JP6323047B2 - Resin multilayer substrate and manufacturing method thereof - Google Patents

Description

  The present invention relates to a resin multilayer substrate and a method for manufacturing the same.

  In the resin multilayer substrate, the density of wiring is increasing. For example, in a resin multilayer substrate, a capacitor may be formed by making conductor patterns face each other while being separated in the thickness direction.

  An example of a configuration in which a conductor pattern is arranged inside a laminate in a resin multilayer substrate is described in International Publication No. 2012/124421 (Patent Document 1).

International Publication No. 2012/124421 Pamphlet

  In order to ensure a large capacitance of the capacitor formed by making the conductor patterns face each other inside the multilayer body, as a first method, it is conceivable to increase the area of the region where the conductor patterns face each other. .

  As a second method, it is conceivable to reduce the gap between the conductor patterns in the thickness direction. In order to reduce the gap between the conductor patterns, it is conceivable to use a thin resin sheet at the portion sandwiched between the two conductor patterns of the capacitor when producing the laminate. However, the thickness of the resin sheet to be used is determined in advance, and it is difficult to use a thin resin sheet only in a desired portion in the laminate.

  Such a problem is applicable not only to capacitors but also to other structures. In these structures, it may be desired to shorten the gap between the conductor patterns without enlarging the area of the structure when viewed in plan.

  In view of the above, an object of the present invention is to provide a resin multilayer substrate in which the gap between conductor patterns is desired to be shortened in the multilayer body, and the manufacturing method thereof.

  In order to achieve the above object, a resin multilayer substrate according to the present invention includes a laminated body in which a plurality of resin layers mainly composed of a thermoplastic resin are stacked and pressed in the laminating direction, and disposed inside the laminated body. A plurality of conductor patterns, and two of the plurality of conductor patterns form a conductor pattern pair in a positional relationship overlapping in the vertical direction across at least one of the plurality of resin layers. A dummy structure is arranged inside the laminated body so as to be close to the upper side, the lower side, or the upper side and the lower side of the conductor pattern pair, and is partially sandwiched between the conductor pattern pairs. The thickness of the resin layer at the portion sandwiched between the conductor pattern pairs is smaller than the thickness at the portion not sandwiched between the conductor pattern pairs.

  ADVANTAGE OF THE INVENTION According to this invention, the structure which shortened the clearance gap between the conductor patterns of a structure can be implement | achieved easily.

It is sectional drawing of the resin multilayer substrate in Embodiment 1 based on this invention. It is sectional drawing of the modification of the resin multilayer substrate in Embodiment 1 based on this invention. It is sectional drawing of the resin multilayer substrate in Embodiment 2 based on this invention. It is a perspective view of the dummy structure contained in the resin multilayer substrate in Embodiment 2 based on this invention. It is a side view of the 1st modification of the dummy structure contained in the resin multilayer substrate in Embodiment 2 based on this invention. It is a side view of the 2nd modification of the dummy structure contained in the resin multilayer substrate in Embodiment 2 based on this invention. It is a perspective view of the 2nd modification of the dummy structure contained in the resin multilayer substrate in Embodiment 2 based on this invention. It is a side view of the 3rd modification of the dummy structure contained in the resin multilayer substrate in Embodiment 2 based on this invention. It is a side view of the 4th modification of the dummy structure contained in the resin multilayer substrate in Embodiment 2 based on this invention. It is a side view of the 5th modification of the dummy structure contained in the resin multilayer substrate in Embodiment 2 based on this invention. It is sectional drawing of the resin multilayer substrate in Embodiment 3 based on this invention. It is sectional drawing of the 1st modification of the resin multilayer substrate in Embodiment 3 based on this invention. It is sectional drawing of the 2nd modification of the resin multilayer substrate in Embodiment 3 based on this invention. It is a top view of the 1st example of the positional relationship of a dummy structure and a conductor pattern pair. It is a top view of the 2nd example of the positional relationship of a dummy structure and a conductor pattern pair. It is sectional drawing of the resin multilayer substrate in Embodiment 4 based on this invention. It is sectional drawing of the modification of the resin multilayer substrate in Embodiment 4 based on this invention. FIG. 11 is a first explanatory diagram relating to a preferred arrangement of dummy structures when there is a difference in the size of conductor patterns constituting conductor pattern pair 8. It is the 2nd explanatory view about desirable arrangement of a dummy structure when there is a difference in the size of the conductor pattern which constitutes conductor pattern pair. It is sectional drawing of the resin multilayer substrate in Embodiment 5 based on this invention. It is a perspective top view of the resin multilayer substrate in Embodiment 5 based on this invention. It is a see-through | perspective perspective view of the resin multilayer substrate in Embodiment 5 based on this invention. It is a flowchart of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is a conceptual explanatory drawing of the state just before performing the process of obtaining the manufacturing method laminated body of the resin multilayer substrate in Embodiment 6 based on this invention. It is sectional drawing of the state immediately after performing the process of obtaining the manufacturing method laminated body of the resin multilayer substrate in Embodiment 6 based on this invention.

(Embodiment 1)
(Constitution)
With reference to FIG. 1, the resin multilayer substrate in Embodiment 1 based on this invention is demonstrated. A cross-sectional view of the resin multilayer substrate 101 in the present embodiment is shown in FIG.

  The resin multilayer substrate 101 according to the present embodiment includes a laminated body in which a plurality of resin layers 2 mainly made of a thermoplastic resin are stacked and pressed in the laminating direction, and a plurality of layers arranged inside the laminated body. A conductor pattern. The conductor patterns 8a and 8b, which are two of the plurality of conductor patterns, form a conductor pattern pair 8 in a positional relationship that overlaps in the vertical direction with at least one of the plurality of resin layers 2 interposed therebetween. The conductor pattern pair 8 constitutes a capacitor. The dummy structure 3 is disposed so as to be close to the upper side, the lower side, or the upper side and the lower side of the conductor pattern pair 8 inside the laminated body. The resin layer partially sandwiched between the conductor pattern pairs 8 is smaller in thickness at a portion sandwiched between the conductor pattern pairs than at a portion not sandwiched between the conductor pattern pairs. Yes.

  In the example shown in FIG. 1, the dummy structure 3 is above the conductor pattern pair 8. In the example shown in FIG. 1, the dummy structure 3 includes a first dummy conductor pattern 31 and a plurality of dummy conductor vias 36 are arranged so as to be connected to the upper side of the first dummy conductor pattern 31. . These configurations are merely examples.

  In the present specification, the “dummy” of the dummy structure, the dummy conductor pattern, and the dummy conductor via does not function as a part of the circuit itself, and is substantially electrically connected to other circuit elements. Means not done.

  The resin multilayer substrate 101 may include a conductor pattern 7 in addition to the two conductor patterns 8 a and 8 b that form the conductor pattern pair 8. Further, the conductor via 6 may be provided at a location different from the dummy structure 3. In FIG. 1, for the convenience of explanation, a simplified configuration is shown, but this is only an example, and the specific structure is not limited to that shown in FIG.

Such a resin multilayer substrate 101 can be obtained, for example, as follows.
(1) A resin layer (resin sheet) made of a plurality of thermoplastic resins provided with a metal foil such as copper foil on one side or both sides, or a resin layer (resin sheet) made of a thermoplastic resin not provided with a metal foil Prepare.

  (2) A hole that does not penetrate the conductor foil but penetrates the resin layer is provided at a predetermined position of the specific resin layer in the resin layer by laser processing or the like.

(3) Fill the through hole with a via material made of a conductive paste and dry it.
(4) A predetermined conductor pattern is formed by performing etching or the like on the conductor foil of a specific resin layer in the resin layer.

  (5) Laminating a plurality of resin layers, and applying pressure while heating at a temperature equal to or higher than the softening point of the thermoplastic resin (for example, 300 ° C.), obtains a laminate, and cures the via material filled in the through holes. Get conductor vias.

(Action / Effect)
In the present embodiment, the resin layer partially sandwiched between the conductor pattern pairs 8 is a portion where the thickness of the resin layer sandwiched between the conductor pattern pairs is not sandwiched between the conductor pattern pairs. It is smaller than the thickness. The conductor pattern pair 8 is a structure in which it is desired to shorten the gap between the conductor patterns inside the multilayer body. That is, in the present embodiment, the conductor pattern pair 8 is a capacitor, and according to the present embodiment, the gap between the conductor patterns can be shortened, so that the capacitor pattern pair 8 can be used without increasing the area of the conductor pattern pair. The capacity value can be increased. In the present embodiment, a configuration in which the gap between the conductor patterns of such a structure is shortened can be easily realized.

  When a plurality of resin layers are stacked to form a laminated body, the rigidity in the thickness direction of the portion occupied by the dummy structure 3 is increased by inserting the dummy structure 3 therein. In the case of the resin multilayer substrate in the present embodiment, when thermocompression bonding a stack of a plurality of resin layers into an integrated laminate, other parts are provided within the vertical projection area of the dummy structure 3. The pressure is relatively higher than. Since the conductor pattern pair 8 is in the projection region in the vertical direction of the dummy structure 3, the conductor pattern pair 8 is affected by a relatively increased pressure due to the presence of the dummy structure 3. As a result, the portion of the resin layer 2 located between the conductor pattern pair 8 is compressed and thinned, and the distance between the conductor patterns 8a and 8b of the conductor pattern pair 8 is reduced.

The resin multilayer substrate in the present embodiment can be easily manufactured as described above.
The conductor patterns 8a and 8b included in the conductor pattern pair 8 may be formed of the same material as the other conductor patterns 7 with the same thickness. The same applies to the dummy conductor pattern included in the dummy structure 3. Any of these conductor patterns can be formed, for example, by patterning a conductor foil of a resin sheet with a conductor foil by a method such as etching. The conductor foil here may be a copper foil, for example. These conductor patterns are preferably copper, since they have good conductivity, but may be other materials.

  The dummy conductor via 36 included in the dummy structure 3 may be formed by filling a conductive paste. That is, the dummy conductor via 36 may be formed by the same method as a conductor via conventionally used for electrical connection between layers. The conductive paste here may be, for example, a conductive paste containing at least one of tin, copper, and silver, or may be a paste made of other materials. The dummy conductor via 36 included in the dummy structure 3 includes the word “conductor via” in its name here, but may be a via formed of a material that is not actually a conductor. However, since it is convenient to form the conductive vias in the same manner as the conventional conductive vias used for the electrical connection between the layers without increasing extra steps, the vias included in the dummy structure 3 are usually used. Is considered to be a via formed of a conductor.

  As shown in the present embodiment, the dummy structure 3 is preferably a combination of the first dummy conductor pattern 31 and the dummy conductor via 36 connected to the first dummy conductor pattern 31. By adopting this configuration, the shape of the dummy structure 3 can be made three-dimensional, and the rigidity of the dummy structure 3 itself can be increased.

  In the example of the resin multilayer substrate 101 shown in FIG. 1, the dummy structure 3 is above the conductor pattern pair 8, and the dummy structure 3 is connected to the dummy conductor via 36 above the first dummy conductor pattern 31. It was a composition. That is, the first dummy conductor pattern 31 is present instead of the dummy conductor via 36 on the side closest to the conductor pattern pair 8 in the entire dummy structure 3.

  A configuration like the resin multilayer substrate 102 shown in FIG. 2 may be used. In the resin multilayer substrate 102, the dummy structure 3 is on the upper side of the conductor pattern pair 8, and the dummy structure 3 is configured such that the dummy conductor via 36 is connected to the lower side of the first dummy conductor pattern 31. That is, the dummy conductor via 36 is present instead of the first dummy conductor pattern 31 on the side closest to the conductor pattern pair 8 in the entire dummy structure 3. Even in such a configuration, the pressure can be relatively increased due to the presence of the dummy structure 3, so that the same effect can be obtained.

  However, when the resin multilayer substrate 101 shown in FIG. 1 is compared with the resin multilayer substrate 102 shown in FIG. 2, as in the resin multilayer substrate 101, on the side closest to the conductor pattern pair 8 in the dummy structure 3, A superior effect can be expected when the dummy conductor pattern included in the dummy structure 3 is arranged. This is because, as shown in FIG. 1, if the dummy structure 3 faces the conductor pattern pair 8 with a flat dummy conductor pattern, the dummy structure 3 can easily transmit pressure to the conductor pattern pair 8.

  In other words, the dummy conductor via 36 included in the dummy structure 3 is preferably connected to the surface of the first dummy conductor pattern 31 included in the dummy structure 3 on the side opposite to the conductor pattern pair 8. This is because the adoption of this configuration makes it easier to transmit the pressure to the conductor pattern pair 8.

  Further, the dummy structure 3 does not function as a part of the circuit itself, and is not substantially electrically connected to other circuit elements. Therefore, it is possible to suppress the possibility of characteristic fluctuations due to unnecessary capacitive coupling between the dummy structure 3 and other circuit elements.

(Embodiment 2)
(Constitution)
With reference to FIGS. 3 to 4, a resin multilayer substrate in accordance with the second embodiment of the present invention will be described. A cross-sectional view of the resin multilayer substrate 103 in the present embodiment is shown in FIG. The basic configuration of the resin multilayer substrate 103 is the same as that described in the first embodiment, but differs in the following points.

  In the resin multilayer substrate 103, the dummy structure 3 includes a second dummy conductor pattern 32 that is different from the first dummy conductor pattern 31 and has a positional relationship that at least partially overlaps the first dummy conductor pattern 31. The via 36 connects the first dummy conductor pattern 31 and the second dummy conductor pattern 32.

  That is, in the resin multilayer substrate 103, the dummy structure 3 includes two conductor patterns. The dummy structure 3 includes a first dummy conductor pattern 31, a second dummy conductor pattern 32, and a dummy conductor via 36 that connects them to each other.

  FIG. 4 is a perspective view showing only the dummy structure 3 included in the resin multilayer substrate 103 taken out.

(Action / Effect)
In the present embodiment, since the dummy structure 3 includes two dummy conductor patterns, and the two dummy conductor patterns are connected to each other by the conductor vias, the rigidity of the dummy structure 3 can be further increased. . This contributes to increasing the pressure applied to the conductor pattern pair 8 and is preferable in reducing the distance between the conductor patterns 8a and 8b of the conductor pattern pair 8.

  In FIG. 3, the dummy conductor via 36 has a tapered shape in which the side close to the conductor pattern pair 8 is thin. However, the dummy conductor via 36 may have a reverse tapered shape or a straight shape. It may be. The same applies to the conductor vias that appear in the following description unless otherwise noted.

  In FIG. 3 and FIG. 4, for convenience of explanation, the first dummy conductor pattern 31 and the second dummy conductor pattern 32 are shown as substantially the same size, but both are not necessarily the same size. In FIG. 4, for the convenience of explanation, both the first dummy conductor pattern 31 and the second dummy conductor pattern 32 are shown as squares. However, this is only an example, and is not limited to a square. The shape may also be

  For convenience of explanation, FIG. 4 shows a configuration in which the dummy conductor vias 36 are regularly arranged in a matrix between the first dummy conductor pattern 31 and the second dummy conductor pattern 32. For example, the arrangement of the dummy conductor vias 36 is not limited to a matrix.

  FIG. 4 shows an example in which the dummy structure 3 includes two dummy conductor patterns arranged in the thickness direction, but the number of dummy conductor patterns arranged in the thickness direction included in the dummy structure 3 is not limited to two. It may be the above. FIG. 5 shows an example in which the dummy structure 3 includes three dummy conductor patterns arranged in the thickness direction. In the example shown in FIG. 5, the dummy structure 3 includes a first dummy conductor pattern 31, a second dummy conductor pattern 32, and a third dummy conductor pattern 33 arranged in the thickness direction. The first dummy conductor pattern 31, the second dummy conductor pattern 32, and the third dummy conductor pattern 33 are connected by a dummy conductor via 36 so as to be connected together in the stacking direction.

  1 to 5, the dummy conductor vias 36 are arranged relatively densely in the dummy structure 3, but a certain degree of effect can be obtained even if the arrangement of the dummy conductor vias 36 is smaller. For example, as shown in FIG. 6, a configuration may be adopted in which dummy conductor vias 36 are arranged only at both ends between the first dummy conductor pattern 31 and the second dummy conductor pattern 32 arranged in the thickness direction. In this case, the perspective view of the dummy structure 3 is as shown in FIG. If the dummy conductor vias 36 are arranged in the corner portions as viewed in a plane as described above, the strength can be increased even with a small number of dummy conductor vias 36.

  In FIG. 7, for the convenience of explanation, both the first dummy conductor pattern 31 and the second dummy conductor pattern 32 are shown as squares. However, this is merely an example, and is not limited to a square. The shape may also be Further, the number of dummy conductor patterns arranged in the thickness direction from the structure shown in FIG. 7 may be increased to 3 or more. FIG. 8 shows an example in which the number of dummy conductor patterns arranged in the thickness direction is three. The dummy structure 3 may have such a configuration.

  Furthermore, a very simple example of the dummy structure 3 may be as shown in FIG. In the example shown in FIG. 9, the dummy structure 3 has a structure in which the first dummy conductor pattern 31 and one dummy conductor via 36 are simply connected. As a modification of this configuration, the one shown in FIG. 10 is also conceivable. In the example shown in FIG. 10, the dummy structure 3 has a structure in which the first dummy conductor pattern 31 and the second dummy conductor pattern 32 are connected by one dummy conductor via 36. Even with such a simple configuration, a certain degree of effect can be obtained.

(Embodiment 3)
(Constitution)
In the embodiments so far, the dummy conductor pattern arranged as one layer is integrated in one dummy structure 3, but it is not necessarily integrated, And may be divided into a plurality of parts.

  With reference to FIG. 11, the resin multilayer substrate in Embodiment 3 based on this invention is demonstrated. FIG. 11 is a cross-sectional view of resin multilayer substrate 111 in the present embodiment. The basic configuration of the resin multilayer substrate 111 is the same as that described in the first embodiment, but differs in the following points.

  As shown in FIG. 11, in the resin multilayer substrate 111, the first dummy conductor pattern 31 is divided into a plurality of small pieces. One dummy conductor via 36 is connected to each of the divided pieces of the first dummy conductor pattern 31. The divided pieces of the first dummy conductor pattern 31 are arranged close to each other in the same layer. In the example shown in FIG. 11, only one dummy conductor via 36 is connected to one piece of the first dummy conductor pattern 31, but the number of dummy conductor vias 36 connected to one piece is one. The number is not limited, and may be two or more.

(Action / Effect)
Also in the present embodiment, the same effect as in the first embodiment can be obtained. However, the degree of effect is not necessarily the same as in the first embodiment.

  In addition, a structure like the resin multilayer substrate 112 shown in FIG. 12 may be sufficient. In the resin multilayer substrate 112, the dummy structure 3 is on both the upper side and the lower side of the conductor pattern pair 8. The configuration in which the conductor pattern pair 8 is sandwiched from above and below by the two dummy structures 3 is preferable because pressure can be easily transmitted to the conductor pattern 8.

  In FIG. 12, the upper and lower dummy structures 3 of the conductor pattern pair 8 are both arranged in the orientation in which the first dummy conductor pattern 31 faces downward, but the present invention is not limited to this configuration. For example, a configuration like a resin multilayer substrate 113 shown in FIG. 13 is more preferable. In the resin multilayer substrate 113, the upper dummy structure 3 of the conductor pattern pair 8 is oriented so that the first dummy conductor pattern 31 faces downward, and the lower dummy structure 3 of the conductor pattern pair 8 is The first dummy conductor pattern 31 is directed upward. The configuration in which the conductor pattern pair 8 is sandwiched from above and below so that the dummy conductor pattern sides are opposed to each other with the two dummy structures 3 is preferable because pressure is more easily transmitted to the conductor pattern 8.

  Note that the dummy structure 3 is preferably positioned so as to cover the projection region of the conductor pattern pair 8 in a plan view, as it applies to all of the above embodiments. That is, when only the area occupied by both is viewed in plan, the dummy structure 3 preferably covers the conductor pattern pair 8 as shown in FIG. Here, the dummy structure 3 and the conductor pattern pair 8 are both shown as a square, but the shape is not limited to a square and may be an arbitrary shape. In this way, if the dummy structure 3 is in the relationship of covering the conductor pattern pair 8, the dummy structure 3 can more reliably apply pressure to the conductor pattern pair 8. In particular, in this case, it is possible to reduce the influence due to the relative positional deviation between the dummy structure 3 and the conductor pattern pair 8 when viewed in plan.

  Further, even when the dummy conductor patterns included in the dummy structure 3 are not integrated but divided into a plurality of pieces, as shown in FIG. 15, these divided dummy conductor patterns are close to each other. It is preferable that the conductor pattern pair 8 is covered by the entire arrangement. That is, it is preferable that the entire outline of the arrangement of the plurality of pieces of dummy conductor patterns is outside the outline of the conductor pattern pair 8.

(Embodiment 4)
(Constitution)
With reference to FIG. 16, the resin multilayer substrate in Embodiment 4 based on this invention is demonstrated. FIG. 16 is a cross-sectional view of resin multilayer substrate 121 in the present embodiment. The basic configuration of the resin multilayer substrate 121 is the same as that described in the first embodiment, but differs in the following points.

  The dummy structure 3 is a combination of two or more dummy conductor patterns 34a and 34b arranged so as to be separated in the vertical direction and overlapped in the vertical direction. The dummy conductor patterns 34a and 34b are separated from each other. The dummy conductor patterns 34a and 34b are not connected to each other by dummy conductor vias.

(Action / Effect)
Also in the present embodiment, the pressure can be transmitted to the conductor pattern 8 by the rigidity provided by the two or more dummy conductor patterns arranged so as to be separated in the vertical direction and overlapped in the vertical direction. 1 can be obtained. However, the degree of effect is not necessarily the same as in the first embodiment.

  In the present embodiment, since the dummy structure 3 can be produced without including any dummy conductor vias, a process for forming a dummy conductor via for the dummy structure 3 is not required.

  In the example illustrated in FIG. 16, the dummy structure 3 includes two dummy conductor patterns, but is not limited to two and may be three or more. For example, in the resin multilayer substrate 122 shown in FIG. 17, the dummy structure 3 includes three dummy conductor patterns 34a, 34b, and 34c arranged in the thickness direction. The dummy conductor patterns 34a, 34b, 34c are arranged in the thickness direction in a state of being separated from each other. Thus, when the number of dummy conductor patterns included in the dummy structure 3 increases, there is a demerit that the dimension in the thickness direction occupied by the dummy structure 3 increases, but the rigidity of the dummy structure 3 itself can be increased. It can be expected that the pressure applied to the conductor pattern pair 8 is increased.

  In addition, although it applies to all the embodiments so far, when there is a difference in the size of the conductor patterns 8a and 8b constituting the conductor pattern pair 8, the conductor pattern 8a and 8b having a smaller size is used. It is preferable that the dummy structure 3 is arranged on the existing side. For example, as shown in FIG. 18, the conductor pattern pair 8 includes a conductor pattern 8a on the lower side and a conductor pattern 8b on the upper side. The conductor pattern 8a on the lower side is more than the conductor pattern 8b on the upper side. In the case of being small, the dummy structure 3 is preferably arranged below the conductor pattern pair 8.

  On the contrary, as shown in FIG. 19, when the conductor pattern 8b on the upper side is smaller than the conductor pattern 8a on the lower side, the dummy structure 3 is preferably arranged on the upper side of the conductor pattern pair 8. .

  This is because such a configuration is advantageous in reducing the distance between the conductor pattern pair 8 due to an increase in pressure by the dummy structure 3.

  18 and 19, most of the boundary lines between the resin layers 2 are omitted for convenience of explanation.

  The conductor pattern pair 8 is preferably for forming a capacitor. This is because, by adopting this configuration, the capacitance of the capacitor can be increased by shortening the distance between the conductor patterns forming the capacitor.

(Embodiment 5)
(Constitution)
With reference to FIGS. 20-22, the resin multilayer substrate in Embodiment 5 based on this invention is demonstrated. A cross-sectional view of the resin multilayer substrate in the present embodiment is shown in FIG.

  The resin multilayer substrate in the present embodiment includes a conductor pattern pair 8. The conductor pattern pair 8 includes a combination of a wiring 8c and a shield conductor 8d arranged in parallel to the wiring 8c. The dummy structure 3 is arranged below the conductor pattern pair 8. The dummy structure 3 provided in the resin multilayer substrate in the present embodiment includes a first dummy conductor pattern 31 having a long shape and a plurality of dummy conductor vias 36 connected to the lower surface thereof.

  FIG. 21 shows a perspective view of the wiring 8c and the shield conductor 8d when the resin multilayer substrate in the present embodiment is viewed from the upper side in FIG. A perspective view of the resin multilayer substrate in the present embodiment is shown in FIG. Each of the wiring 8c and the shield conductor 8d has a longitudinal shape. The width of the shield conductor 8d is larger than the width of the wiring 8c.

  The shield conductor 8d may be a ground conductor. In that case, a microstrip line is constituted by the wiring 8c and the shield conductor 8d.

(Action / Effect)
In the present embodiment, since the dummy structure 3 is provided, the conductor pattern pair 8 is pressed when the laminated body is crimped. As a result, the wiring 8c and the shield conductor 8d which are conductor patterns constituting the conductor pattern pair 8 are pressed. The distance between is reduced. In the present embodiment, since the wiring 8c is arranged close to the shield conductor 8d, the shielding effect can be enhanced.

  Further, when the shield conductor 8d is a ground conductor, a microstrip line having a low characteristic impedance can be obtained.

  In the present embodiment, the first dummy conductor pattern 31 has been described as an integral object, but the first dummy conductor pattern 31 may be divided into a plurality of pieces.

(Embodiment 6)
(Constitution)
With reference to FIGS. 23-25, the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention is demonstrated. FIG. 23 shows a flowchart of the method for manufacturing the resin multilayer substrate in the present embodiment. This flowchart shows only the main steps, and in fact, other steps can be performed before and after this.

  Below, the manufacturing method of the resin multilayer substrate in this Embodiment is demonstrated in detail. Here, although it demonstrates on the assumption that a conductor pattern is formed with copper foil, you may form a conductor pattern other than copper foil. The manufacturing method described here is merely an example. Here, the case where the left half of the resin multilayer substrate 101 shown in FIG.

  First, a resin sheet with copper foil is prepared. The resin sheet is made of a thermoplastic resin. As a thermoplastic resin here, a liquid crystal polymer, thermoplastic polyimide, etc. can be used, for example. A resist pattern is formed on the resin sheet with copper foil by printing. Unnecessary portions of the copper foil are removed by etching with acid or the like. Thus, a conductor pattern made of copper foil is formed. The dummy conductor pattern to be included in the dummy structure 3, the conductor pattern to be included in the conductor pattern pair 8, and the conductor patterns of other roles can be produced by the same method.

  The resist pattern is stripped with an alkaline solution, and then neutralized. As the alkaline solution here, for example, NaOH can be used. A hole used as a conductor via is formed by irradiating the resin sheet subjected to the processing so far with laser light from the surface on which the copper foil is not attached. This hole does not penetrate through the copper foil, and is formed so as to penetrate only the resin portion. Fill the via hole with a conductive paste. Stack what has been processed so far. FIG. 24 conceptually shows the state immediately before stacking. Here, a total of 7 layers are to be stacked, but this is only an example, and the number of layers to be stacked is not limited to this. In the example shown in FIG. 24, a first dummy conductor pattern 31 and a dummy conductor via 36 are formed in the second resin layer 2 from the top. The first dummy conductor pattern 31 and the dummy conductor via 36 formed in the resin layer 2 constitute the dummy structure 3. A conductor pattern 8b is formed on the lower surface of the third resin layer 2 from the top, and a conductor pattern 8a is formed on the lower surface of the fourth resin layer 2 from the top. The arrangement of each element shown here is merely an example.

  The method for producing a resin multilayer substrate in the present embodiment is a step of stacking a plurality of resin layers including two or more resin layers on which conductor patterns are formed, and at least two conductor patterns are formed of the plurality of resin layers. Including a conductor pattern pair in a positional relationship overlapping in the vertical direction across at least one of them, and the dummy structure close to the upper side, the lower side, or the upper side and the lower side of the conductor pattern pair A step S1 of stacking a plurality of resin layers and a step S2 of obtaining a laminate by pressing the plurality of resin layers in the stacking direction and reducing the distance between the conductor pattern pairs. In step S1, provisional pressurization prior to the main pressurization performed in step S2 may be performed. By performing step S1, the resin layers 2 prepared separately as shown in FIG. 24 are overlapped to be as shown in FIG. However, the laminated body at this time is not yet integrated. In the example shown in FIG. 25, several conductor patterns are sandwiched between the stacked resin layers 2. In the portion where the conductor pattern is sandwiched, the peripheral resin layer 2 is deformed due to the thickness of the conductor pattern. In particular, on the uppermost surface, regions corresponding to the conductor pattern pair 8 and the dummy structure 3 are raised. Here, by pressing the plurality of stacked resin layers 2 in the stacking direction while heating, a stacked body is obtained, and step S <b> 2 for shortening the distance between the conductor pattern pair 8 is performed. As a result of this pressurization, a portion of the stacked resin layer 2 located within the projection region of the conductor pattern pair 8 and the dummy structure 3 is greatly compressed as compared with other regions. More specifically, due to the rigidity of the dummy structure, when the pressure is applied while heating, the portion of the conductor pattern 8 and the portion of the dummy structure 3 that are located within the projection region of the dummy structure 3 is pushed away to the surroundings, The portion located in the projection area is greatly compressed compared to the portion located in the other area. Thus, the distance between the conductor pattern pair 8 is also shortened. As a result, a state like the left half of the resin multilayer substrate 101 shown in FIG. 1 is obtained.

(Action / Effect)
According to the method for manufacturing a resin multilayer substrate in the present embodiment, it is possible to easily obtain a resin multilayer substrate in which the gap between conductor patterns is desired to be shortened in the multilayer body, and the gap is shortened. it can.

  In the method for manufacturing a resin multilayer substrate in the present embodiment, the dummy structure 3 is preferably a combination of a first dummy conductor pattern 31 and a dummy conductor via 36 connected to the first dummy conductor pattern 31. . By adopting this method, the shape of the dummy structure 3 can be made three-dimensional and the rigidity of the dummy structure 3 itself can be increased.

  In the method for manufacturing the resin multilayer substrate in the present embodiment, the dummy structure 3 is different from the first dummy conductor pattern 31 and at least partially overlaps the first dummy conductor pattern 31 as shown in FIG. It is preferable that the dummy conductor via 36 includes the second dummy conductor pattern 32 in a positional relationship and connects the first dummy conductor pattern 31 and the second dummy conductor pattern 32. By adopting this method, the rigidity of the dummy structure 3 itself can be further increased.

  In the method for manufacturing the resin multilayer substrate in the present embodiment, as shown in FIG. 16, the dummy structure 3 includes two or more dummy conductor patterns 34a, which are arranged so as to be separated in the vertical direction and overlapped in the vertical direction. The combination of 34b may be sufficient. By adopting this method, a process for forming a conductor via for the dummy structure 3 is not required, so that the dummy structure 3 can be easily manufactured.

  In the method for manufacturing a resin multilayer substrate in the present embodiment, the dummy structure 3 is positioned so as to cover the projection region of the conductor pattern pair 8 as viewed in plan, as shown in FIG. Is preferred. By adopting this method, the dummy structure 3 can more reliably apply pressure to the conductor pattern pair 8.

  In the above embodiments, built-in components and surface-mounted components are not shown, but the resin multilayer substrate may appropriately include built-in components and surface-mounted components.

  In each of the above embodiments, only one conductor pattern pair 8 has been shown, but a plurality of conductor pattern pairs may be arranged in one resin multilayer substrate. In that case, another conductor pattern pair may be arranged in the projection region in the thickness direction of one conductor pattern pair.

  In each of the above-described embodiments, an example in which only one conductor pattern pair exists for one dummy structure 3 has been shown, but it is not necessarily 1: 1 correspondence. A plurality of conductor pattern pairs may be arranged for one dummy structure. A plurality of dummy structures may be arranged for one conductor pattern pair.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and includes all modifications within the scope and meaning equivalent to the terms of the claims.

  2 resin layer, 3 dummy structure, 6 conductor via, 7 conductor pattern, 8 conductor pattern pair, 8a, 8b conductor pattern, 8c wiring, 8d shield conductor, 31 1st dummy conductor pattern, 32 2nd dummy conductor pattern, 33 1st 3 dummy conductor patterns, 34a, 34b, 34c dummy conductor patterns, 36 dummy conductor vias, 101, 102, 103, 111, 112, 113, 121, 122 resin multilayer substrate.

Claims (13)

A laminate formed by stacking a plurality of resin layers mainly composed of a thermoplastic resin and being pressed in the laminating direction;
A plurality of conductor patterns arranged inside the laminate,
Two of the plurality of conductor patterns form a first conductor pattern pair in a positional relationship overlapping in the vertical direction across at least one of the plurality of resin layers,
Among the plurality of conductor patterns, two conductor patterns different from the conductor pattern forming the first conductor pattern pair are provided at positions that do not overlap with each other in the vertical direction. The two conductor patterns form a second conductor pattern pair in a positional relationship overlapping in the vertical direction across at least one of the plurality of resin layers,
The first conductor pattern pair and the second conductor pattern pair are arranged across the same resin layer,
Inside the laminate, a dummy structure including a metal is disposed so as to be close to the upper side, the lower side, or the upper side and the lower side of the first conductor pattern pair,
The first of the same resin layer thickness at a site flanked by partially between the conductor pattern pairs, the same resin layer at a site flanked by partially between said second conductor pattern pairs Resin multilayer substrate that is smaller than the thickness of   The resin multilayer substrate according to claim 1, wherein the dummy structure is a combination of a first dummy conductor pattern and a dummy conductor via connected to the first dummy conductor pattern.   The resin multilayer substrate according to claim 2, wherein the dummy conductor via is connected to a surface of the first dummy conductor pattern opposite to the first conductor pattern pair.   The dummy structure includes a second dummy conductor pattern that is different from the first dummy conductor pattern and has a positional relationship that at least partially overlaps the first dummy conductor pattern. The resin multilayer substrate according to claim 2 or 3, wherein a conductor pattern and the second dummy conductor pattern are connected.   2. The resin multilayer substrate according to claim 1, wherein the dummy structure is a combination of two or more dummy conductor patterns arranged so as to be separated in the vertical direction and overlapped in the vertical direction.   6. The resin multilayer substrate according to claim 1, wherein the dummy structure is positioned so as to cover a projection region of the first conductor pattern pair in a plan view.   The resin multilayer substrate according to claim 1, wherein the first conductor pattern pair is for forming a capacitor.   The resin multilayer substrate according to claim 1, wherein the first conductor pattern pair includes a combination of a wiring and a shield conductor arranged in parallel to the wiring. A position in which a plurality of resin layers including two or more resin layers on which a conductor pattern is formed are stacked, and at least two conductor patterns overlap in the vertical direction across at least one of the plurality of resin layers The first conductor pattern pair in the relationship and at least two conductor patterns , the two conductor patterns provided at positions where the first conductor pattern pair does not overlap with each other in the vertical direction are formed of the plurality of resin layers. A dummy conductor structure including a step of forming a second conductive pattern pair having a positional relationship overlapping vertically with at least one of them sandwiched between the same resin layers, Stacking the plurality of resin layers so as to be close to the upper side, the lower side, or the upper side and the lower side of the conductor pattern pair of
A step of pressing the plurality of resin layers in the stacking direction to obtain a stacked body, and shortening the distance between the first conductor pattern pair than the distance between the second conductor pattern pair; A method for producing a resin multilayer substrate.   The method for manufacturing a resin multilayer substrate according to claim 9, wherein the dummy structure is a combination of a first dummy conductor pattern and a dummy conductor via connected to the first dummy conductor pattern.   The dummy structure includes a second dummy conductor pattern that is different from the first dummy conductor pattern and has a positional relationship that at least partially overlaps the first dummy conductor pattern, and the dummy conductor vias are the first dummy conductor patterns. The manufacturing method of the resin multilayer substrate of Claim 10 which has connected the conductor pattern and the said 2nd dummy conductor pattern.   The method for manufacturing a resin multilayer substrate according to claim 9, wherein the dummy structure is a combination of two or more dummy conductor patterns arranged so as to be separated in the vertical direction and overlapped in the vertical direction.   The method for manufacturing a resin multilayer substrate according to claim 9, wherein the dummy structure is positioned so as to cover a projection region of the first conductor pattern pair in a plan view.

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