JP6327704B2 - Method for producing surface protective film - Google Patents

Description

  The present invention relates to a method for producing a surface protective film. Moreover, this invention relates to the surface protection film manufactured by such a manufacturing method. Furthermore, the present invention relates to an optical member and an electronic member to which such a surface protective film is attached.

  LCDs, organic EL, touch panels using these, lens parts of cameras, optical members and electronic members such as electronic devices are generally exposed to prevent scratches on the surface during processing, assembly, inspection, transportation, etc. A surface protective film is attached to the surface side.

  Such a surface protective film usually has a base material layer and an adhesive layer, and a separator is provided to protect the surface of the adhesive layer. Such a surface protective film is applied to an adherend such as an optical member or an electronic member after peeling the separator and exposing the pressure-sensitive adhesive layer. It peels from adherends, such as a member and an electronic member (for example, patent documents 1, 2).

  In a surface protective film used for an optical member or an electronic member, charging such as generation of static electricity must be sufficiently prevented in order not to cause loss of alignment of liquid crystal molecules or loss of a panel.

  However, when the separator is peeled from the surface of the pressure-sensitive adhesive layer, peeling electrification can occur. In addition, the substrate layer of the surface protection film and the adherends such as optical members and electronic members generally include a plastic material as a constituent material, and thus have high electrical insulation, and generate static electricity during friction and peeling. obtain.

JP-A-2005-306996 JP 2005-309071 A

  The subject of this invention is providing the manufacturing method of the surface protection film which was very excellent in antistatic property. Moreover, the subject of this invention is providing the surface protection film manufactured by such a manufacturing method. Furthermore, the subject of this invention is providing the optical member and electronic member by which such a surface protection film was stuck.

The method for producing the surface protective film of the present invention comprises:
A method for producing a surface protective film having a base material layer and an adhesive layer,
A laminate comprising a base material layer and an adhesive layer, wherein the adhesive layer is the outermost layer,
A separator containing at least one compound (A) selected from an ionic liquid, an ion conductive polymer, an ion conductive filler, and an electric conductive polymer is bonded to the surface of the pressure-sensitive adhesive layer opposite to the base material layer,
Thereafter, the separator is peeled off.

  In a preferred embodiment, the time from bonding the separator to peeling is 6 hours to 2 years.

  In a preferred embodiment, the ionic liquid is an ionic liquid composed of a fluoroorganic anion and an onium cation.

  In a preferred embodiment, the onium cation is at least one selected from a nitrogen-containing onium cation, a sulfur-containing onium cation, and a phosphorus-containing onium cation.

  In preferable embodiment, the content rate of the said compound (A) in the said separator is 0.001 weight%-2.0 weight%.

  In a preferred embodiment, the pressure-sensitive adhesive layer contains at least one pressure-sensitive adhesive selected from an acrylic pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, and a rubber-based pressure-sensitive adhesive.

  The surface protective film of the present invention is produced by the production method of the present invention.

  The optical member of the present invention has the surface protective film of the present invention attached thereto.

  The electronic member of the present invention is obtained by attaching the surface protective film of the present invention.

  According to this invention, the manufacturing method of the surface protection film which was very excellent in antistatic property can be provided. Moreover, according to this invention, the surface protection film manufactured by such a manufacturing method can be provided. Furthermore, according to this invention, the optical member and electronic member which such a surface protection film was stuck can be provided.

It is a schematic sectional drawing of the surface protection film manufactured with the manufacturing method by preferable embodiment of this invention. It is a schematic sectional drawing of the laminated body obtained in the 2nd step of the manufacturing method by preferable embodiment of this invention.

≪A. Manufacturing method of surface protective film >>
The manufacturing method of the surface protection film of this invention is a manufacturing method of the surface protection film which has a base material layer and an adhesive layer.

  FIG. 1 is a schematic cross-sectional view of a surface protective film produced by a production method according to a preferred embodiment of the present invention. The surface protective film 10 includes a base material layer 1 and an adhesive layer 2 in this order. The surface protective film of the present invention may further have any appropriate other layer as required (not shown).

  For the purpose of forming a wound body that can be easily rewound on the surface of the base material layer 1 that is not provided with the pressure-sensitive adhesive layer 2, for example, the base material layer includes a fatty acid amide, polyethyleneimine, and a long-chain alkyl series. A release treatment can be performed by adding an additive or the like, or a coating layer made of any appropriate release agent such as silicone, long-chain alkyl, or fluorine can be provided.

<A-1. Stage 1>
In the method for producing a surface protective film of the present invention, first, a laminate comprising a base material layer and an adhesive layer, wherein the adhesive layer is the outermost layer, is produced.

A laminate comprising a base material layer and a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is the outermost layer, for example,
(1) Based on a solution or hot melt of a material for forming an adhesive layer (for example, a composition containing a polyol (A) and a polyfunctional isocyanate compound (B) which is a raw material of the urethane adhesive of the present invention). A method of applying on the material layer,
(2) A method for transferring the pressure-sensitive adhesive layer applied and formed on the separator to the base material layer according to the above,
(3) A method of forming and applying the forming material of the pressure-sensitive adhesive layer onto the base material layer,
(4) A method of extruding a base material layer and an adhesive layer in two layers or multiple layers,
(5) A method of laminating a pressure-sensitive adhesive layer on a base material layer, or a method of laminating two pressure-sensitive adhesive layers together with a laminate layer,
(6) A method of laminating a pressure-sensitive adhesive layer and a base material layer forming material such as a film or a laminate layer in two or multiple layers,
And can be prepared by any suitable method.

  The base material layer may be composed of a single layer or may be composed of a plurality of layers. The base material layer may be stretched.

  The thickness of the base material layer can be set to any appropriate thickness depending on the application. From the viewpoint of fully expressing the effects of the present invention, the thickness is preferably 20 μm to 150 μm, more preferably 25 μm to 125 μm, still more preferably 30 μm to 100 μm, and particularly preferably 35 μm to 75 μm.

  Any appropriate material can be adopted as the material of the base material layer depending on the application. Examples of such a material include plastic, paper, metal film, and non-woven fabric. Among such materials, plastic is preferable. The base material layer may be composed of one kind of material, or may be composed of two or more kinds of materials. For example, you may be comprised from 2 or more types of plastics.

  Examples of the plastic include a polyester resin, a polyamide resin, and a polyolefin resin. Examples of the polyester resin include polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. Examples of the polyolefin resin include olefin monomer homopolymers, olefin monomer copolymers, and the like. Specific examples of polyolefin resins include homopolypropylene; block-type, random-type, and graft-type propylene copolymers having an ethylene component as a copolymer component; reactor TPO; low density, high density, linear Low density, ultra-low density, etc. ethylene polymers; ethylene / propylene copolymer, ethylene / vinyl acetate copolymer, ethylene / methyl acrylate copolymer, ethylene / ethyl acrylate copolymer, ethylene / acrylic acid And ethylene copolymers such as butyl copolymer, ethylene / methacrylic acid copolymer, and ethylene / methyl methacrylate copolymer.

  The base material layer may contain any appropriate additive as required. Examples of the additive that can be contained in the base material layer include an antioxidant, an ultraviolet absorber, a light stabilizer, an antistatic agent, a filler, and a pigment. The kind, number, and amount of additives that can be contained in the base material layer can be appropriately set according to the purpose. In particular, when the material of the base material layer is plastic, it is preferable to contain some of the above additives for the purpose of preventing deterioration. From the viewpoint of improving weather resistance and the like, particularly preferred additives include antioxidants, ultraviolet absorbers, light stabilizers, and fillers.

  Any appropriate antioxidant can be adopted as the antioxidant. Examples of such antioxidants include phenol-based antioxidants, phosphorus-based processing heat stabilizers, lactone-based processing heat stabilizers, sulfur-based heat-resistant stabilizers, phenol-phosphorus-based antioxidants, and the like. The content of the antioxidant is preferably 1% by weight or less with respect to the base resin of the base layer (when the base layer is a blend, the blend is the base resin), more preferably It is 0.5 weight% or less, More preferably, it is 0.01 weight%-0.2 weight%.

  Arbitrary appropriate ultraviolet absorbers can be employ | adopted as a ultraviolet absorber. Examples of such UV absorbers include benzotriazole UV absorbers, triazine UV absorbers, and benzophenone UV absorbers. The content ratio of the ultraviolet absorber is preferably 2% by weight or less based on the base resin forming the base layer (when the base layer is a blend, the blend is the base resin), Preferably it is 1 weight% or less, More preferably, it is 0.01 weight%-0.5 weight%.

  Any appropriate light stabilizer can be adopted as the light stabilizer. Examples of such light stabilizers include hindered amine light stabilizers and benzoate light stabilizers. The content ratio of the light stabilizer is preferably 2% by weight or less based on the base resin forming the base layer (when the base layer is a blend, the blend is the base resin). Preferably it is 1 weight% or less, More preferably, it is 0.01 weight%-0.5 weight%.

  Any appropriate filler can be adopted as the filler. Examples of such fillers include inorganic fillers. Specific examples of the inorganic filler include carbon black, titanium oxide, and zinc oxide. The content of the filler is preferably 20% by weight or less with respect to the base resin forming the base layer (when the base layer is a blend, the blend is the base resin), and more preferably Is 10% by weight or less, more preferably 0.01% by weight to 10% by weight.

  Furthermore, as the additive, for the purpose of imparting antistatic properties, inorganic, low molecular weight and high molecular weight antistatic agents such as surfactants, inorganic salts, polyhydric alcohols, metal compounds, carbon and the like are also preferred. In particular, a high molecular weight antistatic agent and carbon are preferable from the viewpoint of contamination and adhesiveness maintenance.

  The pressure-sensitive adhesive layer may be composed of a single layer or may be composed of a plurality of layers.

  The thickness of the pressure-sensitive adhesive layer can be set to any appropriate thickness depending on the application. From the viewpoint of sufficiently expressing the effects of the present invention, the thickness is preferably 5 μm to 50 μm, more preferably 6 μm to 40 μm, still more preferably 7 μm to 30 μm, and particularly preferably 8 μm to 20 μm.

  Any appropriate pressure-sensitive adhesive layer can be adopted as the pressure-sensitive adhesive layer as long as the effects of the present invention are not impaired. Such an adhesive layer contains, for example, at least one adhesive selected from an acrylic adhesive, a urethane adhesive, a silicone adhesive, a polyester adhesive, and a rubber adhesive.

  The content ratio of the pressure-sensitive adhesive in the pressure-sensitive adhesive layer (for example, at least one pressure-sensitive adhesive selected from acrylic pressure-sensitive adhesives, urethane pressure-sensitive adhesives, silicone-based pressure-sensitive adhesives, polyester-based pressure-sensitive adhesives, and rubber-based pressure-sensitive adhesives) is preferable. Is 96% to 100% by weight, more preferably 97% to 100% by weight, still more preferably 98% to 100% by weight, and particularly preferably 99% to 100% by weight. By adjusting the content ratio of the pressure-sensitive adhesive in the pressure-sensitive adhesive layer within the above range, for example, a pressure-sensitive adhesive layer excellent in adhesive residue prevention and reworkability can be obtained.

  As the acrylic pressure-sensitive adhesive, any appropriate acrylic pressure-sensitive adhesive such as a known acrylic pressure-sensitive adhesive described in JP-A-2013-241606 can be adopted as long as the effects of the present invention are not impaired. .

  As the silicone-based pressure-sensitive adhesive, any appropriate silicone-based pressure-sensitive adhesive such as a known silicone-based pressure-sensitive adhesive described in Japanese Patent Application Laid-Open No. 2014-47280 can be adopted as long as the effects of the present invention are not impaired. .

  As the polyester-based pressure-sensitive adhesive, any appropriate polyester-based pressure-sensitive adhesive such as a known polyester-based pressure-sensitive adhesive described in Japanese Patent Application Laid-Open No. 2013-216875 can be adopted as long as the effects of the present invention are not impaired. .

  As the rubber-based pressure-sensitive adhesive, any appropriate rubber-based pressure-sensitive adhesive such as a known rubber-based pressure-sensitive adhesive described in JP 2011-236358 A can be employed as long as the effects of the present invention are not impaired. .

  As the urethane pressure-sensitive adhesive, any appropriate urethane pressure-sensitive adhesive such as a publicly known urethane pressure-sensitive adhesive can be adopted as long as the effects of the present invention are not impaired.

  As the urethane-based pressure-sensitive adhesive, it is particularly preferable to include a polyurethane-based resin.

  The content ratio of the polyurethane-based resin in the urethane-based pressure-sensitive adhesive is preferably 40% by weight or more, more preferably 50% by weight or more, still more preferably 55% by weight or more, and further preferably as a lower limit. 60% by weight, particularly preferably 65% by weight, most preferably 70% by weight, and the upper limit is preferably 99.999% by weight or less, more preferably 99.99% by weight or less. More preferably, it is 99.9% by weight or less, more preferably 99% by weight or less, particularly preferably 95% by weight or less, and most preferably 90% by weight or less. By adjusting the content ratio of the polyurethane resin in the urethane pressure-sensitive adhesive within the above range, for example, it is possible to obtain a urethane pressure-sensitive adhesive that is extremely excellent in antistatic property and excellent in adhesive residue prevention and reworkability. it can.

  The polyurethane-based resin is a polyurethane-based resin obtained by curing a composition containing a polyol (A) and a polyfunctional isocyanate compound (B).

  As a polyol (A), only 1 type may be sufficient and 2 or more types may be sufficient.

  As the polyol (A), any appropriate polyol can be adopted as long as it is a polyol having two or more OH groups. Examples of such a polyol (A) include a polyol having 2 OH groups (diol), a polyol having 3 OH groups (triol), a polyol having 4 OH groups (tetraol), and 5 OH groups. Examples thereof include a polyol having a single number (pentaol) and a polyol having six OH groups (hexaol).

  As the polyol (A), a polyol (triol) having three OH groups is preferably employed as an essential component. Thus, when a polyol (triol) having three OH groups is adopted as an essential component as the polyol (A), for example, a urethane-based pressure-sensitive adhesive that is superior in antistatic properties and also excellent in adhesive residue prevention and reworkability. Can be provided. The content ratio of the polyol (triol) having three OH groups in the polyol (A) is preferably 50% by weight to 100% by weight, more preferably 70% by weight to 100% by weight, and still more preferably. 80 to 100% by weight, more preferably 90 to 100% by weight, particularly preferably 95 to 100% by weight, and most preferably substantially 100% by weight.

  The polyol (A) preferably includes a polyol having a number average molecular weight Mn of 400 to 20000. The content ratio of the polyol having a number average molecular weight Mn of 400 to 20000 in the polyol (A) is preferably 50% by weight to 100% by weight, more preferably 70% by weight to 100% by weight, and still more preferably. It is 90 to 100% by weight, particularly preferably 95 to 100% by weight, and most preferably substantially 100% by weight. By adjusting the content ratio of the polyol having a number average molecular weight Mn of 400 to 20000 in the polyol (A) within the above range, for example, it is more excellent in antistatic property and more excellent in adhesive residue prevention and reworkability. In addition, a urethane-based pressure-sensitive adhesive can be provided.

  When employing a polyol (triol) having three OH groups as the polyol (A) as an essential component, preferably a triol having a number average molecular weight Mn of 7000 to 20000, a triol having a number average molecular weight Mn of 2000 to 6000, A triol having a number average molecular weight Mn of 400 to 1900 is used in combination, more preferably a triol having a number average molecular weight Mn of 8000 to 15000, a triol having a number average molecular weight Mn of 2000 to 5000, and a number average molecular weight Mn of 500 to 500. A triol having a number average molecular weight Mn of 8000 to 12000, a triol having a number average molecular weight Mn of 2000 to 4000, and a triol having a number average molecular weight Mn of 500 to 1500 are preferably used in combination. . When such three types of triols are used in combination, for example, a urethane-based pressure-sensitive adhesive that is more excellent in antistatic properties and more excellent in adhesive residue prevention and reworkability can be provided.

  Examples of the polyol (A) include polyester polyol, polyether polyol, polycaprolactone polyol, polycarbonate polyol, castor oil-based polyol, and the like.

  The polyester polyol can be obtained, for example, by an esterification reaction between a polyol component and an acid component.

  Examples of the polyol component include ethylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, and 2-butyl-2-ethyl-1. , 3-propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl Examples include -1,8-octanediol, 1,8-decanediol, octadecanediol, glycerin, trimethylolpropane, pentaerythritol, hexanetriol, and polypropylene glycol.

  Examples of the acid component include succinic acid, methyl succinic acid, adipic acid, pimelic acid, azelaic acid, sebacic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, dimer acid, 2-methyl-1, 4-cyclohexanedicarboxylic acid, 2-ethyl-1,4-cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, phthalic acid, isophthalic acid, terephthalic acid, 1,4-naphthalenedicarboxylic acid, 4,4′-biphenyldicarboxylic acid , And these acid anhydrides.

  Examples of polyether polyols include water, low molecular weight polyols (propylene glycol, ethylene glycol, glycerin, trimethylolpropane, pentaerythritol, etc.), bisphenols (bisphenol A, etc.), dihydroxybenzenes (catechol, resorcin, hydroquinone, etc.), etc. And polyether polyols obtained by addition polymerization of alkylene oxides such as ethylene oxide, propylene oxide, butylene oxide. Specific examples include polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and the like.

  Examples of the polycaprolactone polyol include caprolactone-based polyester diols obtained by ring-opening polymerization of cyclic ester monomers such as ε-caprolactone and σ-valerolactone.

  Examples of the polycarbonate polyol include a polycarbonate polyol obtained by polycondensation reaction of the polyol component and phosgene; the polyol component, dimethyl carbonate, diethyl carbonate, diprovir carbonate, diisopropyl carbonate, dibutyl carbonate, ethyl butyl carbonate, ethylene carbonate, Polycarbonate polyol obtained by ester exchange condensation with carbonic acid diesters such as propylene carbonate, diphenyl carbonate and dibenzyl carbonate; copolymerized polycarbonate polyol obtained by using two or more of the above polyol components in combination; Polycarbonate polyol obtained by esterification reaction with a compound; the above-mentioned various polycarbonate polyols and a hydroxyl group-containing compound A polycarbonate polyol obtained by a reaction of tellurization; a polycarbonate polyol obtained by a transesterification reaction between the above various polycarbonate polyols and an ester compound; a polycarbonate polyol obtained by a transesterification reaction between the various polycarbonate polyols and a hydroxyl group-containing compound; And polyester polycarbonate polyols obtained by polycondensation reaction of the various polycarbonate polyols with dicarboxylic acid compounds; copolymer polyether polycarbonate polyols obtained by copolymerizing the various polycarbonate polyols and alkylene oxides;

  An example of the castor oil-based polyol is a castor oil-based polyol obtained by reacting a castor oil fatty acid with the polyol component. Specific examples include castor oil-based polyols obtained by reacting castor oil fatty acid with polypropylene glycol.

  Only one type of polyfunctional isocyanate compound (B) may be used, or two or more types may be used.

  As the polyfunctional isocyanate compound (B), any appropriate polyfunctional isocyanate compound that can be used in the urethanization reaction can be adopted. Examples of such a polyfunctional isocyanate compound (B) include polyfunctional aliphatic isocyanate compounds, polyfunctional alicyclic isocyanate compounds, polyfunctional aromatic isocyanate compounds, and the like.

  Examples of the polyfunctional aliphatic isocyanate compound include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene diisocyanate, 2,4,4 Examples include 4-trimethylhexamethylene diisocyanate.

  Examples of the polyfunctional alicyclic isocyanate compound include 1,3-cyclopentene diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, isophorone diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, Examples include hydrogenated tolylene diisocyanate and hydrogenated tetramethylxylylene diisocyanate.

  Examples of the polyfunctional aromatic diisocyanate compound include phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 2,2′-didiphenylmethane diisocyanate, 4,4′-diphenylmethane diisocyanate, 4 4,4'-toluidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4'-diphenyl diisocyanate, 1,5-naphthalene diisocyanate, xylylene diisocyanate and the like.

  Examples of the polyfunctional isocyanate compound (B) include trimethylolpropane adducts of various polyfunctional isocyanate compounds as described above, burettes reacted with water, and trimers having an isocyanurate ring. These may be used in combination.

  The content ratio of the polyfunctional isocyanate compound (B) is preferably 5% by weight to 60% by weight and more preferably 8% by weight to 60% by weight of the polyfunctional isocyanate compound (B) with respect to the polyol (A). %, More preferably 10% to 60% by weight. By adjusting the content ratio of the polyfunctional isocyanate compound (B) within the above range, for example, it is possible to provide a urethane-based pressure-sensitive adhesive that is more excellent in antistatic properties and more excellent in adhesive residue prevention and reworkability. it can.

  In the polyol (A) and the polyfunctional isocyanate compound (B), the equivalent ratio of the NCO group to the OH group is more than 1.0 and not more than 5.0 as the NCO group / OH group, preferably 1.1 to It is 5.0, More preferably, it is 1.2-4.0, More preferably, it is 1.5-3.5, Most preferably, it is 1.8-3.0. By adjusting the equivalent ratio of NCO group / OH group within the above range, for example, it is possible to provide a urethane-based pressure-sensitive adhesive that is more excellent in antistatic properties and more excellent in adhesive residue prevention and reworkability.

  The polyurethane-based resin is obtained by curing a composition containing the polyol (A) and the polyfunctional isocyanate compound (B). Such a composition may contain any appropriate other component other than the polyol (A) and the polyfunctional isocyanate compound (B) as long as the effects of the present invention are not impaired. Examples of such other components include catalysts, other resin components other than polyurethane resins, tackifiers, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, plasticizers, Examples thereof include an antioxidant, a conductive agent, an antioxidant, an ultraviolet absorber, a light stabilizer, a surface lubricant, a leveling agent, a corrosion inhibitor, a heat stabilizer, a polymerization inhibitor, a lubricant, and a solvent.

  The polyurethane-based resin preferably contains a deterioration inhibitor such as an antioxidant, an ultraviolet absorber, and a light stabilizer. When the polyurethane-based resin contains a deterioration preventing agent, the adhesive residue can be prevented from remaining on the adherend, for example, even when the polyurethane resin is attached to the adherend and stored in a heated state, and thus the adhesive residue hardly occurs on the adherend. Only one type of deterioration preventing agent may be used, or two or more types may be used. As the deterioration preventing agent, an antioxidant is particularly preferable.

  The content ratio of the deterioration preventing agent is preferably 0.01% by weight to 20% by weight, more preferably 0.02% by weight to 15% by weight, and still more preferably 0.8% with respect to the polyol (A). 03 wt% to 10 wt%, more preferably 0.05 wt% to 7 wt%, further preferably 0.1 wt% to 5 wt%, particularly preferably 0.1 wt% to 3 wt%. % By weight, most preferably from 0.1% to 1% by weight. By adjusting the content ratio of the deterioration preventive agent within the above range, adhesive residue is less likely to remain on the adherend even if it is stored in a heated state after being attached to the adherend. Can become better. If the content ratio of the deterioration inhibitor is too small, there is a possibility that the adhesive residue preventing property cannot be sufficiently exhibited. If the content of the deterioration inhibitor is too large, there may be a problem that the cost is disadvantageous, a problem that the adhesive property cannot be maintained, or a problem that the adherend is contaminated may occur. .

  Examples of the antioxidant include a radical chain inhibitor and a peroxide decomposer.

  Examples of the radical chain inhibitor include phenolic antioxidants and amine antioxidants.

  Examples of the peroxide decomposer include a sulfur-based antioxidant and a phosphorus-based antioxidant.

  Examples of phenolic antioxidants include monophenolic antioxidants, bisphenolic antioxidants, and high-molecular phenolic antioxidants.

  Examples of the monophenol antioxidant include 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-t-butyl-4-ethylphenol, stearin-β- ( 3,5-di-t-butyl-4-hydroxyphenyl) propionate and the like.

  Examples of the bisphenol antioxidant include 2,2′-methylenebis (4-methyl-6-tert-butylphenol), 2,2′-methylenebis (4-ethyl-6-tert-butylphenol), 4,4 ′. -Thiobis (3-methyl-6-tert-butylphenol), 4,4'-butylidenebis (3-methyl-6-tert-butylphenol), 3,9-bis [1,1-dimethyl-2- [β- ( 3-t-butyl-4-hydroxy-5-methylphenyl) propionyloxy] ethyl] 2,4,8,10-tetraoxaspiro [5,5] undecane.

  Examples of the polymeric phenolic antioxidant include 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5-trimethyl-2,4, 6-Tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene, tetrakis- [methylene-3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl) propionate] methane Bis [3,3′-bis- (4′-hydroxy-3′-t-butylphenyl) butyric acid] glycol ester, 1,3,5-tris (3 ′, 5′-di-t-butyl) -4′-hydroxybenzyl) -S-triazine-2,4,6- (1H, 3H, 5H) trione, tocophenol and the like.

  Examples of the sulfur-based antioxidant include dilauryl 3,3'-thiodipropionate, dimyristyl 3,3'-thiodipropionate, distearyl 3,3'-thiodipropionate.

  Examples of phosphorus antioxidants include triphenyl phosphite, diphenylisodecyl phosphite, and phenyl diisodecyl phosphite.

  Examples of UV absorbers include benzophenone UV absorbers, benzotriazole UV absorbers, salicylic acid UV absorbers, oxalic anilide UV absorbers, cyanoacrylate UV absorbers, and triazine UV absorbers. It is done.

  Examples of the benzophenone ultraviolet absorber include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2-hydroxy-4-dodecyloxybenzophenone, 2,2 ′. -Dihydroxy-4-dimethoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone, bis (2-methoxy-4-hydroxy-5-benzoylphenyl) ) Methane.

  Examples of the benzotriazole ultraviolet absorber include 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-5′-tert-butylphenyl) benzotriazole, 2- ( 2'-hydroxy-3 ', 5'-di-tert-butylphenyl) benzotriazole, 2- (2'-hydroxy-3'-tert-butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2 -(2'-hydroxy-3 ', 5'-di-tert-butylphenyl) 5-chlorobenzotriazole, 2- (2'-hydroxy-3', 5'-di-tert-amylphenyl) benzotriazole, 2- (2′-hydroxy-4′-octoxyphenyl) benzotriazole, 2- [2′-hydroxy-3 ′-(3 ', 4' ', 5' ', 6' ',-tetrahydrophthalimidomethyl) -5'-methylphenyl] benzotriazole, 2,2'methylenebis [4- (1,1,3,3-tetramethylbutyl) -6- (2H-benzotriazol-2-yl) phenol], [2 (2′-hydroxy-5′-methacryloxyphenyl) -2H-benzotriazole, and the like.

  Examples of salicylic acid-based ultraviolet absorbers include phenyl salicylate, p-tert-butylphenyl salicylate, and p-octylphenyl salicylate.

  Examples of the cyanoacrylate-based ultraviolet absorber include 2-ethylhexyl-2-cyano-3,3′-diphenyl acrylate, ethyl-2-cyano-3,3′-diphenyl acrylate, and the like.

  Examples of the light stabilizer include hindered amine light stabilizers and ultraviolet light stabilizers.

  Examples of the hindered amine light stabilizer include [bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate], bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate. Methyl 1,2,2,6,6-pentamethyl-4-piperidyl sebacate and the like.

  Examples of the ultraviolet stabilizer include nickel bis (octylphenyl) sulfide, [2,2′-thiobis (4-tert-octylphenolate)]-n-butylamine nickel, nickel complex-3,5-di-tert- Examples thereof include butyl-4-hydroxybenzyl-phosphate monoethylate, nickel-dibutyldithiocarbamate, benzoate type quencher, and nickel-dibutyldithiocarbamate.

  The deterioration inhibitor is preferably a deterioration inhibitor having a hindered phenol structure. When the deterioration inhibitor having a hindered phenol structure is included as the deterioration inhibitor, the content thereof is preferably 0.01% by weight to 10% by weight, more preferably 0.05%, based on the polyol (A). % By weight to 10% by weight, more preferably 0.1% by weight to 10% by weight. By adjusting the content ratio of the deterioration preventing agent having a hindered phenol structure within the above range, it is more difficult to produce adhesive residue on the adherend even if it is stored in a heated state after being attached to the adherend. , It can become more excellent in preventing adhesive residue. If the content ratio of the deterioration inhibitor having a hindered phenol structure is too small, there is a possibility that the adhesive residue preventing property cannot be sufficiently exhibited. If the content of the anti-degradation agent having a hindered phenol structure is too large, there may be a problem that the cost is disadvantageous, the problem that the adhesive properties cannot be maintained, or the adherend is contaminated. May occur.

  Examples of the degradation inhibitor having a hindered phenol structure include a group having a large steric hindrance such as a tertiary butyl group bonded to at least one of the adjacent carbon atoms on the aromatic ring to which the OH group of phenol is bonded. Any appropriate deterioration preventing agent can be adopted as long as it is a deterioration preventing agent having a hindered phenol structure. By using a specific degradation inhibitor called a degradation inhibitor having such a hindered phenol structure, it is considered that the effect of suppressing a decrease in the molecular weight of the polyol is greatly increased compared to the conventional one. An effect that the preventive property is remarkably superior to the conventional one can be exhibited.

  Specific examples of the degradation inhibitor having such a hindered phenol structure include, for example, dibutylhydroxytoluene (BHT); trade name “IRGANOX1010” (manufactured by BASF), trade name “IRGANOX1010FF” (manufactured by BASF), and merchandise. Name “IRGANOX1035” (BASF), product name “IRGANOX1035FF” (BASF), product name “IRGANOX1076” (BASF), product name “IRGANOX1076FD” (BASF), product name “IRGANOX1076DWJ” (BASF), product Name “IRGANOX1098” (manufactured by BASF), product name “IRGANOX1135” (manufactured by BASF), product name “IRGANOX1330” (manufactured by BASF), product name “IRGANOX1726” (manufactured by BASF), Product name “IRGANOX1425WL” (manufactured by BASF), product name “IRGANOX1520L” (manufactured by BASF), product name “IRGANOX245” (manufactured by BASF), product name “IRGANOX245FF” (manufactured by BASF), product name “IRGANOX259” (manufactured by BASF), product Hindered phenolic antioxidants such as “IRGANOX 3114” (BASF), trade name “IRGANOX565” (BASF), trade name “IRGANOX295” (BASF); trade name “TINUVIN P” (BASF), product Name “TINUVIN P FL” (BASF), product name “TINUVIN234” (BASF), product name “TINUVIN326” (BASF), product name “TINUVIN326FL” (BASF), product name “T” Benzotriazole ultraviolet absorbers such as NUVIN 328 (manufactured by BASF), trade name “TINUVIN 329” (manufactured by BASF), trade name “TINUVIN 329FL” (manufactured by BASF); trade name “TINUVIN 213” (manufactured by BASF), trade name “TINUVIN 571” Liquid UV absorbers such as (manufactured by BASF); Triazine UV absorbers such as trade name “TINUVIN1577ED” (manufactured by BASF); Benzoate UV absorbers such as trade name “TINUVIN120” (manufactured by BASF); Trade name “TINUVIN144” Hindered amine light stabilizers such as (manufactured by BASF); and the like.

  The polyurethane-based resin preferably contains a fatty acid ester. When the polyurethane resin contains a fatty acid ester, the wetting speed can be improved. Only one type of fatty acid ester may be used, or two or more types may be used.

  The content ratio of the fatty acid ester is preferably 5% by weight to 50% by weight, more preferably 7% by weight 40% by weight, and further preferably 8% by weight to 35% by weight with respect to the polyol (A). Particularly preferably 9 to 30% by weight, most preferably 10 to 20% by weight. By adjusting the content ratio of the fatty acid ester within the above range, the wetting rate can be further improved. If the content of the fatty acid ester is too small, the wetting rate may not be sufficiently improved. When the content ratio of the fatty acid ester is too large, there may be a problem that the cost becomes disadvantageous, a problem that the adhesive property cannot be maintained, or a problem that the adherend is contaminated.

  The number average molecular weight Mn of the fatty acid ester is preferably 200 to 400, more preferably 210 to 395, still more preferably 230 to 380, particularly preferably 240 to 360, and most preferably 270 to 340. It is. By adjusting the number average molecular weight Mn of the fatty acid ester within the above range, the wetting rate can be further improved. If the number average molecular weight Mn of the fatty acid ester is too small, the wetting rate may not be improved even if the number of added parts is large. If the number average molecular weight Mn of the fatty acid ester is too large, the curability of the pressure-sensitive adhesive at the time of drying deteriorates, and there is a possibility that it may not only affect the wettability but also adversely affect other adhesive properties.

  As the fatty acid ester, any appropriate fatty acid ester can be adopted as long as the effects of the present invention are not impaired. Examples of such fatty acid esters include polyoxyethylene bisphenol A laurate, butyl stearate, 2-ethylhexyl palmitate, 2-ethylhexyl stearate, monoglyceride behenate, cetyl 2-ethylhexanoate, and myristic acid. Isopropyl, isopropyl palmitate, cholesteryl isostearate, lauryl methacrylate, coconut fatty acid methyl, methyl laurate, methyl oleate, methyl stearate, myristyl myristate, octyldodecyl myristate, pentaerythritol monooleate, pentaerythritol monostearate , Pentaerythritol tetrapalmitate, stearyl stearate, isotridecyl stearate, triglyceride 2-ethylhexanoate , Butyl laurate, and the like octyl oleate.

  The polyurethane-based resin preferably contains a leveling agent. By including a leveling agent in the polyurethane resin, it is possible to prevent uneven appearance due to the skin. Only one type of leveling agent may be used or two or more types may be used.

  The content ratio of the leveling agent is preferably 0.001% by weight to 1% by weight, more preferably 0.002% by weight to 0.5% by weight, and still more preferably 0% with respect to the polyol (A). 0.003 wt% to 0.1 wt%, particularly preferably 0.004 wt% to 0.05 wt%, and most preferably 0.005 wt% to 0.01 wt%. By adjusting the content ratio of the leveling agent within the above range, it is possible to further prevent appearance unevenness due to the yuzu skin. If the content of the leveling agent is too small, it may not be possible to prevent uneven appearance due to yuzu skin. If the content of the leveling agent is too large, there may be a problem that the cost becomes disadvantageous, a problem that the adhesive property cannot be maintained, or a problem that the adherend is contaminated.

  Any appropriate leveling agent can be adopted as the leveling agent as long as the effects of the present invention are not impaired. Examples of such a leveling agent include an acrylic leveling agent, a fluorine leveling agent, and a silicon leveling agent. As an acrylic leveling agent, polyflow no. 36, Polyflow No. 56, Polyflow No. 85HF, Polyflow No. 99C (Isure is also Kyoeisha Chemical Co., Ltd.). Examples of the fluorine leveling agent include Megafac F470N and Megafac F556 (both manufactured by DIC). Examples of the silicon leveling agent include Grandic PC4100 (manufactured by DIC).

  As a method for obtaining a polyurethane resin by curing a composition containing a polyol (A) and a polyfunctional isocyanate compound (B), the effects of the present invention, such as a urethanization reaction method using bulk polymerization or solution polymerization, are used. Any appropriate method can be adopted as long as it is not impaired. However, since the conventional polyurethane-based resin obtained via a so-called urethane prepolymer may not exhibit the effects of the present invention, it contains a polyol (A) and a polyfunctional isocyanate compound (B). The method for obtaining the polyurethane resin by curing the product is preferably a method other than the method for obtaining the polyurethane resin via the urethane prepolymer.

  In order to cure the composition containing the polyol (A) and the polyfunctional isocyanate compound (B), a catalyst is preferably used. Examples of such a catalyst include organometallic compounds and tertiary amine compounds.

  Examples of organometallic compounds include iron compounds, tin compounds, titanium compounds, zirconium compounds, lead compounds, cobalt compounds, zinc compounds, and the like. Among these, iron-based compounds and tin-based compounds are preferable in terms of reaction rate and pot life of the pressure-sensitive adhesive layer.

  Examples of iron-based compounds include iron acetylacetonate and iron 2-ethylhexanoate.

  Examples of tin compounds include dibutyltin dichloride, dibutyltin oxide, dibutyltin dibromide, dibutyltin maleate, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin sulfide, tributyltin methoxide, tributyltin acetate, triethyltin ethoxide, Examples include tributyltin ethoxide, dioctyltin oxide, dioctyltin dilaurate, tributyltin chloride, tributyltin trichloroacetate, and tin 2-ethylhexanoate.

  Examples of titanium compounds include dibutyltitanium dichloride, tetrabutyltitanate, butoxytitanium trichloride, and the like.

  Examples of the zirconium-based compound include zirconium naphthenate and zirconium acetylacetonate.

  Examples of the lead-based compound include lead oleate, lead 2-ethylhexanoate, lead benzoate, lead naphthenate, and the like.

  Examples of the cobalt-based compound include cobalt 2-ethylhexanoate and cobalt benzoate.

  Examples of the zinc-based compound include zinc naphthenate and zinc 2-ethylhexanoate.

  Examples of the tertiary amine compound include triethylamine, triethylenediamine, 1,8-diazabixic mouth- (5,4,0) -undecene-7, and the like.

  Only one type of catalyst may be used, or two or more types of catalysts may be used. Further, a catalyst and a crosslinking retarder may be used in combination. The amount of the catalyst is preferably 0.02% by weight to 0.10% by weight, more preferably 0.02% by weight to 0.08% by weight, and still more preferably 0% with respect to the polyol (A). 0.02 wt% to 0.06 wt%, particularly preferably 0.02 wt% to 0.05 wt%. By adjusting the amount of the catalyst within the above range, for example, it is possible to provide a urethane-based pressure-sensitive adhesive that is more excellent in antistatic property and more excellent in anti-glue property and reworkability.

  Any appropriate other component may be included in the pressure-sensitive adhesive layer or the pressure-sensitive adhesive in the pressure-sensitive adhesive layer as long as the effects of the present invention are not impaired. Examples of such other components include other resin components, tackifiers, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, plasticizers, conductive agents, surface lubricants, Examples thereof include a corrosion inhibitor, a heat stabilizer, a polymerization inhibitor, a lubricant, and a solvent.

  The pressure-sensitive adhesive in the pressure-sensitive adhesive layer may contain, for example, at least one compound (A) selected from ionic liquids, ion conductive polymers, ion conductive fillers, and electrically conductive polymers as described above. . The pressure-sensitive adhesive in the pressure-sensitive adhesive layer contains at least one compound (A) selected from the ionic liquid, the ion conductive polymer, the ion conductive filler, and the electric conductive polymer as described above. After the adhesive layer is adhered to the adherend such as an optical member or an electronic member, the effect of effectively preventing the peeling charge that may occur when the separator is peeled from the surface of the layer can be expressed. It is possible to effectively prevent the generation of static electricity that may occur during friction and peeling.

    The content ratio of the compound (A) in the pressure-sensitive adhesive layer is preferably 0.0004% to 0.8% by weight, more preferably 0.001% to 0.6% by weight. More preferably, it is 0.002 to 0.4% by weight, and particularly preferably 0.004 to 0.2% by weight. By adjusting the content ratio of the compound (A) in the pressure-sensitive adhesive in the pressure-sensitive adhesive layer within the above range, it is possible to effectively prevent the peeling charge that may occur when the separator is peeled from the surface of the pressure-sensitive adhesive layer. The effect can be further manifested, and the generation of static electricity that can occur during friction and peeling after the pressure-sensitive adhesive layer is stuck to an adherend such as an optical member or an electronic member can be more effectively prevented.

  The pressure-sensitive adhesive in the pressure-sensitive adhesive layer may contain a modified silicone oil. By including the modified silicone oil in the pressure-sensitive adhesive in the pressure-sensitive adhesive layer, the effects of the present invention can be expressed more effectively.

  When the modified silicone oil is contained in the pressure-sensitive adhesive in the pressure-sensitive adhesive layer, the content ratio is preferably 0.001 to 50 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive in the pressure-sensitive adhesive layer. More preferably, it is 0.01 weight part-40 weight part, More preferably, it is 0.01 weight part-30 weight part, Especially preferably, it is 0.01 weight part-20 weight part, Most preferably, it is 0.00. 01 parts by weight to 10 parts by weight. By adjusting the content ratio of the modified silicone oil within the above range, the effects of the present invention can be expressed more effectively.

  Any appropriate modified silicone oil can be adopted as the modified silicone oil as long as the effects of the present invention are not impaired. Examples of such modified silicone oil include modified silicone oil available from Shin-Etsu Chemical Co., Ltd.

  The modified silicone oil is preferably a polyether-modified silicone oil. By employing the polyether-modified silicone oil, the effects of the present invention can be expressed more effectively.

  Examples of the polyether-modified silicone oil include a side chain-type polyether-modified silicone oil and a both-end-type polyether-modified silicone oil. Among these, a polyether-modified silicone oil of both terminal types is preferable in that the effect of the present invention can be expressed sufficiently more effectively.

  The pressure-sensitive adhesive layer can be produced by any appropriate production method. Examples of such a production method include a method in which a composition that is a material for forming the pressure-sensitive adhesive layer is applied onto the base material layer, and the pressure-sensitive adhesive layer is formed on the base material layer. Examples of such coating methods include roll coating, gravure coating, reverse coating, roll brushing, spray coating, air knife coating, extrusion coating using a die coater, and the like.

  The pressure-sensitive adhesive layer preferably has high transparency. Due to the high transparency of the pressure-sensitive adhesive layer, it is possible to accurately inspect the surface of the optical member or the electronic member while it is adhered. The adhesive layer preferably has a haze of 5% or less, more preferably 4% or less, still more preferably 3% or less, particularly preferably 2% or less, and most preferably 1% or less. is there.

  In addition, the measurement of the said haze uses haze meter HM-150 (made by Murakami Color Research Laboratory Co., Ltd.), and based on JIS-K-7136, haze (%) = (Td / Tt) × 100 (Td : Diffuse transmittance, Tt: Total light transmittance).

<A-2. Second stage>
In the method for producing the surface protective film of the present invention, next, at least one selected from an ionic liquid, an ion conductive polymer, an ion conductive filler, and an electric conductive polymer on the surface of the pressure-sensitive adhesive layer opposite to the base material layer. A separator containing the compound (A) is bonded.

  As a method for laminating the separator, any appropriate laminating method can be adopted as long as the effects of the present invention are not impaired.

  The separator may be composed of a single layer or may be composed of a plurality of layers.

  The thickness of the separator can be set to any appropriate thickness depending on the application. From the viewpoint of sufficiently expressing the effects of the present invention, the thickness is preferably 20 μm to 100 μm, more preferably 25 μm to 90 μm, still more preferably 30 μm to 80 μm, and particularly preferably 35 μm to 70 μm.

  Any appropriate material can be adopted as a material for the separator as long as the effects of the present invention are not impaired. Examples of such a material include plastic, paper, metal film, and non-woven fabric. Among such materials, plastic is preferable. The separator may be composed of one kind of material, or may be composed of two or more kinds of materials. For example, you may be comprised from 2 or more types of plastics.

  FIG. 2 is a schematic cross-sectional view of the laminate obtained in the second stage. The laminate 100 includes a base material layer 1, an adhesive layer 2, and a separator 3 in this order. The laminated body obtained in the second stage may further include any appropriate other layer as necessary (not shown).

  In the method for producing a surface protective film of the present invention, the separator contains at least one compound (A) selected from an ionic liquid, an ion conductive polymer, an ion conductive filler, and an electric conductive polymer.

  When the separator contains at least one compound (A) selected from an ionic liquid, an ion conducting polymer, an ion conducting filler, and an electrically conducting polymer, the effect brought about by the compound (A) is only expressed in the separator. In addition, it is also expressed in the pressure-sensitive adhesive layer adjacent to the separator, and thereby, an effect that it is possible to effectively prevent the peeling charge that may occur when the separator is peeled from the surface of the pressure-sensitive adhesive layer can be exhibited. Further, as described above, since the effect brought about by the compound (A) is also expressed in the pressure-sensitive adhesive layer, the friction and peeling after the pressure-sensitive adhesive layer is adhered to an adherend such as an optical member or an electronic member. It is possible to effectively prevent the generation of static electricity that may occur during the process.

  The content ratio of the compound (A) in the separator is preferably 0.001% by weight to 2.0% by weight, more preferably 0.0025% by weight to 1.5% by weight, and still more preferably 0.8%. It is 005 weight%-1.0 weight%, Most preferably, it is 0.01 weight%-0.5 weight%. By adjusting the content ratio of the compound (A) in the separator within the above range, it is possible to provide a surface protective film that is much more excellent in antistatic properties. When the content rate of the compound (A) in a separator is less than 0.001 weight%, there exists a possibility that the antistatic property of the surface protection film obtained may be inferior. When the content rate of the compound (A) in a separator exceeds 2.0 weight%, there exists a possibility that the to-be-adhered surface to which an adhesive is affixed may be extremely contaminated.

  Any appropriate ionic liquid can be adopted as the ionic liquid as long as the effects of the present invention are not impaired. Here, in this invention, an ionic liquid means the molten salt (ionic compound) which exhibits a liquid state at 25 degreeC. Only one kind of ionic liquid may be used, or two or more kinds may be used.

  Such an ionic liquid is preferably an ionic liquid composed of a fluoroorganic anion and an onium cation. By employing an ionic liquid composed of a fluoro organic anion and an onium cation as the ionic liquid, a surface protective film having extremely excellent antistatic properties can be produced.

  Any appropriate onium cation can be adopted as the onium cation capable of constituting the ionic liquid as long as the effects of the present invention are not impaired. Such an onium cation is preferably at least one selected from a nitrogen-containing onium cation, a sulfur-containing onium cation, and a phosphorus-containing onium cation. By selecting these onium cations, a surface protective film having extremely excellent antistatic properties can be produced.

The onium cation capable of constituting the ionic liquid is preferably at least one selected from cations having a structure represented by the general formulas (1) to (5).

  In the general formula (1), Ra represents a hydrocarbon group having 4 to 20 carbon atoms and may contain a hetero atom, and Rb and Rc may be the same or different, and hydrogen or a carbon atom having 1 to 16 carbon atoms. Represents a hydrogen group and may contain a hetero atom. However, there is no Rc when the nitrogen atom contains a double bond.

  In the general formula (2), Rd represents a hydrocarbon group having 2 to 20 carbon atoms, and may contain a hetero atom, and Re, Rf, and Rg are the same or different and each represents hydrogen or 1 to carbon atoms. Represents 16 hydrocarbon groups and may contain heteroatoms.

  In the general formula (3), Rh represents a hydrocarbon group having 2 to 20 carbon atoms and may contain a hetero atom, and Ri, Rj, and Rk may be the same or different, and may be hydrogen or 1 carbon atom. Represents 16 hydrocarbon groups and may contain heteroatoms.

  In the general formula (4), Z represents a nitrogen atom, a sulfur atom, or a phosphorus atom, Rl, Rm, Rn, and Ro are the same or different and represent a hydrocarbon group having 1 to 20 carbon atoms, It may contain atoms. However, when Z is a sulfur atom, there is no Ro.

  In the general formula (5), X represents a Li atom, a Na atom, or a K atom.

  Examples of the cation represented by the general formula (1) include a pyridinium cation, a pyrrolidinium cation, a piperidinium cation, a cation having a pyrroline skeleton, and a cation having a pyrrole skeleton.

  Specific examples of the cation represented by the general formula (1) include, for example, 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, and 1-butyl. -3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-butyl-3,4-dimethylpyridinium cation, Pyridinium cations such as 1,1-dimethylpyrrolidinium cation; 1-ethyl-1-methylpyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidini Cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation 1-ethyl-1-pentylpyrrolidinium cation, 1-ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation, 1,1-dipropylpyrrolidinium cation, Pyrrolidinium cations such as 1-propyl-1-butylpyrrolidinium cation and 1,1-dibutylpyrrolidinium cation; 1-propylpiperidinium cation, 1-pentylpiperidinium cation, 1-methyl-1- Ethyl piperidinium cation, 1-methyl-1-propyl piperidinium cation 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexylpiperidinium cation, 1- Ethyl-1-heptylpiperidinium cation, 1-propyl-1-butylpiperidinium cation, 1,1-dimethylpiperidinium cation, 1,1-dipropylpiperidinium cation, 1,1-dibutylpi Piperidinium cations such as peridinium cations; 2-methyl-1-pyrroline cations; Til-2-phenylindole cation; 1,2-dimethylindole cation; 1-ethylcarbazole cation;

  Among these, 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, and 1 are preferable because the effects of the present invention can be further exhibited. -Pyridinium cations such as butyl-3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-octyl-4-methylpyridinium cation; 1-ethyl-1- Methylpyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexyl Pyrrolidinium cation, 1-methyl-1-he Tylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation, 1-ethyl-1-hexyl Pyrrolidinium cations such as pyrrolidinium cation and 1-ethyl-1-heptylpyrrolidinium cation; 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, 1- Methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidinium cation, 1-ethyl -1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cut 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation, 1-propyl-1-butylpiperidinium cation And more preferably, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-octyl-4-methyl, and the like. Pyridinium cation, 1-methyl-1-propylpyrrolidinium cation, and 1-methyl-1-propylpiperidinium cation.

  Examples of the cation represented by the general formula (2) include an imidazolium cation, a tetrahydropyrimidinium cation, and a dihydropyrimidinium cation.

  Specific examples of the cation represented by the general formula (2) include, for example, 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, and 1-butyl. -3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl-3-methylimidazole 1-tetradecyl-3-methylimidazolium cation, 1,2-dimethyl-3-propylimidazolium cation, 1-ethyl-2,3-dimethylimidazolium cation, 1-butyl-2,3-dimethylimidazole Lilium cation, 1-hexyl-2,3-dimethylimidazo Imidazolium cations such as um cation; 1,3-dimethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3-trimethyl-1,4,5,6-tetrahydropyrimidinium cation, 1 , 2,3,4-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3,5-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation, etc. Tetrahydropyrimidinium cation; 1,3-dimethyl-1,4-dihydropyrimidinium cation, 1,3-dimethyl-1,6-dihydropyrimidinium cation, 1,2,3-trimethyl-1,4- Dihydropyrimidinium cation, 1,2,3-trimethyl-1,6-dihydropyrimidinium cation, 1,2,3,4-tetramethyl-1 4-dihydropyrimidinium cation, 1,2,3,4-tetramethyl-1,6-dihydropyrimidinium dihydropyrimidinium cation, such as cations; and the like.

  Among these, from the viewpoint that the effects of the present invention can be further exhibited, 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1 -Butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl-3- Imidazolium cations such as methylimidazolium cation and 1-tetradecyl-3-methylimidazolium cation, more preferably 1-ethyl-3-methylimidazolium cation and 1-hexyl-3-methylimidazolium cation is there.

  Examples of the cation represented by the general formula (3) include a pyrazolium cation and a pyrazolinium cation.

  Specific examples of the cation represented by the general formula (3) include, for example, 1-methylpyrazolium cation, 3-methylpyrazolium cation, 1-ethyl-2-methylpyrazolinium cation, 1-ethyl- Pyrazolium cations such as 2,3,5-trimethylpyrazolium cation, 1-propyl-2,3,5-trimethylpyrazolium cation, 1-butyl-2,3,5-trimethylpyrazolium cation; Pilas such as 1-ethyl-2,3,5-trimethylpyrazolinium cation, 1-propyl-2,3,5-trimethylpyrazolinium cation, 1-butyl-2,3,5-trimethylpyrazolinium cation Zolinium cation; and the like.

  Examples of the cation represented by the general formula (4) include, for example, a tetraalkylammonium cation, a trialkylsulfonium cation, a tetraalkylphosphonium cation, and a part of the alkyl group substituted with an alkenyl group, an alkoxyl group, or an epoxy group. And the like.

  Specific examples of the cation represented by the general formula (4) include, for example, tetramethylammonium cation, tetraethylammonium cation, tetrabutylammonium cation, tetrapentylammonium cation, tetrahexylammonium cation, tetraheptylammonium cation, and triethylmethylammonium. Cation, tributylethylammonium cation, trimethylpropylammonium cation, trimethyldecylammonium cation, N, N-diethyl-N-methyl-N- (2-methoxyethyl) ammonium cation, glycidyltrimethylammonium cation, trimethylsulfonium cation, triethylsulfonium cation , Tributylsulfonium cation, trihexylsulfonium cation , Diethylmethylsulfonium cation, dibutylethylsulfonium cation, dimethyldecylsulfonium cation, tetramethylphosphonium cation, tetraethylphosphonium cation, tetrabutylphosphonium cation, tetrahexylphosphonium cation, tetraoctylphosphonium cation, triethylmethylphosphonium cation, tributylethylphosphonium cation, Examples include trimethyldecylphosphonium cation and diallyldimethylammonium cation.

  Among these, the triethylmethyl ammonium cation, tributyl ethyl ammonium cation, trimethyl decyl ammonium cation, diethyl methyl sulfonium cation, dibutyl ethyl sulfonium cation, dimethyl decyl sulfonium cation, Asymmetric tetraalkylammonium cations such as triethylmethylphosphonium cation, tributylethylphosphonium cation, trimethyldecylphosphonium cation, trialkylsulfonium cation, tetraalkylphosphonium cation, N, N-diethyl-N-methyl-N- (2-methoxy) Ethyl) ammonium cation, glycidyltrimethylammonium cation, diallyldimethylammoni Cation, N, N-dimethyl-N-ethyl-N-propylammonium cation, N, N-dimethyl-N-ethyl-N-butylammonium cation, N, N-dimethyl-N-ethyl-N-pentylammonium cation, N, N-dimethyl-N-ethyl-N-hexylammonium cation, N, N-dimethyl-N-ethyl-N-heptylammonium cation, N, N-dimethyl-N-ethyl-N-nonylammonium cation, N, N-dimethyl-N, N-dipropylammonium cation, N, N-diethyl-N-propyl-N-butylammonium cation, N, N-dimethyl-N-propyl-N-pentylammonium cation, N, N-dimethyl -N-propyl-N-hexylammonium cation, N, N-dimethyl- -Propyl-N-heptylammonium cation, N, N-dimethyl-N-butyl-N-hexylammonium cation, N, N-diethyl-N-butyl-N-heptylammonium cation, N, N-dimethyl-N-pentyl -N-hexylammonium cation, N, N-dimethyl-N, N-dihexylammonium cation, trimethylheptylammonium cation, N, N-diethyl-N-methyl-N-propylammonium cation, N, N-diethyl-N- Methyl-N-pentylammonium cation, N, N-diethyl-N-methyl-N-heptylammonium cation, N, N-diethyl-N-propyl-N-pentylammonium cation, triethylpropylammonium cation, triethylpentylammonium Cation, triethylheptylammonium cation, N, N-dipropyl-N-methyl-N-ethylammonium cation, N, N-dipropyl-N-methyl-N-pentylammonium cation, N, N-dipropyl-N-butyl-N -Hexylammonium cation, N, N-dipropyl-N, N-dihexylammonium cation, N, N-dibutyl-N-methyl-N-pentylammonium cation, N, N-dibutyl-N-methyl-N-hexylammonium cation , Trioctylmethylammonium cation, N-methyl-N-ethyl-N-propyl-N-pentylammonium cation, and the like, more preferably trimethylpropylammonium cation.

  Any appropriate fluoroorganic anion can be adopted as the fluoroorganic anion capable of constituting the ionic liquid as long as the effects of the present invention are not impaired. Such a fluoroorganic anion may be completely fluorinated (perfluorinated) or partially fluorinated.

  Examples of such fluoroorganic anions include fluorinated aryl sulfonates, perfluoroalkane sulfonates, bis (fluorosulfonyl) imides, bis (perfluoroalkanesulfonyl) imides, cyanoperfluoroalkanesulfonylamides, and bis (cyano). Perfluoroalkanesulfonylmethide, cyano-bis- (perfluoroalkanesulfonyl) methide, tris (perfluoroalkanesulfonyl) methide, trifluoroacetate, perfluoroalchelate, tris (perfluoroalkanesulfonyl) methide, (perfluoroalkane) Sulfonyl) trifluoroacetamide and the like.

  Among these fluoro organic anions, more preferred are perfluoroalkylsulfonate, bis (fluorosulfonyl) imide, bis (perfluoroalkanesulfonyl) imide, and more specifically, for example, trifluoromethanesulfonate, pentafluoroethane. Sulfonate, heptafluoropropane sulfonate, nonafluorobutane sulfonate, bis (fluorosulfonyl) imide, bis (trifluoromethanesulfonyl) imide.

Specific examples of the ionic liquid may be appropriately selected from a combination of the cation component and the anion component. Specific examples of such ionic liquids include, for example, 1-hexylpyridinium bis (fluorosulfonyl) imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, 1-ethyl-3-methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropane sulfonate, 1-ethyl-3-methylpyridinium nonafluorobutane sulfonate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis (trifluoromethane Sulfonyl) imide, 1-butyl-3-methylpyridinium bis (pentafluoroethanesulfonyl) imide, 1-octyl-4-methylpyridinium bis (fluorosulfonyl) imi 1,1-dimethylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-ethylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-propylpyrrolidinium bis (trifluoromethanesulfonyl) ) Imide, 1-methyl-1-propylpyrrolidinium bis (fluorosulfonyl) imide, 1-methyl-1-butylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-pentylpyrrolidinium bis ( Trifluoromethanesulfonyl) imide, 1-methyl-1-hexylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-heptylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1-ethyl-1- Propyl pyro Dinium bis (trifluoromethanesulfonyl) imide, 1-ethyl-1-butylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1-ethyl-1-pentylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1-ethyl-1- Hexylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1-ethyl-1-heptylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1,1-dipropylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1 -Propyl-1-butylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1,1-dibutylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1-propylpiperidinium bis (trifluoromethanesulfone) Nyl) imide, 1-pentylpiperidinium bis (trifluoromethanesulfonyl) imide, 1,1-dimethylpiperidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-ethylpiperidinium bis (trifluoromethanesulfonyl) Imido, 1-methyl-1-propylpiperidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-propylpiperidinium bis (fluorosulfonyl) imide, 1-methyl-1-butylpiperidinium bis (trifluoro) Romethanesulfonyl) imide, 1-methyl-1-pentylpiperidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-hexylpiperidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-heptylpiperi Nitrobis (trifluoromethanesulfonyl) imide, 1-ethyl-1-propylpiperidinium bis (trifluoromethanesulfonyl) imide, 1-ethyl-1-butylpiperidinium bis (trifluoromethanesulfonyl) imide, 1-ethyl-1- Pentylpiperidinium bis (trifluoromethanesulfonyl) imide, 1-ethyl-1-hexylpiperidinium bis (trifluoromethanesulfonyl) imide, 1-ethyl-1-heptylpiperidinium bis (trifluoromethanesulfonyl) imide, 1,1-dipropylpiperidinium bis (trifluoromethanesulfonyl) imide, 1-propyl-1-butylpiperidinium bis (trifluoromethanesulfonyl) imide, 1,1-dibutylpiperidinium bis (trifluoro Tansulfonyl) imide, 1,1-dimethylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1-methyl-1-ethylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1-methyl-1-propylpyrrolidi Nitrobis (pentafluoroethanesulfonyl) imide, 1-methyl-1-butylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1-methyl-1-pentylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1- Methyl-1-hexylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1-methyl-1-heptylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1-ethyl-1-propylpyrrolidinium bis ( Pentafluoroethane Sulfonyl) imide, 1-ethyl-1-butylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1-ethyl-1-pentylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1-ethyl-1-hexyl Pyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1-ethyl-1-heptylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1,1-dipropylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1-propyl-1-butylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1,1-dibutylpyrrolidinium bis (pentafluoroethanesulfonyl) imide, 1-propylpiperidinium bis (pentafluoroethanesulfonyl) imide , 1- Ntilpiperidinium bis (pentafluoroethanesulfonyl) imide, 1,1-dimethylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1-methyl-1-ethylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1 -Methyl-1-propylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1-methyl-1-butylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1-methyl-1-pentylpiperidinium bis (penta Fluoroethanesulfonyl) imide, 1-methyl-1-hexylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1-methyl-1-heptylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1-ethyl- 1-propi Piperidinium bis (pentafluoroethanesulfonyl) imide, 1-ethyl-1-butylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1-ethyl-1-pentylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1-ethyl-1-hexylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1-ethyl-1-heptylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1,1-dipropylpiperidinium bis (Pentafluoroethanesulfonyl) imide, 1-propyl-1-butylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1,1-dibutylpiperidinium bis (pentafluoroethanesulfonyl) imide, 1-ethyl-3- Methyl imidazolium Mutrifluoroacetate, 1-ethyl-3-methylimidazolium heptafluorobutyrate, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl-3 -Methylimidazolium nonafluorobutanesulfonate, 1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide, 1-ethyl-3-methylimidazolium bis (fluorosulfonyl) imide, 1-ethyl-3-methylimidazole Bis (pentafluoroethanesulfonyl) imide, 1-ethyl-3-methylimidazolium tris (trifluoromethanesulfonyl) methide, 1-butyl-3-methylimidazolium trifluoroacetate 1-butyl-3-methylimidazolium heptafluorobutyrate, 1-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium perfluorobutanesulfonate, 1-butyl-3-methylimidazole Bis (trifluoromethanesulfonyl) imide, 1-hexyl-3-methylimidazolium trifluoromethanesulfonate, 1-hexyl-3-methylimidazolium bis (fluorosulfonyl) imide, 1,2-dimethyl-3-propylimidazolium Bis (trifluoromethanesulfonyl) imide, 1-ethyl-2,3,5-trimethylpyrazolium bis (trifluoromethanesulfonyl) imide, 1-propyl-2,3,5-trimethylpyrazolium bis (trifluoro) Methanesulfonyl) imide, 1-butyl-2,3,5-trimethylpyrazolium bis (trifluoromethanesulfonyl) imide, 1-ethyl-2,3,5-trimethylpyrazolium bis (pentafluoroethanesulfonyl) imide, 1-propyl-2,3,5-trimethylpyrazolium bis (pentafluoroethanesulfonyl) imide, 1-butyl-2,3,5-trimethylpyrazolium bis (pentafluoroethanesulfonyl) imide, 1-ethyl- 2,3,5-trimethylpyrazolium (trifluoromethanesulfonyl) trifluoroacetamide, 1-propyl-2,3,5-trimethylpyrazolium (trifluoromethanesulfonyl) trifluoroacetamide, 1-butyl-2,3 5-trimethylpyrazolium (trifluoromethyl Tansulfonyl) trifluoroacetamide, trimethylpropylammonium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N-ethyl-N-propylammonium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N-ethyl- N-butylammonium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N-ethyl-N-pentylammonium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N-ethyl-N-hexylammonium bis ( Trifluoromethanesulfonyl) imide, N, N-dimethyl-N-ethyl-N-heptylammonium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N-ethyl-N-nonylammonium bis (tri Fluoromethanesulfonyl) imide, N, N-dimethyl-N, N-dipropylammonium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N-propyl-N-butylammonium bis (trifluoromethanesulfonyl) imide, N , N-dimethyl-N-propyl-N-pentylammonium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N-propyl-N-hexylammonium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N -Propyl-N-heptylammonium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N-butyl-N-hexylammonium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N-butyl-N-heptyla Monium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N-pentyl-N-hexylammonium bis (trifluoromethanesulfonyl) imide, N, N-dimethyl-N, N-dihexylammonium bis (trifluoromethanesulfonyl) imide, Trimethylheptylammonium bis (trifluoromethanesulfonyl) imide, N, N-diethyl-N-methyl-N-propylammonium bis (trifluoromethanesulfonyl) imide, N, N-diethyl-N-methyl-N-pentylammonium bis (trifluoro) Romethanesulfonyl) imide, N, N-diethyl-N-methyl-N, N-heptylammonium bis (trifluoromethanesulfonyl) imide, N, N-diethyl-N-propyl-N-pentylammo Ni-bis (trifluoromethanesulfonyl) imide, triethylpropylammonium bis (trifluoromethanesulfonyl) imide, triethylpentylammonium bis (trifluoromethanesulfonyl) imide, triethylheptylammonium bis (trifluoromethanesulfonyl) imide, N, N-dipropyl-N-methyl -N-ethylammonium bis (trifluoromethanesulfonyl) imide, N, N-dipropyl-N-methyl-N-pentylammonium bis (trifluoromethanesulfonyl) imide, N, N-dipropyl-N-butyl-N-hexylammonium bis (Trifluoromethanesulfonyl) imide, N, N-dipropyl-N, N-dihexylammonium bis (trifluoromethanesulfonyl) imide, N N-dibutyl-N-methyl-N-pentylammonium bis (trifluoromethanesulfonyl) imide, N, N-dibutyl-N-methyl-N-hexylammonium bis (trifluoromethanesulfonyl) imide, trioctylmethylammonium bis (trifluoro) Romethanesulfonyl) imide, N-methyl-N-ethyl-N-propyl-N-pentylammonium bis (trifluoromethanesulfonyl) imide, 1-butylpyridinium (trifluoromethanesulfonyl) trifluoroacetamide, 1-butyl-3-methylpyridinium (Trifluoromethanesulfonyl) trifluoroacetamide, 1-ethyl-3-methylimidazolium (trifluoromethanesulfonyl) trifluoroacetamide, tetrahexylammonium (Trifluoromethanesulfonyl) imide, diallyldimethylammonium trifluoromethanesulfonate, diallyldimethylammonium bis (trifluoromethanesulfonyl) imide, diallyldimethylammonium bis (pentafluoroethanesulfonyl) imide, N, N-diethyl-N-methyl-N- (2-methoxyethyl) ammonium trifluoromethanesulfonate, N, N-diethyl-N-methyl-N- (2-methoxyethyl) ammonium bis (trifluoromethanesulfonyl) imide, N, N-diethyl-N-methyl-N- (2-methoxyethyl) ammonium bis (pentafluoroethanesulfonyl) imide, glycidyltrimethylammonium trifluoromethanesulfonate, glycidyltrimethylammoni Umbis (trifluoromethanesulfonyl) imide, glycidyltrimethylammonium bis (pentafluoroethanesulfonyl) imide, diallyldimethylammonium bis (trifluoromethanesulfonyl) imide, diallyldimethylbis (pentafluoroethanetanesulfonyl) imide, lithium bis (trifluoromethanesulfonyl) Examples thereof include imide and lithium bis (fluorosulfonyl) imide.

  Among these ionic liquids, 1-hexylpyridinium bis (fluorosulfonyl) imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, 1-ethyl-3-methylpyridinium pentafluoroethanesulfonate, Ethyl-3-methylpyridinium heptafluoropropanesulfonate, 1-ethyl-3-methylpyridinium nonafluorobutanesulfonate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis (trifluoromethanesulfonyl) Imido, 1-octyl-4-methylpyridinium bis (fluorosulfonyl) imide, 1-methyl-1-propylpyrrolidinium bis (trifluoromethanesulfonyl) imi 1-methyl-1-propylpyrrolidinium bis (fluorosulfonyl) imide, 1-methyl-1-propylpiperidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-propylpiperidinium bis (fluorosulfonyl) ) Imido, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide, 1-ethyl -3-methylimidazolium bis (fluorosulfonyl) imide, 1-hexyl-3-methylimidazolium bis (fluorosulfonyl) imide, trimethylpropylammonium bis (trifluoromethanesulfonyl) imide, Chiumubisu (trifluoromethanesulfonyl) imide, lithium bis (fluorosulfonyl) imide.

  A commercially available ionic liquid may be used, but it can also be synthesized as follows. The method of synthesizing the ionic liquid is not particularly limited as long as the target ionic liquid can be obtained. In general, the document “ionic liquids—the forefront and future of development” (CMC Publishing Co., Ltd.). The halide method, the hydroxide method, the acid ester method, the complex formation method, the neutralization method, and the like are used.

  The synthesis method for the halide method, hydroxide method, acid ester method, complex formation method, and neutralization method will be described below using nitrogen-containing onium salts as examples. Other sulfur-containing onium salts and phosphorus-containing onium salts Other ionic liquids can be obtained by the same method.

  The halide method is a method performed by reactions as shown in reaction formulas (1) to (3). First, a tertiary amine and an alkyl halide are reacted to obtain a halide (reaction formula (1), and chlorine, bromine, and iodine are used as the halogen).

Acid (HA) or salt having the anionic structure (A ⁻ ) of the ionic liquid intended for the obtained halide (MA and M are cations that form a salt with the intended anion such as ammonium, lithium, sodium, potassium, etc.) ) To obtain the desired ionic liquid (R ₄ NA).

The hydroxide method is a method performed by reactions as shown in reaction formulas (4) to (8). First, halide (R ₄ NX) is subjected to ion exchange membrane electrolysis (reaction formula (4)), OH type ion exchange resin method (reaction formula (5)) or reaction with silver oxide (Ag ₂ O) (reaction formula ( 6)) to obtain a hydroxide (R ₄ NOH) (chlorine, bromine and iodine are used as the halogen).

The target ionic liquid (R ₄ NA) can be obtained by using the reaction of the reaction formulas (7) to (8) in the same manner as the halogenation method for the obtained hydroxide.

The acid ester method is a method performed by reactions as shown in reaction formulas (9) to (11). First, a tertiary amine (R ₃ N) is reacted with an acid ester to obtain an acid ester product (Reaction Formula (9)). As the acid ester, inorganic acids such as sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, and carbonic acid are used. And esters of organic acids such as esters, methanesulfonic acid, methylphosphonic acid, formic acid, etc.).

The target ionic liquid (R ₄ NA) can be obtained by using the reaction of the reaction formulas (10) to (11) in the same manner as the halogenation method for the obtained acid ester. Further, by using methyl trifluoromethanesulfonate, methyl trifluoroacetate or the like as the acid ester, an ionic liquid can be directly obtained.

The neutralization method is a method performed by a reaction as shown in the reaction formula (12). A tertiary amine is reacted with an organic acid such as CF ₃ COOH, CF ₃ SO ₃ H, (CF ₃ SO ₂ ) ₂ NH, (CF ₃ SO ₂ ) ₃ CH, and (C ₂ F ₅ SO ₂ ) ₂ NH. Can be obtained.

  R described in the above reaction formulas (1) to (12) represents hydrogen or a hydrocarbon group having 1 to 20 carbon atoms, and may contain a hetero atom.

  Any appropriate ion conductive polymer may be employed as the ion conductive polymer as long as the effects of the present invention are not impaired. Examples of such an ion conductive polymer include an ion conductive polymer obtained by polymerizing or copolymerizing a monomer having a quaternary ammonium base), such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine polymer. Conductive polymer; and the like. Only one type of ion conductive polymer may be used, or two or more types may be used.

  Any appropriate ion conductive filler can be adopted as the ion conductive filler as long as the effects of the present invention are not impaired. Examples of such ion conductive filler include tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, and iron. , Cobalt, copper iodide, ITO (indium oxide / tin oxide), ATO (antimony oxide / tin oxide), and the like. Only one type of ion conductive filler may be used, or two or more types may be used.

  Any appropriate electrically conductive polymer can be adopted as the electrically conductive polymer as long as the effects of the present invention are not impaired. Examples of such an electrically conductive polymer include (3,4-ethylenedioxythiophene) -poly (styrenesulfonic acid).

  The separator may contain any appropriate additive as long as the effects of the present invention are not impaired.

<A-3. Stage 3>
In the method for producing a surface protective film of the present invention, the separator is subsequently peeled off.

  In the method for producing the surface protective film of the present invention, the time from the pasting of the separator to the surface opposite to the base material layer of the pressure-sensitive adhesive layer until peeling is preferably 6 hours to 2 years, more preferably. Is 12 hours to 1 year, more preferably 1 day to 6 months, particularly preferably 2 days to 1 month, and most preferably 3 days to 2 weeks. By adjusting the time from the pasting of the separator to the surface opposite to the base material layer of the pressure-sensitive adhesive layer to the peeling within the above range, the effect brought about by the compound (A) is only expressed in the separator. In addition, it is also expressed in the pressure-sensitive adhesive layer adjacent to the separator, and thereby, an effect that it is possible to effectively prevent the peeling charge that may occur when the separator is peeled from the surface of the pressure-sensitive adhesive layer can be exhibited. Further, as described above, since the effect brought about by the compound (A) is also expressed in the pressure-sensitive adhesive layer, the friction and peeling after the pressure-sensitive adhesive layer is adhered to an adherend such as an optical member or an electronic member. It is possible to effectively prevent the generation of static electricity that may occur during the process.

  By peeling the separator, a surface protective film having a base material layer and a pressure-sensitive adhesive layer in this order and having a very excellent antistatic property can be obtained.

≪B. Surface protection film >>
The surface protective film of the present invention is produced by the production method of the present invention.

  FIG. 1 is a schematic cross-sectional view of a surface protective film according to a preferred embodiment of the present invention. The surface protective film 10 includes a base material layer 1 and an adhesive layer 2 in this order. The surface protective film of the present invention may further have any appropriate other layer as required (not shown).

  For the purpose of forming a wound body that can be easily rewound on the surface of the base material layer 1 that is not provided with the pressure-sensitive adhesive layer 2, for example, the base material layer includes a fatty acid amide, polyethyleneimine, and a long-chain alkyl series. A release treatment can be performed by adding an additive or the like, or a coating layer made of any appropriate release agent such as silicone, long-chain alkyl, or fluorine can be provided.

  The thickness of the surface protective film of the present invention can be set to any appropriate thickness depending on the application. From the viewpoint of sufficiently expressing the effects of the present invention, the thickness is preferably 60 μm to 200 μm, more preferably 70 μm to 160 μm, still more preferably 80 μm to 140 μm, and particularly preferably 90 μm to 120 μm.

  The surface protective film of the present invention preferably has high transparency. Due to the high transparency of the surface protective film of the present invention, it becomes possible to accurately inspect the surface of the optical member or the electronic member while it is adhered. The surface protective film of the present invention has a haze of preferably 5% or less, more preferably 4% or less, still more preferably 3% or less, particularly preferably 2% or less, and most preferably 1 % Or less.

  In addition, the measurement of the said haze uses haze meter HM-150 (made by Murakami Color Research Laboratory Co., Ltd.), and based on JIS-K-7136, haze (%) = (Td / Tt) × 100 (Td : Diffuse transmittance, Tt: Total light transmittance).

≪C. Application >>
Since the surface protective film of the present invention is very excellent in antistatic properties, it can be suitably used for surface protection of optical members and electronic members.

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples at all. In addition, the test and evaluation method in an Example etc. are as follows. Note that “parts” means “parts by weight” unless otherwise noted, and “%” means “% by weight” unless otherwise noted.

<Measurement of peeling voltage>
A surface protective film having a width of 70 mm and a length of 130 mm was subjected to one-way reciprocation with a 2 kg roller against untreated glass (manufactured by Matsunami Glass, 1.35 mm × 10 cm × 10 cm) that had been previously neutralized. At this time, the surface protective film was in a state of protruding 30 mm from the glass. After being left for 1 day in an environment of 23 ° C. × 50% RH, one end protruding 30 mm from the glass was fixed to an automatic winder, and peeled so that the peeling angle was 150 degrees and the peeling speed was 10 m / min. did. Then, the stripping voltage was measured with a potential measuring device (KSD-0103, manufactured by Kasuga Electric Co., Ltd.) fixed at a position 3 cm away from the surface protective film. This measurement was performed in an environment of 23 ° C. × 50% RH.

[Example 1]
<Preparation of acrylic adhesive>
In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas inlet tube, and a condenser, 2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.): 200 parts by weight, 2-hydroxyethyl acrylate (manufactured by Toagosei Co., Ltd.): 8 Part by weight, 2,2′-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.): 0.4 part by weight, ethyl acetate: 312 parts by weight as a polymerization initiator, and nitrogen gas was added while gently stirring. Then, a polymerization reaction was carried out for 6 hours while keeping the liquid temperature in the flask at around 65 ° C. to prepare an acrylic polymer (A) solution (40% by weight).
The obtained acrylic polymer (A) solution (40% by weight) was diluted to 20% by weight with ethyl acetate, and 100 parts by weight of this solution was mixed with trimethylolpropane / tolylene diisocyanate (Nippon Polyurethane Industry) as a crosslinking agent. Co., Ltd., Coronate L, 75% by weight): 0.8 part by weight, dibutyltin dilaurate as a crosslinking catalyst (manufactured by Tokyo Fine Chemical Co., Ltd., 1% by weight ethyl acetate solution): 0.4 part by weight is added and stirred. A solution of acrylic pressure-sensitive adhesive (1) was prepared.
<Manufacture of surface protective film>
A solution of the acrylic pressure-sensitive adhesive (1) obtained above was applied to a base material “Lumirror S10” (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin so that the thickness after drying with a fountain roll was 12 μm. It was cured and dried under the conditions of a drying temperature of 130 ° C. and a drying time of 2 minutes. Thus, the adhesive layer was produced on the base material.
Next, a separator (1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide having a thickness of 25 μm having a silicone treatment on one surface and 0.05 wt. The surface treated with a separator (1) was obtained.
The obtained surface protective film with separator (1) was allowed to stand for 1 day, then cut to a width of 70 mm and a length of 130 mm, and the separator was peeled off to obtain a surface protective film (1).
The results are shown in Table 1.

[Example 2]
<Preparation of acrylic adhesive>
In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas inlet tube, and a condenser, 2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.): 200 parts by weight, 2-hydroxyethyl acrylate (manufactured by Toagosei Co., Ltd.): 8 Part by weight, 2,2′-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.): 0.4 part by weight, ethyl acetate: 312 parts by weight as a polymerization initiator, and nitrogen gas was added while gently stirring. Then, a polymerization reaction was carried out for 6 hours while keeping the liquid temperature in the flask at around 65 ° C. to prepare an acrylic polymer (A) solution (40% by weight).
The obtained acrylic polymer (A) solution (40% by weight) was diluted to 20% by weight with ethyl acetate, and 100 parts by weight of this solution was mixed with trimethylolpropane / tolylene diisocyanate (Nippon Polyurethane Industry) as a crosslinking agent. Co., Ltd., Coronate L, 75% by weight): 0.8 part by weight, dibutyltin dilaurate as a crosslinking catalyst (manufactured by Tokyo Fine Chemicals, 1% by weight ethyl acetate solution): 0.4 part by weight, and 1-ethyl-3- Methylimidazolium bis (fluoromethanesulfonyl) imide (Daiichi Kogyo Seiyaku Co., Ltd., AS110): 0.01 parts by weight was added and mixed and stirred to prepare an acrylic pressure-sensitive adhesive (2) solution.
<Manufacture of surface protective film>
A solution of the acrylic pressure-sensitive adhesive (2) obtained above was applied to a base material “Lumirror S10” (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin so that the thickness after drying with a fountain roll was 12 μm. It was cured and dried under the conditions of a drying temperature of 130 ° C. and a drying time of 2 minutes. Thus, the adhesive layer was produced on the base material.
Next, a separator (1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide having a thickness of 25 μm having a silicone treatment on one surface and 0.05 wt. The surface treated with a separator (2) was obtained.
The obtained surface protective film with separator (2) was allowed to stand for 1 day, then cut to a width of 70 mm and a length of 130 mm, and the separator was peeled off to obtain a surface protective film (2).
The results are shown in Table 1.

Example 3
<Preparation of urethane adhesive>
As the polyol (A), Preminol S3011 (manufactured by Asahi Glass Co., Ltd., Mn = 10000) which is a polyol having 3 OH groups: 85 parts by weight, Sanniks GP-3000 (Sanyo Chemical Co., Ltd.) which is a polyol having 3 OH groups Sanix GP-1000 (manufactured by Sanyo Chemical Co., Ltd., Mn = 1000): 2 parts by weight using 13 parts by weight and a polyol having 3 OH groups, polyfunctional isocyanate compound (B ) Coronate HX (Nippon Polyurethane Industry Co., Ltd.) which is a polyfunctional alicyclic isocyanate compound: 18 parts by weight, catalyst (manufactured by Nippon Chemical Industry Co., Ltd., trade name: Nursem Ferric): 0.04 parts by weight, Irganox 1010 (manufactured by BASF) as a deterioration inhibitor: 0.50 parts by weight, fatty acid ester (palmitin Isopropyl, manufactured by Kao, trade name: EXCEPARL IPP, Mn = 299): 30 parts by weight, ethyl acetate: 241 parts by weight as a diluent solvent, and stirred with a disper to prepare a solution of urethane-based adhesive (3) .
<Manufacture of surface protective film>
Apply the urethane adhesive (3) solution obtained above to a base material “Lumirror S10” (thickness 38 μm, manufactured by Toray Industries, Inc.) made of a polyester resin so that the thickness after drying with a fountain roll is 12 μm. It was cured and dried under the conditions of a drying temperature of 130 ° C. and a drying time of 2 minutes. Thus, the adhesive layer was produced on the base material.
Next, a separator (1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide having a thickness of 25 μm having a silicone treatment on one surface and 0.05 wt. The surface treated with a separator (3) was obtained.
The obtained surface protective film with separator (3) was allowed to stand for 1 day, then cut to a width of 70 mm and a length of 130 mm, and the separator was peeled off to obtain a surface protective film (3).
The results are shown in Table 1.

Example 4
<Preparation of urethane adhesive>
As the polyol (A), Preminol S3011 (manufactured by Asahi Glass Co., Ltd., Mn = 10000) which is a polyol having 3 OH groups: 85 parts by weight, Sanniks GP-3000 (Sanyo Chemical Co., Ltd.) which is a polyol having 3 OH groups Sanix GP-1000 (manufactured by Sanyo Chemical Co., Ltd., Mn = 1000): 2 parts by weight using 13 parts by weight and a polyol having 3 OH groups, polyfunctional isocyanate compound (B ) Coronate HX (Nippon Polyurethane Industry Co., Ltd.) which is a polyfunctional alicyclic isocyanate compound: 18 parts by weight, catalyst (manufactured by Nippon Chemical Industry Co., Ltd., trade name: Nursem Ferric): 0.04 parts by weight, Irganox 1010 (manufactured by BASF) as a deterioration inhibitor: 0.50 parts by weight, fatty acid ester (palmitin Isopropyl, manufactured by Kao, trade name: Exepal IPP, Mn = 299): 30 parts by weight, 1-ethyl-3-methylimidazolium bis (fluoromethanesulfonyl) imide (Daiichi Kogyo Seiyaku Co., Ltd., AS110): 1.00 Part by weight, 241 parts by weight of ethyl acetate as a diluting solvent were blended and stirred with a disper to prepare a solution of urethane-based pressure-sensitive adhesive (4).
<Manufacture of surface protective film>
The urethane adhesive (4) solution obtained above was applied to a base material “Lumirror S10” (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin so that the thickness after drying with a fountain roll was 12 μm. It was cured and dried under the conditions of a drying temperature of 130 ° C. and a drying time of 2 minutes. Thus, the adhesive layer was produced on the base material.
Next, a separator (1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide having a thickness of 25 μm having a silicone treatment on one surface and 0.05 wt. The surface treated with a separator (4) was obtained.
The obtained surface protective film with separator (4) was allowed to stand for 1 day, then cut to a width of 70 mm and a length of 130 mm, and the separator was peeled off to obtain a surface protective film (4).
The results are shown in Table 1.

Example 5
<Preparation of silicone adhesive>
Addition reaction type silicone pressure-sensitive adhesive (trade name “X-40-3306”, manufactured by Shin-Etsu Chemical Co., Ltd.): 100 parts by weight and platinum-based catalyst (trade name “CAT-PL-50T”, Shin-Etsu Chemical Co., Ltd.) (Made by company): 0.2 part by weight was mixed to prepare a silicone-based pressure-sensitive adhesive (5).
<Manufacture of surface protective film>
The silicone-based pressure-sensitive adhesive (5) obtained above is applied to a base material “Lumirror S10” (thickness 38 μm, manufactured by Toray Industries, Inc.) made of a polyester resin so that the thickness after drying with a fountain roll is 12 μm. It was cured by drying at a temperature of 130 ° C. and a drying time of 2 minutes. Thus, the adhesive layer was produced on the base material.
Next, a separator (1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide having a thickness of 25 μm having a silicone treatment on one surface and 0.05 wt. The surface treated with a separator (5) was obtained.
The obtained surface protective film with separator (5) was allowed to stand for 1 day, then cut to a width of 70 mm and a length of 130 mm, and the separator was peeled off to obtain a surface protective film (5).
The results are shown in Table 1.

Example 6
<Preparation of silicone adhesive>
Addition reaction type silicone adhesive (trade name “X-40-3306”, manufactured by Shin-Etsu Chemical Co., Ltd.): 100 parts by weight, platinum-based catalyst (trade name “CAT-PL-50T”, manufactured by Shin-Etsu Chemical Co., Ltd.) ): 0.2 part by weight and 1-ethyl-3-methylimidazolium bis (fluoromethanesulfonyl) imide (Daiichi Kogyo Seiyaku Co., Ltd., AS110) Agent (6) was prepared.
<Manufacture of surface protective film>
The silicone-based pressure-sensitive adhesive (6) obtained above is applied to a base material “Lumirror S10” (thickness 38 μm, manufactured by Toray Industries, Inc.) made of a polyester resin so that the thickness after drying with a fountain roll is 12 μm. It was cured by drying at a temperature of 130 ° C. and a drying time of 2 minutes. Thus, the adhesive layer was produced on the base material.
Next, a separator (1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide having a thickness of 25 μm having a silicone treatment on one surface and 0.05 wt. The surface treated with a separator (6) was obtained.
The obtained surface protective film with separator (6) was allowed to stand for 1 day, then cut to a width of 70 mm and a length of 130 mm, and the separator was peeled off to obtain a surface protective film (6).
The results are shown in Table 1.

Example 7
<Preparation of polyester adhesive>
A three-necked separable flask was equipped with a stirrer, a thermometer, and a condenser tube, and the molar ratio of dimer acid as dicarboxylic acid to dimer diol as diol was 1: 1.05. Dimer acid (trade name “PRIPOL 1009”, manufactured by Croda, weight average molecular weight: 567): 100.9 parts by weight, dimer diol (trade name “PRIPOL 2033”, manufactured by CRODA, weight average molecular weight: 537): 100 wt. In addition, 0.1 part by weight of titanium tetraisopropoxide (made by Kishida Chemical Co., Ltd.) as a catalyst was charged, and the temperature was raised to 200 ° C. while stirring in a reduced pressure atmosphere (0.002 MPa), and this temperature was maintained. The reaction was continued for about 5 hours to obtain polyester (A).
Polyester (A) obtained: 100 parts by weight of isocyanurate-type polyhexamethylene diisocyanate (trade name “Desmodur N3600”, manufactured by Sumika Bayer) as a crosslinking agent: 25 parts by weight as a solvent Toluene: 150 parts by weight was added to adjust the viscosity to be easy to apply (about 10 Pa · s) to obtain a polyester-based pressure-sensitive adhesive (7).
<Manufacture of surface protective film>
The polyester-based pressure-sensitive adhesive (7) obtained above is applied to a base material “Lumirror S10” (thickness 38 μm, manufactured by Toray Industries, Inc.) made of a polyester resin so that the thickness after drying with a fountain roll is 12 μm. It was cured by drying at a temperature of 130 ° C. and a drying time of 2 minutes. Thus, the adhesive layer was produced on the base material.
Next, a separator (1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide having a thickness of 25 μm having a silicone treatment on one surface and 0.05 wt. The surface treated with a separator (7) was obtained.
The obtained surface protective film with separator (7) was allowed to stand for 1 day, then cut to a width of 70 mm and a length of 130 mm, and the separator was peeled off to obtain a surface protective film (7).
The results are shown in Table 1.

Example 8
<Preparation of polyester adhesive>
A three-necked separable flask was equipped with a stirrer, a thermometer, and a condenser tube, and the molar ratio of dimer acid as dicarboxylic acid to dimer diol as diol was 1: 1.05. Dimer acid (trade name “PRIPOL 1009”, manufactured by Croda, weight average molecular weight: 567): 100.9 parts by weight, dimer diol (trade name “PRIPOL 2033”, manufactured by CRODA, weight average molecular weight: 537): 100 wt. In addition, 0.1 part by weight of titanium tetraisopropoxide (made by Kishida Chemical Co., Ltd.) as a catalyst was charged, and the temperature was raised to 200 ° C. while stirring in a reduced pressure atmosphere (0.002 MPa), and this temperature was maintained. The reaction was continued for about 5 hours to obtain polyester (A).
Isocyanurate type polyhexamethylene diisocyanate (trade name “Desmodur N3600”, manufactured by Sumika Bayer Co., Ltd.): 25 parts by weight and 1-ethyl as a crosslinking agent with respect to 100 parts by weight of the obtained polyester (A) -3-Methylimidazolium bis (fluoromethanesulfonyl) imide (Daiichi Kogyo Seiyaku Co., Ltd., AS110): 1.00 part by weight, toluene: 150 parts by weight as a solvent, viscosity easy to coat It adjusted to (about 10 Pa * s) and the polyester-type adhesive (8) was obtained.
<Manufacture of surface protective film>
The polyester-based pressure-sensitive adhesive (8) obtained above is applied to a base material “Lumirror S10” (thickness 38 μm, manufactured by Toray Industries, Inc.) made of a polyester resin so that the thickness after drying with a fountain roll is 12 μm. It was cured by drying at a temperature of 130 ° C. and a drying time of 2 minutes. Thus, the adhesive layer was produced on the base material.
Next, a separator (1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide having a thickness of 25 μm having a silicone treatment on one surface and 0.05 wt. The surface treated with a separator (8) was obtained.
The obtained surface protective film with separator (8) was allowed to stand for 1 day, then cut to a width of 70 mm and a length of 130 mm, and the separator was peeled off to obtain a surface protective film (8).
The results are shown in Table 1.

[Comparative Example 1]
A surface protective film (C1) was prepared in the same manner as in Example 1 except that a separator (not including the compound (A)) made of a polyester resin with a thickness of 25 μm and treated with silicone on one surface was used as the separator. )
The results are shown in Table 1.

[Comparative Example 2]
A surface protective film (C1) was prepared in the same manner as in Example 1 except that a separator (not including the compound (A)) made of a polyester resin with a thickness of 25 μm and treated with silicone on one surface was used as the separator. )
The results are shown in Table 1.

[Comparative Example 3]
A surface protective film (C1) was prepared in the same manner as in Example 1 except that a separator (not including the compound (A)) made of a polyester resin with a thickness of 25 μm and treated with silicone on one surface was used as the separator. )
The results are shown in Table 1.

[Comparative Example 4]
A surface protective film (C1) was prepared in the same manner as in Example 1 except that a separator (not including the compound (A)) made of a polyester resin having a thickness of 25 μm and subjected to silicone treatment on one surface was used as the separator. )
The results are shown in Table 1.

[Comparative Example 5]
A surface protective film (C1) was prepared in the same manner as in Example 1 except that a separator (not including the compound (A)) made of a polyester resin with a thickness of 25 μm and treated with silicone on one surface was used as the separator. )
The results are shown in Table 1.

[Comparative Example 6]
A surface protective film (C1) was prepared in the same manner as in Example 1 except that a separator (not including the compound (A)) made of a polyester resin with a thickness of 25 μm and treated with silicone on one surface was used as the separator. )
The results are shown in Table 1.

[Comparative Example 7]
A surface protective film (C1) was prepared in the same manner as in Example 1 except that a separator (not including the compound (A)) made of a polyester resin with a thickness of 25 μm and treated with silicone on one surface was used as the separator. )
The results are shown in Table 1.

[Comparative Example 8]
A surface protective film (C1) was prepared in the same manner as in Example 1 except that a separator (not including the compound (A)) made of a polyester resin with a thickness of 25 μm and treated with silicone on one surface was used as the separator. )
The results are shown in Table 1.

Example 9
The surface protective film (1) obtained in Example 1 was attached to a polarizing plate (manufactured by Nitto Denko Corporation, trade name “TEG1465DUHC”) which is an optical member, and the optical member to which the surface protective film was attached was attached. Obtained.

Example 10
The surface protective film (2) obtained in Example 2 was attached to a polarizing plate (manufactured by Nitto Denko Corporation, trade name “TEG1465DUHC”) which is an optical member, and the optical member to which the surface protective film was attached was attached. Obtained.

Example 11
The surface protective film (3) obtained in Example 3 was attached to a polarizing plate (manufactured by Nitto Denko Corporation, trade name “TEG1465DUHC”) which is an optical member, and the optical member to which the surface protective film was attached was attached. Obtained.

Example 12
The surface protective film (4) obtained in Example 4 was attached to a polarizing plate (manufactured by Nitto Denko Corporation, trade name “TEG1465DUHC”) which is an optical member, and the optical member to which the surface protective film was attached was attached. Obtained.

Example 13
The surface protective film (5) obtained in Example 5 was attached to a polarizing plate (manufactured by Nitto Denko Corporation, trade name “TEG1465DUHC”) which is an optical member, and the optical member to which the surface protective film was attached was attached. Obtained.

Example 14
The surface protective film (6) obtained in Example 6 was attached to a polarizing plate (manufactured by Nitto Denko Corporation, trade name “TEG1465DUHC”) which is an optical member, and the optical member to which the surface protective film was attached was attached. Obtained.

Example 15
The surface protective film (7) obtained in Example 7 was attached to a polarizing plate (manufactured by Nitto Denko Corporation, trade name “TEG1465DUHC”) which is an optical member, and the optical member to which the surface protective film was attached was attached. Obtained.

Example 16
The surface protective film (8) obtained in Example 8 was attached to a polarizing plate (manufactured by Nitto Denko Corporation, trade name “TEG1465DUHC”) which is an optical member, and the optical member to which the surface protective film was attached was attached. Obtained.

Example 17
The surface protective film (1) obtained in Example 1 was attached to a conductive film (Nitto Denko Corporation, trade name “Electrista V270L-TFMP”) which is an electronic member, and the surface protective film was attached. An electronic member was obtained.

Example 18
The surface protective film (2) obtained in Example 2 is attached to a conductive film (Nitto Denko Corporation, trade name “Electrista V270L-TFMP”) which is an electronic member, and the surface protective film is attached. An electronic member was obtained.

Example 19
The surface protective film (3) obtained in Example 3 was attached to a conductive film (Nitto Denko Corporation, trade name “Electrista V270L-TFMP”) which is an electronic member, and the surface protective film was attached. An electronic member was obtained.

Example 20
The surface protective film (4) obtained in Example 4 was attached to a conductive film (Nitto Denko Corporation, trade name “Electrista V270L-TFMP”) which is an electronic member, and the surface protective film was attached. An electronic member was obtained.

Example 21
The surface protective film (5) obtained in Example 5 was attached to a conductive film (Nitto Denko Corporation, trade name “Electrista V270L-TFMP”) which is an electronic member, and the surface protective film was attached. An electronic member was obtained.

[Example 22]
The surface protective film (6) obtained in Example 6 was attached to a conductive film (Nitto Denko Corporation, trade name “Electrista V270L-TFMP”) which is an electronic member, and the surface protective film was attached. An electronic member was obtained.

Example 23
The surface protective film (7) obtained in Example 7 was attached to a conductive film (Nitto Denko Corporation, trade name “Electrista V270L-TFMP”) which is an electronic member, and the surface protective film was attached. An electronic member was obtained.

Example 24
The surface protective film (8) obtained in Example 8 was attached to a conductive film (Nitto Denko Corporation, trade name “Electrista V270L-TFMP”) which is an electronic member, and the surface protective film was attached. An electronic member was obtained.

Example 140
The surface protective film (36) obtained in Example 36 was attached to a conductive film (Nitto Denko Corporation, trade name “Electrista V270L-TFMP”) as an electronic member, and the surface protective film was attached. An electronic member was obtained.

  The surface protective film of this invention can be used suitably for the surface protection of an optical member or an electronic member.

DESCRIPTION OF SYMBOLS 1 Base material layer 2 Adhesive layer 3 Separator 10 Surface protection film 100 Laminate

Claims (4)

A method for producing a surface protective film having a base material layer and an adhesive layer,
A laminate comprising a base material layer and an adhesive layer, wherein the adhesive layer is the outermost layer,
A separator containing an ionic liquid is bonded to the surface of the pressure-sensitive adhesive layer opposite to the base material layer,
Then peel the separator,
A method for producing a surface protective film.
However, the ionic liquid is an ionic liquid composed of a fluoroorganic anion and an onium cation, and the onium cation has a structure represented by the general formulas (2), (3), and (5). Is at least one selected from

(In the general formula (2), Rd represents a hydrocarbon group having 2 to 20 carbon atoms and may contain a hetero atom, and Re, Rf, and Rg are the same or different and each represents hydrogen or 1 carbon atom. The hydrocarbon group of 1 to 16 may contain a hetero atom, and in the general formula (3), Rh represents a hydrocarbon group of 2 to 20 carbon atoms, may contain a hetero atom, Ri , Rj, and Rk are the same or different and each represents hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, and may contain a hetero atom, In the general formula (5), X represents a Li atom, a Na atom Or represents a K atom.)   The method for producing a surface protective film according to claim 1, wherein the time from pasting the separator to peeling is 6 hours to 2 years. The manufacturing method of the surface protection film of Claim 1 or 2 whose content rate of the said ionic liquid in the said separator is 0.001 weight%-2.0 weight%. The adhesive layer according to any one of claims 1 to 3 , wherein the adhesive layer contains at least one adhesive selected from an acrylic adhesive, a urethane adhesive, a silicone adhesive, a polyester adhesive, and a rubber adhesive. A method for producing the surface protective film according to claim 1.

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