JP6331866B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device including a semiconductor module incorporating a semiconductor element, a cooler for cooling the semiconductor module, an electronic component electrically connected to the semiconductor module, and a case for housing them.

  For example, as a power conversion device that converts power between DC power and AC power, a device that includes a semiconductor module incorporating a semiconductor element, a cooler that cools the semiconductor module, and a case that accommodates the semiconductor module is known. (See Patent Document 1 below).

  The power conversion device includes an electronic component electrically connected to the semiconductor module. The electronic component is, for example, a capacitor for smoothing a DC voltage or a boosting reactor. These electronic components are housed in the case together with the semiconductor module and the cooler.

JP 2011-134413 A

  In the power converter, although the semiconductor module is cooled by the cooler, the electronic component is not sufficiently cooled. Therefore, there is a demand for a power conversion device that can further increase the cooling efficiency of electronic components.

  Further, it is desirable that the case has a higher rigidity. However, the power converter has room for improvement in case rigidity. Therefore, a power conversion device that can increase the rigidity of the case is desired.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power conversion device capable of effectively cooling an electronic component and improving the rigidity of a case.

One embodiment of the present invention has a main body portion containing a semiconductor element, a semiconductor module in which a power terminal protrudes from the main body portion , and a structure in which a cooling pipe for cooling the semiconductor module is stacked ;
An electronic component electrically connected to the semiconductor module;
A metal case for housing the structure and the electronic component;
The case includes a side wall portion forming an outer shell and a partition plate formed inside the side wall portion and connected to the side wall portion, and a component storage for storing the electronic component in the space in the case by the partition plate. Divided into a space and a structure storage space for storing the structure, and the electronic component is stored in the component storage space in contact with the partition plate,
The case includes a reinforcing plate formed in the structure housing space and connected to the partition plate and the side wall portion,
The side wall portion, the partition plate, and the reinforcing plate are integrally formed of the same metal material,
In the stacking direction of the semiconductor module and the cooling pipe, the structure and the component storage space are arranged,
The main surface of the reinforcing plate is orthogonal to both the main surface of the side wall portion and the main surface of the partition plate, and the thickness direction of the reinforcing plate coincides with the protruding direction of the power terminal,
Between the partition plate and the structure, a pressure member that pressurizes the structure in the stacking direction is interposed,
The part of the cooling tube and the said reinforcing plate is in the power conversion apparatus characterized by being configured to adjacent to the thickness direction.

  In the power converter, the reinforcing plate is formed in the case. And at least one part of a cooler and a reinforcement board are comprised so that it may adjoin in the said thickness direction. Therefore, the reinforcing plate can be easily cooled by the cooler. The electronic component is in contact with the partition plate, and the reinforcing plate is connected to the partition plate. Therefore, the heat generated from the electronic component can be transmitted to the reinforcing plate via the partition plate and further transmitted to the cooler. Thereby, it becomes possible to cool an electronic component effectively.

  The reinforcing plate is connected to the partition plate and the side wall portion. Therefore, when an external force is applied to the side wall portion from the outside of the case, the external force can be received by the reinforcing plate. Therefore, the rigidity of the case can be increased.

  As described above, according to the present invention, it is possible to provide a power conversion device that can effectively cool an electronic component and improve the rigidity of the case.

It is sectional drawing of the power converter device in Example 1, Comprising: II sectional drawing of FIG. II-II sectional drawing of FIG. III-III sectional drawing of FIG. IV-IV sectional drawing of FIG. FIG. 3 is an exploded perspective view of the case in the first embodiment. The circuit diagram of the power converter device in Example 1. FIG. It is sectional drawing of the power converter device in Example 2, Comprising: It is VII-VII sectional drawing of FIG. VIII-VIII sectional drawing of FIG. The circuit diagram of the power converter device in Example 2. FIG. The partial expansion perspective view of the power converter device in the reference example 1. FIG. Sectional drawing of the power converter device in a comparative example.

  The power conversion device can be a vehicle-mounted power conversion device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle.

Example 1
Examples of the power supply apparatus will be described with reference to FIGS. As shown in FIGS. 1 to 3, the power supply device 1 of the present example includes a structure 10 including a semiconductor module 2 and a cooler 3, an electronic component 4, and a case 5. The semiconductor module 2 includes a semiconductor element 20 (see FIG. 6). The cooler 3 cools the semiconductor module 2.

The electronic component 4 is electrically connected to the semiconductor module 2. Case 5 is made of metal. In this case 5, the structure 10 and the electronic component 4 are accommodated.
As shown in FIG. 5, the case 5 includes a side wall 51 that forms an outer shell, and a partition plate 52 that is formed inside the side wall 51 and connected to the side wall 51. The partition 52 separates the space in the case 5 into a component storage space S1 for storing the electronic component 4 and a structure storage space S2 for storing the structure 10. The electronic component 4 is stored in the component storage space S <b> 1 in contact with the partition plate 52.

The case 5 has a reinforcing plate 53 formed in the structure housing space S2. The reinforcing plate 53 is connected to the partition plate 52 and the side wall 51.
As shown in FIG. 2, a part of the cooler 3 and the reinforcing plate 53 are configured to be adjacent to each other in the thickness direction (Z direction) of the reinforcing plate 53.

  The power conversion device 1 of this example is a vehicle-mounted power conversion device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle.

  As shown in FIG. 2, in this example, the pair of reinforcing plates 53a and 53b are formed so as to overlap in the Z direction. A part of the cooler 3 is disposed between the pair of reinforcing plates 53a and 53b. The reinforcing plate 53 includes a power-side reinforcing plate 53a located on the power terminal 22 side described later in the Z direction and a control-side reinforcing plate 53b located on the control terminal 23 side described later. The power-side reinforcing plate 53a and the control-side reinforcing plate 53b are formed as a pair in the longitudinal direction (Y direction) of the cooling pipe 30 to be described later.

  As shown in FIG. 5, the case 5 includes two partition plates 52a and 52b. The electronic component 4 is stored in the component storage space S1 surrounded by the two partition plates 52a and 52b, the side wall 51, and the bottom wall 56 (see FIG. 3).

In this example as shown in FIG. 3, the component housing space S1, it is housed the capacitor 4 _C as an electronic component 4. Capacitor 4 _C includes a capacitor element 41 disposed in the component accommodating space S1, a capacitor sealing member 42 for sealing the capacitor element 41. The capacitor element 41 is directly sealed in the component storage space S <b> 1 of the case 5 by the capacitor sealing member 42. Therefore, the capacitor sealing member 42 is in contact with the partition plate 52.

  As described above, in this example, the partition plate 52 divides the space in the case 5 into the component storage space S1 and the structure storage space S2. As shown in FIG. 1, the structure 10 and the terminal block 14 are accommodated in the structure accommodation space S2. The plurality of connection terminals 140 provided on the terminal block 14 are used to electrically connect the power conversion device 1 and an external device.

  As shown in FIGS. 1 and 3, in this example, a plurality of semiconductor modules 2 and a plurality of cooling pipes 30 are stacked. Two cooling pipes 30 adjacent in the stacking direction (X direction) are connected by a connecting pipe 31. A flow path 13 through which the refrigerant 12 flows is formed inside the cooling pipe 30. The cooling pipe 30 and the connecting pipe 31 constitute the cooler 3.

As shown in FIG. 2, the semiconductor module 2 includes a main body portion 21, a power terminal 22 protruding from the main body portion 21, and a control terminal 23. The main body 21 contains the semiconductor element 20 (see FIG. 6). The power terminal 22, is DC terminals 22a connected to the capacitor _{4 C,} and 22b, and the AC terminal 22c is electrically connected to the AC load 82 (see FIG. 6). DC terminals 22a, 22b, depending busbar (not shown) is connected to the capacitor _{4 C} terminal 49 (see FIG. 1). The AC terminal 22c is connected to an AC output terminal 140c provided on the terminal block 14 by a bus bar (not shown).

  The control terminal 23 is connected to the control circuit board 23. The control circuit board 23 controls the on / off operation of the semiconductor module 2. Thereby, the DC voltage applied between the DC terminals 22a and 22b is converted into an AC voltage. And it is comprised so that the said alternating current load 82 (refer FIG. 6) may be driven using the obtained alternating current power.

As shown in FIG. 6, in this example, an inverter circuit is configured using three semiconductor modules 2. The DC voltage applied to the semiconductor module 2, and smoothed by capacitor 4 _C. The capacitor 4 _C, the discharge resistor 11 are connected in parallel. The charge stored in the capacitor 4 _C, through the discharge resistor 11, are to be discharged little by little constantly. Thereby, even when the relay 18 is turned off for some reason, the capacitor _4C is discharged in a short time so that an electric shock accident or the like does not occur.

  In this example, as shown in FIGS. 2 and 4, the discharge resistor 11 is mounted on the control circuit board 6. The discharge resistor 11 is provided at a position overlapping the reinforcing plate 53 in the Z direction. When the power converter 1 is operating, the discharge resistor 11 always generates heat. Therefore, the heat generated from the discharge resistor 11 is transmitted to the cooler 3 through the reinforcing plate 53 to cool the discharge resistor 11.

  As shown in FIGS. 2 to 4, the case 5 has a plurality of fixing portions 61 for fixing the control circuit board 6 to the case 5. Among the plurality of fixing portions 61, some of the fixing portions 61 a are formed on the reinforcing plate 53. The other fixing portion 61 b is formed on the bottom wall portion 56.

  As shown in FIG. 5, the side wall 51 of the case 5 is formed with a first opening 57 that opens in the X direction and a second opening 58 that opens in the Y direction. The first opening 57 is blocked by the mounting plate 7. The mounting plate 7 is provided with an introduction pipe 15 for introducing the refrigerant 12 into the cooler 3 and a lead-out pipe 16 for deriving the refrigerant 12 from the cooler 3. The mounting plate 7 is bolted to the side wall 51.

  Case 5 of this example is manufactured by die casting. In die casting, a molding space is formed by combining a plurality of dies, and molten metal is poured into the molding space. Thereafter, the molten metal is cooled and solidified, and the mold is pulled out. At this time, some of the molds are used to form a space between the pair of reinforcing plates 53 a and 53 b in the space in the case 5. Even if the mold is to be pulled out in the Z direction, the reinforcing plates 53a and 53b are in the way and cannot be pulled out. Further, even if it is attempted to be pulled out in the Y direction, the side wall portion 51 is in the way and cannot be pulled out. Therefore, this mold must be pulled out in the X direction. The first opening 57 is formed in order to pull out the mold in the X direction.

  The second opening 58 is used for attaching a DC power supply 81 (see FIG. 6) and a connector (not shown) of the AC load 82.

  As shown in FIGS. 1 and 3, in this example, the pressure member 17 is interposed between the structure 10 and the partition plate 52. Using this pressurizing member 17, the cooling pipe 30 and the semiconductor module 2 are pressed toward the mounting plate 7. Thereby, the structure 10 is fixed in the case 5 while ensuring a contact pressure between the cooling pipe 30 and the semiconductor module 2.

As shown in FIGS. 2 and 3, two covers 54 and 55 are attached to the case 5. One cover 54, the power terminals 22 of the semiconductor module 2, the capacitor 4 _C terminal 49 to protect the bus bar that connects these (not shown). The other cover 55 protects the control circuit board 6.

  The effect of this example will be described. As shown in FIGS. 1 and 2, in this example, a reinforcing plate 53 is formed in the case 5. And at least one part of the cooler 3 and the reinforcement board 53 are comprised so that it may adjoin with Z direction. Therefore, the reinforcing plate 53 can be easily cooled by the cooler 3. The electronic component 4 is in contact with the partition plate 52, and the reinforcing plate 53 is connected to the partition plate 52. Therefore, the heat generated from the electronic component 4 can be transmitted to the reinforcing plate 53 via the partition plate 52 and further transmitted to the cooler 3. Thereby, the electronic component 4 can be effectively cooled.

  The reinforcing plate 53 is connected to the partition plate 52 and the side wall 51. Therefore, even when an external force is applied to the side wall 51 of the case 5, this external force can be received by the reinforcing plate 53. Therefore, the rigidity of the case 5 can be increased.

As shown in FIGS. 1 and 5, the reinforcing plate 53 is orthogonal to the side wall 51.
In this way, a part of the cooler 3 and the reinforcing plate 53 can be adjacent to each other in the Z direction, and a part of the side wall 51 (adjacent part 51a) and the cooler 3 can be adjacent to each other in the Y direction. Can do. Therefore, a part of the heat of the electronic component 4 can be transmitted to the cooler 3 through the adjacent portion 51a. That is, the heat conduction path can be increased. Thereby, it becomes possible to cool the electronic component 4 more effectively.

Moreover, the electronic component 4 of the present embodiment is a capacitor 4 _C. Capacitor 4 _C, as shown in FIG. 3, a capacitor element 41 housed in the part housing space S1, a capacitor sealing member 42 for sealing the capacitor element 41 to the component housing space S1. The capacitor sealing member 42 is in contact with the partition plate 52.
It is possible to seal the capacitor element 41 in a dedicated capacitor case to form the capacitor 4 _C and store it in the component storage space S 1. In this case, the capacitor sealing member 42, the partition plate 52, Therefore, there is a possibility that the heat generated from the capacitor element 41 is difficult to be transmitted to the partition plate 52. Moreover, since a capacitor case is required, the number of parts increases and the manufacturing cost of the power converter device 1 may increase. However, if the capacitor sealing member 42 is brought into contact with the partition plate 52 as in this example, the heat generated from the capacitor element 41 can be easily transferred to the partition plate 52. Therefore, the cooling efficiency of the capacitor element 41 can be increased. Moreover, since the capacitor case is not necessary, the number of parts can be reduced, and the manufacturing cost of the power conversion device 1 can be reduced.

As shown in FIGS. 2 and 4, the power conversion device 1 of the present example includes a discharge resistor 11 for discharging the charge stored in the capacitor 4 </ b> _C. The discharge resistor 11 is mounted on the control circuit board 6. The discharge resistor 11 is mounted at a position overlapping the reinforcing plate 53 in the Z direction.
Therefore, the discharge resistor 11 can be disposed in the vicinity of the reinforcing plate 53. Therefore, the heat generated from the discharge resistor 11 can be transferred to the reinforcing plate 53 and further transferred to the cooler 3. Thereby, the discharge resistor 11 can be effectively cooled. Since the discharge resistor 11 constantly generates heat during operation of the power conversion device 1, the effect of allowing the discharge resistor 11 to be cooled is great.

In this example, as shown in FIGS. 2 and 4, a fixing portion 61 for fixing the control circuit board 6 is provided on the reinforcing plate 53.
In this way, even when vibration is transmitted from the outside, it is possible to suppress a large stress from being applied to the control terminal 23. That is, since the reinforcing plate 53 is formed in the vicinity of the cooler 3 and the semiconductor module 2 to be cooled by the cooler 3, the control terminal 23 of the semiconductor module 2 is located in the vicinity of the reinforcing plate 53. Therefore, by providing the fixing portion 61 on the reinforcing plate 53, the control circuit board 23 can be fixed at a position close to the control terminal 23. Therefore, even when vibration is transmitted from the outside, a portion 69 of the control circuit board 23 near the control terminal 23 is difficult to be displaced, and the stress applied to the control terminal 23 can be reduced.

In this example, as shown in FIGS. 2 and 3, the pair of reinforcing plates 53a and 53b are formed so as to overlap each other in the Z direction. Therefore, the heat generated from the electronic component 4 flows in a pair of reinforcing plates 53a and 53b. Therefore, the heat transfer paths can be increased, and the electronic component 4 can be cooled more effectively.
Further, when the reinforcing plates 53 are formed as a pair, the number of the reinforcing plates 53 can be increased, so that the rigidity of the case 5 can be further increased.

  Further, when the pair of reinforcing plates 53a and 53b are formed so as to overlap each other in the Z direction, it is possible to suppress a problem that the case 5 is deformed by the pressing force of the pressing member 17. That is, as shown in FIG. 11, if the reinforcing plates 53 are not paired but are provided only on one side in the Z direction, the case 5 may be deformed by the pressing force of the pressure member 917. On the other hand, if the reinforcing plates 53a and 53b are formed as a pair as in this example, the force applied to the case 5 can be equalized. Therefore, the malfunction which case 5 deform | transforms can be suppressed.

In this example, as shown in FIGS. 1 and 2, the cooler 3 is configured by a plurality of cooling pipes 30 and a connecting pipe 31 that connects the cooling pipes 30. The reinforcing plate 53 is formed adjacent to the cooling pipe 30 and the connecting pipe 31 in the Z direction.
If it does in this way, since the reinforcement board 53 adjoins not only the cooling pipe 30 but the connection pipe 31, the cooling efficiency of the reinforcement board 53 can be improved. Therefore, the cooling efficiency of the electronic component 4 can be further improved.

In this example, as shown in FIG. 1, the partition plate 52 is formed thinner than the side wall 51. In this way, the case 5 can be reduced in weight. Moreover, since the usage-amount of the metal material which comprises the case 5 can be reduced, the manufacturing cost of the power converter device 1 can be reduced.
In this example, since the component housing space S1 is filled with the capacitor sealing member 42, the pressing force of the pressing member 17 can be received by the capacitor sealing member 42. Therefore, even if the partition plate 52 is formed thin, a problem that the partition plate 52 is deformed due to the pressing force of the pressurizing member 17 hardly occurs.

  As described above, according to this example, it is possible to provide a power conversion device that can effectively cool an electronic component and improve the rigidity of the case.

(Example 2)
In the following embodiments, the same reference numerals used in the drawings among the reference numerals used in the drawings represent the same components as in the first embodiment unless otherwise specified.

In this example, the shape of the case 5 is changed. In this example, as shown in FIG. 7, a component storage space S <b> 1 and an auxiliary component storage space S <b> 1 ′ are formed in the case 5. Then, the reactor 4 _L accommodated in the component accommodating space S1, the auxiliary component housing space S1 'to are housed capacitor 4 _C.

As shown in FIGS. 7 and 8, the reactor 4 _L includes an electromagnetic coil 43 stored in the component storage space S <b> 1 and a coil sealing member 44 that seals the electromagnetic coil 43. The electromagnetic coil 43 is directly sealed in the component storage space S <b> 1 of the case 5 by a coil sealing member 44. Therefore, the coil sealing member 44 is in contact with the partition plate 52. The coil sealing member 44 is a so-called dust core in which a magnetic powder is mixed with an insulating resin.

As shown in FIG. 9, the power conversion device 1 of this example includes a booster circuit 89 for boosting the voltage of the DC power supply 81. Reactor 4 _L is used in booster circuit 89.

The effect of this example will be described. In this example, since the coil sealing member 44 is in contact with the partition plate 52, the heat of the electromagnetic coil 43 can be easily transmitted to the partition plate 52. Therefore, the cooling efficiency of the electromagnetic coil 43 can be increased.
In addition, the configuration and operational effects similar to those of the first embodiment are provided.

( Reference Example 1 )
In this example, the configuration of the structure 10 is changed. In this example, the cooler 3 and the semiconductor module 2 are not stacked. The cooler 3 includes a cooling pipe 30 in which a flow path 13 for the refrigerant 12 is formed, and an introduction pipe 15 and a lead-out pipe 16 connected to the cooling pipe 30. The semiconductor module 2 is pressed and fixed to the cooling pipe 30 by a pressure member (not shown).
In addition, the configuration and operational effects similar to those of the first embodiment are provided.

DESCRIPTION OF SYMBOLS 1 Power converter 10 Structure 2 Semiconductor module 20 Semiconductor element 3 Cooler 4 Electronic component 5 Case 51 Side wall part 52 Partition plate 53 Reinforcement plate S1 Component storage space S2 Structure storage space

Claims (8)

A semiconductor module (2) having a main body (21) containing a semiconductor element (20) and having a power terminal (22) protruding from the main body (21) , and a cooling pipe for cooling the semiconductor module (2) (30) laminated structure (10),
An electronic component (4) electrically connected to the semiconductor module (2);
A metal case (5) for housing the structure (10) and the electronic component (4);
The case (5) includes a side wall portion (51) forming an outer shell and a partition plate (52) formed inside the side wall portion (51) and connected to the side wall portion (51). 52) divides the space in the case (5) into a component storage space (S1) for storing the electronic component (4) and a structure storage space (S2) for storing the structure (10). The electronic component (4) is stored in the component storage space (S1) in contact with the partition plate (52),
The case (5) includes a reinforcing plate (53) formed in the structure housing space (S2) and connected to the partition plate (52) and the side wall (51).
The side wall (51), the partition plate (52), and the reinforcing plate (53) are integrally formed of the same metal material,
In the stacking direction (X) of the semiconductor module (2) and the cooling pipe (30), the structure (10) and the component storage space (S1) are arranged.
The main surface of the reinforcing plate (53) is orthogonal to both the main surface of the side wall portion (51) and the main surface of the partition plate (52), and the thickness direction (Z ) Matches the protruding direction of the power terminal (22),
Between the partition plate (52) and the structure (10), a pressure member (17) for pressing the structure (10) in the stacking direction (X) is interposed,
A portion the reinforcing plate of the cooling tube (30) and (53), but the power conversion apparatus characterized by being configured to adjacent to the thickness direction (Z) (1). The electronic component (4) is a capacitor (4 _C ), and the capacitor (4 _C ) includes the capacitor element (41) accommodated in the component accommodating space (S1) and the capacitor element (41) as the component. The capacitor sealing member (42) sealed in the storage space (S1), wherein the capacitor sealing member (42) is in contact with the partition plate (52). The power converter (1) described. The semiconductor module (2) includes a main body (21) containing the semiconductor element (20) and a control terminal (23) protruding in the thickness direction from the main body (21). The control circuit board (6) for controlling the operation of (20) is connected to the control terminal (23), and the electric charge stored in the capacitor (4 _C ) is discharged to the control circuit board (6). The discharge resistance (11) is mounted, and the discharge resistance (11) is mounted at a position overlapping the reinforcing plate (53) in the thickness direction. Device (1). The electronic component (4) is a reactor (4 _L ), and the reactor (4 _L ) includes an electromagnetic coil (43) accommodated in the component accommodating space (S1) and the electromagnetic coil (43) as the component. The coil sealing member (44) sealed in the storage space (S1), wherein the coil sealing member (44) is in contact with the partition plate (52). The power converter described. The pair of reinforcing plates (53a, 53b) are provided so as to overlap each other in the thickness direction, and a part of the cooling pipe (30) is arranged between the pair of reinforcing plates (53a, 53b). The power converter device (1) according to any one of claims 1 to 4, wherein the power converter device (1) is provided.   The semiconductor module (2) includes a control terminal (23) protruding from the main body (21) to the opposite side of the power terminal (22) in the thickness direction (Z), and the pair of reinforcing plates (53a, 53b) include a power-side reinforcing plate (53a) disposed on the power terminal (22) side in the thickness direction (Z) and a control-side reinforcing member disposed on the control terminal (23) side. And the two power reinforcing plates (53a) are adjacent to each other in the width direction (Y) perpendicular to both the stacking direction (X) and the thickness direction (Z). The power converter device (1) according to claim 5, wherein the two control-side reinforcing plates (53b) are configured to be adjacent to each other. Comprising connecting pipe for connecting said plurality of cooling tubes (30) to (31), the reinforcing plate (53), the cooling tube (30) and the connecting pipe relative to (31), next to the thickness direction It forms in the position which fits, The power converter device (1) of any one of Claims 1-6 characterized by the above-mentioned. The semiconductor module (2) includes a main body (21) containing the semiconductor element (20) and a control terminal (23) protruding in the thickness direction from the main body (21). A control circuit board (6) for controlling the operation of the control circuit is connected to the control terminal (23), and a fixing portion (61) for fixing the control circuit board (6) is formed on the reinforcing plate (53). The power converter device (1) according to any one of claims 1 to 7 , characterized in that:

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