JP6384234B2 - Radical polymerization type adhesive composition and method for producing electrical connector - Google Patents

Description

  The present invention relates to a radical polymerizable adhesive composition containing a radical polymerizable compound, a thermal radical polymerization initiator, a photoacid generator, and a cationic polymerizable compound.

  After superposing an electrical component such as a liquid crystal panel or an organic EL panel and another electrical component such as an IC chip or a flexible substrate via an uncured adhesive layer formed from a curable adhesive composition, It is widely performed to manufacture an electrical connection body by curing an uncured adhesive layer to form a cured adhesive layer. In this case, if excessive heating is performed to cure the uncured adhesive layer, the electrical connection body may be warped or the electrical component may be damaged. For this reason, as a curable adhesive composition, a cationic photopolymerizable adhesive composition in which a photoacid generator is mixed as a cationic photopolymerization initiator with a cationically polymerizable compound such as an epoxy compound is used. Yes.

  However, if there is a light shielding part such as a metal wiring in the electrical component, there is a problem in that light is not sufficiently irradiated to the uncured adhesive layer by the light shielding part and the die shear strength of the joint part is reduced. For this reason, the photocation polymerization type adhesive composition is blended with a thermal radical polymerizable compound such as an acrylate monomer or oligomer and a thermal radical polymerization initiator such as an organic peroxide to impart thermosetting properties. Has been proposed (Patent Document 1).

Japanese Patent No. 4469089

  By the way, the heating temperature at the time of thermocompression bonding when conducting conductive connection using a curable adhesive composition as disclosed in Patent Document 1 is an electrical connection created using the curable adhesive composition. In order to achieve a low conduction resistance value and good die shear strength in the body, the temperature is generally 130 to 180 ° C.

  However, when thermocompression treatment is performed at such a temperature, there is a problem that warpage that cannot be ignored in practice occurs in the electrical connection body. For this reason, it is conceivable to lower the heating temperature to about 100 ° C. However, since the thermosetting reaction becomes insufficient, the light-shielding portion is not sufficiently cured, resulting in an increase in conduction resistance value or die shear strength. There is concern that it will cause a decline.

  An object of the present invention is to solve the above-described problems of the conventional technology, and an electrical component such as a liquid crystal panel or an organic EL panel and another electrical component such as an IC chip or a flexible substrate are bonded to each other. When the electrical connection body is manufactured by superposing the uncured adhesive layer formed from the adhesive composition and then curing the uncured adhesive layer to form a cured adhesive layer Even if there is a light-shielding part such as a metal wiring in an electrical component, it will not cause a warp that is not negligible in practical use in the electrical connection body, and it will be possible to realize sufficient die shear strength and low conduction resistance value. is there.

  When the present inventors applied a polymerizable composition containing a radical polymerizable compound, a thermal radical polymerization initiator, a cationic polymerizable compound, and a photoacid generator to the production of an electrical connector, the warp cannot be ignored in practice. In order to realize a sufficient die shear strength and a low conduction resistance value, a photoacid generator having a function of promoting a radical polymerization reaction is used, and a photoacid generator is used. The inventors have found that this can be achieved by limiting the blending amount of the cationic polymerizable compound to a specific range, and have completed the present invention.

That is, the present invention is a radical polymerization type adhesive composition containing a radical polymerizable compound, a thermal radical polymerization initiator, a cationic polymerizable compound, and a photoacid generator,
The photoacid generator has the property of accelerating the thermal radical polymerization reaction of the radical polymerization type adhesive composition,
Provided is a radical polymerization type adhesive composition in which the content of the cationic polymerizable compound in the radical polymerization type adhesive composition is 0.25 to 3.75 parts by mass with respect to 1 part by mass of the photoacid generator.

The present invention also includes a step of disposing an adhesive layer on the terminal of one of the two electrical components to be opposed to each other,
Placing the terminals of the other electrical component on the adhesive layer;
While pressing one of the two electrical components facing each other toward the other, heating and irradiating the adhesive layer, the adhesive layer is cured and the two electrical components disposed facing each other In the manufacturing method of the electrical connection body which has the process of electrically connecting,
The adhesive layer is formed from the above-mentioned radical polymerization type adhesive composition,
Provided a manufacturing method for curing an adhesive layer by generating an acid from a photoacid generator by light irradiation when curing the adhesive layer, thereby promoting a thermal radical polymerization reaction of the radical polymerization type adhesive composition To do.

Furthermore, the present invention includes a step of disposing an adhesive layer on a terminal of one of the two electrical components to be opposed to each other,
Placing the terminals of the other electrical component on the adhesive layer;
While pressing one of the two electrical components facing each other toward the other, heating and irradiating the adhesive layer, the adhesive layer is cured and the two electrical components disposed facing each other In the manufacturing method of the electrical connection body which has the process of electrically connecting,
The adhesive layer is formed from the above-mentioned radical polymerization type adhesive composition,
A manufacturing method in which heating to the adhesive layer is performed at a temperature lower than the thermal radical polymerization reaction temperature of the radical polymerization control composition corresponding to the radical polymerization adhesive composition from which the photoacid generator has been removed. provide.

  The radical polymerization type adhesive composition of the present invention includes a radical polymerizable compound, a thermal radical polymerization initiator, a photoacid generator having a property of promoting the thermal radical polymerization reaction of the radical polymerization type adhesive composition, a cation In addition, the compounding amount of the cationic polymerizable compound with respect to the photoacid generator is limited to a specific range. Therefore, although the cationic polymerization of the cationic polymerizable compound proceeds, the acid generated by the photoacid generator by light irradiation is not consumed for the cationic polymerization of the cationic polymerizable compound, and as a result, radical polymerization type It becomes possible to accelerate the thermal radical polymerization reaction of the adhesive composition. Therefore, even when a light-shielding part such as a metal wiring exists in the electrical parts to be joined, the electric connection body does not generate a warp that cannot be ignored in practice, and a sufficient die shear strength and a low conduction resistance value are realized. be able to.

<< Radical polymerization type adhesive composition >>
The radical polymerization type adhesive composition of the present invention contains a radical polymerizable compound, a thermal radical polymerization initiator, a photoacid generator, and a cationic polymerizable compound. As the photoacid generator, one having a property of promoting the thermal radical polymerization reaction of the radical polymerization type adhesive composition is used. Moreover, content in the radical polymerization type adhesive composition of a cation polymeric compound is 0.25-3.75 mass parts with respect to 1 mass part of photoacid generators.

<Radically polymerizable compound>
The radical polymerizable compound constituting the radical polymerization type adhesive composition of the present invention is a compound capable of undergoing radical polymerization reaction with active radicals generated by thermal decomposition of a thermal radical polymerization initiator, preferably one or more in the molecule. It has a carbon unsaturated bond, and includes so-called monofunctional radical polymerizable compounds and polyfunctional radical polymerizable compounds. When the radical polymerizable compound contains a polyfunctional radical polymerizable compound, the die shear strength of the cured product of the radical polymerization adhesive composition can be further improved. Therefore, the radically polymerizable compound preferably contains at least 30% by mass of the polyfunctional radically polymerizable compound, more preferably at least 50% by mass.

  Examples of the monofunctional radically polymerizable compound include monofunctional vinyl compounds such as styrene and methylstyrene, and monofunctional (meth) acrylate compounds such as butyl acrylate and butyl methacrylate. Here, “(meth) acrylate” is a term including acrylate and methacrylate. As the polyfunctional radical polymerizable compound, polyfunctional vinyl compounds such as divinylbenzene, 1,6-hexanediol diacrylate, trimethylolpropane trimethacrylate, bisphenol A glycidyl methacrylate (EA-1020, Shin-Nakamura Chemical Co., Ltd.) And polyfunctional (meth) acrylate compounds such as isocyanuric acid EO-modified diacrylate (M-215, Toagosei Co., Ltd.). These may be monomers or oligomers. Of these, polyfunctional (meth) acrylate compounds, particularly bisphenol A-type glycidyl methacrylate and isocyanuric acid EO-modified diacrylate are preferable from the viewpoint of heat resistance.

  The polyfunctional radical polymerizable compound may be composed of a polyfunctional vinyl compound and a polyfunctional (meth) acrylate compound. By using in combination in this way, it becomes possible to control thermal responsiveness and to introduce reactive functional groups.

<Thermal radical polymerization initiator>
The thermal radical polymerization initiator constituting the radical polymerization type adhesive composition of the present invention generates an active radical for radical polymerization of a radical polymerizable compound by thermal decomposition, and is a known thermal radical polymerization initiator. For example, an organic peroxide or an azo compound can be preferably used. Among these, an organic peroxide can be preferably used from the viewpoint that excellent storage stability and low-temperature rapid curability can be realized.

  As the organic peroxide, an organic peroxide known as a thermal radical polymerization initiator, for example, from the viewpoint of chemical structural classification, diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide is used. Examples thereof include oxides, hydroperoxides, and silyl peroxides. Among these, peroxyesters and diacyl peroxides can be preferably used from the viewpoint that less organic acid is generated after thermal decomposition. From the viewpoint of the 1 minute half-life temperature, those of 80 to 170 ° C. are preferable from the viewpoint of reactivity, and those of 180 to 1000 are preferable from the viewpoint of molecular weight.

  As the azo compound, a known azo compound can be used as a thermal radical polymerization initiator.

  The amount of the thermal radical polymerization initiator in the radical polymerization adhesive composition is such that the radical polymerization compound 100 is sufficiently cured to prevent the radical polymerization adhesive composition from curing and cause foaming. Preferably it is 0.5-30 mass parts with respect to a mass part, More preferably, it is 1.0-20 mass parts.

<Photo acid generator>
The photoacid generator that constitutes the radical polymerization type adhesive composition of the present invention generates an acid when irradiated with light such as ultraviolet rays and initiates cationic polymerization of the cationically polymerizable compound. It promotes the decomposition of the radical polymerization initiator. In other words, the photoacid generator has the property of promoting the thermal radical polymerization reaction of the radical polymerization type adhesive composition. More specifically, the thermal radical polymerization reaction of the radical polymerization adhesive composition is carried out using a radical polymerization control composition corresponding to the radical polymerization adhesive composition in which the photoacid generator is further removed from the radical polymerization adhesive composition. It is possible to promote the thermal radical polymerization reaction.

Therefore, than the thermal radical polymerization reaction temperature T ₀ of containing no photoacid generator radical polymerization type control composition, thermal radical polymerization reaction temperature T ₁ of the radical polymerization type adhesive composition containing a photoacid generator, It will be low. Here, the thermal radical polymerization reaction temperature is a reaction temperature necessary for realizing the desired characteristics of the polymer, and is set according to the type of the polymerization system components, the blending ratio thereof, the desired characteristics, etc. Polymerization reaction temperature.

In the present invention, the thermal radical polymerization reaction temperature T _{0 of the} radical polymerization control composition containing no photoacid generator is preferably in the range of 100 to 130 ° C. On the other hand, the thermal radical polymerization reaction temperature T ₁ of the radical polymerization type adhesive composition containing the photoacid generator is preferably 10 ° C. or more lower than T ₀ .

  Such a photoacid generator can be appropriately selected from photoacid generators used as a photocationic polymerization initiator, and is an onium salt such as an aromatic diazonium salt; an aromatic sulfonium salt, an aliphatic sulfonium. Sulfonium salts such as salts; pyridinium salts; selenonium salts; iodonium salts such as aromatic iodonium salts; complex compounds including metal arene complexes such as iron arene complexes; tosylate compounds such as benzoin tosylate and o-nitrobenzyl tosylate Etc. Of these, sulfonium salts, iodonium salts, and iron arene complexes can be preferably mentioned because they can improve the generation efficiency of cationic species. In particular, an aromatic sulfonium salt that reacts with high sensitivity to I-line (365 nm) from an LED light source as light, specifically, a triarylsulfonium salt can be preferably exemplified.

  When the photoacid generator is a salt, hexafluoroborate, hexafluorophosphate, tetrafluoroborate, tetrakis (pentafluorophenyl) borate are used as counter anions constituting the salt from the viewpoint of improving reactivity. Etc. can be preferably employed. Among these, tetrakis (pentafluorophenyl) volley can be preferably employed.

  The blending amount of the photoacid generator in the radical polymerization type adhesive composition is preferably 1.0 to 30 parts by mass, more preferably 2 to 20 parts by mass with respect to 100 parts by mass of the thermal radical polymerization initiator. If it is this range, the effect of promoting decomposition | disassembly of a thermal radical polymerization initiator will be acquired.

<Cationically polymerizable compound>
As the cationically polymerizable compound constituting the radical polymerization type adhesive composition of the present invention, a cyclic ether compound can be preferably mentioned from the viewpoint of low temperature fast curability. Among these, those which are liquid at room temperature are preferable from the viewpoint of compatibility with other components and fluidity. Examples of such cyclic ether compounds include epoxy compounds and oxetane compounds. An epoxy compound can be preferably used from the viewpoints of cost, availability, and the like.

  Preferred examples of the epoxy compound include polyfunctional glycidyl ether type epoxy compounds and alicyclic epoxy compound compounds. In these, a polyfunctional glycidyl ether type epoxy compound can be used preferably.

  Polyfunctional glycidyl ether type epoxy compounds include bisphenol A type diglycidyl ether and its prepolymer (condensate), bisphenol F type diglycidyl ether and its prepolymer (condensate), phenol novolac type diglycidyl ether, di ( β-alkyl glycidyl) resorcinol ether, bisphenol A type di (β-alkyl glycidyl) ether, bisphenol F type di (β-alkyl glycidyl) ether, and the like.

  The epoxy equivalent of such an epoxy compound is preferably 100 to 500, more preferably 140 to 300.

  The compounding quantity of cationically polymerizable compounds, such as an epoxy compound, in a radical polymerization type adhesive composition is 1-15 mass parts with respect to 1 mass part of photoacid generators, Preferably it is 1-3 mass parts. If it is this range, the effect with which a photo-acid generator accelerates | stimulates a radical polymerization reaction and reaction with a cationically polymerizable compound will be attained.

<Other ingredients>
The radical polymerization type adhesive composition of the present invention can further contain a thermoplastic resin such as a phenoxy resin as a film-forming resin. The blending amount of such a thermoplastic resin is preferably 10 to 70 parts by mass, and more preferably 20 to 60 parts by mass with respect to 100 parts by mass of the radical polymerizable compound.

  Moreover, the radical polymerization type adhesive composition of this invention can contain a well-known silane coupling agent. The compounding amount of the silane coupling agent is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 10 parts by mass with respect to 100 parts by mass of the radical polymerizable compound. If it is this range, the effect that the adhesiveness with respect to an inorganic and metal type material will improve is acquired.

  The radical polymerization adhesive composition of the present invention can contain a known radical photopolymerization initiator, an inorganic filler, an organic filler, a conductive filler, an insulating filler, and the like, if necessary.

<Preparation of radical polymerization type adhesive composition>
The radical polymerization type adhesive composition of the present invention includes a radical polymerizable compound, a thermal radical polymerization initiator, a photoacid generator, a cationic polymerizable compound, and a thermoplastic resin blended as necessary. Can be prepared by uniformly mixing them with a known mixing means.

<< Method for manufacturing electrical connector: Part 1 >>
The manufacturing method (the 1) of the electrical connection body of this invention has the following process (I)-(C). Below, it demonstrates for every process.

<Process (I)>
An adhesive layer is disposed on a terminal of one of the two electrical components to be disposed to face each other according to a known technique. Here, a rigid circuit board, a flexible wiring board, etc. are mentioned as one of the two electric components which should be arrange | positioned facing each other. Examples of these terminals include pad electrodes, line electrodes, and bump electrodes formed from electrode materials such as copper, aluminum, silver, gold, and ITO. Further, the adhesive layer is formed from the radical polymerization type adhesive composition of the present invention described above. Such an adhesive layer can be formed by using a known method, for example, various coating methods, printing methods, and photolithographic techniques.

<Process (b)>
Next, the terminal of the other electrical component is placed on the adhesive layer formed in the step (A) according to a known method. Examples of the other electrical component include an IC chip, a liquid crystal panel, an organic EL panel, an IC module, and a solar cell module. Examples of these terminals include pad electrodes, line electrodes, and bump electrodes formed from electrode materials such as copper, aluminum, silver, gold, and ITO.

<Process (C)>
In the step (b), the adhesive layer is heated while pressing one of the two electric components opposed to each other with a known heating and pressing tool. Simultaneously with this heating or waiting for softening or melting of the composition, after the heating is started, the heating is continued, preferably after 2 or 3 seconds, light such as ultraviolet rays, preferably the I-line of the LED light source is applied to the adhesive layer. It is irradiated with light to cure the adhesive layer. Here, when at least one of the electrical components has a metal terminal that can serve as a light-shielding part on one side of the transparent substrate, light irradiation to the adhesive layer is performed from the other side of the transparent substrate of the electrical component. Is preferred. An electrical connector is obtained by curing in this way. At this time, an acid is generated from the photoacid generator by light irradiation, thereby cationically polymerizing the cation polymerizable compound, and thermal radical polymerization of the radical polymerization adhesive composition is performed from the radical polymerization adhesive composition. The adhesive layer is cured by accelerating the thermal radical polymerization of the radical polymerization control composition corresponding to the photoacid generator removed. Thereby, even if there exists a light-shielding part, an adhesive bond layer can fully be hardened and two electric components arranged facing each other can be connected by a low conductive resistance value. In addition, good die shear strength can be achieved, and warpage of the electrical connection body can be suppressed.

<< Method for manufacturing electrical connector: Part 2 >>
The manufacturing method (part 2) of the electrical connection body of the present invention has the same steps as steps (a) to (c) of the manufacturing method (part 1). In the step (c), heating to the adhesive layer is performed. Clarify the specific heating conditions to be performed at a temperature lower than the thermal radical polymerization reaction temperature of the radical polymerization control composition corresponding to the radical polymerization adhesive composition from which the photoacid generator is further removed. It differs in that it is. Since heat curing is performed at a temperature lower than the thermal radical polymerization reaction temperature T _0, it is possible to suppress the warpage of the electric bonded body, and the heat radical of the radical polymerization type adhesive composition is generated by the acid generated by the photoacid generator. Since the polymerization reaction temperature T ₁ is lower than T _0, it can be sufficiently cured, and the two electric components arranged opposite to each other can be connected with a low conductive resistance value. In addition, good die shear strength can be achieved, and warpage of the electrical connection body can be suppressed.

  Hereinafter, the present invention will be specifically described by way of examples.

Examples 1-5, Comparative Examples 1-4
A mixture (adhesive composition) obtained by mixing the components of the composition shown in Table 1 by a conventional method was applied to a release polyester film and dried at 70 ° C. to obtain an adhesive sheet having a thickness of 20 μm.

<Conduction resistance measurement, die shear strength measurement, creation of electrical connection body for warpage measurement>
The obtained adhesive sheet is provided with an IC (outside dimension: 1.8 mm × 20 mm, bump height 15 μm) as an evaluation base, and a 200 μm wide 500 nm-thick aluminum line electrode (light-shielding portion) on the back surface at a pitch of 200 μm. Sandwiched between ITO coated glass (glass thickness 0.5mm, ITO thickness 200nm) as the base glass substrate, heat-pressed the IC under the conditions of pressure bonding temperature 100 ° C, pressure bonding pressure 80MPa, pressure bonding time 5 seconds, and start heating 2 seconds later, by performing UV irradiation for 3 seconds from the back surface side (aluminum line electrode forming surface side) of the glass substrate under the UV irradiation conditions shown in Table 1 (UV light source: UV irradiator ZUV-C30H (OMRON Corporation)). Then, an electrical connection for test evaluation was prepared.

<Measurement of conduction resistance value of electrical connection body>
An aging tent that was left in a high-temperature and high-humidity tank at 85 ° C. and 85% RH for 500 hours was performed on the prepared electrical connection body. Before and after the aging test, the conduction resistance value of the electrical connection body when a current of 2 mA was passed through the electrical connection body was measured by a four-terminal method using a resistance measuring machine (Digital Multimeter 7555, manufactured by Yokogawa Electric Corporation). Measured with The obtained results are shown in Table 1. Practically, it is desirable that it is 1.0Ω or less before aging and 10Ω or less after aging.

<Measurement of die shear strength of electrical connector>
The die shear strength of the created electrical connection was measured using a die shear tester (universal bond tester series 4000, manufactured by Daisy Japan) under the condition of a tool speed of 100 μm / second. The obtained results are shown in Table 1. Practically, it is desired to be 130 kgf or more.

<Measurement of warpage of electrical connection body>
The aluminum line electrode formation surface of the glass substrate of the electrical connection body thus prepared was scanned with a probe of a stylus type surface roughness meter (SE-3H, Kosaka Laboratory Ltd.), and the amount of warpage (μm) was measured. The obtained results are shown in Table 1. Practically, it is desired to be 10 μm or less.

<Discussion of results in Table 1>
(1) Comparative Example 4 which contained 8 parts by mass of an organic peroxide which is a radical polymerization initiator without containing a photoacid generator, 4 parts by mass of an organic peroxide, and 4 photoacid generators From the comparison with Comparative Example 1 that contained part by mass, it can be seen that the curing reaction was promoted by replacing half of the organic peroxide, which is a radical polymerization initiator, with a photoacid generator. Therefore, it turns out that the photo-acid generator used in Examples 1-5 has the property which accelerates | stimulates the thermal radical polymerization reaction of a radical polymerization type adhesive composition.

(2) a radically polymerizable compound, a radical polymerization initiator (organic peroxide), a photoacid generator having a property of accelerating a thermal radical polymerization reaction of a radical polymerization type adhesive composition, and a cationically polymerizable compound It can be seen that the radically polymerizable adhesive compositions of Examples 1 to 5 containing the above show “conducting resistance values” that are practically acceptable before and after the aging test. In addition, “die shear strength” and “warp amount” showed no problem in practical use.

(3) In addition, when comparing Examples 1 to 5 with Comparative Example 1 in which no cationically polymerizable compound is blended and Comparative Example 2 in which 20 parts by mass of the cationically polymerizable compound is blended, photoacid generator 1 It turns out that the preferable compounding quantity of the cationically polymerizable compound with respect to a mass part is 1-15 mass parts.

(4) In the case of Comparative Example 3, since the radical polymerization initiator (organic peroxide) and the cationic polymerizable compound are not included, it can be seen that the curing reaction does not proceed.

  The radical polymerization type adhesive composition of the present invention includes a radical polymerizable compound, a thermal radical polymerization initiator, a photoacid generator having a property of promoting the thermal radical polymerization reaction of the radical polymerization type adhesive composition, a cation In addition, the compounding amount of the cationic polymerizable compound with respect to the photoacid generator is limited to a specific range. For this reason, even if there is a light-shielding part such as metal wiring in the electrical parts to be joined, the electrical connection body does not cause warp that is not negligible in practice, and sufficient die shear strength and low conduction resistance value are realized. can do. Therefore, the radical polymerization type adhesive composition of the present invention has a low conductive resistance value, a good die shear strength, and an electrical connection body produced by connecting electrical components having a light-shielding portion at the joint portion, This is useful for realizing a small amount of warpage.

Claims (12)

A radical polymerizable adhesive composition containing a radical polymerizable compound, a thermal radical polymerization initiator, a cationic polymerizable compound, and a photoacid generator,
The photoacid generator has the property of accelerating the thermal radical polymerization reaction of the radical polymerization type adhesive composition,
The radical polymerization type adhesive composition whose content in the radical polymerization type adhesive composition of a cation polymeric compound is 0.25-3.75 mass parts with respect to 1 mass part of photo-acid generators.   The radical polymerization type adhesive composition according to claim 1, wherein the content of the photoacid generator in the radical polymerization type adhesive composition is 1.0 to 30 parts by mass with respect to 100 parts by mass of the thermal radical polymerization initiator. .   The radically polymerizable adhesive composition according to claim 1 or 2, wherein the cationic polymerizable compound is an epoxy compound.   The radical polymerization type adhesive composition according to claim 3, wherein an epoxy equivalent of the epoxy compound is 100 to 500.   The radical polymerization adhesive composition according to any one of claims 1 to 4, wherein the thermal radical polymerization initiator is an organic peroxide, and the photoacid generator is a sulfonium salt, an iodonium salt, or an iron arene complex.   The organic peroxide as a thermal radical polymerization initiator is a peroxyester or diacyl peroxide having a half-life temperature of 80 to 170 ° C and a molecular weight of 180 to 1000 for 1 minute, and the photoacid generator is a triarylsulfonium salt. 5. The radical polymerization type adhesive composition according to 5. Placing an adhesive layer on the terminals of one of the two electrical components to be placed opposite each other;
Placing the terminals of the other electrical component on the adhesive layer;
While pressing one of the two electrical components facing each other toward the other, heating and irradiating the adhesive layer, the adhesive layer is cured and the two electrical components disposed facing each other In the manufacturing method of the electrical connection body which has the process of electrically connecting,
The adhesive layer is formed from the radical polymerization adhesive composition according to any one of claims 1 to 6,
A production method for curing an adhesive layer by generating an acid from a photoacid generator by light irradiation during curing of the adhesive layer, thereby promoting a thermal radical polymerization reaction of the radical polymerization type adhesive composition. Placing an adhesive layer on the terminals of one of the two electrical components to be placed opposite each other;
Placing the terminals of the other electrical component on the adhesive layer;
While pressing one of the two electrical components facing each other toward the other, heating and irradiating the adhesive layer, the adhesive layer is cured and the two electrical components disposed facing each other In the manufacturing method of the electrical connection body which has the process of electrically connecting,
The adhesive layer is formed from the radical polymerization adhesive composition according to any one of claims 1 to 6,
A production method in which the adhesive layer is heated at a temperature lower than the thermal radical polymerization reaction temperature of the radical polymerization control composition corresponding to the radical polymerization adhesive composition from which the photoacid generator has been removed.   The manufacturing method according to claim 7 or 8, wherein at least one of the electrical components has a metal terminal formed on one side of the transparent substrate, and the adhesive layer is irradiated with light from the other side of the transparent substrate. Method.   The manufacturing method according to claim 7, wherein light irradiation is performed after heating the adhesive layer.   The production method according to claim 7, wherein the thermal radical polymerization initiator is an organic peroxide, and the photoacid generator is a sulfonium salt, an iodonium salt, or an iron arene complex.   The organic peroxide as a thermal radical polymerization initiator is a peroxyester or diacyl peroxide having a half-life temperature of 80 to 170 ° C and a molecular weight of 180 to 1000 for 1 minute, and the photoacid generator is a triarylsulfonium salt. 11. The production method according to 11.