JP6295571B2 - Electronic devices, quantum interference devices, atomic oscillators, electronic devices, and moving objects - Google Patents

Description

  The present invention relates to an electronic device, a quantum interference device, an atomic oscillator, an electronic apparatus, and a moving object.

As an electronic device including a temperature-controlled portion to be temperature-controlled, for example, a thermostat crystal oscillator, an atomic oscillator, or the like is known.
For example, in the piezoelectric oscillator according to Patent Document 1, the temperature of a metal block that is a thermostatic chamber that accommodates the piezoelectric vibrator is adjusted using heat from a heater. In this piezoelectric oscillator, the metal block is supported via the substrate with respect to the bottom plate of the housing containing the metal block and the heater, and the substrate is attached to the substrate for the purpose of suppressing the escape of heat from the metal block to the bottom plate. A cut is provided to reduce the heat transfer path.

  However, although the piezoelectric oscillator according to Patent Document 1 can suppress the heat conduction of the substrate, there is a problem in that heat escapes from the substrate by radiation (radiation), resulting in an increase in power consumption. In general, the amount of heat escape due to radiation is less than the amount of heat escape due to heat conduction or convection, but in recent years, with the demand for power saving of electronic devices, the heat conduction from the temperature controlled part or the heat due to convection is reduced. The transmission is made as small as possible. As a result, heat escape due to radiation becomes obvious, and the above-described problem becomes particularly significant.

Japanese Patent Laid-Open No. 2003-142943

  An object of the present invention is to provide an electronic device, a quantum interference device, and an atomic oscillator that can achieve low power consumption, and to provide an electronic device and a moving body that have such an electronic device or an atomic oscillator that includes the electronic device or the atomic oscillator. It is to provide.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
A quantum interference device according to an aspect of the present invention includes a base unit, a unit unit including a gas cell in which metal atoms are sealed, and the unit unit is disposed between the base unit and the unit unit. A support part supported by the first surface facing the unit part, and a support side reflection part having a reflectance of 50% or more with respect to an electromagnetic wave having a wavelength of 4 μm, wherein the support side reflection part has a plurality of parts. And the plurality of portions are disposed apart from each other on a plurality of surfaces of the support portion including the first surface.
In a quantum interference device according to another aspect of the present invention, at least one of the plurality of portions of the support-side reflecting portion is disposed on the first surface with a gap from the unit portion. Yes.
In a quantum interference device according to another aspect of the present invention, the unit section includes a heating section that heats the gas cell.
In a quantum interference device according to another aspect of the present invention, the gas cell is engaged with a connection member included in the unit part, and is disposed between an outer surface of the gas cell and the connection member, and has an electromagnetic wave with a wavelength of 4 μm. The heating side reflection part whose reflectance with respect to is 50% or more is provided.
In a quantum interference device according to another aspect of the present invention, the heating-side reflection unit is formed of a metal film.
A quantum interference device according to another aspect of the present invention includes a light emitting unit that emits light that excites the metal atoms in the gas cell, and a light detection unit that detects the light transmitted through the gas cell. The heating-side reflecting portion is disposed on a portion of the outer surface of the gas cell excluding a portion through which the light is transmitted.
In a quantum interference device according to another aspect of the present invention, the plurality of portions of the support-side reflecting portion are arranged in a striped pattern.
In the quantum interference device according to another aspect of the present invention, the plurality of portions of the support-side reflecting portion are arranged in a spot shape.
In a quantum interference device according to another aspect of the present invention, the arrangement density of the support-side reflecting portions on the plurality of surfaces of the support portion is larger on the gas cell side than on the base portion side.
In a quantum interference device according to another aspect of the present invention, the support-side reflecting portion is made of a metal material.
In a quantum interference device according to another aspect of the present invention, the support portion includes a plurality of leg portions whose one end portions are connected to the base portion, and a connecting portion that connects the plurality of leg portions. And the connection part of the said leg part and the said base part is spaced apart with respect to the said unit part by the planar view seen from the direction where the said base part and the said unit part overlap.
In a quantum interference device according to another aspect of the present invention, the support portion is configured with a resin material as a main material.
An atomic oscillator according to an aspect of the present invention includes the above-described quantum interference device.
An electronic apparatus according to an aspect of the present invention includes the above-described quantum interference device.
The moving body which concerns on a certain form of this invention is provided with the quantum interference apparatus mentioned above, It is characterized by the above-mentioned.
[Application Example 1]
The electronic device of the present invention has a base part, a temperature-adjusted part that is temperature-controlled, a support part that supports the temperature-adjusted part with respect to the base part, and a reflectance with respect to electromagnetic waves having a wavelength of 4 μm is 50. %, And a support-side reflection part including a plurality of parts arranged apart from each other on the surface of the support part.

  According to such an electronic device, the heat radiation from the support part is suppressed while suppressing the heat conduction between the temperature-adjusted part and the base part via the support part by increasing the heat insulating property (thermal resistance) of the support part. Can be suppressed by the support-side reflecting portion. Here, since the support side reflection part includes a plurality of parts arranged apart from each other, heat conduction between the temperature-adjusted part and the base part via the support side reflection part can be suppressed. . That is, the support side reflection part can suppress the thermal radiation from a support part, making small the increase in the heat conduction between a to-be-temperature-adjusted part and a base part. As a result, the power consumption of the electronic device can be reduced.

[Application Example 2]
The quantum interference device of the present invention includes a base portion,
A gas cell in which metal atoms are enclosed;
A support portion supporting the gas cell with respect to the base portion;
A support-side reflecting portion including a plurality of portions arranged to be separated from each other on the surface of the support portion, the reflectivity for an electromagnetic wave having a wavelength of 4 μm is 50% or more;
It is characterized by providing.

  According to such a quantum interference device, the heat insulating property (thermal resistance) of the support part is increased and the heat conduction between the gas cell (temperature-adjusted part) and the base part via the support part is suppressed, and the support part Can be suppressed by the support-side reflecting portion. Here, since the support side reflection part includes a plurality of parts arranged away from each other, heat conduction between the gas cell and the base part via the support side reflection part can be suppressed. That is, the support side reflection part can suppress the thermal radiation from a support part, reducing the increase in the heat conduction between a gas cell and a base part. As a result, the power consumption of the quantum interference device can be reduced.

[Application Example 3]
The quantum interference device of the present invention includes a heating unit for heating the gas cell,
The support part preferably supports the heating part with respect to the base part.
Thereby, the temperature of the gas cell can be adjusted to a desired temperature. Moreover, since the heating part is supported by the base part via the support part, the thermal interference between a heating part and the exterior can be suppressed.

[Application Example 4]
In the quantum interference device of the present invention, it is preferable to include a heating-side reflecting portion that is disposed on the outer surface of the gas cell and has a reflectance of 50% or more with respect to an electromagnetic wave having a wavelength of 4 μm.
Thereby, it can suppress that the heat of a gas cell escapes by radiation.

[Application Example 5]
In the quantum interference device of the present invention, a light emitting unit that emits light that excites the metal atoms in the gas cell;
A light detection unit for detecting the light transmitted through the gas cell,
It is preferable that the said heating side reflection part is arrange | positioned in the part except the part which the said light permeate | transmits among the outer surfaces of the said gas cell.
Thereby, the light from the light emitting part can be irradiated to the metal atoms in the gas cell and detected by the light detecting part regardless of the constituent material and thickness of the heating side reflecting part. Therefore, it is possible to effectively suppress the heat radiation from the heating side reflection part.

[Application Example 6]
In the quantum interference device according to the aspect of the invention, it is preferable that the plurality of portions of the support-side reflecting portion are arranged in a stripe shape.
Thereby, it is possible to efficiently suppress heat conduction between the gas cell and the base portion via the support-side reflecting portion with a relatively simple configuration.

[Application Example 7]
In the quantum interference device according to the aspect of the invention, it is preferable that the plurality of portions of the support-side reflecting portion are arranged in a spot shape.
Thereby, it is possible to efficiently suppress heat conduction between the gas cell and the base portion via the support-side reflecting portion with a relatively simple configuration.

[Application Example 8]
In the quantum interference device according to the aspect of the invention, it is preferable that an arrangement density of the support side reflection portions on the surface of the support portion is larger on the gas cell side than on the base portion side.
Thereby, the radiation of the heat | fever of the part by which the temperature of a support part is high can be suppressed efficiently.

[Application Example 9]
In the quantum interference device according to the aspect of the invention, it is preferable that the support-side reflecting portion is made of a metal material.
Thereby, the effect | action which suppresses the heat radiation of a support side reflection part can be exhibited suitably.

[Application Example 10]
In the quantum interference device of the present invention, comprising a unit portion including the gas cell,
The support portion includes a plurality of leg portions whose one end portions are connected to the base portion, and a connecting portion that connects the plurality of leg portions,
The other end part of the leg part or the connecting part is connected to the unit part,
The connecting portion between the leg portion and the base portion is preferably separated from the unit portion in a plan view as viewed from the direction in which the base portion and the unit portion overlap.

  As a result, one end of each leg (connecting part to the base) is separated from the unit part in plan view, so that even if the distance between the base part and the unit part is reduced, it is supported. The heat transfer path from the unit part to the base part via the part can be lengthened. Therefore, it is possible to suppress the transmission of heat from the unit part to the base part via the support part while reducing the size of the atomic oscillator. Further, since the plurality of leg portions are connected by the connecting portion, the rigidity of the support portion can be increased. Therefore, the vibration of the unit part can be suppressed.

[Application Example 11]
In the quantum interference device according to the aspect of the invention, it is preferable that the support portion is formed using a resin material as a main material.
Thereby, the thermal resistance of a support part can be made high.
[Application Example 12]
The atomic oscillator according to the present invention includes the quantum interference device according to the present invention.
According to such an atomic oscillator, power consumption can be reduced.

[Application Example 13]
An electronic apparatus according to the present invention includes the quantum interference device according to the present invention.
Thereby, an electronic device having excellent reliability can be provided.
[Application Example 14]
The moving body of the present invention includes the quantum interference device of the present invention.
Thereby, the mobile body which has the outstanding reliability can be provided.

1 is a cross-sectional view showing an atomic oscillator (electronic device) according to a first embodiment of the present invention. It is the schematic of the atomic oscillator shown in FIG. It is a figure for demonstrating the energy state of the alkali metal in the gas cell of the atomic oscillator shown in FIG. 2 is a graph showing the relationship between the frequency difference between two lights from a light emitting part and the detection intensity at the light detecting part for the light emitting part and the light detecting part of the atomic oscillator shown in FIG. 1. It is sectional drawing for demonstrating the heating part and connection member of a unit part with which the atomic oscillator shown in FIG. 1 is provided. It is an exploded view for demonstrating the gas cell with which the atomic oscillator shown in FIG. 1 is provided, and a heating side reflection part. (A) is a top view of the support part of the atomic oscillator shown in FIG. 1, (b) is the sectional view on the AA line in (a). It is a side view of the support part of the atomic oscillator shown in FIG. 1, and is a view for explaining a support side reflection part provided on the surface of the support part. It is a figure for demonstrating the support side reflection part which concerns on the modification of the atomic oscillator shown in FIG. It is sectional drawing which shows the atomic oscillator (electronic device) which concerns on 2nd Embodiment of this invention. It is a top view of the support part of the atomic oscillator shown in FIG. It is a partial expansion perspective view of the support part shown in FIG. It is a figure which shows schematic structure at the time of using the atomic oscillator of this invention for the positioning system using a GPS satellite. It is a perspective view which shows the structure of a mobile body (automobile) provided with the atomic oscillator of this invention.

Hereinafter, an electronic device, a quantum interference device, an atomic oscillator, an electronic apparatus, and a moving body of the present invention will be described in detail based on embodiments shown in the accompanying drawings.
1. Atomic oscillator (electronic device)
First, the atomic oscillator of the present invention (the electronic device of the present invention) will be described.
<First Embodiment>
FIG. 1 is a cross-sectional view showing an atomic oscillator (electronic device) according to the first embodiment of the present invention, and FIG. 2 is a schematic view of the atomic oscillator shown in FIG. FIG. 3 is a diagram for explaining the energy state of the alkali metal in the gas cell of the atomic oscillator shown in FIG. FIG. 4 is a graph showing the relationship between the frequency difference between the two lights from the light emitting portion and the detection intensity at the light detecting portion for the light emitting portion and the light detecting portion of the atomic oscillator shown in FIG. . FIG. 5 is a cross-sectional view for explaining the heating unit and the connecting member of the unit unit included in the atomic oscillator shown in FIG. FIG. 6 is an exploded view for explaining a gas cell and a heating-side reflection unit provided in the atomic oscillator shown in FIG. 7A is a plan view of the support portion of the atomic oscillator shown in FIG. 1, and FIG. 7B is a cross-sectional view taken along line AA in FIG. FIG. 8 is a side view of the support portion of the atomic oscillator shown in FIG. 1, for explaining the support-side reflection portion provided on the surface of the support portion.
In the following, for convenience of explanation, the upper side in FIG. 1 is referred to as “upper” and the lower side is referred to as “lower”.

An atomic oscillator 1 shown in FIG. 1 is an atomic oscillator using a quantum interference effect.
As shown in FIG. 1, the atomic oscillator 1 includes a unit part 2 that constitutes a main part that generates a quantum interference effect, a package 3 that houses the unit part 2, and a package 3 that houses the unit part 2. A support member 4 (support portion) that supports the package 3 and a support-side reflection portion 7 provided on the outer surface of the support member 4 are provided.

Here, the unit part 2 includes the gas cell 21, the light emitting part 22, the optical components 231, 232, the light detecting part 24, the heater 25 (heat generating part), the temperature sensor 26, the substrate 28, and the connecting member. 29, and these are unitized. In addition, the heating side reflection section 6 is provided on the outer surface of the gas cell 21.
Although not shown in FIG. 1, the atomic oscillator 1 includes a coil 27 and a control unit 5 in addition to the above (see FIG. 2).

First, the principle of the atomic oscillator 1 will be briefly described.
In the atomic oscillator 1, gaseous alkali metal (metal atom) such as rubidium, cesium, or sodium is enclosed in a gas cell 21.
As shown in FIG. 3, the alkali metal has a three-level energy level, and is in three states, two ground states (ground states 1 and 2) having different energy levels, and an excited state. Can take. Here, the ground state 1 is a lower energy state than the ground state 2.

When two types of resonant lights 1 and 2 having different frequencies are irradiated to such a gaseous alkali metal, depending on the difference (ω1−ω2) between the frequency ω1 of the resonant light 1 and the frequency ω2 of the resonant light 2. The optical absorptance (light transmittance) of the resonance light 1 and 2 in the alkali metal changes.
When the difference (ω1−ω2) between the frequency ω1 of the resonant light 1 and the frequency ω2 of the resonant light 2 matches the frequency corresponding to the energy difference between the ground state 1 and the ground state 2, the ground states 1 and 2 Each excitation to the excited state stops. At this time, both the resonant lights 1 and 2 are transmitted without being absorbed by the alkali metal. Such a phenomenon is called a CPT phenomenon or an electromagnetically induced transparency (EIT) phenomenon.

The light emitting unit 22 emits two types of light (resonant light 1 and resonant light 2) having different frequencies as described above toward the gas cell 21.
For example, when the light emitting unit 22 fixes the frequency ω1 of the resonant light 1 and changes the frequency ω2 of the resonant light 2, the difference between the frequency ω1 of the resonant light 1 and the frequency ω2 of the resonant light 2 (ω1-ω2). ) Coincides with the frequency ω 0 corresponding to the energy difference between the ground state 1 and the ground state 2, the detection intensity of the light detection unit 24 increases sharply as shown in FIG. Such a steep signal is detected as an EIT signal. This EIT signal has an eigenvalue determined by the type of alkali metal. Therefore, an oscillator can be configured by using such an EIT signal.

Hereinafter, each part of the atomic oscillator 1 will be described in detail sequentially.
[Gas cell]
The gas cell 21 is filled with gaseous alkali metals such as rubidium, cesium and sodium. Further, in the gas cell 21, a rare gas such as argon or neon, or an inert gas such as nitrogen may be sealed together with an alkali metal gas as a buffer gas, if necessary.
As shown in FIG. 5, the gas cell 21 includes a main body portion 211 having a columnar through hole and a pair of window portions 212 and 213 that block both openings of the through hole. Thereby, the internal space S in which the alkali metal as described above is enclosed is formed.

Here, each window part 212,213 of the gas cell 21 has the permeability | transmittance with respect to the excitation light from the light-projection part 22 mentioned above. One window portion 212 transmits excitation light that enters the gas cell 21, and the other window portion 213 transmits excitation light emitted from the gas cell 21.
The material constituting the window portions 212 and 213 is not particularly limited as long as it has transparency to the excitation light as described above, and examples thereof include glass materials and crystal.

Moreover, the material which comprises the main-body part 211 of the gas cell 21 is not specifically limited, A silicon material, a ceramic material, a metal material, a resin material, etc. may be sufficient and a glass material, a crystal | crystallization, etc. are similar to the window parts 212 and 213. It may be.
The window portions 212 and 213 are airtightly joined to the main body portion 211. Thereby, the internal space S of the gas cell 21 can be made into an airtight space.

The bonding method of the main body 211 and the windows 212 and 213 of the gas cell 21 is determined according to these constituent materials and is not particularly limited. For example, a bonding method using an adhesive, a direct bonding method, an anode A bonding method or the like can be used.
The gas cell 21 as described above is heated by the heat from the heater 25. Thereby, the temperature of the gas cell 21 can be adjusted to a desired temperature.

[Heating-side reflection part]
The heating side reflection part 6 is arrange | positioned at the outer surface of the gas cell 21, as shown in FIG.5 and FIG.6. And the heating side reflection part 6 has a reflectance of 50% or more with respect to an electromagnetic wave having a wavelength of 4 μm (that is, far infrared rays). Thereby, it can suppress that the heat of the gas cell 21 escapes by radiation. In addition, the heat radiated from the package 3 can be reflected by the heating-side reflecting unit 6 to suppress heat conduction due to the radiation from the package 3 to the gas cell 21.

Moreover, the heating side reflection part 6 is arrange | positioned in the part except the part which the excitation light LL from the light emission part 22 permeate | transmits among the outer surfaces of the gas cell 21. FIG. Thereby, the light from the light emitting part 22 can be irradiated to the alkali metal in the gas cell 21 and detected by the light detection part 24 regardless of the constituent material and thickness of the heating side reflection part 6. Therefore, the heat radiation from the heating side reflection part 6 can be suppressed effectively.
More specifically, the heating-side reflection unit 6 has openings 61 and 62 formed in the region where the excitation light LL passes, and the heating-side reflection unit 6 covers the entire region other than the region where the openings 61 and 62 are formed. The outer surface of the gas cell 21 is covered.

Further, the reflectance of the heating-side reflecting portion 6 with respect to an electromagnetic wave having a wavelength of 4 μm (hereinafter also referred to as “thermal reflectance”) is preferably 75% or more because the above-described effect is enhanced as it is higher. % Or more is more preferable, and it is further more preferable that it is 95% or more.
The constituent material of the heating side reflection unit 6 is not particularly limited as long as the heat reflectance is higher than the outer surface of the gas cell 21. For example, a ceramic material, a metal material, a resin material, or the like can be used. However, it is preferable to use a metal material. Thereby, the heat | fever reflectance of the heating side reflection part 6 can be 75% or more.

  Although it does not specifically limit as a metal material which comprises the heating side reflection part 6, For example, copper (thermal reflectivity 97.93%), silver (thermal reflectivity 98.47%), gold (thermal reflectivity) 98.62%), titanium (thermal reflectance 78.04%), chromium (thermal reflectance 93.77%), iron (thermal reflectance 87.09%), cobalt (thermal reflectance 87.04%). 75%), nickel (thermal reflectance 92.38%), aluminum (thermal reflectance 99.03%), iridium (thermal reflectance 98.73%), lead (thermal reflectance 98.90%) ) Or an alloy containing at least one of them can be used, and among them, copper, silver, gold, chromium, nickel, aluminum, iridium, and lead are used from the viewpoint of high heat reflectivity. The view that it is excellent in chemical stability. From, gold is preferable.

Moreover, the heating side reflection part 6 may be comprised by 1 type of metals or alloys, and may be comprised by laminating | stacking 2 or more types of metals or alloys.
Further, the heating-side reflecting portion 6 is made of a material having a thermal conductivity larger than that of the material constituting the gas cell 21, so that the heat from the connection member 29 is more efficiently transferred by the heating-side reflecting portion 6. Can be diffused. As a result, the temperature distribution in the gas cell 21 can be made uniform. In particular, since the heating-side reflection unit 6 connects the windows 212 and 213, the temperature difference between the windows 212 and 213 can be reduced. Moreover, since the heating side reflection part 6 is provided over the perimeter along the edge of each window part 212,213, the temperature distribution of each window part 212,213 can be equalize | homogenized. Also from such a viewpoint, it is preferable that the heating side reflection part 6 is comprised with the metal material.
Moreover, the heating side reflection part 6 is carrying out the film form, and although the formation method of the heating side reflection part 6 is not specifically limited, For example, vapor phase film-forming methods, such as vapor deposition and sputtering, can be used.

[Light emitting part]
The light emitting unit 22 has a function of emitting excitation light that excites alkali metal atoms in the gas cell 21.
More specifically, the light emitting unit 22 emits two types of light (resonant light 1 and resonant light 2) having different frequencies as described above as excitation light.
The frequency ω1 of the resonant light 1 can excite the alkali metal in the gas cell 21 from the ground state 1 to the excited state.

Further, the frequency ω2 of the resonant light 2 can excite the alkali metal in the gas cell 21 from the ground state 2 to the excited state.
The light emitting unit 22 is not particularly limited as long as it can emit the excitation light as described above. For example, a semiconductor laser such as a vertical cavity surface emitting laser (VCSEL) can be used.

[Optical parts]
As shown in FIG. 2, the plurality of optical components 231 and 232 are respectively provided on the optical path of the excitation light LL between the light emitting unit 22 and the gas cell 21 described above.
In the present embodiment, the optical component 231 and the optical component 232 are arranged in this order from the light emitting unit 22 side to the gas cell 21 side.

The optical component 231 is a λ / 4 wavelength plate. Thereby, the excitation light LL from the light emitting part 22 can be converted from linearly polarized light into circularly polarized light (right circularly polarized light or left circularly polarized light).
As will be described later, in the state where the alkali metal atoms in the gas cell 21 are Zeeman split by the magnetic field of the coil 27, if the alkali metal atoms are irradiated with linearly polarized excitation light, the interaction between the excitation light and the alkali metal atoms causes an alkali. This means that metal atoms are evenly distributed in a plurality of levels where Zeeman splits. As a result, the number of alkali metal atoms at a desired energy level is relatively small with respect to the number of alkali metal atoms at other energy levels, so that the number of atoms that develop a desired EIT phenomenon is reduced and desired. As a result, the oscillation characteristics of the atomic oscillator 1 are deteriorated.

  On the other hand, when the alkali metal atom is irradiated with circularly polarized excitation light in a state where the alkali metal atom in the gas cell 21 is Zeeman split by the magnetic field of the coil 27 as will be described later, the interaction between the excitation light and the alkali metal atom. Thus, the number of alkali metal atoms having a desired energy level among the plurality of levels in which the alkali metal atom is Zeeman split can be relatively increased with respect to the number of alkali metal atoms having other energy levels. . Therefore, the number of atoms that develop the desired EIT phenomenon increases, and the intensity of the desired EIT signal increases, and as a result, the oscillation characteristics of the atomic oscillator 1 can be improved.

The optical component 232 is a neutral density filter (ND filter). As a result, the intensity of the excitation light LL incident on the gas cell 21 can be adjusted (decreased). Therefore, even when the output of the light emitting unit 22 is large, the excitation light incident on the gas cell 21 can be set to a desired light amount. In the present embodiment, the optical component 232 adjusts the intensity of the excitation light LL having polarized light in a predetermined direction that has passed through the optical component 231 described above.
In addition to the wave plate and the neutral density filter, other optical components such as a lens and a polarizing plate may be disposed between the light emitting unit 22 and the gas cell 21. The optical component 232 can be omitted depending on the intensity of the excitation light from the light emitting unit 22.

[Photodetection section]
The light detection unit 24 has a function of detecting the intensity of the excitation light LL (resonance light 1 and 2) transmitted through the gas cell 21.
In the present embodiment, the light detection unit 24 is bonded onto the connection member 29 via the adhesive 30.

Here, a known adhesive can be used as the adhesive 30, but when an adhesive having excellent thermal conductivity is used, the temperature of the light detection unit 24 can also be adjusted by heat from the connection member 29.
The light detector 24 is not particularly limited as long as it can detect the excitation light as described above. For example, a photodetector (light receiving element) such as a solar cell or a photodiode can be used.

[heater]
The heater 25 has a heating resistor (heat generating part) that generates heat when energized.
Heat from the heater 25 is transmitted to the gas cell 21 via the substrate 28 and the connection member 29. Thereby, the gas cell 21 (more specifically, the alkali metal in the gas cell 21) is heated, and the alkali metal in the gas cell 21 can be maintained in a gaseous state with a desired concentration. In the present embodiment, the heat from the heater 25 is also transmitted to the light emitting unit 22 through the substrate 28.

The heater 25 is separated from the gas cell 21. Thereby, it is possible to suppress the unnecessary magnetic field generated by energizing the heater 25 from adversely affecting the metal atoms in the gas cell 21.
In the present embodiment, the heater 25 is provided on the substrate 28. Thereby, heat from the heater 25 is transmitted to the substrate 28.

[Temperature sensor]
The temperature sensor 26 detects the temperature of the heater 25 or the gas cell 21. Based on the detection result of the temperature sensor 26, the amount of heat generated by the heater 25 is controlled. Thereby, the alkali metal atom in the gas cell 21 can be maintained at a desired temperature.

In the present embodiment, the temperature sensor 26 is provided on the substrate 28.
The installation position of the temperature sensor 26 is not limited to this. For example, the temperature sensor 26 may be on the connection member 29, the heater 25, or the outer surface of the gas cell 21. .
The temperature sensor 26 is not particularly limited, and various known temperature sensors such as a thermistor and a thermocouple can be used.

[coil]
The coil 27 has a function of generating a magnetic field when energized. Thereby, by applying a magnetic field to the alkali metal in the gas cell 21, the gap between different energy levels in which the alkali metal is degenerated can be expanded by Zeeman splitting, and the resolution can be improved. As a result, the accuracy of the oscillation frequency of the atomic oscillator 1 can be increased.

The magnetic field generated by the coil 27 may be either a DC magnetic field or an AC magnetic field, or may be a magnetic field in which a DC magnetic field and an AC magnetic field are superimposed.
The coil 27 may be a solenoid coil provided so as to surround the gas cell 21 or a Helmholtz coil provided so as to sandwich the gas cell 21.
Although not shown, the installation position of the coil 27 may be between the gas cell 21 and the connection member 29 or between the connection member 29 and the package 3.

[substrate]
On one surface (upper surface) of the substrate 28, the light emitting unit 22, the heater 25, the temperature sensor 26, and the connection member 29 are mounted.
The substrate 28 has a function of transmitting heat from the heater 25 to the connection member 29. Thereby, even if the heater 25 is separated from the connection member 29, the heat from the heater 25 can be transmitted to the connection member 29.

Here, the substrate 28 thermally connects the heater 25 and the connection member 29. By mounting the heater 25 and the connection member 29 on the substrate 28 in this way, the degree of freedom of installation of the heater 25 can be increased.
Further, since the light emitting part 22 is mounted on the substrate 28, the temperature of the light emitting part 22 can be adjusted by the heat from the heater 25.

The substrate 28 also has a function of supporting the light emitting unit 22, the heater 25, the temperature sensor 26, and the connection member 29.
The constituent material of the substrate 28 is not particularly limited, but a material having excellent thermal conductivity, for example, a metal material can be used. In addition, by configuring the substrate 28 with a metal material, the heat reflectance of the surface of the substrate 28 can be increased, and the radiation of heat from the substrate 28 can be suppressed. In addition, when the board | substrate 28 is comprised with a metal material, the insulating layer comprised, for example with the resin material, the metal oxide, the metal nitride etc. may be provided in the surface of the board | substrate 28 as needed. . However, such an insulating layer is preferably not provided on the lower surface of the substrate 28 as much as possible from the viewpoint of suppressing the above-described heat radiation.
The substrate 28 may be omitted depending on the shape of the connection member 29, the installation position of the heater 25, and the like. In this case, the heater 25 may be installed at a position where the heater 25 is brought into contact with the connection member 29.

[Connecting member]
The connection member 29 thermally connects the heater 25 and the window portions 212 and 213 of the gas cell 21. Thereby, the heat from the heater 25 can be transmitted to the window portions 212 and 213 by heat conduction through the connecting member 29, and the window portions 212 and 213 can be heated. Further, the heater 25 and the gas cell 21 can be separated from each other. Therefore, it is possible to suppress the unnecessary magnetic field generated by energizing the heater 25 from adversely affecting the metal atoms in the gas cell 21. Further, since the number of heaters 25 can be reduced, for example, the number of wires for energizing the heater 25 can be reduced, and as a result, the atomic oscillator 1 (quantum interference device) can be reduced in size. .

As shown in FIGS. 5 and 6, the connection member 29 is composed of a pair of connection members 291 and 292 provided with the gas cell 21 interposed therebetween. Thereby, heat can be uniformly transmitted from the connection member 29 to each of the windows 212 and 213 of the gas cell 21 while facilitating the installation of the connection member 29 with respect to the gas cell 21.
More specifically, the connection member 291 has a pair of connection portions 291a and 291b arranged with the gas cell 21 in between, and a connection portion 291c for connecting the pair of connection portions 291a and 291b. ing. Similarly, the connection member 292 includes a pair of connection portions 292a and 292b disposed with the gas cell 21 therebetween, and a connection portion 292c that connects between the pair of connection portions 292a and 292b. Thereby, the heat from the heater 25 can be efficiently transmitted to the window portions 212 and 213.

Here, the connecting portions 291a, 292a, 291b, and 292b are in contact with the heating-side reflecting portion 6, respectively. That is, the window portions 212 and 213 and the connection members 291 and 292 are connected via the heating side reflection portion 6.
Further, each of the connection portions 291a, 291b, 292a, and 292b is formed so as to avoid the passage region of the excitation light LL. That is, the connecting portions 291a, 291b, 292a, and 292b are disposed outside the passage region of the excitation light LL, respectively. Thereby, the excitation light can be incident on the gas cell 21 and the excitation light can be emitted from the gas cell 21.

Such a pair of connection members 291 and 292 are fitted, for example, so as to sandwich the gas cell 21 from both sides of a pair of side surfaces of the gas cell 21 facing each other.
In addition, when a gap is formed between at least one of the heating side reflection unit 6 and the connection portions 291a and 292a and between the heating side reflection unit 6 and the connection portions 291b and 292b, The adhesive having thermal conductivity may be filled. Examples of such an adhesive include a metal paste, a resin adhesive containing a heat conductive filler, and a silicone resin adhesive.

Further, each of the connecting portions 291c and 292c is disposed with a gap between the heating side reflection portion 6 (the gas cell 21 when the heating side reflection portion 6 is omitted). Thereby, heat transfer between the connecting portions 291c and 292c and the gas cell 21 can be suppressed, and heat can be efficiently transferred from the connection members 291 and 292 to the window portions 212 and 213.
As a constituent material of such a connection member 29, a material excellent in thermal conductivity, for example, a metal material can be used.

[package]
The package 3 has a function of accommodating the unit portion 2 and the support member 4. Although not shown in FIG. 1, the coil 27 shown in FIG. In addition, the package 3 may contain components other than the components described above.
As shown in FIG. 1, the package 3 includes a plate-like base body 31 (base portion) and a bottomed cylindrical lid body 32, and an opening of the lid body 32 is sealed by the base body 31. Thereby, the space which accommodates the unit part 2 and the supporting member 4 is formed.

The base 31 supports the unit portion 2 via the support member 4.
Although not shown, the base 31 is provided with a plurality of wirings and a plurality of terminals for energizing the unit unit 2 from the outside of the package 3.
The constituent material of the base 31 is not particularly limited, and for example, a resin material, a ceramic material, or the like can be used.

A lid 32 is joined to such a base 31.
A method for joining the base body 31 and the lid body 32 is not particularly limited. For example, brazing, seam welding, energy beam welding (laser welding, electron beam welding, etc.) or the like can be used.
In addition, between the base body 31 and the lid body 32, a joining member for joining them may be interposed.

The constituent material of the lid 32 is not particularly limited, and for example, a resin material, a ceramic material, a metal material, or the like can be used.
Moreover, it is preferable that the base 31 and the lid 32 are airtightly joined. That is, the inside of the package 3 is preferably an airtight space. Thereby, the inside of the package 3 can be put into a reduced pressure state or an inert gas sealed state, and as a result, the characteristics of the atomic oscillator 1 can be improved.

  In particular, the inside of the package 3 is preferably in a reduced pressure state. Thereby, the heat transfer through the space in the package 3 can be suppressed. Therefore, thermal interference between the connection member 29 and the outside of the package 3 or between the heater 25 and the gas cell 21 via the space in the package 3 can be suppressed. Therefore, heat from the heater 25 can be efficiently transmitted to the window portions 212 and 213 via the connection member 29, and a temperature difference between the two window portions 212 and 213 can be suppressed. In addition, heat transfer between the unit portion 2 and the outside of the package 3 can be more effectively suppressed.

[Support member]
The support member 4 (support part) is housed in the package 3 and has a function of supporting the unit part 2 with respect to the base 31 constituting a part of the package 3. That is, the support member 4 directly or indirectly supports each part of the unit part 2 with respect to the base 31.
The support member 4 has a function of suppressing heat transfer between the unit portion 2 and the outside of the package 3. Thereby, the thermal interference between each part of the unit part 2 and the exterior can be suppressed.

As shown in FIG. 7, the support member 4 includes a plurality of leg portions 41 (column portions) and a connecting portion 42 that connects the plurality of leg portions 41.
Each of the plurality of leg portions 41 is bonded to the inner surface of the base 31 of the package 3 with an adhesive, for example.
The plurality of leg portions 41 are arranged outside the unit portion 2 in a plan view (hereinafter, also simply referred to as “plan view”) viewed from the direction in which the base 31 and the unit portion 2 overlap.

In this embodiment, the four leg parts 41 are provided so that it may correspond to the corner | angular part of the gas cell 21 which makes a square in planar view.
Each leg portion 41 has a cylindrical shape and extends in a direction perpendicular to the inner surface of the base 31.
Each leg portion 41 is formed with a hollow portion 411. Thereby, it is possible to suppress heat transfer in the leg portions 41 while ensuring the rigidity of each leg portion 41.
The hollow portion 411 is preferably in an atmosphere (a reduced pressure state or a vacuum state) reduced in pressure from atmospheric pressure. Thereby, the heat transfer in the leg part 41 can be suppressed more effectively.

In this embodiment, the hollow part 411 penetrates the leg part 41 up and down. Therefore, the inside of the hollow part 411 can also be made into a pressure reduction state by making the inside of the package 3 into a pressure reduction state.
In addition, when the upper side of the hollow part 411 is not open, if a gap that communicates the inside and outside of the hollow part 411 is formed between each leg part 41 and the base body 31, The hollow portion 411 can also be in a reduced pressure state.

The connecting portion 42 connects the upper end portions (other end portions) of the plurality of leg portions 41. Thereby, the rigidity of the support member 4 is improved. In the present embodiment, the connecting portion 42 is formed integrally with the plurality of leg portions 41. The connecting portion 42 is formed separately from the plurality of leg portions 41, and may be joined to each leg portion 41 with an adhesive, for example.
The connecting portion 42 has a plate shape as a whole. That is, the connecting portion 42 includes a plate-like portion that forms a plate shape. Thereby, the rigidity of the support member 4 can be increased with a relatively simple configuration.

Further, the connecting portion 42 has a quadrangular shape so that the four leg portions 41 are positioned at the corners in plan view.
The unit portion 2 (more specifically, the substrate 28) is joined (connected) to the upper surface of the connecting portion 42 (the surface opposite to the leg portion 41). Thereby, the unit part 2 is supported by the support member 4.

The connection portion between the coupling portion 42 and the unit portion 2 is located on the inner side of the upper end portions (the other end portions) of the plurality of leg portions 41 described above in plan view.
A concave portion 421 is formed at the center of the upper surface of the connecting portion 42 (ie, the surface on the unit portion 2 side).
The space in the recess 421 is located between the unit part 2 and the connecting part 42. Therefore, a space is formed between the connecting portion 42 and the unit portion 2. Thereby, the contact area of the unit part 2 and the connection part 42 can be reduced, and the transmission of heat between the connection part 42 and the unit part 2 can be effectively suppressed. Further, the concave portion 421 can be thinned to increase the thermal resistance of the connecting portion 42, and heat transfer in the connecting portion 42 can be suppressed.

In the present embodiment, the recess 421 is disposed on the inner side of the outer shape of the unit portion 2 in plan view. Accordingly, the unit portion 2 is joined to a portion on the outer peripheral side with respect to the concave portion 421 of the connecting portion 42. In addition, the recessed part 421 may have a part located outside the external shape of the unit part 2 in planar view.
Moreover, it is preferable that the inside of the recessed part 421 is a pressure reduction state. Thereby, the heat insulation in the recessed part 421 can be improved and the escape of the heat | fever from the unit part 2 to the connection part 42 can be suppressed.

The joint part between the unit part 2 and the support member 4 may be formed over the entire circumference along the outer periphery of the recess 421, but the heat between the unit part 2 and the support member 4 via the joint part. From the viewpoint of suppressing conduction, a plurality of spots are preferably formed.
Further, it is preferable that a gap communicating between the inside and the outside of the recess 421 is formed between the unit portion 2 and the support member 4. Thereby, the inside of the recessed part 421 can also be made into a pressure reduction state by making the inside of the package 3 into a pressure reduction state.

  According to such a support member 4, the lower end portion (one end portion) of each leg portion 41 is separated from the unit portion 2 in plan view. Therefore, the support member 4 has a heat transfer path (hereinafter referred to as “support”) from the connecting portion between the unit portion 2 and the supporting member 4 to the lower end portion of each leg portion 41 (that is, the connecting portion between the leg portion 41 and the base 31). The heat transfer path of the member 4) has a bent or curved portion (curved portion).

  Thereby, even if the distance between the base 31 and the unit part 2 is reduced, the heat transfer path from the unit part 2 to the base 31 via the support member 4 can be lengthened. Therefore, transmission of heat from the unit portion 2 to the base 31 via the support member 4 can be suppressed while downsizing the atomic oscillator 1. Moreover, since the leg portions 41 are connected by the connecting portion 42, the rigidity of the support member 4 can be increased. Therefore, the vibration of the unit part 2 can be suppressed.

  The constituent material of the support member 4 is not particularly limited as long as the material has relatively low thermal conductivity and the support member 4 can secure the rigidity for supporting the unit portion 2. It is preferable to use a nonmetal such as a ceramic material, and it is more preferable to use a resin material. When the support member 4 is mainly made of a resin material, the heat resistance of the support member 4 can be increased, and even if the shape of the support member 4 is complicated, a known method such as injection molding is used. The support member 4 can be easily manufactured. In addition, the constituent material of the leg part 41 and the constituent material of the connection part 42 may be the same, and may differ. Moreover, when the supporting member 4 is comprised using the resin material, the inorganic filler, various additives, etc. may be contained with content of less than 50 wt% other than the resin material.

  Although it does not specifically limit as a resin material used for the constituent material of the supporting member 4, For example, polyolefin, such as polyethylene and ethylene-vinyl acetate copolymer (EVA), acrylic resin, acrylonitrile-butadiene-styrene copolymer (ABS) Resin), acrylonitrile-styrene copolymer (AS resin), polyethylene terephthalate (PET), polyether, polyether ketone (PEK), polyether ether ketone (PEEK), styrene, polyolefin, polyvinyl chloride, polyurethane , Polyester, polyamide, polybutadiene, trans polyisoprene, fluororubber, chlorinated polyethylene, and other thermoplastic elastomers, epoxy resins, phenol resins, urea resins, melamine resins, unsaturated polyesters , Silicone resins, polyurethanes, etc., or copolymers, blends, polymer alloys, etc. mainly comprising these, and combinations of one or more of these (for example, as a laminate of two or more layers) ) Can be used.

The thermal conductivity of the support member 4 is preferably 0.1 W · m ⁻¹ · K ⁻¹ or more and 40 W · m ⁻¹ · K ⁻¹ or less, and 0.1 W · m ⁻¹ · K ^−1. More preferably, it is 0.5 W · m ⁻¹ · K ⁻¹ or less. Thereby, the heat conduction via the support member 4 between the unit part 2 and the package 3 can be suppressed more effectively. That is, the heat insulating property of the support member 4 can be improved, and the effect of thermally separating the unit portion 2 and the package 3 can be made remarkable.

[Support side reflection part]
As shown in FIGS. 7B and 8, the support-side reflecting portions 7 are arranged away from each other along the vertical direction (that is, the direction in which the gas cells 21 and the base 31 are arranged on the surface of the support member 4). A plurality of portions 71, 72, 73. And the support side reflection part 7 is 50% or more of the reflectance (thermal reflectance) with respect to electromagnetic waves with a wavelength of 4 μm.

  Thereby, the heat radiation from the support member 4 is supported on the support side reflecting portion while enhancing the heat insulating property (thermal resistance) of the support member 4 and suppressing the heat conduction between the gas cell 21 and the base 31 via the support member 4. 7. Here, a plurality of support-side reflecting portions 7 are arranged apart from each other along the direction in which the gas cell 21 and the base 31 are arranged (in other words, the heat transfer direction in the support member 4 from the gas cell 21 to the base 31). Therefore, the heat conduction between the gas cell 21 and the base 31 via the support-side reflecting portion 7 can be suppressed. That is, the support side reflection part 7 can suppress the heat radiation from the support member 4 while reducing the increase in heat conduction between the gas cell 21 and the base 31. As a result, the power consumption of the atomic oscillator 1 can be reduced.

Further, the heat radiated from the package 3 can be reflected by the support-side reflecting portion 7 to suppress heat conduction due to the radiation from the package 3 to the support member 4.
In the present embodiment, the plurality of portions 71, 72, 73 of the support side reflecting portion 7 are arranged in a stripe shape when viewed from a direction perpendicular to the direction in which the gas cell 21 and the base 31 are arranged. Thereby, it is possible to efficiently suppress the heat conduction between the gas cell 21 and the base 31 via the support-side reflecting portion 7 with a relatively simple configuration.

Further, the portions 71, 72, 73 of the support-side reflecting portion 7 are arranged in this order from the gas cell 21 side to the base 31 side, and the portions 71, 72 are arranged on the surface of the connecting portion 42 of the support member 4, The portion 73 is disposed on the surface of the leg portion 41 of the support member 4.
The portion 71 arranged closest to the gas cell 21 is provided not only on the outer peripheral surface of the connecting portion 42 but also on the upper surface of the connecting portion 42. Thereby, the radiation of the heat from the upper surface of the connection part 42 can be suppressed.

Further, the portion 71 is formed in a portion of the upper surface of the connecting portion 42 except for the vicinity of the portion where the unit portion 2 contacts, and is separated from the unit portion 2 (more specifically, the substrate 28) with a gap G. (See FIG. 7A). Thereby, the heat conduction from the unit part 2 to the support side reflection part 7 can be suppressed.
Further, the portion 72 is provided not only on the outer peripheral surface of the connecting portion 42 but also on the lower surface of the connecting portion 42. Thereby, radiation of heat from the lower surface of the connecting portion 42 can be suppressed.

  Further, the portion 72 is separated from the portion 71 with a gap G1, and is separated from the portion 73 with a gap G2. Thereby, the heat conduction between the parts 71 and 73 and the part 72 can be suppressed. Here, the gaps G <b> 1 and G <b> 2 are arranged so as to traverse (shut off) the heat transfer path of heat from the gas cell 21 side to the base 31 side of the support-side reflecting portion 7. In other words, the portions 71, 72, 73 are arranged intermittently at intervals G 1, G 2 on the way from the gas cell 21 side to the base 31 side. Therefore, the heat conduction from the gas cell 21 side of the support side reflection part 7 to the base | substrate 31 side can be suppressed.

  In the present embodiment, the lengths of the portions 71, 72, 73 in the vertical direction (the length in the width direction of the stripes) are equal, but the interval G2 is larger than the interval G1. Therefore, the arrangement density of the support-side reflecting portions 7 on the surface of the support member 4 (in other words, the area of the support-side reflecting portion 7 disposed per unit area on the surface of the support member 4) is the base on the gas cell 21 side. It is larger than 31 side. Thereby, the radiation of the heat | fever of the part by which the temperature of the supporting member 4 is high can be suppressed efficiently. Even if the gap G1 and the gap G2 are equal, the order in which the lengths in the vertical direction of the portions 71, 72, 73 are large is the order of the portions 71, 72, 73, and the arrangement density as described above is realized. Also good.

Further, the higher the reflectivity (thermal reflectivity) for the electromagnetic wave having a wavelength of 4 μm of the support-side reflecting portion 7 is, the higher the effect as described above is, the more the effect is as described above. Therefore, it is preferably 75% or more, and 90% or more. More preferably, it is more preferably 95% or more.
The constituent material of the support-side reflecting portion 7 is not particularly limited as long as the heat reflectance is higher than that of the outer surface of the support member 4. For example, a ceramic material, a metal material, a resin material, or the like is used. However, it is preferable to use a metal material. Thereby, the heat | fever reflectance of the support side reflection part 7 can be 75% or more. As a result, the effect | action which suppresses the heat radiation of the support side reflection part 7 can be exhibited suitably.

  Although it does not specifically limit as a metal material which comprises the support side reflection part 7, For example, copper (thermal reflectance 97.93%), silver (thermal reflectance 98.47%), gold (thermal reflectance) 98.62%), titanium (thermal reflectance 78.04%), chromium (thermal reflectance 93.77%), iron (thermal reflectance 87.09%), cobalt (thermal reflectance 87.04%). 75%), nickel (thermal reflectance 92.38%), aluminum (thermal reflectance 99.03%), iridium (thermal reflectance 98.73%), lead (thermal reflectance 98.90%) ) Or an alloy containing at least one of them can be used, and among them, copper, silver, gold, chromium, nickel, aluminum, iridium, and lead are used from the viewpoint of high heat reflectivity. The view that it is excellent in chemical stability. From, gold is preferable.

Moreover, the support side reflection part 7 may be comprised with 1 type of metals or alloys, and may be comprised by laminating | stacking 2 or more types of metals or alloys.
The material as described above has a higher thermal conductivity than the material constituting the support member 4. However, as described above, by providing the gaps G1 and G2, the heat conduction of the entire support-side reflecting portion 7 is suppressed. Can do.
The portions 71, 72, and 73 each have a film shape, and the formation method of the support-side reflecting portion 7 is not particularly limited. For example, a vapor deposition method such as vapor deposition or sputtering is used. it can.

[Control unit]
The control unit 5 shown in FIG. 2 has a function of controlling the heater 25, the coil 27, and the light emitting unit 22, respectively.
Such a control unit 5 includes an excitation light control unit 51 that controls the frequencies of the resonant lights 1 and 2 of the light emitting unit 22, a temperature control unit 52 that controls the temperature of the alkali metal in the gas cell 21, and the gas cell 21. And a magnetic field control unit 53 that controls the magnetic field to be applied.

  The excitation light control unit 51 controls the frequencies of the resonance lights 1 and 2 emitted from the light emission unit 22 based on the detection result of the light detection unit 24 described above. More specifically, the excitation light control unit 51 emits light from the light emitting unit 22 so that (ω1-ω2) detected by the light detection unit 24 described above becomes the frequency ω0 unique to the alkali metal described above. The frequency of the resonant lights 1 and 2 is controlled. Further, the excitation light control unit 51 controls the center frequency of the resonance lights 1 and 2 emitted from the light emitting unit 22. Thereby, the EIT signal as described above can be detected. Then, the control unit 5 outputs a crystal oscillator signal (not shown) in synchronization with the EIT signal.

Further, the temperature control unit 52 controls energization to the heater 25 based on the detection result of the temperature sensor 26. Thereby, the gas cell 21 can be maintained within a desired temperature range.
The magnetic field control unit 53 controls energization of the coil 27 so that the magnetic field generated by the coil 27 is constant.
Such a control part 5 is provided in the IC chip mounted on the board | substrate with which the package 3 is mounted, for example. The control unit 5 may be provided in the package 3.

  According to the atomic oscillator 1 of the present embodiment as described above, the heat insulation (thermal resistance) of the support member 4 is enhanced and the heat conduction between the gas cell 21 and the base 31 via the support member 4 is suppressed. The heat radiation from the support member 4 can be suppressed by the support-side reflecting portion 7. Here, a plurality of support-side reflecting portions 7 are arranged apart from each other along the direction in which the gas cell 21 and the base 31 are arranged (in other words, the heat transfer direction in the support member 4 from the gas cell 21 to the base 31). Therefore, the heat conduction between the gas cell 21 and the base 31 via the support-side reflecting portion 7 can be suppressed. That is, the support side reflection part 7 can suppress the heat radiation from the support member 4 while reducing the increase in heat conduction between the gas cell 21 and the base 31. As a result, the power consumption of the atomic oscillator 1 can be reduced.

(Modification)
Hereinafter, modified examples of the above-described support-side reflection unit 7 will be described. In addition, about the matter similar to the support side reflection part 7, the description is abbreviate | omitted.
FIG. 9 is a diagram for explaining a support-side reflection unit according to a modification of the atomic oscillator shown in FIG.
The support side reflection part according to the modification is the same as the support side reflection part 7 described above except that the shape and arrangement of a plurality of parts constituting the support side reflection part are different.

9 includes a plurality of portions 74 disposed on the surface of the connecting portion 42 of the support member 4 so as to be separated from each other and a plurality of portions disposed on the surface of the leg portion 41 of the support member 4 so as to be separated from each other. Part 75.
The plurality of portions 74 and the plurality of portions 75 are arranged in spots. Thereby, it is possible to efficiently suppress heat conduction between the gas cell 21 and the base 31 via the support-side reflecting portion with a relatively simple configuration.

Such a plurality of portions 74 and 75 are arranged away from each other along the vertical direction (that is, the direction in which the gas cell 21 and the base 31 are arranged on the surface of the support member 4).
In the present modification, the portions 74 and 75 are circular. In addition, the shape of each part 74 and 75 is not limited to this, For example, polygons, such as a quadrangle | tetragon and a pentagon, an ellipse, etc. may be sufficient.

In this modification, the area of one portion 74 is equal to the area of one portion 75, but the interval between the portions 74 is smaller than the interval between the portions 75. Therefore, the arrangement density of the support-side reflecting portions on the surface of the support member 4 is larger on the gas cell 21 side than on the base 31 side. Thereby, the radiation of the heat | fever of the part by which the temperature of the supporting member 4 is high can be suppressed efficiently.
Even with the support-side reflecting portion as described above, the same operations and effects as those of the support-side reflecting portion 7 described above can be achieved.

Second Embodiment
Next, a second embodiment of the present invention will be described.
10 is a cross-sectional view showing an atomic oscillator (electronic device) according to a second embodiment of the present invention, FIG. 11 is a plan view of a support portion of the atomic oscillator shown in FIG. 10, and FIG. 12 is a support shown in FIG. It is a partial expansion perspective view of a part.
The atomic oscillator according to the present embodiment is the same as the atomic oscillator according to the first embodiment described above except that the configuration of the support section and the arrangement of the heating section are different.

  In the following description, the atomic oscillator according to the second embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. 10 and 10, the same reference numerals are given to the same configurations as those in the above-described embodiment. Moreover, in FIG. 11, illustration of the support side reflection part is abbreviate | omitted for convenience of explanation.

An atomic oscillator 1A shown in FIG. 10 includes a support member 4A (support portion) that supports the unit portion 2 with respect to the package 3 in the package 3, and a support-side reflection portion 7A disposed on the surface of the support member 4A. Prepare.
As shown in FIG. 11, the supporting member 4A includes a plurality of (four in this embodiment) leg portions 41A (column portions), a plurality (four in this embodiment) column portions 43, and a plurality of leg portions. 41A and the some pillar part 43 are mutually connected, and it has the connection part 42A which mutually connects. Here, it can also be said that the pillar portion 43 and the connecting portion 42A constitute a “connecting portion” that connects the plurality of leg portions 41A. It can also be said that the portion connecting the leg portion 41A and the column portion 43 of the connection portion 42A, the leg portion 41A, and the column portion 43 constitute a “leg portion”.

The plurality of leg portions 41A are disposed outside the unit portion 2 in plan view.
Each leg portion 41 </ b> A has a rectangular tube shape and extends in a direction perpendicular to the inner surface of the base 31.
Each leg portion 41A is formed with a hollow portion 411A along the axial direction thereof.
The lower end portion of each leg portion 41A is joined to the base 31 of the package 3 by, for example, an adhesive.

On the other hand, the upper end portions (other end portions) of the plurality of leg portions 41A are connected via a connecting portion 42A.
The connecting portion 42A has a plate shape as a whole, and a plurality of through holes 422, a plurality of through holes 423, and a plurality of through holes 424 penetrating in the thickness direction are formed in the connecting portion 42A. That is, the connecting portion 42 </ b> A has a plurality of through holes 422, 423, and 424 that penetrate in the direction in which the base 31 and the unit portion 2 overlap. Thereby, the heat transfer in the connecting portion 42A can be suppressed while securing the rigidity of the connecting portion 42A.

The plurality of through holes 422 are provided corresponding to the plurality of leg portions 41A, respectively. Each through hole 422 is located between the corresponding leg portion 41A and the column portion 43 closest to the leg portion 41A in plan view. Thereby, the heat transfer path from the pillar portion 43 to the leg portion 41A via the connecting portion 42A can be lengthened.
The plurality of through holes 423 are located between two adjacent through holes 422 in plan view. Further, the plurality of through holes 424 are located in a region surrounded by the plurality of through holes 423 in plan view. By providing such a plurality of through holes 423 and a plurality of through holes 424, the thermal resistance of the entire connecting portion 42A can be increased.

In the present embodiment, the shape of each through hole 422, 423, 424 in plan view is a quadrangle. In addition, this planar view shape is not limited to this, For example, other polygons, such as a triangle and a pentagon, circular shape, irregular shape, etc. may be sufficient.
The plurality of pillars 43 are erected on the upper surface side of the connecting part 42A, and the lower ends of the plurality of pillars 43 are connected by the connecting part 42A.

The plurality of column portions 43 are disposed inside the unit portion 2 in plan view. In the present embodiment, four column portions 43 are provided so as to correspond to the corner portions of the gas cell 21 having a square shape.
Each column portion 43 has a rectangular tube shape and extends in a direction parallel to the extending direction of the leg portion 41A.
Each column portion 43 is formed with a hollow portion 431 along the axial direction thereof.
The unit portion 2 (more specifically, the substrate 28) is joined (connected) to the upper end portion (the end portion opposite to the connecting portion 42A) of each column portion 43. Thereby, the unit part 2 is supported by the support member 4A.

In this embodiment, the length of each pillar part 43 is longer than the length of each leg part 41A. Thereby, the thermal resistance of the column part 43 can be enlarged and the transmission of the heat from the unit part 2 to 4 A of support members can be suppressed. Further, by shortening the length of each leg 41A, it is possible to increase the rigidity of the support member 4A, to reduce the height of the support member 4A, and thus to reduce the height of the atomic oscillator 1A.
In the support member 4A configured in this way, as shown in FIG. 12, heat from the unit part 2 passes through the column part 43, the wall part forming the through hole 422 of the coupling part 42A, and the leg part 41A in this order. Is transmitted to the base 31. Thereby, the heat transfer path from the unit part 2 to the base 31 via the support member 4A can be lengthened.

The support-side reflecting portion 7A is disposed on the surface of the support member 4A as described above.
As shown in FIG. 12, the support-side reflecting portion 7A includes a plurality of portions 71A that are arranged away from each other along the vertical direction (that is, the direction in which the gas cells 21 and the base 31 are arranged on the surface of the support member 4A). 72A and 73A are included. The support-side reflecting portion 7A has a reflectance (thermal reflectance) with respect to an electromagnetic wave having a wavelength of 4 μm of 50% or more.

In the present embodiment, the plurality of portions 71A, 72A, 73A of the support-side reflecting portion 7A are arranged in a stripe shape when viewed from a direction perpendicular to the direction in which the gas cell 21 and the base 31 are arranged. Thereby, it is possible to efficiently suppress heat conduction between the gas cell 21 and the base 31 via the support-side reflecting portion 7A with a relatively simple configuration.
Further, the portions 71A, 72A, 73A of the support-side reflecting portion 7A are arranged in this order from the gas cell 21 side to the base 31 side, and the portion 71A is arranged on the surface of the column portion 43 of the support member 4A, and the portion 72A , 73A are arranged on the surface of the connecting portion 42A of the support member 4A.

7 A of support side reflection parts containing such part 71A, 72A, 73A can suppress the thermal radiation from 4 A of support members, reducing the increase in the heat conduction between the gas cell 21 and the base | substrate 31. As shown in FIG.
As shown in FIG. 10, the support member 4 </ b> A provided with such support-side reflecting portion 7 </ b> A is provided with a heater 25 (heating unit) via a substrate 28.

  In the present embodiment, the heater 25 is provided on the opposite side of the gas cell 21 with respect to the substrate 28. As a result, when viewed from the emission direction of the excitation light of the light emission part 22, that is, in a plan view, the heater 25 can be disposed at a position overlapping the region through which the excitation light of the gas cell 21 passes. For this reason, the heat transfer path from the heater 25 to the region through which the excitation light of the gas cell 21 passes can be configured to be equal to each other in each circumferential portion of each window portion of the gas cell 21. it can.

In the present embodiment, the substrate 28 preferably has a magnetic shielding property. Thereby, it is possible to suppress the unnecessary magnetic field generated by energizing the heater 25 from adversely affecting the metal atoms in the gas cell 21. In this case, as a constituent material of the substrate 28, for example, a soft magnetic material such as Fe, various Fe alloys (silicon iron, permalloy, amorphous, Sendust) may be used.
The atomic oscillator 1A of the second embodiment as described above can also reduce power consumption.

2. Electronic Device The atomic oscillator of the present invention as described above can be incorporated into various electronic devices. Such an electronic device including the atomic oscillator of the present invention has excellent reliability.
Hereinafter, an example of an electronic apparatus including the atomic oscillator of the present invention will be described.
FIG. 13 is a diagram showing a schematic configuration when the atomic oscillator of the present invention is used in a positioning system using a GPS satellite.

The positioning system 100 shown in FIG. 13 includes a GPS satellite 200, a base station device 300, and a GPS receiving device 400.
The GPS satellite 200 transmits positioning information (GPS signal).
The base station device 300 receives the positioning information from the GPS satellite 200 with high accuracy via, for example, an antenna 301 installed at an electronic reference point (GPS continuous observation station), and the reception device 302 receives the positioning information. And a transmission device 304 that transmits positioning information via the antenna 303.

Here, the receiving device 302 is an electronic device provided with the above-described atomic oscillator 1 of the present invention as its reference frequency oscillation source. Such a receiving apparatus 302 has excellent reliability. In addition, the positioning information received by the receiving device 302 is transmitted by the transmitting device 304 in real time.
The GPS receiver 400 includes a satellite receiver 402 that receives positioning information from the GPS satellite 200 via the antenna 401, and a base station receiver 404 that receives positioning information from the base station device 300 via the antenna 403. Prepare.

3. Mobile Object The atomic oscillator of the present invention as described above can be incorporated into various mobile objects. Such a moving body including the atomic oscillator of the present invention has excellent reliability.
Hereinafter, an example of the moving body of the present invention will be described.
FIG. 14 is a perspective view showing a configuration of a moving object (automobile) provided with the atomic oscillator of the present invention.
A moving body 1500 shown in FIG. 14 includes a vehicle body 1501 and four wheels 1502, and is configured to rotate the wheels 1502 by a power source (engine) (not shown) provided in the vehicle body 1501. In such a moving body 1500, the atomic oscillator 1 is built. Based on the oscillation signal from the atomic oscillator 1, for example, a control unit (not shown) controls driving of the power source.

  Note that the electronic apparatus or the moving body in which the atomic oscillator or the electronic device of the present invention is incorporated is not limited to those described above. For example, a mobile phone, a digital still camera, an ink jet type ejection device (for example, an ink jet printer), a personal computer (mobile) Type personal computer, laptop personal computer), TV, video camera, video tape recorder, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, TV phone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (eg, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish finder, various measuring devices Instruments (e.g., gages for vehicles, aircraft, and ships), a flight simulator, terrestrial digital broadcasting, can be applied to a mobile phone base station or the like.

The electronic device, the atomic oscillator, the electronic apparatus, and the moving body of the present invention have been described based on the illustrated embodiments. However, the present invention is not limited to these, for example, each part of the above-described embodiments. This configuration can be replaced with any configuration that exhibits the same function, and any configuration can be added.
Moreover, you may make it this invention combine arbitrary structures of each embodiment mentioned above.

In the above-described embodiment, the case where the support portion is configured by a plurality of legs and connecting portions has been described as an example. However, the shape of the support portion is such that the gas cell or the temperature-controlled portion is directly connected to the base portion. As long as it can be supported manually or indirectly, it is not limited to this, For example, plate shape, block shape, beam shape etc. may be sufficient. Moreover, the support part may be comprised with the some member.
In the embodiment described above, the case where the unit portion supported by the support portion includes a connection member, a substrate, and the like in addition to the gas cell has been described as an example. However, the present invention is not limited to this, and the unit portion includes at least the gas cell. It only has to be.

Moreover, although embodiment mentioned above demonstrated the case where the gas cell was indirectly supported by the support part via the board | substrate and the connection member, the gas cell may be directly supported by the support part.
In the above-described embodiment, the atomic oscillator (quantum interference device) using the quantum interference effect has been described as an example of the electronic device of the present invention. However, the electronic device of the present invention includes a temperature-adjusted unit that is temperature-controlled. For example, a magnetic sensor using a quantum interference effect, another quantum interference device such as a quantum memory, another oscillator such as a thermostat crystal oscillator, a gyro sensor, an angular velocity sensor It can be applied to various electronic devices such as sensor devices.

DESCRIPTION OF SYMBOLS 1 ... Atomic oscillator 1A ... Atomic oscillator 2 ... Unit part 3 ... Package 4 ... Support member 4A ... Support member 5 ... Control part 6 ... Heating side reflection part 7 ... Support side reflection part 7A ... …… Supporting side reflection part 21 ・ ・ ・ Gas cell 22 ...... Light emission part 24 ...... Light detection part 25 ... Heater 26 ... Temperature sensor 27 ... Coil 28 ... Board 29 ... Connection member 30 ... Adhesive 31 ··· Base 32 ···································································································································· Part 61, 62 ... opening 71 ... part 71A ... part 72 ... part 72A ... part 73 ... part 73A ... part 74 ... part 75 ... part 100 ... positioning system 200 ... GPS satellite 211 ... Body part 212 ... Window part 213 ... Window part 231 ... Optical part 232 ... Optical part 291 ... Connection member 291a ... Connection part 291b ... Connection part 291c ... Connection part 292 ... Connection member 292a ... Connection section 292b ... Connection section 292c ... Connection section 300 ... Base station apparatus 301 ... Antenna 302 ... Reception apparatus 303 ... Antenna 304 ... Transmission apparatus 400 ... GPS reception apparatus 401 ... Antenna 402 Satellite receiver 403 Antenna 404 Base station 411 Hollow 411A Hollow 421 Recess 422 Through hole 423 Through hole 424 Through hole 431 Hollow 1500 ... Moving object 1501 ... Car body 1502 ... Wheel G ... Interval G1 ... Interval G2 ... Interval L L ... Excitation light S ... Internal space

Claims (15)

A base part;
A unit including a gas cell in which metal atoms are enclosed;
Is disposed between the unit part and the base portion, the unit portion, a supporting portion which supports at a first surface opposite to the unit section,
A support-side reflecting portion having a reflectance of 50% or more with respect to an electromagnetic wave having a wavelength of 4 μm ,
The support-side reflecting portion has a plurality of portions, and the plurality of portions are disposed apart from each other on a plurality of surfaces of the support portion including the first surface. apparatus. 2. The quantum interference device according to claim 1, wherein at least one of the plurality of portions of the support-side reflecting portion is disposed on the first surface with a gap from the unit portion . Said unit section, quantum interference device according to claim 1 or 2 and a heating unit for heating the gas cell. The gas cell is engaged with a connection member included in the unit part, and is disposed between the outer surface of the gas cell and the connection member, and has a heating side reflection part having a reflectance of 50% or more with respect to an electromagnetic wave having a wavelength of 4 μm. The quantum interference apparatus according to any one of claims 1 to 3 . The quantum interference device according to claim 4, wherein the heating-side reflection unit is formed of a metal film. A light emitting portion that emits light that excites the metal atoms in the gas cell;
A light detection unit for detecting the light transmitted through the gas cell,
The heating-side reflecting portion, quantum interference device according to claim 4 or 5 wherein the light is disposed in a portion except for the portion for transmitting of the outer surface of the gas cell. The quantum interference device according to claim 1, wherein the plurality of portions of the support-side reflection unit are arranged in a striped pattern. The quantum interference device according to claim 1, wherein the plurality of portions of the support-side reflection unit are arranged in a spot shape. 9. The quantum interference device according to claim 1, wherein an arrangement density of the support-side reflection portions on the plurality of surfaces of the support portion is larger on the gas cell side than on the base portion side. The supporting side reflection section, quantum interference device according to any one of claims 1 is composed of a metallic material 9. Before Symbol support section, possess a plurality of legs having one end connected to the base portion, and a connecting portion for connecting said plurality of legs, and
The connection portion between the front Kiashi portion said base portion, in a plan view viewed from a direction with the base portion and the unit portion overlap any of claims 1 to 10 spaced apart with respect to the unit section 1 The quantum interference device according to Item. It said support portion, quantum interference device according to any one of the resin materials claims 1 as a main material 11. An atomic oscillator comprising the quantum interference device according to claim 1 . An electronic apparatus comprising the quantum interference device according to claim 1 . A moving body comprising the quantum interference device according to claim 1 .

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