pb. The ejection channel C and the dummy channel D have a predetermined length in the depth direction of the paper, for example, 3 mm to 8 mm, the channel width in the channel row CR direction is 20 μm to 100 μm, and the channel depth is 100 μm to 400 μm. The drive electrode 6 is formed by an oblique deposition method using a conductive material made of a metal material or a semiconductor material. For example, Ti, Ni, Al, Au, Ag, Si, C, Pt, Ta, Sn, In, or the like can be used. The discharge channel C and the dummy channel D shown in FIG. 1 have the same width in the channel row CR direction.

  As will be described in detail later, the drive electrode 6 is formed by oblique deposition of a conductive material. In the present embodiment, before bonding the first substrate Pa to the upper end surface of the partition wall 3, a resin film is formed on the upper end surface of the partition wall 3 between the discharge channel C and the dummy channel D, and then the side surface of the partition wall 3. An electrode material is deposited by oblique evaporation. In this case, in the two end regions Ae, a resin film is formed on the inner side of the upper end surface (partition region) of the partition wall 3 located on the inner side (point P side) among the two partition walls 3 constituting the discharge channel C. The resin film is removed from the outside (end side), and the resin film is left on the inside (point P side) and outside (end side) on the upper end surface of the partition 3 located outside. In the central region Ac, the resin film is left on both the inner side (the point P side) and the outer side (the end side) on both upper end surfaces of the two partition walls 3 constituting the discharge channel C. Then, a conductive material is deposited by oblique evaporation from the upper right side of the upper end surface (first oblique evaporation), and then the conductive material is deposited by oblique evaporation from the upper left side (second oblique evaporation). As a result, in the end region Ae, the electrode material deposited on the outer side surface of the discharge channel C is in the depth direction of the groove by the thickness of the removed resin film rather than the electrode material formed by leaving the resin film. Deeply deposited. Although specifically described later, the electrode material deposited on the outer side surface of the discharge channel C is deposited deeper by the thickness of the resin film than the electrode material deposited on the inner side surface of the same discharge channel C. There may be. Next, the resin film is removed and the drive electrode 6 is formed. The electrode material deposited by the first oblique deposition becomes the drive electrode 6 on the left side of the discharge channel C and the dummy channel D, and the electrode material deposited by the second oblique deposition on the right side of the discharge channel C and the dummy channel D Drive electrode 6. Each discharge channel C and each dummy channel D have the same spacing (groove width) between the left and right partition walls 3.

  As a result, in the end region Ae, the depth Tce of the ejection channel outer drive electrode 6ce of the ejection channel C is equal to the depth Tdee of the outer dummy channel outer drive electrode 6dee of the two adjacent dummy channels D and the inner dummy channel outside. The driving electrode 6die is deeper than the average depth Tdie and satisfies the expression (3). On the other hand, the depth Tci of the ejection channel drive electrode 6ci of the ejection channel C is equal to the depth Tdei of the outer dummy channel drive electrode 6dei of the two adjacent dummy channels D and the depth Tdii of the inner dummy channel drive electrode 6dii. It is almost the same as the average depth and satisfies the formula (2). In the central region Ac, the depth Tce of the ejection channel outer drive electrode 6ce of the ejection channel C is equal to the depth Tdee of the outer dummy channel outer drive electrode 6dee of the two adjacent dummy channels D and the inner dummy channel outer drive electrode. It is approximately equal to the average depth of the 6die depth Tdie and satisfies the equation (7). Similarly, the depth Tci of the discharge channel drive electrode 6ci of the discharge channel C is equal to the depth Tdei of the outer dummy channel drive electrode 6dei of the two adjacent dummy channels D and the depth Tdii of the inner dummy channel drive electrode 6dii. It is substantially equal to the average depth of and satisfies equation (2).

  In this embodiment, the depth of the discharge channel C and the dummy channel D is 360 μm. The electrode depth of the drive electrode 6 formed by the first and second oblique deposition of each channel is about 130 μm at the substrate position near the point P (0 mm) in the approximate center of the channel row CR. The film thickness of the resin film left on the upper end surface of the partition wall 3 during the oblique vapor deposition is about 20 μm. Therefore, in the end region Ae, the depth Tce of the ejection channel outer drive electrode 6ce is about 20 μm deeper than the depth Tdee of the outer dummy channel outer drive electrode 6dee and the Tdie of the inner dummy channel outer drive electrode 6die.

  FIG. 1C shows the relationship between the electrode depth of the drive electrode 6 and the substrate position of the channel. The horizontal axis represents the substrate position (unit: mm) of the discharge channel C or the dummy channel D, and the vertical axis represents the electrode depth of the drive electrode 6. In a region (− region) on the left side of the point P (0 mm), the ejection channel drive electrode 6ci, the outer dummy channel drive electrode 6dei, and the inner dummy channel drive electrode 6dii located on the outer side surface (left side surface) of the partition wall 3. As shown by the upper solid line, the depth of the drive electrode 6 gradually decreases from the outside to the inside (toward the + side). The outer dummy channel outer drive electrode 6dee and the inner dummy channel outer drive electrode 6die located on the inner side surface (right side surface) of the partition wall 3 gradually increase in depth of the drive electrode 6 from the outer side to the inner side, as indicated by the lower solid line. Deepen. On the other hand, the ejection channel outer drive electrode 6ce has a depth indicated by a solid line in the central region Ac similar to the outer dummy channel outer drive electrode 6dee and the inner dummy channel outer drive electrode 6die, but in the end region Ae. As indicated by a broken line, it is about 20 μm deeper than the outer dummy channel outer drive electrode 6dee and the inner dummy channel outer drive electrode 6die. In the present embodiment, the boundary between the center region Ac and the end region Ae is defined as a position where the depth Tce of the ejection channel drive electrode 6ce and the depth Tci of the ejection channel drive electrode 6ci are equal. The amount of variation in the substrate is reduced.

  Each drive electrode 6 and its depth have a plane-symmetrical relationship with respect to a plane passing through the point P and perpendicular to the channel row CR direction. Accordingly, each drive electrode 6 in the end region Ae on the right side of the point P is a left-right inverted version of FIG. Further, in the dummy channel D, the depth Td1 of the drive electrode 6 located on the one end (left end) side of the channel row CR is such that the position of the dummy channel D is from one end (left end) to the other end. The depth Td2 of the drive electrode 6 located on the other end (right end) side of the channel row CR is such that the position of the dummy channel D is one of the channel rows CR. Gradually becomes shallower as it changes from one end (left end) to the other end (right end). Then, at the point P, the depths of the two drive electrodes 6 of the dummy channel D become substantially equal (Td1≈Td2).

  The partition wall 3 undergoes thickness-slip deformation by applying a voltage to the drive electrodes 6 sandwiching the partition wall 3. The amount of thickness slip deformation of the partition wall 3 increases as the area of voltage applied to the partition wall 3 increases. Since the application area of the voltage applied to the partition wall 3 is determined by the overlapping area of the two drive electrodes 6 sandwiching the partition wall 3, the thickness of the two drive electrodes 6 sandwiching the partition wall 3 is eventually reduced by the drive electrode 6 having a shallow electrode depth. The amount of slip deformation is determined. Accordingly, in the case shown in FIG. 1B, the thickness slip deformation amount of the left partition wall 3 of the discharge channel C is determined by the discharge channel outside drive electrode 6ce, and the thickness slip deformation amount of the right partition wall 3 is driven outside the inner dummy channel. It is determined by the electrode 6die. That is, the driving electrode 6 of the partition wall 3 has a shallower driving electrode 6 having an effective electrode depth. The deformation amount of the discharge channel C is represented by the sum of the deformation amount of the left partition wall 3 and the deformation amount of the right partition wall 3. Therefore, in order to reduce the variation in the deformation amount of each discharge channel C, it is to reduce the variation in the sum of the deformation amounts of the left and right partition walls 3 of each discharge channel C. In other words, the deformation amount of the ejection channel C is such that the shallower one of the two drive electrodes 6 sandwiching the left partition 3 and the shallower one of the two drive electrodes 6 sandwiching the right partition 3. Since it depends on the total value (average depth) with the electrode depth of the drive electrode 6, in order to reduce the variation in the deformation amount of each discharge channel C, the variation in the total value (average depth) is reduced. It is to let you.

  2 and 3, the depth of the drive electrode 6 satisfies the formulas (2) and (3) in the end region Ae, and the depth of the drive electrode 6 in the center region Ac satisfies the formulas (2) and (3). The effect by satisfying (7) will be described.

  FIG. 2 is a graph showing the relationship between the substrate position of the discharge channel C and the maximum displacement amount of the partition 3. When a solid line uses the drive electrode 6 of the liquid jet head 1 of this embodiment, a broken line shows a simulation result when the drive electrode 6 of the conventional liquid jet head 1 is used. The vertical axis represents the maximum amount of horizontal displacement of the partition 3, and the horizontal axis represents the channel substrate position. For the discharge channel C, the average horizontal displacement Δdm = (Δd1 + Δd2) / where the maximum horizontal displacement of one (outer) partition 3 is Δd1 and the maximum horizontal displacement of the other (inner) partition 3 is Δd2. 2.

As shown in FIG. 2, when the average displacement amount Δdm of the partition wall 3 of the liquid jet head 1 in this embodiment is compared with the average displacement amount Δdm of the conventional method, the average displacement amount Δdm of the present embodiment and the conventional method are compared in the central region Ac. The average displacement amount Δdm is substantially equal. On the other hand, in both end regions Ae, the average displacement amount Δdm of the present invention is larger than the average displacement amount Δdm of the conventional method. In addition, the average displacement amount Δdm gradually decreases as the position of the discharge channel C moves outward (both ends), but the decreasing gradient of the average displacement amount Δdm is smaller in the present invention than in the conventional method. Further, the difference between the maximum value and the minimum value of the average displacement amount Δdm in the substrate is about 0.12 × 10 ⁻⁸ m in the present invention, whereas it is 0.17 × 10 ⁻⁸ m in the conventional method. And big. That is, in the drive electrode 6 of the present invention, the variation in the substrate of the average displacement amount Δdm of the partition wall 3 is reduced as compared with the conventional method, and regardless of the substrate position of the discharge channel C, the droplet discharge conditions, such as the droplet amount and It is possible to equalize the droplet discharge speed and improve the recording quality.

  FIG. 3 is a graph showing the relationship between the substrate position of the ejection channel C and the displacement area of the partition 3. When a solid line uses the drive electrode 6 of the liquid jet head 1 of the present invention, a broken line shows a simulation result when the drive electrode 6 of the conventional liquid jet head 1 is used. The vertical axis represents the displacement area ratio, and the horizontal axis represents the channel substrate position. The displacement area is an amount obtained by converting the deformation amount of the partition wall 3 into the cross-sectional area of the discharge channel C, and the displacement area ratio is normalized by the displacement area of the partition wall 3 corresponding to the central point P. For the discharge channel C, the displacement area of one (outer) partition wall 3 is Δs1, and the displacement area of the other (inner) partition wall 3 is Δs2, and the average displacement area Δsm = (Δs1 + Δs2) / 2. As can be easily understood from FIG. 3, the difference between the maximum value and the minimum value of the average displacement area Δsm is smaller than that of the conventional drive electrode 6, and the variation in the average displacement area Δsm within the substrate is small. Is greatly reduced. For example, in the case of the ejection channel C located at both ends (−54 mm, +54 mm) of the substrate, the drive electrode 6 of the present invention improves the average displacement area Δsm of the partition wall 3 by about 43% compared to the conventional drive electrode 6.

In the present embodiment, the depths of the drive electrodes 6 of the ejection channel C and the dummy channel D located in the end region Ae satisfy Expressions (3) and (2). ) And formula (2) can be satisfied. Accordingly, in this case, the formula (1) is naturally satisfied.
Tce <(Tdee + Tdie) / 2 (5)
Tci≈ (Tdei + Tdii) / 2 (2)
That is, the depth Tce of the ejection channel outer drive electrode 6ce of the ejection channel C is set to the depth Tde of the outer dummy channel outer drive electrode 6dee of the two dummy channels D adjacent to the ejection channel C and the inner dummy channel outer drive electrode 6die. It is made shallower than the average depth of the depth Tdie. Further, the depth Tci of the ejection channel drive electrode 6ci of the ejection channel C is set to the depth Tdei of the outer dummy channel drive electrode 6dei of the two dummy channels D adjacent to the ejection channel C and the inner dummy channel drive electrode 6dii. The depth is approximately the same as the average depth of the depth Tdi. That is, in FIG. 1, it is the same as replacing the ejection channel C and the dummy channel D without changing the partition wall 3 and the drive electrode 6. Even if the discharge channel C and the dummy channel D are interchanged, the deformation amount of the partition wall 3 does not change. Therefore, the variation in the substrate of the average displacement amount Δdm of the partition wall 3 is reduced as compared with the conventional method, regardless of the substrate position of the discharge channel C. The droplet discharge conditions, for example, the droplet amount and the droplet discharge speed are equalized, and the recording quality can be improved.

  In the present embodiment, the boundary between the central region Ac and the end region Ae is set to a position where the depth Tce of the ejection channel drive electrode 6ce and the depth Tci of the ejection channel drive electrode 6ci are equal. It is not limited to this. For example, even if the boundary position between the central region Ac and the end region Ae is shifted outward or inward from the position of the present embodiment liquid, as is apparent from FIGS. 2 and 3, the average displacement amount Δdm and the average displacement area Δsm Variation in the substrate is reduced as compared with the conventional example. For example, when the distance from the substantially central point P to the end of the channel row CR is 1, the boundary between the central region Ac and the end region Ae ranges from 2/5 to 2/3 outward from the point P. It is preferable that However, this range changes depending on the magnitude of the difference ΔT = Tce− (Tdee + Tdie) / 2 of the electrode depth in the end region Ae. Specifically, it varies depending on the thickness of the resin film installed on the upper end surface of the partition wall 3 before the oblique vapor deposition.

(Second embodiment)
FIG. 4 is a schematic exploded perspective view of the liquid jet head 1 according to the second embodiment of the present invention. The liquid jet head 1 is an edge shoot type. The same portions or portions having the same function are denoted by the same reference numerals.

As shown in FIG. 4, the liquid jet head 1 includes an actuator substrate 2, a cover plate 10 that is bonded to the upper surface US of the actuator substrate 2, and a nozzle plate 13 that is bonded to the front end surface of the actuator substrate 2. The actuator substrate 2 is made of a piezoelectric material, and for example, PZT or BaTiO ₃ ceramics can be used. The actuator substrate 2 is uniformly polarized from below to above or from above to below. The actuator substrate 2 is alternately arranged on the upper surface US with the partition walls 3 sandwiched between the ejection grooves 4 and the non-ejection grooves 5 constituting the groove row MR, and the side surfaces of the partition walls 3 and is located in the depth direction from the upper end of the partition walls 3. Drive electrode 6 to be provided.

  The discharge groove 4 extends from the front end of the actuator substrate 2 to the front of the rear end, and the non-discharge groove 5 extends straight from the front end of the actuator substrate 2 to the rear end. The ejection groove 4 opens at the front end surface of the actuator substrate 2, and the rear end side forms an inclined surface that rises from the bottom surface of the ejection groove 4 to the upper surface US and terminates at the upper surface US. The non-ejection groove 5 opens on the front end surface and the rear end surface of the actuator substrate 2. The actuator substrate 2 includes a common terminal 15a and an individual terminal 15b on the upper surface US near the rear end. The common terminal 15 a is electrically connected to the drive electrodes 6 located on both side surfaces of the ejection groove 4, and the individual terminal 15 b is located on the side surface on the ejection groove 4 side of the two non-ejection grooves 5 that sandwich the ejection groove 4. The two drive electrodes 6 are electrically connected and located on the rear end side with respect to the common terminal 15a. Note that the ejection grooves 4 and the non-ejection grooves 5 shown in FIG. 4 correspond to the end region Ae, and the partition wall 3 has the electrode 8 continuous with the common terminal 15a on the ejection groove 4 side of the upper end surface (upper surface US). Prepare.

The cover plate 10 includes a liquid chamber 11 and a plurality of slits 12 penetrating from the bottom surface of the liquid chamber 11 to the actuator substrate 2 side. The cover plate 10 is bonded to the upper surface US of the actuator substrate 2 while exposing the common terminals 15a, the individual terminals 15b, and a part of the rear side of the non-ejection grooves 5. Each slit 12 communicates with the rear side of the ejection groove 4. Accordingly, the liquid chamber 11 communicates with each ejection groove 4 through each slit 12 and does not communicate with the non-ejection groove 5. The nozzle plate 13 includes nozzles 14 at positions corresponding to the respective ejection grooves 4 and adheres to the actuator substrate 2 and the front end surfaces of the cover plate 10. Each nozzle 14 communicates with the ejection groove 4. The discharge groove 4 is surrounded by the cover plate 10 and the nozzle plate 13 to form a discharge channel C, and the non-discharge groove 5 is covered by the cover plate 10 to form a dummy channel D. Further, the groove row MR corresponds to the channel row CR. PZT ceramics, BaTiO ₃ ceramics material or plastic material can be used as the cover plate 10. As the nozzle plate 13, a plastic material such as a polyimide film or a metal material can be used.

Similarly to the channel row CR, the end of the groove row MR is located outside the substantially central point P (not shown), and the point P side is located inside the end of the groove row MR, and the groove row MR is not shown in the center. The region Ac and the central region Ac are divided into end regions Ae (not shown) located at both ends.
Here, in the end region Ae of the groove row MR (channel row CR), the depth of the drive electrode 6 located on the outer side surface of the discharge groove 4 (discharge channel C) is not adjacent to both sides of the discharge groove 4. It is deeper than the average depth of the two drive electrodes 6 located on the outer side surface of the ejection groove 5 (dummy channel D). On the other hand, in the end region Ae, the depth of the drive electrode 6 located on the inner side surface of the ejection groove 4 is the two driving positions located on the inner side surface of the non-ejection groove 5 adjacent to both sides of the ejection groove 4. It is almost equal to the average depth of the electrode 6.
Further, in the central region Ac of the groove row MR (channel row CR), the depth of the drive electrode 6 located on the outer side surface of the ejection groove 4 is the outer side surface of the non-ejection groove 5 adjacent to both sides of the ejection groove 4. Is approximately equal to the average depth of the two drive electrodes 6 located at Further, in the central region Ac, the depth of the drive electrode 6 located on the inner side surface of the ejection groove 4 is the same as that of the two drive electrodes 6 located on the inner side surface of the non-ejection groove 5 adjacent to both sides of the ejection groove 4. It is almost equal to the average depth.

  The liquid jet head 1 is driven as follows. When the liquid is supplied to the liquid chamber 11, the liquid flows into each discharge groove 4 through each slit 12. When a driving voltage is supplied to the common terminal 15a and the individual terminal 15b (usually, the common terminal 15a is connected to GND and the driving voltage is applied to the individual terminal 15b), first, the two partition walls 3 of the ejection groove 4 are thick. Sliding deformation increases the volume of the discharge groove 4 (discharge channel C) to take in the liquid from the liquid chamber 11, and then decreases the volume of the discharge groove 4, or returns to the original volume and drops from the nozzle 14. Is discharged. According to the configuration of the drive electrode 6 of the present invention, variations in the substrate of the average displacement amount Δdm and the average displacement area Δsm of the partition walls 3 are reduced. As a result, the droplet discharge conditions can be equalized with respect to the substrate position of the discharge channel C.

  In the present embodiment, the ejection grooves 4 and the non-ejection grooves 5 may be interchanged without changing the partition walls 3 and the drive electrodes 6. Further, when the distance from the substantially central point P to the end portion of the groove row MR is 1, the boundary between the central region Ac and the end region Ae ranges from 2/5 to 2/3 outward from the point P. It is preferable that However, this range changes depending on the magnitude of the difference ΔT = Tce− (Tdee + Tdie) / 2 of the electrode depth in the end region Ae. Specifically, it varies depending on the thickness of the resin film installed on the upper end surface of the partition wall 3 before the oblique vapor deposition.

(Third embodiment)
FIG. 5 is an explanatory diagram of the liquid jet head 1 according to the third embodiment of the present invention. FIG. 5A is a schematic exploded perspective view of the liquid ejecting head 1, and FIG. 5B is a schematic cross-sectional view of the ejection groove 4. The liquid jet head 1 is a side chute type. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIG. 5, the liquid ejecting head 1 includes an actuator substrate 2, a cover plate 10 bonded to the upper surface US of the actuator substrate 2, and a nozzle plate 13 bonded to the lower surface LS of the actuator substrate 2. The actuator substrate 2 includes discharge grooves 4 and non-discharge grooves 5 that are alternately arranged with the partition walls 3 interposed therebetween to form the groove row MR, and drive electrodes that are on the side surfaces of the partition walls 3 and are located in the depth direction from the upper ends of the partition walls 3. 6. The ejection grooves 4 and the non-ejection grooves 5 are elongated in the x direction (groove direction) and are alternately arranged in the y direction to constitute a groove row MR (channel row CR). The ejection grooves 4 and the non-ejection grooves 5 penetrate in the thickness direction of the actuator substrate 2. The ejection groove 4 extends from the front of one end of the actuator substrate 2 in the x direction to the front of the other end. In the longitudinal direction of the groove, the discharge groove 4 has a central portion opened in a shape elongated in the x direction of the upper surface US, and both end portions are inclined surfaces that spread from the lower surface LS to the upper surface US. In the longitudinal direction of the groove, the non-ejection groove 5 extends from one end to the other end in the groove direction of the actuator substrate 2. The non-ejection groove 5 has the same shape as the ejection groove 4 at the center, and both ends have a certain depth from the upper surface US. That is, the non-ejection groove 5 opens in an elongated shape from one end to the other end of the upper surface US. The drive electrodes 6 located on both side surfaces of the ejection groove 4 extend from the front side of the −x side to the front side of the + x side. The drive electrodes 6 located on both side surfaces of the non-ejection groove 5 have the −x side end portions substantially the same as the −x side end portions of the ejection electrodes 4 of the ejection grooves 4, and the + x side has the non-ejection groove 5. Extends to the end of the.

  The actuator substrate 2 includes a common terminal 15a and an individual terminal 15b on the upper surface US near the end on the + x side. The common terminal 15 a is located near the opening of the ejection groove 4 and is electrically connected to the drive electrodes 6 located on both side surfaces of the ejection groove 4. The individual terminal 15b is electrically connected to the two drive electrodes 6 located on the side of the two non-ejection grooves 5 between the two non-ejection grooves 5 that are located closer to the + x end than the common terminal 15a. Connect to. Note that the ejection grooves 4 and the non-ejection grooves 5 shown in FIG. 5 correspond to the end region Ae, and the partition wall 3 has an electrode 8 continuous with the common terminal 15a on the ejection groove 4 side of the upper end surface (upper surface US). Prepare.

  The cover plate 10 includes two liquid chambers 11a and 11b, and the common terminal 15a and the individual terminals 15b are exposed and joined to the upper surface US of the actuator substrate 2. One liquid chamber 11a communicates with the −x side end of the ejection groove 4 via a slit 12a, and the other liquid chamber 11b communicates with the + x side end of the ejection groove 4 via a slit 12b. The two liquid chambers 11 a and 11 b do not communicate with the non-ejection groove 5. The nozzle plate 13 includes nozzles 14. The nozzle plate 13 closes the openings on the lower surface LS side of the ejection grooves 4 and the non-ejection grooves 5 and adheres to the lower surface LS of the actuator substrate 2. The nozzle 14 communicates with the discharge groove 4 opened in the lower surface LS. The discharge groove 4 is surrounded by the cover plate 10 and the nozzle plate 13 to form a discharge channel C, and the non-discharge groove 5 is covered by the cover plate 10 and the nozzle plate 13 to form a dummy channel D. The groove row MR arranged in the y direction constitutes a channel row CR.

Ceramics such as PZT and BaTiO ₃ can be used as the actuator substrate 2. As the cover plate 10, PZT ceramics, other ceramic materials, or plastic materials can be used. As the nozzle plate 13, a plastic material such as a polyimide film or a metal material can be used. The drive electrode 6 is formed by an oblique deposition method using a conductive material made of a metal material or a semiconductor material. For example, Ti, Ni, Al, Au, Ag, Si, C, Pt, Ta, Sn, In, or the like can be used. The channel length is 3 mm to 8 mm in the x direction, the channel width is 20 μm to 100 μm, and the channel depth h is 100 μm to 400 μm.

Here, the depths of the two drive electrodes 6 located on the opposite side surfaces of the ejection groove 4 (ejection channel C) and the non-ejection groove 5 (dummy channel D) are the same as in the second embodiment.
In other words, in the end region Ae of the groove row MR (channel row CR), the depth of the drive electrode 6 positioned on the outer side surface of the discharge groove 4 (discharge channel C) is the non-discharge state adjacent to both sides of the discharge groove 4. It is deeper than the average depth of the two drive electrodes 6 located on the outer side surface of the groove 5 (dummy channel D). On the other hand, in the end region Ae, the depth of the drive electrode 6 located on the inner side surface of the ejection groove 4 is the two driving positions located on the inner side surface of the non-ejection groove 5 adjacent to both sides of the ejection groove 4. It is almost equal to the average depth of the electrode 6.
Further, in the central region Ac of the groove row MR (channel row CR), the depth of the drive electrode 6 located on the outer side surface of the ejection groove 4 is the outer side surface of the non-ejection groove 5 adjacent to both sides of the ejection groove 4. Is approximately equal to the average depth of the two drive electrodes 6 located at Further, in the central region Ac, the depth of the drive electrode 6 located on the inner side surface of the ejection groove 4 is the same as that of the two drive electrodes 6 located on the inner side surface of the non-ejection groove 5 adjacent to both sides of the ejection groove 4. It is almost equal to the average depth.

  The liquid jet head 1 is driven as follows. Liquid is supplied from the outside to the liquid chamber 11a (or the liquid chamber 11b), and each discharge groove 4 (discharge channel C) is filled with liquid. Furthermore, the liquid flows out from each discharge groove 4 to the liquid chamber 11b (or the liquid chamber 11a) and is discharged from the liquid chamber 11b (or the liquid chamber 11a) to the outside. That is, the liquid circulates. When a driving voltage is supplied between the common terminal 15a and the individual terminal 15b, first, the two partition walls 3 of the discharge groove 4 are subjected to thickness-slip deformation to increase the volume of the discharge channel C (discharge groove 4). The liquid is taken in from 11a and 11b. Next, the volume of the discharge channel C is reduced or returned to the original volume, and the droplets are discharged from the nozzle 14. According to the configuration of the drive electrode 6 of the present invention, variations in the substrate of the average displacement amount Δdm and the average displacement area Δsm of the partition walls 3 are reduced. As a result, it is possible to equalize the droplet discharge conditions, for example, the droplet amount and the droplet discharge speed, with respect to the substrate position of the discharge channel C.

  In the present embodiment, the ejection grooves 4 and the non-ejection grooves 5 may be interchanged without changing the partition walls 3 and the drive electrodes 6. Further, when the distance from the substantially central point P to the end portion of the groove row MR is 1, the boundary between the central region Ac and the end region Ae ranges from 2/5 to 2/3 outward from the point P. It is preferable that However, this range changes depending on the magnitude of the difference ΔT = Tce− (Tdee + Tdie) / 2 of the electrode depth in the end region Ae. Specifically, it varies depending on the thickness of the resin film installed on the upper end surface of the partition wall 3 before the oblique vapor deposition.

(Fourth embodiment)
FIG. 6 is a graph showing the relationship between the substrate position of the channel of the liquid jet head 1 and the electrode depth of the drive electrode 6 according to the fourth embodiment of the present invention. The difference from the first embodiment is the drive electrode 6 in the central region Ac. Other configurations are the same as those of the first embodiment. The same portions or portions having the same function are denoted by the same reference numerals.

  In the central region Ac of the channel row CR, the drive electrode 6 positioned outside the substantially central point P satisfies the expressions (2) and (3). Specifically, referring to FIG. 1B, the depth Tce of the ejection channel outer drive electrode 6ce of the ejection channel C is equal to the depth Tdee of the outer dummy channel outer drive electrode 6dee of two adjacent dummy channels D. And deeper than the average depth Tdie of the inner dummy channel outer drive electrode 6die, the expression (3) is satisfied. On the other hand, the depth Tci of the ejection channel drive electrode 6ci of the ejection channel C is equal to the depth Tdei of the outer dummy channel drive electrode 6dei of the two adjacent dummy channels D and the depth Tdii of the inner dummy channel drive electrode 6dii. The depth is substantially the same as the average depth and satisfies the formula (2). The drive electrodes 6 of the ejection channel C and the dummy channel D have a plane-symmetric relationship with respect to a plane that passes through the point P and is perpendicular to the channel row CR direction. In other words, each drive electrode 6 on the right side of the point P is obtained by horizontally inverting each drive electrode 6 on the left side of the point P. For this reason, the relationship of Expression (2) and Expression (3) is satisfied in all regions of the channel string CR. In addition, the depth Td1 of the drive electrode 6 located on one side of the channel row CR in the dummy channel D gradually increases as the position of the dummy channel D changes from one end to the other end. The depth Td2 of the drive electrode 6 located on the other end side of the channel row CR becomes gradually shallower as the position of the dummy channel D changes from one end portion to the other end portion of the channel row CR. Then, at the point P, the depths of the two drive electrodes 6 of the dummy channel D become substantially equal (Td1≈Td2).

  The effect of this embodiment is demonstrated using FIG.7 and FIG.8. FIG. 7 is a graph showing the relationship between the substrate position of the ejection channel C and the maximum displacement amount of the partition wall 3 of the liquid jet head 1 according to the fourth embodiment of the present invention. When a solid line uses the drive electrode 6 of the liquid jet head 1 of this embodiment, a broken line shows a simulation result when the drive electrode 6 of the conventional liquid jet head 1 is used. For the discharge channel C, the average horizontal displacement Δdm = (Δd1 + Δd2) / where the maximum horizontal displacement of one (outer) partition 3 is Δd1 and the maximum horizontal displacement of the other (inner) partition 3 is Δd2. 2.

  As shown in FIG. 7, in the central region Ac, the average displacement amount Δdm of the liquid jet head 1 of the present invention is smaller than the average displacement amount Δdm of the conventional liquid jet head 1. On the other hand, in the end region Ae, the average displacement amount Δdm of the liquid jet head 1 of the present invention is larger than the average displacement amount Δdm of the conventional liquid jet head 1. As is apparent from FIG. 7, the drive electrode 6 of the present invention has less variation in the substrate of the average displacement amount Δdm of the partition wall 3 than the conventional drive electrode 6. As a result, it is possible to equalize the droplet discharge conditions, for example, the droplet amount and the droplet discharge speed, with respect to the substrate position of the discharge channel C, thereby improving the recording quality.

  FIG. 8 is a graph showing the relationship between the substrate position of the ejection channel C and the displacement area of the partition wall 3 of the liquid jet head 1 according to the fourth embodiment of the present invention. When a solid line uses the drive electrode 6 of the liquid jet head 1 of the present invention, a broken line shows a simulation result when the conventional liquid jet head drive electrode 6 is used. The vertical axis represents the displacement area ratio, and the horizontal axis represents the channel substrate position. The displacement area ratio is normalized by the displacement area of the partition wall 3 whose substrate position is the center. For the discharge channel C, the displacement area of one (outer) partition wall 3 is Δs1, and the displacement area of the other (inner) partition wall 3 is Δs2, and the average displacement area Δsm = (Δs1 + Δs2) / 2. As is apparent from FIG. 8, the difference between the maximum value and the minimum value of the average displacement area Δsm is smaller in the drive electrode 6 of the present invention than in the conventional drive electrode, and the variation in the substrate of the average displacement area Δsm is greatly increased. Reduce. For example, in the case of the ejection channel C located at both ends (−54 mm, +54 mm) of the substrate, the drive electrode 6 of the present invention improves the average displacement area Δsm of the partition wall 3 by about 36% compared to the conventional drive electrode. As a result, regardless of the substrate position of the ejection channel C, the droplet ejection conditions, for example, the droplet amount and the droplet ejection speed can be equalized, and the recording quality can be improved.

  In the present embodiment, the drive electrodes 6 of the discharge channel C and the dummy channel D located in all the end region Ae and the central region Ac satisfy the expressions (2) and (3). Thus, even if the discharge channel C and the dummy channel D located in the entire region satisfy the expressions (5) and (2), the same effect can be obtained. This is the same as replacing the ejection channel C and the dummy channel D without changing the partition wall 3 and the drive electrode 6. Further, the drive electrode 6 of the present embodiment can be applied to the liquid jet heads 1 of the second and third embodiments.

(Fifth embodiment)
FIG. 9 is a graph showing the relationship between the substrate position of the channel of the liquid jet head 1 and the electrode depth of the drive electrode 6 according to the fifth embodiment of the present invention. The difference from the first and fourth embodiments is the drive electrode 6 in the central region Ac. Other configurations are the same as those of the first and fourth embodiments. The same portions or portions having the same function are denoted by the same reference numerals.

In the central region Ac of the channel row CR, the drive electrode 6 positioned outside the substantially central point P satisfies the formula (3) and the following formula (4).
Tci> (Tdei + Tdii) / 2 (4)
Specifically, referring to FIG. 1B, the depth Tce (indicated by a broken line in FIG. 9) of the ejection channel outer drive electrode 6ce of the ejection channel C is the outer dummy channel of the two adjacent dummy channels D. Deeper than the average depth of the depth Tdee of the outer drive electrode 6dee and the depth Tdie of the inner dummy channel outer drive electrode 6die (both shown by a solid line in FIG. 9), Expression (3) is satisfied. On the other hand, the depth Tci of the ejection channel drive electrode 6ci of the ejection channel C is equal to the depth Tdei of the outer dummy channel drive electrode 6dei of the two adjacent dummy channels D and the depth Tdii of the inner dummy channel drive electrode 6dii. Deeper than the average depth, equation (4) is satisfied. The drive electrodes 6 of the ejection channel C and the dummy channel D have a plane-symmetric relationship with respect to a plane that passes through the point P and is perpendicular to the channel row CR direction. In other words, each drive electrode 6 on the right side of the point P is obtained by horizontally inverting each drive electrode 6 on the left side of the point P.

  In the two end regions Ae, as in the first embodiment, each drive electrode 6 satisfies the relationship of Expression (2) and Expression (3). In addition, the depth Td1 of the drive electrode 6 located on one side of the channel row CR in the dummy channel D gradually increases as the position of the dummy channel D changes from one end to the other end. The depth Td2 of the drive electrode 6 located on the other end side of the channel row CR becomes gradually shallower as the position of the dummy channel D changes from one end portion to the other end portion of the channel row CR. Then, at the point P, the depths of the two drive electrodes 6 of the dummy channel D become substantially equal (Td1≈Td2).

  The effect of this embodiment will be described with reference to FIGS. 10 and 11. FIG. 10 is a graph showing the relationship between the substrate position of the ejection channel C and the maximum displacement amount of the partition wall 3 of the liquid jet head 1 according to the fifth embodiment of the present invention. When a solid line uses the drive electrode 6 of the liquid jet head 1 of this embodiment, a broken line shows a simulation result when the drive electrode 6 of the conventional liquid jet head 1 is used. For the discharge channel C, the average horizontal displacement Δdm = (Δd1 + Δd2) / where the maximum horizontal displacement of one (outer) partition 3 is Δd1 and the maximum horizontal displacement of the other (inner) partition 3 is Δd2. 2.

As shown in FIG. 10, in the central region Ac, the average displacement amount Δdm of the liquid jet head 1 of the present invention and the average displacement amount Δdm of the conventional liquid jet head 1 are substantially the same. On the other hand, in the end region Ae, the average displacement amount Δdm of the liquid jet head 1 of the present invention is larger than the average displacement amount Δdm of the conventional liquid jet head 1. Further, from FIG. 10, the difference between the maximum value and the minimum value of the average displacement amount Δdm is 0.3 × 10 ⁻⁸ m or more in the conventional drive electrode 6, whereas the drive electrode 6 of the present invention is almost the same. It is 0.1 × 10 ⁻⁸ m and is small.

  FIG. 11 is a graph showing the relationship between the substrate position of the ejection channel C and the displacement area of the partition wall 3 of the liquid jet head 1 according to the fifth embodiment of the present invention. When a solid line uses the drive electrode 6 of the liquid jet head 1 of the present invention, a broken line shows a simulation result when the conventional liquid jet head drive electrode 6 is used. The vertical axis represents the displacement area ratio, and the horizontal axis represents the channel substrate position. The displacement area ratio is normalized by the displacement area of the partition wall 3 whose substrate position is the center. For the discharge channel C, the displacement area of one (outer) partition wall 3 is Δs1, and the displacement area of the other (inner) partition wall 3 is Δs2, and the average displacement area Δsm = (Δs1 + Δs2) / 2. As is clear from FIG. 11, the difference between the maximum value and the minimum value of the average displacement area Δsm is smaller than that of the conventional drive electrode of the present invention, and the variation in the average displacement area Δsm within the substrate is greatly increased. Reduce. For example, in the case of the ejection channel C located at both ends (−54 mm, +54 mm) of the substrate, the drive electrode 6 of the present invention improves the average displacement area Δsm of the partition wall 3 by about 36% compared to the conventional drive electrode.

In the present embodiment, each drive electrode 6 located in the central area Ac satisfies the expressions (3) and (4), and each drive electrode 6 located in the end area Ae is represented by the expressions (2) and (3). However, instead of this, the drive electrode 6 located in the central region Ac satisfies the equation (5) and the following equation (6), and the drive electrode 6 located in the end region Ae is represented by the equations (5) and (6). Even if (2) is satisfied, the same effect can be obtained.
Tci <(Tdei + Tdii) / 2 (6)
Expression (6) indicates that the depth Tci of the discharge channel drive electrode 6ci of the discharge channel C is equal to the depth Tdei of the outer dummy channel drive electrode 6dei of the two dummy channels D adjacent to the discharge channel C and the inner dummy channel. The driving electrode 6dii is made shallower than the average depth Tdii. This is the same as replacing the ejection channel C and the dummy channel D without changing the partition wall 3 and the drive electrode 6. Further, the drive electrode 6 of the present embodiment can be applied to the liquid jet heads 1 of the second and third embodiments.

  Note that when the distance from the substantially central point P to the end of the channel row CR is 1, the boundary between the central region Ac and the end region Ae is approximately 0 to 0.9 outside the point P. It is preferable to do. However, this range changes depending on the magnitude of the difference ΔT = Tce− (Tdee + Tdie) / 2 of the electrode depth in the end region Ae. Specifically, it varies depending on the thickness of the resin film installed on the upper end surface of the partition wall 3 before the oblique vapor deposition.

<Manufacturing method of liquid jet head>
The basic manufacturing method of the liquid jet head 1 according to the present invention includes a resin film pattern forming step S1, a groove forming step S2, and an electrode material deposition step S3. In the resin film pattern forming step S 1, a pattern of the resin film 7 is formed on the surface of the actuator substrate 2. In the groove forming step S <b> 2, a groove row MR in which the discharge grooves 4 and the non-discharge grooves 5 are alternately arranged is formed on the surface of the actuator substrate 2. In the electrode material deposition step S3, an electrode material is deposited on the surface of the actuator substrate 2 and the side surfaces of the ejection grooves 4 and the non-ejection grooves 5 by an oblique evaporation method. Here, the side closer to the end than the central point P of the groove row MR is the outside, the side of the point P is closer to the inner side than the end of the groove row MR, and the groove row MR is arranged in the arrangement direction between the central region Ac and the central region. The region is divided into three regions of end regions Ae located on both sides of Ac. Further, a partition region Rw is defined between the ejection groove 4 and the non-ejection groove 5. The resin film pattern forming step S1 includes the first resin pattern Rj1 that leaves the resin film 7 in the inner region of the partition wall region Rw and removes the resin film 7 from the outer region, and the partition wall region Rw. The second resin pattern Rj2 that leaves the resin film 7 in both the inner region and the outer region is alternately formed in the groove row MR direction. Thereby, the drive electrode 6 of the required depth, the common terminal 15a, and the individual terminal 15b can be formed simultaneously by two oblique vapor deposition methods. Further, it is possible to manufacture the liquid jet head 1 with improved recording quality by reducing the variation in the substrate of the displacement amount of both the partition walls 3 constituting the ejection channel C. This will be specifically described below.

(Sixth embodiment)
12-17 is explanatory drawing of the manufacturing method of the liquid jet head 1 which concerns on 6th embodiment of this invention. FIG. 12 is a process diagram of the method of manufacturing the liquid jet head 1 according to the sixth embodiment of the invention. FIG. 13 is a schematic partial top view of the actuator substrate 2. 14A is a partial top schematic view of the actuator substrate 2, and FIG. 14B is a partial cross-sectional schematic view of the actuator substrate 2 in the groove row MR direction. FIG. 15 is a partial cross-sectional schematic view of the actuator substrate 2 in the groove row MR direction. FIG. 16A is a schematic partial sectional view of the actuator substrate 2 in the groove row MR direction, and FIG. 16B is a schematic partial top view of the actuator substrate 2. FIG. 17 is a schematic longitudinal sectional view of the liquid ejecting head 1 in the direction of the ejection groove 4. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIGS. 12 and 13, in the resin film pattern forming step S <b> 1, a pattern of the resin film 7 is formed on the surface of the actuator substrate 2. Here, when the ejection grooves 4 and the non-ejection grooves 5 are formed on the surface of the actuator substrate 2, an area to be the partition 3 between the ejection grooves 4 and the non-ejection grooves 5 is defined as a partition area Rw. In the two end regions Ae, the first resin pattern Rj1 that leaves the resin film 7 in the inner (point P side) region of the partition wall region Rw and removes the resin film 7 from the outer (end side) region; The second resin pattern Rj2 that leaves the resin film 7 in both the inner region and the outer region of the partition wall region Rw is alternately formed in the arrangement direction of the groove rows MR. More specifically, the second resin pattern Rj2 is formed outside the ejection groove 4 and the first resin pattern Rj1 is formed inside the ejection groove 4 in the two end regions Ae. On the other hand, in the central region Ac, all the partition regions Rw are formed by the second resin pattern Rj2. Further, the resin film is removed from the region on the rear side of the ejection groove 4 and the region where the common terminal 15a is to be formed and the region where the individual terminal 15b on the rear side is to be formed.

Here, the actuator substrate 2 uses a piezoelectric material such as PZT ceramics or BaTiO ₃ ceramics. The actuator substrate 2 may be entirely made of a piezoelectric material, or a region where the partition wall 3 is formed may be a piezoelectric material, and the other region may be a non-piezoelectric material. The piezoelectric material of the actuator substrate 2 is previously polarized in the normal direction of the substrate surface. As the resin film 7, a photosensitive resin film, for example, a resist film is attached to the surface of the actuator substrate 2, and a pattern is formed by a photolithography process. The resin film 7 has a thickness in the range of 10 μm to 50 μm, for example. The position where Tdi = Dj + Tde is set in the central region, where Dj is the thickness of the resin film 7, Tdi is the depth of the drive electrode 6 inside the non-ejection groove 5, and Tde is the depth of the drive electrode 6 outside. It can be a boundary between Ac and the end region Ae.

  Next, as shown in FIGS. 12 and 14, in the groove forming step S <b> 2, a groove row MR in which the ejection grooves 4 and the non-ejection grooves 5 are alternately arranged on the surface of the actuator substrate 2 with the partition walls 3 interposed therebetween is formed. The discharge groove 4 is formed from a position serving as a front end face to a position before a position serving as a rear end face. The non-ejection groove 5 is formed straight from a position serving as a front end face to a position serving as a rear end face. The partition wall 3 in the end region Ae includes a second resin pattern Rj2 outside the discharge groove 4 and a first resin pattern Rj1 inside the discharge groove 4. All the partition walls 3 in the central region Ac include the second resin pattern Rj2. The discharge grooves 4 and the non-discharge grooves 5 can be formed by grinding using a dicing blade in which abrasive grains such as diamond are embedded in the outer periphery, for example. The ejection groove 4 and the non-ejection groove 5 can be formed to have the same groove width with a groove width of 20 μm to 100 μm and a groove depth of 100 μm to 400 μm. As shown in FIG. 14B, the pattern of the resin film 7 in the right end region Ae is a plane perpendicular to the groove row MR direction through the point P and the resin film 7 in the left end region Ae. Have a plane-symmetric shape.

  Next, as shown in FIGS. 12 and 15, in the electrode material deposition step S <b> 3, an electrode material is deposited on the surface of the actuator substrate 2 and the side surfaces of the ejection grooves 4 and the non-ejection grooves 5 by an oblique vapor deposition method. Form. The electrode material is deposited to a depth approximately half that of the ejection groove 4 or the non-ejection groove 5 at the point P in the central region Ac. As the electrode material, for example, a metal material such as Ti, Ni, Al, Au, Ag, Si, C, Pt, Ta, Sn, In, or a semiconductor material can be used. First, in the first oblique vapor deposition method, the first conductive material is formed from the upper right obliquely inclined at the angle θ in the groove row MR direction with respect to the normal line of the surface of the substantially central point P with respect to the groove row MR of the actuator substrate 2. Diagonal vapor deposition is performed. Next, in the second oblique vapor deposition method, the second oblique vapor deposition is performed by rotating 180 ° about the normal line of the substantially central point P of the groove row MR as a central axis. In FIG. 15, the second oblique deposition of the conductive material is performed from the upper left oblique direction inclined by the angle θ in the groove row MR direction with respect to the normal line. At this time, the deposition angle changes continuously according to the positions of the ejection grooves 4 and the non-ejection grooves 5 in the groove row MR, and the incident angle has a relationship of θ ′> θ> θ ″. As the position of the non-ejection groove 5 changes from the left to the right of the groove row MR, the depth of the electrode 8 on the left side surface of each groove gradually increases and the depth of the electrode 8 on the right side surface gradually decreases. The partition wall 3 on the inner side (point P side) of the discharge groove 4 in the end region Ae is provided with a first resin pattern Rj1 on the upper end surface, and the first resin pattern Rj1 has no resin film 7 on the discharge groove 4 side and is discharged. The depth of the electrode 8 deposited on the outer side surface of the groove 4 is deeper by the thickness of the resin film 7 than the depth of the electrode 8 deposited on the outer side surface of the adjacent non-ejection groove 5.

  Next, as shown in FIGS. 12 and 16, in the resin film removal step S4, the resin film 7 is removed, and at the same time, the conductive material (electrode 8) deposited on the upper surface of the resin film 7 is also removed (lift-off method). As a result, the electrodes 8 deposited on both side surfaces of the ejection grooves 4 and the non-ejection grooves 5 remain as drive electrodes 6, and the electrodes 8 deposited on the surface of the actuator substrate 2 remain as common terminals 15a and individual terminals 15b. Further, the electrode 8 remains on the upper end surface of the partition wall 3 on which the first resin pattern Rj1 is disposed on the discharge groove 4 side, and the electrode 8 is electrically connected to the common terminal 15a.

  Therefore, as described in the first embodiment, in the end region Ae, the depths of the drive electrodes 6 of the ejection grooves 4 and the non-ejection grooves 5 are the same as the depth Tce of the ejection channel outside drive electrodes 6ce of the ejection channels C. The outer dummy channel outer drive electrode 6dee of the two dummy channels D adjacent to the ejection channel C is deeper than the average depth of the depth Tdee of the inner dummy channel outer drive electrode 6die and the depth Tdie of the inner dummy channel outer drive electrode 6die, and satisfies Expression (3). In the end region Ae, the depth Tci of the ejection channel drive electrode 6ci of the ejection channel C is equal to the depth Tdei of the outer dummy channel drive electrode 6dei of the two dummy channels D adjacent to the ejection channel C and the inner dummy. It is substantially equal to the average depth of the depth Tdi of the in-channel drive electrode 6dii and satisfies the formula (2). Further, in the central region Ac, the depth of each drive electrode 6 satisfies the expressions (2) and (7).

  Further, the common terminal 15 a is electrically connected to the drive electrodes 6 located on both side surfaces of the ejection groove 4. As shown in FIG. 16B, the discharge channel drive electrode 6ci of the discharge groove 4 located in the end region Ae is continuous with the electrode 8 deposited on the upper end of the partition wall 3, and is electrically connected to the common terminal 15a. Since the connection is made, the wiring resistance is lowered. The individual terminal 15 b is electrically connected to the drive electrode 6 located on the side surface of the non-ejection groove 5 adjacent to the ejection groove 4 on the ejection groove 4 side. In the resin film removing step S4, the resin film 7 can be removed by grinding the surface of the actuator substrate 2. In this case, it is necessary to form the common terminal 15a and the individual terminal 15b after the resin film removing step S4.

  Next, as shown in FIGS. 12 and 17, in the cover plate joining step S <b> 5, the cover plate 10 is joined to the surface (upper surface US) of the actuator substrate 2. The cover plate 10 includes a liquid chamber 11 and a plurality of slits 12 penetrating from the bottom surface of the liquid chamber 11 to the actuator substrate 2 side. Each slit 12 communicates with the rear end of each ejection groove 4. Next, in the nozzle plate bonding step S <b> 6, the nozzle plate 13 is bonded to the actuator substrate 2 and the front end surface of the cover plate 10. The nozzle plate 13 includes a plurality of nozzles 14, and each nozzle 14 communicates with each ejection groove 4 that opens at the front end surface of the actuator substrate 2. A discharge channel C is constituted by the discharge groove 4, the cover plate 10, and the nozzle plate 13. The non-ejection groove 5 and the cover plate 10 constitute a dummy channel D. In this way, the liquid jet head 1 shown in FIG. 4 can be manufactured. Thereby, the variation in the deformation amount of both the partition walls 3 of the ejection channel C can be reduced, and the recording quality can be improved.

  In order to reduce the variation in deformation amount of both partition walls 3 of the discharge channel C, the depth of the electrode 8 deposited on the outer side surface of the discharge groove 4 and the electrode 8 deposited on the outer side surface of the adjacent non-discharge groove 5 are reduced. It is desirable to make the difference from the depth of the constant. According to the manufacturing method of this embodiment, the difference in depth can be controlled by a resin film having a uniform film thickness. As a result, a liquid ejecting head with high recording quality can be realized easily and stably.

  In the resin film pattern forming step S1, in the central region Ac, if the second resin pattern Rj2 is formed outside the ejection groove 4 and the first resin pattern Rj1 is formed inside the ejection groove 4, the fourth embodiment will be described. The liquid jet head 1 can be produced. That is, in the central region Ac, as in the end region Ae, it is possible to manufacture the liquid jet head 1 in which each drive electrode 6 satisfies the expressions (2) and (3).

  Further, in the case of the fourth embodiment, in the central region Ac, both the partition walls 3 of the ejection grooves 4 or the non-ejection grooves 5 corresponding to the substantially central point P are the first resin patterns on both the inner side and the outer side. Even if Rj1 is formed, the second resin pattern Rj2 may be formed both inside and outside. That is, in the present invention, the discharge groove 4 and the non-discharge groove 5 are defined as “outside” and “inside” with the substantially central point P as a reference, but the discharge groove 4 or non-corresponding to the substantially central point P is defined. The ejection grooves 5 are exceptionally distinguished from other ejection grooves 4 or other non-ejection grooves 5 as ejection grooves 4 or non-ejection grooves 5 positioned in the middle of the groove row MR. Can be handled selectively.

  The resin film pattern forming step S1 is a third resin pattern in which the resin film 7 is removed from the inner region of the partition wall region Rw and the resin film 7 is left in the outer region outside the ejection groove 4 in the central region Ac. Rj3 is formed, and the first resin pattern Rj1 is formed inside the ejection groove 4. Thereby, the liquid jet head 1 of the fifth embodiment can be manufactured. That is, in the central region Ac, each drive electrode 6 satisfies the expressions (3) and (4), and in the end region Ae, each drive electrode 6 satisfies the expressions (2) and (3).

  In the resin film pattern forming step S1, the second resin pattern Rj2 may be formed outside the non-ejection groove 5 and the first resin pattern Rj1 may be formed inside the non-ejection groove 5 in the end region Ae. . In this case, it is the same as replacing each drive electrode 6 of the ejection groove 4 (ejection channel C) and each drive electrode 6 of the non-ejection groove 5 (dummy channel D) of the sixth embodiment. The same effects as those of the liquid jet head 1 can be obtained.

  In the resin film pattern forming step S1, the second resin pattern Rj2 is formed outside the non-ejection groove 5 and the first resin pattern Rj1 is formed inside the non-ejection groove 5 in the central region Ac and the end region Ae. May be. In this case, it is the same as replacing each drive electrode 6 of the ejection channel C and each drive electrode 6 of the dummy channel D of the fourth embodiment, and the same effect as the liquid jet head 1 of the fourth embodiment is obtained. be able to.

  In the resin film pattern forming step S1, in the end region Ae, the second resin pattern Rj2 is formed outside the non-ejection groove 5, the first resin pattern Rj1 is formed inside the non-ejection groove 5, and the center In the region Ac, the third resin pattern Rj3 may be formed outside the non-ejection groove 5 and the first resin pattern Rj1 may be formed inside the non-ejection groove 5. In this case, it is the same as replacing each drive electrode 6 of the discharge channel C and each drive electrode 6 of the dummy channel D of the liquid jet head 1 of the fifth embodiment, and with the liquid jet head 1 of the fifth embodiment. Similar effects can be obtained. Further, instead of the edge shoot type liquid jet head 1, the side shoot type liquid jet head 1 of the third embodiment can be manufactured by the manufacturing method of the present embodiment.

(Seventh embodiment)
18 to 20 are explanatory diagrams of the method of manufacturing the liquid jet head 1 according to the seventh embodiment of the invention. FIG. 18 is a process diagram of the method of manufacturing the liquid jet head 1 according to the seventh embodiment of the present invention. FIG. 19 is a partial top schematic view of the actuator substrate 2. FIG. 20 is a schematic partial sectional view of the actuator substrate 2. The difference from the sixth embodiment is that the first to third resin patterns Rj1, Rj2, and Rj3 are not formed in the resin film pattern forming step S1, and the conductive material is deposited by four oblique vapor depositions in the electrode material deposition step S3. Is a point. Hereinafter, differences from the sixth embodiment will be described. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIGS. 18 and 19, in the resin film pattern forming step S <b> 1, a pattern of the resin film 7 is formed on the surface of the actuator substrate 2. Here, the resin film 7 is removed from the region where the common terminal 15 a and the individual terminal 15 b are formed, and the resin film 7 is left in the region where the ejection groove 4 and the non-ejection groove 5 are formed. Next, in the groove forming step S2, a groove row MR in which the ejection grooves 4 and the non-ejection grooves 5 are alternately arranged on the surface of the actuator substrate 2 with the partition walls 3 interposed therebetween is formed. Specifically, since it is similar to the groove forming step S2 of the sixth embodiment, description thereof is omitted.

  Next, as shown in FIG. 18 and FIG. 20A, in the first electrode material deposition step S31, the electrode material is formed on the surface of the actuator substrate 2 and the side surfaces of the ejection grooves 4 and the non-ejection grooves 5 by oblique vapor deposition. To deposit. First, in the first oblique deposition, the conductive material is obliquely deposited from the upper right side inclined at an angle θ in the direction of the groove row MR with respect to the normal line of the substantially central point P of the groove row MR of the actuator substrate 2 (electrodes). The incident angle θ of the material. Next, in the second oblique deposition, oblique deposition is performed by rotating the actuator substrate 2 by 180 ° about the normal line of the substantially central point P of the groove row MR. In FIG. 20 (a), the conductive material is obliquely deposited from the upper left obliquely inclined by the angle θ in the groove row MR direction with respect to the normal (incident angle θ of the electrode material). At this time, the incident angle changes continuously according to the positions of the ejection grooves 4 and the non-ejection grooves 5 in the groove row MR, and the incidence angle has a relationship of θ ′> θ> θ ″. As the position of the non-ejection groove 5 changes from the left to the right of the groove row MR, the depth of the electrode 8 on the left side surface of each groove gradually increases and the depth of the electrode 8 on the right side surface gradually decreases.

  Next, as shown in FIGS. 18 and 20B, in the second electrode material deposition step S32, a mask 17 is placed on the surface of the actuator substrate 2 and a conductive material is deposited by oblique vapor deposition. Here, the end side of the substantially central point P of the groove row MR is on the outer side, the point P side is on the inner side of the groove row MR, and the groove row MR is on both sides of the central region Ac and the central region Ac. Is divided into three regions of the end region Ae. Then, in the second electrode material deposition step S32, a mask 17 that shields either the non-ejection groove 5 or the ejection groove 4 included in the end region Ae is installed, and the side surface of the ejection groove 4 or the non-ejection groove 5 An electrode material is deposited by oblique evaporation.

  Specifically, in the second electrode material deposition step S32, the ejection grooves 4 and the non-ejection grooves 5 included in the central region Ac and the right end region Ae, and the non-ejection grooves included in the left end region Ae. 5 is shielded by a mask 17, and a conductive material is deposited on the outer side surface of the ejection groove 4 included in the left end region Ae by the third oblique deposition. In the third oblique deposition method, the conductive material is obliquely deposited from the upper right side inclined by the angle φ in the groove row MR direction with respect to the normal of the surface of the actuator substrate 2 (incident angle φ of the electrode material).

  Next, the ejection grooves 4 and non-ejection grooves 5 included in the central area Ac and the left end area Ae, and the non-ejection grooves 5 included in the right end area Ae are shielded by the mask 17, and the right end section A conductive material is deposited on the outer side surface of the ejection groove 4 included in the region Ae by the fourth oblique deposition. In the fourth oblique vapor deposition method, after the third oblique vapor deposition method is completed, the actuator substrate 2 is rotated by 180 ° with the normal direction of the point P as the central axis, and the fourth oblique vapor deposition is performed. In FIG. 20B, the conductive material is deposited from the upper left obliquely inclined with the incident angle φ in the direction of the groove row MR with respect to the normal line (incident angle φ of the electrode material). Here, the incident angle φ with respect to the normal of the surface of the actuator substrate 2 in the second electrode material deposition step S32 is smaller than the angle θ ′ with respect to the normal of the surface of the actuator substrate 2 in the first electrode material deposition step S31. (Φ <θ ′). Therefore, the depth of the electrode 8 deposited on the side surface becomes deeper. By appropriately setting the incident angles θ ′ and φ in the oblique deposition method, as described in the liquid ejecting head 1 of the first embodiment, in the two end regions Ae, the expressions (1) and (2) And each drive electrode 6 which satisfy | fills the relationship of Formula (3) can be created.

  Next, as shown in FIGS. 18 and 20C, in the resin film removing step S4, the resin film 7 is removed, and at the same time, the conductive material deposited on the upper surface of the resin film 7 is also removed. As a result, the electrode 8 remains as the drive electrode 6 on both surfaces of the ejection groove 4 and the non-ejection groove 5, and the electrode 8 on the upper surface US of the actuator substrate 2 remains as the common terminal 15a and the individual terminal 15b. Hereinafter, the cover plate joining step S5 and the nozzle plate adhering step S6 are the same as those in the sixth embodiment, and thus description thereof is omitted.

  Note that, in the second electrode material deposition step S32, the mask 17 is used for the ejection grooves 4 and the non-ejection grooves 5 included in the central area Ac and the right end area Ae, and the ejection grooves 4 included in the left end area Ae. The conductive material is deposited on the outer side surface of the non-ejection groove 5 included in the left end region Ae by the third oblique deposition. Next, the actuator substrate 2 is rotated by 180 ° about the normal of the point P as the central axis, and a conductive material is deposited by the fourth oblique vapor deposition. Thereby, each drive electrode 6 included in the end region Ae satisfies the relationship of the expressions (2) and (5), and the same effect as the liquid jet head 1 of the first embodiment can be obtained.

  Further, in the second electrode material deposition step S32, either the non-ejection groove 5 or the ejection groove 4 included on one outer side than the point P is shielded, and the ejection groove included on the other outer side than the point P. 4 and a mask 17 that shields the non-ejection grooves 5 are installed, and an electrode material is deposited by the third oblique deposition. Next, the actuator substrate 2 is rotated by 180 ° about the normal line of the point P as the central axis, and the electrode material is deposited by the fourth oblique vapor deposition. Thereby, each drive electrode 6 located outside the point P satisfies the relationship of Expression (2) and Expression (3) or Expression (5) and Expression (2), and the liquid jet head according to the fourth embodiment. 1 can be obtained.

  Further, in the second electrode material deposition step S32, either the non-ejection groove 5 or the ejection groove 4 included in one end region Ae and the central region Ac is shielded and included in the other end region Ae. A mask 17 that shields the ejection grooves 4 and the non-ejection grooves 5 is provided, and an electrode material is deposited by the third oblique deposition. Next, the actuator substrate 2 is rotated by 180 ° about the normal line of the point P as the central axis, and the electrode material is deposited by the fourth oblique vapor deposition. Thereby, each drive electrode 6 located in the edge part area | region Ae satisfy | fills Formula (2) and Formula (3), and each drive electrode 6 located in center area | region Ac satisfy | fills Formula (3) and Formula (4). Or each drive electrode 6 located in the edge part area | region Ae satisfy | fills Formula (2) and Formula (5), and each drive electrode 6 located in center area | region Ac satisfy | fills Formula (5) and Formula (6). Therefore, the same effect as the liquid jet head 1 of the fifth embodiment can be obtained.

  In the present invention, the substantially central point P is described so as to correspond to the ejection groove 4. However, the present invention is not limited to this description, and the substantially central point P may correspond to the non-ejection groove 5. In addition, the exact center position in the arrangement direction of the groove row MR including a plurality of grooves may correspond to the ejection grooves 4 or the non-ejection grooves 5, or may correspond to the partition walls 3. When the center position corresponds to the partition wall 3, the discharge groove 4 or the non-discharge groove 5 positioned around the partition wall 3 is handled as a groove corresponding to the substantially central point P.

<Liquid jetting device>
(Eighth embodiment)
FIG. 21 is a schematic perspective view of a liquid ejecting apparatus 30 according to the eighth embodiment of the present invention. The liquid ejecting apparatus 30 includes a moving mechanism 40 that reciprocates the liquid ejecting heads 1 and 1 ′, and a flow path unit that supplies the liquid to the liquid ejecting heads 1 and 1 ′ and discharges the liquid from the liquid ejecting heads 1 and 1 ′. 35, 35 ′, liquid pumps 33, 33 ′ and liquid tanks 34, 34 ′ communicating with the flow path portions 35, 35 ′. Each of the liquid jet heads 1, 1 ′ uses any of the first to seventh embodiments already described.

  The liquid ejecting apparatus 30 includes a pair of conveying units 41 and 42 that convey a recording medium 44 such as paper in the main scanning direction, liquid ejecting heads 1 and 1 ′ that eject liquid onto the recording medium 44, and a liquid ejecting head. 1, 1 ′ carriage unit 43, liquid tanks 34, 34 ′ and liquid pumps 33, 33 ′ that supply the liquid stored in the liquid tanks 34, 34 ′ to the flow path portions 35, 35 ′, the liquid jet head 1, And a moving mechanism 40 that scans 1 ′ in the sub-scanning direction orthogonal to the main scanning direction. A control unit (not shown) controls and drives the liquid ejecting heads 1, 1 ′, the moving mechanism 40, and the conveying units 41 and 42.

  The pair of conveying means 41 and 42 includes a grid roller and a pinch roller that extend in the sub-scanning direction and rotate while contacting the roller surface. The recording medium 44 sandwiched between the rollers is rotated in the main scanning direction by rotating the grid roller and the pinch roller around the axis by a motor (not shown). The moving mechanism 40 couples a pair of guide rails 36 and 37 extending in the sub-scanning direction, a carriage unit 43 slidable along the pair of guide rails 36 and 37, and the carriage unit 43 to move in the sub-scanning direction. An endless belt 38 is provided, and a motor 39 that rotates the endless belt 38 via a pulley (not shown) is provided.

  The carriage unit 43 mounts a plurality of liquid jet heads 1, 1 ′, and ejects, for example, four types of liquid droplets of yellow, magenta, cyan, and black. The liquid tanks 34 and 34 'store liquids of corresponding colors and supply them to the liquid jet heads 1 and 1' via the liquid pumps 33 and 33 'and the flow path portions 35 and 35'. Each liquid ejecting head 1, 1 ′ ejects droplets of each color according to the drive signal. An arbitrary pattern is recorded on the recording medium 44 by controlling the timing at which liquid is ejected from the liquid ejecting heads 1, 1 ′, the rotation of the motor 39 that drives the carriage unit 43, and the conveyance speed of the recording medium 44. I can.

  In this embodiment, the moving mechanism 40 moves the carriage unit 43 and the recording medium 44 to perform recording, but instead, the carriage unit is fixed and the moving mechanism is the recording medium. May be a liquid ejecting apparatus that moves and records two-dimensionally. That is, the moving mechanism may be any mechanism that relatively moves the liquid ejecting head and the recording medium.

DESCRIPTION OF SYMBOLS 1 Liquid ejecting head 2 Actuator board | substrate 3 Partition wall 4 Discharge groove 5 Non-discharge groove 6 Drive electrode, 6ce Discharge channel outside drive electrode, 6ci Discharge channel inside drive electrode, 6dee outside dummy channel outside drive electrode, 6dei outside dummy channel inside drive electrode, 6die inner dummy channel drive electrode, 6di inner dummy channel drive electrode 7 resin film 8 electrode 10 cover plate, 11, 11a, 11b liquid chamber, 12, 12a, 12b slit 13 nozzle plate, 14 nozzle 15a common terminal, 15b individually Terminal 17 Mask C Discharge channel, D dummy channel, CR channel row Pa First substrate, Pb Second substrate Rw Partition region, Rj1 First resin pattern, Rj2 Second resin pattern, Rj3 Third resin pattern, CR channel row, MR Groove row US , LS bottom surface Ac center region, Ae end region, P point

Claims (20)

A discharge channel and a dummy channel that are alternately arranged across a partition wall to form a channel row;
A drive electrode that is a side surface of the partition wall and is positioned in a depth direction from an upper end of the partition wall;
The channel row is located on the outer side, the point P side is located on the inner side from the end of the channel row, and the channel row is located on both sides of the central region. A liquid jet head in which the drive electrode in the end region satisfies the following expressions (1) and (2) when divided into three regions of the end region.
Tce ≠ (Tdee + Tdie) / 2 (1)
Tci≈ (Tdei + Tdii) / 2 (2)
Tce: Depth of the drive electrode positioned on the outer side surface of the discharge channel Tci: Depth of the drive electrode positioned on the inner side surface of the discharge channel Tdee: The depth adjacent to the outer side of the discharge channel Depth Tdei of the drive electrode positioned on the outer side surface of the dummy channel: Depth Tdie of the drive electrode positioned on the inner side surface of the dummy channel adjacent to the outer side of the discharge channel: Depth Tdi of the driving electrode positioned on the outer side surface of the dummy channel adjacent to the inner side: Depth of the driving electrode positioned on the inner side surface of the dummy channel adjacent to the inner side of the ejection channel The liquid ejecting head according to claim 1, wherein the driving electrode in the end region satisfies the following expression (3).
Tce> (Tdee + Tdie) / 2 (3)   The liquid ejecting head according to claim 2, wherein the driving electrode located outside the point P in the central region satisfies the formula (3). The liquid ejecting head according to claim 2, wherein the driving electrode in the central region satisfies the formula (3) and the following formula (4).
Tci> (Tdei + Tdii) / 2 (4) The liquid ejecting head according to claim 1, wherein the driving electrode in the end region satisfies the following formula (5).
Tce <(Tdee + Tdie) / 2 (5)   6. The liquid ejecting head according to claim 5, wherein the driving electrode located outside the point P in the central region satisfies the formula (5). The liquid ejecting head according to claim 5, wherein the driving electrode in the central region satisfies the formula (5) and the following formula (6).
Tci <(Tdei + Tdii) / 2 (6) The depth of the drive electrode on the side surface located on the one end side of the channel row in the dummy channel is changed as the position of the dummy channel changes from one end portion to the other end portion of the channel row. Gradually deepen,
In the dummy channel, the depth of the drive electrode on the side surface located on the other end side of the channel row is changed as the position of the dummy channel changes from one end portion to the other end portion of the channel row. The liquid jet head according to claim 2, wherein the liquid jet head gradually becomes shallower. The depth of the drive electrode on the side surface located on one end side of the channel row in the discharge channel is such that the discharge channel is located from one end side to the other end side of the channel row. As you go deeper,
In the ejection channel, the depth of the drive electrode on the side surface located on the other end side of the channel row is such that the ejection channel is located from one end side to the other end side of the channel row. The liquid jet head according to any one of claims 5 to 7, wherein the liquid jet head gradually becomes shallower as it goes. A liquid ejecting head according to claim 1;
A moving mechanism for relatively moving the liquid ejecting head and the recording medium;
A liquid supply pipe for supplying a liquid to the liquid ejecting head;
And a liquid tank that supplies the liquid to the liquid supply pipe. A resin film pattern forming step of forming a resin film pattern on the surface of the actuator substrate;
A groove forming step of forming a groove row in which discharge grooves and non-discharge grooves are alternately arranged on the surface of the actuator substrate;
An electrode material deposition step of depositing an electrode material by oblique vapor deposition on a surface of the actuator substrate and side surfaces of the ejection grooves and the non-ejection grooves,
The side of the end portion from the substantially central point P of the groove row is the outer side, the side of the point P is the inner side of the end portion of the groove row, and the groove row is arranged in the center region and both sides of the central region in the arrangement direction. Is divided into three regions of the end region located in the region, the partition between the discharge groove and the non-discharge groove,
The resin film pattern forming step includes
In the end region, a first resin pattern that leaves the resin film in the inner region of the partition region and removes the resin film from the outer region, and the inner region and the outer portion of the partition region A method of manufacturing a liquid ejecting head, wherein the second resin pattern that leaves the resin film in any of the regions is alternately formed.   The said resin film pattern formation process forms the said 2nd resin pattern in the said outer side of the said discharge groove in the said edge part area | region, and forms the said 1st resin pattern in the said inner side of the said discharge groove. Manufacturing method of the liquid jet head of the present invention.   The said resin film pattern formation process forms the said 2nd resin pattern in the said outer side of the said discharge groove in the said center area | region, and forms the said 1st resin pattern in the said inner side of the said discharge groove. A method of manufacturing the liquid jet head according to claim.   The resin film pattern forming step includes removing a resin film from the inner region of the partition wall and leaving the resin film in the outer region on the outer side of the discharge groove in the central region. The method of manufacturing a liquid jet head according to claim 11, wherein a pattern is formed, and the first resin pattern is formed on the inner side of the ejection groove.   The said resin film pattern formation process forms the said 2nd resin pattern in the said outer side of the said non-ejection groove in the said edge part area | region, and forms the said 1st resin pattern in the said inner side of the said non-ejection groove. A manufacturing method of the liquid jet head according to the above.   The said resin film pattern formation process forms the said 2nd resin pattern in the said outer side of the said non-ejection groove | channel in the said center area | region, and forms the said 1st resin pattern in the said inner side of the said non-ejection groove | channel. 15. A method for manufacturing a liquid jet head according to 15.   The resin film pattern forming step includes a step of removing the resin film from the inner region of the partition region and leaving the resin film in the outer region outside the non-ejection groove in the central region. The method of manufacturing a liquid jet head according to claim 11, wherein a resin pattern is formed, and the first resin pattern is formed on the inner side of the non-ejection groove. The groove forming step is a step of forming the discharge groove from one end of the actuator substrate to the front of the other end,
A cover plate joining step for joining a cover plate to the surface of the actuator substrate;
The method of manufacturing a liquid jet head according to claim 11, further comprising a nozzle plate bonding step of bonding a nozzle plate to an end face of the actuator substrate. The groove forming step is a step of forming the discharge groove from the front of one end of the actuator substrate to the front of the other end,
A cover plate joining step for joining a cover plate to the surface of the actuator substrate;
The method of manufacturing a liquid jet head according to claim 11, further comprising: a nozzle plate bonding step of bonding a nozzle plate to a back surface of the actuator substrate. A groove forming step of forming a groove row in which discharge grooves and non-discharge grooves are alternately arranged on the surface of the actuator substrate;
A first electrode material deposition step of depositing an electrode material by oblique vapor deposition on the surface of the actuator substrate and the side surfaces of the ejection grooves and the non-ejection grooves;
The groove row is located on both sides of the central region and the central region, with the end side from the substantially central point P of the groove row being the outer side, the point P side being the inner side than the end portion of the groove row. A mask that shields either the non-ejection groove or the ejection groove included in the end area when being divided into three areas of the end area is provided, and a side surface of the ejection groove or the non-ejection groove And a second electrode material deposition step of depositing an electrode material by an oblique evaporation method,
The incident angle of the electrode material with respect to the normal of the surface of the actuator substrate in the second electrode material deposition step is the incident angle of the electrode material with respect to the normal of the surface of the actuator substrate in the first electrode material deposition step. A method of manufacturing a smaller liquid jet head.

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