JP6349729B2 - Electrical component unit - Google Patents

Description

  The present invention relates to an electrical component unit that cools a heat-generating component by using cold heat of a refrigerant.

  When the electrical component is cooled by the cold heat of the refrigerant, dew condensation occurs when the refrigerant temperature is low when the electric component is cooled by direct heat transfer. In order to prevent this, for example, in the control box disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 2012-127591) and Patent Document 2 (Japanese Patent Laid-Open No. 2013-15295), the inside of the box is cooled in the box. For this purpose, a refrigerant-air heat exchanger and a fan are installed and cooled by cold air. In this case, the entire board, including the power module, has a temperature higher than the dew point in the box, so there is no condensation, and it is structured to receive dew condensation water below the refrigerant-air heat exchanger. Condensed water does not adhere to the substrate.

  However, with such a structure, it is not possible to sufficiently cool a power module with a large calorific value, and if the power module is sufficiently cooled, the capacity of the refrigerant-air heat exchanger must be significantly increased. Both size and cost will increase significantly.

  Moreover, in the electrical component box disclosed in Patent Document 3 (Japanese Patent Laid-Open No. 2010-002120) and Patent Document 4 (Japanese Patent Laid-Open No. 2011-220654), cooling by direct heat transfer and cooling by cold air are used in combination. However, it is necessary to prevent the refrigerant temperature of the cooling by direct heat transfer from dropping below the dew point, so that the cooling capacity is lowered and the structure is further complicated.

  An object of the present invention is to provide an electrical component unit that does not cause condensation on the direct heat transfer cooling portion without reducing the cooling capacity while directly cooling the heat generating component with heat transfer.

An electrical component unit according to a first aspect of the present invention is an electrical component unit on which an electrical component group including a heat generating component is used for controlling an apparatus having a refrigerant circuit, and includes a case, a cooling unit, and a dehumidifying unit. And. The case houses the electrical component group. The cooling unit includes a refrigerant flow path through which the refrigerant passes, and cools the heat generating component by natural convection . The dehumidifying unit is disposed in the case and dehumidifies the air in the case by the cold heat of the refrigerant. The case has a semi-enclosed structure in which the ventilation frequency V / R, which is a value obtained by dividing the amount of air V per hour flowing out of the case or flowing into the case by the volume R of the case, is suppressed to 0 to 5 times. is there. Further, the case has a drain drain hole at a position adjacent to the dehumidifying portion.

  In this electrical component unit, heat transfer cooling is performed directly by the cooling unit, but the case has a semi-enclosed structure, and the dehumidifying part arranged inside the case has a dew point inside the case that is lower than the temperature of the lowest temperature part of the electrical component group. Since the condensation is prevented by lowering the temperature, the condensation can be prevented without lowering the refrigerant capacity.

  Inside the case, the air is changed 0 to 5 times within one hour, but the dehumidifying part dehumidifies the case and lowers the dew point. For example, even if the power module is directly cooled by heat transfer, condensation is generated around the power module. Does not occur.

  In addition, although heat is trapped in the case, the cooling unit also cools the air, so that the heat-generating components that are not subject to direct heat transfer cooling are indirectly cooled by natural convection of cold air.

Further, in this electrical component unit, the drainage drain hole, which is assumed to be inflow of external air, is provided at a position adjacent to the dehumidifying unit, so that the air containing moisture is dehumidified before natural convection. Condensation water adheres to the water.

An electrical component unit according to a second aspect of the present invention is an electrical component unit equipped with an electrical component group including a heat generating component, which is used for controlling an apparatus having a refrigerant circuit, and includes a case, a cooling unit, and a dehumidifying unit. And. The case houses the electrical component group. The cooling unit includes a refrigerant flow path through which the refrigerant passes, and cools the heat generating component. The dehumidifying unit is disposed in the case and dehumidifies the air in the case by the cold heat of the refrigerant. The case has a semi-enclosed structure in which the ventilation frequency V / R, which is a value obtained by dividing the amount of air V per hour flowing out of the case or flowing into the case by the volume R of the case, is suppressed to 0 to 5 times. is there. Furthermore, the case has a cable lead-in hole at a position adjacent to the dehumidifying part.

  In this electrical component unit, since the cable lead-in hole where inflow of external air is assumed is provided at a position adjacent to the dehumidifying part, the air containing moisture is dehumidified before natural convection, so Adhesion of condensed water is prevented.

The electrical component unit according to the third aspect of the present invention is the electrical component unit according to the first aspect or the second aspect , and the dehumidifying portion is disposed at a position lower than the electrical component group.

  In this electrical component unit, the dehumidifying part is disposed at a position lower than the electrical component group, so that dew condensation water generated in the dehumidifying part is prevented from being applied to the electrical component group.

The electrical component unit according to the fourth aspect of the present invention is the electrical component unit according to the first or second aspect , and the cooling unit and the dehumidifying unit are integrated.

  In this electrical component unit, the manufacturing cost can be reduced by integrating both members.

The electrical component unit according to the fifth aspect of the present invention is the electrical component unit according to the first or second aspect , and the cooling unit further includes a heat transfer plate and a refrigerant jacket. The heat transfer plate is attached so that the heat generating component can transfer heat. The refrigerant jacket cools the heat transfer plate by the cold heat of the refrigerant. The case also houses a refrigerant jacket and a heat transfer plate.

  In this electrical component unit, the refrigerant jacket can also be used as a dehumidifying unit, and the manufacturing cost can be reduced by reducing the number of parts.

  In the electrical component unit according to the first aspect of the present invention, the heat transfer is directly cooled by the cooling unit, but the case has a semi-enclosed structure, and the dehumidification unit arranged inside the case uses the dew point inside the case as an electrical component group. Since the dew condensation is prevented by lowering the temperature of the lowest temperature portion, dew condensation can be prevented without lowering the refrigerant capacity.

  Inside the case, the air is changed 0 to 5 times within one hour, but the dehumidifying part dehumidifies the case and lowers the dew point. For example, even if the power module is directly cooled by heat transfer, condensation is generated around the power module. Does not occur.

  In addition, although heat is trapped in the case, the cooling unit also cools the air, so that the heat-generating components that are not subject to direct heat transfer cooling are indirectly cooled by natural convection of cold air.

Furthermore , by providing a drain drainage hole that is supposed to be inflow of external air at a position adjacent to the dehumidifying part, the moisture-containing air is dehumidified before natural convection. Is prevented.

In the electrical component unit according to the second aspect of the present invention, the cable lead-in hole that is assumed to be inflow of external air is provided at a position adjacent to the dehumidifying unit, so that the air containing moisture is dehumidified before natural convection. Therefore, the condensation water is prevented from adhering to the cooling unit.

In the electrical component unit according to the third aspect of the present invention, the dehumidifying part is disposed at a position lower than the electrical component group, thereby preventing the dew condensation water generated in the dehumidifying part from being applied to the electrical component group. .

In the electrical component unit according to the fourth aspect of the present invention, the manufacturing cost can be reduced by integrating the cooling unit and the dehumidifying unit.

In the electrical component unit according to the fifth aspect of the present invention, the refrigerant jacket can be used also as the dehumidifying part, and the manufacturing cost can be reduced by reducing the number of parts.

The refrigerant circuit figure of the freezing apparatus carrying the electrical equipment unit which concerns on one Embodiment of this invention. External view of an electrical component unit. The table which shows the frequency of ventilation according to the board structure. The graph which represented the relationship between the internal volume of a case and the dehumidification amount in a case by the heat sink for dehumidification of a predetermined size as a parameter | index of ventilation frequency. A graph showing the relationship between the internal volume of the case and the dew point in the case, using the ventilation frequency as a parameter.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following embodiments are specific examples of the present invention and do not limit the technical scope of the present invention.

(1) Overall Configuration of Refrigeration Apparatus 1 FIG. 1 is a refrigerant circuit diagram of a refrigeration apparatus 1 equipped with an electrical component unit 50 according to an embodiment of the present invention. In FIG. 1, the refrigeration apparatus 1 includes an indoor unit 2 and an outdoor unit 3. The refrigeration apparatus 1 performs air conditioning in a building by performing a vapor compression refrigeration cycle operation.

  In the refrigeration apparatus 1, the compressor 32, the four-way switching valve 33, the outdoor heat exchanger 30, the electric expansion valve 34, the indoor heat exchanger 20, the accumulator 31, and the like are connected via the refrigerant pipes 41 and 42. A refrigerant circuit 11 is configured.

(1-1) Refrigerant circuit 11
A refrigerant is sealed in the refrigerant circuit 11, and the refrigerant is compressed, cooled, decompressed, evaporated, and then compressed again.

  During the cooling operation, the four-way switching valve 33 is in the state indicated by the solid line in FIG. 1, that is, the discharge side of the compressor 32 is connected to the gas side of the outdoor heat exchanger 30 and the suction side of the compressor 32 is the accumulator 31. Is connected to the gas side of the indoor heat exchanger 20. In the cooling operation, the refrigeration apparatus 1 causes the outdoor heat exchanger 30 to function as a radiator and the indoor heat exchanger 20 to function as an evaporator.

  During the heating operation, the four-way switching valve 33 is in the state indicated by the broken line in FIG. 1, that is, the discharge side of the compressor 32 is connected to the gas side of the indoor heat exchanger 20, and the suction side of the compressor 32 is the accumulator 31. It is in the state connected to the gas side of the outdoor heat exchanger 30 via. In the heating operation, the refrigeration apparatus 1 causes the indoor heat exchanger 20 to function as a radiator and the outdoor heat exchanger 30 to function as an evaporator.

(1-2) Branch circuit 12
The refrigerant branched from the refrigerant circuit 11 flows through the branch circuit 12. The branch circuit 12 is provided in parallel in the portion of the refrigerant circuit 11 between the outdoor heat exchanger 30 and the electric expansion valve 34 and between the electric expansion valve 34 and the indoor heat exchanger 20. The branch circuit 12 is connected to the second electric expansion valve 62, the cooling unit 53, and the third electric expansion valve 63.

  During the cooling operation, a part of the refrigerant flowing through the refrigerant circuit 11 is branched into the branch circuit 12 from between the outdoor heat exchanger 30 and the electric expansion valve 34, and the second electric expansion valve 62, the cooling unit 53, and the third electric motor. It flows in the order of the expansion valve 63 and joins between the electric expansion valve 34 and the indoor heat exchanger 20. Further, during the heating operation, a part of the refrigerant flowing through the refrigerant circuit 11 is branched into the branch circuit 12 from between the indoor heat exchanger 20 and the electric expansion valve 34, and the third electric expansion valve 63, the cooling unit 53, and the The two electric expansion valves 62 flow in this order, and join between the electric expansion valve 34 and the outdoor heat exchanger 30.

(2) Configuration of Electrical Component Unit 50 FIG. 2 is an external view of the electrical component unit 50. In FIG. 2, the electrical component unit 50 includes a case 51, a cooling unit 53, a dehumidifying heat sink 55, and a control board 57 on which electronic components are mounted.

(2-1) Case 51
The case 51 is a rectangular parallelepiped box, and is arranged so that the long side is parallel to the vertical direction. The case 51 has a drain drain hole 51a and a cable lead-in hole 51b on the lower surface.

  The drain drain hole 51a discharges the condensed water when the water condensed in the dehumidifying heat sink 55, so-called condensed water, falls.

  The cable drawing hole 51b draws the cable 70 in a state where the power supply line, the signal line, and the like to the control board 57 are bundled.

  The opening area of the drain drain hole 51a is extremely smaller than the clearance area between the cable drawing hole 51b and the cable 70, and ventilation in the case 51 is performed exclusively between the cable drawing hole 51b and the cable 70.

  The case 51 has an opening 51c on one side surface. The opening 51 c is covered by the cooling unit 53.

(2-2) Cooling unit 53
The cooling unit 53 includes a refrigerant pipe 531, a refrigerant jacket 533, and a heat transfer plate 535.

(2-2-1) Refrigerant tube 531
The refrigerant pipe 531 is a pipe bent into a serpentine shape, and is connected to the second electric expansion valve 62 of the branch circuit 12 at one end and the third electric expansion valve 63 of the branch circuit 12 at the other end (see FIG. 1).

(2-2-2) Refrigerant jacket 533
The refrigerant jacket 533 is an aluminum rectangular parallelepiped lump and has a groove into which the refrigerant pipe 531 is fitted.

(2-2-3) Heat transfer plate 535
The heat transfer plate 535 is attached so as to be in close contact with the surface of the refrigerant jacket 533 opposite to the refrigerant tube 531. A heat transfer plate 535 covers the opening 51 c of the case 51. The heat transfer plate 535 extends from the bottom surface in the case 51 toward the top surface, and terminates in front of the top surface.

  Of the heat transfer plate 535, the surface in contact with the refrigerant jacket 533 is the first region 535a, the surface in contact with the dehumidifying heat sink 55 is the second region 535b, and the surface in contact with the power module 571a and the diode module 571b. A third region 535c and a region adjacent to and in contact with the reactor 572a are referred to as a fourth region 535d.

  The heat transfer plate 535 has a temperature distribution in the in-plane direction due to the cooling capacity of the refrigerant jacket 533 and the amount of heat generated by the heat-generating component in contact therewith. Basically, the portion where the heat generation amount is large has a high temperature, and the portion where the heat generation amount is small has a low temperature. Moreover, the temperature is low in the portion with high cooling capacity, and the temperature is high in the portion with low cooling capacity.

  Since the heat resistance in the plate thickness direction of the heat transfer plate 535 is small, the second region 535b and the second region 535b on the opposite side across the plate thickness from the first region 535a of the heat transfer plate 535 in contact with the refrigerant jacket 533 The third region 535c may be considered to be directly cooled by the refrigerant jacket 533, and is a region having a high cooling capacity.

  On the other hand, since the fourth region 535d is separated from the refrigerant jacket 533, the cooling capacity is low.

  Regarding the heat generation amount of each part, the heat generation amount of the power module 571a and the diode module 571b is the largest, and the reactor is much smaller (a fraction of the reactor), and the heat sink 55 for dehumidification has the latent heat of dehumidification. Because it is only the heat transfer from the air, it hardly generates heat.

  From these facts, when considering the balance between the heat generation amount and the cooling capacity, it is considered that the temperature of the second area 535b with little heat generation and the high cooling capacity is the lowest, and the third area 535c and the fourth area 535d are lower than that. The temperature is high.

(2-3) Heat sink 55 for dehumidification
The dehumidifying heat sink 55 is fixed to the second region 535 b of the heat transfer plate 535. The dehumidifying heat sink 55 includes a base 551 fixed to the second region 535 b of the heat transfer plate 535 and a fin portion 553 extending from the base 551 in a direction perpendicular to the heat transfer plate 535.

  The heat sink 55 for dehumidification is cooled by the second region 535 b having the lowest temperature in the heat transfer plate 535, and the surface temperature thereof is lower than the dew point in the case 51. As a result, moisture contained in the air in the case 51 is cooled and condensed by the dehumidifying heat sink 55, and condensation is formed on the surface of the dehumidifying heat sink 55.

  Since the drain drain hole 51a is provided on the lower surface, the dew condensation water that has dropped from the surface of the heat sink 55 for dehumidification is discharged through the drain drain hole 51a.

  Further, since the cable lead-in hole 51b is also provided on the lower surface of the case 51, the air entering from the cable lead-in hole 51b passes through the surface of the dehumidifying heat sink 55. At this time, moisture contained in the invading air is cooled and condensed by the dehumidifying heat sink 55, and condensation is formed on the surface of the dehumidifying heat sink 55.

  Therefore, air that enters the case 51 by natural ventilation is dehumidified by the heat sink 55 for dehumidification, so that the dew point in the case 51 is suppressed from increasing.

(2-4) Control board 57
The control board 57 includes a first board 571 and a second board 572. The first substrate 571 and the second substrate 572 have a thin plate shape made of a resin such as a glass epoxy resin, and are arranged in parallel to each other.

(2-4-1) First substrate 571
Of the outer surface of the first substrate 571, the power module 571a and the diode module 571b are mounted on the surface facing the heat transfer plate 535, and the control microcomputer 571c and the switching power supply 571d are mounted on the opposite surface. Yes. The heat radiation surfaces of the power module 571a and the diode module 571b are attached to the third region 535c of the heat transfer plate 535 so that heat can be transferred.

  Here, “attached so that heat can be transferred” means that the heat is transferred between the heat radiation surfaces of the power module 571a and the diode module 571b and the second region 535b of the heat transfer plate 535. Meaning. Therefore, not only the two are in direct contact with each other, but also a configuration in which a heat radiating sheet or silicon grease is sandwiched is “a configuration that allows heat transfer”.

  In such a configuration, since the heat resistance due to heat transfer is sufficiently small, the power module 571a and the diode module 571b are equivalent to being directly cooled by the refrigerant jacket 533.

(2-4-2) Second substrate 572
A reactor 572a is mounted on a region of the outer surface of the second substrate 572 that faces the first substrate 571 and does not overlap the first substrate 571. Reactor 572a is attached to heat transfer plate 535 via a heat transfer sheet so that heat can be transferred.

  Also, a film capacitor 572b as a smoothing capacitor and a regenerative absorption capacitor 572c are mounted on a surface of the outer surface of the second substrate 572 that does not face the first substrate 571.

  Although the temperature of the reactor 572a rises due to heat generation, it is significantly smaller than the heat generation amounts of the power module 571a and the diode module 571b, so that the reactor 572a is sufficiently attached to the fourth region 535d of the heat transfer plate 535 so that heat can be transferred. To be cooled.

  Since the heat generation amount of other components such as the film capacitor 572b and the regeneration absorption capacitor 572c is smaller than that of the reactor 572a, it can be cooled by the air cooled by the heat transfer plate 535.

(3) Humidity control in the electrical component unit 50 In the electrical component unit 50, the inside of the case 51 is dehumidified by the heat sink 55 for dehumidification, thereby dew condensation on the heat transfer plate 535 cooled by the refrigerant jacket 533 and having a low temperature. Is preventing.

  In the sealed structure in which the outside air does not enter the case 51, the dew condensation on the heat transfer plate 535 hardly occurs once the inside of the case 51 is dehumidified.

  On the other hand, in the case of a semi-hermetic structure that allows the outside air to enter the case 51 to some extent, it is necessary to grasp the relationship between the number of ventilations in the case 51 and the necessary dehumidification amount.

  FIG. 3 is a table showing the ventilation frequency for each panel structure cited from Nissin Electric Co., Ltd./Vanlom Electronic Dehumidifier Technical Document 9. In FIG. 3, the four columns of [ventilation hole], [door clearance], [cable entry hole clearance], and [joint clearance] are displayed in the horizontal column labeled [Structure]. Shows the number of ventilations. In addition, the vertical display columns for [Ventilation hole], [Door clearance], [Cable entry clearance], and [Junction clearance] indicate ○ if there is such a structure, × if not. Is displayed.

  For example, when there are [ventilation hole], [door clearance], [cable entry hole clearance], and [joint clearance], the ventilation frequency is 15 times per hour. In addition, when there are only [cable drawing hole clearance] and [joint clearance], the ventilation frequency is 5 times per hour. In addition, when there is only [a gap between joints], the ventilation frequency is 0.5 to 1 per hour.

  The applicant substituted the sealing level of the case 51 with the ventilation frequency shown in FIG. 3, and conducted the following examination using the ventilation frequency as a parameter.

  FIG. 4 is a graph showing the relationship between the internal volume (L) of the case 51 and the dehumidification amount (g / h) in the case 51 by the dehumidifying heat sink 55 of a predetermined size, using the ventilation frequency as a parameter. The size of the dehumidifying heat sink 55 is 100 mm × 50 mm × 50 mm, and the refrigerant temperature is 20 ° C. As shown in FIG. 4, as the number of ventilations increases, naturally, the chance of entering moist air into the case 51 increases. Therefore, the dehumidification amount of the heat sink 55 for dehumidification increases.

  Condensation does not cause condensation because each electrical component generates heat and the dew point of the air in the case 51 is always lower than the minimum temperature of each electrical component. The dew point of the internal air rises when there is much intrusion of air from the outside, and falls when the amount of dehumidification in the dehumidifying heat sink 55 increases.

  FIG. 5 is a graph showing the relationship between the internal volume (L) of the case 51 and the dew point (° C.) in the case 51 using the ventilation frequency as a parameter. In FIG. 5, in the case 51 having an internal volume of 6 liters, the dew point is 24.7 ° C. with a ventilation degree of 10 (times / h) and the dew point is 5 (times / h). Has a sealing degree of 22.6 ° C. and a ventilation rate of 1 (times / h) and a dew point of about 20.6 ° C.

  For example, in the case of the electrical component unit 50 according to this embodiment, the internal volume of the case 51 is about 5 liters, and there is no specification of [ventilation hole] and [door clearance]. Times / h) level of sealing. Then, since the dew point in the case 51 is about 22 ° C. from FIG. 5, condensation does not occur unless the electrical component is cooled to a temperature lower than 22 ° C.

  4 and 5, when the internal volume of the case 51 is 6L or less, the sealing degree of the case 51 may be semi-sealed with a ventilation frequency of 5 (times / h). However, when the internal volume of the case 51 exceeds 6L, it is preferable that the degree of sealing of the case 51 is suppressed to 1 (times / h) or less.

  As described above, since the dew point in the case 51 is lowered by the dehumidifying effect of the dehumidifying heat sink 55 provided in the lower part of the case 51 of the electrical component unit 50, the power module 571 a is directly transferred from the cooling unit 53. In addition, by cooling the diode module 571b, the diode module 571b can be sufficiently cooled without causing condensation.

(4) Features (4-1)
In the electrical component unit 50, heat transfer cooling is performed directly by the cooling unit 53, but the case 51 is used as a sealed structure to prevent intrusion of outside air, and the dehumidifying heat sink 55 disposed inside the case 51 reduces the dew point inside the case 51. Since condensation is prevented by lowering the temperature of the electrical component group 570 below the lowest temperature portion, condensation can be prevented without lowering the refrigerant capacity.

  Further, although heat is trapped in the case 51, since the cooling unit 53 also cools the air, heat-generating components (such as a reactor) that are not directly subjected to heat transfer cooling are indirectly cooled by natural convection of cold air.

(4-2)
Further, in the electrical component unit 50, the inside of the case has a semi-enclosed structure in which air is exchanged at a frequency of 0 to 5 times within one hour, but the dehumidifying heat sink dehumidifies the inside of the case 51 and lowers the dew point. Even if the power module 571a is directly heat-transfer cooled, condensation does not occur around the power module 571a.

(4-3)
Further, in the electrical component unit 50, the drain drain hole 51a, which is assumed to be inflow of external air, is provided at a position adjacent to the dehumidifying heat sink 55, so that the air containing moisture is dehumidified before natural convection. In addition, adhesion of condensed water to the cooling unit 53 is prevented.

(4-4)
Further, in the electrical component unit 50, since the cable lead-in hole 51b where inflow of external air is assumed is provided at a position adjacent to the heat sink 55 for dehumidification, the air containing moisture is dehumidified before natural convection. In addition, adhesion of condensed water to the cooling unit 53 is prevented.

(4-5)
Further, in the electrical component unit 50, the dehumidifying heat sink 55 is disposed at a position lower than the electrical component group 570, so that dew condensation water generated by the dehumidifying heat sink 55 is prevented from being applied to the electrical component group 570. The

(5) Modification (5-1)
The electrical component unit 50 according to the above embodiment has a configuration in which the cooling unit 53 and the dehumidifying heat sink 55 are joined, but is not limited thereto. For example, by integrating the cooling unit 53 and the dehumidifying heat sink 55, the thermal conductivity from the cooling unit 53 to the dehumidifying heat sink 55 is improved. Further, the manufacturing cost can be reduced by integral molding by die casting.

(5-2)
In the electrical component unit 50 according to the above-described embodiment, only the heat transfer plate 535 is accommodated in the case 51. However, the refrigerant jacket 533 can also be accommodated and the refrigerant jacket 533 itself can be used as a heat sink for dehumidification. is there. In this case, the manufacturing cost can be further reduced by reducing the number of parts.

(5-3)
Further, a part of the piping constituting the refrigerant pipe 531 may be allowed to enter the case 51 and be used as a heat sink for dehumidification.

(6) Others (6-1)
In the electrical component unit 50 according to the above embodiment, a fan that forcibly circulates the air cooled by the cooling unit 53 may be installed. By the forced circulation of the cold air by the fan, the dehumidifying performance and the cooling performance are improved, and further, the heat sink 55 for dehumidification can be downsized.

(6-2)
In the electrical component unit 50 according to the above-described embodiment, the dehumidifying heat sink 55 is provided in the lower portion of the case 51 so that the dew condensation water of the dehumidifying heat sink 55 does not drip onto the electrical component group 570. However, the present invention is limited to this. It is not a thing. For example, it is possible to provide a tray on the heat sink 55 for dehumidification and arrange it in a portion other than the lower part in the case 51.

  The present invention is useful not only for electrical component units of refrigeration apparatuses but also for electrical component units that require cooling.

DESCRIPTION OF SYMBOLS 50 Electrical component unit 51 Case 51a Drain drainage hole 51b Cable lead-in hole 53 Cooling part 531 Refrigerant flow path 533 Refrigerant jacket 535 Heat transfer plate 55 Dehumidification heat sink (dehumidification part)
570 Electrical component group 571a Heating component 571b Heating component

JP 2012-1227591 A JP2013-15295A JP 2010-002120 A JP 2011-220654 A

Claims (5)

An electrical component unit equipped with an electrical component group (570) including heat generating components (571a, 571b) used for controlling a device having a refrigerant circuit,
A case (51) for housing the electrical component group (570);
A cooling section (53) that includes a refrigerant flow path (531) through which the refrigerant passes, and cools the heat generating components (571a, 571b) by natural convection ;
A dehumidifying part (55) disposed in the case (51) and dehumidifying the air in the case (51) by the cold heat of the refrigerant;
With
The case (51) is a ventilation that is a value obtained by dividing the amount of air (V) per hour flowing out of the case (51) or flowing into the case (51) by the volume (R) of the case (51). count (V / R) is Ri semi-sealed structure der which is suppressed to 0-5 times,
Furthermore, the case (51) has a drain drain hole (51a) at a position adjacent to the dehumidifying part (55).
Electrical component unit (50). An electrical component unit equipped with an electrical component group (570) including heat generating components (571a, 571b) used for controlling a device having a refrigerant circuit,
A case (51) for housing the electrical component group (570);
A cooling section (53) that includes a refrigerant flow path (531) for passing the refrigerant and cools the heat generating components (571a, 571b);
A dehumidifying part (55) disposed in the case (51) and dehumidifying the air in the case (51) by the cold heat of the refrigerant;
With
The case (51) is a ventilation that is a value obtained by dividing the amount of air (V) per hour flowing out of the case (51) or flowing into the case (51) by the volume (R) of the case (51). It is a semi-enclosed structure in which the number of times (V / R) is suppressed to 0 to 5 times,
Furthermore, the case (51) has a cable lead-in hole (51b) at a position adjacent to the dehumidifying part (55).
Electrical component unit (50). The dehumidifying part (55) is disposed at a position lower than the electrical component group (570).
The electrical component unit (50) according to claim 1 or 2 . The cooling part (53) and the dehumidifying part (55) are integrated.
The electrical component unit (50) according to claim 1 or 2 . The cooling part (53)
A heat transfer plate (535) to which the heat generating components (571a, 571b) are attached so as to be able to transfer heat;
A refrigerant jacket (533) for cooling the heat transfer plate (535) by the cold of the refrigerant;
Further including
The case (51) accommodates the refrigerant jacket (533) and the heat transfer plate (535).
The electrical component unit (50) according to claim 1 or 2 .

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