JP6310379B2 - Substrate manufacturing method and substrate manufacturing apparatus - Google Patents

Description

  The present invention relates to a substrate manufacturing method and a substrate manufacturing apparatus.

  There is known a method for manufacturing a semiconductor device, which includes a step of fixing a film substrate to a support and a step of peeling the film substrate from the support (for example, see Patent Document 1). In this method of manufacturing a semiconductor device, a semiconductor device is produced on a film substrate in a state where the film substrate is fixed on a support, and then the film substrate is peeled off from the support so as to be formed on the film substrate. A semiconductor device is manufactured.

JP 2006-237542 A

  In the manufacturing method of the semiconductor device described above, when the film base material is peeled from the support through the heating and cooling processes in the manufacturing process of the semiconductor device, the film base material is contracted and deformed. There is a problem that the dimensional accuracy of the material is lowered.

  The problem to be solved by the present invention is to provide a substrate manufacturing method and a substrate manufacturing apparatus with high dimensional accuracy.

  [1] A substrate manufacturing method according to the present invention is a first method for detecting a difference between a first shape and a second shape of a thermoplastic substrate that is relatively small with respect to the first shape. A step, a second step of heating the substrate while applying a tensile force to at least a part of the outer peripheral edge of the substrate, and a third step of releasing the tensile force applied to the substrate. And the second step includes elastically stretching the substrate so as to be at least a third shape larger than the first shape based on at least the difference.

  [2] In the above invention, the second step includes heating the substrate within a predetermined temperature range, and the predetermined temperature range is set based on a glass transition temperature of a material constituting the substrate. May be.

  [3] In the above invention, the glass transition temperature may be 40 ° C. or higher and 200 ° C. or lower.

  [4] In the above invention, the second step may include applying a greater tensile force as the difference becomes larger.

  [5] In the above invention, the third shape may be relatively larger than the first shape.

  [6] In the above invention, the substrate manufacturing method may include a fourth step of forming or mounting an electronic component on the substrate before the first step.

  [7] The substrate manufacturing apparatus according to the present invention includes a detecting means for detecting a difference between the first shape and the second shape of the thermoplastic substrate relatively small with respect to the first shape, A tension applying means for applying a tensile force to at least a part of the outer peripheral edge of the substrate; and a heating means for heating the substrate, wherein the tension applying means is based on at least the difference and at least a first The substrate is elastically stretched so as to have a third shape larger than the shape.

  According to the present invention, the difference between the first shape as a reference and the second shape of the substrate that is relatively small with respect to the first shape is detected, and the tensile force is determined based on at least the difference. The substrate is elastically stretched by application, and the substrate is heated in a state where a tensile force is applied, thereby relaxing the stress accumulated during tension. As a result, a substrate with high dimensional accuracy can be obtained.

FIG. 1 is a plan view showing a schematic configuration of a substrate manufacturing apparatus in the present embodiment. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is a perspective plan view showing a range that can be observed by a microscope when the observation unit in the present embodiment is arranged on a circuit board. FIG. 4 is a plan view showing a schematic configuration of the reference workpiece in the present embodiment. FIG. 5 is a plan view showing a state in which the circuit board is held by the tensioner in the present embodiment. FIG. 6 is a diagram showing the circuit board before and after the deformation in the present embodiment, FIG. 6A is a plan view showing the circuit board before the deformation, and FIG. 6B is a circuit after the deformation. It is a top view which shows a board | substrate. FIG. 7 is a process diagram showing a circuit board manufacturing method according to this embodiment. FIG. 8A to FIG. 8C are diagrams showing steps S12 to S14 of FIG. 8, respectively. FIG. 9 is a diagram illustrating the configuration of the circuit board for explaining step S14. FIG. 9A is a plan view for explaining a method for aligning the circuit board and the reference workpiece, and FIG. It is a top view explaining the method to detect a difference. 10 (a) and 10 (b) are diagrams showing step S15 of FIG. 7, FIG. 10 (c) is a diagram showing step S16 of FIG. 7, and FIG. 10 (d) is a diagram of FIG. 7 is a diagram showing step S17 in FIG. 7, and FIG. 10E is a diagram showing step S18 in FIG. 11 is a diagram showing a circuit board, FIG. 11 (a) is a plan view showing a state after applying a tensile force to the insulating substrate based on the difference, and FIG. 11 (b) is a diagram showing the difference. FIG. 11C is a plan view showing a state after applying a tensile force to the insulating substrate based on the offset amount, and FIG. 11C is a plan view showing a state in which the tensile force is released from the insulating substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 is a plan view showing a schematic configuration of a substrate manufacturing apparatus according to the present embodiment, FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1, and FIG. 3 is an observation unit according to the present embodiment arranged on a circuit board. FIG. 4 is a plan view showing a schematic configuration of the reference workpiece in the present embodiment, and FIG. 5 is a plan view showing a state in which the circuit board is held by the tensioner in the present embodiment. It is.

  The board manufacturing apparatus 1 in the present embodiment is an apparatus that corrects a deformed circuit board 100 into a predetermined shape. As shown in FIGS. 1 and 2, the substrate manufacturing apparatus 1 includes an observation unit 10, a reference work unit 20, a tensioner 30, a heating stage 40, an alignment stage 50, and a housing 60. .

  The observation unit 10 includes a support unit 11, a guide 14, and a microscope 15. The support portion 11 is bridged on both side portions 602 of the housing 60 and has a traveling portion 12 and an opening 13. The housing 60 has a bottom portion 601 and a pair of side portions 602 provided at both ends of the bottom portion 601, respectively, and as a whole, a substantially U-shaped cross-sectional shape with the top opened. have. A rail 61 is provided on each side portion 602, and the rail 61 extends along the Y direction.

  The traveling unit 12 is provided at both ends of the support unit 11 and is slidably engaged with the rail 61. The traveling unit 12 slides along the extending direction of the rail 61 (Y direction in the figure), so that the observation unit 10 can move.

  By moving the observation unit 10 above the circuit board 100, the circuit board 100 can be observed with the microscope 15. On the other hand, the circuit board 100 can be detached from the tensioner 30 by retracting the observation unit 10 from above the circuit board 100. A plurality of (four in the present embodiment) openings 13 are formed in the vicinity of the approximate center of the support portion 11 and penetrate the support portion 11 along the Z direction.

  In the observation unit 10 in the present embodiment, four microscopes 15 are provided so as to face downward. The four microscopes 15 are attached to corresponding four guides 14. The four guides 14 are respectively disposed in the corresponding openings 13. Each guide 14 has, for example, an X direction moving mechanism and a Y direction moving mechanism. As a specific example of the X direction moving mechanism and the Y direction moving mechanism, for example, a mechanism having a feed screw mechanism can be exemplified. Each guide 14 is provided with a stage for attaching the microscope 15. The microscope 15 can be moved in the X direction and the Y direction by moving this stage by the above-described X direction moving mechanism and Y direction moving mechanism. Further, the four microscopes 15 are provided on the guides 14 corresponding to the four microscopes 15 so that they can move independently of each other. Furthermore, the microscope 15 has a function of moving up and down along the Z direction, and can adjust the focal length according to the object to be observed.

  As shown in FIG. 3, the four microscopes 15 can observe the circuit board 100 from above in a non-overlapping range (shaded area in the drawing) in plan view. The four microscopes 15 can visually recognize the circuit board 100 through an opening 232 (described later) of the reference work holding unit 23, so that almost the entire plane of the circuit board 100 can be observed in the opening 232. It has become. Further, a CCD camera (not shown) is attached to the microscope 15, and each portion can be observed at the same time by projecting the captured signal on a monitor. In the present embodiment, four openings 13, guides 14, and microscopes 15 are provided, but the number is not particularly limited as long as the plane of the circuit board 100 can be observed. The “microscope 15” in the present embodiment corresponds to an example of “detection means” in the present invention.

  The reference work unit 20 is a unit for mounting the reference work 21 on the substrate manufacturing apparatus 1 as shown in FIGS. The reference work unit 20 includes a reference work 21, a glass holder 22, and a reference work holding unit 23.

  The reference workpiece 21 is an alignment member used as an alignment reference when correcting the deformed circuit board 100 into a predetermined shape. For example, a metal film such as chromium (Cr) is formed on glass. In this embodiment, as shown in FIG. 4, it has a rectangular flat plate shape. The reference workpiece 21 is formed with an alignment mark 211 at a predetermined position. The alignment mark 211 is formed, for example, by patterning a metal film by photolithography. In the present embodiment, the alignment mark 211 is disposed at a position corresponding to a reference shape 111 (described later) before deformation of the insulating substrate 110 (described later).

  As shown in FIGS. 1 and 2, the glass holder 22 is made of a transparent material. The glass holder 22 has a vacuum suction hole 221 formed therein. The vacuum suction hole 221 is connected to one end of a vacuum suction hole 234 (described later) formed in the glass holder holding portion 233 at one end.

  The reference work holding part 23 is fixed to both side parts 602 of the housing 60 by, for example, fixing screws 231 and can be attached and detached. The reference work holding part 23 has an annular shape with an opening 232 formed in the center thereof. The opening 232 has substantially the same size as a region of the circuit board 100 where the electronic component 120 can be formed. Above the opening 232, the above-described microscope 15 can be arranged.

  Further, a glass holder holding part 233 is provided below the reference work holding part 23. The glass holder holding portion 233 is formed along the outer peripheral edge portion of the opening 232 of the reference workpiece holding portion 23. A vacuum suction hole 234 is formed in the glass holder holding part 233 so as to face the vacuum suction hole 221 described above. The vacuum suction hole 234 is connected to the vacuum pump 235 at the end opposite to the side connected to the vacuum suction hole 221. By driving the vacuum pump 235, the reference workpiece 21 can be sucked and fixed onto the glass holder 22 through the vacuum suction holes 221 and 234.

  As shown in FIG. 2, the tensioner 30 is provided in the housing 60 and includes an actuator 31 and a grip clip 32. A plurality of tensioners 30 are provided along the outer peripheral edge of a moving stage 51 (described later) of the alignment stage 50. In the present embodiment, as shown in FIG. 5, five tensioners 30 are arranged independently with respect to the circuit board 100 in the longitudinal direction and four tensioners 30 in the lateral direction. The plurality of tensioners 30 can be individually operated, and a tensile force can be independently applied to the circuit board 100. Further, the tensioner 30 can move along the arrangement direction of the plurality of tensioners 30 for each side. In addition, it is preferable that the tensioners 30 adjacent to each other are arranged at a pitch (center distance) of 20 to 150 [mm], and more preferably 100 [mm] or less.

  The actuator 31 can be exemplified by a motor-driven linear actuator or the like. The actuator 31 is provided with an arm portion 311 extending along the X direction or the Y direction. The arm portion 311 is connected to the above-described linear actuator, and thereby can advance and retract along the X direction or the Y direction. The circuit board 100 can be extended by retracting the arm portion 311 in a direction away from the circuit board 100 in a state where the circuit board 100 and the tensioner 30 are connected.

  The maximum tension Tmax of the actuator 31 is preferably 10 to 500 [N] for each tensioner 30, and more preferably 100 [N] to 200 [N]. The moving resolution of the actuator 31 is preferably 10 [μm] or less, and more preferably 1 [μm] or less. This is because deformation that occurs in the insulating substrate 110 (described later) is often several hundreds [μm].

  The grip clip 32 is provided at the tip of the arm portion 311 of the actuator 31. The grip clip 32 can grip the circuit board 100 by bringing the distance between the claw parts 321 closer to each other with the circuit board 100 interposed between the pair of claw parts 321. As such a gripping mechanism of the gripping clip 32, a mechanism using a pressure of compressed air, a spring, or a screw can be exemplified. In the present embodiment, the pair of claw portions 321 are close to each other, but the present invention is not particularly limited thereto. For example, one claw portion 321 is fixed and the other claw portion 321 is relatively close to each other. The circuit board 100 may be gripped. The “tensioner 30” in the present embodiment corresponds to an example of the “tension applying unit” in the present invention.

  The heating stage 40 is provided in the housing 60 and is placed on the moving stage 51 of the alignment stage 50. The circuit board 100 can be placed on the upper surface of the heating stage 40, whereby the circuit board 100 can be heated by the heating stage 40. Inside the heating stage 40, for example, a heating element such as a heater, an oven mechanism, or an infrared heating mechanism is accommodated. The “heating stage 40” in the present embodiment corresponds to an example of the “heating means” in the present invention.

  The alignment stage 50 is provided in the housing 60 and includes a moving stage 51 and a moving mechanism 52. On the moving stage 51, the tensioner 30 and the heating stage 40 are provided as described above. The moving mechanism 52 has an X direction moving mechanism, a Y direction moving mechanism, a rotating mechanism, and a height moving mechanism. Examples of the X direction moving mechanism, the Y direction moving mechanism, and the height moving mechanism include those having a feed screw mechanism. As a rotation mechanism, what is comprised from the rotating plate and the rotating shaft provided in the approximate center of the rotating plate can be illustrated, for example. A moving stage 51 is provided on the moving mechanism 52. The configuration of the moving mechanism 52 is not particularly limited to the above.

  The circuit board 100 can be attached to the tensioner 30 provided on the moving stage 51. On the other hand, the reference work 21 is fixed to the reference work unit 20 attached to the housing 60. Then, the circuit board 100 on the moving stage 51 is moved relative to the reference workpiece 21 by the moving mechanism 52. Thereby, the circuit board 100 and the reference | standard workpiece | work 21 can be aligned.

  Next, the structure of the circuit board 100 corrected by the board manufacturing apparatus 1 described above will be described.

  6A and 6B are diagrams showing the circuit board before and after the deformation in the present embodiment. FIG. 6A is a plan view showing the circuit board before the deformation, and FIG. 6B is a plan view showing the circuit board after the deformation. It is.

  The circuit board 100 is a so-called flexible printed wiring board (FPC), and includes an insulating substrate 110 and an electronic component 120 as shown in FIGS. 6 (a) and 6 (b).

  The insulating substrate 110 has a rectangular flat plate shape in a reference shape 111 (described later) before deformation. The material constituting the insulating substrate 110 may be any material having electrical insulation and thermoplasticity, but more preferably has transparency and a low heat shrinkage rate. Examples of the material constituting the insulating substrate 110 include polystyrene, ABS resin, vinyl chloride resin, methyl methacrylate resin, nylon, fluororesin, polycarbonate, polyethylene terephthalate (PET), and polyethylene naphthalate (polyethylene naphthalate). , PEN) and the like. The shape of the circuit board 100 is not particularly limited to the above. The “insulating substrate 110” in the present embodiment corresponds to an example of “thermoplastic substrate” in the present invention.

  An alignment mark 114 is formed on the surface of the insulating substrate 110. This alignment mark 114 is arranged so as to correspond to a reference shape 111 (described later) of the insulating substrate 110 before deformation. Further, each of the alignment marks 114 corresponds to each of the alignment marks 211 of the reference workpiece 21 described above. The thickness of the insulating substrate 110 is not particularly limited, but is preferably 10 [μm] to 200 [μm], and more preferably 30 [μm] to 150 [μm].

  The electronic component 120 can be exemplified by an organic transistor such as a thin film transistor (TFT). As such a thin film transistor, a gate electrode, a gate insulating layer, a semiconductor layer, and a source electrode are formed on an insulating substrate 110. The drain electrode can be formed by sequentially forming the drain electrode by a printing method. Although not particularly shown, a wiring pattern may be formed on the insulating substrate 110. For example, the electronic components 120 may be connected to each other by this wiring pattern.

  In this embodiment, the electronic component 120 is formed by a printing method, and in this printing process, the circuit board 100 is heated at a temperature exceeding 150 [° C.] and then cooled to near room temperature. The insulating substrate 110 is deformed. For this reason, the insulating substrate 110 in this embodiment has the reference shape 111 before deformation (see FIG. 6A), but is deformed into the contracted shape 112 in the process of forming the electronic component 120 as described above. (See FIG. 6 (b)).

  Note that the “reference shape 111” in the present embodiment is the shape of the insulating substrate 110 before deformation, and corresponds to an example of the “first shape” in the present invention, and the “contracted shape 112” in the present embodiment is The shape of the insulating substrate 110 after deformation corresponds to an example of the “second shape” in the present invention.

  In this embodiment, since the electronic component 120 is already formed on the insulating substrate 110, the temperature at which the electronic component 120 is not thermally affected when the circuit board 100 is heated by the heating stage 40. It is necessary to heat in the range. For this reason, the glass transition temperature Tg of the material constituting the insulating substrate 110 is preferably 40 [° C.] or higher and 200 [° C.] or lower, and more preferably 70 [° C.] or higher and 160 [° C.] or lower. . The relationship between the temperature range for heating the circuit board 100 by the heating stage 40 and the glass transition temperature Tg of the material constituting the insulating substrate 110 will be described in detail later.

  In the present embodiment, the electronic component 120 is formed by a printing method, but is not particularly limited thereto. For example, the electronic component may be mounted on the insulating substrate by printing the solder paste on the insulating substrate by a screen printing method, placing the electronic component on the solder paste, and then performing reflow. In the reflow process, by heating the circuit board on which the electronic component is placed, the solder is melted and the electronic component is mounted on the insulating substrate. However, the insulating substrate may be deformed due to heat shrinkage or the like. is there.

  Next, a method for manufacturing the circuit board 100 according to this embodiment, that is, a method for correcting the shape of the insulating substrate 110 will be described.

  FIG. 7 is a process diagram showing a circuit board manufacturing method according to the present embodiment.

  As shown in FIG. 7, the substrate manufacturing method in this embodiment includes a mark forming process (step S10), an electronic component forming process (step S11), a circuit board attaching process (step S12), and a reference work unit. An attachment process (step S13), a detection process (step S14), an extension process (step S15), a heating process (step S16), a cooling process (step S17), and a release process (step S18) are provided. . In the following description, the electronic component 120 is omitted in the drawings.

  The “detection step (step S14)” in the present embodiment corresponds to an example of the “first step” of the present invention, and the “extension step (step S15)” and the “heating step (step S16)” in the present embodiment. The “second process” of the present invention corresponds to an example, and the “release process (step S18)” in the present embodiment corresponds to an example of the “third process” of the present invention. The “forming step (step S11)” corresponds to an example of the “fourth step” in the present invention.

In the present embodiment, for example, using the method disclosed in Patent Document 1, the alignment mark 114 is formed on the insulating substrate 110 in step S10, and the electronic component is formed on the insulating substrate 110 in step S11. . In step S10, first, an adhesive layer (not shown) is formed on a support (not shown) using a printing method such as screen printing, and then the insulating substrate 110 is bonded with a laminator. Then, with the circuit board 100 adhered to the support, the alignment mark 114 is formed on the surface of the insulating substrate 110 using a printing method such as reverse printing, gravure offset printing, flexographic printing, or screen printing. The method of forming the alignment mark 114 is not particularly limited to the above, and for example, a laser marking method using a CO ₂ laser, an excimer laser, or the like may be used.

  In step S <b> 11, the electronic component 120 is formed on the insulating substrate 110. In this embodiment, a thin film transistor is formed as the electronic component 120. This thin film transistor uses a printing method such as relief printing, intaglio printing, planographic printing, reversal printing, inkjet, thermal transfer printing, dispenser, and the like on a gate electrode, a gate insulating layer, a semiconductor layer, a source electrode, and a drain electrode on an insulating substrate 110. Are sequentially formed. Note that step S10 and step S11 described above may be performed simultaneously. Although not particularly limited, for example, printing is performed using a plate cylinder or a screen having a pattern corresponding to the alignment mark 114 and a pattern corresponding to the electronic component 120, so that these patterns are simultaneously formed on the insulating substrate 100. It is formed.

  FIG. 8A to FIG. 8C are diagrams showing steps S12 to S14 of FIG. 8, respectively.

  In step S12, first, the circuit board 100 is peeled from the support. At this time, the shape of the insulating substrate 110 is deformed from the reference shape 111 to the contracted shape 112. The contracted shape 112 is relatively small with respect to the reference shape 111 because it is deformed by thermal contraction or the like. Note that the step of forming the alignment mark 114 described in step S <b> 10 (mark formation step) is performed before the circuit board 100 is peeled from the support, so that the deformation of the insulating substrate 110 is brought to the position of the alignment mark 114. Reflected. As described above, in the present embodiment, the alignment mark 114 moves in accordance with the deformation of the insulating substrate 110 into the contracted shape 112 in the deformed state.

  Next, as shown in FIG. 8A, the circuit board 100 is placed on the upper surface of the heating stage 40. Next, the circuit board 100 is attached to the tensioner 30. Specifically, the outer peripheral edge of the insulating substrate 110 is gripped by the grip clip 32, and the circuit board 100 and the actuator 31 are connected.

  In step S13, the reference work unit 20 is attached to the housing 60 as shown in FIG. First, the reference work 21 is fixed to the reference work holding part 23 by vacuum suction. Next, the reference work holding part 23 is attached to the side part 602 of the housing 60 with the fixing screw 231. The circuit board 100 is placed on the heating stage 40, whereby the reference workpiece 21 and the circuit board 100 face each other.

  FIG. 9 is a diagram showing the configuration of the circuit board for explaining step S14. FIG. 9A is a plan view for explaining a method of aligning the circuit board and the reference work, and FIG. 9B detects the difference. It is a top view explaining a method.

  In step S14, as shown in FIG. 8C, first, the observation unit 10 is moved above the heating stage 40. Next, while observing with the microscope 15 the position of the alignment mark 211 formed on the reference workpiece 21 and the position of the alignment mark 114 formed on the insulating substrate 110, Adjust the position.

  In adjusting the position of the reference workpiece 21 and the position of the circuit board 100, the focal length is adjusted by moving the height of the circuit board 100 up and down by the moving mechanism 52, and the alignment marks 211 and 114 are positioned on the microscope 15. So that it can be observed more accurately. The position of the reference workpiece 21 and the position of the circuit board 100 are adjusted by moving the circuit board 100 by the moving mechanism 52. Since the microscope 15 has a function of moving up and down along the Z direction, the focal length is adjusted by adjusting the height of the microscope 15 and the height of the circuit board 100 using this function. May be.

  In step S13, the position of the reference workpiece 21 and the position of the circuit board 100 are adjusted so that the positional deviation between the alignment marks 211 and 114 is minimized in plan view. Specifically, as shown in FIG. 9A, first, the distance (L1) between any one of the alignment marks 211a and the alignment mark 114a corresponding to the alignment mark 211a. Is measured from the image captured by the microscope 15. Further, the distances (L2 to L10) between the corresponding alignment marks 211 and 114 are measured from the image captured by the microscope 15 in the same manner as described above, except for between the marks 211a and 114a.

  Then, the circuit board 100 is moved relative to the reference workpiece 21 by the alignment stage 50 so that the total of the measured distances (L1 to L10) is minimized, and the position of the reference workpiece 21 and the circuit board 100 are Adjust the position. In addition, the adjustment method of the position of the reference | standard workpiece | work 21 and the position of the circuit board 100 is not specifically limited above, You may employ | adopt a well-known method.

  Next, based on the position of the alignment mark 211 and the position of the alignment mark 114, the difference A1 between the reference shape 111 before the deformation of the insulating substrate 110 and the contracted shape 112 after the deformation. Is detected. Even after the position of the reference workpiece 21 and the position of the circuit board 100 are adjusted, there is a deviation between the position of the alignment mark 211 and the position of the alignment 114 in plan view. This is because the alignment mark 211 is formed corresponding to the reference shape 111 of the insulating substrate 110 before the deformation, whereas the alignment mark 114 is a contracted shape 112 of the insulating substrate 110 after the deformation. This is because it has moved along with the deformation. As described above, the difference A1 is generated by the deformation from the reference shape 111 to the contracted shape 112, and in the present embodiment, the difference A1 is detected.

  In detecting the difference A1 between the reference shape 111 of the insulating substrate 110 before the deformation and the contracted shape 112 of the deformed state, it is detected for each of the alignment marks 211 and 114. Specifically, as shown in FIG. 9B, after the position of the reference workpiece 21 and the position of the circuit board 100 are adjusted, any one of the alignment marks 211a, The distance between the alignment mark 114a corresponding to the alignment mark 211a is measured from the image captured by the microscope 15, and the difference (A10) is detected. Further, in the same manner as described above, the distance between the corresponding alignment marks 211 and 114 is measured from the image picked up by the microscope 15 and the difference (A11 to A19) is detected except for between the marks 211a and 114a.

  In the present embodiment, in step S15 described later, the circuit board 100 is stretched by the tensioner 30 based on the difference A1 detected above, but the tensioner 30 applies a tensile force along the X direction or the Y direction. Accordingly, the difference A1 may be detected by being decomposed into an X component and a Y component.

  10A and 10B show step S15 in FIG. 7, FIG. 10C shows step S16 in FIG. 7, and FIG. 10D shows step S17 in FIG. FIG. 10E is a diagram showing step S18 of FIG. 7, FIG. 11 is a diagram showing the circuit board, and FIG. 11A is a state after applying a tensile force to the insulating substrate based on the difference. FIG. 11 (b) is a plan view showing a state after applying a tensile force to the insulating substrate based on the difference and the offset amount, and FIG. 11 (c) is a drawing of releasing the tensile force from the insulating substrate. It is a top view which shows a state.

  In step S15, a tensile force is applied by the tensioner 30 connected to the outer peripheral edge portion of the insulating substrate 110 to extend the circuit board 100. In this step S15, first, as shown in FIG. 10A, the bending generated in the circuit board 100 is removed. Specifically, in a state where the circuit board 100 and the tensioner 30 are connected, the actuator 31 slightly retracts the arm portion 311 in a direction away from the circuit board 100 and pulls it against the insulating substrate 110. Apply force. At this time, the tensile force applied to the insulating substrate 110 may be about 1 [N] for each connected tensioner 30.

  Next, as shown in FIG. 10B, a tensile force is further applied to the insulating substrate 110 to extend the circuit board 100. Specifically, in a state where the circuit board 100 and the tensioner 30 are connected, the arm unit 311 is moved backward in the direction away from the circuit board 100 by the actuator 31 and the tensioners 30 are arranged. It moves so that the pitch of tensioners 30 which adjoin along the direction spreads.

  In this step S15, the insulating substrate 110 is stretched by the stretch amount A3 (A3 = A1 + A2) and deformed from the contracted shape 112 to the expanded shape 113. First, as shown in FIG. 11A, the insulating substrate 110 is stretched by the difference A1 obtained in step S14 described above, and deformed from the contracted shape 112 to the reference shape 111. Then, as shown in FIG. 11B, the insulating substrate 110 is further expanded by an offset amount A2 (described later), and deformed from the reference shape 111 to the expanded shape 113. In the present embodiment, the tensile force applied to the insulating substrate 110 is increased as the difference A1 increases. Specifically, the difference A10 to the difference A13 in the difference A1 illustrated in FIG. 9B will be described as an example. These values increase in the order of the difference A10, the difference A11, the difference A12, and the difference A13 (A10 < In a state where the insulating substrate 110 is stretched based on the difference A1 shown in A11 <A12 <A13) and FIG. 11A, a tensile force is applied so that the insulating substrate 110 is stretched as the value of the difference A1 increases. Is greatly applied.

  Here, in steps S16 to S18 described later, after the circuit board 100 is heated and cooled (that is, after the insulating board 110 is heated and cooled), the tensile force applied to the insulating board 110 is released. At this time, thermal contraction depending on the linear expansion coefficient of the material constituting the insulating substrate 110 occurs in the insulating substrate 110. This heat shrinkage occurs uniformly along the outer peripheral edge of the insulating substrate 110, and the amount of heat shrinkage can be easily estimated. Therefore, in the present embodiment, the offset amount A2 is set in advance based on the estimated heat shrinkage amount, and in step S15, the extension amount A3 (A3 = A1 + A2), which is the sum of the detected difference A1 and offset amount A2. The insulating substrate 110 is stretched as much as possible, and deformed into a stretched shape 113 that is relatively larger than the reference shape 111. The “extension shape 113” in the present embodiment is the shape of the insulating substrate 110 set based on at least the difference A1 and the offset amount A2, and corresponds to an example of the “third shape” in the present invention.

  In the present embodiment, the enlargement amount A3 is the total value of the difference A1 and the offset amount A2, but is not particularly limited thereto. For example, in addition to the difference A1 and the offset amount A2, the stretching amount A3 may be set in consideration of the heating / cooling method of the circuit board 100, parameters at the time of manufacturing the circuit board 100, and the like. For example, based on the extending direction of the insulating substrate 110 that is a parameter at the time of manufacturing the circuit board 100, a large tensile force is exerted on the insulating substrate 110 at a portion where deformation is estimated to be large after heating and cooling of the circuit board 100. Is applied to increase the stretch amount, and in a portion where deformation is estimated to be small after heating / cooling of the circuit board 100, a small tensile force may be applied to the insulating substrate 110 to reduce the stretch amount. . Examples of the extending direction of the insulating substrate 110 include a direction along the flow direction (Machine Direction, MD) and a direction along the vertical direction (Transverse Direction, TD).

  In this embodiment, in order to prevent damage to the electronic component 120 already formed on the insulating substrate 110, the insulating substrate 110 is stretched within the elastic deformation range. In this case, the stretching amount A3 is preferably set to 1% or less with respect to the outer diameter dimension of the insulating substrate 110. The stretching amount A3 is more preferably set to 0.5% or less with respect to the outer diameter dimension of the insulating substrate 110, and the stretching amount A3 is 0.3% with respect to the outer diameter dimension of the insulating substrate 110. More preferably, it is set at% or less.

  In step S16, as shown in FIG. 10C, within the temperature range set based on the glass transition temperature Tg of the material constituting the insulating substrate 110 in a state where a tensile force is applied to the insulating substrate 110. Then, the circuit board 100 is heated.

  The insulating substrate 110 is deformed from the contracted shape 112 to the extended shape 113 by applying a tensile force. In the conventional case, when the tensile force is released, the insulating substrate 110 returns to the contracted shape 112 in a state before the tensile force is applied due to the stress accumulated during the pulling. On the other hand, in this embodiment, the stress accumulated during the tension is generated by heating the insulating substrate 110 made of a thermoplastic material to the vicinity of the glass transition temperature Tg while applying a tensile force. Alleviated. As a result, even in the state after releasing the tensile force on the insulating substrate 110, the insulating substrate 110 is maintained in the shape of the extended shape 113.

  The temperature range set based on the glass transition temperature Tg of the insulating substrate 110 is preferably a glass transition temperature Tg−20 [° C.] or more and a glass transition temperature Tg + 20 [° C.] or less, and the glass transition temperature A temperature range of Tg−20 [° C.] or higher and a glass transition temperature or lower is more preferable. For example, when polyethylene naphthalate having a glass transition temperature Tg of 155 [° C.] is used, the lower limit value of the temperature range set based on the glass transition temperature Tg is 135 [° C.], and the upper limit value of the temperature range is 155 [C]. In step S16 in the present embodiment, the circuit board 100 is heated to a temperature range set based on the glass transition temperature Tg, and the circuit board 100 is held for 3 minutes while maintaining this temperature range. Heat.

  In step S17, as shown in FIG. 10D, heating to the circuit board 100 is stopped by turning off the heat source of the heating stage 40. For example, the circuit board 100 is brought to near room temperature by a method such as natural cooling. Slowly cool. Note that heating the circuit board 100 may be stopped by separating the circuit board 100 from the heating stage 40.

  In step S18, as shown in FIG. 10E, the tensile force applied to the circuit board 100 cooled to near room temperature is released. At this time, the insulating substrate 110 is heated to near the glass transition temperature Tg, so that the stress accumulated at the time of tension is relaxed, and the contracted shape 112 is in a state before the tensile force is applied. The deformation to return is suppressed. Further, the insulating substrate 110 is deformed by the amount of thermal contraction as shown in FIG. 11C by releasing the tensile force after heating to the glass transition temperature Tg and cooling to near room temperature. The insulating substrate 110 has a stretched shape 113 that is larger than the reference shape 111 by an offset amount A2 set based on the estimated heat shrinkage amount. The amount and the offset amount A2 are offset, and the insulating substrate 110 is deformed from the elongated shape 113 to the substantially reference shape 111.

  Next, the operation of the circuit board 100 manufacturing method and the board manufacturing apparatus 1 according to this embodiment will be described.

  In this embodiment, the difference A1 between the reference shape 111 before the deformation of the insulating substrate 110 and the contracted shape 112 after the deformation is detected, and a tensile force is applied based on at least the difference A1. The insulating substrate 110 is deformed from the contracted shape 112 to the extended shape 113 by elastically extending the circuit board 100. Further, by heating the circuit board 100 in a state where a tensile force is applied, the stress accumulated during the tensioning is relieved, whereby the insulating substrate 110 is deformed when the tensile force is released. Is suppressed. As a result, the circuit board 100 having high dimensional accuracy with respect to the desired shape can be obtained.

  In the present embodiment, the circuit board 100 is heated in a temperature range set based on the glass transition temperature Tg of the material constituting the insulating substrate 110. Thereby, the stress accumulated at the time of tension is more relaxed. As a result, when the tensile force is released, the insulating substrate 110 can be further prevented from being deformed, and the circuit substrate 100 with high dimensional accuracy with respect to the desired shape can be obtained.

  Further, in the present embodiment, the glass transition temperature Tg of the material constituting the insulating substrate 110 is set to 40 [° C.] or more and 200 [° C.] or less so that the formed electronic component 120 is not thermally affected. The circuit board 100 can be heated. Thereby, the quality of the circuit board 100 can be improved.

  Further, in the present embodiment, the insulating substrate 110 is deformed so that the extended shape 113 is set based on the offset amount A2. This offset amount A2 is set based on a value obtained by estimating the amount of heat shrinkage generated in the insulating substrate 110. For this reason, when the thermal contraction occurs in the insulating substrate 110, the thermal contraction amount and the offset amount A <b> 2 are offset, and the insulating substrate 110 is deformed so as to be substantially the reference shape 111. Thereby, the circuit board 100 with higher dimensional accuracy can be obtained.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, in this embodiment, in order to correct the contracted shape 112 of the insulating substrate 110 after the deformation, the insulating substrate 110 is stretched by applying a tensile force, but the invention is not particularly limited thereto. For example, the difference between the shape formed on the reference workpiece and the shape of the base material may be detected, and the base material may be stretched by applying a tensile force based on the difference. Even in such a case, the base material can be deformed to a shape set based on the shape formed on the reference workpiece by individually operating the plurality of tensioners 30 provided in the substrate manufacturing apparatus 1. . Thereby, a circuit board with high dimensional accuracy can be obtained for a desired shape.

  In this embodiment, after the circuit board 100 is stretched (stretching process (step S15)), the circuit board 100 is heated (heating process (step S16)), but the insulating substrate 110 is stretched and insulated. The conductive substrate 110 is not particularly limited as long as the conductive substrate 110 can be heated. That is, after the circuit board 100 is heated, the circuit board 100 may be stretched in a heated state.

  In the present embodiment, after the circuit board 100 is cooled to near room temperature (cooling process (step S17)), the tensile force applied to the circuit board 100 is released (release process (step S18)). However, it is not particularly limited to this. That is, after releasing the tensile force applied to the circuit board 100, the circuit board 100 may be cooled to around room temperature.

  In the present embodiment, the circuit board 100 is gradually cooled to near room temperature by a method such as natural cooling, but is not particularly limited thereto. For example, even if the circuit board 100 is rapidly cooled by providing a cooling means such as a cooling stage in the board manufacturing apparatus 1 and extending and heating the circuit board 100, the circuit board 100 is transferred from the heating stage 40 to the cooling stage. Good. The method for rapidly cooling the circuit board 100 is not particularly limited to the above.

  Moreover, you may provide board | substrate fixing means, such as a vacuum suction mechanism and an adhesive plate, in the heating stage 40 in this embodiment. In this case, after the circuit board 100 is stretched by the tensioner 30 in step S15, the lower surface of the circuit board 100 is fixed and heated by the above-described substrate fixing means, thereby suppressing the bending due to the thermal expansion of the insulating substrate 110. it can. Examples of the vacuum suction mechanism include a mechanism using a porous chuck. As an adhesive plate, what uses adhesives, such as a silicone resin, an epoxy resin, an acrylic resin, or a polyester resin, can be illustrated.

  In the present embodiment, the flexible printed wiring board is exemplified and described as the correction target, but only the insulating substrate 110 may be corrected instead of the flexible printed wiring board.

DESCRIPTION OF SYMBOLS 1 ... Substrate manufacturing apparatus 10 ... Observation part 11 ... Support part 12 ... Traveling part 13 ... Opening 14 ... Guide 15 ... Microscope 20 ... Standard work unit 21 ... Reference work 211 ... Alignment mark 22 ... Glass holder 221 ... Vacuum suction hole 23 ... Reference work holding part 231 ... Fixing screw 232 ... Opening 233 ... Glass holder holding part 234 ... Vacuum suction hole 235 ... Vacuum pump 30 ... Tensioner 31 ... Actuator 311 ... Arm part 32 ... Grip clip 321 ... Claw part 40 ... Heating stage 50 ... Alignment stage 51 ... Stage 52 ... Movement mechanism 60 ... Housing 601 ... Bottom 602 ... Side 61 ... Rail 100 ... Circuit board 1 0 ... substrate 111 ... reference shape 112 ... contracted configuration 113 ... decompression shape 114 ... alignment marks 120 ... electronic component

Claims (7)

A first step of detecting a difference between the first shape and a second shape of the thermoplastic substrate that is relatively small with respect to the first shape;
A second step of heating the substrate while applying a tensile force to at least a part of the outer peripheral edge of the substrate;
A third step of releasing the tensile force applied to the substrate,
The method of manufacturing a substrate, wherein the second step includes elastically stretching the substrate so as to be at least a third shape larger than the first shape based on at least the difference. . It is a manufacturing method of the board according to claim 1, Comprising:
The second step includes heating the substrate within a predetermined temperature range;
The said predetermined temperature range is set based on the glass transition temperature of the material which comprises the said board | substrate, The manufacturing method of the board | substrate characterized by the above-mentioned. A method of manufacturing a substrate according to claim 2,
The said glass transition temperature is 40 degreeC or more and 200 degrees C or less, The manufacturing method of the board | substrate characterized by the above-mentioned. It is a manufacturing method of a substrate given in any 1 paragraph of Claims 1-3,
The method of manufacturing a substrate according to claim 2, wherein the second step includes applying a large tensile force as the difference becomes large. It is a manufacturing method of the substrate given in any 1 paragraph of Claims 1-4,
The method for manufacturing a substrate, wherein the third shape is relatively large with respect to the first shape.   The method for manufacturing a substrate according to any one of claims 1 to 5, further comprising a fourth step of forming or mounting an electronic component on the substrate before the first step. Detection means for detecting a difference between the first shape and the second shape of the thermoplastic substrate relatively small with respect to the first shape;
Tension applying means for applying a tensile force to at least a part of the outer peripheral edge of the substrate;
Heating means for heating the substrate,
The substrate manufacturing apparatus characterized in that the tension applying means elastically stretches the substrate so as to be at least a third shape larger than the first shape based on at least the difference.

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