JP6386405B2 - Ink jet head substrate and method for manufacturing ink jet head - Google Patents

Description

Embodiments of the present invention relates to the production how the ink jet head substrate and the ink jet head.

  2. Description of the Related Art There is known an inkjet head that ejects ink from nozzle holes by applying pressure to a pressure chamber provided in an ink circulation path. This type of inkjet head includes an inkjet head substrate on which an actuator (pressure chamber wall) that applies pressure to the pressure chamber is disposed. A wiring pattern that connects the actuator and a drive circuit that drives the actuator is formed on the inkjet head substrate.

  The wiring pattern may be plated to improve electrical conductivity. In addition to the wiring pattern, an electrode pattern for electrolytic plating is also provided on the inkjet head substrate.

  The electrode pattern is usually formed by etching. When an electrode pattern is formed by etching, it is necessary to peel off the resist pattern from the surface of the electrode pattern using a stripping solution after the etching.

  The electrode pattern for electrolytic plating is often a solid pattern so that terminals can be easily connected. In many cases, the electrode pattern for electrolytic plating has a higher density than the wiring pattern. A high-density electrode pattern takes a long time for the permeation of the stripping solution, and therefore requires a long time for stripping the resist pattern. The increase in manufacturing time increases the manufacturing cost of the inkjet head.

JP 2014-83766 A

  The problem to be solved by the present invention is to reduce the manufacturing cost of an inkjet head substrate, an inkjet head, and a printer.

  The inkjet head substrate according to the embodiment includes a base substrate on which an actuator is disposed, a wiring pattern formed on the base substrate and connected to an electrode of the actuator, and formed on the base substrate and connected to the wiring pattern. An electrode pattern for electroplating in the form of a punched pattern.

It is a perspective view of the inkjet head of this embodiment. It is a development perspective view of an ink-jet head. (A) The top view of an inkjet head board | substrate, (B) is the elements on larger scale of an inkjet head board | substrate. It is the elements on larger scale of a drive unit. (A) is a figure which shows the actuator before a deformation | transformation, (B) is a figure which shows the actuator after a deformation | transformation. It is the elements on larger scale of the electrode pattern for electrolytic plating. (A) is a perspective view of the inkjet head from which the nozzle plate has been removed, and (B) is a plan view of the inkjet head from which the nozzle plate has been removed. It is sectional drawing of an inkjet head. It is a flowchart which shows the manufacturing method of an inkjet head. It is a perspective view of the inkjet head by which the electrode pattern formation part for electrolytic plating was cut | disconnected. It is a top view of the inkjet head board | substrate by which the electrode pattern formation part for electrolytic plating was cut | disconnected. It is a top view of the inkjet head board | substrate with which the electrode pattern for electrolytic plating became a solid pattern. It is a figure which shows the modification of the electrode pattern for electrolytic plating. It is a figure which shows the modification of the electrode pattern for electrolytic plating. It is a figure which shows the modification of an inkjet head board | substrate. It is a figure which shows a printer provided with the inkjet head of this embodiment.

  Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the drawings, the same or equivalent parts are denoted by the same reference numerals.

  FIG. 1 is a perspective view showing an inkjet head 10 of the present embodiment. The ink jet head 10 of this embodiment is a side shooter type ink jet head of a share mode shared wall. In the following description, an orthogonal coordinate system including the X axis, the Y axis, and the Z axis is used. In the figure, the direction indicated by the arrow is the plus direction. In the following description, the plus direction of the Z-axis is upward and the opposite direction is downward.

  FIG. 2 is a developed perspective view of the inkjet head 10. The ink jet head 10 includes an ink jet head substrate 20, a frame 30, and a nozzle plate 40.

FIG. 3A is a plan view of the inkjet head substrate 20. The inkjet head substrate 20 includes a base substrate 21 and two drive units 50 (a drive unit 50 ₁ and a drive unit 50 ₂ ) disposed on the base substrate 21.

The base substrate 21 is a substrate on which the actuator is arranged. In the present embodiment, the actuator is a part of the drive unit 50 and is disposed on the base substrate 21 via the drive unit 50. The base substrate 21 is a rectangular plate body whose longitudinal direction is the X-axis direction. The base substrate 21 is made of a ceramic such as alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC), or barium titanate (BaTiO ₃ ). .

A plurality of openings 22 are formed in a line along the X-axis direction at the center of the base substrate 21 in the Y-axis direction. Further, the Y-axis minus direction side of the opening 22 has a plurality of openings 23 ₁ in a row along the X-axis direction is formed. Further, the Y-axis plus direction side of the opening 22 has a plurality of openings 23 ₂ in a row along the X-axis direction is formed. In the present embodiment, the inner diameter of the opening 22 is slightly larger than the inner diameter of the opening 23 (the opening 23 ₁ and the opening 23 ₂ ). An ink circulation system is connected to the openings 22 and 23. The opening 22 functions as an ink inlet, and the opening 23 functions as an ink outlet.

Two drive units 50 (drive unit 50 ₁ and drive unit 50 ₂ ) are arranged on the upper surface of the base substrate 21. Drive unit 50 ₁ is disposed between the opening 22 and the opening 23 _1, the drive unit 50 ₂ is disposed between the opening 22 and the opening 23 _2.

  FIG. 4 is a partially enlarged view of the drive unit 50. The drive unit 50 includes a base material 51 bonded to the upper surface of the base substrate 21, a plurality of piezoelectric bodies 52 supported by the base material 51, and an electrode pattern 53.

  The base material 51 is an elongated member whose longitudinal direction is the X-axis direction. The base material 51 is made of, for example, a piezoelectric material mainly composed of lead zirconate titanate. A protrusion 51 a that protrudes upward is formed on the upper surface of the base material 51. The protrusions 51a are formed at equal intervals along the X axis. The lower surface of the base material 51 is bonded to the upper surface of the base substrate 21.

  The piezoelectric body 52 is a piezoelectric member having a trapezoidal ZY section. The piezoelectric body 52 is made of a piezoelectric material. For example, the piezoelectric body 52 is composed of a piezoelectric element whose main component is lead zirconate titanate. The lower surface of the piezoelectric body 52 is bonded to the upper surface of the protruding portion 51a.

  The piezoelectric body 52 and the protrusion 51a are a part of the actuator (pressure chamber wall) 50a. The actuator 50a includes a piezoelectric body 52, a protruding portion 51a, and an electrode 53a. The electrode 53a is a part of the electrode pattern 53, and is disposed on both surfaces of the piezoelectric body 52 and the protruding portion 51a in the X-axis direction (hereinafter referred to as electrode surfaces). The actuators 50a are arranged in a row in the X-axis direction so that the electrode surfaces face each other. As described above, both the piezoelectric body 52 and the protruding portion 51a are made of a piezoelectric material. The polarization directions of the piezoelectric body 52 and the protruding portion 51a are parallel to the Z axis, and the polarity of the piezoelectric body 52 and the polarity of the protruding portion 51a are reversed.

  In the present embodiment, the pressure chamber S is between the actuator 50a and the actuator 50a. On the inner wall surface of each pressure chamber S, an electrode pattern 53 is formed. The electrode pattern 53 is composed of a metal film such as a nickel film. The surface of the electrode pattern 53 is plated with gold or the like. A part of the electrode pattern 53 extends to the base substrate 21. The end of the extended portion is connected to the wiring pattern 24 formed on the base substrate 21. A drive circuit (for example, a driver IC) (not shown) is connected to the electrode pattern 53 via the wiring pattern 24.

One electrode pattern 53 is arranged in one pressure chamber S. By selectively applying a voltage to each electrode pattern 53, the actuator 50a that is linear as shown in FIG. 5A can be bent as shown in FIG. 5B. . When the pressure chamber wall a is bent, the pressure in the pressure chamber S increases and ink is ejected from the nozzle holes 41. The configuration of the drive unit 50 described above is merely an example. The drive unit 50 can have various known configurations. On the upper surface of the base substrate 21, as shown in FIG. 3A, a wiring pattern 24 (wiring pattern 24 ₁ and wiring pattern 24 ₂ ), and Electrolytic plating electrode patterns 25 (electrolytic plating electrode patterns 25 ₁ and electrolytic plating electrode patterns 25 ₂ ) are formed.

  The wiring pattern 24 is an electrode pattern for connecting the actuator 50a and a drive circuit (not shown) that drives the actuator 50a (for example, a driver IC). The wiring pattern 24 is composed of a metal film such as a nickel film. The surface of the wiring pattern 24 is plated with gold or the like. One wiring pattern 24 is arranged in one pressure chamber S. As shown in FIG. 3B, one end of the wiring pattern 24 is connected to the electrode pattern 53 and the other end is connected to the electrode pattern 25 for electrolytic plating.

  The electrode pattern 25 for electrolytic plating is an electrode pattern used for supplying current to the wiring pattern 24 and the electrode pattern 53 when electrolytic plating is performed on the wiring pattern 24 and the electrode pattern 53. As shown in FIG. 3A, the electrolytic plating electrode patterns 25 are disposed on both ends of the upper surface of the base substrate 21 in the Y-axis direction. In the present embodiment, the electrode pattern 25 for electroplating is a blank pattern as shown in FIG. A blank pattern is a pattern in which non-electrode regions are uniformly arranged in the pattern.

  FIG. 6 is an enlarged view of the electrode pattern 25 for electrolytic plating. In the present embodiment, the electrode pattern 25 for electrolytic plating is a mesh pattern. The mesh pattern is a pattern in which electrodes are arranged in a mesh shape. In other words, the mesh pattern is a pattern in which dot-like non-electrode regions (hereinafter referred to as “blanking regions B”) are arranged in a matrix in the electrodes. The electrode pattern 25 for electrolytic plating is configured such that the distance d from the non-electrode region to the deepest portion P of the electrode is not more than a preset distance. The deepest portion P is a portion (point) having the longest shortest distance to the non-electrode region (or substrate edge) in the electrode region of the electrode pattern 25 for electrolytic plating. As an example, the distance d is 100 μm to 3 mm.

  In the present embodiment, the widths W1 and W2 of the vertical and horizontal conductor lines (hereinafter simply referred to as lines) of the mesh constituting the electrode pattern 25 for electroplating are the widths of the largest lines of the wiring pattern 24. It is equal to W3. There is no significant difference between the time that the resist pattern on the wiring pattern 24 is peeled off and the time that the resist pattern on the electrode pattern for electrolytic plating 25 is peeled off. In addition, even if there is a slight difference in width, it can be regarded as the same width. For example, a difference of about plus or minus 10% can be regarded as the same width. When the width W3 is 1, the widths W1 and W2 are 0.9 to 1.1. Note that the vertical and horizontal widths W4 and W5 of the extraction region B are also equal to the width W3. For example, when the width W3 is 1, the widths W4 and W5 are 0.9 to 1.1.

  Returning to FIG. 2, the frame 30 is a frame-like body whose longitudinal direction is the X-axis direction. The frame 30 is made of, for example, ceramic. The frame 30 is slightly smaller than the base substrate 21.

  The frame 30 is bonded to the upper surface of the base substrate 21 as shown in FIG. An opening 31 is formed in the center of the frame 30. As shown in FIG. 7B, the frame 30 is bonded so that the opening 23 of the base substrate 21 is located in the opening 31 of the frame 30.

  Returning to FIG. 2, the nozzle plate 40 is a rectangular sheet whose longitudinal direction is the X-axis direction. The nozzle plate 40 is made of a resin film such as a polyimide film. The size of the nozzle plate 40 on the XY plane is the same as the size of the frame 30 on the XY plane.

The nozzle plate 40, as shown in FIG. 2, circular nozzle holes 41 ₁ are formed at equal intervals along the X-axis. Further, the Y-axis plus direction side of the nozzle hole 41 _1, the circular nozzle hole 41 ₂ is formed at equal intervals along the X-axis. The arrangement pitch of the nozzle holes 41 (nozzle holes 41 ₁ and 41 ₂ ) is the same as the arrangement pitch of the actuator 50a in the X-axis direction.

  As shown in FIG. 1, the nozzle plate 40 is bonded to the upper surface of the frame 30 and the upper end surface of the actuator 50a. As can be seen from FIG. 5A, when the nozzle plate 40 is bonded to the frame 30, the nozzle holes 41 are located above the pressure chambers S, respectively.

  FIG. 8 is a cross-sectional view of the inkjet head 10 shown in FIG. When the inkjet head substrate 20, the frame 30, and the nozzle plate 40 are integrated, the upper side of the pressure chamber S is closed by the nozzle plate 40. An ink flow path is formed between the openings 22 and 23 and the pressure chamber S. As indicated by the solid arrow, the ink that has flowed from the opening 22 passes through the pressure chamber S and flows out from the opening 23 of the inkjet head substrate 20.

  By selectively applying a voltage to the electrode pattern 53 while the ink is circulating, the actuator 50a is deformed from the state shown in FIG. 5A to the state shown in FIG. . Ink is ejected from the nozzle holes 41 as indicated by the white arrows in FIG.

  Next, a method for manufacturing the inkjet head 10 will be described. FIG. 9 is a flowchart showing the manufacturing process of the inkjet head 10.

  First, a manufacturer of the inkjet head 10 (hereinafter simply referred to as a manufacturer) forms the base substrate 21 by machining a plate-like body made of the same material as the base substrate 21 (S1). Then, the manufacturer adheres the two drive units 50 to a predetermined position of the base substrate 21 (S2).

  Next, the manufacturer forms the wiring pattern 24, the electrode pattern for electrolytic plating 25, and the electrode pattern 53 on the base substrate 21 and the drive unit 50 by using a photolithography method. Specifically, the following steps are executed.

  First, the manufacturer forms a metal film on the surfaces of the base substrate 21 and the drive unit 50 (S3). The metal film is, for example, a nickel film. As a method for forming the metal film, various known methods such as an electroless plating method, an ion beam sputtering method, a chemical vapor deposition method, an evaporation method, and an electron beam co-evaporation method can be used.

  Next, the manufacturer forms a positive resist pattern on the metal film (S4). Specifically, the following processing is executed.

  First, the manufacturer uniformly applies a resist to the surface of the metal film. Then, after pre-baking the resist, the manufacturer exposes the resist in accordance with the shape of the electrode pattern formed on the substrate, such as the wiring pattern 24. In addition, the formation part of the electrode pattern 25 for electroplating is exposed so that the extraction pattern may be formed. More specifically, the portion where the electrolytic plating electrode pattern 25 is formed is exposed so that a mesh pattern is formed. By exposure, a latent image is formed on the metal film. Thereafter, the producer develops the resist using a developer. By developing, the latent image is melted and removed, and a resist pattern is formed on the metal film.

  Next, the manufacturer etches a portion of the metal film that is not covered with the resist pattern (S5). By etching, the wiring pattern 24, the electrode pattern 25 for electrolytic plating, and the electrode pattern 53 are formed on the base substrate 21 and the drive unit 50.

  Next, the manufacturer removes the resist pattern remaining on the electrode pattern (S6). When removing the resist pattern, the manufacturer removes the resist pattern using a stripping solution. As the stripper, various known photoresist strippers can be used. For example, the stripping solution is a mixture of an organic amine and a polar solvent. The manufacturer removes the resist pattern by immersing the base substrate 21 in the stripping solution for a predetermined time. The resist pattern is peeled off from the electrode pattern, and the electrode is exposed.

  Next, the manufacturer performs electrolytic plating on the wiring pattern 24 and the electrode pattern 53 (S7). As the electrolytic plating method, various known methods can be used. For example, the manufacturer immerses the base substrate 21 in an electrolytic solution in which a substance (for example, gold) serving as a plating layer is dissolved, and supplies current to the wiring pattern 24 and the electrode pattern 53. When supplying a current to the electrode pattern 53, the apparatus manufacturer supplies a current from the electrode pattern 25 for electrolytic plating. A plating layer is formed on the surfaces of the wiring pattern 24 and the electrode pattern 53. The inkjet head substrate 20 is completed through the above steps.

  Next, the manufacturer bonds the frame 30 to the inkjet head substrate 20 (S8). Thereafter, the nozzle plate 40 is bonded to the upper surface of the frame 30 (S9). The inkjet head 10 is completed through the above steps.

  The electrolytic plating electrode pattern 25 is cut out from the inkjet head substrate 20 together with the base substrate 21 when the inkjet head 10 is mounted on a printer. For example, an ink jet head 10 for mounting a printer as shown in FIG. 10 is completed. The electrolytic plating electrode pattern 25 may be cut off before the frame 30 is bonded to the inkjet head substrate 20, for example, as shown in FIG. 11.

  When the electrolytic plating electrode pattern 25 is a solid pattern as shown in FIG. 12, it takes a long time for the peeling solution to penetrate to the deepest part of the electrolytic plating electrode pattern 25. As a result, it takes a lot of time to remove the resist pattern. However, the electrode pattern 25 for electroplating of this embodiment is a blank pattern as shown in FIG. Since the stripping solution quickly penetrates to the deepest portion P, the resist pattern is stripped in a short time. As a result, since the inkjet head substrate 20 is manufactured in a short time, the manufacturing cost of the inkjet head substrate 20 and the inkjet head 10 including the inkjet head substrate 20 can be reduced.

  The above-described embodiment shows an example, and various changes and applications are possible.

  For example, in the above-described embodiment, it is assumed that the widths W1 and W2 of the vertical and horizontal lines of the mesh constituting the electrode pattern for electrolytic plating 25 are the same as the width W3 of the largest line of the wiring pattern 24. However, the widths W1 and W2 may be different from the width W3. For example, the widths W1 and W2 may be equal to or less than the width W3. That is, the widths W1 and W2 may be the same as the width W3 or may be smaller than the width W3. By setting the widths W1 and W2 to be equal to or less than the width W3, there is a large time difference between the time when the resist pattern on the wiring pattern 24 is peeled off and the time when the resist pattern on the electrode pattern for electrolytic plating 25 is peeled off. No longer occurs. Of course, the widths W1 and W2 may be larger than the width W3. Further, the width W1 and the width W2 may be different widths.

  In the above-described embodiment, the vertical and horizontal widths W4 and W5 of the extraction region B are described as being equal to the width W3. However, the widths W4 and W5 may be different from the width W3. The width W4 and the width W5 may be different widths.

  In the above-described embodiment, the electrode pattern 25 for electroplating is described as a mesh pattern. However, the electrode pattern 25 for electroplating is, for example, shown in FIG. B may be a dot pattern arranged uniformly. The dot shape is not limited to a circle or semicircle as shown in FIG. The shape of the dots may be a shape other than a circle or a semicircle, for example, an ellipse or a polygon. The mesh pattern can be regarded as a dot pattern in which square dots are arranged in a matrix.

  Further, the electrode pattern 25 for electrolytic plating is not limited to a dot pattern. For example, as shown in FIG. 14, the electrode pattern 25 for electrolytic plating may be a stripe pattern in which striped regions B are uniformly arranged in the electrode.

In the above-described embodiment, the inkjet head substrate 20 has been described as including the drive unit 50, but a substrate that does not include the drive unit 50 can also be regarded as the inkjet head substrate 20. For example, as shown in FIG. 15 (A) and FIG. 15 (B), the a state in which the drive unit 50 is not disposed in the arrangement region of the drive unit 50 (recess 26 ₁ and the recess 26 ₂ in the figure) Can also be regarded as the inkjet head substrate 20. The ink jet head substrate 20 may be in a state before the wiring pattern 24 is plated, or may be in a state after the plating is performed.

  In the above-described embodiment, the substrate in which the wiring pattern 24 and the electrode pattern 53 are plated is the inkjet head substrate 20. However, the substrate before being plated can also be regarded as the inkjet head substrate 20. it can.

  In the above-described embodiment, the wiring pattern 24, the electrode pattern for electrolytic plating 25, and the electrode pattern 53 are described as being formed of a nickel film. However, the wiring pattern 24, the electrode pattern for electrolytic plating 25, and the electrode pattern are described. The material of 53 is not limited to nickel (Ni). For example, the wiring pattern 24, the electrode pattern for electrolytic plating 25, and the electrode pattern 53 may be made of a metal other than nickel, such as copper (Cu).

  In the above-described embodiment, the wiring pattern 24 and the electrode pattern 53 are described as being subjected to gold plating. However, the plating is not limited to gold plating. The plating applied to the wiring pattern 24 and the electrode pattern 53 may be plating other than gold plating, such as silver plating, copper plating, nickel plating, chrome plating, tin plating, and zinc plating. The plating may be alloy plating such as brass plating.

  Moreover, although the nozzle plate 40 was demonstrated as what was a resin plate in the above-mentioned embodiment, the nozzle plate 40 may be a metal plate. The nozzle plate 40 may be a laminated plate in which a metal film is laminated on a resin film.

In the above-described embodiment, the base material 51 and the piezoelectric body 52 are described as being composed of a piezoelectric material mainly composed of lead zirconate titanate (PZT). The constituting piezoelectric material is not limited to lead zirconate titanate. For example, the piezoelectric material constituting the base material 51 and the piezoelectric body 52 may be barium titanate (BaTiO ₃ ), lead titanate (PbTiO ₃ ), or the like.

  In the above-described embodiment, the base substrate 21 and the frame 30 are described as being made of ceramic, but the material of the base substrate 21 and the frame 30 is not limited to ceramic. The base substrate 21 and the frame 30 may be made of resin. Further, for example, the base substrate 21 and the frame 30 may be made of metal as long as the surface is covered with an insulating material and insulation is ensured.

  In the above-described embodiment, the inkjet head 10 is described as a side shooter type inkjet head that pushes ink in the depth direction (Z-axis direction) of the pressure chamber S. However, the inkjet head 10 is a side shooter. It is not limited to the type of inkjet head. For example, the inkjet head 10 may be an edge shooter type inkjet head that pushes ink in the longitudinal direction (Y-axis direction) of the pressure chamber S.

  The inkjet head 10 according to the above embodiment is an example. The number of openings 22, 22 formed in the base substrate 21, the number of nozzle holes 41, and the number of actuators 50 a can be appropriately changed according to the use and resolution of the inkjet head 10.

  Next, the printer 70 having an inkjet head will be described. FIG. 16 is a diagram illustrating the printer 70 of the present embodiment. The printer 70 includes four colors of inkjet heads 10C, 10M, 10Y, and 10K of cyan, magenta, yellow, and black. The inkjet heads 10C, 10M, 10Y, and 10K are inkjet heads manufactured using the manufacturing method described above.

  The printer 70 includes a housing 80, a paper feed cassette 71, a paper discharge tray 72, a holding roller 73, a transport device 74, and a reversing device 78. Around the holding roller 73, a holding device 75, an image forming device 76, a charge removing device 77, and a cleaning device 79 are provided in order from the upstream side to the downstream side. In addition, a paper position sensor 107 that detects the leading end position of the paper P and a temperature sensor 108 that detects the temperature inside the printer 70 are provided inside the printer 70.

  The holding roller 73 is a roller that holds and rotates the paper P. The holding roller 73 includes a rotating shaft 71 a, a cylindrical cylindrical frame 91 made of aluminum, and an insulating layer 92 formed on the surface of the cylindrical frame 91. The cylindrical frame 91 is grounded.

  The transport device 74 is a device that transports the paper P along the transport path A1. The transport path A <b> 1 is formed from the paper feed cassette 71 to the paper discharge tray 72 via the holding roller 73. The conveyance device 74 includes a plurality of guide members 81 to 83 provided along the conveyance path A1, a plurality of first conveyance rollers, and a plurality of second conveyance rollers. The transport device 74 includes a pickup roller 84 and a paper feed roller pair 85 as a first transport roller. The paper P is transported to the inkjet heads 10C, 10M, 10Y, and 10K by the first transport roller. In addition, as a second transport roller, a registration roller pair 86, a separation roller pair 87, a transport roller pair 88, and a discharge roller pair 89 are provided. The sheet P is conveyed outside the printer 70 by the second conveying roller.

  The holding device 75 is a device that attracts the paper P to the outer peripheral surface of the holding roller 73. The holding device 75 includes a pressing device 93 and a suction device 94. The pressing device 93 is a device that presses the paper P against the holding roller 73. The pressing device 93 includes a rotating shaft 95 c, a pressing roller 95 disposed to face the surface of the holding roller 73, and a pressing motor that drives the pressing roller 95. The outer peripheral surface of the pressing roller 95 is covered with an insulating layer 95b. The suction device 94 is a device that sucks the paper P onto the holding roller 73. The suction device 94 includes a charging roller 97. The charging roller 97 includes a charging shaft 97a that can be charged, and a surface layer portion 97b formed on the outer periphery of the charging shaft 97a. When electric power is supplied to the charging roller 97 while the charging roller 97 is close to the holding roller 73, a potential difference is generated between the charging roller 97 and the grounded cylindrical frame 91. An electrostatic force is generated in a direction in which the paper P is attracted to the holding roller 73, and the paper P is attracted to the surface of the holding roller 73.

  The image forming apparatus 76 is an apparatus that forms an image on the paper P. The image forming apparatus 76 includes four inkjet heads 10C, 10M, 10Y, and 10K disposed above the holding roller 73. The four color inkjet heads 10C, 10M, 10Y, and 10K eject ink onto the paper P. An image is formed on the paper P.

  The neutralization peeling device 77 is a device that peels the paper P from the holding roller 73. The static elimination apparatus 77 includes a static elimination apparatus 101 and a peeling apparatus 102. The neutralization device 101 is a device that neutralizes the paper P. The neutralization device 101 includes a neutralization roller 103 that is provided on the downstream side of the image forming apparatus 76 and can be charged. The static eliminator 101 supplies the electric charge to neutralize the paper P so that the paper P is easily peeled off from the holding roller 73. The peeling device 102 is a device that peels the paper P from the surface of the holding roller 73 after static elimination. The peeling device 102 includes a separation claw 105 provided on the downstream side of the static elimination device 101. The separation claw 105 peels the paper P from the surface of the holding roller 73.

  The reversing device 78 is a device that reverses the paper P peeled off by the peeling device 102. The reversing device 78 reverses the paper P by, for example, guiding the paper P along a reversing path for switching back the paper P.

  The cleaning device 79 is a device that cleans the holding roller 73. The cleaning device 79 includes a cleaning member. The surface of the holding roller 73 is cleaned by the rotation of the holding roller 73 while the cleaning member is in contact with the surface of the holding roller 73.

  The printer 70 described above includes the inkjet heads 10C, 10M, 10Y, and 10K manufactured using the manufacturing method described above. Since the manufacturing cost of the inkjet heads 10C, 10M, 10Y, and 10K is low, the manufacturing cost of the printer 70 can also be reduced.

  Although the embodiment of the present invention has been described, this embodiment is presented as an example and is not intended to limit the scope of the invention. The novel embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. This embodiment and its modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

10,10C, 10K, 10M, 10Y ... inkjet head 20 ... inkjet head substrate 21 ... base substrate 24, 24 _1, 24 2 _... wiring patterns 25 _1, 25 2 _... electrolytic plating electrode pattern 30 ... frame 40 ... nozzle Plate 50, 50 ₁ , 50 ₂ ... Drive unit 50a ... Actuator 70 ... Printer

Claims (4)

A base substrate on which the actuator is disposed;
A wiring pattern formed on the base substrate and connected to the electrode of the actuator;
An electrode pattern for electrolytic plating formed on the base substrate and connected to the wiring pattern.
Inkjet head substrate. The extraction pattern is a stripe pattern in which electrodes are extracted in a stripe shape, or a dot pattern in which electrodes are extracted in a dot shape.
The inkjet head substrate according to claim 1. The punching pattern is a mesh pattern,
The width of the mesh line constituting the punched pattern is equal to or smaller than the width of the largest line of the wiring pattern.
The inkjet head substrate according to claim 1. A positive resist pattern for forming a wiring pattern connected to the electrode of the actuator and an electrode pattern for electrolytic plating connected to the wiring pattern is formed on the base substrate on which the metal film is uniformly formed. Forming a resist pattern on the metal film;
An etching step of etching the metal film on which the resist pattern is formed;
A stripping step of stripping the resist pattern from the metal film using a stripping solution;
A plating step of plating the wiring pattern by passing a current from the electrode pattern for electrolytic plating to the wiring pattern;
In the resist pattern forming step, the resist pattern is formed on the metal film such that the electrode pattern for electrolytic plating is a blank pattern.
A method for manufacturing an inkjet head.

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