JP6297872B2 - Measuring jig for inspecting surface mounted piezoelectric device and inspection method for surface mounted piezoelectric device - Google Patents

Description

  The present invention relates to a measuring jig used when inspecting electrical characteristics of a surface-mount piezoelectric device and a method for inspecting a surface-mount piezoelectric device.

  A pin-type piezoelectric device that vibrates at a predetermined vibration frequency and is provided with a plurality of lead terminals is known. Such a pin type piezoelectric device is mounted on a base substrate having surface mounting terminals for surface mounting and formed as a surface mounting type surface mounting type piezoelectric device. In addition, the surface mount type piezoelectric device is inspected for electrical characteristics before shipment. The inspection is performed by attaching a surface mount type piezoelectric device to a measurement jig for inspection.

  For example, Patent Document 1 discloses a measurement jig for inspecting a surface-mount type electronic component in which a probe is disposed in a socket. The inspection using such a measuring jig is performed by placing an electronic component on the socket so that the probe and the surface mounting terminal are in contact with each other.

JP 2006-337119 A

  However, in the measurement jig shown in Patent Document 1, it is necessary to prepare a plurality of measurement jigs in order to cope with various terminal arrangements of the surface-mount type surface-mount piezoelectric device, and the inspection cost increases. was there.

  An object of the present invention is to provide a measuring jig for inspecting a surface-mount type piezoelectric device in which an increase in inspection cost is suppressed and a method for inspecting the surface-mount type piezoelectric device.

  A measuring jig according to a first aspect includes a base substrate having a first main surface and a second main surface opposite to the first main surface, a plurality of lead terminals, and the plurality of lead terminals exposed on the second main surface. Thus, there is provided a measuring jig for inspecting a surface-mounted surface-mounted piezoelectric device including a pin-type piezoelectric device placed on the first main surface of the base substrate. Further, the measuring jig has a third main surface and a fourth main surface opposite to the third main surface, and a mounting portion for mounting the second main surface of the surface mount piezoelectric device so as to face the third main surface. And a fixing unit that fixes the surface-mount type piezoelectric device to the mounting unit, and a plurality of units that are fixed to the mounting unit and that contact the plurality of lead terminals when the surface-mounting type piezoelectric device is mounted on the mounting unit. A first contact probe.

  In the measurement tool of the second aspect, in the first aspect, the first contact probe extends linearly from the fourth main surface to the third main surface.

  In the first aspect or the second aspect, the measurement jig according to the third aspect has a plurality of surface-mount terminals that the base substrate is electrically connected to the lead terminals on the second main surface. The measurement jig includes a plurality of second contact probes that are fixed to the mounting portion and come into contact with the plurality of surface mounting terminals when the surface-mount type piezoelectric device is mounted on the mounting portion.

  In the measurement jig of the fourth aspect, in the third aspect, each second contact probe is bent in an arc shape from the contact portion so that the contact portion that contacts the surface mounting terminal is elastically deformed in a direction perpendicular to the third surface. A plurality of plates that have a shaft portion and are punched and formed are overlapped.

  According to a fifth aspect of the surface mounting type piezoelectric device inspection method, the surface mounting type piezoelectric device is mounted so that the plurality of lead terminals and the plurality of first contact probes are in contact with the measurement jig according to the first to fourth aspects. A mounting step of mounting on the mounting portion, a fixing step of fixing the surface-mounted piezoelectric device with the fixing portion, and an inspection for supplying power to the surface-mounted piezoelectric device and inspecting an output signal via the first contact probe And a process.

  According to a sixth aspect of the surface mounting type piezoelectric device inspection method, the surface mounting type piezoelectric device is arranged so that the plurality of surface mounting terminals and the plurality of second contact probes are in contact with the measurement jig according to the third or fourth aspect. A mounting step of mounting on the mounting portion, a fixing step of fixing the surface mount piezoelectric device with the fixing portion, and supplying power to the surface mount piezoelectric device and inspecting an output signal via the second contact probe And an inspection process.

  According to the measuring jig and the method for inspecting a surface-mounted piezoelectric device for inspecting the surface-mounted piezoelectric device of the present invention, it is possible to prevent an increase in the inspection cost of the surface-mounted piezoelectric device.

1 is a perspective view of a surface mount piezoelectric device 110 and a measurement jig 100. FIG. FIG. 4A is a side view of the surface-mount piezoelectric device 110. FIG. FIG. 2B is a bottom view of the surface mount piezoelectric device 110. FIG. FIG. 4A is a plan view of the measurement jig 100. FIG. FIG. 4B is a side view of the measurement jig 100 on which the surface mount type piezoelectric device 110 is placed. (A) is a side view of the measuring jig 200. FIG. (B) is a side view of the measurement jig 200 on which the surface-mount piezoelectric device 110 is placed. FIG. 4A is a side view of the second contact probe 203. FIG. FIG. 4B is a top view of the second contact probe 203. FIG. (C) is a schematic plan view of the measuring jig 200. 5 is a flowchart showing a method for inspecting the surface mount piezoelectric device 110.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the drawings. It should be noted that the scope of the present invention is not limited to these forms unless otherwise specified in the following description.

(First embodiment)
<Configuration of measuring jig 100>
FIG. 1 is a perspective view of the surface-mounted piezoelectric device 110 and the measuring jig 100. The surface mount type piezoelectric device 110 is formed by placing a pin type piezoelectric device 111 on a base substrate 112. The base substrate 112 is a substrate having a rectangular plane. In the following description, an axis parallel to the long side of the base substrate 112 will be described as the X axis, an axis parallel to the short side as the Y axis, and an axis orthogonal to the X axis and the Y axis will be described as the Z axis. The measurement jig 100 will also be described in accordance with the coordinate axes of the surface mount piezoelectric device 110 when the surface mount piezoelectric device 110 is placed on the measurement jig 100.

  The pin-type piezoelectric device 111 is, for example, a crystal oscillator with a thermostat (OCXO). The crystal oscillator with a thermostat (OCXO) has a crystal resonator element (not shown) that vibrates at a predetermined vibration frequency in a thermostat tank, and a quartz resonator element is maintained at a predetermined temperature with a heater. It is a crystal oscillator that stabilizes the vibration frequency of the high-precision. The base substrate 112 has surface mount terminals 113 formed along the sides on the + X axis side and the −X axis side. The surface-mounted piezoelectric device 110 is formed by placing the pin-type piezoelectric device 111 on the surface of the base substrate 112 on the + Z axis side. The surface mount type piezoelectric device 110 is used by being surface mounted on a printed circuit board or the like via the surface mount terminals 113.

  The measurement jig 100 is configured to include a placement part 101, a fixing part 102, and a first contact probe 103. The mounting portion 101 has a rectangular plane whose long side extends in the X-axis direction and whose short side extends in the Y-axis direction, and the surface-mounted piezoelectric device 110 is mounted on the surface on the + Z-axis side. The fixing portions 102 are disposed at both ends of the + Z-axis side and the −X-axis side of the surface on the + Z-axis side of the mounting portion 101, and fix the surface mount piezoelectric device 110 mounted on the mounting portion 101. A plurality of first contact probes 103 are arranged in the center of the placement portion 101 so as to penetrate the placement portion 101 in the Z-axis direction.

  FIG. 2A is a side view of the surface mount piezoelectric device 110. A plurality of lead terminals 114 are formed on the surface of the pin-type piezoelectric device 111 on the −Z axis side. A plurality of through holes 115 (see FIG. 2B) penetrating the base substrate 112 in the Z-axis direction are formed in the base substrate 112, and the pin type piezoelectric device is inserted by inserting the lead terminals 114 into the through holes 115. 111 is placed on the base substrate 112. The surface mount terminals 113 formed along the + X-axis side and the −X-axis side of the base substrate 112 are respectively moved from the + Z-axis side surface of the base substrate 112 to the −Z-axis side through the side surface of the base substrate 112. It is formed to be pulled out.

  FIG. 2B is a bottom view of the base substrate 112. Near the center of the base substrate 112, a plurality of through holes 115 are formed. As for the arrangement of the through-holes 115, for example, two rows formed by arranging the through-holes 115 so as to be aligned in the Y-axis direction are formed so as to be aligned in the X-axis direction. The column on the + X axis side is formed by three through holes 115, and the column on the −X axis side is formed by six through holes 115. Such an arrangement of the through holes 115 is matched to the arrangement of the lead terminals 114. That is, the lead terminal 114 is formed on the surface of the pin-type piezoelectric device 111 on the −Z-axis side so as to overlap the arrangement of the through hole 115 shown in FIG.

  Further, three surface mount terminals 113 are formed on the −X axis side of the base substrate 112, and four surface mount terminals 113 are formed on the + X axis side. Hereinafter, for the sake of explanation, the surface mount terminal 113 on the −X axis side is referred to as surface mount terminals 113a to 113c from the + Y axis side toward the −Y axis side, and the surface mount terminal 113 on the + X axis side is − Surface mount terminals 113d to 113g are formed toward the Y-axis side. An electrode (not shown) is formed in each through hole 115, and when the pin type piezoelectric device 114 is placed on the base substrate 112, the electrode of the through hole 115 and the lead terminal 114 are electrically connected. The Each surface mount terminal 113 is electrically connected to an electrode formed in each through hole 115.

  In the surface-mounted piezoelectric device 110, even when the same pin-type piezoelectric device 111 is used, the role (pin arrangement) of each surface-mounted terminal 113 formed on the base substrate 112 may be different. For example, the surface mount terminals 113a, 113b, and 113e may be a control voltage terminal (VCONT), a reference voltage output terminal (Vref), and an unused terminal (NC), respectively. In another example, the surface mount terminals 113a, 113b, and 113e may be an unused terminal (NC), a power supply (VCC), and a ground terminal (GND), respectively. Such a difference in the pin arrangement of the surface mount terminals changes the wiring connecting the surface mount terminals 113 and the electrodes formed in the through holes 115 in order to meet the demands of users of the surface mount piezoelectric device 110. Due to that. On the other hand, the pin arrangement of the lead terminals 114 of the pin type piezoelectric device 111 is unified.

  FIG. 3A is a plan view of the measurement jig 100. A plurality of first contact probes 103 are arranged near the center of the mounting portion 101. As the arrangement of the first contact probes 103, two rows formed by arranging the first contact probes 103 so as to be arranged in the Y-axis direction are arranged in the X-axis direction. The column on the + X axis side is formed by three first contact probes 103, and the column on the −X axis side is formed by six first contact probes 103. Such an arrangement of the first contact probe 103 is an arrangement in which the lead terminal 114 is in contact with the first contact probe 103 when the surface mount type piezoelectric device 110 is placed on the placement portion 101.

  A pedestal 101 a on which the surface mount type piezoelectric device 110 is placed is formed as a part of the placement unit 101 on the surface on the + Z-axis side of the placement unit 101. In FIG. 3A, a part of the pedestal 101a is shown. By mounting the surface-mounted piezoelectric device 110 on the pedestal 101a, a gap is formed between the surface-mounted piezoelectric device 110 and the surface of the mounting portion 101 on the + Z-axis side. The pedestal 101a is formed so that the surface mount terminals 113 and the lead terminals 114 of the surface mount piezoelectric device 110 are exposed in this gap. In FIG. 3A, the pedestal 101a is formed on the + X axis side and the −X axis side of the mounting portion 101, but the pedestal 101a is arranged on the + X axis side row and the −X axis side row of the first contact probe 103. It can be formed at various locations that do not interfere with the inspection, such as between.

  FIG. 3B is a side view of the measuring jig 100 on which the surface mount type piezoelectric device 110 is placed. In FIG. 3B, the first contact probe 103 is displayed in front of the placement unit 101 for explanation. In the state where the surface mount type piezoelectric device 110 is placed on the placement unit 101, both the + X axis side and −X axis side ends of the base substrate 112 are fixed by the fixing unit 102. The fixing part 102 is formed as a clip, for example. When the tip 102b of the fixing portion 102 is pressed against the base substrate 112 by the spring 102a, both the + X axis side and the −X axis side of the base substrate 112 are fixed to the mounting portion 101.

  The lead terminal 114 of the surface mount type piezoelectric device 110 contacts the first contact probe 103 in a state where the surface mount type piezoelectric device 110 is placed on the placement unit 101. As a result, the electrical characteristics of the surface mount piezoelectric device 110 can be inspected via the first contact probe 103.

  The first contact probe 103 includes, for example, a head 103 a that contacts the lead terminal 114 and a main body 103 b that is fixed to the placement unit 101. The head 103a can be removed and replaced according to the length and shape of the lead terminal 114. Further, as indicated by a dotted line in the first contact probe 103 shown on the right side of FIG. 3B, a spring 103c is charged in the main body 103b. As a result, when the surface-mounted piezoelectric device 110 is placed and fixed on the placement portion 101 and the head 103a and the lead terminal 114 come into contact with each other, a force that pushes back the lead terminal 114 is generated in the head 103a. Contact with the lead terminal 114 can be ensured.

  In the surface mount type piezoelectric device, as described with reference to FIG. 2B, the pin arrangement of each surface mount terminal 113 is various. Further, the pin arrangement of each surface mount terminal 113 differs depending on the user and cannot be unified. Therefore, a measurement jig for inspecting the surface mount type piezoelectric device cannot be made common, and a measurement jig must be prepared for each surface mount type piezoelectric device. As a result, there has been a problem that the cost associated with the inspection of the electrical properties of the surface-mount piezoelectric device is increased. Further, when the pin arrangement of the surface mounting terminal 113 of the surface mounting type piezoelectric device is changed, there is a trouble that a new measuring jig has to be manufactured.

  In the measuring jig 100, the inspection can be performed regardless of the pin arrangement of the surface mounting terminal 113 by inspecting the first contact probe 103 directly in contact with the lead terminal 114 of the surface mounting type piezoelectric device 110. Further, in the surface mount type piezoelectric device 110, the pin arrangement of the lead terminals 114 is unified, and the wiring of the base substrate 112 is changed, so that the pin arrangement of the surface mount terminals 113 which varies from user to user can be dealt with. The measuring jig 100 can correspond to a plurality of surface mount piezoelectric devices having different pin arrangements of the surface mount terminals 113. As a result, when the measurement jig 100 is used for inspection, it is not necessary to prepare a plurality of measurement jigs corresponding to the surface-mount type piezoelectric device, so that the inspection cost can be reduced. Further, even when the pin arrangement of the surface mounting terminal 113 of the surface mounting type piezoelectric device is changed, it is preferable that a new measuring jig need not be prepared.

  Further, conventionally, when inspecting a surface-mounted piezoelectric device as a return product from the market, the pin-type piezoelectric device 111 may be inspected after the pin-type piezoelectric device 111 is detached from the base substrate 112. When the measurement jig 100 is used, the pin type piezoelectric device 111 can be inspected without removing the pin type piezoelectric device 111 from the base substrate 112, so that it is easy to inspect the returned product from the market.

  Furthermore, conventionally, since the pin-type piezoelectric device 111 is inspected during the manufacturing process, the inspection process and the manufacturing process cannot be separated. On the other hand, in the inspection using the measuring jig 100, since the inspection can be performed after the surface-mounted surface-mounted piezoelectric device 110 is assembled, the inspection process and the manufacturing process can be separated. It is. This is preferable because the inspection process and the manufacturing process can be performed without being restricted by each other.

(Second Embodiment)
In the measurement jig, a second contact probe that contacts the surface mount terminal may be formed together with the first contact probe that contacts the lead terminal. Hereinafter, the measuring jig 200 in which the second contact probe is formed together with the first contact probe will be described. In the following description, the same parts as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and the description thereof is omitted.

<Configuration of measuring jig 200>
FIG. 4A is a side view of the measurement jig 200. The measurement jig 200 is formed by further arranging a second contact probe 203 on the measurement jig 100. In FIG. 4A, the first contact probe 103 and the second contact probe 203 are shown in front of the mounting portion 101 for the sake of explanation. The second contact probe 203 is formed such that a contact portion 203 a formed at the tip of the second contact probe 203 is in contact with the surface mount terminal 113 in a state where the surface mount type piezoelectric device 110 is placed on the measurement jig 200. Has been. Similarly to the first contact probe 103, the second contact probe 203 is formed so that a part of the second contact probe 203 protrudes from the surface on the −Z axis side of the mounting portion 101.

  FIG. 4B is a side view of the measurement jig 200 on which the surface mount piezoelectric device 110 is placed. In some cases, the surface mount type piezoelectric device 110 is covered with an underfill (not shown) such as an epoxy resin as an insulator by cutting the lead terminal 114 according to a request from a customer or the like. In this case, the surface mount piezoelectric device 110 cannot be inspected via the lead terminal 114. In such a case, the measuring apparatus 200 can inspect the surface-mount piezoelectric device 110 via the second contact probe 203.

  FIG. 4B shows a state in which the surface mount type piezoelectric device 110 is mounted on the mounting portion 101 of the measuring jig 200 and the contact portion 203a of the second contact probe 203 is in contact with the surface mount terminal 113. Has been. In the measurement jig 200, the electrical characteristics of the surface mount piezoelectric device 110 can be inspected via the second contact probe 203 by bringing the second contact probe 203 and the surface mount terminal 113 into contact with each other. In the inspection using the second contact probe 203, the head 103a may be detached from the first contact probe 103 so that the first contact probe 103 does not interfere with the measurement.

  FIG. 5A is a side view of the second contact probe 203. The second contact probe 203 has a shaft portion 203b bent in an arcuate shape, and a contact portion 203a is formed at the tip of the shaft portion 203b. When the surface mount type piezoelectric device 110 is placed on the measuring jig 200 and the contact portion 203a contacts the surface mount terminal 113, the shaft portion 203b is bent so that the contact portion 203a moves in the −Z axis direction. And elastically deforms. Further, as a reaction, the contact portion 203a is pressed against the surface mount terminal 113. Thereby, the contact between the contact portion 203a and the surface mounting terminal 113 is ensured.

  FIG. 5B is a top view of the second contact probe 203. The second contact probe 203 is a plate-type contact probe formed so that the plate is bent. The second contact probe 203 is formed with a narrow width in the Y-axis direction so as to correspond to various shapes and sizes of surface-mounted terminals. Such a second contact probe 203 is formed, for example, by being punched from a predetermined mold.

  FIG. 5C is a schematic plan view of the measurement jig 200. In FIG. 5C, the fixing portion 102 is omitted for the sake of explanation. Further, in FIG. 5C, the outer shape of the surface-mounted piezoelectric device 110 and the surface-mounted terminal 113 on the surface of the surface-mounted piezoelectric device 110 on the −Z-axis side are indicated by dotted lines. In the measurement jig 200, one terminal 204 is formed in a bundle such that three second contact probes 203 overlap in the Y-axis direction. In the measurement jig 200, one terminal 204 is formed so as to correspond to one surface mount terminal 113.

  When a plate-type contact probe is arranged on a conventional measuring jig, one contact probe is formed so as to correspond to one surface mount terminal. However, one contact probe cannot pass a large current due to its thin plate, and the contact probe contact is likely to be a point contact, and the voltage cannot be applied in a state where the power supply voltage is constant. was there. In addition, in order to use a thick plate, it is necessary to make a new mold for producing a contact probe, and there is a problem that the cost for inspection increases.

  In the measuring jig 200, the plurality of second contact probes 203 are overlapped and bundled and used, so that the plurality of second contact probes 203 come into contact with one surface mount terminal, so that the contact of the contact probe is only one point. It is a contact probe that can withstand a large current. Further, since a new contact probe is not manufactured at the terminal 204 of the measuring jig 200, the inspection cost is not increased.

  In addition, when a pin-type piezoelectric device is attached to a base substrate to form a surface-mount type piezoelectric device, the surface-mount type piezoelectric device with a limited number of terminals has fewer terminals than the pin-type piezoelectric device. There are lead terminals that cannot actually be used or tested in the device. Since the measurement jig 100 can inspect the pin type piezoelectric device through the lead terminal even when the surface mounting type piezoelectric device having the surface mounting terminal is used, the inspection of the lead terminal that cannot be inspected through the surface mounting terminal is also performed. I can do it.

  In other words, the measurement jig 200 has the first contact probe 103 for measuring the surface mount terminals 113 necessary for the product, and the second contact probe 203 can be used for inspection.

(Third embodiment)
Hereinafter, a method for inspecting the surface mount piezoelectric device 110 using the measurement jig 100 or the measurement jig 200 will be described. Moreover, in the following description, the same code | symbol as 1st Embodiment or 2nd Embodiment is attached | subjected regarding the part similar to 1st Embodiment or 2nd Embodiment, and the description is abbreviate | omitted.

<Inspection Method of Surface Mount Type Piezoelectric Device 110>
FIG. 6 is a flowchart showing a method for inspecting the surface-mounted piezoelectric device 110. Hereinafter, an inspection method for the surface-mounted piezoelectric device 110 will be described with reference to FIG.

  In step S101, a contact probe to be used is selected. That is, in step S101, it is selected whether the inspection is performed using the surface mounting terminal 113 of the surface mounting type piezoelectric device 110 or the inspection using the lead terminal 114. When the inspection is performed via the lead terminal 114, the first contact probe 103 is selected. Either the measurement jig 100 or the measurement jig 200 may be selected as the measurement jig. When the inspection is performed via the surface mount terminal 113, the second contact probe 203 is selected, and thus the measurement jig 200 is selected as the measurement jig. When the first contact probe 103 is selected as the contact probe to be used, the process proceeds to step S102, and when the second contact probe 203 is selected, the process proceeds to step S202.

  In step S <b> 102, the surface mount piezoelectric device 110 is placed on the placement unit 101 so that the lead terminal 114 contacts the first contact probe 103. Step S102 is a placement process. When the surface mount type piezoelectric device 110 is mounted on the mounting portion 101, the fixing portion 102 is mounted by raising the tip 102b (see FIG. 3B, etc.) of the fixing portion 102 to the + Z axis side. Keep it out of the way.

  In step S <b> 103, the surface mount piezoelectric device 110 is fixed by the fixing unit 102. Step S103 is a fixing process. In the fixing step, both the + X-axis side and the −X-axis side of the base substrate 112 are held by the tip 102b of the fixing unit 102, whereby the surface-mount type piezoelectric device 110 is fixed to the mounting unit 101 (FIG. 3B). )reference).

  In step S <b> 104, the surface-mounted piezoelectric device 110 is inspected via the first contact probe 103. Step S104 is an inspection process. In the inspection process, electrical characteristics such as power supply and output signals of the surface mount piezoelectric device 110 are inspected via the first contact probe 103 protruding from the surface on the −Z-axis side of the mounting portion 101.

  On the other hand, in step S <b> 202, the surface mount type piezoelectric device 110 is placed on the placement unit 101 so that the surface mount terminals 113 are in contact with the second contact probe 203. Step S202 is a placement process. In step S <b> 202, the number of second contact probes 203 used for each terminal 204 of the measuring jig 200 is adjusted and placed on the mounting portion 101 in consideration of the size of the surface mounting terminal 113 and the voltage used. (See FIG. 5C). Thereafter, the surface mount piezoelectric device 110 is placed on the placement portion 101 such that the contact portions 203a of the second contact probes 203 come into contact with the surface mount terminals 113. Further, when the surface-mount piezoelectric device 110 is placed on the placement portion 101, the tip 102b (see FIG. 4B, etc.) of the fixed portion 102 is raised to the + Z-axis side as in step S102. For example, the fixing portion 102 is prevented from hindering placement.

  In step S <b> 203, the surface mount piezoelectric device 110 is fixed by the fixing unit 102. Step S203 is a fixing step. In the fixing step, both the + X-axis side and the −X-axis side of the base substrate 112 are held down by the tip 102b of the fixing unit 102, whereby the surface mount piezoelectric device 110 is fixed to the mounting unit 101 (FIG. 4B). )reference).

  In step S204, the surface-mounted piezoelectric device 110 is inspected via the second contact probe 204. Step S204 is an inspection process. In the inspection process, electrical characteristics such as power supply and output signals of the surface-mount piezoelectric device 110 are inspected via the second contact probe 203 protruding from the surface on the −Z-axis side of the mounting portion 101.

  The optimal embodiment of the present invention has been described above in detail, but as will be apparent to those skilled in the art, the present invention can be implemented with various modifications and variations within the technical scope thereof. Moreover, the features of each embodiment can be implemented in various combinations.

DESCRIPTION OF SYMBOLS 100, 200 ... Measuring jig 101 ... Mounting part 101a ... Base 102 ... Fixed part 102a ... Spring 102b ... Tip of fixed part 103 ... First contact probe 103a ... Head 103b ... Main body 103c ... Spring 110 ... Surface mount type piezoelectric device DESCRIPTION OF SYMBOLS 111 ... Pin type piezoelectric device 112 ... Base substrate 113, 113a-113g ... Surface mount terminal 114 ... Lead terminal 203 ... Second contact probe 203a ... Contact part 203b ... Shaft part 204 ... Terminal

Claims (3)

A base substrate having a first main surface and a second main surface on which a plurality of surface mount terminals are formed on the opposite side of the first main surface, and a plurality of lead terminals electrically connected to the plurality of surface mount terminals A surface-mounted surface-mount type piezoelectric device comprising: a pin-type piezoelectric device mounted on the first main surface of the base substrate so that the plurality of lead terminals are exposed on the second main surface ;
The third major surface and a fourth major surface of the opposite side, a mounting portion for mounting said second main surface of the surface mount type piezoelectric device to face the third major surface, said surface a fixing unit for fixing the mount type piezoelectric device to the mounting section, in contact with the plurality of lead terminals when fixed to the mounting section prior Symbol surface mount type piezoelectric device is placed on the placement section A plurality of first contact probes and a plurality of second contact probes that contact the plurality of surface mount terminals ,
Measurement system for surface-mount piezoelectric devices composed of 2. The surface mounting type piezoelectric device measurement system according to claim 1, wherein the first contact probe has a shape extending linearly and penetrates the mounting portion from the fourth main surface to the third main surface. 3. Forming the second contact probe has a shaft portion contact portion in contact with the surface mount terminal is bent arcuately from said contact portion so as to elastically deform in a direction perpendicular to the third main surface, punched and The surface mounting type piezoelectric device measurement system according to claim 1, wherein a plurality of the formed plates are overlapped.

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